WO2013099145A1 - Module d'émission de lumière et appareil d'éclairage pour véhicule - Google Patents

Module d'émission de lumière et appareil d'éclairage pour véhicule Download PDF

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Publication number
WO2013099145A1
WO2013099145A1 PCT/JP2012/008049 JP2012008049W WO2013099145A1 WO 2013099145 A1 WO2013099145 A1 WO 2013099145A1 JP 2012008049 W JP2012008049 W JP 2012008049W WO 2013099145 A1 WO2013099145 A1 WO 2013099145A1
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WIPO (PCT)
Prior art keywords
light emitting
semiconductor light
resistor
emitting module
emitting element
Prior art date
Application number
PCT/JP2012/008049
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English (en)
Japanese (ja)
Inventor
祥敬 佐々木
主 時田
Original Assignee
株式会社小糸製作所
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Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to CN201280064626.8A priority Critical patent/CN104011884B/zh
Publication of WO2013099145A1 publication Critical patent/WO2013099145A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines

Definitions

  • the present invention relates to a light emitting module and a vehicular lamp including the light emitting module.
  • a light distribution pattern having an approximately rectangular light distribution pattern in which an irradiation region extends in the vehicle width direction and a light distribution pattern in which the central portion of the irradiation region is brighter than the peripheral portion is required.
  • LEDs light emitting diodes
  • the light emitting area of the semiconductor light emitting element located inside the both ends is more than the light emitting area of the semiconductor light emitting element located at both ends among the plurality of semiconductor light emitting elements arranged in a straight line. Is also small. Since the semiconductor light emitting device having a small light emitting area has a high current density, the light emission luminance near the center of the module is high.
  • the present invention has been made in view of such a situation, and an object of the present invention is to provide a light emitting module in which the luminance of the semiconductor light emitting element disposed in the central portion is higher than the luminance of the semiconductor light emitting element disposed in the peripheral portion.
  • the object is to provide a technique that can be realized with a simple configuration.
  • a light emitting module is a light emitting module used for a vehicular lamp, and includes a plurality of semiconductor light emitting elements arranged linearly.
  • the plurality of semiconductor light emitting elements are disposed at both ends of the module and are connected in series with each other, and are disposed at the center of the module, and emit light more than the first semiconductor light emitting element.
  • one or more second semiconductor light emitting elements configured to be capable of increasing the luminance of the light emitting element.
  • the first semiconductor light emitting element and the second semiconductor light emitting element are connected in parallel.
  • the currents flowing through the first semiconductor light emitting element and the second semiconductor light emitting element can be made different from each other. Therefore, a light emitting module having a high luminance at the central portion can be realized. For example, when applied to a vehicular lamp, a desired light distribution pattern with a bright central portion can be realized.
  • the second resistor has a smaller electrical resistance than the first resistor. Accordingly, the currents flowing through the first semiconductor light emitting element and the second semiconductor light emitting element can be made different from each other with a simple configuration without particularly controlling the current and voltage flowing through each element.
  • An LED package on which a plurality of semiconductor light emitting elements are mounted may be further provided. At least one of the first resistor and the second resistor is disposed at a location affected by the temperature change of the LED package, and at least one of the first resistor and the second resistor is positive. It may have a temperature coefficient. Thereby, even if the resistance of the light emitting diode as the semiconductor light emitting element decreases (increases) due to the temperature change, the resistance of the resistor arranged at the place affected by the temperature change of the LED package increases (decreases). As a result, the change in resistance of the entire light emitting module is alleviated. Therefore, even when the light emitting module is driven at a constant voltage, the temperature dependence of the current flowing through the light emitting diode can be reduced.
  • a control unit that independently controls the current flowing through the first semiconductor light emitting element and the second semiconductor light emitting element may be further provided. Thereby, the currents flowing through the first semiconductor light emitting element and the second semiconductor light emitting element can be made different from each other. Therefore, a light emitting module having a high luminance at the central portion can be realized. For example, when applied to a vehicular lamp, a desired light distribution pattern with a bright central portion can be realized.
  • the control unit may increase the amount of current flowing through the second semiconductor light emitting element when forming the light distribution pattern for high beam as compared with the case of forming the light distribution pattern for low beam.
