WO2013057443A1 - Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide - Google Patents
Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide Download PDFInfo
- Publication number
- WO2013057443A1 WO2013057443A1 PCT/FR2012/052388 FR2012052388W WO2013057443A1 WO 2013057443 A1 WO2013057443 A1 WO 2013057443A1 FR 2012052388 W FR2012052388 W FR 2012052388W WO 2013057443 A1 WO2013057443 A1 WO 2013057443A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- injection
- module
- reservoir
- ramp
- modules
- Prior art date
Links
- 238000002347 injection Methods 0.000 title claims abstract description 183
- 239000007924 injection Substances 0.000 title claims abstract description 183
- 238000007738 vacuum evaporation Methods 0.000 title claims abstract description 15
- 238000000151 deposition Methods 0.000 title abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000001704 evaporation Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000004891 communication Methods 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 238000010549 co-Evaporation Methods 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 229910021397 glassy carbon Inorganic materials 0.000 claims description 3
- 239000000446 fuel Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000000427 thin-film deposition Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 31
- 230000008020 evaporation Effects 0.000 description 12
- 230000008021 deposition Effects 0.000 description 11
- 238000001771 vacuum deposition Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011364 vaporized material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- QNWMNMIVDYETIG-UHFFFAOYSA-N gallium(ii) selenide Chemical compound [Se]=[Ga] QNWMNMIVDYETIG-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- SIXIBASSFIFHDK-UHFFFAOYSA-N indium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[In+3].[In+3] SIXIBASSFIFHDK-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
Definitions
- the present invention relates to an injection system for a vacuum evaporation deposition device, also called PVD for Physical Vapor Deposition.
- PVD vacuum deposition devices of materials evaporated from a source of solid material are known. Such devices are especially used in the manufacture of thin film stacks on large substrates. For example such devices are used for the manufacture of solar panels type CIGS (for Copper Indium Gallium Selenium) or OLED type diodes (for Organic Light Emitting Devices).
- PVD vacuum deposition devices generally include an evaporation source connected to a vacuum deposition chamber. The evaporation source makes it possible to evaporate or sublimate the material, which is transferred in gaseous form into the vacuum deposition chamber where it is deposited on a substrate.
- the known vacuum deposition devices generally comprise an injector placed between the evaporation source and the substrate.
- the injector diffuses the evaporated material to obtain a uniform deposit on a large substrate.
- the geometry of the injector depends on the shape and size of the substrate.
- an injector formed of an elongated conduit comprising openings, also called injection nozzles, is used to diffuse the evaporated material uniformly along the injector.
- the length of the injector is at least equal to the width or the length of a substrate. A relative movement between the substrate and the injector allows deposits on very large surfaces (greater than 1 m 2 ).
- Each nozzle generally comprises a channel connecting the internal conduit of the injector to the vacuum deposition chamber.
- the shape and dimensions of the nozzles make it possible to adapt the flow rate and the distribution of the flow of evaporated material to the surface of the substrate.
- a vacuum evaporation chamber may be configured to allow deposition on a single substrate or on multiple substrates placed in the same deposition chamber.
- the change in size of the substrates or the number of substrates to be treated generally requires a change of injector so as to adapt to the configuration of the substrate and avoid the loss of material by deposition in the vacuum deposition chamber. outside substrates.
- One of the aims of the invention is to ensure a good quality of deposition of thin films by PVD, including uniformity of thickness and physicochemical composition of the layers for widths of 1.5 to 1.8 m.
- the object of the present invention is to overcome the drawbacks of the prior art and more particularly relates to an injection system for a device for depositing thin layers by vacuum evaporation, said injection system being intended to be placed in an evaporation chamber. under vacuum, and said injection system comprising a reservoir for receiving a material to be evaporated, means for heating the reservoir capable of evaporating said material, at least one injection manifold comprising an internal conduit connected to the reservoir so as to receive said evaporated material from the reservoir and a plurality of nozzles, each nozzle including at least one communication channel between said inner conduit and the outer portion of the ramp so as to diffuse the evaporated material into said vacuum evaporation chamber.
