CN101869006A - 用于led安装与互连的可弯曲电路结构 - Google Patents

用于led安装与互连的可弯曲电路结构 Download PDF

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CN101869006A
CN101869006A CN200880117433A CN200880117433A CN101869006A CN 101869006 A CN101869006 A CN 101869006A CN 200880117433 A CN200880117433 A CN 200880117433A CN 200880117433 A CN200880117433 A CN 200880117433A CN 101869006 A CN101869006 A CN 101869006A
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laminated sheet
aluminium
places
copper
substrate
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D·艾梅一世
D·R·格雷夫利
M·J·格林
S·H·怀特
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EIDP Inc
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Abstract

本发明涉及用于LED的安装与互连的可弯曲电路基板结构。

Description

用于LED安装与互连的可弯曲电路结构
发明领域
本发明涉及用于LED(发光二极管)安装与互连的挠性基板结构。
发明技术背景
在例如显示器背光照明、机动车照明、以及普通商业照明与消费者照明的应用中，目前使用绝缘金属基板来安装与互连发光二极管(LED)。目前使用的基板一般为刚性的，在不劣化与损害其机械性质、电性质和热性质的情况下无法使其变形与弯曲。期望在保持此类基板的机械完整性与热完整性、以及不引起此类基板或其电性质劣化的同时，能将此类基板材料成形或弯曲以形成角度、弧度或弯曲。
本领域已知多种多功能电子基板材料。这些基板的一些层可由例如聚酰亚胺(以下称为“PI”)的多种聚合物材料制成。一般来讲，这些基板为几乎没有柔韧性的刚性结构，除非其结构为凹槽状。
例如，美国专利2007/0076381 A1描述了具有散热片的挠性散热电路板。电路板的柔韧性来自于凹槽型，凹槽使得在基板弯曲时产生上表面与下表面的挠性。
在可见光LED电路中使用铝基板是已知的。例如Tom Morris于2007年9月18日发表在Canadian Electronics Magazine e-magazine中的一篇名为“Aluminum Substrates Make light work of visible LEDCircuits”的文章中所描述的那样。在不引起基板劣化的情况下，可将经济型可焊性聚合物厚膜导体直接丝网印刷在此类基板上。该文章提及可将铝合金基板挤压、压铸并制成特定的形状。导热铝合金材料使得设计工程师能够将高功率LED组件直接安装于其上。然而，并未提及此类合金基板的任何柔韧性。
Richard Stevenson于2007年6月发表在Compound Semiconductor上的一篇名为“Poor fixtures threaten to jeopardize theillumination potential of LEDs”的文章中，作者指出在行业中许多夹具的效率低是因为许多公司从事LED供电用电力系统工作的员工中缺乏致力于这些夹具设计方面的相关技术人员。热管理与光学设计需要利用这些技术。
因为应用扩大了对更复杂机械构造的需求，同时电路变得更薄并且更为复杂，所以期望基板可在不引起基板表面特性的任何劣化或不干扰其热性质或电性质的情况下成形。还期望选择的基板性价比高、易于操纵并且可以在夹具中使用，使得可以充分利用来自LED的光。本专利申请中描述的层压板可用于此类夹具中，因为可将其成形以改善光学性质，同时并不引起其电性质的任何劣化并可保持其热性质。使层压结构弯曲而不劣化电路的能力使得LED可以按“3D”样式配置。此类结构不限于平面样式。具有这种可弯曲的能力使装置设计者在定制与优化装置设计时拥有更多的选择。通过突破刚性基板材料与互连材料对LED安装与LED结构和夹具的限制，使得设计者能够定制与优化存在于固态照明组件中的机械特征。
期望本发明中的挠性结构可以将当前在LED结构中所见的总光电效率范围从30％增加至40％，并且期望手动优化配置，以允许在最有效率的配置下进行弯曲，从而集中与分散LED光。
发明内容
本发明涉及一种层压板，该层压板在基板上包括下列层：
(a)铜或铝金属层；
(b)聚酰亚胺或粘合剂层，金属层邻近该聚酰亚胺或粘合剂层；
(c)铜箔层；和
(d)液体或薄膜阻焊层。
该层压板可以为聚合物基薄覆铜填充的聚酰亚胺(PI)，例如CooLamTM热层压板，诸如LC(氧化铝填充的PI)和LX(氧化铝填充的PI)，该层压板与铝合金组合物基板一起使用。该层压板还可以为阳极氧化铝CooLamTM热层压板，例如LU(具有粘合剂并且阳极化的氧化铝)。必须将此类层压板设计成可以在具有LED应用中合适厚度的组合物中使用。此类层压板的使用创造了多用途的以及可弯曲的结构，从而使LED的包装轻松易用。