  • the control unit may increase only the amount of current flowing through the second semiconductor light emitting element disposed in the central portion of the light emitting module, which has a large influence on the distance visibility, and is disposed at both ends of the light emitting module. Therefore, it is not necessary to increase the amount of current flowing through the first semiconductor light emitting element that has a small effect on the performance. Thereby, the increase in power consumption at the time of forming the light distribution pattern for high beams can be suppressed.
  • a desired light distribution pattern with a bright central portion can be realized with a simple configuration.
  • a light emitting module in which the brightness of the semiconductor light emitting element disposed in the central part is higher than the brightness of the semiconductor light emitting element disposed in the peripheral part can be realized with a simple configuration.
  • FIG. 1 is a front view showing a vehicular lamp according to a first embodiment. It is a sectional side view of a vehicle lamp unit. It is a figure which shows the light emitting module which concerns on this Embodiment. It is the circuit diagram which showed typically the connection state of each semiconductor light-emitting element and a power supply. It is a figure which shows an example of the light distribution pattern of a vehicle lamp. It is a schematic diagram of the light emitting module which concerns on 2nd Embodiment. It is a schematic diagram of the light emitting module which concerns on 3rd Embodiment. FIG.
  • FIG 8A is a schematic view showing the arrangement of the first semiconductor light emitting element and the second semiconductor light emitting element in the light emitting module having the total number of semiconductor light emitting elements of 4, and FIG. It is the schematic diagram which showed arrangement
  • FIG. 1 is a front view showing a vehicular lamp 100 according to the first embodiment.
  • the vehicle lamp 100 is, for example, a vehicle headlamp for low beam irradiation that irradiates light in a predetermined irradiation direction in front of the vehicle.
  • the vehicular lamp 100 accommodates three vehicular lamp units 10 in a horizontal row in a lamp chamber formed by a transparent cover 102 and a lamp body 104 constituting the lamp chamber.
  • vehicle lamp units 10 have the same or similar configuration, and when the vehicle lamp 100 is attached to the vehicle body, the optical axis is about 0.3 to 0.6 ° downward with respect to the vehicle longitudinal direction. It is accommodated in the lamp chamber.
  • the vehicular lamp 100 irradiates light ahead of the vehicle based on the light emitted by the vehicular lamp unit 10 to form a predetermined light distribution pattern.
  • the vehicular lamp 100 may include a plurality of vehicular lamp units 10 having different light distribution characteristics.
  • FIG. 2 is a side sectional view of the vehicular lamp unit 10.
  • the vehicular lamp unit 10 is a direct-type vehicular lamp unit that irradiates light emitted from the light emitting module 16 directly forward by the projection lens 12 that is an optical member.
  • the vehicular lamp unit 10 includes a support member 18, a light shielding member 14, a light emitting module 16, and a projection lens 12.
  • the support member 18 is a plate-like body that causes the light emitting module 16 to emit light toward the front of the vehicle by supporting and fixing the bottom surface of the light emitting module 16 on the surface facing the front of the vehicle.
  • the support member 18 is provided upright in the vertical direction.
  • a heat sink 19 that dissipates heat generated by the light emitting module 16 is provided at the upper and lower ends of the support member 18. The heat sink 19 can prevent the light emission efficiency of the light emitting module 16 from being reduced by heat.
  • the light shielding member 14 is a plate-like body provided to face the upper surface of the support member 18 with the light emitting module 16 interposed therebetween, and blocks the light generated by the light emitting module 16 at the upper edge portion, thereby Based on the projected shape of the edge in the front direction, a light / dark boundary of light incident on the projection lens 12 is defined.
  • the projected shape is, for example, a straight shape extending in the left-right direction of the vehicle.
  • the lower end of the light shielding member 14 is connected to the lower end of the support member 18, and the light shielding member 14 and the support member 18 are integrally formed.
  • the light emitting module 16 includes a substrate 22 having a bottom surface fixed on a support member 18, a plurality of semiconductor light emitting elements 20 arranged in a straight line on the upper surface of the substrate 22, and a translucent member that seals the semiconductor light emitting elements 20. 24.
  • the translucent member 24 is formed of a material that transmits light generated by the semiconductor light emitting element 20 such as a transparent resin.
  • the light emitting module 16 is disposed such that the arrangement direction of the plurality of semiconductor light emitting elements 20 is the left-right direction of the vehicle.
