WO2013031223A1 - Dispositif de traitement de substrat et procédé de traitement de substrat, procédé d'exposition et dispositif d'exposition ainsi que procédé de fabrication d'un dispositif et procédé de fabrication d'un écran plat - Google Patents

Dispositif de traitement de substrat et procédé de traitement de substrat, procédé d'exposition et dispositif d'exposition ainsi que procédé de fabrication d'un dispositif et procédé de fabrication d'un écran plat Download PDF

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Publication number
WO2013031223A1
WO2013031223A1 PCT/JP2012/005466 JP2012005466W WO2013031223A1 WO 2013031223 A1 WO2013031223 A1 WO 2013031223A1 JP 2012005466 W JP2012005466 W JP 2012005466W WO 2013031223 A1 WO2013031223 A1 WO 2013031223A1
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WIPO (PCT)
Prior art keywords
substrate
moving body
exposure
processing
holding
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PCT/JP2012/005466
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English (en)
Japanese (ja)
Inventor
青木　保夫
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to KR1020147008312A priority Critical patent/KR102105809B1/ko
Priority to CN201280042608.XA priority patent/CN103782239B/zh
Priority to KR1020207011723A priority patent/KR102226989B1/ko
Priority to JP2013531102A priority patent/JP6071068B2/ja
Publication of WO2013031223A1 publication Critical patent/WO2013031223A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Definitions

  • the present invention relates to a substrate processing apparatus, a substrate processing method, an exposure method, an exposure apparatus, a device manufacturing method, and a flat panel display manufacturing method, and in particular, a plurality of substrates on a substrate by sequentially moving the substrate with respect to a processing position.
  • Substrate processing apparatus and substrate processing method for performing predetermined processing on region, exposure method and exposure apparatus for exposing a plurality of regions on substrate by sequentially moving substrate relative to exposure position (processing position), and said substrate The present invention relates to a device manufacturing method and a flat panel display manufacturing method using the processing apparatus, the substrate processing method, the exposure method or the exposure apparatus.
  • a step-and-repeat type projection exposure apparatus such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.
  • stepper step-and-repeat type projection exposure apparatus
  • scanning stepper also called a scanner
  • a glass plate or a wafer (hereinafter collectively referred to as a substrate) whose surface is coated with a sensitive agent is placed on a substrate stage apparatus. Then, the circuit pattern formed on the mask (or reticle) is transferred to the substrate by exposure light exposure through an optical system such as a projection lens.
  • a substrate stage can be formed in order to achieve the purpose of positioning the substrate at high speed and with high accuracy.
  • the goal was to reduce the weight as much as possible and eliminate disturbance (vibration).
  • a VCM (voice coil motor) and other components that are necessary for high-precision positioning control are placed on the fine movement stage, and other components (such as electrical boards and supply cables) are mounted on the coarse movement stage.
  • VCM voice coil motor
  • glass substrates for liquid crystals tend to be larger in the latest 10th generation, such as a side of 3 meters or more, and a fine movement stage on which a substrate holder that holds and holds the entire large substrate is mounted.
  • the size is increased and the weight is increased.
  • the enlargement of the substrate holder and the substrate table that supports the substrate holder has caused various disadvantages.
  • the exposure apparatus has become large, the manufacturing cost has increased, and it has taken time to manufacture and transport the apparatus.
  • it takes time to move the substrate and the tact time is long. For this reason, there has been a demand for the development of a stage apparatus that can guide the exposure object (substrate) with high accuracy and that can be further reduced in size and weight.
  • the substrate exchange on the substrate stage is performed by unloading (withdrawing) the substrate from the substrate holder that holds the substrate by suction and then loading (injecting) the new substrate onto the substrate holder.
  • a substrate holder having a holding surface of the same size as the substrate has been used. For this reason, in the conventional exposure apparatus, the substrate cannot be carried out from the substrate holder unless the substrate is transported by the same distance as the size, and the substrate cannot be carried into the substrate holder. .
  • glass substrates for liquid crystals tend to become larger, so it takes some time to replace the substrate, and development of a new device that can further shorten the substrate replacement time. was desired.
  • the inventor once again observed the stage device in order to realize a stage device that can guide the object (substrate) at high speed and with high accuracy and that can be further reduced in size and weight.
  • the weight of the substrate having an area of 3 square meters and a thickness of about 0.7 mm is less than 20 kg, while the weight of the substrate holder supporting the substrate is about 1 ton.
  • the table that supports the substrate holder also becomes heavy. If the weight of the substrate holder located at the tip can be reduced, it will be recognized again that all the components connected to the bottom of the holder, that is, the table, weight canceling device (core column), guide, etc., can be reduced in weight. did.
  • the main role of the substrate holder is to flatten a thin substrate that is prone to warping and / or bending. For this reason, the conventional substrate holder has almost the same area as the substrate, and the substrate is made to follow the surface (upper surface) of the substrate holder by, for example, vacuum suction. For this reason, it is necessary to finish the surface of the substrate holder as a plane reference with extremely high flatness, and the thickness is increased and the weight is increased to ensure rigidity.
  • the batch exposure area that can be exposed at one time (also referred to as a shot area) is set to be smaller than the area of the entire substrate.
  • the entire surface of the substrate cannot be exposed. Therefore, the entire surface of the substrate is exposed while repeating scan exposure and step movement without exposure.
  • the substrate needs to be flat only within the scan range (shot region) of the collective exposure, and more strictly, only the fixed irradiation range by the projection optical system. There is no need to pay particular attention to the flatness of the substrate during other steps and step movement without exposure.
  • the inventor sets the substrate holder for correcting the substrate flatly to a width in the cross scan direction substantially equal to that of the exposure field (a little wider than the exposure field), and even if the length in the scan direction is small.
  • the scan exposure area (shot area) on the substrate to be exposed next is moved relative to the substrate holder, and the plane correction and the substrate alignment are performed each time to perform the scan exposure. I thought that I should do it.
  • the area of the substrate holder is reduced, and the table supporting the substrate holder is also reduced, so that the entire fine movement stage is reduced in size and weight.
  • the present invention has been made based on the idea of the inventor, and adopts the following configuration.
  • a substrate processing apparatus for processing a substrate, having a holding unit that holds a part of the substrate in a state in which flatness is ensured, A first moving body that moves in at least a first direction within a predetermined plane parallel to the surface of the substrate; a step driving device that drives the substrate in a second direction orthogonal to the first direction within the predetermined plane; A first substrate processing apparatus is provided.
  • the movement in the first direction with respect to the substrate processing position of the first moving body that holds the part of the substrate in a state in which the flatness is ensured by the holding unit is the second direction of the substrate by the step driving device.
  • the plurality of regions to be processed on the substrate are processed.
  • substrate can be made small, and the moving body which has the holding
  • a substrate processing apparatus for processing a substrate
  • the substrate processing apparatus includes a holding unit that holds a part of a surface opposite to the processing surface of the substrate arranged in parallel to a horizontal plane.
  • a first moving body that moves in at least a first direction within a predetermined plane parallel to the surface of the substrate with respect to the substrate processing position; and the first direction within the predetermined plane across the first moving body.
  • a pair of first surfaces each having a support surface that is disposed on both sides in a second direction orthogonal to the substrate and supports at least a portion of the substrate from below and having a size equal to or greater than that of the substrate in the first direction and the second direction.
  • a first transport device that transports the substrate in the predetermined plane so that the substrate is displaced in the second direction when the substrate is unloaded from the first moving body.
  • the holding part of the first moving body holds a part of the surface of the substrate opposite to the surface to be processed. That is, the substrate holding surface of the holding unit is set smaller than the substrate. For this reason, when the first transport device carries the substrate from the first moving body, the substrate is transported within a predetermined plane so as to be displaced in the second direction. By simply displacing the substrate in the second direction by a distance smaller than the size in the second direction, the unloading of the substrate is completed. Therefore, it is possible to shorten the substrate replacement time by shortening the carry-out distance as compared with the prior art.
  • any one of the substrate processing apparatuses according to the first and second aspects is disposed at a substrate processing position, and the processing region is irradiated with an energy beam.
  • a device manufacturing method including exposing the substrate using the substrate processing apparatus and developing the exposed substrate is provided.
  • any one of the substrate processing apparatuses according to the first and second aspects is disposed at a substrate processing position, and the set processing region is irradiated with an energy beam to thereby form the processing region. Exposing the substrate used for a flat panel display as a substrate using the substrate processing apparatus, and developing the exposed substrate. A method of manufacturing a flat panel display is provided.
  • a substrate processing method for processing a substrate wherein a part of the substrate is held by a moving body while ensuring flatness, and the moving body is placed at a substrate processing position.
  • driving in a first direction within a predetermined plane parallel to the surface of the substrate to perform a predetermined process on the region in the part of the substrate, and moving the unprocessed region on the substrate to the movable body First substrate processing method including: driving the substrate to the movable body by a predetermined amount in a second direction orthogonal to the first direction within the predetermined plane with respect to the moving body.
  • a plurality of regions to be processed on the substrate are processed by performing the predetermined processing before and after performing the step drive.
  • substrate can be reduced in size and weight. Thereby, it becomes possible to improve the position controllability of the moving body and to reduce the production cost of the substrate processing apparatus.
  • a substrate processing method for processing a substrate wherein a part of a surface opposite to the processing surface of the substrate arranged in parallel to a horizontal plane is ensured in flatness.
  • the movable body is held by the movable body, and the movable body is driven in a first direction within a predetermined plane parallel to the surface of the substrate with respect to the substrate processing position to perform predetermined processing on the region within the part of the substrate.
  • a second substrate processing method including unloading the substrate from the movable body.
  • a substrate that has been subjected to a predetermined process is transported in a second direction perpendicular to the first direction within a predetermined plane by a distance shorter than the size of the substrate in the second direction. Is removed from the moving object. Therefore, it is possible to shorten the substrate replacement time by shortening the carry-out distance as compared with the prior art.
  • a processing method for processing a substrate wherein a surface opposite to the processing surface of the substrate arranged in parallel to a horizontal plane is held in a state in which flatness is ensured.
  • the substrate is transported in a direction determined according to the arrangement and the order at a position in the first direction determined according to the arrangement of the region to be processed on the substrate and the order of processing.
  • a third substrate processing method including unloading from the moving body.
  • the substrate is determined according to the arrangement and the order at the position in the first direction within the predetermined plane determined according to the arrangement of the processing target area on the substrate and the order of processing. Transport in the direction and unload from the moving body. For this reason, it becomes possible to carry out a board
  • any of the substrate processing methods according to the fifth to seventh aspects is a method of exposing a substrate
  • the substrate is exposed using the substrate processing method. And developing the exposed substrate.
  • a device manufacturing method is provided.
  • any one of the substrate processing methods according to the fifth to seventh aspects is a method for exposing a substrate
  • the substrate processing method is used as a flat panel display as a substrate.
  • a method of manufacturing a flat panel display which includes exposing a substrate used in the above and developing the exposed substrate.
  • an exposure method for exposing a plurality of substrates wherein the two substrates are mounted on a substrate holding apparatus having first and second holding regions capable of holding two substrates individually.
  • a device manufacturing method including exposing the substrate by the exposure method according to the tenth aspect and developing the exposed substrate.
  • a flat comprising: exposing a substrate used for a flat panel display as the substrate by the exposure method according to the tenth aspect; and developing the exposed substrate.
  • a method for manufacturing a panel display is provided.
  • an exposure apparatus that exposes a plurality of areas on a substrate, the substrate holding apparatus having first and second holding areas each capable of holding a part of two substrates. And the substrate holding device is provided in a part thereof, and a movable body that moves in the first direction, and moves in the first direction integrally with the movable body, and one of the two substrates is
  • An exposure apparatus is provided that includes a first substrate feeder that moves in a second direction that intersects the first direction.
  • a moving body in which a part of each of the two substrates is placed on the first holding region and the second holding region of the substrate holding device, respectively, and the substrate holding device is provided in a part thereof.
  • the other substrate In parallel with the movement of the first direction to scan and expose a part of the processing area of one substrate, the other substrate is moved in the second direction with respect to the substrate holding device by the first substrate feeding device. It becomes possible. Thereby, after the exposure of one processing area (unexposed area) is completed for the first substrate, the substrate is stepped to expose the next processing area (unexposed area). Exposure and step movement Are alternately repeated to expose the substrate, and the time required for the exposure processing of the two substrates can be shortened as compared with the case where the second substrate is exposed in the same procedure. .
  • a fourteenth aspect of the present invention there is provided a device manufacturing method comprising: exposing a substrate using the exposure apparatus according to the thirteenth aspect; and developing the exposed substrate. .
  • exposing a substrate used for a flat panel display as the substrate using the exposure apparatus according to the thirteenth aspect, exposing a substrate used for a flat panel display as the substrate, and developing the exposed substrate.
  • a method of manufacturing a flat panel display is provided.
  • FIG. 1 is a partially omitted plan view showing an exposure apparatus according to a first embodiment.
  • FIG. 2 is a schematic side view showing the exposure apparatus according to the first embodiment with a part thereof omitted when viewed from the + X direction in FIG. 1.
  • FIG. 2 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of the exposure apparatus according to the first embodiment.
  • FIG. (1) for demonstrating a series of operation
  • FIG. (2) for demonstrating a series of operation
  • FIG. (3) for demonstrating a series of operation
  • FIG. (4) for demonstrating a series of operation
  • FIG. (5) for demonstrating a series of operation
  • FIG. (6) for demonstrating a series of operation
  • FIG. (8) for demonstrating a series of operation
  • FIG. (9) for demonstrating a series of operation
  • FIG. (9) for demonstrating a series of operation
  • FIG. which shows schematically the structure of the exposure apparatus which concerns on 2nd Embodiment. It is the top view which abbreviate
  • FIG. 1 It is a schematic side view which abbreviate
  • FIG. 21 is a schematic side view showing the exposure apparatus according to the fourth embodiment with a part thereof omitted when viewed from the + X direction of FIG. 20. It is a figure which shows schematically the structure of the exposure apparatus which concerns on 5th Embodiment.
  • FIG. 10 is a partially omitted plan view showing an exposure apparatus according to a fifth embodiment. It is a schematic side view which abbreviate
  • FIG. 10 is a partially omitted plan view showing an exposure apparatus according to a sixth embodiment.
  • FIG. (2) for demonstrating a series of operation
  • FIG. (3) for demonstrating a series of operation
  • FIG. (4) for demonstrating a series of operation
  • FIG. 10 is a partially omitted plan view showing an exposure apparatus according to a seventh embodiment.
  • FIG. 31 is a side view of the exposure apparatus according to the seventh embodiment when viewed from the + X direction in FIG. 30 (partially omitted, partially shown in section).
  • FIG. (1) for demonstrating a series of operation
  • FIG. (2) for demonstrating a series of operation
  • FIG. (3) for demonstrating a series of operation
  • FIG. (4) for demonstrating a series of operation
  • FIG. (5) for demonstrating a series of operation
  • FIG. (6) for demonstrating a series of operation
  • FIG. (8) for demonstrating a series of operation
  • FIG. (9) for demonstrating a series of operation
  • FIG. (10) for demonstrating a series of operation
  • FIG. (11) for demonstrating a series of operation
  • FIG. (12) for demonstrating a series of operation
  • FIG. 10 is a partially omitted plan view showing an exposure apparatus according to an eighth embodiment.
  • FIG. (1) for demonstrating a series of operation
  • FIG. (2) for demonstrating a series of operation
  • FIG. (3) for demonstrating a series of operation
  • FIG. (4) for demonstrating a series of operation
  • FIG. (5) for demonstrating a series of operation
  • FIG. (6) for demonstrating a series of operation
  • FIG. (7) for demonstrating a series of operation
  • FIG. (8) for demonstrating a series of operation
  • FIG. (9) for demonstrating a series of operation
  • FIG. (11) for demonstrating a series of operation
  • FIG. (12) for demonstrating a series of operation
  • FIG. (13) for demonstrating a series of operation
  • FIG. (14) for demonstrating a series of operation
  • FIG. 10 is a partially omitted plan view showing an exposure apparatus according to a ninth embodiment.
  • FIG. 68 is a schematic side view showing the exposure apparatus according to the ninth embodiment with a part thereof omitted when viewed from the + X direction of FIG. 67.
  • FIG. 69 is an enlarged view of a part of the plan view of FIG. 68 taken out.
  • It is a block diagram which shows the input / output relationship of the main controller which mainly comprises the control system of the exposure apparatus which concerns on 9th Embodiment.
  • 75A to 75D are diagrams for explaining parallel processing of exposure of the shot area SA1 of the substrate P2 and Y-step operation of the substrate P1. It is exposure procedure explanatory drawing (the 4) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 5) performed with the exposure apparatus which concerns on 9th Embodiment.
  • FIG. 116 is a schematic side view showing the exposure apparatus according to the tenth embodiment with a portion omitted as viewed from the + X direction in FIG. 115.
  • FIG. 1 schematically shows a configuration of an exposure apparatus 100 according to the first embodiment
  • FIG. 2 shows a plan view in which the exposure apparatus 100 is partially omitted. 2 corresponds to a plan view of a portion below the projection optical system PL in FIG. 1 (a portion below a lens barrel surface plate described later).
  • the exposure apparatus 100 is used for manufacturing, for example, a flat panel display, a liquid crystal display device (liquid crystal panel), and the like.
  • the exposure apparatus 100 is a projection exposure apparatus that uses a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used for a display panel of a liquid crystal display device as an exposure object.
  • the exposure apparatus 100 includes an illumination system IOP, a mask stage MST that holds a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, and the like mounted on a body BD (only a part thereof is shown in FIG. 1 and the like).
  • a substrate stage apparatus PST including a fine movement stage 26 (substrate table) for holding the substrate P, and a control system thereof.
  • the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction (X direction), and the direction orthogonal to this in the horizontal plane is the Y-axis direction (Y Direction), the direction orthogonal to the X axis and Y axis is the Z axis direction (Z direction), and the rotation (tilt) directions around the X axis, Y axis, and Z axis are the ⁇ x, ⁇ y, and ⁇ z directions, respectively.
  • the illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure reflectors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL.
  • a light source for example, a mercury lamp
  • exposure reflectors not shown
  • dichroic mirrors for example, a mercury lamp
  • shutters for example, a light source
  • wavelength selection filters for example, a light that is applied to the mask M as IL.
  • Irradiation light is applied to the mask M as IL.
  • the illumination light IL for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line,
  • a mask M having a circuit pattern or the like formed on its pattern surface (the lower surface in FIG. 1) is fixed to the mask stage MST, for example, by vacuum suction (or electrostatic suction).
  • Mask stage MST is supported in a non-contact state on a mask surface plate (not shown) constituting a part of body BD, for example, via an air bearing (not shown) fixed to the bottom surface thereof.
  • the mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a mask stage drive system 12 (not shown in FIG. 1, see FIG. 4) including a linear motor, for example, And are slightly driven appropriately in the ⁇ z direction.
  • Position information (including rotation information in the ⁇ z direction) of the mask stage MST in the XY plane includes a plurality of laser interferometers that irradiate a measuring beam onto a reflective surface provided (or formed) on the mask stage MST. It is measured by a mask laser interferometer system (hereinafter referred to as “mask interferometer system”) 14.
  • mask interferometer system a mask laser interferometer system
  • the projection optical system PL is supported by the lens barrel surface plate 16 which is a part of the body BD below the mask stage MST in FIG.
  • the projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in, for example, a staggered pattern, and a single direction whose longitudinal direction is the Y-axis direction. It functions in the same way as a projection optical system having a rectangular (band-like) image field.
  • each of the plurality of projection optical systems for example, a bilateral telecentric equal magnification system that forms an erect image is used.
  • a plurality of projection areas arranged in a staggered pattern in the projection optical system PL are collectively referred to as an exposure area IA.
  • the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL.
  • An area (exposure area) IA is formed.
  • the mask M is relatively moved in the scanning direction (X-axis direction) with respect to the illumination area (illumination light IL) by synchronous driving of the mask stage MST and a substrate holder PH (fine movement stage 26) described later that holds the substrate P.
  • scanning exposure of one shot area (partition area) on the substrate P is performed by moving the substrate P relative to the exposure area IA (illumination light IL) in the scanning direction (X-axis direction).
  • the pattern of the mask M is transferred to the shot area. That is, in the exposure apparatus 100, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the sensitive layer (resist layer) on the substrate P is exposed on the substrate P by the illumination light IL. A pattern is formed.
  • the body BD is separated from each other by a predetermined distance in the X-axis direction on the floor F as shown in FIG. 2 and FIG. 3 in which the schematic side view of the exposure apparatus 100 viewed from the + X direction is partially omitted.
  • a pair of (two) substrate stage mounts (hereinafter abbreviated as mounts) 18 composed of rectangular parallelepiped members arranged in parallel and with the longitudinal direction as the Y-axis direction, and a pair of side frames 20 on the pair of mounts 18.
  • mounts 18 composed of rectangular parallelepiped members arranged in parallel and with the longitudinal direction as the Y-axis direction, and a pair of side frames 20 on the pair of mounts 18.
  • a lens barrel surface plate 16 supported horizontally and a mask surface plate (not shown).
  • the number of the gantry 18 is not limited to two, but may be one or three or more.
  • Each base 18 is installed on the floor F via a plurality of vibration isolators 22 (see FIGS. 1 and 3).
  • the pair of side frames 20 has lower ends connected to one end and the other end in the Y-axis direction on the upper surface of the pair of mounts 18.
  • the lens barrel surface plate 16 is formed of a rectangular parallelepiped member that is arranged in parallel to the XY plane and whose longitudinal direction is the Y-axis direction, and both ends in the Y-axis direction are downward on the pair of mounts 18 by the pair of side frames 20. It is supported from.
  • the substrate stage apparatus PST includes a coarse movement stage unit 24, a fine movement stage 26, a weight cancellation apparatus 28, and the like, as shown in FIG.
  • the weight cancellation device 28 is disposed on the upper surface parallel to the XY plane of the X guide 82 disposed on the pair of mounts 18.
  • the coarse movement stage unit 24 includes two (a pair) X beams 30A and 30B, two (a pair) coarse movement tables 32A and 32B, and two X beams 30A and 30B. And a plurality of legs 34 that support each of the two on the floor surface F.
  • Each of the X beams 30A and 30B is formed of a hollow member having a rectangular frame shape with a YZ cross section extending in the X-axis direction and having a rib inside, and is arranged in parallel to each other at a predetermined interval in the Y-axis direction (FIGS. 1 to 5). 3).
  • each of the X beams 30A and 30B has three legs 34 in the vicinity of both ends in the longitudinal direction (X-axis direction) and the central portion. On the surface F, it is supported without contact with the pair of mounts 18. As a result, the coarse movement stage portion 24 is vibrationally separated from the pair of mounts 18.
  • positioning and the number of the leg parts 34 may be arbitrary.
  • the X beams 30A and 30B are not limited to hollow members, but may be solid members, or may be rod-shaped members having an I-shaped YZ cross section.
  • a plurality of X linear guides 36 extending in the X axis direction (for example, two (a pair)) are fixed in parallel to each other at predetermined intervals in the Y axis direction on the upper surfaces of the X beams 30A and 30B.
  • X stators 38A and 38B extending in the X-axis direction are fixed to the upper surfaces of the X beams 30A and 30B, respectively, between the pair of X linear guides 36.
  • Each of the X stators 38A and 38B has a magnet unit including a plurality of permanent magnets arranged at a predetermined interval in the X-axis direction, for example. In this embodiment, as shown in FIGS.
  • the cross-sectional shapes of the X beams 30A and 30B are such that the + Y side X beam 30A is wider than the ⁇ Y side X beam 30B, that is, in the Y-axis direction.
  • the same shape may be used.
  • the coarse movement tables 32A and 32B are individually arranged above the X beams 30A and 30B as shown in FIG.
  • the coarse motion table 32B located on the ⁇ Y side is made of a plate-like member having a rectangular shape in plan view
  • the coarse motion table 32A located on the + Y side is a U-shaped plate in plan view having a recess at the end portion on the ⁇ Y side. It consists of a member.
  • the coarse motion table 32 ⁇ / b> A is partially shown in a sectional view together with a weight cancellation device 28 described later. As shown in FIG.
  • a predetermined gap (gap and clearance) is provided between the X stators 38A and 38B fixed to the X beams 30A and 30B, respectively.
  • Opposing X movers 40A and 40B are fixed.
  • Each of the X movers 40A and 40B includes, for example, a coil unit (not shown), and together with the X stators 38A and 38B, the X linear motors 42A and D drive the coarse motion tables 32A and 32B with a predetermined stroke in the X axis direction. 42B is configured.
  • the lower surfaces of the coarse movement tables 32A and 32B include rolling elements (not shown) (for example, a plurality of balls, etc.), and are slidable with respect to the respective X linear guides 36.
  • a plurality of sliders 44 to be engaged are fixed.
  • four sliders 44 are provided at predetermined intervals in the X-axis direction with respect to each X linear guide 36 (see FIG. 1), and a total of 8 sliders 44 are provided on the lower surfaces of the coarse motion tables 32A and 32B, for example.
  • the sliders 44 are fixed.
  • Each of the coarse motion tables 32 ⁇ / b> A and 32 ⁇ / b> B is linearly guided in the X-axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.
  • an X scale having the X axis direction as a periodic direction is fixed to each of the X beams 30A and 30B, and each of the coarse motion tables 32A and 32B has an X scale.
