WO2013187329A1 - 太陽電池モジュールの製造方法、太陽電池用導電性接着剤、太陽電池モジュール - Google Patents

太陽電池モジュールの製造方法、太陽電池用導電性接着剤、太陽電池モジュール Download PDF

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Publication number
WO2013187329A1
WO2013187329A1 PCT/JP2013/065855 JP2013065855W WO2013187329A1 WO 2013187329 A1 WO2013187329 A1 WO 2013187329A1 JP 2013065855 W JP2013065855 W JP 2013065855W WO 2013187329 A1 WO2013187329 A1 WO 2013187329A1
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WO
WIPO (PCT)
Prior art keywords
solar cell
conductive adhesive
cell module
powder
solder powder
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PCT/JP2013/065855
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English (en)
French (fr)
Japanese (ja)
Inventor
賢一郎 花村
正弘 西本
太一 小山
Original Assignee
デクセリアルズ株式会社
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Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR20157000434A priority Critical patent/KR20150030700A/ko
Priority to CN201380030966.3A priority patent/CN104350610B/zh
Publication of WO2013187329A1 publication Critical patent/WO2013187329A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a method for manufacturing a solar cell module, a conductive adhesive for solar cells, and a solar cell module, and more particularly to a solar cell for conductively connecting electrodes formed on solar cells and tab wires connecting between solar cells.
  • the present invention relates to an improvement of a conductive adhesive.
  • a solar cell module in which a plurality of solar cells each having a p-type electrode and an n-type electrode on the light-receiving surface and a p-type electrode and the other of the n-type electrode on the back surface opposite to the light-receiving surface are connected.
  • this type of solar cell module 50 includes a front electrode 52 provided on the light receiving surface of the solar cell 51A and a back electrode 53 provided on the back surface of the adjacent solar cell 51B.
  • the tab lines 54 are connected by soldering at several places, thereby forming a string.
  • the back contact type solar cell module in which both a p-type electrode and an n-type electrode are provided on the back surface of the solar cell.
  • both the p-type electrode and the n-type electrode are provided on the back surface of the solar cell.
  • the back contact type solar cell module does not need to be provided with electrodes or tab wires on the surface of the solar cell serving as the light receiving surface, and the light receiving efficiency is improved and the appearance is also improved.
  • the back contact type solar battery module is different from the type in which electrodes are provided on the front and back surfaces of the solar battery cell, and the tab wire can be routed across the surface of one solar battery cell and the back surface of another solar battery cell. In addition, the manufacturing process becomes easy.
  • FIG. 9 shows a connection configuration of solar cells in a conventional back contact type solar cell module 60.
  • p-type electrodes 62 and n-type electrodes 63 are alternately arranged on the back surface, and a p-type electrode current collector 64 that is continuous with one end of the p-type electrode 62 along one side edge.
  • An n-type electrode current collector 65 that is formed and continues to each end of the n-type electrode 63 is formed along the other side edge.
  • connection points 67 with the tab wire 66 are provided at opposite positions. And each solar cell 61 is arrange
  • the temperature is about 260 ° C. Since the connection process is performed, there is a concern about warping of the solar cells 51 and 61.
  • a method of using a conductive adhesive paste in which conductive particles are contained in an insulating thermosetting resin composition as an adhesive instead of using solder for connecting the tab wires 54 and 66.
  • the tab wires 54 and 66 are arranged on the electrodes of the solar cells 51 and 61 through the conductive adhesive paste, and heat is pressed from above the tab wires 54 and 66.
  • the conductive particles are sandwiched between the electrodes of the solar cells 51 and 61 and the tab wires 54 and 66, thereby achieving electrical conduction and mechanical connection.
  • the present invention provides a method for manufacturing a solar cell module, a conductive adhesive for solar cells, and a solar cell module that do not impair conduction reliability and adhesive strength even when connected using a conductive adhesive. With the goal.
  • a method for manufacturing a solar cell module includes a method for manufacturing a solar cell module in which electrodes formed on a plurality of solar cells are connected to each other via a connection conductor.
