WO2013105397A1 - Module de haute fréquence - Google Patents

Module de haute fréquence Download PDF

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Publication number
WO2013105397A1
WO2013105397A1 PCT/JP2012/082612 JP2012082612W WO2013105397A1 WO 2013105397 A1 WO2013105397 A1 WO 2013105397A1 JP 2012082612 W JP2012082612 W JP 2012082612W WO 2013105397 A1 WO2013105397 A1 WO 2013105397A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfic
frequency module
matching circuit
electronic component
frequency
Prior art date
Application number
PCT/JP2012/082612
Other languages
English (en)
Japanese (ja)
Inventor
直樹 郷地
伸郎 池本
邦明 用水
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2013553225A priority Critical patent/JP5541424B2/ja
Priority to CN201290001126.5U priority patent/CN204316869U/zh
Publication of WO2013105397A1 publication Critical patent/WO2013105397A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/18—Networks for phase shifting
    • H03H7/19—Two-port phase shifters providing a predetermined phase shift, e.g. "all-pass" filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Definitions

  • the present invention relates to a high-frequency module that is provided on a wiring board and includes an RFIC that is an electronic component that handles high-frequency signals, a matching circuit, and other electronic components.
  • the electronic component 502 incorporated in the module 500 is an RFIC that handles a high-frequency signal (RF signal)
  • RF signal radio frequency
  • other electronic components provided in the module 500 may malfunction due to noise caused by electromagnetic waves caused by high-frequency signals being radiated from the electronic component 502 or a wiring pattern connected to the electronic component 502, or the characteristics thereof may be reduced. There is a risk of deterioration.
  • the ground pattern 503 having a shape that covers one surface of the electronic component 502 without a gap is provided on the wiring board 501, so that the radiation noise from the electronic component 502 is reduced to other electronic components provided in the module 500. The effect on parts is reduced.
  • Japanese Unexamined Patent Publication No. 2006-303202 paragraphs 0020 to 0047, FIGS. 1 to 4, abstract, etc.
  • the wiring substrate 501 by providing the wiring substrate 501 with the ground pattern 503 having a shape that covers one surface of the electronic component 502 without a gap, the influence of radiation noise from the electronic component 502 on other electronic components can be reduced.
  • the wiring substrate 501 is provided with the ground pattern 503 having a shape that covers the entire surface of the electronic component 502 without any gap, the thickness of the wiring substrate 501 increases, which hinders the miniaturization of the module 500.
  • the wiring board 501 is provided with various passive elements such as inductor elements and capacitor elements to form a matching circuit or the like, depending on the arrangement relationship between the ground pattern 503 and the passive elements,
  • the coupling with the passive element causes problems such as changes in characteristics of the passive element and deterioration of the Q value of a circuit formed by the passive element.
  • the present invention has been made in view of the above-described problems, and can reduce the effect of radiation noise from an RFIC, which is an electronic component that handles a high-frequency signal, provided on a wiring board on other electronic components. It aims at providing the technique which can achieve size reduction of.
  • a high-frequency module includes an RFIC, which is an electronic component that handles a high-frequency signal, provided on a wiring board, a matching circuit, and another electronic component.
  • the wiring board includes a magnetic layer, the RFIC is provided on one main surface side of the magnetic layer, and the other electronic component is provided on the other main surface side of the magnetic layer, and the matching circuit Inductor elements for forming are provided on the magnetic layer.
  • the RFIC which is an electronic component that handles high-frequency signals
  • the RFIC is provided on one main surface side of the magnetic layer provided in the wiring board, and the other electronic component is on the other main surface side of the magnetic layer. Since the radiation noise (electromagnetic wave) from the RFIC due to the high-frequency signal being handled passes through the magnetic material layer (magnetic material) and is lost due to heat generation, the radiation noise from the RFIC is generated by other electrons. The influence on parts can be reduced.
  • the inductor element forming the matching circuit is provided in the magnetic layer and the inductance of the inductor element is increased, the inductor element can be reduced in size, so that the high-frequency module can be reduced in size.
  • the RFIC has a function of demodulating the input high-frequency signal into a baseband signal and modulating the baseband signal into the high-frequency signal, and the other electronic component is an IC that handles the baseband signal. It is good to be.
  • the other electronic component may be a passive element that forms the matching circuit together with the inductor element.
  • either one of the RFIC and the other electronic component is built in the wiring board.
  • the inductor element may include two coil patterns formed in a spiral shape in the thickness direction of the magnetic layer, and the two coil patterns may be arranged adjacent to each other and coupled with a predetermined mutual inductance.
  • both coil patterns are coupled with a predetermined mutual inductance and are arranged adjacent to the magnetic layer, so that an inductor element can be formed with a smaller number of turns. Magnetic field noise radiated from the element can be reduced.
  • the coil patterns may be arranged adjacent to each other so that at least the spiral winding axes do not overlap with each other, and a closed magnetic circuit is formed in the magnetic layer by a magnetic field generated in the coil patterns. .
  • both coil patterns are arrange
