WO2012165275A1 - Dispositif d'aide à la fabrication de circuits électriques et procédé d'aide à la fabrication de circuits électriques - Google Patents

Dispositif d'aide à la fabrication de circuits électriques et procédé d'aide à la fabrication de circuits électriques Download PDF

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Publication number
WO2012165275A1
WO2012165275A1 PCT/JP2012/063277 JP2012063277W WO2012165275A1 WO 2012165275 A1 WO2012165275 A1 WO 2012165275A1 JP 2012063277 W JP2012063277 W JP 2012063277W WO 2012165275 A1 WO2012165275 A1 WO 2012165275A1
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WIPO (PCT)
Prior art keywords
work
substrate
board
machine
quality
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PCT/JP2012/063277
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English (en)
Japanese (ja)
Inventor
博之 羽根田
中山　大輔
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富士機械製造株式会社
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Publication of WO2012165275A1 publication Critical patent/WO2012165275A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Definitions

  • the present invention relates to an apparatus and a method for supporting the production of an electric circuit by an electric circuit production line.
  • This system is a machine for board work, which is a device for performing work on circuit boards (hereinafter sometimes referred to as “to board work”) such as cream solder printing work, electrical component mounting work, and the like. It is manufactured by inspecting the work results by the machine, based on the inspection data of the inspection machine, grasping the quality degradation until it does not reach the standard certified as defective and dealing with it Maintains high reliability for the quality of electrical circuits.
  • an electrical circuit manufacturing support apparatus and support method of the present invention include: An electric circuit manufacturing support apparatus and a support method for supporting the manufacture of an electric circuit by an electric circuit manufacturing line provided with a counter board working machine for executing a counter board operation, which is an operation for a circuit board constituting an electric circuit, Based on work machine related information including information on at least one of an operation performed by the substrate work machine and a treatment performed on the substrate work machine in the board work, a change in work conditions in the board work Recognize working condition fluctuations, Identifying a work site where the recognized variation in work conditions may affect work quality, certifying at least one of the identified work sites as a monitoring target site, The control data including at least one of the operation-based acquisition data acquired based on the operation of the substrate work machine and the inspection data by the inspection machine that inspects the work result of the substrate work by the substrate work machine, Monitored against circuit boards that have undergone on-board work prior to the occurrence of a recognized change in work conditions versus those on circuit boards that have under
  • the change in quality is monitored with the change of the working condition as a trigger.
  • item (1) corresponds to claim 1
  • items (4) to (7) correspond to claims 2 to 5, respectively.
  • item (11) corresponds to the sixth aspect.
  • An electric circuit manufacturing support apparatus for supporting the manufacture of an electric circuit by an electric circuit manufacturing line provided with an anti-substrate work machine for executing an anti-substrate work that is an operation for a circuit board constituting an electric circuit, Based on work machine related information including information on at least one of an operation performed by the substrate work machine and a treatment performed on the substrate work machine in the board work, a change in work conditions in the board work
  • a monitoring part identifying unit that identifies a working part where the recognized work condition variation may affect work quality, and authorizes at least one of the identified working parts as a monitoring target part;
  • Control data including at least one of operation-based acquisition data acquired based on the operation of the substrate-working machine and inspection data by an inspection machine that inspects a work result of the substrate-working by the substrate-working machine
  • the circuit board for which the board work was performed before the recognized change in the work condition was compared with the circuit board for which the board work was performed after the work condition change occurred
  • This section is an aspect of the claimable invention that belongs to the category of apparatus, that is, an aspect of an electric circuit manufacturing support apparatus (hereinafter, simply referred to as “support apparatus”) according to the claimable invention.
  • “Working against the substrate” in this section means a work performed on a circuit board (hereinafter sometimes simply referred to as “substrate”) in general electric circuit manufacturing.
  • Various operations such as a component fixing operation for fixing the component to the substrate by melting and solidifying the substrate are included.
  • the “to-board working machine” includes devices such as a solder printing machine, a component mounting machine, and a reflow furnace that perform these board-to-board work.
  • the “work site” differs depending on the board work, and generally, for example, in solder printing work, printed solder lands (also referred to as “solder pads”) are mounted in component mounting work.
  • solder printing work printed solder lands (also referred to as “solder pads”) are mounted in component mounting work.
  • solder pads also referred to as “solder pads”
  • each of the electrical components thus obtained corresponds to a component fixed to the substrate and a solder solidified to fix the component.
  • the work site can also be set arbitrarily.
  • the “work condition” refers to the configuration of the board working machine such as various devices equipped, the status (state) of the board working machine, What are various things such as the substrate, parts, materials such as solder used in the board work, the work procedure in the board work, the mode of work operation, the environment in which the work machine operates or is operated, etc.
  • the “working condition fluctuation” is a concept that means that various things are changed or changed. A specific example of working condition fluctuation will be given in the following description.
  • the “work machine-related information” that is relied upon in recognition by the condition fluctuation recognition unit is the type of device or material that was used when the anti-substrate work machine performed anti-substrate work on one board. This broadly means information indicating whether such an operation has been performed or what state the work implement is in.
  • the work machine related information includes the above-mentioned “information related to work performed by the work machine against the substrate (hereinafter sometimes referred to as“ work result information ”)” and “information related to the action performed on the work machine against the board (hereinafter referred to as“ work information ”) , “Sometimes referred to as“ treatment information ”)”. Specific examples of such information will be given in the following description.
  • the work implement related information is mainly information sent from the substrate work implement, but may be information sent from other equipment, and is information acquired by the support apparatus itself. Also good.
  • the “recognition of work condition fluctuation” performed in the condition fluctuation recognition unit does not only mean confirming that the work condition fluctuation has occurred, but also includes specifying the content of the work condition fluctuation that has occurred. .
  • the recognition of a change in work condition also means that an event that causes the change in the work condition, that is, a change in work condition is recognized.
  • the “work site where fluctuations in work conditions may affect the work quality (hereinafter sometimes referred to as“ influenced site ”)” identified by the monitoring target site identification unit is all work on one board. It may be a part of the part, or it may be the whole. The affected area varies depending on the type of work for the substrate and the contents of the work condition variation.
  • the “monitoring target site” may be all of the affected site or a part of the affected site. Increasing the number of monitoring target parts increases the reliability of the quality of the electric circuit to be manufactured, but conversely increases the burden of processing performed by the target part quality determination unit described later.
  • the number of affected parts to be certified as monitored parts and which affected parts are certified as monitored parts are determined based on the reliability of the above quality, taking into account the type of work on the board, the contents of work condition fluctuations, etc. What is necessary is just to set in view of the burden of processing.
  • the “determination regarding the change in the work quality of the monitoring target part” performed by the target part quality determination unit means, for example, a determination regarding a change in the quality level of the work against the board performed for the monitoring target part. Simply put, it means grasping how much the quality of work at that part has improved or decreased. In other words, this level of work quality means a low possibility of occurrence of defects, and a decrease in work quality can be considered as a sign of occurrence of defects. Therefore, grasping the deterioration in work quality is effective in preventing the occurrence of defects.
  • the level of work quality can be indicated, for example, by various statistical indicators used in the field of quality control including stability described later. What is necessary is just to compare those indexes before and after.
  • the “control data” used for the determination by the target part quality determination unit includes at least one of the operation-based acquisition data and the inspection data. More specifically, the “operation-based acquisition data” is data relating to the operation of the substrate work machine when performing the work on the substrate, and data relating to the state (status) of the substrate work machine during or after the operation. Various data that can be detected / measured / recognized by the work machine with respect to the substrate, such as data on the movement and state of the object to be operated are included. In general, an inspection machine is often arranged on the downstream side of the substrate working machine (which means not the immediate downstream side but also the downstream side sandwiching other equipment). The data acquired by the inspection machine, specifically, the inspection data of each work part when the work result of each work part is inspected can be adopted. Specific examples of the control data, specifically, the operation-based acquisition data and the inspection data will be given in the following description.