- the injection ramp comprises a plurality of injection modules mechanically connected to one another in series along a longitudinal direction, each injection module comprising a plurality of injection nozzles, and said injection ramp.
- injection comprises means for adjusting the orientation of said injection modules around said longitudinal direction so as to align said injection nozzles of said injection modules along a line parallel to the longitudinal direction of the injection rail .
- said injection modules are of cylindrical shape, the injection nozzles of an injection module being disposed on a generator of said cylinder.
- said injection modules have an identical structure, the injection ramp further comprising a shutter module able to close one end of the injection manifold in a sealed manner;
- said reservoir is formed of at least a first cylindrical reservoir module that can be fixed to a first injection module at a first open end of the injection manifold and / or a second cylindrical reservoir module that can be fixed on a last injection module at a second open end of the injection rail;
- the material of the injection modules is one of the following materials: alumina (Al 2 O 3 ), graphite carbon, vitreous carbon, pyrolytic graphite-coated carbon, purified carbon, carbide-coated carbon silicon or pyrolytic boron nitride (or PBN).
- alumina Al 2 O 3
- graphite carbon vitreous carbon
- pyrolytic graphite-coated carbon purified carbon
- the injection system further comprises:
- At least one seal compression said seal being adapted to ensure the alignment of the nozzles when compressed;
- said at least one seal being made of flexible graphite
- said at least one seal being disposed between two adjacent injection modules and / or between the reservoir module and the first injection module and / or between the last injection module and a shutter module;
- heating means associated with each injection module and / or the reservoir module, said heating means comprising two semi-cylindrical half-shells capable of wrapping said injection module or said reservoir module respectively;
- thermal screening means arranged around the heating means and cooling means arranged around the thermal screening means
- said frame comprises one or more rectilinear bars, said fixing means being slidably mounted along the one or more bars.
- the invention also relates to an injection system comprising a plurality of injection ramps according to one of the embodiments described, the longitudinal axes of said injection rails being arranged parallel to each other to allow uniform co-evaporation of materials. .
- the invention will find a particularly advantageous application in an injection device for vacuum evaporation deposition system, in particular for the manufacture of OLEDs.
- the present invention also relates to the features which will emerge in the course of the description which follows and which will have to be considered individually or in all their technically possible combinations.
- FIG. 2 represents an injection ramp, seen from below and in longitudinal section according to a second embodiment of the invention
- FIG. 3 represents an injection ramp, in front view, from the side, in axial section and in longitudinal section;
- FIG. 4 shows a front view and in perspective of a thermal shell for wrapping a module of an injection rail according to a particular embodiment of the invention
- FIG. 5 schematically shows a perspective view of an injection rail during assembly / disassembly of a tank according to a particular embodiment
- FIG. 6 schematically shows a perspective view of an injection boom during assembly / disassembly of a tank according to another particular embodiment
- FIG. 7 shows schematically in side view different deposition configurations based on the use respectively of a single injection ramp for mono-evaporation and two and three injection ramps for co-evaporation.
- the invention relates to an injection rail for a vacuum evaporation deposition system, the injection rail being adapted to receive vaporized materials from an evaporation source.
- a ramp comprises a diffuser provided with a plurality of nozzles for diffusing the vaporized material in a vacuum deposition chamber.
- the evaporation chamber in which the substrate and the injection rail are located is not shown in FIGS. 1 to 6.
- FIG. 1 schematically represents an injection ramp according to a first embodiment of the invention.
- the right part of FIG. 1 represents a front view of an injection ramp 1.
- a substrate 10 On the left side of Figure 1, there is shown a substrate 10 on which it is desired to deposit a material and the injection rail 1 in longitudinal section along the direction AA '.
- an enlargement of a detail of the sectional view of the ramp In insert, on the left side of Figure 1 is shown an enlargement of a detail of the sectional view of the ramp.
