JP5035995B2 - 光源モジュール及び車輌用灯具 - Google Patents
光源モジュール及び車輌用灯具 Download PDFInfo
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- JP5035995B2 JP5035995B2 JP2008073046A JP2008073046A JP5035995B2 JP 5035995 B2 JP5035995 B2 JP 5035995B2 JP 2008073046 A JP2008073046 A JP 2008073046A JP 2008073046 A JP2008073046 A JP 2008073046A JP 5035995 B2 JP5035995 B2 JP 5035995B2
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- Prior art keywords
- electrode pad
- light source
- source module
- connection
- line forming
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4009—Loop shape
- H01L2224/40091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Claims (5)
- 第1の部分と第2の部分を有する回路パターンが形成された回路基板と、
矩形状に形成された第1の面と該第1の面の反対側に位置する第2の面とを有し該第2の面が前記回路パターンの第2の部分に接続された半導体発光素子と、
前記半導体発光素子の第1の面に設けられ接続部を有する電極パッドと、
前記電極パッドの接続部と前記回路パターンの第1の部分とを接続する接続体とを備え、
前記半導体発光素子の第1の面における一端部を含む一部に前記電極パッドを設け、
前記電極パッドの接続部を前記電極パッドの長手方向に連続又は離隔する位置に設けた
ことを特徴とする光源モジュール。 - 前記接続体として金属材料によって形成された接続シートを用い、
前記接続シートの一端部を前記電極パッドの接続部に接続した
ことを特徴とする請求項1に記載の光源モジュール。 - 前記電極パッドの長手方向に延びる一方の側縁を、前記半導体発光素子から出射される光によって生成される配光パターンのカットラインを形成するカットライン形成部とした
ことを特徴とする請求項1又は請求項2に記載の光源モジュール。 - 前記電極パッドのカットライン形成部を前記長手方向において二つに分割してそれぞれ第1のライン形成部と第2のライン形成部とし、
前記第1のライン形成部と前記第2のライン形成部を前記電極パッドの長手方向に直交する方向において異なる位置に形成した
ことを特徴とする請求項3に記載の光源モジュール。 - 灯具空間に配置された光源モジュールと該光源モジュールから出射された光に対して所定の機能を発揮する光学部材とを備えた車輌用灯具であって、
前記光源モジュールは、
第1の部分と第2の部分を有する回路パターンが形成された回路基板と、
矩形状に形成された第1の面と該第1の面の反対側に位置する第2の面とを有し該第2の面が前記回路パターンの第2の部分に接続された半導体発光素子と、
前記半導体発光素子の第1の面に設けられ接続部を有する電極パッドと、
前記電極パッドの接続部と前記回路パターンの第1の部分とを接続する接続体とを備え、
前記半導体発光素子の第1の面における一端部を含む一部に前記電極パッドを設け、
前記電極パッドの接続部を前記電極パッドの長手方向に連続又は離隔する位置に設けた
ことを特徴とする車輌用灯具。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008073046A JP5035995B2 (ja) | 2008-03-21 | 2008-03-21 | 光源モジュール及び車輌用灯具 |
US12/405,116 US8113699B2 (en) | 2008-03-21 | 2009-03-16 | Light source module and vehicular lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008073046A JP5035995B2 (ja) | 2008-03-21 | 2008-03-21 | 光源モジュール及び車輌用灯具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009230959A JP2009230959A (ja) | 2009-10-08 |
JP5035995B2 true JP5035995B2 (ja) | 2012-09-26 |
Family
ID=41088732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008073046A Expired - Fee Related JP5035995B2 (ja) | 2008-03-21 | 2008-03-21 | 光源モジュール及び車輌用灯具 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8113699B2 (ja) |
JP (1) | JP5035995B2 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9082921B2 (en) * | 2007-10-31 | 2015-07-14 | Cree, Inc. | Multi-die LED package |
US9666762B2 (en) | 2007-10-31 | 2017-05-30 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US9172012B2 (en) | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
JP2010225754A (ja) * | 2009-03-23 | 2010-10-07 | Stanley Electric Co Ltd | 半導体発光装置 |
JP5605626B2 (ja) * | 2010-09-08 | 2014-10-15 | スタンレー電気株式会社 | 車両用灯具 |
CN102374466B (zh) * | 2010-08-24 | 2016-03-09 | 斯坦雷电气株式会社 | 灯具 |
JPWO2012120979A1 (ja) * | 2011-03-07 | 2014-07-17 | 株式会社小糸製作所 | 光源モジュール |
WO2013037408A1 (en) * | 2011-09-14 | 2013-03-21 | Osram Ag | Head light apparatus with led |
JP2014132546A (ja) * | 2012-12-04 | 2014-07-17 | Koito Mfg Co Ltd | 車両用照明装置 |
JP2014164810A (ja) * | 2013-02-21 | 2014-09-08 | Wen Sung Lee | 遠近照明を具える自転車灯装置 |
GB2511077B (en) * | 2013-02-22 | 2015-06-24 | Wen-Sung Lee | High beam and low beam combination lamp for a bicycle |
JP5723418B2 (ja) * | 2013-06-26 | 2015-05-27 | 富士重工業株式会社 | 車両用前照灯 |
JP6765241B2 (ja) * | 2016-07-13 | 2020-10-07 | 株式会社小糸製作所 | 車輌用照明装置 |
JP7054429B2 (ja) * | 2019-03-13 | 2022-04-14 | 日亜化学工業株式会社 | 発光装置、発光モジュール及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6496285B1 (en) * | 1998-02-25 | 2002-12-17 | Rohm Co., Ltd. | Image reading apparatus |
US7180099B2 (en) * | 2002-11-11 | 2007-02-20 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
JP4411892B2 (ja) | 2003-07-09 | 2010-02-10 | 日亜化学工業株式会社 | 光源装置およびこれを用いた車両用前照灯 |
JP4326889B2 (ja) * | 2003-09-11 | 2009-09-09 | 株式会社沖データ | 半導体装置、ledプリントヘッド、画像形成装置、及び半導体装置の製造方法 |
JP4350617B2 (ja) * | 2004-08-24 | 2009-10-21 | 株式会社小糸製作所 | 灯具 |
US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
JP4500273B2 (ja) * | 2006-01-31 | 2010-07-14 | 株式会社小糸製作所 | 車両用前照灯 |
JP4535453B2 (ja) * | 2006-03-06 | 2010-09-01 | 株式会社小糸製作所 | 光源モジュール及び車輌用灯具 |
-
2008
- 2008-03-21 JP JP2008073046A patent/JP5035995B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-16 US US12/405,116 patent/US8113699B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20090237938A1 (en) | 2009-09-24 |
US8113699B2 (en) | 2012-02-14 |
JP2009230959A (ja) | 2009-10-08 |
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