  • a conductive adhesive is interposed between the electrode of the solar cell and the connection conductor, the electrode and the connection conductor are heated and pressed to cure the conductive adhesive, and the electrode and the connection conductor.
  • the conductive adhesive contains solder powder and silver powder in a thermosetting resin, and the solder powder reacts with the silver powder under the heating and pressing treatment, A high melting point solder alloy showing a melting point higher than the melting temperature of the solder powder is produced.
  • the conductive adhesive for solar cells comprises an electrode formed on a solar cell constituting a solar cell module and a connection conductor connecting the electrodes formed on a plurality of the solar cells.
  • the thermosetting resin contains solder powder and silver powder, and the solder powder is Sn-Bi, and the mass ratio of Sn-Bi: silver powder is 2: 1 to 1: 2.
  • the solar cell module according to the present invention is a solar cell module in which electrodes formed on a plurality of solar cells are connected to each other via a connection conductor, and the electrode formed on the solar cell and the connection conductor. Is connected by a conductive adhesive, the conductive adhesive contains solder powder and silver powder in a thermosetting resin, the solder powder reacts with the silver powder under the heating and pressing treatment, A high melting point solder alloy having a melting point higher than the melting temperature of the solder powder is produced.
  • the solder powder and the silver powder are contained in the thermosetting resin, and the solder powder reacts with the silver powder under the heating and pressing treatment, and exhibits a melting point higher than the melting temperature of the solder powder.
  • a melting point solder alloy is produced.
  • the conductive adhesive is heat-cured, the solder powder is melted before reaching the heat-curing treatment temperature, and thus, a relatively small amount of melted solder powder is continuously passed through the silver powder in the thermosetting resin.
  • a network continuous metal phase
  • FIG. 1 is an exploded perspective view showing a solar cell module.
  • FIG. 2 is a perspective view showing the light-receiving surface side of the solar battery cell.
  • FIG. 3 is a cross-sectional view showing a solar battery cell.
  • FIG. 4 is a cross-sectional view showing the manufacturing process of the solar battery cell.
  • FIG. 5 is a cross-sectional view showing a conductive adhesive film.
  • FIG. 6 is a cross-sectional view showing the solar cell module.
  • FIG. 7 is a perspective view for explaining the embodiment.
  • FIG. 8 is a cross-sectional view showing a conventional solar cell module.
  • FIG. 9 is a plan view showing a conventional solar cell module.
  • the solar cell module 1 to which the present invention is applied will be described by taking as an example a so-called back contact type solar cell module in which both a p-type electrode and an n-type electrode are provided on the back surface of the solar cell.
  • the solar cell module 1 has strings 4 in which a plurality of solar cells 2 are connected in series by connecting conductors 3 serving as interconnectors, and a matrix 5 in which a plurality of strings 4 are arranged Prepare.
  • the solar cell module 1 is sealed by laminating the matrix 5 together with the sheet 6 of the sealing adhesive and the surface cover 7 provided on the light receiving surface side. Finally, the surroundings are made of aluminum or the like.
  • the metal frame 9 is attached.
  • sealing adhesive for example, a translucent sealing material such as ethylene vinyl alcohol resin (EVA) is used.
  • EVA ethylene vinyl alcohol resin
  • surface cover 7 for example, a light-transmitting material such as glass or light-transmitting plastic is used.
  • the solar cell 2 uses, as a photoelectric conversion element, a silicon photoelectric conversion element such as a single crystal silicon type, a polycrystalline silicon type, or an amorphous silicon type, or a photoelectric conversion element such as a thin film type, a compound type, or a dye sensitizing type. Can do. Especially, the solar cell 2 can use suitably the single crystal silicon photoelectric conversion element excellent in power generation efficiency.
  • the solar cell 2 has no electrode formed on the surface 2a serving as the light receiving surface, and the p-type electrodes 11 and n having different polarities on the back surface 2b opposite to the light receiving surface.
  • a mold electrode 12 is formed.
  • the p-type electrodes 11 and the n-type electrodes 12 in a line shape are alternately arranged on the back surface 2 b and are connected to one end of the plurality of p-type electrodes 11 along one side edge.