- the injection rail extends along a longitudinal axis 5.
- the injection rail 1 comprises a reservoir module 4 for containing the material to be evaporated.
- the material to be evaporated can be in different forms (liquid, solid, powder ).
- the tank is intended to evaporate the following materials: silver (Ag), magnesium (Mg), gallium (Ga), indium (In), lithium fluoride (LiF), indium sulphide (In 2 S 3 ) zinc (Zn), cadmium (Cd), tin (Sn), aluminum (Al) or copper (Cu).
- the injection ramp 1 is mainly intended for be mounted vertically.
- the reservoir module 4 is positioned at the lower end of the ramp so as to contain the material not evaporated by gravity.
- the reservoir module is in alignment with the ramp.
- the reservoir module 4 may have a geometry, a disposition (in line, at 45 °, at 90 ° with respect to the longitudinal axis 5) or else a capacity (length, diameter) very particular according to the operation (horizontal or vertical), the material to be evaporated, the production time of the injection system or the consumption of material to be evaporated.
- the injection rail 1 also comprises a plurality of injection modules 2a, 2b, 2c, 2d, 2e connected in series.
- the example shown has five injection modules. However, the number of injection modules is of course not limited.
- the first injection module 2a is fixed on the reservoir module 4.
- the injection module 2b is fixed on an injection module 2a.
- the injection module 2c is fixed on an injection module 2b, etc.
- a shutter module 6 is fixed on the injection module 2e.
- the end of the ramp 1 opposite the reservoir module 4 is thus closed by the vapor-tight shutter module 6 of said material to be evaporated.
- the shutter module 6 can be integrated with an end injection module to form a single injection module closed at one end.
- the various injection modules comprising the ramp may be fixed to each other, for example by interlocking or by screwing.
- the injection modules are orientable about their axis so as to be able to make an angular adjustment of each injection module. This adjustment in orientation makes it possible to ensure the alignment of the nozzles along the ramp, this alignment being critical for the quality of the deposits.
- each injection module has a thread 7 adapted.
- the starting position of the thread is controlled with respect to the position of the nozzles, which gives a coarse alignment, the fine alignment is ensured by the compression of a seal.
- the reservoir module 4 and the injection modules 2a, 2b, 2c, 2d, 2e are tubular and hollow.
- the injection modules are cylindrical, the nozzles being aligned on a generatrix of the cylinder.
- the injection modules are of approximately circular section but include a flat which carries the nozzles.
- the injection module 2a communicates with the reservoir 4 through a central opening.
- the injection module 2b also communicates with the injection module 2a via a central opening and so on until the injection module 2e and the shutter module 6.
- the evaporated material leaving the reservoir can thus diffuse freely inside all the modules of the injection rail to the shutter module.
- the internal diameter of the various modules of the injection manifold is sufficient for its conductance to ensure a low or negligible pressure drop, thereby ensuring the same flow on each nozzle.
- Each injection module 2a, 2b, ... 2e is provided with a plurality of injection nozzles 3.
- a nozzle 3 generally comprises a channel connecting the interior of the ramp to the evaporation chamber to allow the diffusion of the material evaporated towards the substrate 10.
- the nozzles 3 of the different modules are aligned along an axis parallel to the axis 5 of the ramp.
- each injection module 2 comprises about twenty nozzles 3.
- the nozzles are distributed with a constant interval between consecutive nozzles so as to obtain a spatially uniform distribution of the nozzles 3 along of an axis parallel to the axis 5.
- each nozzle is constituted by an insert, for example screwed on the injection module.
- a nozzle is interchangeable with a nozzle having a different opening. It is thus possible to arrange the nozzles 3 having different openings according to the position of the nozzle 3 along the ramp 1, in order to adjust the deposition profile over the entire surface of the substrate 10.