  • Encoder heads constituting X linear encoder systems 46A and 46B for obtaining position information in the X-axis direction of coarse motion tables 32A and 32B using a scale are fixed.
  • the positions of the coarse motion tables 32A and 32B in the X-axis direction are controlled by the main controller 50 (see FIG. 4) based on the output of the encoder head.
  • the coarse movement tables 32A and 32B have relative movement amounts (relative to the coarse movement tables 32A and 32B in the X-axis and Y-axis directions relative to the coarse movement tables 32A and 32B).
  • Gap sensors 48A and 48B (see FIG. 4) for measuring the (displacement amount) are attached.
  • Main controller 50 immediately stops fine movement stage 26 and coarse movement tables 32A and 32B when the relative movement amounts measured by gap sensors 48A and 48B reach a predetermined limit value.
  • a mechanical stopper member that mechanically limits the movable amount of the fine movement stage 26 with respect to the coarse movement tables 32A and 32B may be provided.
  • fine movement stage 26 is made of a plate-shaped (or box-shaped) member having a rectangular shape in plan view, and substrate holder PH is mounted on the upper surface thereof.
  • the substrate holder PH has a length in the X-axis direction equivalent to that of the substrate P, and a width (length) in the Y-axis direction is about 1 ⁇ 2 of the substrate P (see FIG. 2).
  • the substrate holder PH adsorbs and holds a part of the substrate P (here, about a half of the substrate P with respect to the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption) and a pressurized gas (for example, High pressure air) is ejected upward, and a part of the substrate P (about 1 ⁇ 2 of the substrate P) can be supported in a non-contact (floating) direction from below by the ejection pressure.
  • the switching between high-pressure air ejection and vacuum suction to the substrate P by the substrate holder PH is performed via a holder intake / exhaust switching device 51 (see FIG. 4) that switches and connects the substrate holder PH to a vacuum pump and a high-pressure air source (not shown). This is performed by the main controller 50.
  • the fine movement stage 26 is moved in a direction of six degrees of freedom (X axis, Y axis, Z axis, ⁇ x) on the coarse movement table 32A by a fine movement stage drive system 52 (see FIG. 4) including a plurality of voice coil motors (or linear motors). , ⁇ y, and ⁇ z).
  • a stator 56 is provided on the upper surface of the + X side end of the coarse movement table 32 ⁇ / b> A via a support member 33.
  • a mover 58 that constitutes the X voice coil motor 54X together with the stator 56 is fixed to the side surface on the + X side.
  • a pair of X voice coil motors 54X having the same configuration is provided at a predetermined distance in the Y-axis direction.
  • a stator 60 is provided via a support member 35 at a substantially central position in the Y-axis direction on the upper surface of the coarse movement table 32A.
  • a movable element 62 constituting the Y voice coil motor 54Y is fixed together with the stator 60 on the side surface on the + Y side.
  • a pair of Y voice coil motors 54Y having the same configuration is provided at a predetermined distance in the X-axis direction.
  • the fine movement stage 26 is supported by a weight cancellation device 28, which will be described later, by a main controller 50 using a pair of X voice coil motors 54X, and is driven synchronously with a coarse movement table 32A (at the same speed in the same direction as the coarse movement table 32A). Driven) with a predetermined stroke in the X-axis direction together with the coarse motion table 32A, and driven in the Y-axis direction with respect to the coarse motion table 32A by being driven using a pair of Y voice coil motors 54Y. Also moves with a slight stroke.
  • the fine movement stage 26 causes the coarse movement by causing the main controller 50 to generate driving forces in opposite directions to each of the pair of X voice coil motors 54X or each of the pair of Y voice coil motors 54Y. It moves in the ⁇ z direction with respect to the table 32A.
  • the fine movement stage 26 includes the above-described X linear motors 42A and 42B and the pair of the X voice coil motor 54X and the Y voice coil motor 54Y of the fine movement stage drive system 52. 1), it can be moved (coarse movement) with a long stroke in the X-axis direction, and can be slightly moved (fine movement) in three degrees of freedom in the X-axis, Y-axis, and ⁇ z directions.
  • the fine movement stage drive system 52 has a plurality of, for example, four, fine movement stages 26 for finely driving the fine movement stage 26 in the remaining three degrees of freedom (each direction of ⁇ x, ⁇ y, and Z axis).
  • a Z voice coil motor 54Z is provided.
  • Each of the plurality of Z voice coil motors 54Z includes a stator 59 fixed to the upper surface of the coarse movement table 32A and a mover 57 fixed to the lower surface of the fine movement stage 26, and is formed at four corners of the lower surface of the fine movement stage 26. (In FIG. 1, only two of the four Z voice coil motors 54Z are shown, and the other two are not shown. In FIG.
  • each voice coil motor 54X, 54Y, 54Z may be either a moving magnet type or a moving coil type. A position measurement system for measuring the position of fine movement stage 26 will be described later.
  • four air levitation units 84 having a rectangular support surface (upper surface) are arranged above the coarse movement tables 32A and 32B. And fixed to the upper surfaces of the coarse motion tables 32A and 32B.
  • each air levitation unit 84 has a thrust type air bearing structure having a porous body and mechanically a plurality of minute holes.
  • Each air levitation unit 84 can float and support a part of the substrate P by supplying pressurized gas (for example, high-pressure air) from a gas supply device 85 (see FIG. 4).
  • pressurized gas for example, high-pressure air
  • On / off of the supply of high-pressure air to each air levitation unit 84 is controlled by the main controller 50 shown in FIG.
  • a single gas supply device 85 is illustrated.
  • the present invention is not limited to this, and the air levitation unit 84 that supplies high-pressure air individually to each air levitation unit 84
  • the same number of gas supply devices may be used, or two or more gas supply devices respectively connected to the plurality of air levitation units 84 may be used.
  • the single gas supply apparatus 85 is shown on behalf of all of these. In any case, on / off of the supply of high-pressure air from the gas supply device 85 to each air levitation unit 84 is individually controlled by the main controller 50.
  • Each of the four air levitation units 84 attached to each of the coarse motion tables 32A and 32B is disposed on both sides of the substrate holder PH in the Y-axis direction.
  • the upper surface of each air levitation unit 84 is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.
  • each of the four air levitation units 84 arranged on one side and the other side of the substrate holder PH in the Y-axis direction has almost the same area as the substrate holder PH (that is, about the size of the substrate P). In a rectangular area of 1/2), they are arranged in 2 rows and 2 columns with a predetermined gap in the X-axis direction and a slight gap in the Y-axis direction. In this case, each of the four air levitation units 84 can levitate and support about 1 ⁇ 2 of the substrate P.
  • the entire substrate P is supported by the substrate holder PH and the two air levitation units 84 adjacent to both sides ( ⁇ Y side) of the substrate holder PH. it can. Further, the entire substrate P can be levitated and supported by the substrate holder PH and the four air levitation units 84 on one side (+ Y side or ⁇ Y side) of the substrate holder PH.
  • Each of the four air levitation units 84 on both sides ( ⁇ Y side) of the substrate holder PH described above may be replaced with one large air levitation unit having substantially the same area as the substrate holder PH in plan view.
  • Each of the two air levitation units 84 arranged in a row may be replaced with one air levitation unit having substantially the same area.
  • the air floating unit on the + Y side of the substrate holder PH as a whole has the same length in the Y-axis direction as the substrate holder PH. It is desirable to have a rectangular support surface that is somewhat shorter in the X-axis direction and to be divided into two at least in the X-axis direction.
  • the substrate Y step feeding device 88 is a device for holding the substrate P and moving it in the Y-axis direction. Of the four air floating units 84 on the + Y side of the substrate holder PH, each of the + X side and the ⁇ X side It is disposed between the two air levitation units 84.
  • the substrate Y step feeding device 88 is fixed to the coarse motion table 32A via a support member 89 (see FIG. 3).
  • the substrate Y step feeding device 88 includes a movable portion 88a that attracts the back surface of the substrate P and moves in the Y-axis direction, and a fixed portion 88b that is fixed to the coarse motion table 32A.
  • the movable portion 88a is driven by a driving device 90 (not shown in FIG. 3, refer to FIG. 4) including a linear motor including a mover provided on the movable portion 88a and a stator provided on the fixed portion 88b.
  • the Y-axis direction is driven with respect to the coarse movement table 32A.
  • the substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 3, see FIG.
  • the drive device 90 is not limited to a linear motor, and may be configured by a drive mechanism that uses a rotary motor using a ball screw or a belt as a drive source.
  • the movement stroke of the movable portion 88a of the substrate Y step feeding device 88 in the Y-axis direction is about 1 ⁇ 2 of the length of the substrate P in the Y-axis direction. Can be located on the substrate holder PH. Therefore, each time step feed of the substrate P in the Y-axis direction is performed, the substrate P held by the substrate holder PH is scanned in the X-axis direction with respect to the exposure area IA of the projection optical system PL. It becomes possible to expose the entire area to be exposed.
  • the drive device 90 performs the Z-axis operation. It is configured to be able to be driven minutely in the direction.
  • the substrate Y step feeding device 88 is attached to the coarse movement table 32A, but is not limited thereto, and may be attached to the fine movement stage 26.
  • the movable portion 88a of the substrate Y step feeding device 88 needs to be separated from and contacted with the substrate P, the movable portion 88a is also movable in the Z-axis direction.
  • the fine movement stage 26 may move in the Z-axis direction for the adsorption of the substrate P by the movable portion 88a (substrate adsorption surface) and the separation from the substrate P.
  • the weight canceling device 28 is composed of a columnar member extending in the Z-axis direction, and is also referred to as a core column.
  • the weight canceling device 28 supports the fine movement stage 26 from below via a device called a leveling device described later.
  • the weight cancellation device 28 is disposed in the recess of the coarse motion table 32A, and its upper half is exposed above the coarse motion table 32A (and 32B), and its lower half is the coarse motion table 32A (and 32B). ) Exposed below.
  • the weight cancellation device 28 includes a housing 64, an air spring 66, a Z slider 68, and the like, as shown in FIG.
  • the housing 64 is formed of a bottomed cylindrical member that is open on the + Z side.
  • the air spring 66 is housed inside the housing 64. Pressurized gas (for example, high-pressure air) is supplied to the air spring 66 from the outside.
  • the Z slider 68 is made of, for example, a low-profile columnar member extending in the Z-axis direction, is inserted into the housing 64, and is placed on the air spring 66.
  • the Z slider 68 is provided with a guide (not shown) for restricting movement in directions other than the Z-axis direction.
  • a guide for example, an air bearing or a parallel leaf spring is used as the guide.
  • the parallel leaf spring is configured by using, for example, six leaf springs made of, for example, a thin spring steel plate having a thickness parallel to the XY plane. Of the six leaf springs, three leaf springs are radially arranged around the upper end of the Z slider 68, and the remaining three leaf springs are placed at the three places around the lower end of the Z slider 68. It arrange
  • each leaf spring is attached to the outer peripheral surface of the Z slider 68 and the other end portion is attached to the housing 64. Since the stroke is determined by the amount of bending of the leaf spring by using the parallel leaf spring, the Z slider 68 can be structured to be short in the Z-axis direction, that is, to have a low back (height). However, the Z slider 68 cannot cope with a long stroke as in the case where the guide is constituted by an air bearing.
  • An air bearing (not shown) (referred to as a sealing pad) whose bearing surface faces the + Z side is attached to the upper portion (the end portion on the + Z side) of the Z slider 68. Further, as shown in FIGS.
  • a plurality of arms (referred to as “feelers”) 71 are radially arranged and fixed around the housing 64.
  • a target plate 72 used in each of a plurality of reflective optical sensors (also referred to as leveling sensors) 74 attached to the lower surface of the fine movement stage 26 is installed on the upper surface of the tip of each feeler 71.
  • the reflective optical sensors 74 are actually arranged at three or more places that are not on a straight line.
  • a plurality of these reflective optical sensors 74 constitute a Z tilt measurement system 76 (see FIG. 4) that measures the position of the fine movement stage 26 in the Z-axis direction and the tilt amount (rotation amount in the ⁇ x and ⁇ y directions). Yes.
  • FIG. 3 only one reflective photosensor 74 is shown in order to avoid complication of the drawing.
  • the leveling device 78 is a device that supports the fine movement stage 26 so as to be tiltable (swingable in the ⁇ x and ⁇ y directions with respect to the XY plane).
  • the leveling device 78 includes a spherical bearing having a fixed portion 78a (schematically shown by a rectangular parallelepiped member in FIG. 3) and a movable portion 78b (schematically shown by a spherical member in FIG. 3).
  • the fixed part 78a can incline the movable part 78b around the axis (for example, X axis and Y axis) in a horizontal plane with a small stroke while supporting the movable part 78b from below. It has become.
  • a concave portion that allows inclination of the movable portion 78b in the ⁇ x direction and the ⁇ y direction may be formed on the upper surface of the fixed portion 78a.
  • the upper surface (the upper half of the spherical surface) of the movable part 78b is fixed to the fine movement stage 26, and the fine movement stage 26 can be tilted with respect to the fixed part 78a.
  • the lower surface of the fixing portion 78a is finished in a horizontal plane, and has a slightly larger area as the guide surface of the above-described sealing pad of the weight cancellation device 28 than the bearing surface of the entire sealing pad.
  • the fixed portion 78a is supported in a non-contact manner from below by a sealing pad attached to the Z slider 68 of the weight cancellation device 28.
  • the weight canceling device 28 cancels (cancels) the weight of the system including the fine movement stage 26 (downward force in the gravity direction) via the Z slider 68 and the leveling device 78 by the upward force in the gravity direction generated by the air spring 66. This reduces the load on the plurality of Z voice coil motors 54Z described above.
  • the weight canceling device 28 is connected to the coarse motion table 32A via a pair of connecting devices 80 (see FIG. 1).
  • the Z position of the pair of coupling devices 80 substantially coincides with the position of the center of gravity of the weight cancellation device 28 in the Z-axis direction.
  • Each coupling device 80 includes a thin steel plate having a thickness parallel to the XY plane, and is also referred to as a flexure device.
  • Each of the pair of connecting devices 80 is disposed opposite to the + X side and the ⁇ X side of the weight canceling device 28.
  • Each connecting device 80 is arranged in parallel to the X axis between the casing 64 of the weight canceling device 28 and the coarse motion table 32A, and connects the two.
  • the weight canceling device 28 moves in the X-axis direction integrally with the coarse motion table 32A by being pulled by the coarse motion table 32A via one of the pair of connecting devices 80. Further, the upper components (fine movement stage 26, substrate holder PH, etc.) supported by the weight cancellation device 28 through the leveling device 78 in a non-contact manner are connected to the coarse movement table 32A by driving the pair of X voice coil motors 54X. Moves integrally in the X-axis direction. At this time, since the traction force acts on the weight cancellation device 28 in a plane parallel to the XY plane including the center of gravity position in the Z-axis direction, the moment around the axis (Y-axis) orthogonal to the moving direction (X-axis). (Pitching moment) does not work.
  • the coarse movement tables 32A and 32B, the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like are integrated with the substrate P (holding a part of the substrate P).
  • a moving body that moves in the X-axis direction (hereinafter, referred to as a substrate stage (26, 28, 32A, 32B, PH) as appropriate) is configured.
  • the detailed configuration of the weight cancellation device 28 of the present embodiment including the leveling device 78 and the coupling device 80 is disclosed in, for example, US Patent Application Publication No. 2010/0018950 (however, the present embodiment). Then, since the weight cancellation device 28 does not move in the Y-axis direction, a connecting device in the Y-axis direction is unnecessary). Although not shown, the weight canceling device 28 may be restricted by a connecting device in the Y-axis direction so as not to move alone in the Y-axis direction.
  • the X guide 82 has a rectangular parallelepiped shape with the X-axis direction as the longitudinal direction, as shown in FIGS. 1 and 2.
  • the X guide 82 is disposed and fixed on the upper surfaces (+ Z side surfaces) of the pair of mounts 18 described above so as to cross the pair of mounts 18.
  • the length in the longitudinal direction (X-axis direction) of the X guide 82 is the X-axis direction dimension of each of the pair of mounts 18 arranged at predetermined intervals in the X-axis direction and the X-axis direction dimension of the gap between the pair of mounts 18. It is set somewhat longer (almost equal) than the sum of
  • the upper surface (+ Z side surface) of the X guide 82 is parallel to the XY plane and finished with a very high flatness.
  • the weight canceling device 28 is mounted on the X guide 82 and supported to float (supported in a non-contact state) via the base pad 70.
  • the upper surface of the X guide 82 is adjusted to be substantially parallel to the horizontal plane (XY plane), and functions as a guide surface when the weight cancellation device 28 moves.
  • the longitudinal dimension of the X guide 82 is set to be somewhat longer than the movable amount of the weight canceling device 28 (that is, the coarse motion table 32A) in the X axis direction.
  • the width direction dimension (Y-axis direction dimension) of the upper surface of the X guide 82 is set to a dimension that can face all the bearing surfaces of the plurality of base pads 70 (see FIG. 3).
  • the material and manufacturing method of the X guide 82 are not particularly limited. For example, when formed by casting such as cast iron, when formed by stone (for example, gabbro), ceramics, or CFRP (Carbon Fiber Reinforced Plastics) ) It may be formed of materials.
  • the X guide 82 is a solid member or a hollow member having a rib inside, and the shape thereof is formed by a rectangular parallelepiped member.
  • the X guide 82 is not limited to a rectangular parallelepiped member, but may be a rod-shaped member having an I-shaped YZ cross section.
  • a flat mirror (or a corner cube) having a reflective surface orthogonal to the X axis is provided on the side surface of the substrate holder PH on the ⁇ X side via a mirror holding component (not shown).
  • a pair of X movable mirrors 94X 1 and 94X 2 is fixed.
  • the pair of X movable mirrors 94X 1 and 94X 2 may be fixed to the fine movement stage 26 via a bracket.
  • a Y moving mirror 94Y composed of a long plane mirror having a reflecting surface orthogonal to the Y axis is fixed to the side surface on the ⁇ Y side of fine movement stage 26, as shown in FIG. Has been.
  • the position information of fine movement stage 26 (substrate holder PH) in the XY plane is a laser interferometer system using a pair of X moving mirrors 94X 1 , 94X 2 and Y moving mirror 94Y (hereinafter referred to as a substrate stage interferometer system). 98 (see FIG. 4), for example, it is always detected with a resolution of about 0.5 to 1 nm.
  • the substrate stage interferometer system 98 includes an X laser interferometer (hereinafter abbreviated as an X interferometer) corresponding to a pair of X movable mirrors 94X 1 and 94X 2.
  • X interferometer X laser interferometer
  • Y interferometer 98Y corresponding to 98X and Y movable mirror 94Y.
  • the measurement results of the X interferometer 98X and the Y interferometer 98Y are supplied to the main controller 50 (see FIG. 4).
  • the X interferometer 98X has a pair of X movable mirrors 94X at the upper end of an L-shaped interferometer column 102 whose one end is fixed to the X guide 82 (or the ⁇ X side frame 18). 1, is mounted at a height facing the 94X 2.
  • a pair of interferometers that individually irradiate an interferometer beam (measurement beam) to each of the pair of X movable mirrors 94X 1 and 94X 2 can be used, or the pair of X movable mirrors 94X 1 , 94X 2 can also be used a multi-axis interferometer that emits two measurement beams (measurement beams) irradiated.
  • the X interferometer 98X is configured by a multi-axis interferometer.
  • the Y interferometer 98Y is disposed between the two coarse motion tables 32A and 32B, and faces the Y moving mirror 94Y on the upper surface of the support member 104 whose lower end is fixed to the gantry 18. It is fixed.
  • a pair of interferometers that respectively irradiate the Y moving mirror 94Y with an interferometer beam (measurement beam) can be used, or multi-axis interference that irradiates the Y moving mirror 94Y with two measurement beams.
  • a meter can also be used.
  • the Y interferometer 98Y is configured by a multi-axis interferometer.
  • the Y interferometer 98Y has the surface of the substrate P in the Z-axis direction (focusing and leveling control of the substrate P is performed so that this surface coincides with the image plane of the projection optical system PL during exposure). Therefore, the measurement result of the Y position includes an Abbe error due to the attitude change (rolling) of the fine movement stage 26 when moving in the X-axis direction.
  • Y interferometer 98Y in addition to the two measurement beams separated in the X-axis direction, at least one measurement beam separated in the Z-axis direction with respect to the two measurement beams
  • a multi-axis interferometer that irradiates the Y moving mirror 94Y with at least three interferometer beams (measurement beams) may be used.
  • Main controller 50 detects the amount of rolling of fine movement stage 26 by the multi-axis interferometer, and corrects the Abbe error included in the measurement result of the Y position by Y interferometer 98Y based on the detection result.
  • the positional information regarding the ⁇ x, ⁇ y, and the Z-axis direction of the fine movement stage 26 is the Z tilt measurement system 76 described above (three or more reflective optical sensors 74 not on a straight line fixed to the lower surface of the fine movement stage 26). Thus, it is obtained using the target plate 72 at the tip of the feeler 71 described above.
  • the configuration of the position measurement system of the fine movement stage 26 including the Z tilt measurement system 76 is disclosed in, for example, US Patent Application Publication No. 2010/0018950.
  • the main controller 50 when using an interferometer that does not detect the amount of rolling of the fine movement stage 26 as the Y interferometer 98Y, the main controller 50 relates to the ⁇ y direction of the fine movement stage 26, which is obtained by the Z tilt measurement system 76. Based on the position information (rolling amount), the Abbe error included in the measurement result of the Y position by the Y interferometer 98Y may be corrected.
  • the position information regarding the ⁇ x, ⁇ y, and Z-axis directions of the fine movement stage 26 alone is not measured, and a member above the fine movement stage 26 that can be regarded as being integrated with the projection optical system PL (a part of the body BD, for example, a lens barrel surface plate)
  • the position information regarding the ⁇ x, ⁇ y, and the Z-axis direction of the substrate P may be directly measured from above by an oblique incidence type multi-point focal position detection system (focus sensor) (not shown) fixed to 16).
  • focus sensor oblique incidence type multi-point focal position detection system
  • position information regarding ⁇ x, ⁇ y, and the Z-axis direction between the substrate P and the fine movement stage 26 may be measured.
  • a plurality of alignment detection systems are provided at the lower end portion of the lens barrel surface plate 16 located above the substrate holder PH.
  • a plurality of alignment detection systems are arranged at predetermined intervals in the X-axis and Y-axis directions.
  • the substrate holder PH can pass under a plurality of alignment detection systems by the movement of the fine movement stage 26 in the X-axis direction.
  • At least some of the alignment detection systems may be configured to change the positions in the XY directions according to the arrangement (number of shots, number of chamfers) of the pattern area on the substrate P.
  • Each alignment detection system has, for example, a microscope equipped with a CCD camera.
  • a microscope equipped with a CCD camera When an alignment mark previously provided at a predetermined position on the substrate P enters the field of view of the microscope, alignment measurement is performed by image processing, and alignment is performed.
  • the mark position information (position shift information) is sent to the main controller 50 that controls the position of the movable portion of the substrate stage apparatus PST.
  • FIG. 4 is a block diagram showing the input / output relationship of the main controller 50 that centrally configures the control system of the exposure apparatus 100 and performs overall control of each component.
  • the main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the exposure apparatus 100.
  • the exposure area IA shown in FIGS. 5 to 13 is an illumination area where the illumination light IL is irradiated through the projection optical system PL during exposure, and is not actually formed except during exposure. Is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL.
  • the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate stage device PST is loaded by a substrate carry-in device (not shown).
  • the substrate P is loaded (introduced) upward.
  • the substrate P is exposed to a plurality of alignment marks (for example, four shot areas SA1 to SA4 and a plurality of alignment marks (transferred simultaneously with the pattern of each shot area). (Not shown) is provided for each shot area.
  • the substrate P When the substrate P is loaded onto the substrate stage apparatus PST, the substrate P is placed across the substrate holder PH and the four air levitation units 84 on the + Y side of the substrate holder PH, as shown in FIG. Adsorbs and fixes a part of the substrate P (about 1 ⁇ 2 of the whole substrate P), and the four air levitation units 84 levitate and support a part of the substrate P (about the remaining half of the whole substrate P).
  • the substrate P is + Y of the substrate holder PH and the substrate holder PH so that at least two alignment marks on the substrate P are in the field of view of one of the alignment detection systems and on the substrate holder PH. It is placed across the four air levitation units 84 on the side.
  • the main controller 50 determines the position of the fine movement stage 26 with respect to the projection optical system PL and the approximate position of the substrate P with respect to the fine movement stage 26 by the same alignment measurement method as before. Note that the alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.
  • main controller 50 drives fine movement stage 26 via coarse movement table 32A on the basis of the above measurement result to place at least two alignment marks on substrate P within the field of view of any alignment detection system.
  • the alignment measurement of the substrate P with respect to the projection optical system PL is performed, and the scan start position for exposure of the shot area SA1 on the substrate P is obtained based on the result.
  • the scan start position is strictly an acceleration start position.
  • main controller 50 drives coarse movement tables 32A and 32B and fine movement stage 26 to position substrate P at its scan start position (acceleration start position). At this time, as indicated by a cross arrow in FIG.
  • the fine movement stage 26 (substrate holder PH) has a fine minuteness in the X-axis, Y-axis, and ⁇ z directions (or directions of 6 degrees of freedom) with respect to the coarse movement table 32A.
  • Positioning drive is performed.
