WO2013114974A1 - 高周波信号伝送線路及び電子機器 - Google Patents
高周波信号伝送線路及び電子機器 Download PDFInfo
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- WO2013114974A1 WO2013114974A1 PCT/JP2013/050934 JP2013050934W WO2013114974A1 WO 2013114974 A1 WO2013114974 A1 WO 2013114974A1 JP 2013050934 W JP2013050934 W JP 2013050934W WO 2013114974 A1 WO2013114974 A1 WO 2013114974A1
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- conductor
- signal line
- axis direction
- frequency signal
- signal transmission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Definitions
- the present invention relates to a high-frequency signal transmission line and an electronic device, and more particularly to a high-frequency signal transmission line and an electronic device in which a signal line is provided on an element body formed by laminating an insulating layer.
- a microstrip flexible substrate connection line described in Patent Document 1 As a conventional high-frequency signal transmission line, for example, a microstrip flexible substrate connection line described in Patent Document 1 is known.
- a microstrip line is formed with a thin flexible dielectric substrate interposed therebetween.
- Such a microstrip flexible substrate connection line is thinner than a coaxial cable. Therefore, it is easy to arrange the microstrip flexible board connection line in a narrow space in the wireless communication terminal.
- the characteristic impedance of the signal line may be deviated from a predetermined characteristic impedance (for example, 50 ⁇ ).
- the coaxial connector receptacle includes a plurality of parts. For this reason, stray capacitance or parasitic inductance tends to occur in the coaxial connector receptacle, and the characteristic impedance of the coaxial connector receptacle tends to deviate from a predetermined characteristic impedance.
- coaxial connector receptacles having various structures may be mounted on the microstrip flexible board connection line. For this reason, the characteristic impedance may be different for each type of coaxial connector receptacle. As described above, when the characteristic impedance of the coaxial connector receptacle deviates from the predetermined characteristic impedance, high-frequency signal reflection occurs in the coaxial connector receptacle.
- the characteristic impedance of the signal line may deviate from the predetermined characteristic impedance for the following reason.
- an external electrode connected to the signal line is provided on the surface of the end portion of the microstrip flexible substrate connection line.
- the microstrip flexible board connection line is connected to the circuit board, the external electrode is connected to the land electrode of the circuit board by solder or the like.
- the conductor shape and the like are different in the vicinity of the external electrode as compared with the signal line formation region, and the characteristic impedance of the external electrode portion may be different from the signal line formation region. As a result, the characteristic impedance of the signal line may deviate from the predetermined characteristic impedance.
- JP-A-9-139610 Japanese Patent No. 3161281
- an object of the present invention is to provide a high-frequency signal transmission line and an electronic device that can suppress a characteristic impedance from deviating from a predetermined characteristic impedance in a connector.
- a high-frequency signal transmission line includes an element body formed by laminating a plurality of insulator layers, a linear signal line provided on the element body, and the insulator layer.
- a first ground conductor facing the signal line via an adjustment conductor, and the element body is electrically connected to the signal line and an external circuit on one main surface.
- the first ground conductor has a connection portion, and the connection portion is not formed with a conductor in at least a part of a region overlapping with the signal line when viewed in plan from the stacking direction.
- the adjustment conductor is provided on the other main surface of the element body, and overlaps at least a part of the non-forming portion when viewed in plan from the stacking direction. To do.
- An electronic apparatus includes a high-frequency signal transmission line and a housing that accommodates the high-frequency signal transmission line, and the high-frequency signal transmission line includes a plurality of laminated insulating layers. And a linear signal line provided on the element body, a first ground conductor facing the signal line via the insulator layer, an adjustment conductor, The element body has a connection portion for electrically connecting the signal line and an external circuit on one main surface, and the connection portion is connected to the first ground conductor.
- the present invention it is possible to obtain a high-frequency signal transmission line and an electronic device that can suppress a characteristic impedance from deviating from a predetermined characteristic impedance in a connector.
- FIG. 1 It is an exploded view of the dielectric element body of the high frequency signal transmission line concerning a 2nd embodiment. It is a cross-section figure of the high frequency signal transmission track concerning a 2nd embodiment. It is the graph which showed the characteristic impedance of the high frequency signal transmission track concerning a 2nd embodiment. It is an exploded view of the dielectric element body of the high frequency signal transmission line concerning a 3rd embodiment. It is an external appearance perspective view of the high frequency signal transmission track concerning the 1st modification. It is an external appearance perspective view of the high frequency signal transmission track concerning the 2nd modification. It is an external appearance perspective view of the high frequency signal transmission track concerning a 4th embodiment. It is an external appearance perspective view of the high frequency signal transmission track concerning a 4th embodiment. FIG.
- FIG. 16 is an exploded perspective view of a dielectric body of the high-frequency signal transmission line in FIG. 15. It is a perspective view of the connection part of a high frequency signal transmission line and a circuit board. It is a cross-section figure of the connection part of a high frequency signal transmission line and a circuit board.
- FIG. 18 is a cross-sectional structure diagram of the high-frequency signal transmission line along AA in FIG. 17.
- FIG. 1 is an external perspective view of a high-frequency signal transmission line 10 according to the first embodiment.
- FIG. 2 is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10 according to the first embodiment.
- FIG. 3 is a cross-sectional structure diagram of the high-frequency signal transmission line 10 according to the first embodiment.
- FIG. 4 is an external perspective view and a cross-sectional structure diagram of the connector 100 b of the high-frequency signal transmission line 10. 1 to 4, the stacking direction of the high-frequency signal transmission line 10 is defined as the z-axis direction.
- the longitudinal direction of the high-frequency signal transmission line 10 is defined as the x-axis direction, and the direction orthogonal to the x-axis direction and the z-axis direction is defined as the y-axis direction.
- the high-frequency signal transmission line 10 is used for connecting two high-frequency circuits in an electronic device such as a mobile phone. As shown in FIGS. 1 to 3, the high-frequency signal transmission line 10 includes a dielectric element body 12, an adjustment plate 15 (15a, 15b) (adjustment conductor), a signal line 20, a terminal portion 23 (23a, 23b), a ground. A conductor 25, via-hole conductors b1 and b2, and connectors 100a and 100b are provided.
- the dielectric body 12 extends in the x-axis direction when viewed in plan from the z-axis direction, and includes a line portion 12a and connection portions 12b and 12c.
- the dielectric body 12 is configured by laminating the protective layer 14 and the dielectric sheets (insulator layers) 18 (18a, 18b) shown in FIG. 2 in this order from the positive direction side to the negative direction side in the z-axis direction. It is a laminated body.
- the main surface on the positive side in the z-axis direction of the dielectric body 12 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric body 12 is referred to as the back surface.
- the line portion 12a extends in the x-axis direction.
- the connecting portions 12b and 12c are respectively connected to the negative end portion in the x-axis direction and the positive end portion in the x-axis direction of the line portion 12a, and have a rectangular shape.
- the widths of the connecting portions 12b and 12c in the y-axis direction are wider than the width of the line portion 12a in the y-axis direction.
- the dielectric sheet 18 extends in the x-axis direction when viewed in plan from the z-axis direction, and has the same shape as the dielectric body 12.
- the dielectric sheet 18 is made of a flexible thermoplastic resin such as polyimide or liquid crystal polymer.
- the thickness of the dielectric sheet 18 after lamination is, for example, 50 to 200 ⁇ m.
- the main surface on the positive side in the z-axis direction of the dielectric sheet 18 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric sheet 18 is referred to as the back surface.
- the dielectric sheet 18a includes a line portion 18a-a and connection portions 18a-b and 18a-c.
- the dielectric sheet 18b includes a line portion 18b-a and connection portions 18b-b and 18b-c.
- the line portions 18a-a and 18b-a constitute the line portion 12a.
- the connecting portions 18a-b and 18b-b constitute the connecting portion 12b.
- the connecting portions 18a-c and 18b-c constitute a connecting portion 12c.
- the signal line 20 is a linear conductor provided in the dielectric body 12, and extends on the surface of the dielectric sheet 18a in the x-axis direction. Both ends of the signal line 20 are located at the centers of the connecting portions 18a-b and 18a-c when viewed in plan from the z-axis direction.
- the signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper. Further, gold plating is applied to both ends of the signal line 20.
- the ground conductor 25 (first ground conductor) is a negative side in the z-axis direction from the signal line 20 in the dielectric body 12 (that is, the dielectric body from the signal line 20). 12, and more specifically, on the surface of the dielectric sheet 18b.
- the ground conductor 25 extends in the x-axis direction along the signal line 20 on the surface of the dielectric sheet 18b, and faces the signal line 20 via the dielectric sheet 18a as shown in FIG. .
- the signal line 20 and the ground conductor 25 form a microstrip line structure.
- the ground conductor 25 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 25 is composed of a main conductor 25a and terminal conductors 25b and 25c.
- the main conductor 25a is provided on the surface of the line portion 18b-a and extends in the x-axis direction.
- the terminal conductor 25b is provided on the surface of the connecting portion 18b-b and forms a rectangular ring surrounding the center of the connecting portion 18b-b.
- the ground conductor 25 is provided with a non-formed portion Oa where no conductor is provided in a region surrounded by the terminal conductor 25b.
- the end portion on the negative direction side in the x-axis direction of the signal line 20 is located in the non-forming portion Oa when viewed in plan from the z-axis direction.
- the terminal conductor 25b is connected to the end of the main conductor 25a on the negative side in the x-axis direction.
- the terminal conductor 25c is provided on the surface of the connecting portion 18b-c and has an annular rectangular shape surrounding the center of the connecting portion 18b-c.
- the ground conductor 25 is provided with a non-formed portion Ob in which no conductor is provided in a region surrounded by the terminal conductor 25c. Accordingly, the end portion on the positive direction side in the x-axis direction of the signal line 20 is located in the non-forming portion Ob when viewed in plan from the z-axis direction.
- the terminal conductor 25c is connected to the end of the main conductor 25a on the positive side in the x-axis direction.
- the terminal conductor 23a is provided on the surface of the connecting portion 18a-b, and has a U-shape surrounding the center of the connecting portion 18a-b (that is, the end of the signal line 20 on the negative side in the x-axis direction). .
- the terminal conductor 23a has a shape opening toward the positive side in the x-axis direction. Further, the terminal conductor 23a overlaps the terminal conductor 25b when seen in a plan view from the z-axis direction.
- the terminal conductor 23b is provided on the surface of the connecting portion 18a-c, and has a U-shape surrounding the center of the connecting portion 18a-c (that is, the end on the positive direction side in the x-axis direction of the signal line 20). .
- the terminal conductor 23b has a shape that opens toward the negative side in the x-axis direction.
- the terminal conductor 23b overlaps the terminal conductor 25c when viewed in plan from the z-axis direction.
- the via-hole conductor b1 passes through the connecting portions 18a-b of the dielectric sheet 18a in the z-axis direction.