  • the support device may be provided outside the electric circuit manufacturing line (hereinafter may be simply referred to as “manufacturing line”) or may constitute a part of the manufacturing line.
  • the support device is composed of several functional units including the condition variation recognition unit, the monitoring target part recognition unit, and the target part quality judgment unit, all of which are integrated into a single unit. It may be realized as a single device, and some of these functional units are arranged in devices such as an anti-substrate work machine and an inspection machine that inspects the work results of the work, and realized by two or more devices. It may be done.
  • the on-board working machine is a component mounting machine that executes a component mounting operation for mounting an electrical component on a circuit board as the on-board work, and each of the mounted electric parts is set as the work site ( The electrical circuit manufacturing support apparatus according to item 1).
  • the said board work machine is a solder printing machine which performs the solder printing work which prints cream solder on a circuit board as said board work, and each printed solder land was made into the said work part ( The electrical circuit manufacturing support apparatus according to item 1).
  • the modes according to the above two terms are modes in which limitations are added to the type of the work machine for the board and the work for the board, and the work site in the work for the board.
  • the target part quality determination unit is configured so that the stability before the occurrence of the recognized change in the work condition and the post-occurrence of at least one of the work on the substrate for the monitoring target part and the work result of the monitoring target part.
  • the stability of the work against the substrate in the aspect of this section includes the stability of the operation of the work machine with respect to the substrate, the movement of the object of the operation, the stability of the state, and the like. More specifically, for example, the accuracy of movement (in other words, the degree to which no movement error occurs), the movement speed, the movement force, and the position and state of the object of movement from the normal speed, force, position and state It also means the degree of smallness of deviation or the like. “Stability of work results” means the degree of variation in work results.
  • each printed solder land Stability with respect to misregistration from the regular printing position (concept including misalignment of rotational position or orientation), normal area such as rubbing, protrusion, protrusion, etc., deviation from volume (increase, decrease), etc.
  • the fixed fixing of the fixed component It means the stability with respect to misalignment (increase) from the normal area such as misalignment from the position, protrusion of the solidified solder, and the like.
  • the stability of the work against the substrate and the stability of the work result are suitable parameters for predicting the quality level of the work part, that is, the high possibility that the work part will be a defective part.
  • the above-mentioned stability the number or probability of operation mistakes, the average of the deviation amount from the reference value for the above-mentioned various deviations, the relationship with the control limit value of the deviation amount, the deviation variation range, the process capability index, etc.
  • Various statistical indicators used in the field of quality control can be used.
  • the monitoring target part certifying unit monitors some of the specified work parts based on a rule set in consideration of easy appearance of the influence of work condition fluctuation on work quality.
  • the electric circuit manufacturing support device according to any one of items (1) to (4) configured to be recognized as a target part.
  • the above-mentioned influence part may be a considerable number depending on the type of work on the board, the contents of work condition variation, and the like. According to the aspect of this section, it is possible to efficiently monitor the deterioration of the quality of the electric circuit even when there are many affected parts.
  • the above-mentioned “rules set in consideration of the ease of appearance of the influence of work condition fluctuations on work quality” are, in other words, rules for selecting a part whose quality is more likely to deteriorate due to work condition fluctuations, for example. It may be set based on the size of the work site, the position of the work site on the substrate, etc., depending on the type of work on the substrate, the contents of work condition fluctuations, and the like.
  • the electrical circuit manufacturing support device further includes: When the target part quality determination unit determines that the degree of deterioration of the work quality of the monitoring target part exceeds the set level, an improvement for determining an improvement measure for improving the work quality of the monitoring target part A treatment determining unit; Item (1) to Item (5), further comprising a treatment notification unit that notifies the improvement treatment determined by the improvement treatment determination unit to at least one of the on-board work machine and the operator of the electric circuit manufacturing line.
  • the electrical circuit manufacturing support apparatus according to any one of the above.
  • the substrate working machine is configured to be able to automatically execute the improvement procedure by notifying the improvement procedure to itself.
  • the improvement treatment determination unit is applied when improvement of the work quality of the monitoring target portion is not seen even though the determined improvement treatment is applied to the substrate work machine. Configured to determine a remedial action separate from the remedial action, The electrical circuit manufacturing support apparatus according to (6), wherein the treatment notifying unit is configured to notify at least one of the anti-substrate work machine and an operator of the electrical circuit production line of the other improvement measures.
  • the aspect of this section it is possible to further support for the quality of the electric circuit.
  • the priority of improvement actions should be set in consideration of the contents of changes in work conditions, ease of implementation of improvement actions, the degree of effect, etc. The actual decision may be made according to the setting.
  • An electric circuit manufacturing support method for supporting the manufacture of an electric circuit by an electric circuit manufacturing line provided with an on-board work machine that performs an on-board work that is a work on a circuit board constituting an electric circuit, Based on work machine related information including information on at least one of an operation performed by the substrate work machine and a treatment performed on the substrate work machine in the board work, a change in work conditions in the board work
  • a condition change recognition step for recognizing a change in work condition,
  • a monitoring target part qualifying step for identifying a work part in which the recognized work condition variation may affect work quality, and certifying at least one of the specified work parts as a monitoring target part;
  • Control data including at least one of operation-based acquisition data acquired based on the operation of the substrate-working machine and inspection data by an inspection machine that inspects a work result of the substrate-working by the substrate-working machine
  • the circuit board for which the board work was performed before the recognized change in the work condition was compared with the circuit board for which the board work was performed after the work condition change occurred.
  • This section is an aspect of the claimable invention that belongs to the method category, that is, an aspect of the electric circuit manufacturing support method (hereinafter sometimes simply referred to as “support method”) according to the claimable invention. Since the technical contents of the aspect of this section are the same as the technical contents of the aspect of the electric circuit manufacturing support apparatus according to the claimable invention described above, the description thereof is omitted here.
  • some items related to the aspect of the electrical circuit manufacturing support apparatus listed above are “parts” of the functional units (specifically, improvement measure determination unit, measure notification unit, etc.) described in the item. Can be converted to “steps” and subordinated to this section to be a section showing some aspects of the electric circuit manufacturing support method according to the claimable invention.
  • the electric circuit manufacturing support device 10 (hereinafter, may be simply referred to as “support device 10”) of the embodiment supports the manufacturing of the electric circuit performed by the electric circuit manufacturing line 20.
  • support device 10 supports the manufacturing of the electric circuit performed by the electric circuit manufacturing line 20.
  • an electric circuit manufacturing line 20 (hereinafter sometimes simply referred to as “manufacturing line 20”) includes, in order from the upstream side, a substrate feeder 22 and solder.
  • the printing machine 24, the printing work result inspection machine 26, the first transport path switching device 28, the component mounting machine 30, the second transport path switching device 32, the mounting work result inspection machine 34, the reflow furnace 36, and the final inspection machine 38 are arranged.
  • the plurality of substrates sequentially pass through these devices, and an electric circuit is manufactured.
  • the printing work result inspection machine 26, the mounting work result inspection machine 34, and the reflow furnace 36 are for the board work machine, and the solder printing work, the part mounting work, and the part fixing work performed by each of them are the board work.
  • the substrate feeder 22 stores a plurality of substrates in a stacked manner, and sequentially puts the substrates one by one into the production line 20, more specifically, solder printing.
  • the machine 24 is charged.
  • the solder printer 24 performs an operation (solder printing operation) of screen-printing cream solder on the surface of the substrate that has been input.
  • the printing work result inspection machine 26 inspects the result of the solder printing work by the solder printing machine 24.
  • the component mounting machine 30 can perform work in two lanes, and the first transport path switching unit 28 mounts the board unloaded from the printing work result inspection machine 26 on the component mounting. It has a function to distribute to the two lanes of the machine 30.
