JP5289291B2 - 電子部品の製造方法、電子部品および導電性フィルム - Google Patents
電子部品の製造方法、電子部品および導電性フィルム Download PDFInfo
- Publication number
- JP5289291B2 JP5289291B2 JP2009273998A JP2009273998A JP5289291B2 JP 5289291 B2 JP5289291 B2 JP 5289291B2 JP 2009273998 A JP2009273998 A JP 2009273998A JP 2009273998 A JP2009273998 A JP 2009273998A JP 5289291 B2 JP5289291 B2 JP 5289291B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- layer
- wiring
- conductive layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000010410 layer Substances 0.000 claims description 180
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000002313 adhesive film Substances 0.000 claims description 14
- 239000000969 carrier Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 52
- 206010040844 Skin exfoliation Diseases 0.000 description 17
- 238000002788 crimping Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000012789 electroconductive film Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Non-Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
112 光電変換部
114 光入射面
116 フィンガー電極
120 導電性フィルム
130 導電層
132 熱硬化性樹脂
134 粒子
140 剥離層
150 緩衝部材
160 ヒーターヘッド
210 非圧着領域
220 圧着領域
500 太陽電池モジュール
518 タブ線
600 太陽電池モジュール
610 太陽電池セル
612 光電変換部
616 フィンガー電極
618 タブ線
714 バスバー電極
730 導電層
1300 基材
1312 ガラス基板
1316 配線
1420 導電性フィルム
1460 ヒーターヘッド
Claims (11)
- 配線を有する電子部品の製造方法であって、
表面に前記配線が設けられた基板に、接着層と剥離層とが積層されてなる接着フィルムを、前記接着層を前記表面に対向させて配置する配置段階と、
前記接着フィルムを前記基板に対して押圧することにより、前記配線を前記接着層に挿入させて前記接着層を切断する切断段階と、
切断された前記接着層の一方の接着層を前記表面から離間させる離間段階と、
切断された前記接着層の他方の接着層から前記剥離層を剥離する剥離段階と
を備える製造方法。 - 前記切断段階は、前記他方の接着層を加熱する加熱段階を有する
請求項1に記載の製造方法。 - 前記切断段階は、前記接着層のうちの前記配線と接する領域の近傍を加熱する加熱段階を有する
請求項1または2に記載の製造方法。 - 前記電子部品は、光が入射されることにより光生成キャリアを発生させる光電変換部を有する太陽電池モジュールであり、
前記配線は、前記光電変換部が発生させた光生成キャリアを収集するフィンガー電極である
請求項1から3のいずれかに記載の製造方法。 - 前記剥離層が剥離された前記他方の接着層にタブ線を接着して、前記タブ線と前記フィンガー電極とを電気的に接続する電気接続段階
をさらに備える
請求項4に記載の製造方法。 - 前記接着層が、導電性を有する、
請求項1から請求項5までの何れか一項に記載の製造方法。 - 接着層の貼り付け方法であって、
表面に配線が設けられた基板に、前記接着層と剥離層とが積層されてなる接着フィルムを、前記接着層を前記表面に対向させて配置する配置段階と、
前記接着フィルムを前記基板に対して押圧することにより、前記配線を前記接着層に挿入させて前記接着層を切断する切断段階と、
切断された前記接着層の一方の接着層を前記表面から離間させる離間段階と、
切断された前記接着層の他方の接着層から前記剥離層を剥離する剥離段階と
を備える貼り付け方法。 - 基板と、
前記基板の表面に設けられた配線と、
前記表面に貼り付けられた接着層と
を備え、
前記配線は、前記表面に対して前記接着層より高く形成されており、
前記接着層は、前記配線によって切断されている
電子部品。 - 複数の前記配線を備え、
前記複数の配線のうちの第1配線は、前記表面に対して前記複数の配線のうちの他の配線より高く形成されており、
前記接着層は、前記第1配線の一方の側面側に貼り付けられており、前記第1配線の他方の側面側に貼り付けられていない
請求項8に記載の電子部品。 - 前記電子部品は、太陽電池モジュールであり、
前記基板は、光が入射されることにより光生成キャリアを発生させる光電変換部を有し、
前記複数の配線は、前記光電変換部が発生した光生成キャリアを収集する複数のフィンガー電極であり、
前記接着層は、前記複数のフィンガー電極の少なくとも一部に接する、
請求項9に記載の電子部品。 - 導電層と剥離層とが積層されてなる導電性フィルムであって、
前記導電層は、熱硬化性樹脂および導電性粒子を含み、30℃と180℃との間で軟化し、60℃以上で熱硬化し、