  • the matching circuit and the RFIC are connected, and the high-frequency signal input from the antenna element is input to the RFIC through the matching circuit, or the high-frequency signal output from the RFIC is passed through the matching circuit. Or radiated from the antenna element.
  • a high-frequency signal input from the antenna element is input to the RFIC through the matching circuit, or a high-frequency signal output from the RFIC is radiated from the antenna element through the matching circuit.
  • a high-frequency module having a simple configuration can be provided.
  • the RFIC may be an RFID IC.
  • RFID Radio It is possible to provide a high-frequency module having a practical configuration in which an IC for Frequency IDentification System) is mounted and the influence of radiation noise from the RFID IC on other electronic components is reduced.
  • the magnetic layer is disposed between the RFIC, which is an electronic component that handles high-frequency signals, and other electronic components, radiation noise (electromagnetic waves) from the RFIC caused by the high-frequency signals is magnetic. Heat is lost in the body. Therefore, it is possible to reduce the influence of radiation noise from the RFIC on other electronic components.
  • the inductor element forming the matching circuit is provided in the magnetic layer, and the inductance of the inductor element is increased. Therefore, the inductor element can be reduced in size, and thus the high-frequency module can be reduced in size.
  • FIG. 5 is a diagram showing an arrangement relationship of inductor elements provided on the wiring board of FIG. 4.
  • FIG. 5 shows the high frequency module concerning 2nd Embodiment of this invention.
  • FIG. 7 shows the arrangement
  • FIG. 1 is a functional block diagram of a communication terminal device in which the high frequency module according to the first embodiment of the present invention is mounted.
  • FIG. 2 is a diagram showing an equivalent circuit of the matching circuit of FIG.
  • FIG. 3 is a cross-sectional view showing the high-frequency module of FIG.
  • FIG. 4 is an exploded view of a wiring board provided in the high frequency module of FIG.
  • FIG. 5 is a view showing each resin layer provided in the wiring board of FIG.
  • FIG. 6 is a diagram showing the arrangement relationship of the inductor elements provided on the wiring board of FIG.
  • the communication terminal device 1 is configured as an NFC (Near Field Communication) device, and includes a host IC 2 mounted on a mother board or the like (not shown), a high frequency module 3, and an antenna element 4. I have.
  • NFC Near Field Communication
  • the host IC 2 includes a power supply circuit for supplying power to the high-frequency module 3 and a microprocessor that controls the high-frequency module 3 by executing a predetermined application.
  • the communication terminal device 1 executes an application for performing predetermined processing on the host IC 2 based on information included in the baseband signal output from the high-frequency module 3 to control the high-frequency module 3, so that FeliCa (Sony shares It is used for payment of electronic money using a near field communication standard represented by a registered trademark of the company.
  • the communication terminal device 1 when a predetermined application is executed in the host IC 2 and the high frequency module 3 is controlled, the communication terminal device 1 functions as a reader / writer device that performs near field communication with other non-contact IC cards (RF tags). Or peer-to-peer (P2P) communication between the communication terminal device 1 and another NFC device.
  • RF tags non-contact IC cards
  • P2P peer-to-peer
  • the high-frequency module 3 is mounted on a motherboard or the like of the communication terminal device 1 to form an RFID (Radio Frequency Identification) system, and handles electronic high-frequency signals (RF signals) input from the outside.
  • An impedance matching circuit 32 provided between the RFIC 31 and the antenna element 4, and a secure IC 33 connected to the host RFIC 31.
  • the RFIC 31 is formed by an IC for RFID, has a function necessary for short-range communication based on the NFC standard, and is an external reader / writer device (illustrated) input via the antenna element 4 and the matching circuit 32.
  • the communication RF signal output from (omitted) is demodulated into a baseband signal for processing, or based on information (control command) contained in the demodulated baseband signal and a control command from the host IC 2
  • the baseband signal encoded in (1) is modulated into an RF signal by a predetermined modulation method such as ASK modulation, and output through the matching circuit 32 and the antenna element 4.
  • the matching circuit 32 is formed of a general L-type low-pass filter by inductor elements L 1 and L 2 and capacitor elements C 1 and C 2, and the balanced terminal Pi is connected to the antenna element 4.
  • the balanced terminal Po is connected to the RFIC 31.
  • the inductor elements L1 and L2 are arranged so as to be coupled by mutual inductance M.
  • the secure IC 33 includes a memory for storing an identification code for identifying the mobile terminal device 1 and an encryption code for encryption processing necessary for electronic money settlement, a CPU for executing encryption processing, and the like. Yes, by executing predetermined processing based on a control command included in the baseband signal demodulated by the RFIC 31 or a control command from the host IC, predetermined information necessary for the settlement of the electronic money is included. Output baseband signal.
  • the memory included in the secure IC 33 is formed by a rewritable nonvolatile memory, and information such as an identification code and an encryption code stored in the memory of the secure IC 33 is appropriately rewritten by an application executed by the host IC 2. Is executed.
  • the high-frequency module 3 includes a multilayer resin wiring board 30, and various electronic components such as an RFIC 31, a matching circuit 32, and a secure IC 33 are provided on the multilayer resin wiring board 30.
