WO2013125262A1 - トリメチルシランの精製方法 - Google Patents
トリメチルシランの精製方法 Download PDFInfo
- Publication number
- WO2013125262A1 WO2013125262A1 PCT/JP2013/050639 JP2013050639W WO2013125262A1 WO 2013125262 A1 WO2013125262 A1 WO 2013125262A1 JP 2013050639 W JP2013050639 W JP 2013050639W WO 2013125262 A1 WO2013125262 A1 WO 2013125262A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- trimethylsilane
- activated carbon
- impurities
- gas
- adsorption
- Prior art date
Links
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000007670 refining Methods 0.000 title abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 167
- 239000012535 impurity Substances 0.000 claims abstract description 45
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 39
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 30
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 claims abstract description 22
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011787 zinc oxide Substances 0.000 claims abstract description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910000077 silane Inorganic materials 0.000 claims abstract description 12
- 239000005751 Copper oxide Substances 0.000 abstract description 3
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 29
- 238000001179 sorption measurement Methods 0.000 description 27
- 238000000746 purification Methods 0.000 description 19
- 238000010790 dilution Methods 0.000 description 16
- 239000012895 dilution Substances 0.000 description 16
- 238000007323 disproportionation reaction Methods 0.000 description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 10
- 238000011002 quantification Methods 0.000 description 9
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000004817 gas chromatography Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- -1 lithium aluminum hydride Chemical compound 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000005051 trimethylchlorosilane Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000009849 vacuum degassing Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012280 lithium aluminium hydride Substances 0.000 description 2
- 229910000103 lithium hydride Inorganic materials 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 241001474374 Blennius Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910010082 LiAlH Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- HJXBDPDUCXORKZ-UHFFFAOYSA-N diethylalumane Chemical compound CC[AlH]CC HJXBDPDUCXORKZ-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- ZFAYZXMSTVMBLX-UHFFFAOYSA-J silicon(4+);tetrachloride Chemical compound [Si+4].[Cl-].[Cl-].[Cl-].[Cl-] ZFAYZXMSTVMBLX-UHFFFAOYSA-J 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/20—Purification, separation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0896—Compounds with a Si-H linkage
Definitions
- the present invention relates to a method for purifying trimethylsilane which is useful as a film forming material in semiconductor production.
- trimethylsilane As a method for producing trimethylsilane, a method in which trimethylchlorosilane ((CH 3 ) 3 SiCl) is reduced using an appropriate hydrogenating agent is generally used.
- Non-patent Document 1 a method of synthesizing trimethylchlorosilane and lithium aluminum hydride (LiAlH 4 ) by reacting them in a solvent of dimethoxyethane (DME) is disclosed (Non-patent Document 1). Also disclosed are a method using lithium hydride (LiH) as a hydrogenating agent (Patent Document 1) and a method using diethylaluminum hydride ((C 2 H 5 ) 2 AlH) (Patent Document 2). In addition, a method using a lithium aluminum hydride as a hydrogenating agent and an aromatic hydrocarbon organic solvent as a solvent is disclosed (Patent Document 3).
- trimethylchlorosilane which is a common raw material in these synthesis methods, usually several tens to several thousand ppm of methyltrichlorosilane (CH 3 SiCl 3 ), dimethyldichlorosilane ((CH 3 ) 2 SiCl 2 ), tetrachloride Silicon (SiCl 4 ) or the like is mixed as impurities, and these impurities react with the hydrogenating agent to react with the corresponding silanes, that is, methylsilane (CH 3 SiH 3 ), dimethylsilane ((CH 3 ) 2 SiH 2. ) Or silane (SiH 4 ).
- Patent Document 4 As a method for removing these impurities, purification by distillation is generally used, but other methods utilizing recrystallization, reprecipitation, and sublimation can also be used. Furthermore, a method using activated carbon (Patent Document 4) and a method of cleaning gas with an absorbing solution (Patent Document 5) are disclosed.
- Activated carbon has a porous structure and itself acts as a heat insulating material, so that heat generated in the packed tower packed with activated carbon is easily accumulated.
- the heat of reaction caused by the disproportionation reaction caused by the generated heat of adsorption further increases the temperature of the activated carbon in the packed tower.
- the present invention relates to a purification method for removing impurities such as dimethylsilane, which is an impurity in trimethylsilane, using activated carbon, and purification of trimethylsilane capable of efficiently removing impurities by suppressing heat generation of the activated carbon. It aims to provide a method.
