WO2013161827A1 - 無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法 - Google Patents
無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法 Download PDFInfo
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- WO2013161827A1 WO2013161827A1 PCT/JP2013/061947 JP2013061947W WO2013161827A1 WO 2013161827 A1 WO2013161827 A1 WO 2013161827A1 JP 2013061947 W JP2013061947 W JP 2013061947W WO 2013161827 A1 WO2013161827 A1 WO 2013161827A1
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- WO
- WIPO (PCT)
- Prior art keywords
- inorganic fine
- oxide film
- silicon oxide
- glass substrate
- fine particles
- Prior art date
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- 239000011521 glass Substances 0.000 title claims abstract description 181
- 239000010419 fine particle Substances 0.000 title claims abstract description 152
- 239000000758 substrate Substances 0.000 title claims abstract description 124
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 120
- 229910052814 silicon oxide Inorganic materials 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 97
- 239000011248 coating agent Substances 0.000 claims abstract description 93
- 238000000576 coating method Methods 0.000 claims abstract description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 23
- 239000006060 molten glass Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 34
- 229910044991 metal oxide Inorganic materials 0.000 claims description 31
- 150000004706 metal oxides Chemical class 0.000 claims description 31
- 238000010583 slow cooling Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 5
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 29
- 230000003287 optical effect Effects 0.000 abstract description 7
- 230000007062 hydrolysis Effects 0.000 abstract description 5
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 31
- 239000007921 spray Substances 0.000 description 28
- 239000007787 solid Substances 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- 238000000149 argon plasma sintering Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 238000000605 extraction Methods 0.000 description 10
- 238000005507 spraying Methods 0.000 description 10
- 239000002243 precursor Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 239000011787 zinc oxide Substances 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
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- 239000000203 mixture Substances 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000011164 primary particle Substances 0.000 description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 6
- 229910001887 tin oxide Inorganic materials 0.000 description 6
- 239000012702 metal oxide precursor Substances 0.000 description 5
- 229910052693 Europium Inorganic materials 0.000 description 4
- 238000006124 Pilkington process Methods 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- -1 acryloyloxy group Chemical group 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000005083 Zinc sulfide Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
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- 239000005357 flat glass Substances 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
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- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
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- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
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- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
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- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- JAKMJRVRMANFEU-UHFFFAOYSA-J 2,11,12,17-tetraoxa-5,8-diaza-1-stannatricyclo[6.3.3.31,5]heptadecane-3,10,13,16-tetrone Chemical compound [Sn+4].[O-]C(=O)CN(CCN(CC([O-])=O)CC([O-])=O)CC([O-])=O JAKMJRVRMANFEU-UHFFFAOYSA-J 0.000 description 1
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- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- YUOWTJMRMWQJDA-UHFFFAOYSA-J tin(iv) fluoride Chemical compound [F-].[F-].[F-].[F-].[Sn+4] YUOWTJMRMWQJDA-UHFFFAOYSA-J 0.000 description 1
- QPBYLOWPSRZOFX-UHFFFAOYSA-J tin(iv) iodide Chemical compound I[Sn](I)(I)I QPBYLOWPSRZOFX-UHFFFAOYSA-J 0.000 description 1
- UBZYKBZMAMTNKW-UHFFFAOYSA-J titanium tetrabromide Chemical compound Br[Ti](Br)(Br)Br UBZYKBZMAMTNKW-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 1
- NLLZTRMHNHVXJJ-UHFFFAOYSA-J titanium tetraiodide Chemical compound I[Ti](I)(I)I NLLZTRMHNHVXJJ-UHFFFAOYSA-J 0.000 description 1
- WYKQDEPZMVTTSJ-UHFFFAOYSA-J titanium(4+);tetrabenzoate Chemical compound [Ti+4].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 WYKQDEPZMVTTSJ-UHFFFAOYSA-J 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- YJGJRYWNNHUESM-UHFFFAOYSA-J triacetyloxystannyl acetate Chemical compound [Sn+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O YJGJRYWNNHUESM-UHFFFAOYSA-J 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- HUZZQXYTKNNCOU-UHFFFAOYSA-N triethyl(methoxy)silane Chemical compound CC[Si](CC)(CC)OC HUZZQXYTKNNCOU-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QWVYNEUUYROOSZ-UHFFFAOYSA-N trioxido(oxo)vanadium;yttrium(3+) Chemical compound [Y+3].[O-][V]([O-])([O-])=O QWVYNEUUYROOSZ-UHFFFAOYSA-N 0.000 description 1
- UVPKQBWUNYZZFZ-UHFFFAOYSA-N tris(1,1,2,2,2-pentafluoroethoxy)-(1,1,2,2,2-pentafluoroethyl)silane Chemical compound FC(F)(F)C(F)(F)O[Si](OC(F)(F)C(F)(F)F)(OC(F)(F)C(F)(F)F)C(F)(F)C(F)(F)F UVPKQBWUNYZZFZ-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- BHHYHSUAOQUXJK-UHFFFAOYSA-L zinc fluoride Chemical compound F[Zn]F BHHYHSUAOQUXJK-UHFFFAOYSA-L 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- YTSDVWYUJXKXCC-UHFFFAOYSA-L zinc;2-[2-[carboxylatomethyl(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetate Chemical compound [Zn+2].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O YTSDVWYUJXKXCC-UHFFFAOYSA-L 0.000 description 1
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/104—Pretreatment of other substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/107—Post-treatment of applied coatings
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2203/00—Other substrates
- B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
- B05D2203/35—Glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/42—Coatings comprising at least one inhomogeneous layer consisting of particles only
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/70—Properties of coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method for producing a glass substrate with inorganic fine particles and a silicon oxide film.
- the glass substrate having irregularities on the surface scatters incident light it is used as a window glass having an antiglare effect, a glass substrate for an organic EL element having a light extraction effect, a cover glass for a solar cell having a light confinement effect, etc. It is used.
- a silicon oxide film on a glass substrate containing inorganic fine particles is known.
- the following method has been proposed.
- (1) A method of further forming a silicon oxide film after forming metal oxide particles on a glass substrate by a thermal decomposition method using metal chloride as a raw material (see Patent Document 1).
- the method (1) it is difficult to control the particle diameter of the metal oxide particles. Therefore, it is difficult to obtain a glass substrate having the target optical performance.
- the method (2) although inorganic fine particles having a desired particle diameter can be used in accordance with the target optical performance, since the organopolysiloxane is nonpolar, the liquid medium of the coating liquid is nonpolar. Limited. For this reason, the inorganic fine particles are limited to those which have been separately subjected to a surface treatment such as hydrophobization so as not to aggregate in the nonpolar liquid medium.
- the present invention provides a method for producing a glass substrate with an inorganic fine particle-containing silicon oxide film in which inorganic fine particles having a desired particle diameter can be used according to the target optical characteristics and the range of selection of the inorganic fine particles is wide. .
- the present invention is the following [1] and [2].
- [1] A coating liquid containing inorganic fine particles, a hydrolyzate of alkoxysilane, and water and / or (poly) ethylene glycol is applied on a glass substrate to form a silicon oxide film containing inorganic fine particles.
