WO2013168698A1 - 導電性フイルム - Google Patents

導電性フイルム Download PDF

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Publication number
WO2013168698A1
WO2013168698A1 PCT/JP2013/062830 JP2013062830W WO2013168698A1 WO 2013168698 A1 WO2013168698 A1 WO 2013168698A1 JP 2013062830 W JP2013062830 W JP 2013062830W WO 2013168698 A1 WO2013168698 A1 WO 2013168698A1
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WO
WIPO (PCT)
Prior art keywords
conductive film
film according
mesh
shape
conductive
Prior art date
Application number
PCT/JP2013/062830
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
栗城匡志
橋本明裕
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to CN201380024150.XA priority Critical patent/CN104395864B/zh
Publication of WO2013168698A1 publication Critical patent/WO2013168698A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

Definitions

  • the present invention relates to a conductive film capable of suppressing the occurrence of moire.
  • the touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but it is considered that the touch panel will be increased in size by being applied to a display for a personal computer.
  • PDA personal digital assistant
  • moire may occur due to interference with the pixel arrangement pattern of the display device.
  • a moire suppressing portion is formed at the intersection of the lattice (see Japanese Patent Application Laid-Open No. 2008-282924), or a moire is formed on a line connecting the intersection in the opening of the lattice.
  • a method of forming a suppression unit has been proposed (see Japanese Patent Application Laid-Open No. 2008-306177).
  • the thin metal wire when a thin metal wire is used as an electrode of the touch panel, the thin metal wire is made of an opaque material, and thus transparency and visibility become a problem.
  • a conductive film using a fine metal wire as an electrode is placed on a display panel of a display device and used, good visibility is required even in the following two modes.
  • the fine metal lines are difficult to be seen, the visible light transmittance is high, and the pixel period of the display device (for example, the black matrix pattern of the liquid crystal display) and the conductive pattern It is difficult for noise such as moire caused by optical interference to occur.
  • the second mode is that when the display device is turned off and the screen is black, and the observation is performed under external light such as fluorescent light, sunlight, LED light, etc., the thin metal wire is difficult to see.
  • the configuration described in Japanese Patent Application Laid-Open No. 2008-282924 increases the area of the intersection by forming a metal layer at the intersection, which makes the intersection of the lattice more noticeable and disadvantageous in terms of visibility. Become.
  • a metal layer is formed in the opening, so that the aperture ratio may decrease and transparency may decrease.
  • the present invention has been made in consideration of such a problem, and even when an electrode such as a touch panel is configured by arranging a large number of grids configured with fine metal wires, it is possible to reduce the occurrence of moire,
  • An object of the present invention is to provide a conductive film in which a fine metal wire is difficult to be visually recognized and high transparency can be secured.
  • the conductive film according to the present invention is a conductive film having a conductive portion and an opening made of a fine metal wire, and the conductive portion has an intersection of the plurality of fine metal wires, and the fine metal wire An overhanging portion is disposed on a line and at a portion other than the intersection.
  • the metal thin wire has a form in which an intersection portion centered on the intersection and a pseudo intersection portion centered on the intersection of the metal thin wire and the overhanging portion are arranged. It becomes irregular and does not converge to a specific spatial frequency. As a result, even when the conductive film is placed on the display panel of the display device, for example, interference with the pixel arrangement pattern does not occur, and the generation of moire can be reduced.
  • the combined shape of the conductive portion and the opening may be a mesh shape.
  • the projecting portion is at least one side of the plurality of sides constituting the mesh shape, and at a position that does not overlap the intersection of the mesh shape. It is preferable that they are arranged to cross each other.
  • the overhanging portion is arranged so as to extend across the one side, and the shape of the overhanging portion is a line segment shape, an elliptical shape, or a rhombus shape having the extending direction as a major axis. It may be a parallelogram shape or a polygonal shape.
  • the projecting portion may have a line segment shape having the extending direction as a major axis.
  • the other side intersecting with the one side and the major axis of the projecting portion are substantially parallel.
  • the line width of the projecting portion is preferably 30 ⁇ m or less. More preferably, it is 10 micrometers or less, More preferably, it is 7 micrometers or less.
  • the length of the one side is preferably 50 ⁇ m or more and 900 ⁇ m or less. More preferably, they are 50 micrometers or more and 600 micrometers or less, More preferably, they are 50 micrometers or more and 500 micrometers or less.
  • the conductive portion has a mesh pattern having a plurality of mesh shapes, and the plurality of protruding portions are randomly arranged with respect to the mesh pattern.
  • a mesh shape in which the protruding portion is not arranged may be present at random.
  • the arrangement position of the overhanging portion with respect to one or more mesh shapes in which the overhanging portion is arranged may be random.
  • the arrangement positions of the overhang portions on the plurality of sides are random. May be.
  • At least one of the overhang portions has a distance from the one intersection to a center position, May be different.
