WO2012167488A1 - Cof、cof载带及液晶电视的驱动电路 - Google Patents

Cof、cof载带及液晶电视的驱动电路 Download PDF

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Publication number
WO2012167488A1
WO2012167488A1 PCT/CN2011/077594 CN2011077594W WO2012167488A1 WO 2012167488 A1 WO2012167488 A1 WO 2012167488A1 CN 2011077594 W CN2011077594 W CN 2011077594W WO 2012167488 A1 WO2012167488 A1 WO 2012167488A1
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Prior art keywords
cof
trace
sides
carrier tape
parallel
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PCT/CN2011/077594
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English (en)
French (fr)
Inventor
林柏伸
廖良展
张勇
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/380,045 priority Critical patent/US20120314175A1/en
Publication of WO2012167488A1 publication Critical patent/WO2012167488A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates

Definitions

  • the present invention relates to COF (Chip On Film, flip chip), especially relates to a COF, COF carrier tape and LCD TV drive circuit.
  • COF Chip On Film, flip chip
  • the COF carrier tape is a semiconductor component that is bonded and mounted on a long carrier tape.
  • the COF is a soft additional circuit board that uses a soft additional circuit board as a package chip carrier to bond the chip to the flexible substrate circuit, or a single unpackaged chip.
  • the COF is formed by bonding a chip (a source driver IC or a gate driver IC or the like, as shown in FIG. 1 to a shaded portion in black) to a flexible wiring substrate on which a wiring pattern is formed.
  • the wiring pattern of the COF is usually composed of an inner lead connected to the electrodes of the chip and an outer lead connected to an external circuit.
  • the COF is connected to the PCB (Printed Circuit Board (Printed Circuit Board) has a thinner one end and a denser connection to the other end of the panel.
  • Figure 1 shows a conventional COF.
  • the number of wires on one side of the trace is small, but it also takes up the same side length as the other trace.
  • the COF is a rectangular structure, which wastes unnecessary COF area. The cost of its materials will increase.
  • 2 is a schematic structural view of a conventional COF carrier tape.
  • the COF 100 in the COF carrier tape has a rectangular structure, and the area of the shaded portion 101 is useless, but it also occupies a part of the area of the carrier tape, and a large amount of material is wasted in mass production.
  • the main object of the present invention is to provide a COF, COF carrier tape and a driving circuit for a liquid crystal television, which aims to save the area of the COF, improve the utilization rate of the carrier tape, and effectively reduce the production cost.
  • the invention provides a COF carrier tape, comprising a COF belt formed by sequentially connecting a plurality of COFs and a carrier connected to the COF belt, wherein the COF profile is composed of two mutually parallel trace sides and two not a trapezoid formed by parallel sides; between two adjacent COFs, a long trace of one COF is connected to a short trace of another COF and is on the same straight line, and two short lines of two COFs The sides and long lines are also connected and on the same line.
  • the carrier comprises two parallel long sides, both of which are parallel to the long sides.
  • the COF is a trapezoidal, right-angled trapezoid or an isosceles trapezoidal structure, and the two trace sides are a trapezoidal upper bottom and a lower bottom side, respectively.
  • the shape and area of each of the COFs are consistent.
  • a plurality of via holes are respectively disposed on the edges of the long sides of the carrier.
  • the invention further proposes a COF having a trapezoidal shape consisting of two mutually parallel trace sides and two non-parallel sides.
  • the COF is a right-angled trapezoid or an isosceles trapezoidal structure, and the two trace sides are respectively an upper bottom edge and a lower bottom edge of the trapezoid.
  • the COF includes a strip-shaped semiconductor element that is perpendicular to a trace side of the COF.
  • the COF includes a strip-shaped semiconductor element that is parallel to a trace side of the COF.
  • one of the trace sides of the COF is provided with a plurality of wires connectable to the external PCB, and the other of the traces is provided with a plurality of wires connectable to the external panel.
  • the invention further provides a driving circuit for a liquid crystal television, comprising a COF, a trace side of the COF is connected to the PCB, and another trace side can be connected with the outer panel; the COF shape is two parallel walks. A trapezoid formed by a line edge and two non-parallel sides.