- the via-hole conductor b1 connects the terminal conductor 23a and the terminal conductor 25b.
- the via-hole conductor b2 passes through the connection portions 18a-c of the dielectric sheet 18a in the z-axis direction.
- the via-hole conductor b2 connects the terminal conductor 23b and the terminal conductor 25c.
- the protective layer 14 covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the signal line 20 and the terminal conductors 23a and 23b.
- the protective layer 14 is made of a flexible resin such as a resist material, for example.
- the protective layer 14 includes a line portion 14a and connecting portions 14b and 14c.
- the line portion 14a covers the signal line 20 by covering the entire surface of the line portion 18a-a.
- the connecting portion 14b is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-b.
- openings Ha to Hd are provided in the connection portion 14b.
- the opening Ha is a rectangular opening provided substantially at the center of the connection portion 14b.
- An end of the signal line 20 on the negative side in the x-axis direction functions as an external terminal by being exposed to the outside through the opening Ha.
- the opening Hb is a rectangular opening provided on the positive side of the opening Ha in the y-axis direction.
- the opening Hc is a rectangular opening provided on the negative direction side of the opening Ha in the x-axis direction.
- the opening Hd is a rectangular opening provided on the negative direction side of the opening Ha in the y-axis direction.
- the terminal conductor 23a functions as an external terminal by being exposed to the outside through the openings Hb to Hd.
- the connecting portion 14c is connected to the end portion on the positive side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-c.
- openings He to Hh are provided in the connection portion 14c.
- the opening He is a rectangular opening provided substantially at the center of the connection portion 14c.
- the end of the signal line 20 on the positive side in the x-axis direction functions as an external terminal by being exposed to the outside through the opening He.
- the opening Hf is a rectangular opening provided on the positive side of the opening He in the y-axis direction.
- the opening Hg is a rectangular opening provided on the positive direction side of the opening He in the x-axis direction.
- the opening Hh is a rectangular opening provided on the negative side of the opening He in the y-axis direction.
- the terminal conductor 23b functions as an external terminal by being exposed to the outside through the openings Hf to Hh.
- the adjustment plate 15a is provided on the back surface of the connecting portion 12b of the dielectric element body 12 (that is, the back surface of the connecting portion 18b-b of the dielectric sheet 18b), and is not formed when viewed in plan from the z-axis direction. It is a rectangular metal plate that overlaps at least part of the portion Oa. Further, the adjustment plate 15a is not electrically connected to either the signal line 20 or the ground conductor 25, and is kept at a floating potential. More specifically, the adjustment plate 15a overlaps with the entire non-formed portion Oa when viewed in plan from the z-axis direction, and thus overlaps with the end portion of the signal line 20 on the negative direction side in the x-axis direction. Yes.
- a capacitance is formed between the adjusting plate 15a and the end of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15a overlaps the terminal conductor 25b of the ground conductor 25 in a plan view from the z-axis direction by protruding from the non-forming portion Oa. Thus, a capacitance is formed between the adjustment plate 15a and the terminal conductor 25b of the ground conductor 25.
- the adjustment plate 15b is provided on the back surface of the connecting portion 12c of the dielectric body 12 (that is, the back surface of the connecting portion 18b-c of the dielectric sheet 18b), and is not formed when viewed in plan from the z-axis direction. It is a rectangular metal plate that overlaps at least part of the portion Ob. Further, the adjustment plate 15b is not electrically connected to either the signal line 20 or the ground conductor 25, and is kept at a floating potential. More specifically, the adjustment plate 15b overlaps the entire non-forming portion Ob when viewed in plan from the z-axis direction, and thus overlaps the end portion of the signal line 20 on the positive direction side in the x-axis direction. Yes.
- the adjustment plates 15a and 15b are made of, for example, a copper plate or a SUS plate.
- the connectors 100a and 100b are mounted on the surfaces of the connecting portions 12b and 12c, and are electrically connected to the signal line 20 and the ground conductor 25, respectively. Since the configurations of the connectors 100a and 100b are the same, the configuration of the connector 100b will be described below as an example.
- the connector 100b includes a connector main body 102, external terminals 104 and 106, a central conductor 108, and an external conductor 110 as shown in FIGS.
- the connector body 102 has a shape in which a cylinder is connected to a rectangular plate, and is made of an insulating material such as a resin.
- the external terminal 104 is provided at a position facing the end of the signal line 20 on the positive side in the x-axis direction on the surface of the connector body 102 on the negative side in the z-axis direction.
- the external terminal 106 is provided at a position corresponding to the terminal conductor 23b exposed through the openings Hf to Hh on the surface of the connector main body 102 on the negative side in the z-axis direction.
- the center conductor 108 is provided at the center of the cylinder of the connector main body 102 and is connected to the external terminal 104.
- the center conductor 108 is a signal terminal for inputting or outputting a high frequency signal.
- the external conductor 110 is provided on the cylindrical inner peripheral surface of the connector main body 102 and is connected to the external terminal 106.
- the outer conductor 110 is a ground terminal that is maintained at a ground potential.
- the connector 100b configured as described above has the connecting portion 12c such that the external terminal 104 is connected to the end of the signal line 20 on the positive side in the x-axis direction, and the external terminal 106 is connected to the terminal conductor 23b. Mounted on the surface of the. Thereby, the signal line 20 is electrically connected to the central conductor 108. The ground conductor 25 is electrically connected to the external conductor 110.
- the connector 100b overlaps with the non-forming portion Ob provided in the terminal conductor 25c of the ground conductor 25 as shown in FIG. 3 when viewed in plan from the z-axis direction.
- the connector 100b and the non-forming portion Ob do not need to coincide and overlap when viewed in plan from the z-axis direction. Therefore, the non-formation part Ob should just be formed by not providing a conductor in at least one part of the area
- the connector 100b protrudes from the non-forming portion Ob when viewed in plan from the z-axis direction.
- FIG. 5 is a plan view of the electronic device 200 using the high-frequency signal transmission line 10 from the y-axis direction and the z-axis direction.
- the electronic device 200 includes the high-frequency signal transmission line 10, circuit boards 202 a and 202 b, receptacles 204 a and 204 b, a battery pack (metal body) 206, and a casing 210.
- the housing 210 accommodates the high-frequency signal transmission line 10, circuit boards 202 a and 202 b, receptacles 204 a and 204 b, and a battery pack (metal body) 206.
- the circuit board 202a is provided with, for example, a transmission circuit or a reception circuit including an antenna.
- a power supply circuit is provided on the circuit board 202b.
- the battery pack 206 is a lithium ion secondary battery, for example, and has a structure in which the surface is covered with a metal cover.
- the circuit board 202a, the battery pack 206, and the circuit board 202b are arranged in this order from the negative direction side to the positive direction side in the x-axis direction.
- the receptacles 204a and 204b are provided on the main surfaces of the circuit boards 202a and 202b on the negative side in the z-axis direction, respectively.
- Connectors 100a and 100b are connected to receptacles 204a and 204b, respectively. That is, the signal line 20 and the circuit board 202a are electrically connected through the surface of the connection part 12b.
- the signal line 20 and the circuit board 202b are electrically connected via the surface of the connection part 12c. Accordingly, a high frequency signal having a frequency of, for example, 2 GHz transmitted between the circuit boards 202a and 202b is applied to the central conductor 108 of the connectors 100a and 100b via the receptacles 204a and 204b.
- the external conductor 110 of the connectors 100a and 100b is kept at the ground potential via the circuit boards 202a and 202b and the receptacles 204a and 204b.
- the high-frequency signal transmission line 10 electrically connects the circuit boards 202a and 202b.
- the surface of the dielectric body 12 (more precisely, the protective layer 14) is in contact with the battery pack 206.
- the surface of the dielectric body 12 and the battery pack 206 are fixed with an adhesive or the like.
- a dielectric sheet 18 made of a thermoplastic resin having a copper foil formed on the entire surface is prepared.
- the surface of the copper foil of the dielectric sheet 18 is smoothed by applying, for example, zinc plating for rust prevention.
- the thickness of the copper foil is 10 ⁇ m to 20 ⁇ m.
- the signal line 20 and the terminal conductors 23a and 23b shown in FIG. 2 are formed on the surface of the dielectric sheet 18a by a photolithography process. Specifically, a resist having the same shape as the signal line 20 and the terminal conductors 23a and 23b shown in FIG. 2 is printed on the copper foil of the dielectric sheet 18a. And the copper foil of the part which is not covered with the resist is removed by performing an etching process with respect to copper foil. Thereafter, the resist is removed. Thereby, the signal line 20 and the terminal conductors 23a and 23b as shown in FIG. 2 are formed on the surface of the dielectric sheet 18a.
- the ground conductor 25 shown in FIG. 2 is formed on the surface of the dielectric sheet 18b by a photolithography process.
- the photolithography process here is the same as the photolithography process in forming the signal line 20 and the terminal conductors 23a and 23b, and thus the description thereof is omitted.
- a laser beam is irradiated from the back side to the position where the via hole conductors b1 and b2 of the dielectric sheet 18a are formed to form a through hole. Thereafter, the through-hole formed in the dielectric sheet 18a is filled with a conductive paste.
- the dielectric sheets 18a and 18b are stacked in this order from the positive direction side in the z-axis direction to the negative direction side. Then, by applying heat and pressure to the dielectric sheets 18a and 18b from the positive side and the negative side in the z-axis direction, the dielectric sheets 18a and 18b are softened to be crimped and integrated, and through holes The conductive paste filled in is solidified to form via-hole conductors b1 and b2 shown in FIG.
- Each dielectric sheet 18 may be integrated using an adhesive such as an epoxy resin instead of thermocompression bonding.
- the via-hole conductors b1 and b2 may be formed by forming a through hole after the dielectric sheet 18 is integrated, and filling the through hole with a conductive paste or forming a plating film.
- the via-hole conductors b1 and b2 do not necessarily have to completely fill the through hole with the conductor.
- the via hole conductors b1 and b2 may be formed by forming the conductor along only the inner peripheral surface of the through hole.
- a protective layer 14 is formed on the dielectric sheet 18a by applying a resin (resist) paste.
- adjustment plates 15a and 15b are attached to the back surfaces of the connecting portions 12b and 12c with an adhesive or the like. Thereby, the high frequency signal transmission line 10 shown in FIG. 1 is obtained.
- FIG. 6 is a graph showing the characteristic impedance of the high-frequency signal transmission line 10 according to the first embodiment.
- the vertical axis represents characteristic impedance
- the horizontal axis represents the x-axis.
- 6 indicates the characteristic impedance of the high-frequency signal transmission line 10
- the dotted line in FIG. 6 indicates the characteristic impedance of the high-frequency signal transmission line according to the comparative example. Adjustment plates 15a and 15b are not provided in the high-frequency signal transmission line according to the comparative example.