  • the overhanging portions arranged on the adjacent sides may have different distances from the corresponding intersections.
  • the arrangement ratio of the overhang portions is (Nb / Na) ⁇ 100%
  • the arrangement ratio is 10% or more and 100%. The following is preferable.
  • the line width of the fine metal wire is preferably 30 ⁇ m or less. More preferably, it is 10 micrometers or less, More preferably, it is 7 micrometers or less. The lower limit is 0.1 ⁇ m or more.
  • the aperture ratio is preferably 90% or more.
  • FIG. 4A to 4E are process diagrams showing an example of a method for manufacturing a conductive film according to the present embodiment.
  • 5A and 5B are process diagrams showing another example of a method for manufacturing a conductive film according to the present embodiment.
  • 6A and 6B are process diagrams showing still another example of the method for manufacturing a conductive film according to the present embodiment. It is process drawing which shows the further another example of the manufacturing method of the electroconductive film which concerns on this Embodiment.
  • ⁇ indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.
  • the conductive film 10 includes a transparent base 12 (see FIG. 2) and a conductive portion 14 formed on one main surface of the base 12.
  • the conductive portion 14 has a mesh pattern 20 including a metal fine wire (hereinafter referred to as a metal fine wire 16) and an opening 18.
  • the thin metal wire 16 is made of, for example, gold (Au), silver (Ag), or copper (Cu).
  • the conductive portion 14 extends in the first direction (x direction) and is arranged in the second direction (y direction in FIG. 1), and a plurality of first metal fine wires 16 a. And a plurality of second metal wires 16b extending in the second direction and arranged in the first direction, each having a mesh pattern 20 formed.
  • the mesh pattern 20 has a large number of intersections 22 formed by a plurality of first metal fine wires 16a and a plurality of second metal fine wires 16b.
  • one mesh shape of the mesh pattern 20, that is, a combined shape (hereinafter, referred to as a lattice 24) of one opening 18 and four thin metal wires 16 surrounding the one opening 18 is shown in FIG.
  • a square or a rhombus may be used.
  • the shape of one side of the lattice 24 may be a curved shape or a circular arc shape in addition to a linear shape.
  • an arc shape for example, two opposing sides may be outwardly convex arc shapes, and the other two opposing sides may be inwardly convex arc shapes.
  • the shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous.
  • the shape of each side may be a sine curve.
  • the moire suppression part 26 (overhang
  • the moire suppressing unit 26 is a single side 28 at a position that is at least one side 28 of the plurality of sides 28 constituting the grid 24 and does not overlap the intersection 22 of the grid 24. It is arranged so as to extend across.
  • the shape of the moire suppressing portion 26 is a line segment shape with the extending direction as a major axis in FIG. Of course, an elliptical shape, a rhombus shape, a parallelogram shape, or a polygonal shape whose long axis is the extending direction may be used.
  • the moire suppressing part 26 may be formed of the same metal material as that of the thin metal wire 16 or may be formed of another metal material.
  • the plurality of moire suppressing units 26 are randomly arranged with respect to the mesh pattern 20.
  • the meaning of “randomly arranged” means at least one of the following (a) to (e).
  • the mesh pattern 20 has the lattice point 24 with the original intersection point 22 as the center.
  • a cross-shaped crossing portion 30 and a pseudo cross-shaped crossing portion 34 centering on the intersection 32 between the side 28 of the lattice 24 and the moire suppressing portion 26 are arranged. Since the arrangement is random, the arrangement of the intersecting portions 30 and 34 becomes irregular and does not converge to a specific spatial frequency. As a result, even when the conductive film 10 according to the present embodiment is installed on, for example, a display panel of a display device, interference with the pixel arrangement pattern does not occur and generation of moire can be reduced.
  • the width of one side 28 of the lattice 24 is Wa
  • the length of one side 28 (the length between two intersections 22)
  • the moire suppressing portion 26 extends in the extending direction.
  • the length is Lb
  • the lower limit of the length Lb is preferably 2 ⁇ Wa or more, more preferably 3 ⁇ Wa or more, and more preferably 4 ⁇ Wa or more.
  • the upper limit of the length Lb is preferably La or less, more preferably La / 2 or less, more preferably La / 3 or less, and particularly preferably La / 4 or less.
  • the length of the first overhanging portion 26a to the one opening 18a of the moire suppressing portion 26 (the overhanging length Lb1) and the length of the second overhanging portion 26b to the other opening 18b (the overhanging length Lb2).
  • the lower limit of each overhang length Lb1 and Lb2 is preferably Wa or more, more preferably 1.5 ⁇ Wa or more, and more preferably 2 ⁇ Wa or more.
  • the upper limit of each overhang length Lb1 and Lb2 is preferably La / 2 or less, more preferably La / 4 or less, more preferably La / 6 or less, and particularly preferably La / 8 or less.