  • the COF is a right-angled trapezoid or an isosceles trapezoidal structure, and the two trace sides are respectively an upper bottom edge and a lower bottom edge of the trapezoid.
  • the COF includes a strip-shaped semiconductor element that is perpendicular to a trace side of the COF.
  • the COF includes a strip-shaped semiconductor element that is parallel to a trace side of the COF.
  • the COF of the present invention is a quadrilateral structure in which two trace sides are parallel, and the lengths of the two trace sides are different, for example, the COF is trapezoidal, right-angled trapezoid or isosceles trapezoidal structure.
  • the COF of this shape is suitable for a small number of traces on one side of the trace, and the COF of a relatively large number of traces on the other trace side, the COF of the trapezoidal structure is reduced relative to the COF of the rectangular structure, and the cost is reduced.
  • the COF carrier tape includes a COF belt and a carrier which are sequentially connected by a plurality of COFs, and between the two adjacent COFs, a long trace side of one COF is connected to a short trace side of another COF and is in the same straight line.
  • the adjacent COFs are aligned in a direction of 180° on the COF carrier tape, and the other COF carriers are connected to each other on the COF carrier tape. Cut it down to get the same shape of COF. Therefore, in the tape carrier type semiconductor device, the COF of the present shape structure can increase the number of COFs on the carrier tape of a predetermined length, and the cost can be greatly reduced.
  • 1 is a schematic structural view of a conventional COF and an external connection
  • FIG. 2 is a schematic structural view of a conventional COF carrier tape
  • FIG. 3 is a schematic structural view of a first embodiment of a COF of the present invention.
  • FIG. 4 is a schematic structural view of a first embodiment of a COF carrier tape according to the present invention.
  • Figure 5 is a schematic structural view of a second embodiment of the COF of the present invention.
  • Figure 6 is a schematic view showing the structure of a second embodiment of the COF carrier tape of the present invention.
  • FIG. 3 is a schematic structural view of a first embodiment of a COF 200 of the present invention.
  • the shape of the COF 200 is a trapezoid formed by two parallel sides of the opposite sides and two non-parallel sides 203.
  • the COF 200 is an isosceles trapezoidal structure, and the two trace sides are respectively trapezoidal upper bottom sides. 201 and lower base 202.
  • a short trace edge of the COF 200, that is, the upper bottom edge 201 is provided with a plurality of wires connectable to the external PCB, and the other long trace edge, that is, the lower bottom edge 202 is provided with a plurality of wires connectable to the external panel, and the upper bottom edge 201 is disposed.
  • the wiring of the lower bottom edge 202 is relatively small.
  • the upper bottom edge and the lower bottom edge of the COF are respectively provided with four or ten traces, and may also be other numbers of traces.
  • the COF 200 includes a strip-shaped semiconductor component 204, which may also be an IC chip.
  • the strip-shaped semiconductor component 204 is disposed perpendicular to the trace side of the COF 200, or the strip-shaped semiconductor component is disposed in parallel with one of the trace sides of the COF.
  • the semiconductor component 204 can also be placed at other locations on the COF 200, the location of which is set according to the needs of the actual application.
  • the COF200 of the present invention has an isosceles trapezoidal shape, and the COF 200 of this shape is suitable for a wire edge (the upper bottom edge 201) has a smaller number of wires, and the other wire edge (the lower bottom edge 202) has a relatively larger number of wires.
  • the COF200 saves the position where the wiring is not set.
  • the COF200 of the trapezoidal structure saves material and reduces the cost compared with the rectangular structure COF200.
  • FIG. 4 is a schematic structural view of a first embodiment of a COF carrier tape 300 of the present invention.
  • the COF carrier tape 300 includes a COF belt which is sequentially connected by a plurality of COFs 200 and a carrier 301 connected to the COF belt.
