Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
  • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
  • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
  • B23K35/3613—Polymers, e.g. resins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
  • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
  • B23K35/3618—Carboxylic acids or salts
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
  • B23K35/362—Selection of compositions of fluxes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/04—Mounting of components, e.g. of leadless components
  • H05K13/046—Surface mounting
  • H05K13/0465—Surface mounting by soldering
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/032—Organic insulating material consisting of one material
  • H05K1/0346—Organic insulating material consisting of one material containing N

Definitions

• the present invention relates to a flux used for soldering electronic components, a solder composition, and a method of manufacturing an electronic circuit mounting board using these solder compositions.
• the solder used to mount electronic components on an electronic circuit board such as a printed wiring board includes a solder composition such as a solder paste in which a solder alloy powder and a flux are mixed, or a flux inside a linear solder alloy. There are so-called filler solder filled.
• a solder composition such as a solder paste in which a solder alloy powder and a flux are mixed, or a flux inside a linear solder alloy.
• filler solder filled As the flux used for these solders, resin-based fluxes containing a synthetic resin, a rosin-based resin, or the like as a resin component are generally widely used.
• the flux removes the metal oxide on the surface conductive part of the printed wiring board, prevents re-oxidation of the solder alloy during soldering, or reduces the surface tension of the solder. In order to improve the properties, it is blended in a solder composition or the like.
• a film portion called a flux residue resulting from the resin component in the flux remains on the electronic circuit mounting substrate after the soldering.
• Such flux residue may be cracked due to temperature changes such as a cooling cycle, etc., and when moisture penetrates into the flux residue from the crack, defects such as a decrease in insulation between leads occur.
• Patent Documents 1 and 2 describe a flux containing an acrylic resin having a low glass transition temperature.
• Patent Document 3 describes a flux containing hydrogenated 1,2-polybutadiene as a resin component.
• Patent Document 4 describes a flux containing a polyamide resin having a softening point of 80 to 150 ° C. obtained by a condensation reaction of dimer acid and diamine.
• Patent Document 5 describes a flux containing rosin and an activator and further containing an ethylene vinyl acetate copolymer.
• Patent Document 6 describes a flux containing, as a resin component, atactic 1,2 polybutadiene or a hydride thereof having an acrylic group or a methacrylic group bonded to the molecular end.
• the fluxes described in Patent Documents 1 and 2 have a problem that the flux residue is sticky and contamination with dust or the like is likely to occur.
• the fluxes described in Patent Documents 3 to 6 provide a certain degree of solder wettability under low temperature preheating conditions of 160 ° C. or lower, but sufficient solder under high temperature preheating conditions exceeding 160 ° C. required for lead-free solder and the like. There is a problem that wettability cannot be obtained and dewetting may occur.
• all of the fluxes described in Patent Documents 1 to 6 have a problem that reflow heating in an air atmosphere cannot sufficiently exhibit solder wettability, so that only reflow in a nitrogen atmosphere can be performed. .
• the present invention has been made in view of the problems of the prior art as described above, and it is possible to suppress the occurrence of cracks in the flux residue and to have good solder wettability even at high temperature soldering. It is an object of the present invention to provide a composition and a method for producing an electronic circuit mounting substrate.
• the flux of the present invention is At least one polybutadiene (meth) acrylate compound selected from the group consisting of a polybutadiene (meth) acrylate compound represented by the following formula 1 and a polybutadiene (meth) acrylate compound represented by the following formula 2, and a hydrogenated dimer Contains acid.
• the dimer acid may be at least one selected from the group consisting of a dimer acid represented by the following formula 3 and a dimer acid represented by the following formula 4.
• the present invention may further include at least one rosin resin selected from the group consisting of rosin, hydrogenated rosin, polymerized rosin, disproportionated rosin and acrylic acid-modified rosin.
• the present invention includes at least one of the above fluxes.
• the present invention may contain a lead-free solder alloy.
• the manufacturing method of the electronic circuit mounting board of the present invention Printing a solder composition to form a solder print pattern; Mounting electronic components on the solder printing pattern; Reflowing the electronic circuit board on which the electronic component is mounted after preheating at 150 ° C. or more and 200 ° C. or less in an air atmosphere.
• the flux of this embodiment is at least one polybutadiene (meth) selected from the group consisting of a polybutadiene (meth) acrylate compound represented by the following formula 5 and a polybutadiene (meth) acrylate compound represented by the following formula 6.