- FIG. 7 is an equivalent circuit diagram of the high-frequency signal transmission line 10.
- FIG. 8 is a cross-sectional structure diagram of the high-frequency signal transmission line 10.
- the characteristic impedance of the connectors 100a and 100b is a predetermined characteristic impedance (see FIG. 6). 50 ⁇ ).
- the connectors 100a and 100b are designed such that the characteristic impedance of the connectors 100a and 100b is slightly higher than a predetermined characteristic impedance.
- the adjustment plates 15a and 15b are respectively provided on the back surface of the dielectric body 12, and overlap with at least a part of the non-formed portions Oa and Ob when viewed in plan from the z-axis direction. ing. Accordingly, as shown in FIGS. 7 and 8, a capacitor C ⁇ b> 2 is formed between the adjustment plates 15 a and 15 b and the end of the signal line 20. Further, a capacitor C3 is formed between the adjustment plates 15a and 15b and the terminal conductors 25b and 25c of the ground conductor 25. That is, the capacitors C2 and C3 are connected in series between the signal line 20 and the ground conductor 25.
- the capacitors C2 and C3 are connected in series, the combined capacitance Ct of the capacitors C2 and C3 becomes a minute value. Therefore, it is possible to slightly reduce the characteristic impedance of the connectors 100a and 100b by forming a small composite capacitance Ct in the connectors 100a and 100b. That is, the characteristic impedance of the connectors 100a and 100b can be finely adjusted. As described above, in the high-frequency signal transmission line 10, by providing the non-forming portions Oa and Ob and the adjustment plates 15a and 15b, the characteristic impedances of the connectors 100a and 100b can be matched with the predetermined characteristic impedance with high accuracy.
- connection parts 12b and 12c may be greatly deformed and damaged. Therefore, in the high-frequency signal transmission line 10, adjustment plates 15 a and 15 b that are harder than the dielectric body 12 are provided in the connection portions 12 b and 12 c. Thereby, it is suppressed that the connection parts 12b and 12c deform
- FIG. 9 is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10a according to the second embodiment.
- FIG. 10 is a cross-sectional structure diagram of the high-frequency signal transmission line 10a according to the second embodiment.
- FIG. 1 is used for an external perspective view of the high-frequency signal transmission line 10a.
- the high-frequency signal transmission line 10a includes a dielectric body 12, external terminals 16 (16a, 16b), connection conductors 17 (17a, 17b), signal lines 20, and ground conductors 22, 24. , Via-hole conductors b11 to b14, B1 to B6 and connectors 100a and 100b.
- the dielectric body 12 extends in the x-axis direction when viewed in plan from the z-axis direction, and includes a line portion 12a and connection portions 12b and 12c.
- the dielectric body 12 is formed by laminating the protective layer 14 and the dielectric sheets (insulator layers) 18 (18a to 18d) shown in FIG. 2 in this order from the positive side in the z-axis direction to the negative side. It is a laminated body.
- the main surface on the positive side in the z-axis direction of the dielectric body 12 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric body 12 is referred to as the back surface.
- the line portion 12a extends in the x-axis direction.
- the connecting portions 12b and 12c are respectively connected to the negative end portion in the x-axis direction and the positive end portion in the x-axis direction of the line portion 12a, and have a rectangular shape.
- the widths of the connecting portions 12b and 12c in the y-axis direction are wider than the width of the line portion 12a in the y-axis direction.
- the dielectric sheet 18 extends in the x-axis direction when viewed in plan from the z-axis direction, and has the same shape as the dielectric body 12.
- the dielectric sheet 18 is made of a flexible thermoplastic resin such as polyimide or liquid crystal polymer.
- the thickness of the dielectric sheet 18 after lamination is, for example, 50 to 200 ⁇ m.
- the main surface on the positive side in the z-axis direction of the dielectric sheet 18 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric sheet 18 is referred to as the back surface.
- the dielectric sheet 18a includes a line portion 18a-a and connection portions 18a-b and 18a-c.
- the dielectric sheet 18b includes a line portion 18b-a and connection portions 18b-b and 18b-c.
- the dielectric sheet 18c includes a line portion 18c-a and connection portions 18c-b and 18c-c.
- the dielectric sheet 18d includes a line portion 18d-a and connection portions 18d-b and 18d-c.
- the line portions 18a-a, 18b-a, 18c-a, and 18d-a constitute the line portion 12a.
- the connecting portions 18a-b, 18b-b, 18c-b, and 18d-b constitute the connecting portion 12b.
- the connecting portions 18a-c, 18b-c, 18c-c, and 18d-c constitute the connecting portion 12c.
- the external terminal 16a is a rectangular conductor provided near the center of the surface of the connecting portion 18a-b, as shown in FIGS.
- the external terminal 16b is a rectangular conductor provided near the center of the surface of the connection portion 18a-c.
- the external terminals 16a and 16b are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the surfaces of the external terminals 16a and 16b are gold plated.
- connection conductor 17a is a rectangular conductor provided near the center of the surface of the connection portion 18b-b. When viewed in plan from the z-axis direction, the external conductor 16a It overlaps with.
- the connecting conductor 17b is a rectangular conductor provided near the center of the surface of the connecting portion 18b-c. When viewed in plan from the z-axis direction, the connecting terminal 17b It overlaps with.
- the connection conductors 17a and 17b are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the signal line 20 is a linear conductor provided in the dielectric body 12 and extends on the surface of the dielectric sheet 18 c in the x-axis direction. Both ends of the signal line 20 overlap the external terminals 16a and 16b and the connection conductors 17a and 17b, respectively, when viewed in plan from the z-axis direction.
- the signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 22 (second ground conductor) is in the positive direction side in the z-axis direction of the signal line 20 in the dielectric element body 12 (that is, the surface side of the dielectric element body 12). More specifically, it is provided on the surface of the dielectric sheet 18a.
- the ground conductor 22 extends in the x-axis direction along the signal line 20 on the surface of the dielectric sheet 18a, and faces the signal line 20 via the dielectric sheets 18a and 18b as shown in FIG. ing.
- the ground conductor 22 is composed of a main conductor 22a and terminal conductors 22b and 22c.
- the main conductor 22a is provided on the surface of the line portion 18a-a and extends in the x-axis direction.
- the main conductor 22a is substantially not provided with an opening. That is, the main conductor 22a is an electrode that extends continuously in the x-axis direction along the signal line 20 in the line portion 12a, a so-called solid electrode. However, the main conductor 22a does not need to completely cover the line portion 12a.
- a predetermined position of the main conductor 22a is used to release gas generated when the thermoplastic resin of the dielectric sheet 18 is thermocompression bonded. May be provided with a minute hole or the like.
- the main conductor 22a is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the terminal conductor 22b is provided on the surface of the line portion 18a-b and forms a rectangular ring surrounding the periphery of the external terminal 16a.
- the terminal conductor 22b is connected to the end of the main conductor 22a on the negative direction side in the x-axis direction.
- the terminal conductor 22c is provided on the surface of the line portion 18a-c and has an annular rectangular shape surrounding the periphery of the external terminal 16b.
- the terminal conductor 22c is connected to the end of the main conductor 22a on the positive direction side in the x-axis direction.
- the characteristic impedance of the high-frequency signal transmission line 10a is determined mainly based on the opposing area and distance between the signal line 20 and the ground conductor 22 and the relative dielectric constant of the dielectric sheets 18a to 18d. Therefore, when the characteristic impedance of the high-frequency signal transmission line 10a is set to 50 ⁇ , for example, the characteristic impedance of the high-frequency signal transmission line 10a is designed to be 55 ⁇ which is slightly higher than 50 ⁇ by the signal line 20 and the ground conductor 22. To do. Then, the shape of the ground conductor 24 described later is adjusted so that the characteristic impedance of the high-frequency signal transmission line 10a is 50 ⁇ by the signal line 20, the ground conductor 22, and the ground conductor 24 described later. As described above, the ground conductor 22 serves as a reference ground conductor.
- the ground conductor 24 (first ground conductor) is in the negative direction side in the z-axis direction of the signal line 20 in the dielectric element body 12 (that is, the back surface side of the dielectric element body 12). More specifically, it is provided on the surface of the dielectric sheet 18d.
- the ground conductor 24 extends in the x-axis direction along the signal line 20 on the surface of the dielectric sheet 18d, and faces the signal line 20 via the dielectric sheet 18c, as shown in FIG. .
- the ground conductor 24 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 24 is composed of a line conductor 24a and terminal conductors 24b and 24c.
- the line conductor 24a is provided on the surface of the line portion 18d-a and extends in the x-axis direction.
- the line conductor 24a is provided with a plurality of openings 30 in which no conductor layer is formed and a plurality of bridge portions 60 in which the conductor layer is formed alternately along the signal line 20, thereby providing a ladder. It has a shape.
- the opening 30 has an elliptical shape having a longitudinal direction in the x-axis direction when viewed in plan from the z-axis direction, and overlaps the signal line 20. Thereby, the signal line 20 overlaps with the openings 30 and the bridge portions 60 alternately when viewed in plan from the z-axis direction.
- the openings 30 are arranged at equal intervals.
- the terminal conductor 24b is provided on the surface of the connecting portion 18d-b and forms a rectangular ring surrounding the center of the connecting portion 18d-b.
- the ground conductor 24 is provided with a non-formed portion Oa where no conductor is provided in a region surrounded by the terminal conductor 24b.
- the end portion on the negative direction side in the x-axis direction of the signal line 20 is located in the non-forming portion Oa when viewed in plan from the z-axis direction.
- the terminal conductor 24b is connected to the end of the line conductor 24a on the negative direction side in the x-axis direction.
- the terminal conductor 24c is provided on the surface of the connecting portion 18d-c and forms a rectangular ring surrounding the center of the connecting portion 18d-c.
- the ground conductor 24 is provided with a non-formed portion Ob in which no conductor is provided in a region surrounded by the terminal conductor 24c.
- the end of the signal line 20 on the positive direction side in the x-axis direction is located in the non-forming portion Ob when viewed in plan from the z-axis direction.
- the terminal conductor 24c is connected to the end of the line conductor 24a on the positive side in the x-axis direction.
- the ground conductor 24 is an auxiliary ground conductor that also functions as a shield.
- the ground conductor 24 is designed for final adjustment so that the characteristic impedance of the high-frequency signal transmission line 10a is 50 ⁇ as described above. Specifically, the size of the opening 30 and the line width of the bridge portion 60 are designed.
- the ground conductor 22 is not provided with an opening, and the ground conductor 24 is provided with an opening 30. Therefore, the area where the ground conductor 24 and the signal line 20 face each other is smaller than the area where the ground conductor 22 and the signal line 20 face each other.
