WO2013038840A1 - フィルム状異方導電性接着剤 - Google Patents

フィルム状異方導電性接着剤 Download PDF

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Publication number
WO2013038840A1
WO2013038840A1 PCT/JP2012/069963 JP2012069963W WO2013038840A1 WO 2013038840 A1 WO2013038840 A1 WO 2013038840A1 JP 2012069963 W JP2012069963 W JP 2012069963W WO 2013038840 A1 WO2013038840 A1 WO 2013038840A1
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WIPO (PCT)
Prior art keywords
film
resin
epoxy resin
conductive adhesive
anisotropic conductive
Prior art date
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PCT/JP2012/069963
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English (en)
French (fr)
Japanese (ja)
Inventor
山本　正道
勝成 御影
直樹 新原
Original Assignee
住友電気工業株式会社
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Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to CN201280044095.6A priority Critical patent/CN103827236B/zh
Publication of WO2013038840A1 publication Critical patent/WO2013038840A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Definitions

  • the present invention relates to a film-like anisotropic conductive adhesive used for bonding between circuit boards such as a glass panel of a liquid crystal display (LCD) and a flexible printed wiring board (FPC), and particularly has a repair property and an adhesive strength.
  • the present invention relates to a film-like anisotropic conductive adhesive having a balance.
  • An anisotropic conductive adhesive is used.
  • an LCD glass panel 1 in which electrodes 1a, 1a,... Are juxtaposed at a predetermined interval and a flexible printed wiring board (FPC) 2 in which electrodes 2a, 2a are juxtaposed at a predetermined interval.
  • the film-like anisotropic conductive adhesive 3 When the film-like anisotropic conductive adhesive 3 is placed and heated and pressed with a pressing tool 5 (cushion material 4 may be interposed), the resin in the adhesive flows, Between the electrodes (between 1a and 2a), which are embedded in the gaps between the electrodes formed on each circuit board 1 and 2 (between 1a and 1a, between 2a and 2a), and at the same time a part of the conductive particles are opposed ) To achieve electrical connection. Therefore, the film-like anisotropic conductive adhesive is capable of flowing into the gap between the electrodes on each circuit board (between 1a and 2a) by heating and pressing, and between the connected electrodes facing each other in the joined body ( Connection reliability and adhesive strength are required to maintain an electrical connection between 1a and 2a.
  • Patent Document 1 JP-A-5-117419 discloses an epoxy resin or an imidazole-based adhesive as a film-like anisotropic conductive adhesive that enables reuse (repairability) of a circuit board having poor bonding. It has been proposed to add polyvinyl butyral to a conductive adhesive in which a latent curing agent and conductive particles are combined. Even if this film-like anisotropic conductive adhesive is a bonded body bonded by thermocompression bonding, the bonded portion is softened by heating, and can be peeled without damaging the adherend.
  • Patent Document 2 a mixture of a bisphenol type solid epoxy resin and a naphthalene type epoxy resin is used as a thermosetting resin, and the glass transition temperature of the cured product is 90 ° C. or higher. This indicates that connection reliability can be ensured while maintaining repairability.
  • Patent Document 3 contains a bisphenol A type solid epoxy resin, a naphthalene type epoxy resin, a polyimide resin, and a latent curing agent as a film-like conductive adhesive in consideration of wiping properties.
  • a film-like conductive adhesive has been proposed. It is disclosed that the cured product of the adhesive can be easily wiped off with N-methyl-2-pyrrolidone even if it remains on the substrate surface after peeling. However, since N-methyl-2-pyrrolidone as a solvent is harmful to the human body, it is required that it can be easily wiped off with a general-purpose solvent such as alcohol or ketone.
  • Patent Document 5 by using an acrylic resin having a functional group such as a carboxyl group, a hydroxyl group, and an epoxy group together with a phenoxy resin and an epoxy resin, wiping with a solvent can be easily performed. Is disclosed.
  • Patent Document 6 JP-A-9-143252 (Patent Document 6), by using bisphenol A and F copolymerization type phenoxy resin as the phenoxy resin, repair using a general-purpose solvent is possible compared to the case of using bisphenol A type phenoxy resin. It is disclosed that the time required for this is shortened.
  • Patent Document 7 describes polyvinyl butyral having a molecular weight of 100,000 to 700,000 and a hydroxyl group concentration of 20 to 40 mol%. It has been proposed that the use can prevent the deterioration of connection reliability due to moisture absorption, and can easily wipe off the cohesive force necessary for adhesion and various solvent solubility. In the examples, a mixed solvent of methyl ethyl ketone and ethanol is used as the wiping solvent.
  • Patent Document 8 a ketone solvent is used by using two types of polyvinyl butyral, a glass transition point of 100 ° C. or higher and a polyvinyl butyral of 90 ° C. or lower. It is disclosed that an anisotropic conductive film having high heat resistance that can be wiped off and can cope with further fine pitching of electrodes having a minimum pitch of 150 ⁇ m or less is disclosed.
  • the present invention has been made in view of such circumstances, and in the film-like anisotropic conductive adhesive, even if the heating temperature at the time of bonding is lowered, connection reliability, repairability, and adhesive strength are not impaired.
  • the object is to provide a film-like anisotropic conductive adhesive.
  • the film-like anisotropic conductive adhesive of the present invention comprises (A) a phenoxy resin, (B) an epoxy resin, (C) a thermoplastic elastomer, (D) a microcapsule type imidazole-based latent curing agent, and (E) a conductive material. Contains sex particles.
  • the (C) thermoplastic elastomer is preferably a polyamide thermoplastic elastomer, and the content of the (C) thermoplastic elastomer with respect to the total amount of the resin is preferably 2 to 30% by mass.
  • the (A) phenoxy resin is preferably a bisphenol A type phenoxy resin
  • the (B) epoxy resin contains a bisphenol A type epoxy resin and a naphthalene type epoxy resin, more preferably a bisphenol F type epoxy resin. preferable.
  • the film-like anisotropic conductive adhesive of the present invention can obtain a bonded body that maintains connection reliability, repairability, and adhesive strength even when the heating temperature during bonding is lowered.
  • the film-like anisotropic conductive adhesive of the present invention comprises (A) a phenoxy resin, (B) an epoxy resin, (C) a thermoplastic elastomer, (D) a microcapsule type imidazole-based latent curing agent, and (E) a conductive material. It is a film-like anisotropic conductive adhesive containing conductive particles.
  • Phenoxy resin corresponds to a high molecular weight epoxy resin and has a degree of polymerization (n) of about 100 or more.
  • the phenoxy resin used in the present invention has a weight average molecular weight measured by gel permeation chromatography (GPC) of 30,000 or more, preferably 40,000 or more, more preferably 45000 or more.
  • GPC gel permeation chromatography
  • a phenoxy resin corresponding to such a high molecular weight epoxy resin usually has a softening point of about 80 to 150 ° C. and is solid at room temperature. Since it behaves as a thermoplastic resin, it has good film formability.
  • the type of phenoxy resin used in the present invention is not particularly limited.
  • bisphenol A type, bisphenol F type, bisphenol S type phenoxy resin, copolymer type phenoxy resin of bisphenol A type and bisphenol F type, distilled product thereof, naphthalene type phenoxy resin, novolac type phenoxy resin, biphenyl type phenoxy resin, cyclo A pentadiene type phenoxy resin or the like can be used.
  • bisphenol A-type phenoxy resins are preferably used from the viewpoint of film formability and heat resistance.
  • the phenoxy resin is preferably contained in an amount of 15 to 50% by mass, more preferably 20 to 40% by mass, based on the total amount of the resin. If it is less than 15 mass%, it will become difficult to maintain the solidity as the whole composition, and it will become difficult to produce a film-like anisotropic conductive adhesive.
  • the total amount of resin means (A) phenoxy resin, (B) epoxy resin, (C) thermoplastic elastomer, (D) microcapsule type imidazole-based latent curing agent, and other resin (F) described later. When included, it means the total amount of other resins added (hereinafter the same).
  • the epoxy resin may be a polymer having an epoxy group in the molecule, and the degree of polymerization, molecular weight, type and the like are not particularly limited.
  • a liquid epoxy resin having a degree of polymerization of 1 or less and a weight average molecular weight of 700 or less and showing a liquid state at room temperature a solid epoxy resin having a degree of polymerization exceeding 1 or a crystalline epoxy resin can be used.
  • the type of epoxy resin is not particularly limited.
  • bisphenol A type, bisphenol F type, bisphenol S type epoxy resin, distilled products thereof, naphthalene type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, cyclohexane Modified epoxy resins such as a pentadiene type epoxy resin, an alkoxy-containing silane-modified epoxy resin, a fluorinated epoxy resin, and a rubber-modified epoxy resin can be used.
  • epoxy resins may be used alone or in combination with a plurality of types of epoxy resins having different molecular weights, reactivity, softening points and the like as necessary.
  • a liquid epoxy resin that is liquid at room temperature and a solid epoxy resin that is solid at room temperature are used in combination. Since the liquid epoxy resin is in a liquid state at normal temperature, the viscosity is quickly lowered with the start of heating, and the liquid epoxy resin is mixed with the curing agent, so that the reaction can proceed rapidly.
  • the solid epoxy resin has a function of abruptly decreasing the viscosity accompanying the start of heating of the liquid epoxy resin and slowing the progress of the reaction accompanying this.
  • the liquid epoxy resin it is useful for viscosity adjustment by suppressing a rapid viscosity drop due to the liquid epoxy resin.
  • the content of the epoxy resin in the total amount of the resin contained in the adhesive composition is usually about 40 to 80% by mass, preferably about 40 to 70% by mass from the viewpoint of adhesive strength.
  • the (D) microcapsule type imidazole-based latent curing agent is provided as, for example, a dispersant type curing agent dispersed in an epoxy resin
  • an epoxy resin derived from the dispersion medium of the curing agent is also used. It is included in the content of the epoxy resin.
  • thermoplastic elastomer A thermoplastic elastomer is softened by heating and exhibits fluidity, and can behave as a rubber-like elastic body at room temperature. Thermoplastic elastomers tend to have a lower melt viscosity as the temperature rises. Therefore, the fluidity of the adhesive composition decreases with the progress of the curing reaction of the epoxy resin and phenoxy resin due to heat and pressure. Thus, the gap between the counter electrodes (between 1a and 2a in FIG. 1) can be reduced.
  • thermoplastic elastomer used in the present invention examples include a styrene thermoplastic elastomer, a polyamide thermoplastic elastomer, a polyolefin thermoplastic elastomer, a polyester thermoplastic elastomer, a polyvinyl chloride thermoplastic elastomer, and a polyurethane thermoplastic elastomer. Etc. can be used. These may be used alone or in combination of two or more.
  • the molecular structure of the thermoplastic elastomer used in the present invention is not particularly limited, and may be any of a triblock copolymer type, a tetrablock copolymer type, a multiblock copolymer type, a star block copolymer type, and the like.
  • the polyamide-based thermoplastic elastomer is preferably used.
  • the polyamide-based thermoplastic elastomer is a block copolymer having nylon as a hard segment and polyester and / or polyol as a soft segment, and the kind thereof is not particularly limited.
  • Polyamide based on a polymerized fatty acid is used as a hard segment, and a polyether ester and A polyamide elastomer having a polyester as a soft segment is preferably used. Since such a polyamide elastomer is thermoplastic, it can melt and flow at an early stage in heating of the film-like anisotropic conductive adhesive, so even if the heating temperature is less than 200 ° C., it flows into the gap between the electrodes on the same substrate.
  • thermoplastic elastomer is preferably contained in an amount of 2 to 30% by mass, more preferably 2 to 20% by mass, based on the total amount of the resin in the adhesive composition. If the content of the thermoplastic elastomer is too high, the heat resistance of the joint and thus the connection reliability will be reduced. If the content is too low, it will be difficult to increase the adhesive strength and easily wipe off. .
  • Microcapsule-type imidazole-type latent curing agent has an imidazole derivative as a core and the core is covered with a film, and acts as a curing agent for phenoxy resin and epoxy resin. To do.
  • the core imidazole derivative is usually a solid powder at normal temperature, and an adduct of an epoxy compound and an imidazole compound or an imidazole compound carboxylate is pulverized to an appropriate particle size.
  • imidazole derivatives include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, Examples thereof include 1-benzyl-2-ethyl-5-methylimidazole and 2-phenyl-3-methyl-5-hydroxymethylimidazole.
  • the epoxy compound include glycidyl ether type epoxy resins such as bisphenol A, bisphenol F, and brominated bisphenol A, dimer acid diglycidyl ester, and phthalic acid diglycidyl ester.
  • a film having a urethane bond is usually preferably used because of its good compatibility with the epoxy resin.
  • a film obtained by polymerizing a compound having an isocyanate group with an OH group on the powder surface, which is a main body of the curing agent, is preferably used.
  • isocyanate compound examples include tetramethylene diisocyanate, hexamethylene diisocyanate, tolylene diisocyanate, xylene diisocyanate, and diphenylmethane diisocyanate.
  • a film is formed by polymerizing these isocyanate compounds on the surface of the imidazole compound at room temperature.
  • the microcapsule type imidazole-type latent curing agent as described above is usually preferably having an average particle diameter of 1 to 10 ⁇ m.
  • the measurement of the average particle diameter is performed by measuring the microcapsule particles taken out as a solid content with a xylene organic solvent using a laser diffraction measurement apparatus RODOS SR type (HEROS & RODOS manufactured by SYMPATEC), and calculating the volume integrated average particle diameter. The average particle size was taken.
  • microcapsule type imidazole-based latent curing agent having the above-described configuration may be used in a state of being dispersed in a liquid epoxy resin or the like instead of the microcapsule particles alone.
  • the microcapsule type imidazole-based latent curing agent is an imidazole-based curing agent relative to the total amount of the resin (for example, when blended in a state dispersed in a resin dispersion medium such as the above liquid epoxy, the amount of the resin dispersion medium is not counted. ) Content is preferably 8 to 20% by mass, and is appropriately selected depending on the type and amount of epoxy resin, phenoxy resin, and thermoplastic elastomer used.
  • the conductive particles may be any conductive particles, such as solder particles, nickel particles, gold-plated nickel powder, copper powder, silver powder, nano-sized metal crystals, and metal surfaces.
  • Metal particles such as particles coated with other metals; resin particles such as styrene resin, urethane resin, melamine resin, epoxy resin, acrylic resin, phenol resin, styrene-butadiene resin, gold, nickel, silver, copper, solder, etc. Particles coated with a conductive thin film can be used.
  • the particle size of such conductive particles is not particularly limited, but usually the average particle size is 0.1 to 5 ⁇ m.
  • particles having magnetism are preferably used from the viewpoint that the conductive particles are easily oriented in a predetermined direction (in the present invention, the film thickness direction). Further, from the viewpoint of easily orienting the conductive particles in the thickness direction, conductive particles having an aspect ratio of 5 or more are preferably used. Specifically, a shape in which fine metal particles are connected in a straight chain, or acicular particles are preferably used. Such conductive particles can be oriented in the thickness direction by the action of a magnetic field during film formation.
  • the content of conductive particles varies depending on the application, but the anisotropic conductive adhesive used for joining circuit boards is not sufficient for conducting gaps between adjacent electrodes juxtaposed on the same surface. In addition, it is an amount capable of conducting between the opposing electrodes. Specifically, the amount is preferably 0.01 to 10% by volume, more preferably 0.8% with respect to the total volume of the conductive adhesive. 01 to 1% by volume.
  • a resin other than phenoxy resin and epoxy resin for example, polyimide resin, polyamideimide resin, polyesterimide resin, Other thermosetting resins such as phenol resins and polyurethane resins, and thermoplastic resins such as acrylic resins, fluorine resins, polyester resins, and silicone resins may be appropriately contained as necessary.
  • the film-like anisotropic conductive adhesive of the present invention is obtained by forming a composition for an adhesive containing the above components into a film.
  • the manufacturing method of a film-form anisotropic conductive adhesive is not specifically limited, Usually, it manufactures with the following methods.
  • an adhesive solution examples include toluene, xylene, benzene, ethyl acetate, butyl acetate, aromatic hydrocarbons and the like.
  • the film-like anisotropic conductive adhesive uses acicular particles (for example, conductive particles having an aspect ratio of 5 or more) as the conductive particles, the conductive particles can be oriented in the thickness direction during drying.
  • a solvent having a high volatilization rate is preferably used.
  • ester systems such as propylene glycol monomethyl ether acetate (PGMEA) and cellosolve acetate are preferably used.
  • the solid content of the adhesive solution is not particularly limited, but is preferably 40 to 70% by mass.
  • the prepared adhesive solution is coated on a base film, cast, and dried by heating to form a film.
  • the drying temperature for producing the film-like anisotropic conductive adhesive varies depending on the organic solvent used, but is usually about 60 to 80 ° C.
  • the film-like anisotropic conductive adhesive contains magnetic particles having an aspect ratio of 5 or more as the component (E), the conductive particles are passed through a magnetic field before or simultaneously with heating and drying. It is preferable to align in the thickness direction.
  • the thickness of the film-like anisotropic conductive adhesive is not particularly limited, but is usually 10 to 50 ⁇ m, preferably 15 to 40 ⁇ m.
  • two circuit boards in which a plurality of electrodes are juxtaposed face each other so that the electrodes face each other, and the film-like anisotropic of the present invention is interposed between the circuit boards.
  • a conductive adhesive is interposed and heated and pressurized under the following conditions.
  • the heating and pressing method is not particularly limited, but is usually performed using a pressing tool such as a press machine or a pressing member heated to a predetermined temperature.
  • a cushion material may be appropriately interposed between the circuit board serving as the adherend and the pressing tool.
  • the heating temperature is 150 to 220 ° C, preferably 170 to 200 ° C, more preferably 180 to 200 ° C.
  • the melting point and softening point of the thermoplastic elastomer are lower than those of polyvinyl butyral and polyimide resin that have been blended to ensure easy wiping, so it is necessary and sufficient even at heating temperatures of less than 200 ° C. Can exhibit excellent fluidity.
  • the heating temperature is a temperature that the film-like anisotropic conductive adhesive should reach.
  • a thin thermocouple is embedded in the film-like anisotropic conductive adhesive, and the glass panel 1 and the flexible print. A method of actually measuring by sandwiching between the wiring boards 2 is used.
  • the pressurizing pressure is 1 to 7 MPa, preferably 1 to 5 MPa.
  • the pressing time is appropriately determined depending on the heating temperature and the composition of the adhesive resin composition, but is preferably as short as possible from the viewpoint of productivity. Usually, it is less than 20 seconds, preferably 15 seconds or less.
  • the film-like anisotropic conductive adhesive of the present invention is softened and melted by heating and pressing and flows into a gap between electrodes on the same plane, and the distance between electrodes to be bonded is reduced to 1 ⁇ m or less and cured.
  • thermoplastic elastomers have a low melting point, so they soften and melt from the beginning of heating, contribute to narrowing the distance between electrodes by pressurization, and become liquid at high temperatures, resulting in an increase in viscosity due to the progress of the curing reaction. Even in this case, it can contribute to the flow of the resin and the reduction of the distance between the electrodes, which in turn helps to improve the adhesive strength.
  • the obtained joined body has high adhesive strength, good connectivity, and can maintain connection reliability even after being stored at high temperature and high humidity.
  • the heating and pressurization is less than 200 ° C. and about 180 ° C.
  • the thermoplastic elastomer melts and flows, it is possible to prevent the occurrence of poor bonding.
  • the connection reliability is high.
  • the adhesive remaining on the adherend after heating and peeling off the cured product can be easily wiped off with a general-purpose solvent such as a ketone or alcohol.
  • phenoxy resin bisphenol A type phenoxy resin (Epicoat 1256 manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 50,000)
  • epoxy resin bisphenol A type epoxy resin (Epicoat 1010 manufactured by Japan Epoxy Resin Co., Ltd.), weight average Molecular weight 5500) and naphthalene type epoxy resin (Epicron 4032D manufactured by Dainippon Ink and Chemicals, weight average molecular weight 270), polyamide-based thermoplastic elastomer (TPAE826 manufactured by Fuji Kasei) as a thermoplastic elastomer, and Sekisui Chemical Co., Ltd.
  • TPAE826 polyamide-based thermoplastic elastomer manufactured by Fuji Kasei
  • BM-1 glass transition point 67 ° C.
  • nitrile rubber Nipol 1072J from ZEON Corporation
  • microcapsule type imidazole-based curing agent manufactured by Asahi Kasei Epoxy Co., Ltd. Novacure HX3941
  • the "in proportions shown in Table 1 was dissolved in a mixed solvent of propylene glycol monomethyl ether acetate and isophorone, to obtain an adhesive solution is a solid content of 50 mass%.
  • the “Novacure HX3941” is a dispersion of a microcapsule-type imidazole curing agent in a liquid epoxy resin.
  • the content of the microcapsule-type imidazole curing agent is 35% by mass, and the epoxy resin (dispersion medium) The content is 65 mass% (bisphenol A type epoxy resin 13 mass% and bisphenol F type epoxy resin 52 mass%).
  • linear nickel particles were uniformly dispersed so as to be 0.05% by volume with respect to the components excluding the solvent, thereby preparing a conductive adhesive composition.
  • the prepared conductive adhesive composition is applied onto a release-treated PET film, and dried and solidified in a magnetic field with a magnetic flux density of 100 mT at 70 ° C. for 40 minutes, whereby linear Ni particles in the film thickness direction.
  • a film-like conductive adhesive having a thickness of 35 ⁇ m was prepared.
  • a flexible printed wiring board in which 50 gold-plated copper electrodes (width 100 ⁇ m, height 18 ⁇ m) are arranged at intervals of 100 ⁇ m and gold-plated copper electrodes (width 100 ⁇ m, height 35 ⁇ m) are 50 at intervals of 100 ⁇ m.
  • the produced film-like anisotropic conductive adhesive is sandwiched between the individually arranged glass epoxy substrates, and heated and heated at 200 ° C., and then pressed and bonded at a pressure of 2 MPa for 15 seconds to form a flexible printed wiring board and glass.
  • a joined body 1 with an epoxy substrate was obtained.
  • a joined body 2 was obtained in the same manner except that the heating temperature was changed to 180 ° C.
  • No. 1-3 is a case containing a thermoplastic elastomer.
  • the adhesive strength is 8.0 N / cm or more, and it can be seen that there is no problem even if heating and pressurization for bonding is performed at 180 ° C.
  • the insulation resistance was 60 m ⁇ or less even after the initial and high temperature / high humidity storage, and there was no problem in connection reliability. Furthermore, the repairability was satisfied.
  • the connection reliability was the same as that when the thermoplastic elastomer was contained, but the adhesive strength was low and the repairability was not satisfactory. Furthermore, it can be seen that when the heating temperature of the joining operation is lowered to 180 ° C., the adhesive strength is significantly reduced to 5.8 N / cm, and the joining operation at less than 200 ° C. cannot be performed.
  • the repair property and the connection reliability were comparable as compared with the case where the thermoplastic elastomer was used.
  • the bonding strength of the bonded body when bonded at 200 ° C. is slightly inferior (less than 8.0 N / cm). In the bonded body bonded at 180 ° C., the bonding strength further decreases, so the heating temperature during bonding It can be seen that the temperature cannot be lowered below 200 ° C.
  • connection reliability is poor, and particularly the connection reliability is lowered (increase in connection resistance) in the high temperature and high humidity specification.
  • the film-like anisotropic conductive adhesive of the present invention can ensure repairability without impairing connection reliability and adhesive strength, and can also lower the heating temperature at the time of joining. It is economical because it makes it easier to save energy on site and reuse circuit boards with poor bonding.

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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Insulators (AREA)
PCT/JP2012/069963 2011-09-12 2012-08-06 フィルム状異方導電性接着剤 WO2013038840A1 (ja)

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JP2015147832A (ja) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体
WO2015152164A1 (ja) * 2014-03-31 2015-10-08 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート

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JP5806760B1 (ja) * 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
CN104762050B (zh) * 2015-04-02 2017-08-11 3M创新有限公司 压敏粘合剂组合物、压敏胶带及其制备方法、载体、组件
JP6969165B2 (ja) * 2017-06-02 2021-11-24 昭和電工マテリアルズ株式会社 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体
CN109666413B (zh) * 2018-12-17 2020-09-08 深圳市华星光电技术有限公司 一种各向异性导电胶黏剂及其导电膜
CN110903797A (zh) * 2019-12-13 2020-03-24 深圳市百事达卓越科技股份有限公司 无溶剂无异味高性能的环氧树脂粘结组合物及使用方法
KR20230038196A (ko) * 2020-07-13 2023-03-17 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 접착용 수지 조성물 및 접착 필름
JPWO2022209116A1 (zh) * 2021-03-31 2022-10-06
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JP2004277573A (ja) * 2003-03-17 2004-10-07 Sony Chem Corp 接着剤及び電気装置
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WO2015152164A1 (ja) * 2014-03-31 2015-10-08 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート

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