• An acrylate compound and a hydrogenated dimer acid are included.
• Examples of the polybutadiene (meth) acrylate compound represented by Formula 5 include a product name “NISSO-PB TEA-1000” manufactured by Nippon Soda Co., Ltd.
• the polybutadiene (meth) acrylate compound represented by Formula 6 is a polybutadiene (meth) acrylate obtained by adding hydrogen to the polybutadiene unsaturated portion of the polybutadiene (meth) acrylate compound represented by Formula 5 to form a saturated bond.
• Examples of the polybutadiene (meth) acrylate compound represented by the formula 6 include a product name “NISSO-PB TEAI-1000” manufactured by Nippon Soda Co., Ltd.
• the polybutadiene (meth) acrylate compound used in the present embodiment is represented by the above formula 5 or formula 6, and 85% by mass or more of all butadiene units constituting the polymer chain is 1,2-vinyl.
• the content of 1,2-vinyl-bonded butadiene is a value determined by a Fourier transform infrared spectrophotometer (liquid cell method), and specifically means a value measured by a method described later.
• the average molecular weight is a value obtained by gel permeation chromatography (GPC), and specifically means a value measured by a molecular weight measurement method described later.
• the said polybutadiene (meth) acrylate compound can be used individually by 1 type or in mixture of multiple types.
• the polybutadiene (meth) acrylate compound is preferably a hydrogenated type from the viewpoint of thermal cycle performance.
• the content rate measurement method is a value obtained by a Fourier transform infrared spectrophotometer (liquid cell method), and specifically, a value measured by the following method. That is, using "Shimadzu Corporation FTIR-8400" is used as a measuring instrument to measure the infrared absorption spectrum, 910 cm around -1 (1,2-vinyl) and 970 cm -1 vicinity (1,4-trans) absorbance Quantify by measuring
• the average molecular weight is a value determined by gel permeation chromatography (GPC), and specifically refers to a value measured by the following method. That is, “GPC” manufactured by Waters is used as the GPC apparatus, “KF-803, KF-802, KF-801” manufactured by Showa Denko is used as the column, and THF (tetrahydrofuran) solution is used as the eluent. And using a “UV245 nm RI” manufactured by Waters as a detector. A standard sample of polystyrene was used as the standard molecular weight substance, a calibration curve was created based on the measurement results, and the average molecular weight was determined from the calibration curve. The average molecular weight is a value of weight average molecular weight (Mw).
• Mw weight average molecular weight
• the concentration of the polybutadiene (meth) acrylate compound is 3% by mass or more and 40% by mass or less, preferably 5% by mass or more and 25% by mass or less, more preferably about 16% by mass or more and 23% by mass or less.
• concentration range solder spreading property and solder wettability will be favorable, suppressing that a crack residue produces a flux residue.
• concentration range when mix
• the hydrogenated dimer acid of this embodiment is at least one dimer acid selected from the group consisting of a dimer acid represented by the following formula 7 and a dimer acid represented by the following formula 8.
• the dimer acid is a dimer of unsaturated fatty acid, which is a hydrogenated dimer acid obtained by hydrogenating the unsaturated double bond of the dimer, and in particular, dimerizes an unsaturated fatty acid having 18 carbon atoms.
• dimer acid having 36 total carbon atoms, which is hydrogenated, is preferable.
• Examples of the hydrogenated dimer acid represented by Formula 7 include a product name “EMPOL1008” manufactured by Cognis Japan.
• Examples of the hydrogenated dimer acid represented by the formula 8 include a product name “PRIPOL1010” manufactured by Croda Japan Co., Ltd.
• the dimer acid can be used singly or in combination.
• the concentration of the dimer acid is preferably 3% by mass or more and 30% by mass or less, preferably 5% by mass or more and 25% by mass or less, and more preferably 9% by mass or more and 16% by mass or less. If it is the said density
• the flux of the present embodiment includes the polybutadiene (meth) acrylate compound and the dimer acid as resin components, but further includes other synthetic resins or rosin resins as the resin components. May be.
• rosin and at least one rosin resin selected from the group consisting of hydrogenated rosin, a polymerized rosin, a disproportionated rosin, and an acrylic acid-modified rosin, which are derivatives of the rosin may further be included as a resin component. It is preferable from the viewpoint of solderability.
• hydrogenated rosin is preferable from the viewpoint of thermal cycleability.