  • a n-type electrode current collector 13 is provided, and an n-type electrode current collector 14 connected to each end of the plurality of n-type electrodes 12 is provided along the other side edge.
  • the p-type electrode current collector 13 and the n-type electrode current collector 14 are provided along one opposite side edge and the other side edge of the solar cell 2 and have a predetermined width.
  • the p-type electrode 11 and the p-type electrode current collector 13 are formed in a comb shape, and each is alternately between the combs. It has entered.
  • a conductive paste such as Ag paste is applied to the back surface 2 b of the solar cell 2 in a predetermined pattern. It is formed by firing.
  • the solar cell 2 is electrically connected to the p-type electrode current collector 13 and the n-type electrode current collector 14 of the adjacent solar cell 2 by a connecting conductor 3 to be described later.
  • the formed strings 4 are configured.
  • the connection conductor 3 is connected to the p-type electrode current collector 13 and the n-type electrode current collector 14 by a conductive adhesive paste 20 described later.
  • connection conductor 3 that connects the solar cells 2 to each other will be described.
  • the connection conductor 3 has a wiring 17 formed on an insulating substrate 16, and has, for example, a terminal 17 a for connecting a plurality of solar cells 2 in series.
  • a polymer resin substrate such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polyimide, a composite material in which an insulating resin is impregnated into glass fiber, or the like can be used.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • polyimide a composite material in which an insulating resin is impregnated into glass fiber, or the like
  • the wiring 17 and the terminal 17a copper, aluminum, iron-nickel alloy, or the like can be used.
  • the connecting conductor 3 is covered with an insulating layer 18 on the wiring 17.
  • the insulating layer 18 is made of an insulating material and prevents corrosion due to, for example, acetic acid gas released from the EVA sheet.
  • an insulating material an epoxy resin, an acrylic resin, a urethane resin etc. are mentioned, for example, These resins may be used individually or may use 2 or more types together. These resins may contain inorganic powders such as silica, mica, alumina, and barium sulfate.
  • the connection conductor 3 includes a p-type electrode current collector 13 provided on the back surface 2b of one solar cell 2A and an n-type provided on the back surface 2b of another solar cell 2B adjacent to the one solar cell 2A.
  • a terminal 17a is disposed on the electrode current collector 14 via a conductive adhesive such as a conductive adhesive paste 20 described later.
  • the conductive adhesive paste 20 is hardened
  • the conductive adhesive that connects the p-type electrode current collector 13 and the n-type electrode current collector 14 of the solar cell 2 and the connection conductor 3 will be described.
  • a conductive adhesive paste 20 containing solder powder and silver powder in a thermosetting resin composition to be an adhesive is used as the conductive adhesive.
  • thermosetting resin As a curing component constituting the thermosetting resin, an epoxy resin, a phenol resin, a urethane resin or the like having an adhesive action by performing a thermosetting treatment with a curing agent can be used, and among them, the flux component is inactivated. Therefore, it is preferable to use an epoxy resin.
  • epoxy resins include glycidyl ether type epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, and novolac type epoxy resins.
  • generally known materials such as an alicyclic epoxy resin and a heterocyclic ring-containing epoxy resin can be applied.
  • thermosetting resin having a relatively high reaction rate
  • the curing rate of the thermosetting resin increases with the use thereof, so that the network (continuous metal phase) is formed more quickly by the molten solder powder. It is preferable to do so. In that case, solder powder having a lower melting point may be used.
  • a curing agent corresponding to the curing component is used.
  • the curing component is an epoxy resin
  • there is no gas generation during thermal curing and a long pot life can be realized when mixed with the epoxy resin, and the electrical properties, chemical properties and machinery of the resulting cured product
  • an acid anhydride as a curing agent from the viewpoint that a good balance between physical properties can be realized.
  • thermosetting a curing agent having a flux activity
  • the wettability of molten solder with respect to silver powder can be improved during thermosetting, and a relatively small amount is contained in the thermosetting product of the conductive adhesive.
