WO2013056553A1 - 逆变器、密封风道和散热系统 - Google Patents

逆变器、密封风道和散热系统 Download PDF

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Publication number
WO2013056553A1
WO2013056553A1 PCT/CN2012/075813 CN2012075813W WO2013056553A1 WO 2013056553 A1 WO2013056553 A1 WO 2013056553A1 CN 2012075813 W CN2012075813 W CN 2012075813W WO 2013056553 A1 WO2013056553 A1 WO 2013056553A1
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WO
WIPO (PCT)
Prior art keywords
cavity
heat
inverter
heat sink
sealing
Prior art date
Application number
PCT/CN2012/075813
Other languages
English (en)
French (fr)
Inventor
刘小虎
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP12841538.7A priority Critical patent/EP2651022B1/en
Publication of WO2013056553A1 publication Critical patent/WO2013056553A1/zh
Priority to US14/012,659 priority patent/US9167729B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present invention relates to the field of electronic devices, and more particularly to inverters, hermetic ducts, and heat dissipation systems in the field of electronic devices. Background technique
  • Magnetic conversion circuits typically include a boost inductor and an inverter inductor.
  • the magnetic conversion circuit has a large heat consumption and a high temperature, and is usually disposed at the top of the inverter, wherein the heat of the magnetic device is directly transmitted to the heat sink substrate and is dissipated through the separated heat dissipating teeth at the top.
  • the heat loss of the power conversion circuit is mainly distributed on the Boost power tube and the Invertor power tube, and the heat consumption is large. Most of the heat consumption needs to be directly attached to the heat sink, and the remaining heat consumption will cause the internal air temperature of the inverter. Elevated, thus affecting such as electrolytic capacitors and liquid crystal displays (Liquid Crystal Display, referred to as
  • photovoltaic inverters mostly use die-casting and profile heat sink solutions, they can only reduce the temperature of the power device, and can not effectively improve the air temperature inside the cavity. Therefore, in order to reduce the air temperature inside the cavity, it is usually necessary to increase the volume of the heat sink. Increasing the air volume of the fan causes the inverter to increase in weight, increase in volume, and increase in noise.
  • Embodiments of the present invention provide an inverter, a sealed air duct, and a heat dissipation system, which can reduce the air temperature inside the cavity and improve heat dissipation efficiency.
  • an embodiment of the present invention provides an inverter, where the inverter includes: a housing, a first cavity and a second cavity separated from each other and closed; a magnetic conversion circuit including a magnetic element disposed in the first cavity; a power conversion circuit including a power tube disposed in the second cavity; Provided at the bottom of the housing and outside the first cavity and the second cavity; a sealing air passage disposed outside the second cavity, the sealing air channel including at least one formed by the heat dissipation surface and the bottom surface a cylindrical pipe, the two ends of the at least one column pipe are closed, the bottom surface is formed by a side wall of the second cavity or a substrate of the heat sink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity The at least one columnar conduit.
  • an embodiment of the present invention provides a sealed air duct disposed outside an enclosed cavity, the sealed air duct including at least one columnar duct formed by a heat dissipating surface and a bottom surface, the at least one column The two ends of the duct are closed, and the bottom surface is constituted by the wall of the closed cavity, and the bottom surface includes an air inlet and an air outlet to communicate the cavity with the at least one columnar duct.
  • an embodiment of the present invention provides a heat dissipation system including: a heat sink disposed at a bottom of the closed cavity and outside the closed cavity; and a sealed air duct according to an embodiment of the present invention, the seal a duct is disposed outside the closed cavity, the seal duct including at least one columnar duct formed by the heat dissipating surface and the bottom surface, the two ends of the at least one column duct being closed, the bottom surface being constituted by the wall of the closed cavity, and The bottom surface includes an air inlet and an air outlet to communicate the cavity with the at least one columnar conduit.
  • the inverter, the sealing air duct and the heat dissipation system of the embodiment of the invention provide a sealed air duct having an air inlet and an air outlet outside the closed cavity, so that the hot air inside the closed cavity enters the sealing wind.
  • the heat exchange between the heat-dissipating surface of the sealed air passage and the outside air can reduce the air temperature inside the cavity, improve the heat dissipation efficiency, and improve the reliability and life of the device, reduce the volume and weight of the product, and reduce the product. noise.
  • FIG. 1A and 1B are schematic perspective views of an inverter according to an embodiment of the present invention.
  • FIG. 2 is a partial schematic perspective view of an inverter in accordance with an embodiment of the present invention.
  • FIG. 3 is a partial schematic perspective view of an inverter in accordance with another embodiment of the present invention.
  • FIGS. 4A through 4C are schematic perspective views of an inverter in accordance with still another embodiment of the present invention.
  • 5A to 5C are schematic perspective views of an inverter according to still another embodiment of the present invention.
  • 6A to 6C are schematic perspective views of an inverter according to still another embodiment of the present invention.
  • 7A to 7D are schematic perspective views of an inverter according to still another embodiment of the present invention.
  • Figure 8 is a schematic perspective view of an inverter in accordance with still another embodiment of the present invention.
  • FIGS. 9A and 9B are schematic perspective views of a heat dissipation profile in accordance with an embodiment of the present invention.
  • Figure 10 is a schematic perspective view of a sealed air duct in accordance with an embodiment of the present invention.
  • FIG 11 is a schematic perspective view of a heat dissipation system in accordance with an embodiment of the present invention. Concrete it ⁇ r
  • the inverter of the embodiment of the present invention includes: a housing having first and second cavities separated from each other and closed; a magnetic conversion circuit including a magnetic element, disposed at the first a power conversion circuit including a power tube disposed in the second cavity; a heat sink disposed at a bottom of the housing and located outside the first cavity and the second cavity; a sealing air duct disposed at the Outside the second cavity, the sealed air passage includes at least one cylindrical tube formed by the heat dissipation surface and the bottom surface a second end of the at least one cylindrical pipe closed by a side wall of the second cavity or a substrate of the heat sink, and the bottom surface includes an air inlet and an air outlet to communicate the second cavity and the At least one columnar pipe.
  • the inverter 100 includes: a housing 110, a magnetic conversion circuit 120 including a magnetic element, a power conversion circuit 130 including a power tube, a heat sink 140, and a sealing duct 150.
  • the body 110 has a first cavity 111 and a second cavity 112 which are separated from each other and are closed.
  • the magnetic conversion circuit 120 is disposed in the first cavity 111
  • the power conversion circuit 130 is disposed in the second cavity 112.
  • the heat sink 140 is disposed at the bottom of the housing 110 and outside the first cavity 111 and the second cavity 112.
