WO2012149786A1 - 一种散热器 - Google Patents

一种散热器 Download PDF

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Publication number
WO2012149786A1
WO2012149786A1 PCT/CN2011/080424 CN2011080424W WO2012149786A1 WO 2012149786 A1 WO2012149786 A1 WO 2012149786A1 CN 2011080424 W CN2011080424 W CN 2011080424W WO 2012149786 A1 WO2012149786 A1 WO 2012149786A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat sink
sub
common bracket
heat source
Prior art date
Application number
PCT/CN2011/080424
Other languages
English (en)
French (fr)
Inventor
刘贞贞
侯晓静
池善久
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN2011800019500A priority Critical patent/CN102449759B/zh
Priority to PCT/CN2011/080424 priority patent/WO2012149786A1/zh
Publication of WO2012149786A1 publication Critical patent/WO2012149786A1/zh
Priority to US14/081,288 priority patent/US9917029B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of electronic products, and in particular to a heat sink. Background technique
  • veneers in the field of electronic products is widely spoken.
  • One or more main chips are usually disposed on the board, and a plurality of peripheral devices are disposed in the single board around each main chip. Due to the close layout characteristics of the peripheral device and the main chip, it is determined that the independent heat sink cannot be separately cooled by the main chip and the peripheral device. Therefore, the shared heat sink solution is required to dissipate the main chip and the peripheral device.
  • the existing shared heat sink includes a substrate and a heat sink.
  • the substrate is disposed above all the main chips and all the peripheral devices, and between the substrate and the main chip, and between the substrate and the peripheral device, respectively, is filled with a thermal pad to eliminate The height difference between the main chip and the peripheral device ensures that the main chip and peripheral devices dissipate heat through the shared heat sink.
  • the common heat sink and the single board are fixed by screws.
  • the thermal pad itself is an elastic body having a thickness specification and a compression amount, it is necessary to compress the thermal pad by screwing in the mounting screw of the shared heat sink and the veneer during installation, so that the shared heat sink is affected.
  • the compressive stress is large, and the compressive stress acts on the main chip and the peripheral device through the thermal pad, so that the reliability of the main chip and the peripheral device is lowered.
  • the embodiment of the present invention A heat sink is provided.
  • the technical solution is as follows - a heat sink comprising a sub-heatsink, a connecting device and a common bracket, wherein the sub-radiator is connected to the common bracket by the connecting device; wherein the sub-radiator includes a heat conducting surface, the sub heat sink is in contact with the first heat source through the first heat conducting surface to dissipate heat to the first heat source, the common bracket includes a second heat conducting surface, and the common bracket passes through the second heat conducting surface Contacting the second heat source to dissipate heat to the second heat source, the second heat conducting surface
  • the sub-heatsinks are respectively disposed at different positions of the common bracket.
  • the beneficial effects of the technical solution provided by the embodiments of the present invention are as follows: Compared with the prior art, the heat sink of the embodiment of the present invention realizes the heat dissipation problem of the second heat source through the second heat conduction surface of the shared bracket, and the A heat conducting surface realizes the heat dissipation problem of the first heat source, and the coplanar mounting between the first heat source and the second heat source is realized by the connecting device, and only a small force is required to realize the first heat source and the sub heat sink
  • the good contact reduces the stress of the first heat source, increases the reliability of the first heat source, and on the other hand, eliminates the heat dissipation effect of the thermal pad on the first heat source and the second heat source in the prior art, and improves The overall heat dissipation effect.
  • FIG. 1 is a layout view of a single board according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the mounting of the heat sink and the main chip and the peripheral device according to an embodiment of the present invention
  • FIG. 3 is a view showing the heat sink and the main chip and the peripheral device according to another embodiment of the present invention
  • FIG. 4 is an exploded view of the heat sink with the peripheral device removed according to another embodiment of the present invention
  • FIG. 5 is a schematic structural view of a connecting device according to an embodiment of the present invention.
  • FIG. 5A is a schematic structural view of a connecting device according to another embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a bridge heat pipe according to an embodiment of the present invention.
  • Fig. 7 is a schematic view showing another structure of the bridge heat pipe according to the embodiment of the present invention.
  • peripheral devices 31 peripheral devices eight, 32 peripheral devices B;
  • connection device 81 support column, 81A internal thread, 82 screw, 83 spring, 81A smooth support column, 811A limit structure;
  • the embodiment of the present invention is described by taking a single board and a main chip and a peripheral device thereon as an example.
