WO2014107891A1 - 背光模组、印刷电路板及其制造方法 - Google Patents

背光模组、印刷电路板及其制造方法 Download PDF

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Publication number
WO2014107891A1
WO2014107891A1 PCT/CN2013/070390 CN2013070390W WO2014107891A1 WO 2014107891 A1 WO2014107891 A1 WO 2014107891A1 CN 2013070390 W CN2013070390 W CN 2013070390W WO 2014107891 A1 WO2014107891 A1 WO 2014107891A1
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WIPO (PCT)
Prior art keywords
light bar
circuit board
printed circuit
area
backlight module
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PCT/CN2013/070390
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English (en)
French (fr)
Inventor
胡哲彰
张光耀
曹谦
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/811,279 priority Critical patent/US9084345B2/en
Priority to US14/647,807 priority patent/US9545012B2/en
Publication of WO2014107891A1 publication Critical patent/WO2014107891A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the present invention relates to the field of liquid crystal display technologies, and in particular, to a backlight module, a printed circuit board for a backlight module, and a method of fabricating the same.
  • the side-lit liquid crystal display has become the mainstream of the market.
  • the side-entry liquid crystal display in order to ensure the appearance of the liquid crystal display, it is generally required to reduce the thickness of the liquid crystal display frame. For this reason, many side-entry liquid crystal displays use a bent type metal-based printed circuit board, and there is no need to provide aluminum extrusion in the liquid crystal display, thereby greatly reducing the thickness of the liquid crystal display frame.
  • the prior art of the bending type metal-based printed circuit board in the prior art comprises the following steps: 1) manufacturing a printed circuit board; 2) plating copper on the printed circuit board and etching to remove the copper plating layer on the heat dissipation area (ie, conductive layer); 3) Spray insulating varnish on the copper plating layer of the light bar area to form an insulating layer.
  • the metal-based printed circuit board produced by the prior art may not completely etch the copper plating layer of the heat dissipation region, and the copper remaining in the heat dissipation region is liable to cause a short circuit of the LED light bar.
  • the technical problem to be solved by the embodiments of the present invention is to provide a backlight module, a printed circuit board for a backlight module, and a manufacturing method thereof, which can prevent the copper plating layer on the heat dissipation area of the printed circuit board from being completely etched. And the resulting short circuit problem.
  • a technical solution adopted by the present invention is to provide a backlight module, which includes a light bar and a printed circuit board, and the printed circuit board includes a light bar area and a heat dissipation area.
  • the light bar area is used for installing the light bar of the backlight module, and the light bar area is formed with a conductive circuit for supplying power to the light bar.
  • the light bar area includes an aluminum layer, a dielectric layer, a conductive layer and an insulating layer, an aluminum layer and a dielectric layer.
  • the conductive layer and the insulating layer are arranged in an overlapping manner; the heat dissipation region is connected to the light bar region, and the heat dissipation region comprises an aluminum layer and a dielectric layer, wherein the aluminum layer and the dielectric layer are overlapped in sequence, and the connection between the heat dissipation region and the light bar region is provided
  • the grooving and grooving are located on the side of the printed circuit board for mounting the light bar to prevent short circuit connection between the heat sink and the conductive circuit of the light bar area by the grooving.
  • the slot is a V-shaped slot.
  • the printed circuit board is a metal-based printed circuit board.
  • the light bar is a side-entry LED light.
  • another technical solution adopted by the present invention is to provide a printed circuit board for a backlight module, the printed circuit board including a light bar area and a heat dissipation area.
  • the light bar area is used for installing the light bar of the backlight module, and the light bar area is formed with a conductive circuit for supplying power to the light bar;
  • the heat dissipation area is connected with the light bar area, and the connection between the heat dissipation area and the light bar area is provided with a slot and
  • the grooving is located on the side of the printed circuit board on which the light bar is mounted to prevent short-circuiting between the heat-dissipating area and the conductive circuit of the light-strip area by grooving.
  • the printed circuit board is a metal-based printed circuit board.
  • the slot is a V-shaped slot.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a printed circuit board for a backlight module, the manufacturing method comprising: a light bar area for mounting a light strip on a printed circuit board substrate Performing a pattern etching process on the conductive layer to form a conductive circuit for supplying power to the light bar, performing an etching cleaning process on the conductive layer of the printed circuit board substrate for heat dissipation; and connecting the light bar area and the heat dissipation area Cutting is performed to form a slit, which is located on a side of the printed circuit board for mounting the light strip to prevent short-circuit connection between the heat sink and the conductive circuit of the light strip area by the slit.