  • the length Lb in the extending direction of the moire suppressing portion 26 is too short, the pseudo cross-shaped crossing portion 34 cannot be formed, and the effect of reducing the occurrence of moire cannot be obtained. If the length Lb is too long, the aperture ratio decreases and high transparency cannot be ensured. The same applies to the overhang lengths Lb1 and Lb2.
  • the line width Wb of the moiré suppressing portion 26 is preferably 30 ⁇ m or less. More preferably, it is 10 micrometers or less, More preferably, it is 7 micrometers or less.
  • the line width Wb of the moire suppressing portion 26 is too small, it does not substantially become a pseudo cross-shaped crossing portion 34, and the effect of reducing the occurrence of moire cannot be obtained. If the line width Wb is too large, the aperture ratio decreases and high transparency cannot be ensured.
  • the other side intersecting with one side 28 where the moire suppressing part 26 is arranged and the extending direction (long axis) of the moire suppressing part 26 are substantially parallel.
  • substantially parallel means that the angle formed by the extending direction of the one side 28 and the extending direction of the moire suppressing portion 26 is ⁇ 1, and the extending direction of the one side 28 and the other side described above. When the angle is ⁇ 2, 0 ° ⁇
  • the shape of the lattice 24 is square or rectangular, it is preferable that the one side 28 described above and the extending direction of the moire suppressing portion 26 are substantially orthogonal. As a result, a pseudo cross-shaped crossing portion 34 can be formed by the moire suppressing portion 26 and one side 28.
  • may be different. In this case, it is preferable that 0 ° ⁇
  • the moire suppressing portion 26 is disposed close to the intersection 22 of the lattice 24. As a result, the intersection 22 of the lattice 24 is obtained.
  • the line width of the cross-shaped intersecting portion 30 centering on is increased, and it is easy to visually recognize as so-called line thickening.
  • the range of the distance Da is narrower than the above range, the degree of freedom of random arrangement is reduced. Therefore, it is preferable to set the range of the distance Da to the above range.
  • the arrangement rate of the moire suppressing units 26 is (Nb / Na) ⁇ 100%
  • the arrangement rate is 10% or more. It is preferable that it is 100% or less.
  • An arrangement rate of 100% indicates that one moire suppressing unit 26 is arranged on each side 28.
  • the arrangement ratio is too small, a region of the mesh pattern 20 where the pseudo cross-shaped intersection 34 is not formed becomes wide, and there is a problem that moire becomes conspicuous in the region. If the arrangement ratio is too large, the aperture ratio decreases, and high transparency cannot be ensured. On the other hand, if the arrangement rate range is narrower than the above range, the degree of freedom of random arrangement is reduced. Therefore, it is preferable to set the range of the arrangement ratio within the above range.
  • the length La of one side 28 of the lattice 24 can be selected from 50 ⁇ m to 900 ⁇ m. Preferably they are 50 micrometers or more and 600 micrometers or less, More preferably, they are 50 micrometers or more and 500 micrometers or less. Further, the line width Wa of the fine metal wire 16 can be selected from 30 ⁇ m or less. Preferably it is 10 micrometers or less, More preferably, it is 7 micrometers or less. The lower limit is 0.1 ⁇ m or more.
  • the opening ratio of the conductive film 10 is preferably 90% or more. Thereby, high transparency can be ensured.
  • the silver salt photosensitive layer provided on the substrate 12 is exposed, developed, and fixed to form a metal silver portion or a metal silver portion and a conductive metal carried on the metal silver portion. And a method of forming the moire suppressing portion 26.
  • a silver salt photosensitive layer 40 obtained by mixing silver halide 36 (for example, silver bromide grains, silver chlorobromide grains or silver iodobromide grains) with gelatin 38 is used as a substrate 12. Apply on top.
  • silver halide 36 for example, silver bromide grains, silver chlorobromide grains or silver iodobromide grains
  • gelatin 38 is used as a substrate 12. Apply on top.
  • the silver halide 36 is expressed as “grains”, but it is exaggerated to help the understanding of the present invention, and the size, concentration, etc. are shown. It is not a thing.
  • the silver salt photosensitive layer 40 is subjected to exposure necessary for forming the mesh pattern 20.
  • silver halide 36 receives light energy, it is exposed to light and generates minute silver nuclei called “latent images” that cannot be observed with the naked eye.
  • development processing is performed as shown in FIG. 4C.
  • the silver salt photosensitive layer 40 on which the latent image is formed is developed with a development processing solution (both alkaline solution and acidic solution, but usually alkaline solution is large).
  • a development processing solution both alkaline solution and acidic solution, but usually alkaline solution is large.
  • silver ions supplied from silver halide grains or a developer are reduced to metallic silver by using a latent image silver nucleus as a catalyst nucleus by a reducing agent called a developing agent in the developer, and as a result
  • the image silver nuclei are amplified to form a visualized silver image (developed silver 42).
  • a fixing processing solution (either an acidic solution or an alkaline solution is used as shown in FIG. 4D). However, fixing is usually performed by using an acidic solution.