- a method for producing a glass substrate with an inorganic fine particle-containing silicon oxide film is also referred to as a method according to the first embodiment of the present invention.
- the temperature of the glass substrate when applying the coating solution is preferably 200 to 650 ° C.
- a coating liquid containing inorganic fine particles, a hydrolyzate of alkoxysilane, and one or both of water and (poly) ethylene glycol is applied to form inorganic fine particles.
- the production method [2] is also referred to as a method according to the second embodiment of the present invention.
- the temperature of the glass ribbon when applying the coating liquid is preferably 200 to 650 ° C.
- inorganic fine particles having a desired particle diameter can be used, and the selection range of the inorganic fine particles is relatively wide.
- (Poly) ethylene glycol in the present specification means ethylene glycol or polyethylene glycol.
- the temperature of the glass substrate or glass ribbon in this specification is the surface temperature on the side where the coating liquid is applied.
- the refractive index in this specification is the refractive index of light having a wavelength of 550 nm.
- the film thickness of the inorganic fine particle-containing silicon oxide film in this specification is measured from an image obtained by observing the cross section of the glass substrate with the inorganic fine particle-containing silicon oxide film with a scanning electron microscope. This is the average distance to the vertex.
- the film thickness of the metal oxide film in this specification is measured from an image obtained by observing a cross section of a glass substrate with an inorganic fine particle-containing silicon oxide film having a metal oxide film with a scanning electron microscope.
- the average primary particle diameter in the dispersion in the present specification is an average primary particle diameter (median diameter: 50% particle diameter) measured by a dynamic scattering method.
- FIG. 1 is a schematic cross-sectional view showing an example of a glass substrate with an inorganic fine particle-containing silicon oxide film obtained by the production method of the present invention.
- the glass substrate 1 with an inorganic fine particle-containing silicon oxide film has a glass substrate 10 and an inorganic fine particle-containing silicon oxide film 12 having irregularities on the surface formed on the surface of the glass substrate 10.
- Glass substrate examples of the material of the glass substrate 10 include soda lime silica glass, borosilicate glass, and aluminosilicate glass.
- the glass substrate 10 is preferably a non-alkali glass or a soda lime silica glass coated with silica.
- the glass substrate 10 may have a functional layer on the surface of the substrate body.
- the functional layer include an undercoat layer, an adhesion improving layer, and a protective layer.
- the undercoat layer functions as an alkali barrier layer or a wide band low refractive index layer.
- the undercoat layer is preferably a layer formed by applying an undercoat coating liquid containing alkoxysilane or a hydrolyzate thereof (sol-gel silica) to the surface of the substrate body.
- functional layers such as the undercoat layer, the adhesion improving layer, and the protective layer as described above are formed. It may be formed.
- the inorganic fine particle-containing silicon oxide film 12 is a film formed by applying a coating liquid (that is, a first coating liquid) described later.
- the inorganic fine particle-containing silicon oxide film 12 includes a plurality of inorganic fine particles 14 disposed on the surface of the glass substrate 10 and a silicon oxide film 16 that covers the inorganic fine particles 14 and the surface of the glass substrate 10 thinly.
- the surface has irregularities derived from the shape of the inorganic fine particles 14.
- the inorganic fine particle-containing silicon oxide film 12 is useful as an antiglare film for a window glass, a light extraction layer for a glass substrate for an organic EL element, and a light confinement layer for a cover glass for a solar cell.
- the thickness of the inorganic fine particle-containing silicon oxide film 12 is preferably 100 to 5000 nm, and more preferably 200 to 1000 nm.
- the thickness of the inorganic fine particle-containing silicon oxide film 12 is 100 nm or more, the antiglare effect, the light extraction effect, the light confinement effect, and the like due to light scattering are good.
- the thickness of the inorganic fine particle-containing silicon oxide film 12 is 5000 nm or less, the film formation does not take excessive time, and there is no problem in production.
- the coverage of the inorganic fine particles 14 on the glass substrate 10 is preferably 1 to 100%, more preferably 5 to 100%.
- the coverage of the inorganic fine particles 14 is a measure of the deposition efficiency of the inorganic fine particles 14. When the coverage of the inorganic fine particles 14 is 1% or more, the antiglare effect due to light scattering, the light extraction effect, the light confinement effect, and the like are good.
- the haze of the glass substrate 1 with an inorganic fine particle-containing silicon oxide film is preferably 0.5 to 100%, more preferably 2 to 100%.
- the haze of the glass substrate 1 with an inorganic fine particle-containing silicon oxide film is a measure of light scattering. When the haze of the inorganic fine particle-containing glass substrate 1 with a silicon oxide film is 0.5% or more, the antiglare effect, the light extraction effect, the light confinement effect, and the like due to light scattering are good.
- inorganic fine particles 14 examples include metal oxide particles (including composite metal oxide particles) and metal particles. What is necessary is just to select the kind of inorganic fine particle 14 suitably according to the function requested
- silicon oxide is preferable as the material of the inorganic fine particles 14 because it is relatively inexpensive.
- the materials of the inorganic fine particles 14 include the followings according to functions. UV shielding: zinc oxide, cerium oxide, etc. Infrared shielding: Indium tin oxide (ITO), antimony tin oxide (ATO), tungsten oxide, erbium, etc. Antistatic: ITO, ATO, silver, etc. Photocatalyst: titanium oxide and the like.
- Wavelength conversion zinc oxide, europium doped zinc oxide, zinc sulfide, europium doped zinc sulfide, indium phosphide, bismuth doped calcium sulfide, europium doped calcium fluoride, europium doped yttrium vanadate, and the like.
- Examples of the shape of the inorganic fine particles 14 include a spherical shape, a granular shape, a rod shape, a bead shape, a fiber shape, a flake shape, a hollow shape, an aggregate shape, and an indefinite shape.
- the inorganic fine particles 14 may be core-shell type particles in which one component is coated with another component.
- the inorganic fine particles 14 may be surface-treated with a surfactant, a polymer dispersant, a silane coupling agent, or the like.
- the inorganic fine particles 14 are inactive to heat of 400 to 650 ° C., that is, when the dispersion of only the inorganic fine particles 14 is used as a coating solution, the inorganic fine particles 14 do not form a film or have extremely low film formation efficiency. It may be.
- the silicon oxide film 16 is a calcined product of an alkoxysilane hydrolyzate contained in a coating liquid described later, and serves as a binder for fixing the inorganic fine particles 14 to the surface of the glass substrate 10.
- the glass substrate 1 with inorganic fine particle-containing silicon oxide film may further include a metal oxide film 18 having a refractive index different from that of the inorganic fine particles 14 on the inorganic fine particle-containing silicon oxide film 12. Good.
- the metal oxide film 18 has irregularities derived from the inorganic fine particles 14 on the surface.
- Examples of the metal oxide film 18 include a titanium oxide film (refractive index: 2.5), a zinc oxide film (refractive index: 2.0), a tin oxide film (refractive index: 2.0), and a silicon oxide film (refractive index). : 1.5), aluminum oxide (refractive index: 1.8), and the like.