  • the light emitting module 16 is arranged so that the center of the semiconductor light emitting element 20 in the vertical direction is located on the optical axis Ax of the projection lens 12. Details of the light emitting module 16 will be described later.
  • the projection lens 12 is composed of a biconvex lens whose front surface and rear surface are convex, and its focal length fa is set to a relatively large value.
  • the projection lens 12 is fixed to the support member 18 via a connecting member (not shown).
  • the projection lens 12 is an optical system provided in common to the plurality of semiconductor light emitting elements 20 of the light emitting module 16, is provided in front of the vehicle with respect to the light emitting module 16, and transmits light generated by the light emitting module 16. Thus, the light is irradiated in a predetermined irradiation direction in front of the vehicle.
  • the projection lens 12 is disposed such that the rear focal point F as the optical center is located on the center line of the plurality of semiconductor light emitting element arrays.
  • the light emitted from the light emitting module 16 is inverted and irradiated forward by the projection lens 12 so as to converge slightly toward the optical axis Ax.
  • the light emitted from the light emitting module 16 that is directed downward from the optical axis Ax is shielded by the light shielding member 14, thereby moving forward from the vehicle lamp unit 10.
  • the upward light is not irradiated.
  • FIG. 3 is a diagram showing the light emitting module 16 according to the present embodiment.
  • the light emitting module 16 is a linear light source extending in the left-right direction of the vehicle, and includes a substrate 22, a plurality of semiconductor light emitting elements 20a to 20d, and a translucent member.
  • illustration of the translucent member is abbreviate
  • the plurality of semiconductor light emitting elements 20a to 20d are arranged on the substrate 22 in the order of the first semiconductor light emitting element 20a, the second semiconductor light emitting elements 20b and 20c, and the first semiconductor light emitting element 20d from the left side in a top view. They are arranged in a straight line at equal intervals. That is, the plurality of semiconductor light emitting elements 20a to 20d are disposed at the center of the light emitting module 16 and the plurality of first semiconductor light emitting elements 20a and 20d disposed on both ends of the light emitting module 16. And a plurality of second semiconductor light emitting elements 20b and 20c configured to be capable of increasing luminance at the time of light emission than the elements 20a and 20d. Note that there may be one second semiconductor light emitting element.
  • the semiconductor light emitting elements 20a to 20d are white LEDs that emit white light.
  • the semiconductor light emitting devices 20a to 20d emit, for example, blue light to a phosphor (not shown) provided on the surface, thereby causing the phosphor to emit yellow light and generate white light as a whole of the device. To do.
  • substantially the entire area of the upper surface shown in FIG. 3 is a light emitting area.
  • the semiconductor light emitting elements 20a to 20d are LED chips having a light emission area of approximately 1 mm square.
  • FIG. 4 is a circuit diagram schematically showing a connection state between each semiconductor light emitting element and a power source.
  • the first semiconductor light emitting elements 20a and 20d and the second semiconductor light emitting elements 20b and 20c are formed by a wiring pattern (not shown) formed on the substrate 22. Electrically connected.
  • the anode of the first semiconductor light emitting element 20a is connected to the positive terminal of the power supply device 21 shown in FIG. 4, and the cathode of the first semiconductor light emitting element 20a is the anode of the first semiconductor light emitting element 20d. Connected to.
  • the cathode of the first semiconductor light emitting element 20d is connected to the negative terminal of the power supply device 21 via the first resistor R1.
  • the anode of the second semiconductor light emitting element 20b is connected to the positive terminal of the power supply device 21, and the cathode of the second semiconductor light emitting element 20b is connected to the anode of the second semiconductor light emitting element 20c.
  • the cathode of the second semiconductor light emitting element 20c is connected to the negative terminal of the power supply device 21 via the second resistor R2.
  • the two first semiconductor light emitting elements 20 a and 20 d arranged on both ends of the light emitting module 16 are connected in series to the power supply device 21.
  • the two second semiconductor light emitting elements 20 b and 20 c arranged at the center of the light emitting module 16 are connected in series to the power supply device 21.
  • the first semiconductor light emitting elements 20a and 20d and the second semiconductor light emitting elements 20b and 20c are connected in parallel.
