WO2013152598A1 - 连接装置、平板装置、图像传感器、显示器及触摸设备 - Google Patents

连接装置、平板装置、图像传感器、显示器及触摸设备 Download PDF

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Publication number
WO2013152598A1
WO2013152598A1 PCT/CN2012/086037 CN2012086037W WO2013152598A1 WO 2013152598 A1 WO2013152598 A1 WO 2013152598A1 CN 2012086037 W CN2012086037 W CN 2012086037W WO 2013152598 A1 WO2013152598 A1 WO 2013152598A1
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WO
WIPO (PCT)
Prior art keywords
unit
conductive contact
contact terminal
substrate
wire
Prior art date
Application number
PCT/CN2012/086037
Other languages
English (en)
French (fr)
Inventor
凌严
Original Assignee
上海天马微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海天马微电子有限公司 filed Critical 上海天马微电子有限公司
Priority to EP12866399.4A priority Critical patent/EP2840656B1/en
Priority to US13/958,414 priority patent/US9615477B2/en
Publication of WO2013152598A1 publication Critical patent/WO2013152598A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Definitions

  • Connecting device tablet device, image sensor, display, and touch device
  • the present invention relates to the field of electronic technologies, and in particular, to a connection device, a tablet device, an image sensor, a display, and a touch device.
  • the X-ray flat panel detector is a large-area planar X-ray imaging device.
  • the X-rays transmitted through the illuminated object are converted into electronic signals by X-ray flat panel detectors, which in turn form a digitized grayscale image directly related to the internal structure of the illuminated object.
  • X-ray flat panel detectors achieve non-destructive internal imaging of objects and are one of the best ways to achieve non-destructive testing. It has been widely used and developed in the fields of medical imaging and industrial non-destructive testing.
  • the X-ray flat panel detector includes an X-ray fluorescent layer 1, a flat panel sensor 2, an image acquisition chip 3, and a peripheral logic control and image processing system 4.
  • the image acquisition chip 3 includes a switch control chip 31 and a signal readout chip 32.
  • the flat panel sensor 2 used in the X-ray flat panel detector shown in FIG. 1 is an indirect flat panel sensor, and the indirect flat panel sensor only absorbs light of visible light and its nearby wavelength, so it is necessary to convert the X-ray into X-ray using the X-ray fluorescent layer 1 Visible light such as green or blue light.
  • the flat panel sensor 2 includes a large-area pixel array and a transparent substrate, which is one of the core components of the entire X-ray flat panel detector, and is generally fabricated on the transparent substrate (for example, a glass substrate or a quartz substrate).
  • the pixel array includes a plurality of control lines 22 extending in the X-axis direction and a plurality of read lines 23 extending in the Y-axis direction, wherein the X-axis and the Y-axis are substantially perpendicular.
  • a region enclosed between the adjacent control lines 22 and the two adjacent read lines 23 is a pixel region in which pixel units are disposed.
  • Each of the pixel units 21 includes a photosensor 211 (e.g., a photodiode), and at least one switching device 212 (e.g., a thin film transistor, a thin film transistor).
  • the switching state of the switching device 212 is controlled by a control signal on the control line 22; when the switching device 212 is turned on, the signal in the pixel unit 21 located in the same pixel region can be read by the reading line 23; When the device 212 is turned off, signals in the pixel unit 21 located in the same pixel region cannot be read by the read line 23.
  • a thin film transistor is used as the switching device 212.
  • the thin film transistor is disposed at an intersection of a control line 22 and a read line 23, and the pixel unit 21 located in the same pixel region as the thin film transistor passes through the thin film transistor.
  • the control line 22 and the read line 23 are coupled.
  • the specific meaning of the coupling is that the gate of the thin film transistor is electrically connected to the control line 22; the source/drain of the thin film transistor is electrically connected to the read line 23; the drain/source of the thin film transistor is The pixel unit 21 is electrically connected.
  • the size and number of pixel units 21 can reflect the resolution and area of the image.
  • the X-rays passing through the detected object can be converted into visible light by the X-ray fluorescent layer 1, and the visible light is projected onto the photosensitive device 211 of the flat panel sensor 2 (or directly transmitted through the X-ray of the detected object), and the photosensitive device 211 A corresponding proportion of charge is converted and temporarily stored in each pixel unit 21 of the flat panel sensor 2.
  • a control line 22 is applied with a control signal such that the switching device TFT212 electrically connected to the gate and the control line 22 is turned on
  • the read line 23 electrically connected to the source/drain of the switching device TFT 212 can read out the photosensor 211.
  • the temporarily stored charge signal is then subjected to analog-to-digital conversion and the like.
  • the peripheral logic control and image processing system 4 controls the orderly operation of the image pickup chip 3, thereby realizing the opening and closing of the switching device TFT212 in each row of pixel units 21, and the reading of the charge signals in the photosensitive device 211 in each pixel unit 21. deal with.
  • the switch control chip 31 turns on the switching device TFT212 one by one by the control line 22 in order. While the switching device TFT212 is turned on, the signal sensing chip 32 reads out the temporarily stored charge signal in the pixel unit 21 through the read line 23 and performs analog-to-digital conversion, and transmits the processed digital signal to the peripheral logic control and image processing system. 4. Image acquisition is performed line by line in this manner until the charge signals in the pixel unit 21 of the entire flat panel sensor 2 are read out, and the entire image is read and processed.
  • the image acquisition chip 3 is packaged on a flexible printed circuit board (FPC) 5 by a chip on film (Chip On Film, COF) bonding process.
  • the packaged image acquisition chip 3 and the FPC 5 form a COF module 6.
  • the COF module 6 is bound to the conductive contact 24 of the flat panel sensor 2 by a film on glass (Film On Glass, FOG) bonding process, and electrical connection and conduction between the flat panel sensor 2 and the image acquisition chip 3 are realized.
  • FOG Film On Glass
  • an anisotropic conductive film (ACF) 7 is applied on the conductive contact 24 of the flat panel sensor 2, and then the hot pressing method is applied.
  • ACF anisotropic conductive film
  • the FPC 5 of the COF module 6 is press-fitted onto the conductive contacts 24 of the flat panel sensor 2.
  • the ACF 7 is capable of conducting conduction in the vertical direction and is non-conductive in the horizontal direction, so the COF module 6 is electrically connected to the conductive contacts 24 but is insulated from the adjacent conductive contacts.
  • the COF module 6 can also be soldered to the conductive contact 24 of the flat panel sensor 2 by metal fusion welding technology to realize electrical connection and conduction between the flat panel sensor 2 and the image acquisition chip 3.
  • the problem of non-compliance of the flat panel sensor 2 is found to require separation of the COF module 6 from the flat panel sensor 2, the bonding and hot pressing process of the ACF7 or the metal fusion welding process, as well as the soft characteristics of the FPC5
  • the FPC5 in the COF module 6 is damaged during the separation process, so that the entire COF module 6 cannot be used normally; however, the image acquisition chip 3 in the COF module is not damaged, but the image acquisition chip 3 cannot be reused due to damage of the FPC5. , caused a great waste.
  • the above-mentioned image acquisition chip 3 chip can not be reused, resulting in waste; the chip unit and soft connection device of other devices (such as touch screen, flat panel display, etc.) are packaged into a COF module.
  • the substrate unit of the device is connected by ACF bonding or metal fusion welding, and there is also a problem that the soft connecting device in the COF module is damaged during the stripping process, so that the chip cannot be reused, resulting in great waste.
  • the technical problem solved by the technical solution of the present invention is that the chip unit and the flexible connecting device of the prior art are packaged into a COF module, and then connected to the substrate unit by ACF bonding or metal fusion welding, and the flexible connecting device is separated from the substrate unit. It is easy to cause damage, which in turn causes the chip bundled with the soft connection device to be unusable, resulting in great waste.
  • connection device for connecting a substrate unit and a chip unit
  • the connection device comprising: a first flexible connection unit, including a first portion for electrically connecting with the substrate unit a wire; a rigid connection unit, coupled to the first flexible connection unit, including a second wire for electrically connecting to the first wire; the chip unit being electrically connected to the second wire.
  • the rigid connecting unit is connected to the first flexible connecting unit by ACF bonding or metal fusion welding.
  • the first flexible connecting unit is respectively provided with a first conductive contact at two ends of the first wire And a second conductive contact terminal; the first conductive contact terminal is configured to be connected to the substrate unit by ACF bonding or metal fusion welding; The second conductive contact terminal and the third conductive contact terminal are connected by ACF bonding or metal fusion welding.