- the length of the nozzle an injection module 2a is equal to 400mm, the orientation accuracy by rotation about the longitudinal axis being less than two degrees, the space between nozzles is equal to 20mm, and the threading 7 extends over 10mm long.
- the injection modules, the shutter module and / or the reservoir module are made of a material which is chemically compatible with the material to be evaporated at the desired evaporation temperature.
- the material of the injection modules of the reservoir module and / or of a shutter module may be carbon, graphite, pyrolytic graphite, vitreous carbon, boron nitride, alumina, etc.
- sealing ring 8 made of flexible graphite of the order of 1 mm thick is interposed between two adjacent modules to seal and also to adjust the orientation of the different injection modules 2a, 2b. and thus allow to align the nozzles 3.
- the ramp 1 therefore consists of different modules connected in series to form a linear cell along the axis 5: reservoir module, injection modules and shutter module.
- the number of injection modules determines the length of the ramp and is easily reconfigurable.
- FIG. 2 represents a second embodiment of an injection ramp, intended more particularly to be mounted horizontally along the axis 5.
- the right part of FIG. 2 represents a view from below of an injection ramp 1.
- a substrate 10 on which it is desired to deposit a material and the injection ramp 1 in longitudinal section along a section ⁇ .
- the same reference signs designate the same elements as in FIG.
- the ramp of FIG. 2 also comprises a reservoir module 4, a plurality of injection modules 2a, 2b, 2c, 2d, 2e connected in series and provided with injection nozzles 3, and a shutter module 6.
- insert is represented a sectional view of an intermediate module located between the reservoir module 4 and the first injection module 2a.
- the intermediate module is fixed on the one hand to the opening of the reservoir and on the other hand to the first injection module 2a.
- the intermediate module 9 has an inner wall which partially closes the inner opening of the ramp so as to contain the non-evaporated material in the tank.
- the inner wall has an opening for passing the flow of evaporated material (shown schematically by an arrow on the insert of Figure 2).
- This intermediate module 9 with internal wall is particularly suitable in the case where the reservoir module is aligned horizontally to allow to maintain the non-evaporated material in the reservoir module 4.
- the intermediate module is rotatable about the axis 5 of the ramp , so that the opening of the inner wall is in the upper part of the ramp, as shown in insert, in the case where the nozzles are oriented upwards.
- Figure 3 shows different views of an injection rail provided with heating means to allow evaporation and diffusion of material.
- a ramp in front view on the left of Figure 3 in side view on the right of Figure 3 a longitudinal sectional view along the axis 5 and in the upper left of the figure 3 an axial sectional view of the ramp along the cutting plane BB '.
- the ramp comprises the various modules as described in connection with FIG. 1, in particular a reservoir module 4, a plurality of injection modules 2a,..., 2e and an end module 6.
- the reservoir module 4 as well as each module injection is wrapped by a thermal shell.
- Each thermal shell has the same length as the reservoir module or injection module that it wraps.
- external cooling means of the thermal shells are observed in the form of coils 16 intended for the circulation of a cooling fluid, for example water.
- the injection rail is mounted on a frame comprising two cylindrical bars 1 1, the bars 1 1 being parallel to each other and parallel to the axis 5 of the ramp.
- the ramp 1 is fixed to the frame by means of fixing lugs 13.
- the fixing lugs 13 are adjustable by sliding along the axis of the bars 1 January.
- a thermal shell is composed of two semi-shells of generally semi-cylindrical shape and intended to envelop a ramp of external shape also cylindrical.
- the two half-shells forming a thermal shell are symmetrical with respect to a plane passing through the longitudinal axis 5 of the ramp.
- FIG. 4 represents a front, rear and perspective view of a thermal half-shell intended to envelop a module of an injection rail according to a particular embodiment.
- the half-shell 17 comprises on its inner face a filament 14 for heating a module of the ramp by radiation.
- the filament 14 makes it possible to carry the injection rail at a temperature that can reach 1200 ° C. to 1500 ° C.
- the half-shell 17 has electrical connections 14a, 14b at both ends of the filament 14.
