WO2013054783A1 - 枚葉式化学研磨装置 - Google Patents

枚葉式化学研磨装置 Download PDF

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Publication number
WO2013054783A1
WO2013054783A1 PCT/JP2012/076096 JP2012076096W WO2013054783A1 WO 2013054783 A1 WO2013054783 A1 WO 2013054783A1 JP 2012076096 W JP2012076096 W JP 2012076096W WO 2013054783 A1 WO2013054783 A1 WO 2013054783A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
chemical polishing
processing chamber
unit
chamber
Prior art date
Application number
PCT/JP2012/076096
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
西山榮
Original Assignee
株式会社Ｎｓｃ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｎｓｃ filed Critical 株式会社Ｎｓｃ
Priority to CN201280050075.XA priority Critical patent/CN103889912B/zh
Priority to KR1020147010681A priority patent/KR101988999B1/ko
Publication of WO2013054783A1 publication Critical patent/WO2013054783A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)
PCT/JP2012/076096 2011-10-13 2012-10-09 枚葉式化学研磨装置 WO2013054783A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280050075.XA CN103889912B (zh) 2011-10-13 2012-10-09 单片式化学研磨装置
KR1020147010681A KR101988999B1 (ko) 2011-10-13 2012-10-09 매엽식 화학연마장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011225799A JP5383769B2 (ja) 2011-10-13 2011-10-13 枚葉式化学研磨装置
JP2011-225799 2011-10-13

Publications (1)

Publication Number Publication Date
WO2013054783A1 true WO2013054783A1 (ja) 2013-04-18

Family

ID=48081838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/076096 WO2013054783A1 (ja) 2011-10-13 2012-10-09 枚葉式化学研磨装置

Country Status (5)

Country Link
JP (1) JP5383769B2 (ko)
KR (1) KR101988999B1 (ko)
CN (1) CN103889912B (ko)
TW (1) TWI568540B (ko)
WO (1) WO2013054783A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP6371502B2 (ja) * 2013-07-30 2018-08-08 大日本印刷株式会社 光学フィルムの製造方法
JP6557953B2 (ja) * 2014-09-09 2019-08-14 大日本印刷株式会社 構造体及びその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01188444A (ja) * 1988-01-20 1989-07-27 Toshiba Corp ウェットエッチング方法
JPH07500877A (ja) * 1991-11-07 1995-01-26 アトテック　ユーエスエー，インコーポレイティド 制御されたスプレーエッチングのための方法と装置
JPH08307037A (ja) * 1995-04-28 1996-11-22 Yoshisato Tsubaki 基板のエッチング方法、および、基板のエッチング装置
JPH11307494A (ja) * 1998-04-17 1999-11-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000323813A (ja) * 1999-05-12 2000-11-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001059190A (ja) * 1999-08-24 2001-03-06 Tokyo Kakoki Kk 薬液処理装置
JP2007217752A (ja) * 2006-02-16 2007-08-30 Toshiba Matsushita Display Technology Co Ltd エッチング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2105491U (zh) * 1991-10-18 1992-05-27 夏长孝 玻璃前处理机
KR101387711B1 (ko) 2007-04-10 2014-04-23 에프엔에스테크 주식회사 평판디스플레이 유리기판 에칭장치
JP5449876B2 (ja) * 2008-08-28 2014-03-19 東京応化工業株式会社 搬送装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01188444A (ja) * 1988-01-20 1989-07-27 Toshiba Corp ウェットエッチング方法
JPH07500877A (ja) * 1991-11-07 1995-01-26 アトテック　ユーエスエー，インコーポレイティド 制御されたスプレーエッチングのための方法と装置
JPH08307037A (ja) * 1995-04-28 1996-11-22 Yoshisato Tsubaki 基板のエッチング方法、および、基板のエッチング装置
JPH11307494A (ja) * 1998-04-17 1999-11-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000323813A (ja) * 1999-05-12 2000-11-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001059190A (ja) * 1999-08-24 2001-03-06 Tokyo Kakoki Kk 薬液処理装置
JP2007217752A (ja) * 2006-02-16 2007-08-30 Toshiba Matsushita Display Technology Co Ltd エッチング装置

Also Published As

Publication number Publication date
TWI568540B (zh) 2017-02-01
CN103889912A (zh) 2014-06-25
JP5383769B2 (ja) 2014-01-08
JP2013086978A (ja) 2013-05-13
KR20140081828A (ko) 2014-07-01
KR101988999B1 (ko) 2019-06-13
CN103889912B (zh) 2016-01-20
TW201341118A (zh) 2013-10-16

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