  • the printed circuit board is provided with a slot at the connection between the light bar area and the heat dissipation area, and the connection between the heat dissipation area in the printed circuit board and the copper plating layer of the light bar area is completely cut through the slot, thereby preventing the heat dissipation area and the light A short circuit connection between the conductive circuits of the strip.
  • the printed circuit board of the embodiment of the invention can effectively avoid the short circuit problem caused by the inability of the conductive layer on the heat dissipation area of the printed circuit board to be completely etched.
  • FIG. 1 is a schematic structural view of a printed circuit board according to an embodiment of the present invention.
  • FIG. 2 is a partial structural view of a backlight module using the printed circuit board shown in FIG. 1;
  • Figure 3 is an enlarged schematic view showing a portion A of the printed circuit board shown in Figure 1;
  • FIG. 4 is a flow chart showing an embodiment of a method of manufacturing a printed circuit board of the present invention.
  • FIG. 1 is a schematic structural view of a printed circuit board according to an embodiment of the present invention
  • FIG. 2 is a partial structural view of a backlight module using the printed circuit board shown in FIG. 1.
  • the printed circuit board is a metal-based printed circuit board and the two parts of the circuit board are vertically disposed.
  • the printed circuit board includes but is not limited to the light bar area 11 and the heat dissipation area 12, and the light bar area 11 is located at a vertical portion of the printed circuit board. Central.
  • the light bar area 11 is used to mount the light bar 14 of the backlight module, and the light bar area 11 is formed with a conductive circuit for supplying power to the light bar 14.
  • the light bar 14 is a side-in type LED lamp, and the installation of the light bar 14 on the light bar area 11 can be referred to a manner well known to those skilled in the art, and details are not described herein.
  • the heat dissipation zone 12 is connected to the light bar zone 11, and the junction of the heat dissipation zone 12 and the light bar zone 11 is provided with a slot 13 and the slot 13 is located on the side of the printed circuit board for mounting the light bar 14 to pass the slot 13 prevents a short circuit connection between the heat dissipation region 12 and the conductive circuit of the light bar region 11.
  • the light bar area 11 includes an Al layer (aluminum layer) 111 of the light bar area 11, a dielectric layer 112 of the light bar area 11, a conductive layer 113, and an insulating layer 114, and an Al layer 111 of the light bar area 11 and a lamp
  • the dielectric layer 112, the conductive layer 113, and the insulating layer 114 of the strip 11 are sequentially stacked.
  • the conductive layer 113 is a copper plating layer, and the conductive layer 113 forms a conductive circuit.
  • the heat dissipation region 12 includes an Al layer 121 of the heat dissipation region 12 and a dielectric layer 122 of the heat dissipation region 12, and the Al layer 121 of the heat dissipation region 12 and the dielectric layer 122 of the heat dissipation region 12 are sequentially disposed to overlap each other.
  • the Al layer 111 and the Al layer 121 are adjacent to the back frame of the backlight module for dissipating heat from the printed circuit board. Since the printed circuit board is dissipated through the Al layer, the backlight module does not need to be provided with aluminum extrusion for heat dissipation, thereby effectively reducing the thickness. The thickness of the border of the backlight module.
  • a slit 13 is provided at the junction between the conductive layer 113, the dielectric layer 122 of the heat dissipation region 12, and the dielectric layer 112 of the light bar region 11.
  • the slits 13 are V-shaped slits.
  • the slits may have other shapes, such as a rectangular shape, which is not limited in the present invention.
  • the slit 13 can completely cut off the connection between the conductive strip layer 113 of the strip region and the copper remaining on the post-etching heat-dissipating region 12, effectively preventing short-circuit connection between the heat-dissipating region 12 and the conductive circuit of the strip region 11.
  • the printed circuit board is provided with a slot 13 at the junction of the light bar area 11 and the heat dissipation area 12, and the connection between the heat dissipation area 12 of the printed circuit board and the conductive layer 113 of the light bar area 11 is completely cut by the slit 13 A short circuit connection between the heat dissipation region 12 and the conductive circuit of the light bar region 11 is prevented.
  • the printed circuit board of the embodiment of the present invention can avoid the short circuit problem caused by the inability of the conductive layer on the heat dissipation region of the printed circuit board to be completely etched.