- the inventors of the present invention adsorbed trimethylsilane in advance to activated carbon containing copper (II) oxide and zinc oxide, and trimethylsilane containing impurities in the activated carbon.
- the inventors have found that the heat generation of activated carbon is suppressed by contacting the substrate and impurities such as dimethylsilane can be efficiently removed, resulting in the present invention.
- the present invention includes (1) a step of preparing activated carbon impregnated with at least copper (II) oxide and zinc oxide, (2) a step of adsorbing trimethylsilane to the activated carbon, (3) silane, methylsilane, or dimethyl
- the present invention provides a method for purifying trimethylsilane comprising the step of bringing trimethylsilane containing silane as an impurity into contact with activated carbon which has been subjected to the step (2) and adsorbing the impurity to remove it from trimethylsilane.
- the present invention provides the method for purifying trimethylsilane, wherein in the step (2), trimethylsilane is adsorbed on the activated carbon by bringing diluted trimethylsilane into contact with the activated carbon. .
- the trimethylsilane to be purified contains silane, methylsilane, or dimethylsilane, and is obtained by the above-mentioned known method in which trimethylchlorosilane ((CH 3 ) 3 SiCl) is reduced with a hydrogenating agent.
- the activated carbon used in this step is a so-called impregnated activated carbon containing copper (II) oxide and zinc oxide. Any shape such as granular, sheet, crushed, granular, and fibrous can be used. Such activated carbon is commercially available. When used in a packed tower form, granular, crushed, granular, etc. can be preferably used.
- the method of adsorbing copper (II) oxide and zinc oxide on activated carbon is as follows: Any method can be used as long as this chemical interaction can be expected.
- a method of mixing raw materials crushed before carbonization during the production of activated carbon with powders of copper (II) oxide and zinc oxide, carbonizing and activating, a method of attaching to activated carbon using surface potential, powdered carbon There is a method in which copper, copper (II) oxide and zinc oxide are kneaded in the presence of a suitable binder, and after granulation, heat treatment is applied.
- a suitable binder any binder that can be cured after kneading can be used.
- inorganic materials, thermosetting resins, thermoplastic resins, etc. used for inorganic adhesives such as cement, water glass, and solder. can be used.
- thermosetting resin phenol resin, epoxy resin, unsaturated polyester resin, alkyd resin, melamine resin, urea resin, polyurethane, and thermosetting polyimide
- thermoplastic resin polyethylene, polypropylene, polyvinyl chloride, acrylic resin, polyvinyl chloride, polystyrene, polyvinyl acetate, polytetrafluoroethylene, ABS resin, AS resin, polyamide, polycarbonate, cyclic polyolefin, and the like can be used.
- the concentration of copper (II) oxide and zinc oxide with respect to the activated carbon is preferably 1 to 10 wt% in terms of Cu and 1 to 10 wt% in terms of Zn, and the ratio of copper (II) oxide and zinc oxide is particularly Not limited.
- concentrations of copper (II) oxide and zinc oxide are less than 1 wt% as Cu and Zn, the removal ability of silane, methylsilane, and dimethylsilane is lowered, and complete removal cannot be performed.
- the concentration of copper oxide (II) and zinc oxide exceeds 10 wt% as Cu and Zn, it is not preferable because the adsorption ability of the activated carbon itself is remarkably reduced as the specific surface area decreases.
- trimethylsilane is adsorbed on the activated carbon prepared in the step (1).
- the trimethylsilane used for this adsorption is desirably as highly pure as possible, and it is preferable to use trimethylsilane having a purity of at least 95% or more, more preferably a purity of 99.9% or more.
- Concerning impurities, silane, methylsilane, and dimethylsilane may be included, but a corrosive substance such as trimethylchlorosilane only damages equipment for carrying out the present invention.
- the content is preferably less than 1 vol%.
- trimethylsilane can be adsorbed by contacting the activated carbon.
- this method there is a method of contacting the activated carbon in a gaseous state or a method of contacting with the liquid, but a method of contacting in a gaseous state having a large diffusion coefficient is efficient.
- a batch type or a distribution type may be used, it is preferable to use a distribution type in order to improve production efficiency industrially.
- the temperature of the activated carbon at the time of adsorption is preferably as low as possible considering the disproportionation reaction of trimethylsilane.
- the boiling point of trimethylsilane is 6.7 ° C.