  • the first semiconductor light emitting elements 20a, 20d and the second semiconductor light emitting elements 20b, 20c are connected in parallel, so that the first semiconductor light emitting elements 20a, 20d and the second semiconductor light emitting elements are connected.
  • the currents flowing through 20b and 20c can be made different from each other. Therefore, if the current passed through the second semiconductor light emitting elements 20b and 20c is increased, the light emitting module 16 having high luminance at the center can be realized.
  • the vehicle lamp unit 10 provided with such a light emitting module 16 can implement
  • the light emitting module 16 includes a first resistor R1 connected in series with the first semiconductor light emitting elements 20a and 20d, and a second semiconductor light emitting element 20b and 20c in series. And it has further 2nd resistor R2 connected in parallel with 1st resistor R1. Further, the second resistor R2 has a smaller electrical resistance than the first resistor R1. Thereby, even if it does not control especially the electric current and voltage which flow into each semiconductor light-emitting device, it is simple structure, and it is 2nd semiconductor light-emitting device 20b, 20c rather than the electric current which flows into 1st semiconductor light-emitting device 20a, 20d. The flowing current can be increased. Therefore, the second semiconductor light emitting elements 20b and 20c arranged inside the light emitting module have higher emission luminance than the first semiconductor light emitting elements 20a and 20d arranged on both ends.
  • a current control circuit for individually controlling the current flowing to each semiconductor light emitting element is not necessary.
  • a current control circuit for individually controlling the current flowing to each semiconductor light emitting element is not necessary.
  • even in a light emitting module in which a plurality of semiconductor light emitting elements having the same size and performance are arranged it is possible to easily vary the brightness of each element, so there is no need to use a plurality of types of semiconductor light emitting elements, and the light emitting module Cost is reduced.
  • mounting a single type of semiconductor light emitting devices on a substrate reduces manufacturing costs by simplifying the process and improving mass productivity. it can.
  • the projection lens 12 is placed on the center line C of the four semiconductor light emitting element rows. It arrange
  • FIG. 5 shows an example of a light distribution pattern of the vehicular lamp 100.
  • a light distribution pattern 400 illustrated in FIG. 5 is a left low beam light distribution pattern formed on a virtual vertical screen disposed at a position 25 m ahead of the vehicular lamp 100.
  • the light distribution pattern 400 is formed as a combined light distribution pattern of the three vehicle lamp units 10 included in the vehicle lamp 100.
  • the light distribution pattern 400 has a horizontal cut line CL1 and an oblique cut line CL2 that define a vertical light-dark boundary at the upper end thereof.
  • the horizontal cut line CL1 is set slightly below (downward from about 0.5 to 0.6 °) with respect to the front of the vehicle lamp 100 (intersection of the horizontal axis H and the vertical axis V).
  • the oblique cut line CL2 is inclined about 15 ° to the upper left from the intersection of the vertical axes V and CL1.
  • the horizontal cut line CL1 in the light distribution pattern 400 is formed by the horizontal edge of the upper edge portion of the light shielding member 14.
  • the oblique cut line CL2 is formed by the inclined edge of the upper edge portion of the light shielding member 14.
  • a region in the vicinity of the intersection of the horizontal axis H and the vertical axis V in the light distribution pattern is referred to as a hot zone 402 and is preferably illuminated brighter than other regions of the light distribution pattern 400 from the viewpoint of safety. .
  • the formation accuracy of the horizontal cut line CL1 and the oblique cut line CL2 of the light distribution pattern will be examined.
  • the first semiconductor light emitting elements 20a and 20d and the second semiconductor light emitting elements 20b and 20c are connected in parallel, and are connected in series with the second semiconductor light emitting elements 20b and 20c. Since the electric resistance of the second resistor R2 is set to be smaller than the electric resistance of the first resistor R1 connected in series with the first semiconductor light emitting elements 20a and 20d, the second resistor R2 is disposed inside the light emitting module.
  • the second semiconductor light emitting elements 20b and 20c have higher luminance than the first semiconductor light emitting elements 20a and 20d disposed on both ends of the light emitting module.
  • the vehicular lamp unit 10 When the vehicular lamp unit 10 is configured using the light emitting module 16 so that the rear focal point F of the projection lens 12 as the optical center of the optical system is located on the center line C of the semiconductor light emitting element array, The brightness of the inner second semiconductor light emitting elements 20b and 20c close to the rear focal point F increases, so that the amount of light passing through the rear focal point F increases.