  • the sealing air channel 150 is disposed outside the second cavity 112, and the sealing air channel 150 includes At least one columnar pipe formed by the heat dissipating surface and the bottom surface, the two ends of the at least one column pipe are closed, the bottom surface is composed of a side wall of the second cavity or a substrate of the heat sink, and the bottom surface includes an air inlet and a bottom a tuyere for communicating the second cavity 112 with the at least one columnar conduit.
  • the inverter of the embodiment of the present invention by providing a sealed air passage having an air inlet and an air outlet outside the closed cavity, the hot air inside the closed cavity enters the sealed air passage, and the heat dissipation type of the air passage is sealed.
  • the surface exchanges heat with the outside air, which can reduce the air temperature inside the cavity, improve the heat dissipation efficiency, and improve the reliability and life of the device, reduce the volume and weight of the product, and reduce product noise.
  • the inverter of the embodiment of the present invention is described by taking only the inverter 100 shown in FIGS. 1A and 1B as an example, but the embodiment of the present invention is not limited thereto.
  • the inverter may also have a plurality of closed cavities, each of which may be separated by a baffle or by a closed cavity.
  • the bottom of the housing of the inverter may be constructed from a substrate of the heat sink, i.e., the substrate of the heat sink forms the bottom or bottom of the first cavity and the second cavity.
  • the corresponding circuit including the magnetic component in the embodiment of the present invention is referred to as a magnetic conversion circuit
  • the corresponding circuit including the power tube is referred to as a power conversion circuit
  • the magnetic conversion circuit and the power conversion circuit may further include other electronic components.
  • the magnetic component includes a boost (Boost) Inductor and Invertor Inductor
  • the power tube includes a boost power tube and an inverter power tube.
  • Boost boost
  • the embodiment of the present invention is only described by taking a photovoltaic inverter including a boost inductor, a reverse inductor, a boost power tube, and an inverter power tube as an example, but the embodiment of the present invention is not limited thereto.
  • the embodiment of the present invention can also be applied to a radio remote unit (Radio Remote Unit, abbreviated as "RRU").
  • RRU Radio Remote Unit
  • the sealing air passage 150 is disposed outside the second cavity 112, and the sealing air passage 150 includes at least one columnar pipe formed by the heat dissipation surface 151 and the bottom surface 152.
  • the two ends of the at least one columnar conduit are closed, and the bottom surface 152 may be formed by a sidewall of the second cavity 112 or a substrate of the heat sink 140, and the bottom surface 152 includes an air inlet 153 and an air outlet 154 to communicate the first
  • the two chambers 112 and the at least one columnar conduit of the sealing duct 150 are such that the hot air inside the closed second chamber 112 enters the sealing duct 150 and passes through the heat dissipating surface 151 of the sealing duct 150 and the outside air. The heat exchange can thereby reduce the temperature of the air inside the second chamber 112.
  • the heat dissipating surface 151 of the sealing duct 150 is a pleated wall, and the cross section of the heat dissipating surface 151 may be a continuous convex shape, and each of the bosses may have a regular polygonal shape or may be a regular polygon. It is an irregular polygon.
  • the heat dissipation surface 151 is a series of square protrusions, and the interval between each protrusion can be designed as needed.
  • the heat dissipating surface 151 may also have a zigzag or corrugated cross section.
  • the cross section of the heat dissipating surface 151 may also be other shapes. It should also be understood that in order to enhance the heat dissipation effect of the heat dissipation profile, the heat dissipation profile outer surface may further include a plurality of protrusions to increase the contact area of the heat dissipation profile with the outside air, thereby enhancing the heat dissipation effect.
  • the bottom surface 152 of the sealing air duct 150 includes an air inlet 153 and an air outlet 154.
  • the air inlet or the air outlet may be an opening spanning a plurality of columnar pipes, or may be one or An opening in the plurality of at least one columnar pipe, the opening may be an opening on a bottom surface of a columnar pipe, or may be an opening across the plurality of columnar pipes.
  • the embodiment of the present invention is not limited thereto, as long as the air in the second cavity 112 passes through the air inlet 153 and the air outlet 154. It is possible to communicate with at least one columnar duct of the seal duct 150 to constitute a circulation passage of the internal air.
  • the internal air temperature can be reduced by at least 10 ° C or more compared with the prior art solution, and the requirement of heat dissipation on the heat dissipation area can be effectively reduced, thereby reducing the volume of the heat sink and reducing heat dissipation.
  • the weight of the device, and the thermal power density of the photovoltaic inverter can be increased by more than 20%.
  • the internal air temperature can be reduced by more than 10 °C compared with the prior art solution, which means that the working environment temperature of the power device is lower, and the reliability and life expectancy will be greatly improved.
  • the heat sink 140 includes a first heat sink 141 located outside the first cavity 111, and a second heat sink located outside the second cavity 112. 142, the heat dissipating fins of the first heat sink 141 and the heat dissipating fins of the second heat sink 142 are disconnected from each other, as indicated by an arrow G in FIG. That is, the magnetic conversion circuit 120 dissipates heat through the independent first heat sink 141, and the power conversion circuit 130 dissipates heat through the independent second heat sink 142.
  • the heat dissipating teeth of the first heat sink 141 and the heat dissipating teeth of the second heat sink 142 are broken. The thermal isolation is achieved, so that the heat generated by the magnetic conversion circuit 120 can be prevented from being transferred to the power conversion circuit 130, and the influence on the device of the power conversion circuit 130 can be prevented.
  • the magnetic conversion circuit 120 is disposed to closely adhere to the substrate of the first heat sink 141, and the power conversion circuit 130 is disposed to closely adhere the substrate of the second heat sink 142. Therefore, the heat generated by the components in the circuit is transmitted to the heat dissipating fins of the heat sink through the substrate of the heat sink to improve the heat dissipation efficiency, thereby improving the reliability of the product and the life of the product.
  • the inverter 100 may further include a heat shield 160, which is insulated by heat The material is made and covered over the magnetic conversion circuit 120, as shown in FIG. Thereby, the thermal cascade of the magnetic conversion circuit to the power conversion circuit can be further avoided.
  • the inverter further includes a first fan disposed in the second cavity and/or a second fan disposed outside the casing according to an application requirement.
  • the first fan is disposed in the second cavity to accelerate the air circulation inside the second cavity, accelerate the reduction of the air temperature in the cavity, and improve the heat dissipation efficiency.
  • the heat sink can be a unitary structure or a combined structure.
  • the heat sink of the unitary structure may be formed by extrusion or die casting; the heat sink of the combined structure may be crimped, welded or bonded by the substrate and the blade, and the material of the heat sink may be metal or non-metal.