- a region where the opening 30 is provided is referred to as a region A1
- a region where the bridge portion 60 is provided is referred to as a region A2. That is, the signal line 20 overlaps the opening 30 in the region A1, and the signal line 20 overlaps the bridge portion 60 and does not overlap the opening 30 in the region A2.
- the areas A1 and A2 are alternately arranged in the x-axis direction.
- the line width Wa of the signal line 20 in the region A1 is larger than the line width Wb of the signal line 20 in the region A2.
- the line width Wa can be increased to reduce the high-frequency resistance value of the signal line.
- the line width Wb is set smaller than the region A1 in order to suppress a decrease in the high-frequency resistance value.
- the via-hole conductor b11 penetrates the connecting portion 18a-b of the dielectric sheet 18a in the z-axis direction, and connects the external terminal 16a and the connecting conductor 17a.
- the via-hole conductor b13 passes through the connection portion 18b-b of the dielectric sheet 18b in the z-axis direction, and connects the connection conductor 17a and the end portion on the negative direction side of the signal line 20 in the x-axis direction. As a result, the end of the signal line 20 on the negative side in the x-axis direction is connected to the external terminal 16a.
- the via-hole conductor b12 penetrates the connecting portion 18a-c of the dielectric sheet 18a in the z-axis direction, and connects the external terminal 16b and the connecting conductor 17b.
- the via-hole conductor b14 passes through the connecting portion 18b-c of the dielectric sheet 18b in the z-axis direction, and connects the connecting conductor 17b and the end of the signal line 20 on the positive side in the x-axis direction. As a result, the end of the signal line 20 on the positive direction side in the x-axis direction is connected to the external terminal 16b.
- the via-hole conductors b11 to b14 are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the plurality of via-hole conductors B1 to B3 respectively penetrate the line portions 18a-a, 18b-a, 18c-a of the dielectric sheets 18a, 18b, 18c in the z-axis direction, and the line portions 18a-a, 18b- a, 18c-a are arranged in a line at equal intervals.
- the via-hole conductors B1 to B3 are provided on the positive direction side in the y-axis direction with respect to the signal line 20 when viewed in plan from the z-axis direction.
- the via-hole conductors B1 to B3 are connected to each other to form one via-hole conductor, and connect the ground conductor 22 and the ground conductor 24.
- the via-hole conductors B1 to B3 are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the plurality of via-hole conductors B4 to B6 respectively penetrate the line portions 18a-a, 18b-a, 18c-a of the dielectric sheets 18a, 18b, 18c in the z-axis direction, and the line portions 18a-a, 18b- a, 18c-a are arranged in a line at equal intervals.
- the via-hole conductors B4 to B6 are provided closer to the negative direction side in the y-axis direction than the signal line 20 when viewed in plan from the z-axis direction.
- the via-hole conductors B4 to B6 constitute one via-hole conductor by being connected to each other, and connect the ground conductor 22 and the ground conductor 24.
- the via-hole conductors B4 to B6 are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the signal line 20 and the ground conductors 22 and 24 have a triplate type stripline structure.
- the distance between the signal line 20 and the ground conductor 22 is substantially equal to the total thickness T1 of the dielectric sheets 18a and 18b as shown in FIG. 10, and is, for example, 50 ⁇ m to 300 ⁇ m. In the present embodiment, the distance between the signal line 20 and the ground conductor 22 is 150 ⁇ m.
- the distance between the signal line 20 and the ground conductor 24 is substantially equal to the thickness T2 of the dielectric sheet 18c as shown in FIG. 10, and is, for example, 10 ⁇ m to 100 ⁇ m. In the present embodiment, the distance between the signal line 20 and the ground conductor 24 is 50 ⁇ m. That is, the thickness T1 is designed to be larger than the thickness T2.
- the protective layer 14 covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the ground conductor 22.
- the protective layer 14 is made of a flexible resin such as a resist material, for example.
- the protective layer 14 includes a line portion 14a and connecting portions 14b and 14c.
- the line portion 14a covers the main conductor 22a by covering the entire surface of the line portion 18a-a.
- the connecting portion 14b is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-b.
- openings Ha to Hd are provided in the connection portion 14b.
- the opening Ha is a rectangular opening provided substantially at the center of the connection portion 14b.
- the external terminal 16a is exposed to the outside through the opening Ha.
- the opening Hb is a rectangular opening provided on the positive side of the opening Ha in the y-axis direction.
- the opening Hc is a rectangular opening provided on the negative direction side of the opening Ha in the x-axis direction.
- the opening Hd is a rectangular opening provided on the negative direction side of the opening Ha in the y-axis direction.
- the terminal conductor 22b functions as an external terminal by being exposed to the outside through the openings Hb to Hd.
- the connecting portion 14c is connected to the end portion on the positive side in the x-axis direction of the line portion 14a and covers the surface of the connecting portion 18a-c.
- openings He to Hh are provided in the connection portion 14c.
- the opening He is a rectangular opening provided substantially at the center of the connection portion 14c.
- the external terminal 16b is exposed to the outside through the opening He.
- the opening Hf is a rectangular opening provided on the positive side of the opening He in the y-axis direction.
- the opening Hg is a rectangular opening provided on the positive direction side of the opening He in the x-axis direction.
- the opening Hh is a rectangular opening provided on the negative side of the opening He in the y-axis direction.
- the terminal conductor 22c functions as an external terminal by being exposed to the outside through the openings Hf to Hh.
- the adjustment plate 15a is provided on the back surface of the connection portion 12b of the dielectric body 12, and is a rectangular metal plate that overlaps at least a part of the non-forming portion Oa when viewed in plan from the z-axis direction. is there. Further, the adjustment plate 15 a is not electrically connected to either the signal line 20 or the ground conductors 22 and 24. More specifically, the adjustment plate 15a overlaps with the entire non-formed portion Oa when viewed in plan from the z-axis direction, and thus overlaps with the end portion of the signal line 20 on the negative direction side in the x-axis direction. Yes.
- a capacitance is formed between the adjusting plate 15a and the end of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15a overlaps the terminal conductor 24b of the ground conductor 24 by protruding from the non-forming portion Oa. Thus, a capacitance is formed between the adjustment plate 15a and the terminal conductor 24b of the ground conductor 24.
- the adjustment plate 15b is provided on the back surface of the connection portion 12c of the dielectric body 12, and is a rectangular metal plate that overlaps at least a portion of the non-forming portion Ob when viewed in plan from the z-axis direction. is there. Further, the adjustment plate 15 b is not electrically connected to either the signal line 20 or the ground conductors 22 and 24. More specifically, the adjustment plate 15b overlaps the entire non-forming portion Ob when viewed in plan from the z-axis direction, and thus overlaps the end portion of the signal line 20 on the positive direction side in the x-axis direction. Yes. Thereby, a capacitance is formed between the adjustment plate 15b and the end of the signal line 20 on the positive side in the x-axis direction.
- the adjustment plate 15b overlaps the terminal conductor 24c of the ground conductor 24 by protruding from the non-forming portion Ob. Thereby, a capacitance is formed between the adjustment plate 15 b and the terminal conductor 24 c of the ground conductor 24.
- FIG. 11 is a graph showing the characteristic impedance of the high-frequency signal transmission line 10a according to the second embodiment.
- the vertical axis represents characteristic impedance
- the horizontal axis represents the x-axis.
- the solid line in FIG. 11 indicates the characteristic impedance of the high-frequency signal transmission line 10a
- the dotted line in FIG. 11 indicates the characteristic impedance of the high-frequency signal transmission line according to the comparative example.
- Adjustment plates 15a and 15b are not provided in the high-frequency signal transmission line according to the comparative example.
- the connectors 100a and 100b are designed so that the characteristic impedance of the connectors 100a and 100b is slightly higher than the predetermined characteristic impedance.
- the characteristic impedances of the connectors 100a and 100b are slightly lowered by providing the non-forming portions Oa and Ob and the adjusting plates 15a and 15b.
- the characteristic impedances of the connectors 100a and 100b can be matched with the predetermined characteristic impedance with high accuracy.
- the characteristic impedance of the signal line 20 in the region A1 is higher than the characteristic impedance of the signal line in the region A2. More specifically, as will be described below, the characteristic impedance of the signal line 20 increases from the minimum value Z2 as the bridge portion 60 approaches the other bridge portion 60 between two adjacent bridge portions 60. After increasing to the maximum value Z1, it fluctuates so as to decrease from the maximum value Z1 to the minimum value Z2.
- the width of the opening 30 in the y-axis direction is maximum at the center of the region A1 in the x-axis direction, and decreases as it approaches both ends of the region A1 in the x-axis direction.
- the distance between the signal line 20 and the ground conductor 24 in the region A1 is maximum at the center in the x-axis direction of the region A1, and decreases as it approaches both ends of the region A1 in the x-axis direction.
- the strength of the magnetic field generated in the signal line 20 at the center of the region A1 in the x-axis direction is larger than the strength of the magnetic field generated in the signal line 20 at both ends of the region A1 in the x-axis direction. That is, the inductance component at the center in the x-axis direction of the region A1 increases. That is, the L property is dominant at the center in the x-axis direction of the region A1.
- the bridge portion 60 is provided in the region A2. Therefore, the distance between the signal line 20 and the ground conductor 24 in the region A2 is smaller than the distance between the signal line 20 and the ground conductor 24 in the region A1. Thereby, in addition to the capacitance generated in the signal line 20 in the region A2 being larger than the capacitance generated in the signal line 20 in the region A1, the magnetic field strength in the region A2 is smaller than the magnetic field strength in the region A1. That is, the C property is dominant in the region A2.
- the maximum value Z1 is mainly generated by the inductance of the signal line 20.
- the minimum value Z2 is mainly generated by the capacitance.
- the maximum value Z1 is, for example, 70 ⁇ .
- the minimum value Z2 is 30 ⁇ , for example.
- the characteristic impedance of the signal line 20 in the region A1 and the characteristic impedance in the region A2 are designed so that the characteristic impedance of the entire signal line 20 becomes a predetermined characteristic impedance (for example, 50 ⁇ ).
- the high-frequency signal transmission line 10a it is possible to reduce the transmission loss accompanying the stabilization of the ground potential in the ground conductor 24 and further improve the shielding characteristics. More specifically, in the high-frequency signal transmission line 10a, the width of the opening 30 at the center in the x-axis direction of the region A1 is wider than the width of the opening 30 at both ends of the region A1 in the x-axis direction. Thereby, in the high frequency signal transmission line 10a, the magnetic field energy of the signal line 20 located in the center of the region A1 in the x-axis direction is the magnetic field energy of the signal line 20 located at both ends of the region A1 in the x-axis direction. Higher than.
