WO2014067275A1 - 制备电路板的方法 - Google Patents

制备电路板的方法 Download PDF

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Publication number
WO2014067275A1
WO2014067275A1 PCT/CN2013/075223 CN2013075223W WO2014067275A1 WO 2014067275 A1 WO2014067275 A1 WO 2014067275A1 CN 2013075223 W CN2013075223 W CN 2013075223W WO 2014067275 A1 WO2014067275 A1 WO 2014067275A1
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Prior art keywords
circuit board
flexible circuit
manufacturing
shaped
strip
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PCT/CN2013/075223
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English (en)
French (fr)
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刘建兵
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广东欧珀移动通信有限公司
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Publication of WO2014067275A1 publication Critical patent/WO2014067275A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Definitions

  • This invention relates to the field of circuit boards and, more particularly, to a method of making a circuit board.
  • Flexible circuit board referred to as soft board or FPC It is a highly flexible and excellent flexible printed circuit board made of polyimide or polyester film. It has the advantages of high wiring density, light weight and thin thickness.
  • the technical problem to be solved by the present invention is to provide a method for preparing a circuit board with high utilization rate of a flexible circuit board in view of the defects of the prior art flexible circuit board having low utilization rate.
  • the technical solution adopted by the present invention to solve the technical problem thereof is: constructing a method for preparing a circuit board, comprising the following steps:
  • At least one bending zone is disposed in the typesetting unit of the divided strip shape, and electronic components are disposed on one side or both sides of the bending zone;
  • the shape of the flexible circuit board after bending is L-shaped, gate-shaped or Z-shaped.
  • the flexible circuit board has a rectangular shape.
  • the method further comprises the step of setting the size of the strip-shaped typesetting unit according to requirements.
  • the strip shape means that the width dimension is less than one third of the length dimension.
  • the flexible circuit board having the same width or length is punched out each time in the step S3.
  • the arranging the electronic components in the step S2 means fixing the electronic components to the typesetting unit by means of patch or wave soldering.
  • a process frame is disposed around the flexible circuit board; the process frame is provided with a MARK point, a positioning hole, and a foolproof point.
  • the MARK point is disposed at a diagonal position of the process frame.
  • the method for manufacturing a circuit board of the present invention has the following advantageous effects: a strip-shaped flexible circuit board is used The strip typesetting is performed in the flexible circuit board, the utilization rate of the flexible circuit board is high, the loss is small, and the cost of preparing a single flexible circuit board is low.
  • FIG. 1 is a schematic layout diagram of a flexible circuit board in the prior art
  • FIG. 2 is a flow chart of a method of manufacturing a circuit board of the present invention
  • FIG. 3 is a schematic layout diagram of a flexible circuit board in a method for manufacturing a circuit board according to the present invention
  • FIG. 4 is a schematic view showing the layout of electronic components in the method for fabricating a circuit board of the present invention
  • Figure 5 is a schematic view showing the bending of a flexible circuit board in the method of manufacturing a circuit board of the present invention.
  • the method for preparing a circuit board of the present invention comprises the following steps:
  • the at least one bending area 103 is disposed in the typesetting unit 102 of the divided strip shape, and the electronic component 104 is disposed on one side or both sides of the bending area 103;
  • step S4 of preparing a circuit board the shape of the flexible circuit board 105 bent one by one is L-shaped, gate-shaped or Z-shaped.
  • the method further includes the step of setting the size of the strip-shaped typesetting unit 102 according to requirements.
  • the user designs the size of the strip-shaped typesetting unit 102 according to the required area of the flexible circuit board 105 so that the two areas are equal, and the strip shape means that the width size is less than one third of the length size.