  • FIG. 5 shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this way. Thereafter, a step-and-scan exposure operation is performed.
  • the plurality of shot areas SA1 to SA4 on the substrate P are sequentially exposed.
  • the substrate P is accelerated in the X-axis direction for a predetermined acceleration time, and then driven at a constant speed for a predetermined time (exposure (scan exposure) is performed during this constant speed driving), and then the same time as the acceleration time.
  • exposure scan exposure
  • a series of operations of the substrate P is referred to as an X scan operation.
  • the substrate is appropriately driven in the X-axis or Y-axis direction during the step operation (moving between shot areas) (hereinafter referred to as X-step operation and Y-step operation, respectively).
  • the exposure operation is performed as follows.
  • the substrate stage (26, 28, 32A, 32B, PH) is driven in the ⁇ X direction as indicated by the white arrow in FIG. 5, and the X scan operation of the substrate P is performed.
  • the mask M mask stage MST
  • the shot area SA1 is a projection area of the pattern of the mask M by the projection optical system PL. Since it passes through the exposure area IA, scanning exposure for the shot area SA1 is performed at that time. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL while the fine movement stage 26 (substrate holder PH) is moving in the ⁇ X direction at a constant speed. .
  • main controller 50 suctions and fixes a part of substrate P (about 1/2 of the entire substrate P) to substrate holder PH mounted on fine movement stage 26 and places it on coarse movement table 32A.
  • the substrate stage (26, 28, 32A, 32B, PH) is driven in a state where a part of the substrate P (about 1 ⁇ 2 of the entire substrate P) is floated and supported on four air levitation units 84.
  • the main controller 50 drives the coarse motion tables 32A and 32B in the X-axis direction via the X linear motors 42A and 42B based on the measurement results of the X linear encoder systems 46A and 46B, and the substrate stage interference.
  • the fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven.
  • the substrate P is integrated with the fine movement stage 26 and is lifted and supported on the weight cancellation device 28, and is pulled by the coarse movement table 32A to move in the X-axis direction, and from the coarse movement table 32A.
  • the position is precisely controlled in each of the X-axis, Y-axis, Z-axis, ⁇ x, ⁇ y, and ⁇ z directions (6 degrees of freedom direction).
  • main controller 50 synchronizes with fine movement stage 26 (substrate holder PH), and sets mask stage MST for holding mask M on the X axis based on the measurement result of mask interferometer system 14. Scanning is performed in the direction, and minute driving is performed in the Y-axis direction and ⁇ z direction.
  • FIG. 6 shows a state in which the scanning exposure for the shot area SA1 is completed and the substrate stage (26, 28, 32A, 32B, PH) holding a part of the substrate P is stopped.
  • main controller 50 performs the X step operation of substrate P that slightly drives substrate P in the + X direction as shown by the white arrow in FIG. Do.
  • the main controller 50 drives the substrate stage (26, 28, 32A, 32B, PH) in the same state as the X scan operation (however, the positional deviation during movement is a scan operation). (Without as much regulation).
  • FIG. 7 shows a state where the substrate stage (26, 28, 32A, 32B, PH) has moved to the scan start position for exposure of the shot area SA2.
  • Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P.
  • main controller 50 determines -X between substrate P (substrate stage (26, 28, 32A, 32B, PH)) and mask M (mask stage MST).
  • Direction acceleration is started, and scan exposure is performed on the shot area SA2 in the same manner as described above.
  • FIG. 8 shows a state where the scanning exposure for the shot area SA2 is completed and the substrate stage (26, 28, 32A, 32B, PH) is stopped.
  • a Y-step operation for moving the unexposed area of the substrate P onto the substrate holder PH is performed.
  • the main controller 50 sucks and holds the back surface of the + Y side end of the substrate P in the state shown in FIG. 8 by the movable portion 88a of the substrate Y step feeding device 88.
  • the substrate Y step feeding device After releasing the adsorption of the substrate holder PH to the substrate P, the substrate Y step feeding device in a state where the substrate P is levitated by exhausting high-pressure air from the substrate holder PH and continuing high-pressure air exhaust by the air levitation unit 84.
  • the main controller 50 releases the adsorption of the substrate P by the substrate Y step feeding device 88.
  • new alignment measurement of the substrate P with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area provided in advance on the substrate P is performed.
  • the above-described X-step operation of the substrate P is performed as necessary so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 9). .
  • the main controller 50 makes a coarse movement table of the fine movement stage 26 based on the result, as indicated by a cross arrow in FIG. Precise minute positioning drive in the X-axis, Y-axis, and ⁇ z directions (or 6-degree-of-freedom directions) with respect to 32A is performed.
  • FIG. 11 shows a state in which the scanning exposure for the shot area SA3 is completed and the substrate stage (26, 28, 32A, 32B, PH) is stopped.
  • FIG. 12 shows a state where the substrate stage (26, 28, 32A, 32B, PH) has moved to the scan start position for exposure of the shot area SA4.
  • FIG. 13 shows a state where the scanning exposure for the shot area SA4 is completed and the substrate stage (26, 28, 32A, 32B, PH) is stopped.
  • the exposure apparatus 100 repeats the scan exposure and the step operation, thereby exposing the entire substrate P (all the shot areas SA1 to SA4 on the substrate) (overlaying the pattern of the mask M). Alignment transfer) is performed.
  • the order of exposure and the direction of scanning for the shot areas SA1 to SA4 on the substrate P are not limited to the order and direction described above.
  • the irradiation of the illumination light IL onto the substrate P via the projection optical system PL is performed by masking (not shown) so that it is performed only when the mask stage MST and the fine movement stage 26 are moved at a constant speed in the X-axis direction.
  • the position of the blade or the opening and closing of the shutter is performed.
  • the opening width of the masking blade may be made variable so that the width of the exposure area IA can be changed.
  • the substrate P is placed and the substrate holding surface (substrate placing surface) of the substrate holder PH that holds the substrate P in a state where the flatness of the substrate P is secured. Is about half the area of the conventional substrate holder, the substrate holder PH can be reduced in size and weight. Further, the fine movement stage 26 that supports the reduced substrate holder PH is also reduced in size and weight, and the high speed, high acceleration / deceleration drive, and position controllability of the fine movement stage 26 by the voice coil motors 54X, 54Y, and 54Z are improved. It becomes possible.
  • the processing time for flatness of the substrate holding portion is shortened, and the processing accuracy is also improved.
  • the fine movement stage 26 does not perform step movement in the Y-axis direction, and the substrate Y step feed device 88 on the coarse movement table 32A moves only the substrate P in the Y-axis direction with rough accuracy. Therefore, the structure of the coarse motion table 32A is simple and can be reduced in size, weight, and cost.
  • the substrate stage apparatus PST provided in the exposure apparatus 100 according to the present embodiment is effective for a multi-chamfer layout in which a plurality of shot areas are arranged on the substrate P in the cross scan direction (Y-axis direction).
  • the area (total area) of the substrate support surfaces of the air levitation units respectively disposed on the + Y side and the ⁇ Y side of the substrate holder PH is not necessarily about 1 ⁇ 2 of the substrate P.
  • the dimension in the cross scan direction does not necessarily need to be about 1 ⁇ 2 the dimension of the substrate P. That is, the substrate P may be levitated by an air levitation unit having a substrate supporting surface with a smaller area and size.
  • an air bearing structure capable of increasing air rigidity can be used as the air levitation unit, an air bearing structure having low air rigidity is used, and an air current is generated by a fan having a large load capacity. You may make it surface.
  • FIG. 14 schematically shows a configuration of an exposure apparatus 200 according to the second embodiment
  • FIG. 15 shows a plan view in which the exposure apparatus 200 is partially omitted.
  • FIG. 16 a schematic side view of the exposure apparatus 200 viewed from the + X direction is partially omitted.
  • the coarse motion table 32A is shown in a cross-sectional view as in FIG.
  • the exposure apparatus 200 according to the second embodiment is different from the first embodiment described above in that a substrate stage apparatus PSTa is provided instead of the substrate stage apparatus PST described above.
  • the configuration and the like are the same as those in the first embodiment described above.
  • the substrate stage apparatus PSTa eliminates the ⁇ Y side coarse movement table 32B from the two coarse movement tables 32A and 32B provided in the substrate stage apparatus PST.
  • the point that the air floating unit on the ⁇ Y side of the substrate holder PH is not movable but a fixed type is different from the substrate stage apparatus PST described above.
  • the substrate stage apparatus PSTa according to the second embodiment will be described focusing on the differences.
  • an air levitation unit 84A and an air levitation unit 84B are arranged in a pair with a slight gap in the Y-axis direction.
  • the set is arranged in a predetermined order in the X-axis direction.
  • the air levitation unit 84A has a support surface having substantially the same shape and size as the air levitation unit 84 described above, and the air levitation unit 84B has the same length in the Y-axis direction as the air levitation unit 84A and is in the X-axis direction.
  • the support surface has a length of about 1/3.
  • the air levitation units 84A and 84B are both configured in the same manner as the air levitation unit 84.
  • four sets of air levitation units 84A and three sets of air levitation units 84B are used, for a total of seven sets.
  • a total of seven sets of air levitation units 84A and 84B have a width in the Y-axis direction that is about 1 ⁇ 2 of the width in the Y-axis direction of the substrate P, and a length in the X-axis direction that moves when the substrate holder PH is scanned. They are arranged at a predetermined interval in the X-axis direction within a rectangular region having a length substantially equal to the range.
  • a total of seven sets of air levitation units 84A and 84B are fixed on a frame 110 fixed to the floor F so as not to contact the gantry 18, as shown in FIG.
  • Air levitation unit 84B is disposed.
  • a pair of air levitation units 84B and a pair of air levitation units 84A adjacent to the one set of air levitation units 84B are spaced from each other in the X axis direction from the Y interferometer 98Y through a gap between the air levitation units 84A on both sides in the X axis direction.
  • a measurement beam is applied to the Y moving mirror 94Y.
  • the Y interferometer 98Y is fixed to the side frame 20 of the body BD located on the ⁇ Y side of the seven sets of air levitation units 84A and 84B.
  • a multi-axis interferometer capable of measuring the amount of rolling of the fine movement stage 26 is used (see FIG. 16).
  • the movable portion of the leveling device 78 can be tilted to the Z slider 68 of the weight cancellation device 28 with a slight stroke around an axis in the horizontal plane (for example, the X axis and the Y axis). Is attached.
  • the upper surface (the upper half of the spherical surface) is fixed to the fine movement stage 26, and the Z slider 68 has a concave portion that allows rotation (inclination) of the leveling device 78 in the ⁇ x and ⁇ y directions. It may be formed.
  • the leveling device 78 has a lower surface (lower half of the spherical surface) fixed to the Z slider 68, for example, and a recess that allows the fine movement stage 26 to tilt in the ⁇ x direction and the ⁇ y direction with respect to the leveling device 78 is finely moved. It may be formed on the stage 26.
  • the leveling device 78 is supported by the Z slider 68 from below and allows the fine movement stage 26 to tilt within a minute angle range around an axis (for example, the X axis and the Y axis) in the horizontal plane.
  • the Z slider 68 also serves as a fixing portion of the leveling apparatus 78, no sealing pad is provided, and the weight cancellation apparatus 28 is integrated with the fine movement stage 26. Further, since the weight canceling device 28 is integrated with the fine movement stage 26, there is no connecting device 80 (flexure device) or the like that restricts the single motion of the weight canceling device 28.
  • the configuration of the other parts of the substrate stage apparatus PSTa is the same as that of the substrate stage apparatus PST.
  • the same effects as those of the exposure apparatus 100 according to the first embodiment described above can be obtained, and the ⁇ Y side of the substrate holder PH can be obtained. Since the air levitation units 84A and 84B are not mounted on the coarse motion table 32B and are fixed to the separately placed frame 110, the air levitation units 84A and 84B do not block the measurement beam of the Y interferometer 98Y.
  • the Y moving mirror 94Y may be attached to the side surface of the substrate holder PH or the fine movement stage 26 via a bracket.
  • FIG. 17 shows a plan view of a substrate stage device PSTb included in the exposure apparatus according to the third embodiment together with a part of the body BD
  • FIG. 18 shows the exposure apparatus according to the third embodiment.
  • a schematic side view seen from the + X direction is partially omitted.
  • the coarse motion table 32 ⁇ / b> A (and 32 ⁇ / b> B) is shown in a cross-sectional view, as in FIG. 16 described above.
  • the substrate stage apparatus PSTb is provided with two coarse movement tables 32A and 32B as in the substrate stage apparatus PST according to the first embodiment described above.
  • the coarse table 32B is not equipped with an air levitation unit.
  • the air levitation unit on the ⁇ Y side of the substrate holder PH is a separate frame. 110 is attached to the entire range of movement of the substrate holder PH in the X direction (see FIG. 17). Also in this case, a total of seven sets of air levitation units 84A and 84B arranged in the same manner as in the second embodiment are used as the ⁇ Y side air levitation units.
  • a part of the pair of X voice coil motors 54X and the plurality of Z voice coil motors 54Z includes the coarse movement table 32B and the fine movement stage 26. Between.
  • the Y moving mirror 94Y is disposed on the ⁇ Y side side surface of the substrate holder PH at a position substantially the same as the X moving mirrors 94X 1 and 94X 2, and the ⁇ Y of the fine movement stage 26 is passed through the bracket 96A. It is fixed to the side surface. In this case, since an Abbe error does not occur, the Y interferometer 98Y may not necessarily be able to measure the rolling amount.
  • the weight canceling device 28 is integrated with the fine movement stage 26.
  • the configuration of other parts of the substrate stage apparatus PSTb and the configuration of each part other than the substrate stage apparatus PSTb are the same as those in the first embodiment or the second embodiment described above.
  • the same effects as those of the exposure apparatuses 100 and 200 according to the first and second embodiments described above can be obtained, and the fine movement stage 26 is provided.
  • the X voice coil motor 54X and the Z voice coil motor 54Z to be driven can be mounted in a balanced manner on both the coarse motion tables 32A and 32B, and a motor arrangement having higher rigidity than that of the second embodiment is possible. (See FIG. 18).
  • the present invention is not limited to this, and the coarse motion tables 32A and 32B are integrated as shown in FIG.
  • the coarse motion table 32 as described above may be provided, and the coarse motion table 32 may be slidably mounted on the two X beams 30A and 30B.
  • the air levitation unit on at least one side of the substrate holder PH in the Y-axis direction is mounted on the coarse motion table 32A or 32 and the X-axis direction.
  • the present invention is not limited to this, and another moving body that moves following the coarse movement table is provided, and an air levitation unit is mounted on the other moving body so as to be movable in the X-axis direction. It is good also as a structure.
  • another moving body that moves along the + Y side of the movement path of the coarse movement table 32A and / or the movement path on the ⁇ Y side of the movement path of the coarse movement table 32B is provided.
  • the air levitation unit may be mounted on the other moving body in the state of being close to the substrate holder PH in the Y-axis direction, for example, via an inverted L-shaped support member.
  • FIG. 20 shows a plan view of a substrate stage device PSTc included in the exposure apparatus according to the fourth embodiment together with a part of the body
  • FIG. 21 shows the exposure apparatus according to the fourth embodiment.
  • a schematic side view of 20 viewed from the + X direction is partially omitted.
  • the integrated coarse motion table 32 is slidably mounted on the two X beams 30A and 30B as in FIG. No air levitation unit is mounted on 32.
  • the coarse motion table 32 is shown in a sectional view.
  • the ⁇ Y side and + Y side air levitation units of the substrate holder PH are frames installed on the floor surface F so as not to contact the gantry 18 like the ⁇ Y side air levitation units of the second and third embodiments. It is fixed to each of 110A and 110B. Further, as shown in FIG.
  • each of the ⁇ Y side and + Y side air levitation units of the substrate holder PH has a width in the Y axis direction that is approximately 1 ⁇ 2 of the width in the Y axis direction of the substrate P, and the X axis.
  • the length in the direction is arranged within a rectangular region having a length substantially equal to the moving range when the substrate holder PH is scanned, with a predetermined gap in the X-axis direction and a slight gap in the Y-axis direction. ing.
  • a total of seven sets of air levitation units 84A and 84B arranged in the same manner as in the second and third embodiments are used as the ⁇ Y side air levitation units.
  • the + Y side air levitation unit as shown in FIG. 20, four sets (total of eight) air levitation units 84D arranged in the rectangular area with a predetermined gap in the X-axis direction. Is used.
  • the air levitation unit 84D is configured in the same manner as the air levitation unit 84 described above, and the width in the Y-axis direction is the same as that of the air levitation unit 84, but the length in the X-axis direction is somewhat longer than the air levitation unit 84.
  • a plurality of (three in FIG. 20) substrate Y step feeding devices 88 described above are provided in the X-axis direction on the frame 110A to which the four sets of air floating units 84D on the + Y side are fixed. .
  • a plurality of substrate Y step feeding devices 88 are provided. Each substrate Y step feeding device 88 is disposed in a gap between air levitation units 84D adjacent in the X-axis direction.
  • each substrate Y step feeding device 88 can adsorb the substrate P levitated on the air levitation unit 84D and move it in the Y-axis direction, and releases the adsorption and separates it from the substrate P. Can be done.
  • the configuration of other parts of the substrate stage apparatus PSTc and the configuration of each part other than the substrate stage apparatus PSTc are the same as those in the first, second, or third embodiment described above.
  • the same effect as the exposure apparatus according to each of the embodiments described above can be obtained, and not only the ⁇ Y side of the substrate holder PH but also + Y Since the air levitation unit 84D and the substrate Y step feeding device 88 located on the side are separated from the coarse motion table 32 and fixed on the frame 110A, the load applied to the coarse motion table 32 is reduced and the coarse motion is reduced. The thrust for driving the table 32 can be reduced.
  • FIG. 22 schematically shows a configuration of an exposure apparatus 500 according to the fifth embodiment
  • FIG. 23 shows a plan view in which the exposure apparatus 500 is partially omitted
  • 24 is a schematic side view of the exposure apparatus 500 viewed from the + X direction in FIG. In FIG. 24, the coarse motion table 32 is shown in a sectional view.
  • the exposure apparatus 500 according to the fifth embodiment is basically configured in the same manner as the exposure apparatus according to the fourth embodiment described above, but the substrate stage apparatus PSTd is the same as that of the fourth embodiment. This is partly different from the substrate stage apparatus PSTc. Specifically, the substrate stage apparatus PSTd differs from the substrate stage apparatus PSTc in the mounting position of the pair of X movable mirrors 94X 1 and 94X 2 on the fine movement stage 26, and the configuration of the X interferometer is corresponding to this. Etc. are different from the substrate stage apparatus PSTc.
  • the exposure apparatus 500 according to the fifth embodiment will be described below with a focus on the differences.
  • the pair of X moving mirrors 94X 1 and 94X 2 are respectively in the X axis direction on both side surfaces in the Y axis direction of the fine movement stage 26 via moving mirror support parts (not shown). It is attached near the center.
  • a pair of X interferometers 98X 1 and 98X 2 facing each of the pair of X movable mirrors 94X 1 and 94X 2 are provided corresponding to the pair of X movable mirrors 94X 1 and 94X 2 . As shown in FIG.
  • each of the pair of X interferometers 98X 1 and 98X 2 has an L-shaped frame (X interferometer) with one end portion (lower end portion) fixed to the ⁇ X side frame 18.
  • Frames) 102A and 102B are individually fixed to the other ends (upper ends).
  • L-shaped frames are used as the frames 102A and 102B in order to avoid interference with the above-described frames 110A and 110B and the coarse motion table 32 moving in the X-axis direction.
  • the pair of X movable mirrors 94X 1 and 94X 2 is located at a position lower than the upper surface (front surface) of the substrate P on the + X side than the ⁇ X side end surface of the substrate holder PH, specifically, slightly lower than the lower surface of the substrate holder PH. It is provided at a low position.
  • the pair of X interferometers 98X 1 and 98X 2 is located at a position lower than the upper surface of the substrate P, and the substrate holder PH and the air floating unit 84D or 84A in the Y-axis direction. It is arranged at a position that fits in the gap.
  • the pair of X interferometers 98X 1 and 98X 2 is, for example, an X interferometer (a pair of X interferometers) as can be seen by comparing FIG. 23 and FIG.
  • the interferometers 98X 1 and 98X 2 ) can be arranged closer to the ⁇ X side mount 18 than the X interferometer 98X according to the fourth embodiment (and the first to third embodiments). It becomes.
  • the substrate stage device Pstd as shown in FIG. 23, + a X movable mirror 94X 1 of Y side, the fine motion stage 26 so that the Y voice coil motors 54Y that finely drives the Y-axis direction, do not interfere
  • a pair of Y voice coil motors 54 ⁇ / b> Y are attached at positions close to the center (center) of fine movement stage 26 in the X-axis direction.
  • a pair of Y voice coil motors 54Y may be anywhere mounting.
  • both side surfaces of the fine movement stage 26 in the X-axis direction may be used.
  • the positions of the pair of Y voice coil motors 54Y are preferably arranged so that the resultant force of the driving force acts on the position of the center of gravity of the fine movement stage 26, that is, the center of gravity of the fine movement stage 26 can be driven. .
  • the same effects as those of the exposure apparatus according to the fourth embodiment described above can be obtained, and a pair of X interferometers 98X 1 and 98X. 2 can be disposed closer to the ⁇ X side frame 18 than the X interferometer 98X according to the fourth embodiment (and the first to third embodiments).
  • a pair of X interferometers 98X 1 and 98X. 2 can be disposed closer to the ⁇ X side frame 18 than the X interferometer 98X according to the fourth embodiment (and the first to third embodiments).
  • the total weight of 102B is lighter than the weight of the interferometer column 102, and the rigidity is increased.
  • FIG. 25 is a plan view in which a part of the exposure apparatus according to the sixth embodiment is omitted.
  • FIG. 26 is a partially omitted XZ sectional view of the exposure apparatus according to the sixth embodiment.
  • the exposure apparatus according to the sixth embodiment is basically configured in the same manner as the exposure apparatus according to the fifth embodiment described above, but the substrate stage apparatus PSTe is according to the fifth embodiment. This is partly different from the substrate stage device PSTd.
  • the substrate stage apparatus PSTe as shown in FIG. 25, as the substrate holder PH, not only the size in the Y axis direction but also the size in the X axis direction is larger than the size of the substrate P in the X axis direction. For example, about 1/2 of the substrate P is used.
  • a pair of air levitation units (moving air levitation units) 84C are disposed on both sides of the substrate holder PH in the X-axis direction. As shown in FIG. 26, each of the pair of air levitation units 84 ⁇ / b> C has the coarse motion table 32 through the support member 112 so that the upper surface thereof is almost the same height (slightly lower) as the substrate holder PH. It is fixed on the top surface.
  • Each of the pair of air levitation units 84C has, for example, a length in the Y-axis direction that is equivalent to (or slightly shorter than the substrate holder PH) the length in the X-axis direction and substantially the same as that in the substrate holder PH. Or rather short.
  • the pair of X movable mirrors 94X 1 and 94X 2 are supported by a movable mirror (not shown) near both ends in the Y-axis direction on the ⁇ X side surface of the substrate holder PH. It is fixed via a member.
  • the configuration of other parts of the substrate stage apparatus PSTe is the same as that of the substrate stage apparatus PSTd according to the fourth embodiment.
  • the pair of X interferometers 98X 1 and 98X 2 does not interfere with the fixed air levitation unit (84A, 84B) and the air levitation unit 84C on the coarse motion table 32, as in the fifth embodiment.
  • the arrangement is such that the pair of X movable mirrors 94X 1 and 94X 2 can be approached.
  • the pair of X interferometers 98X 1 and 98X 2 may be attached near the center in the X-axis direction on both side surfaces of the substrate holder PH, as in the fifth embodiment. In such a case, the X interferometers 98X 1 and 98X 2 can be further arranged on the + X side. Further, the pair of X movable mirrors 94X 1 and 94X 2 may be attached to the fine movement stage 26 instead of the substrate holder PH via the X movable mirror support frame.
  • the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate stage device PSTe is loaded by a substrate carry-in device (not shown).
  • the substrate P is carried in upward.
  • the substrate P is exposed to a plurality of shot areas SA1 to SA4, for example, two in the X-axis direction and two in the Y-axis direction.
  • a plurality of alignment marks (not shown) transferred simultaneously with the pattern of each shot area are provided for each shot area.
  • the substrate P is placed across the substrate holder PH, a part of the + Y side fixed air levitation units 84D, and the + X side air levitation unit 84C.
  • high-pressure air is ejected from the upper surfaces of the substrate holder PH, the air levitation unit 84D, and the air levitation unit 84C, and the substrate P is supported to be levitated.
  • the main controller 50 switches the substrate holder PH from exhaust to intake (suction).
  • a part of the substrate P (about 1 ⁇ 4 of the whole substrate P corresponding to the rectangular area including the shot area SA1) is sucked and fixed by the substrate holder PH, and a part of the plurality of air levitation units 84D and the air levitation unit A part of the substrate P (about 3/4 of the entire substrate P) is levitated and supported by 84C. Then, an alignment operation is performed by the same method as in the first embodiment described above (see FIG. 26).
  • FIG. 26 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA1 is completed.