- Each thermal half-shell can thus be connected to a source of electrical power independently of other thermal shells.
- Each thermal half-shell can also be connected in series with the other thermal shells to a single electric power source.
- the filament is protected from the environment of the ramp by a heat shield 15.
- a water cooling system 16 placed on the outer portion of the shell 17 reduces the outside temperature of the ramp.
- the cooling system 16 comprises fluidic connections 16a, 16b at both ends of the cooling circuit of a half-shell.
- Each thermal half-shell can thus be connected to a source of cooling water independently of the other thermal half-shells.
- Each thermal half-shell can also be connected in series with the other thermal half-shells to a single cooling water source.
- FIG. 5 schematically shows a perspective view of an injection rail during assembly / disassembly of a tank according to a particular embodiment.
- the two thermal half-shells 17 which surround the reservoir module are detached.
- the reservoir module is fitted or screwed by threads 7 on the first injection module 2a.
- This system makes it possible to leave the injection rail in place in the evaporation chamber.
- the tank change can be done very quickly.
- FIG. 6 schematically shows a perspective view of an injection rail during assembly / disassembly of a tank according to another particular embodiment.
- the thermal shell surrounding the reservoir module is not dismantled, but simply moved by loosening the bracket 13 and then sliding the thermal shell along the bars 1 1 of the frame. The space released allows access to the tank to fill or replace it.
- the fixing lugs can be held by screws. It is also conceivable to fill the tank without disassembling the tank module or the thermal shell. For example, it is possible to disassemble only an end module 6 without having to disassemble a thermal shell.
- FIG. 7 illustrates different deposition configurations.
- the chassis ensures the rigidity of the whole of the injection rail 1.
- the chassis makes it possible to interface the injection ramp with a transfer system to produce a movement of the ramp relative to large substrates.
- the chassis makes it easy to orient one or more injection ramps relative to the plane of a substrate.
- Figure 7 illustrates different deposition configurations.
- a system with two injection ramps 1 and 1 ' Each of the two injection ramps 1, 1 'has its own material tank. This system with two injection ramps easily allows the co-evaporation of different materials, which are deposited at the same time on the substrate.
- each ramp allows by simple rotation around a bar to orient each ramp for example symmetrically relative to the normal to the substrate.
- the two ramps advantageously have the same length, are parallel to each other, and parallel to the plane of the substrate which allows to obtain homogeneous co-evaporation over the entire length of the ramps 1 and 1 '.
- a system with three injection ramps 1, 1 ', 1 " is represented at the bottom of FIG. 7.
- Each of the three injection ramps 1, 1', 1" has its own material reservoir, for allow the co-evaporation of three different materials deposited simultaneously on the substrate 10.
- the three ramps have the same length, are arranged parallel to each other and parallel to the plane of the substrate 10, to allow uniform co-evaporation.
- injection rail by assembling different modules (injection modules, reservoir module) makes it possible to easily adapt to the size of the substrate to be treated and in particular to large substrate sizes.
- the manufacture of a ramp of particular length is based on the assembly of a predetermined number of injection modules, but does not require study or specific tools and is therefore of a lower cost.
- the reservoir module is easy to load and unload, which reduces the time when the device is stopped and thus improve the efficiency of the vacuum evaporation machine.
