WO2022269679A1 - Procédé de contrôle pour système de montage de composant et système de montage de composant - Google Patents

Procédé de contrôle pour système de montage de composant et système de montage de composant Download PDF

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Publication number
WO2022269679A1
WO2022269679A1 PCT/JP2021/023385 JP2021023385W WO2022269679A1 WO 2022269679 A1 WO2022269679 A1 WO 2022269679A1 JP 2021023385 W JP2021023385 W JP 2021023385W WO 2022269679 A1 WO2022269679 A1 WO 2022269679A1
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Prior art keywords
component
mounting
inspection
board
post
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PCT/JP2021/023385
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English (en)
Japanese (ja)
Inventor
智也 藤本
一也 小谷
恵市 小野
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株式会社Fuji
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Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2021/023385 priority Critical patent/WO2022269679A1/fr
Priority to JP2023529210A priority patent/JPWO2022269679A1/ja
Publication of WO2022269679A1 publication Critical patent/WO2022269679A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to a component mounting system control method and a component mounting system.
  • Patent Literature 1 a visual inspection device is provided downstream of the component mounting line in the direction in which the board is conveyed.
  • a component mounting system that specifies a mounter and outputs an operation stop command to the mounter is disclosed.
  • Patent Literature 2 discloses a component mounter having a function of inspecting components mounted on a board. In this component mounter, a camera mounted on the head of the component mounter takes an image of the component immediately after mounting to inspect mounting errors and mounting deviations. This inspection is called post-mounting component inspection. The post-mounting component inspection is started when the operator inputs a component inspection mode start command.
  • Patent Document 2 whether or not to perform the post-mounting component inspection is determined by the operator, so for example, if the post-mounting component inspection is performed excessively, productivity will decrease. Also, the timing of executing the post-mounting component inspection depends on the experience of the operator.
  • the present disclosure has been made to solve such problems, and its main purpose is to appropriately perform post-mounting component inspections regardless of the experience of workers.
  • the control method of the component mounting system of the present disclosure includes: a component mounting line in which a plurality of component mounters that hold a board and mount components on the board are arranged along the transport direction of the board; an imaging device provided for each of the component mounters for capturing an image of the board held by the component mounters; Appearance inspection for determining whether or not each of the plurality of components mounted on the substrate by the plurality of component mounters is in a defective mounting state, provided downstream of the component mounting line in the conveying direction.
  • a visual inspection device that performs A method of controlling a component mounting system comprising: (a) setting the component determined by the visual inspection apparatus to be in a defective mounting state as a component to be inspected; (b) The component mounter that has mounted the inspection target component controls the imaging device to obtain an image of the inspection target component, and the inspection target component is successfully mounted based on the image of the inspection target component. a step of performing a post-mounting component inspection to determine whether or not it is defective; includes.
  • a component determined by a visual inspection device to be in a defective mounting state is set as a component to be inspected; obtaining an image of the component to be inspected, and performing a post-mounting component inspection to determine whether the component to be inspected is properly mounted or defective based on the image of the component to be inspected. Therefore, when the visual inspection apparatus determines in the visual inspection that the component to be mounted on the board is in a defective mounting state, the post-mounting component inspection is performed. Therefore, the post-mounting component inspection is less likely to be performed with excessive frequency, and the timing of performing the post-mounting component inspection is no longer influenced by the experience of the operator.
  • the defective mounting state is, for example, a state in which the mounting position of the component is displaced beyond the allowable range, a state in which the component on the board is missing, or the like.
  • FIG. 1 is a perspective view showing a schematic configuration of a component mounting system 1;
  • FIG. FIG. 2 is an external perspective view of the component mounter 10;
  • FIG. 2 is a block diagram showing the electrical connection relationship of the component mounting system 1;
  • 4 is a flowchart showing an example of an appearance inspection routine;
  • FIG. 7 is an explanatory diagram showing an example of a result of appearance inspection 76;
  • FIG. 7 is an explanatory diagram showing an example of a result of appearance inspection 76;
  • 4 is a flowchart showing an example of a component mounting routine;
  • 4 is a flowchart showing an example of a post-mounting component inspection subroutine;
  • FIG. 1 is a configuration diagram showing an outline of a component mounting system 1 of this embodiment.