如上文所指出的，可用于本发明的合适材料家族为CooLamTM热层压板。实例为诸如LC(氧化铝填充的PI)、LU(具有粘合剂的阳极氧化铝)与LX(氧化铝填充的PI)的实施方案。CooLamTM结构由金属、任选地粘合剂(仅在LU(具有粘合剂的阳极氧化铝)实施方案中)、聚酰亚胺(PI)、铜箔与阻焊层组成。参见图3A与3B(图例)中的图片。LU产品还可以为氧化铝填充的。
附图简述
图1示出典型的具有弯曲位置6、7和8的层压板基板。
图2详细示出了测试线6。测定的两条迹线标注为9和10。
图3(A)示出CooLamTM层压板的堆叠布局。图3(B)用作图3(A)中的图的“图例”。在图3(B)中，1/2盎司至4盎司的铜在公制单位中为“14.79毫升至118.29毫升”。
发明详述
参见图3(A)与3(B)，本文中的术语“层压板”是指金属(1)与聚酰亚胺(3)、以及当存在粘合剂时的粘合剂(2)，再加上铜箔(4)。术语“基板”是指金属(1)自身。具有图案化铜箔与阻焊层(5)的成品被称为“金属芯印刷电路板”或“绝缘金属基板(IMS)”。
在一个实施方案中，铜在18μm处，电介质在6μm处并且铝在100μm处。在另一个实施方案中，铜在35μm处，电介质在12μm处并且铝在选自以下的厚度处：200μm和247μm。
本发明的复合膜通常来源于具有一层或多层聚酰亚胺复合材料的多层结构。这些聚酰亚胺复合材料与层可具有热导率、电导率、电阻率、电容以及其他所期望的性质。还可以多种方式将其成层以产生其他所期望的性质。对于基板上的涂层的一个此类成层方案的实例在美国专利7,100,814中有所描述，该专利以引用方式并入本文。本领域中已知的一些层状结构缺乏柔韧性，这导致在使用时出现断裂与破损。层压板的厚度为约125微米至约3毫米。允许基板具有柔韧性使成本降低，片段数量需求更少，处理需求更少并且使安装变得轻松，同时改善外观，能够实现定制的形状与更有效的配置以集中或分散光束，从而提供改善的照明和外观特性。
实施例
确定本发明中层压板的互连完整性的测试。
在使用LCD背光单元电路设计加工17微米厚的CooLamTM热层压板与2毫米厚的铝合金5005而得的基板上进行确定在弯曲应力下的CooLamTM层压板的互连完整性的测试。该测试的目的为确定在LED照明中应用此类构造的可行性。
总样本尺寸为17mm×423mm(5/8”×17”)，并且由6个相同的片段组成，如图1中所示。
在六个片段中每一个片段上测试三个位置，如图1中所示。弯曲前与弯曲后测试在图2中以9和10示出的分别为11.8密耳、1.4密耳厚的两条迹线在每一个位置的阻抗。将每一个片段上的弯曲点中心线定位在直径为11/8”的芯轴的中心线上，并用手将其弯曲至大约90度弯曲。该层压板/导体在使材料处于张力中的弯曲之外。追踪每一个测试位置的实际弯曲轮廓线或将其与先前样本迹线比较，并将测试数据录入笔记本电脑中。下面的表1汇总了构型的阻抗测试结果。在弯曲点处的肉眼检查证实阻焊层未断裂或微裂。使用Electro Scientific Industries的1700系列微欧计系统(Micro-Ohmmeter system)，在20毫欧的范围(分辨率为1微欧姆)进行阻抗测量。
所有电路线阻抗的平均变化值为1.55毫欧，其中最大变化值为3毫欧，并且最小变化值为0.8毫欧。该测试显示在金属衬层结构中使用的CooLamTM材料具有被弯曲至90度或更大角度的潜力，同时具有可靠的互连。
表1
样本 位置 迹线   弯曲之前的阻抗(毫欧)   弯曲之后的阻抗(毫欧)   阻抗变化值(毫欧)
  111111   112233   121212   17.3171717.617.417.8   18.217.918.518.418.518.6   0.90.91.50.81.10.8
  222222   112233   121212   17.317.217.718.117.817.6   19.31919.419.218.619.7   21.81.71.10.82.1
  333333   112233   121212   17.816.517.917.618.217.8   19.619.519.619.319.319.4   1.831.71.71.11.6
样本 位置 迹线   弯曲之前的阻抗(毫欧)   弯曲之后的阻抗(毫欧)   阻抗变化值(毫欧)
  444444   112233   121212   18.51818.217.917.918   19.519.919.819.719.719.6   11.91.61.81.81.6
  555555   112233   121212   17.317.917.61817.717.9   19.219.819.319.219.819.4   1.91.91.71.22.11.5
  666666   112233   121212   17.917.918.318.117.918.3   19.219.819.619.719.519.9   1.31.91.31.61.61.6