- the magnetic field energy of the signal line 20 located in the region A2 is lower than the magnetic field energy of the signal line 20 located at both ends of the region A1 in the x-axis direction. Therefore, the characteristic impedance of the signal line 20 is repeatedly changed in the order of Z2, Z1, Z2,... As shown in FIG. Therefore, in the signal line 20, the fluctuation of the magnetic field energy in the portion adjacent in the x-axis direction becomes moderate. As a result, the magnetic field energy is reduced at the boundary between the regions A1 and A2, fluctuations in the ground potential of the ground conductor are suppressed, generation of unnecessary radiation, and transmission loss of high-frequency signals are suppressed.
- the solid ground conductor 22 is disposed on the battery pack 206 side of the signal line 20 when the high-frequency signal transmission line 10a is disposed in an electronic apparatus such as the electronic apparatus 200 illustrated in FIG.
- the electric interference from the battery pack 206 side to the signal line 20 can be suppressed. Therefore, a high-frequency signal transmission line with little transmission loss can be obtained even when metal members such as the battery pack 206 are close to each other.
- FIG. 12 is an exploded view of the dielectric body 12 of the high-frequency signal transmission line 10b according to the third embodiment.
- FIG. 1 is used for the external perspective view of the high-frequency signal transmission line 10b.
- the high-frequency signal transmission line 10b is different from the high-frequency signal transmission line 10a mainly in that the ground conductor 24 is not provided. Hereinafter, the difference will be described in detail.
- the external terminal 16a is a rectangular conductor provided near the center of the surface of the connecting portion 18a-b as shown in FIGS. As shown in FIGS. 1 and 12, the external terminal 16b is a rectangular conductor provided near the center of the surface of the connecting portion 18a-c.
- the external terminals 16a and 16b are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the surfaces of the external terminals 16a and 16b are gold plated.
- the signal line 20 is a linear conductor provided in the dielectric element body 12, and extends on the surface of the dielectric sheet 18b in the x-axis direction.
- the line width of the signal line 20 is constant. Both ends of the signal line 20 overlap the external terminals 16a and 16b when viewed in plan from the z-axis direction.
- the signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the via-hole conductor b11 passes through the connection portion 18a-b of the dielectric sheet 18a in the z-axis direction, and connects the external terminal 16a and the end portion of the signal line 20 on the negative direction side in the x-axis direction.
- the via-hole conductor b12 passes through the connection portion 18a-c of the dielectric sheet 18a in the z-axis direction, and connects the external terminal 16b and the end of the signal line 20 on the positive side in the x-axis direction.
- the via-hole conductors b11 and b12 are made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 22 (first ground conductor) is in the positive direction side in the z-axis direction of the signal line 20 in the dielectric element body 12 (that is, the surface side of the dielectric element body 12). More specifically, it is provided on the surface of the dielectric sheet 18a.
- the ground conductor 22 extends in the x-axis direction along the signal line 20 on the surface of the dielectric sheet 18a, and faces the signal line 20 via the dielectric sheets 18a and 18b as shown in FIG. ing.
- the ground conductor 22 is composed of a main conductor 22a and terminal conductors 22b and 22c.
- the main conductor 22a is provided on the surface of the line portion 18a-a and extends in the x-axis direction.
- the main conductor 22a is substantially not provided with an opening. That is, the main conductor 22a is an electrode that extends continuously in the x-axis direction along the signal line 20 in the line portion 12a, a so-called solid electrode. However, the main conductor 22a does not need to completely cover the line portion 12a.
- a predetermined position of the main conductor 22a is used to release gas generated when the thermoplastic resin of the dielectric sheet 18 is thermocompression bonded. May be provided with a minute hole or the like.
- the main conductor 22a is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the terminal conductor 22b is provided on the surface of the line portion 18a-b and forms a rectangular ring surrounding the periphery of the external terminal 16a.
- the ground conductor 22 is provided with a non-formed portion Oa in which no conductor is provided in a region surrounded by the terminal conductor 22b.
- the end portions on the negative direction side in the x-axis direction of the external terminal 16a and the signal line 20 are located in the non-forming portion Oa when viewed in plan from the z-axis direction.
- the terminal conductor 22b is connected to the end of the main conductor 22a on the negative direction side in the x-axis direction.
- the terminal conductor 22c is provided on the surface of the line portion 18a-c and has an annular rectangular shape surrounding the periphery of the external terminal 16b.
- the ground conductor 22 is provided with a non-formed portion Ob where no conductor is provided in a region surrounded by the terminal conductor 22c.
- the ends on the positive side in the x-axis direction of the external terminal 16b and the signal line 20 are located in the non-forming portion Ob when viewed in plan from the z-axis direction.
- the terminal conductor 22c is connected to the end of the main conductor 22a on the positive direction side in the x-axis direction.
- the protective layer 14 and the adjustment plates 15a and 15b of the high-frequency signal transmission line 10b are the same as the protective layer 14 and the adjustment plates 15a and 15b of the high-frequency signal transmission line 10a, description thereof is omitted.
- the high-frequency signal transmission lines 10 and 10a are not formed on the ground conductors 24 and 25 provided on the negative side in the z-axis direction (that is, the back surface side of the dielectric body 12) with respect to the signal line 20. Portions Oa and Ob are provided.
- the high-frequency signal transmission line 10b as shown in FIG. 12, there are no ground conductors 24 and 25 provided with non-formed portions Oa and Ob.
- the non-forming portions Oa and Ob are provided on the ground conductor 22 provided on the positive side in the z-axis direction (that is, the surface side of the dielectric body 12) with respect to the signal line 20. Is provided.
- the ground conductors 22, 24, and 25 in which the non-formed portions Oa and Ob are formed may be provided on the positive direction side in the z-axis direction from the signal line 20, or in the z-axis direction from the signal line 20. It may be provided on the negative direction side.
- the adjustment plates 15a and 15b are respectively provided on the back surface of the dielectric body 12, and when viewed in plan from the z-axis direction, at least one of the non-forming portions Oa and Ob. It overlaps with the department. As a result, a capacitor C ⁇ b> 2 is formed between the adjustment plates 15 a and 15 b and the end of the signal line 20.
- capacitor C3 is formed between the adjustment plates 15a and 15b and the terminal conductors 22b and 22c of the ground conductor 22. That is, between the signal line 20 and the ground conductor 22, capacitors C2 and C3 are connected in series as shown in FIG.
- the capacitors C2 and C3 are connected in series, the combined capacitance Ct of the capacitors C2 and C3 becomes a minute value. Therefore, it is possible to slightly reduce the characteristic impedance of the connectors 100a and 100b by forming a small composite capacitance Ct in the connectors 100a and 100b. That is, the characteristic impedance of the connectors 100a and 100b can be finely adjusted. As described above, in the high-frequency signal transmission line 10b, by providing the non-forming portions Oa and Ob and the adjustment plates 15a and 15b, the characteristic impedances of the connectors 100a and 100b can be matched with the predetermined characteristic impedance with high accuracy.
- connection parts 12b and 12c are prevented from being greatly deformed, and the connection parts 12b and 12c are prevented from being damaged.
- the solid ground conductor 22 is disposed on the battery pack 206 side of the signal line 20 when the high-frequency signal transmission line 10b is disposed in the electronic apparatus such as the electronic apparatus 200 illustrated in FIG.
- the electric interference from the battery pack 206 side to the signal line 20 can be suppressed. Therefore, a high-frequency signal transmission line with little transmission loss can be obtained even when metal members such as the battery pack 206 are close to each other.
- FIG. 13 is an external perspective view of the high-frequency signal transmission line 10c according to the first modification.
- the internal configuration of the high-frequency signal transmission line 10c may be the same as the internal configuration of any of the high-frequency signal transmission lines 10 and 10a.
- a difference between the high-frequency signal transmission line 10c and the high-frequency signal transmission lines 10 and 10a is a method of attaching the adjusting plates 15a and 15b. More specifically, in the high-frequency signal transmission lines 10 and 10a, the adjustment plates 15a and 15b are attached to the dielectric body 12 with an adhesive.
- the adhesive is generally a relatively thin layer.
- the adjustment plates 15a and 15b are attached to the dielectric body 12 with relatively thick adhesive sheets 40a and 40b (adhesive). Therefore, by adjusting the thickness of the adhesive sheets 40a and 40b, the size of the capacitance between the adjustment plates 15a and 15b and the signal line 20, and between the adjustment plates 15a and 15b and the ground conductors 24 and 25, respectively. It is possible to adjust the size of the capacity. Therefore, the thickness of the adhesive sheets 40a and 40b may be designed so that the characteristic impedance of the connectors 100a and 100b becomes a predetermined characteristic impedance (50 ⁇ ).
- FIG. 14 is an external perspective view of the high-frequency signal transmission line 10d according to the second modification.
- the internal configuration of the high-frequency signal transmission line 10d may be the same as the internal configuration of either the high-frequency signal transmission line 10 or 10a.
- the difference between the high-frequency signal transmission line 10d and the high-frequency signal transmission lines 10, 10a is the shape of the adjustment plates 15a, 15b. More specifically, in the high-frequency signal transmission lines 10 and 10a, the adjustment plates 15a and 15b have a rectangular shape.
- the adjustment plates 15a and 15b are provided with holes H1 and H2 and notches E1 and E2.
- the shape of the adjustment plates 15a and 15b may be designed so that the characteristic impedance of the connectors 100a and 100b becomes a predetermined characteristic impedance (50 ⁇ ).
- FIG. 15 and 16 are external perspective views of the high-frequency signal transmission line 10e according to the fourth embodiment.
- FIG. 17 is an exploded perspective view of the dielectric body 12 of the high-frequency signal transmission line 10e of FIG.
- the stacking direction of the high-frequency signal transmission line 10e is defined as the z-axis direction.
- the longitudinal direction of the high-frequency signal transmission line 10e is defined as the x-axis direction, and the direction orthogonal to the x-axis direction and the z-axis direction is defined as the y-axis direction.
- the high-frequency signal transmission line 10e is not connected to the circuit board via the connectors 100a and 100b, but is connected to the circuit board via the terminal conductors 22b, 22c, 43a and 43b.
- the high-frequency signal transmission line 10e is a flat cable type flexible circuit board used for connecting two high-frequency circuits in an electronic device such as a mobile phone.
- the high-frequency signal transmission line 10e includes a dielectric body 12, adjustment plates 15a and 15b, a signal line 20, ground conductors 22 and 24, terminal conductors 43a and 43b, and via-hole conductors b11 and b12. , B11 to B18.
- the dielectric element body 12 is a flexible plate-like member extending in the x-axis direction when viewed in plan from the z-axis direction.
- the parts 12b and 12c are included.
- the dielectric body 12 is a laminated body in which a protective layer 14 and dielectric sheets 18a to 18c are laminated in this order from the positive side to the negative side in the z-axis direction. is there.
- the main surface on the positive side in the z-axis direction of the dielectric body 12 is referred to as the front surface
- the main surface on the negative direction side in the z-axis direction of the dielectric body 12 is referred to as the back surface.
- the line portion 12a extends in the x-axis direction as shown in FIGS.