  • the first flexible connection unit is an FPC.
  • the rigid connection unit further includes a rigid substrate, and the other end of the second wire of the rigid connection unit is provided with a fourth conductive contact terminal, the second wire, the third conductive contact terminal, and the first Four conductive contact terminals are located on the rigid substrate.
  • the fourth conductive contact terminal is used for connection with the chip unit by ACF bonding or metal fusion welding.
  • the connecting device further includes a second flexible connecting unit, the second flexible connecting unit includes a fifth conductive contact terminal, a sixth conductive contact terminal, and a third wire connecting the two;
  • the conductive contact terminal and the fifth conductive contact terminal are connected by ACF bonding or metal fusion welding;
  • the sixth conductive terminal is used for connection with the chip unit by ACF bonding or metal fusion welding.
  • the technical solution of the present invention further provides a tablet device, including: a substrate unit, a first flexible connection unit, a rigid connection unit, and a chip unit, wherein the first flexible connection unit, The substrate unit is connected to include a first wire, the first wire is electrically connected to the substrate unit, and the rigid connection unit is connected to the first flexible connection unit, and includes a second wire, the second The wire is electrically connected to the first wire; the chip unit is electrically connected to the substrate unit through the second wire and the first wire in sequence.
  • the substrate unit and the first flexible connecting unit are connected by ACF bonding or metal fusion welding; the first flexible connecting unit and the rigid connecting unit are bonded by ACF or metal fusion welding. Connected.
  • the rigid connection unit is connected to the chip unit by ACF bonding or metal fusion welding.
  • the tablet device further includes a second flexible connecting unit, and the rigid connecting unit is connected to the second flexible connecting unit by ACF bonding or metal fusion welding.
  • the second flexible connection unit and the chip unit are bound by ACF or metal melting The fusion welding is connected.
  • the tablet device further includes a printed circuit board (PCB); the second flexible connection unit is connected to the PCB; the PCB and the chip unit are bound by ACF or metal The fusion welding is connected.
  • PCB printed circuit board
  • the substrate unit includes a substrate conductive contact terminal; the first conductive connection terminal is respectively provided with a first conductive contact terminal and a second conductive contact terminal; the rigid connection unit The second conductive wire is respectively provided with a third conductive contact terminal and a fourth conductive contact terminal; the substrate conductive contact terminal and the first conductive contact terminal are connected by ACF bonding or metal fusion welding; The second conductive contact terminal is connected to the third conductive contact terminal by ACF bonding or metal fusion welding.
  • the fourth conductive contact terminal of the rigid connection unit is connected to the chip unit by ACF bonding or metal fusion welding.
  • the second flexible connection unit further includes a third wire and a fifth conductive contact terminal and a sixth conductive contact terminal respectively disposed at two ends of the third wire;
  • the fourth conductive contact terminal of the rigid connection unit and the fifth conductive contact terminal of the second flexible connection unit are connected by ACF bonding or metal fusion welding.
  • the sixth conductive contact terminal of the second flexible connecting unit is connected to the chip unit by ACF bonding or metal fusion welding.
  • the tablet device further includes a PCB; the PCB includes a fourth wire and a seventh conductive contact terminal and an eighth conductive contact terminal respectively disposed at two ends of the fourth wire; the second flexible connection unit The sixth conductive contact terminal is connected to the PCB; the PCB is connected to the chip unit by ACF bonding or metal fusion welding.
  • the second flexible connection unit is an FPC.
  • the substrate unit comprises a TFT array substrate.
  • the substrate unit is a touch screen.
  • the technical solution of the present invention further provides a flat panel image sensor comprising the flat panel device, wherein the substrate unit comprises a TFT array substrate, and a photosensitive sensor is disposed in a pixel region of the TFT array substrate.
  • the technical solution of the present invention further provides an organic light emitting diode display including the tablet device
  • the substrate unit includes a TFT array substrate, and an organic light emitting diode is disposed in a pixel region of the TFT array substrate.
  • the technical solution of the present invention further provides a liquid crystal display, comprising: a color filter substrate, a liquid crystal layer, and the flat panel device; the substrate unit includes a TFT array substrate, and a pixel electrode is disposed in a pixel region of the TFT array substrate; The color filter substrate and the TFT array substrate are oppositely disposed, and the liquid crystal layer is filled between the two.
  • the technical solution of the present invention further provides an electronic paper display, comprising: an upper substrate, a microcapsule layer, and the flat panel device; the substrate unit includes a TFT array substrate, and the pixel array of the TFT array substrate is provided with a pixel An electrode; the upper substrate and the TFT array substrate are oppositely disposed, and the microcapsule layer is filled between the two.
  • the technical solution of the present invention further provides a touch device including the tablet device, wherein the substrate unit is a touch screen.
  • the chip unit in the technical solution of the present invention is electrically connected to the substrate unit through the rigid connection unit and the flexible connection unit in sequence; the chip unit is not directly connected to the flexible connection unit directly connected to the substrate unit, and the chip is directly packaged.
  • a rigid connecting unit directly connected to the flexible connecting unit is further disposed between the unit and the flexible connecting unit; therefore, even if the flexible connecting unit is damaged when separated from the substrate unit, the chip unit and the rigid connecting unit are not thereby In the case of damage, the chip unit can be reused as long as the flexible connecting unit is separated from the rigid connecting unit.
  • FIG. 1 is a schematic perspective view of a conventional X-ray flat panel detector
  • Figure 2 is a schematic cross-sectional view taken along line A-A' of Figure 1;
  • FIG. 3 is a schematic structural view of a connecting device according to Embodiment 1 of the present invention.
  • FIG. 4 and FIG. 5 are schematic views showing a set of three-dimensional structures of the tablet device of the present invention.
  • FIG. 6 is a schematic structural view of a connecting device according to Embodiment 2 of the present invention.
  • FIG. 7 and 8 are schematic views showing another set of three-dimensional structures of the tablet device of the present invention.
  • FIG. 9 and FIG. 10 are schematic structural diagrams of a tablet device according to Embodiment 3 of the present invention.
  • FIG. 11 and FIG. 12 are schematic structural diagrams of a tablet device according to Embodiment 4 of the present invention.
  • FIG. 13 is a schematic perspective structural view of a tablet device according to Embodiment 5 of the present invention.
  • Figure 14 is a cross-sectional view taken along line BB' of Figure 13; 15 and FIG. 16 are schematic perspective structural views of a tablet device according to Embodiment 6 of the present invention; FIG. 17 and FIG. 18 are schematic perspective structural views of a tablet device according to Embodiment 7 of the present invention.
  • connection by ACF in the application file of the present invention.
  • the chip and the glass substrate are connected by ACF binding, which is a well-known COG binding; the chip and the FPC are connected by ACF binding, which is a well-known COF binding; the chip and the PCB substrate are connected by ACF binding, which is known.
  • COB binding; FPC and glass substrate are connected by ACF binding, which is known as FOG binding; FPC and FPC are connected by ACF binding, which is known as FOF binding; FPC is connected with PCB substrate through ACF binding Is the well-known FOB binding.
  • the metal fusion welding technique is also well known in the art, and the present invention does not make too many statements.
  • the core of the metal fusion welding technique is that the conductive contacts of the two units are pressed while being applied at a high temperature. Or ultrasonic waves, causing the conductive contacts of the two units to be heated and melted and fused together to form an alloy, thereby achieving mechanical connection while achieving mechanical connection.
  • the technical solution of the present invention provides a connection device for connecting a substrate unit and a chip unit.
  • the connecting device includes: a first flexible connecting unit, including a first wire for electrically connecting with the substrate unit; a rigid connecting unit connected to the first flexible connecting unit, including a second wire electrically connected to the first wire; the chip unit being electrically connected to the second wire.
  • the chip unit may sequentially transmit signals to the substrate unit through the second wire and the first wire.
  • the term "sequentially" as used in the present invention means that the signal provided by the chip unit passes through the second wire on the transmission path and then finally reaches the substrate unit through the first wire; therefore, the chip unit can be directly disposed in the
  • the rigid connection unit may also directly connect other units first, and then indirectly connect with the rigid connection unit through the other unit.
  • the first wire may be a metal or other conductor and may be one or more layers.
  • the second wire may be a metal or other conductor and may be one or more layers.