- silicon oxide particles are used as the inorganic fine particles 14, antiglare effect due to light scattering, light extraction effect, light confinement effect, etc.
- a titanium oxide film, a zinc oxide film, and a tin oxide film are preferable from the viewpoint that they are sufficiently exhibited.
- the metal oxide film 18 is made of transparent material such as fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), tin-doped indium oxide (ITO), aluminum-doped zinc oxide (AZO), and gallium-doped zinc oxide (GZO).
- FTO fluorine-doped tin oxide
- ATO antimony-doped tin oxide
- ITO tin-doped indium oxide
- AZO aluminum-doped zinc oxide
- GZO gallium-doped zinc oxide
- the refractive index of the metal oxide film 18 is lower than that of the inorganic fine particles 14, a refractive index gradient structure is formed, so that the transmittance is improved.
- the refractive index of the metal oxide film can be adjusted depending on the application.
- the thickness of the metal oxide film 18 is preferably 100 to 5000 nm, and more preferably 200 to 1000 nm. When the thickness of the metal oxide film 18 is 100 nm or more, the antiglare effect due to light scattering, the light extraction effect, the light confinement effect, and the like are good. If the thickness of the metal oxide film 18 is 5000 nm or less, the film formation does not take excessive time, and there is no problem in production.
- the film thickness is obtained as an average value obtained by observing the cross section of the film using a scanning electron microscope (S-4300, manufactured by Hitachi High-Technologies Corporation), measuring the film thickness at three points in the range of 10 ⁇ m in the out-of-plane direction. .
- the method for producing a glass substrate with an inorganic fine particle-containing silicon oxide film according to the present invention includes: a glass substrate or a glass ribbon serving as a glass substrate; any of inorganic fine particles, an alkoxysilane hydrolyzate, water, and (poly) ethylene glycol. This is a method of forming a silicon oxide film containing inorganic fine particles on a glass substrate or glass ribbon by applying a first coating liquid containing either or both of them and baking a hydrolyzate of alkoxysilane.
- the inorganic fine particle-containing silicon oxide film is formed on the glass ribbon, specifically, there is a method having the following steps.
- a coating liquid containing inorganic fine particles, a hydrolyzate of alkoxysilane, water and one or both of water and (poly) ethylene glycol is applied onto a glass ribbon formed from molten glass, and inorganic fine particle-containing silicon oxide is applied.
- a method comprising the steps of forming a film and then cutting the glass ribbon.
- a metal oxide precursor having a refractive index different from that of the inorganic fine particle is included on the inorganic fine particle-containing silicon oxide film on the glass substrate or the glass ribbon.
- a second coating solution may be applied to form a metal oxide film.
- Glass substrate examples of the material for the glass substrate include those described above. Further, as a glass substrate, in a glass substrate manufacturing method in which molten glass is formed into a glass ribbon, the glass ribbon is slowly cooled, and then cut to manufacture the glass substrate, the glass ribbon is coated with a coating solution. An unstrengthened green glass substrate is preferable because it is applied to a method of forming an inorganic fine particle-containing silicon oxide film.
- the first coating liquid contains inorganic fine particles, a hydrolyzate of alkoxysilane, and one or both of water and (poly) ethylene glycol.
- the inorganic fine particles are used in the form of a dispersion in which the above-described inorganic fine particles are previously dispersed in water or (poly) ethylene glycol.
- the average primary particle size of the inorganic fine particles in the dispersion is preferably 100 to 1000 nm, more preferably 300 to 500 nm.
- the average primary particle diameter of the inorganic fine particles in the dispersion is 100 to 1000 nm, the antiglare effect, the light extraction effect, the light confinement effect, and the like due to light scattering are exhibited.
- Alkoxysilane hydrolyzate The hydrolyzate of alkoxysilane is obtained by hydrolyzing alkoxysilane with water and a catalyst.
- the hydrolyzate of alkoxysilane may contain unreacted alkoxysilane.
- alkoxysilane examples include tetraalkoxysilane (tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, etc.), monoalkyltrialkoxysilane (methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane) Ethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, etc.), dialkyl dialkoxysilane (dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, dipropyldimethoxysilane, dipropyldiethoxysilane, etc.) , Trialkylmonoalkoxysilane (trimethylmethoxysilane,
- alkoxysilane tetraalkoxysilane is preferable and tetraethoxysilane and tetramethoxysilane are more preferable from the viewpoint of high hydrolysis rate and high productivity.
- Alkoxysilane hydrolysis is carried out using water and acid or alkali as a catalyst.
- the acid include inorganic acids (such as nitric acid, sulfuric acid, and hydrochloric acid) and organic acids (such as formic acid, oxalic acid, tartaric acid, citric acid, monochloroacetic acid, dichloroacetic acid, and trichloroacetic acid).
- the alkali include ammonia, sodium hydroxide, potassium hydroxide and the like.
- the catalyst is preferably an acid from the viewpoint of long-term storage stability, and the catalyst is preferably one that does not hinder the dispersion of inorganic fine particles.
- liquid medium of the first coating liquid either one or both of water and (poly) ethylene glycol are used.
- a liquid medium other than water and (poly) ethylene glycol is used, the inorganic fine particle-containing silicon oxide film is not deposited on the glass substrate, or the deposition efficiency of the inorganic fine particle-containing silicon oxide film is significantly reduced.
- liquid medium of the first coating liquid water alone or a mixture of water and (poly) ethylene glycol is preferable because water is required for hydrolysis of the alkoxysilane.
- a mixture of (poly) ethylene glycol and a minimum amount of water is particularly preferable from the viewpoint of good deposition efficiency of the inorganic fine particle-containing silicon oxide film.
- Examples of (poly) ethylene glycol include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol having a molecular weight of 300 or less, and triethylene from the viewpoint of good deposition efficiency of the silicon oxide film containing inorganic fine particles. Glycol and tetraethylene glycol are preferred, and tetraethylene glycol is particularly preferred.
- the first coating liquid may contain a liquid medium other than water and (poly) ethylene glycol as long as the effects of the present invention are not impaired.
- composition of the first coating solution The solid content concentration of the first coating liquid (the total concentration of the inorganic fine particles and the hydrolyzate of alkoxysilane in the first coating liquid) depends on the deposition efficiency of the silicon oxide film containing inorganic fine particles and the first coating liquid. From the viewpoint of viscosity (handleability), 0.3 to 70% by mass is preferable, and 3 to 25% by mass is more preferable.
- the proportion of the inorganic fine particles is preferably 1 to 60% by mass in 100% by mass of the solid content of the first coating liquid (the total of the inorganic fine particles and the alkoxysilane hydrolyzate in the first coating liquid). More preferable is 30% by mass.
- the proportion of the inorganic fine particles is 1% by mass or more, the function derived from the inorganic fine particles is sufficiently exhibited.
- the proportion of the inorganic fine particles is 60% by mass or less, the aggregation of the inorganic fine particles is suppressed, and a film in which the inorganic fine particles are uniformly dispersed is obtained.