  • the main controller 50 sucks the back surface of the substrate P by using the movable portion 88a (not shown in FIG. 27, see FIG. 25) of the substrate Y step feeding device 88 at the position facing the substrate P at that time. Then, after the adsorption of the substrate P by the substrate holder PH is released, the substrate P is floated by exhausting high-pressure air from the substrate holder PH and continuing high-pressure air exhausting by the + X side air levitation unit 84C. As a result, the substrate P is held only by the movable portion 88a of the substrate Y step feeding device 88.
  • main controller 50 maintains the substrate stage (26, 28, 32, PH) in FIG. 27 while maintaining the holding state of substrate P only by movable portion 88a of substrate Y step feeding device 88.
  • the X step of the substrate P which is driven in the + X direction, is started. Accordingly, the substrate holder PH moves in the + X direction with respect to the substrate P while the substrate P is stopped at the position before the start of the X step. Then, when the substrate holder PH reaches just below the next shot area SA2 of the substrate P, the main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 28).
  • the substrate P is placed across the substrate holder PH, a part of the + Y side fixed air levitation units 84D, and the ⁇ X side air levitation unit 84C.
  • High-pressure air is ejected from the substrate holder PH, a part of the plurality of air levitation units 84D, and the upper surface of the air levitation unit 84C, and the substrate P is levitated and supported.
  • the main controller 50 In parallel with the driving of the substrate stage (26, 28, 32, PH) for the X step of the substrate P, the main controller 50 returns the mask stage MST to a predetermined acceleration start position.
  • FIG. 29 shows a state where the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA2.
  • the Y step operation of the substrate P is performed by the substrate Y step feeding device 88, the alignment by alignment is performed, and the scan exposure is repeatedly performed.
  • the exposure apparatus according to the sixth embodiment can obtain the same effects as those of the exposure apparatus 500 according to the fifth embodiment described above.
  • the size of the substrate holder PH is set to be equal to one shot area (collective exposure area), and the other areas are levitated and supported by the air levitation unit. Therefore, the substrate holder PH mounted on the fine movement stage 26 is smaller and lighter than the first to fifth embodiments.
  • the substrate stage (26, 28, 32, PH) only scans one shot area, the stroke of the substrate stage (26, 28, 32, PH) in the X-axis direction is the first to the fifth. It becomes shorter (about 1/2) than the embodiment. Accordingly, it is possible to further reduce the size and weight of the substrate stage apparatus, and thus the exposure apparatus including the substrate stage apparatus, and to reduce the cost.
  • the substrate P is left, and the substrate stage (26, 28, 32, PH) is moved in the + X direction for exposure of the next shot area. (See FIGS. 27 and 28), leaving the substrate stage (26, 28, 32, PH), the substrate X step feed device (not shown) moves only the substrate in the ⁇ X direction, and then the substrate stage ( (26, 28, 32, PH), exposure may be performed by scanning in the + X direction.
  • the substrate X step feeding device may also serve as a substrate P loading / unloading device.
  • the air levitation unit separated from the coarse movement stage is fixed to the floor surface through the frame. May be fixed to the gantry 18.
  • the substrate stage apparatus and exposure apparatus are summarized as follows.
  • the substrate holder that adsorbs the substrate and corrects the plane is not made the same size as the substrate as in the conventional device, but the same width (size in the Y-axis direction) as the exposure field by the projection optical system.
  • the length in the scanning direction (X-axis direction) is equal to the length of the substrate in the X-axis direction or the same as the scanning length of the collective exposure region exposed by a single scanning operation. Then, the portion of the substrate that protrudes from the substrate holder is levitated and supported by a moving or fixed air levitation unit.
  • the substrate holder is small, light and easy to achieve high precision (high flatness), and the controllability (position speed controllability, etc.) of the fine movement stage is improved, so that high precision and high speed can be achieved.
  • the coarse movement table is a table (stage) that moves only in one axial direction (X-axis direction) with respect to the exposure field (irradiation area (exposure position) of illumination light IL), the coarse movement stage portion is simple. This makes it possible to reduce the cost.
  • the step movement of the substrate in the Y direction is light because the substrate Y step feed device moves only the substrate in the Y direction. Further, since the Y step positioning of the substrate is performed with rough accuracy, the cost of the substrate Y step feeding device is also low. Since the coarse movement stage portion with a simple configuration is separated from the fine movement stage, rough accuracy is sufficient, and the components including the rough accuracy movable portion (such as the coarse movement stage portion and the substrate Y step feeding device) are not included. It can be made using general industrial materials without using a lightweight, high-rigidity ceramic member. Therefore, there is no need for a large firing furnace required to increase the size of a lightweight and highly rigid ceramic member, and a large grinding machine required to process the ceramic member with high accuracy.
  • the component including the movable portion with rough accuracy can be made using a rolling guide with a ball or a roller without using any of a highly accurate guide and a highly rigid static pressure gas bearing.
  • the components including the moving parts with rough accuracy can be used without using a coreless linear motor (voice coil motor) with high thrust and low ripple, which is required for high-precision positioning at high speed.
  • a linear motor, ball screw drive, belt drive, or the like that is relatively inexpensive and easy to increase in size can be used.
  • vibration transmission to the fine movement stage can be suppressed by arranging the fine movement stage and the coarse movement stage separately.
  • the positioning after the step movement in the X and Y directions is performed by detecting the alignment mark provided on the substrate in advance with the alignment detection system and moving the fine movement stage based on the detection result. Also, the positioning accuracy during exposure is high.
  • FIG. 30 schematically shows a configuration of an exposure apparatus 700 according to the seventh embodiment, omitting an air levitation unit group and the like which will be described later, and FIG. 31 partially omits the exposure apparatus 700.
  • a plan view is shown.
  • FIG. 31 corresponds to a plan view of a portion below the projection optical system PL in FIG. 30 (portion below the lens barrel surface plate).
  • FIG. 32 shows a side view of the exposure apparatus 700 as viewed from the + X direction in FIG. 30 (partially omitted, partially sectional view).
  • FIG. 33 is a block diagram showing the input / output relationship of the main controller 50 that centrally configures the control system of the exposure apparatus 700 and performs overall control of each component. In FIG. 33, each component related to the substrate stage system is shown.
  • the main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the exposure apparatus 700.
  • the exposure apparatus 700 according to the seventh embodiment is different from the first embodiment described above in that a substrate stage apparatus PSTf is provided instead of the substrate stage apparatus PST described above.
  • the configuration and the like are the same as those in the first embodiment described above.
  • the configuration of the substrate stage apparatus PSTf is the same as that of the substrate stage apparatus PSTd included in the exposure apparatus 500 according to the fifth embodiment described above, among the substrate stage apparatuses PST, PSTa, PSTb, PSTc, PSTd, and PSTe described so far. Closest to the configuration. Therefore, hereinafter, the substrate stage apparatus PSTf included in the exposure apparatus 700 according to the seventh embodiment will be described focusing on differences from the substrate stage apparatus PSTd.
  • the substrate stage apparatus PSTf includes the size of the substrate holder PH (fine movement stage 26), the arrangement of air levitation unit groups arranged on both sides of the substrate holder PH in the Y-axis direction, and It differs from the substrate stage apparatus PSTd in that the substrate X step feeding device 91 is arranged in the arrangement area of the air levitation unit group on both sides in the Y axis direction. 24 and 32, the width of the pair of X beams 30A and 30B in the substrate stage apparatus PSTf in the Y-axis direction is narrower than the width of the pair of X beams in the substrate stage apparatus PSTd. (Almost half).
  • the X linear guide 36 has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction, and also serves as an X stator.
  • an X stator having a magnet unit may be provided.
  • a plurality of, for example, two X linear guides may be provided on the X beams 30A and 30B.
  • the coarse motion table 32 is disposed on the X beams 30A and 30B in the same manner as the substrate stage apparatus PSTd described above.
  • the coarse motion table 32 is made of a plate member having a rectangular shape in plan view and having an opening penetrating in the Z-axis direction at the center.
  • the coarse motion table 32 is partially shown in a sectional view together with the weight canceling device 28.
  • On the lower surface of the coarse motion table 32 as shown in FIG. 32, there are four sliders 44, for example, four (see FIG. 30) at predetermined intervals in the X-axis direction with respect to each X linear guide 36. It is fixed.
  • the coarse motion table 32 is guided linearly in the X-axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.
  • each slider 44 includes a coil unit, and the coarse motion table 32 is driven with a predetermined stroke in the X-axis direction together with the above-described X stator by a total of eight coil units included in each slider 44.
  • An X linear motor 42 (see FIG. 33) is configured.
  • An X mover may be provided separately from the slider 44.
  • the slider 44 includes rolling elements (for example, a plurality of balls) and is slidable with respect to each X linear guide 36. You may engage.
  • an X scale having a periodic direction in the X axis direction is fixed to a predetermined one of the X beams 30A and 30B, for example, the X beam 30A
  • the encoder head constituting the X linear encoder system 46 for obtaining the position information in the X axis direction of the coarse motion table 32 using the X scale is fixed.
  • the position of the coarse movement table 32 in the X-axis direction is controlled by the main controller 50 (see FIG. 33) based on the output of the encoder head.
  • the substrate holder PH mounted on the upper surface of the fine movement stage 26 will be explained.
  • the substrate holder PH has the same length in the X-axis direction as that of the substrate P, and the width (length) in the Y-axis direction is about 1/3 of the substrate P.
  • the substrate holder PH adsorbs and holds a part of the substrate P (here, a portion of about 1/3 of the substrate P in the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption) and a pressurized gas (for example, High pressure air) is ejected upward, and a part of the substrate P (about 1/3 of the substrate P) can be supported non-contacting (floating) from below by the ejection pressure.
  • Switching between high-pressure air ejection and vacuum suction to the substrate P by the substrate holder PH is performed via a holder intake / exhaust switching device 51 (see FIG. 33) that switches and connects the substrate holder PH to a vacuum pump and a high-pressure air source (not shown). This is performed by the main controller 50.
  • fine movement stage 26 includes a plurality of voice coil motors (or linear motors), for example, a pair of X voice coil motors 54X, a pair of Y voice coil motors 54Y, and four Z voice coil motors 54Z.
  • the fine movement stage drive system 52 (see FIG. 33) configured in the same manner as in the first embodiment described above includes six degrees of freedom directions (X axis, Y axis, Z axis, ⁇ x, It is slightly driven in each direction of ⁇ y and ⁇ z.
  • the fine movement stage 26 is provided with the projection optical by the above-described X linear motor 42 and the pair of X voice coil motor 54X and Y voice coil motor 54Y of the fine movement stage drive system 52.
  • the system PL With respect to the system PL (see FIG. 30), it can be moved (coarse movement) with a long stroke in the X-axis direction, and can be slightly moved (fine movement) in the three-degree-of-freedom directions of the X-axis, Y-axis, and ⁇ z directions.
  • the width (length) in the Y-axis direction is larger on the + Y side of the X beam 30A and on the ⁇ Y side of the X beam 30B than in the frame of the fifth embodiment described above.
  • Each of the pair of frames 110 ⁇ / b> A and 110 ⁇ / b> B is installed on the floor surface F so as not to contact the gantry 18.
  • Air levitation unit groups 84E and 84F are installed on the upper surfaces of the pair of frames 110A and 110B, respectively.
  • the pair of frames 110 ⁇ / b> A and 110 ⁇ / b> B may be installed on the gantry 18.
  • the air levitation unit groups 84E and 84F are arranged on both sides of the substrate holder PH in the Y-axis direction, as shown in FIGS.
  • each of the air levitation unit groups 84E and 84F has a width in the Y-axis direction equal to the width in the Y-axis direction of the substrate P, and the length in the X-axis direction is scanned by the substrate holder PH.
  • It is composed of a plurality of air levitation units that are dispersedly arranged in a rectangular region having a length substantially equal to the moving range when moving, with a predetermined gap in the X-axis direction and a slight gap in the Y-axis direction. Yes.
  • the X positions of the center of the exposure area IA and the centers of the air levitation unit groups 84E and 84F substantially coincide.
  • the upper surface of each air levitation unit is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.
  • the air levitation units constituting the air levitation unit groups 84E and 84F are different in size, but are configured in the same manner as the air levitation unit 84 according to the first embodiment described above. ON / OFF of the supply of high-pressure air to each air levitation unit is controlled by the main controller 50 shown in FIG.
  • the entire substrate P is levitated by the substrate holder PH and at least one of the air levitation unit groups 84E and 84F on both sides ( ⁇ Y side) of the substrate holder PH. Can be supported. Further, the entire substrate P can be levitated and supported by the air levitation unit group 84E or 84F on one side (+ Y side or ⁇ Y side) of the substrate holder PH.
  • Each of the air levitation unit groups 84E and 84F has the same width in the Y-axis direction as that of the substrate P in the Y-axis direction and the length in the X-axis direction when the substrate holder PH is scanned. If it has a total support area that is almost the same as a rectangular area that is almost the same length as the moving range, it may be replaced with a single large air levitation unit, and the size of each individual air levitation unit Different from the case of FIG. 31, it may be distributed in the rectangular area.
  • Three substrate Y step feeding devices 88 and one substrate X step feeding device 91 are arranged asymmetrically with respect to the X axis passing through the center of the exposure area IA (the center of the projection optical system PL).
  • Each of the substrate Y step feeding device 88 and the substrate X step feeding device 91 is arranged in the two rectangular regions without interfering with the air floating unit.
  • the number of substrate Y step feeding devices 88 may be two, or four or more.
  • the substrate Y step feeding device 88 is a device for holding (for example, adsorbing) the substrate P and moving it in the Y-axis direction.
  • the substrate Y step feeding device 88 is arranged in each of the air levitation unit groups 84E and 88F in the X-axis direction. Three are arranged at predetermined intervals.
  • Each substrate Y step feeding device 88 is fixed on a frame 110A or 110B via a support member 89 (see FIG. 32).
  • Each substrate Y step feeding device 88 includes a movable portion 88a that attracts the back surface of the substrate P and moves in the Y-axis direction, and a fixed portion 88b fixed to the frame 110A or 110B.
  • the movable portion 88a is driven by a driving device 90 (not shown in FIG. 32, see FIG. 33) configured by a linear motor including a mover provided in the movable portion 88a and a stator provided in the fixed portion 88b. , Driven in the Y-axis direction with respect to the frame 110A or 110B.
  • the substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 32, see FIG. 33) such as an encoder for measuring the position of the movable portion 88a.
  • the moving stroke of the movable portion 88a of each substrate Y step feeding device 88 in the Y-axis direction is about 2/3 (somewhat shorter) of the length of the substrate P in the Y-axis direction.
  • the movable portion 88a (substrate adsorption surface) of each substrate Y step feeding device 88 needs to adsorb the back surface of the substrate P or release the adsorption to separate it from the substrate P. Therefore, the driving device 90 is configured to be able to be driven minutely in the Z-axis direction.
  • the movable portion 88a adsorbs the substrate P and moves in the Y-axis direction.
  • the substrate Y step feeding device 88 and the movable portion 88a Are used without distinction.
  • the substrate X step feeding device 91 is a device for holding (for example, adsorbing) the substrate P and moving it in the X-axis direction.
  • One substrate X step feeding device 91 is disposed in each of the air levitation unit groups 84E and 84F in plan view. .
  • Each substrate X step feeding device 91 is fixed on a frame 110A or 110B via a support member 93 (see FIG. 32).
  • each substrate X step feeding device 91 includes a movable portion 91a that sucks the back surface of the substrate P and moves in the X-axis direction, and a fixed portion 91b fixed to the frame 110A or 110B. ing.
  • the movable portion 91a is driven in the X-axis direction with respect to the frame 110A or 110B by a driving device 95 (not shown in FIG. 32, see FIG. 33) configured by, for example, a linear motor.
  • the substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIG. 32, see FIG. 33) such as an encoder for measuring the position of the movable portion 91a.
  • the drive device 95 is not limited to a linear motor, and may be configured by a drive mechanism that uses a rotary motor using a ball screw or a belt as a drive source.
  • the movement stroke in the X-axis direction of the movable portion 91a of each substrate X step feeding device 91 is, for example, about twice the length of the substrate P in the X-axis direction.
  • the + X side end of each fixing portion 91b protrudes from the air levitation unit group 84E, 84F to the + X side by a predetermined length.
  • each substrate X step feeding device 91 needs to adsorb the back surface of the substrate P or release the adsorption to separate it from the substrate P, the drive device 95 performs Z It is configured so that it can be driven minutely in the axial direction. Actually, the movable portion 91a adsorbs the substrate P and moves in the X-axis direction. However, in the following, the substrate X step feeding device 91 and the movable portion 91a Are used without distinction.
  • the movable parts of the substrate Y step feeding device 88 and the substrate X step feeding device 91 need to be separated from and contacted with the substrate P, they can also move in the Z-axis direction.
  • the present invention is not limited to this, and the substrate holder PH (fine movement stage 26) that holds and holds a part of the back surface of the substrate P for the adsorption of the substrate P by the movable portion (substrate adsorption surface) and the separation from the substrate P. May move in the Z-axis direction.
  • the weight canceling device 28 supports the fine movement stage 26 from below via a leveling device 78.
  • the weight canceling device 28 is disposed in the opening of the coarse motion table 32, and its upper half is exposed above the coarse motion table 32 and its lower half is exposed below the coarse motion table 32. .
  • the weight canceling device 28 includes a housing 64, an air spring 66, a Z slider 68, and the like, and is configured in the same manner as the above-described second and subsequent embodiments, for example. . That is, in the substrate stage device PSTf according to the seventh embodiment, the Z slider 68 also serves as a fixing portion of the leveling device 78, no sealing pad is provided, and the weight cancellation device 28 is integrated with the fine movement stage 26. ing. Further, since the weight canceling device 28 is integrated with the fine movement stage 26, there is no connecting device 80 (flexure device) or the like that restricts the single motion of the weight canceling device 28.
  • Fine movement stage 26 can be tilted on Z slider 68 by a leveling device 78 having a spherical bearing or a pseudo spherical bearing structure schematically shown as a spherical member in FIG. 32 ( ⁇ x and ⁇ y with respect to the XY plane). It can be swung in the direction).
  • a leveling device 78 having a spherical bearing or a pseudo spherical bearing structure schematically shown as a spherical member in FIG. 32 ( ⁇ x and ⁇ y with respect to the XY plane). It can be swung in the direction).
  • the weight canceling device 28 and the upper constituent parts (the fine motion stage 26 and the substrate holder PH) supported by the weight canceling device 28 via the leveling device 78 are operated by the pair of X voice coil motors 54X to operate the coarse motion table 32. And move in the X-axis direction. That is, the upper components (fine movement stage 26, substrate holder PH, etc.) are supported by the weight canceling device 28 by the main controller 50 using a pair of X voice coil motors 54X and are synchronously driven (coarse) by the coarse movement table 32. And is driven at the same speed in the same direction as the moving table 32), and moves with the coarse moving table 32 in the X-axis direction with a predetermined stroke.
  • the upper components are controlled by main controller 50 via a pair of X voice coil motors 54X, a pair of Y voice coil motors 54Y, and four Z voice coil motors 54Z.
  • the coarse movement table 32 is slightly driven in the direction of six degrees of freedom.
  • a moving body (hereinafter referred to as a substrate as appropriate) including the coarse movement table 32, the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like, which moves integrally with the substrate P in the X-axis direction. Stages (denoted as 26, 28, 32, PH) are configured.
  • the fine movement stage 26 has reflection surfaces orthogonal to the X axis in the vicinity of the center in the X axis direction on both side surfaces in the Y axis direction via movable mirror support parts (not shown).
  • a pair of X movable mirrors 94X 1 , 94X 2 composed of plane mirrors (or corner cubes) are attached in the same manner as in the fifth embodiment.
  • Y movable mirror 94Y composed of a long plane mirror having a reflecting surface orthogonal to the Y axis via a mirror holding part (not shown). Is fixed.
  • the positional information of the fine movement stage 26 (substrate holder PH) in the XY plane is set to, for example, 0.5 by the substrate stage interferometer system 98 (see FIG. 33) as in the above-described embodiments. It is always detected with a resolution of about 1 nm.
  • the substrate stage interferometer system 98 includes a pair of X laser interferometers (hereinafter referred to as X interferometers) corresponding to the pair of X movable mirrors 94X 1 and 94X 2.
  • Y interferometers a pair of Y laser interferometers (hereinafter abbreviated as Y interferometers) 98Y 1 , 98Y 2 corresponding to the Y moving mirror 94Y.
  • the measurement results of the X interferometers 98X 1 and 98X 2 and the Y interferometers 98Y 1 and 98Y 2 are supplied to the main controller 50 (see FIG. 33).
  • each of the pair of X interferometers 98X 1 and 98X 2 has an L shape when viewed from the + X direction in which one end portion (lower end portion) is fixed to the ⁇ X side frame 18.
  • X interferometer frames are individually fixed to the other ends (upper ends) of frames (X interferometer frames) 102A and 102B.
  • L-shaped frames are used as the frames 102A and 102B, avoid interference between the frames 102A and 102B and the above-described frames 110A and 110B and the coarse motion table 32 moving in the X-axis direction. be able to.
  • the pair of X interferometers 98X 1 and 98X 2 are opposed to the pair of X movable mirrors 94X 1 and 94X 2 and at a position lower than the upper surface of the substrate P, the substrate holder PH and the air floating unit group in the Y-axis direction. It is arranged at a position that fits in a gap with 84E or 84F.
  • the pair of X interferometers 98X 1 and 98X 2 is on the ⁇ X side as compared with the case where the pair of X interferometers 98X 1 and 98X 2 are installed outside the X axis direction movement range of the substrate holder PH. It can be arranged at a position close to the gantry 18.
  • a predetermined one of the X interferometers 98X 1 and 98X 2 for example, the X interferometer 98X 2, as shown in FIG. 30, two interferometer beams (measurement beams) separated in the Z-axis direction.
  • multi-axis interferometer which irradiates the X movable mirror 94X 2 are used. The reason for this will be described later.
  • the X interferometer is not limited to the pair of X interferometers 98X 1 and 98X 2 that individually irradiate the pair of X movable mirrors 94X 1 and 94X 2 with the interferometer beam (measurement beam).
  • a multi-axis interferometer that emits a plurality of measurement beams including at least one measurement beam irradiated to each of the movable mirrors 94X 1 and 94X 2 can also be used.
  • the pair of Y interferometers 98Y 1 and 98Y 2 includes a first row of air levitation unit rows that are closest to the substrate holder PH that constitutes the air levitation unit group 84F, and a first row that is adjacent thereto. Arranged at a position facing two gaps between adjacent air levitation units located between the two air levitation unit rows and in the vicinity of the center in the X-axis direction constituting the first air levitation unit row Has been. These two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA. As shown in FIG.
  • the pair of Y interferometers 98Y 1 and 98Y 2 are arranged so that the upper surface of the support member 104 ′ installed on the upper surface of the frame 110B is opposed to the Y moving mirror 94Y and is an air floating unit.
  • the air levitation units constituting the group 84F are separated (non-contact) and fixed.
  • the Y moving mirror 94Y is irradiated with the measurement beam (measurement beam) from the pair of Y interferometers 98Y 1 and 98Y 2 through the above-mentioned two gaps.
  • the frame 110B is integrated with the projection optical system PL so that the measurement standard of the Y interferometer is the projection optical system PL. It is preferable to install it on the gantry 18.
  • the support member 104 ′ that supports the Y interferometers 98Y 1 and 98Y 2 may be directly fixed to the gantry 18 instead of the frame 110B installed on the floor surface.
  • the Y interferometer is not limited to the pair of Y interferometers 98Y 1 and 98Y 2 that individually irradiate the Y moving mirror 94Y with the interferometer beam (measurement beam), and the Y moving mirror 94Y is irradiated with two measurement beams.
  • a multi-axis interferometer can also be used.
  • the X interferometers 98X 1 and 98X 2 are arranged such that the surface of the substrate P in the Z-axis direction (the surface of the substrate P is focused so that this surface coincides with the image plane of the projection optical system PL during exposure). Since the position is lower than the position where leveling control is performed), the X position measurement result includes an Abbe error due to the attitude change (pitching) of the fine movement stage 26 when moving in the X-axis direction.
  • the main controller 50 detects the pitching amount of the fine movement stage 26 by X interferometer 98x 2 consisting of multi-axis interferometer described above, based on the detection result, the measurement of the X-position by X interferometer 98x 1, 98x 2
  • the Abbe error included in the result is corrected. That is, since the correction of such Abbe errors, as the X interferometer 98x 2, irradiates two interferometer beams spaced in the Z-axis direction (measurement beam) to the X movable mirror 94X 2, i.e. the pitching amount of the fine movement stage 26 A detectable multi-axis interferometer is used.
  • the configuration of the other parts of the substrate stage apparatus PSTf is the same as that of the substrate stage apparatus PSTd.
  • the components other than the substrate stage apparatus are the same as those in the above-described embodiments (see FIGS. 30 to 33).
  • the exposure area IA shown in FIGS. 34 to 49 is an illumination area in which the illumination light IL is irradiated through the projection optical system PL during exposure, and is not actually formed except during exposure. Is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL.
  • the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate stage device PSTf is loaded by a substrate carry-in device (not shown).
  • the substrate P is loaded (introduced) upward.
  • main controller 50 levitates and supports substrate P carried above ⁇ Y side air levitation unit group 84F by the substrate carry-in device using air levitation unit group 84F.
  • the substrate is sucked and held by using the substrate Y step feeding device 91 on the ⁇ Y side, and is conveyed in the ⁇ X direction as indicated by the black arrow in FIG.