- the connecting portions 12b and 12c are respectively connected to the negative end portion in the x-axis direction and the positive end portion in the x-axis direction of the line portion 12a, and have a rectangular shape.
- the width in the y-axis direction of the connection parts 12b and 12c is larger than the width in the y-axis direction of the line part 12a.
- the dielectric sheets 18 a to 18 c extend in the x-axis direction when viewed in plan from the z-axis direction, and have the same shape as the dielectric body 12.
- the dielectric sheets 18a to 18c are sheets made of flexible thermoplastic resin such as polyimide or liquid crystal polymer.
- the front surface the main surface on the positive side in the z-axis direction of the dielectric sheets 18a to 18c
- the main surface on the negative direction side in the z-axis direction of the dielectric sheets 18a to 18c is referred to as the back surface.
- the thickness T1 of the dielectric sheet 18a is larger than the thickness T2 of the dielectric sheet 18b.
- the thickness T1 is, for example, 50 ⁇ m to 300 ⁇ m. In the present embodiment, the thickness T1 is 150 ⁇ m.
- the thickness T2 is, for example, 10 ⁇ m to 100 ⁇ m. In the present embodiment, the thickness T2 is 50 ⁇ m.
- the dielectric sheet 18a includes a line portion 18a-a and connecting portions 18a-b and 18a-c.
- the dielectric sheet 18b includes a line portion 18b-a and connection portions 18b-b and 18b-c.
- the dielectric sheet 18c includes a line portion 18c-a and connection portions 18c-b and 18c-c.
- the line portions 18a-a, 18b-a, and 18c-a constitute the line portion 12a.
- the connecting portions 18a-b, 18b-b, and 18c-b constitute a connecting portion 12b.
- the connecting portions 18a-c, 18b-c, and 18c-c constitute a connecting portion 12c.
- the signal line 20 is a linear conductor that transmits a high-frequency signal and is provided in the dielectric element body 12.
- the signal line 20 is a linear conductor that is formed on the surface of the dielectric sheet 18b and extends in the x-axis direction.
- the end of the signal line 20 on the negative side in the x-axis direction is positioned on the negative side in the y-axis direction with respect to the center of the connecting portion 18b-b, as shown in FIG. As shown in FIG. 17, the end of the signal line 20 on the positive side in the x-axis direction is located on the negative direction side in the y-axis direction from the center of the connecting portion 18b-c.
- the signal line 20 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the signal line 20 is formed on the surface of the dielectric sheet 18b means that the signal line 20 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18b, It means that the signal line 20 is formed by patterning the metal foil attached to the surface of the dielectric sheet 18b. Further, since the surface of the signal line 20 is smoothed, the surface roughness of the surface of the signal line 20 that is in contact with the dielectric sheet 18b is the surface roughness of the surface of the signal line 20 that is not in contact with the dielectric sheet 18b. It becomes larger than the surface roughness.
- the ground conductor 22 is a solid conductor layer provided on the positive side in the z-axis direction from the signal line 20. More specifically, the ground conductor 22 is formed on the surface of the dielectric sheet 18a and faces the signal line 20 through the dielectric sheet 18a. The ground conductor 22 is not provided with an opening at a position overlapping the signal line 20.
- the ground conductor 22 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 22 is formed on the surface of the dielectric sheet 18a means that the ground conductor 22 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18a, This indicates that the ground conductor 22 is formed by patterning the metal foil attached to the surface of the dielectric sheet 18a. Further, since the surface of the ground conductor 22 is smoothed, the surface roughness of the surface of the ground conductor 22 that is in contact with the dielectric sheet 18a is the surface roughness of the surface of the ground conductor 22 that is not in contact with the dielectric sheet 18a. It becomes larger than the surface roughness.
- the ground conductor 22 includes a main conductor 22a and terminal conductors 22b and 22c.
- the main conductor 22a is provided on the surface of the line portion 18a-a and extends along the x-axis direction.
- the terminal conductor 22b is a rectangular conductor provided on the surface of the connecting portion 18a-b. More specifically, the terminal conductor 22b extends in the x-axis direction on the positive side in the y-axis direction from the center of the connection portion 18a-b, and functions as an external electrode.
- the terminal conductor 22b is connected to the end of the main conductor 22a on the negative direction side in the x-axis direction.
- the terminal conductor 22c is a rectangular conductor provided on the surface of the connecting portion 18a-c. More specifically, the terminal conductor 22c extends in the x-axis direction on the positive side in the y-axis direction from the center of the connection portion 18a-c, and functions as an external electrode. The terminal conductor 22c is connected to the end of the main conductor 22a on the positive direction side in the x-axis direction.
- the characteristic impedance of the high-frequency signal transmission line 10e is determined mainly based on the facing area and distance between the signal line 20 and the ground conductor 22 and the relative permittivity of the dielectric sheets 18a to 18c. Therefore, when the characteristic impedance of the high-frequency signal transmission line 10 is set to 50 ⁇ , for example, the characteristic impedance of the high-frequency signal transmission line 10e is designed to be 55 ⁇ which is slightly higher than 50 ⁇ by the signal line 20 and the ground conductor 22. To do. Then, the shape of the ground conductor 24 described later is adjusted so that the characteristic impedance of the high-frequency signal transmission line 10 e is 50 ⁇ by the signal line 20, the ground conductor 22, and the ground conductor 24. As described above, the ground conductor 22 serves as a reference ground conductor.
- the ground conductor 24 is a conductor layer provided on the negative side in the z-axis direction from the signal line 20 as shown in FIG. More specifically, the ground conductor 24 is formed on the surface of the dielectric sheet 18c and faces the signal line 20 via the dielectric sheet 18b.
- the ground conductor 24 is made of a metal material having a small specific resistance mainly composed of silver or copper.
- the ground conductor 24 is formed on the surface of the dielectric sheet 18c means that the ground conductor 24 is formed by patterning a metal foil formed by plating on the surface of the dielectric sheet 18c, This indicates that the ground conductor 24 is formed by patterning the metal foil attached to the surface of the dielectric sheet 18c. Further, since the surface of the ground conductor 24 is smoothed, the surface roughness of the surface of the ground conductor 24 that is in contact with the dielectric sheet 18c is the surface roughness of the surface of the ground conductor 24 that is not in contact with the dielectric sheet 18c. It becomes larger than the surface roughness.
- the ground conductor 24 includes a main conductor 24a and terminal conductors 24b and 24c.
- the main conductor 24a is provided on the surface of the line portion 18c-a, and extends along the x-axis direction.
- the terminal conductor 24b is provided on the surface of the line portion 18c-b and has a rectangular shape.
- the terminal conductor 24b is connected to the end of the main conductor 24a on the negative side in the x-axis direction.
- the terminal conductor 24b is provided with a rectangular non-formed portion Oa.
- the non-forming portion Oa overlaps the end portion of the signal line 20 on the negative direction side in the x-axis direction when viewed in plan from the z-axis direction.
- the terminal conductor 24c is provided on the surface of the connecting portion 18c-c and has a rectangular shape.
- the terminal conductor 24c is connected to the end of the main conductor 24a on the positive side in the x-axis direction.
- the terminal conductor 24c is provided with a rectangular non-formed portion Ob.
- the non-forming portion Ob overlaps the end portion of the signal line 20 on the positive direction side in the x-axis direction when viewed in plan from the z-axis direction.
- the main conductor 24a is provided with a plurality of openings 30 arranged along the x-axis direction and having a rectangular shape.
- the main conductor 24a has a ladder shape.
- a portion of the ground conductor 24 sandwiched between adjacent openings 30 is referred to as a bridge portion 60.
- the bridge part 60 extends in the y-axis direction.
- the plurality of openings 30 and the plurality of bridge portions 60 alternately overlap the signal line 20 when viewed in plan from the z-axis direction.
- the signal line 20 crosses the center of the opening 30 and the bridge portion 60 in the y-axis direction in the x-axis direction.
- the ground conductor 24 is an auxiliary ground conductor that also functions as a shield. Further, as described above, the ground conductor 24 is designed for final adjustment so that the characteristic impedance of the high-frequency signal transmission line 10e is 50 ⁇ . Specifically, the size of the opening 30 and the line width of the bridge portion 60 are designed.
- the ground conductor 22 is not provided with an opening, and the ground conductor 24 is provided with an opening 30. Therefore, the area where the ground conductor 24 and the signal line 20 face each other is smaller than the area where the ground conductor 22 and the signal line 20 face each other.
- the terminal conductor 43a is a rectangular conductor provided on the surface of the connecting portion 18a-b and functions as an external electrode. More specifically, the terminal conductor 43a extends in the x-axis direction on the negative direction side in the y-axis direction from the center of the connection portion 18a-b. Further, the end portion on the positive direction side in the x-axis direction of the terminal conductor 43a overlaps the end portion on the negative direction side in the x-axis direction of the signal line 20 when viewed in plan from the z-axis direction.
- the terminal conductor 43b is a rectangular conductor provided on the surface of the connecting portion 18a-c and functions as an external electrode. More specifically, the terminal conductor 43b extends in the x-axis direction on the negative direction side in the y-axis direction from the center of the connection portion 18a-c. Further, the end portion on the negative direction side in the x-axis direction of the terminal conductor 43b overlaps the end portion on the positive direction side in the x-axis direction of the signal line 20 when viewed in plan from the z-axis direction.
- the signal line 20, the ground conductors 22 and 24, and the terminal conductors 43a and 43b have substantially the same thickness.
- the thickness of the signal line 20, the ground conductors 22 and 24, and the terminal conductors 43a and 43b is, for example, 10 ⁇ m to 20 ⁇ m.
- the signal line 20 is sandwiched between the ground conductor 22 and the ground conductor 24 from both sides in the z-axis direction. That is, the signal line 20, the ground conductor 22, and the ground conductor 24 have a triplate stripline structure. Further, the distance (distance in the z-axis direction) between the signal line 20 and the ground conductor 22 is substantially equal to the thickness T1 of the dielectric sheet 18a as shown in FIG. 17, and is, for example, 50 ⁇ m to 300 ⁇ m. In the present embodiment, the distance between the signal line 20 and the ground conductor 22 is 150 ⁇ m.
- the distance (distance in the z-axis direction) between the signal line 20 and the ground conductor 24 is substantially equal to the thickness T2 of the dielectric sheet 18b as shown in FIG. 17, for example, 10 ⁇ m to 100 ⁇ m.
- the distance between the signal line 20 and the ground conductor 24 is 50 ⁇ m. Therefore, the distance in the z-axis direction between the signal line 20 and the ground conductor 24 is smaller than the distance in the z-axis direction between the signal line 20 and the ground conductor 22.
- the plurality of via-hole conductors B11 penetrate the dielectric sheet 18a in the z-axis direction on the positive side in the y-axis direction from the signal line 20, and are evenly spaced in a line in the x-axis direction.