  • a continuous network metal continuous phase
  • a proton acid group such as a carboxyl group, a sulfonyl group, or a phosphate group is introduced into the curing agent by a known method. Especially, it is preferable to apply a carboxyl group from the point of reactivity with an epoxy resin.
  • a monocarboxylic anhydride of a tricarboxylic acid having a free carboxyl group preferably cyclohexane-1,2,4-tricarboxylic acid-1,2-
  • acid anhydrides may be mentioned.
  • the content ratio of the curing component and the curing agent in the thermosetting resin varies depending on the type of the curing component and the curing agent, but when the curing component is an epoxy resin and the curing agent is a tricarboxylic acid monoacid anhydride, If the content of the epoxy resin is relatively large or too small, the curing becomes insufficient, so the equivalent ratio ([epoxy resin] / [curing agent]) on the molar equivalent basis is preferably 1: 0.5 to 1: 1.5, more preferably 1: 0.8 to 1: 1.2.
  • thermosetting adhesives such as pigments, ultraviolet absorbers, curing accelerators, silane coupling agents, are included in the thermosetting resin. Can be added as long as the effects of the invention are not impaired.
  • thermosetting resin can be adjusted by uniformly mixing a curing component, a curing agent, and other additives by a conventional method.
  • thermosetting resin contains solder powder and silver powder.
  • Silver powder has a low electrical resistance but a high melting point, and does not melt by heating during the normal thermosetting treatment of thermosetting resins. Therefore, to achieve efficient conductivity using only silver powder as conductive particles Needs to contact silver powder which is not melted. For that purpose, a large amount of silver powder is blended with the thermosetting resin. However, when a large amount of silver powder is blended, the content of the thermosetting resin is relatively decreased, and the adhesive force may be decreased.
  • solder powder showing a melting temperature near the thermosetting temperature is used, and the silver powder is networked with the molten solder powder (metal (Continuous phase).
  • solder powder for use for such a purpose specifically, it exhibits a melting temperature lower than the thermosetting temperature of the thermosetting resin, and silver powder under the thermosetting condition of the thermosetting resin. What reacts and produces
  • solder powder examples include Sn—Bi solder powder, Sn—In solder powder, and Sn—Zn solder powder.
  • Sn—Bi solder powder is preferred from the viewpoint of low-temperature melting property.
  • Sn-In solder powder can be mentioned more preferably.
  • Sn-Bi solder powder Sn-58Bi eutectic solder powder (melting point 139 ° C.)
  • Sn—In solder powder Sn-52In solder powder (melting point 117 ° C.)
  • Specific examples of Sn—Zn solder powder include Sn-9Zn solder powder (melting point: 199 ° C.).
  • Examples of the particle shape of silver powder and solder powder include a spherical shape, a flat shape, a granular shape, and a needle shape.
  • the mass ratio of the silver powder and the solder powder is preferably because the former (too much metal) tends to reduce the network (continuous metal phase), and if the former is too little, the amount of high melting point solder tends to be reduced.
  • the weight ratio is 1: 2 to 2: 1, more preferably 1: 1.5 to 1.5: 1.
  • the conductive adhesive paste 20 is prepared by uniformly mixing the above-described metal filler and thermosetting resin by a conventional method, and an organic solvent may be added as necessary.
  • an organic solvent may be added as necessary.
  • the content of the metal filler in the thermosetting resin mass-based metal filler filling rate defined by the following formula (1)
  • it is preferably 75 to 95%, more preferably 80 to 90%.
  • Metal filler filling rate (%) ⁇ Metal filler / (metal filler + curing component + curing agent) ⁇ ⁇ 100 (1)
  • the manufacturing process of the solar cell module 1 will be described with reference to FIG.
  • the insulating substrate 16 on which the terminal 17a that is electrically connected to the electrode current collectors 13 and 14 formed on the back surface 2b of the solar cell 2 is formed is disposed.
  • the conductive adhesive paste 20 is applied on the terminals 17a.