  • the single board 1 is provided with a plurality of main chips 2, and each of the main chips 2 is provided with a plurality of peripheral devices 3.
  • the main chip 2 and the peripheral device can be any heat generating device.
  • the main chip 2 is defined as a first heat source
  • the peripheral device 3 is defined as a second heat source.
  • a heat sink includes a sub-heatsink 4, a connecting device 8 and a common bracket 7.
  • the sub-heatsink 4 is connected to the common bracket 7 by a connecting device 8;
  • the sub-heat sink 4 includes a first heat conducting surface 4A, and the sub-heat sink 4 contacts the first heat source (in this example, the main chip 2) through the first heat conducting surface 4A to dissipate heat from the first heat source (in this example, the main chip 2).
  • the bracket 7 includes a second heat conducting surface 7A, and the common bracket 7 contacts the second heat source (in this example, the peripheral device 3) through the second heat conducting surface 7A to dissipate heat to the second heat source (in this example, the peripheral device 3), and the second heat conducting surface 7A and the sub-heatsink 4 are respectively disposed at different positions of the common bracket 7.
  • the first heat source is the main chip 2
  • the second heat source is the peripheral device 3.
  • the heat sink of the embodiment of the present invention realizes the heat dissipation problem of the peripheral device 3 through the shared bracket 7, and the heat dissipation problem of the main chip 2 is realized by the sub-heatsink 4, which is realized by the connection device.
  • the coplanar mounting between the main chip 2 and the sub-heatsink 4 ensures good contact between the main chip 2 and the sub-heatsink 4, and the structure of the embodiment of the present invention makes good contact between the peripheral device 3 and the common bracket 7.
  • attachment means can be connected by conventional fixed attachment means such as screw connections, bolt-and-nut connections or rivet connections.
  • the sub-heat sink 4 includes a substrate 5 and a heat sink 6, and the first heat transfer surface 4A of the sub-heat sink 4 and the heat sink 6 are respectively formed on opposite sides of the substrate 5.
  • the substrate 5 of the heat sink 4 includes a connecting portion 5B and an embedded portion 5A, and the connecting portion 5B is connected to the common bracket 7, and the heat sink 6 of the heat sink 4 is formed.
  • the fitting portion 5A is formed on the lower surface of the connecting portion 5B with respect to the heat sink 6, and the first heat conducting surface 4A is formed on the lower surface of the fitting portion 5A;
  • the common bracket 7 is formed with the fitting portion 5A of the corresponding substrate 5
  • the perforations 71, the embedded portions 5A of the substrate 5 are placed in the perforations 71 of the common holder 7.
  • the connecting device can float relative to the shared bracket.
  • the first heat source that is, the main chip 2 and the second heat source, that is, the peripheral device 3
  • the first heat source that is, the main chip 2 Coplanar mounting is achieved with the second heat source, peripheral device 3.
  • the coplanar mounting means that the main chip 2 is flush with the bottom surface of the peripheral device 3.
  • the relative distance between the sub-heatsink 4 and the common bracket 7 is adjusted by the respective connecting devices 8, and the installation distance between the main chip 2 and the peripheral device 3 is adjusted.
  • the heat sink according to another embodiment of the present invention may also be referred to FIG. 4.
  • the present embodiment is mainly described with reference to FIG. 3, and the present embodiment uses two first heat sources, that is, two main chips.
  • the two main chips include a main chip A 21 and a main chip B 22 .
  • the peripheral device 3 includes a peripheral device A 31 corresponding to the main chip A 21 and a peripheral device B 32 corresponding to the main chip B 22.
  • the heat sink includes a common bracket 7, a sub-heat sink A 41, a sub-heat sink B 42 and two connecting devices 8.
  • the sub-heat sink A 41 includes a substrate 51 of the sub-heat sink A and a heat sink 61 of the sub-heat sink A.
  • the sub-heat sink B 42 includes a substrate 52 of the sub-heat sink B and a heat sink 62 of the sub-heat sink B.
  • the common bracket 7 is provided with two through holes 71, one of which is embedded in the embedded portion of the main chip A 21 and the sub-heat sink A of the substrate 51, and the other through hole 71 is embedded with the main chip B 22 and the substrate 52 of the heat sink B. Embedding department.
  • the peripheral device A 31 and the peripheral device B 32 are connected under the common bracket 7 and radiated through the common bracket 7.
  • the two sub-heatsinks A 41 and the sub-heatsinks B 42 share a common bracket 7, which effectively reduces the screw mounting holes of the radiator and improves the installation efficiency.
  • the present embodiment is described by taking two main chips as an example.