Claims (16)

1.层压板，所述层压板在基板上包括下列层：
(e)铜或铝金属层；
(f)聚酰亚胺或粘合剂层，所述金属层邻近所述聚酰亚胺或所述粘合剂层；
(g)铜箔层；和
(h)液体或薄膜阻焊层。
2.权利要求1的层压板，其中所述层压板为聚合物基薄覆铜填充的聚酰亚胺(PI)。
3.权利要求2的层压板，其中所述层压板为CooLamTM热层压板。
4.权利要求3的层压板，其中CooLamTM热层压板选自LC(氧化铝填充的PI)和LX(氧化铝填充的PI)，所述层压板与铝合金组合物基板一起使用。
5.权利要求1的层压板，其中所述层压板为LU(具有粘合剂的阳极氧化铝)。
6.权利要求1的层压板，其中所述第一金属层的组成为铝。
7.权利要求1的层压板，其中所述第一金属层的组成为铜。
8.权利要求6或权利要求7的层压板，其中所述层压板的厚度为约125微米至约3毫米。
9.权利要求1的层压板，其中所述层压板为CooLamTM层压板，并且所述金属为铝合金5005。
10.用于LED的安装与互连的权利要求1的层压板。
11.权利要求10的层压板，其中所述层压板用于选自照明设备、灯、招牌、显示器以及舞台照明的应用。
12.权利要求1的层压板，其中所述铜层在18μm处，电介质在6μm处并且铝在100μm处。
13.权利要求1的层压板，其中所述铜在35μm处，电介质在12μm处并且铝在200μm至247μm厚度处。
14.用权利要求1的层压板制成的“金属芯印刷电路板”。
15.权利要求6的层压板，其中所述铝为阳极氧化的。
16.权利要求6的层压板，其中所述铝用化学转化膜进行处理。
CN200880117433A 2007-12-04 2008-12-03 用于led安装与互连的可弯曲电路结构 Pending CN101869006A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180347A (zh) * 2013-05-20 2014-12-03 华宏新技股份有限公司 可弯曲热辐射复合物及具有所述可弯曲热辐射复合物的背光单元
CN104976578A (zh) * 2015-07-29 2015-10-14 陈丽晓 一种可变形的太阳能灯片