  • seat 6a of a sealing adhesive material is mounted on the insulating substrate 16, and the solar cell 2 is laminated
  • the solar cell 2 aligns the p-type electrode current collector 13 and the n-type electrode current collector 14 formed on the back surface 2b with the terminal 17a of the connection conductor 3. Thereby, the connection conductor 3 is disposed across the adjacent p-type electrode current collector 13 and n-type electrode current collector 14 between the two solar cells 2.
  • the conductive adhesive paste 20 applied on the p-type electrode current collector 13 does not touch the nearby n-type electrode 12, and the conductive adhesive applied on the n-type electrode current collector 14.
  • the paste 20 is prevented from touching the nearby p-type electrode 11.
  • one terminal 17a of the connection conductor 3 disposed on the p-type electrode current collector 13 is prevented from touching the nearby n-type electrode 12, and is disposed on the n-type electrode current collector 14.
  • the other terminal 17a of the connecting conductor 3 is made so as not to touch the p-type electrode 11 in the vicinity.
  • a sheet 6b of sealing adhesive is placed on the light receiving surface of the solar cell 2, and the surface cover 7 is placed thereon. Then, the laminate is laminated and pressed from the upper surface of the surface cover 7 while being heated with a heater by a laminating apparatus (decompressing laminator).
  • a laminating apparatus decompressing laminator
  • the conductive adhesive paste 20 is hot-pressed for a predetermined time at a predetermined temperature (for example, 150 to 180 ° C.) and a predetermined pressure (for example, 0.5 to 2.0 MPa) by a reduced pressure laminator. .
  • a predetermined temperature for example, 150 to 180 ° C.
  • a predetermined pressure for example, 0.5 to 2.0 MPa
  • the conductive adhesive paste 20 melts the solder powder before reaching the thermosetting temperature, and thereby a continuous network (metal) with a relatively small amount of molten solder powder in the thermosetting resin through the silver powder.
  • a continuous phase the conductive adhesive paste 20 flows out of the thermosetting resin from between the connecting conductor 3 and the p-type electrode current collector 13 and the n-type electrode current collector 14, and silver powder or the above-described network (continuous metal).
  • thermosetting resin is cured in this state.
  • the connecting conductor 3, the p-type electrode current collector 13 and the n-type electrode current collector 14 are conductively connected via the conductive adhesive paste 20, and the adjacent solar cells 2 are connected in series.
  • a metal frame 9 such as aluminum is attached to the periphery, and the solar cell module 1 is completed.
  • the solder powder contained in the thermosetting resin exhibits a melting temperature lower than the thermosetting temperature of the thermosetting resin, and the thermosetting conditions of the thermosetting resin. It reacts with the silver powder below to produce a high melting point solder alloy showing a melting point higher than the melting temperature of the solder powder.
  • a network of high-melting-point solder alloys that are continuous through silver powder with a relatively small amount of molten solder powder in the thermosetting resin below the curing temperature until the thermosetting resin is cured (continuous metal phase) ,
  • the terminal 17a of the connecting conductor 3 and the electrode current collectors 13 and 14 of the solar cell 2 are electrically connected, and then the thermosetting resin is thermoset. Therefore, the solar cell module 1 can exhibit high conduction reliability, relatively increase the content of the thermosetting resin, and improve the adhesive strength between the solar cell electrode and the connection conductor.
  • the conductive adhesive paste 20 has high thermal conductivity, the entire thermosetting resin has high thermal conductivity because silver powder has high thermal conductivity. Therefore, the conductive adhesive paste 20 has fast curability in the heat and pressurization step, the heating time is short, the thermal shock to the solar cell 2 is suppressed, and the tact time can be shortened. Furthermore, in the solar cell module 1 manufactured using the conductive adhesive paste 20, the molten solder powder reacts with the silver powder under the thermosetting treatment to exhibit a melting point higher than the melting temperature of the solder powder. Since the solder alloy is generated, the heat resistance of the conductive adhesive layer is increased, and the mechanical connection reliability can be improved.
  • the conductive adhesive may be a conductive adhesive film 21 formed into a film by adding a film-forming resin to a thermosetting resin as shown in FIG. .