  • FIG. 2 is an external perspective view of the component mounter 10
  • FIG. 3 is a block diagram showing electrical connections of the component mounting system 1.
  • the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.
  • the component mounting system 1 includes a printer 2, a print inspection machine 3, a component mounting line 12, a reflow device 13, a visual inspection device 14, and a management device 80 for managing the entire system. , provided.
  • the printer 2 prints solder on the board S to form a circuit pattern.
  • a print inspection machine 3 inspects the state of solder printed by the printer 2 .
  • a plurality of component mounters 10 perform a mounting operation for mounting components on the board S and perform a mounting inspection to determine whether or not the components have been mounted on the board S.
  • the printer 2, the print inspection machine 3, the component mounting line 12, and the appearance inspection device 14 are arranged side by side in the transport direction of the board S (from left to right) to form a production line.
  • the component mounting line 12, as shown in FIG. 1, includes a plurality of (here, five) component mounters 10A to 10E arranged along the transport direction (X-axis direction) of the board S.
  • the component mounters 10A to 10E are referred to as the component mounters 10 when they are not distinguished from each other.
  • the component mounter 10 includes a component supply device 21 for supplying components, a substrate transfer device 22 for transferring a substrate S, a head 40 having suction nozzles 45 for sucking components, and the head 40.
  • a head moving device 30 for moving in the X-axis direction and the Y-axis direction, and a control device 60 (see FIG. 3) for controlling the entire mounter are provided.
  • the component mounter 10 also includes a parts camera 23 for capturing an image of the suction posture of a component sucked by the suction nozzle 45, a nozzle station 24 for accommodating a replacement suction nozzle 45, and a substrate S.
  • a mark camera 43 for taking an image is also provided.
  • a mark camera 43 is attached to the bottom surface of the X-axis slider 32 or the head 40 .
  • the mark camera 43 has an imaging area below, and is a camera that reads reference marks attached to the substrate S that indicate reference positions of the substrate S, reference positions for arranging components, and the like.
  • the component supply device 21 includes, for example, a tape reel on which a carrier tape containing components is wound at predetermined intervals, and a tape feeding mechanism that pulls out the carrier tape from the tape reel by driving a drive motor and feeds the carrier tape to a component supply position.
  • a tape feeder comprising:
  • the substrate conveying device 22 has a pair of conveyor rails spaced apart in the Y-axis direction. transport.
  • the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, an X-axis actuator 33 (see FIG. 3), a pair of Y-axis guide rails 35, a Y-axis It has a slider 36 and a Y-axis actuator 37 (see FIG. 3).
  • a pair of Y-axis guide rails 35 are installed on the upper stage of the housing 16 so as to extend parallel to each other in the Y-axis direction.
  • the Y-axis slider 36 is bridged over a pair of Y-axis guide rails 35 and is moved in the Y-axis direction along the Y-axis guide rails 35 by driving the Y-axis actuator 37 .
  • a pair of X-axis guide rails 31 are installed on the front surface of the Y-axis slider 36 so as to extend parallel to each other in the X-axis direction.
  • the X-axis slider 32 is bridged over a pair of X-axis guide rails 31 and moves in the X-axis direction along the X-axis guide rails 31 by driving the X-axis actuator 33 .
  • a head 40 is attached to the X-axis slider 32, and the head moving device 30 moves the X-axis slider 32 and the Y-axis slider 36 to move the head 40 in the X-axis direction and the Y-axis direction. .
  • the head 40 includes a Z-axis actuator 41 (see FIG. 3) that moves the suction nozzle 45 in the Z-axis (vertical) direction, and a ⁇ -axis actuator 42 (see FIG. 3) that rotates the suction nozzle 45 around the Z-axis. .
  • a negative pressure source to the suction port of the suction nozzle 45
  • the head 40 can apply negative pressure to the suction port to suck the component.
  • a positive pressure source to the suction port of the suction nozzle 45
  • the head 40 can apply positive pressure to the suction port to release the suction of the component.
  • the control device 60 is configured as a microprocessor centered around a CPU 61, and in addition to the CPU 61, it also includes a ROM 62, a storage 63 (for example, HDD or SSD), and a RAM 64.