  • the component mounting machine 30 is a base 40, six mounting modules 42 that are arranged side by side on the base 40 and each function as a component mounting device, and an overall control device that controls these mounting modules 42 in an integrated manner.
  • the module integrated controller 44 is configured to mount a component by each mounting module 42 while the board on which the solder is printed passes through the six mounting modules 42 in sequence (component mounting operation). And the component mounting work on the board is completed.
  • the second transport path switching unit 32 has a function of collecting the transport paths of the boards transported in two lanes in the component mounting machine 30 into one path.
  • the mounting operation result inspection machine 34 inspects the result of the component mounting operation by the component mounting machine 30.
  • the reflow furnace 36 melts the cream solder by heating the substrate on which the component is mounted, and then solidifies the solder by cooling to perform a fixing operation of the component to the substrate (component fixing operation).
  • the final inspection machine 38 is disposed at the end of the production line 20 and performs final inspection of an electric circuit manufactured by performing a counter-to-board operation by each device.
  • the production line 20 includes a line controller 46 that controls the devices 24, 26, 30, 34, 36, and 38 in an integrated manner.
  • the line controller 46 is connected to these devices via a LAN 48.
  • the support apparatus 10 is also connected to the LAN 48, and is connected to the devices 24, 26, 30, 34, 36, 38 and the line controller 46 via the LAN 48.
  • the main equipment will be described in detail below individually.
  • the solder printer 24 has a base frame 50 mainly composed of square pipes, and is a substrate conveyor device that is supported and arranged on the base frame 50. 52, a substrate holding / lifting device 54 (only a part of the device is hidden behind the screen 56 in the figure), a screen holding device 58, a squeegee device 60, a cleaning device 62, and the like.
  • the substrate conveyor device 52 has a function of transporting the substrate from the upstream side to the downstream side and stopping the substrate at a predetermined work position below the screen 56.
  • the substrate holding / lifting device 54 holds and lifts / lowers the substrate stopped at the work position.
  • the screen holding device 58 includes a holding frame 64 that holds the screen 56 and four holding frame position adjustment mechanisms 66 that adjust the position of the holding frame 64 in order to adjust the position of the screen 56.
  • the squeegee device 60 includes a squeegee unit 72 having a pair of squeegees 68 and a squeegee raising / lowering mechanism 70 for moving the pair of squeegees 68 up and down, and moving the pair of squeegee units forward and backward. And a unit moving mechanism 74 to be moved.
  • the substrate carried in from the upstream side by the substrate conveyor device 52 is stopped at the above-mentioned working position, and the stopped substrate is held by the substrate holding / lifting device 54 and then raised, and the lower surface of the screen 56 Pressed against.
  • the screen 56 is provided with openings (through holes) for forming solder lands (also referred to as “solder pads”), and cream solder is supplied to the upper surface of the screen 56.
  • solder pads also referred to as “solder pads”
  • the cream solder is applied to the upper surface of the pressed substrate through the opening of the screen 56. Thereby, solder lands are formed on the upper surface of the substrate with a specific land pattern defined by the openings. In this way, solder printing on the substrate surface is completed. After the printing is completed, the substrate is lowered by the substrate holding / elevating device 54, then the holding is released, and the substrate is conveyed to the downstream side by the substrate conveyor device 52. In the solder printer, the solder printing operation for one substrate is performed in this way.
  • the solder printer 24 moves between the screen 56 and the substrate in a state before being raised, and can image both the lower surface of the screen 56 and the upper surface of the substrate.
  • the substrate reference mark attached to the surface of the substrate and the screen reference mark attached to the lower surface of the screen 56 are imaged.
  • the substrate and the screen The amount of relative positional deviation is grasped. Based on the grasped relative positional deviation amount, the position of the screen 56 is adjusted by the holding frame position adjusting mechanism 66, and then the board is raised by the board holding / lifting device 54, and solder printing is performed.
  • the cleaning device 62 is a device that cleans the lower surface of the screen 56 when the area / volume is excessive or excessive, such as solder land rubbing or protrusion.
  • the cleaning device 62 has a cleaning unit 80 having a non-woven fabric 76 wound around a pair of rollers and passed between them, and a nozzle 78 for impregnating the non-woven fabric 76 with alcohol as a cleaning liquid.
  • the cleaning unit 80 is configured to be moved back and forth by a unit moving mechanism that is hidden in the drawing. The cleaning unit 80 is moved by the unit moving mechanism while the nonwoven fabric 76 is in contact with the lower surface of the screen 56, so that the lower surface of the screen 56 is cleaned by being wiped by the nonwoven fabric 76.
  • a backup member 82 for backing up the nonwoven fabric 76 is provided below the nonwoven fabric 76, and the nonwoven fabric 76 is brought into contact with the lower surface of the screen 56 while being backed up by the backup member 82.
  • the cleaning unit 80 is provided with a vacuum suction device (not shown), and the suction material sucks the deposits adhering to the screen 56 through the slot and the nonwoven fabric 76 provided in the backup member 82. Is possible.
  • the cleaning by the cleaning device 62 is dry cleaning performed without impregnation of alcohol into the nonwoven fabric 76 and suction with a suction device, wet cleaning performed with alcohol impregnation, and vacuum performed with alcohol impregnation and suction.
  • the three modes of cleaning can be performed, and any one of these modes is selected, and the lower surface of the screen 56 is cleaned in the selected mode.
  • the cleaning device 62 is configured to perform cleaning automatically periodically, automatically based on an external signal, or manually by an operator's operation.
  • the solder printer 24 includes a controller 84 that is a control device mainly composed of a computer, and the operation of each of the above-described devices and mechanisms constituting the solder printer 24 is performed by the controller 84.
  • the controller 84 grasps and manages the currently supplied cream solder based on the solder ID input by the operation of the operator's operation panel.
  • the solder printer 24 also includes an air conditioner 86 that adjusts the temperature inside the solder printer 24 for adjusting the viscosity of the cream solder supplied to the upper surface of the screen 56.
  • the printing work result inspection machine 26 is configured to include a substrate conveyor device, an inspection head, and a head moving device that moves the inspection head, although illustration of the internal structure is omitted.
  • the board conveyor device has a function of carrying the solder printed board from the upstream side and carrying it out to the downstream side, and placing it at a predetermined inspection position.
  • the inspection head is a work head for obtaining information on the surface of the substrate placed at the inspection position.
  • the head moving device is a so-called XY type moving device, and an X direction moving mechanism for moving the inspection head in a direction parallel to the substrate transport direction (X direction) and a direction perpendicular to the X direction (Y direction).
  • the Y-direction moving mechanism is moved to move the inspection head along a plane parallel to the surface of the substrate above the substrate.
  • the inspection head is a printing result inspection head 90 for inspecting the result of the solder printing operation, and this printing result inspection head 90 is the surface of the substrate.
  • a light source that irradiates slit light obliquely from four directions so that a grating is formed on the substrate, and a camera as an imaging device that images the grating of light formed on the surface of the substrate obliquely from two directions. Yes.
  • a light line 92 constituting a lattice formed by the irradiated slit light is a solder land 94 on the substrate, that is, a portion formed at a place where the solder is printed is on the substrate itself on which the solder land 94 is not formed. It will shift from the part formed in the surface. The amount of this shift varies depending on the thickness (height) of the solder land.
  • the printing work result inspection machine 26 can detect the positional deviation amount of the solder land 94 in the X and Y directions and the positional deviation amount in the rotational direction. (Amount of deviation in rotation angle or direction), area, and volume are acquired.
  • the camera can image a plurality of solder lands 94 in one field of view, and the printing work result inspection machine 26 can inspect a plurality of solder lands 94 at a time.
  • the printing work result inspection machine 26 has the above-mentioned deviation amount, soldering area 94, the amount of change in area from the normal area, and the amount of volume change, which is the amount of change in volume from the normal volume.
  • the limit value (defect determination limit value) defined for the land 94 is exceeded, the solder land 94 is recognized as a defective portion, and the defect is notified to the operator via the display on the operation panel.
