WO2013017131A3 - Integrierte nichtflüchtige speicherelemente, aufbau und verwendung - Google Patents

Integrierte nichtflüchtige speicherelemente, aufbau und verwendung Download PDF

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Publication number
WO2013017131A3
WO2013017131A3 PCT/DE2012/200047 DE2012200047W WO2013017131A3 WO 2013017131 A3 WO2013017131 A3 WO 2013017131A3 DE 2012200047 W DE2012200047 W DE 2012200047W WO 2013017131 A3 WO2013017131 A3 WO 2013017131A3
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WO
WIPO (PCT)
Prior art keywords
design
contact
volatile
piezo
integrated
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PCT/DE2012/200047
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English (en)
French (fr)
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WO2013017131A2 (de
Inventor
Heidemarie Schmidt
Yao Shuai
Shengqiang Zhou
Ilona Skorupa
Xin OU
Nan DU
Christian Mayr
Wenbo LUO
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Helmholtz-Zentrum Dresden - Rossendorf E.V.
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Publication date
Priority claimed from DE102011051767.7A external-priority patent/DE102011051767B4/de
Priority claimed from DE102012102326.3A external-priority patent/DE102012102326B4/de
Priority claimed from DE102012104425.2A external-priority patent/DE102012104425B4/de
Application filed by Helmholtz-Zentrum Dresden - Rossendorf E.V. filed Critical Helmholtz-Zentrum Dresden - Rossendorf E.V.
Priority to US14/131,956 priority Critical patent/US9520445B2/en
Publication of WO2013017131A2 publication Critical patent/WO2013017131A2/de
Publication of WO2013017131A3 publication Critical patent/WO2013017131A3/de

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/06Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/032Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0368Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/09Devices sensitive to infrared, visible or ultraviolet radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H10B63/82Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H10N70/235Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect between different crystalline phases, e.g. cubic and hexagonal
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/253Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/823Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/883Oxides or nitrides
    • H10N70/8836Complex metal oxides, e.g. perovskites, spinels
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/06Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
    • G06N3/063Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
    • G06N3/065Analogue means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)

Abstract

Beschrieben werden die Herstellung und der Aufbau eines integrierten Speicherbauelementes, umfassend mindestens einen Oberflächenkontakt (S) und einen Gegenkontakt (O), wovon mindestens ein Kontakt gleichrichtend ausgebildet ist und eine ferrroelektrische oder piezoelektrische Schicht (11) als leitfähigen Kanal zwischen den Kontakten. Weiterhin wird der Aufbau des Speicherbauelementes mit einem zusätzlichen Drain-Anschluss und einem zusätzlichen Source-Anschluss zur nichtflüchtigen Steuerung der Leitfähigkeit zwischen dem Source- und Drain-Anschluss über den gleichrichtenden Bottom-Kontakt oder Top-Kontakt beschrieben. Das Prinzip und der Aufbau wird anschließend auf nichtflüchtige Analogspeicher erweitert, wobei die Leitfähigkeit der piezo- oder ferroelektrischen Schicht zwischen den Kontakten und/oder unter dem Oberflächenkontakt und/oder unter dem zugehörigen Gegenkontakt modifiziert ist, so dass eine an gegenüberliegenden Kontakten von außen angelegte Spannung nicht gleichmäßig in der piezo- oder ferroelektrischen Schicht abfällt und das elektrische Feld lokal groß/klein ist und ein großes elektrisches Feld eine Phasenumwandlung der piezo- oder ferroelektrischen Schicht induzieren kann. Weiterhin wird die Integration und Verwendung des nichtflüchtigen Analogspeichers in einer Arraystruktur für neuromorphe Anwendungen und als Kalibrierelement mit darunterliegender CMOS-Analogschaltung beschrieben. Das Prinzip des Aufbaus des erfindungsgemäßen Speicherbauelements ist weiterhin als integrierbare Elektrode mit nichtflüchtig positionierbarer, statisch geladener Grenzschicht erweiterbar. Dazu wird die Verwendung der integrierbaren Elektrode in Photobauelementen, Teilchendetektoren, in kapazitiven Energiespeichern und in Logikbauelementen beschrieben.
PCT/DE2012/200047 2011-07-12 2012-07-12 Integrierte nichtflüchtige speicherelemente, aufbau und verwendung WO2013017131A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/131,956 US9520445B2 (en) 2011-07-12 2012-07-12 Integrated non-volatile memory elements, design and use

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102011051767.7A DE102011051767B4 (de) 2011-07-12 2011-07-12 Integriertes nichtflüchtiges Speicherbauelement mit einer ferroelektrischen Schicht
DE102011051767.7 2011-07-12
DE102012102326.3 2012-03-20
DE102012102326.3A DE102012102326B4 (de) 2012-03-20 2012-03-20 Verfahren zur Herstellung eines integrierten nichtflüchtigen Analogspeichers
DE102012104425.2 2012-05-23
DE102012104425.2A DE102012104425B4 (de) 2012-05-23 2012-05-23 Integrierbare Elektrode mit nichtflüchtig positionierbarer, statisch geladener Grenzschicht, Aufbau und Verwendung

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WO2013017131A2 WO2013017131A2 (de) 2013-02-07
WO2013017131A3 true WO2013017131A3 (de) 2013-04-25

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EP3040036B1 (de) * 2014-12-29 2017-10-11 Erbe Elektromedizin GmbH Instrumentenkopf, Applikationsinstrument mit entsprechendem Instrumentenkopf und Applikationssystem
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US10176425B2 (en) * 2016-07-14 2019-01-08 University Of Dayton Analog neuromorphic circuits for dot-product operation implementing resistive memories
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US10141923B2 (en) 2016-08-25 2018-11-27 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for eliminating gate voltage oscillation in paralleled power semiconductor switches
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US9520445B2 (en) 2016-12-13
WO2013017131A2 (de) 2013-02-07
US20140312400A1 (en) 2014-10-23

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