  • the multilayer resin wiring board 30 includes dielectric layers 30a to 30d and 30h and magnetic layers 30e to 30g, and the magnetic layers 30e to 30g are interposed between the dielectric layers 30a to 30d and the dielectric layer 30h.
  • the matching circuit 32 is formed by inductor elements L1, L2 constituted by coil patterns 32a, 32b and capacitor elements 32c, 32d constituting capacitor elements C1, C2.
  • a front surface terminal 301 for mounting a surface mounting component is formed on the front surface (one main surface) of the multilayer resin wiring board 30, and the high frequency module 3 is connected to the back surface (the other main surface) of the communication terminal device 1.
  • a back terminal 302 is formed for connection to a motherboard or the like.
  • Each of the resin layers 30a to 30h is provided with an in-plane conductor pattern 303 and an interlayer conductor pattern 304 (via conductor). These conductor patterns 303 and 304 form various passive elements, Various electronic components provided on the resin wiring board 30 are electrically connected.
  • the magnetic layers 30e to 30g are provided with inductor elements L1 and L2 respectively formed by two coil patterns 32a and 32b formed in a spiral shape in the thickness direction. Further, as shown in FIG. 6, the two coil patterns 32a and 32b are arranged adjacent to each other in the layer direction, and the magnetic field MF is coupled with the mutual inductance M by passing through the winding centers of the two coil patterns 32a and 32b. Yes.
  • the inductor element L1 is formed in a spiral shape by connecting the coil patterns 32a formed on the magnetic layers 30f and 30g with the interlayer conductor pattern 304, and the inductor element L2 includes the dielectric layer 30d and the magnetic body.
  • the coil pattern 32b formed on each layer 30e is connected to the interlayer conductor pattern 304 to form a spiral shape.
  • a capacitor element that forms the matching circuit 32 together with the RFIC 31 and the inductor elements L1 and L2 is provided on the surface terminal 301 provided on the surface of the multilayer resin wiring board 30 which is one main surface side of the magnetic layers 30e to 30g.
  • Capacitor elements 32c and 32d are provided as C1 and C2.
  • the secure IC 33 is built in the dielectric layers 30b and 30c on the other main surface side of the magnetic layers 30e to 30g.
  • the secure IC 33 includes a rewiring layer having a post electrode 33b connected to an integrated circuit provided on a semiconductor substrate 33a such as Si or GaAs, and a resin sealing layer 33c formed so as to cover a side surface of the post electrode 33b. It is formed in a so-called CSP (chip size package), and the end face of the post electrode 33b exposed from the resin sealing increase 33c and the interlayer conductor pattern 304 are directly connected.
  • CSP chip size package
  • the dielectric layers 30a to 30d and 30h are made of a heat-resistant thermoplastic resin such as polyimide or liquid crystal polymer
  • the magnetic layers 30e to 30g are made of thermoplastic resin such as polyimide or liquid crystal polymer with ferrite powder or the like.
  • the magnetic powder is mixed to form.
  • the front surface terminal 301, the back surface terminal 302, the in-plane conductor pattern 303, and the interlayer conductor pattern 304 are formed of a metal material having a small specific resistance mainly composed of silver or copper.
  • the resin layers 30a to 30h are preferably formed of a liquid crystal polymer because they have excellent high frequency transmission characteristics with low loss as compared with general resin substrate materials.
  • the in-plane conductor pattern 303 and the interlayer conductor pattern 304 are formed by using a well-known method using screen printing, laser processing, etc.
  • Body layers 30a-30d, 30h and magnetic layers 30e-30g are prepared.
  • the dielectric layers 30b, 30c having the openings OP are exposed from the resin sealing layer 33c in the cavities formed by temporary pressure bonding.
  • the secure IC 33 is arranged so that the end surface of the post electrode 33b faces upward.
  • the high frequency module 3 is manufactured by thermocompression bonding.
  • the RFIC 31 which is an electronic component that handles RF signals for communication, is provided on one main surface side of the magnetic layers 30e to 30g included in the multilayer resin substrate 30, and the other electronic components Since the secure IC 33 is provided on the other main surface side of the magnetic layers 30e to 30g, radiation noise (electromagnetic waves) from the RFIC 31 caused by a high-frequency signal to be handled is the magnetic layers 30e to 30g (magnetic material). Since heat is generated and lost by passing through, the influence of radiation noise from the RFIC 31 on other electronic components such as the secure IC 33 can be reduced, and the isolation characteristics between the RFIC 31 and the secure IC 33 are improved. can do.
  • the inductor elements L1 and L2 forming the matching circuit 32 are provided in the magnetic layers 30e to 30g, and the inductances of the inductor elements L1 and L2 increase. Therefore, the inductor elements L1 and L2 can be downsized. Therefore, the high-frequency module 3 can be reduced in size.
  • the characteristic of the passive element is changed by combining the ground pattern formed in a shape that covers one surface of the electronic component without a gap and the various passive elements provided on the multilayer resin substrate 30 as in the past. There is no possibility that the Q value of a circuit formed by the passive element deteriorates.
  • each of the magnetic layers 30e to 30g is formed by mixing a magnetic powder with a resin material, the rigidity is higher than that of the dielectric layers 30a to 30d and 30h, and the multilayer resin wiring board 30 has a higher rigidity. Stiffness can be improved. Therefore, the flexural strength of the high-frequency module 3 can be improved, and the mechanical strength of the RFIC 31 mounted on the multilayer resin wiring substrate 30 and the built-in secure IC 33 can be reinforced.