  • the controller 60 receives a position signal from the X-axis position sensor 34 that detects the position of the X-axis slider 32, a position signal from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, and a position signal from the mark camera 43.
  • An image signal, an image signal from the parts camera 23, and the like are input.
  • control device 60 a control signal to the component supply device 21 , a control signal to the substrate transfer device 22 , a drive signal to the X-axis actuator 33 , a drive signal to the Y-axis actuator 37 , a drive signal to the Z-axis actuator 41 , a drive signal to the .theta.-axis actuator 42, a control signal to the parts camera 23, a control signal to the mark camera 43, and the like.
  • the control device 60 is connected to the reflow device 13, the visual inspection device 14, the control device 60 and the management device 80 provided in the other component mounters 10 so as to be capable of two-way communication, and exchange data and control signals with each other. make a deal.
  • the reflow device 13 is arranged downstream of the component mounting line 12 .
  • the reflow device 13 heats the board S to melt the solder, cools the board S, electrically connects the components on the board S, and fixes the components to the board S. As shown in FIG.
  • the visual inspection device 14 is arranged downstream of the reflow device 13 (that is, downstream of the component mounting line 12 in the transport direction).
  • the appearance inspection device 14 includes an inspection camera 75 (see FIG. 3) and a control device 70 (see FIG. 3).
  • the inspection camera 75 is an imaging device that images the substrate S conveyed from the reflow device 13 from above.
  • the control device 70 is configured as a microprocessor centered around a CPU 71 as shown in FIG.
  • the control device 70 outputs control signals to the inspection camera 75 and inputs image signals from the inspection camera 75 . Based on the image captured by the inspection camera 75, the control device 70 determines whether the amount of positional deviation between the actual mounting position and the predetermined target mounting position for each component on the board S is within the permissible range for visual inspection. Appearance inspection is performed to determine
  • the control device 70 is also connected to the control device 60 and the management device 80 provided in the mounters 10A to 10E so as to be capable of two-way communication, and exchanges data and control signals with
  • the management device 80 is, for example, a general-purpose computer, and includes a CPU 81, a ROM 82, a storage 83, and a RAM 84, as shown in FIG.
  • An input signal is input to the management device 80 from an input device 87 such as a mouse and a keyboard.
  • the management device 80 is connected to the component mounters 10A to 10E, the reflow device 13 and the appearance inspection device 14 so as to be able to communicate bidirectionally.
  • An image signal to a display 88 is output from the management device 80 .
  • the storage 83 stores substrate S production jobs.
  • the production job of the board S includes a production schedule such as which components are to be mounted on the board S in what order in each component mounter 10, and the positions on the board S to which such components are to be mounted.
  • the management device 80 generates a production job based on the data input by the operator via the input device 87, and transmits the generated production job to each of the component mounters 10A to 10E. to start production.
  • FIG. 4 is a flowchart showing an example of a visual inspection routine
  • FIG. 5 is an explanatory diagram showing an example of the visual inspection result 76.
  • the appearance inspection result 76 is data in which the component inspected by the appearance inspection device 14 and the mounting state (good or bad) are associated and stored.
  • the appearance inspection routine is stored in the ROM 72 of the control device 70 provided in the appearance inspection apparatus 14 and is started after the board S is conveyed to the appearance inspection apparatus 14 .
  • the CPU 71 first acquires a production job (S100). Specifically, the CPU 71 acquires a production job from the management device 80 and stores it in the storage 73 . Subsequently, the CPU 71 captures an image of the substrate S after transport (S110). Specifically, the CPU 71 controls the inspection camera 75 to capture an image of the substrate S conveyed to the appearance inspection device 14 and stores the image in the storage 73 . Subsequently, the CPU 71 detects the position of the substrate S (S120). Specifically, the CPU 71 detects the reference mark from the image captured in S110, and detects the position of the substrate S based on the position of the reference mark. Subsequently, the CPU 71 selects a component for visual inspection (S130).
  • S130 a component for visual inspection
  • the CPU 71 calculates the amount of positional deviation (S140). Specifically, the CPU 71 obtains the value of the X-axis coordinate, the value of the Y-axis coordinate, and the angle when the component selected in S130 is actually mounted based on the image captured in S110.