  • the film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formability.
  • various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin can be used. Among them, a phenoxy resin is preferably used from the viewpoint of the film formation state, connection reliability, and the like. .
  • the conductive adhesive film 21 is a thermosetting resin obtained by mixing the above-described metal filler and a thermosetting resin and applying a resin composition appropriately added with an organic solvent on the base film 22 and volatilizing the solvent.
  • the layer 23 is formed by laminating.
  • the base film 22 is not particularly limited, and PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), or the like can be used.
  • PET Poly Ethylene Terephthalate
  • OPP Oriented Polypropylene
  • PMP Poly-4-methlpentene-1
  • PTFE Polytetrafluoroethylene
  • the conductive adhesive film 21 is formed in a tape shape and wound and stored on a reel 24. In actual use, the conductive adhesive film 21 is pulled out from the reel 24 and substantially the same as the terminal 17a formed on the connecting conductor 3. It is cut to an equivalent predetermined length. Then, after the thermosetting resin layer 23 is temporarily affixed on the terminal 17a and the base film 22 is peeled off, the conductive adhesive film 21 has the p-type electrode current collector 13 and the n-type electrode current collector of the solar cell 2. Part 14 is arranged. In the solar cell 2, adjacent p-type electrode current collectors 13 and n-type electrode current collectors 14 are arranged between terminals 17 a formed on the connection conductor 3, whereby a plurality of solar cells 2 are connected. Solar cell strings 4 connected by the conductor 3 are formed. Thereafter, the solar cell module 1 is formed by the same process as described above.
  • the conductive adhesive film 22 is not limited to the reel shape formed in a long shape, but may be a strip shape corresponding to the terminal 17a.
  • FIG. 1 A solar cell 31 in which a plurality of solar cells 31 each having a back electrode 34 made of the other of a p-type electrode and an n-type electrode are provided on a back surface 31b opposite to the light receiving surface 31a is connected via a tab wire 32 serving as a connection conductor. It can also be applied to the battery module 1.
  • the tab wire 32 is formed by using, for example, a ribbon-like copper foil having a thickness of 50 to 300 ⁇ m, and performing gold plating, silver plating, tin plating, solder plating or the like as necessary. Further, the tab wire 32 is disposed on one surface of the surface electrode 33 of the one solar cell 31 through the conductive adhesive, and the other end of the tab wire 32 is adjacent to the one solar cell 31. It is disposed on the electrode 34.
  • the conductive adhesive paste 20 or the conductive adhesive film 21 described above is used as a conductive adhesive for electrically connecting the front electrode 33 and the back electrode 34 formed on the solar cell 31 and the tab wire 32.
  • the conductive adhesive paste 20 and the conductive adhesive film 21 are supplied between the surface electrode 33 and the back electrode 34 formed on the light receiving surface 31 a and the back surface 31 b of the solar cell 31 and the tab wire 32, From a heat press head (not shown), the resin is thermally cured by being heated and pressed at a predetermined temperature and a predetermined pressure for a predetermined time.
  • the conductive adhesive is a continuous network (a continuous phase of metal) with a relatively small amount of molten solder powder in the thermosetting resin through the silver powder until the thermosetting resin is cured.
  • the thermosetting resin is thermoset after the tab wire 32 is sandwiched between the front electrode 33 and the back electrode 34 of the solar cell 31. Therefore, the solar cell module 1 exhibits high conduction reliability and relatively increases the content of the thermosetting resin, thereby bonding the electrodes 33 and 34 of the solar cell 31 and the tab wire 32 serving as a connection conductor. Strength can be improved.
  • the conductive adhesive film 21 may be provided with a tab wire 32 in place of the base film 22 or on the side opposite to the base film 22.
  • a plurality of conductive adhesive pastes in which a metal filler contained in a thermosetting resin is replaced are used to form an Ag electrode and a flexible substrate (FPC) formed on a glass substrate.
  • a connection structure sample in which the connection terminal was connected was formed, and the conduction resistance between the Ag electrode and the connection terminal was measured.