- the disproportionation reaction of trimethylsilane is likely to occur, and the possibility that impurities such as tetramethylsilane ((CH 3 ) 4 Si) are by-produced increases. Above 135 ° C, the disproportionation reaction becomes particularly significant.
- the by-produced tetramethylsilane adsorbs and stays on the activated carbon, and then may be mixed into the product to be purified when contacting trimethylsilane containing impurities to be purified.
- the temperature of the activated carbon at the time of adsorption is preferably less than 100 ° C., and this step is preferably completed. It is more preferable to adsorb until the temperature rise stops and to end this step.
- trimethylsilane when brought into contact with the activated carbon, it is preferable to contact only trimethylsilane in consideration of raw material costs and simplification of the process.
- the cooling for adjusting the temperature of the activated carbon to a temperature at which disproportionation reaction is unlikely to occur, there is a possibility that the load of cooling capacity becomes large and the equipment structure of the activated carbon tower becomes complicated.
- it is preferable to contact trimethylsilane at a low temperature but since the boiling point of trimethylsilane is 6.7 ° C., there is a limit as to the effect of reducing the load. For this reason, it is preferable to dilute trimethylsilane with a gas that is inert to trimethylsilane and difficult to be adsorbed on the activated carbon, and to contact the activated carbon.
- gases used for dilution include rare gases such as helium, neon, argon, krypton, and xenon, and nitrogen.
- a gas highly reactive with trimethylsilane is not preferable because other impurities are produced and affect the purity. Further, in the case of a gas that is highly reactive with activated carbon or easily adsorbed, it is not preferable because it may cause a decrease in adsorption capacity.
- the dilution ratio at the time of dilution is not particularly limited, the purpose of this step is to suppress the temperature rise of the activated carbon and adsorb trimethylsilane, so the temperature of the activated carbon in this step depends on the heat of adsorption of trimethylsilane. It is preferable to adsorb at a temperature that does not cause a disproportionation reaction. For this reason, a dilution rate can be suitably selected with the supply amount per time of the gas to contact, and the temperature of the activated carbon at the time of contact. Generally, as the concentration of trimethylsilane is increased, a rapid temperature increase due to heat of adsorption is observed. In order to avoid this, it is preferable to dilute and adsorb.
- the dilution ratio at the time of dilution is preferably 0.5 to 100 times in terms of the volume ratio of the inert gas to trimethylsilane.
- the dilution ratio exceeds 100 times, much time is required in consideration of the adsorption time and the amount of gas used for dilution, and the processing efficiency decreases.
- the dilution factor is less than 0.5, it is difficult to obtain the effect of dilution.
- the dilution ratio of trimethylsilane during this step does not need to be constant.
- a large amount of heat of adsorption is likely to be generated, so that it is preferable to adsorb at a relatively high dilution factor.
- This heat treatment is a treatment in which the activated carbon is heated at 100 to 300 ° C. to remove adsorbed moisture and the like by vacuum degassing or inert gas flow.
- the activated carbon that has been completed the step (2) is used as an impurity, such as silane, methylsilane, or dimethylsilane. Containing trimethylsilane to be purified.
- a contact method there are a gas contact method and a liquid contact method, but a gas contact method with a large diffusion coefficient is efficient. Either a batch type or a flow type may be used, but in order to remove impurities efficiently, the flow type is preferable, and among them, a multi-stage type is excellent and more preferable.
- the temperature of the activated carbon at the time of contact is the same as in the case of the step (2).
- the impurities are replaced with the trimethylsilane adsorbed by the step (2), or the trimethylsilane of the activated carbon is adsorbed. It is thought that the impurities are removed by adsorbing to the surface that is not. Furthermore, since the adsorption of trimethylsilane to activated carbon has already been performed by the step (2), the rapid adsorption of the purified trimethylsilane itself is inhibited, and the step (2) is not performed. Compared with, the heat generation of the activated carbon is suppressed, and the generation of impurities due to heating is also suppressed.
- the rapid adsorption of the trimethylsilane to be purified can be inhibited.
- the heat generation of the activated carbon due to the heat of adsorption is suppressed, so that the disproportionation reaction of trimethylsilane is suppressed and the increase in impurity concentration can be suppressed. Therefore, it is possible to obtain high purity trimethylsilane.