  • the X-axis coordinates, Y-axis coordinates and angles are as follows. That is, when the substrate S is defined as the XY plane with the left front corner of the substrate S as the origin, the X-axis coordinates are the X-axis coordinates of the center of the component, and the Y-axis coordinates are the Y-axis coordinates of the center of the component.
  • the angle is the angle between the long side of the part and a line parallel to the Y-axis. Then, the CPU 71 calculates the amount of positional deviation from the target mounting position by calculating the difference between the X-axis coordinate value and the Y-axis coordinate value and the angle of the component selected in S130 and the target mounting position.
  • the CPU 71 determines whether or not the positional deviation amount is within the allowable range (S150). If all of the X-axis coordinates, Y-axis coordinates, and angles of the amount of positional deviation from the target mounting position calculated in S140 are within the allowable range of the amount of positional deviation, the CPU 71 makes an affirmative determination. On the other hand, if at least one of the X-axis coordinate, Y-axis coordinate, and angle out of the positional deviation amount calculated in S140 exceeds the positional deviation amount allowable range, the CPU 71 makes a negative determination.
  • the CPU 71 determines that the mounting state of the component is good and updates the visual inspection result 76 (S160). Specifically, as shown in FIG. 5, the CPU 71 associates the component selected in S130 with the mounting state (good) and stores them in the storage 73 . On the other hand, if a negative determination is made in S150, the CPU 71 regards the mounting state of the component as defective and updates the visual inspection result 76 (S170). Specifically, the CPU 71 associates the component selected in S130 with the mounting state (defective) determined in S150 and stores them in the storage 73 as shown in FIG.
  • the CPU 71 determines whether or not there are uninspected parts (S180). If an affirmative determination is made in S180, the CPU 71 returns to S130 again. On the other hand, if a negative determination is made in S180, the CPU 71 determines whether or not there is a defectively mounted component in the appearance inspection result 76 (S190). For example, when the appearance inspection result 76 (the mounting state of the component P3 is defective) as shown in FIG. 6, the CPU 71 makes an affirmative determination. On the other hand, if the appearance inspection result 76 indicates that the mounting state of all components is good, the CPU 71 makes a negative determination. If a negative determination is made in S190, the CPU 71 terminates this routine.
  • the CPU 71 outputs the appearance inspection result 76 to all the component mounters 10 (component mounters 10A to 10E) (S200), and ends this routine.
  • the CPU 61 provided in the control device 60 of the component mounters 10A to 10E stores the visual inspection result 76 in the storage 63 when the visual inspection result 76 output from the control device 70 in S200 is input.
  • FIG. 7 is a flow chart showing an example of a component mounting routine
  • FIG. 8 is a flow chart showing an example of a post-mounting component inspection subroutine.
  • a component mounting routine is stored in the ROM 62 of the control device 60 and is started after a production job is input from the management device 80 .
  • the component mounting routine is executed by each of the CPUs 61 provided in the controllers 60 of the component mounters 10A to 10E.
  • the CPU 61 When this routine is started, the CPU 61 first loads the substrate S (S300). Specifically, the CPU 61 drives and controls the board transfer device 22 to transfer the board S to a predetermined position of the component mounter 10 . Subsequently, the CPU 61 determines whether or not a mounting stop instruction has been input (S310). This mounting stop instruction will be described later. If a negative determination is made in S310, the CPU 61 takes an image of the substrate S (S320). Specifically, the CPU 61 controls the mark camera 43 to take an image of the state immediately after being conveyed to the component mounter 10 and stores the image in the storage 63 . Subsequently, the CPU 61 detects the position of the substrate S (S330). Specifically, the reference mark is detected from the image captured in S320, and the position of the substrate S is detected based on the position of the reference mark.
  • the CPU 61 mounts the component on the substrate S (S340). Specifically, the CPU 61 first acquires the target mounting positions of the components to be mounted from the input production job. Then, the CPU 61 controls the head moving device 30 and the head 40 so that the component is mounted at the target mounting position with respect to the position of the board S acquired in S330. Subsequently, the CPU 61 determines whether or not there is an unmounted component (S350). If an affirmative determination is made in S350, the CPU 61 returns to S340 again. On the other hand, if a negative determination is made in S350, the CPU 61 determines whether or not the appearance inspection result 76 is stored in the storage 63 (S360).