  • the COF 200 is composed of two parallel sides and two non-parallel sides 203. Trapezoidal; between the two adjacent COFs 200, the long trace side 202 of one COF 200 is connected to the short trace side 201 of another COF 200 and is on the same straight line, and the other COF 200 has another short trace side 201 and long walk.
  • the line edges 202 are also joined and aligned on the same line, i.e., on the COF carrier tape 300, adjacent COFs 200 are aligned relative to each other by 180°.
  • the shape and area of each COF 200 on the COF carrier tape 300 are the same, and the COF 200 has a trapezoidal structure.
  • the COF 200 in this embodiment has an isosceles trapezoidal structure, and the two trace sides are a trapezoidal upper bottom edge 201 and a lower bottom.
  • the edge 202, a slant waist 203 of a COF 200 abuts against the slant waist 203 of another adjacent COF 200.
  • the carrier 301 includes two parallel long sides, and the two trace sides of the COF 200 are parallel to the carrier 301 and the long sides.
  • a plurality of via holes 302 are respectively disposed on the edges of the long sides of the carrier 301.
  • the via holes 302 function to facilitate the connection of the COF carrier tape 300 to the external cutting device, and the COF carrier tape 300 is accurately moved by the via holes 302 to accurately Each of the COFs 200 is completely cut.
  • the upper bottom side 201 of the isosceles trapezoidal COF 200 corresponds to two via holes 302, and the lower bottom side 202 corresponds to four via holes 302.
  • the COF 200 includes a strip-shaped semiconductor component 204 that can be placed anywhere on the COF 200, as desired for practical applications.
  • the strip-shaped semiconductor component 204 in this embodiment is perpendicular to the trace side of the COF 200.
  • FIG. 5 is a schematic structural view of a second embodiment of the COF 200 of the present invention.
  • the difference between the present embodiment and the first embodiment of the COF 200 is that the shape of the COF 200 is different.
  • the second embodiment of the COF 200 adopts a right-angled trapezoid shape, and the two trace sides are a trapezoid upper base 201 and a lower base 202, respectively.
  • the upper bottom edge 201 of the COF 200 is provided with a plurality of wires connectable to the external PCB, and the lower bottom edge 202 is provided with a plurality of wires connectable to the external panel, and the upper bottom edge 201 of the shorter side of the wire is provided with less wiring, and the wires are arranged.
  • the longer lower bottom edge 202 is provided with more wiring, as well as a straight edge 205 and a diagonal waist 203.
  • the COF200 with a right-angled trapezoidal structure saves material and reduces costs compared to the COF200 with a rectangular structure.
  • FIG. 6 is a schematic structural view of a second embodiment of a COF carrier tape 300 of the present invention.
  • the COF carrier tape 300 of the present embodiment employs the second embodiment of the COF 200 described above.
  • the difference from the first embodiment of the COF carrier tape 300 is that the COF 200 of the present embodiment adopts a shape of a right-angled trapezoid.
  • the lower bottom edge 202 of one COF 200 is connected to the upper bottom edge 201 of another COF 200 and is on the same straight line, and the other upper bottom edge 201 and lower bottom edge 202 of the two COFs 200 are also connected.
  • each COF 200 on the COF carrier tape 300 is identical.
  • the COF carrier tape 300 of the present embodiment also saves the material of the carrier tape, improves the utilization rate of the carrier tape, and greatly reduces the cost.
  • the manufacturing method of the COF carrier tape 300 may be such that when the COF 200 is designed on the carrier 301, the COF 200 is designed to be trapezoidal, right-angled trapezoid or isosceles trapezoid according to actual application requirements, and the number of traces of the COF200 trace line according to actual needs. Determine the length of the edge by the spacing of the traces.
  • the present invention further provides a driving circuit for a liquid crystal television, comprising at least one COF 200.
  • a trace side of the COF 200 is connected to the PCB, and another trace side can be connected to the external panel;
  • the COF200 has a trapezoidal shape consisting of two mutually parallel trace sides and two non-parallel sides.
  • the COF 200 is a right-angled trapezoid or an isosceles trapezoidal structure, and the two trace sides are a trapezoidal upper base 201 and a lower base 202, respectively, and the isosceles trapezoidal COF 200 is a preferred solution.