• the concentration of the rosin resin is 5% by mass or more and 40% by mass or less, preferably 20% by mass or more and 35% by mass or less, and more preferably 25% by mass or more and 30% by mass or less. This is preferable from the viewpoint of reducing the occurrence of the above.
• the flux of the present embodiment may further contain components included in a normal flux such as an activator, a solvent, and a thixotropic agent.
• amine-hydrohalide for example, amine-hydrohalide, organic acid, and the like can be used.
• the amine-hydrohalide include diethylamine hydrobromide and cyclohexylamine hydrobromide.
• the organic acid include glutaric acid, adipic acid, azelaic acid, sebacic acid, stearic acid, benzoic acid, and the like.
• the activator can be used alone or in combination of two or more.
• organic acids such as glutaric acid, adipic acid, azelaic acid, and sebacic acid are preferably used from the viewpoint of the viscosity stability of the solder paste.
• the concentration of the activator is preferably 1% by mass or more and 10% by mass or less, and preferably 2% by mass or more and 6% by mass or less.
• the concentration range is preferable because the solder wettability and the electrical insulation can be maintained in an appropriate range.
• the solvent examples include glycols such as diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono 2-ethylhexyl ether (2 ethylhexyl diglycol), and diethylene glycol monobutyl ether (butyl diglycol).
• glycols such as diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono 2-ethylhexyl ether (2 ethylhexyl diglycol), and diethylene glycol monobutyl ether (butyl diglycol).
• Ethers aliphatic compounds such as n-hexane, isohexane and n-heptane; esters such as isopropyl acetate, methyl propionate and ethyl propionate; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; Examples thereof include alcohols such as ethanol, n-propanol, isopropanol, and isobutanol.
• the said solvent can be used individually or in mixture of multiple types.
• glycol ethers such as diethylene glycol hexyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether having a boiling point in the range of 200 ° C. to 300 ° C. among the above solvents. It is preferable from the viewpoint of securing the property.
• the concentration of the solvent is preferably 20% by mass or more and 50% by mass or less, and preferably 25% by mass or more and 40% by mass or less.
• concentration range is preferable because the resin component can be sufficiently dissolved and an appropriate viscosity can be imparted to the flux.
• thixotropic agent examples include hardened castor oil, beeswax, carnauba wax, and higher fatty acid amides such as stearamide.
• the thixotropic agents can be used alone or in combination of two or more.
• the flux of this embodiment may be mixed with solder alloy powder as described later and used as a component of a solder composition such as solder paste, but in addition, the flux is contained inside the solder alloy linear member. It may be filled and used as a material for cored solder. Or you may use the said flux as a flux at the time of soldering by the flow soldering method.
• the solder composition of this embodiment includes the flux and solder alloy powder.
• solder alloy powder known solder alloy powders can be used. Among them, Sn—Ag solder, Sn—Ag—Cu solder, Sn—Ag—Cu—Bi used as lead-free solder are used. It is preferable to use powders of lead-free solder alloys such as Sn solder, Sn—Ag—In—Bi solder, Sn—Cu solder, Sn—Zn solder, and Sn—Bi solder.
• the lead-free solder in this embodiment means the lead-free solder defined in JIS Z 3282.
• the flux is 8 to 20% by mass, preferably 10 to 15% by mass
• the solder alloy powder is 80 to 92% by mass, preferably 85% by mass. It is preferable that the solder paste is paste-like by mixing from 90% to 90% by weight.
• solder composition using the lead-free solder alloy performs preheating at around 200 ° C., which is a higher temperature than conventional lead-based solder compositions such as Sn—Pb, when electronic components are mounted by a reflow method.
• solder wettability is ensured by using a substrate that is compatible with lead-free soldering, such as applying a special treatment to the substrate. That is, in general, lead-free solder has a problem that costs and labor are required as compared with the case where a leaded solder composition is used.
• the solder composition of the present embodiment has good solder wettability even when a lead-free solder alloy powder is used as the solder alloy powder. For example, even if high temperature preheating is performed in an air atmosphere, the solder wettability Can be maintained. Moreover, after soldering, a crack can be hardly generated in the flux residue, and a highly reliable mounting board can be obtained.
• the manufacturing method of the electronic circuit mounting board of the present embodiment is as follows: Printing a solder composition to form a solder print pattern; Mounting electronic components on the solder printing pattern; Reflowing the electronic circuit board on which the electronic component is mounted after preheating at 150 ° C. or higher and 200 ° C. or lower in an air atmosphere.