- the proportion of the hydrolyzate of alkoxysilane (the solid content in terms of SiO 2 ) is 100% by mass of the solid content of the first coating solution (the sum of the inorganic fine particles and the hydrolyzate of alkoxysilane in the first coating solution). Of these, 40 to 99% by mass is preferable, and 70 to 97% by mass is more preferable.
- the proportion of the alkoxysilane hydrolyzate is 40% by mass or more, the inorganic fine particles can be deposited with high efficiency.
- the proportion of the alkoxysilane hydrolyzate is 99% by mass or less, the function derived from the inorganic fine particles is sufficiently exhibited.
- the method for applying the first coating liquid As a method for applying the first coating liquid, spraying the first coating liquid using a nozzle (for example, a spray gun or the like) from the viewpoint that the inorganic fine particle-containing glass substrate with a silicon oxide film can be produced with high production efficiency.
- the method is preferred.
- Specific application methods by the spray method include the following methods (i), (ii), (iii) and the like. The number of steps is small, and a glass substrate with an inorganic fine particle-containing silicon oxide film is produced more efficiently. Method (ii) is preferable because it can be performed.
- the temperature of the glass substrate or glass ribbon when applying the first coating liquid is preferably 200 to 650 ° C., more preferably 300 to 600 ° C.
- the hydrolyzate of alkoxysilane is baked on the glass substrate or glass ribbon in the temperature range to form silicon oxide.
- the temperature of the glass substrate or the glass ribbon is 200 ° C. or higher, the hydrolyzate of alkoxysilane on the glass substrate or the glass ribbon can be fired in a short time, so that productivity is good.
- a glass substrate manufacturing method by a float method if the glass ribbon temperature is 650 ° C. or lower, the glass ribbon does not exist in the float bath, so during spraying There is little possibility of polluting the atmosphere in the bus.
- a glass ribbon obtained by forming molten glass in a float bath is subjected to a float bath and a slow cooling step.
- the first coating liquid it is preferable to spray the first coating liquid at a position where the glass ribbon is in the temperature range of 200 to 650 ° C.
- the temperature of the glass ribbon immediately after the float bath is usually about 650 ° C., although it depends on the glass composition of the glass substrate. It is not realistic that the temperature of the glass ribbon exceeds 650 ° C.
- the glass ribbon exiting the float bath is gradually cooled in the slow cooling step, and is cooled to 400 ° C. or lower in the slow cooling step.
- the second coating liquid contains a metal oxide precursor and, if necessary, a liquid medium.
- Titanium oxide precursors titanium alkoxide, titanium alkoxide, titanium acetate, titanium oxyacetylacetonate, titanium acetylacetonate, ethylenediaminetetraacetate titanium, ethylhexanoate titanium, benzoate titanium, titanium lactate, titanium sulfide, fluoride Titanium, titanium chloride, titanium bromide, titanium iodide, etc.
- Zinc oxide precursors zinc acetate, zinc acetylacetonate, zinc ethylenediaminetetraacetate, zinc ethylhexanoate, zinc octadecanoate, zinc benzoate, zinc naphthenate, zinc lactate, zinc sulfide, zinc borate, zinc carbonate, fluoride Zinc, zinc chloride, zinc bromide, zinc iodide, etc.
- Precursor of tin oxide tin acetate, dibutyltin diacetate, tin acetylacetonate, tin ethylenediaminetetraacetate, tin ethylhexanoate, tin sulfide, tin fluoride, tin chloride, tin bromide, tin iodide, etc.
- Precursor of silicon oxide hydrolyzate of alkoxysilane, organopolysiloxane (silicone oil, etc.), etc.
- the liquid medium of the second coating liquid may be appropriately selected according to the metal oxide precursor.
- composition of the second coating solution The solid content concentration of the second coating liquid (concentration of the metal oxide precursor in the second coating liquid) may be appropriately selected according to the metal oxide precursor.
- a method for applying the second coating liquid spraying the second coating liquid using a nozzle (for example, a spray gun) from the viewpoint that the inorganic fine particle-containing glass substrate with a silicon oxide film can be produced with high production efficiency.
- the method is preferred.
- Specific application methods by the spray method include the above-described methods (i), (ii), (iii), etc., and the number of steps is small, and a glass substrate with an inorganic fine particle-containing silicon oxide film is produced more efficiently.
- Method (ii) is preferable because it can be performed.
- the temperature of the glass substrate or glass ribbon when applying the second coating liquid is preferably 200 to 650 ° C., more preferably 300 to 600 ° C.
- a glass ribbon obtained by forming molten glass in a float bath is used as the second coating liquid application method.
- FIG. 3 is a schematic diagram illustrating an example of a glass manufacturing apparatus.
- the glass manufacturing apparatus 20 melts a glass raw material to form a molten glass 30, and floats the molten glass 30 supplied from the melting furnace 22 on the surface of the molten tin 24, so that the molten glass 30 becomes a glass substrate.
- an air-type first spray gun 34 for applying a first coating liquid installed at a height of 5 mm. It is also preferable to provide a second spray gun 36 for applying the second coating liquid after the first spray gun 34.
- the glass ribbon 32 moving at a predetermined conveying speed is moved from the first spray gun 34 to the first spray gun 34 at a position where the surface temperature of the glass ribbon 32 is 200 to 650 ° C. between the float bath 26 and the slow cooling furnace 28.
- the coating liquid is sprayed to form an inorganic fine particle-containing silicon oxide film on the glass ribbon 32.
- the second coating liquid is sprayed from the second spray gun 36 onto the inorganic fine particle-containing silicon oxide film, and the inorganic fine particle-containing silicon oxide film is sprayed.
- a metal oxide film is formed on the silicon oxide film containing fine particles.
- the glass ribbon 32 exiting the slow cooling furnace 28 is cut into a glass substrate by a cutting device (not shown).
- the coating liquid containing inorganic fine particles is applied on the glass substrate or the glass ribbon, and therefore, according to the target optical characteristics.
- Inorganic fine particles having a desired particle size can be used.
- a glass substrate with an inorganic fine particle-containing silicon oxide film having the desired optical performance can be obtained.
- a hydrosilane of alkoxysilane is used instead of the conventional organopolysiloxane. Since a decomposition product is used, a polar medium can be used as the liquid medium.
- inorganic fine particles that can be dispersed in a polar liquid medium rather than inorganic fine particles that can be dispersed in a non-polar liquid medium, and there is no need for surface treatment such as hydrophobization. A wider range of choices.
- the hydrolyzate of alkoxysilane which is a precursor of silicon oxide, tends to vaporize at a higher temperature than conventional organopolysiloxanes and tends to have poor film deposition efficiency on a glass substrate or glass ribbon.
- the efficiency of depositing the inorganic fine particle-containing silicon oxide film on the glass substrate or glass ribbon is good.
- a metal oxide film on a silicon oxide film containing inorganic fine particles a glass substrate with an inorganic fine particle-containing silicon oxide film with improved antiglare effect, light extraction effect, light confinement effect, etc. due to light scattering Can be manufactured.
- Examples 8 to 19 are examples, and examples 1 to 7 are comparative examples.