  • the rectangular flexible circuit board 101 corresponding to the size of the flexible circuit board 105 is selected, and the flexible circuit board 101 is divided into a plurality of strip-shaped typesetting units 102 arranged in an array, and the flexible circuit board 101
  • the craft frame is placed around the perimeter and is reserved for the conveyor belt of the placement equipment. to ensure that The flexible circuit board 101 can be accurately and firmly placed on the fixture of the printing apparatus, and one or two pairs of non-metallized positioning holes are required, and the positioning holes are designed to be circular.
  • the positioning MARK point and the anti-stagnation point are set on the process frame of the flexible circuit board 101.
  • the MARK point is set at the diagonal of the craft frame, and the MARK point is a solid circle. It can be bare copper, bare copper protected by a clear oxidation-proof coating, nickel-plated or tin-plated, or solder-coated.
  • at least one bending zone 103 is disposed in each of the divided typesetting units 102, and the electronic component 104 is disposed on one side or both sides of the bending zone, as shown in FIG. 4, which may be by patch or wave soldering.
  • the electronic component 104 is fixed to the typesetting unit 102. Then, the flexible circuit board 101 after the electronic component 104 is laid out is punched into a plurality of flexible circuit boards 105 one by one in an array manner, and the width or length of the blank printed circuit board 105 is the same every time. Since the flexible circuit board 105 has a bendable characteristic, finally, the punched flexible circuit board 105 is bent one by one in the bending area 103, and an L-shape can be formed when a bending area 103 is provided, and two bendings are set.
  • the area 103 can form a gate or a Z shape, as shown in FIG.
  • the angle and shape of the bending of the flexible circuit board 105 are set according to the needs of the user, and it is necessary to ensure that components cannot be disposed at the bend.
  • manual bending can be adopted.
  • mechanical bending can also be adopted, the angle and shape of the bending are consistent, and the labor cost can be reduced. .
  • the specific operation is as follows: (1) The size of the strip-shaped typesetting unit 102 is set according to the area of the L-shaped flexible circuit board, and then the typesetting unit 102 according to the strip shape The size is selected to correspond to the size of the rectangular flexible circuit board 101. (2) dividing the flexible circuit board 101 into a plurality of strip-shaped typesetting units 102 arranged in an array, and then in a rectangular shape The periphery of the flexible circuit board 101 is designed with a process frame, and then a MARK point, a positioning hole, and a foolproof point are set on the process frame.
  • a bent area 103 is provided in each of the divided typesetting units 102, and the electronic component 104 is laid on both sides of the bent area 103.
  • the flexible circuit board 101 after the electronic component 104 is laid out is punched into a plurality of flexible circuit boards 105 one by one in an array manner; (5) the punched flexible circuit board 105 is bent one by one in the bending area 103 In the shape of L.
  • eleven strip-shaped flexible circuit boards 105 are laid out in the flexible circuit board 101, and eleven L-shaped flexible circuit boards are formed by bending, and the same area of flexible circuit boards in the prior art. Only 101 L-shaped flexible circuit boards are typeset in 101.
  • a flexible circuit board of other shapes is prepared by using the flexible circuit board 101 of the same area, such as a gate shape or a Z shape, the number of flexible circuit boards prepared by the method is more than the number of flexible circuit boards prepared by the prior art. It can be seen that the present invention is employed. The method for preparing a circuit board, the high utilization rate of the flexible circuit board 101, the low cost of the prepared single flexible circuit board, and the economic benefit of industrial production.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种制备电路板的方法，包括以下步骤：S1：将柔性电路板材（101）划分为多个阵列方式排布的条形状的排版单元（102）；S2：在划分的条形状的排版单元（102）中至少设置一个弯折区（103），在弯折区（103）的一侧或两侧布局电子元器件（104）；S3：将布局了电子元器件（104）后的柔性电路板材（101）按阵列方式逐一冲裁成多个柔性电路板（105）；S4：将冲裁后的柔性电路板（105）在其弯折区（103）逐一进行弯折。采用条形状的柔性电路板在柔性电路板材中进行条形排版，柔性电路板材利用率高，损耗小，制备单个柔性电路板成本低。

