WO2013085223A1 - 레이저 열전사용 폴리이미드 감광성 조성물 - Google Patents

레이저 열전사용 폴리이미드 감광성 조성물 Download PDF

Info

Publication number
WO2013085223A1
WO2013085223A1 PCT/KR2012/010213 KR2012010213W WO2013085223A1 WO 2013085223 A1 WO2013085223 A1 WO 2013085223A1 KR 2012010213 W KR2012010213 W KR 2012010213W WO 2013085223 A1 WO2013085223 A1 WO 2013085223A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive composition
polyimide
thermal transfer
laser thermal
polyimide photosensitive
Prior art date
Application number
PCT/KR2012/010213
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
김병욱
윤혁민
김동명
김진우
황치용
Original Assignee
주식회사 동진쎄미켐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Priority to CN201280060276.8A priority Critical patent/CN103975275B/zh
Publication of WO2013085223A1 publication Critical patent/WO2013085223A1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet

Definitions

  • the present invention relates to a laser thermal transfer polyimide photosensitive composition, and more particularly, by using a material having excellent adhesion to a substrate, double taper formation is possible when applied to laser induced thermal imaging (LITI), It is related with this excellent polyimide photosensitive composition.
  • LITI laser induced thermal imaging
  • an organic light emitting diode includes an anode electrode, which is a lower electrode, formed on an insulating substrate, and an organic film layer including an insulating layer formed on the anode electrode.
  • the cathode electrode which is the upper electrode is formed on the film layer.
  • the organic layer includes at least one of a hole injection layer, a hole transport layer, a light emitting layer, a hole suppression layer, an electron transport layer, an electron injection layer.
  • the organic light emitting diode includes a plurality of pixels, defines each pixel, and includes an insulating layer for shorting electrodes and planarization between layers. Organic and inorganic materials may be used as the insulating film.
  • the film When the insulating film is formed by using an inorganic material, the film itself has excellent rigidity, and thus, when the transfer layer of the donor substrate is removed after transfer of the organic light emitting layer, the insulating layer may be laminated to a thin thickness.
  • the inorganic material not only has a weak ability to fill the via hole, but also increases the thickness of the film, causing cracks around the via hole and protruding outer portions of the first electrode due to stress, resulting in a short circuit between the first electrode and the second electrode. There is a risk of occurrence.
  • an insulating film is formed using a general organic material
  • patterning by photolithography and wet etching to form an opening to define a pixel in forming the insulating film may damage the organic light emitting layer.
  • one method of forming the insulating layer may be laser induced thermal imaging (LITI), which converts light emitted from a laser into thermal energy, and converts the transfer layer into an organic light emitting display device by the converted thermal energy. It is a method of forming an organic film layer by transferring to a board
  • the laser thermal transfer method is not only able to produce high-resolution pattern formation and uniform thickness film by laser-induced imaging process, but also very high alignment accuracy, multi-layer formation, and laser beam size due to the adhesion of the film. Accordingly, it is easy to cope from the ultrafine pattern of the small substrate to the uniform pixel formation pattern of the large substrate.
  • a polyimide-based resin is used as an organic material when forming an insulating film by using a laser thermal transfer method.
  • a conventional general polyimide composition is applied to LITI, a double taper cannot be formed, resulting in a poor process margin. .
  • an object of the present invention is to provide a polyimide photosensitive composition capable of forming a double taper when applying the LITI method.
  • Another object of the present invention is to provide an insulating film manufactured by using the polyimide photosensitive composition for laser thermal transfer and an organic light emitting display device (OLED) including the same.
  • the present invention includes a polyimide precursor, a hydroxystyrene polymer, a photo active compound (PAC), and a solvent, wherein the polyimide precursor is a 1,3-bis (3) as a diamine monomer.
  • -Aminopropyl) tetramethyldisiloxane (SiDA) or N-2 (aminoethyl) 3-aminopropyltrimethoxysilane (KBM-603) as amine monomer or as a protecting group
  • GPTS glycidyloxypropyl trimethoxysilane
  • the present invention provides an insulating film prepared using the polyimide photosensitive composition.
  • the present invention provides an organic light emitting device comprising the insulating film.
  • the polyimide photosensitive composition of the present invention is capable of double taper formation and excellent releasability when applied to laser induced thermal imaging (LITI), it is useful for an insulating film and an organic light emitting display device including the same. Can be used.
  • LITI laser induced thermal imaging
  • 1 is a schematic diagram of a laser transfer process.
  • the present invention relates to a polyimide photosensitive composition capable of double tapering upon application of the LITI method.
  • the polyimide photosensitive composition for laser transfer of the present invention comprises a polyimide precursor, a hydroxystyrene polymer, a photo active compound (PAC), and a solvent, wherein the polyimide precursor is a 1,3-bis as a diamine monomer.
  • the polyimide precursor is a 1,3-bis as a diamine monomer.
  • SiDA 3-aminopropyl) tetramethyldisiloxane
  • KBM-603 N-2 (aminoethyl) 3-aminopropyltrimethoxysilane
  • GPTS 3-glycidyloxypropyl trimethoxysilane
  • the polyimide photosensitive composition Preferably, the polyimide photosensitive composition,
  • the polyimide precursor is prepared by two-step condensation polymerization of an amine-based or diamine-based monomer component and an dianhydride component in a polar organic solvent, and a bonding of a protecting group at the terminal thereof.
  • SiDA 3-aminopropyl) tetramethyldisiloxane
  • KBM-603 aminoethyl 3-aminopropyltrimethoxysilane
  • GPTS (3-glycidyloxypropyl) tramethoxysilane
  • the polyimide precursor is a polyimide precursor represented by the following formula (1).
  • X is a tetravalent organic group
  • Y is partially or totally 1,3-bis (3-aminopropyl) tetramethyldisiloxane (SiDA) or N-2 (aminoethyl) 3-aminopropyltrimethoxysilane (KBM -603)
  • each R is independently epoxy cyclohexyl methyl methacrylate (ECMMA) or (3-glycidyloxypropyl) tramethoxysilane (GPTS)
  • n is an integer from 3 to 100,000 .