  • the optical system of the vehicular lamp unit is configured such that light passing through the optical center forms a light distribution pattern with the highest accuracy, so that the amount of light passing through the rear focal point F increases,
  • the horizontal cut line CL1 and the oblique cut line CL2 of the light distribution pattern can be clearly formed.
  • the hot zone 402 can be illuminated brightly by increasing the amount of light passing through the rear focal point F of the projection lens 12. Furthermore, since only the second semiconductor light emitting elements 20b and 20c arranged on the inner side where the light use efficiency for forming the light distribution pattern is relatively high increases in luminance, the loss of power consumption can be reduced.
  • positioned three or more semiconductor light emitting elements linearly may be sufficient. Also, considering the internal resistance of each semiconductor light emitting element, it is possible to omit either the first resistor or the second resistor.
  • the power supply device 21 may be provided inside the vehicle lamp unit 10 or may be provided outside. Further, the control of the current to each semiconductor light emitting element is not limited to the constant voltage control as in the case where it is directly connected to the battery on the vehicle side, and may be control via a lighting circuit.
  • the present invention can be applied to a vehicle headlamp configured to be able to switch between a low beam light distribution pattern and a high beam light distribution pattern.
  • FIG. 6 is a schematic diagram of a light emitting module according to the second embodiment.
  • FIG. 6 mainly shows the circuit configuration. Note that descriptions of configurations, operations, and effects similar to those of the first embodiment are omitted as appropriate.
  • the first semiconductor light emitting element 20a is connected in series with the first resistor R1
  • the second semiconductor light emitting element 20b is connected in series with the second resistor R2.
  • 20c is connected in series with the third resistor R3, and the first semiconductor light emitting element 20d is connected in series with the fourth resistor R4.
  • the second resistor R2 and the third resistor R3 have a smaller electrical resistance than the first resistor R1 and the fourth resistor R4.
  • the second semiconductor light emitting element 20b, 20b, 20b, 20c, 20d, and 20d can be compared with the current flowing through the first semiconductor light emitting elements 20a, 20d with a simple configuration without special control of the current and voltage flowing through the semiconductor light emitting elements 20a-20d.
  • the current flowing through 20c can be increased. Therefore, the second semiconductor light emitting elements 20b and 20c arranged inside the light emitting module 116 have higher emission luminance than the first semiconductor light emitting elements 20a and 20d arranged on both ends.
  • FIG. 7 is a schematic diagram of a light emitting module according to the third embodiment.
  • FIG. 7 mainly shows the circuit configuration. Note that descriptions of configurations, operations, and effects similar to those of the above-described embodiments are omitted as appropriate.
  • the light emitting module 16 is a linear light source extending in the left-right direction of the vehicle, and includes a plurality of semiconductor light emitting elements 120a to 120c and a control unit 122.
  • the plurality of semiconductor light emitting elements 120a to 120c will be described as having the same configuration as each of the semiconductor light emitting elements 20a to 20d according to the first embodiment.
  • the plurality of semiconductor light emitting elements 120a to 120c are arranged on a substrate (not shown) in the order of the first semiconductor light emitting element 120a, the second semiconductor light emitting element 120b, and the first semiconductor light emitting element 120c from the left side of FIG. They are arranged in a straight line at substantially equal intervals. That is, the plurality of semiconductor light emitting elements 120a to 120c are disposed at the center of the light emitting module 216 and the plurality of first semiconductor light emitting elements 120a and 120c disposed on both ends of the light emitting module 216. And a second semiconductor light emitting element 120b configured to be able to increase luminance at the time of light emission than the elements 120a and 120c.
  • the second semiconductor light emitting element may be plural.
  • the first semiconductor light emitting elements 120a and 120c and the second semiconductor light emitting element 120b are provided in independent energization paths, respectively.
  • the control unit 122 independently controls the currents flowing through the first semiconductor light emitting elements 120a and 120c and the second semiconductor light emitting element 120b. Thereby, the currents flowing through the first semiconductor light emitting elements 120a and 120c and the second semiconductor light emitting element 120b can be made different from each other. Therefore, a light emitting module having a high luminance at the central portion can be realized. For example, when applied to a vehicular lamp, a desired light distribution pattern with a bright central portion can be realized.