  • the CPU 61 sets the inspection target component (S370). Specifically, the CPU 61 finds a component whose mounting state is defective from the appearance inspection result 76, and sets the component as a component to be inspected. For example, if the appearance inspection result 76 as shown in FIG. 6 is stored in the storage 63, the CPU 61 sets the part P3 as the part to be inspected. Subsequently, the CPU 61 determines whether or not the component to be inspected has been mounted by its own machine (the component mounting machine 10 provided with the CPU 61) (S380). Specifically, the CPU 61 compares the inspection target component set in S370 with the production job, and determines whether or not the own machine has mounted the inspection target component.
  • the CPU 61 provided in the component mounter 10A determines that the component to be inspected has been mounted by itself, and the CPU 61 provided in the component mounters 10B to 10E has mounted the component to be inspected by itself. judge not. If an affirmative determination is made in S380, the CPU 61 executes the post-mounting component inspection subroutine (see FIG. 8) (S390).
  • the CPU 61 takes an image of the board S with its own mark camera 43 (S500). Specifically, the CPU 61 controls the mark camera 43 to capture an image of the board S immediately after mounting all the components to be mounted by itself, and stores the image in the storage 63 . Subsequently, the CPU 61 calculates the positional deviation amount (S510). Specifically, the CPU 61 obtains the value of the X-axis coordinate, the value of the Y-axis coordinate, and the angle when the component is actually mounted on the board S based on the image captured in S500.
  • the CPU 61 calculates the amount of positional deviation from the target mounting position by calculating the difference between the X-axis coordinate value and the Y-axis coordinate value and the angle of the component to be inspected and the target mounting position. Subsequently, the CPU 61 determines whether or not the positional deviation amount is within the allowable range (S520). If all of the X-axis coordinates, Y-axis coordinates, and angles of the positional deviation amount from the target mounting position calculated in S510 are within the allowable range of the positional deviation amount, the CPU 61 makes an affirmative determination. On the other hand, if at least one of the X-axis coordinate, Y-axis coordinate, and angle out of the positional deviation amount calculated in S510 exceeds the positional deviation amount allowable range, the CPU 61 makes a negative determination.
  • the CPU 61 sets the number of good determinations to 0 (S530). Specifically, the CPU 61 sets the number of good judgments to 0 and stores it in the storage 63 . Subsequently, the CPU 61 determines whether or not the machine itself is in the mounting stop instruction output state (S540). The mounting stop instruction output state will be described later.
  • the CPU 61 If a negative determination is made in S540, the CPU 61 outputs a mounting stop instruction (S550). Specifically, the CPU 61 outputs a mounting stop signal so that the component mounter 10 arranged downstream in the conveying direction from the self-mounter stops mounting components, and changes the status of the self-mounter to stop mounting.
  • the instruction output state is set and stored in the storage 63 .
  • the control device 60 provided in the component mounter 10 arranged on the downstream side in the conveying direction of the own machine inputs a mounting stop instruction.
  • the CPU 61 provided in the control device 60 that has received the mounting stop instruction makes an affirmative determination in S310 of the above-described component mounting routine, and adjusts various components so that the components are not mounted by the component mounter 10 having the CPU 61 (self).
  • the substrate transport device 22 is controlled to transport the substrate S to the downstream side (S400). Therefore, it is possible to prevent the components mounted on the board S from being wasted by the component mounters 10 arranged downstream in the transport direction from the component mounters 10 that have mounted the components to be inspected.
  • the CPU 61 provided in the component mounter 10A outputs a mounting stop instruction so that the component mounters 10B to 10E stop mounting the components.
  • the control device 60 provided in each of the component mounters 10B to 10E inputs a mounting stop instruction, controls various members so that the components are not mounted, and conveys the board S downstream.
  • the CPU 61 After making an affirmative determination in S540 or after S550, the CPU 61 issues a warning to the operator and temporarily suspends production (S552).
  • the warning is issued, for example, by displaying a warning message (for example, a message to the effect that the component to be inspected has been improperly mounted in the post-mounting component inspection) on a display device (not shown) provided in the device itself.