  • Y is converted to 1,3-bis (3-aminopropyl) tetramethyldisiloxane (SiDA) or N-2 (aminoethyl) 3-aminopropyltrimethoxysilane (KBM-603)
  • SiDA 1,3-bis (3-aminopropyl) tetramethyldisiloxane
  • KBM-603 N-2 (aminoethyl) 3-aminopropyltrimethoxysilane
  • R is an epoxy cyclohexyl methyl methacrylate (ECMMA) :( 3-glycidyloxypropyl) trimethoxysilane (GPTS) in a molar ratio of 80-99: 1-20. good.
  • X is 2,2-bis (3,4-anhydrodicarboxyphenyl) hexafluoropropane (6FDA), 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3
  • DADM 4,4'-diamino-3,3'-dimethyl-diphenylmethane
  • Bis-APAF 2,
  • the molecular weight of the polyimide precursor is preferably 3,000-10,000, preferably 3,500-7,000. If it is in the above range, solubility control, yield and sensitivity can be further enhanced.
  • the solvent used for preparing the polyimide polymer may be a solvent that is commonly used in the art to which the present invention pertains.
  • the content of the polyimide polymer is preferably used in an amount of 20-40 parts by weight, and if it is within the above range, it may further improve heat resistance.
  • the hydroxystyrene polymer is preferably used that has a molecular weight of 4,000 to 20,000, the content is preferably used in 10-20 parts by weight, it can further enhance the heat resistance in the above range.
  • the PAC used in the present invention may be a known PAC that can be used for the OLED insulating film, and in the present invention, the PAC is preferably included in an amount of 3-20 parts by weight.
  • a conventional solvent used for preparing a polyimide photosensitive composition in the art may be used, and specifically, alcohols such as methanol, ethanol, benzyl alcohol and hexyl alcohol; Ethylene glycol alkyl ether acetates such as ethylene glycol methyl ether acetate and ethylene glycol ethyl ether acetate; Ethylene glycol alkyl ether propionates such as ethylene glycol methyl ether propionate and ethylene glycol ethyl ether propionate; Ethylene glycol monoalkyl ethers such as ethylene glycol methyl ether and ethylene glycol ethyl ether; Diethylene glycol alkyl ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol
  • the content of the solvent is preferably 70 to 90 parts by weight, more preferably it is included so that the solid content of the entire photosensitive composition is 15 to 50% by weight.
  • the laser thermosensitive photosensitive composition of the present invention may further include a crosslinking agent and a surfactant.
  • the crosslinking agent is a melanin-based crosslinking agent, and preferably contained in 1 to 30 parts by weight of the photosensitive composition of the present invention.
  • the surfactant is, for example, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, F171, F172, F173 (trade name: Japan Nippon Ink Company), FC430, FC431 (trade name: Sumitomo Triem, Inc.), or KP341 ( A brand name: Shinwol Chemical Co., Ltd.) etc. can be used, It is preferable that it is contained in 0.0001-2 weight part of the photosensitive composition of this invention.
  • the present invention provides an insulating film prepared using the polyimide photosensitive composition for laser thermal transfer and an organic light emitting display device including the same.
  • the method for forming an insulating film according to the present invention is characterized by using the laser thermal transfer polyimide photosensitive composition according to the present invention in manufacturing the insulating film using the laser thermal transfer method, and of course, a known laser thermal transfer method may be applied. .
  • a method of forming an insulating film is as follows.
  • the photosensitive composition according to the present invention is coated, followed by prebake, exposure, development and curing to form an insulating film, and attaching a donor film for the laser transfer process.
  • Laser transfer is performed to form a light emitting layer (see FIG. 1), and then the donor film is removed.
  • the insulating film is positioned between the transferred light emitting layer and the substrate.
  • DADM 100 g, 6-FDA 80 g, SiDA 5 g and gamma butyrolactone 70 g in a 300 ml four-necked reaction vessel were added to the reaction vessel and reacted with stirring for 1 hour.
  • 2 g of PA was added thereto, and then further reacted at 20 ° C. for 1 hour to prepare a polyimide precursor having a solid content of 30%.
  • 100 g of ECMMA, a protecting group material was added thereto, and then heated to 70 ° C., triethylamine (TEA) as a catalyst was added thereto, and reacted for 24 hours to prepare a new polyimide precursor.
  • TAA triethylamine
  • Example 1 except that KBM 603 was used as the amine monomer instead of SiDA which is a diamine monomer, it was carried out in the same manner as in Example 1 to prepare a polyimide photosensitive composition for laser thermal transfer.
  • the polyimide photosensitive composition of the laser thermal transfer method was prepared in the same manner as in Example 1, except that 100 g of the ECMMA and 5 g of the GPTS were used as the protecting group material without using SiDA as the diamine monomer in Example 1. Prepared.
  • a polyimide photosensitive composition was prepared in the same manner as in Example 1, except that SiDA, which is a diamine monomer, was not used in Example 1.
  • Each of the photosensitive resin compositions prepared in Examples 1 to 3 and Comparative Example 1 was spin coated on an ITO glass substrate to obtain a film having a thickness of 0.3 ⁇ m. Thereafter, prebaking was performed at 120 ° C. for 2 minutes, and exposure energy of 100 mJ / cm 2 was irradiated at a wavelength of 365 nm through a photomask having a line / space of 20 ⁇ m. Then, after developing for 35 seconds in a 2.38% TMAH developer, it was cured for 1 hour in an oven at 230 °C.
  • the cross section of the formed pattern was observed by SEM. At this time, when the thickness of the double taper formed below the main taper (thickness 0.3 ⁇ m) was 0.1 ⁇ m or less and the length of the double taper was observed in the range of 0.3 ⁇ m to 1 ⁇ m, it was determined that the double taper was formed. The results are shown in Table 2 below.
  • the polyimide photosensitive composition of the present invention is capable of double taper formation and excellent releasability when applied to laser induced thermal imaging (LITI), it is useful for an insulating film and an organic light emitting display device including the same. Can be used.
  • LITI laser induced thermal imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
PCT/KR2012/010213 2011-12-06 2012-11-29 레이저 열전사용 폴리이미드 감광성 조성물 WO2013085223A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280060276.8A CN103975275B (zh) 2011-12-06 2012-11-29 激光热转印用聚酰亚胺光敏性组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110129548A KR101840416B1 (ko) 2011-12-06 2011-12-06 레이저 열전사용 폴리이미드 감광성 조성물
KR10-2011-0129548 2011-12-06