• the solder composition containing the lead-free solder alloy powder of the present embodiment is printed on a conductor portion on the surface of a printed wiring board as an electronic circuit board to form a solder print pattern.
• the conductor part include a part for mounting an electronic component such as a copper foil part or a through-hole opening part exposed on the surface of the printed wiring board without being covered with an insulating layer such as a solder resist.
• a solder printing method can be employed.
• a solder composition can be used by a squeegee or the like using a mask having an opening through which the conductor portion is exposed. The method of printing on the said conductor part is mentioned.
• performing automatically using a well-known solder printing apparatus is mentioned.
• an electronic component to be mounted on the solder print pattern is mounted. It is preferable that the electronic component is temporarily fixed on the printed wiring board using an adhesive or the like as necessary.
• performing automatically using a well-known component mounting apparatus etc. is mentioned.
• the printed wiring board on which the electronic component is mounted is preheated at 150 ° C. or higher and 200 ° C. or lower in an air atmosphere, and then reflowing is performed.
• the preheating may be performed for 60 seconds or more and 180 seconds or less.
• the following reflow conditions are preferable as the reflow conditions.
• the temperature profile is preheated and heated in an air atmosphere at a temperature of 150 ° C. to 200 ° C. for 60 seconds to 180 seconds. Further, as the main heating, the heating is performed in an air atmosphere at a peak temperature of 180 ° C. or higher and 250 ° C. or lower and 20 seconds or longer and 60 seconds or shorter.
• the substrate is cooled using a cooling device such as natural cooling or a cooler, and an electronic component is mounted, whereby an electronic circuit mounting substrate is manufactured.
• a cooling device such as natural cooling or a cooler
• the electronic circuit mounting board manufactured by the manufacturing method of the present embodiment can exhibit sufficient solder wettability even when reflow soldering is performed under high-temperature preheating conditions in an air atmosphere as described above, such as dewetting. It is difficult to cause defects.
• the flux residue present on the electronic circuit mounting substrate after reflow has good crack resistance, and even when used under conditions where the temperature changes severely, such as a thermal cycle, cracks are unlikely to occur, thus improving the reliability of the substrate. Can be maintained. Therefore, the electronic circuit mounting board manufactured by the manufacturing method of the present embodiment can be optimally used as an electronic circuit mounting board for, for example, an automobile engine part.
• the flux of the present invention is less susceptible to cracking in the residual flux after soldering, and can exhibit good solder wettability even when reflow heating is performed under high temperature preheating. Furthermore, even if reflow heating under the high temperature preheating is performed in an air atmosphere, good solder wettability can be exhibited.
• the flux of the present invention comprises at least one rosin resin selected from the group consisting of rosin, hydrogenated rosin, polymerized rosin, disproportionated rosin, and acrylic acid-modified rosin as the polybutadiene (meth) acrylate compound and the dimer acid.
• the solder composition according to the present invention can exhibit sufficient solder wettability even when reflow heating at a temperature at which the lead-free solder alloy melts is performed in an air atmosphere.
• the method for manufacturing an electronic circuit mounting board according to the present invention includes forming a solder print pattern by printing the solder composition according to the present invention on a conductor portion exposed on a surface of an electronic circuit board; Reflow heating is performed without using nitrogen gas or the like because it includes mounting an electronic component on a printed pattern and performing reflow for main heating after preheating at 150 ° C.
• Flux production The following materials were put in an appropriate beaker with the composition shown in Table 1, and stirred and mixed with a glass rod to prepare a flux.
• the production temperature is suitably adjusted to a temperature at which rosin, thixotropic agent, activator, etc. can be dissolved in a solvent, for example, a temperature of 100 ° C. to 200 ° C. It is preferable to adjust appropriately for about 3 hours.