  • the printing failure information such as the work site and the content of the failure is notified. Based on the notified information, the operator includes changes in the conditions of solder printing work by the solder printer 24 (program change, temperature change, additional supply of solder, cleaning of the screen 56 by the cleaning device 62, etc. )I do.
  • the component mounting machine 30 is a working machine for mounting components on a board, and includes a base 40, six mounting modules 42, and a module overall controller 44 as described above. It is configured.
  • FIG. 4 shows the mounting module 42 with the exterior panel removed. With reference to this figure, the mounting module 42 includes a module base 100, a beam 102 overlaid on the module base 100, and a module.
  • a substrate conveyor device 104 disposed on the base 100, a plurality of component feeders 106 that are replaceably attached to the module base 100 on the front side of the module 42, and each function as a component supply device; a substrate conveyor device 104; A base-fixed component camera 108 fixed to the module base 100 between the plurality of component feeders 106 and a component supplied from any of the plurality of component feeders 106 are held and the component is mounted on the substrate S.
  • Mounting head 110 to be removed for the purpose of And a is) is configured to include a head moving device 112 for moving the mounting head 110 is disposed in the beam 102.
  • the substrate conveyor device 104 has two tracks (lanes) for transporting the substrate, and the substrate is loaded into each track from the upstream side and unloaded from each track to the downstream side.
  • the substrate conveyor device 104 has a support table that can be moved up and down at the lower part of each track, and the substrate S carried to a predetermined position is supported by the raised support table and fixed at that position. That is, the board conveyor device 104 functions as a board fixing device that fixes the board S to a predetermined work position in the component mounting work. Since the board conveyor device 104 is disposed in each mounting module 42, the component mounting machine 30 can perform component mounting work in two lanes.
  • the substrate transport direction which is the substrate transport direction by the substrate conveyor device 104, is the X direction shown in the figure (shown with arrows together with the Y direction and Z direction).
  • the head moving device 112 is a so-called XY type moving device, and is supported by the beam 102, a head mounting body 114 to which the mounting head 110 is detachably mounted, an X direction moving mechanism for moving the head mounting body 114 in the X direction, and the beam 102.
  • the X-direction moving mechanism includes a Y-direction moving mechanism that moves the mounting head 110 to move over the component feeder 106 and the substrate S.
  • a substrate camera 116 for capturing an image of the surface of the substrate S is fixed to the lower portion of the head attachment body 114.
  • the mounting head 110 is a so-called index type mounting head. As shown in FIG. 5 (a), each functions as a component holding device and sucks and holds the component at the lower end by supplying a negative pressure (meaning that “the pressure is reduced below atmospheric pressure”). Eight suction nozzles 118 are provided and are held by the revolver 120. The revolver 120 rotates intermittently, and one suction nozzle 118 located at a specific position can be moved up and down by the nozzle lifting mechanism, that is, can be moved in the vertical direction (Z direction). When the suction nozzle 118 located at a specific position is lowered, negative pressure is supplied to hold the component, and when the negative pressure is cut off, the suction holding component is removed.
  • a negative pressure meaning that “the pressure is reduced below atmospheric pressure”.
  • Eight suction nozzles 118 are provided and are held by the revolver 120.
  • the revolver 120 rotates intermittently, and one suction nozzle 118 located at a specific position can be moved up and down by the nozzle lifting mechanism, that
  • each of the eight suction nozzles 118 can be rotated around its own axis (hereinafter sometimes referred to as “nozzle axis”) by the nozzle rotation mechanism, that is, around the nozzle axis.
  • the mounting head 110 can change / adjust the rotational positions (also referred to as “rotational posture” and “azimuth”) of the components held by the respective suction nozzles 118.
  • Each of the plurality of component feeders 106 is set with a reel on which a component holding tape (a plurality of components are held on the tape, also called “component taping”) is wound.
  • Each of the feeders 106 supplies parts one by one sequentially at a predetermined part supply site by intermittently sending out the part holding tape.
  • the replenishment of the parts may be performed by splicing the part taping while exchanging the reels (splicing), or may be performed by exchanging the reels together with the part feeder 106.
  • the mounting module 42 can also be attached with a so-called tray-type component supply device in place of the plurality of component feeders 106.
  • the components are managed by the component ID, and each mounting module 42 grasps what components are supplied by itself by its own controller.
  • the board S to be used for the work is carried in from the upstream side by the board conveyor device 104 and fixed at a predetermined work position.
  • the substrate camera 116 is moved by the head moving device 112, and the reference mark attached to the upper surface of the substrate S is imaged. Based on the imaging data obtained by the imaging, a coordinate system serving as a reference for the mounting position is determined.
  • the mounting head 110 is positioned above the plurality of component feeders 106 by the head moving device 112, and the components are sequentially held in each of the eight suction nozzles 118.
  • the mounting head 110 While the mounting head 110 is moved above the substrate S, the components passing through the component camera 108 and held by each of the suction nozzles 118 are imaged by the component camera 108. Based on the imaging data, a positional deviation amount (a concept including a rotational positional deviation) of each component with respect to the nozzle axis is grasped. Subsequently, the mounting head 42 is moved above the substrate S, and each component is sequentially mounted at a set position determined by the mounting program while performing correction based on the positional deviation amount. The mounting head 42 is reciprocated between the component feeder 106 and the substrate S a number of times determined by the mounting program, and the holding and mounting of the components by the mounting head 42 are repeated as described above, and one mounting module 42 Parts installation work is completed.
  • a positional deviation amount a concept including a rotational positional deviation
  • the mounting module 42 can be mounted with another working head instead of the mounting head 110.
  • the mounting head 122 shown in FIG. 5B can be attached.
  • the mounting head 122 is a so-called single nozzle type mounting head.
  • This mounting head 122 is provided with only one suction nozzle 124 as a component holding device. Although only one part can be sucked and held at a time, relatively large parts can be sucked and held.
  • the mounting head 122 also includes a nozzle lifting / lowering mechanism and a nozzle rotating mechanism, and the suction nozzle 124 is lifted / lowered when holding / removing the component, and the nozzle axis line is used for changing / adjusting the rotational position of the component. Rotated around.
  • the eight suction nozzles 118 included in the mounting head 110 and the suction nozzles 124 included in the mounting head 122 are automatically replaceable, and the replacement suction nozzles 118 and 124 are connected to the substrate conveyor device 104 and a plurality of suction nozzles. It is accommodated in a nozzle stocker 126 arranged between the component feeder 106.
  • a nozzle cleaner 128 is disposed at a position where the component camera 108 is sandwiched between the nozzle stocker 126 in the X direction.
  • the nozzle cleaner 128 has a brush as a main component, and the mounting heads 110 and 122 are moved by the head moving device 112 so that the lower ends of the suction nozzles 118 and 124 are in contact with the brush.
  • the suction nozzles 118 and 124 and the mounting heads 110 and 122 are assigned a nozzle ID and a head ID, and each mounting module 42 has a function of recognizing the nozzle ID and the head ID.
  • the suction nozzle and work head used in the current component mounting work are grasped.
  • the mounting module 42 can be further mounted with, for example, an inspection head 130 shown in FIG. 5C instead of the mounting head 110.
  • the inspection head 128 includes a substrate camera 132 as an imaging device capable of imaging the surface of the substrate S.
  • the board camera 132 has a relatively large field of view, can capture a plurality of components mounted on the board S in one field of view, and has a relatively high resolution. Accordingly, the board camera 132 is a camera suitable for inspection relating to a shift of the mounting position of the mounted component (in this sense, it may be hereinafter referred to as “inspection camera 130”).
  • the mounting module 42 to which the inspection head 130 is attached has a function equivalent to that of the mounting work result inspection machine 34 disposed on the downstream side of the component mounting machine 30.
  • the inspection head 130 functions as an inspection module. For example, when there are a large number of parts to be inspected, that is, work parts, it takes too much time to inspect the mounting result with only this inspection machine 34.