  • the rigid connection unit may be connected to the first flexible connection unit in a one-to-one manner, that is, one of the rigid connection units is connected to a first flexible connection unit.
  • the rigid connection unit can also be connected to the first flexible connection unit in a one-to-many manner, i.e., one of the rigid connection units is coupled to at least two first flexible connection units.
  • the rigid connection unit 13 can be connected to the first flexible connection unit 12 by ACF bonding; that is, the conductive contact terminal of the rigid connection unit 13 and the conductive contact terminal of the first flexible connection unit 12.
  • the ACF is coated with hot pressing to connect the conductive contact terminals of the rigid connecting unit 13 and the conductive contact terminals of the first flexible connecting unit 12 together.
  • the first conductive contact terminal 122 and the second conductive contact terminal 123 are respectively disposed at two ends of the first conductive line 121 of the first flexible connecting unit 12.
  • the second conductive line 131 of the rigid connecting unit 13 is provided with a third conductive contact terminal 132.
  • the first conductive contact terminal 122 is for being connected to the substrate unit by ACF bonding.
  • the second conductive contact terminal 123 and the third conductive contact terminal 132 are connected by an ACF bond.
  • the first wire 121 connects the corresponding first conductive contact terminal 122 and second conductive contact terminal 123.
  • the first flexible connection unit 12 may be an FPC.
  • the first flexible connecting unit 12 may include a first flexible substrate 124, and the first conductive line 121, the first conductive contact terminal 122, and the second portion on the first flexible substrate 124.
  • the first wire may be a metal or other conductor and may be one or more layers.
  • the first wire 121 may be formed on one surface of the first flexible substrate 124 or may be formed on both surfaces of the first flexible substrate 124.
  • the first wires 121 located on different surfaces of the same layer of the first flexible substrate 124 or the first wires 121 of different surfaces of the first flexible substrate 124 may be connected by holes.
  • the rigid connecting unit 13 may include a rigid substrate 134.
  • the other end of the second conductive line 131 of the rigid connecting unit 13 may be provided with a fourth conductive contact terminal 133, the second conductive line 131, the third conductive contact terminal 132 and the fourth conductive
  • the contact terminal 133 is located on the rigid substrate 134.
  • the second wire 131 connects the corresponding third conductive contact terminal 132 and fourth conductive contact terminal 133.
  • the rigid substrate 134 may be glass, quartz or PCB or the like.
  • the second wire may be metal or other guide
  • the body can be one or more layers.
  • the second wire 131 may be formed on one surface of the rigid substrate 134 or on both surfaces of the rigid substrate 134.
  • the second wires 131 located on different surfaces of the same surface of the rigid substrate 134 or the second wires 131 on different surfaces of the rigid substrate 134 may be connected through the holes.
  • the rigid connection unit 13 can be connected to the first flexible connection unit 12 in a one-to-one manner, that is, one of the rigid connection units 13 and one first flexible connection unit 12 connection. As shown in FIG. 5, the rigid connection unit 13 can also be connected to the first flexible connection unit 12 in a one-to-many manner, that is, one of the rigid connection units 13 and at least two first flexible connections Units 12 are connected.
  • the fourth conductive contact terminal 133 can be used to be connected to the chip unit via ACF bonding.
  • the fourth conductive contact terminal 133 can also be used to connect with other devices.
  • connection by ACF bonding in the first embodiment can be replaced by "connection by metal fusion welding”.
  • the connecting device further includes a second flexible connecting unit 14.
  • the second flexible connecting unit 14 includes a fifth conductive contact terminal 142, a sixth conductive contact terminal 143, and a third wire 141 connecting the fifth conductive contact terminal 142 and the sixth conductive contact terminal 143.
  • the fifth conductive contact terminal 142 and the fourth conductive contact terminal 133 are connected by an ACF bond.
  • the sixth conductive terminal 143 can be used to be connected to the chip unit by ACF bonding.
  • the sixth conductive terminal 143 can also be used to connect with other devices.
  • the second flexible connection unit 14 may be an FPC.
  • the second flexible connecting unit 14 may include a second flexible substrate 144, and the third conductive line 141, the fifth conductive contact terminal 142, and the sixth on the second flexible substrate 144.
  • Conductive contact terminal 143 The fifth conductive contact terminal 142 and the sixth conductive contact terminal 143 are located at two ends of the third wire 141, and the third wire 141 is connected to the fifth conductive contact terminal 142 and the sixth conductive contact Terminal 143.
  • the third wire 141 may be a metal or other conductor and may be one or more layers.
  • the third wire 141 may be formed on one surface of the second flexible substrate 144 or may be formed on both surfaces of the second flexible substrate 144.
  • the third wires 141 on the different surfaces of the third layer 141 or the second flexible substrate 144 of the different layers on the same surface of the second flexible substrate 144 may be connected by holes.
  • the rigid connection unit 13 can be connected to the second soft one-to-one manner.
  • the connection units 14 are connected, that is, one of the rigid connection units 13 is connected to a second flexible connection unit 14.
  • the rigid connection unit 13 can also be connected to the second flexible connection unit 14 in a one-to-many manner, that is, one of the rigid connection units 13 and at least two second flexible connections. Units 14 are connected.
  • the technical solution of the present invention further provides a tablet device, comprising: a substrate unit, a first flexible connection unit, a rigid connection unit and a chip unit.
  • the first flexible connecting unit is connected to the substrate unit and includes a first wire, and the first wire is electrically connected to the substrate unit.
  • the rigid connection unit is connected to the first flexible connection unit and includes a second wire, and the second wire is electrically connected to the first wire.
  • the chip unit is electrically connected to the substrate unit through the second wire and the first wire in sequence.
  • the substrate unit may be connected to the first flexible connection unit by ACF bonding; the first flexible connection unit and the rigid connection unit are connected by ACF binding.
  • the chip unit may be a switch control chip or a signal readout chip; for a flat panel display (such as LCD, OLED, E-BOOK), the chip unit may be a scan driver chip, The chip may be a data driving chip; the chip unit may be a scan driving chip or a touch detecting chip.
  • connection by ACF bonding in the second embodiment can be replaced by "connection by metal fusion welding”.
  • the substrate unit 11 includes a substrate conductive contact terminal 112; the first conductive contact terminal 122 of the first flexible connecting unit 12 is respectively provided with a first conductive contact terminal 122 and a second conductive contact a second conductive contact terminal 132 and a fourth conductive contact terminal 133 are respectively disposed at two ends of the second wire 131 of the rigid connecting unit 13; the substrate conductive contact terminal 112 and the first conductive contact terminal 122 is connected by ACF bonding; the second conductive contact terminal 123 and the third conductive contact terminal 132 are connected by ACF bonding.
  • the rigid connection unit may be connected to the chip unit by ACF binding.
  • the fourth conductive contact terminal 133 of the rigid connection unit 13 is connected to the chip unit 15 by ACF bonding.
  • the fourth conductive contact terminal 133 of the rigid connection unit 13 and the chip conductive contact terminal 152 of the chip unit 15 are connected by ACF bonding.
  • the rigid connection unit 13 can be connected to the first flexible connection unit 12 in a one-to-one manner, that is, one of the rigid connection units 13 is connected to a first flexible connection unit 12.
  • the rigid connection unit 13 can also be connected to the first flexible connection unit 12 in a one-to-many manner, that is, one of the rigid connection unit 13 and at least two first flexible connection units. 12-phase connection.
  • connection by ACF bonding in the third embodiment can be replaced with "connection by metal fusion welding”.
  • the tablet device further includes a second flexible connection unit, and the rigid connection unit is further connectable to the second flexible connection unit by ACF bonding.
  • the second flexible connecting unit 14 includes a third conductive line 141 and fifth conductive contact terminals 142 and sixth conductive contact terminals 143 respectively disposed at two ends of the third conductive line 141; the rigid connection The fourth conductive contact terminal 133 of the unit 13 and the fifth conductive contact terminal 142 of the second flexible connection unit 14 are connected by ACF bonding.
  • the second flexible connection unit is an FPC.
  • the second flexible connection unit may be connected to the chip unit by ACF bonding. As shown
  • the sixth conductive contact terminal 143 of the second flexible connecting unit 14 is connected to the chip unit 15 by ACF bonding. Specifically, the sixth conductive contact terminal 143 of the second flexible connecting unit 14 and the chip conductive contact terminal 152 of the chip unit 15 are connected by ACF bonding.