  • the inverter of the embodiment of the present invention by providing a sealed air passage having an air inlet and an air outlet outside the closed cavity, the hot air inside the closed cavity enters the sealed air passage, and the heat dissipation type of the air passage is sealed.
  • the surface exchanges heat with the outside air, which can reduce the air temperature inside the cavity, improve the heat dissipation efficiency, and improve the reliability and life of the device, reduce the volume and weight of the product, and reduce product noise.
  • the first cavity 111 may be disposed at the top of the entire inverter, that is, the first cavity 111 is located above the second cavity 112. It may be possible to avoid the rise of the hot gas flow of the first cavity affecting the temperature of the second cavity.
  • the first cavity 111 may be located on the left side of the second cavity 112; as shown in FIGS. 6A to 6C, the first cavity 111 may be located on the right side of the second cavity 112;
  • the first cavity 111 may be located in the middle of the second cavity 112. That is, the first cavity may be located above, to the left, to the right or in the middle of the second cavity.
  • the sealed air channel is located on the substrate of the second heat sink, and Located on the left, middle or right side of the second heat sink.
  • the first cavity 111 is located above the second cavity 112, and the sealing air channel 150 is disposed on the substrate of the second heat sink 142, and is located on the left side of the second heat sink 142. That is, the air inlet and the air outlet of the sealing air passage 150 are disposed on the left side of the power conversion circuit 130; as shown in FIG. 4B, the air inlet and the air outlet of the sealing air passage 150 are disposed on the right side of the power conversion circuit 130, that is, the sealing air The channel 150 is disposed on the substrate of the second heat sink 142 and located on the right side of the second heat sink 142. As shown in FIG. 4C, the sealing air channel 150 is disposed on the substrate of the second heat sink 142, and is located at the first The middle of the two heat sinks 142.
  • the first cavity 111 is located on the left side of the second cavity 112, and the air inlet and the air outlet of the sealing air channel 150 are disposed on the right side of the power conversion circuit 130, that is, the sealing air channel 150 is disposed in the second heat dissipation.
  • the substrate of the device 142 is located on the right side of the second heat sink 142; as shown in FIG. 5B, the sealing air channel 150 is located on the left side of the second heat sink 142; as shown in FIG. 5C, the sealing air channel 150 is located The middle of the second heat sink 142.
  • the first cavity 111 is located on the right side of the second cavity 112, and the air inlet and the air outlet of the sealing air channel 150 are disposed on the right side of the power conversion circuit 130, that is, the sealing air channel 150 is disposed in the second heat dissipation.
  • the substrate of the device 142 is located on the right side of the second heat sink 142; as shown in FIG. 6B, the sealing air channel 150 is located on the left side of the second heat sink 142; as shown in FIG. 6C, the sealing air channel 150 is located The middle of the second heat sink 142.
  • the first cavity 111 is located in the middle of the second cavity 112, and the air inlet and the air outlet of the sealing air channel 150 are disposed on the right side of the power conversion circuit 130, that is, the sealing air channel 150 is disposed in the second heat dissipation.
  • the substrate of the device 142 is located on the right side of the second heat sink 142; as shown in FIG. 7B, the sealing air channel 150 is located on the left side of the second heat sink 142; as shown in FIGS. 7C and 7D, the air channel is sealed. 150 is located in the middle of the second heat sink 142.
  • the sealed air duct is located at an outer sidewall of the second cavity.
  • the sealing air duct 150 is disposed outside the second cavity 112 and located at the outer side wall of the second cavity 112.
  • the bottom surface of the sealing air channel 150 is from the side of the second cavity 112. Wall composition, And the bottom surface includes an air inlet and an air outlet to communicate the second cavity and the at least one column pipe.
  • the heat dissipating surface is integrally formed from an aluminum plate, which is simple in processing, can reduce product cost, and improve productivity.
  • the heat dissipating surface is sealingly connected to the outer sidewall of the second cavity or the substrate of the second heat sink.
  • the sealing air duct is sealed by at least one of a metal structural member sealing method and a plastic member sealing method.
  • the heat dissipating surface may also be a pleated panel, wherein the sealing is the most critical portion.
  • the following sealing scheme can be adopted: a combination of multiple seals is used to finally achieve a complete seal, and the sealing structure and the dipping method are sealed at both ends of the pleated panel, in the pleated panel
  • the joint with the cabinet is sealed by a sealing material with a certain installation pressure.
  • the sealing scheme is characterized by: The pleated panel is first crimped at the end by using the edge material, and then the second sealing is realized by the toothed structural member and the riveting, and finally the third sealing is achieved by dipping, and finally the complete sealing is achieved. The effect of the seal.
  • the specific implementation form of the seal may include the following forms:
  • Fig. 9A after the pleats are formed, the ends are 90° flanged, the size of the flanges is determined according to the pleat spacing, and the two flanges are butted or overlapped to achieve the first seal.
  • Fig. 9B a "comb" type structure having the same shape as that of the pleats is used at both ends of the pleated plate to achieve sealing by riveting or other joining means. Finally, the final sealing of the pleated plate itself is achieved by dipping.
  • the sealing method is characterized in that: the pleated plate is sealed at the end by a plastic member.
  • the specific method may be that the plastic head member is first formed, and then the head member is placed on the formed pleated plate, and then the sealing is achieved by dipping.
  • the inverter of the embodiment of the present invention by providing a sealed air passage having an air inlet and an air outlet outside the closed cavity, the hot air inside the closed cavity enters the sealed air passage and passes through The heat-dissipating surface of the sealed air duct exchanges heat with the outside air, thereby reducing the air temperature inside the cavity, improving the heat dissipation efficiency, and improving the reliability and life of the device, reducing the volume and weight of the product, and reducing product noise.
  • Figure 10 shows a schematic perspective view of a sealed air duct 200 in accordance with an embodiment of the present invention.
  • the sealing duct 200 is disposed outside the closed cavity 250.
  • the sealing duct 200 includes at least one columnar pipe formed by the heat radiating surface 210 and the bottom surface 220, and the ends of the at least one column pipe are closed.
  • the bottom surface 220 is formed by the wall of the closed cavity, and the bottom surface includes an air inlet 230 and an air outlet 240 to communicate the cavity 250 and the at least one columnar pipe.
  • the sealed air duct of the embodiment of the invention by providing a sealing air passage having an air inlet and an air outlet outside the closed cavity, the hot air inside the closed cavity enters the sealing air passage, and the heat dissipation surface of the air passage is sealed.