  • the light emitting module 216 is applied to a vehicle lamp unit configured to realize both a high beam light distribution pattern and a low beam light distribution pattern with one type of light source. Can be installed as.
  • the control unit 122 makes the amount of current flowing through the first semiconductor light emitting elements 120a and 120c and the second semiconductor light emitting element 120b substantially the same, and emits each semiconductor light emitting element.
  • the luminances of the elements 120a to 120c are made almost equal.
  • the control unit 122 can increase the amount of current flowing through the second semiconductor light emitting element 120b as compared with the case of forming the low beam light distribution pattern. It is configured as follows.
  • the second semiconductor light emitting element 120b which is disposed in the central portion of the light emitting module 216 and has a large influence on far visibility, and is disposed on both ends of the light emitting module 216.
  • the amount of current flowing through the first semiconductor light emitting elements 120a and 120c which has a small influence on far visibility, does not need to be increased.
  • the vehicle headlamp it is possible to suppress an increase in power consumption when forming a high beam light distribution pattern.
  • FIG. 8A is a schematic view showing the arrangement of the first semiconductor light emitting element and the second semiconductor light emitting element in the light emitting module having the total number of semiconductor light emitting elements of 4, and FIG. It is the schematic diagram which showed arrangement
  • a light emitting module 218 shown in FIG. 8A has two first semiconductor light emitting elements 130a and 130d on both ends, and two second semiconductor light emitting elements 130b and 130c near the center.
  • the light emitting module 220 shown in FIG. 8B includes two first semiconductor light emitting elements 140a and 140e on both ends, and three second semiconductor light emitting elements 130b to 130d near the center.
  • one or more second light lines pass through the center of the light emitting surface of the light emitting module and are perpendicular to the longitudinal direction of the light emitting surface.
  • the semiconductor light emitting elements are arranged to be line symmetric.
  • Each semiconductor light emitting element has a shape that is symmetric with respect to the center of the light emitting surface.
  • the shape of the light emitting surface of each half conductor light emitting element is a square or a rectangle.
  • the ratio of the light emitting area of the second semiconductor light emitting element that increases the luminance by increasing the current by increasing the current in the light emitting area of the light emitting module is about 30% to 60% of the area of the entire light emitting surface. There should be. Thereby, compared with the case where the current of all the semiconductor light emitting elements is increased, the increase in power consumption can be suppressed to about 40% to 70%.
  • FIG. 9 is a diagram showing the relationship between ambient temperature and voltage when a general LED is driven with a constant current. As shown in FIG. 9, it can be seen that the drive voltage of the LED decreases as the ambient temperature increases.
  • FIG. 10 is a diagram showing the temperature dependence of the voltage-current characteristics of a general LED. As shown in FIG. 10, it can be seen that the change in current with respect to the change in voltage increases as the ambient temperature rises like T0, T1, and T2. Due to such characteristics, a ballast such as a control circuit is separately required to drive a general LED at a constant current.
  • the present inventor generally connects a resistor having a positive temperature coefficient in series with an LED having a negative temperature coefficient as a resistance component, so that the variation in brightness with respect to a change in temperature is reduced.
  • the idea was that a small number of light emitting modules could be realized with a simple configuration.
  • the light emitting module according to the first embodiment it is preferable to use materials having the following configurations as the first resistor R1 and the second resistor R2.
  • FIG. 11 is a top view showing a schematic configuration of the light emitting module according to the fourth embodiment.
  • the light emitting module 222 includes an LED package 224 on which the first semiconductor light emitting elements 150a and 150d that are LEDs and the second semiconductor light emitting elements 150b and 150c that are LEDs are mounted, a first resistor R1, and a second resistor. Resistor R2 (hereinafter, referred to as “resistors R1, R2” as appropriate).
  • the LED package 224 includes a heat conductive insulating substrate 230 formed of ceramic or the like, and a wiring pattern 232 formed on the heat conductive insulating substrate 230.
  • the first resistor R1 is connected in series with the first semiconductor light emitting elements 150a and 150d.