  • the rigid connection unit 13 can be connected to the second flexible connection unit 14 in a one-to-one manner, that is, one of the rigid connection unit 13 and one second flexible connection unit 14 connection.
  • the rigid connection unit 13 can also be connected to the second flexible connection unit 14 in a one-to-many manner, that is, one of the rigid connection units 13 and at least two second flexible connections. Units 14 are connected.
  • connection by ACF bonding in the fourth embodiment can be replaced with "connection by metal fusion welding”.
  • the tablet device further includes a PCB 16; the second flexible connection unit 14 is connected to the PCB 16; and the PCB 16 is connected to the chip unit 15 by ACF bonding.
  • the PCB 16 includes a fourth wire 161 and a seventh conductive contact terminal 162 and an eighth conductive contact terminal 163 respectively disposed at two ends of the fourth wire; the second flexible connecting unit 14
  • the sixth conductive contact terminal 143 is connected to the seventh conductive contact terminal 162 of the PCB by ACF bonding;
  • the eighth conductive contact terminal 163 of the PCB and the chip conductive contact terminal 152 of the chip unit 15 are tied by ACF Phased connection.
  • the second flexible connecting unit 14 and the PCB 16 can also be connected by other means such as a connector.
  • a circuit unit may be disposed on the PCB, and the circuit unit includes a peripheral logic control and image processing system.
  • connection by ACF bonding in the fifth embodiment can be replaced with "connection by metal fusion welding”.
  • the tablet device further includes a PCB 16; the PCB 16 is connected to the rigid connection unit 13 and electrically connected to the chip unit 15 through the second wire 131.
  • the tablet device further includes a PCB 16; the PCB 16 is connected to the second flexible connecting unit 14, and is electrically connected to the chip unit 15 through the third wire 141. .
  • the substrate unit may include a TFT array substrate.
  • the TFT array substrate may be a TFT array substrate in a tablet device.
  • a liquid crystal display (LCD) TFT array substrate for example, a liquid crystal display (LCD) TFT array substrate, an electronic paper TFT array substrate, an organic light emitting diode display (AMOLED) TFT array substrate, an (X-ray) flat panel image sensor TFT array substrate.
  • the TFT array substrate includes a substrate and a TFT array layer on the substrate.
  • the TFT array layer may include a plurality of scan lines and a plurality of data lines crossing each other, and a region enclosed between adjacent scan lines and data lines is a pixel area, and pixel electrodes, scan lines and data lines are disposed in the pixel area.
  • a TFT switch is disposed at the intersection, and the pixel electrode is coupled to the scan line and the data line through the TFT switch, that is, the gate of the TFT is electrically connected to the corresponding scan line, and the source/drain of the TFT is electrically connected to the corresponding data line, and the TFT The drain/source are electrically connected to the corresponding pixel electrode.
  • the AMOLED an organic light emitting diode is disposed on the pixel electrode.
  • a photosensor is disposed on the pixel electrode, which is generally a photodiode.
  • the substrate unit may be a touch screen.
  • the touch screen can be a capacitive touch screen or a resistive touch screen or the like.
  • the touch screen includes a substrate and a touch structure layer on the substrate. Taking a capacitive touch screen as an example, the touch structure layer includes a plurality of scanning lines and a plurality of sensing lines crossing each other, and an insulating layer is disposed between the scanning lines and the sensing lines at the intersection.
  • the technical solution of the present invention further provides a flat panel image sensor, comprising the flat panel device including the TFT array substrate in the above embodiment, wherein the pixel array of the TFT array substrate is provided with a photosensor.