- the linear construction of the ramp injection allows to consider uniform co-evaporation configurations with two or three injection ramps or more.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12790607.1A EP2769001B1 (fr) | 2011-10-21 | 2012-10-18 | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
CN201280051570.2A CN103906856B (zh) | 2011-10-21 | 2012-10-18 | 用于通过真空蒸发沉积薄膜的装置的喷射系统 |
KR1020147010540A KR102108173B1 (ko) | 2011-10-21 | 2012-10-18 | 진공 증발에 의한 박막 증착용 장치를 위한 분사 시스템 |
IN3425DEN2014 IN2014DN03425A (fr) | 2011-10-21 | 2012-10-18 | |
JP2014536318A JP6170927B2 (ja) | 2011-10-21 | 2012-10-18 | 真空蒸着によって薄膜を堆積させる装置のための噴射システム |
SG11201401635PA SG11201401635PA (en) | 2011-10-21 | 2012-10-18 | Injection system for an apparatus for depositing thin layers by vacuum evaporation |
US14/350,104 US20140245955A1 (en) | 2011-10-21 | 2012-10-18 | Injection system for an apparatus for depositing thin layers by vacuum evaporation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1159560A FR2981667B1 (fr) | 2011-10-21 | 2011-10-21 | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
FR1159560 | 2011-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013057443A1 true WO2013057443A1 (fr) | 2013-04-25 |
Family
ID=47221468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2012/052388 WO2013057443A1 (fr) | 2011-10-21 | 2012-10-18 | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
Country Status (9)
Country | Link |
---|---|
US (1) | US20140245955A1 (fr) |
EP (1) | EP2769001B1 (fr) |
JP (1) | JP6170927B2 (fr) |
KR (1) | KR102108173B1 (fr) |
CN (1) | CN103906856B (fr) |
FR (1) | FR2981667B1 (fr) |
IN (1) | IN2014DN03425A (fr) |
SG (1) | SG11201401635PA (fr) |
WO (1) | WO2013057443A1 (fr) |
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JP2017534767A (ja) * | 2014-11-07 | 2017-11-24 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空堆積のための材料源アレンジメント及びノズル |
JP2018066059A (ja) * | 2017-09-11 | 2018-04-26 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空堆積チャンバ |
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CN107078215B (zh) * | 2014-11-07 | 2020-09-22 | 应用材料公司 | 用于真空沉积的材料源配置与材料分布配置 |
CN107002221B (zh) * | 2014-11-07 | 2020-03-03 | 应用材料公司 | 用于真空沉积的材料沉积布置和材料分配布置 |
WO2017008838A1 (fr) * | 2015-07-13 | 2017-01-19 | Applied Materials, Inc. | Source d'évaporation. |
CN105088145B (zh) * | 2015-08-19 | 2017-03-29 | 京东方科技集团股份有限公司 | 用于oled蒸发源的坩埚及其制造方法 |
CN205443432U (zh) * | 2016-04-07 | 2016-08-10 | 鄂尔多斯市源盛光电有限责任公司 | 一种线性蒸发源、蒸发源系统及蒸镀装置 |
JP6823954B2 (ja) * | 2016-07-08 | 2021-02-03 | 株式会社ジャパンディスプレイ | 成膜装置および成膜方法 |
CN106868456B (zh) * | 2017-03-21 | 2019-03-12 | 京东方科技集团股份有限公司 | 蒸发源和蒸镀设备 |
CN109943806A (zh) * | 2017-12-20 | 2019-06-28 | 合肥欣奕华智能机器有限公司 | 一种线性蒸发源装置及蒸镀装置 |
CN109817842B (zh) * | 2019-01-16 | 2021-10-01 | 京东方科技集团股份有限公司 | 一种真空干燥装置、显示用基板的制备方法 |
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Also Published As
Publication number | Publication date |
---|---|
KR20140092816A (ko) | 2014-07-24 |
JP2015501379A (ja) | 2015-01-15 |
FR2981667A1 (fr) | 2013-04-26 |
US20140245955A1 (en) | 2014-09-04 |
IN2014DN03425A (fr) | 2015-06-05 |
KR102108173B1 (ko) | 2020-05-08 |
CN103906856B (zh) | 2016-11-09 |
CN103906856A (zh) | 2014-07-02 |
SG11201401635PA (en) | 2014-09-26 |
FR2981667B1 (fr) | 2014-07-04 |
EP2769001A1 (fr) | 2014-08-27 |
EP2769001B1 (fr) | 2017-12-20 |
JP6170927B2 (ja) | 2017-07-26 |
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