  • the external air exchanges heat, which can reduce the air temperature inside the cavity, improve the heat dissipation efficiency, and improve the reliability and life of the device, reduce the volume and weight of the product, and reduce product noise.
  • the heat dissipating surface has a cross section of a boss shape, a zigzag shape or a corrugated shape.
  • the outer surface of the heat dissipating surface may also be provided with a boss type or a corrugated type reinforcing surface.
  • the heat dissipating surface and the material of the reinforcing surface may be metal or non-metal.
  • the heat dissipating surface is integrally formed from an aluminum plate.
  • the heat dissipation profile is sealingly connected to the wall of the closed cavity.
  • the sealing duct is sealed by at least one of a metal structural member sealing method and a plastic member sealing method.
  • the seal duct 200 may correspond to the seal duct 150 in the inverter of the embodiment of the present invention, and the above and other operations and/or functions of the respective modules in the seal duct 200 may be referred to the foregoing. Corresponding descriptions in the embodiments are omitted for brevity.
  • the sealing air duct of the embodiment of the invention has an air inlet and a outlet provided outside the closed cavity
  • the sealing air passage of the tuyere allows the hot air inside the closed cavity to enter the sealed air passage, and exchanges heat with the external air through the heat dissipating surface of the sealing air passage, thereby reducing the air temperature inside the cavity, improving the heat dissipation efficiency, and capable of Improve device reliability and longevity, reduce product size and weight, and reduce product noise.
  • FIG 11 shows a schematic perspective view of a heat dissipation system 300 in accordance with an embodiment of the present invention. As shown
  • the heat dissipation system 300 includes:
  • a heat sink 310 disposed at the bottom of the closed cavity 330 and outside the closed cavity 330; and a sealed air duct 320 according to an embodiment of the present invention, the sealed air passage 320 being disposed in the closed cavity
  • the sealed air duct 320 includes at least one cylindrical duct formed by the heat radiating surface 321 and the bottom surface 322, and both ends of the at least one cylindrical duct are closed, and the bottom surface 322 is closed by the closed cavity
  • the wall of the 330 is constructed, and the bottom surface 332 includes an air inlet 323 and an air outlet 324 to communicate the cavity 330 with the at least one columnar conduit.
  • the heat dissipation system may further include a first fan disposed within the enclosed cavity and/or a second fan disposed outside the enclosed cavity.
  • a sealed air duct is located on an outer side wall of the closed cavity, or the sealed air duct is located at a bottom of the closed cavity and is located on a left side, a middle side or a right side of the heat sink.
  • the heat dissipation system 300 may include a seal air duct 320 that may correspond to the seal air duct 150 or the seal air duct 200 in the inverter 100 of the embodiment of the present invention, and seal each of the air ducts 320.
  • seal air duct 320 may correspond to the seal air duct 150 or the seal air duct 200 in the inverter 100 of the embodiment of the present invention, and seal each of the air ducts 320.