  • the metal silver portion 44 is formed in the exposed portion, and only the gelatin 38 remains in the unexposed portion to become the light transmissive portion 46. That is, the mesh pattern 20 and the moire suppressing portion 26 are formed on the base 12 by a combination of the fine metal wires 16 formed by the metal silver portions 44 and the openings 18 formed by the light transmitting portions 46.
  • the reaction formula of the fixing process when silver bromide is used as the silver halide 36 and the fixing process is performed with thiosulfate is as follows. AgBr (solid) + 2 S 2 O 3 ions ⁇ Ag (S 2 O 3 ) 2 (excellent water-soluble complex) That is, two thiosulfate ions S 2 O 3 and silver ions in gelatin 38 (silver ions from AgBr) form a silver thiosulfate complex. Since the silver thiosulfate complex is highly water-soluble, it is eluted from the gelatin 38. As a result, the developed silver 42 is fixed and remains as the metallic silver portion 44.
  • the development step is a step of causing the developing agent to react with the latent image to precipitate the developed silver 42
  • the fixing step is a step of eluting the silver halide 36 that has not become the developed silver 42 into water.
  • a plating process (electroless plating or electroplating alone or in combination) is performed, and the conductive metal 48 is supported only on the metallic silver portion 44, thereby the metallic silver portion 44 and the conductive metal.
  • the mesh pattern 20 and the moire suppression part 26 by 48 may be formed.
  • the mask used for exposure to the silver salt photosensitive layer 40 has a mesh pattern 20 and a mask pattern corresponding to the pattern in which the moire suppressing portion 26 is formed in the opening 18 of the mesh pattern 20. Also good.
  • the silver salt photosensitive layer 40 may be exposed to a pattern in which the mesh pattern 20 and the moire suppressing portion 26 are formed in the opening 18 of the mesh pattern 20 by digital writing exposure on the silver salt photosensitive layer 40. Good.
  • a photoresist film 52 on the copper foil 50 formed on the substrate 12 is exposed and developed to form a resist pattern 54, as shown in FIG. 5B.
  • the mesh pattern 20 and the moire suppressing portion 26 may be formed by etching the copper foil 50 exposed from the resist pattern 54.
  • the mask used in the exposure for the photoresist film 52 may have a mask pattern corresponding to the pattern in which the mesh pattern 20 and the moire suppressing portion 26 are formed.
  • a pattern in which the mesh pattern 20 and the moire suppressing portion 26 are formed may be exposed on the photoresist film 52 by digital writing exposure on the photoresist film 52.
  • a paste 56 containing metal fine particles is printed on the substrate 12, and a metal plating 58 is applied to the paste 56 as shown in FIG. 6B, whereby the mesh pattern 20 and the mesh pattern 20 are obtained.
  • a pattern in which the moire suppressing portion 26 is formed in the opening 18 may be formed.
  • a mesh pattern 20 and a pattern in which a moire suppressing portion 26 is formed in the opening 18 of the mesh pattern 20 are printed and formed on the base 12 using a screen printing plate or a gravure printing plate. May be.
  • a photosensitive pre-plated layer is formed on the base 12 using a pretreatment material for plating, and then exposed and developed, and then subjected to a plating treatment, whereby a metal is applied to the exposed and unexposed areas, respectively.
  • the mesh pattern 20 and the moire suppressing portion 26 may be formed by forming a portion and a light transmitting portion.
  • a conductive metal may be supported on the metal part by further performing physical development and / or plating treatment on the metal part.
  • a plating layer containing a functional group that interacts with the plating catalyst or its precursor is applied on the substrate 12, and then exposed and developed, and then plated to form a metal part on the material to be plated. Aspect.
  • B After laminating a base layer containing a polymer and a metal oxide and a layer to be plated containing a functional group that interacts with a plating catalyst or a precursor thereof in this order on the substrate 12, and then exposing and developing. A mode in which a metal part is formed on a material to be plated by plating.
  • the mesh pattern 20 and the moire suppressing portion 26 may be formed on the base 12 by inkjet.
  • the manufacturing method of the conductive film 10 according to the present embodiment includes the following three forms depending on the photosensitive material and the form of development processing.
  • (1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
  • (2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
  • a photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.
  • the above aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material.
  • the resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
  • the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion.
  • a characteristic film is formed.
  • This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
  • the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet.
  • a conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.
  • either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material).
  • the other side intersecting with one side 28 where the moire suppressing part 26 is arranged and the extending direction (long axis) of the moire suppressing part 26 are substantially parallel.
  • the following embodiments can be preferably employed.
  • the extending direction (long axis) of the moire suppressing portion 26 is inclined with respect to one side 28 where the moire suppressing portion 26 is disposed ( May not be orthogonal).
  • the moire suppressing part 26 having only the first protruding part 26a, and the second protruding part may be arranged at random.