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101869006A (zh) * 2007-12-04 2010-10-20 E.I.内穆尔杜邦公司 用于led安装与互连的可弯曲电路结构
CN101742814B (zh) * 2009-12-22 2011-08-24 华为终端有限公司 一种印刷电路板屏蔽方法及印刷电路板
US20130199771A1 (en) * 2010-04-13 2013-08-08 Ube Industries, Ltd. Heat-dissipating substrate for led
US8629464B2 (en) 2010-12-22 2014-01-14 E. I. Du Pont De Nemours And Company Three dimensional light emitting diode systems, and compositions and methods relating thereto
US8637880B2 (en) 2010-12-22 2014-01-28 E.I. Du Pont De Nemours And Company Three dimensional light emitting diode systems, and compositions and methods relating thereto
JP5432201B2 (ja) * 2011-03-30 2014-03-05 Ｊｘ日鉱日石金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP5961970B2 (ja) * 2011-10-06 2016-08-03 大日本印刷株式会社 積層体およびそれを用いた素子
US8912447B2 (en) * 2011-10-18 2014-12-16 Fischer Technology Pte. Ltd. Method of moulding
US10199138B2 (en) 2014-02-05 2019-02-05 Essex Group, Inc. Insulated winding wire
US9324476B2 (en) * 2014-02-05 2016-04-26 Essex Group, Inc. Insulated winding wire
WO2015130681A1 (en) 2014-02-25 2015-09-03 Essex Group, Inc. Insulated winding wire
DE102014010329A1 (de) * 2014-07-14 2016-01-14 Carl Freudenberg Kg Laminat zur Herstellung einer IMS-Leiterplatte und IMS-Leiterplatte
GB2545906A (en) * 2015-12-23 2017-07-05 Univ Southampton Modular electronic structures
US20170356640A1 (en) 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
JP2018056397A (ja) 2016-09-29 2018-04-05 日亜化学工業株式会社 メタルベース基板の製造方法、半導体装置の製造方法、メタルベース基板、及び、半導体装置
JP6359605B2 (ja) * 2016-11-15 2018-07-18 株式会社京写 プリント配線板
US10488028B2 (en) * 2017-05-03 2019-11-26 Fluence Bioengineering, Inc. Systems and methods for a heat sink

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615950A (en) * 1985-03-15 1986-10-07 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
JP2529967B2 (ja) * 1987-04-15 1996-09-04 株式会社東芝 半導体集積回路装置
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JPH0836368A (ja) 1994-07-21 1996-02-06 Hiyoshi Denshi Kk イルミネーション・テープ
US5920643A (en) 1997-05-16 1999-07-06 Northeast Robotics Llc Flexible lighting element circuit and method of manufacturing the same
US6183104B1 (en) 1998-02-18 2001-02-06 Dennis Ferrara Decorative lighting system
US6502968B1 (en) 1998-12-22 2003-01-07 Mannesmann Vdo Ag Printed circuit board having a light source
US6290713B1 (en) 1999-08-24 2001-09-18 Thomas A. Russell Flexible illuminators for phototherapy
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
US6771021B2 (en) 2002-05-28 2004-08-03 Eastman Kodak Company Lighting apparatus with flexible OLED area illumination light source and fixture
US7210818B2 (en) 2002-08-26 2007-05-01 Altman Stage Lighting Co., Inc. Flexible LED lighting strip
CN100585274C (zh) 2002-10-25 2010-01-27 森山产业株式会社 发光模块
CN2637885Y (zh) 2003-02-20 2004-09-01 高勇 发光面为曲面的led灯泡
JP4627138B2 (ja) * 2003-08-06 2011-02-09 住友軽金属工業株式会社 電池包装用アルミラミネート材料
US7100814B2 (en) 2004-02-18 2006-09-05 Cardiac Pacemakers, Inc. Method for preparing integrated circuit modules for attachment to printed circuit substrates
US7086756B2 (en) 2004-03-18 2006-08-08 Lighting Science Group Corporation Lighting element using electronically activated light emitting elements and method of making same
JP2006024906A (ja) * 2004-06-10 2006-01-26 Showa Denko Kk プリント回路用アルミニウム基板及びその製造方法、並びにプリント基板及びその製造方法
US7323230B2 (en) * 2004-08-02 2008-01-29 Applied Materials, Inc. Coating for aluminum component
US7284882B2 (en) * 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
CA2605209C (en) * 2005-04-19 2013-10-22 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board, light-emitting diode and led light source unit
TWI302821B (en) * 2005-08-18 2008-11-01 Ind Tech Res Inst Flexible circuit board with heat sink
JP4672515B2 (ja) * 2005-10-12 2011-04-20 Ｊｘ日鉱日石金属株式会社 屈曲用圧延銅合金箔
JP2007134550A (ja) * 2005-11-11 2007-05-31 Fujikura Ltd 多層プリント配線板の製造方法
CN101869006A (zh) * 2007-12-04 2010-10-20 E.I.内穆尔杜邦公司 用于led安装与互连的可弯曲电路结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180347A (zh) * 2013-05-20 2014-12-03 华宏新技股份有限公司 可弯曲热辐射复合物及具有所述可弯曲热辐射复合物的背光单元
CN104976578A (zh) * 2015-07-29 2015-10-14 陈丽晓 一种可变形的太阳能灯片

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