WO2013145036A1 - Procédé de séparation d'éléments à l'aide de lumière laser - Google Patents

Procédé de séparation d'éléments à l'aide de lumière laser Download PDF

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Publication number
WO2013145036A1
WO2013145036A1 PCT/JP2012/006283 JP2012006283W WO2013145036A1 WO 2013145036 A1 WO2013145036 A1 WO 2013145036A1 JP 2012006283 W JP2012006283 W JP 2012006283W WO 2013145036 A1 WO2013145036 A1 WO 2013145036A1
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WO
WIPO (PCT)
Prior art keywords
laser light
adhesive tape
laser beam
adhesive layer
adhesive
Prior art date
Application number
PCT/JP2012/006283
Other languages
English (en)
Japanese (ja)
Inventor
山田　功作
博文 村上
藤田　和也
Original Assignee
早川ゴム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 早川ゴム株式会社 filed Critical 早川ゴム株式会社
Priority to JP2014507023A priority Critical patent/JP6009540B2/ja
Priority to KR1020147025862A priority patent/KR20140142704A/ko
Priority to CN201280071785.0A priority patent/CN104204122A/zh
Publication of WO2013145036A1 publication Critical patent/WO2013145036A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • the present invention relates to a separation method for separating a first member and a second member, which are bonded in advance with an adhesive tape, using laser light.
  • an adhesive tape having an adhesive layer is used when two members are joined.
  • adhesive tapes do not require curing time, and can instantly bond two members and avoid separation when impacted after bonding due to their low elastic modulus. Since there is an advantage that it can be used, its application range is wide. For example, it is widely used in the manufacturing site of household goods, office supplies, home appliances, electronic products, automobiles and the like.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape used in various situations is composed of a pressure-sensitive adhesive, and as this pressure-sensitive adhesive, it exerts a strong adhesive force after bonding and maintains it for a long period of time. What can be used is used.
  • the above-mentioned drugs and the like can be used from the viewpoint of protecting each component.
  • the whole cannot be heated, and separation of members becomes very difficult.
  • the present inventors irradiate the intermediate member by irradiating the same portion with the laser beam again after irradiating the laser beam with the intermediate member sandwiched between the two members and joining the two members.
  • a method of separating one member from the other member by softening, melting, etc. has been invented first, and this has been filed as Japanese Patent Application No. 2010-208304.
  • the intermediate member is made of a hot-melt material, which is effective in that the intermediate member can be melted and separated by irradiation with laser light.
  • a hot-melt material which is effective in that the intermediate member can be melted and separated by irradiation with laser light.
  • the price of electronic parts is high, and there is a high demand for reusing parts (members) that are free from defects during rework and repair after bonding with adhesive tape.
  • the pressure-sensitive adhesive layer of a general pressure-sensitive adhesive tape employs a method of increasing the cross-linking density using heat or ultraviolet rays in order to improve the cohesive force. Have difficulty.
  • the present invention has been made in view of such points, and an object of the present invention is to make it possible to easily separate a member bonded using an adhesive tape.
  • the present inventors have found that the adhesive strength can be easily reduced by changing the state of the pressure-sensitive adhesive layer by using laser light, leading to the present invention.
  • 1st invention is the separation method which isolate
  • the laser beam non-transparent portion of at least one of the first member, the second member, and the adhesive tape is irradiated with laser light to generate heat, and this heat softens, melts, foams, and decomposes the adhesive layer of the adhesive tape.
  • the first member and the second member are separated by reducing the adhesive force of the pressure-sensitive adhesive layer in at least one state.
  • the laser beam non-transmitting portion generates heat by absorbing the laser beam.
  • the adhesive force of the pressure-sensitive adhesive layer is reduced, and the first member and the second member can be separated.
  • the second invention is characterized in that, in the first invention, the laser light non-transmitting portion is formed by printing.
  • the laser beam non-transparent portion can reliably absorb the laser beam and generate heat.
  • the third invention is characterized in that, in the first invention, the laser beam non-transmitting portion is made of a colored resin that transmits at least 5% of the laser beam.