  • the magnetic layers 30e to 30g are arranged between the RFIC 31 and the secure IC 33, the RFIC 31 caused by the RF signal is transmitted to the secure IC 33 that handles the baseband signal obtained by demodulating the input RF signal by the RFIC 31. It is possible to prevent the radiation noise from affecting.
  • the secure IC 33 is built in the multilayer resin wiring board 30, the high-frequency module 3 can be reduced in size.
  • the coil patterns 32a and 32b are coupled with a predetermined mutual inductance M and are arranged adjacent to the magnetic layers 30e to 30g in the layer direction, so that the inductor elements L1 and L2 can be formed with a smaller number of turns. L1 and L2 can be reduced in size, and magnetic field noise radiated from the inductor elements L1 and L2 can be reduced.
  • FIG. 7 is a sectional view showing a high-frequency module according to the second embodiment of the present invention.
  • FIG. 8 is a diagram showing an arrangement relationship of inductor elements provided on a wiring board provided in the high frequency module of FIG. This embodiment differs from the first embodiment described above in that a secure IC 33 is provided on the surface terminal 301 on the surface of the multilayer resin wiring board 30 on one main surface side of the magnetic layers 30e to 30g, as shown in FIG.
  • the RFIC 31 is built in the dielectric layers 30b and 30c on the other main surface side of the magnetic layers 30e to 30g.
  • the coil patterns 32a and 32b are arranged adjacent to each other in the plane direction of the magnetic layers 30e to 30g so that at least the spiral winding axes do not overlap with each other, and the inductor elements L1 and L2 are formed.
  • the inductor elements L1 and L2 are arranged in the magnetic layers 30e to 30g so as to form a closed magnetic path due to the magnetic field MF generated in the coil patterns 32a and 32b. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the RFIC 31 includes a post electrode 31b connected to an integrated circuit provided on a semiconductor substrate 31a such as Si or GaAs, and a resin sealing layer 31c formed so as to cover the side surface of the post electrode 31b.
  • the wiring layer is provided and is formed in a so-called CSP, and the end face of the post electrode 31b exposed from the resin sealing layer 31c and the interlayer conductor pattern 304 are directly connected.
  • a heat dissipation interlayer conductor pattern 304a is connected to the surface of the RFIC 31 opposite to the integrated circuit formation surface of the semiconductor substrate 31a, and the heat of the RFIC 31 is radiated to the outside of the multilayer resin substrate 30. Has been.
  • coil patterns 32a and 32b are formed on the magnetic layers 30e to 30g so as to be adjacent to each other in the plane direction.
  • the coil patterns 32a and 32b formed on the magnetic layers 30e to 30g are connected to each other by the interlayer conductor pattern 304, thereby forming spiral inductor elements L1 and L2.
  • the two coil patterns 32a and 32b forming the inductor elements L1 and L2 are arranged so that at least the spiral winding axes do not overlap with each other, and the two coil patterns 32a and 32b are formed in the magnetic layers 30e to 30g. Since the closed magnetic circuit is formed by the magnetic field MF generated in 32b, magnetic field noise radiated from the inductor elements L1 and L2 can be reduced.
  • Capacitor elements C1 and C2 (capacitor elements 32c and 32d), which are passive elements that form the matching circuit 32 together with the inductor elements L1 and L2, and the RFIC 31 are arranged with the magnetic layers 30e to 30g interposed therebetween. Therefore, it is possible to prevent radiation noise from the RFIC 31 caused by the RF signal from affecting the capacitor elements C1 and C2 and changing the characteristics of the matching circuit 32.
  • the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.
  • the high-frequency module 3 is described as an example for configuring an RFID system, but the high-frequency module to which the present invention is applied is not limited thereto.
  • either one of the RFIC 31 and the secure IC 33 is not necessarily built in the multilayer resin substrate 30, and the RFIC 31 and the secure IC 33 may be arranged with the magnetic layers 30e to 30g interposed therebetween. Further, the wiring board may be formed of only the magnetic layer. In this case, the RFIC 31 may be disposed on one surface of the magnetic layer and the secure IC 33 may be disposed on the other surface.
  • the present invention can be widely applied to a high-frequency module that is provided on a wiring board and includes an RFIC that is an electronic component that handles high-frequency signals, a matching circuit, and other electronic components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transmitters (AREA)
  • Transceivers (AREA)
  • Structure Of Receivers (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention porte sur une technologie qui permet de réduire l'impact d'un bruit rayonné provenant d'un RFIC - un composant électronique destiné à manipuler un signal de haute fréquence - sur un autre composant électronique et qui permet de rendre un module plus faible. Du fait que les couches du corps magnétique (30e-30g) sont disposées entre le RFIC (31) - un composant électronique destiné à manipuler un signal de haute fréquence - et un CI sécurisé (33), le bruit rayonné (ondes électromagnétiques) depuis le RFIC (31) causé par le signal RF est perdu à cause de l'échauffement, alors que le bruit rayonné traverse les couches du corps magnétique (30e-30g), de sorte que l'impact du bruit rayonné du RFIC (31) sur un autre composant électronique tel que le CI sécurisé (33) peut être réduit. En outre, étant donné que les composants d'inducteurs (L1, L2) constituant un circuit d'adaptation (32), sont respectivement disposés sur les couches du corps magnétique (30e-30g) de manière à augmenter les composants d'inducteurs, ces derniers peuvent être plus petits, de sorte que ce module haute fréquence (3) peut être réduit.
PCT/JP2012/082612 2012-01-11 2012-12-17 Module de haute fréquence WO2013105397A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013553225A JP5541424B2 (ja) 2012-01-11 2012-12-17 高周波モジュール
CN201290001126.5U CN204316869U (zh) 2012-01-11 2012-12-17 高频模块