  • the present invention further provides an AMOLED, comprising the flat panel device including the TFT array substrate in the above embodiment, wherein the TFT array substrate is provided with an organic light emitting diode in a pixel region.
  • the technical solution of the present invention further provides a liquid crystal display comprising the flat panel device, the color filter substrate and the liquid crystal layer comprising the TFT array substrate in the above embodiment.
  • a pixel electrode is disposed in a pixel region of the TFT array substrate; the color filter substrate and the TFT array substrate are disposed opposite to each other, and the liquid crystal layer is filled between the color filter substrate and the TFT array substrate.
  • the technical solution of the present invention further provides an electronic paper display, comprising the flat panel device, the upper substrate and the microcapsule layer comprising the TFT array substrate in the above embodiment.
  • a pixel electrode is disposed in a pixel region of the TFT array substrate; the upper substrate and the TFT array substrate are oppositely disposed, and the microcapsule layer is filled between the upper substrate and the TFT array substrate.
  • the technical solution of the present invention further provides a touch device, which comprises the tablet device in which the substrate unit is a touch screen in the above embodiment.

Abstract

提供一种连接装置、平板装置、图像传感器、显示器及触摸设备。该连接装置用于连接基板单元（11）和芯片单元（15），其包括第一软性连接单元（12）和与该第一软性连接单元相连接的硬性连接单元（13），该第一软性连接单元包括用于与该基板单元电连接的第一导线（121），该硬性连接单元包括用于与该第一导线电连接的第二导线（131），该芯片单元与该第二导线电连接。由于该芯片单元依次通过该硬性连接单元和该第一软性连接单元与该基板单元电连接，因此，即使该第一软性连接单元在与该基板单元分离时被损坏，该芯片单元以及该硬性连接单元也不会损坏，只要将该第一软性连接单元与该硬性连接单元分离，该芯片单元就可以重复利用。

Description

连接装置、 平板装置、 图像传感器、 显示器及触摸设备
本申请要求于 2012 年 4 月 13 日提交中国专利局、 申请号为 201210109807.X, 发明名称为 "连接装置、 平板装置、 图像传感器、 显示器及 触摸设备"的中国专利申请的优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子技术领域， 尤其涉及一种连接装置、 平板装置、 图像传感 器、 显示器及触摸设备。
背景技术
X光平板探测器是一种大面积的平面 X光成像设备。透过被照射物体的 X 光通过 X光平板探测器转化为电子信号， 继而形成与被照射物体内部结构直 接相关的数字化灰阶图像。 X光平板探测器实现了物体的无损内部成像， 是实 现无损检测的最佳方法之一。在医疗成像， 工业无损探测等领域都得到了广泛 的应用和长足的发展。
如图 1所示， X光平板探测器包括 X光荧光层 1、 平板传感器 2、 图像采 集芯片 3, 以及外围逻辑控制和图像处理系统 4。 其中， 图像采集芯片 3包括 开关控制芯片 31和信号读出芯片 32。图 1所示的 X光平板探测器使用的平板 传感器 2为间接型平板传感器，间接型平板传感器只对可见光及其附近波长的 光有吸收， 所以需要利用 X光荧光层 1将 X光转化为绿光或蓝光等可见光。 另外还有一种 X光平板探测器， 其使用的平板传感器 2是直接型平板传感器， 可以直接吸收 X光， 所以在 X光平板探测器中可以不再需要 X光荧光层 1。
平板传感器 2包括一个大面积的像素阵列和透明基板，该像素阵列是整个 X光平板探测器中的核心部件之一，一般制作于该透明基板（例如：玻璃基板、 石英基板）上。 该像素阵列包括多条沿 X轴方向延伸的控制线 22和多条沿 Y 轴方向延伸的读取线 23, 其中 X轴和 Y轴基本垂直。 两 ^相邻的控制线 22 和两根相邻的读取线 23之间所围成的区域为像素区域， 在该像素区域中设置 有像素单元。 每个像素单元 21包括光敏器件 211 (例如光电二极管）， 和至少 一个开关器件 212 (例如薄膜晶体管， Thin Film Transistor, TFT )。 开关器件 212的开关状态由控制线 22上的控制信号来控制； 当开关器件 212打开时， 与其位于同一像素区域的像素单元 21中的信号可以被读取线 23读取；当开关 器件 212关闭时， 与其位于同一像素区域的像素单元 21中的信号不能被读取 线 23读取。 具体的以一个薄膜晶体管作为开关器件 212为例， 该薄膜晶体管 设置于一根控制线 22和一根读取线 23的交叉处，与该薄膜晶体管位于同一像 素区域的像素单元 21通过该薄膜晶体管与该控制线 22和该读取线 23耦接。 所述耦接的具体意义即该薄膜晶体管的栅极与该控制线 22电连接； 该薄膜晶 体管的源极 /漏极与该读取线 23电连接；该薄膜晶体管的漏极 /源极与该像素单 元 21电连接。 像素单元 21的尺寸和数量可以反映图像的分辨率和面积。
透过被检测物的 X光通过 X光荧光层 1可以被转换为可见光， 该可见光 投射到 （或透过被检测物的 X光直接投射到 )平板传感器 2的光敏器件 211 上，光敏器件 211转化出相应比例的电荷且暂存在平板传感器 2的各个像素单 元 21元里。 当一根控制线 22被施加控制信号使得与栅极与该控制线 22电连 接的开关器件 TFT212打开，与开关器件 TFT212的源极 /漏极电连接的读取线 23 可以读出光敏器件 211 中暂存的电荷信号， 然后该电荷信号被进行模数转 换等相应处理。
外围逻辑控制和图像处理系统 4控制着图像采集芯片 3有序工作，从而实 现每一行像素单元 21中开关器件 TFT212的开与关， 以及各像素单元 21中光 敏器件 211里电荷信号的读出和处理。开关控制芯片 31通过控制线 22按顺序 一行一行开启开关器件 TFT212。 开关器件 TFT212开启的同时， 信号读出芯 片 32通过读取线 23读出像素单元 21中暂存的电荷信号并进行模数转换， 并 将处理过的数字信号传输给外围逻辑控制和图像处理系统 4。 如此一行一行地 进行图像采集，直到整个平板传感器 2的像素单元 21中的电荷信号都被读出， 完成整个图像的读取和处理。
结合图 2所示， 在现有技术中， 通过芯片在薄膜上 （Chip On Film, COF) 绑定工艺将图像采集芯片 3 封装在一个软性印刷线路板 （Flexible Printed Circuit board, FPC ) 5上， 该封装在一起的图像采集芯片 3和 FPC5形成一个 COF模块 6。 然后， 通过薄膜在玻璃上 （Film On Glass, FOG)绑定工艺将 COF 模块 6绑定到平板传感器 2的导电触点 24上， 实现平板传感器 2和图像采集 芯片 3的电性连接和导通。 FOG绑定时， 在平板传感器 2的导电触点 24上涂 覆异方性导电胶膜 ( Anisotropic Conductive Film, ACF ) 7, 然后通过热压方 式将 COF模块 6的 FPC5压合到平板传感器 2的导电触点 24上。 ACF7能够 实现垂直方向导电而水平方向不导电， 所以 COF模块 6与导电触点 24导通， 但与相邻的导电触点保持绝缘。 当然， 现有技术中， 也可以通过金属熔融焊接 技术将 COF模块 6焊接到平板传感器 2的导电触点 24上， 实现平板传感器 2 和图像采集芯片 3的电性连接和导通。