  • the laser beam non-transmitting portion when the laser beam is irradiated, the laser beam non-transmitting portion is heated not only in the irradiation surface but also in the thickness direction. As a result, the amount of heat in the laser light non-transmitting portion increases, so that heat is easily transmitted to the adhesive layer of the adhesive tape, and the adhesive layer can be reliably softened.
  • the fourth invention is characterized in that, in the first invention, the laser light non-transmitting portion is made of a metal or a metal oxide.
  • the laser beam when the laser beam is irradiated, the laser beam is reflected to some extent on the surface of the laser beam non-transmitting portion, but the rest is absorbed by the laser beam non-transmitting portion.
  • the laser light non-transmitting part generates heat appropriately, and the adhesive layer of the adhesive tape can be surely softened.
  • a force is applied to the adhesive layer of the adhesive tape in a direction to separate the first member and the second member, and in this state The laser light non-transmission part is irradiated with laser light.
  • the force for separating the member since the force for separating the member always acts on the adhesive layer of the adhesive tape, the adhesive layer is peeled off in order from the softened part, and efficiently with a small amount of laser light irradiation.
  • the members can be separated.
  • the sixth invention is characterized in that, in any one of the first to fifth inventions, the same portion is irradiated with laser light twice or more.
  • the heat storage amount can be increased by the second or third laser light irradiation to securely soften the adhesive layer of the adhesive tape.
  • the laser beam non-transmitting part when it is thick, it may take some time for heat conduction to the adhesive layer of the adhesive tape. In this case, the adhesive layer is gradually heated by irradiating the laser beam multiple times. Can be softened.
  • the adhesive layer can be gradually heated and softened without increasing the temperature of the laser light non-transparent part by irradiating the laser beam multiple times. Is possible.
  • the member can be easily separated by softening, melting, foaming and decomposing the adhesive layer of the adhesive tape using laser light, so that rework, repair, recycling Can be performed smoothly.
  • the laser light non-transmission part is configured by printing, the laser light non-transmission part can be surely heated to reduce the adhesive force of the adhesive layer of the adhesive tape.
  • the laser light non-transmitting portion is made of a colored resin that transmits at least 5% of the laser light, so that the adhesive layer of the adhesive tape can be reliably softened and the member can be reused. Can be reliably separated.
  • the laser light non-transmissive portion is made of metal or metal oxide, the laser light non-transmissive portion can be appropriately heated, and the members can be reliably separated in a reusable form. .
  • the force is applied to the adhesive layer of the adhesive tape in the direction of separating the first member and the second member, and the laser beam is irradiated in this state. It can be separated well.
  • the heat storage amount can be gradually increased to surely soften the adhesive layer of the adhesive tape.
  • FIG. 1 shows a product A in which a first member 10 and a second member 20 are bonded with an adhesive tape 30.
  • a laser beam L shown in FIG. 6 is used.
  • the first member 10 can be composed of, for example, a transparent glass plate, a resin film, a resin sheet, or the like.
  • the first member 10 is a rectangular glass plate in this embodiment, but the shape and material can be arbitrarily set.
  • the first member 10 may be colorless and transparent, but may be lightly colored so that most of the laser light can be transmitted.
  • FIG. 4 is a view of the first member 10 as seen from the back side (second member 20 side). As shown in this figure, the printed layer is formed on the peripheral portion of the surface of the first member 10 on the second member 20 side. 40 is provided. Thus, by providing the printing layer 40 on the surface of the first member 10 on the second member 20 side, the printing layer 40 and the adhesive tape 30 are adjacent to each other.
  • the printing layer 40 can be formed using various printing methods such as offset printing, gravure printing, and screen printing.
  • the print layer 40 is a laser beam non-transmission part of the present invention.
  • the laser light non-transmitting portion is a portion having a laser light absorption property that absorbs the laser light when irradiated with the laser light.
  • Laser light absorption is a property of absorbing the remainder of the laser light even if it is partially transmitted and / or reflected, and includes that which absorbs all of the irradiated laser light.
  • a color of the printing layer 40 a dark color such as black is preferable as a color having a high shielding property for shielding laser light.
  • the printing layer 40 is composed of a resin, a so-called binder, and a laser light absorber.