  • the COF 200 includes a strip-shaped semiconductor component 204 that is perpendicular to the trace side of the COF 200. Or the strip-shaped semiconductor component 204 is parallel to the trace side of the COF 200.
  • the COF 200 in the driving circuit embodiment of the present invention includes all the technical solutions of the first and second embodiments of the COF 200 described above, and the technical effects achieved are also the same, and details are not described herein again.

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Abstract

一种COF载带，包括由若干个COF（200）依次连接起来构成的COF带以及与所述COF带相连接的载体（301）。所述COF（200）外形为由两条相互平行走线边（201、202）和两条不平行的侧边（203、205）构成的梯形，相邻两个所述COF（200）之间，一COF（200）的长走线边（202）与另一COF（200）的短走线边（201）相接并在同一直线上，两个COF（200）另外的短走线边（201）、长走线边（202）也相接并在同一直线上。通过这种设计，COF节省了材料。在载带型半导体装置中，这种COF能在规定长度的载带上增加COF的数量，从而大幅度地降低成本。

Description

COF、COF载带及液晶电视的驱动电路
技术领域
本发明涉及COF（Chip On Film，覆晶薄膜），特别涉及一种COF、COF载带及液晶电视的驱动电路。
背景技术
COF载带是将半导体元件接合并安装在长的载带上，COF是运用软质附加电路板作封装芯片载体将芯片与软性基板电路接合，或单指未封装芯片的软质附加电路板。如图1所示，COF是将芯片（源驱动IC或门驱动IC等，如图1中涂黑的阴影部分）接合并安装在形成了布线图形的柔性布线基板上构成的。COF的布线图形通常由与芯片的电极连接的内引线和与外部电路连接的外引线构成。通常，在液晶电视的驱动线路中，COF连接至PCB（Printed Circuit Board，印制电路板）的一端走线较疏，连接至面板的另一端走线较密。
图1为现有的COF的一种，其一走线边的接线数量较少，但也占用了与另一走线边同样的边长，COF为矩形结构，浪费了不必要的COF面积，使其材料成本随之增加。图2为现有COF载带的结构示意图。COF载带中的COF100为矩形结构，阴影部分101的面积是无用的，但也占用了载带的一部分面积，大量生产时将浪费大量的材料。
发明内容
本发明的主要目的是提供一种COF、COF载带及液晶电视的驱动电路，旨在节省COF的面积，提高载带的利用率，有效地降低生产成本。
本发明提出一种COF载带，包括由若干个COF依次连接起来构成的COF带以及与所述COF带相连接的载体，所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形；相邻两个所述COF之间，一COF的长走线边与另一COF的短走线边相接并在同一直线上，两个COF另外的短走线边、长走线边也相接并在同一直线上。
优选地，所述载体包括有两个相平行的长边，所述COF的两走线边均与所述长边平行。
优选地，所述COF为梯形、直角梯形或等腰梯形结构，两条走线边分别为梯形的上底这和下底边。
优选地，每个所述COF的形状、面积均相一致。
优选地，所述载体的长边的边缘上分别设置有若干个过孔。
本发明又提出一种COF，所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形。
优选地，所述COF为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边和下底边。
优选地，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相垂直。
优选地，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相平行。
优选地，所述COF的一走线边设置有可与外部PCB连接的若干接线，另一走线边设置有可与外部面板连接的若干接线。
本发明再提出一种液晶电视的驱动电路，包括COF，所述COF的一走线边与PCB连接，另一走线边可与外部面板连接；所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形。
优选地，所述COF为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边和下底边。