  • the second resistor R2 is connected in series with the second semiconductor light emitting elements 150b and 150c. Note that the second resistor R2 has a smaller electrical resistance than the first resistor R1.
  • Resistors R 1 and R 2 are flip-chip mounted on the wiring pattern 232 of the LED package 224. For this reason, the resistors R1 and R2 are arranged at a location that is affected by the temperature change of the LED package 224.
  • Resistors R1 and R2 according to the present embodiment have a positive temperature coefficient.
  • FIG. 12 is a diagram illustrating the relationship between the ambient temperature and the voltage when the light emitting module according to this embodiment is driven with a constant current.
  • the light emitting module according to the present embodiment is a resistor arranged at a location that is affected by the temperature change of the LED even if the resistance of each of the semiconductor light emitting elements 150a to 150d that are LEDs decreases (increases) due to the temperature change.
  • the resistances of R1 and R2 increase (decrease). Therefore, by appropriately designing the material and configuration of the resistor according to the LED to be used, the change in the resistance of the light emitting module as a whole is mitigated.
  • the light emitting module according to the present embodiment is less temperature dependent on the voltage than the LED only light emitting module. In other words, even when the light emitting module according to this embodiment is driven at a constant voltage, the temperature dependence of the current flowing through the light emitting diode can be reduced. That is, a light-emitting module with little variation in brightness with respect to a change in temperature can be realized using a simple control circuit or without using a control circuit or the like.
  • the life of the control circuit is usually shorter than the life of the LED chip, the life of the entire light emitting module depends on the life of the control circuit. However, if the light emitting module can be configured without using the control circuit, the life of the light emitting module and the lamp equipped with the light emitting module can be extended to the original life of the LED chip.
  • Table 1 exemplifies volume resistivity and temperature coefficient values of a metal material having a positive temperature coefficient.
  • FIG. 13 is a diagram showing the relationship between the volume resistivity and the temperature coefficient of the metal materials shown in Table 1.
  • the volume resistivity indicates a value of 0 ° C.
  • At least one of the resistors R1 and R2 of the present embodiment may have a volume resistivity at 0 ° C. of 2 ⁇ 10 ⁇ 8 [ ⁇ ⁇ m] or more. More preferably, the volume resistivity at 0 ° C. is 3 ⁇ 10 ⁇ 8 [ ⁇ ⁇ m] or more.
  • At least one of the resistors R1 and R2 only needs to have a positive temperature coefficient between 0 ° C. and 100 ° C. More preferably, at least one of the resistors R1 and R2 has a temperature coefficient between 0 ° C. and 100 ° C. of 0.05 [10 ⁇ 3 / ° C.] or more.
  • Some resistors constituting the circuit have a positive temperature coefficient in some cases, but the value is very small. And it is avoided to use a resistor having a large positive temperature coefficient in the circuit.
  • a combination of a resistor having a positive temperature coefficient that is large enough to avoid use in a circuit in general and an LED having a negative temperature coefficient as a resistance component in general makes it possible to change the LED package 224 due to temperature changes. The change in the overall resistance can be more relaxed.
  • the present invention has been described with reference to the above-described embodiments.
  • the present invention is not limited to the above-described embodiments, and the configurations of the embodiments are appropriately combined or replaced. Those are also included in the present invention. Further, it is possible to appropriately change the combination and processing order in each embodiment based on the knowledge of those skilled in the art and to add various modifications such as various design changes to each embodiment. Embodiments to which is added can also be included in the scope of the present invention.
  • the present invention can be used for a vehicular lamp.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un module d'émission de lumière (16) conçu pour être intégré dans un appareil d'éclairage pour véhicule et muni d'une pluralité d'éléments électroluminescents à semi-conducteurs, qui sont disposés de façon linéaire. Les éléments électroluminescents à semi-conducteurs selon l'invention comprennent : une pluralité d'éléments électroluminescents à semi-conducteurs (20a, 20d) primaires, qui sont disposés sur les deux extrémités du module et qui sont connectés en série les uns aux autres ; et un ou plusieurs éléments électroluminescents à semi-conducteurs (20b, 20c) secondaires, chacun de ceux-ci étant disposé au niveau de la partie centrale du module et étant configuré de sorte que l'élément puisse avoir une luminance supérieure à celle des éléments électroluminescents à semi-conducteurs primaires lorsqu'il émet la lumière. Les éléments électroluminescents à semi-conducteurs (20a, 20d) primaires et les éléments électroluminescents à semi-conducteurs (20b, 20c) secondaires sont connectés en parallèle.