  • the embodiment of the invention further provides a backlight module, which comprises a light bar and a printed circuit board.
  • the printed circuit board is a metal-based printed circuit board and the two parts of the circuit board are vertically disposed.
  • the printed circuit board includes but is not limited to a light bar area and a heat dissipation area, and the light bar area is located at a middle portion of the vertical portion of the printed circuit board.
  • the light bar area is used to install the light bar of the backlight module, and the light bar area is formed with a conductive circuit for supplying power to the light bar.
  • the light bar is a side-in type LED lamp, and the installation of the light bar on the light bar area can refer to a manner well known to those skilled in the art, and details are not described herein.
  • the heat dissipation area is connected to the light bar area, and the connection between the heat dissipation area and the light bar area is provided with a slot, and the slot is located on a side of the printed circuit board for mounting the light bar, so as to prevent the heat dissipation area and the light bar area by the slot A short circuit connection between the conductive circuits.
  • the grooving is a V-shaped grooving. In other embodiments of the present invention, the grooving may be other shapes, such as a rectangular shape, which is not limited in the present invention.
  • the grooving can completely cut off the connection between the conductive layer of the plated strip and the copper remaining on the heat-dissipating area after etching, and effectively prevent the short-circuit connection between the heat-dissipating area and the conductive circuit of the light-strip area.
  • the backlight module of the embodiment of the invention is provided with a slot at the connection between the light bar area of the printed circuit board and the heat dissipation area, and completely cuts the connection between the heat dissipation area of the printed circuit board and the conductive layer of the light bar area through the slot, thereby preventing heat dissipation.
  • the printed circuit board of the embodiment of the present invention can avoid the short circuit problem caused by the inability of the conductive layer on the heat dissipation region of the printed circuit board to be completely etched.
  • the embodiment of the present invention further provides a liquid crystal display device using the backlight module according to the previous embodiment of the present invention. Since the backlight module has been described in detail above, it will not be described again here.
  • liquid crystal display device of the embodiment of the present invention adopts the backlight module described in the previous embodiment, it is possible to avoid the short circuit problem caused by the inability of the conductive layer on the heat dissipation region of the printed circuit board to be completely etched.
  • FIG. 4 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention. The manufacturing method includes the following steps.
  • Step S201 performing a pattern etching process on the printed circuit board substrate for mounting the light bar area of the light bar to form a conductive circuit for supplying power to the light bar, and conducting electricity to the heat dissipation area of the printed circuit board substrate for heat dissipation.
  • the layer is etched and cleaned.
  • the printed circuit board is a metal-based printed circuit board and the two parts of the circuit board are vertically disposed, the light bar area may be disposed in the middle of the vertical part of the printed circuit board, or the vertical part of the printed circuit board may be used as the light bar area.
  • the invention is not limited thereto.
  • Step S202 cutting at a connection where the light bar area and the heat dissipation area are connected to form a slot, the slot is located on a side of the printed circuit board for mounting the light bar, so as to prevent conduction between the heat dissipation area and the light bar area by the slot Short circuit connection between circuits.
  • the V-cut can be formed at the junction where the light bar area and the heat dissipation area are connected to form a V-shaped cut, that is, the cutting is performed by the V-Cut process, although other embodiments may also be used.
  • the process is performed to obtain a slit of a different shape, which only needs to ensure the short-circuit connection between the heat-dissipating area and the conductive circuit of the light-strip area, which is not limited by the present invention.
  • the grooving can completely cut off the connection between the conductive layer and the copper remaining on the heat-dissipating area after etching, and effectively prevent short-circuit connection between the heat-dissipating area and the conductive circuit of the light-strip area.
  • the method for manufacturing a printed circuit board according to an embodiment of the present invention forms a grooving by cutting between a strip region and a heat dissipating region after the etching treatment and the etch cleaning process, and completely cuts the heat dissipating region and the strip region in the printed circuit board through the grooving.
  • the connection between the layers prevents short-circuit connections between the heat sink and the conductive circuitry of the light strip area.