  • a resin a so-called binder, and a laser light absorber.
  • the binder a general thermoplastic resin, thermosetting resin, ultraviolet curable resin, or the like can be used.
  • the laser light absorber examples include organic pigments and organic dyes, commercially available laser light absorbers, carbon black, and the like.
  • the printing layer 40 may be provided for writing characters, decorating, or coloring the product A.
  • a metal vapor deposition film may be provided on the peripheral portion of the surface of the first member 10 on the second member 20 side. This metal deposition film also has laser light absorption.
  • the second member 20 is, for example, a plate material made of resin or the like, but may be formed of a glass plate, a resin film, a resin sheet, or the like.
  • the second member 20 may be transparent or opaque. Further, the shape of the second member 20 is not limited to the plate.
  • the adhesive tape 30 for example, an adhesive tape that is commercially available for industrial use, electrical use, electronic use, or home use can be used. As shown in FIG. 3A, the adhesive tape 30 is attached to one surface of the film-like substrate 30a.
  • the single-sided adhesive tape provided with the layer 30b, or the double-sided adhesive tape provided with the adhesive layers 30b and 30b on both sides of the base material 30a as shown in FIG. 3B can be used.
  • Examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 30b include a general acrylic type whose cohesion is improved by heat or ultraviolet light.
  • an elastomer-based pressure-sensitive adhesive may be used.
  • examples of styrene-based materials include SIS (styrene isoprene styrene), SBS (styrene butadiene styrene), and SEBS (styrene ethylene butylene styrene).
  • Other examples include acrylic elastomers, urethane elastomers, and polyolefin elastomers.
  • a general rubber-based pressure-sensitive adhesive can also be used.
  • the print layer 40 is formed on the first member 10. Thereafter, as shown in FIG. 5, one adhesive layer 30 b of the double-sided adhesive tape 30 is pressed against the printing layer 40, and the adhesive tape 30 is attached to the first member 10.
  • the first member 10 and the second member 20 are arranged, and the other adhesive layer 30 b of the adhesive tape 30 is pressed against a predetermined portion of the second member 20.
  • the 1st member 10 and the 2nd member 20 are bonded to the adhesive tape 30 instantly and firmly.
  • Product A includes, for example, household items, office supplies, home appliances, electronic products, automobile parts, and the like.
  • Examples of the electronic product include a mobile phone, particularly a smartphone, but the product A can be used as long as it can be adhered by the adhesive tape 30.
  • first member 10 of the product A manufactured as described above is separated from the second member 20 .
  • reason for separating for example, when the bonding position of the first member 10 with respect to the second member 20 has shifted, rework for separating the first member 10 from the second member 20 and bonding again, or bonding Examples include so-called repair in which the first member 10 is later damaged and only the first member 10 is replaced, and recycling in which the first member 10 and the second member 20 are separately collected and reused.
  • the first member 10 is separated from the second member 20 using the laser light L.
  • a weight W is suspended from the second member 20 to apply a force to the adhesive layer 30 b of the adhesive tape 30 in a direction that separates the first member 10 and the second member 20.
  • the magnitude of the force in the separating direction is preferably 0.01 MPa or more, for example.
  • the laser beam L is irradiated from the front side of the first member 10 toward the printing layer 40.
  • the laser light is absorbed by the printing layer 40, and the printing layer 40 generates heat.
  • the heat of the printing layer 40 is transmitted to the adhesive layer 30b of the adhesive tape 30.
  • the adhesive layer 30b is adjacent to the print layer 40, the heat of the print layer 40 is quickly transferred to the adhesive layer 30b, and the temperature of the adhesive layer 30b rises quickly.
  • the laser beam L to be used for example, a gas laser, a solid laser, a semiconductor laser, a fiber laser, or the like can be used, but an infrared semiconductor laser with a wavelength of 800 nm to 1500 nm that is easy to handle is particularly preferable.
  • the output of the laser beam L and the scanning speed are set to such an extent that the first member 10 and the second member 20 are not melted or damaged.