- Examples 1 to 5 Activated carbon containing zinc oxide and copper oxide by attachment in a tube made of SUS304 having an inner diameter of 158.4 mm x length of 3350 mm (active carbon filling height: 3000 mm) (Nippon Enviro Chemicals Co., Ltd. Granular white seaweed XRC410: content 1 as Cu
- the packing in the packed tower packed with 30 kg of ⁇ 10 wt% and 1-10 wt% Zn was vacuum degassed at 200 ° C. for 1 hour to desorb moisture adhering to the activated carbon. Then, it cooled once to room temperature of 25 degreeC.
- the packed tower After adsorption of trimethylsilane, the packed tower was returned to room temperature (25 ° C.) while purging with nitrogen gas for 2 hours. Thereafter, trimethylsilane containing 62 volppm of methylsilane and 248 volppm of dimethylsilane was passed through the packed tower at 100 sccm under atmospheric pressure, and purification was performed for the purpose of removing these two kinds of impurities.
- the temperature of the packed column during the purification was 33 ° C. in all examples.
- Example 6 The packing in the packed tower in which 30 kg of the same activated carbon as in Example 1 is packed in a tube made of SUS304 having an inner diameter of 158.4 mm ⁇ length of 3350 mm (active carbon packing height: 3000 mm) is vacuum degassed at 200 ° C. for 1 hour. By degassing, water adhering to the activated carbon was desorbed. Then, it cooled once to room temperature of 25 degreeC.
- mixed gas was supplied to the packed tower while supplying trimethylsilane (purity 99.9% or more) at a flow rate of 3 slm and nitrogen gas (purity 99.999% or more) at a flow rate of 10 slm (dilution ratio was approximately 3.3 times).
- trimethylsilane purity 99.9% or more
- nitrogen gas purity 99.999% or more
- the packed tower After stopping the supply, the packed tower was returned to room temperature (25 ° C.) while purging the packed tower with nitrogen gas for 2 hours. Thereafter, 30 kg of trimethylsilane containing 10 volppm of silane and 500 volppm of dimethylsilane was passed through the packed tower at a flow rate of 17 slm, and purification was performed for the purpose of removing these two kinds of impurities.
- the temperature of the packed column during the purification was 31 ° C.
- the gas at the outlet of the packed tower during the purification was analyzed by gas chromatography and a gas chromatograph mass spectrometer.
- concentrations of silane and dimethylsilane were both less than 1 volppm which is the lower limit of quantification.
- the contents of methane and tetramethylsilane were similarly analyzed, but both were less than 1 volppm which is the lower limit of quantification.
- Example 7 After vacuum degassing at 250 ° C. for 1 hour, the packed material in a packed tower in which 62 g of the same activated carbon as in Example 1 (packed length: 300 mm) is packed in a stainless steel tube having an inner diameter of 22.1 mm and a length of 600 mm is used. After returning to room temperature (25 ° C.), a mixed gas obtained by diluting trimethylsilane with nitrogen gas (both purity is 99.999% or more) with a dilution ratio of 0.6 times in a volume ratio is supplied to the packed column at a flow rate of 0.5 slm. Then, the trimethylsilane was adsorbed until the temperature increase due to heat of adsorption could not be confirmed.
- the packed tower After adsorption of trimethylsilane, the packed tower was returned to room temperature (25 ° C.) while purging with nitrogen gas for 2 hours. Thereafter, trimethylsilane containing 62 volppm of methylsilane and 248 volppm of dimethylsilane was passed through the packed column at 100 sccm under atmospheric pressure, and purification was performed for the purpose of removing these two kinds of impurities.
- the temperature of the packed column during the purification was 32 ° C.
- the gas at the outlet of the packed tower at the time of the purification was analyzed by gas chromatography and a gas chromatograph mass spectrometer.
- concentrations of methylsilane and dimethylsilane were both less than 1 volppm which is the lower limit of quantification.
- contents of methane and tetramethylsilane were similarly analyzed, but both were less than 1 volppm which is the lower limit of quantification.
- Example 8 After vacuum degassing at 250 ° C. for 1 hour, the packed material in a packed tower in which 62 g of the same activated carbon as in Example 1 (packed length: 300 mm) is packed in a stainless steel tube having an inner diameter of 22.1 mm and a length of 600 mm is used.