在使用或测试过程中， 若发现平板传感器 2有性能不达标等问题需要将 COF模块 6与平板传感器 2分离时， ACF7的粘贴和热压过程或金属熔融焊接 过程，以及 FPC5的软性特点会使得 COF模块 6中的 FPC5在分离过程中被损 坏， 使得整个 COF模块 6不能正常使用； 然而， COF模块中的图像采集芯片 3并没有损坏， 但由于 FPC5的损坏导致图像采集芯片 3不能重复利用， 造成 了极大的浪费。
事实上， 不仅是对于 X光平板探测器会出现上述图像采集芯片 3芯片不 能重复利用， 造成浪费； 其他装置（如触摸屏、 平板显示器等）的芯片单元与 软性连接装置封装成 COF模块后与该装置的基板单元通过 ACF绑定或金属熔 融焊接相连接， 也会存在该 COF模块中的软性连接装置在剥离过程中损坏导 致该芯片不能重复利用， 造成极大浪费的问题。
发明内容
本发明技术方案解决的技术问题是：现有技术的芯片单元与软性连接装置 封装成 COF模块后与基板单元通过 ACF绑定或金属熔融焊接相连接，该软性 连接装置与基板单元分离时容易产生损坏，进而造成与该软性连接装置绑定在 一起的芯片无法重复利用， 造成极大的浪费。
为解决上述技术问题， 本发明技术方案提供一种连接装置， 用于连接基板 单元和芯片单元， 所述连接装置包括： 第一软性连接单元， 包括用于与所述基 板单元电连接的第一导线； 硬性连接单元， 与所述第一软性连接单元相连接， 包括用于与所述第一导线电连接的第二导线；所述芯片单元与所述第二导线电 连接。
可选的， 所述硬性连接单元与所述第一软性连接单元通过 ACF绑定或金 属熔融焊接相连接。
可选的，所述第一软性连接单元的第一导线两端分别设置有第一导电接触 端子和第二导电接触端子；所述硬性连接单元的第二导线一端设置有第三导电 接触端子； 所述第一导电接触端子用于与所述基板单元通过 ACF绑定或金属 熔融焊接相连接； 所述第二导电接触端子与所述第三导电接触端子通过 ACF 绑定或金属熔融焊接相连接。
可选的， 所述第一软性连接单元为 FPC。
可选的， 所述硬性连接单元还包括硬性基板， 所述硬性连接单元的第二导 线另一端设置有第四导电接触端子， 所述第二导线、所述第三导电接触端子和 所述第四导电接触端子位于所述硬性基板上。
可选的， 所述第四导电接触端子用于与所述芯片单元通过 ACF绑定或金 属熔融焊接相连接。
可选的， 所述连接装置还包括第二软性连接单元， 所述第二软性连接单元 包括第五导电接触端子、第六导电接触端子以及连接二者的第三导线； 所述第 四导电接触端子与所述第五导电接触端子通过 ACF绑定或金属熔融焊接相连 接； 所述第六导电端子用于与所述芯片单元通过 ACF绑定或金属熔融焊接相 连接。
为解决上述技术问题， 本发明技术方案还提供一种平板装置， 包括： 基板 单元、 第一软性连接单元、 硬性连接单元和芯片单元， 其中， 所述第一软性连 接单元， 与所述基板单元相连接， 包括第一导线， 所述第一导线与所述基板单 元电连接； 所述硬性连接单元， 与所述第一软性连接单元相连接， 包括第二导 线， 所述第二导线与所述第一导线电连接； 所述芯片单元， 依次通过所述第二 导线和所述第一导线与所述基板单元电连接。
可选的， 所述基板单元与所述第一软性连接单元通过 ACF绑定或金属熔 融焊接相连接； 所述第一软性连接单元与所述硬性连接单元通过 ACF绑定或 金属熔融焊接相连接。
可选的， 所述硬性连接单元与所述芯片单元通过 ACF绑定或金属熔融焊 接相连接。
可选的， 所述平板装置还包括第二软性连接单元， 所述硬性连接单元与所 述第二软性连接单元通过 ACF绑定或金属熔融焊接相连接。
可选的， 所述第二软性连接单元与所述芯片单元通过 ACF绑定或金属熔 融焊接相连接。
可选的， 所述平板装置还包括印刷电路板（Printed Circuit Board, PCB ); 所述第二软性连接单元与所述 PCB相连接； 所述 PCB 与所述芯片单元通过 ACF绑定或金属熔融焊接相连接。
可选的， 所述基板单元包括基板导电接触端子； 所述第一软性连接单元的 所述第一导线两端分别设置有第一导电接触端子和第二导电接触端子；所述硬 性连接单元的所述第二导线两端分别设置有第三导电接触端子和第四导电接 触端子； 所述基板导电接触端子与所述第一导电接触端子通过 ACF绑定或金 属熔融焊接相连接;所述第二导电接触端子与所述第三导电接触端子通过 ACF 绑定或金属熔融焊接相连接。
可选的，所述硬性连接单元的第四导电接触端子与所述芯片单元通过 ACF 绑定或金属熔融焊接相连接。
可选的，还包括第二软性连接单元， 所述第二软性连接单元包括第三导线 以及分别设置于所述第三导线两端的第五导电接触端子和第六导电接触端子； 所述硬性连接单元的所述第四导电接触端子与所述第二软性连接单元的所述 第五导电接触端子通过 ACF绑定或金属熔融焊接相连接。
可选的，所述第二软性连接单元的所述第六导电接触端子与所述芯片单元 通过 ACF绑定或金属熔融焊接相连接。
可选的， 所述平板装置还包括 PCB; 所述 PCB包括第四导线以及分别设 置于所述第四导线两端的第七导电接触端子和第八导电接触端子；所述第二软 性连接单元的所述第六导电接触端子与所述 PCB相连接； 所述 PCB与所述芯 片单元通过 ACF绑定或金属熔融焊接相连接。
可选的， 所述第二软性连接单元为 FPC。
可选的， 所述基板单元包括 TFT阵列基板。
可选的， 所述基板单元为触摸屏。
本发明技术方案还提供一种包括所述的平板装置的平板图像传感器，所述 基板单元包括 TFT阵列基板， 所述 TFT阵列基板的像素区域中设置有光敏传 感器。
本发明技术方案还提供一种包括所述的平板装置的有机发光二极管显示 器， 所述基板单元包括 TFT阵列基板， 所述 TFT阵列基板的像素区域中设置 有有机发光二极管。
本发明技术方案还提供一种液晶显示器， 包括： 彩膜基板、 液晶层， 以及 所述的平板装置； 所述基板单元包括 TFT阵列基板， 所述 TFT阵列基板的像 素区域中设置有像素电极； 所述彩膜基板和所述 TFT阵列基板相对设置， 所 述液晶层填充于二者之间。
本发明技术方案还提供一种电子纸显示器， 包括： 上基板、 微胶嚢层， 以 及所述的平板装置； 所述基板单元包括 TFT阵列基板， 所述 TFT阵列基板的 像素区域中设置有像素电极； 所述上基板和所述 TFT阵列基板相对设置， 所 述微胶嚢层填充于二者之间。
本发明技术方案还提供一种包括所述的平板装置的触摸设备，所述基板单 元为触摸屏。
与现有技术相比，本发明技术方案中的芯片单元依次通过硬性连接单元和 柔性连接单元与基板单元电连接；该芯片单元没有与该和基板单元直接相连柔 性连接单元直接封装在一起，芯片单元与柔性连接单元之间还设置有直接与该 柔性连接单元相连的硬性连接单元； 因此， 即使该柔性连接单元与该基板单元 分离时被损坏， 该芯片单元以及该硬性连接单元也不会因此而损坏， 只要将该 柔性连接单元与该硬性连接单元分离， 该芯片单元就可以重复利用。
附图说明
图 1为现有的一种 X光平板探测器的立体结构示意图；
图 2为图 1沿 A-A'线的剖面示意图；
图 3为本发明实施例一的连接装置的结构示意图；
图 4和图 5为本发明平板装置的一组立体结构示意图；
图 6为本发明实施例二的连接装置的结构示意图；
图 7和图 8为本发明平板装置的另一组立体结构示意图；
图 9和图 10为本发明实施例三的平板装置的结构示意图；
图 11和图 12为本发明实施例四的平板装置的结构示意图；
图 13为本发明实施例五的平板装置的立体结构示意图；
图 14为图 13沿 B-B'线的剖面示意图; 图 15和图 16为本发明实施例六的平板装置的立体结构示意图； 图 17和图 18为本发明实施例七的平板装置的立体结构示意图。
具体实施方式
下面结合附图对本发明的具体实施方式做详细的说明。在下列段落中参照 附图以举例方式更具体地描述本发明。根据下列说明， 本发明的优点和特征将 更清楚。
需要说明的是， ACF绑定技术是本领域的技术人员所公知的技术， 本发 明申请文件中不做过多陈述， 筒单说来 ACF绑定技术的核心就是在两个单元 的导电触点之间设置异方性导电胶膜 ( anisotropic conductive film, ACF )后通 过热压工艺使得该两个单元的导电触电在垂直方向导通而水平方向不导通。因 此， 在本发明申请文件中将这两个单元的这种连接方式称之为 "通过 ACF绑 定相连接" 。 例如， 芯片与玻璃基板通过 ACF绑定相连接， 就是公知的 COG 绑定； 芯片与 FPC通过 ACF绑定相连接，就是公知的 COF绑定； 芯片与 PCB 基板通过 ACF绑定相连接，就是公知的 COB绑定； FPC与玻璃基板通过 ACF 绑定相连接， 就是公知的 FOG绑定； FPC与 FPC通过 ACF绑定相连接， 就 是公知的 FOF绑定； FPC与 PCB基板通过 ACF绑定相连接，就是公知的 FOB 绑定。 另外， 金属熔融焊接技术也是本领域的公知技术， 本发明申请文件中不 做过多陈述，筒单说来金属熔融焊接技术的核心就是两个单元的导电触点被压 合的同时被施加高温或超声波，导致两个单元的导电触点加热熔化且互相熔合 在一起形成合金， 实现机构连接的同时实现电连接。
本发明技术方案提供一种连接装置， 用于连接基板单元和芯片单元。所述 连接装置包括： 第一软性连接单元， 包括用于与所述基板单元电连接的第一导 线； 硬性连接单元， 与所述第一软性连接单元相连接， 包括用于与所述第一导 线电连接的第二导线； 所述芯片单元与所述第二导线电连接。 所述芯片单元可 以依次通过所述第二导线和所述第一导线向所述基板单元传输信号。本发明所 说的 "依次 "指的是芯片单元所提供的信号在传输路径上先经过所述第二导线、 然后经过所述第一导线最终到达基板单元；因此芯片单元可以直接设置于所述 硬性连接单元，也可以先直接连接其他单元， 然后通过该其他单元与所述硬性 连接单元间接连接。 所述第一导线可以是金属或其他导体， 可以是一层或多层。