  • the printed circuit board manufacturing method of the embodiment of the present invention can avoid the short circuit problem caused by the inability of the conductive layer on the heat dissipation region of the printed circuit board to be completely etched.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

一种背光模组、印刷电路板及其制造方法，该印刷电路板包括灯条区（11）和散热区（12），灯条区（11）用于安装背光模组的灯条（14）且形成有用于向灯条（14）供电的导电电路，散热区（12）与灯条区（11）相连接，其连接处设置有切槽（13）且切槽（13）位于印刷电路板用于安装灯条（14）的一侧，通过切槽（13）防止散热区（12）与灯条区（11）的导电电路之间的短路连接。

Description

背光模组、印刷电路板及其制造方法
【技术领域】
本发明涉及液晶显示技术领域，具体是涉及一种背光模组、一种用于背光模组的印刷电路板及其制造方法。
【背景技术】
目前，侧入式的液晶显示器已经成为市场的主流。而在侧入式液晶显示器的生产中，为了保证液晶显示器外表的美观性，通常需要降低液晶显示器边框的厚度。为此很多侧入式液晶显示器采用弯折型的金属基印刷电路板，液晶显示器中无需设置铝挤，从而较大地降低了液晶显示器边框的厚度。现有技术中弯折型的金属基印刷电路板的前期制作包括以下步骤：1），制作印刷电路板；2），在印刷电路板上镀铜并蚀刻，以去掉散热区上的镀铜层（即导电层）；3）在灯条区的镀铜层上喷绝缘漆以形成绝缘层。
然而，现有技术生产的金属基印刷电路板有可能不能完全将散热区的镀铜层蚀刻，而散热区残留下来的铜容易造成LED灯条的短路。
【发明内容】
本发明实施例主要解决的技术问题是提供一种背光模组、一种用于背光模组的印刷电路板及其制造方法，可以避免由于印刷电路板散热区上的镀铜层不能被完全蚀刻而导致的短路问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种背光模组，该背光模组包括灯条以及印刷电路板，印刷电路板包括灯条区和散热区。灯条区用于安装背光模组的灯条，灯条区形成有用于向灯条供电的导电电路，灯条区包括铝层、介电层、导电层以及绝缘层，铝层、介电层、导电层以及绝缘层依次重叠设置；散热区与灯条区相连接，散热区包括铝层和介电层，铝层和介电层依次重叠设置，散热区和灯条区的连接处设置有切槽且切槽位于印刷电路板用于安装灯条的一侧，以通过切槽防止散热区与灯条区的导电电路之间的短路连接。
其中，切槽为V型切槽。
其中，印刷电路板为金属基印刷电路板。
其中，灯条为侧入式LED灯。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种用于背光模组的印刷电路板，该印刷电路板包括灯条区和散热区。灯条区用于安装背光模组的灯条，灯条区形成有用于向灯条供电的导电电路；散热区与灯条区相连接，散热区和灯条区的连接处设置有切槽且切槽位于印刷电路板用于安装灯条的一侧，以通过切槽防止散热区与灯条区的导电电路之间的短路连接。
其中，印刷电路板为金属基印刷电路板。
其中，切槽为V型切槽。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种用于背光模组的印刷电路板制造方法，该制造方法包括：对印刷电路板基板用于安装灯条的灯条区进行导电层的图案化蚀刻处理以形成用于向灯条供电的导电电路，对印刷电路板基板用于散热的散热区进行导电层的蚀刻清洗处理；在灯条区和散热区相连接的连接处进行切割以形成切槽，切槽位于印刷电路板用于安装灯条的一侧，以通过切槽防止散热区与灯条区的导电电路之间的短路连接。
其中，印刷电路板基板为金属基印刷电路板基板；在灯条区和散热区相连接的连接处进行切割以形成切槽的步骤具体包括：在灯条区和散热区相连接的连接处进行V型切割以形成V型切槽。
