WO2013020469A1 - Composé ester bis-phosphonyl phosphonate - Google Patents
Composé ester bis-phosphonyl phosphonate Download PDFInfo
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- WO2013020469A1 WO2013020469A1 PCT/CN2012/079445 CN2012079445W WO2013020469A1 WO 2013020469 A1 WO2013020469 A1 WO 2013020469A1 CN 2012079445 W CN2012079445 W CN 2012079445W WO 2013020469 A1 WO2013020469 A1 WO 2013020469A1
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- Prior art keywords
- compound
- meth
- formula
- reaction
- ethylenically unsaturated
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- 150000001875 compounds Chemical class 0.000 claims abstract description 35
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 150000003254 radicals Chemical class 0.000 claims abstract description 7
- -1 n-octyl Chemical group 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 16
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000005935 nucleophilic addition reaction Methods 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000005886 esterification reaction Methods 0.000 claims description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 125000004434 sulfur atom Chemical group 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 238000003848 UV Light-Curing Methods 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- NXHPIYRSMIFFBV-UHFFFAOYSA-N formaldehyde;1,3,5-trimethylbenzene Chemical compound O=C.CC1=CC(C)=CC(C)=C1 NXHPIYRSMIFFBV-UHFFFAOYSA-N 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 238000010526 radical polymerization reaction Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- 229920006243 acrylic copolymer Polymers 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 150000001299 aldehydes Chemical class 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- FDWNORQBNLVBQI-UHFFFAOYSA-N decoxymethanediol Chemical compound CCCCCCCCCCOC(O)O FDWNORQBNLVBQI-UHFFFAOYSA-N 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 230000032050 esterification Effects 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 claims description 2
- 239000011964 heteropoly acid Substances 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 238000011065 in-situ storage Methods 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 claims description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000007858 starting material Substances 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 125000003944 tolyl group Chemical group 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract 2
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000003847 radiation curing Methods 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- KNZSPKGFNVVCLS-UHFFFAOYSA-N 1,3,5-trimethylcyclohexa-2,4-diene-1-carbaldehyde Chemical compound CC1=CC(C)=CC(C)(C=O)C1 KNZSPKGFNVVCLS-UHFFFAOYSA-N 0.000 description 1
- 229940122361 Bisphosphonate Drugs 0.000 description 1
- 0 Cc1cc(C)c(C(O)P(C(c2c(C)cc(C)cc2C)O)(O*)=O)c(C)c1 Chemical compound Cc1cc(C)c(C(O)P(C(c2c(C)cc(C)cc2C)O)(O*)=O)c(C)c1 0.000 description 1
- HIKRJHFHGKZKRI-UHFFFAOYSA-N Cc1cc(C)c(C=O)c(C)c1 Chemical compound Cc1cc(C)c(C=O)c(C)c1 HIKRJHFHGKZKRI-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- RMNRDBFBZMUPHB-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.CCCCCC Chemical compound OC(=O)C=C.OC(=O)C=C.CCCCCC RMNRDBFBZMUPHB-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000006612 decyloxy group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- XKCQASMZNPBLKI-UHFFFAOYSA-N phosphorosooxymethane Chemical compound COP=O XKCQASMZNPBLKI-UHFFFAOYSA-N 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N tert-butyl alcohol Substances CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/28—Phosphorus compounds with one or more P—C bonds
- C07F9/30—Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
- C07F9/32—Esters thereof
- C07F9/3205—Esters thereof the acid moiety containing a substituent or a structure which is considered as characteristic
- C07F9/3247—Esters of acids containing the structure -C(=X)-P(=X)(R)(XH) or NC-P(=X)(R)(XH), (X = O, S, Se)
- C07F9/3252—Esters of acids containing the structure -C(=X)-P(=X)(R)(XH) or NC-P(=X)(R)(XH), (X = O, S, Se) containing the structure -C(=X)-P(=X)(R)(XR), (X = O, S, Se)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
Definitions
- the invention relates to the technical field of new materials for UV light radiation radical polymerization, in particular to a structural formula such as
- phosphono-type structural compounds are important photoinitiators in the field of UV ultraviolet radiation curing due to their long-wavelength light absorption and photobleaching properties, and have been widely disclosed in the patent literature, such as US 5,218,009, EP 0 615 980 A2, and CN 1 659 175 A. New preparation processes for some phosphono-type structural compounds have also been the focus of recent research. Representative patent documents such as WO2006/056541 Al o However, the cost and price of phosphono-type photoinitiator compounds are often significantly higher than other photoinitiator compounds.