  • the main controller 50 sucks and holds the substrate P levitated and supported by the air levitation unit group 84F using the -Y side most + X side substrate Y step feeding device 88, and the substrate X with respect to the substrate P The suction by the step feeding device 91 is released. Then, main controller 50 transports substrate P in the + Y direction as shown by the dotted arrow in FIG. 34 using substrate Y step feeding device 88.
  • the substrate P is placed across the substrate holder PH and a part of the air floating unit group 84F on the ⁇ Y side of the substrate holder PH.
  • the substrate P is levitated and supported by the substrate holder PH and a part of the air levitation unit group 84F.
  • the main controller 50 switches the substrate holder PH from exhaust to suction.
  • a part of the substrate P (about 3 of the whole substrate P) is attracted and fixed by the substrate holder PH, and a part of the substrate P (about the remaining about 2 of the whole substrate P by the part of the air floating unit group 84F) / 3) is in a state of being supported by levitation.
  • the substrate P is placed on the substrate holder PH and the air levitation unit group 84F so that at least two alignment marks on the substrate P are in the field of view of any alignment detection system and on the substrate holder PH. It is placed across a part of.
  • the main controller 50 releases the adsorption of the substrate P by the substrate Y step feeding device 88, and the substrate Y step feeding device 88 (movable portion 88a) 36, it is returned to the standby position which is the movement limit position on the -Y side shown in FIG.
  • the substrate X step feeding device 91 (movable part 91a) is also returned to the standby position, which is the movement limit position on the ⁇ X side shown in FIG.
  • the main controller 50 obtains the position of the fine movement stage 26 (substrate holder PH) with respect to the projection optical system PL and the approximate position of the substrate P with respect to the fine movement stage 26 by the same alignment measurement method as before. Note that the alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.
  • main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the above measurement result to place at least two alignment marks on substrate P within the field of view of any alignment detection system.
  • the alignment measurement of the substrate P with respect to the projection optical system PL is performed, and the scan start position for exposure of the shot area SA1 on the substrate P is obtained based on the result.
  • the scan start position is strictly an acceleration start position.
  • main controller 50 drives coarse movement table 32 and finely moves fine movement stage 26 to position substrate P at its scan start position (acceleration start position).
  • FIG. 36 shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this way. Thereafter, a step-and-scan exposure operation is performed.
  • the plurality of shot areas SA1 to SA6 on the substrate P are sequentially exposed.
  • the substrate P is accelerated in the X axis direction for a predetermined acceleration time, and then driven at a constant speed for a predetermined time (exposure (scan exposure) is performed during this constant speed drive), and thereafter It is decelerated by the same time as the acceleration time.
  • the substrate is appropriately driven in the X-axis or Y-axis direction during the step operation (moving between shot areas) (hereinafter referred to as X-step operation and Y-step operation, respectively).
  • the exposure operation is performed as follows.
  • the substrate stage (26, 28, 32, PH) is driven in the ⁇ X direction as shown by the white arrow in FIG. 36, and the X scan operation of the substrate P is performed.
  • the mask M mask stage MST
  • the shot area SA1 is a projection area of the pattern of the mask M by the projection optical system PL. Since it passes through the exposure area IA, scanning exposure for the shot area SA1 is performed at that time. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL while the fine movement stage 26 (substrate holder PH) is moving in the ⁇ X direction at a constant speed. .
  • main controller 50 adsorbs and fixes a part of substrate P (about 1/3 of the entire substrate P) to substrate holder PH mounted on fine movement stage 26, and moves on air floating unit group 84F.
  • the substrate stage (26, 28, 32, PH) is driven in a state in which a part of the substrate P (about 2/3 of the entire substrate P) is levitated and supported.
  • the main controller 50 drives the coarse movement table 32 in the X-axis direction via the X linear motor 42 based on the measurement result of the X linear encoder system 46, and the substrate stage interferometer system 98, Z tilt Based on the measurement result of measurement system 76, fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven.
  • the substrate P is moved together with the coarse movement table 32 in the X-axis direction by the action of the pair of X voice coil motors 54X while being supported by the weight cancellation device 28 together with the fine movement stage 26.
  • FIG. 37 shows a state in which the scanning exposure for the shot area SA1 is completed and the substrate stage (26, 28, 32, PH) holding a part of the substrate P is stopped.
  • main controller 50 performs the X step operation of substrate P that slightly drives substrate P in the + X direction as shown by the white arrow in FIG. Do.
  • the main controller 50 drives the substrate stage (26, 28, 32, PH) in the same state as the X scan operation (however, the positional deviation during movement is as strict as the scan operation). Do not regulate).
  • Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P.
  • FIG. 38 shows a state where the scanning exposure for the shot area SA2 is completed and the substrate stage (26, 28, 32, PH) is stopped.
  • a Y-step operation for moving the unexposed area of the substrate P onto the substrate holder PH is performed.
  • This Y step operation of the substrate P is performed by the main controller 50 using the substrate Y step feeding device 88 (movable portion 88a) closest to the ⁇ Y side and the ⁇ X side to move the back surface of the substrate P in the state shown in FIG. , And the substrate P is lifted by releasing the high-pressure air from the substrate holder PH and continuing the high-pressure air exhaust by the air levitation unit group 84F.
  • the substrate P is transferred by the substrate Y step feeding device 88 in the + Y direction.
  • the substrate P moves in the + Y direction with respect to the substrate holder PH.
  • the unexposed shot areas SA3 and SA4 face the substrate holder PH as shown in FIG. And part of the air levitation unit group 84E and part of the air levitation unit group 84F.
  • the substrate P is levitated and supported by the substrate holder PH, part of the air levitation unit group 84E, and part of the air levitation unit group 84F.
  • the main controller 50 switches the substrate holder PH from exhaust to intake (suction).
  • a part of the substrate P (about 1 / of the whole substrate P) is sucked and fixed by the substrate holder PH, and a part of the substrate P is formed by a part of the air levitation unit group 84E and a part of the air levitation unit group 84F.
  • the part (the remaining approximately 2/3 of the entire substrate P) is levitated and supported.
  • the main controller 50 releases the adsorption of the substrate P by the substrate Y step feeding device 88.
  • new alignment measurement of the substrate P with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area provided in advance on the substrate P is performed.
  • the X step operation of the substrate P described above is performed as necessary so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 40).
  • the main controller 50 determines, based on the result, the X-axis, Y-axis, and ⁇ z directions (or the z-axis direction relative to the coarse movement table 32 of the fine movement stage 26) Precise fine positioning drive in the direction of 6 degrees of freedom is performed.
  • FIG. 41 shows a state in which the scanning exposure for the shot area SA3 is completed and the substrate stage (26, 28, 32, PH) is stopped.
  • the main controller 50 performs the X step operation of the substrate P for driving the substrate stage (26, 28, 32, PH) in the ⁇ X direction and the acceleration of the mask stage MST.
  • acceleration in the + X direction (see the white arrow in FIG. 42) of the substrate P and the mask M is started, and scan exposure is performed on the shot area SA4 in the same manner as described above.
  • FIG. 42 shows a state where the scanning exposure for the shot area SA4 is completed and the substrate stage (26, 28, 32, PH) is stopped.
  • a Y-step operation for moving the unexposed area of the substrate P onto the substrate holder PH is performed.
  • the main controller 50 adsorbs the back surface of the substrate P in the state shown in FIG. 42 by the substrate Y step feeding device 88 (movable part 88a) on the ⁇ Y side and the most + X side.
  • the substrate P is levitated by exhausting high-pressure air from the substrate holder PH and continuing high-pressure air exhausting by the air levitation unit groups 84E and 84F.
  • the substrate P is transported in the + Y direction by the substrate Y step feeding device 88, as indicated by the black arrow in FIG. Thereby, only the substrate P moves in the Y-axis direction with respect to the substrate holder PH (see FIG. 43).
  • the main controller 50 may take over the feeding of the substrate P using the substrate Y step feeding device 88 on the + Y side. Good (see FIG. 44). In preparation for this takeover, the main controller 50 may drive the + Y-side substrate Y step feeding device 88 (movable portion 88a) in advance in the ⁇ Y direction and wait in the vicinity of the substrate holder PH ( (See FIG. 43).
  • a part of the substrate P that is driven in the + Y direction by the substrate Y step feeding device 88 and has moved the unexposed shot areas SA5 and SA6 onto the substrate holder PH (about 1/3 of the entire substrate P) is the substrate holder. It is fixed to the substrate holder PH again by adsorption by PH, and a part (the remaining approximately 2/3 of the whole substrate P) is levitated and supported by a part of the air levitation unit group 84E. Immediately after the start of the adsorption operation of the substrate P by the substrate holder PH, the main controller 50 releases the adsorption of the substrate P by the substrate Y step feeding device 88.
  • new alignment measurement of the substrate P with respect to the projection optical system PL that is, measurement of an alignment mark for the next shot area provided in advance on the substrate P is performed.
  • the above-described X-step operation of the substrate P is performed as necessary so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 45). .
  • a new substrate P is loaded into the ⁇ Y side air levitation unit group 84F by a substrate carry-in device (not shown) (see FIG. 45).
  • the movable portion 91a of the ⁇ Y side substrate X step feeding device 91 moves to a position near the + X side movement limit position, that is, a position below the newly loaded substrate P, and waits at that position. is doing.
  • the movable portion 88a of the substrate Y step feed device 88 closest to the -X side on the -Y side is moved by the main controller 50 to the movement limit position on the -Y side, as indicated by a solid arrow in FIG. Has been moved.
  • the main controller 50 determines based on the result. Then, precise fine positioning drive in the X-axis, Y-axis, and ⁇ z directions (or 6-degree-of-freedom directions) is performed on the coarse movement table 32 of the fine movement stage 26. Then, according to the same procedure as in the case of the first shot areas SA1 and SA2, the main controller 50 exposes the last two shot areas SA5 and SA6.
  • FIG. 46 shows a state immediately after the exposure for the last shot area SA6 is completed.
  • the newly loaded substrate P is sucked and held by the main controller 50 at the ⁇ Y side substrate X step feeding device 91 and is transported to the ⁇ X side. (See FIG. 46).
  • the substrate P that has been exposed to all the shot areas SA1 to SA6 is whitened with a dotted line in FIG. 47 by the main controller 50 using the substrate Y step feed device 88 on the + Y side and the most ⁇ X side.
  • the sheet is conveyed to the + Y side, completely retracted from the substrate holder PH, and conveyed onto the air floating unit group 84E.
  • the newly loaded substrate P is indicated by the black arrow in FIG. 47 by the main controller 50 using the substrate Y step feed device 88 on the ⁇ Y side and the most ⁇ X side.
  • the shot areas SA1 and SA2 are positioned on the substrate holder PH (see FIG. 47).
  • the exposed substrate P carried on the air levitation unit group 84E is subjected to + X by the main controller 50 using the + Y side substrate X step feed device 91, as indicated by the black arrow in FIG. And is carried out in the + X direction by a substrate carrying-out device (not shown) (see FIGS. 48 and 49).
  • the substrate P on the substrate holder PH is subjected to the same alignment operation as described above, and then the substrate P and the mask M are accelerated in the + X direction.
  • the first shot area SA2 is subjected to scan exposure (see FIGS. 48 and 49). Thereafter, in the same procedure as the exposure for the first substrate P described above, alignment (X step, Y step) for the remaining shot regions on the second substrate P, operations such as exposure, and the like Operations such as alignment (X step, Y step) and exposure with respect to the third and subsequent substrates are repeated.
  • the first (odd-numbered) substrates P and 2 are used.
  • the exposure order of the shot areas is different.
  • the exposure order is the shot areas SA1, SA2, SA3, SA4, SA5, and SA6, whereas in the second (even-numbered) substrate P, the exposure order.
  • the order of exposure is not limited to this.
  • the exposure apparatus 700 according to the seventh embodiment can obtain the same effects as those of the exposure apparatus 100 according to the first embodiment described above.
  • the substrate holder PH mounted on the fine movement stage 26 is a part of the surface opposite to the exposed surface (processed surface) of the substrate P. Hold. That is, the substrate holding surface of the substrate holder PH is smaller than the substrate P, specifically, is set to about 1/3. For this reason, when the substrate Y step feeding device 88 carries the substrate P out of the fine movement stage 26 (substrate holder PH) based on an instruction from the main control device 50, the substrate P is displaced in the Y-axis direction so as to be displaced in the XY plane.
  • the substrate Y step feeding device 88 is at a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, that is, about 1 / the size of the substrate P in the Y-axis direction.
  • the substrate P is unloaded only by displacing the substrate P in the Y-axis direction by the same distance as the width in the Y-axis direction of the substrate holder PH 3 (see, for example, FIGS. 46 and 47).
  • substrate P is smaller than the size of a board
  • the fine movement stage 26 (substrate holder PH) is located at the position in the X-axis direction when the scan exposure for the final shot area on the substrate P is completed, and the Y-axis.
  • the exposed substrate P is slid to one side in the direction and taken out (retracted) from the substrate holder PH, and in parallel (substantially simultaneously), the unexposed substrate P is slid from the other side in the Y-axis direction. It becomes possible to carry (inject) the substrate onto the substrate holder PH (see FIGS. 46 and 47).
  • the substrate Y step feeding device 88 is based on an instruction from the main controller 50 so that the substrate P is displaced in the Y-axis direction.
  • the substrate Y step feeding device 88 has a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, that is, the width of the substrate holder PH in the Y-axis direction.
  • the loading of the substrate P is completed simply by displacing the substrate P in the Y-axis direction by the same distance as (about 1/3 of the size of the substrate P in the Y-axis direction). Therefore, in addition to the substrate carry-out time, the substrate carry-in time can be shortened compared to the conventional case, and as a result, the substrate exchange time can be shortened.
  • the main controller 50 also slides the substrate P from the substrate holder PH to one side in the Y-axis direction at a position in the X-axis direction of the substrate holder PH according to the arrangement of the shot areas on the substrate P and the exposure order. Unloading and slide loading from the other side in the Y-axis direction onto the substrate holder PH of the substrate P are performed. Therefore, unlike the conventional substrate replacement, the substrate holder PH does not need to move to a predetermined substrate replacement position (for example, a position near the movement limit position in the + X direction). Thereby, the substrate replacement time can be further shortened.
  • a predetermined substrate replacement position for example, a position near the movement limit position in the + X direction
  • the carry-out direction of the exposed substrate P from the substrate holder PH is the + Y direction in any substrate, but the arrangement of shot areas on the substrate and the exposure Depending on the order, at least one of the even-numbered substrate and the odd-numbered substrate may naturally be unloaded from the substrate holder PH in the ⁇ Y direction. That is, in the present embodiment, the main controller 50 sets the substrate at the position in the X-axis direction of the substrate holder PH according to the arrangement of the shot areas on the substrate P and the exposure order so that the substrate replacement time is minimized.
  • the substrate P is unloaded in a direction (+ Y direction or -Y direction) according to the arrangement of the shot areas on P and the order of exposure. Therefore, regardless of the arrangement of shot areas (processed areas) on the substrate and the order of processing, the substrate replacement time can be shortened as compared with the case of always carrying out at the constant X position in the same direction.
  • the size of the support surfaces of the air levitation unit groups 84E and 84F on both sides of the substrate holder PH in the Y-axis direction is not limited to the size in the Y-axis direction of the substrate P, and may be larger. It may be slightly smaller.
  • the size of the substrate holding surface of the substrate holder PH in the Y-axis direction is not limited to 1/3 of the size of the substrate P in the Y-axis direction, and may be 1/2, 1/4, etc.
  • the size of the substrate holding surface of the substrate holder PH in the Y-axis direction may be smaller than the size of the substrate P in the Y-axis direction to some extent. Actually, it is set to be the same (slightly larger) as the size of the shot area formed on the substrate P.
  • FIG. 50 schematically shows the arrangement of an exposure apparatus 800 according to the eighth embodiment, omitting the air levitation unit groups 84E and 84F.
  • FIG. 51 shows a plan view in which a part of the exposure apparatus 800 is omitted. 51 corresponds to a plan view of a portion below the projection optical system PL in FIG. 50 (portion below the lens barrel surface plate 16).
  • the exposure apparatus 800 according to the eighth embodiment is basically configured in the same manner as the exposure apparatus 700 according to the seventh embodiment described above, but the substrate stage apparatus PSTg is the seventh embodiment. This is partly different from the substrate stage apparatus PSTf according to FIG.
  • the size in the Y axis direction is larger than the size in the X axis direction of the substrate P as the substrate holder PH.
  • a small size (for example, about 1/2 of the substrate P) is used.
  • the size of the substrate holder PH in the Y-axis direction is about 1 ⁇ 2 of the size of the substrate P in the Y-axis direction.
  • a pair of air levitation units (moving air levitation units) 84G independent of the substrate holder PH and the fine movement stage 26 are disposed on both sides of the substrate holder PH in the X-axis direction. As shown in FIG.
  • each of the pair of air levitation units 84G has the coarse motion table 32 through the support member 112 so that the upper surface thereof is almost the same height as the substrate holder PH (slightly lower). It is fixed on the top surface.
  • Each of the pair of air levitation units 84G has, for example, a length in the Y-axis direction that is equivalent to (or slightly shorter than the substrate holder PH) the length in the X-axis direction, for example, about 1 of the substrate holder PH. / 2.
  • a pair of moving substrate Y step feeding devices 120 is disposed between the substrate holder PH and each of the pair of air levitation units 84G.
  • Each of the pair of moving substrate Y step feeding devices 120 is configured in the same manner as the substrate Y step feeding device 88 described above, and is mounted on the coarse motion table 32 as shown in FIG.
  • the movable part 120 a of each movable substrate Y step feeding device 120 is relatively movable in the Y-axis direction with respect to the fixed part 120 b fixed on the coarse motion table 32. Accordingly, each moving substrate Y step feeding device 120 can move in the X-axis direction together with the coarse movement table 32 and can transport only the substrate P in the Y-axis direction.
  • three substrate Y step feeding devices 88 similar to those in the seventh embodiment are provided.
  • One substrate X step feeding device 91 is arranged.
  • three substrate Y step feeding devices 88 and one substrate X step feeding device 91 inside each of the arrangement regions of the air levitation unit groups 84E and 84F. are arranged symmetrically with respect to the X axis passing through the center of the exposure area IA. Further, from the relationship of adopting such a symmetrical arrangement, the arrangement positions of the pair of Y interferometers 98Y 1 and 98Y 2 are shifted to the + Y side as compared with the seventh embodiment.
  • X beams 30A and 30B those having a slightly wider width in the Y-axis direction than the X beams 30A and 30B of the seventh embodiment are used.
  • two X linear guides 36 are fixed to the upper surfaces of the X beams 30A and 30B, respectively, as in the above-described substrate stage apparatus PST, and an X stator 38 is interposed between the two X linear guides 36. It is fixed.
  • a plurality of sliders 44 that are engaged with each of the two X linear guides 36 are fixed to the lower surface of the coarse motion table 32.
  • An X mover (not shown) that constitutes an X linear motor together with the X stator 38 is fixed to the lower surface of the coarse motion table 32.
  • the configuration of other parts of the substrate stage apparatus PSTg is the same as that of the substrate stage apparatus PSTf according to the seventh embodiment.
  • the pair of X interferometers 98X 1 and 98X 2 does not interfere with any of the fixed air levitation unit groups 84E and 84F and the air levitation unit 84G on the coarse motion table 32, and the pair of X movable mirrors 94X. 1 and 94X 2 are accessible.
  • the substrate stage apparatus PSTg also includes a moving body that moves in the X-axis direction integrally with the substrate P, including the coarse movement table 32, the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like. . Also in the eighth embodiment, this moving body will be appropriately referred to as a substrate stage (26, 28, 32, PH) below.
  • the exposure area IA shown in FIGS. 52 to 65 is an illumination area where the illumination light IL is irradiated through the projection optical system PL during exposure, and is not actually formed except during exposure. Is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL.
  • the mask M is loaded onto the mask stage MST by a mask transfer device (mask loader) (not shown), and the substrate stage device PSTg is loaded by a substrate carry-in device (not shown).
  • the substrate P is carried in upward.
  • the substrate P is exposed to a plurality of shot areas SA1 to SA4, for example, two in the X-axis direction and two in the Y-axis direction.
  • a plurality of alignment marks (not shown) transferred simultaneously with the pattern of each shot area are provided for each shot area.
  • the substrate P is, as shown in FIG. 52, the substrate holder PH and the air floating unit group on the ⁇ Y side of the substrate holder PH. It is placed straddling part of 84F. At this time, the substrate P is levitated and supported by the substrate holder PH, a part of the air levitation unit group 84F, and the + X side air levitation unit 84G.
  • the main controller 50 switches the substrate holder PH from exhaust to intake (suction).
  • a part of the substrate P (about 1 ⁇ 4 of the whole substrate P corresponding to the rectangular area including the shot area SA1) is sucked and fixed by the substrate holder PH, and a part of the air levitation unit group 84F and the air levitation unit 84G are fixed.
  • a part of the substrate P (the remaining approximately 3/4 of the entire substrate P) is supported in a floating state.
  • the substrate P is in contact with the substrate holder PH and the air so that at least two alignment marks on the substrate P are in the field of view of any alignment detection system (not shown) and on the substrate holder PH. It is placed across a part of the levitation unit group 84F and the air levitation unit 84G.
  • the main controller 50 releases the adsorption of the substrate P by the substrate Y step feeding device 88.
  • the substrate Y step feeding device 88 (movable portion 88a) and the substrate X step feeding device 91 (movable portion 91a) are respectively set by the main controller 50 to a standby position that is a movement limit position on the ⁇ Y side, ⁇ X It is returned to the standby position which is the movement limit position on the side.
  • the main controller 50 determines the position of the fine movement stage 26 with respect to the projection optical system PL and the approximate position of the substrate P with respect to the fine movement stage 26 by the same alignment measurement method as before. Note that the alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.
  • main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the above measurement result to place at least two alignment marks on substrate P within the field of view of any alignment detection system.
  • the substrate P is moved, the alignment measurement of the substrate P with respect to the projection optical system PL is performed, and the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P is obtained based on the result.
  • main controller 50 drives coarse movement table 32 and finely moves fine movement stage 26 to position substrate P at its scan start position (acceleration start position).
  • precise fine positioning drive in the X-axis, Y-axis, and ⁇ z directions (or 6-degree-of-freedom directions) is performed on the coarse movement table 32 of the fine movement stage 26.
  • FIG. 52 shows a state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this way. Thereafter, a step-and-scan exposure operation is performed.
  • the plurality of shot areas SA1 to SA4 on the substrate P are sequentially exposed.
  • the X scan operation of the substrate P is performed during the scan operation, and the X step operation or the Y step operation of the substrate P is performed during the step operation (when moving between shot areas). Is called.
  • the Y step operation of the substrate P is the same as that of the seventh embodiment, but the X step operation of the substrate P is different from that of the seventh embodiment as will be described later.
  • the exposure operation is performed as follows. From the state of FIG. 52, the substrate stage (26, 28, 32, PH) is driven in the ⁇ X direction as shown by the white arrow in FIG. 52, and the X scan operation of the substrate P is performed. At this time, the mask M (mask stage MST) is driven in the ⁇ X direction in synchronization with the substrate P (fine movement stage 26), and the shot area SA1 is an exposure area where the projection optical system PL projects the pattern of the mask M. Since it passes through the area IA, scanning exposure for the shot area SA1 is performed at that time. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL while the fine movement stage 26 (substrate holder PH) is moving in the ⁇ X direction at a constant speed. .
  • main controller 50 adsorbs and fixes a part of substrate P (about 1 ⁇ 4 of the entire substrate P) to substrate holder PH on fine movement stage 26, and a part of air levitation unit group 84F.
  • the substrate stage (26, 28, 32, PH) is driven in a state where a part of the substrate P (about 3/4 of the entire substrate P) is supported by the air floating unit 84G on the + X side.
  • main controller 50 drives coarse movement table 32 in the X-axis direction and fine movement stage drive system 52 in the same manner as described above.
  • the substrate P is moved together with the coarse movement table 32 in the X-axis direction by the action of the pair of X voice coil motors 54X while being supported by the weight cancellation device 28 together with the fine movement stage 26.
  • main controller 50 scans the mask stage MST holding the mask M in the X-axis direction (in the Y-axis direction and the ⁇ z direction) in synchronization with fine movement stage 26 (substrate holder PH) during the X-scan operation. (Small drive).
  • FIG. 53 shows a state in which the scanning exposure for the shot area SA1 is completed and the substrate stage (26, 28, 32, PH) is stopped.
  • an X-step operation for moving the next shot area SA2 of the substrate P onto the substrate holder PH is performed.
  • the main controller 50 sucks and holds the back surface of the substrate P in the state shown in FIG. 53 by the substrate X step feeding device 91 (movable portion 91a) on the ⁇ Y side,
  • the substrate P is floated by exhausting high-pressure air from the substrate holder PH and continuing high-pressure air exhausting by the air levitation unit group 84F and the + X side air levitation unit 84G.
  • substrate P will be in the state hold
  • the main controller 50 indicates the substrate stage (26, 28, 32, PH) with a white arrow in FIG. 53 while maintaining the holding state of the substrate P only by the substrate X step feeding device 91.
  • the X step of the substrate P which is driven in the + X direction, is started.
  • the substrate holder PH moves in the + X direction with respect to the substrate P while the substrate P is stopped at the position before the start of the X step.
  • the main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 54).