优选地，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相垂直。
优选地，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相平行。
本发明COF是两条走线边相平行的四边形结构，且两条走线边的长度不相同，如COF为梯形、直角梯形或等腰梯形结构。这种形状的COF适合一走线边的走线数量较少，另一走线边的走线数量相对较多的COF，梯形结构相对于矩形结构的COF节省了材料，成本降低。COF载带包括由若干个COF依次连接起来构成的COF带和载体，相邻两个所述COF之间，一COF的长走线边与另一COF的短走线边相接并在同一直线上，两个COF另外的短走线边、长走线边也相接并在同一直线上，即在COF载带上，相邻的COF相对旋转180°的方向排列，从COF载带上冲切下来能获得相同形状的COF。因此在载带型半导体装置中，应用本形状结构的COF能在规定长度的载带上增加COF的数量，能大幅度地降低成本。
附图说明
图1为现有的COF与外部连接的结构示意图；
图2为现有的COF载带的结构示意图；
图3为本发明的COF第一实施例的结构示意图；
图4为本发明的COF载带第一实施例的结构示意图；
图5为本发明的COF第二实施例的结构示意图；
图6为本发明的COF载带第二实施例的结构示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参照图3，图3为本发明的COF200第一实施例的结构示意图。该COF200外形为由两条对边相互平行的走线边和两条不平行的侧边203构成的梯形，本实施例COF200为等腰梯形结构，两条走线边分别为梯形的上底边201和下底边202。COF200的一短走线边即上底边201设置有可与外部PCB连接的若干接线，另一长走线边即下底边202设置有可与外部面板连接的若干接线，上底边201设置的接线较少，下底边202的接线较多，本实施例COF的上底边和下底边分别设置有四个、十个走线，还可以为其它数量的走线。该COF200包括有条形半导体元件204，还可以是IC芯片，条形半导体元件204与COF200的走线边相垂直设置，或条形半导体元件与COF的其中一条走线边相平行设置，条形半导体元件204还可以设置在COF200上的其它位置，其位置根据实际应用的需要而设置。
本发明的COF200外形为等腰梯形，这种形状的COF200适合一走线边（上底边201）的走线数量较少，另一走线边（下底边202）的走线数量相对较多的COF200，节省没有设置走线的位置，梯形结构的COF200相对于矩形结构的COF200节省了材料，降低了成本。
参照图4，图4为本发明的COF载带300第一实施例的结构示意图。该COF载带300包括由若干个COF200依次连接起来构成的COF带以及与COF带相连接的载体301，COF200是由两条对边相互平行的走线边和两条不平行的侧边203构成的梯形；相邻两个COF200之间，一COF200的长走线边202与另一COF200的短走线边201相接并在同一直线上，两个COF200另外的短走线边201、长走线边202也相接并在同一直线上，即在COF载带300上，相邻的COF200相对旋转180°的方向排列。COF载带300上的每个COF200的形状、面积均相一致，COF200为梯形结构，本实施例中的COF200为等腰梯形结构，两条走线边分别为梯形的上底边201和下底边202，一COF200的一斜腰边203与相邻的另一COF200的斜腰边203相接紧靠。载体301包括有两个相平行的长边，COF200的两条走线边均与载体301和长边平行。该载体301的长边的边缘上分别设置有若干个过孔302，该过孔302作用是便于COF载带300与外部切割设备连接，通过过孔302带动COF载带300精确移动，能准确地将每一个COF200完整地切割下来，本实施例等腰梯形的COF200的上底边201对应两个过孔302，下底边202对应四个过孔302。COF200包括有条形半导体元件204，根据实际应用的需要，条形半导体元件204可以设置在COF200上任何位置，本实施例中的条形半导体元件204与COF200的走线边相垂直。
现有技术中的COF载带，如图2所示，长度为L的COF载带上能取得2.5个COF，而本发明的COF载带充分利用了不需要的区域（图2中阴影部分101的面积），因此，在同样长度为L的COF载带上，能取得3又1/3个COF，这意味着，为取得相同数量的COF200，与矩形结构的COF200相比，应用本发明能使节省25%的载带，提高载带的利用率。因此，在COF200的制造价格方面能大幅度地降低成本。
参照图5，图5为本发明的COF200第二实施例的结构示意图。本实施例与上述COF200第一实施例的区别在于，COF200的形状不相同，COF200第二实施例采用直角梯形的形状，两条走线边分别为梯形的上底边201和下底边202，COF200的上底边201设置有可与外部PCB连接的若干接线，下底边202设置有可与外部面板连接的若干接线，走线边较短的上底边201设置的接线较少，走线边较长的下底边202设置的接线较多，还有一直角边205和一斜腰边203。直角梯形结构的COF200相对于矩形结构的COF200同样节省了材料，降低了成本。