所述第二导线可以是金属或其他导体， 可以是一层或多层。
所述硬性连接单元可以一对一的方式与所述第一软性连接单元相连接， 即，一个所述硬性连接单元与一个第一软性连接单元相连接。 所述硬性连接单 元还可以一对多的方式与所述第一软性连接单元相连接， 即，一个所述硬性连 接单元与至少两个第一软性连接单元相连接。
实施例一
如图 3所示，硬性连接单元 13可以与所述第一软性连接单元 12通过 ACF 绑定相连接； 即在硬性连接单元 13 的导电接触端子和第一软性连接单元 12 的导电接触端子之间涂覆 ACF后热压，使硬性连接单元 13的导电接触端子和 第一软性连接单元 12的导电接触端子连接在一起。
具体的， 第一软性连接单元 12的第一导线 121两端分别设置有第一导电 接触端子 122和第二导电接触端子 123。 硬性连接单元 13的第二导线 131— 端设置有第三导电接触端子 132。 第一导电接触端子 122用于与所述基板单元 通过 ACF绑定相连接。 第二导电接触端子 123与第三导电接触端子 132通过 ACF绑定相连接。 第一导线 121连接相应的第一导电接触端子 122和第二导 电接触端子 123。
所述第一软性连接单元 12可以为 FPC。所述第一软性连接单元 12可以包 括第一软性基底 124,以及位于所述第一软性基底上 124的所述第一导线 121、 所述第一导电接触端子 122和所述第二导电接触端子 123。 所述第一导线可以 是金属或其他导体， 可以是一层或多层。 第一导线 121可以制作在第一软性基 底 124的一个表面，也可以制作在第一软性基底 124的两个表面。位于第一软 性基底 124同一表面的不同层的第一导线 121或第一软性基底 124不同表面的 第一导线 121可以通过孔连接起来。
所述硬性连接单元 13可以包括硬性基板 134, 硬性连接单元 13的第二导 线 131另一端可以设置有第四导电接触端子 133, 所述第二导线 131、 第三导 电接触端子 132和第四导电接触端子 133位于所述硬性基板 134上。所述第二 导线 131连接相应的第三导电接触端子 132和第四导电接触端子 133。 所述硬 性基板 134可以为玻璃、 石英或 PCB等。 所述第二导线可以是金属或其他导 体， 可以是一层或多层。 第二导线 131可以制作在硬性基板 134的一个表面， 也可以在硬性基板 134的两个表面。位于硬性基板 134同一表面的不同层的第 二导线 131或硬性基板 134不同表面的第二导线 131可以通过孔连接起来。
如图 4所示， 所述硬性连接单元 13可以一对一的方式与所述第一软性连 接单元 12相连接， 即， 一个所述硬性连接单元 13与一个第一软性连接单元 12相连接。 如图 5所示， 所述硬性连接单元 13还可以一对多的方式与所述第 一软性连接单元 12相连接， 即，一个所述硬性连接单元 13与至少两个第一软 性连接单元 12相连接。
所述第四导电接触端子 133可以用于与芯片单元通过 ACF绑定相连接。 所述第四导电接触端子 133也可以用于与其他装置相连接。
作为另一种优选的实施方式， 实施例一中 "通过 ACF绑定相连接" 可以 替换为 "通过金属熔融焊接相连接" 。
实施例二
如图 6所示， 所述连接装置还包括第二软性连接单元 14。 所述第二软性 连接单元 14包括第五导电接触端子 142、第六导电接触端子 143, 以及连接所 述第五导电接触端子 142和所述第六导电接触端子 143的第三导线 141。 所述 第五导电接触端子 142与所述第四导电接触端子 133通过 ACF绑定相连接。
所述第六导电端子 143可以用于与所述芯片单元通过 ACF绑定相连接。 所述第六导电端子 143也可以用于与其他装置相连接。
所述第二软性连接单元 14可以为 FPC。所述第二软性连接单元 14可以包 括第二软性基底 144,以及位于所述第二软性基底 144上的所述第三导线 141、 所述第五导电接触端子 142和所述第六导电接触端子 143。 所述第五导电接触 端子 142和所述第六导电接触端子 143位于所述第三导线 141的两端，所述第 三导线 141连接所述第五导电接触端子 142和所述第六导电接触端子 143。 所 述第三导线 141 可以是金属或其他导体， 可以是一层或多层。 所述第三导线 141可以制作在第二软性基底 144的一个表面，也可以制作在第二软性基底 144 的两个表面。位于第二软性基底 144同一表面的不同层的第三导线 141或第二 软性基底 144不同表面的第三导线 141可以通过孔连接起来。
如图 7所示， 所述硬性连接单元 13可以一对一的方式与所述第二软性连 接单元 14相连接， 即， 一个所述硬性连接单元 13与一个第二软性连接单元 14相连接。 如图 8所示， 所述硬性连接单元 13还可以一对多的方式与所述第 二软性连接单元 14相连接， 即，一个所述硬性连接单元 13与至少两个第二软 性连接单元 14相连接。
本发明技术方案还提供一种平板装置， 所述平板装置包括： 基板单元、 第 一软性连接单元、硬性连接单元和芯片单元。 所述第一软性连接单元， 与所述 基板单元相连接， 包括第一导线， 所述第一导线与所述基板单元电连接。 所述 硬性连接单元， 与所述第一软性连接单元相连接， 包括第二导线， 所述第二导 线与所述第一导线电连接。所述芯片单元依次通过所述第二导线和所述第一导 线与所述基板单元电连接。
所述基板单元可以与所述第一软性连接单元通过 ACF绑定相连接； 所述 第一软性连接单元与所述硬性连接单元通过 ACF绑定相连接。 对于 X光平板 探测器， 所述芯片单元可以为开关控制芯片， 也可以为信号读出芯片； 对于平 板显示器（如 LCD、 OLED、 E-BOOK ) , 所述芯片单元可以为扫描驱动芯片， 也可以为数据驱动芯片； 所述芯片单元可以为扫描驱动芯片， 也可以为触摸检 测芯片。
作为另一种优选的实施方式， 实施例二中 "通过 ACF绑定相连接" 可以 替换为 "通过金属熔融焊接相连接" 。
实施例三
如图 9所示， 所述基板单元 11 包括基板导电接触端子 112; 所述第一软 性连接单元 12的所述第一导线 121两端分别设置有第一导电接触端子 122和 第二导电接触端子 123; 所述硬性连接单元 13的所述第二导线 131两端分别 设置有第三导电接触端子 132和第四导电接触端子 133; 所述基板导电接触端 子 112与所述第一导电接触端子 122通过 ACF绑定相连接； 所述第二导电接 触端子 123与所述第三导电接触端子 132通过 ACF绑定相连接。
所述硬性连接单元可以与所述芯片单元通过 ACF绑定相连接。如图 10所 示， 所述硬性连接单元 13的第四导电接触端子 133与所述芯片单元 15通过 ACF绑定相连接。 具体的， 所述硬性连接单元 13的第四导电接触端子 133与 所述芯片单元 15的芯片导电接触端子 152通过 ACF绑定相连接。 继续参考图 4, 所述硬性连接单元 13可以一对一的方式与所述第一软性 连接单元 12相连接， 即，一个所述硬性连接单元 13与一个第一软性连接单元 12相连接。 继续参考图 5, 所述硬性连接单元 13还可以一对多的方式与所述 第一软性连接单元 12相连接， 即，一个所述硬性连接单元 13与至少两个第一 软性连接单元 12相连接。
作为另一种优选的实施方式， 实施例三中 "通过 ACF绑定相连接" 可以 替换为 "通过金属熔融焊接相连接" 。
实施例四
所述平板装置还包括第二软性连接单元，所述硬性连接单元还可以与所述 第二软性连接单元通过 ACF绑定相连接。 如图 11所示， 所述第二软性连接单 元 14包括第三导线 141以及分别设置于所述第三导线 141两端的第五导电接 触端子 142和第六导电接触端子 143; 所述硬性连接单元 13的所述第四导电 接触端子 133与所述第二软性连接单元 14的所述第五导电接触端子 142通过 ACF绑定相连接。 可选择的， 所述第二软性连接单元为 FPC。
所述第二软性连接单元可以与所述芯片单元通过 ACF绑定相连接。 如图
12所示， 所述第二软性连接单元 14的所述第六导电接触端子 143与所述芯片 单元 15通过 ACF绑定相连接。 具体的， 所述第二软性连接单元 14的所述第 六导电接触端子 143与所述芯片单元 15的芯片导电接触端子 152通过 ACF绑 定相连接。
如图 7所示， 所述硬性连接单元 13可以一对一的方式与所述第二软性连 接单元 14相连接， 即， 一个所述硬性连接单元 13与一个第二软性连接单元 14相连接。 如图 8所示， 所述硬性连接单元 13还可以一对多的方式与所述第 二软性连接单元 14相连接， 即，一个所述硬性连接单元 13与至少两个第二软 性连接单元 14相连接。
作为另一种优选的实施方式， 实施例四中 "通过 ACF绑定相连接" 可以 替换为 "通过金属熔融焊接相连接" 。
实施例五
如图 13所示， 所述平板装置还包括 PCB16; 所述第二软性连接单元 14 与所述 PCB16相连接；所述 PCB16与所述芯片单元 15通过 ACF绑定相连接。 如图 14所示，所述 PCB16包括第四导线 161以及分别设置于所述第四导线两 端的第七导电接触端子 162和第八导电接触端子 163; 所述第二软性连接单元 14的所述第六导电接触端子 143与所述 PCB的第七导电接触端子 162通过 ACF绑定相连接；所述 PCB的第八导电接触端子 163与所述芯片单元 15的芯 片导电接触端子 152通过 ACF绑定相连接。 可以理解的是， 所述第二软性连 接单元 14与所述 PCB16还可以通过接插件等其他方式进行连接。