  • the inspection head 130 is attached to the one located on the most downstream side of the six mounting modules 42, and the module 42 functions as a mounting work result inspection machine in addition to the mounting work result inspection machine 34.
  • the working heads 110, 122, and 130 can be exchanged with one touch by lever operation.
  • Each of the mounting modules 42 is identified by the module ID, and the module controller 44 recognizes which mounting module 42 is located at which position on the base 40 by grasping the module ID. Yes.
  • the substrate conveyor device, the inspection head, and the head movement for moving the inspection head are the same as the printing work result inspection machine 26.
  • the board conveyor device has a function of carrying in a board on which components are mounted from the upstream side and carrying it out to the downstream side and placing the board at a predetermined inspection position.
  • the substrate conveyor device and the head moving device have the same configuration as that of the printing work result inspection machine 26, but the inspection head has a configuration different from that of the printing work result inspection machine 26.
  • the inspection head provided in the mounting inspection result inspection machine 34 that is, the mounting inspection head is configured with a substrate camera as an imaging device that images the substrate surface and the upper surface of a component mounted on the substrate from above as a main component.
  • the two-dimensional imaging data is acquired by the substrate camera.
  • the mounting work result inspection machine 34 based on the imaging data acquired by the substrate camera of the mounting inspection head, the amount of positional displacement of the component in the X and Y directions and the amount of positional displacement (rotation angle or direction). The amount of misalignment) is obtained and the occurrence of missing parts or standing parts (so-called “chip standing”) is confirmed. When it is confirmed that a part is missing or standing, it is recognized that the work site is defective due to the fact of the occurrence, that is, the work site is recognized as a defective part.
  • the displacement of the mounting position if the amount of deviation of a part exceeds the limit value (defect determination limit value) specified for that part, that part, that is, its work site is defective. It is recognized as a part.
  • the operator is notified of the installation failure information such as the defective part and the content of the operation defect via the display of the operation panel. Based on the notified information, the operator changes the condition of the component mounting operation by the component mounting machine 30 (changes in the program related to the misalignment correction amount, etc.), replaces the suction nozzle, and the supplied component.
  • the substrate camera included in the mounting inspection head of the mounting operation result inspection machine 34 includes the camera included in the printing inspection head 90 of the printing operation result inspection machine 26, and the inspection substrate camera 132 of the inspection head 122 attached to the component mounting machine 30.
  • a plurality of work parts (mounted parts) can be stored in one field of view, and the mounting work result inspection machine 34 can inspect the results of work on a plurality of parts at a time. .
  • Reflow furnace The reflow furnace 36 heats the substrate carried from the mounting work result inspection machine 34, that is, the conveyor device that conveys the substrate on which the component is mounted to the carry-out port, and the substrate conveyed by the conveyor device. And a hot air type, infrared type heater and the like. While the board on which the components are mounted is transported by the conveyor device, it is heated by a heater so that the cream solder melts and is cooled (naturally cooled) near the carry-out port, so that the solder is solidified. Then, the parts are fixed.
  • the substrate transport speed by the conveyor device, the temperature profile in the furnace changes in the substrate heating temperature relative to the transport position change when the substrate is transported in the furnace), etc.
  • the final inspection machine 38 has substantially the same configuration as the mounting work result inspection machine 34. Based on the imaging data acquired by the board camera that the inspection head has, the positional displacement amount of the component in the X direction and the Y direction and the displacement amount in the rotational direction (deviation amount in the rotation angle or direction) with respect to the component fixing position are acquired. Check the occurrence of missing parts and standing parts (so-called “chip standing”). When it is confirmed that a part is missing or standing, it is recognized that the work site is defective due to the fact of the occurrence, that is, the work site is recognized as a defective part.
  • the final inspection machine 38 also performs inspection on the solidified solder. More specifically, based on the imaging data, the difference between the outer dimensions of each solder land on which each component is placed with respect to the normal outer dimension (outer dimension fluctuation amount). Check for shape defects. For example, if the solder sag and the area of the solder land becomes excessive, it will be connected to the adjacent solder land and the electrical circuit will be short-circuited, etc. The external shape of the solder land is inspected from such a viewpoint.
  • the solder lands When the solder lands are in contact with each other, the solder lands are recognized as defective parts.
  • the operator is notified of defect information such as the contents of the defective part and work defect via the display on the operation panel.
  • the operator adjusts the conveyance speed and temperature profile of the reflow furnace 36 based on the notified information.
  • the defect in the component fixing position is caused not only by the defect in the component fixing operation by the reflow furnace 36 but also by the deterioration of the work quality of the component mounting operation by the component mounting machine 30. Therefore, in that sense, the final inspection machine 38 functions as an inspection machine that inspects not only the result of the component fixing work by the reflow furnace 36 but also the result of the mounting work by the component mounting apparatus 30.
  • the line controller 46 is a control device whose main function is to control and control the production line 20, grasps the board currently being worked on by each device, and the board is an electric circuit by the production line 20.
  • the number of scheduled productions and the actual number of productions, the production tact of the production line 20, etc. are managed, and the setting process by the operator's input operation for the setting items common to each device is performed.
  • Each device has a function of recognizing the substrate ID of the substrate on which the device is currently working.
  • Each device grasps the substrate ID of the substrate on which it performs the substrate work, and the line controller 46 manages the substrate to which the production line 20 is added based on the substrate ID information from each device.
  • the line controller 46 also has a function of managing an operator, and grasps who is currently an operator of the production line 20 based on an operator ID input by the operator himself. ing.
  • the electric circuit manufacturing support apparatus 10 is realized by a general-purpose computer executing a predetermined program, and supports the quality of the electric circuit manufactured by the manufacturing line 20. More specifically, as described above, each of the solder printing machine 24, the component mounting machine 30, and the reflow furnace 36, each of which is a board working machine, has a printing work result inspection machine 26 and a mounting. Since it is detected by the work result inspection machine 34 and the final inspection machine 38, the support apparatus 10 has a quality that does not reach a standard that is recognized as defective in order to maintain high reliability with respect to the quality of the manufactured electric circuit. Support processing to grasp the decline.
  • the support process of the support apparatus 10 mainly recognizes a change in work condition and recognizes a work part to be monitored and recognizes a work part to be monitored and a part to be monitored and a recognized work part.
  • Information / Data used in support processing can be roughly classified into two types.
  • One is “work machine-related information” which is information for recognizing fluctuations in work conditions, and the other is “data for determining deterioration of quality (hereinafter referred to as“ reference data for determining deterioration ”).
  • control data data for determining deterioration of quality
  • information / data is stored in the information / data storage unit of the support apparatus 10 in the support process.
  • work machine-related information indicates what devices and materials were used when the anti-substrate work machine performed anti-substrate work on one board, and what kind of device and materials were used. This is information indicating whether the operation has been performed, the state of the work machine, and the like, and can be further classified into two.
  • One is information related to the work actually performed by the substrate working machine (work result information), and the other is information related to the treatment actually performed on the substrate working machine (treatment information). is there.
  • the work machine related information is transmitted from the counter work machine to the support device mainly when each of the work machines has completed the work on the board.
  • the information related to the operator described above is also a kind of work implement related information, and such information is transmitted from the line controller 46.
  • work performance information examples include the type of solder cream that is currently supplied that can be recognized from the solder ID, the lot number, the supplier (vendor), and the solder printer 24, the ID of each device such as the screen ID and squeegee ID, the squeegee pressure (printing pressure) on the screen, the speed of the squeegee, etc., information about the operation of the squeegee during solder printing, the substrate of the screen 56
  • the work performance information includes the speed of separation from the machine, the temperature inside the machine, the humidity, and the like.
  • information obtained from the imaging data of the substrate reference mark by the imaging device is also included in the work performance information in a broad sense.