- Covering rate (%) 100 ⁇ length (mm) of portion where inorganic fine particles are present / measured length (1 mm).
- Examples 1 to 11 To the liquid medium shown in Table 1, tetraethoxysilane (manufactured by Kanto Chemical Co., Inc., SiO 2 conversion solid content: 99.9% by mass) is added so as to be 30% by mass in the first coating liquid, and nitric acid (70 (Mass% aqueous solution) was added so that it might become 0.35 mass% in the 1st coating liquid, and it stirred for 1 hour. Next, silica sol (manufactured by Nissan Chemical Industries, MP-4540M, average primary particle size: 450 nm, solid content: 40.7 mass%, medium: water) is adjusted to 2.5 mass% in the first coating liquid.
- nitric acid 70 (Mass% aqueous solution) was added so that it might become 0.35 mass% in the 1st coating liquid, and it stirred for 1 hour.
- silica sol manufactured by Nissan Chemical Industries, MP-4540M, average primary particle size: 450 nm, solid content: 40.7 mass%, medium: water
- KM-100 manufactured by SPD Laboratory
- glass substrate 10 cm ⁇ 10 cm ⁇ 4 mm high transmission glass (Asahi Glass Co., Ltd.) was used.
- a glass substrate was placed on the stage, and a heater was installed on the back side of the stage without contact with the stage.
- the glass substrate was heated to 600 ° C. through the stage by the radiant heat of the heater.
- the temperature of the glass substrate was measured by bringing a thermocouple into contact with one side of the glass substrate. Since the glass substrate was heated for a sufficient time before spraying the first coating liquid with the spray gun, the temperature measured here may be considered to be approximately the same as the surface temperature of the glass substrate.
- the first coating solution was sprayed onto the glass substrate from a spray gun disposed above the glass substrate.
- the liquid feed pressure to the spray gun was adjusted so that the liquid feed speed was 0.3 to 0.6 mL / second, and the spray pressure was set to 0.1 MPa.
- the coating time was 15 seconds.
- the stage, glass substrate, and spray gun were sprayed in a state surrounded by an explosion-proof device, and the ambient temperature was not adjusted.
- Table 1 shows the coverage and haze of the obtained glass substrates with silicon oxide particles containing silicon oxide particles of Examples 1 to 11.
- Examples 8 to 11 according to the examples of the present invention using water or (poly) ethylene glycol as the main liquid medium showed higher particle coverage than Examples 1 to 7 using other liquid media. .
- the haze was increased accordingly, and high light scattering characteristics were exhibited.
- Example 12 to 14 The glass with silicon oxide particles containing silicon oxide particles was used in the same manner as in Examples 1 to 11 except that the temperature of the glass substrate was changed to 300 ° C., 400 ° C., and 500 ° C. as shown in Table 2, using the liquid medium of Example 10. A substrate was obtained. Table 2 shows the coverage and haze of the obtained silicon oxide particle-containing glass substrate with a silicon oxide film.
- Tetraethoxysilane (manufactured by Kanto Chemical Co., Inc., SiO 2 equivalent solid content: 99.9% by mass) is added to triethylene glycol so as to be 30% by mass in the first coating liquid, and further nitric acid (70% by mass aqueous solution). ) was added so that it might become 0.35 mass% in a 1st coating liquid, and it stirred for 1 hour.
- silica sol manufactured by Nissan Chemical Industries, MP-2040, average primary particle size: 190 nm, solid content: 40% by mass, medium: water
- the solid content concentration in terms of SiO 2 is 9.65% by mass
- the ratio of silicon oxide particles in the solid content is 10.4% by mass
- hydrolyzate of alkoxysilane in the solid content in terms of SiO 2
- the first coating liquids of Examples 15 to 19 having a solid content ratio of 89.6% by mass were obtained.
- Silicone oil (X-22-7322, manufactured by Shin-Etsu Silicone Co., Ltd.) is added to normal decane so as to be 70% by mass in the second coating solution, and stirred for 10 minutes to obtain the second coating solution of Example 16. It was.
- Titanium tetrabutoxide was added to acetylacetone so as to be 20% by mass in the second coating solution, and stirred for 1 hour to obtain a second coating solution of Example 17.
- Zinc acetate dihydride was added to N, N-dimethylformamide so as to be 20% by mass in the second coating liquid, and stirred for 30 minutes to obtain a second coating liquid of Example 18.
- Dibutyltin diacetate (tin oxide precursor) was added to N, N-dimethylformamide so as to be 20% by mass in the second coating liquid, and stirred for 10 minutes to obtain the second coating liquid of Example 19. .
- the first coating solution was sprayed onto the glass substrate from a spray gun disposed above the glass substrate.
- the liquid feed pressure to the spray gun was adjusted so that the liquid feed speed was 0.3 to 0.6 mL / second, and the spray pressure was set to 0.1 MPa.
- the coating time was 15 to 30 seconds.
- Example 15 the glass substrate on which only the silicon oxide particle-containing silicon oxide film was formed was evaluated. Table 3 shows the haze.
- a metal oxide film was further formed as follows using each of the second coating liquids described above.
- the second coating liquid was sprayed onto the silicon oxide particle-containing silicon oxide film from a spray gun placed above the glass substrate while maintaining the glass substrate immediately after forming the silicon oxide particle-containing silicon oxide film at 600 ° C.
- the liquid feed pressure to the spray gun was adjusted so that the liquid feed speed was 0.3 to 0.6 mL / second, and the spray pressure was 0.1 MPa.
- the coating time was 15 to 30 seconds.
- the glass substrates of Examples 16 to 19 in which a metal oxide film was formed on a silicon oxide film containing silicon oxide particles were evaluated. Table 3 shows the haze.
- a glass substrate (Example 15) on which only a silicon oxide particle-containing silicon oxide film is formed (Example 15)
- a glass substrate (Examples 17 to 19) further formed with a metal oxide film having a refractive index different from that of silicon oxide particles has a haze.
- a metal oxide film having a refractive index different from that of silicon oxide particles has a haze.
- no improvement in haze was observed.
- the glass substrate with an inorganic fine particle-containing silicon oxide film obtained by the production method of the present invention includes a window glass having an antiglare effect, a glass substrate for an organic EL element having a light extraction effect, and a cover glass for a solar cell having a light confinement effect. Useful as such.