  • the substrate P is placed across the substrate holder PH, part of the air levitation unit group 84F, and the ⁇ X side air levitation unit 84G.
  • High pressure air is jetted from the upper surfaces of the substrate holder PH, the air levitation unit group 84F, and the air levitation unit 84G, and the substrate P is supported to be levitated.
  • the main controller 50 In parallel with the driving of the substrate stage (26, 28, 32, PH) for the X step of the substrate P, the main controller 50 returns the mask stage MST to a predetermined acceleration start position.
  • FIG. 56 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA2.
  • a Y-step operation for moving the next shot area SA3 of the substrate P onto the substrate holder PH is performed.
  • the Y step operation of the substrate P is performed as follows. That is, main controller 50 sucks and holds the back surface of substrate P in the state shown in FIG. 56 by moving substrate Y step feeding device 120 (movable part 120a) on the ⁇ X side, and sucks substrate holder PH to substrate P. Is released. Thereafter, the main controller 50 causes the substrate P to float in the state shown in FIG. 56 by exhausting high-pressure air from the substrate holder PH and continuing high-pressure air exhausting by the air levitation unit group 84F and the air levitation unit 84G.
  • the substrate P is transported in the + Y direction by the moving substrate Y step feeding device 120 on the ⁇ X side. Accordingly, only the substrate P moves in the + Y direction with respect to the substrate holder PH (see FIG. 57).
  • the main controller 50 uses the + Y side substrate Y step feeding device 88 located closest to the ⁇ X side to use the substrate P. (See black arrows in FIG. 58).
  • the substrate P is placed across the substrate holder PH, a part of the air levitation unit group 84E, and the air levitation unit 84G on the ⁇ X side.
  • High pressure air is jetted from the upper surfaces of the substrate holder PH, the air levitation unit group 84E, and the air levitation unit 84G, and the substrate P is supported to be levitated.
  • FIG. 60 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA3 is completed.
  • the X step operation of the substrate P is performed as follows.
  • the main controller 50 sucks and holds the back surface of the substrate P in the state shown in FIG. 60 by the + Y-side substrate X step feeding device 91 (movable part 91a) and releases the suction of the substrate holder PH
  • the substrate P is levitated by the high-pressure air exhaust from the substrate holder PH and the subsequent high-pressure air exhaust by the air levitation unit group 84E and the -X side air levitation unit 84G.
  • substrate P will be in the state hold
  • the main control device 50 indicates the substrate stage (26, 28, 32, PH) as indicated by the white arrow in FIG. 60 while maintaining the holding state of the substrate P only by the substrate X step feeding device 91. Then, the X step for driving in the ⁇ X direction is started. As a result, the substrate holder PH moves in the ⁇ X direction with respect to the substrate P while the substrate P is stopped at the position before the start of the X step of the substrate stage (26, 28, 32, PH). Then, when the substrate holder PH reaches just below the next shot area SA4 of the substrate P, the main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 61).
  • the substrate P is placed across the substrate holder PH, a part of the air levitation unit group 84E, and the + X side air levitation unit 84G.
  • High pressure air is jetted from the upper surfaces of the substrate holder PH, the air levitation unit group 84E, and the air levitation unit 84G, and the substrate P is supported to be levitated.
  • the main controller 50 In parallel with the step drive of the substrate stage (26, 28, 32, PH), the main controller 50 returns the mask stage MST to a predetermined acceleration start position.
  • FIG. 63 shows a state where the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA4 is completed.
  • the main controller 50 causes the movable portion 91a of the ⁇ Y side substrate X step feeding device 91 to prepare for the next substrate loading. Is driven to a standby position in the vicinity of the movement limit position and is made to wait at that position (see the black arrow in FIG. 62).
  • the substrate P newly introduced onto the air levitation unit group 84F by the substrate carry-in device is -Y Is sucked and held by the side substrate X step feeding device 91 (movable portion 91a) and is transported to the ⁇ X side (see the white arrow in FIG. 63).
  • the substrate P that has been exposed to all the shot areas SA1 to SA4 is + Y as shown by the dotted arrow in FIG. 63 by the main controller 50 using the + X-side moving substrate Y step feed device 120. Then, it is completely retracted from above the substrate holder PH and carried onto the + Y side air floating unit group 84E. At this time, if the stroke of the + X side moving substrate Y step feeding device 120 is insufficient, the main controller 50 takes over the substrate feeding using the + Y side most substrate Y step feeding device 88 on the + Y side. You may make it (refer FIG. 64). At almost the same time, the newly introduced substrate P is indicated by the black arrow in FIG. 64 by the main controller 50 using the substrate Y step feed device 88 on the ⁇ Y side and the most + X side. Then, the shot area SA1 is positioned on the substrate holder (see FIG. 64).
  • the exposed substrate P carried on the air levitation unit group 84E is transported in the + X direction by the main controller 50 using the + Y-side substrate X step feeding device 91, and by a substrate unloading device (not shown). It is carried out in the + X direction (see FIGS. 64 and 65).
  • the substrate P partially held by the substrate holder PH is subjected to the same alignment operation as described above, and then the substrate P, the mask M, The acceleration in the + X direction is started, and scan exposure is performed on the first shot area SA1 in the same manner as described above (see FIG. 65). Thereafter, operations such as alignment (X step, Y step), exposure and the like for the remaining shot regions on the second and subsequent substrates P in the same procedure as the exposure for the first substrate P described above, In addition, operations such as alignment (X step, Y step) and exposure with respect to the third and subsequent substrates are repeated. In this case, both the odd-numbered substrates P and the even-numbered substrates P are exposed in the order of the shot areas SA1, SA2, SA3, and SA4.
  • the same effects as those of the exposure apparatus 700 according to the seventh embodiment described above can be obtained, and the substrate holder PH and the substrate holder PH are mounted.
  • the fine movement stage 26 and the weight canceling device 28 that supports the fine movement stage 26 can be made lighter and more compact than the first embodiment.
  • a frame-shaped substrate support member that can hold the substrate P integrally and can be floated integrally with the substrate P by an air floating unit may be used.
  • this substrate support member is applied to an exposure apparatus 800 according to the eighth embodiment will be described with reference to FIG.
  • the substrate support member 69 has a rectangular (substantially square) outline in plan view, and has a rectangular opening in plan view that penetrates in the Z-axis direction at the center. Consists of a small (thin) frame-shaped member.
  • the substrate support member 69 has a pair of X frame members 61x, which are flat members parallel to the XY plane with the X axis direction as the longitudinal direction, at a predetermined interval in the Y axis direction.
  • Each of the + X side and ⁇ X side ends is connected by a Y frame member 61y that is a flat plate member parallel to the XY plane whose longitudinal direction is the Y-axis direction.
  • Each of the pair of X frame members 61x and the pair of Y frame members 61y is made of, for example, a fiber reinforced synthetic resin material such as GFRP (Glass Fiber Reinforced Plastics), or ceramics to ensure rigidity and reduce weight. From the viewpoint of GFRP (Glass Fiber Reinforced Plastics), or ceramics to ensure rigidity and reduce weight. From the viewpoint of GFRP (Glass Fiber Reinforced Plastics), or ceramics to ensure rigidity and reduce weight. From the viewpoint of
  • a Y movable mirror 94Y having a reflecting surface on the -Y side surface is fixed on the upper surface of the -Y side X frame member 61x. Further, an X movable mirror 94X composed of a plane mirror having a reflecting surface on the ⁇ X side surface is fixed to the upper surface of the ⁇ X side Y frame member 61y. In this case, it is not necessary to provide the X moving mirror and the Y moving mirror in either the substrate holder PH or the fine movement stage 26.
  • Position information in the XY plane (including rotation information in the ⁇ z direction) of the substrate support member 69 (that is, the substrate P) is a pair of X interferometers 98X 1 and 98X that irradiate a length measurement beam onto the reflection surface of the X movable mirror 94X. 2 and the above-described substrate stage interferometer system 98 including a pair of Y interferometers 98Y 1 and 98Y 2 that irradiate a length measuring beam onto the reflecting surface of the Y moving mirror 94Y, and is always detected with a resolution of, for example, about 0.5 nm.
  • the above-described substrate stage interferometer system 98 including a pair of Y interferometers 98Y 1 and 98Y 2 that irradiate a length measuring beam onto the reflecting surface of the Y moving mirror 94Y, and is always detected with a resolution of, for example, about 0.5 nm.
  • the number of X interferometers and / or Y interferometers is such that at least one length measuring beam is irradiated to the corresponding movable mirror within the movable range of the substrate support member 69.
  • the number of optical axes or the interval is set. Therefore, the number of interferometers (number of optical axes) is not limited to two, and depending on the movement stroke of the substrate support member, for example, only one (one axis), or three (three axes) or more good.
  • the substrate support member 69 has a plurality of, for example, four holding units 65 that hold the end (outer peripheral edge) of the substrate P by vacuum suction from below.
  • the four holding units 65 are attached to the opposing surfaces of each of the pair of X frame members 61x so as to be separated from each other in the X axis direction. Note that the number and arrangement of the holding units are not limited to this, and may be appropriately added according to the size of the substrate, the ease of bending, and the like.
  • the holding unit may be attached to the Y frame member.
  • the holding unit 65 has, for example, an L-shaped substrate mounting member provided with a suction pad for vacuum suction of the substrate P on its upper surface, and a parallel connecting the substrate mounting member to the X frame member 61x.
  • a plate spring, the position of the substrate mounting member with respect to the X frame member 61x in the X-axis direction and the Y-axis direction is constrained by the rigidity of the parallel leaf springs, and the elasticity of the leaf springs It is configured to be displaced (moved up and down) in the Z-axis direction without rotating in the ⁇ x direction.
  • a substrate holding frame having the same configuration as the holding unit 65 and the substrate support member 69 provided with the holding unit 65 is disclosed in detail in, for example, US Patent Application Publication No. 2011/0042874.
  • the main controller 50 moves the movable part 91a or the substrate Y of the substrate X step feeding device 91 when the substrate P is moved in and out of the X step or the Y step, or when the substrate P is carried in and out of the substrate stage device PSTg.
  • Any X frame member 61x or any Y frame member 61y of the substrate support member 69 may be sucked and held, or the substrate P may be sucked and held by the movable portion 88a of the step feeding device 88.
  • the position of the substrate P can be measured by the substrate stage interferometer system 98 via the X moving mirror 94X and the Y moving mirror 94Y fixed to the substrate support member 69. Even when the exposure of the first layer on the substrate P is performed by using the exposure apparatus according to the example, the substrate according to the design value based on the position information of the substrate P measured by the substrate stage interferometer system 98 Positioning to the acceleration start position for exposure of each shot area of P can be performed with sufficient accuracy.
  • X movable mirror 94X is not necessarily required. It is not necessary to provide the Y moving mirror 94Y. In this case, the substrate support member 69 can be reduced in weight accordingly.
  • the substrate support member may be used only when the first layer is exposed to the substrate P, or may be used when the second and subsequent layers are exposed.
  • the substrate stage interferometer system 98 since the position of the fine movement stage 26 needs to be measured by the substrate stage interferometer system 98 during the exposure of the second and subsequent layers, for example, the pair of X movable mirrors 94X 1 and 94X composed of the above-described corner cubes. 2 and a Y movable mirror 94Y composed of a long mirror must be attached at the same positions as in the eighth embodiment.
  • the substrate stage interferometer system 98 is also used for measuring the positional information of the substrate support member 69 (substrate P) at the time of the first exposure and the fine movement stage 26 at the time of the second exposure.
  • the present invention is not limited to this, and a substrate interferometer system that measures the position of the substrate support member 69 (substrate P) may be provided separately from the substrate stage interferometer system 98.
  • the substrate support member is not limited to a frame-shaped member, and a substrate support member having a shape in which a part of the frame is cut off may be used.
  • a U-shaped substrate holding frame as disclosed in the eighth embodiment of the above-mentioned US Patent Application Publication No. 2011/0042874 may be used.
  • a drive mechanism that assists driving in the XY plane of the substrate support member 69, for example, long stroke driving in the X-axis direction, may be newly provided as long as the configuration does not adversely affect the operation during scanning exposure of the substrate. .
  • the eighth embodiment has been described as a representative.
  • the substrate support member is used for supporting the substrate P.
  • the air levitation unit is mounted on a frame arranged separately from the coarse movement table 32 and the fine movement stage 26 on one side and the other side of the substrate holder PH in the Y-axis direction.
  • the groups 84E and 84F are installed has been described, at least one of the air levitation unit groups 84E and 84F may be mounted on the coarse motion table 32 and configured to be movable in the X-axis direction.
  • another moving body that moves following the coarse movement table may be provided, and an air floating unit group may be mounted on the other moving body so as to be movable in the X-axis direction.
  • the above-described substrate Y step feeding device 88 disposed inside the air levitation unit group on the coarse movement table 32 on which the air levitation unit group is mounted or another moving body that moves following the coarse movement table. May be provided.
  • the air levitation unit groups 84E and 84F are installed on the floor via the frame, they may be installed on a gantry.
  • FIG. 67 schematically shows the arrangement of an exposure apparatus 900 according to the ninth embodiment, omitting the air levitation unit group and the like.
  • 68 shows a plan view in which a part of the exposure apparatus 900 is omitted, that is, a plan view of a portion below the projection optical system PL in FIG. 67 (portion below a lens barrel surface plate described later).
  • FIG. 69 is a schematic side view showing the exposure apparatus according to the ninth embodiment with a part omitted from the + X direction of FIG.
  • FIG. 70 a part of the plan view of FIG. 68 is taken out and enlarged.
  • the 71 is a block diagram showing the input / output relationship of the main control device 50 that centrally configures the control system of the exposure apparatus 900 and performs overall control of each component.
  • the main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the exposure apparatus 900.
  • the exposure apparatus 900 includes an illumination system IOP, a mask stage MST for holding a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, etc., and a body BD (FIG. 67 and the like show only a part thereof.
  • the substrate stage apparatus PSTh described above is capable of holding a part of each of two substrates (the substrate P1 and the substrate P2 are shown in FIG. 67). Different from PST to PSTg.
  • the substrate stage apparatus PSTh includes a coarse movement stage section 24, a fine movement stage 26, a weight cancellation apparatus 28, and the like, as shown in FIGS.
  • a substrate holder PH is mounted on the upper surface of the fine movement stage 26.
  • the substrate holder PH has the same length in the X-axis direction as that of the substrates (P1, P2), and the width (length) in the Y-axis direction is about 1 / of that of the substrates (P1, P2). 3.
  • a groove 150 parallel to the Y axis that divides the upper surface into two holding areas ADA1 and ADA2 is provided at the center of the upper surface of the substrate holder PH in the X-axis direction.
  • a part of the substrates P1 and P2 (here, about one third of the substrate P1 and P2 with respect to the Y-axis direction, 1/6 region of each substrate that is + X side or ⁇ X side half) is adsorbed and held by, for example, vacuum adsorption (or electrostatic adsorption), and pressurized gas (for example, high-pressure air) is blown upward.
  • a part of the substrates P1 and P2 (a region of about 1/6 of each substrate) can be supported in a non-contact (floating) from below by the ejection pressure.
  • Switching between high-pressure air ejection and vacuum suction to each substrate by the holding areas ADA1 and ADA2 of the substrate holder PH is performed by switching the holding areas ADA1 and ADA2 of the substrate holder PH individually to a vacuum pump and a high-pressure air source (not shown). This is performed by the main controller 50 via the holder intake / exhaust switching devices 51A and 51B (see FIG. 71).
  • the coarse movement stage unit 24 includes two (a pair) X beams 30A and 30B, two (a pair) coarse movement tables 32A and 32B, and two X beams 30A and 30B. And a plurality of legs 34 that support each of the two on the floor surface F.
  • the coarse movement tables 32A and 32B are configured in the same manner as the two coarse movement tables provided in the substrate stage apparatus PST described above, for example.
  • a plurality of, in this case, eight air levitation units 84H each having a rectangular support surface (upper surface) are disposed above the coarse movement tables 32A and 32B, It is being fixed to the upper surface of coarse movement table 32A, 32B via the supporting member 86, respectively.
  • Each of the eight air levitation units 84H has a substrate size of 2/3 of the size of the substrates P1 and P2 with respect to the Y axis direction on the + Y side and the ⁇ Y side of the exposure area IA (projection optical system PL), and the substrate with respect to the X axis direction Two-dimensionally arranged in an area having a size substantially equal to the total size of P1 and P2 in the X-axis direction.
  • the upper surface of each air levitation unit 84H is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.
  • the eight air levitation units 84H are referred to as a + Y side air levitation unit group 84H and a -Y side air levitation unit group 84H, respectively.
  • each pair of air levitation units 84I is arranged on both sides of the substrate holder PH in the X-axis direction.
  • each pair of air levitation units 84I has a support member 112 whose XZ cross section is L-shaped so that the upper surface thereof is almost the same height (slightly lower) as the substrate holder PH. And fixed to the upper surface of the coarse motion table 32A.
  • each air levitation unit 84I has a length in the Y-axis direction somewhat shorter than 1 ⁇ 2 of the substrate holder PH, and a length in the X-axis direction is slightly shorter than 1 ⁇ 2 of the substrate holder PH.
  • each of the pair of frames 110A and 110B is installed on the floor surface F so as not to contact the gantry 18. ing.
  • a plurality of, for example, four air levitation units 84J, for example, are installed on the upper surfaces of the pair of frames 110A and 110B (see FIG. 68).
  • each of the four air levitation units 84J is arranged on the + Y side of the + Y side air levitation unit group 84H and the ⁇ Y side of the ⁇ Y side air levitation unit group 84H, respectively.
  • each of the four air levitation units 84J has a width in the Y-axis direction that is approximately 1/3 of the length in the Y-axis direction of the substrates P1 and P2, and a length in the X-axis direction. It is somewhat shorter than 1/2 of the length of the substrate holder PH in the X-axis direction.
  • each of the + Y side and ⁇ Y side air levitation unit groups 84J has a Y-axis size of approximately one third of the Y-axis length of the substrate P and an X-axis size of the substrates P1 and P2.
  • Y-axis size of approximately one third of the Y-axis length of the substrate P
  • X-axis size of the substrates P1 and P2. Are arranged in the X-axis direction in a region having a size substantially equal to the total size in the X-axis direction.
  • the X positions of the center of the exposure area IA and the centers of the + Y side and ⁇ Y side air levitation unit groups 84J substantially coincide.
  • the upper surface of each air levitation unit 84J is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.
  • Each of the support surfaces (upper surfaces) of the air levitation units 84H, 84I, and 84J described above has a thrust type air bearing structure having a porous body or a plurality of mechanically minute holes.
  • Each of the air levitation units 84H, 84I, and 84J levitates and supports a part of the substrate (for example, P1 and P2) by supplying pressurized gas (for example, high-pressure air) from the gas supply device 85 (see FIG. 71). Can be done.
  • pressurized gas for example, high-pressure air
  • the whole of the two substrates can be levitated and supported by the + Y side or -Y side air levitation unit groups 84H and 84J. Further, the entire substrate can be levitated and supported by the holding area ADA1 of the substrate holder PH, the pair of air levitation units 84I on the + X side, and the four air levitation units 84H on the + Y side or the ⁇ Y side. Further, the entire substrate can be levitated and supported by the holding area ADA2 of the substrate holder PH, the pair of air levitation units 84I on the ⁇ X side, and the four air levitation units 84H on the + Y side or the ⁇ Y side. Further, the entire substrate can be supported by the substrate holder PH and the four air levitation units 84H on the + Y side or the ⁇ Y side of the substrate holder PH.
  • each of the air levitation unit groups 84H and 84J may be replaced with a single large air levitation unit, as long as each of the air levitation unit groups 84H and 84J has a total support area substantially equal to each rectangular area described above.
  • the size of the levitation unit may be distributed in the rectangular area, different from the case of FIG.
  • a single air levitation unit having a double support area may be used. Since the air levitation unit floats the substrate, it does not need to be spread over the entire surface, and may be arranged at predetermined positions at appropriate intervals according to the levitation capacity (load capacity) of the air levitation unit.
  • each of the pair of substrate Y step feeding devices 88 is disposed. .
  • Each substrate Y step feeding device 88 is a device for holding (for example, sucking) a substrate (for example, P1 or P2) and moving it in the Y-axis direction, and is fixed to the upper surface of the support member 112 (see FIG. 67). As shown in FIGS. 67 and 70, each substrate Y step feeding device 88 includes a fixing portion 88b fixed to the coarse motion table 32A via the support member 112 and extending in the Y-axis direction, and a substrate (for example, P1 or P2). ), And a movable portion 88a that moves along the fixed portion 88b in the Y-axis direction. In the present embodiment, the movement stroke in the Y-axis direction of the movable portion 88a of each substrate Y step feeding device 88 is equal to the width of the substrate holder PH in the Y-axis direction.
  • the movable portion 88a adsorbs the substrate P and moves in the Y-axis direction.
  • the substrate Y step feeding device 88 and the movable portion 88a Are used without distinction.
  • each of a pair of substrate X step feeding devices 91 is arranged between the + Y side and ⁇ Y side air levitation unit group 84H and the substrate holder PH.
  • the substrate X step feeding device 91 is a device for holding (for example, adsorbing) a substrate (for example, P1 or P2) and moving it in the X-axis direction.
  • the pair of air levitation units 84H disposed on the surface are fixed to the surfaces facing the substrate holders PH via support members (see FIG. 69).
  • each substrate X step feeding device 91 includes a fixed portion 91b extending in the X-axis direction fixed to the coarse movement table 32A or 32B together with the air floating unit 84H, and a substrate (for example, P1 or And a movable portion 91a that adsorbs the back surface of P2) and moves along the fixed portion 91b in the X-axis direction.
  • the movable portion 91a is driven in the X-axis direction with respect to the coarse motion table 32A or 32B by a drive device 95 (not shown in FIGS. 69 and 70, see FIG. 71) configured by, for example, a linear motor.
  • the substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIGS. 69 and 70, see FIG. 71) such as an encoder for measuring the position of the movable portion 91a.
  • the drive device 95 is not limited to a linear motor, and may be configured by a drive mechanism that uses a rotary motor using a ball screw or a belt as a drive source.
  • the movement stroke in the X-axis direction of the movable portion 91a of each substrate X step feeding device 91 is approximately 1 ⁇ 2 (somewhat longer) the length of the substrate holder in the X-axis direction.
  • the end portion on the ⁇ X side of each fixing portion 91b protrudes from the air levitation unit 84H to which the fixing portion 91b is fixed to the ⁇ X side by a predetermined length.
  • each substrate X step feeding device 91 needs to adsorb the back surface of the substrate P or release the adsorption to separate it from the substrate P, the drive device 95 performs Z It is configured so that it can be driven minutely in the axial direction. Actually, the movable portion 91a adsorbs the substrate P and moves in the X-axis direction. However, in the following, the substrate X step feeding device 91 and the movable portion 91a Are used without distinction.
  • the fine movement stage 26 is Z for the adsorption of the substrate P and the separation from the substrate by the respective movable parts (substrate adsorption surfaces) of the substrate Y step feeding device 88 and the substrate X step feeding device 91. It may move in the axial direction.
  • the weight canceling device 28 includes a housing 64, an air spring 66, a Z slider 68, and the like, and is configured in the same manner as the above-described second and subsequent embodiments, for example. . That is, in the substrate stage device PSTh according to the ninth embodiment, the Z slider 68 also serves as a fixing portion of the leveling device 78, no sealing pad is provided, and the weight cancellation device 28 is integrated with the fine movement stage 26. ing. Further, since the weight canceling device 28 is integrated with the fine movement stage 26, there is no connecting device 80 (flexure device) or the like that restricts the single motion of the weight canceling device 28.
  • the fine movement stage 26 is freely tiltable on the Z slider 68 by a leveling device 78 having a spherical bearing or a pseudo spherical bearing structure schematically shown as a spherical member in FIG. 69 ( ⁇ x and ⁇ y with respect to the XY plane). It can be swung in the direction).
  • the weight canceling device 28 and the upper components (the fine motion stage 26, the substrate holder PH, etc.) supported by the weight canceling device 28 through the leveling device 78 are operated by the coarse motion table 32A by the action of the pair of X voice coil motors 54X. And move in the X-axis direction. That is, the upper components (fine movement stage 26, substrate holder PH, etc.) are supported by the weight canceling device 28 by the main controller 50 using a pair of X voice coil motors 54X, and are synchronously driven (coarse) to the coarse movement table 32A. And is moved at a predetermined stroke in the X-axis direction together with the coarse motion table 32A.
  • the coarse movement table 32A is slightly driven in the direction of 6 degrees of freedom.
  • the coarse movement table 32A (and 32B), the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like are moved in the X-axis direction integrally with the substrates (P1, P2).
  • a movable body hereinafter referred to as a substrate stage (PH, 26, 28, 32A, 32B) as appropriate) is configured.
  • the positional information of the fine movement stage 26 (substrate holder PH) in the XY plane has a resolution of about 0.5 to 1 nm by the substrate stage interferometer system 98 (see FIG. 71).
  • the substrate stage interferometer system 98 according to the ninth embodiment can be understood by comparing FIGS. 67 to 69 with FIGS. 30 to 32, and the substrate stage interferometer system according to the seventh embodiment described above. It is comprised similarly to 98.
  • FIG. a substrate stage interferometer system 98 can be understood by comparing FIGS. 67 to 69 with FIGS. 30 to 32, and the substrate stage interferometer system according to the seventh embodiment described above. It is comprised similarly to 98.