  • the work performance information includes IDs of various devices such as IDs and module IDs, operation speeds of various devices such as a nozzle lowering speed in the mounting operation, and mounting positions of the respective parts set in the mounting program.
  • information obtained from imaging data of the substrate reference mark by the substrate camera 116, information obtained from imaging data of the component sucked and held by the suction nozzles 118 and 124 by the component camera 108 (component displacement, component or The number of suction mistakes for each suction nozzle is also included in the work result information in a broad sense.
  • the work performance information is information that can be grasped that the working condition has fluctuated by comparing the information on the work on the substrate with respect to one board and the work on the work on the board with another board. It can be said that.
  • the treatment information is information directly representing that a treatment that causes a change in the working condition is actually performed.
  • the control data includes at least one of operation-based acquisition data and inspection data.
  • the operation-based acquisition data is data related to the operation of the substrate work machine for performing the work on the substrate, and the state (status) of the substrate work machine during or after the operation.
  • various data such as pressure applied to the screen of the squeegee (printing pressure), data on the deviation of the mark obtained from the imaging data of the board reference mark by the imaging device, and the like.
  • It can be action-based acquisition data.
  • data obtained from imaging data by the component camera 108 of the components sucked and held by the suction nozzles 118 and 124 data on position displacement of the component with respect to the nozzle axis line, etc.
  • the number of suction mistakes for each nozzle, the probability, the data regarding the deviation of the mark obtained from the imaging data of the substrate reference mark by the substrate camera 116, and the like can be the operation-based acquisition data.
  • the substrate transfer speed and the temperature profile in the furnace can be the operation-based acquisition data.
  • the operation-based acquisition data is sent to the support device 10 from the substrate working machine every time the substrate working machine performs the substrate working, for example.
  • the inspection data is an inspection machine that inspects the work result of the work on the substrate for the work site where the work on the board is performed, specifically, the print work result inspection machine 26, the mounting work result inspection machine 34, and the final inspection machine.
  • the inspection data by 38 includes the inspection data by the mounting module 42 which is an inspection module in some cases.
  • the inspection data is transmitted from the inspection machine to the support device 10 every time the inspection machine inspects one substrate. Since the comparison data is data to be compared in order to determine the deterioration of the work quality of the work site, it is desirable that the data for each of a considerable number of boards is stored.
  • the section stores reference data for a considerable number of substrates manufactured or manufactured in succession. Specific examples of the inspection data will be listed below.
  • the above-described print position shift amount, area variation amount, volume variation amount, etc. of each solder land are included in the inspection data.
  • the mounting work result inspection machine 34 for example, the above-described mounting position shift amount of each component
  • the final inspection machine 38 for example, the above-described fixed position shift amount of each component, the outer shape of the solder land.
  • Each of the dimension variation amounts is included in the inspection data.
  • condition fluctuation recognition / monitoring target part recognition processing is performed by executing a condition fluctuation recognition / monitoring target recognition program whose flowchart is shown in FIG. This program is started when one of the substrate work machines has completed the work on the substrate for one substrate. Regardless of the solder printing machine 24, the component mounting machine 30, or the reflow furnace 36, processing corresponding to the board working machine is performed by executing the program.
  • step 1 the condition variation recognition flag Fv is reset to “0”.
  • This flag Fv is a flag that is set to “1” when the support apparatus 10 recognizes a change in work condition.
  • step 2 the work machine related information of the board (current work board) on which the current board work has been performed is referred to.
  • the work machine related information is sent from the substrate work machine or the like and stored in the work machine related information buffer of the information / data storage unit.
  • the work machine related information of the current work board is compared with the work machine related information of the board (previous work board) on which the previous work on the board has already been stored, which is already stored in the work machine related information buffer. More specifically, the work result information of the current work board and the previous work board are compared.
  • S6 it is determined whether or not there is a difference between these pieces of information. If it is determined that there is a difference, it is determined in S7 whether or not the difference corresponds to a change in work condition requiring recognition. If it is determined that it corresponds, the condition fluctuation recognition flag Fv is set to “1” as the second condition fluctuation recognition processing in S8.
  • the second condition change recognition process is skipped when it is determined that the difference does not correspond to the recognition condition change requiring recognition even if the difference is recognized.
  • the determination as to whether or not the work condition needs to be recognized can be made based on the type of work performance information to be compared, the degree of difference, etc., and the operator included in the work implement related information at that time It is also possible to make a judgment based on the information, in detail, the qualities, abilities, skill, etc. of the operator. In this way, the support apparatus 10 determines whether or not there is a change in work conditions that should be recognized, that is, dealt with in the work against the board for the current work board, based on the two types of work machine related information.
  • This rule is stored in the information / data storage unit.
  • the above-mentioned setting rule is a rule that is set in consideration of the ease with which the influence of work condition changes on work quality appears. It is sufficient that the monitoring target part is authorized according to the rules.
  • the work condition fluctuation is data related to the work condition fluctuation, such as data on the board ID of the current work board and the certified monitoring target part (condition fluctuation related data). Are registered in the work condition fluctuation monitoring list set in a specific area of the information / data storage unit.
  • the work condition variation monitoring list includes the work condition subject to the processing. It is provided to identify a variation, and one target work condition variation and accompanying condition variation related data are stored as one set of processing target data for each target work condition variation.
  • registered work condition fluctuations are deleted from the list until it is judged that quality deterioration due to certain work condition fluctuations has not occurred, or even if they occur, the quality is improved by improvement measures. Not.
  • S12 a series of processes by the program for one substrate on which the substrate work has been performed is completed. In S9, if it is determined that no change in the work condition to be recognized has occurred in the current work board-to-board work, S10 and the subsequent steps are skipped, and a series of processing by the program ends.
  • Quality Change Judgment / Countermeasure Processing is performed by executing a quality change judgment / handling program shown in the flowchart of FIG.
  • This program is used to inspect a board that may be affected by fluctuations in the work conditions registered in the work condition fluctuation monitoring list by an inspection machine that inspects the results of work against the board where the fluctuations in the work conditions occurred. More specifically, it is performed every time the inspection of each substrate to be processed is completed.
  • the substrate to be processed is determined based on the substrate ID stored as the condition fluctuation related data, and several substrates that have been subjected to the substrate work successively after the substrate of the substrate ID are the targets. It is said.
  • the value of the quality deterioration certification flag Fq is determined.
  • This flag Fq is set as one of the above condition fluctuation related data, the initial value is set to “0”, registered in the list, and the work quality of the monitoring target part is caused by the work condition fluctuation to be processed. It is set to “1” when it is recognized that it has dropped.
  • the quality degradation recognition flag Fq is “1”, quality degradation has already occurred, so the quality improvement process of S22 described later is executed.
  • Judgment as to whether or not quality degradation has occurred is based on the condition that the substrate work has been performed on a predetermined number of substrates from the time when the work condition change occurs.
  • the post-fluctuation work substrate counter Cn for counting the number of substrates performed is stored as one of the work variation-related data, and this counter Cn is not judged to have been deteriorated in quality in the determination of S21. If it is determined, it is counted up in S23. In S24, if the number of substrates has not reached the set number Cn 0 (set to a number effective for the stability evaluation described later), a series of processing by the program ends. When the set number Cn 0 is reached, the processing from S25 is executed.
  • the control data of the monitoring target part stored in the information / data storage unit before the change of the working condition is extracted. Specifically, the control data for the set number Cn 0 of the substrates traced back from the substrate in front of the substrate on which the working condition change occurred is extracted.
  • the index value Ps B of the stability index of the work result of each monitoring target part before the occurrence of the work condition change (hereinafter, the index value of the stability index is referred to as “stability index”). May be abbreviated as “value”). More specifically, the stability index value Ps A for one or more control items in the board work and the result of the work is calculated, and the calculated stability index value Ps B is 1 in the condition variation related data in S27.
  • the stability index it is possible to adopt a stability index that indicates the stability with respect to the deviation from the normal value of the control item.