- the disclosed preparation process inevitably uses highly air-sensitive alkali metals (sodium, potassium, or lithium metal) to undergo lengthy reaction times and operational steps to prepare corresponding
- the metal phosphine compound the yield is low (for example, the final product obtained in the above-mentioned latest process WO2006/056541A1 often has a yield of less than 30%), and the production safety hazard is large, which severely limits the economic and environmentally friendly promotion of the compound. . Therefore, the identification of new and more economical phosphono-type structural compounds, as well as the development of its new preparation process and application, is a very valuable application challenge in the field of new UV radiation curing materials.
- a bisphosphonophosphonate compound of the formula I is an effective ethylenically unsaturated compound system UV radical photopolymerization curing photoinitiator.
- Compound I (as defined in the following claims) is not only a new structure not reported, but equally important they must be prepared in a new economical process that is completely different from the literature disclosure method.
- R is a linear or branched fluorenyl group having 1 to 24 carbon atoms, and the fluorenyl group may be no more than 4 non-continuous oxygen atoms, nitrogen atoms, silicon atoms, or sulfur atoms.
- the fluorenyl group may have 1 to 40 fluorine atoms; or R is a phenyl group having 6 to 24 carbon atoms or a substituted phenyl group having 1 to 4 substituents, and these substituents may also be no more than Four discontinuous oxygen atoms, nitrogen atoms, silicon atoms, or sulfur atoms are interrupted.
- R methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, phenyl, tolyl.
- the bisphosphono-type compound manufacturing method disclosed in the literature can prepare a series of structures containing a fluorenyl group (branched or linear) or an aryl group (multiple substituents) on a phosphorus atom, such as a patented technology.
- WO2006/056541A1 and CN1659175A but their phosphorus-carbon bond formation chemical reaction characteristics determine that it is not possible to prepare phosphorus-containing structures of the formula I containing an OR group (decyloxy or aryloxy) on a phosphorus atom. Oxygen bond compound.
- the present application has now found that compounds of formula I can be conveniently produced economically via the following reaction formula.
- the industrially inexpensive and safe H 3 PO 2 iypophosphorous acid is the key starting material, and the intermediate hypophosphite is obtained via the R-based esterification reaction, followed by the homo-xylene formaldehyde.
- the carbonyl nucleophilic addition reaction gives a higher intermediate.
- the target compound I can be obtained by catalytic oxidation of B by a hydroxyl group.
- the core feature of this process is the preparation of a hydroxyphosphonate higher intermediate of the general formula B by a bis-carbonyl nucleophilic addition reaction using a hypophosphite of the formula ⁇ and a mesitylene formaldehyde.
- the reaction may be carried out as a pure compound, or may be carried out in an in situ mixture after completion of the hypophosphite reaction under suitable conditions.
- Suitable esterification conditions may be the reaction of hypophosphorous acid [or its corresponding form as MOP C H2 amine salt, hydrazine preferably N3 ⁇ 4, PhNH 3 , HNEt 3 , the same below] and the decyl orthoformate, or hypophosphorous acid. (or the corresponding amine salt) and the alcohol ROH and the acid chloride to promote the reaction, or inferior race phosphorous acid (or the corresponding amine salt) with the form of SI oR;) 4 the reaction of silicone embankment.