  • FIG. 98 in the exposure apparatus 900 according to the ninth embodiment, as shown in FIG.
  • the Y interferometers 98Y 1 and 98Y 2 are positioned below the air floating unit 84H so as to face the Y moving mirror 94Y. They are arranged at predetermined intervals in the X-axis direction.
  • the Y interferometers 98Y 1 and 98Y 2 are fixed to the pair of mounts 18 via the support members 104, respectively.
  • the configuration of other parts of the substrate stage apparatus PSTh is the same as that of the substrate stage apparatuses PSTa, PSTf, etc., for example. Further, the components other than the substrate stage apparatus are the same as those in the above-described embodiments (see FIGS. 67 to 71).
  • FIG. 75 (D) showing the parallel operation of the exposure of the shot region of one substrate and the Y step operation of the other substrate. Description will be made with reference to FIG. 75 (D).
  • 72 to 99 show only the substrate holder PH and the substrate by further simplifying FIG. 70 for easy understanding.
  • each substrate 72 to 99 is an illumination area where the illumination light IL is irradiated through the projection optical system PL during exposure, and is not actually formed except during exposure. Is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL. Further, here, a case will be described in which each substrate is subjected to 6-chamfer exposure (6 scans in total) of 2 surfaces (2 scans) in the X-axis direction and 3 surfaces (3 scans) in the Y-axis direction.
  • the mask M is loaded onto the mask stage MST by a mask transport device (mask loader) (not shown), and the substrate stage device PSTh is loaded by a substrate carry-in device (not shown).
  • the two substrates P1 and P2 are carried in (introduced) upward.
  • Each of the substrates P1 and P2 has a total of six shot areas SA1, for example, two in the X-axis direction and three in the Y-axis direction, as shown in FIG.
  • a plurality of alignment marks PM (see FIG. 70) transferred simultaneously with the pattern of each shot area are provided for each shot area. In FIG. 70, illustration of each shot area is omitted.
  • the two substrates P2 and P1 are conveyed in the + Y direction and the ⁇ Y direction by the substrate carry-in device as shown by the black arrow and the white arrow in FIG. It is carried in to the position shown in FIG.
  • the substrate P2 is placed across the holding area ADA1 of the substrate holder PH, the pair of + X side air levitation units 84I, and a part of the ⁇ Y side air levitation unit group 84H.
  • the substrate holder PH is placed across the holding area ADA2, the pair of air levitation units 84I on the -X side, and a part of the air levitation unit group 84H on the + Y side.
  • the substrate P2 is levitated and supported by the holding area ADA1 of the substrate holder PH, a pair of + X side air levitation units 84I and a part of the ⁇ Y side air levitation unit group 84H, and the substrate P1 is supported by the substrate holder PH.
  • the holding area ADA2, the pair of air levitation units 84I on the -X side, and a part of the + Y side air levitation unit group 84H are supported by levitation.
  • Each substrate does not necessarily have to be loaded from the direction of each arrow in FIG. For example, it may be carried in from above (+ Z side) or outside in the X-axis direction.
  • the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from exhaust to suction. Thereby, a part (about 1/6 of the whole substrate) of the substrates P2 and P1 is sucked and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of the air levitation unit 84I and a part of the air levitation unit group 84H As a result, a part of the substrates P2 and P1 (the remaining approximately 5/6 of the entire substrate) is levitated and supported.
  • the main controller 50 determines the position of the fine movement stage 26 (substrate holder PH) with respect to the projection optical system PL and the approximate positions of the substrates P1 and P2 with respect to the fine movement stage 26 by the same alignment measurement method as before. .
  • the alignment measurement of the substrates P1 and P2 with respect to the fine movement stage 26 may be omitted.
  • main controller 50 drives fine movement stage 26 via coarse movement table 32A on the basis of the above measurement result to drive at least two alignment marks PM (not shown in FIG. 72, see FIG. 70) on substrate P1.
  • the alignment measurement of the substrate P1 with respect to the projection optical system PL is performed, and based on the result, the scan start position for exposure of the shot area SA1 on the substrate P1 is determined.
  • the scan start position is strictly an acceleration start position.
  • main controller 50 drives coarse movement tables 32A and 32B and fine movement stage 26 to position substrate P1 at its scan start position (acceleration start position).
  • precise fine positioning drive in the X-axis, Y-axis, and ⁇ z directions (or 6-degree-of-freedom directions) is performed on the coarse movement table 32A of the fine movement stage 26 (substrate holder PH).
  • FIG. 73 shows a state immediately after the substrate P1 (and substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P1 in this way. Yes.
  • the substrate stage (PH, 26, 28, 32A, 32B) is driven in the ⁇ X direction as shown by the white arrow in FIG. 73, and the X scan operation of the substrate P1 is performed. Done.
  • the main controller 50 drives the mask stage MST holding the mask M in the ⁇ X direction in synchronization with the substrate holder PH (fine movement stage 26), and the shot area SA1 of the substrate P1 is projected optically. Since it passes through the exposure area IA that is the projection area of the pattern of the mask M by the system PL, at that time, the scanning exposure to the shot area SA1 is performed.
  • main controller 50 actually scans mask stage MST in the X-axis direction based on the measurement result of mask interferometer system 14 in synchronization with fine movement stage 26 (substrate holder PH). While being driven, it is finely driven in the Y-axis direction and ⁇ z direction.
  • the scanning exposure is performed by irradiating the substrate P1 with the illumination light IL through the mask M and the projection optical system PL while the fine movement stage 26 (substrate holder PH) is moving at a constant speed after being accelerated in the ⁇ X direction. .
  • main controller 50 adsorbs and fixes a part of substrate P1 (about 1/6 of the entire substrate P1) to holding area ADA2 of substrate holder PH, and sets + Y side air floating unit group 84H.
  • a part of the substrate P1 (about 5/6 of the whole substrate P1) is levitated and supported by a part and a pair of air floating units 84I on the ⁇ X side, and a part of the substrate P2 (substrate) is held in the holding area ADA1 of the substrate holder PH
  • About 1/6 of the entire P2 is adsorbed and fixed, and a part of the substrate P2 (about 5/6 of the entire substrate P2) is attached to a part of the ⁇ Y side air levitation unit group 84H and a pair of + X side air levitation units 84I
  • the substrate stage (PH, 26, 28, 32A, 32B) is driven in a state where the substrate stage is floated and supported.
  • main controller 50 drives coarse movement tables 32A and 32B in the X-axis direction via X linear motors 42A and 42B, respectively, based on the measurement results of X linear encoder systems 46A and 46B.
  • fine movement stage drive system 52 each voice coil motor 54X, 54Y, 54Z
  • the substrates P1 and P2 are integrated with the fine movement stage 26 and are moved integrally with the coarse movement table 32A by the X voice coil motor 54X.
  • the weight cancellation device 28 is also integrated with the fine movement stage 26 and is driven by the X voice coil motor 54X.
  • the substrates P1 and P2 are integrated with the fine movement stage 26, and relative to the X-axis, Y-axis, Z-axis, ⁇ x, ⁇ y, and ⁇ z directions (6 degrees of freedom direction) by relative driving from the coarse movement table 32A.
  • the position is precisely controlled.
  • FIG. 74 shows a state in which the scanning exposure for the shot area SA1 of the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped.
  • a new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, the alignment mark for the next exposure target shot region (in this case, the shot region SA1 on the substrate P2) provided in advance on the substrate P2. Measurement is performed in the same manner as described above.
  • the main controller 50 prepares the substrate P2 (and the substrate holder PH) in preparation for acceleration for the next exposure based on the result.
  • the X step operation of the substrate P2 (and the substrate holder PH) that is slightly driven in the + X direction is performed as indicated by the white arrow in FIG.
  • the main controller 50 drives the substrate stage (PH, 26, 28, 32A, 32B) in the same state as the X scan operation (however, the positional deviation during movement is a scan operation). (Without as much regulation).
  • Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X-step operation of substrate P2.
  • FIG. 76 shows a state immediately after the substrate P2 (and substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P2 in this way. Yes.
  • main controller 50 As shown by the white arrow in FIG. 76, substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST). ) In the -X direction is started, and scan exposure is performed on the shot area SA1 in the same manner as described above. In parallel with this, the main controller 50 sends the substrate P1 in the ⁇ Y direction on the substrate holder PH to perform the Y-step operation of the substrate P1, as indicated by the solid arrows in FIG.
  • the main controller 50 switches the holding area ADA2 from suction to exhaust, releases the adsorption of the substrate P1, and uses the ⁇ X side substrate Y step feed device 88 to move the substrate P1. This is performed by transporting in the ⁇ Y direction by a Y step distance substantially equal to the width of the shot area in the Y axis direction.
  • the substrate Y step feeding device 88 holds the substrate P1 by suction when the holding area ADA2 is switched from suction to exhaust.
  • the exposure of the shot area SA1 of the substrate P2 and the Y step operation of the substrate P1 are performed in parallel with each substrate as time elapses. Changes in position etc. are shown.
  • the scanning exposure of one substrate (P2) and the Y step operation of the other substrate (P1) are performed in parallel. Can be done. This is because the substrate Y step feeding device 88 used for the Y step is fixed to the coarse motion table 32A and moves integrally with the coarse motion table 32A in synchronization with the substrate holder PH.
  • main controller 50 temporarily stops the Y step operation of the other substrate during the scanning exposure of one substrate, and the other during acceleration and deceleration before and after the scanning exposure of one substrate.
  • the Y step operation of the substrate may be performed.
  • the Y step operation of the other substrate adversely affects the scanning exposure of one substrate (for example, the fine movement is performed so that the reaction force of the driving force of the substrate Y step feeding device 88 does not cause the vibration of the fine movement stage 26).
  • the position control accuracy of the fine movement stage 26 during scanning exposure (and the synchronization accuracy between the mask M and the substrate P2) can be reliably prevented.
  • 75 (D) and 77 show a state where the scanning exposure for the shot area SA1 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the Y-step operation of the substrate P1 is completed, and the shot area SA2 on the substrate P1 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA2 of the substrate P1 is adsorbed and fixed to the holding area ADA2.
  • the remaining portion (about 5/6) of the substrate P1 is a part of the + Y side air levitation unit group 84H, a part of the ⁇ Y side air levitation unit group 84H, and a pair of ⁇ X side air levitation unit groups. It is levitated and supported by an air levitating unit 84I.
  • new alignment measurement of the substrate P1 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA2 provided in advance on the substrate P1 is performed.
  • the same X-step operation as described above is performed on the substrate P1 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 77).
  • the main controller 50 determines the substrate P1 (to the acceleration start position for exposure of the shot area SA2 on the substrate P1) based on the result. In addition, the positioning of the substrate holder PH) and the fine positioning driving in the X axis, Y axis and ⁇ z directions (or 6 degrees of freedom) with respect to the coarse movement table 32A of the fine movement stage 26 are performed.
  • FIG. 78 shows a state immediately after the positioning is completed. In the following description, the description of the precise fine positioning drive of the fine movement stage 26 with respect to the coarse movement table 32A is omitted.
  • the main controller 50 starts acceleration of the substrate P1 and the mask M in the + X direction (see a white arrow in FIG. 78), and scan exposure is performed on the shot area SA2 of the substrate P1 as described above.
  • the main controller 50 performs the same Y-step operation as described above for the substrate P2 that sends the substrate P2 in the + Y direction on the substrate holder PH, as indicated by a solid arrow in FIG. .
  • FIG. 79 shows a state in which the scanning exposure for the shot area SA2 on the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA2 on the substrate P2 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA2 of the substrate P2 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P2 is a part of the + Y side air levitation unit group 84H, a part of the ⁇ Y side air levitation unit group 84H, and a pair of + X side air levitation units. It is supported by the flying unit 84I.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA2 provided in advance on the substrate P2 is performed.
  • the same X-step operation as described above is performed on the substrate P2 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 79). ).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA2 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 80 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration of the substrate P2 and the mask M in the ⁇ X direction (see the white arrow in FIG. 80), and scan exposure is performed on the shot area SA2 of the substrate P2 as described above. .
  • the main controller 50 performs the same Y-step operation as described above for the substrate P1 that sends the substrate P1 in the ⁇ Y direction on the substrate holder PH, as indicated by the black arrow in FIG. Is called.
  • the 81 shows a state in which the scanning exposure for the shot area SA2 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the Y step operation of the substrate P1 is completed, and the shot area SA3 on the substrate P1 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA3 of the substrate P1 is adsorbed and fixed to the holding area ADA2.
  • the remaining portion (about 5/6) of the substrate P1 is supported by levitation by a part of the ⁇ Y side air levitation unit group 84H and a pair of air levitation units 84I on the ⁇ X side.
  • new alignment measurement of the substrate P1 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA3 provided in advance on the substrate P1 is performed.
  • the same X-step operation as described above is performed on the substrate P1 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 81).
  • the main controller 50 determines the substrate P1 (to the acceleration start position for exposure of the shot area SA3 on the substrate P1) based on the result. And the substrate holder PH) are positioned.
  • FIG. 82 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the + X direction between the substrate P1 and the mask M (see the white arrow in FIG. 82), and scan exposure similar to that described above is performed on the shot area SA3 of the substrate P1.
  • the main controller 50 performs the same Y-step operation as described above for the substrate P2 that sends the substrate P2 in the + Y direction on the substrate holder PH, as indicated by a solid arrow in FIG. .
  • the 83 shows a state in which the scanning exposure for the shot area SA3 on the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA3 on the substrate P2 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA3 of the substrate P2 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P2 is supported by levitation by a part of the + Y side air levitation unit group 84H and a pair of + X side air levitation units 84I.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA3 provided in advance on the substrate P2 is performed.
  • the above-described X-step operation of the substrate P2 is performed so that the alignment mark to be measured is located within the detection visual field of the alignment detection system (see the white arrow in FIG. 83).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA3 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 84 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration of the substrate P2 and the mask M in the ⁇ X direction (see the white arrow in FIG. 84), and scan exposure similar to that described above is performed on the shot area SA3 of the substrate P2. .
  • the main controller 50 performs the same Y-step operation as described above for the substrate P1 that sends the substrate P1 in the ⁇ Y direction on the substrate holder PH, as indicated by a solid arrow in FIG. Is called.
  • the substrate P1 is completely removed from the substrate holder PH, and is supported entirely by the ⁇ Y side air floating unit group 84H and the ⁇ Y side air floating unit group 84J. Will come to be.
  • FIG. 85 shows a state in which the scanning exposure for the shot area SA3 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P1 is retracted from the substrate holder PH.
  • main controller 50 switches holding area ADA1 of substrate holder PH from suction to exhaust, and sucks and holds substrate P2 by + Y-side substrate X step feed device 91 (see FIG. 70).
  • the X step distance (a distance approximately twice the length of the shot area in the X axis direction) is conveyed in the ⁇ X direction.
  • the main controller 50 sucks and holds the substrate P1 by the substrate Y step feeding device 91 (see FIG. 70) on the ⁇ Y side, and the + X direction as indicated by the black arrow in FIG. To the X step distance.
  • the transport of the substrate P1 in the + X direction and the transport of the substrate P2 in the ⁇ X direction are performed without causing the two to interfere with each other.
  • FIG. 86 shows the positional relationship between the substrates P1 and P2 with respect to the substrate holder PH when the conveyance of the X step distance between the substrate P1 and the substrate P2 is completed.
  • the main controller 50 holds the substrate P1 by suction using the + X side substrate Y step feeding device 88 and cancels the suction of the substrate P1 by the ⁇ Y side substrate X step feeding device 91. Is done. Then, as indicated by a black arrow in FIG. 86, the + Y side substrate Y step feeding device 88 performs step movement of the substrate P1 in the + Y direction. Accordingly, the positions of the substrate P1 and the substrate P2 are reversed on the substrate holder PH, but are in the same positional relationship as FIG. 72 on the substrate holder PH (see FIG. 87).
  • the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from exhaust to suction.
  • a part of the substrates P1 and P2 (about 1/6 of the entire substrate) is sucked and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of the air levitation unit 84I and a part of the air levitation unit group 84H
  • a part of the substrates P1 and P2 (the remaining approximately 5/6 of the entire substrate) is levitated and supported.
  • a new alignment measurement of the substrate P1 with respect to the projection optical system PL that is, the alignment mark for the next exposure target shot region (in this case, the shot region SA4 on the substrate P1) provided in advance on the substrate P1. Measurement is performed in the same manner as described above.
  • the main controller 50 drives the coarse movement tables 32A and 32B and finely drives the fine movement stage 26 based on the result.
  • the substrate P1 (and the substrate holder PH) is positioned at the scan start position (acceleration start position).
  • FIG. 87 shows a state immediately after the substrate P1 (and substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P1 in this way. Yes.
  • main controller 50 as indicated by the white arrow in FIG. 87, + X direction between substrate P1 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST). Is started and scan exposure is performed on the shot area SA4 in the same manner as described above.
  • 88 shows a state in which the scanning exposure for the shot area SA4 of the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped.
  • a new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, the alignment mark for the next shot area to be exposed (the shot area SA4 on the substrate P2 in this case) provided in advance on the substrate P2. Measurement is performed in the same manner as described above.
  • the main controller 50 prepares the substrate P2 (and the substrate holder PH) in preparation for acceleration for the next exposure based on the result.
  • the X step operation of the substrate P2 (and the substrate holder PH) that is slightly driven in the ⁇ X direction is performed in the same manner as described above, as indicated by the white arrow.
  • FIG. 89 shows a state immediately after the substrate P2 (and substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P2 in this way. Yes.
  • main controller 50 determines + X direction between substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST). Is started and scan exposure is performed on the shot area SA4 in the same manner as described above. In parallel with this, the main controller 50 sends the substrate P1 in the + Y direction on the substrate holder PH and performs the same Y-step operation as described above for the substrate P1, as indicated by the solid arrows in FIG. .
  • FIG. 90 shows a state in which the scanning exposure for the shot area SA4 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the Y step operation of the substrate P1 is finished, and the shot area SA5 on the substrate P1 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA5 of the substrate P1 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P1 is a part of the + Y side air levitation unit group 84H, a part of the ⁇ Y side air levitation unit group 84H, and a pair of + X side air levitation units. It is supported by the flying unit 84I.
  • new alignment measurement of the substrate P1 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P1 is performed.
  • the same X-step operation as described above is performed on the substrate P1 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 90).
  • the main controller 50 determines the substrate P1 (to the acceleration start position for exposure of the shot area SA5 on the substrate P1) based on the result. And the substrate holder PH) are positioned.
  • FIG. 91 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration of the substrate P1 and the mask M in the ⁇ X direction (see the white arrow in FIG. 91), and scan exposure is performed on the shot area SA5 of the substrate P1 as described above. .
  • the main controller 50 performs the same Y-step operation as described above for the substrate P2 that sends the substrate P2 in the -Y direction on the substrate holder PH, as indicated by the black arrow in FIG. Is called.
  • FIG. 92 shows a state in which the scanning exposure for the shot area SA5 on the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA5 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA5 of the substrate P2 is adsorbed and fixed to the holding area ADA2.
  • the remaining part (about 5/6) of the substrate P2 is a part of the + Y side air levitation unit group 84H, a part of the ⁇ Y side air levitation unit group 84H, and a pair of ⁇ X side air levitation unit groups. It is levitated and supported by an air levitating unit 84I.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P2 is performed.
  • the same X-step operation as described above is performed on the substrate P2 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 92).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA5 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 93 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the + X direction between the substrate P2 and the mask M (see the white arrow in FIG. 93), and scan exposure is performed on the shot area SA5 of the substrate P2 as described above.
  • the main controller 50 performs the same Y-step operation as described above for the substrate P1 that sends the substrate P1 in the + Y direction on the substrate holder PH, as indicated by the black arrow in FIG. .
  • FIG. 94 shows a state in which the scanning exposure for the shot area SA5 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P1 has finished the Y step operation, and the shot area SA6 on the substrate P1 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA6 of the substrate P1 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P1 is supported by levitation by a part of the + Y side air levitation unit group 84H and the pair of air levitation units 84I on the + X side.
  • new alignment measurement of the substrate P1 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA6 provided in advance on the substrate P1 is performed.
  • the same X-step operation as described above is performed on the substrate P1 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 94).
  • the main controller 50 determines the substrate P1 (to the acceleration start position for exposure of the shot area SA6 on the substrate P1) based on the result. And the substrate holder PH) are positioned.
  • FIG. 95 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the ⁇ X direction between the substrate P1 and the mask M (see the white arrow in FIG. 95), and scan exposure similar to that described above is performed on the shot area SA6 of the substrate P1. .
  • the main controller 50 performs the same Y step operation as described above of the substrate P2 to send the substrate P2 in the ⁇ Y direction on the substrate holder PH as indicated by the black arrow in FIG. Done.
  • FIG. 96 shows a state in which the scanning exposure for the shot area SA6 on the substrate P1 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA6 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA6 of the substrate P2 is adsorbed and fixed to the holding area ADA2.
  • the remaining portion (about 5/6) of the substrate P2 is supported by levitation by a part of the ⁇ Y side air levitation unit group 84H and a pair of air levitation units 84I on the ⁇ X side.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA6 provided in advance on the substrate P2 is performed.
  • the same X-step operation as described above is performed on the substrate P2 so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 96).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA6 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 97 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the + X direction between the substrate P2 and the mask M (see the white arrow in FIG. 97), and scan exposure similar to that described above is performed on the shot area SA6 of the substrate P2.
  • FIG. 98 shows a state in which the scanning exposure for the shot area SA6 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped.
  • the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from suction to exhaust, and sucks and holds the substrate P2 by the ⁇ X side substrate Y step feeding device 88 (see FIG. 70). As shown by a black arrow in 98, it is carried out (conveyed) in the -Y direction. In parallel with this, the main controller 50 sucks and holds the substrate P1 by the + Y-side substrate Y step feeding device 88 (see FIG. 70) and carries it out in the + Y direction as indicated by the white arrow in FIG. (Convey).
  • the exposed substrates P1 and P2 are unloaded, and new substrates P3 and P4 are loaded onto the substrate holder PH as in FIG.
  • the loading and unloading directions of the substrates do not necessarily have to be in the directions indicated by the arrows in FIG. For example, you may carry in and / or carry out from the upper direction or the X-axis direction.
  • the fine movement stage 26 on which the small (1/3 size of the substrate) substrate holder PH is mounted is moved in the direction of one axis (X axis). Since only the substrate is moved in the two-axis (X-axis and Y-axis) directions, the substrate stage device PSTh can be reduced in size and weight, and the substrate holder PH and the substrate stage device PSTh can be reduced in size as in the above embodiments. Various effects accompanying the conversion can be obtained. Further, in the exposure apparatus 900 according to the ninth embodiment, the main controller 50 places a part of each of the two substrates on the holding areas ADA1 and ADA2 of the substrate holder PH, and the substrate holder PH.
  • the other substrate In parallel with the substrate stage which constitutes a part thereof moving in the X-axis direction and a part of the shot area of one substrate is scanned and exposed, the other substrate is moved to the substrate holder by the substrate Y step feeding device 88. It is possible to move in the Y-axis direction with respect to PH. Thereby, after the exposure of one shot area (unexposed area) is completed for the first substrate, the substrate is stepped to expose the next shot area (unexposed area). Exposure and step movement Are alternately repeated to expose the substrate, and the time required for the exposure processing of the two substrates can be shortened as compared with the case where the second substrate is exposed in the same procedure. .
  • the exposure of two substrates is alternately performed, and the Y step time of one substrate can be completely overlapped with the X scan time of the other substrate.
  • (time required for scanning exposure of one shot area + alignment time) ⁇ number of scans (number of shot areas) + ⁇ specifically, conventional step-and-step in which the substrate is not changed over on the substrate holder.
  • the exposure process can be performed in approximately the same time as the exposure process using the scanning method.
  • two substrates are simultaneously loaded onto the substrate holder PH (substrate stage apparatus PST) and simultaneously unloaded from the substrate holder PH (substrate stage apparatus PSTh).
  • two substrates may be alternately carried into and out of the substrate holder PH (substrate stage apparatus PSTh) as in a modification described below.
  • FIG. 100 corresponds to FIG. 85, which is an explanatory view (No. 13) of the exposure procedure in the ninth embodiment described above, but in accordance with an instruction from the main controller 50, a carry-out device (not shown) At this point, the substrate P1 is carried out of the substrate stage apparatus PSTh (see the thick black arrow in FIG. 100). The ⁇ X side half of the substrate P1 may be left unexposed as shown in FIG. 100 or may be exposed in advance.
  • the main controller 50 suctions and holds the substrate P2 by the + Y side substrate X step feeding device 91 (see FIG. 70).
  • the X step distance (distance approximately twice the length of the shot area in the X axis direction) is conveyed in the ⁇ X direction.
  • FIG. 101 shows the positional relationship of the substrate P2 with respect to the substrate holder PH when the conveyance of the X step distance of the substrate P2 is completed. At this time, a new substrate P3 is carried onto the ⁇ Y side air levitation unit groups 84H and 84J.
  • the main controller 50 sucks and holds the substrate P3 using the + Y side substrate Y step feeding device 88, and the + P direction of the substrate P3 in the + Y direction is indicated by the black arrow in FIG. Step movement is performed.
  • the state shown in FIG. 102 is obtained, and the substrate P2 and the substrate P3 have the same positional relationship as the substrate P1 and the substrate P2 in FIG. 72 on the substrate holder PH.