  • the heat dissipation system of the embodiment of the present invention by providing a sealed air passage having an air inlet and an air outlet outside the closed cavity, the hot air inside the closed cavity enters the sealed air passage, and the heat dissipation surface and the outer portion of the air passage are sealed.
  • the air exchanges heat which can reduce the air temperature inside the cavity, improve the heat dissipation efficiency, and improve the reliability and life of the device, reduce the volume and weight of the product, and reduce product noise.
  • the disclosed systems, devices, and methods may be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not executed.
  • the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, or an electrical, mechanical or other form of connection.
  • the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e., may be located in one place, or may be distributed over multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the embodiments of the present invention.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as a standalone product, may be stored in a computer readable storage medium.
  • the technical solution of the present invention contributes in essence or to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, including several instructions.
  • a computer device which may be a personal computer, server, or network device, etc.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read only memory
  • ROM Read-Only Memory
  • RAM Random Access Memory
  • disk or optical disk and other media that can store program code.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种逆变器、密封风道和散热系统。该逆变器（100）包括：壳体（110），具有彼此隔离且封闭的第一腔体（111）和第二腔体（112）；包括磁性元件的磁性变换电路（120），设置在第一腔体（111）内；包括功率管的功率变换电路（130），设置在第二腔体（112）内；散热器（140），设置在壳体（110）底部且位于第一腔体（111）和第二腔体（112）外部；密封风道（150），设置在第二腔体（112）外部。其中密封风道（150）包括由散热型面和底面形成的至少一个柱状管道。至少一个柱状管道的两端封闭。该底面由第二腔体（112）的侧壁或散热器（140）的基板构成。该底面包括进风口和出风口，以连通第二腔体（112）与至少一个柱状管道。该逆变器（100）能够降低腔体内部空气温度，提高散热效率，从而能够提高器件的可靠性和寿命，减小产品体积和噪声。

Description

逆变器、 密封风道和散热系统
技术领域 本发明涉及电子器件领域， 尤其涉及电子器件领域中的逆变器、 密封 风道和散热系统。 背景技术
光伏逆变器的热耗主要集中在磁性变换电路和功率变换电路。 磁性变 换电路一般包含升压 （Boost) 电感和逆变 （Invertor) 电感。 磁性变换电路 热耗较大， 温度较高， 且通常设置在逆变器的顶部， 其中磁性器件的热量 直接传递到散热器基板， 并通过顶部的分离散热齿散出。 功率变换电路的 热耗主要分布在 Boost功率管和 Invertor功率管上， 热耗较大， 其中大部份热 耗需要直接贴合散热器散出， 而其余热耗将导致逆变器内部空气温度升高， 从而影响诸如电解电容和液晶显示屏 （Liquid Crystal Display, 简称为
"LCD" ) 的温度敏感器件的可靠性及寿命。
由于光伏逆变器大多采用压铸和型材散热器方案， 只能降低功率器件 的温度， 不能有效改善腔体内部的空气温度， 因而为了降低腔体内部空气 温度， 通常需要加大散热器的体积及增加风扇的风量， 这导致逆变器重量 增加， 体积增大， 并且噪音升高。
因此， 需要一种方案能够有效地降低腔体内部的空气温度， 提高散热 效率。 发明内容
本发明实施例提供了一种逆变器、 密封风道和散热系统， 能够降低腔 体内部的空气温度， 提高散热效率。
一方面， 本发明实施例提供了一种逆变器， 该逆变器包括： 壳体， 具 有彼此隔离且封闭的第一腔体和第二腔体； 包括磁性元件的磁性变换电路， 设置在该第一腔体内；包括功率管的功率变换电路，设置在该第二腔体内； 散热器， 设置在该壳体底部且位于该第一腔体和该第二腔体外部； 密封风 道， 设置在该第二腔体外部， 该密封风道包括由散热型面和底面形成的至 少一个柱状管道， 该至少一个柱状管道的两端封闭， 该底面由该第二腔体 的侧壁或该散热器的基板构成， 并且该底面包括进风口和出风口， 以连通 该第二腔体与该至少一个柱状管道。
另一方面， 本发明实施例提供了一种密封风道， 该密封风道设置在封 闭腔体的外部， 该密封风道包括由散热型面和底面形成的至少一个柱状管 道， 该至少一个柱状管道的两端封闭， 该底面由该封闭腔体的壁构成， 并 且该底面包括进风口和出风口， 以连通该腔体与该至少一个柱状管道。
再一方面， 本发明实施例提供了一种散热系统， 该散热系统包括： 设 置在封闭腔体底部且位于该封闭腔体外部的散热器； 以及根据本发明实施 例的密封风道， 该密封风道设置在封闭腔体的外部， 该密封风道包括由散 热型面和底面形成的至少一个柱状管道， 该至少一个柱状管道的两端封闭， 该底面由该封闭腔体的壁构成， 并且该底面包括进风口和出风口， 以连通 该腔体与该至少一个柱状管道。
基于上述技术方案， 本发明实施例的逆变器、 密封风道和散热系统， 通过在封闭腔体外部设置具有进风口和出风口的密封风道， 使得封闭腔体 内部的热空气进入密封风道， 并通过密封风道的散热型面与外部空气进行 热交换， 从而能够降低腔体内部空气温度， 提高散热效率， 并且能够提高 器件的可靠性和寿命， 减小产品体积和重量， 降低产品噪声。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对本发明实施例 中所需要使用的附图作简单地介绍， 显而易见地， 下面所描述的附图仅仅 是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性 劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1A和 1B是根据本发明实施例的逆变器的示意性透视图。
图 2是根据本发明实施例的逆变器的部分示意性透视图。
图 3是根据本发明另一实施例的逆变器的部分示意性透视图。