  • FIG. 9 shows an example in which the extending direction (long axis) of the moire suppression unit 26 is orthogonal to one side 28 where the moire suppression unit 26 is arranged, and FIG. On the other hand, an example is shown in which the extending direction (long axis) of the moire suppressing portion 26 is inclined (not orthogonal).
  • substrate 12 examples of the substrate 12 include a plastic film, a plastic plate, and a glass plate.
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, EVA / COP / COC Kinds: Vinyl resin;
  • polycarbonate (PC) polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC), and the like can be used.
  • PET melting point: 258 ° C.
  • PEN melting point: 269 ° C.
  • PE melting point: 135 ° C.
  • PP melting point: 163 ° C.
  • polystyrene melting point: 230 ° C.
  • polyvinyl chloride melting point: 180 ° C
  • polyvinylidene chloride melting point: 212 ° C
  • TAC melting point: 290 ° C
  • the substrate 12 has high transparency.
  • the silver salt photosensitive layer 40 (see FIG. 4A) that becomes the conductive layer (the mesh pattern 20 and the moire suppressing portion 26) of the conductive film 10 contains additives such as a solvent and a dye in addition to the silver salt and the binder.
  • Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.
  • Coated silver amount of the silver salt photosensitive layer 40 is preferably 1 ⁇ 30g / m 2 in terms of silver, and more preferably 1 ⁇ 25g / m 2, 5 ⁇ 20g / m 2 and more preferable. By setting the amount of coated silver in the above range, a desired surface resistance can be obtained when the conductive film 10 is used.
  • binder used in this embodiment examples include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl.
  • PVA polyvinyl alcohol
  • PVP polyvinyl pyrrolidone
  • starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl.
  • acid polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
  • the content of the binder contained in the silver salt photosensitive layer 40 of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited.
  • the binder content in the silver salt photosensitive layer 40 is preferably 1 ⁇ 4 or more, and more preferably 1 ⁇ 2 or more in terms of a silver / binder volume ratio.
  • the silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less.
  • the silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1.
  • the silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain
  • the solvent used for forming the silver salt photosensitive layer 40 is not particularly limited.
  • water an organic solvent (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl, etc.
  • Sulfoxides such as sulfoxide, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
  • the content of the solvent used in the silver salt photosensitive layer 40 of the present embodiment is in the range of 30 to 90% by mass with respect to the total mass of the silver salt and binder contained in the silver salt photosensitive layer 40, and 50 The range of ⁇ 80 mass% is preferable.
  • a protective layer (not shown) may be provided on the silver salt photosensitive layer 40.
  • the “protective layer” means a layer made of a binder such as gelatin or a high molecular polymer.
  • the thickness is preferably 0.5 ⁇ m or less.
  • the coating method and forming method of the protective layer are not particularly limited, and a known coating method and forming method can be appropriately selected. Further, for example, an undercoat layer can be provided below the silver salt photosensitive layer 40.
  • the conductive portion 14 is applied by a printing method, but the conductive portion 14 is formed by exposure, development, and the like except for the printing method. That is, the photosensitive material having the silver salt photosensitive layer 40 provided on the substrate 12 or a photosensitive material coated with a photopolymer for photolithography is exposed.
  • the exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.
  • the development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like.
  • the developer is not particularly limited, but PQ developer, MQ developer, MAA developer and the like can also be used.
  • Commercially available products include, for example, CN-16, CR-56, CP45X, FD prescribed by FUJIFILM Corporation. -3, Papitol, developers such as C-41, E-6, RA-4, D-19, and D-72 prescribed by KODAK, or developers included in the kit can be used.
  • a lith developer can also be used.
  • the development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in an unexposed portion.
  • a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
  • the fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C.
  • the fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds.
  • the replenishing amount of the fixing solution is preferably 600 ml / m 2 or less with respect to the processing of the photosensitive material, more preferably 500 ml / m 2 or less, 300 ml / m 2 or less is particularly preferred.
  • the light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment.
  • the washing water amount is usually 20 liters or less per 1 m 2 of the light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water).
  • the mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.
  • the gradation after the development processing in the present embodiment is not particularly limited, but is preferably more than 4.0.
  • the conductivity of the conductive metal portion metal thin wire 16
  • Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.
  • the conductive film 10 is obtained, but the surface resistance of the obtained conductive film 10 is 0.1 to 100 ohm / sq. It is preferable that it exists in the range.
  • the lower limit is 1 ohm / sq. 3 ohm / sq. 5 ohm / sq. 10 ohm / sq. The above is preferable.
  • the upper limit is 70 ohm / sq. Hereinafter, 50 ohm / sq. The following is preferable.
  • position detection can be performed even with a large touch panel having an area of 10 cm ⁇ 10 cm or more.
  • the conductive sheet after the development treatment may be further subjected to a calendar treatment, and can be adjusted to a desired surface resistance by the calendar treatment.