- R is methyl, Phosphorus, Sulfur and Silicon and the Related Elements, 177(6-7), 1793-1796; 2002; R is ethyl , Tetrahedron Letters, 42(30), 5033-5036; 2001; R is isopropyl, Chemistry Letters, 33(2), 116-117; 2004 and Medicinal Chemistry Letters, 2(1), 11-16; 2011; R is tert-butyl, Tetrahedron Letters, 37(4), 425-8; 1996; R is n-butyl, Journal of Organic Chemistry, 70(10), 4064-4072; 2005 and JOMrwa/of Organometallic Chemistry, 643-644, 154-163; 2002; R is phenyl, Journal of Organometallic Chemistry, 643-644, 154-163; 2002.
- the condensation of the hypophosphite and the aldehyde may employ a suitable base promoter, and the preferred base is an organic tertiary amine compound such as Et 3 N, Bu 3 N, or ' Pr 2 NEt.
- Suitable oxidation catalysts are selected from metal salts containing Mo, W or V, such as vanadium oxyacetate, molybdates, molybdates, phosphomolybdates, tungstic anhydrides, tungstates, or heteropoly containing these metals.
- metal salts containing Mo, W or V such as vanadium oxyacetate, molybdates, molybdates, phosphomolybdates, tungstic anhydrides, tungstates, or heteropoly containing these metals.
- Suitable terminal oxidizing agents can be organic peroxides such as t-butanol peroxide and the like.
- Such a system comprises at least one polymerizable ethylenically unsaturated component and comprises at least one compound of formula I as one of a photoinitiator or a photoinitiator component.
- a suitable amount of the compound of the formula I is contained in an amount of from 0.05 to 15 parts by weight, preferably from 0.5 to 8 parts by weight, per 100 parts by weight based on the total of the ethylenically unsaturated component in the system.
- the suitable UV-curable system disclosed in the present application comprises a polymerizable ethylenically unsaturated component which is a compound or mixture which can be crosslinked by free radical polymerization of the double bond, the ethylenically unsaturated component It may be a monomer, an oligomer or a prepolymer, or a mixture or copolymer thereof.
- Suitable free-radically polymerizable monomers are, for example, ethylenically-containing polymerizable monomers including, but not limited to, (meth) acrylates, acrolein, olefins, conjugated diolefins, styrene, maleic anhydride, fumaric anhydride, Vinyl acetate, vinylpyrrolidone, vinylimidazole, (meth)acrylic acid, (meth)acrylic acid derivatives such as (meth)acrylamide, vinyl halide, vinylidene halide, and the like.
- ethylenically-containing polymerizable monomers including, but not limited to, (meth) acrylates, acrolein, olefins, conjugated diolefins, styrene, maleic anhydride, fumaric anhydride, Vinyl acetate, vinylpyrrolidone, vinylimidazole, (meth)acrylic acid, (meth)acryl
- Suitable prepolymers and oligomers include, but are not limited to, (meth)acryloyl functional (meth)acrylic copolymers, urethane (meth) acrylates, polyester (meth) acrylates, Unsaturated polyester, polyether (meth) acrylate, siloxane (meth) acrylate, epoxy (meth) acrylate, etc.
- Suitable number average molecular weights thereof may vary, for example, from 500 to 10,000, preferably from 500 to 5,000.
- UV light curing application examples 30 parts: epoxy acrylate
- Example photoinitiator compound 4 parts: Example photoinitiator compound.
- the above components were sufficiently ground and sprayed on a white substrate to form a coating of about 5 ⁇ m.
- a 200 W high-pressure mercury lamp was used as a light source to irradiate at a distance of 12 cm from the sample.
- a finger-scratch method determines the complete cure of the coating.
- the above-mentioned examples of the compounds 1 to 5 all caused the film layer to be completely cured, showing good photoinitiation properties.