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Abstract
Description
(1)金属塩化物を原料に用いた熱分解法によってガラス基板上に金属酸化物粒子を形成した後、酸化ケイ素膜をさらに形成する方法(特許文献1参照)。
(2)400~650℃の温度範囲にあるガラス基板上に、オルガノポリシロキサン、無機微粒子および液状媒体を含むコーティング液を塗布し、無機微粒子含有酸化ケイ素膜を形成する方法(特許文献2参照)。
(2)の方法では、目的とする光学性能に合わせて所望の粒子径の無機微粒子を用いることができるものの、オルガノポリシロキサンが非極性であるため、コーティング液の液状媒体が非極性のものに限定される。そのため、無機微粒子も非極性の液状媒体中で凝集しないように、別途疎水化等の表面処理を施したものに限定されてしまう。
[1]ガラス基板上に、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含むコーティング液を塗布し、無機微粒子含有酸化ケイ素膜を形成する、無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法。以下、この[1]の製造方法を、本発明の第1の実施態様に係る方法ともいう。
また、前記無機微粒子含有酸化ケイ素膜上に、前記無機微粒子とは屈折率の異なる金属酸化物膜をさらに形成することが好ましい。
また、フロートバス中で溶融ガラスをガラスリボンに成形し、フロートバスと徐冷工程との間または徐冷工程中で前記コーティング液を塗布することが好ましい。
また、ガラスリボン上の前記無機微粒子含有酸化ケイ素膜上に、前記無機微粒子とは屈折率の異なる金属酸化物膜をさらに形成することが好ましい。
本明細書におけるガラス基板やガラスリボンの温度は、コーティング液を塗布する側の表面温度である。
本明細書における屈折率は、波長550nmの光の屈折率である。
本明細書における無機微粒子含有酸化ケイ素膜の膜厚は、無機微粒子含有酸化ケイ素膜付ガラス基板の断面を走査型電子顕微鏡にて観察して得られる像から計測され、ガラス基板上から無機微粒子の頂点までの距離の平均値である。本明細書における金属酸化物膜の膜厚は、金属酸化物膜を有する無機微粒子含有酸化ケイ素膜付きガラス基板の断面を走査型電子顕微鏡にて観察して得られる像から計測されたものである。
本明細書における分散液中の平均一次粒子径は、動的散乱法によって測定される平均一次粒子径(メジアン径:50%粒子径)である。
図1は、本発明の製造方法によって得られる無機微粒子含有酸化ケイ素膜付ガラス基板の一例を示す概略断面図である。無機微粒子含有酸化ケイ素膜付ガラス基板1は、ガラス基板10と、ガラス基板10の表面に形成された、表面に凹凸を有する無機微粒子含有酸化ケイ素膜12とを有する。
ガラス基板10の材料としては、ソーダライムシリカガラス、ホウケイ酸ガラス、アルミノシリケートガラス等が挙げられる。
無機微粒子含有酸化ケイ素膜付ガラス基板1を有機EL素子用ガラス基板として用いる場合、ガラス基板10としては、無アルカリガラス、またはソーダライムシリカガラスにシリカコートしたものが好ましい。
また、本発明の第2の実施態様に係る方法において、ガラスリボン上に無機微粒子含有酸化ケイ素膜を形成する前に、上記したようなアンダーコート層、密着改善層、保護層等の機能層を形成してもよい。
無機微粒子含有酸化ケイ素膜12は、後述するコーティング液(すなわち、第1のコーティング液)を塗布することによって形成される膜である。具体的には、無機微粒子含有酸化ケイ素膜12は、ガラス基板10の表面に配置された複数の無機微粒子14と、無機微粒子14およびガラス基板10の表面を薄く覆う酸化ケイ素膜16とから構成され、表面に無機微粒子14の形状に由来する凹凸を有する。無機微粒子含有酸化ケイ素膜12は、窓ガラスの防眩膜、有機EL素子用ガラス基板の光取り出し層、太陽電池用カバーガラスの光閉じ込め層として有用である。
接触段差計を用い、測定長さ1mmにて無機微粒子含有酸化ケイ素膜12の表面の凹凸形状を測定し、測定結果から、無機微粒子14が存在している部分の長さを抜き出し、下式から被覆率を求める。
被覆率(%)=100×無機微粒子14が存在している部分の長さ(mm)/測定長さ(1mm)。
無機微粒子14としては、金属酸化物粒子(複合金属酸化物粒子も含む)、金属粒子が挙げられる。無機微粒子含有酸化ケイ素膜付ガラス基板1に要求される機能に応じて、適宜、無機微粒子14の種類を選択すればよい。
光の散乱に加え、他の機能を無機微粒子含有酸化ケイ素膜付ガラス基板1に追加する場合、無機微粒子14の材料としては、機能別に下記のものが挙げられる。
紫外線遮蔽:酸化亜鉛、酸化セリウム等。
赤外線遮蔽:酸化インジウムスズ(ITO)、酸化アンチモンスズ(ATO)、酸化タングステン、エルビウム等。
帯電防止:ITO、ATO、銀等。
光触媒:酸化チタン等。
波長変換:酸化亜鉛、ユーロピウムドープ酸化亜鉛、硫化亜鉛、ユーロピウムドープ硫化亜鉛、リン化インジウム、ビスマスドープ硫化カルシウム、ユーロピウムドープフッ化カルシウム、ユーロピウムドープバナジン酸イットリウム等。
酸化ケイ素膜16は、後述するコーティング液に含まれるアルコキシシランの加水分解物の焼成物であり、無機微粒子14をガラス基板10の表面に固定するバインダとしての役割を果たす。
無機微粒子含有酸化ケイ素膜付ガラス基板1は、図2に示すように、無機微粒子含有酸化ケイ素膜12上に、無機微粒子14とは屈折率の異なる金属酸化物膜18をさらに有していてもよい。金属酸化物膜18は、表面に無機微粒子14に由来する凹凸を有する。
本発明の無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法は、ガラス基板、またはガラス基板となるガラスリボンに、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含む第1のコーティング液を塗布し、アルコキシシランの加水分解物を焼成して、ガラス基板またはガラスリボン上に無機微粒子含有酸化ケイ素膜を形成する方法である。
溶融ガラスから成形されたガラスリボン上に、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含むコーティング液を塗布し、無機微粒子含有酸化ケイ素膜を形成する工程と、その後ガラスリボンを切断する工程とを有する方法。
ガラス基板の材料としては、上述したものが挙げられる。また、ガラス基板としては、溶融ガラスをガラスリボンに成形し、ガラスリボンを徐冷し、ついで切断してガラス基板を製造するガラス基板の製造方法において、ガラスリボンにコーティング液を塗布してガラスリボン上に無機微粒子含有酸化ケイ素膜を形成する方法に適用させるため、強化されていない生板ガラス基板が好ましい。
第1のコーティング液は、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含むものである。
無機微粒子は、上述した無機微粒子をあらかじめ水または(ポリ)エチレングリコールに分散した分散液の状態で用いられる。
アルコキシシランの加水分解物は、アルコキシシランを水および触媒によって加水分解することによって得られるものである。アルコキシシランの加水分解物は、未反応のアルコキシシランを含んでいてもよい。
第1のコーティング液の液状媒体としては、水および(ポリ)エチレングリコールのいずれか一方または両方を用いる。水および(ポリ)エチレングリコール以外の液状媒体を用いた場合、無機微粒子含有酸化ケイ素膜がガラス基板上に着膜しない、または無機微粒子含有酸化ケイ素膜の着膜効率が著しく低下する。
第1のコーティング液の固形分濃度(第1のコーティング液中の無機微粒子およびアルコキシシランの加水分解物の合計の濃度)は、無機微粒子含有酸化ケイ素膜の着膜効率および第1のコーティング液の粘度(取扱性)の点から、0.3~70質量%が好ましく、3~25質量%がより好ましい。