  • the pressure-sensitive adhesive layer 30b When the temperature of the pressure-sensitive adhesive layer 30b is increased by irradiation with the laser light L, the pressure-sensitive adhesive layer 30b is softened and the adhesive force is reduced. At this time, since the force is applied in the direction in which the first member 10 and the second member 20 are separated by the weight W, the first member 10 and the second member 10 are peeled in order from the portion where the adhesive layer 30b starts to soften. The member 20 moves away, and the first member 10 is separated from the second member 20 in due time.
  • the weight of the weight W can be arbitrarily set, but it is preferable that the magnitude of the force in the direction of separating the first member 10 and the second member 20 is 0.01 MPa or more. If this force is smaller than 0.01 MPa, even if the laser beam L is irradiated, the first member 10 is not easily separated from the second member 20, and the irradiation amount of the laser beam L must be increased. In addition, if the force in the direction separating the first member 10 and the second member 20 is too large, the first member 10 and the second member 20 may be damaged. It is preferable to set the weight of the weight W as long as it does not break.
  • a method of applying a force in the direction in which the first member 10 and the second member 20 are separated in addition to the method using the weight W described above, for example, a method using negative pressure suction, a method using the first member 10 and the first member 10
  • the number of times of irradiation with the laser beam L may be one time or a plurality of times. If the output of the laser beam L is low and the same part is irradiated multiple times, the temperature rise of the first member 10 can be moderated, and the temperature of the adhesive layer 30b is gradually increased to increase the adhesive strength. Can be gradually weakened. Thereby, it becomes possible to prevent damage to the first member 10 and the second member 20.
  • the first member 10 When one of the first member 10 and the second member 20 is damaged and cannot be reused (repair), the first member 10 is a housing and the second member 20 is an internal component, and the first member 10 is discarded.
  • the second member 20 is used or for the purpose of separation (recycling)
  • only the adhesive layer 30b is decomposed and easily separated by irradiating the laser beam L with high output once or a plurality of times. It is also possible to make it possible.
  • the laser beam L may be irradiated until the temperature at which the adhesive layer 30b is softened or melted, or the laser beam L may be irradiated until the temperature at which the adhesive layer 30b is foamed or decomposed.
  • the base material 30a of the adhesive tape 30 is made of a foam having a closed cell structure, the base material 30a is destroyed by the thermal expansion of the air in the air bubbles.
  • the second member 20 can be separated.
  • the laser beam L can be irradiated selectively only to a portion that needs to be heated (a portion to which the adhesive tape 30 is attached), for example, the influence of heat on heat-sensitive components such as electronic components (liquid crystal substrates, touch panel devices). Can be kept to a minimum.
  • the first member 10 and the second member 20 are separated by using the laser beam L so that the adhesive layer 30b of the adhesive tape 30 is softened, melted, foamed, or decomposed. Therefore, both members 10, 20, or one of them, or necessary parts and materials can be separated in a reusable form, and rework, repair, and recycling can be performed smoothly.
  • the laser light non-transmission part is configured by the shielding printing layer 40, the laser light non-transmission part can reliably absorb the laser light L and generate heat, and the adhesive force of the adhesive layer 30b can be ensured. Can be reduced.
  • the laser light L is applied to the pressure-sensitive adhesive layer 30b of the pressure-sensitive adhesive tape 30 in a state in which a force is applied in a direction in which the first member 10 and the second member 20 are separated, a small amount of laser light irradiation.
  • the members can be separated efficiently.
  • the second member 20 may be separated from the first member 10.
  • the second member 20 may be made of a transparent member, and a printing layer (laser light non-transmitting portion) 40 may be provided on the surface of the second member 20 on the first member 10 side.
  • the first member 10 can be separated from the second member 20 by irradiating the laser beam L from the second member 20 side to heat the adhesive layer 30 b of the adhesive tape 30.
  • first member 10 and the second member 20 may be electronic components.
  • an electronic component on which an IC or the like is mounted may be the first member 10
  • a housing that houses the first member 10 may be the second member 20
  • a liquid crystal display panel may be the first member 10
  • the liquid crystal display panel may be The substrate to be attached may be the second member 20.
  • Embodiment 2 The second embodiment is different from the first embodiment in that the first member 10 is made of a colored resin that transmits at least 5% of the laser light L, and the other portions are the same as the first embodiment.