图 4A至 4C是根据本发明再一实施例的逆变器的示意性透视图。 图 5A至 5C是根据本发明再一实施例的逆变器的示意性透视图。 图 6A至 6C是根据本发明再一实施例的逆变器的示意性透视图。 图 7A至 7D是根据本发明再一实施例的逆变器的示意性透视图。 图 8是根据本发明再一实施例的逆变器的示意性透视图。
图 9A和 9B是根据本发明实施例的散热型面的示意性透视图。
图 10是根据本发明实施例的密封风道的示意性透视图。
图 11是根据本发明实施例的散热系统的示意性透视图。 具体实 it^r式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进 行清楚、 完整地描述， 显然， 所描述的实施例是本发明的一部分实施例， 而不是全部实施例。 基于本发明中的实施例， 本领域普通技术人员在没有 做出创造性劳动的前提下所获得的所有其他实施例， 都应属于本发明保护 的范围。
图 1A和 1B示出了根据本发明实施例的逆变器的示意性透视图。 如图 1A和 1B所示， 本发明实施例的逆变器包括： 壳体， 具有彼此隔离且封闭 的第一腔体和第二腔体； 包括磁性元件的磁性变换电路， 设置在该第一腔 体内； 包括功率管的功率变换电路， 设置在该第二腔体内； 散热器， 设置 在该壳体底部且位于该第一腔体和该第二腔体外部； 密封风道， 设置在该 第二腔体外部， 该密封风道包括由散热型面和底面形成的至少一个柱状管 道， 该至少一个柱状管道的两端封闭， 该底面由该第二腔体的侧壁或该散 热器的基板构成， 并且该底面包括进风口和出风口， 以连通该第二腔体与 该至少一个柱状管道。
具体地， 如图 1A和 1B所示， 逆变器 100包括： 壳体 110、 包括磁性 元件的磁性变换电路 120、 包括功率管的功率变换电路 130、 散热器 140和 密封风道 150，该壳体 110具有彼此隔离且封闭的第一腔体 111和第二腔体 112， 该磁性变换电路 120设置在该第一腔体 111内， 该功率变换电路 130 设置在该第二腔体 112内， 该散热器 140设置在该壳体 110底部且位于该 第一腔体 111和该第二腔体 112外部， 该密封风道 150设置在该第二腔体 112外部，并且该密封风道 150包括由散热型面和底面形成的至少一个柱状 管道， 该至少一个柱状管道的两端封闭， 该底面由该第二腔体的侧壁或该 散热器的基板构成， 并且该底面包括进风口和出风口， 以连通该第二腔体 112与该至少一个柱状管道。
因此， 本发明实施例的逆变器， 通过在封闭腔体外部设置具有进风口 和出风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过 密封风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气 温度， 提高散热效率， 并且能够提高器件的可靠性和寿命， 减小产品体积 和重量， 降低产品噪声。
应理解， 本发明实施例的逆变器仅以图 1A和 1B所示的逆变器 100为 例进行说明， 但本发明实施例并不限于此。 例如， 逆变器也可以具有多个 封闭的腔体， 各腔体可以通过隔板隔开， 也可以通过封闭的腔体隔开。 还 应理解， 在本发明实施例中， 逆变器的壳体的底部可以由散热器的基板构 成， 即散热器的基板形成第一腔体和第二腔体的底面或底部。
应理解， 本发明实施例中的包括磁性元件的相应电路称之为磁性变换 电路， 包括功率管的相应电路称之为功率变换电路， 并且磁性变换电路和 功率变换电路还可以包括其它电子元器件。 可选地， 该磁性元件包括升压 (Boost) 电感和逆变 （Invertor) 电感， 该功率管包括升压功率管和逆变功 率管。 还应理解， 本发明实施例仅以包括升压电感、 逆变电感、 升压功率 管和逆变功率管的光伏逆变器为例进行说明， 但是本发明实施例并不限于 此。 例如， 本发明实施例还可以应用于射频拉远单元 （Radio Remote Unit, 简称为 "RRU")。
在本发明实施例中， 如图 2所示， 该密封风道 150设置在该第二腔体 112外部，并且该密封风道 150包括由散热型面 151和底面 152形成的至少 一个柱状管道， 该至少一个柱状管道的两端封闭， 该底面 152可以由该第 二腔体 112的侧壁或该散热器 140的基板构成， 并且该底面 152包括进风 口 153和出风口 154，以连通该第二腔体 112与该密封风道 150的至少一个 柱状管道， 从而使得封闭的第二腔体 112内部的热空气进入密封风道 150， 并通过密封风道 150的散热型面 151与外部空气进行热交换， 从而能够降 低第二腔体 112内部空气温度。
在本发明实施例中， 该密封风道 150的散热型面 151为褶皱壁， 该散 热型面 151 的横截面可以是连续的凸台形， 每个凸台的形状可以是规则的 多边形， 也可以是不规则的多边形， 例如散热型面 151 为一系列的方形凸 起， 每个凸起之间的间隔可以根据需要设计。 该散热型面 151 的横截面也 可以是锯齿形或波纹形。
应理解， 该散热型面 151 的横截面还可以是其它形状。 还应理解， 为 了增强散热型面的散热效果， 该散热型面外表面还可以包括多个凸起， 以 增加散热型面与外界空气的接触面积， 从而强化散热效果。
在本发明实施例中， 还应理解， 密封风道 150的底面 152包括进风口 153和出风口 154，该进风口或出风口可以是横跨多个柱状管道的一个开口， 也可以是一个或多个该至少一个柱状管道上的开口， 该开口可以是一个柱 状管道的底面上的开口， 也可以是横跨多个柱状管道的开口。 本发明实施 例并不限于此， 只要第二腔体 112内的空气通过进风口 153和出风口 154， 能够与密封风道 150 的至少一个柱状管道连通， 构成内部空气的循环通道 即可。
因此， 采用本发明实施例的技术方案， 可以使内部空气温度较现有技 术方案降低至少 10°C以上， 能够有效地减少空气散热对散热面积的需求， 从而能够减少散热器的体积， 减轻散热器的重量， 并且光伏逆变器的热功 率密度能够提升 20%以上。 对于具有同样体积的产品， 由于内部空气温度 较现有技术方案能够降低 10°C以上， 这意味着功率器件的工作环境温度更 低， 可靠性及寿命将大幅提升。 此外， 由于产品的散热能力提升， 可以实 现更高功率段的自然散热， 并且即使加装风扇， 风扇也不需要高速运行， 绝大部份时间风扇低速运行甚至不运行， 由此能够显著地降低逆变器的噪 声。
在本发明实施例中， 如图 1A或图 3所示， 该散热器 140包括位于该第 一腔体 111外部的第一散热器 141， 以及位于该第二腔体 112外部的第二散 热器 142，该第一散热器 141的散热齿片与该第二散热器 142的散热齿片彼 此断开， 如图 3中的箭头 G所示。 即磁性变换电路 120通过独立的第一散 热器 141进行散热， 功率变换电路 130通过独立的第二散热器 142进行散 热， 该第一散热器 141 的散热齿与第二散热器 142的散热齿断开， 即实现 热隔绝， 从而能够防止磁性变换电路 120产生的热量传递到功率变换电路 130， 并防止对功率变换电路 130的器件的影响。
应理解， 在本发明实施例中， 可选地， 磁性变换电路 120设置成紧密 贴附该第一散热器 141 的基板， 该功率变换电路 130设置成紧密贴附该第 二散热器 142 的基板， 从而确保电路中的元器件产生的热量通过散热器的 基板传递到散热器的散热齿片， 以提高散热效率， 从而提高产品的可靠性 禾口寿命
为了进一步避免磁性变换电路产生的热量对功率变换电路的影响， 根 据本发明实施例的逆变器 100还可以包括隔热罩 160，该隔热罩 160由隔热 材料制成， 且罩在该磁性变换电路 120上方， 如图 3所示。 从而可以进一 步避免磁性变换电路对功率变换电路的热级联。
可选地， 在本发明实施例中， 根据应用需要， 该逆变器还包括设置在 该第二腔体内的第一风扇和 /或设置在该壳体外部的第二风扇。 例如， 在第 二腔体内设置第一风扇， 能够加速第二腔体内部的空气循环， 加速腔内空 气温度的降低， 提升散热效率。
应理解， 本文中术语 "和 /或"， 仅仅是一种描述关联对象的关联关系， 表示可以存在三种关系， 例如， A和 /或 B, 可以表示： 单独存在 A, 同时 存在 A和 B, 单独存在 B这三种情况。 另外， 本文中字符 " /"， 一般表示 前后关联对象是一种 "或" 的关系。