所述 PCB上可以设置有电路单元， 所述电路单元包括外围逻辑控制和图 像处理系统。
作为另一种优选的实施方式， 实施例五中 "通过 ACF绑定相连接" 可以 替换为 "通过金属熔融焊接相连接" 。
实施例六
如图 15和图 16所示，在实施例三的基础上，所述平板装置还包括 PCB16; 所述 PCB16与硬性连接单元 13相连接， 通过第二导线 131与芯片单元 15电 连接。
实施例七
如图 17和图 18所示，在实施例四的基础上，所述平板装置还包括 PCB16; 所述 PCB16与第二软性连接单元 14相连接， 通过第三导线 141与芯片单元 15电连接。
在一个实施例中， 所述基板单元可以包括 TFT阵列基板。 TFT阵列基板 可以为平板设备中的 TFT阵列基板。 例如液晶显示器（Liquid Crystal Display, LCD ) 的 TFT 阵列基板， 电子纸的 TFT 阵列基板， 有机发光二极管显示器 ( Active Matrix/Organic Light Emitting Diode, AMOLED ) 的 TFT阵列基板， ( X射线 )平板图像传感器的 TFT阵列基板。 TFT阵列基板包括基板和位于 所述基板上的 TFT阵列层。 所述 TFT阵列层可以包括相互交叉的多条扫描线 和多条数据线，相邻扫描线和数据线之间围成的区域为像素区域，像素区域内 设置有像素电极， 扫描线和数据线交叉处设置有 TFT开关， 像素电极通过该 TFT开关与该扫描线和数据线耦接， 即 TFT的栅极与相应扫描线电连接， TFT 的源极 /漏极与相应数据线电连接， TFT漏极 /源极与相应的像素电极电连接。 对于 AMOLED而言像素电极上设置有机发光二极管。对于 X射线平板图像传 感器而言像素电极上设置光敏传感器， 一般为光敏二极管。
在另一实施例中， 所述基板单元可以为触摸屏。所述触摸屏可以为电容式 触摸屏或电阻式触摸屏等。 所述触摸屏包括基板和位于基板上的触摸结构层。 以电容式触摸屏为例， 其触摸结构层包括相互交叉的多条扫描线和多条感应 线， 在交叉处扫描线和感应线之间设置有绝缘层。
本发明技术方案还提供一种平板图像传感器，包括上述实施例中包含 TFT 阵列基板的平板装置， 所述 TFT阵列基板的像素区域中设置有光敏传感器。
本发明技术方案还提供一种 AMOLED, 包括上述实施例中包含 TFT阵列 基板的平板装置， 所述 TFT阵列基板的像素区域中设置有有机发光二极管。
本发明技术方案还提供一种液晶显示器， 包括上述实施例中包含 TFT阵 列基板的平板装置、 彩膜基板和液晶层。 所述 TFT阵列基板的像素区域中设 置有像素电极； 所述彩膜基板和所述 TFT阵列基板相对设置， 所述液晶层填 充于所述彩膜基板和所述 TFT阵列基板之间。
本发明技术方案还提供一种电子纸显示器， 包括上述实施例中包含 TFT 阵列基板的平板装置、 上基板、 微胶嚢层。 所述 TFT阵列基板的像素区域中 设置有像素电极； 所述上基板和所述 TFT阵列基板相对设置， 所述微胶嚢层 填充于所述上基板和所述 TFT阵列基板之间。
本发明技术方案还提供一种触摸设备，包括上述实施例中基板单元为触摸 屏的平板装置。
虽然本发明已以较佳实施例披露如上，但本发明并非限定于此。任何本领 域技术人员， 在不脱离本发明的精神和范围内， 均可作各种更动与修改， 因此 本发明的保护范围应当以权利要求所限定范围。

Claims

权 利 要 求
1. 一种连接装置， 用于连接基板单元和芯片单元， 其特征在于， 包括： 第一软性连接单元， 包括用于与所述基板单元电连接的第一导线；
硬性连接单元， 与所述第一软性连接单元相连接， 包括用于与所述第一导线电 连接的第二导线；
所述芯片单元与所述第二导线电连接。
2. 如权利要求 1所述的连接装置， 其特征在于， 所述硬性连接单元与所述第 一软性连接单元通过 ACF绑定或金属熔融焊接相连接。
3. 如权利要求 1所述的连接装置， 其特征在于， 所述第一软性连接单元的第 一导线两端分别设置有第一导电接触端子和第二导电接触端子；所述硬性连接 单元的第二导线一端设置有第三导电接触端子；所述第一导电接触端子用于与 所述基板单元通过 ACF绑定或金属熔融焊接相连接； 所述第二导电接触端子 与所述第三导电接触端子通过 ACF绑定或金属熔融焊接相连接。
4. 如权利要求 3 所述的连接装置， 其特征在于， 所述第一软性连接单元为 FPC。
5. 如权利要求 3所述的连接装置， 其特征在于， 所述硬性连接单元还包括硬 性基板， 所述硬性连接单元的第二导线另一端设置有第四导电接触端子， 所述 第二导线、所述第三导电接触端子和所述第四导电接触端子位于所述硬性基板 上。
6. 如权利要求 5所述的连接装置， 其特征在于， 所述第四导电接触端子用于 与所述芯片单元通过 ACF绑定或金属熔融焊接相连接。
7. 如权利要求 5所述的连接装置， 其特征在于， 还包括第二软性连接单元， 所述第二软性连接单元包括第五导电接触端子、第六导电接触端子以及连接二 者的第三导线； 所述第四导电接触端子与所述第五导电接触端子通过 ACF绑 定或金属熔融焊接相连接； 所述第六导电端子用于与所述芯片单元通过 ACF 绑定或金属熔融焊接相连接。
8. 一种平板装置， 其特征在于， 包括： 基板单元、 第一软性连接单元、 硬性 连接单元和芯片单元， 其中，
所述第一软性连接单元， 与所述基板单元相连接， 包括第一导线， 所述第一导 线与所述基板单元电连接；
所述硬性连接单元， 与所述第一软性连接单元相连接， 包括第二导线， 所述第 二导线与所述第一导线电连接；
所述芯片单元， 依次通过所述第二导线和所述第一导线与所述基板单元电连 接。
9. 如权利要求 8所述的平板装置， 其特征在于， 所述基板单元与所述第一软 性连接单元通过 ACF绑定或金属熔融焊接相连接； 所述第一软性连接单元与 所述硬性连接单元通过 ACF绑定或金属熔融焊接相连接。
10.如权利要求 9所述的平板装置， 其特征在于， 所述硬性连接单元与所述芯 片单元通过 ACF绑定或金属熔融焊接相连接。
11.如权利要求 9所述的平板装置， 其特征在于， 还包括第二软性连接单元， 所述硬性连接单元与所述第二软性连接单元通过 ACF绑定或金属熔融焊接相 连接。
12.如权利要求 11所述的平板装置， 其特征在于， 所述第二软性连接单元与所 述芯片单元通过 ACF绑定或金属熔融焊接相连接。
13.如权利要求 11所述的平板装置， 其特征在于， 还包括 PCB; 所述第二软性 连接单元与所述 PCB相连接； 所述 PCB与所述芯片单元通过 ACF绑定或金 属熔融焊接相连接。
14.如权利要求 8所述的平板装置， 其特征在于， 所述基板单元包括基板导电 接触端子；所述第一软性连接单元的所述第一导线两端分别设置有第一导电接 触端子和第二导电接触端子；所述硬性连接单元的所述第二导线两端分别设置 有第三导电接触端子和第四导电接触端子；所述基板导电接触端子与所述第一 导电接触端子通过 ACF绑定或金属熔融焊接相连接； 所述第二导电接触端子 与所述第三导电接触端子通过 ACF绑定或金属熔融焊接相连接。
15.如权利要求 14所述的平板装置， 其特征在于， 所述硬性连接单元的第四导 电接触端子与所述芯片单元通过 ACF绑定或金属熔融焊接相连接。
16.如权利要求 14所述的平板装置， 其特征在于， 还包括第二软性连接单元， 所述第二软性连接单元包括第三导线以及分别设置于所述第三导线两端的第 五导电接触端子和第六导电接触端子；所述硬性连接单元的所述第四导电接触 端子与所述第二软性连接单元的所述第五导电接触端子通过 ACF绑定或金属 熔融焊接相连接。
17.如权利要求 16所述的平板装置， 其特征在于， 所述第二软性连接单元的所 述第六导电接触端子与所述芯片单元通过 ACF绑定或金属熔融焊接相连接。
18.如权利要求 16所述的平板装置， 其特征在于， 所述平板装置还包括 PCB; 所述 PCB 包括第四导线以及分别设置于所述第四导线两端的第七导电接触端 子和第八导电接触端子；所述第二软性连接单元的所述第六导电接触端子与所 述 PCB相连接； 所述 PCB与所述芯片单元通过 ACF绑定或金属熔融焊接相 连接。
19.如权利要求 16 所述的平板装置， 其特征在于， 所述第二软性连接单元为 FPC。
20.如权利要求 8所述的平板装置， 其特征在于， 所述基板单元包括 TFT阵列 基板。
21.如权利要求 8所述的平板装置， 其特征在于， 所述基板单元为触摸屏。
22.—种平板图像传感器， 其特征在于， 包括： 权利要求 20所述的平板装置， 所述 TFT阵列基板的像素区域中设置有光敏传感器。
23.—种有机发光二极管显示器， 其特征在于， 包括： 权利要求 20所述的平板 装置， 所述 TFT阵列基板的像素区域中设置有有机发光二极管。
24.—种液晶显示器， 其特征在于， 包括： 彩膜基板、 液晶层， 以及权利要 20 所述的平板装置； 所述 TFT阵列基板的像素区域中设置有像素电极； 所述彩 膜基板和所述 TFT阵列基板相对设置， 所述液晶层填充于二者之间。
25.—种电子纸显示器， 其特征在于， 包括： 上基板、 微胶嚢层， 以及权利要 求 20所述的平板装置； 所述 TFT阵列基板的像素区域中设置有像素电极； 所 述上基板和所述 TFT阵列基板相对设置， 所述微胶嚢层填充于二者之间。
26.—种触摸设备， 其特征在于， 包括： 权利要求 21所述的平板装置。
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