  • the first member 10 is made of a colored resin that transmits at least 5% of the laser light L, and the other portions are the same as the first embodiment.
  • Embodiment 1 a different part from Embodiment 1 is demonstrated in detail.
  • the colored resin constituting the first member 10 can be obtained, for example, by adding a dye or a pigment to the resin. Thereby, the laser beam non-transmission part is comprised in the 1st member 10. Only a part of the first member 10 may be formed of a colored resin, and the other part may be colorless and transparent so-called two-color molding.
  • resin there are various types of resin as a base, and examples thereof include thermoplastic polyethylene, polypropylene, vinyl chloride, polycarbonate, polyacetal, polyethylene terephthalate, and acrylic resin.
  • a thermosetting resin may be sufficient and an epoxy resin, a phenol resin, a melanin resin, a guanamine resin etc. are mentioned in this case.
  • an ultraviolet curable resin may be used, and in this case, an unsaturated acrylic resin, a polyester resin, a cationic polymerization epoxy resin, or a monomer thereof can be used.
  • the first member 10 of Embodiment 2 is not provided with a print layer.
  • the laser beam L is irradiated from the front side of the first member 10.
  • the irradiated laser beam L is absorbed by the first member 10 because the first member 10 is colored.
  • the first member 10 that has absorbed the laser light L generates heat, and the heat of the first member 10 is transmitted to the adhesive layer 30b of the adhesive tape 30 so that the adhesive layer 30b is in at least one state among softening, melting, foaming, and decomposition.
  • the adhesive force by the pressure-sensitive adhesive layer 30b is reduced.
  • the first member 10 is separated from the second member 20.
  • the transmittance of the laser beam L of the first member 10 is lower than 5%, most of the laser beam L is absorbed by the surface of the first member 10 (irradiated surface of the laser beam L). Since the surface is easily damaged by the laser beam L, it is not preferable.
  • the transmittance of the laser beam L of the first member 10 is 80% or more, the laser beam L is hardly converted into heat and the efficiency is lowered.
  • the transmittance of the laser beam L of the first member 10 is preferably in the range of 5% to less than 80%. More preferably, it is 10% or more and 70% or less.
  • the first member 10 and the first member 10 are brought into at least one of softening, melting, foaming, and decomposition using the laser light L. Since the 2nd member 20 can be isolate
  • the adhesive layer 30b of the adhesive tape 30 may be non-transmissive to laser light. In this case, since the adhesive layer 30b itself absorbs the laser beam L and softens, the first member 10 can be easily separated from the second member 20 even when the first member 10 completely transmits the laser beam.
  • the adhesive layer 30b absorbs the laser light L and generates heat even when the laser light transmittance of the first member 10 is high (for example, 80% or more). Thereby, it is possible to separate the first member 10 and the second member 20 by reducing the adhesive force by bringing the adhesive layer 30b into at least one state among softening, melting, foaming and decomposition.
  • the base material 30a of the adhesive tape 30 may have a laser light transmittance of 10% or more. Also in this case, since the adhesive tape 30 has a laser light non-transmitting portion, the first member 10 and the second member 20 can be separated using the laser light L.
  • the second member 20 may be the colored resin.
  • the third embodiment is different from the first embodiment in that the first member 10 is made of a metal or an oxide thereof, and other parts are the same as the first embodiment.
  • the first member 10 is made of a metal or an oxide thereof, and other parts are the same as the first embodiment.
  • Embodiment 1 a different part from Embodiment 1 is demonstrated in detail.
  • Examples of the metal constituting the first member 10 include iron, copper, silver, aluminum, magnesium, and alloys thereof.
  • the first member 10 can be composed of the metal oxide and its alloy.
  • the laser beam L is irradiated from the front side of the first member 10.
  • the irradiated laser light L is reflected to some extent on the surface of the first member 10, but the rest is absorbed by the first member 10.
  • the first member 10 that has absorbed the laser light L generates heat, and the heat of the first member 10 is transmitted to the adhesive layer 30b of the adhesive tape 30 so that the adhesive layer 30b is in at least one state among softening, melting, foaming, and decomposition.