- the plurality of via-hole conductors B12 pass through the dielectric sheet 18b in the z-axis direction on the positive side in the y-axis direction from the signal line 20, and are equally spaced in a line in the x-axis direction.
- Via-hole conductors B11 and B12 are connected to each other to form one via-hole conductor.
- the end of the via-hole conductor B11 on the positive side in the z-axis direction is connected to the ground conductor 22.
- the end of the via-hole conductor B12 on the negative side in the z-axis direction is connected to the ground conductor 24. More specifically, the via-hole conductor B12 is connected to the ground conductor 24 on the positive side in the y-axis direction from the bridge portion 60. Yes.
- the via-hole conductors B11 and B12 are formed by filling the via-holes formed in the dielectric sheets 18a and 18b with a conductive paste mainly composed of silver, tin, or copper and solidifying the via-hole conductors B11 and B12.
- the plurality of via-hole conductors B13 penetrate the dielectric sheet 18a in the z-axis direction on the negative side in the y-axis direction from the signal line 20, and are evenly spaced in a line in the x-axis direction.
- the plurality of via-hole conductors B14 pass through the dielectric sheet 18b in the z-axis direction on the negative side in the y-axis direction from the signal line 20, and are evenly spaced in a line in the x-axis direction.
- the via hole conductors B13 and B14 are connected to each other to form one via hole conductor.
- the end of the via-hole conductor B13 on the positive side in the z-axis direction is connected to the ground conductor 22.
- the end of the via-hole conductor B14 on the negative direction side in the z-axis direction is connected to the ground conductor 24. More specifically, the via-hole conductor B14 is connected to the ground conductor 24 on the negative direction side in the y-axis direction from the bridge portion 60. Yes.
- the via hole conductors B13 and B14 are formed by filling the via holes formed in the dielectric sheets 18a and 18b with a conductive paste mainly composed of silver, tin, copper, or the like and solidifying the via holes.
- the via-hole conductor B15 penetrates the connecting portion 18a-b of the dielectric sheet 18a in the z-axis direction.
- the via-hole conductor B16 penetrates the connecting portion 18b-b of the dielectric sheet 18b in the z-axis direction.
- the via-hole conductors B15 and B16 constitute one via-hole conductor by being connected to each other.
- the end of the via-hole conductor B15 on the positive side in the z-axis direction is connected to the terminal conductor 22b of the ground conductor 22.
- the end of the via-hole conductor B16 on the negative direction side in the z-axis direction is connected to the terminal conductor 24b of the ground conductor 24.
- the via hole conductors B15 and B16 are formed by filling the via holes formed in the dielectric sheets 18a and 18b with a conductive paste mainly composed of silver, tin, copper, or the like and solidifying the via holes.
- the via-hole conductor B17 penetrates the connecting portions 18a-c of the dielectric sheet 18a in the z-axis direction. As shown in FIG. 17, the via-hole conductor B18 passes through the connecting portion 18b-c of the dielectric sheet 18b in the z-axis direction.
- the via-hole conductors B17 and B18 constitute one via-hole conductor by being connected to each other.
- the end of the via-hole conductor B17 on the positive side in the z-axis direction is connected to the terminal conductor 22c of the ground conductor 22.
- the end of the via-hole conductor B18 on the negative side in the z-axis direction is connected to the terminal conductor 24c of the ground conductor 24.
- the via-hole conductors B17 and B18 are formed by filling the via-holes formed in the dielectric sheets 18a and 18b with a conductive paste mainly composed of silver, tin, or copper and solidifying the via-hole conductors B17 and B18.
- the via-hole conductor b11 penetrates the connecting portion 18a-b of the dielectric sheet 18a in the z-axis direction, and the end portion of the terminal conductor 43a and the signal line 20 on the negative direction side in the x-axis direction. And connected.
- the via-hole conductor b12 passes through the connection portions 18a-c of the dielectric sheet 18a in the z-axis direction, and is the end portion of the terminal conductor 43b and the signal line 20 on the positive direction side in the x-axis direction. And connected. Thereby, the signal line 20 is connected between the terminal conductors 43a and 43b.
- the via-hole conductors b11 and b12 are formed by filling a via-hole formed in the dielectric sheets 18a and 18b with a conductive paste mainly composed of silver, tin, or copper and solidifying the via-hole conductors.
- the protective layer 14 is an insulating film provided on the surface of the dielectric sheet 18a and covers substantially the entire surface of the dielectric sheet 18a. Thereby, the protective layer 14 covers the ground conductor 22.
- the protective layer 14 is made of a flexible resin such as a resist material, for example.
- the protective layer 14 includes a line portion 14a and connecting portions 14b and 14c.
- the line portion 14a covers the main conductor 22a by covering the entire surface of the line portion 18a-a.
- the connecting portion 14b is connected to the end portion on the negative side in the x-axis direction of the line portion 14a and covers a part of the surface of the connecting portion 18a-b. However, the connecting portion 14b does not cover the terminal conductors 22b and 43a as shown in FIG.
- the connecting portion 14c is connected to the end portion on the positive side in the x-axis direction of the line portion 14a and covers a part of the surface of the connecting portion 18a-c. However, the connecting portion 14c does not cover the terminal conductors 22c and 43b as shown in FIG.
- the adjustment plate 15a is provided on the back surface of the connection portion 12b of the dielectric element body 12 (that is, the back surface of the connection portion 18c-b of the dielectric sheet 18c), and is not formed when viewed in plan from the z-axis direction. It is a rectangular metal plate that overlaps at least part of the portion Oa. Furthermore, the adjustment plate 15a is not electrically connected to any of the signal line 20 and the ground conductors 22 and 24, and is kept at a floating potential. More specifically, the adjustment plate 15a overlaps with the entire non-formed portion Oa when viewed in plan from the z-axis direction, and thus overlaps with the end portion of the signal line 20 on the negative direction side in the x-axis direction. Yes.
- a capacitance is formed between the adjusting plate 15a and the end of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15a overlaps the terminal conductor 24b of the ground conductor 24 in a plan view from the z-axis direction by protruding from the non-forming portion Oa. Thus, a capacitance is formed between the adjustment plate 15a and the terminal conductor 24b of the ground conductor 24.
- the adjustment plate 15b is provided on the back surface of the connection portion 12c of the dielectric body 12 (that is, the back surface of the connection portion 18c-c of the dielectric sheet 18c), and is not formed when viewed in plan from the z-axis direction. It is a rectangular metal plate that overlaps at least part of the portion Ob. Further, the adjustment plate 15b is not electrically connected to any of the signal line 20 and the ground conductors 22 and 24, and is maintained at a floating potential. More specifically, the adjustment plate 15b overlaps the entire non-forming portion Ob when viewed in plan from the z-axis direction, and thus overlaps the end portion of the signal line 20 on the positive direction side in the x-axis direction. Yes.
- the adjustment plates 15a and 15b are made of, for example, a copper plate or a SUS plate.
- FIG. 18 is a perspective view of a connection portion between the high-frequency signal transmission line 10e and the circuit board 202b.
- FIG. 19 is a cross-sectional structure diagram of a connection portion between the high-frequency signal transmission line 10e and the circuit board 202b.
- the connection structure between the high-frequency signal transmission line 10e and the circuit board 202a and the connection structure between the high-frequency signal transmission line 10e and the circuit board 202b are the same. Therefore, hereinafter, a connection structure between the high-frequency signal transmission line 10e and the circuit board 202b will be described.
- the circuit board 202b includes a board body 207, external terminals 208b and 208c, and a resist 209 as shown in FIG.
- the substrate body 207 has a power feeding circuit and the like built therein.
- the external terminals 208b and 208c are provided on the main surface of the substrate main body 207 on the negative direction side in the z-axis direction, and are arranged in this order from the positive direction side in the y-axis direction to the negative direction side.
- the external terminals 208b and 208c have a rectangular shape, and are made of, for example, copper.
- the resist 209 surrounds the external terminals 208b and 208c when viewed in plan from the z-axis direction. Thereby, the resist 209 also functions for positioning the high-frequency signal transmission line 10e.
- the external terminals 208b and 208c are connected to the terminal conductors 22c and 43b by solder, respectively.
- the characteristic impedance at both ends of the signal line 20 can be suppressed from deviating from the predetermined characteristic impedance.
- 20 is a cross-sectional structure diagram of the high-frequency signal transmission line 10e in AA of FIG.
- the adjustment plates 15a and 15b are respectively provided on the back surface of the dielectric body 12, and overlap with at least a part of the non-forming portions Oa and Ob when viewed in plan from the z-axis direction. .
- a capacitor C ⁇ b> 2 is formed between the adjustment plates 15 a and 15 b and the end of the signal line 20.
- a capacitor C3 is formed between the adjustment plates 15a and 15b and the terminal conductors 24b and 24c of the ground conductor 24. That is, between the signal line 20 and the ground conductor 24, capacitors C2 and C3 are connected in series as shown in FIG.
- the capacitors C2 and C3 are connected in series, the combined capacitance Ct of the capacitors C2 and C3 becomes a minute value. Therefore, it is possible to slightly reduce the characteristic impedance at the end of the signal line 20 by forming a minute combined capacitor Ct at the end of the signal line 20. That is, the characteristic impedance at the end of the signal line 20 can be finely adjusted.
- the characteristic impedance at the end of the signal line 20 can be finely adjusted.
- the high-frequency signal transmission line 10e by providing the non-forming portions Oa and Ob and the adjustment plates 15a and 15b, it is possible to accurately match the characteristic impedance of the end portion of the signal line 20 to the predetermined characteristic impedance. Become.
- the terminal conductors 22c and 43b may be connected to the external terminals 208b and 208c by welding.
- a stainless steel metal plate may be provided on the terminal conductors 22b, 22c, 43a, 43b. Thereby, the deformation of the connecting portions 12b and 12c is suppressed. Further, since the material of the stainless steel metal plate is different from the material of the terminal conductors 22b, 22c, 43a, 43b, the characteristic impedance of the metal plate and the characteristic impedance of the terminal conductors 22b, 22c, 43a, 43b are different. Therefore, the characteristic impedance of the metal plate is likely to deviate from the predetermined characteristic impedance. Therefore, when a metal plate is applied to the high-frequency signal transmission line 10e, the characteristic impedance of the metal plate may be adjusted by the adjustment plates 15a and 15b.
- the high-frequency signal transmission line according to the present invention is not limited to the high-frequency signal transmission lines 10 and 10a to 10e according to the embodiment, and can be changed within the scope of the gist thereof.
- the adjustment plates 15a and 15b may be attached to the dielectric body 12 with a resist material, for example.
- the adjustment plates 15a and 15b are metal plates, for example, an insulating substrate such as a glass epoxy resin on which a conductor layer is formed may be used. In this case, since the conductor layer can be processed by etching, the conductor layer can be processed with high accuracy. Therefore, the characteristic impedances of the connectors 100a and 100b can be accurately matched with the predetermined characteristic impedance.