  • the two connecting devices 8 have the same structure.
  • the sub-heatsink B 42 (see FIG. 3) is disposed.
  • the connecting device 8 is taken as an example.
  • the connecting device 8 includes at least two pairs of supporting pillars 81, a screw 82 and a spring 83.
  • At least two supporting columns 81 are distributed on the common bracket 7, at least two.
  • the screws 82 respectively penetrate the connection portion of the substrate 52 of the sub-heatsink B 42 (see FIG. 3) and are fixed to the common bracket 7, and the positions of the at least two screws 82 correspond to the positions of the at least two support columns 81.
  • the at least two springs 83 are correspondingly sleeved on the outside of the at least two support columns 81.
  • the support post 81 is provided with an internal thread 81A
  • the screw 82 is provided with an external thread
  • the internal thread 81A of the support post 81 and the external thread of the screw 82 are provided. Match.
  • the connecting device 8 has the same structure as the connecting device 8 of the sub-heatsink A 41.
  • the connecting device 8 includes four supporting columns 81 and four. Screw 82 and four springs 83.
  • the number of the support columns 81, the screws 82 and the springs 83 are appropriately set according to the area of the substrate of the sub-heatsink, for example, two, three, five, six, and the like.
  • the connecting device is not limited to a support column with internal threads and with external threads.
  • the screw-fit structure, the support column and the screw can also be designed as a unitary structure, ie a smooth support column with a top stop structure (see Figure 5A).
  • the connecting device shown in FIG. 5A in this example, includes at least two pairs and a matching smooth supporting column 81A and a spring 83, and the bottom ends of the at least two smooth supporting columns 81A respectively pass through the Connection portions of the respective substrates are fixed to the common bracket (not shown), and at least two springs 83 are correspondingly sleeved on the outside of at least two smooth support columns 81A, wherein at least two smooth support columns 81A
  • the top end is provided with a limiting structure 811A.
  • the heat sink further includes an auxiliary heat conducting component 10, which is illustrated by taking the connecting device 8 disposed on the sub-heatsink A 41 (see FIG. 3) as an example.
  • the heat conducting element 10 is thermally coupled to the sub-heat sink A 41 (see FIG. 3) and the common bracket 7 for heat transfer between the sub-heat sink A 41 (see FIG. 3) and the shared rack 7.
  • the common bracket 7 and the sub-heatsink A 41 are communicated through its auxiliary heat-conducting element 10, and the bracket 7 and the sub-heatsink B 42 are shared (see FIG. 3).
  • the auxiliary heat conducting element 10 is connected by its auxiliary heat conducting element 10, which is a heat pipe.
  • auxiliary heat conducting element is not limited to a heat pipe, and may be a material having high heat conductivity such as VC.
  • the auxiliary heat conducting component 10 of the heat sink A is taken as an example.
  • the auxiliary heat conducting component 10 that is, the evaporation end 10A of the heat pipe extends into the sub heat sink A , and the condensation end 10B of the heat pipe extends to the common bracket 7 . Connection, heat transfer between the sub-heatsink A 41, the sub-heatsink B 42 and the common bracket 7 is achieved by the uniform temperature performance of the heat pipe.
  • the heat sink according to the embodiment is provided with the connection device 8, and the heat conduction between the main chip A 21 and the peripheral device A 31 is realized, and the main chip B 22 and the peripheral device B 32 are realized.
  • the heat conduction between the two sides solves the problem that the heat dissipation area of the peripheral device cannot meet its own heat dissipation requirement in the prior art, and the limited size of the single board cannot expand the heat dissipation area of the peripheral device, resulting in the accumulation of heat of the peripheral device, and the main chip
  • the sub-heatsink is not fully utilized, and there is a problem that heat dissipation is manifested.
  • the above-mentioned auxiliary heat-conducting component 10 solves the heat dissipation contradiction between the two, and achieves heat dissipation optimization.
  • the auxiliary heat conducting member 10 i.e., the condensation end 10B of the heat pipe
  • the bending section is L-shaped.
  • the bending section is not limited to the L-shape, and may also be a U-shaped bending form, as long as the bending form can expand the flexibility of the auxiliary heat-conducting element 10.
  • the length is fine.
  • the two auxiliary heat conducting elements 10 are each in a figure-eight shape.
  • the heat sink includes at least two of the sub heat sinks and a one-to-one correspondence thereto
  • the device 9, the at least one flexible heat conducting device 9 is respectively connected to any two of the sub-heatsinks 4 (see FIG. 2) of the at least two sub-heatsinks 4 (see FIG. 2), so that any two The sub-heatsink 4 (see Fig. 2) implements heat exchange.