第1のコーティング液の塗布方法としては、無機微粒子含有酸化ケイ素膜付ガラス基板を生産効率よく製造できる点から、第1のコーティング液を、ノズル(たとえば、スプレーガン等)を用いて噴霧するスプレー法が好ましい。
スプレー法による具体的な塗布方法としては、下記の方法(i)、(ii)、(iii)等が挙げられ、工程数が少なく、無機微粒子含有酸化ケイ素膜付ガラス基板をより生産効率よく製造できる点から、方法(ii)が好ましい。
(ii)ノズルから一方向に移動しているガラスリボンに第1のコーティング液を噴霧する方法。
(iii)移動しているガラス基板の上方でノズルを移動させながら、あるいはノズルを固定して、ノズルからガラス基板に第1のコーティング液を噴霧する方法。
第2のコーティング液は、金属酸化物の前駆体と、必要に応じて液状媒体とを含むものである。
金属酸化物の前駆体としては、下記のものが挙げられる。
酸化チタンの前駆体:チタニウムアルコシキド、チタニウムアルコキシド、酢酸チタン、チタニウムオキシアセチルアセトナート、チタニウムアセチルアセトナート、エチレンジアミン四酢酸チタン、エチルヘキサン酸チタン、安息香酸チタン、乳酸チタン、硫化チタン、フッ化チタン、塩化チタン、臭化チタン、ヨウ化チタン等。
酸化亜鉛の前駆体:酢酸亜鉛、亜鉛アセチルアセトナート、エチレンジアミン四酢酸亜鉛、エチルヘキサン酸亜鉛、オクタデカン酸亜鉛、安息香酸亜鉛、ナフテン酸亜鉛、乳酸亜鉛、硫化亜鉛、ほう酸亜鉛、炭酸亜鉛、フッ化亜鉛、塩化亜鉛、臭化亜鉛、ヨウ化亜鉛等。
酸化スズの前駆体:酢酸スズ、ジブチルスズジアセテート、スズアセチルアセトナート、エチレンジアミン四酢酸スズ、エチルヘキサン酸スズ、硫化スズ、フッ化スズ、塩化スズ、臭化スズ、ヨウ化スズ等。
酸化ケイ素の前駆体:アルコキシシランの加水分解物、オルガノポリシロキサン(シリコーンオイル等)等。
第2のコーティング液の液状媒体は、金属酸化物の前駆体に応じて、適宜選択すればよい。
第2のコーティング液の固形分濃度(第2のコーティング液中の金属酸化物の前駆体の濃度)は、金属酸化物の前駆体に応じて、適宜選択すればよい。
第2のコーティング液の塗布方法としては、無機微粒子含有酸化ケイ素膜付ガラス基板を生産効率よく製造できる点から、第2のコーティング液を、ノズル(たとえば、スプレーガン等)を用いて噴霧するスプレー法が好ましい。
スプレー法による具体的な塗布方法としては、上述した方法(i)、(ii)、(iii)等が挙げられ、工程数が少なく、無機微粒子含有酸化ケイ素膜付ガラス基板をより生産効率よく製造できる点から、方法(ii)が好ましい。
本発明の第2の実施態様において、フロート法によるガラス基板の製造方法を利用する場合は、第2のコーティング液の塗布方法としては、フロートバス中で溶融ガラスを成形して得られたガラスリボンに対し、フロートバスと徐冷工程との間または徐冷工程中、ガラスリボンが200~650℃の温度範囲にある位置にて第2のコーティング液を噴霧することが好ましい。
図3は、ガラス製造装置の一例を示す概略図である。
ガラス製造装置20は、ガラス原料を溶解し、溶融ガラス30とする溶解窯22と、溶解窯22から供給された溶融ガラス30を溶融スズ24の表面に浮かべることで溶融ガラス30をガラス基板となるガラスリボン32に成形するフロートバス26と、該ガラスリボン32を徐冷する徐冷窯28と、フロートバス26の出口と徐冷窯28の入り口との間で、かつガラスリボン32の上方に570mmの高さで設置された第1のコーティング液を塗布するエアー式の第1のスプレーガン34とを備える。また、第1のスプレーガン34の後段に第2のコーティング液を塗布する第2のスプレーガン36を設けることも好ましい。
徐冷窯28を出たガラスリボン32は図示されていない切断装置により切断されてガラス基板とされる。
以上説明した本発明の無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法にあっては、ガラス基板やガラスリボン上に、無機微粒子を含むコーティング液を塗布しているため、目的の光学特性に応じて所望の粒子径の無機微粒子を用いることができる。その結果、目的とする光学性能を有する無機微粒子含有酸化ケイ素膜付ガラス基板を得ることができる。
また、無機微粒子含有酸化ケイ素膜の上に金属酸化物膜を形成することにより、光の散乱による防眩効果、光取り出し効果、光閉じ込め効果等が高められた無機微粒子含有酸化ケイ素膜付ガラス基板を製造することができる。
例8~19は実施例であり、例1~7は比較例である。
着膜効率の目安として、ガラス基板上における無機微粒子の被覆率を以下のようにして求めた。
接触段差計(ALVAC社製、DEKTAK150)を用い、測定長さ1mmにて無機微粒子含有酸化ケイ素膜の表面の凹凸形状を測定した。測定結果から、無機微粒子が存在している部分の長さを抜き出し、下式から被覆率を求めた。
被覆率(%)=100×無機微粒子が存在している部分の長さ(mm)/測定長さ(1mm)。
光の散乱の目安として、無機微粒子含有酸化ケイ素膜付ガラス基板のヘイズを、ヘイズメータ(ビックガードナー社製、ヘイズガードプラスE-4725型)を用いて測定した。
表1に示す液状媒体に、テトラエトキシシラン(関東化学社製、SiO2換算固形分:99.9質量%)を、第1のコーティング液中30質量%となるように加え、さらに硝酸(70質量%水溶液)を、第1のコーティング液中0.35質量%となるように加え、1時間撹拌した。次いで、シリカゾル(日産化学工業製、MP-4540M、平均一次粒子径:450nm、固形分:40.7質量%、媒体:水)を、第1のコーティング液中2.5質量%となるように加え、5~10分撹拌し、SiO2換算固形分濃度が9.65質量%、固形分中の酸化ケイ素粒子の割合が10.4質量%、固形分中のアルコキシシランの加水分解物(SiO2換算固形分)の割合が89.6質量%の例1~例11の第1のコーティング液を得た。
ガラス基板をステージ上に載置し、ステージ裏面側にステージと非接触でヒーターを設置した。ヒーターの放射熱により、ステージを介してガラス基板を600℃に加熱した。ガラス基板の温度は、ガラス基板の一側面に熱伝対を接触させることにより測定した。スプレーガンで第1のコーティング液を噴霧する前にガラス基板を充分な時間加熱したため、ここで測定された温度はガラス基板の表面温度とほぼ同じとみなしてよい。
ガラス基板を600℃まで昇温した後、ガラス基板の上方に配置したスプレーガンからガラス基板上に第1のコーティング液を噴霧した。スプレーガンから第1のコーティング液を噴霧する際、送液速度が0.3~0.6mL/秒となるようにスプレーガンへの送液圧力を調節し、噴霧圧力は0.1MPaとした。塗布時間は15秒とした。なお、ステージ、ガラス基板、スプレーガンは防爆装置で囲われた状態で噴霧を行い、雰囲気温度は調整しなかった。
得られた例1~11の酸化ケイ素粒子含有酸化ケイ素膜付ガラス基板の被覆率、ヘイズを表1に示す。
ガラス基板の温度を表2のように、300℃、400℃、500℃に変更した以外は、例10の液状媒体を用い、例1~11と同様にして酸化ケイ素粒子含有酸化ケイ素膜付ガラス基板を得た。得られた酸化ケイ素粒子含有酸化ケイ素膜付ガラス基板の被覆率、ヘイズを表2に示す。
トリエチレングリコールに、テトラエトキシシラン(関東化学社製、SiO2換算固形分:99.9質量%)を、第1のコーティング液中30質量%となるように加え、さらに硝酸(70質量%水溶液)を、第1のコーティング液中0.35質量%となるように加え、1時間撹拌した。次いで、シリカゾル(日産化学工業製、MP-2040、平均一次粒子径:190nm、固形分:40質量%、媒体:水)を、第1のコーティング液中2.5質量%となるように加え、5~10分撹拌し、SiO2換算固形分濃度が9.65質量%、固形分中の酸化ケイ素粒子の割合が10.4質量%、固形分中のアルコキシシランの加水分解物(SiO2換算固形分)の割合が89.6質量%の例15~例19の第1のコーティング液を得た。