- the ground conductor 24 may not have the opening 30. Further, a plurality of openings 30 may be provided in the ground conductor 22 instead of the ground conductor 24. Furthermore, a plurality of openings 30 may be provided in any of the ground conductors 22 and 24.
- the signal line 20 and the adjustment plates 15a and 15b do not necessarily overlap in a plan view. Also in this case, a capacitance C2 is generated between the signal line 20 and the adjusting plates 15a and 15b via the non-forming portions Oa and Ob. Similarly, the ground conductors 22, 24, 25 and the adjustment plates 15a, 15b do not necessarily overlap in plan view.
- the connectors 100a and 100b may be provided on different main surfaces of the dielectric body 12, respectively.
- the high-frequency signal transmission lines 10, 10a to 10e may be used as high-frequency signal transmission lines in an RF circuit board such as an antenna front end module.
- the present invention is useful for high-frequency signal transmission lines and electronic devices, and is particularly excellent in that the characteristic impedance of a connector can be prevented from deviating from a predetermined characteristic impedance.
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Abstract
Description
(高周波信号伝送線路の構成)
以下に、本発明の第1の実施形態に係る高周波信号伝送線路の構成について図面を参照しながら説明する。図1は、第1の実施形態に係る高周波信号伝送線路10の外観斜視図である。図2は、第1の実施形態に係る高周波信号伝送線路10の誘電体素体12の分解図である。図3は、第1の実施形態に係る高周波信号伝送線路10の断面構造図である。図4は、高周波信号伝送線路10のコネクタ100bの外観斜視図及び断面構造図である。図1ないし図4において、高周波信号伝送線路10の積層方向をz軸方向と定義する。また、高周波信号伝送線路10の長手方向をx軸方向と定義し、x軸方向及びz軸方向に直交する方向をy軸方向と定義する。
以下に、高周波信号伝送線路10の製造方法について図2を参照しながら説明する。以下では、一つの高周波信号伝送線路10が作製される場合を例にとって説明するが、実際には、大判の誘電体シートが積層及びカットされることにより、同時に複数の高周波信号伝送線路10が作製される。
以上のように構成された高周波信号伝送線路10によれば、コネクタ100a,100bにおいて特性インピーダンスが所定の特性インピーダンスからずれることを抑制できる。図6は、第1の実施形態に係る高周波信号伝送線路10の特性インピーダンスを示したグラフである。縦軸は特性インピーダンスを示し、横軸はx軸を示す。図6の実線は高周波信号伝送線路10の特性インピーダンスを示しており、図6の点線は比較例に係る高周波信号伝送線路の特性インピーダンスを示している。比較例に係る高周波信号伝送線路には、調整板15a,15bが設けられていない。図7は、高周波信号伝送線路10の等価回路図である。図8は、高周波信号伝送線路10の断面構造図である。
(高周波信号伝送線路の構成)
以下に、本発明の第2の実施形態に係る高周波信号伝送線路の構成について図面を参照しながら説明する。図9は、第2の実施形態に係る高周波信号伝送線路10aの誘電体素体12の分解図である。図10は、第2の実施形態に係る高周波信号伝送線路10aの断面構造図である。なお、高周波信号伝送線路10aの外観斜視図については、図1を援用する。
以上のように構成された高周波信号伝送線路10aによれば、高周波信号伝送線路10と同様に、コネクタ100a,100bにおいて特性インピーダンスが所定の特性インピーダンスからずれることを抑制できる。図11は、第2の実施形態に係る高周波信号伝送線路10aの特性インピーダンスを示したグラフである。縦軸は特性インピーダンスを示し、横軸はx軸を示す。図11の実線は高周波信号伝送線路10aの特性インピーダンスを示しており、図11の点線は比較例に係る高周波信号伝送線路の特性インピーダンスを示している。比較例に係る高周波信号伝送線路には、調整板15a,15bが設けられていない。
(高周波信号伝送線路の構成)
以下に、本発明の第3の実施形態に係る高周波信号伝送線路の構成について図面を参照しながら説明する。図12は、第3の実施形態に係る高周波信号伝送線路10bの誘電体素体12の分解図である。なお、高周波信号伝送線路10bの外観斜視図については、図1を援用する。
以上のように構成された高周波信号伝送線路10bによれば、高周波信号伝送線路10aと同様に、コネクタ100a,100bにおいて特性インピーダンスが所定の特性インピーダンスからずれることを抑制できる。より詳細には、高周波信号伝送線路10では、調整板15a,15bはそれぞれ、誘電体素体12の裏面に設けられ、z軸方向から平面視したときに、非形成部Oa,Obの少なくとも一部と重なっている。これにより、調整板15a,15bと信号線路20の端部との間に容量C2が形成されるようになる。更に、調整板15a,15bとグランド導体22の端子導体22b,22cとの間に容量C3が形成されるようになる。すなわち、信号線路20とグランド導体22との間には、図7に示すように、容量C2,C3とが直列に接続されている。
以下に、第1の変形例に係る高周波信号伝送線路について図面を参照しながら説明する。図13は、第1の変形例に係る高周波信号伝送線路10cの外観斜視図である。
以下に、第2の変形例に係る高周波信号伝送線路について図面を参照しながら説明する。図14は、第2の変形例に係る高周波信号伝送線路10dの外観斜視図である。
以下に、第4の実施形態に係る高周波信号伝送線路10eについて図面を参照しながら説明する。図15及び図16は、第4の実施形態に係る高周波信号伝送線路10eの外観斜視図である。図17は、図15の高周波信号伝送線路10eの誘電体素体12の分解斜視図である。以下では、高周波信号伝送線路10eの積層方向をz軸方向と定義する。また、高周波信号伝送線路10eの長手方向をx軸方向と定義し、x軸方向及びz軸方向に直交する方向をy軸方向と定義する。
本発明に係る高周波信号伝送線路は、前記実施形態に係る高周波信号伝送線路10,10a~10eに限らず、その要旨の範囲内において変更可能である。
10,10a~10e 高周波信号伝送線路
12 誘電体素体
15a,15b 調整板
18a~18d 誘電体シート
20 信号線路
22,24,25 グランド導体
22b,22c,43a,43b 端子導体
30 開口
40a,40b 粘着シート
60 ブリッジ部
100a,100b コネクタ
Claims (13)
- 複数の絶縁体層が積層されて構成されている素体と、
前記素体に設けられている線状の信号線路と、
前記絶縁体層を介して前記信号線路と対向している第1のグランド導体と、
調整導体と、
を備えており、
前記素体は、前記信号線路と外部回路とが一方の主面において電気的に接続される接続部を有しており、
前記第1のグランド導体には、前記接続部において、積層方向から平面視したときに、前記信号線路と重なる領域の少なくとも一部に導体が設けられていない非形成部が設けられており、
前記調整導体は、前記素体の他方の主面に設けられ、積層方向から平面視したときに、前記非形成部の少なくとも一部と重なっていること、
を特徴とする高周波信号伝送線路。 - 前記調整導体は、前記素体を積層方向から平面視したときに、前記信号線路と一部が重なっていること、
を特徴とする請求項1に記載の高周波信号伝送線路。 - 前記調整導体は、金属板、又は、導体層が形成された絶縁性基板であること、
を特徴とする請求項1又は請求項2のいずれかに記載の高周波信号伝送線路。 - 前記調整導体は、粘着剤又はレジスト材によって前記素体に貼り付けられていること、
を特徴とする請求項1ないし請求項3のいずれかに記載の高周波信号伝送線路。 - 前記調整導体は、前記信号線路及び前記第1のグランド導体に電気的に接続されていないこと、
を特徴とする請求項1ないし請求項4のいずれかに記載の高周波信号伝送線路。 - 前記信号線路よりも前記素体の一方の主面側に設けられ、かつ、前記絶縁体層を介して前記信号線路と対向している第2のグランド導体を、
更に備えており、
前記第1のグランド導体は、前記信号線路よりも前記素体の他方の主面側に設けられており、
前記第1のグランド導体又は前記第2のグランド導体の少なくとも一方には、積層方向から平面視したときに、前記信号線路に沿って並んでいる複数の開口が設けられていること、
を特徴とする請求項1ないし請求項5のいずれかに記載の高周波信号伝送線路。 - 前記開口と重なっている第1の領域における前記信号線路の特性インピーダンスは、該開口と重なっていない第2の領域における該信号線路の特性インピーダンスよりも高く、
前記第1の領域における前記信号線路の特性インピーダンス及び前記第2の領域における該信号線路の特性インピーダンスは、該信号線路の全体の特性インピーダンスが所定の特性インピーダンスとなるように設定されていること、
を特徴とする請求項6に記載の高周波信号伝送線路。 - 前記第1のグランド導体は、前記信号線路より前記素体の一方の主面側に設けられていること、
を特徴とする請求項1ないし請求項5のいずれかに記載の高周波信号伝送線路。 - 前記素体の前記接続部の一方の主面に実装されているコネクタであって、前記信号線路と電気的に接続されているコネクタを、
更に備えており、
前記信号線路は、前記コネクタを介して前記外部回路と電気的に接続されること、
を特徴とする請求項1ないし請求項8のいずれかに記載の高周波信号伝送線路。 - 前記コネクタの特性インピーダンスが所定の特性インピーダンスとなるように、前記調整導体が設計されていること、
を特徴とする請求項9に記載の高周波信号伝送線路。 - 前記素体の前記接続部の一方の主面に設けられている外部電極であって、前記信号線路と電気的に接続されている外部電極を、
更に備えており、
前記信号線路は、前記外部電極を介して前記外部回路と電気的に接続されること、
を特徴とする請求項1ないし請求項8のいずれかに記載の高周波信号伝送線路。 - 前記調整導体と前記信号線路との間に容量が形成されていると共に、該調整導体と前記第1のグランド導体との間に容量が形成されていること、
を特徴とする請求項1ないし請求項11のいずれかに記載の高周波信号伝送線路。 - 高周波信号伝送線路と、
前記高周波信号伝送線路を収容している筐体と、
を備えており、
前記高周波信号伝送線路は、
複数の絶縁体層が積層されて構成されている素体と、
前記素体に設けられている線状の信号線路と、 前記絶縁体層を介して前記信号線路と対向している第1のグランド導体と、
調整導体と、
を備えており、
前記素体は、一方の主面において前記信号線路と外部回路とが電気的に接続される接続部を有しており、
前記第1のグランド導体には、前記接続部において、積層方向から平面視したときに、前記信号線路と重なる領域の少なくとも一部に導体が設けられていない非形成部が設けられており、
前記調整導体は、前記素体の他方の主面に設けられ、積層方向から平面視したときに、前記非形成部の少なくとも一部と重なっていること、
を特徴とする電子機器。
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