参照图6，图6为本发明的COF载带300第二实施例的结构示意图。本实施例的COF载带300采用了上述COF200的第二实施例。与COF载带300第一实施例的区别在于，本实施例COF200采用直角梯形的形状。相邻两个COF200之间，一COF200的下底边202与另一COF200的上底边201相接并在同一直线上，两个COF200另外的上底边201、下底边202也相接并在同一直线上，即在COF载带300上，相邻的COF200相对旋转180°的方向排列。相邻两个COF200之间直角梯形的斜边相紧接，梯形直角边205与另外的COF200的直角边205相紧接。COF载带300上的每个COF200的形状、面积均相一致。本实施例的COF载带300同样节省载带的材料，提高载带的利用率，大幅度地降低成本。
COF载带300的制造方式可以为，COF200在载体301上设计时，COF200根据实际的应用需要设计为等梯形、直角梯形或等腰梯形，COF200的走线边根据实际的需要，走线的数量、走线的间距而确定边的长度。
本发明再提出一种液晶电视的驱动电路，包括至少一个COF200，参照图3、图5，COF200的一走线边与PCB连接，另一走线边可与外部面板连接； COF200外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形。COF200为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边201和下底边202，等腰梯形结构的COF200为较佳方案。
COF200包括有条形半导体元件204，该条形半导体元件204与COF200的走线边相垂直。或该条形半导体元件204与COF200的走线边相平行。本液晶电视的驱动电路实施例中的COF200包括上述COF200的第一、第二实施例的全部技术方案，并且所达到的技术效果也相同，在此不再赘述。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种COF载带，其特征在于，包括由若干个COF依次连接起来构成的COF带以及与所述COF带相连接的载体，所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形；相邻两个所述COF之间，一COF的长走线边与另一COF的短走线边相接并在同一直线上，两个COF另外的短走线边、长走线边也相接并在同一直线上。
  2. 根据权利要求1所述的COF载带，其特征在于，所述COF为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边和下底边。
  3. 根据权利要求2所述的COF载带，其特征在于，所述载体包括有两个相平行的长边，所述COF的两走线边均与所述长边平行。
  4. 根据权利要求1所述的COF载带，其特征在于，每个所述COF的形状、面积均相一致。
  5. 根据权利要求3所述的COF载带，其特征在于，每个所述COF的形状、面积均相一致。
  6. 根据权利要求5所述的COF载带，其特征在于，所述载体的长边的边缘上分别设置有若干个过孔。
  7. 一种COF，其特征在于，所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形。
  8. 根据权利要求7所述的COF，其特征在于，所述COF为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边和下底边。
  9. 根据权利要求8所述的COF，其特征在于，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相垂直。
  10. 根据权利要求7所述的COF，其特征在于，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相平行。
  11. 根据权利要求9所述的COF，其特征在于，所述COF的一走线边设置有可与外部PCB连接的若干接线，另一走线边设置有可与外部面板连接的若干接线。
  12. 一种液晶电视的驱动电路，包括COF，其特征在于，所述COF的一走线边与PCB连接，另一走线边可与外部面板连接；所述COF外形为由两条相互平行的走线边和两条不平行的侧边构成的梯形。
  13. 根据权利要求12所述的驱动电路，其特征在于，所述COF为直角梯形或等腰梯形结构，两条走线边分别为梯形的上底边和下底边。
  14. 根据权利要求13所述的驱动电路，其特征在于，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相垂直。
  15. 根据权利要求13所述的驱动电路，其特征在于，所述COF包括有条形半导体元件，所述条形半导体元件与所述COF的走线边相平行。
PCT/CN2011/077594 2011-06-09 2011-07-26 Cof、cof载带及液晶电视的驱动电路 Ceased WO2012167488A1 (zh)

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