TWI554149B - 用於發光二極體之安裝及互連之可彎曲電路結構 - Google Patents

用於發光二極體之安裝及互連之可彎曲電路結構 Download PDF

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TWI554149B
TWI554149B TW097147203A TW97147203A TWI554149B TW I554149 B TWI554149 B TW I554149B TW 097147203 A TW097147203 A TW 097147203A TW 97147203 A TW97147203 A TW 97147203A TW I554149 B TWI554149 B TW I554149B
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laminate
layer
substrate
aluminum
copper foil
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TW200932047A (en
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爾文 愛米二世 丹尼爾
葛瑞芙里 黛博拉Ｒ
葛林 麥可Ｊ
懷特 史蒂芬Ｈ
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杜邦股份有限公司
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
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    • Y10T428/31678—Of metal
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)

Description

用於發光二極體之安裝及互連之可彎曲電路結構
本發明係關於用於LED(發光二極體)之安裝及互連之可撓性基板結構。
絕緣金屬基板已在例如顯示器背光照明、汽車照明及一般的商用及家庭用照明等應用中用於發光二極體(LED)之安裝及互連。當前所使用之基板通常呈剛性且在變形及彎曲時會降低或損害其機械性質、電性質及熱性質。人們希望能形成或彎曲該等基板材料來製造角形結構、曲線形結構或彎曲結構，同時保持機械完整性及熱完整性且不會導致基板或其電性質之降格。
此項技術中已知各種多功能電子基板材料。該等基板之某些層可由各種聚合物材料製成，例如聚醯亞胺(下文稱為"PI")。大體而言，其為剛性結構，幾乎不具可撓性，除非結構具有凹槽。
例如，US 2007/0076381 A1闡述具有散熱片之可撓性散熱器電路板。其電路板之可撓性係由凹槽圖案引起的，其可在基板彎曲時使上表面及下表面具有可撓性。
吾人已知鋁基板可用於可見LED電路中。例如在由Tom Morris編寫的標題為"Aluminum Substrates Make light work of visible LED Circuits"(Canadian Electronics Magazine e-magazine，日期為2007年9月18日)之文章中所示。可將經濟的可焊接聚合物厚膜導體直接絲網印刷於該等基板上而不導致降格。該文提及可將鋁合金基板擠出、模鑄及製成特別形狀。熱傳導鋁合金材料使設計工程師能夠直接將高功率LED組件安裝於其上。然而，該文未提及該等合金基板之任何可撓性。
在由Richard Stevenson編寫的標題為"Poor fixtures threaten to jeopardize the illumination potential of LEDs"(Compound Semiconductor，2007年6月)之文章中，作者指出工業上許多固定件之低效率係由於許多公司中操作用於為LED供電之電系統的員工在作業時缺乏對該等固定件設計方面之相關技藝所引起的。該等技術為熱量管控及光學設計所需要。
隨著應用的擴展，將需要更複雜的機械構造且電路變得更薄並更複雜，將期望基板可成形為不會導致基板表面性能之任何降格或不會干擾其熱性質或電性質之形狀。亦期望所選取之基板具有成本效益、易於處理且能夠用於固定件中以使來自LED之光得到最佳利用。本專利申請案中所闡述之層壓板可用於該等固定件中，乃因其可經成形用於改良光學性質而絲毫不會降格其電性質且可保持其熱性質。使層壓結構彎曲而不使電路降格之能力允許將LED構造為"3D"形式。該等結構不限於平面形式。具有此可彎曲能力可為裝置設計者定製及優化裝置設計提供更多選擇。克服由剛性基板材料及互連材料施加於LED安裝及LED結構及固定件之限制使得設計者可定製並優化在固態照明組件中所見到之機械特性。
預計本發明可撓性結構可將當前在LED結構中所見到之總光電效率範圍從30%提高至40%並可藉由以最有效之構造彎曲來集中及分散LED光而人工優化構造。
本發明係關於層壓板，其在基板上包含下列層：
(a)　銅或鋁金屬層；
(b)　聚醯亞胺或黏合層，其中金屬層鄰近聚醯亞胺層或黏合層；
(c)　銅箔層；及
(d)　液態或膜狀焊接遮罩層。
層壓板可為與鋁合金組成基板結合使用之填充有銅箔的聚醯亞胺(PI)薄層聚合物，例如諸如LC(經氧化鋁填充之聚醯亞胺)及LX(經氧化鋁填充之聚醯亞胺)等CooLamTM 熱層壓板。層壓板亦可為陽極電鍍鋁CooLamTM 熱層壓板，例如LU(陽極電鍍鋁並具有黏合劑)。必須將該等層壓板設計為使其以適當厚度之組合用於LED應用。使用該等層壓板可產生多種可彎曲之結構以易於其在LED封裝中使用。
如上文所指出，可用於本發明之適宜材料家族係CooLamTM 熱層壓板。實例係諸如LC(經氧化鋁填充之聚醯亞胺)、LU(具有黏合劑之陽極電鍍鋁)及LX(經氧化鋁填充之聚醯亞胺)等實施例。CooLamTM 結構由金屬、視需要黏合劑(僅在LU(具有黏合劑之陽極電鍍鋁)實施例中)、聚醯亞胺(PI)、銅箔及焊接遮罩組成。參見圖3A及3B(圖例)。LU產品亦可經氧化鋁填充。
參照圖3(A)及3(B)，本文中術語"層壓板"指金屬(1)及聚醯亞胺(3)、及黏合劑(2)(其中存在黏合劑)、以及銅箔(4)。術語"基板"指該金屬本身(1)。具有圖案化銅箔及焊接遮罩(5)之成品稱為"金屬芯印刷電路板"或"絕緣金屬基板"(IMS)。
在一個實施例中，銅係18微米，介電質係6微米且鋁係100微米。在另一實施例中，銅係35微米，介電質係12微米且鋁的厚度係選自下述厚度之群：200微米至247微米。
本發明之複合物膜通常自具有一或多個聚醯亞胺複合物層之多層結構得到。該等聚醯亞胺複合物及層可具有導熱性、導電性、電導率、電阻率、電容及其他合意之性質。亦可用各種方式使其成層狀以產生其他所需之性質。此種用於基板上塗層之分層方案之實例闡述於美國專利第7,100,814號中，其以引入方式併入本文中。此項技術中已知之某些層狀結構缺乏可撓性，此可在其使用時導致裂紋及斷裂。層壓板厚度係約125微米至約3毫米。賦予基板可撓性使成本降低、所需之基板數更少、所需之處理更少且更易於安裝、以及改良之外觀並能形成定製形狀及可集中或分配光之更有效構造，從而提供改良之照明及外觀特徵。
實施例 測定本發明層壓板互連完整性之試驗
測定CooLamTM 層壓板在彎曲應力下之互連完整性之試驗係於基板上實施，該基板係由17微米厚的CooLamTM 熱層壓板及2毫米厚的鋁合金5005採用液晶顯示器背光單元(LCD Backlight Unit)電路設計製造而成。此試驗之目的係要確定在LED照明應用中提供此種類型構造之可行性。
樣品總體尺寸係17毫米×423毫米(5/8”×17”)且由圖1中所示之6個相同部分組成。
如圖1中所示，對6個部分中每一者上的3個位置進行測試。量測各位置中之2條粗為11.8密爾與1.4密爾之迹線(如圖2中9及10所示)在彎曲前及彎曲後的電阻。將各部分上之彎曲點中心線定位於1 1/8”直徑心軸之中心線上，並用手彎曲至約90度彎曲。層壓板/導體位於彎曲處外側使材料處於張力中。可描繪出所測試各位置之實際彎曲輪廓或將其與先前樣品迹線相比較並將試驗數據記錄於記錄薄上。下表1列出此等構造之電阻測試結果。在彎曲點經目視檢查證明焊接遮罩無裂紋或裂痕。電阻測量係使用電子科學工業公司1700系列微歐姆計系統(Electro Scientific Industries 1700 series Micro-Ohmmeter system)使用20毫歐範圍(解析度為1微歐)來進行。
所有電路線電阻之變化平均值係1.55毫歐，最大值係3毫歐且最小值係0.8毫歐。該測試表明用於金屬支持結構中之CooLamTM 材料具有以可靠之互連彎曲至90度或更大角度之潛力。
1．．．金屬層
2．．．黏合劑層
3．．．聚醯亞胺層
4．．．銅箔
5．．．焊接遮罩
6．．．彎曲位置
7．．．彎曲位置
8．．．彎曲位置
9．．．迹線
10．．．迹線
圖1顯示典型之層壓基板，其具有彎曲位置6、7及8。
圖2顯示測試線6之細節。所量測的兩條迹線標記為9及10。
圖3(A)顯示CooLamTM 層壓板之堆疊排列。圖3(B)係圖3(A)之圖例。在圖3(B)中1/2盎司至4盎司銅以公製單位計係"14.79毫升至118.29毫升"。
6．．．彎曲位置
7．．．彎曲位置
8．．．彎曲位置