• Hydrogenated rosin Arakawa Chemical Industries, trade name “Hyper CH” 1,2-vinyl-type polybutadiene acrylate: Nippon Soda Co., Ltd., trade name “NISSO-PB TEA-1000” (1,2-vinyl type is 85% or more, the remaining bonds are 1,4-trans type (average molecular weight 2050) ) Hydrogenated 1,2-vinyl type polybutadiene acrylate, manufactured by Nippon Soda Co., Ltd., trade name “NISSO-PB TEAI-1000” (1,2-vinyl type is 85% or more and the remaining bonds are 1,4-trans type (average) Molecular weight 2250) Hydrogenated liquid dimer acid (1): Cognis Japan, trade name “EMPOL1008” Hydrogenated liquid dimer acid (2): product name “PRIPOL 1010” manufactured by Claude Japan C21 liquid dimer acid: C21 dibasic fatty acid (non-hydrogenated product) manufactured by Harima Kasei Co
• Acrylic resin (2) Non-functional group type liquid acrylic polymer, manufactured by Toa Gosei Co., Ltd., trade name “ARUFON UP-1080” (glass transition point-61 ° C., molecular weight 6000)
• Polyamide resin (1) reaction product of linear diamine and polymerized fatty acid, manufactured by Henkel Japan, trade name “MACROMELT OM-673” (glass transition point ⁇ 45 ° C., softening point 185 ° C.)
• Polyamide resin (2) reaction product of linear diamine and polymerized fatty acid, manufactured by Henkel Japan, trade name “MACROMELT OM-652” (glass transition point ⁇ 38 ° C., softening point 155 ° C.)
• Ethylene vinyl acetate copolymer 28% vinyl acetate content (glass transition point -28 ° C, melt flow rate 800g / 10min), product name "EVAFLEX EV205W” manufactured by Mits
• solder pastes as solder compositions of Examples 1 to 4 and Comparative Examples 1 to 10 were produced.
• solder pastes of the respective examples and comparative examples were performed using a reflow soldering apparatus (apparatus name: APSR-257, manufactured by Kouki Tech Co., Ltd.).
• the reflow conditions are as follows. ⁇ Reflow conditions> Preheating: air atmosphere, 200 ° C., 120 seconds Main heating: air atmosphere, peak temperature 230 ° C., 220 ° C. or higher, heating time 50 seconds
• solderability test As a test substrate, an insulating layer made of a solder resist with a thickness of 22 ⁇ m having a circular opening with a diameter of 6 mm is formed on a glass epoxy base material on which a copper foil with a thickness of 18 ⁇ m is laminated. A product coated with a product name: Tough Ace F2, manufactured by Shikoku Kasei Kogyo Co., Ltd. was prepared. On the copper foil exposed from the opening on the surface of the test substrate, the solder paste of each of the examples and comparative examples was printed to a thickness of 180 ⁇ m (metal mask thickness). After heating the substrate on which the solder paste was printed under the above reflow conditions, the presence or absence of dewetting was confirmed.
• the confirmation method is to visually observe any 6 solder parts on each board, and the copper foil of the base is completely wetted by the solder, and there is no dewetting if there is no repellency. However, if there was dewetting, the one that could be repelled was judged as good, and the one without dewetting was good, and the one with dewetting was judged as bad.
• the confirmation method is to observe any 20-point flux residue on each substrate with a stereo microscope capable of magnifying 40 times, and all flux residues have no cracks at all, and some flux residues have small cracks. Although there is no crack that can be used between QFP patterns and can be used, it can be used, or a crack that is completely formed above and below the flux residue and penetrates to the ground even at one place. Evaluated as bad.
• Test substrate A comb-type electrode substrate described in JIS Z 3197 (1999) 8.5.3 (b) 5) (FIG. 9. Test substrate) was prepared as a test substrate.
• the solder paste of each of the above examples and comparative examples was printed on the substrate pattern to a thickness of 100 ⁇ m (metal mask thickness).
• the substrate after reflowing in the same manner as in the soldering test was subjected to a voltage application test in accordance with an insulation resistance test defined in JIS Z 3197 (1999) 8.5.3.
• the voltage application test was performed by humidifying and degrading for 1000 hours at an applied voltage of 16 V at a temperature of 85 ° C. and a relative humidity of 85% as test conditions.
• the evaluation was good when a resistance value of 9th power ⁇ or more was always maintained for 1000 hours from the initial application, and was poor when a resistance value of less than 9th power was even in the middle.
• solder ball test In the test substrate used in the thermal cycle test, the solder pastes of the respective examples and comparative examples were printed in a thickness of 180 ⁇ m on the copper foil portion of the electrode portion on which 6330 chips and 2012 chips can be mounted instead of the circular openings. Then, 7330 chips and 20 2012 chips were each pressed onto the substrate surface on the electrode on which the solder paste was printed, and the substrate on which the chips were mounted was heated under the reflow conditions, and then 6330 chips. And the presence or absence of the generation

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