Publications (1)

Publication Number Publication Date
WO2013085223A1 true WO2013085223A1 (ko) 2013-06-13

Family

ID=48574528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/010213 WO2013085223A1 (ko) 2011-12-06 2012-11-29 레이저 열전사용 폴리이미드 감광성 조성물

Country Status (4)

Country Link
KR (1) KR101840416B1 (zh)
CN (1) CN103975275B (zh)
TW (1) TW201331266A (zh)
WO (1) WO2013085223A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104710616B (zh) * 2015-04-09 2017-07-04 东莞市三条化成实业有限公司 一种可用于激光直接成型的聚酰亚胺组合物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1055065A (ja) * 1996-03-27 1998-02-24 Olin Microelectron Chem Inc ポリイミドプライマーをベースとするネガ型フォトレジスト組成物
KR20010027145A (ko) * 1999-09-10 2001-04-06 성재갑 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
JP2003231752A (ja) * 2002-02-12 2003-08-19 Toyobo Co Ltd 感光性ポリイミド前駆体、感光性樹脂組成物、カラーフィルター、液晶駆動側基板、及び、液晶パネル
JP2007156243A (ja) * 2005-12-07 2007-06-21 Nissan Chem Ind Ltd ポジ型感光性樹脂組成物及びその硬化膜
JP2011023119A (ja) * 2009-07-13 2011-02-03 Sony Corp 表示装置の製造方法、有機発光素子の製造方法および転写方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1909142B1 (en) * 2005-06-30 2015-06-24 Toray Industries, Inc. Photosensitive resin composition and adhesion enhancer
CN101663348B (zh) * 2007-04-25 2012-06-06 日产化学工业株式会社 聚酰亚胺前体和聚酰亚胺以及形成图像的下层膜涂布液
JP2011231199A (ja) * 2010-04-27 2011-11-17 Sanyo Chem Ind Ltd 熱可塑性ウレタン樹脂の製造方法
KR101882217B1 (ko) * 2011-10-18 2018-07-26 주식회사 동진쎄미켐 오엘이디용 폴리이미드 감광성 수지 조성물