  • the production When temporarily suspending production, the production is temporarily suspended not only for the own machine but also for all the devices of the component mounting system 1. ⁇
  • the operator corrects the production job and shape data through the input device 87 of the management device 80 . After that, the operator inputs an interruption cancellation instruction to the management device 80 via the input device 87 .
  • the CPU 61 waits for an instruction to cancel the suspension and resumes the suspended production (S554). All devices in the component mounting system 1 are notified of the instruction to cancel the suspension. Therefore, the interrupted production is resumed in all devices of the component mounting system 1 .
  • the CPU 61 determines whether or not the state of the machine itself is in the mounting stop instruction output state (S560). If an affirmative determination is made in S560, the CPU 61 outputs a mounting restart instruction (S570). Specifically, a signal for resuming mounting is output to the component mounter 10 to which the mounting stop instruction was output in S550, and the mounting stop instruction output state of the own machine is cancelled. The component mounter 10 that has received the mounting resumption signal resumes component mounting.
  • the CPU 61 After making a negative determination in S560 or after S570, the CPU 61 increments the good determination count by one (S580). Subsequently, the CPU 61 determines whether or not the number of good judgments has reached a predetermined number (S590).
  • the predetermined number of times is a preset number of times regardless of the type of component, and is set to five times, for example. If an affirmative determination is made in S590, the CPU 61 executes examination end processing (S600). Specifically, the CPU 61 deletes the appearance inspection result 76 from the storage 63 and resets the number of non-defective product determinations to 0, and deletes the appearance inspection result to the component mounter 10 to which the mounting stop instruction was output in S550.
  • the CPU 61 provided in the control device 60 of the mounter 10 that receives the visual inspection result deletion signal deletes the visual inspection result 76 from the storage 63 . After S554, after making a negative determination in S590 or after S600, the CPU 61 terminates the post-mounting component inspection subroutine and proceeds to S400 of the component mounting routine.
  • the CPU 61 controls the board transfer device 22. to convey the substrate S downstream (S400), after which the component mounting routine ends.
  • the component mounting system 1 of this embodiment corresponds to the component mounting system of the present disclosure
  • the component mounting line 12 corresponds to the component mounting line
  • the component mounter 10 corresponds to the component mounter
  • the mark camera 43 corresponds to the imaging device.
  • the control device 60 corresponds to the control device
  • the appearance inspection device 14 corresponds to the appearance inspection device
  • S370 of the present embodiment corresponds to step (a) of the present disclosure
  • S500 to S520 correspond to step (b) corresponds to
  • the process of ending the post-mounting component inspection after an affirmative determination is made in S590 of the present embodiment corresponds to step (c) of the present disclosure.
  • Step 10 controls the mark camera 43 to acquire an image of the inspection target component (S500), and conducts a post-mounting component inspection to determine whether the inspection target component is properly mounted or defective based on the image of the inspection target component. (S510, S520). Therefore, the CPU 61 of the component mounter 10 executes the post-mounting component inspection when the appearance inspection device 14 determines in the appearance inspection that the component to be mounted on the substrate S is in a defective mounting state. Therefore, the post-mounting component inspection is less likely to be performed with excessive frequency, and the timing of performing the post-mounting component inspection is no longer influenced by the experience of the operator.
  • the control method of the component mounting system 1 includes a step (S590, S600) of terminating the post-mounting component inspection if the judgment result of the post-mounting component inspection is good for a predetermined number of times. For this reason, for example, when a component to be inspected accidentally becomes defective in mounting, the subsequent post-mounting component inspection is performed a predetermined number of times in succession, and the post-mounting component inspection ends. Therefore, it is possible to further suppress the decrease in production efficiency due to the execution of the post-mounting component inspection.
  • a component determined to be in a defective mounting state by the visual inspection device 14 is set as a component to be inspected, and the component mounter 10 that has mounted the component to be inspected controls the mark camera 43 to select the component to be inspected.
  • An image of the component is obtained, and control is performed to perform a post-mounting component inspection for determining whether the mounting of the inspection target component is good or bad based on the image of the inspection target component. Therefore, the post-mounting component inspection is less likely to be performed with excessive frequency, and the timing of performing the post-mounting component inspection is no longer influenced by the experience of the operator.