- a mixed gas obtained by diluting trimethylsilane with nitrogen gas (purity: 99.999% or more respectively) at a dilution ratio of 50 times by volume ratio can be confirmed at a flow rate of 0.5 slm. It was made to distribute
- the packed tower After adsorption of trimethylsilane, the packed tower was returned to room temperature (25 ° C.) while purging with nitrogen gas for 2 hours. Thereafter, trimethylsilane containing 62 volppm of methylsilane and 248 volppm of dimethylsilane was passed through the packed column at 100 sccm under atmospheric pressure, and purification was performed for the purpose of removing these two kinds of impurities. The temperature of the packed column during the purification was 29 ° C.
- the gas at the outlet of the packed tower at the time of the purification was analyzed by gas chromatography and a gas chromatograph mass spectrometer.
- concentrations of methylsilane and dimethylsilane were both less than 1 volppm which is the lower limit of quantification.
- contents of methane and tetramethylsilane were similarly analyzed, but both were less than 1 volppm which is the lower limit of quantification.
- Example 1 The same operation as in Example 6 was performed except that the treatment for adsorbing trimethylsilane was not performed. During this time, the temperature of the packed tower rose to a maximum of 380 ° C.
- the gas at the outlet of the packed tower was analyzed by gas chromatography and a gas chromatograph mass spectrometer. As a result, not only dimethylsilane was detected at 500 volppm, but tetramethylsilane was detected at 2000 volppm, and methane was detected at 100 volppm, making the desired purification difficult. This result is considered to be because the disproportionation reaction was remarkably caused by the temperature rise.
- Example 2 The same operation as in Example 7 was performed except that the treatment for adsorbing trimethylsilane was not performed. During this time, the temperature of the packed tower reached a maximum of 267 ° C.
- the gas at the outlet of the packed tower was analyzed by gas chromatography and a gas chromatograph mass spectrometer. As a result, 78 volppm of methylsilane and 280 volppm of dimethylsilane were detected, 410 volppm of tetramethylsilane and 100 volppm of methane were detected, and the desired purification was difficult. This result is considered to be because the disproportionation reaction was remarkably caused by the temperature rise.
- the present invention can be used for the purification of trimethylsilane using activated carbon.
- this is an effective means when the generation of impurities becomes a problem due to the heat of adsorption of trimethylsilane on activated carbon.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Silicon Compounds (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Separation Of Gases By Adsorption (AREA)
Abstract
Description
本工程に使用する活性炭は、酸化銅(II)及び酸化亜鉛を含む、いわゆる添着活性炭であれば、粉末状、粒状、シート状、破砕状、顆粒状、繊維状等のいずれの形状も使用できる。このような活性炭は市販品として入手できる。充填塔形式で使用する場合には、粒状、破砕状、顆粒状等のものが好ましく使用できる。
本工程では、前記(1)の工程で準備した活性炭にトリメチルシランを吸着させる。この吸着に用いるトリメチルシランは、可能な限り高純度であることが望ましく、少なくとも純度95%以上、より好ましくは純度99.9%以上のトリメチルシランを使用することが好ましい。含まれる不純物については、シラン、メチルシラン、ジメチルシランについては含まれていても構わないが、トリメチルクロロシランのような腐食性を持つ物質は、本発明を実施する為の設備に対しダメージを与えるだけでなく、本発明の精製方法により得られるガスを汚染する可能性があるので、その含有量は1vol%未満であることが好ましい。