应理解， 散热器可以为一体结构或组合结构。 一体结构的散热器可以 通过挤压或压铸成形； 组合结构的散热器可以由基板和齿片压接、 焊接或 粘接成形， 并且散热器的材料可以为金属或非金属。
因此， 本发明实施例的逆变器， 通过在封闭腔体外部设置具有进风口 和出风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过 密封风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气 温度， 提高散热效率， 并且能够提高器件的可靠性和寿命， 减小产品体积 和重量， 降低产品噪声。
在本发明实施例中， 如图 4A至 4C所示， 优选地， 第一腔体 111可以 设置在整个逆变器的顶部， 即第一腔体 111位于第二腔体 112的上方， 以尽 可能避免第一腔体的热气流上升影响第二腔体的温度。如图 5A至 5C所示， 第一腔体 111可以位于第二腔体 112的左侧； 如图 6A至 6C所示， 第一腔 体 111可以位于第二腔体 112的右侧； 如图 7A至 7D所示， 第一腔体 111 可以位于第二腔体 112的中间。即该第一腔体可以位于该第二腔体的上方、 左侧、 右侧或中间。
在本发明实施例中， 可选地， 密封风道位于第二散热器的基板上， 且 位于该第二散热器的左侧、 中间或右侧。
具体而言， 如图 4A所示， 第一腔体 111位于第二腔体 112上方， 密封 风道 150设置在第二散热器 142的基板上， 且位于该第二散热器 142的左 侧， 即密封风道 150的进风口和出风口设置在功率变换电路 130的左侧； 如图 4B所示，密封风道 150的进风口和出风口设置在功率变换电路 130的 右侧， 即密封风道 150设置在第二散热器 142的基板上， 且位于该第二散 热器 142的右侧； 如图 4C所示， 密封风道 150设置在第二散热器 142的基 板上， 且位于该第二散热器 142的中间。
如图 5A所示， 第一腔体 111位于第二腔体 112左侧， 密封风道 150的 进风口和出风口设置在功率变换电路 130的右侧， 即密封风道 150设置在 第二散热器 142的基板上，且位于该第二散热器 142的右侧；如图 5B所示， 密封风道 150位于该第二散热器 142的左侧； 如图 5C所示， 密封风道 150 位于该第二散热器 142的中间。
如图 6A所示， 第一腔体 111位于第二腔体 112右侧， 密封风道 150的 进风口和出风口设置在功率变换电路 130的右侧， 即密封风道 150设置在 第二散热器 142的基板上，且位于该第二散热器 142的右侧；如图 6B所示， 密封风道 150位于该第二散热器 142的左侧； 如图 6C所示， 密封风道 150 位于该第二散热器 142的中间。
如图 7A所示， 第一腔体 111位于第二腔体 112的中间， 密封风道 150 的进风口和出风口设置在功率变换电路 130的右侧， 即密封风道 150设置 在第二散热器 142的基板上， 且位于该第二散热器 142的右侧； 如图 7B所 示， 密封风道 150位于该第二散热器 142的左侧； 如图 7C和 7D所示， 密 封风道 150位于该第二散热器 142的中间。
在本发明实施例中， 可选地， 密封风道位于该第二腔体的外侧壁。 如 图 8所示， 密封风道 150设置在该第二腔体 112外部， 且位于第二腔体 112 的外侧壁， 此时， 该密封风道 150的底面由该第二腔体 112的侧壁构成， 并且该底面包括进风口和出风口， 以连通该第二腔体与该至少一个柱状管 道。
在本发明实施例中， 可选地， 散热型面由铝板一体成型， 加工简单， 能够降低产品成本， 提高生产率。 在本发明实施例中， 散热型面与第二腔 体的外侧壁或第二散热器的基板密封连接。 可选地， 该密封风道采用金属 结构件密封方式和塑料件密封方式中的至少一种方式密封。
具体而言， 对于作为密封风道的主要散热部件的散热型面， 该散热型 面也可以是褶皱板， 其中密封是最关键的部分。 在将密封风道与壳体的内 外壁隔离中， 可以采用如下密封方案： 采用多重密封相结合， 最终实现完 全密封， 在褶皱板的两端利用密封结构和浸胶的方式密封， 在褶皱板与机 柜结合处利用密封材料配合一定安装压力实现密封。 该密封方案的特点为： 褶皱板在端部利用边料实现第一次压接密封， 然后利用齿型结构件和铆接 实现第二次密封， 最后利用浸胶实现第三次密封， 最终实现完全密封的效 果。
其中密封的具体实现形式可以包括以下形式：
( 1 ) 金属结构件密封
如图 9A所示， 褶皱板成型之后， 两端成 90° 翻边， 翻边大小根据褶 皱间距而定， 两翻边对接或重叠实现第一次密封。 如图 9B所示， 在褶皱板 的两端采用与褶皱断面形状相同的 "梳子"型结构通过铆接方式或其他连 接方式实现密封。 最后利用浸胶的方式实现褶皱板本身的最终密封。
( 2) 塑料件密封
该密封方式的特点为： 褶皱板在端部利用塑胶件密封。 具体做法可以 是， 首先制成塑胶封头件， 再将该封头件设置在成型后的褶皱板上， 然后 利用浸胶的方式实现密封。
因此， 本发明实施例的逆变器， 通过在封闭腔体外部设置具有进风口 和出风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过 密封风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气 温度， 提高散热效率， 并且能够提高器件的可靠性和寿命， 减小产品体积 和重量， 降低产品噪声。
上文中结合图 1A至图 9B, 详细描述了根据本发明实施例的逆变器， 下面将结合图 10和图 11， 描述根据本发明实施例的密封风道和散热系统。
图 10示出了根据本发明实施例的密封风道 200的示意性透视图。 如图 10所示， 该密封风道 200设置在封闭腔体 250的外部， 该密封风道 200包 括由散热型面 210和底面 220形成的至少一个柱状管道， 该至少一个柱状 管道的两端封闭， 该底面 220 由该封闭腔体的壁构成， 并且该底面包括进 风口 230和出风口 240， 以连通该腔体 250与该至少一个柱状管道。
本发明实施例的密封风道， 通过在封闭腔体外部设置具有进风口和出 风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过密封 风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气温度， 提高散热效率，并且能够提高器件的可靠性和寿命，减小产品体积和重量， 降低产品噪声。
在本发明实施例中， 可选地， 散热型面的横截面为凸台形、 锯齿形或 波纹形。 该散热型面的外表面还可以设置有凸台型或波纹型强化型面。 该 散热型面和该强化型面的材料可以为金属或非金属。 可选地， 该散热型面 由铝板一体成型。
在本发明实施例中，可选地，该散热型面与该封闭腔体的壁密封连接。 可选地， 该密封风道采用金属结构件密封方式和塑料件密封方式中的至少 一种方式密封。
根据本发明实施例的密封风道 200可对应于本发明实施例的逆变器中 的密封风道 150， 并且密封风道 200中的各个模块的上述和其它操作和 /或 功能， 可以参考前述实施例中的对应描述， 为了简洁， 在此不再赘述。
本发明实施例的密封风道， 通过在封闭腔体外部设置具有进风口和出 风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过密封 风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气温度， 提高散热效率，并且能够提高器件的可靠性和寿命，减小产品体积和重量， 降低产品噪声。
图 11示出了根据本发明实施例的散热系统 300的示意性透视图。 如图
11所示， 该散热系统 300包括：
设置在封闭腔体 330底部且位于该封闭腔体 330外部的散热器 310;和 根据本发明实施例的密封风道 320， 该密封风道 320设置在封闭腔体
330的外部，该密封风道 320包括由散热型面 321和底面 322形成的至少一 个柱状管道， 该至少一个柱状管道的两端封闭， 该底面 322 由该封闭腔体
330的壁构成， 并且该底面 332包括进风口 323和出风口 324， 以连通该腔 体 330与该至少一个柱状管道。