例16~19については、酸化ケイ素粒子含有酸化ケイ素膜の形成に引き続き、上記したそれぞれの第2のコーティング液を用いて、以下のようにして金属酸化物膜をさらに形成した。
酸化ケイ素粒子含有酸化ケイ素膜上に金属酸化物膜が形成された例16~例19のガラス基板について評価を行った。ヘイズを表3に示す。
なお、2012年4月24日に出願された日本特許出願2012-099166号の明細書、特許請求の範囲、図面および要約書の全内容をここに引用し、本発明の開示として取り入れるものである。
10 ガラス基板
12 無機微粒子含有酸化ケイ素膜
14 無機微粒子
16 酸化ケイ素膜
18 金属酸化物膜
20 ガラス製造装置
22 溶解窯
24 溶融スズ
26 フロートバス
28 徐冷窯
30 溶融ガラス
32 ガラスリボン
34 第1のスプレーガン
36 第2のスプレーガン
Claims (7)
- ガラス基板上に、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含むコーティング液を塗布し、無機微粒子含有酸化ケイ素膜を形成する、無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法。
- 前記コーティング液を塗布する際のガラス基板の温度が、200~650℃である、請求項1に記載の製造方法。
- 前記無機微粒子含有酸化ケイ素膜上に、前記無機微粒子とは屈折率の異なる金属酸化物膜をさらに形成する、請求項1または2に記載の製造方法。
- 溶融ガラスから成形されたガラスリボン上に、無機微粒子と、アルコキシシランの加水分解物と、水および(ポリ)エチレングリコールのいずれか一方または両方とを含むコーティング液を塗布し、無機微粒子含有酸化ケイ素膜を形成する工程と、その後ガラスリボンを切断する工程とを有する、無機微粒子含有酸化ケイ素膜付ガラス基板の製造方法。
- 前記コーティング液を塗布する際のガラスリボンの温度が、200~650℃である、請求項4に記載の製造方法。
- フロートバス中で溶融ガラスをガラスリボンに成形し、フロートバスと徐冷工程との間または徐冷工程中で前記コーティング液を塗布する、請求項4または5に記載の製造方法。
- ガラスリボン上の前記無機微粒子含有酸化ケイ素膜上に、前記無機微粒子とは屈折率の異なる金属酸化物膜をさらに形成する、請求項4~6のいずれか一項に記載の製造方法。
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CN201380021597.1A CN104245613A (zh) | 2012-04-24 | 2013-04-23 | 带含有无机微粒的氧化硅膜的玻璃基板的制造方法 |
EP13781896.9A EP2842920A4 (en) | 2012-04-24 | 2013-04-23 | METHOD FOR PRODUCING A GLASS SUBSTRATE WITH A SILICON OXIDE LAYER WITH FINE INORGANIC PARTICLES |
US14/515,270 US20150030778A1 (en) | 2012-04-24 | 2014-10-15 | Process for producing glass substrate provided with inorganic fine particle-containing silicon oxide film |
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US14/515,270 Continuation US20150030778A1 (en) | 2012-04-24 | 2014-10-15 | Process for producing glass substrate provided with inorganic fine particle-containing silicon oxide film |
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US (1) | US20150030778A1 (ja) |
EP (1) | EP2842920A4 (ja) |
JP (1) | JPWO2013161827A1 (ja) |
CN (1) | CN104245613A (ja) |
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WO (1) | WO2013161827A1 (ja) |
Cited By (3)
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JP2015158537A (ja) * | 2014-02-21 | 2015-09-03 | 旭硝子株式会社 | 防眩膜付き物品、その製造方法および画像表示装置 |
WO2017029735A1 (ja) * | 2015-08-19 | 2017-02-23 | 旭硝子株式会社 | 防眩膜付き物品、その製造方法および画像表示装置 |
JP2019513662A (ja) * | 2016-03-08 | 2019-05-30 | セントラル硝子株式会社 | 発光機能を有するガラス窓 |
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CN108139506B (zh) * | 2015-07-31 | 2019-11-15 | 日产化学工业株式会社 | 适合于移动显示设备的玻璃盖片等的玻璃基板 |
CN108328936B (zh) * | 2017-09-15 | 2020-10-20 | 重庆市中光电显示技术有限公司 | 用于触摸屏的自清洁防指纹盖板玻璃及其制备方法 |
CN107793039B (zh) * | 2017-11-13 | 2021-03-23 | 东旭光电科技股份有限公司 | 抗冲击钢化玻璃及其制备方法和显示终端 |
CN112340966A (zh) * | 2020-11-18 | 2021-02-09 | 安徽鸿程光电有限公司 | 防眩光玻璃及生产方法、装置、有该玻璃的电子显示设备 |
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- 2013-04-23 JP JP2014512618A patent/JPWO2013161827A1/ja active Pending
- 2013-04-23 CN CN201380021597.1A patent/CN104245613A/zh active Pending
- 2013-04-23 EP EP13781896.9A patent/EP2842920A4/en not_active Withdrawn
- 2013-04-24 TW TW102114588A patent/TW201402496A/zh unknown
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2014
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JP2019513662A (ja) * | 2016-03-08 | 2019-05-30 | セントラル硝子株式会社 | 発光機能を有するガラス窓 |
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CN104245613A (zh) | 2014-12-24 |
TW201402496A (zh) | 2014-01-16 |
EP2842920A4 (en) | 2016-03-30 |
JPWO2013161827A1 (ja) | 2015-12-24 |
EP2842920A1 (en) | 2015-03-04 |
US20150030778A1 (en) | 2015-01-29 |
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