本工程では、前記(2)の工程を終了した活性炭に、不純物として、シラン、メチルシラン、又はジメチルシランを含有する、精製対象であるトリメチルシランを接触させる。接触方法としては、ガス状で接触させる方法及び液体で接触する方法があるが、拡散係数が大きなガス状で接触させる方法が効率的である。また、バッチ式、流通式のいずれを用いても良いが、効率よく不純物を除去するためには、流通式が好ましく、中でも、多段のものが優れており、より好ましい。
内径158.4mm×長さ3350mm(活性炭充填高さ:3000mm)のSUS304製チューブ内に、添着により酸化亜鉛と酸化銅を含有した活性炭(日本エンバイロケミカルズ株式会社製 粒状白鷺 XRC410:含有量 Cuとして1~10wt%、Znとして1~10wt%)が30kg充填されている充填塔内の充填物を、200℃で1時間真空脱気することにより、該活性炭に付着している水分を脱離した。その後、一度、25℃の室温まで冷却した。
内径158.4mm×長さ3350mm(活性炭充填高さ:3000mm)のSUS304製チューブ内に、実施例1と同じ活性炭が30kg充填されている充填塔内の充填物を、200℃で1時間真空脱気することにより、該活性炭に付着している水分を脱離した。その後、一度、25℃の室温まで冷却した。
内径22.1mm、長さ600mmのステンレス鋼チューブ内に、実施例1と同じ活性炭が62g充填(充填長300mm)されている充填塔内の充填物を、250℃で1時間真空脱気した後室温(25℃)に戻し、該充填塔に、トリメチルシランを窒素ガス(いずれも純度99.999%以上)で希釈倍率を容積比で0.6倍に希釈した混合ガスを、流量0.5slmで、吸着熱による温度上昇が確認できなくなるまで流通させトリメチルシランを吸着させた。
内径22.1mm、長さ600mmのステンレス鋼チューブ内に、実施例1と同じ活性炭が62g充填(充填長300mm)されている充填塔内の充填物を、250℃で1時間真空脱気した後、該充填塔に、トリメチルシランを窒素ガス(それぞれ純度99.999%以上)で希釈倍率を容積比で50倍に希釈した混合ガスを、流量0.5slmで、吸着熱による温度上昇が確認できなくなるまで流通させトリメチルシランを吸着させた。
トリメチルシランを吸着させる処理を実施しない以外は、実施例6と同様の操作を実施した。この間、充填塔の温度は最高で380℃に上昇した。
トリメチルシランを吸着させる処理を実施しない以外は、実施例7と同様の操作を実施した。この間、充填塔の温度は最高で267℃に達した。
Claims (2)
- (1)少なくとも酸化銅(II)及び酸化亜鉛を添着させた活性炭を準備する工程、
(2)トリメチルシランを前記活性炭に吸着させる工程、
(3)シラン、メチルシラン、又はジメチルシランを不純物として含むトリメチルシランを前記(2)の工程を終了した活性炭に接触させ、該不純物を吸着させてトリメチルシランから除去する工程、
からなるトリメチルシランの精製方法。 - (2)の工程において、希釈したトリメチルシランを該活性炭に接触させることにより、トリメチルシランを該活性炭に吸着させることを特徴とする、請求項1に記載のトリメチルシランの精製方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147025932A KR101623827B1 (ko) | 2012-02-21 | 2013-01-16 | 트리메틸실란의 정제 방법 |
CN201380010463.XA CN104136447B (zh) | 2012-02-21 | 2013-01-16 | 三甲基硅烷的纯化方法 |
US14/380,079 US9073953B2 (en) | 2012-02-21 | 2013-01-16 | Method for refining trimethylsilane |
EP13751853.6A EP2818475B1 (en) | 2012-02-21 | 2013-01-16 | Method for refining trimethylsilane |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012034668A JP5861491B2 (ja) | 2012-02-21 | 2012-02-21 | トリメチルシランの精製方法 |
JP2012-034668 | 2012-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013125262A1 true WO2013125262A1 (ja) | 2013-08-29 |
Family
ID=49005456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/050639 WO2013125262A1 (ja) | 2012-02-21 | 2013-01-16 | トリメチルシランの精製方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9073953B2 (ja) |
EP (1) | EP2818475B1 (ja) |
JP (1) | JP5861491B2 (ja) |
KR (1) | KR101623827B1 (ja) |
CN (1) | CN104136447B (ja) |
TW (1) | TWI480284B (ja) |
WO (1) | WO2013125262A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02221110A (ja) | 1985-11-27 | 1990-09-04 | E I Du Pont De Nemours & Co | ケイ素、ゲルマニウム及び錫のハロゲン化物の還元方法 |
JP2002179689A (ja) * | 2000-09-19 | 2002-06-26 | Boc Group Inc:The | メチルシラン類の精製 |
JP2004115388A (ja) | 2002-09-24 | 2004-04-15 | Mitsui Chemicals Inc | 還元剤およびそれを用いたシラン類の製造方法 |
JP2005154336A (ja) | 2003-11-26 | 2005-06-16 | Central Glass Co Ltd | オルガノシランの製造方法 |
JP2006117559A (ja) | 2004-10-20 | 2006-05-11 | Central Glass Co Ltd | トリメチルシランの精製方法 |
JP2006206444A (ja) | 2005-01-25 | 2006-08-10 | Central Glass Co Ltd | トリメチルシランの精製方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101159674B1 (ko) * | 2009-11-16 | 2012-06-25 | 주식회사 케이씨씨 | 모노실란의 정제방법 |