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012003078 2012-01-11
JP2012-003078 2012-01-11

Publications (1)

Publication Number Publication Date
WO2013105397A1 true WO2013105397A1 (fr) 2013-07-18

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PCT/JP2012/082612 WO2013105397A1 (fr) 2012-01-11 2012-12-17 Module de haute fréquence

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JP (1) JP5541424B2 (fr)
CN (1) CN204316869U (fr)
WO (1) WO2013105397A1 (fr)

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JP2015111609A (ja) * 2013-12-06 2015-06-18 大日本印刷株式会社 通信装置
WO2016050349A1 (fr) * 2014-10-04 2016-04-07 Paragon Ag Rack de stockage d'appareils terminaux rechargeables avec dispositif support de commutation
JP2017512424A (ja) * 2014-02-26 2017-05-18 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ チューナブルフィルタ用パッケージ
JP2018037462A (ja) * 2016-08-29 2018-03-08 京セラ株式会社 印刷配線板およびその製造方法
US10104766B2 (en) 2015-06-25 2018-10-16 Murata Manufacturing Co., Ltd. Resin substrate and electronic device
CN111509122A (zh) * 2020-04-20 2020-08-07 上海航天电子通讯设备研究所 一种内埋置无源阻容元件的lcp封装基板及制作方法

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