  • the conductive metal particles may be supported on the metallic silver portion 44 by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion 44 by combining physical development and plating treatment. You may let them.
  • the thing which performed the physical development and / or the plating process to the metal silver part 44 is called a "conductive metal part.”
  • “Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical development is used for instant B & W film, instant slide film, printing plate production, and the like, and this technique can be used in the present invention.
  • the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.
  • the plating treatment can be performed using electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating.
  • electroless plating chemical reduction plating or displacement plating
  • electrolytic plating electrolytic plating
  • electrolytic plating electrolytic plating
  • electroless plating in the present embodiment a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.
  • Oxidation treatment it is preferable to subject the metallic silver portion 44 after development processing and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment.
  • oxidation treatment for example, when a slight amount of metal is deposited on the light transmissive portion 46, the metal can be removed and the light transmissive portion 46 can be made almost 100% transparent.
  • the line width of the conductive metal portion (metal thin wire 16) of the present embodiment can be selected from 30 ⁇ m or less.
  • the line width of the fine metal wire 16 is preferably 1 ⁇ m to 20 ⁇ m, more preferably 1 ⁇ m to 9 ⁇ m, further preferably 2 ⁇ m to 7 ⁇ m, and more preferably 2 ⁇ m to 5 ⁇ m. Particularly preferred.
  • the lower limit is preferably 0.1 ⁇ m or more, 1 ⁇ m or more, 3 ⁇ m or more, 4 ⁇ m or more, or 5 ⁇ m or more
  • the upper limit is 15 ⁇ m or less, 10 ⁇ m or less, 9 ⁇ m or less, 8 ⁇ m.
  • 7 ⁇ m or less is preferable.
  • the line width is less than the above lower limit value
  • the conductivity becomes insufficient, so that when used for a touch panel, the detection sensitivity becomes insufficient.
  • the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or visibility becomes worse when used for a touch panel.
  • the moire of an electroconductive metal part is improved and visibility becomes especially good.
  • the length of one side of the lattice is preferably 50 ⁇ m or more and 900 ⁇ m or less, more preferably 50 ⁇ m or more and 600 ⁇ m or less, and more preferably 50 ⁇ m or more and 500 ⁇ m or less.
  • the conductive metal portion may have a portion whose line width is wider than 200 ⁇ m for the purpose of ground connection or the like.
  • the conductive metal portion in the present embodiment preferably has an aperture ratio of 90% or more from the viewpoint of visible light transmittance.
  • the aperture ratio is a ratio of the light transmissive portion 46 excluding the metal thin wires 16 and the moire suppressing portion 26 to the whole.
  • the “light transmissive part” in the present embodiment means a part having a light transmissive property other than the conductive metal part in the conductive film 10.
  • the transmittance of the light transmissive portion 46 is 90% or more, preferably 90% or more, as indicated by the minimum transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the substrate 12. 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
  • a method through a glass mask or a pattern exposure method by laser drawing is preferable.
  • the thickness of the substrate 12 in the conductive film 10 according to the present embodiment is preferably 75 to 350 ⁇ m. If it is in the range of 75 to 350 ⁇ m, a desired visible light transmittance can be obtained, and handling is easy. In addition, when two conductive films are laminated to form a conductive sheet for a touch panel, the parasitic capacitance between the conductive films 10 can be reduced.
  • the thickness of the metallic silver portion 44 provided on the substrate 12 can be appropriately determined according to the coating thickness of the silver salt photosensitive layer coating applied on the substrate 12.
  • the thickness of the metallic silver portion 44 can be selected from 0.001 mm to 0.2 mm, but is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and further preferably 0.01 to 9 ⁇ m. Preferably, the thickness is 0.05 to 5 ⁇ m.
  • the metal silver part 44 is pattern shape.
  • the metallic silver portion 44 may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion 44 has a pattern shape and has a multilayer structure of two or more layers, different color sensitivities can be imparted so that it can be exposed to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.
  • the thickness of the conductive metal part is preferably as the thickness of the touch panel is thinner because the viewing angle of the display panel is wider, and a thin film is also required for improving the visibility.
  • the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 ⁇ m, more preferably 0.1 ⁇ m or more and less than 5 ⁇ m, and more preferably 0.1 ⁇ m or more. More preferably, it is less than 3 ⁇ m.
  • a metal silver portion 44 having a desired thickness is formed by controlling the coating thickness of the above-described silver salt photosensitive layer 40, and further a layer made of conductive metal particles by physical development and / or plating treatment. Therefore, even the conductive film 10 having a thickness of less than 5 ⁇ m, preferably less than 3 ⁇ m can be easily formed.
  • the method for manufacturing the conductive film 10 according to the present embodiment it is not always necessary to perform a process such as plating. This is because in the method for manufacturing the conductive film 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the amount of silver applied to the silver salt photosensitive layer 40 and the silver / binder volume ratio. In addition, you may perform a calendar process etc. as needed.