-
2012
- 2012-02-21 JP JP2012034668A patent/JP5861491B2/ja active Active
-
2013
- 2013-01-16 CN CN201380010463.XA patent/CN104136447B/zh active Active
- 2013-01-16 EP EP13751853.6A patent/EP2818475B1/en not_active Not-in-force
- 2013-01-16 KR KR1020147025932A patent/KR101623827B1/ko active IP Right Grant
- 2013-01-16 US US14/380,079 patent/US9073953B2/en active Active
- 2013-01-16 WO PCT/JP2013/050639 patent/WO2013125262A1/ja active Application Filing
- 2013-02-20 TW TW102105882A patent/TWI480284B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02221110A (ja) | 1985-11-27 | 1990-09-04 | E I Du Pont De Nemours & Co | ケイ素、ゲルマニウム及び錫のハロゲン化物の還元方法 |
JP2002179689A (ja) * | 2000-09-19 | 2002-06-26 | Boc Group Inc:The | メチルシラン類の精製 |
JP2004115388A (ja) | 2002-09-24 | 2004-04-15 | Mitsui Chemicals Inc | 還元剤およびそれを用いたシラン類の製造方法 |
JP2005154336A (ja) | 2003-11-26 | 2005-06-16 | Central Glass Co Ltd | オルガノシランの製造方法 |
JP2006117559A (ja) | 2004-10-20 | 2006-05-11 | Central Glass Co Ltd | トリメチルシランの精製方法 |
JP2006206444A (ja) | 2005-01-25 | 2006-08-10 | Central Glass Co Ltd | トリメチルシランの精製方法 |
Non-Patent Citations (2)
Title |
---|
J. AMER. CHEM. SOC., vol. 83, 1961, pages 1916 |
See also references of EP2818475A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN104136447B (zh) | 2016-04-13 |
KR20140123109A (ko) | 2014-10-21 |
CN104136447A (zh) | 2014-11-05 |
TWI480284B (zh) | 2015-04-11 |
EP2818475B1 (en) | 2016-08-31 |
US20150119596A1 (en) | 2015-04-30 |
JP5861491B2 (ja) | 2016-02-16 |
EP2818475A4 (en) | 2015-08-26 |
KR101623827B1 (ko) | 2016-05-24 |
US9073953B2 (en) | 2015-07-07 |
EP2818475A1 (en) | 2014-12-31 |
JP2013170139A (ja) | 2013-09-02 |
TW201339167A (zh) | 2013-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5122700B1 (ja) | モノシランの精製方法 | |
CA1319586C (en) | Recovery of lower-boiling silanes in a cvd process | |
EP1720800B1 (en) | Process for producing silicon | |
US9908781B2 (en) | Process and use of amino-functional resins for dismutating halosilanes and for removing extraneous metals | |
EP3296261B1 (en) | Method for regenerating weakly basic ion-exchange resin | |
WO2015059919A1 (ja) | 多結晶シリコンの製造方法 | |
EP1867604B1 (en) | Method for purification of disilicon hexachloride and high purity disilicon hexachloride | |
CN110606490A (zh) | 一种高纯四氟化硅的合成及纯化方法 | |
TWI568673B (zh) | 三氯矽烷之純化 | |
JP5861491B2 (ja) | トリメチルシランの精製方法 | |
CN112645976B (zh) | 一种利用氯基CVD晶体薄膜生长制程尾气FTrPSA制备甲基氯硅烷类有机硅方法 | |
CN112642259B (zh) | 一种烷烃与硅烷反应的氯基SiC-CVD外延制程尾气FTrPSA回收方法 | |
TWI480228B (zh) | 單矽烷及四烷氧基矽烷的製造方法 | |
JP4437733B2 (ja) | トリメチルシランの精製方法 | |
JP7028604B2 (ja) | ヘキサクロロジシランの製造方法 | |
JP4498152B2 (ja) | トリメチルシランの精製方法 | |
KR20140120507A (ko) | 폴리실란 제조방법 | |
CN108250230B (zh) | 一种二异丙胺硅烷的精制方法 | |
JPH0436090B2 (ja) | ||
RU2129984C1 (ru) | Способ получения моносилана высокой чистоты | |
JPS6270217A (ja) | モノシランの精製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13751853 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20147025932 Country of ref document: KR Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2013751853 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013751853 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14380079 Country of ref document: US |