  • the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from exhaust to suction. Accordingly, a part of the substrates P3 and P2 (about 1/6 of the entire substrate) is sucked and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of the air levitation unit 84I and a part of the air levitation unit group 84H As a result, part of the substrates P3 and P2 (the remaining approximately 5/6 of the entire substrate) is levitated and supported.
  • the main controller 50 drives the coarse movement tables 32A and 32B and finely drives the fine movement stage 26 based on the result.
  • the substrate P3 (and the substrate holder PH) is positioned at the scan start position (acceleration start position).
  • FIG. 102 shows a state immediately after the substrate P3 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P3 in this way. Yes.
  • main controller 50 determines + X direction between substrate P3 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST). Is started and scan exposure is performed on the shot area SA1 in the same manner as described above.
  • FIG. 103 shows a state in which the scanning exposure for the shot area SA1 of the substrate P3 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped.
  • a new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, the alignment mark for the next shot area to be exposed (the shot area SA4 on the substrate P2 in this case) provided in advance on the substrate P2. Measurement is performed in the same manner as described above.
  • the main controller 50 prepares the substrate P2 (and the substrate holder PH) in preparation for acceleration for the next exposure based on the result.
  • the X step operation of the substrate P2 (and substrate holder PH) that is slightly driven in the ⁇ X direction is performed in the same manner as described above.
  • FIG. 104 shows a state immediately after the substrate P2 (and substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P2 in this way. Yes.
  • main controller 50 as indicated by the white arrow in FIG. 104, + X direction between substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST) Is started and scan exposure is performed on the shot area SA4 in the same manner as described above.
  • the main controller 50 sends the substrate P3 in the + Y direction on the substrate holder PH and performs the same Y-step operation as described above for the substrate P3, as indicated by the solid arrows in FIG. .
  • FIG. 105 shows a state in which the scanning exposure for the shot area SA4 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P3 has finished the Y step operation, and the shot area SA2 on the substrate P3 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA2 of the substrate P3 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P3 is a part of the + Y side air floating unit group 84H, a part of the ⁇ Y side air floating unit group 84H, and a pair of + X side air floating units. It is supported by the flying unit 84I.
  • new alignment measurement of the substrate P3 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA2 provided in advance on the substrate P3 is performed.
  • the above-described X-step operation of the substrate P3 is performed so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 105).
  • the main controller 50 determines the substrate P3 (to the acceleration start position for exposure of the shot area SA2 on the substrate P3) based on the result. And the substrate holder PH) are positioned.
  • FIG. 106 shows a state immediately after the positioning is completed.
  • main controller 50 starts acceleration in the ⁇ X direction between substrate P3 and mask M (see the white arrow in FIG. 106), and scan exposure is performed on shot area SA2 of substrate P3 as described above. .
  • the main controller 50 performs the same Y step operation as described above for the substrate P2 that sends the substrate P2 in the ⁇ Y direction on the substrate holder PH, as indicated by the solid arrows in FIG. Is called.
  • FIG. 107 shows a state in which the scanning exposure for the shot area SA2 on the substrate P3 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA5 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA5 of the substrate P2 is adsorbed and fixed to the holding area ADA2.
  • the remaining part (about 5/6) of the substrate P2 is a part of the + Y side air levitation unit group 84H, a part of the ⁇ Y side air levitation unit group 84H, and a pair of ⁇ X side air levitation unit groups. It is levitated and supported by an air levitating unit 84I.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P2 is performed.
  • the above-described X-step operation of the substrate P2 is performed so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 107).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA5 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 108 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the + X direction between the substrate P2 and the mask M (see the white arrow in FIG. 108), and scan exposure is performed on the shot area SA5 of the substrate P2 as described above.
  • the main controller 50 performs the same Y-step operation as described above for the substrate P3 that sends the substrate P3 in the + Y direction on the substrate holder PH, as indicated by a solid arrow in FIG. .
  • FIG. 109 shows a state in which the scanning exposure for the shot area SA5 on the substrate P2 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the Y step operation of the substrate P3 is finished, and the shot area SA3 on the substrate P3 is located on the holding area ADA1 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA3 of the substrate P3 is adsorbed and fixed to the holding area ADA1.
  • the remaining portion (about 5/6) of the substrate P3 is supported by levitation by a part of the + Y side air levitation unit group 84H and a pair of + X side air levitation units 84I.
  • new alignment measurement of the substrate P3 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA3 provided in advance on the substrate P3 is performed.
  • the above-described X-step operation of the substrate P3 is performed so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 109).
  • the main controller 50 determines the substrate P3 (to the acceleration start position for exposure of the shot area SA3 on the substrate P3 based on the result). And the substrate holder PH) are positioned.
  • FIG. 110 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration in the ⁇ X direction between the substrate P3 and the mask M (see the white arrow in FIG. 110), and scan exposure similar to that described above is performed on the shot area SA3 of the substrate P3. .
  • the main controller 50 performs the same Y-step operation as described above for the substrate P2 that sends the substrate P2 in the ⁇ Y direction on the substrate holder PH, as indicated by the black arrow in FIG. Is called.
  • FIG. 111 shows a state in which the scanning exposure for the shot area SA3 on the substrate P3 is completed and the substrate stage (PH, 26, 28, 32A, 32B) is stopped. At this time, the substrate P2 has finished the Y step operation, and the shot area SA6 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.
  • the main controller 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the 1/6 portion including the shot area SA6 of the substrate P2 is adsorbed and fixed to the holding area ADA2.
  • the remaining portion (about 5/6) of the substrate P2 is supported by levitation by a part of the ⁇ Y side air levitation unit group 84H and a pair of air levitation units 84I on the ⁇ X side.
  • new alignment measurement of the substrate P2 with respect to the projection optical system PL that is, measurement of the alignment mark for the next shot area SA6 provided in advance on the substrate P2 is performed.
  • the above-described X-step operation of the substrate P2 is performed so that the alignment mark to be measured is positioned within the detection visual field of the alignment detection system (see the white arrow in FIG. 111).
  • the main controller 50 determines the substrate P2 (to the acceleration start position for exposure of the shot area SA6 on the substrate P2) based on the result. And the substrate holder PH) are positioned.
  • FIG. 112 shows a state immediately after the positioning is completed.
  • the main controller 50 starts acceleration of the substrate P2 and the mask M in the + X direction (see a white arrow in FIG. 112), and scan exposure similar to that described above is performed on the shot area SA6 of the substrate P2.
  • FIG. 113 shows a state where the substrate stage (PH, 26, 28, 32A, 32B) is stopped after the scan exposure for the shot area SA6 on the substrate P2 is completed.
  • the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from suction to exhaust, and sucks and holds the substrate P2 by the ⁇ X side substrate Y step feeding device 88 (see FIG. 70). As shown by a black arrow in 113, it is carried out (conveyed) in the -Y direction. In parallel with this, the main controller 50 sucks and holds the substrate P3 by the + Y side substrate X step feeding device 91 (see FIG. 70). When the substrate P2 is completely retracted from the substrate holder PH, the main controller 50 conveys the substrate P3 in the ⁇ X direction by an X step distance as indicated by a white arrow in FIG.
  • the substrate P2 that has been exposed on the entire surface of the substrate is unloaded, and a new substrate P4 is loaded onto the holding area ADA1 of the substrate holder PH.
  • the shot area to be exposed is changed and the efficiency of the substrate exchange operation is high.
  • the two-axis movement of the X axis and the Y axis as shown in the exposure procedure of the ninth embodiment, 13 and 14 (FIGS. 85 and 86), as performed on the substrate P1 is performed. Disappear.
  • the exchange operation can be performed in a short time even if one unillustrated loading device and unloading device are involved in loading and unloading the substrate.
  • the holding regions ADA1 and ADA2 of the substrate holder PH are approximately 1/6 of the area of the substrate, respectively, two surfaces in the X-axis direction (two scans) and three in the Y-axis direction.
  • the present invention is not limited to this, and each of the holding regions ADA1 and ADA2 of the substrate holder PH is set to an area of about 1/4 of the substrate. You may do it. In this case, it is possible to cope with four chamfering of two surfaces in the X-axis direction (two scans) and two surfaces in the Y-axis direction (two scans).
  • the arrangement relationship between the two substrates arranged on the substrate holder PH and the order of changing the exposure area are merely examples, and are not limited to this.
  • scanning exposure is alternately performed on one and the other of the two substrates (therefore, the Y step operation of the other substrate and the one substrate is performed in parallel with this.
  • two substrates are placed on the holding areas ADA1 and ADA2 on the substrate holder PH, and at least partly the scanning exposure of at least one shot area of one substrate and the Y step operation of the other substrate are at least partially parallel.
  • the present invention is not limited to this, and two independent substrate holders are used. It may be fixed side by side on the fine movement stage.
  • the substrate X step feeding device 91 and the substrate Y step feeding device 88 are arranged around the substrate holder PH. However, the two substrates are moved with respect to the substrate holder PH so as to have the same positional relationship as described above. If possible, the arrangement, number, etc. of the substrate X step feeding device 91 and the substrate Y step feeding device 88 may be arbitrary. However, since the substrate Y step feeding device 88 needs to perform the scanning exposure on the shot area on one substrate and the Y step feeding of the other substrate in parallel, the fine movement stage 26 on which the substrate holder PH is mounted or the substrate holder It is necessary to provide on the moving body which moves integrally with PH.
  • FIG. 115 shows a partially omitted plan view of the exposure apparatus 1000 according to the tenth embodiment.
  • FIG. 116 a schematic side view of the exposure apparatus 1000 viewed from the + X direction is partially omitted.
  • the coarse motion table 32 is partially shown in a sectional view together with the weight cancellation device 28, as in FIG.
  • the exposure apparatus 1000 according to the tenth embodiment differs from the above-described ninth embodiment in that a substrate stage apparatus PSTi is provided instead of the above-described substrate stage apparatus PSTh.
  • the configuration and the like are the same as those in the ninth embodiment described above.
  • the substrate stage apparatus PSTi includes a coarse movement stage portion 24 ′ instead of the coarse movement stage portion 24 described above, as shown in FIG. 116.
  • the coarse movement stage unit 24 ′ includes two (a pair) of X beams 30 A ′ and 30 B ′, a coarse movement table 32, and two X beams 30 A ′ and 30 B ′.
  • a plurality of legs 34 supported on the floor surface F.
  • the coarse motion table 32 is provided in place of the two coarse motion tables 32A and 32B provided in the substrate stage apparatus PSTh, for example, and as can be seen from FIGS. 115 and 116, the coarse motion tables 32A and 32B are integrated. And having a shape that is reduced in size in the Y-axis direction.
  • each part of the coarse movement stage unit 24 ′ is the same as that of the substrate stage apparatus PSTc included in the exposure apparatus according to the fourth embodiment described above, for example, detailed description thereof is omitted.
  • the air levitation units on both sides in the Y-axis direction of the substrate holder PH are separated from the coarse motion table 32 and installed on the floor surface F. Further, along with these, a pair of substrate Y step feeding devices 88 and a pair of substrate X step feeding devices 91 are attached to the fine movement stage 26.
  • each of the pair of frames 110A ′ and 110B ′ prevents the floor F from contacting the gantry 18. It is installed on the top.
  • a pair of air levitation unit groups 84 ⁇ / b> H ′ is installed on the upper surfaces of the pair of frames 110 ⁇ / b> A ′ and 110 ⁇ / b> B ′.
  • Each of the pair of air levitation unit groups 84H ′ is disposed on both sides of the substrate holder PH in the Y-axis direction, as shown in FIGS. 115 and 116. As shown in FIG. 115, each of the pair of air levitation unit groups 84H ′ has a width in the Y-axis direction that is somewhat shorter than the width in the Y-axis direction of the substrate (for example, P1 or P2), and the length in the X-axis direction.
  • a predetermined gap is provided in the X-axis direction and the Y-axis direction. It is composed of a plurality of air levitation units arranged.
  • the upper surface of each air levitation unit of the pair of air levitation unit groups 84H ' is set to be equal to or slightly lower than the upper surface of the substrate holder PH.
  • each of the pair of air levitation unit groups 84I ' includes a plurality of, for example, three air levitation units elongated in the Y axis direction, which are arranged at predetermined intervals in the X axis direction.
  • the length of each air levitation unit in the Y-axis direction is somewhat shorter than the distance between the pair of air levitation unit groups 84H ′.
  • Each of the pair of air levitation unit groups 84I ' is fixed to the upper surface of the coarse movement table 32 in the same manner as the air levitation unit 84I.
  • the support surfaces (upper surfaces) of the air levitation units constituting the pair of air levitation unit groups 84H ′ and the pair of air levitation unit groups 84I ′ are the same as the air levitation unit 84 described above.
  • it is a thrust type air bearing structure having a plurality of minute holes.
  • Each air levitation unit can float and support a part of the substrate by supplying pressurized gas (for example, high-pressure air) from the above-described gas supply device. On / off of the supply of high-pressure air to each air levitation unit is controlled by main controller 50.
  • the pair of air levitation unit groups 84H ′ and the pair of air levitation unit groups 84I ′ described above cause the substrate to move in the X-axis direction by the substrate stage (PH, 26, 28, 32), for example, Even when the full stroke is moved, the substrate can be prevented from sagging and can be supported in a floating manner.
  • each of the pair of air levitation unit groups 84H ′ may be replaced with a single large air levitation unit as long as it has a total support area substantially equal to that of the rectangular area.
  • the shape or size of the levitation unit may be different from the case of FIG. 115 and distributed in the rectangular area.
  • the shape or size of each air levitation unit may be different from that in FIG.
  • a pair of substrate X step feeding apparatuses 91 are arranged on both sides of the substrate holder PH in the Y-axis direction, and are fixed to the fine movement stage 26 via a support member.
  • a pair of substrate Y step feeding devices 88 are disposed on both sides of the substrate holder PH in the X-axis direction, and are fixed to the fine movement stage 26 via a support member (see FIG. 115).
  • the pair of Y interferometers 98Y 1 and 98Y 2 includes a plurality of air levitation units in the first row that are close to the substrate holder PH and constitute the air levitation unit group 84H ′ on the ⁇ Y side.
  • the two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA.
  • the Y moving mirror 94Y is irradiated with the measurement beam (measurement beam) from the pair of Y interferometers 98Y 1 and 98Y 2 through the above-mentioned two gaps.
  • the configuration of the other parts of the substrate stage apparatus PSTi is the same as that of the substrate stage apparatus PSTh described above.
  • a substrate feeding device (not shown) different from the substrate X step feeding device 91 and the substrate Y step feeding device 88 described above is provided near the pair of air levitation unit groups 84H ′. It is good also as carrying out.
  • a series of operations such as substrate replacement, alignment, and exposure are performed in the same procedure as the exposure apparatus 900 according to the ninth embodiment described above.
  • the air levitation unit group 84H ′ on both sides in the Y-axis direction of the substrate holder PH is fixed, and is configured by a plurality of air levitation units arranged in a wide range with respect to the X-axis direction.
  • the substrate replacement shown in the exposure procedure explanatory diagram (No.
  • the air levitation unit group 84H ′ on both sides in the Y-axis direction of the substrate holder PH is separated from the substrate stage (coarse motion table 32).
  • the load on the table 32) is reduced, and the controllability of the substrate stage is improved.
  • each air levitation unit of the air levitation unit group 84H ′ does not move, there is no possibility that the measurement beams of the Y interferometers 98Y 1 and 98Y 2 that measure the Y-axis direction position of the fine movement stage 26 are blocked by the air levitation unit. . Therefore, the Y interferometers 98Y 1 and 98Y 2 can be installed on the side frame 20 of the apparatus main body outside ( ⁇ Y side) the air levitation unit group 84H ′ (see FIGS. 115 and 116). .
  • the movable air levitation unit, the substrate X step feeding device 91, and the substrate Y step feeding device 88 are mechanically different from the substrate holder PH (that is, the fine movement stage 26). It may be attached to the separated coarse motion table 32 or may be attached to the substrate holder PH or the fine motion stage 26 integrally.
  • a part of the plurality of air levitation units constituting the pair of air levitation unit groups 84H ′ is attached to the substrate stage (coarse movement table 32 or fine movement stage 26), and the first embodiment described above.
  • a movable air levitation unit may be used as in the embodiment.
  • the ⁇ Y side air floating unit group 84H ′ of the substrate holder PH is configured by a fixed air floating unit, and the + Y side air floating unit group of the substrate holder 84H may be mounted on the substrate stage (coarse movement table 32) to be movable.
  • the fixed air levitation unit group 84H ′ is mechanically and vibrationally separated from the body BD (exposure apparatus main body) on which the substrate stage is mounted and installed on the floor surface F. You may install on BD.
  • FIG. 120 schematically shows the arrangement of an exposure apparatus 1100 according to the eleventh embodiment.
  • a plurality of alignment detection systems AL for detecting alignment marks on the substrate are substrate holders on which substrates P1, P2, etc. are placed. PH is provided.
  • At least two alignment marks correspond to one of the plurality of alignment detection systems AL on the back surface (the surface on the ⁇ Z side). It is provided at a predetermined position.
  • Each alignment mark has, for example, a plurality of scale lines, and the alignment detection system AL can measure the position of the substrate with respect to the substrate holder PH (or the amount of displacement from the reference position).
  • the exposure apparatus 1100 includes the substrate stage apparatus PSTh, and are configured in the same manner as the exposure apparatus 900 according to the ninth embodiment described above. Therefore, the exposure apparatus 1100 according to the eleventh embodiment can obtain the same effects as those of the exposure apparatus 900 according to the ninth embodiment.
  • the exposure apparatus 1100 can measure the alignment of the substrate even when the substrate stage including the fine movement stage 26 is moving. Specifically, main controller 50 can perform alignment measurement on the substrate holder PH of the other substrate during the X scan for one of the two substrates, for example, substrates P1 and P2.
  • the main controller 50 moves the other substrate slightly along with the fine movement stage 26 (substrate holder PH) based on the result of the alignment measurement, The position of the other substrate can be corrected. For this reason, after the scanning exposure of one substrate is completed, the scanning exposure of the other substrate can be started immediately, and the throughput is improved.
  • the alignment detection system AL is not limited to the substrate holder PH, and may be provided on the fine movement stage 26 on which the substrate holder PH is mounted.
  • the air levitation unit, the substrate Y step feeding device, the substrate X step feeding device and the like mounted on the coarse motion table are mounted on the fine motion stage.
  • another moving body that moves following the coarse movement table may be provided, and an air floating unit may be mounted on the other moving body so as to be movable in the X-axis direction.
  • the substrate Y step feeding device 88 described above may be provided on another moving body that moves following the coarse movement table on which the air levitation unit is mounted.
  • the substrate X step feeding device 91 may be disposed outside the substrate stage.
  • the width of the substrate holder PH in the Y-axis direction is about 1/3 or 1/2 of the substrate.
  • the width of the substrate holder PH in the Y-axis direction is As long as it is clearly shorter than the width of the holder PH in the Y-axis direction, it is not limited to these.
  • the width of the substrate holder PH in the Y-axis direction may be equal to or greater than the exposure field width (Y direction) by the projection optical system. For example, if the exposure field width (Y direction) by the projection optical system is about 1 / n of the substrate (n is an integer of 2 or more), the width of the substrate holder PH is also about 1 / n of the Y direction dimension of the substrate.
  • the width in the Y-axis direction of the air levitation unit disposed on both sides of the substrate holder PH in the Y-axis direction is approximately (n ⁇ 1) / of the dimension in the Y-axis direction of the substrate in order to suppress the substrate from bending. n is good.
  • the substrate Y step feeding device it is desirable for the substrate Y step feeding device to have a Y stroke that can move the entire substrate to a region on the substrate holder.
  • the present invention is not limited thereto, and the substrate is provided with a contact-type rolling bearing using a roller or a ball.
  • the drooping prevention device may be replaced with at least a part of the air levitation unit of each of the above embodiments.
  • a substrate drooping prevention device including a bearing member other than the air floating unit and the rolling bearing may be used.
  • the weight canceling device (center column) may be separated from the fine movement stage (see FIGS. 1 and 3) as in the first embodiment, or the second to eleventh ones. It may be integrated with the fine movement stage as in the embodiment. Further, the feeler for the target of the leveling sensor may not be provided. Further, the leveling mechanism and the weight cancellation mechanism may be arranged upside down. Thus, the structure of the weight cancellation device is not limited to the above-described embodiments.
  • the present invention is not limited to this.
  • the holding portion having the same function as the substrate holder PH for holding the substrate may be formed integrally with the fine movement stage.
  • the substrate support apparatus such as an air levitation unit does not hang down due to the weight of the substrate.
  • a weight cancellation device is not essential.
  • a moving stage for moving the substrate holder is required, but the moving stage may be a so-called coarse / fine moving stage or a single 6DOF stage.
  • the moving stage only needs to be able to drive the substrate holder in the XY plane (at least in the X-axis direction), and it is more desirable if it can be driven in the direction of six degrees of freedom.
  • the components of the first to eleventh embodiments may be arbitrarily combined as long as the configurations do not contradict each other.
  • the exposure apparatus is a projection exposure apparatus that performs scanning exposure with a step-and-scan operation of the substrate P.
  • the present invention is not limited to this, and the step-and-stitch method is used.
  • the above-described embodiments can also be applied to a proximity exposure apparatus that does not use a projection optical system.
  • the illumination light is ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F 2 laser light (wavelength 157 nm). It may be.
  • the illumination light for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium).
  • harmonics converted into ultraviolet light using a nonlinear optical crystal may be used.
  • a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.
  • the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical systems (projection optical units) has been described. Not limited to one or more.
  • the projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example.
  • the projection optical system PL has an equal magnification
  • the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.
  • a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used.
  • an electronic mask (variable molding mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, for example, Alternatively, a variable molding mask using DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (also referred to as a spatial light modulator) may be used.
  • DMD Digital Micro-mirror Device
  • the exposure apparatus is a substrate having a size (including at least one of an outer diameter, a diagonal line, and one side) of 500 mm or more, for example, a large substrate for a flat panel display (FPD) such as a liquid crystal display element. It is particularly effective to apply to an exposure apparatus that performs exposure. This is because the present invention has been made to cope with an increase in the size of the substrate.
  • FPD flat panel display
  • a liquid crystal display element as a micro device can be manufactured using the exposure apparatus according to each of the above embodiments.
  • a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (such as a glass substrate coated with a resist).
  • a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate.
  • the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, whereby a predetermined pattern is formed on the substrate.
  • a liquid crystal display element as a micro device can be obtained through a color filter forming process, a cell assembling process, a module assembling process, and the like.
  • the exposure apparatus has been described as the substrate processing apparatus.
  • the present invention is not limited to this, and for example, a substrate other than an exposure apparatus such as an element manufacturing apparatus provided with an ink jet type functional liquid application apparatus or an inspection apparatus. At least some of the first to eleventh embodiments may be applied to the processing apparatus.
  • the substrate processing apparatus and the substrate processing method of the present invention are suitable for processing large substrates.
  • the exposure method and exposure apparatus of the present invention are suitable for exposure of a large substrate.
  • the device manufacturing method and the flat panel display manufacturing method of the present invention are suitable for manufacturing liquid crystal display elements and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

L'invention concerne un dispositif d'exposition pour traitement d'exposition d'un substrat (P), lequel dispositif comporte: un plateau de micromouvement possédant un support (PH) de substrat destiné à maintenir une partie du substrat (P) à plat et se déplaçant par rapport à un emplacement d'exposition (zone d'exposition (IA)) en direction d'un axe X; ainsi qu'un dispositif (88) de placement du substrat de pas Y, lequel entraîne le substrat (P) en direction d'un axe Y dans un plan XY. Dans ce cas, le déplacement en direction de l'axe X par rapport à la zone d'exposition (IA) du plateau de micromouvement maintenant une partie du substrat (P) à plat grâce au support (PH) de substrat est effectué après déplacement du substrat (P) en direction de l'axe Y au moyen du dispositif (88) de déplacement du substrat de Y, et plusieurs zones situées sur le substrat (P) sont soumises à un traitement d'exposition.
PCT/JP2012/005466 2011-08-30 2012-08-30 Dispositif de traitement de substrat et procédé de traitement de substrat, procédé d'exposition et dispositif d'exposition ainsi que procédé de fabrication d'un dispositif et procédé de fabrication d'un écran plat WO2013031223A1 (fr)

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KR1020147008312A KR102105809B1 (ko) 2011-08-30 2012-08-30 기판 처리 장치 및 기판 처리 방법, 노광 방법 및 노광 장치 그리고 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법
CN201280042608.XA CN103782239B (zh) 2011-08-30 2012-08-30 基板处理装置及基板处理方法、曝光方法及曝光装置、以及元件制造方法、及平板显示器的制造方法
KR1020207011723A KR102226989B1 (ko) 2011-08-30 2012-08-30 기판 처리 장치 및 기판 처리 방법, 노광 방법 및 노광 장치 그리고 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법
JP2013531102A JP6071068B2 (ja) 2011-08-30 2012-08-30 露光方法及び露光装置、並びにデバイス製造方法及びフラットパネルディスプレイの製造方法

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WO2018062483A1 (fr) * 2016-09-30 2018-04-05 株式会社ニコン Dispositif d'exposition, procédé de fabrication d'écran plat, procédé de fabrication de dispositif et procédé d'exposition
JPWO2018062483A1 (ja) * 2016-09-30 2019-07-04 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法

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