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1055065A (ja) * 1996-03-27 1998-02-24 Olin Microelectron Chem Inc ポリイミドプライマーをベースとするネガ型フォトレジスト組成物
KR20010027145A (ko) * 1999-09-10 2001-04-06 성재갑 새로운 폴리이미드 전구체 및 이를 이용한 감광성 수지 조성물
JP2003231752A (ja) * 2002-02-12 2003-08-19 Toyobo Co Ltd 感光性ポリイミド前駆体、感光性樹脂組成物、カラーフィルター、液晶駆動側基板、及び、液晶パネル
JP2007156243A (ja) * 2005-12-07 2007-06-21 Nissan Chem Ind Ltd ポジ型感光性樹脂組成物及びその硬化膜
JP2011023119A (ja) * 2009-07-13 2011-02-03 Sony Corp 表示装置の製造方法、有機発光素子の製造方法および転写方法

Also Published As

Publication number Publication date
KR101840416B1 (ko) 2018-03-20
CN103975275B (zh) 2018-05-25
KR20130063172A (ko) 2013-06-14
TW201331266A (zh) 2013-08-01
CN103975275A (zh) 2014-08-06

Similar Documents

Publication Publication Date Title
KR102134263B1 (ko) 폴리이미드 수지, 폴리이미드 수지 조성물, 그것을 사용한 터치 패널 및 그의 제조 방법, 컬러 필터 및 그의 제조 방법, 액정 소자 및 그의 제조 방법, 유기 el 소자 및 그의 제조 방법
US8993209B2 (en) Positive-type photosensitive resin composition and black bank of an organic light-emitting device including same
US9828469B2 (en) Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic EL display, and methods respectively for producing organic EL element and color filter
WO2013048069A1 (en) Positive-type photosensitive resin composition, and insulating film and oled formed using the same
KR101400181B1 (ko) 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 디스플레이 소자
KR102021745B1 (ko) 부분 가수 분해 축합물, 발잉크제, 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 광학 소자
TWI734795B (zh) 感光性樹脂組成物、感光性薄片、硬化膜、元件、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置及有機ｅｌ顯示裝置之製造方法
KR20150005513A (ko) 컬러 필터 기판 및 그것을 이용한 화상 표시 장치
CN114874441A (zh) 一种化学增幅型正性光敏聚酰亚胺涂层胶及其制备方法与应用
KR20200064274A (ko) 감광성 수지 조성물, 필름 및 전자장치
KR20200052303A (ko) 폴리이미드 전구체 수지 조성물, 폴리이미드 수지 조성물, 폴리이미드 수지막, 적층체의 제조 방법, 컬러 필터의 제조 방법, 액정 소자의 제조 방법 및 유기 el 소자의 제조 방법
TW201936650A (zh) 負型感光性樹脂組成物、硬化膜、具備硬化膜之元件及顯示裝置以及其製造方法
WO2009110764A2 (en) Positive photosensitive polyimide composition
KR20090049541A (ko) 착색 감광성 수지 조성물
US20050153238A1 (en) Photosensitive polyimide resin composition, insulating film using the same, process for producing insulating film, and electronic component using the insulating film
WO2011053100A2 (ko) 아크릴레이트 수지, 이를 포함하는 포토레지스트 조성물, 및 포토레지스트 패턴
WO2013085223A1 (ko) 레이저 열전사용 폴리이미드 감광성 조성물
US20230205085A1 (en) Positive photosensitive resin composition
WO2015194892A1 (ko) 광가교성 수지 조성물, 이로부터 형성된 절연막 및 유기발광소자
WO2012091424A2 (ko) 광분해성 전자재료,이로부터 형성된 절연막 및 유기발광소자
CN115561966A (zh) 一种化学增幅型负性光敏聚酰亚胺涂层胶及应用
CN108017730B (zh) 一种光刻胶组合物、彩色滤光片及其制备方法
JP7334725B2 (ja) 樹脂組成物、黒色樹脂膜、積層体および表示装置
WO2013100537A1 (ko) 에이엠오엘이디용 폴리이미드계 포지티브 감광성 수지 조성물
KR101738466B1 (ko) 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 유기 el 표시 장치 및 액정 표시 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12854640

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12854640

Country of ref document: EP

Kind code of ref document: A1