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Abstract
La présente invention concerne le domaine technique de nouvelles matières polymérisées par radicaux libres sous rayonnement UV, en particulier un composé ester bis-phosphonyl phosphonate tel que représenté par la formule I, un procédé de préparation de celui-ci, une utilisation de celui-ci comme photoinitiateur pour un système de composé insaturé à teneur en alcényle pour effectuer une polymérisation et un durcissement par radicaux libres sous rayonnement UV, et un système de matières de polymérisation et durcissement par radicaux libres sous rayonnement UV contenant le composé.
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CN 201110227608 CN102924509A (zh) | 2011-08-09 | 2011-08-09 | 双膦酰膦酸酯化合物 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014095724A1 (fr) * | 2012-12-19 | 2014-06-26 | Basf Se | Dérivés d'acide bisacylphosphinique, leur préparation et leur utilisation en tant que photo-initiateurs |
US9644068B2 (en) | 2012-12-18 | 2017-05-09 | Basf Se | Semiconducting materials based on naphthalenediimide-vinylene-oligothiophene-vinylene polymers |
US9796740B2 (en) | 2013-07-08 | 2017-10-24 | Basf Se | Liquid bisacylphosphine oxide photoinitiator |
WO2018186822A1 (fr) * | 2017-04-03 | 2018-10-11 | Hewlett-Packard Development Company, L.P. | Agents photoactifs |
Families Citing this family (3)
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CN103333202B (zh) * | 2013-06-08 | 2016-09-07 | 广东博兴新材料科技有限公司 | 一种基于环氧化合物的含磷酸酯基的长波吸收光引发剂及其制备方法 |
KR102575896B1 (ko) * | 2016-01-11 | 2023-09-07 | 헨켈 아게 운트 코. 카게아아 | 실리콘-상용성 화합물 |
CN109867693B (zh) * | 2019-01-08 | 2021-08-10 | 广东博兴新材料科技有限公司 | 一种氟碳链改性亚磷酸酯类丙烯酸酯化合物及其制备方法和应用 |
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US5534559A (en) * | 1993-03-18 | 1996-07-09 | Ciba-Geigy Corporation | Daylight curing compositions containing bisacylphosphine oxide photoinitiators |
CN101065388A (zh) * | 2004-11-23 | 2007-10-31 | 西巴特殊化学品控股有限公司 | 制备酰基磷烷及其衍生物的方法 |
CN102471150A (zh) * | 2010-06-30 | 2012-05-23 | 帝斯曼知识产权资产管理有限公司 | D1492液体双酰基氧化膦光引发剂及其在可辐射固化组合物中的用途 |
-
2011
- 2011-08-09 CN CN 201110227608 patent/CN102924509A/zh active Pending
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- 2012-07-31 WO PCT/CN2012/079445 patent/WO2013020469A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5534559A (en) * | 1993-03-18 | 1996-07-09 | Ciba-Geigy Corporation | Daylight curing compositions containing bisacylphosphine oxide photoinitiators |
CN101065388A (zh) * | 2004-11-23 | 2007-10-31 | 西巴特殊化学品控股有限公司 | 制备酰基磷烷及其衍生物的方法 |
CN102471150A (zh) * | 2010-06-30 | 2012-05-23 | 帝斯曼知识产权资产管理有限公司 | D1492液体双酰基氧化膦光引发剂及其在可辐射固化组合物中的用途 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9644068B2 (en) | 2012-12-18 | 2017-05-09 | Basf Se | Semiconducting materials based on naphthalenediimide-vinylene-oligothiophene-vinylene polymers |
WO2014095724A1 (fr) * | 2012-12-19 | 2014-06-26 | Basf Se | Dérivés d'acide bisacylphosphinique, leur préparation et leur utilisation en tant que photo-initiateurs |
US9796740B2 (en) | 2013-07-08 | 2017-10-24 | Basf Se | Liquid bisacylphosphine oxide photoinitiator |
WO2018186822A1 (fr) * | 2017-04-03 | 2018-10-11 | Hewlett-Packard Development Company, L.P. | Agents photoactifs |
US10858380B2 (en) | 2017-04-03 | 2020-12-08 | Hewlett-Packard Development Company, L.P. | Photo active agents |
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