前記導電性フィルムが、前記導電層の厚さより高い配線を表面に有する基板に前記配線を跨いで配置され、前記導電層の少なくとも一部が、加熱されることにより軟化され、軟化された前記導電層に前記配線が挿入されることで前記導電層が切断され、切断された前記導電層の一方の導電層が前記表面から離間され、切断された前記導電層の他方の導電層から前記剥離層が剥離され、前記他方の導電層が熱硬化されることにより、前記他方の導電層が前記基板の表面に貼り付けられる導電性フィルム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009273998A JP5289291B2 (ja) | 2009-12-01 | 2009-12-01 | 電子部品の製造方法、電子部品および導電性フィルム |
EP10834332.8A EP2509400A4 (en) | 2009-12-01 | 2010-06-22 | METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND CONDUCTIVE FILM |
PCT/JP2010/004144 WO2011067875A1 (ja) | 2009-12-01 | 2010-06-22 | 電子部品の製造方法、電子部品および導電性フィルム |
KR1020117029658A KR101287782B1 (ko) | 2009-12-01 | 2010-06-22 | 전자 부품의 제조 방법, 전자 부품 및 도전성 필름 |
TW099120869A TW201121072A (en) | 2009-12-01 | 2010-06-25 | Method for manufacturing electronic component, electronic component and conductive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009273998A JP5289291B2 (ja) | 2009-12-01 | 2009-12-01 | 電子部品の製造方法、電子部品および導電性フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011119367A JP2011119367A (ja) | 2011-06-16 |
JP5289291B2 true JP5289291B2 (ja) | 2013-09-11 |
Family
ID=44114739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009273998A Active JP5289291B2 (ja) | 2009-12-01 | 2009-12-01 | 電子部品の製造方法、電子部品および導電性フィルム |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2509400A4 (ja) |
JP (1) | JP5289291B2 (ja) |
KR (1) | KR101287782B1 (ja) |
TW (1) | TW201121072A (ja) |
WO (1) | WO2011067875A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5745349B2 (ja) * | 2011-06-27 | 2015-07-08 | デクセリアルズ株式会社 | 太陽電池モジュールの製造方法 |
KR20130013841A (ko) * | 2011-07-29 | 2013-02-06 | 엘지이노텍 주식회사 | 태양전지 접속부재 부착방법 |
JP2013045994A (ja) * | 2011-08-26 | 2013-03-04 | Dexerials Corp | 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法 |
JP6039905B2 (ja) * | 2012-02-14 | 2016-12-07 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法 |
US8998622B2 (en) | 2012-08-31 | 2015-04-07 | Apple Inc. | Electrical connectors with applicators for electronic devices |
KR102319471B1 (ko) * | 2014-06-11 | 2021-10-28 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 태양전지 및 태양전지의 제조 방법 |
JP6199839B2 (ja) | 2014-09-30 | 2017-09-20 | 信越化学工業株式会社 | 太陽電池及びその製造方法 |
JP6654815B2 (ja) * | 2015-06-09 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続方法、セラミック基板の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02293721A (ja) * | 1989-05-08 | 1990-12-04 | Sharp Corp | 異方性導電膜貼り付け方法 |
JPH0837208A (ja) * | 1994-07-25 | 1996-02-06 | Toshiba Corp | 半導体素子の実装方法およびその装置 |
JPH11204567A (ja) * | 1997-10-28 | 1999-07-30 | Seiko Epson Corp | 異方性導電接着剤およびその基板への形設方法ならびに半導体チップ実装方法ならびに半導体装置 |
JP2005327922A (ja) * | 2004-05-14 | 2005-11-24 | Alps Electric Co Ltd | 導電接合膜貼着方法および導電接合膜貼着装置 |
TWI487124B (zh) * | 2006-08-25 | 2015-06-01 | Sanyo Electric Co | 太陽電池模組及太陽電池模組的製造方法 |