PCT/JP2012/008049 2011-12-26 2012-12-17 Module d'émission de lumière et appareil d'éclairage pour véhicule WO2013099145A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280064626.8A CN104011884B (zh) 2011-12-26 2012-12-17 发光模块及车辆用灯具

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JP2011-284234 2011-12-26
JP2011284234A JP5952557B2 (ja) 2011-12-26 2011-12-26 発光モジュールおよび車両用灯具

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WO2013099145A1 true WO2013099145A1 (fr) 2013-07-04

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Publication number Priority date Publication date Assignee Title
DE102015013191A1 (de) * 2015-10-10 2017-04-13 Daimler Ag Verfahren zum Betrieb einer Leuchteinheit und Leuchteinheit
JP6872413B2 (ja) * 2017-04-28 2021-05-19 株式会社小糸製作所 車両用灯具
JP6991811B2 (ja) * 2017-09-25 2022-02-03 株式会社小糸製作所 車両用前照灯
CN112368848B (zh) * 2018-06-21 2024-08-06 新唐科技日本株式会社 白色发光装置

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JPH01306264A (ja) * 1988-06-03 1989-12-11 Matsushita Graphic Commun Syst Inc 発光ダイオードアレー
JP2001287398A (ja) * 2000-04-06 2001-10-16 Nippon Sheet Glass Co Ltd 自己走査型発光素子アレイおよびその駆動方法
JP2004039466A (ja) * 2002-07-04 2004-02-05 Koito Mfg Co Ltd 車両用灯具
JP2005324657A (ja) * 2004-05-13 2005-11-24 Toyota Motor Corp 車両用前照灯装置
JP2006267780A (ja) * 2005-03-25 2006-10-05 Funai Electric Co Ltd 液晶表示装置
JP2007317423A (ja) * 2006-05-24 2007-12-06 Harison Toshiba Lighting Corp バックライトユニット
WO2008136359A1 (fr) * 2007-04-26 2008-11-13 Sharp Kabushiki Kaisha Elément émettant de la lumière et dispositif d'affichage à cristaux liquides
JP2009266434A (ja) * 2008-04-22 2009-11-12 Koito Mfg Co Ltd 光源モジュールおよび車両用灯具
JP2011134474A (ja) * 2009-12-22 2011-07-07 Sharp Corp 面発光装置

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JP3016028B2 (ja) * 1988-06-03 2000-03-06 大日本印刷株式会社 オフセット輪転印刷機の印刷条件設定システム
CN1166517C (zh) * 2000-04-06 2004-09-15 日本板硝子株式会社 自扫描型发光元件阵列的驱动方法

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Publication number Priority date Publication date Assignee Title
JPH01306264A (ja) * 1988-06-03 1989-12-11 Matsushita Graphic Commun Syst Inc 発光ダイオードアレー
JP2001287398A (ja) * 2000-04-06 2001-10-16 Nippon Sheet Glass Co Ltd 自己走査型発光素子アレイおよびその駆動方法
JP2004039466A (ja) * 2002-07-04 2004-02-05 Koito Mfg Co Ltd 車両用灯具
JP2005324657A (ja) * 2004-05-13 2005-11-24 Toyota Motor Corp 車両用前照灯装置
JP2006267780A (ja) * 2005-03-25 2006-10-05 Funai Electric Co Ltd 液晶表示装置
JP2007317423A (ja) * 2006-05-24 2007-12-06 Harison Toshiba Lighting Corp バックライトユニット
WO2008136359A1 (fr) * 2007-04-26 2008-11-13 Sharp Kabushiki Kaisha Elément émettant de la lumière et dispositif d'affichage à cristaux liquides
JP2009266434A (ja) * 2008-04-22 2009-11-12 Koito Mfg Co Ltd 光源モジュールおよび車両用灯具
JP2011134474A (ja) * 2009-12-22 2011-07-07 Sharp Corp 面発光装置

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CN104011884A (zh) 2014-08-27
CN104011884B (zh) 2016-11-09
JP2013135073A (ja) 2013-07-08

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