在本发明实施例中， 散热系统还可以包括设置在该封闭腔体内的第一 风扇和 /或设置在该封闭腔体外部的第二风扇。 可选地， 密封风道位于该封 闭腔体的外侧壁， 或该密封风道位于该封闭腔体的底部， 且位于该散热器 的左侧、 中间或右侧。
应理解， 根据本发明实施例的散热系统 300包括的密封风道 320可对 应于本发明实施例的逆变器 100中的密封风道 150或密封风道 200，并且密 封风道 320中的各个模块的上述和其它操作和 /或功能， 可以参考前述实施 例中的对应描述， 为了简洁， 在此不再赘述。
本发明实施例的散热系统， 通过在封闭腔体外部设置具有进风口和出 风口的密封风道， 使得封闭腔体内部的热空气进入密封风道， 并通过密封 风道的散热型面与外部空气进行热交换， 从而能够降低腔体内部空气温度， 提高散热效率，并且能够提高器件的可靠性和寿命，减小产品体积和重量， 降低产品噪声。
本领域普通技术人员可以意识到， 结合本文中所公开的实施例描述的 各示例的单元及算法步骤， 能够以电子硬件、 计算机软件或者二者的结合 来实现， 为了清楚地说明硬件和软件的可互换性， 在上述说明中已经按照 功能一般性地描述了各示例的组成及步骤。 这些功能究竟以硬件还是软件 方式来执行， 取决于技术方案的特定应用和设计约束条件。 专业技术人员 可以对每个特定的应用来使用不同方法来实现所描述的功能， 但是这种实 现不应认为超出本发明的范围。
所属领域的技术人员可以清楚地了解到， 为了描述的方便和简洁， 上 述描述的系统、 装置和单元的具体工作过程， 可以参考前述方法实施例中 的对应过程， 在此不再赘述。
在本申请所提供的几个实施例中， 应该理解到， 所揭露的系统、 装置 和方法， 可以通过其它的方式实现。 例如， 以上所描述的装置实施例仅仅 是示意性的， 例如， 所述单元的划分， 仅仅为一种逻辑功能划分， 实际实 现时可以有另外的划分方式， 例如多个单元或组件可以结合或者可以集成 到另一个系统， 或一些特征可以忽略， 或不执行。 另外， 所显示或讨论的 相互之间的耦合或直接耦合或通信连接可以是通过一些接口、 装置或单元 的间接耦合或通信连接， 也可以是电的， 机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的， 作为单元显示的部件可以是或者也可以不是物理单元， 即可以位于一个地 方， 或者也可以分布到多个网络单元上。 可以根据实际的需要选择其中的 部分或者全部单元来实现本发明实施例方案的目的。
另外， 在本发明各个实施例中的各功能单元可以集成在一个处理单元 中， 也可以是各个单元单独物理存在， 也可以是两个或两个以上单元集成 在一个单元中。 上述集成的单元既可以采用硬件的形式实现， 也可以采用 软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销 售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解， 本发明的技术方案本质上或者说对现有技术做出贡献的部分， 或者该技术 方案的全部或部分可以以软件产品的形式体现出来， 该计算机软件产品存 储在一个存储介质中， 包括若干指令用以使得一台计算机设备 （可以是个 人计算机， 服务器， 或者网络设备等） 执行本发明各个实施例所述方法的 全部或部分步骤。 而前述的存储介质包括： U 盘、 移动硬盘、 只读存储器
(ROM, Read-Only Memory )、 随机存取存储器 (RAM, Random Access Memory )、 磁碟或者光盘等各种可以存储程序代码的介质。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围并不局 限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可 轻易想到各种等效的修改或替换， 这些修改或替换都应涵盖在本发明的保 护范围之内。 因此， 本发明的保护范围应以权利要求的保护范围为准。

Claims

权利要求
1、 一种逆变器， 其特征在于， 包括：
壳体， 具有彼此隔离且封闭的第一腔体和第二腔体；
包括磁性元件的磁性变换电路， 设置在所述第一腔体内；
包括功率管的功率变换电路， 设置在所述第二腔体内；
散热器， 设置在所述壳体底部且位于所述第一腔体和所述第二腔体外 部；
密封风道， 设置在所述第二腔体外部， 所述密封风道包括由散热型面 和底面形成的至少一个柱状管道， 所述至少一个柱状管道的两端封闭， 所 述底面由所述第二腔体的侧壁或所述散热器的基板构成， 并且所述底面包 括进风口和出风口， 以连通所述第二腔体与所述至少一个柱状管道。
2、 根据权利要求 1所述的逆变器， 其特征在于， 所述散热器包括位于 所述第一腔体外部的第一散热器， 以及位于所述第二腔体外部的第二散热 器， 所述第一散热器的散热齿片与所述第二散热器的散热齿片彼此断开。
3、 根据权利要求 2所述的逆变器， 其特征在于， 所述磁性变换电路设 置成紧密贴附所述第一散热器的基板， 所述功率变换电路设置成紧密贴附 所述第二散热器的基板。
4、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述逆 变器还包括设置在所述第二腔体内的第一风扇和 /或设置在所述壳体外部的 第二风扇。
5、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述逆 变器还包括隔热罩， 所述隔热罩由隔热材料制成， 且罩在所述磁性变换电 路上方。
6、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述第 一腔体位于所述第二腔体的上方、 左侧、 右侧或中间。
7、 根据权利要求 2或 3所述的逆变器， 其特征在于， 所述密封风道位 于所述第二腔体的外侧壁， 或所述密封风道位于所述第二散热器的基板上， 且位于所述第二散热器的左侧、 中间或右侧。
8、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述散 热型面的横截面为凸台形、 锯齿形或波纹形。
9、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述散 热型面由铝板一体成型。
10、 根据权利要求 2或 3所述的逆变器， 其特征在于， 所述散热型面 与所述第二腔体的外侧壁或所述第二散热器的基板密封连接。
11、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述 密封风道采用金属结构件密封方式和塑料件密封方式中的至少一种方式密 封。
12、 根据权利要求 1至 3中任一项所述的逆变器， 其特征在于， 所述 磁性元件包括升压电感和逆变电感， 所述功率管包括升压功率管和逆变功 率管。
13、 一种密封风道， 其特征在于， 所述密封风道设置在封闭腔体的外 部， 所述密封风道包括由散热型面和底面形成的至少一个柱状管道， 所述 至少一个柱状管道的两端封闭， 所述底面由所述封闭腔体的壁构成， 并且 所述底面包括进风口和出风口， 以连通所述腔体与所述至少一个柱状管道。
14、 根据权利要求 13所述的密封风道， 其特征在于， 所述散热型面的 横截面为凸台形、 锯齿形或波纹形。
15、 根据权利要求 13所述的密封风道， 其特征在于， 所述散热型面由 铝板一体成型。
16、 根据权利要求 13所述的密封风道， 其特征在于， 所述散热型面与 所述封闭腔体的壁密封连接。
17、 根据权利要求 13至 16中任一项所述的密封风道， 其特征在于， 所述密封风道采用金属结构件密封方式和塑料件密封方式中的至少一种方 式密封。
18、 一种散热系统， 其特征在于， 包括：
设置在封闭腔体底部且位于所述封闭腔体外部的散热器； 和
根据权利要求 13至 17中任一项所述的密封风道。
19、 根据权利要求 18所述的散热系统， 其特征在于， 所述散热系统还 包括设置在所述封闭腔体内的第一风扇和 /或设置在所述封闭腔体外部的第 二风扇。
20、 根据权利要求 18或 19所述的散热系统， 其特征在于， 所述密封 风道位于所述封闭腔体的外侧壁， 或所述密封风道位于所述封闭腔体的底 部， 且位于所述散热器的左侧、 中间或右侧。
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