Description

制备电路板的方法
技术领域
本发明涉及电路板领域，更具体地说，涉及一种制备电路板的方法。
背景技术
柔性电路板简称软板或 FPC ，是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板，具有配线密度高、重量轻、厚度薄等优点。
在制备柔性电路板时，需要将一批柔性电路板一起制作在一整块的柔性电路板板材上，然后再将单个柔性电路板一一冲裁下来。单个柔性电路板的排版方式，会影响柔性电路板材的利用率和生产效率，如何在同样面积的柔性电路板材上排布更多单元的柔性电路板，是设计人员考虑的重要因素。现有的柔性电路板（ FPC ）成本计算是按照面积来决定价格，背光产品上的柔性电路板（ FPC ）多为 L 形柔性电路板，其排版方式如图 1 所示，在柔性电路板材 101 中存在空置部分，这部分需作为废料处理，浪费了大部分原材料，从而增加了单个柔性电路板（ FPC ）的成本。
发明内容
本发明要解决的技术问题在于，针对现有技术的上述柔性电路板材利用率低的缺陷，提供一种柔性电路板材利用率高的制备电路板的方法。
本发明解决其技术问题所采用的技术方案是：构造一种制备电路板的方法， 包括以下步骤：
S1 ：将柔性电路板材划分为多个阵列方式排布的条形状的排版单元；
S2 ：在划分的条形状的所述排版单元中至少设置一个弯折区，在所述弯折区的一侧或两侧布局电子元器件；
S3 ：将布局了电子元器件后的所述柔性电路板材按阵列方式逐一冲裁成多个柔性电路板；
S4 ：将冲裁后的所述柔性电路板在其弯折区逐一进行弯折。
在本发明所述的制备电路板的方法中， 在所述步骤S4中，所述柔性电路板弯折后的形状为L形、门形或Z形。
在本发明所述的制备电路板的方法中， 所述柔性电路板材的形状为矩形。
在本发明所述的制备电路板的方法中， 在所述步骤S1之前还包括步骤：根据需求设定所述条形状的排版单元的尺寸。
在本发明所述的制备电路板的方法中， 所述条形状是指宽度尺寸是长度尺寸的三分之一以下。
在本发明所述的制备电路板的方法中， 所述步骤S3中每次冲裁出具有相同宽度或长度的柔性电路板。
在本发明所述的制备电路板的方法中， 所述步骤S2中布局电子元器件是指通过贴片或波峰焊方式将电子元器件固定到所述排版单元上。
在本发明所述的制备电路板的方法中， 所述步骤S1中，所述柔性电路板材的四周设置有工艺边框；所述工艺边框中设置有MARK点、定位孔以及防呆点。
在本发明所述的制备电路板的方法中， 所述MARK点设置在所述工艺边框对角的位置。
实施本发明的制备电路板的方法，具有以下有益效果：采用 条形状的柔性电路板在 柔性电路板材中进行条形排版，柔性电路板材利用率高，损耗小，制备单个柔性电路板成本低。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图 1 是现有技术中的柔性电路板材排版示意图；
图2是本发明制备电路板的方法流程图；
图 3 是本发明制备电路板的方法中柔性电路板材排版示意图；
图4是本发明制备电路板的方法中布局电子元器件示意图；
图5是本发明制备电路板的方法中柔性电路板弯折示意图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图2所示，本发明制备电路板的方法包括以下步骤：
S1 ：将柔性电路板材101划分为多个阵列方式排布的条形状的排版单元102；
S2 ：在划分的条形状的所述排版单元102中至少设置一个弯折区103，在所述弯折区103的一侧或两侧布局电子元器件104；
S3 ：将布局了电子元器件104后的所述柔性电路板材101按阵列方式逐一冲裁成多个柔性电路板105；
S4 ：将冲裁后的所述柔性电路板105在其弯折区103逐一进行弯折。
在上述 制备电路板的方法步骤S4中，柔性电路板105逐一弯折后的形状为L形、门形或Z形。 在上述 制备电路板的方法之前，还包括步骤：根据需求设定条形状的排版单元102的尺寸。
首先，用户根据需求的柔性电路板105的面积，设计条形状的排版单元102的尺寸，使两者面积相等，条形状是指宽度尺寸是长度尺寸的三分之一以下。选择与柔性电路板105的尺寸相对应的矩形柔性电路板材101，将柔性电路板材101划分为多个以阵列方式排布的条形状的排版单元102，柔性电路板材101 的四周设置有工艺边框，留给贴片设备的传送带使用。为了保证 柔性电路板材101能够准确、牢固地放置在印刷设备的夹具上，需要设置一对或两对非金属化的定位孔，定位孔设计成圆形。当采用不同的贴片机时，定位孔的位置、数量以及尺寸都会不同，应根据贴片机进行设定。为了精确地贴装元器件，在柔性电路板材101的工艺边框上设置定位MARK点以及防呆点。MARK点设置在工艺边框对角的位置，MARK点采用实心圆，可以是裸铜、由清澈的防氧化涂层保护的裸铜、镀镍或镀锡、或焊锡涂层。其次，在划分的各个排版单元102中至少设置一个弯折区103，在弯折区的一侧或两侧布局电子元器件104，请参阅图4所示，可以通过贴片或波峰焊方式将电子元器件104固定到排版单元102上。然后，将布局了电子元器件104后的所述柔性电路板材101按阵列方式逐一冲裁成多个柔性电路板105，每次冲裁出的柔性电路板105宽度或长度相同。由于柔性电路板105具有可弯折的特性，最后，将冲裁后的柔性电路板105在弯折区103逐一进行弯折，设置一个弯折区103时可以形成L形，设置两个弯折区103时可以形成门形或Z形，请参阅图5所示。柔性电路板105弯折的角度、形状根据用户的需求设定，需保证在弯折处不能设置元器件。弯折柔性电路板105时可采用手工弯折，对于同一形状的柔性电路板105进行大批量生产时，亦可采用机械弯折，弯折的角度和形状一致性高，同时也能降低人工成本。
按照本发明制备电路板的方法，在一个制备 L 形柔性电路板的实施例中，如图 1 、图 3 所示，具体操作过程如下：（ 1 ）根据 L 形柔性电路板的面积，设定条形状的排版单元 102 的尺寸，然后根据条形状的排版单元 102 的尺寸选择相对应尺寸的矩形 柔性电路板材101。（2）将柔性电路板材101划分为多个以阵列方式排布的条形状的排版单元102，然后在 矩形 柔性电路板材101的四周设计工艺边框，再在工艺边框上设置MARK点、定位孔以及防呆点。（3）在划分后的各个排版单元102中设置一个弯折区103，在弯折区103的两侧布局电子元器件104。（4）将布局了电子元器件104后的柔性电路板材101按阵列方式逐一冲裁成多个柔性电路板105；（5）将冲裁后的柔性电路板105在弯折区103逐一弯折成L形。
在上述具体实施例中，在柔性电路板材101中排版了11个条形状的柔性电路板105，再通过弯折生成11个L形柔性电路板，而在现有技术中相同面积的柔性电路板材101中只排版了8个L形柔性电路板。在利用相同面积的柔性电路板材101制备其它形状的柔性电路板时，如门形或Z形，采用本方法制备的柔性电路板个数都会多于现有技术制备的柔性电路板个数。由此可见，采用本发明 的制备电路板的方法，柔性电路板材 101 的利用率高，制备的单个柔性电路板成本低，提高了工业生产的经济效益。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些均属于本发明的保护之内。