  • an Ag solid electrode 41 is formed on the entire surface of the glass substrate 40, and the conductive adhesive paste 42 according to the example and the comparative example is formed on the Ag electrode 41 with a thickness of 200 ⁇ m and a diameter. It was printed in a 5 mm circle.
  • an EVA sheet in which a connecting portion was hollowed in a circular shape having a diameter of 10 mm was overlaid in advance.
  • the FPC 43 has a connection terminal 44 having the same shape as that of the conductive adhesive.
  • the FPC 43 is connected by overlapping the connection terminal 44 with the conductive adhesive paste 42 facing the opening of the EVA sheet and pressing with a decompression laminator.
  • a structure sample was prepared.
  • thermocompression bonding 160 ° C. (temperature of the conductive adhesive paste), 0.1 MPa, and 20 minutes.
  • the conduction resistance between the Ag electrode and the connection terminal of the connection structure sample was measured after the initial connection and TCT (Temperature Cycle Test: ⁇ 40 ° C., 30 min ⁇ ⁇ 125 ° C., 30 min; 200 cycles) using a digital multimeter. It was measured. Then, the case where the rate of increase of the resistance value with respect to the resistance value at the initial stage of connection was less than 15% was marked with ⁇ , the value between 15% and less than 30% was ⁇ , and the case where it was 30% or more was marked with ⁇ .
  • thermosetting resin constituting the conductive adhesive paste is 100 parts by mass of a bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation: JER806) as a curing component, and cyclohexane-1,2,4-tricarboxylic acid-1, It was obtained by mixing 80 parts by mass of 2-acid anhydride (Mitsubishi Gas Chemical Co., Ltd .: H-TMAn / H-TMAn-S).
  • Example 1 With respect to 100 parts by mass of the thermosetting resin described above, 470 parts by mass of Sn-58Bi solder powder (Mitsui Metal Mining Co., Ltd .: Sn-Bi solder powder) having an average particle size of 20 ⁇ m as a metal filler, and 230 parts by mass of silver powder (Fukuda Metal Foil Powder Co., Ltd .: AgC-224) was mixed (Sn-Bi: silver powder ⁇ 2: 1).
  • Example 6 230 parts by mass of Sn-58Bi solder powder (Mitsui Metal Mining Co., Ltd .: Sn-Bi solder powder) having an average particle size of 20 ⁇ m as a metal filler with respect to 100 parts by mass of the thermosetting resin described above, and 470 parts by mass of silver powder (Fukuda Metal Foil Powder Co., Ltd .: AgC-224) was mixed (Sn-Bi: silver powder ⁇ 1: 2).
  • thermosetting resin contains solder powder and silver powder as metal fillers
  • the rate of increase in resistance value after TCT was less than 30%. This is because a continuous network (metal continuous phase) is formed through the silver powder with solder powder melted in the thermosetting resin until the thermosetting resin is cured, and the Ag solid electrode 41 of the glass substrate 40 and This is because electrical connection is established between the connection terminal 44 of the FPC 43 and the thermosetting resin is thermoset in this state.
  • the Ag solid electrode 41 of the glass substrate 40 and the connection terminal 44 of the FPC 43 are firmly connected, and excellent electrical conductivity is exhibited even after TCT.
  • Comparative Example 1 and Comparative Example 2 containing only one of solder powder or silver powder as the metal filler, the initial conduction resistance is high, and after TCT, the Ag solid electrode 41 of the glass substrate 40 and the connection terminal 44 of the FPC 43 The resistance was not able to be measured because the gap was open.
  • Example 1 When comparing Example 1 with other examples, in Example 1, since the Ag powder was relatively small, the amount of high melting point solder alloy produced was relatively small, and the resistance value increased slightly after TCT. From this, it can be seen that the mass ratio of silver powder to solder powder is 1: 2 to 2: 1, more preferably 1: 1.5 to 1.5: 1.

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PCT/JP2013/065855 2012-06-13 2013-06-07 太陽電池モジュールの製造方法、太陽電池用導電性接着剤、太陽電池モジュール WO2013187329A1 (ja)

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