  • the process capability index C pK can be adopted.
  • This process capability index C pK is a stability index that is commonly used in the field of quality control, and is defined by the formula shown in FIG. 8 (the standard upper limit L U and the standard lower limit L L are inspections). It is set to be considerably smaller than the above-mentioned limit value for defect determination prescribed for determining defects in the machine).
  • the process capability index C pK is a stability index indicating that the larger the value is, the more stable the process capability index C pK is.
  • the stability index is the average of the amount of deviation from the reference value for various deviations, which are the control items, the relationship with the control limit value of the deviation, the range of deviation variation, the work Various things such as the number of mistakes and the probability (in other words, the number and probability of work success) can be adopted.
  • the control data of the monitoring target part after the change of the working condition stored in the information / data storage unit is extracted. Specifically, reference data is extracted for a set number of substrates Cn 0 after the substrate on which the working condition change occurred.
  • an index value Ps A of the stability index of the work result of each monitoring target part after the work condition variation occurs is calculated.
  • the stability index value Ps B before the occurrence of work condition fluctuation and the stability index value Ps A after the occurrence of work condition fluctuation are compared with each other to be monitored, and the stability index value Ps sets the set threshold value ⁇ Ps.
  • step S30 when it is determined that the work quality of the monitoring target part has not decreased beyond the set level, it is assumed that there is no decrease in work quality due to the change in the work condition.
  • step S35 the registered work condition change and the related condition change related data are deleted from the work condition change monitoring list and removed from the processing target. . With the end of the process of S33 or S35, a series of processes by the program ends.
  • the quality improvement process is a process executed in S22 on the condition that the quality deterioration is recognized and the improvement process is once notified in the previous quality change determination / handling process. This is processing performed by executing a quality improvement subroutine showing a flowchart. Incidentally, the quality change determination / coping is also finished by the end of the processing by this subroutine.
  • the contents of the quality improvement process are explained below according to the flowchart. Since the quality improvement process is performed on the assumption that the improvement process is being performed, first, in S41, a determination based on the improvement process execution flag Fi is performed. This flag Fi is stored in the information / data storage unit as one of the condition fluctuation related data, and is set to “0” when the improvement measure is not implemented, and set to “1” when the improvement procedure is implemented. Is done. Whether or not improvement measures have been implemented is determined based on information from the substrate working machine and the substrate ID of the substrate currently being processed.
  • a post-improvement work substrate counter Cn ′ for counting the number of substrates that have been subjected to the substrate work after the improvement treatment has been adopted is adopted, and information / data storage is performed as one of the condition variation related data.
  • a determination is made based on the improvement measure execution flag Fi, and if the improvement process has not been executed yet, in S42, whether or not the current board is a board that has been newly improved. Is determined, and the improvement process is not performed, the series of processing by the subroutine ends.
  • the improvement process execution flag Fi is set to “1” in S43, and the post-improvement work substrate counter Cn ′ is reset in S44. Counter Cn ′ is counted up.
  • S42 to S44 are skipped, and the counter Cn 'is incremented in S45.
  • the index value Ps A 'of the stability index of the work result of each monitoring target site after the implementation of the improvement treatment is calculated.
  • the stability index value Ps B before the occurrence of work condition fluctuation is compared with the stability index value Ps A ′ after the improvement treatment for each monitoring target part, and the stability index value Ps is set to the set threshold value ⁇ Ps. In the case where the work quality has been lowered beyond the range, it is determined that the degree of work quality degradation of the monitoring target part has exceeded the set level, that is, the work quality has not been improved by the remedial action.
  • next improvement action is determined by referring to the table in S53. That is, when a plurality of improvement actions are set in the action table, another improvement action is determined repeatedly within a range where the improvement actions are set until quality improvement is observed. Then, in S54, the fact that the quality degradation is continuing and the improvement action of the next order are notified to the substrate work machine and the line controller 46 in which the working condition fluctuation has occurred. If it is determined in S52 that the next improvement measure is not set, it is determined in S55 that the quality degradation is still continuing and that the improvement measure could not be notified. 46 is notified. In S56, the registered work condition fluctuation and the related condition fluctuation-related data are deleted from the work condition fluctuation monitoring list and removed from the processing target. Thereafter, a series of processing by the subroutine is performed. finish.
  • the electric circuit manufacturing support device 10 performs the condition variation recognition / monitoring target part recognition processing, quality change determination / handling processing, and quality improvement processing as described above. It can be considered that it has a functional configuration as shown in FIG. Specifically, the support apparatus 10 includes an information / data acquisition unit 152, a condition variation recognition unit 154, a monitoring target part recognition unit 156, and a target part, each of which is a plurality of functional units connected to each other by a virtual internal bus 150. It has a quality judgment unit 158, an improvement treatment determination unit 160, an information / treatment notification unit 162, and an information / data storage unit 164.
  • the support apparatus 10 is connected to the solder printing machine 24, the component mounting machine 30, the reflow furnace 36, the printing work result inspection machine 26, and the mounting work result inspection machine 34, each of which is a substrate work machine, via the LAN 48. , It is connected to the final inspection machine 38.
  • the information / data obtaining unit 152 is used for comparing the above-mentioned work machine related information such as work performance information and treatment information, operation-based acquisition data, inspection data, etc. from the substrate work machine and the inspection machine. It has a function to obtain data.
  • the condition fluctuation recognition unit 154 has a function of recognizing work condition fluctuations based on the work implement related information
  • the monitoring target part recognition unit 156 specifies the influence part and monitors the part to be monitored from the influence parts.
  • the target part quality judging unit 158 has a function for judging the change of the work quality of the monitoring target part from the control data before and after the change of the work condition, and the improvement treatment determining part 160 is used for the change of the work condition.
  • the information / treatment notifying unit 162 has a function of notifying the on-board work machine and the operator of the determined improvement treatment, and a function for determining the improvement treatment for improving the work quality of the monitoring target site. is doing.
  • the information / data storage unit 164 has a function of storing the work implement related information and the comparison data, and various information, data, tables, lists, rules, and the like described above.
  • the condition variation recognition unit 154 has the functions realized by the processing of S1 to S9.
  • the monitoring target part recognition unit 156 has a function realized by the processes of S10 to S12
  • the target part quality judgment unit 158 has a function realized by the processes of S23 to S30
  • the improvement measure determination unit 160 has S32 and S52.
  • S53 the information / data storage unit 164 has functions realized by S33, S34, S50, S54, S55 and the like.
  • the support processing executed by the support device 10 corresponds to an electrical circuit manufacturing support method, and includes a condition variation recognition unit 154, a monitoring target part recognition unit 156, a target part quality determination unit 158, an improvement measure determination unit 160, information and measures.
  • the processing for realizing each function of the notification unit 162 corresponds to a condition variation recognition step, a monitoring target part recognition step, a target part quality determination step, an improvement action determination step, and a action notification step in the electric circuit manufacturing support method, respectively. To do.
  • the largest part, the smallest part, and the part with the largest number of terminals for one part are certified as the monitoring target part.
  • the amount of displacement of the mounting position for the monitoring target portion on the board on which the component mounting operation has been performed before replacement of the suction nozzles 118, 124 and the component mounting operation are performed after replacement.
  • the displacement amount of the mounting position for the monitored portion on the broken substrate is used as control data, and the process capability index C pK with respect to those displacement amounts before and after replacement of the suction nozzles 118 and 124 for each of the monitored portions.
  • the process capability indexes C pK are compared to determine whether or not there is a quality deterioration for each of the monitored parts. Further, out of the operation-based acquisition data from the component mounting machine 30, the displacement of the component with respect to the axis of the suction nozzles 118 and 124 acquired based on the imaging data of the component camera 108 of the component to be monitored, that is, the suction shift amount of the suction holding position of the component by the nozzle 118, 124 is also used as a control data, the process capability index C pK for position shift amount thereof in the before and after replacement of the suction nozzle 118, 124 for each of the monitor target Are respectively calculated as stability index values, and the process capability indexes C pK are compared to determine whether or not there is a quality deterioration for each of the monitored parts.