  • the image of the board S is acquired by controlling the mark camera 43 provided in the component mounter 10 on which the component to be inspected is mounted, but the present invention is not limited to this.
  • the board S for which the post-mounting component inspection subroutine has not been executed by the component mounter 10 on which the inspection target component is mounted is arranged downstream of the component mounter 10 on which the inspection target component is mounted.
  • the component mounter 10 may perform the post-mounting component inspection (one component mounter 10 may perform the post-mounting component inspection for one inspection target component).
  • the controller 60 provided in the component mounter 10 that has mounted the component to be inspected executes the post-mounting component inspection subroutine. All you have to do is output a signal to start component inspection after mounting.
  • the number of good judgments is the number of times the control device 60 of the mounter 10 that mounted the inspection target component has judged that the mounting state of the inspection target component is good, and the number of times the component inspection start signal after mounting has been output.
  • the number of times the control device 60 of the component mounter 10 of the output destination determines that the mounting state of the inspection target component is good may be the total number of times.
  • the post-mounting component inspection subroutine may be executed immediately after the component to be inspected is mounted.
  • the CPU 61 may set the parts to be inspected after the negative determination is made in S310 and before the parts are mounted.
  • the control device 60 provided in the component mounter 10 sets the inspection target component (S370), but it is not limited to this.
  • the management device 80 or the control device 70 of the visual inspection device 14 may set the parts to be inspected.
  • the control device 60 provided in the component mounter 10 determines whether or not the component mounter 10 has mounted the inspection target component (S380), but the present invention is not limited to this.
  • the management device 80 or the control device 70 may specify the component mounter 10 that has mounted the inspection target component.
  • the predetermined number of times is set to a constant number regardless of the type of part, but it is not limited to this.
  • the predetermined number of times may be set for each type of component.
  • the predetermined number of times may be set based on the failure rate in visual inspection by the visual inspection device 14 . That is, each time a visual inspection is performed by the appearance inspection apparatus 14, the defect occurrence rate for each component may be calculated, and the number obtained by multiplying the calculated occurrence rate by a predetermined specified number of times may be set as the predetermined number of times. .
  • the CPU 61 outputs a mounting stop instruction after making a negative determination in S520, but the present invention is not limited to this.
  • the CPU 61 may output a mounting stop instruction before starting the post-mounting component inspection subroutine.
  • a mounting restart instruction is output in S570.
  • S560 and S570 may be omitted and the process may proceed to S580.
  • a mounting restart instruction may be output when the inspection end process is executed in S600.
  • the component mounting system control method and component mounting system of the present disclosure may be configured as follows.
  • the inspection target component is removed.
  • the component mounter arranged on the downstream side of the component mounter that has mounted the components may perform the post-mounting component inspection. In this way, for example, even if the board on which the inspection target component is mounted has already passed the component mounter that has already mounted the inspection target component, the board can be located downstream of the component mounter in the transport direction.
  • Post-mounting component inspection can be performed using an image captured by an imaging device provided in the component mounter.
  • step (b) if the mounting of the inspection target component is determined to be defective in the post-mounting component inspection, the subsequent components for the board determined to be defective Implementation may be discontinued. In this way, it is possible to prevent the components mounted on the board from being wasted by the component mounters downstream of the component mounter that mounted the inspection target component.
  • the control method of the component mounting system of the present disclosure may include (c) the step of terminating the post-mounting component inspection if the judgment result of the post-mounting component inspection is positive for a predetermined number of consecutive times. .
  • the subsequent post-mounting component inspection will continuously make a good determination for a predetermined number of times, and the post-mounting component inspection will end. Therefore, it is possible to further suppress the decrease in production efficiency due to the execution of the post-mounting component inspection.
  • the component mounting system of the present disclosure includes: a component mounting line in which a plurality of component mounters that hold a board and mount components on the board are arranged along the transport direction of the board; an imaging device provided for each of the component mounters for capturing an image of the board held by the component mounters; Appearance inspection for determining whether or not each of the plurality of components mounted on the substrate by the plurality of component mounters is in a defective mounting state, provided downstream of the component mounting line in the conveying direction.
  • a visual inspection device that performs The component determined by the appearance inspection device to be in a defective mounting state is set as a component to be inspected, and the component mounting machine that has mounted the component to be inspected controls the imaging device to image the component to be inspected.