  • the adhesive force by the pressure-sensitive adhesive layer 30b is reduced.
  • the first member 10 is separated from the second member 20.
  • the first member 10 and the adhesive member 30b of the adhesive tape 30 are softened, melted, foamed, and decomposed by using the laser light L. Since the 2nd member 20 can be isolate
  • the 1st member 10 when the 1st member 10 is comprised with the metal with high heat conductivity like silver and aluminum, and its oxide, when the thickness of the 1st member 10 is thick, heat_generation
  • the second member 20 may be made of a metal or an oxide thereof.
  • a part of the first member 10 may be a metal or an oxide thereof, and the other part may be made of resin or glass.
  • the first member 10 was a glass plate, and had a width of 50 mm, a length of 100 mm, and a thickness of 1 mm.
  • the print layer 40 was formed using a black UV screen ink (manufactured by Jujo Chemical Co., Ltd .: Reicure GA4100).
  • the formation range of the printing layer 40 is the entire circumference of the peripheral portion of the surface of the first member 10 on the second member 20 side, and the width thereof is 2 mm.
  • the printing layer 40 was obtained by irradiating the ink with ultraviolet rays using a metal halide lamp, thereby curing the ink.
  • the amount of ultraviolet irradiation at this time is 300 mJ / mm 2 .
  • the second member 20 is a transparent plate made of polycarbonate and has a width of 60 mm, a length of 120 mm, and a thickness of 2 mm.
  • the adhesive tape 30 was a double-sided adhesive tape (DIC Corporation: 8402B). This was punched into a rectangular frame. The outer dimensions are 50 mm in width and 100 mm in length, and the width of the frame portion is 1 mm.
  • one pressure-sensitive adhesive layer 30 b of the pressure-sensitive adhesive tape 30 was pressed against the printing layer 40 of the first member 10 to attach the pressure-sensitive adhesive tape 30 to the first member 10.
  • a 500 g weight W is attached to the second member 20, and the first member 10 is affixed to a colorless and transparent fixed glass plate (not shown) using a fixing adhesive tape. It was. The fixing adhesive tape is prevented from overlapping the print layer 40.
  • the laser beam L was applied to the printing layer 40 from the surface side of the first member 10.
  • the wavelength of the laser beam L was 940 nm, the output was 10 W, and the focus diameter was 3 mm.
  • the scanning speed was 600 mm / min.
  • the number of times of irradiation with the laser beam L is five.
  • the adhesive layer 30b of the adhesive tape 30 was softened by the irradiation with the laser beam L, and the second member 20 was separated from the first member 10 and dropped. At this time, the first member 10 and the second member 20 were not damaged.
  • Example 2 The first member 10 was a 0.5 mm thick copper plate, and the width and length were the same as those of the first member 10 of Example 1.
  • the second member 20 is the same as in the first embodiment.
  • the adhesive tape 30 was Y-4914 manufactured by Sumitomo 3M Limited.
  • the laser beam L was irradiated with the weight W attached.
  • the output of the laser beam L was 30W.
  • the wavelength, focus diameter, and scanning speed were the same as in Example 1.
  • the number of irradiations was one.
  • the one-time irradiation of the laser beam L softened the adhesive layer 30b of the adhesive tape 30, and the second member 20 was separated from the first member 10 and dropped. At this time, the first member 10 and the second member 20 were not damaged.
  • the first member 10 was a polycarbonate plate colored blue. Each dimension is the same as the first member 10 of the first embodiment.
  • the laser light transmittance of the first member 10 was 10% at a wavelength of 940 nm.
  • the second member 20 was the same as in Example 1.
  • Adhesive tape 30 was 5000-NS made by Nitto Denko Corporation.
  • Example 1 In the same manner as in Example 1, the laser beam L was irradiated with the weight W attached. The output of the laser beam L was 10W. The wavelength, focus diameter, and scanning speed were the same as in Example 1.
  • the second member 20 was separated from the first member 10 and dropped by the eighth laser beam L irradiation. At this time, the first member 10 and the second member 20 were not damaged.
  • the second member 20 is the same as that in the first embodiment.
  • the adhesive tape 30 was 5230NSB manufactured by Sekisui Chemical Co., Ltd.