  • the silver salt photosensitive layer 40 is developed and then dipped in a hardener to perform the hardening process.
  • a hardener examples include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. it can.
  • the conductive film 10 may be provided with a functional layer such as an antireflection layer or a hard coat layer.
  • this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in the following Table 1 and Table 2. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.
  • K 3 Rh 2 Br 9 and K 2 IrCl 6 were added so as to have a concentration of 10 ⁇ 7 (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. .
  • the coating amount of silver is 10 g / m 2. It was coated on a transparent substrate (here, both polyethylene terephthalate (PET)). At this time, the volume ratio of Ag / gelatin was 2/1.
  • the exposure pattern is a pattern in which moire suppressing portions 26 are randomly arranged on each side 28 of the lattice 24 constituting the mesh pattern 20.
  • the exposure pattern is formed on the A4 size (210 mm ⁇ 297 mm) base 12. went.
  • the exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.
  • the exposed photosensitive material is processed using an automatic developing machine FG-710PTS manufactured by FUJIFILM Corporation. Development conditions: 35 ° C. for 30 seconds, fixing at 34 ° C. for 23 seconds, washing with running water (5 L / min) for 20 seconds Done in the process.
  • the line width Wa of the fine metal wires 16 is 10 ⁇ m
  • the length La of one side of the grid 24 (square shape in this example) is 500 ⁇ m
  • the line width Wb of the moire suppressing unit 26 is A conductive film according to Example 1 having a thickness Lb of 10 ⁇ m and a moire suppressing portion 26 of 125.0 ⁇ m was produced.
  • Example 2 is the same as Example 1 except that the length La of one side of the grating 24 is 400 ⁇ m and the length Lb of the moire suppressing portion 26 is 100.0 ⁇ m. A film was prepared.
  • Example 3 In the third embodiment, the line width Wa of the fine metal wire 16 is 9 ⁇ m, the length La of one side of the grating 24 is 400 ⁇ m, the line width Wb of the moire suppression unit 26 is 9 ⁇ m, and the length Lb of the moire suppression unit 26 is 100.0 ⁇ m.
  • a conductive film according to Example 3 was produced in the same manner as in Example 1 described above except that.
  • Example 4 (Examples 4 to 6)
  • the line width Wa of the fine metal wire 16 is 8 ⁇ m, 7 ⁇ m and 6 ⁇ m
  • the length La of one side of the grating 24 is 300 ⁇ m
  • the line width Wb of the moire suppressing portion 26 is 8 ⁇ m, 7 ⁇ m and 6 ⁇ m
  • the conductive films according to Examples 4, 5 and 6 were produced in the same manner as in Example 1 except that the length Lb of the moire suppressing portion 26 was 75.0 ⁇ m.
  • Example 7 to 9 In Examples 7, 8 and 9, the line width Wa of the thin metal wire 16 is 5 ⁇ m, 4 ⁇ m and 3 ⁇ m, the length La of one side of the grating 24 is 200 ⁇ m, the line width Wb of the moire suppressing part 26 is 5 ⁇ m, 4 ⁇ m and 3 ⁇ m, Conductive films according to Examples 7, 8 and 9 were produced in the same manner as in Example 1 except that the length Lb of the moire suppressing portion 26 was 50.0 ⁇ m.
  • Example 10 In Example 10, the line width Wa of the thin metal wire 16 is 2 ⁇ m, the length La of one side of the grating 24 is 100 ⁇ m, the line width Wb of the moire suppressing unit 26 is 2 ⁇ m, and the length Lb of the moire suppressing unit 26 is 25.0 ⁇ m.
  • a conductive film according to Example 10 was produced in the same manner as in Example 1 except for the above.
  • Example 11 In Example 11, the line width Wa of the fine metal wire 16 is 1 ⁇ m, the length La of one side of the grating 24 is 50 ⁇ m, the line width Wb of the moire suppression unit 26 is 1 ⁇ m, and the length Lb of the moire suppression unit 26 is 12.5 ⁇ m.
  • a conductive film according to Example 11 was produced in the same manner as in Example 1 except for the above.
  • ⁇ indicates that the border of the line thickening or black spot and the conductive pattern is inconspicuous
  • ⁇ indicates that any one of the border of the line thickening, black spot or conductive pattern is conspicuous, “line thick”, black
  • ⁇ indicates that any two of the spots and the boundary of the conductive pattern are conspicuous
  • X a case where all of the borders of the thickened black spots and the conductive pattern are conspicuous
  • ⁇ when moire was seen at a slight level with no problem, moiré was revealed.
  • the case was marked with x.
  • D the case where there was no angle range for C and ⁇ and the angle range for X was 30 ° or more was defined as D.
  • Examples 1 to 11 all had good visibility, the aperture ratio was 90% or more, and the moire was evaluated as B or more. In particular, in Examples 2 to 11, the visibility was excellent, the aperture ratio was 90% or more, and the moire was A evaluation.