  • the number of suction holding mistakes when the part to be monitored is taken out from the component feeder 106 by the suction nozzles 118 and 124 is also used as the reference data, and for each monitored part.
  • the suction holding error rate (strictly speaking, the suction holding success rate) before and after the replacement of the suction nozzles 118 and 124 is calculated as a stability index value, and these suction holding error rates are compared, and each of the monitoring target parts is compared. It is determined whether or not there is a deterioration in quality.
  • the automatic cleaning of the suction nozzles 118 and 124 using the nozzle cleaner 128 as the first order improvement measure improves the second order.
  • the correction of the bending of the nozzle by the operator is decided, and the replacement of the suction nozzles 118 and 124 is decided as the third order improvement treatment.
  • ii) Change of parts lot in the component mounting machine When the parts are replenished in the component mounting machine 30 by splicing or replacement of the parts feeder 106, a lot change occurs.
  • the change of the part lot is a change in work condition that affects the work quality of the part mounting work, specifically, the mounting accuracy of the part.
  • a part ID is adopted as the work performance information that is work implement related information, and the part ID is recognized by being different between the previous work board and the current work board.
  • the change of the part lot is recognized, the part of the changed lot is identified as the affected part. And all the parts specified as an influence part are authorized as a monitoring object part.
  • the amount of displacement of the mounting position for the monitoring target part in the substrate on which the component mounting operation has been performed before the change of the component lot and the substrate on which the component mounting operation has been performed after the change Is used as control data, and the process capability index C pK with respect to those positional deviation amounts before and after changing the part lot for each of the monitoring target parts is used as the stability index value.
  • the calculated process capability indexes C pK are compared, and it is determined whether or not there is a quality deterioration for each of the monitoring target parts.
  • the displacement of the component with respect to the axis of the suction nozzles 118 and 124 acquired based on the imaging data of the component camera 108 of the component to be monitored that is, the suction
  • the deviation amount of the suction holding position of the part by the nozzles 118 and 124 is also used as control data, and the process capability index C pK with respect to the positional deviation amount before and after the part lot change for each monitored part is a stability index. each is computed as the value is compared their process capability index C pK, whether degradation for each of the monitor target is determined.
  • the number of suction holding mistakes when the part to be monitored is taken out from the component feeder 106 by the suction nozzles 118 and 124 is also used as the reference data, and for each monitored part.
  • the suction retention error rate (strictly speaking, the suction retention success rate) before and after the parts lot change is calculated as a stability index value, and these suction retention error rates are compared to reduce the quality degradation for each of the monitored parts. Presence or absence is determined. Further, when it is determined that quality degradation has occurred in any of the monitoring target parts, when the part lot is changed by exchanging parts together with the part feeder 106, first, only the part feeder 106 is changed.
  • the procedure for replacing another component feeder 106 does not show improvement, the procedure for replacing the component with a component in another lot is sequentially determined and notified as an improvement procedure. .
  • the lot of a part is changed by exchanging only the part by splicing or the like, a process for replacing the part with a part in another lot is determined and notified as the only improvement process.
  • the screen 56 in the solder printer 24 is an effective means for preventing the solder land from rubbing, protruding, and protruding. Cleaning is performed. This regular dry cleaning causes a change in working conditions in the solder printing operation. When periodic dry cleaning is performed, the fact that the cleaning has been performed is sent from the solder printer 24 to the support device 10 as the processing information that is information related to the work machine. Implementation is recognized as a change in working conditions. In the case of dry cleaning, all the solder lands to be printed are identified as affected parts, and the smallest solder lands, the largest solder lands, the two closest solder lands, and the X direction and Y direction are monitored parts.
  • the solder land closest to each of the both ends of the board in each of the above, the solder land located at the center of the board is certified.
  • Area variation amount before dry cleaning in each of the monitored site, the process capability index C pK and dry cleaning before the area change amount for each of the volume variation, the process capability index C pK is stability index values for the volume change amount Are calculated for each of the monitoring target parts, and the deterioration of the work quality is determined.
  • wet cleaning is determined as the first order improvement process
  • vacuum cleaning is determined as the second order improvement process.
  • the control data can be selected appropriately according to changes in work conditions, and the identification of affected parts, the rules for qualifying monitored parts, stability index values, countermeasures, etc. can be set arbitrarily. Has been. That is, the mounting apparatus 10 can easily cope with a wide variety of work condition fluctuations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention propose de manière efficace une aide, associée à la qualité, pour la fabrication de circuits électriques au moyen d'une ligne de fabrication de circuits électriques. Sur la base d'informations associées à des dispositifs de traitement, lesquelles informations comprennent des informations concernant des opérations exécutées sur des substrats par un dispositif de traitement de substrat et/ou des informations concernant des actions exécutées sur ledit dispositif de traitement de substrat, un changement dans des conditions de traitement de substrat est reconnu (154) ; des emplacements d'opérations dans lesquels ledit changement pourrait affecter la qualité des opérations sont identifiés et au moins l'un desdits emplacements d'opérations est sélectionné pour une surveillance (156) ; et une détermination est réalisée quant au changement de la qualité d'opérations au niveau dudit ou desdits emplacements (158). Ladite détermination est effectuée par comparaison de ce qui suit : des données de comparaison concernant des cartes de circuit traitées avant le changement mentionné ci-dessus dans les conditions de traitement de substrat ; et des données de comparaison concernant des cartes de circuit traitées après ledit changement. Lesdites données de comparaison comprennent l'une de ce qui suit : des données dépendant des opérations, acquises de façon à dépendre des opérations exécutées par le dispositif de traitement de substrat mentionné ci-dessus ; et des données d'inspection provenant d'un dispositif d'inspection qui inspecte les résultats des opérations.
PCT/JP2012/063277 2011-05-31 2012-05-24 Dispositif d'aide à la fabrication de circuits électriques et procédé d'aide à la fabrication de circuits électriques WO2012165275A1 (fr)

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JP2011121939A JP5781835B2 (ja) 2011-05-31 2011-05-31 電気回路製造支援装置および電気回路製造支援方法
JP2011-121939 2011-05-31

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JPWO2014091546A1 (ja) * 2012-12-10 2017-01-05 富士機械製造株式会社 はんだ印刷機
EP3098679A4 (fr) * 2014-01-22 2017-07-05 Fuji Machine Mfg. Co., Ltd. Système de production
CN107561382A (zh) * 2017-08-23 2018-01-09 南方电网科学研究院有限责任公司 一种输电设备运行状况的监控方法及装置
CN114073178A (zh) * 2019-07-23 2022-02-18 株式会社富士 数据管理装置

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EP3579677B1 (fr) 2017-02-02 2023-12-13 Fuji Corporation Dispositif de gestion de production
JP6830538B2 (ja) * 2017-07-25 2021-02-17 株式会社Ｆｕｊｉ 対基板作業管理システム
JP7012819B2 (ja) 2018-03-09 2022-01-28 株式会社Fuji 部品実装機
CN112237059B (zh) 2018-06-12 2022-03-04 株式会社富士 元件安装机及元件安装系统
WO2020044431A1 (fr) * 2018-08-28 2020-03-05 株式会社Ｆｕｊｉ Dispositif de vérification de programme de commande
WO2024189728A1 (fr) * 2023-03-13 2024-09-19 株式会社Fuji Dispositif d'inspection et système d'inspection

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EP3098679A4 (fr) * 2014-01-22 2017-07-05 Fuji Machine Mfg. Co., Ltd. Système de production
CN107561382A (zh) * 2017-08-23 2018-01-09 南方电网科学研究院有限责任公司 一种输电设备运行状况的监控方法及装置
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CN114073178B (zh) * 2019-07-23 2023-07-14 株式会社富士 数据管理装置

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