  • the laser beam L was irradiated with the weight W attached.
  • the output of the laser beam L was 20W.
  • the wavelength, focus diameter, and scanning speed of the laser beam L were the same as in Example 1.
  • the second member 20 was separated from the first member 10 and dropped by the 15th laser light L irradiation. At this time, the first member 10 and the second member 20 were not damaged.
  • the method for separating a member using laser light according to the present invention can be widely applied to separating a strongly bonded member using an adhesive tape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention porte sur un procédé de séparation d'un premier élément (10) et d'un second élément (20) qui sont collés conjointement avec une bande adhésive (30) l'un de l'autre, une partie non émissive de lumière laser d'au moins l'un du premier élément (10), du second élément (20) et de la bande adhésive (30) est irradié et chauffé avec une lumière laser (L), amenant une couche adhésive de la bande adhésive (30) à être dans au moins l'un d'un état ramolli, fondu, moussé ou décomposé avec cette chaleur afin de réduire la force d'adhésion de la couche adhésive.
PCT/JP2012/006283 2012-03-30 2012-10-01 Procédé de séparation d'éléments à l'aide de lumière laser WO2013145036A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014507023A JP6009540B2 (ja) 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法
KR1020147025862A KR20140142704A (ko) 2012-03-30 2012-10-01 레이저 광을 이용한 부재의 분리방법
CN201280071785.0A CN104204122A (zh) 2012-03-30 2012-10-01 利用激光的部件分离方法

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JP2012-081230 2012-03-30
JP2012081230 2012-03-30

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WO2013145036A1 true WO2013145036A1 (fr) 2013-10-03

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KR (1) KR20140142704A (fr)
CN (1) CN104204122A (fr)
TW (1) TWI464027B (fr)
WO (1) WO2013145036A1 (fr)

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JP2015150576A (ja) * 2014-02-13 2015-08-24 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
FR3094905A1 (fr) * 2019-04-12 2020-10-16 Psa Automobiles Sa Procédé de marquage de pièce pour guider le dépôt de matière lors d’un procédé d’assemblage
WO2023053537A1 (fr) * 2021-09-29 2023-04-06 日東電工株式会社 Feuille adhésive sensible à la pression pour la fixation temporaire d'un composant électronique et procédé de traitement de composant électronique
WO2023053538A1 (fr) * 2021-09-29 2023-04-06 日東電工株式会社 Feuille adhésive sensible à la pression pour composant électronique de fixation temporaire et procédé de traitement pour composant électronique

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CN105964512A (zh) * 2016-04-26 2016-09-28 乐视控股（北京）有限公司 一种对触控面板进行返工的方法
CN106475680B (zh) * 2016-12-09 2018-12-07 深圳市吉祥云科技有限公司 一种采用激光拆解夹层内oca光学胶的方法
CN109087932A (zh) * 2018-06-26 2018-12-25 武汉华星光电半导体显示技术有限公司 柔性基板的剥离方法与显示面板
CN114458667A (zh) * 2022-01-29 2022-05-10 苏州富润泽激光科技有限公司 工件贴合方法及其电子产品

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JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015150576A (ja) * 2014-02-13 2015-08-24 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
FR3094905A1 (fr) * 2019-04-12 2020-10-16 Psa Automobiles Sa Procédé de marquage de pièce pour guider le dépôt de matière lors d’un procédé d’assemblage
WO2023053537A1 (fr) * 2021-09-29 2023-04-06 日東電工株式会社 Feuille adhésive sensible à la pression pour la fixation temporaire d'un composant électronique et procédé de traitement de composant électronique
WO2023053538A1 (fr) * 2021-09-29 2023-04-06 日東電工株式会社 Feuille adhésive sensible à la pression pour composant électronique de fixation temporaire et procédé de traitement pour composant électronique

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CN104204122A (zh) 2014-12-10
JPWO2013145036A1 (ja) 2015-08-03
JP6009540B2 (ja) 2016-10-19
TW201338899A (zh) 2013-10-01
TWI464027B (zh) 2014-12-11
KR20140142704A (ko) 2014-12-12

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