  • the line width Wa of the fine metal wire 16 can be selected from 30 ⁇ m or less, preferably 10 ⁇ m or less, and the length La of one side of the grating 24 can be selected from 50 ⁇ m to 900 ⁇ m, but 50 ⁇ m to 500 ⁇ m. Is preferable.
  • Samples 1 to 3 Samples 1, 2 and 3 were prepared as in Example 9, except that the length Lb of the moire suppression portion 26 was 6 ⁇ m, 9 ⁇ m and 12 ⁇ m. did.
  • Example 4 For Sample 4, a conductive film was produced in the same manner as in Example 9 described above.
  • Samples 5, 6 and 7 were prepared as conductive films according to Samples 5, 6 and 7 in the same manner as in Example 9 except that the length Lb of the moire suppressing portion 26 was set to 67 ⁇ m, 100 ⁇ m and 200 ⁇ m. did.
  • Table 4 shows the evaluation results for samples 1-7.
  • Samples 1 to 7 all had good visibility, an aperture ratio of 94% or higher, and a moire evaluation of B or higher.
  • the moire was B evaluation, but the visibility was ⁇ evaluation.
  • sample 6 the visibility was evaluated as ⁇ , but the moire was evaluated as A.
  • Samples 3 to 5 all had a visibility of ⁇ , an aperture ratio of 97% or higher, and a moire of A evaluation.
  • the lower limit of the length Lb is preferably 2 ⁇ Wa or more, more preferably 3 ⁇ Wa or more, more preferably 4 ⁇ Wa or more, and the upper limit of the length Lb is La or less. It is preferable that it is La / 2 or less, more preferably La / 3 or less, and particularly preferably La / 4 or less.
  • Example 10 For Sample 10, a conductive film was produced in the same manner as in Example 9 described above.
  • Samples 11, 12, 13, 14, and 15 are the examples described above except that the line width Wb of the moire suppressing portion 26 is 4.5 ⁇ m, 6.0 ⁇ m, 7.5 ⁇ m, 9.0 ⁇ m, and 12.0 ⁇ m.
  • the line width Wb of the moire suppressing portion 26 is 4.5 ⁇ m, 6.0 ⁇ m, 7.5 ⁇ m, 9.0 ⁇ m, and 12.0 ⁇ m.
  • conductive films according to Samples 11, 12, 13, 14, and 15 were produced.
  • Table 5 shows the evaluation results of Samples 8-15.
  • sample 8 had a C evaluation for moire
  • sample 15 had a ⁇ evaluation for visibility.
  • the other samples 9 to 14 all had good visibility, an aperture ratio of 95% or more, and moire evaluation of B or more.
  • Samples 9 to 12 all had a visibility of ⁇ , an aperture ratio of 96% or more, and a moire of A evaluation.
  • the ratio (Wb / Wa) between the line width Wa of the fine metal wire and the line width Wb of the moire suppressing portion 26 is preferably 0.9 or more and 3.0 or less, more preferably 0.9 or more and 2.5 or less. More preferably, it is 0.9 or more and 2.0 or less, and particularly preferably 0.9 or more and 1.5 or less.
  • the conductive film according to the present invention is not limited to the above-described embodiment, and can of course have various configurations without departing from the gist of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
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PCT/JP2013/062830 2012-05-08 2013-05-07 導電性フイルム WO2013168698A1 (ja)

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JP2022111005A (ja) * 2021-01-18 2022-07-29 朗色林科技股▲フン▼有限公司 ピコスコピックスケール／ナノスコピックスケールの回路パターンを作製する方法

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KR101802690B1 (ko) * 2014-06-10 2017-11-28 후지필름 가부시키가이샤 터치 패널용 도전성 적층체, 터치 패널, 투명 도전성 적층체
JP2016194811A (ja) * 2015-03-31 2016-11-17 トッパン・フォームズ株式会社 電極およびタッチパネル
JP6529329B2 (ja) * 2015-05-01 2019-06-12 株式会社ブイ・テクノロジー タッチパネル製造方法、タッチパネルのガラス基板及びタッチパネル製造用マスク
JP6388558B2 (ja) 2015-05-29 2018-09-12 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
WO2018047493A1 (ja) * 2016-09-12 2018-03-15 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
JP6732638B2 (ja) * 2016-11-16 2020-07-29 株式会社Ｖｔｓタッチセンサー 導電性フィルム、タッチパネル、および、表示装置
CN108845693A (zh) * 2018-06-04 2018-11-20 业成科技（成都）有限公司 具有辅助线的触控电极
CN114327118A (zh) * 2020-10-09 2022-04-12 天材创新材料科技(厦门)有限公司 透明导电薄膜、透明导电薄膜的制造方法以及触控面板
TWI773207B (zh) * 2020-11-06 2022-08-01 友達光電股份有限公司 觸控顯示裝置
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