JP4958525B2 (ja) * | 2006-11-29 | 2012-06-20 | 三洋電機株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
JP4294048B2 (ja) | 2006-11-29 | 2009-07-08 | 三洋電機株式会社 | 太陽電池モジュール |
JP5010493B2 (ja) * | 2008-02-05 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着フィルムの転着方法 |
CN101939847B (zh) * | 2008-02-08 | 2012-04-25 | 三洋电机株式会社 | 太阳能电池模块和太阳能电池 |
-
2009
- 2009-12-01 JP JP2009273998A patent/JP5289291B2/ja active Active
-
2010
- 2010-06-22 WO PCT/JP2010/004144 patent/WO2011067875A1/ja active Application Filing
- 2010-06-22 EP EP10834332.8A patent/EP2509400A4/en not_active Withdrawn
- 2010-06-22 KR KR1020117029658A patent/KR101287782B1/ko active IP Right Grant
- 2010-06-25 TW TW099120869A patent/TW201121072A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2011119367A (ja) | 2011-06-16 |
EP2509400A1 (en) | 2012-10-10 |
KR20120014205A (ko) | 2012-02-16 |
KR101287782B1 (ko) | 2013-07-19 |
EP2509400A4 (en) | 2014-11-26 |
WO2011067875A1 (ja) | 2011-06-09 |
TW201121072A (en) | 2011-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5289291B2 (ja) | 電子部品の製造方法、電子部品および導電性フィルム | |
JP5213712B2 (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 | |
JP6064177B2 (ja) | 太陽電池モジュールの製造方法 | |
JP2013080982A (ja) | 太陽電池モジュールの製造方法及び太陽電池モジュール製造装置 | |
TW200905901A (en) | Solar module manufacturing processes | |
JP2013219378A (ja) | 太陽電池モジュール | |
US20140251409A1 (en) | Solar cell module and manufacturing method thereof | |
JP5676944B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法 | |
JP6043971B2 (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 | |
JP5892584B2 (ja) | 太陽電池モジュール、太陽電池モジュールの製造方法 | |
KR20130132497A (ko) | 도전성 접착 재료, 태양 전지 모듈 및 그의 제조 방법 | |
KR20130021374A (ko) | 태양전지 모듈 및 태양전지 모듈의 제조 방법 | |
WO2014119252A1 (ja) | 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置 | |
KR102019310B1 (ko) | 태양 전지 모듈 및 그의 제조 방법 | |
JP5820976B2 (ja) | 太陽電池モジュールの製造方法 | |
WO2013187329A1 (ja) | 太陽電池モジュールの製造方法、太陽電池用導電性接着剤、太陽電池モジュール | |
WO2017043518A1 (ja) | 太陽電池モジュールの製造方法、太陽電池モジュール、及び太陽電池セルの接続方法 | |
JP5938665B2 (ja) | 太陽電池モジュールの製造方法 | |
JP5934985B2 (ja) | 太陽電池モジュールの製造方法及び太陽電池モジュール | |
JP2013065690A (ja) | 半導体モジュール、配線シート付き半導体セル及び配線シート並びに半導体モジュールの製造方法及び配線シート付き半導体セルの製造方法 | |
JP2017055112A (ja) | 太陽電池モジュールの製造方法、太陽電池モジュール、及び太陽電池セルの接続方法 | |
JP2010041009A (ja) | 素子形成基板配線ストリング、太陽電池モジュールおよびその製造方法 | |
JP2013211286A (ja) | 配線基板、太陽電池モジュール、及び配線基板の製造方法 | |
JP5934984B2 (ja) | 太陽電池の製造方法及び太陽電池 | |
CN102194923A (zh) | 电连接光伏面板的电极的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121004 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130528 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130604 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5289291 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |