WO2013035732A1 - Cigs膜の製法およびそれを用いるcigs太陽電池の製法 - Google Patents
Cigs膜の製法およびそれを用いるcigs太陽電池の製法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 86
- 239000011669 selenium Substances 0.000 claims abstract description 83
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229910052738 indium Inorganic materials 0.000 claims abstract description 40
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 239000013078 crystal Substances 0.000 claims abstract description 28
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000031700 light absorption Effects 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 15
- 239000007791 liquid phase Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 6
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- 239000007787 solid Substances 0.000 claims description 3
- 229910000058 selane Inorganic materials 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 25
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- 239000005361 soda-lime glass Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
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- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- 238000000224 chemical solution deposition Methods 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910003363 ZnMgO Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
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- 239000011888 foil Substances 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a method for producing a CIGS film used as a light absorption layer of a CIGS solar cell having good characteristics by causing uniform copper diffusion and uniform crystal grains, and a method for producing a CIGS solar cell using the same.
- Thin film solar cells represented by amorphous silicon solar cells and compound thin film solar cells can greatly reduce material costs and manufacturing costs compared to conventional crystalline silicon solar cells. For this reason, in recent years, these research and development have been advanced rapidly. Especially, it is a compound thin-film solar cell having elements of Group I, III, and VI as constituents, and the light absorption layer is made of copper (Cu), indium (In), gallium (Ga), selenium (Se) alloy.
- the CIGS solar cell made of is attracting particular attention among thin-film solar cells because it does not use any silicon and has excellent solar conversion efficiency (hereinafter referred to as “conversion efficiency”).
- the light absorption layer in such a CIGS solar cell can be manufactured by a selenization method, a non-vacuum process (nanoparticle) method, a vacuum deposition method, or the like.
- the vacuum evaporation method is a manufacturing method in which Cu, In, Ga, and Se are heated by different evaporation sources to form a film by evaporation, and the film can be formed while controlling the discharge amount of each element. It has the advantage that it can be controlled.
- the highest conversion efficiency is obtained by a method called a three-stage method which is a kind of multi-source deposition method.
- the process is divided into three stages. First, in the first stage, In, Ga, and Se are vapor-deposited on the substrate, and (In, Ga) 2 A Se 3 film is formed. In the next second stage, the substrate temperature is raised to 550 ° C., and Cu and Se are further deposited to form a CIGS film having an excessive Cu composition. In the CIGS film at this stage, two phases of liquid phase Cu (2-x) Se and solid phase CIGS coexist, and the crystal suddenly increases in size due to Cu (2-x) Se.
- the CIGS thin film obtained by the three-stage method has a large crystal grain size, and has a crystallographically high-quality thin film crystal structure as compared with that obtained by the conventional vapor deposition method (for example, Patent Documents). 1.).
- the present invention has been made in view of such circumstances, and includes a CIGS film manufacturing method capable of manufacturing a CIGS film excellent in conversion efficiency at low cost with high reproducibility even when a large-area element is manufactured, and the same.
- the purpose is to provide a method for producing a CIGS solar cell.
- the CIGS film production method of the present invention is a CIGS film production method used as a light absorption layer of a CIGS solar cell, comprising a layer (A) containing indium, gallium and selenium, copper and A layering step of laminating a layer (B) containing selenium on a substrate in this order in a solid state, and heating the layered body in which the layer (A) and the layer (B) are layered, the layer (B) And a heating step of obtaining a CIGS film by diffusing copper in the layer (B) into the layer (A) to cause crystal growth by melting in a liquid phase state.
- the second gist is a CIGS solar cell production method that uses the CIGS film production method as the first gist.
- the present inventors have focused on CIGS solar cells among compound semiconductor solar cells and repeated research. As a result, instead of obtaining the CIGS film as the light absorption layer of the CIGS solar cell by the conventional three-step method shown in FIG. 8B, first, as shown in FIG.
- a layer (A) containing In, Ga and Se and a layer (B) containing Cu and Se are laminated together in this order on the substrate in this order, and then the two layers (A) , (B) is heated to melt the compound of Cu and Se in the layer (B) to form a liquid phase, whereby the layer (B) contains the layer (B) in the layer (B). It is found that when Cu is diffused and crystal is grown to obtain a CIGS film, the crystal grains in the film become uniform large grains and excessive Cu (2-x) Se is not taken into the film. The present invention has been reached.
- the crystal grains of the CIGS film as a light absorption layer are large and uniform, so that the conversion efficiency increases and each element A CIGS solar cell in which variations in the conversion efficiency are unlikely to occur can be obtained.
- excess Cu (2-x) Se is not formed in the CIGS film, the battery characteristics are not adversely affected. Therefore, a highly efficient CIGS solar cell can be obtained with good reproducibility.
- solid phase refers to a phase that is in a solid state at that temperature
- liquid phase refers to a phase that is in a liquid state at that temperature
- the layer (A) and the layer (B) are laminated on the substrate means not only the case where these are laminated directly on the substrate, but also the case where these are laminated on the substrate via other layers. Is included.
- a layer (A) containing In, Ga and Se and a layer (B) containing Cu and Se are laminated in this order on the substrate. It has become. For this reason, the layer (B) can be laminated with a uniform thickness on the layer (A) which is also in the solid phase in the solid phase. At this stage, mutual diffusion of each layer is suppressed.
- the layered body in which the two layers (A) and (B) are stacked is heated to melt the Cu and Se compound in the layer (B) to be in a liquid phase state. Then, Cu in the layer (B) diffuses rapidly.
- the layer (B) is formed on the layer (A) with a uniform thickness in the previous process, Cu in the layer (B) is uniformly diffused in the layer (A). As a result, large and uniform crystal grains are formed. Moreover, since the layer (B) is once used as a solid phase, Cu (2-x) Se can be prevented from being excessively taken into the CIGS film. Therefore, the CIGS solar cell using the CIGS film obtained by this manufacturing method has high conversion efficiency and hardly causes variations in conversion efficiency for each element. In addition, since excess Cu (2-x) Se is not formed in the film, the battery characteristics are not adversely affected.
- the above-described lamination step is performed at a temperature in the range of 100 to 250 ° C., mutual diffusion at the interface between the layer (A) and the layer (B) can be suppressed to a minimum.
- By heating the laminate larger and more uniform crystal grains can be formed.
- the heating step is performed at a temperature of 520 ° C. or higher, most of the Cu and Se compounds in the layer (B) melt, so that the Cu in the layer (B) is more contained in the layer (A). It can be diffused rapidly and uniformly, and larger and more uniform crystal grains can be formed.
- the liquid phase of the layer (B) rapidly proceeds, and the layer (A) Further, Cu in the layer (B) diffuses more rapidly, so that larger and more uniform crystals are formed in the film.
- the heating step when the Se vapor or hydrogen selenide (H 2 Se) is supplied so that the Se partial pressure on the CIGS film surface is maintained higher than the internal Se partial pressure, the heating step The release of Se from the CIGS film can be suppressed, and the composition of the CIGS film can be made more preferable.
- H 2 Se hydrogen selenide
- the CIGS film at the end of the heating step is obtained by the heating step while satisfying the molar ratio of 0.95 ⁇ Cu / (In + Ga) ⁇ 1.30 and maintaining the temperature during the heating step.
- the CIGS film satisfies the molar ratio of 0.70 ⁇ Cu / (In + Ga) ⁇ 0.95 by further depositing In, Ga, and Se on the CIGS film, first, the heating step
- the composition of the CIGS film at the end satisfies the molar ratio of 0.95 ⁇ Cu / (In + Ga) ⁇ 1.30, the Cu component is sufficiently present even at the interface between the layer (A) and the layer (B).
- the CIGS solar cell which has the process of providing a back surface electrode layer on a board
- the CIGS film manufacturing method as the first gist is used as the step of providing, the obtained CIGS solar cell can be made highly reproducible with little variation in conversion efficiency for each element, The conversion efficiency can be sufficiently increased.
- FIG. 1 is an explanatory diagram of a CIGS film 3 obtained according to an embodiment of the present invention.
- the CIGS film 3 is used for a light absorption layer of a CIGS solar cell.
- a back electrode layer 2 made of molybdenum (Mo) is provided on a substrate 1 made of soda-lime glass (SLG).
- the CIGS film 3 is laminated on the back electrode layer 2.
- the substrate 1 is used as a support substrate, and in addition to SLG, a flexible metal foil or the like can be used as a substrate.
- a material resistant to a temperature of 520 ° C. or higher so that it can withstand the heating in the subsequent heating step.
- the back electrode layer 2 is formed by a sputtering method.
- tungsten, chromium, titanium, or the like can be used, and it can be formed not only in a single layer but also in multiple layers.
- the thickness is preferably in the range of 100 nm to 1000 nm.
- the CIGS film 3 is a compound semiconductor containing four elements of Cu, In, Ga, and Se, and has a thickness of 2.0 ⁇ m.
- the composition ratio of Cu, In and Ga is 22.1: 21.2: 7.5, and Cu / (In + Ga) ⁇ 0.77 (molar ratio).
- Such a CIGS film 3 can be manufactured as follows. First, a substrate 1 provided with a back electrode layer 2 is prepared. As shown in FIG. 2, from the side where the back electrode layer 2 is formed, with the holding temperature of the substrate 1 being 200 ° C., In, Ga , Se is vapor-deposited to form a layer (A) 4 on the back electrode layer 2.
- the laminated body 6 is heated, the holding temperature of the substrate 1 is set to 550 ° C., and the heated and sublimated Se vapor is supplied for 15 minutes, whereby the compound of Cu and Se in the layer (B) is obtained.
- the layer (A) and the layer (B) are integrated into a CIGS film 3 '(see FIG. 4).
- the composition ratio of Cu, In, and Ga in the CIGS film 3 ′ is 25.1: 18.5: 6.4, and Cu / (In + Ga) ⁇ 1.00 (molar ratio). .
- the temperature increase from the above-described lamination process (temperature 200 ° C.) to the heating process (temperature 550 ° C.) is performed at 10 ° C./second. That is, if the rate of temperature rise is too slow, the liquid phase of the layer (B) proceeds slowly, Cu in the layer (B) cannot rapidly diffuse into the layer (A), and crystals are formed. Since there is a tendency that the particles do not become large, the above temperature rise is preferably performed at 10 ° C./second or more.
- substrate 1 is hold
- the CIGS film 3 (see FIG. 1) can be obtained by further depositing In, Ga, and Se in a state where the vaporized Se vapor is supplied. Thereby, the whole CIGS film 3 can be made slightly Cu-deficient.
- a profile of the holding temperature of the substrate 1 in the above embodiment is shown in FIG.
- the layer (A) 4 containing In, Ga and Se on the substrate 1 and the layer (B) containing Cu and Se. 5 are laminated in this order, and then the laminated body 6 in which the layer (A) 4 and the layer (B) 5 are laminated is heated to hold the substrate 1 at a holding temperature of 550 ° C. for 15 minutes.
- the compound of Cu and Se in the layer (B) 5 is melted to form a liquid phase, and the Cu in the layer (B) 5 is rapidly diffused into the layer (A) 4. .
- Cu contained in the layer (B) 5 can be uniformly diffused into the layer (A) 4, and a CIGS film 3 ′ in which large and uniform crystal grains are formed can be obtained.
- Cu contained in the layer (B) 5 is once used as a solid phase (layer (B) 5), it is possible to suppress excessive Cu (2-x) Se incorporation into the film.
- the Se vapor heated and sublimated is supplied during the heating process, it is possible to suppress the release of Se out of the system due to heating, and the composition ratio of Cu, In, and Ga in the CIGS film 3 ′ is as desired. Can be adjusted.
- the CIGS film 3 ′ is further vapor-deposited with In, Ga, and Se at the same temperature (550 ° C. or higher) as in the heating step, the CIGS film 3 is slightly formed.
- a more efficient light absorption layer can be obtained.
- the formation of the layer (A) 4 and the layer (B) 5 is performed in a state where the holding temperature of the substrate 1 is set to 200 ° C.
- the temperature can be set to an arbitrary temperature.
- the formation of the layer (A) 4 and the layer (B) 5 is preferably carried out in a state where the holding temperature of the substrate 1 is set to a temperature in the range of 100 to 250 ° C., respectively. It is preferable to carry out at a temperature in the range. If the temperature is too high, the layer (B) 5 cannot be laminated on the layer (A) 4 as a solid phase. Conversely, if the temperature is too low, formation of each layer by vapor deposition tends to be difficult. It is.
- the laminate 6 in which the layers (A) 4 and (B) 5 are laminated is heated for 15 minutes in a state where the holding temperature of the substrate 1 is 550 ° C.
- the heating temperature is preferably 520 ° C. or higher.
- the heating time is preferably 1 to 30 minutes, more preferably 2 to 15 minutes. This is because Cu contained in the layer (B) 5 diffuses very rapidly into the layer (A) 4 but requires a certain amount of time for sufficient crystal growth to occur.
- In, Ga, and Se are further deposited on the CIGS film 3 ′ after the heating step in a state where the substrate 1 holding temperature is 550 ° C., but the CIGS film 3
- a Cu or Se-based layer that has not been incorporated into the film is not exposed on the surface layer of ′, it is not necessary to further deposit In, Ga, and Se.
- In, Ga, and Se are further deposited on the CIGS film 3 ′ after the heating step, a Cu—Se phase is not formed in the film, and sufficient crystal growth can be achieved. Since it is easy to make Cu slightly short as the whole film
- finish of a heating process is 25.1: 18.5: 6.4, and Cu / (In + Ga) ⁇ 1.
- the composition ratio is not limited to this and can be any composition ratio.
- the composition ratio of Cu, In, and Ga in the CIGS film 3 ′ is preferably in a range that satisfies the formula of 0.95 ⁇ Cu / (In + Ga) ⁇ 1.30 (molar ratio).
- Cu / (In + Ga) is too low, there is a tendency that the Cu component is insufficient and sufficient crystal growth does not occur.
- Cu (2-x) is contained in the CIGS film 3 ′. This is because Se is taken in excessively and the device characteristics tend to be deteriorated when the CIGS film 3 'is used for the device.
- the composition ratio of Cu, In, and Ga in the CIGS film 3 is 22.1: 21.2: 7.5, and Cu / (In + Ga) ⁇ 0.77 (molar ratio).
- the present invention is not limited to this, and an arbitrary composition ratio can be obtained.
- the expression 0.70 ⁇ Cu / (In + Ga) ⁇ 0.95 (molar ratio) is satisfied, it is indicated that Cu (2-x) Se is excessively taken into the CIGS film 3. This is preferable in that it can be further prevented and the entire film can be slightly deficient in Cu.
- the ratio of Ga and In which are homologous elements is in the range of 0.10 ⁇ Ga / (In + Ga) ⁇ 0.40.
- membrane 3 is formed in 2.0 micrometers, it can be set not only to this but arbitrary thickness.
- the thickness of the CIGS film 3 is preferably in the range of 1.0 to 3.0 ⁇ m, and more preferably in the range of 1.5 to 2.5 ⁇ m. If the thickness is too thin, the amount of light absorption when used as a light-absorbing layer will decrease, and the performance of the device will tend to be reduced. Conversely, if it is too thick, the time taken to form the film will increase, producing This is because the tendency to be inferior is seen.
- Se vapor is supplied during the heating process and in the subsequent process of depositing In, Ga, and Se.
- H 2 Se is supplied. Also good. In this case, the same effect as that of supplying Se vapor can be obtained. Further, when there is little release of Se out of the CIGS film 3 ′ and CIGS film 3 into the system, it is not necessary to supply them.
- a buffer layer 7, a buffer layer 8, and a transparent conductive layer 9 are laminated in this order on the CIGS film 3.
- a buffer layer 7 (thickness 50 nm) made of cadmium sulfide (CdS) is formed on the obtained CIGS film 3 by a chemical bath deposition method (CBD method), and further by a sputtering method, A buffer layer 8 (thickness 50 nm) made of ZnO is formed.
- These buffer layers (7, 8) are preferably high-resistance n-type semiconductors so that they can be pn-junction with the CIGS film 3.
- a single layer such as ZnMgO, Zn (O, S), etc. Can be used.
- the thickness of the buffer layers (7, 8) is preferably 30 to 200 nm.
- the thickness is preferably in the range of 30 to 200 nm.
- the buffer layer 7 can be formed by the CBD method, which is a solution method
- the buffer layer 8 can be formed by a sputtering method, which is a vacuum film forming method.
- the pn junction with the CIGS film 3 can be improved.
- a plurality of layers are not necessarily provided. It is not necessary to provide a layer.
- a transparent conductive layer 9 (thickness 200 nm) made of indium tin oxide (ITO) is formed on the buffer layer 8 by sputtering.
- the transparent conductive layer 9 is preferably made of a material having high transmittance.
- ITO indium zinc oxide
- Al zinc aluminum oxide
- the thickness is preferably 100 nm to 300 nm.
- the CIGS solar since the CIGS film 3 is used as the light absorption layer, the CIGS solar has high conversion efficiency and hardly causes variation in conversion efficiency for each element. Battery Q can be obtained.
- excess Cu (2-x) Se is not formed in the CIGS film 3 as the light absorption layer, the battery characteristics are not deteriorated and the efficiency is improved.
- the efficiency can be further increased.
- the solar cell Q includes the substrate 1, the back electrode layer 2, the CIGS film 3, the buffer layer 7, the buffer layer 8, and the transparent conductive layer 9. If necessary, the transparent conductive layer A metal electrode may be formed on 9.
- Example 1 A CIGS solar cell was manufactured in the same manner as in the above embodiment. That is, SLG (size 30 ⁇ 30 mm, thickness 0.55 mm) was prepared as the substrate 1, and Mo (thickness 500 nm) was laminated thereon to form the back electrode layer 2. Then, In, Ga, and Se were vapor-deposited in a state where the substrate 1 holding temperature was 200 ° C. to form a layer (A). Subsequently, Cu and Se were vapor-deposited on the layer (A) while the substrate 1 holding temperature was kept at 200 ° C., and the layer (B) was laminated to form a laminate 6.
- the laminate 6 was heated while supplying a small amount of Se vapor, and the substrate 1 holding temperature was held at 550 ° C. for 15 minutes, and crystal growth was performed to obtain a CIGS film 3 ′. Further, while supplying a small amount of Se gas to this CIGS film 3 ′, In, Ga, and Se are vapor-deposited while maintaining the substrate 1 holding temperature at 550 ° C., the target CIGS film 3 (thickness 2 0.0 ⁇ m) was obtained. A CIGS solar cell using this CIGS film 3 was designated as Example 1. In addition, the schematic for obtaining Example 1 goods is shown in FIG. 8 (a).
- Example 1 Similarly to Example 1, a substrate 1 on which a back electrode layer 2 was formed was prepared. Then, Cu, In, Ga, and Se were vapor-deposited in a state where the holding temperature of the substrate 1 was set to 200 ° C., and a layer made of Cu, In, Ga, and Se that slightly increased Cu was formed. This was heated while supplying a small amount of Se gas, held for 15 minutes at a substrate 1 holding temperature of 550 ° C., and crystal growth was performed to obtain a CIGS film ′ (not shown).
- the target CIGS film (thickness 2.0 ⁇ m) is deposited by depositing In, Ga, and Se while maintaining the substrate 1 holding temperature at 550 ° C. )
- the CIGS solar cell using this CIGS film was designated as one comparative example.
- a schematic diagram for obtaining one product of Comparative Example is shown in FIG.
- Example 2 Similarly to Example 1, a substrate 1 on which a back electrode layer 2 was formed was prepared. Then, In, Ga, and Se were vapor-deposited in a state where the holding temperature of the substrate 1 was 350 ° C., and a layer made of In, Ga, and Se was formed. Next, in a state where the holding temperature of the substrate 1 is heated to 550 ° C., Cu and Se are deposited on this layer, and crystal growth is performed to obtain a CIGS film ′′ (not shown). .
- composition ratio of Cu / (In + Ga) The contents of Cu, In, and Ga in the CIGS films used in each of the examples and comparative examples were measured using an energy dispersive X-ray fluorescence apparatus (EX-250, Horiba Seisakusho). Based on the above, the composition ratio of Cu / (In + Ga) was calculated.
- the product of Example 1 shows a high average conversion efficiency of 14.7%, and the variation in the conversion efficiency between the elements is only 2.5, which is the production method of the present invention.
- the product of Comparative Example 1 had a relatively small variation in conversion efficiency of 3.0, the average conversion efficiency was as low as 9.5%.
- the two comparative examples had a relatively high average conversion efficiency of 13.6%, but had a large conversion efficiency variation of 3.6.
- the method for producing a CIGS film of the present invention is suitable for producing a CIGS film used as a light absorption layer of a CIGS solar cell with good characteristics and good reproducibility. Moreover, the manufacturing method of the CIGS solar cell of this invention is suitable for manufacturing a solar cell with high conversion efficiency with sufficient reproducibility.
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Abstract
Description
上記実施の形態と同様にして、CIGS太陽電池を製造した。すなわち、基板1として、SLG(大きさ30×30mm、厚み0.55mm)を用意し、この上に、Mo(厚み500nm)を積層し、裏面電極層2を形成した。そして、基板1保持温度を200℃にした状態で、In、Ga、Seを蒸着し、層(A)を形成した。つづいて、基板1保持温度を200℃に保ったままの状態で、上記層(A)上にCu、Seを蒸着し、層(B)を積層し、積層体6を形成した。この積層体6を、微量のSe蒸気を供給しつつ加熱し、基板1保持温度が550℃の状態を15分間保持し、結晶成長を行いCIGS膜3’を得た。さらに、このCIGS膜3’に、微量のSeガスを供給しつつ、基板1保持温度を550℃に保った状態で、In、Ga、Seを蒸着することで、目的のCIGS膜3(厚み2.0μm)を得た。このCIGS膜3を用いたCIGS太陽電池を実施例1品とした。なお、実施例1品を得るための概略図を〔図8(a)〕に示す。
実施例1と同様に、裏面電極層2が形成された基板1を準備した。そして、基板1の保持温度を200℃にした状態で、Cu、In、Ga、Seを蒸着し、わずかにCu過剰となるCu、In、Ga、Seからなる層を形成した。これを微量のSeガスを供給しつつ加熱し、基板1保持温度が550℃の状態で15分間保持し、結晶成長を行いCIGS膜’(図示せず)を得た。さらに、このCIGS膜’に、微量のSe蒸気を供給しつつ、基板1保持温度を550℃に保った状態で、In、Ga、Seを蒸着することで、目的のCIGS膜(厚み2.0μm)を得た。このCIGS膜を用いたCIGS太陽電池を比較例1品とした。なお、比較例1品を得るための概略図を〔図9〕に示す。
実施例1と同様に、裏面電極層2が形成された基板1を準備した。そして、基板1の保持温度を350℃にした状態で、In、Ga、Seを蒸着し、In、Ga、Seからなる層を形成した。つぎに、基板1の保持温度が550℃の状態となるよう加熱した状態で、この層の上に、Cu、Seを蒸着させ、結晶成長を行いCIGS膜''(図示せず)を得た。さらに、このCIGS膜''に、微量のSe蒸気を供給しつつ、基板1保持温度を550℃に保った状態で、In、Ga、Seを蒸着することで、目的のCIGS膜(厚み2.0μm)を得た。このCIGS膜を用いたCIGS太陽電池を比較例2品とした。なお、比較例2品を得るための概略図を〔図8(b)〕に示す。
擬似太陽光(AM1.5)を各実施例品および比較例品の表面面積以上の領域に照射し、その変換効率をソーラーシミュレーター(セルテスターYSS150、山下電装社)によって測定した。
各実施例品および比較例品に用いたCIGS膜のCu、In、Gaの含有量を、エネルギー分散型蛍光X線装置(EX-250、堀場製作所)を用いて測定し、これらの原子数濃度を元にCu/(In+Ga)の組成比を算出した。
Claims (7)
- CIGS太陽電池の光吸収層として用いられるCIGS膜の製法であって、インジウムとガリウムとセレンとを含む層(A)と、銅とセレンとを含む層(B)を、固相状態でこの順で基板に積層する積層工程と、上記層(A)および層(B)が積層された積層体を加熱し、上記層(B)を溶融させ液相状態とすることにより、上記層(A)中に上記層(B)中の銅を拡散させ、結晶成長させてCIGS膜を得る加熱工程とを有することを特徴とするCIGS膜の製法。
- 上記積層工程を、100~250℃の範囲の温度で行う請求項1記載のCIGS膜の製法。
- 上記加熱工程を、520℃以上の温度で行う請求項1または2記載のCIGS膜の製法。
- 上記積層工程の温度から上記加熱工程の温度への昇温を、昇温速度10℃/秒以上で行う請求項1~3のいずれか一項に記載のCIGS膜の製法。
- 上記加熱工程において、セレン蒸気もしくはセレン化水素を供給し、CIGS膜表面のセレン分圧が、内部のセレン分圧よりも高い状態で維持されるようにする請求項1~4のいずれか一項に記載のCIGS膜の製法。
- 上記加熱工程終了時のCIGS膜が、0.95<銅/(インジウム+ガリウム)<1.30のモル比を満たすとともに、上記加熱工程時の温度を維持した状態で、上記加熱工程により得られたCIGS膜に、さらにインジウムとガリウムとセレンとを蒸着させることにより、上記CIGS膜が、0.70<銅/(インジウム+ガリウム)<0.95のモル比を満たすようにする請求項1~5のいずれか一項に記載のCIGS膜の製法。
- 基板上に、裏面電極層を設ける工程と、光吸収層を設ける工程と、バッファ層を設ける工程と、透明導電層を設ける工程とを有するCIGS太陽電池の製法であって、上記光吸収層を設ける工程として、上記請求項1に記載のCIGS膜の製法を用いることを特徴とするCIGS太陽電池の製法。
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US14/241,007 US8962379B2 (en) | 2011-09-07 | 2012-09-05 | Method of producing CIGS film, and method of producing CIGS solar cell by using same |
EP12830489.6A EP2755242B1 (en) | 2011-09-07 | 2012-09-05 | Method for producing cigs film, and method for manufacturing cigs solar cell using same |
KR1020147006884A KR101785771B1 (ko) | 2011-09-07 | 2012-09-05 | Cigs막의 제법 및 그것을 이용하는 cigs 태양 전지의 제법 |
CN201280042573.XA CN103765604B (zh) | 2011-09-07 | 2012-09-05 | Cigs膜的制法和使用其的cigs太阳能电池的制法 |
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---|---|---|---|---|
WO2014125900A1 (ja) * | 2013-02-12 | 2014-08-21 | 日東電工株式会社 | Cigs膜の製法およびそれを用いるcigs太陽電池の製法 |
WO2014125902A1 (ja) * | 2013-02-12 | 2014-08-21 | 日東電工株式会社 | Cigs膜の製法およびその製法を用いるcigs太陽電池の製法 |
WO2014202624A2 (en) | 2013-06-19 | 2014-12-24 | Dsm Ip Assets B.V. | Rasamsonia gene and use thereof |
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JP2015061062A (ja) * | 2013-09-20 | 2015-03-30 | 株式会社東芝 | 光電変換素子の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000156517A (ja) * | 1998-09-10 | 2000-06-06 | Matsushita Electric Ind Co Ltd | 化合物半導体薄膜の製造方法およびこれを用いた太陽電池 |
JP2004342678A (ja) * | 2003-05-13 | 2004-12-02 | Rikogaku Shinkokai | Cu(In1−xGax)Se2膜の製造方法及び太陽電池 |
JP2009541991A (ja) * | 2006-06-19 | 2009-11-26 | イン−ソーラー−テック カンパニー,リミテッド | 太陽電池用光吸収層の製造方法 |
JP2011060891A (ja) * | 2009-09-08 | 2011-03-24 | Optorun Co Ltd | 多源蒸着薄膜の組成制御方法および製造装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5356839A (en) | 1993-04-12 | 1994-10-18 | Midwest Research Institute | Enhanced quality thin film Cu(In,Ga)Se2 for semiconductor device applications by vapor-phase recrystallization |
US5441897A (en) | 1993-04-12 | 1995-08-15 | Midwest Research Institute | Method of fabricating high-efficiency Cu(In,Ga)(SeS)2 thin films for solar cells |
US5436204A (en) | 1993-04-12 | 1995-07-25 | Midwest Research Institute | Recrystallization method to selenization of thin-film Cu(In,Ga)Se2 for semiconductor device applications |
US6127202A (en) | 1998-07-02 | 2000-10-03 | International Solar Electronic Technology, Inc. | Oxide-based method of making compound semiconductor films and making related electronic devices |
US20070169809A1 (en) * | 2004-02-19 | 2007-07-26 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of low-melting chalcogenides |
FR2886460B1 (fr) * | 2005-05-25 | 2007-08-24 | Electricite De France | Sulfurisation et selenisation de couches de cigs electrodepose par recuit thermique |
CN101438416B (zh) * | 2006-02-23 | 2011-11-23 | 耶罗恩·K·J·范杜伦 | 从金属间微米薄片颗粒的半导体前体层的高生产量印刷 |
WO2007146964A2 (en) * | 2006-06-12 | 2007-12-21 | Robinson Matthew R | Thin-film devices fromed from solid particles |
US20090183675A1 (en) * | 2006-10-13 | 2009-07-23 | Mustafa Pinarbasi | Reactor to form solar cell absorbers |
US8415559B2 (en) * | 2008-02-08 | 2013-04-09 | Solopower, Inc. | Method for forming copper indium gallium chalcogenide layer with shaped gallium profile |
US8115095B2 (en) * | 2009-02-20 | 2012-02-14 | Miasole | Protective layer for large-scale production of thin-film solar cells |
US8153469B2 (en) * | 2009-12-07 | 2012-04-10 | Solopower, Inc. | Reaction methods to form group IBIIIAVIA thin film solar cell absorbers |
US20110174363A1 (en) * | 2010-01-21 | 2011-07-21 | Aqt Solar, Inc. | Control of Composition Profiles in Annealed CIGS Absorbers |
CN101768729B (zh) * | 2010-03-05 | 2012-10-31 | 中国科学院上海硅酸盐研究所 | 磁控溅射法制备铜铟镓硒薄膜太阳电池光吸收层的方法 |
-
2011
- 2011-09-07 JP JP2011194933A patent/JP5764016B2/ja not_active Expired - Fee Related
-
2012
- 2012-09-05 WO PCT/JP2012/072590 patent/WO2013035732A1/ja active Application Filing
- 2012-09-05 US US14/241,007 patent/US8962379B2/en active Active
- 2012-09-05 KR KR1020147006884A patent/KR101785771B1/ko active IP Right Grant
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000156517A (ja) * | 1998-09-10 | 2000-06-06 | Matsushita Electric Ind Co Ltd | 化合物半導体薄膜の製造方法およびこれを用いた太陽電池 |
JP2004342678A (ja) * | 2003-05-13 | 2004-12-02 | Rikogaku Shinkokai | Cu(In1−xGax)Se2膜の製造方法及び太陽電池 |
JP2009541991A (ja) * | 2006-06-19 | 2009-11-26 | イン−ソーラー−テック カンパニー,リミテッド | 太陽電池用光吸収層の製造方法 |
JP2011060891A (ja) * | 2009-09-08 | 2011-03-24 | Optorun Co Ltd | 多源蒸着薄膜の組成制御方法および製造装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2755242A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014125900A1 (ja) * | 2013-02-12 | 2014-08-21 | 日東電工株式会社 | Cigs膜の製法およびそれを用いるcigs太陽電池の製法 |
WO2014125902A1 (ja) * | 2013-02-12 | 2014-08-21 | 日東電工株式会社 | Cigs膜の製法およびその製法を用いるcigs太陽電池の製法 |
WO2014202624A2 (en) | 2013-06-19 | 2014-12-24 | Dsm Ip Assets B.V. | Rasamsonia gene and use thereof |
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CN103765604B (zh) | 2016-08-17 |
EP2755242A1 (en) | 2014-07-16 |
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EP2755242A4 (en) | 2016-02-17 |
EP2755242B1 (en) | 2018-06-27 |
JP2013058540A (ja) | 2013-03-28 |
US8962379B2 (en) | 2015-02-24 |
US20140220729A1 (en) | 2014-08-07 |
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