本发明实施例印刷电路板在灯条区和散热区的连接处设置切槽，通过切槽完全切断印刷电路板中散热区与灯条区镀铜层之间的连接，防止了散热区与灯条区的导电电路之间的短路连接。本发明实施例印刷电路板能够有效地避免由于印刷电路板散热区上的导电层不能被完全蚀刻而导致的短路问题。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明一实施例印刷电路板的结构示意图；
图2是采用图1所示印刷电路板的背光模组的部分结构示意图；
图3是图1所示印刷电路板的A部分放大示意图；
图4是本发明印刷电路板制造方法一实施例的流程示意图。
【具体实施方式】
下面结合附图和实施例，对本发明作进一步的详细描述。以下实施例仅用于说明本发明，但不应用来限制本发明的范围。
请一并参阅图1-图3，图1是本发明一实施例印刷电路板的结构示意图，图2是采用图1所示印刷电路板的背光模组的部分结构示意图，图3是图1所示印刷电路板的A部分放大示意图。
本实施例中，印刷电路板为金属基印刷电路板且电路板两部分垂直设置，印刷电路板包括但不限于灯条区11和散热区12，灯条区11位于印刷电路板竖直部分的中部。
如图2所示，灯条区11用于安装背光模组的灯条14，灯条区11形成有用于向灯条14供电的导电电路。本实施例中，灯条14为侧入式LED灯，灯条14在灯条区11上的安装可以参考本领域技术人员公知的方式，在此不作赘述。
散热区12与灯条区11相连接，散热区12和灯条区11的连接处设置有切槽13，且切槽13位于印刷电路板用于安装灯条14的一侧，以通过切槽13防止散热区12与灯条区11的导电电路之间的短路连接。
具体而言，灯条区11包括灯条区11的Al层（铝层）111、灯条区11的介电层112、导电层113以及绝缘层114，灯条区11的Al层111、灯条区11的介电层112、导电层113以及绝缘层114依次重叠设置。本实施例中，导电层113为镀铜层，导电层113形成导电电路。散热区12包括散热区12的Al层121和散热区12的介电层122，散热区12的Al层121和散热区12的介电层122依次重叠设置。其中，Al层111和Al层121靠近背光模组的背框，用于对印刷电路板进行散热，由于印刷电路板通过Al层散热，背光模组无需设置铝挤进行散热，从而可以有效降低了背光模组的边框的厚度。导电层113、散热区12的介电层122以及灯条区11的介电层112之间的连接处设置有切槽13。本实施例中，切槽13为V型切槽，在本发明其他的实施例中，切槽也可以为其他的形状，例如矩形，本发明对此不作限定。切槽13能够完全切断灯条区导电层113与蚀刻后散热区12上残留的铜之间的连接，有效地防止散热区12与灯条区11的导电电路之间的短路连接。
本发明实施例印刷电路板在灯条区11和散热区12的连接处设置切槽13，通过切槽13完全切断印刷电路板中散热区12与灯条区11导电层113之间的连接，防止了散热区12与灯条区11的导电电路之间的短路连接。本发明实施例印刷电路板能够避免由于印刷电路板散热区上的导电层不能被完全蚀刻而导致的短路问题。
本发明实施例还提供了一种背光模组，该背光模组包括灯条以及印刷电路板。其中，印刷电路板为金属基印刷电路板且电路板两部分垂直设置，印刷电路板包括但不限于灯条区和散热区，灯条区位于印刷电路板竖直部分的中部。
灯条区用于安装背光模组的灯条，灯条区形成有用于向灯条供电的导电电路。本实施例中，灯条为侧入式LED灯，灯条在灯条区上的安装可以参考本领域技术人员公知的方式，在此不作赘述。
散热区与灯条区相连接，散热区和灯条区的连接处设置有切槽，且切槽位于印刷电路板用于安装灯条的一侧，以通过切槽防止散热区与灯条区的导电电路之间的短路连接。本实施例中，切槽为V型切槽，在本发明其他的实施例中，切槽也可以为其他的形状，例如矩形，本发明对此不作限定。切槽能够完全切断镀灯条区导电层与蚀刻后散热区上残留的铜之间的连接，有效地防止散热区与灯条区的导电电路之间的短路连接。
本发明实施例背光模组在印刷电路板的灯条区和散热区的连接处设置切槽，通过切槽完全切断印刷电路板中散热区与灯条区导电层之间的连接，防止了散热区与灯条区的导电电路之间的短路连接。本发明实施例印刷电路板能够避免由于印刷电路板散热区上的导电层不能被完全蚀刻而导致的短路问题。
本发明实施例还提供了一种液晶显示装置，该液晶显示装置采用本发明上一实施例所述的背光模组。由于背光模组已经在上文中作了详细说明，在此不再赘述。
不难理解，由于本发明实施例液晶显示装置采用了上一实施例所述的背光模组，故能够避免由于印刷电路板散热区上的导电层不能被完全蚀刻而导致的短路问题。