Claims (10)

  1. 一種層壓板，其包括位於基板上之下列層：(a)連續的銅或鋁金屬層；(b)聚醯亞胺層或黏合劑層，該金屬層係鄰近該聚醯亞胺層或該黏合層；(c)銅箔層；及(d)液態或膜狀焊接遮罩層，其中，該層壓板彎曲後較彎曲前所增加的電阻少於11%。
  2. 如請求項1之層壓板，其中該層壓板係填充有銅箔之聚醯亞胺(PI)薄層聚合物。
  3. 如請求項2之層壓板，其中該層壓板係熱層壓板。
  4. 如請求項3之層壓板，其中該熱層壓板係選自由經氧化鋁填充之聚醯亞胺及經氧化鋁填充之聚醯亞胺組成之群，其係與鋁合金組成之基板結合使用。
  5. 如請求項1之層壓板，其中該層壓板係具有黏合劑之陽極電鍍鋁。
  6. 如請求項1之層壓板，其中該層壓板厚度為約125微米至約3毫米。
  7. 如請求項1之層壓板，其係用於LED安裝及互連。
  8. 如請求項7之層壓板，其中該層壓板係用於選自由光源、燈、信號、顯示器及舞臺照明組成之群之用途。
  9. 如請求項1之層壓板，其中該鋁金屬層係經陽極電鍍鋁。
  10. 一種金屬芯印刷電路板，其包含經圖案化之請求項1之銅箔層以及請求項1之焊接遮罩。
TW097147203A 2007-12-04 2008-12-04 用於發光二極體之安裝及互連之可彎曲電路結構 TWI554149B (zh)

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