Claims (9)

  1. 一种制备电路板的方法，其特征在于，包括以下步骤：
    S1 ：将柔性电路板材（101）划分为多个阵列方式排布的条形状的排版单元（102）；
    S2 ：在划分的条形状的所述排版单元（102）中至少设置一个弯折区（103），在所述弯折区（103）的一侧或两侧布局电子元器件（104）；
    S3 ：将布局了电子元器件（104）后的所述柔性电路板材（101）按阵列方式逐一冲裁成多个柔性电路板（105）；
    S4 ：将冲裁后的所述柔性电路板（105）在其弯折区（103）逐一进行弯折。
  2. 根据权利要求1所述的制备电路板的方法，其特征在于，在所述步骤S4中，所述柔性电路板（105）弯折后的形状为L形、门形或Z形。
  3. 根据权利要求2所述的制备电路板的方法，其特征在于，所述柔性电路板材（101）的形状为矩形。
  4. 根据权利要求3所述的制备电路板的方法，其特征在于，在所述步骤S1之前还包括步骤：根据需求设定所述条形状的排版单元（102）的尺寸。
  5. 根据权利要求3所述的制备电路板的方法，其特征在于，所述条形状是指宽度尺寸是长度尺寸的三分之一以下。
  6. 根据权利要求3所述的制备电路板的方法，其特征在于，所述步骤S3中每次冲裁出具有相同宽度或长度的柔性电路板（105）。
  7. 根据权利要求3所述的制备电路板的方法，其特征在于，所述步骤S2中布局电子元器件（104）是指通过贴片或波峰焊方式将电子元器件（104）固定到所述排版单元（102）上。
  8. 根据权利要求3所述的制备电路板的方法，其特征在于，在所述步骤S1中，所述柔性电路板材（101）的四周设置有工艺边框；所述工艺边框中设置有MARK点、定位孔以及防呆点。
  9. 根据权利要求8所述的制备电路板的方法，其特征在于，所述MARK点设置在所述工艺边框对角的位置。
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CN105960094B (zh) * 2016-05-31 2019-02-01 Oppo广东移动通信有限公司 电路板拼板及其加工方法
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