本发明实施例还提供了一种用于背光模组的印刷电路板制造方法。请参阅图4，图4是本发明印刷电路板制造方法一实施例的流程示意图。该制造方法包括以下步骤。
步骤S201：对印刷电路板基板用于安装灯条的灯条区进行导电层的图案化蚀刻处理以形成用于向灯条供电的导电电路，对印刷电路板基板用于散热的散热区进行导电层的蚀刻清洗处理。
其中，印刷电路板为金属基印刷电路板且电路板两部分垂直设置，灯条区可以设置于印刷电路板竖直部分的中间，也可以将印刷电路板竖直部分全部作为灯条区使用，本发明对此不作限定。
步骤S202：在灯条区和散热区相连接的连接处进行切割以形成切槽，切槽位于印刷电路板用于安装灯条的一侧，以通过切槽防止散热区与灯条区的导电电路之间的短路连接。
其中，在灯条区和散热区相连接的连接处可以进行V型切割（V-Cut）以形成V型切槽，即采用V-Cut工艺进行切割，当然在其他实施例中也可以采用其他工艺进行切割以得到不同其他形状的切槽，其只需保证切断散热区与灯条区的导电电路之间的短路连接效果即可，本发明对此不作限定。切槽能够完全切断导电层与蚀刻后散热区上残留的铜之间的连接，有效地防止散热区与灯条区的导电电路之间的短路连接。
本发明实施例印刷电路板制造方法通过在蚀刻处理和蚀刻清理处理后的灯条区和散热区之间进行切割以形成切槽，通过切槽完全切断印刷电路板中散热区与灯条区导电层之间的连接，防止了散热区与灯条区的导电电路之间的短路连接。本发明实施例印刷电路板制造方法能够避免由于印刷电路板散热区上的导电层不能被完全蚀刻而导致的短路问题。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种背光模组，其中，所述背光模组包括灯条以及印刷电路板，所述印刷电路板包括：
    灯条区，用于安装所述背光模组的灯条，所述灯条区形成有用于向所述灯条供电的导电电路，所述灯条区包括铝层、介电层、导电层以及绝缘层，所述铝层、所述介电层、所述导电层以及所述绝缘层依次重叠设置；
    散热区，与所述灯条区相连接，所述散热区包括铝层和介电层，所述铝层和所述介电层依次重叠设置，所述散热区和所述灯条区的连接处设置有切槽且所述切槽位于所述印刷电路板用于安装所述灯条的一侧，以通过所述切槽防止所述散热区与所述灯条区的导电电路之间的短路连接。
  2. 根据权利要求1所述的背光模组，其中，所述切槽为V型切槽。
  3. 根据权利要求1所述的背光模组，其中，所述印刷电路板为金属基印刷电路板。
  4. 根据权利要求2所述的背光模组，其中，所述灯条为侧入式LED灯。
  5. 一种用于背光模组的印刷电路板，其中，所述印刷电路板包括：
    灯条区，用于安装所述背光模组的灯条，所述灯条区形成有用于向所述灯条供电的导电电路；
    散热区，与所述灯条区相连接，所述散热区和所述灯条区的连接处设置有切槽且所述切槽位于所述印刷电路板用于安装所述灯条的一侧，以通过所述切槽防止所述散热区与所述灯条区的导电电路之间的短路连接。
  6. 根据权利要求5所述的印刷电路板，其中，所述切槽为V型切槽。
  7. 根据权利要求5所述的印刷电路板，其中，所述印刷电路板为金属基印刷电路板。
  8. 根据权利要求7所述的印刷电路板，其中，所述切槽为V型切槽。
  9. 一种用于背光模组的印刷电路板制造方法，其中，所述制造方法包括：
    对印刷电路板基板用于安装灯条的灯条区进行导电层的图案化蚀刻处理以形成用于向灯条供电的导电电路，对印刷电路板基板用于散热的散热区进行导电层的蚀刻清洗处理；
    在所述灯条区和所述散热区相连接的连接处进行切割以形成切槽，所述切槽位于所述印刷电路板用于安装所述灯条的一侧，以通过所述切槽防止所述散热区与所述灯条区的导电电路之间的短路连接。
  10. 根据权利要求9所述的制造方法，其中，所述印刷电路板基板为金属基印刷电路板基板；所述在灯条区和所述散热区相连接的连接处进行切割以形成切槽的步骤具体包括：
    在所述灯条区和所述散热区相连接的连接处进行V型切割以形成V型切槽。
PCT/CN2013/070390 2013-01-09 2013-01-11 背光模组、印刷电路板及其制造方法 WO2014107891A1 (zh)

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