  • a control device for performing a post-mounting component inspection for determining whether the mounting of the inspection target component is good or bad based on the image of the inspection target component; is provided.
  • a component determined to be defective in mounting by a visual inspection device is set as a component to be inspected, and the component mounting machine that has mounted the component to be inspected controls an imaging device to image the component to be inspected. is obtained, and control is performed to perform post-mounting component inspection for determining whether the mounting of the inspection target component is good or bad based on the image of the inspection target component. Therefore, the post-mounting component inspection is less likely to be performed with excessive frequency, and the timing of performing the post-mounting component inspection is no longer influenced by the experience of the operator.
  • the present disclosure can be used for a component mounting system incorporating a component mounter.
  • Parts mounting system 2. Printing machine, 3. Print inspection machine, 10, 10A, 10B, 10C, 10D, 10E. Parts mounting machine, 12. Parts mounting line, 13. Reflow device, 14. Appearance inspection device, 16. Housing, 21. Parts supply Device, 22 Substrate transfer device, 23 Parts camera, 24 Nozzle station, 30 Head moving device, 31 X-axis guide rail, 32 X-axis slider, 33 X-axis actuator, 34 X-axis position sensor, 35 Y-axis guide rail, 36 Y Axis slider, 37 Y-axis actuator, 38 Y-axis position sensor, 40 Head, 41 Z-axis actuator, 42 ⁇ -axis actuator, 43 Mark camera, 45 Suction nozzle, 60 Control device, 61 CPU, 62 ROM, 63 Storage, 64 RAM , 70 control device, 71 CPU, 72 ROM, 73 storage, 74 RAM, 75 inspection camera, 76 visual inspection result, 80 management device, 81 CPU, 82 ROM, 83 storage, 84 RAM

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Procédé de contrôle selon la présente invention pour contrôler un système de montage de composants comprenant les éléments suivants : une ligne de montage de composants comportant une pluralité de machines de montage de composants pour monter des composants sur un substrat ; des dispositifs d'imagerie prévus pour les machines de montage de composants respectives et qui capturent des images du substrat ; et un dispositif d'inspection d'apparence qui exécute une inspection d'apparence pour déterminer si chacun de la pluralité de composants montés sur le substrat est dans un état de montage défectueux ou non. Le procédé de contrôle du système de montage de composants selon la présente invention comprend les étapes suivantes : une étape pour configurer un composant dont le montage a été estimé défectueux par le dispositif d'inspection d'apparence en tant que composant à inspecter ; et une étape où une machine de montage de composants ayant monté le composant à inspecter commande le dispositif d'imagerie correspondant afin d'acquérir une image du composant à inspecter, et effectue une inspection de composant après montage pour déterminer, sur la base de l'image du composant à inspecter, si l'état de montage du composant à inspecter est réussi ou défectueux.
PCT/JP2021/023385 2021-06-21 2021-06-21 Procédé de contrôle pour système de montage de composant et système de montage de composant WO2022269679A1 (fr)

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PCT/JP2021/023385 WO2022269679A1 (fr) 2021-06-21 2021-06-21 Procédé de contrôle pour système de montage de composant et système de montage de composant
JP2023529210A JPWO2022269679A1 (fr) 2021-06-21 2021-06-21

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248796A (ja) * 2011-05-31 2012-12-13 Fuji Mach Mfg Co Ltd 対基板作業検査支援装置
WO2014076755A1 (fr) * 2012-11-13 2014-05-22 富士機械製造株式会社 Dispositif de surveillance d'état de production de substrat
JP2021057392A (ja) * 2019-09-27 2021-04-08 ヤマハ発動機株式会社 表面実装機、実装ライン、表面実装機の基板検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248796A (ja) * 2011-05-31 2012-12-13 Fuji Mach Mfg Co Ltd 対基板作業検査支援装置
WO2014076755A1 (fr) * 2012-11-13 2014-05-22 富士機械製造株式会社 Dispositif de surveillance d'état de production de substrat
JP2021057392A (ja) * 2019-09-27 2021-04-08 ヤマハ発動機株式会社 表面実装機、実装ライン、表面実装機の基板検査方法

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