  • the heat sink includes a sub-heat sink A 41, a sub-heat sink B 42 and a connection device 8 corresponding to one of the ones, and a sub-heat sink A 41 and a sub-heat sink B 42 are disposed.
  • the flexible heat conducting device 9 allows the heat of the two sub-heat sinks A 41 and the sub-heatsink B to be mutually conducted by the flexible heat conducting device 9 on the basis of the floating average temperature of the single main chip A 21 or the main chip B 22, ensuring the sub-heat sink A
  • the temperature of the 41 and the sub-heatsink B 42 tends to be the same, achieving a balance of the temperature field, effectively utilizing the heat dissipation area between the two main chips.
  • the flexible heat conducting device 9 is a bridge heat pipe 91.
  • auxiliary heat conducting element is not limited to the bridge heat pipe, and may be any material having high thermal conductivity.
  • the ends of the bridge heat pipes 91 are respectively fixed on any two of the sub heat sinks.
  • the ends of the bridge heat pipes 91 are respectively fixed to the sub heat sink A 41 and the sub heat sink B 42 . on.
  • the main chip A 21 and the main chip B 22 are taken as an example.
  • One end of the bridge heat pipe 91 is fixed to the substrate 51 of the sub-heat sink A and the heat sink 61 of the sub-heat sink A.
  • the other end of the bridging heat pipe 91 is fixed between the substrate 52 of the sub-heat sink B and the fins 62 of the sub-heat sink B, so that the structural design is more reasonable.
  • a part or the whole of the bridge heat pipe 91 is provided with a deformation zone 91A for expanding the flexible length of the bridge connecting the heat pipe 91.
  • the middle portion of the bridge heat pipe 91 is provided with a deformation region 91A, the deformation region 91A is arched, and the arched design of the bridge heat pipe 91 at the intermediate position realizes bridging in a short distance.
  • the flexible design of the heat pipe 91 is provided with a deformation region 91A, the deformation region 91A is arched, and the arched design of the bridge heat pipe 91 at the intermediate position realizes bridging in a short distance.
  • the deformation zone 91A is a polygonal arch.
  • the deformation zone 91A is an arcuate arch.
  • the deformation zone 91A is a rectangular arch.
  • the number of the bridging heat pipes 91 is two, and a redundant bridging heat pipe 91 is designed to ensure the reliability of the bridging heat pipe 91, and the two bridging heat pipes 91 are evenly arranged on the radiator A 41 and The center position of the radiator B 42 avoids damage to the bridge heat pipe 91 during the installation operation.
  • the embodiment of the present invention achieves heat dissipation balance between the main chip and the device and the two main devices with different power consumption, and solves the high heat dissipation margin of the main device with less power consumption.
  • the heat dissipation problem of the power consumption main device effectively reduces the heat sink area.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

一种散热器 技术领域
本发明涉及电子产品领域， 特别涉及一种散热器。 背景技术
单板在电子产品领域中用途广泛说。 单板上通常布置着一个或多个主芯片， 单板中围绕 着每个主芯片还布置着多个外围器件。 由于外围器件和主芯片的紧邻布局特点， 决定了无 法增加独立的散热器分别为主芯片和外围器件散热， 因此需要采用共用散热器方案为主芯 片和外围器件进行散热。
书
目前， 现有的共用散热器包括基板与散热片， 基板设置在所有主芯片及所有外围器件 的上方， 基板与主芯片之间， 以及基板与外围器件之间， 分别填充有导热垫， 以消除主芯 片与外围器件之间的高度差， 从而保证主芯片及外围器件通过共用散热器散热。 同时， 共 用散热器与单板之间通过螺丝固定。
在实现本发明的过程中， 发明人发现现有技术至少存在以下问题：
一方面， 由于导热垫本身是有厚度规格和压缩量要求的弹性体， 因此在安装时， 需要 通过在共用散热器与单板的安装螺丝的旋入下压缩导热垫， 致使共用散热器的受压应力较 大， 压应力通过导热垫作用在主芯片及外围器件上， 致使主芯片及外围器件的可靠性降低。
另一方面， 由于导热垫自身散热差， 加之主芯片具有功耗大的特点， 导致主芯片结温 升高， 使得共用散热器散热效果差。 发明内容
为了克服现有技术中由于采用共用散热器， 而存在的主芯片及外围器件受力较大， 导 致主芯片及外围器件的可靠性差的问题， 以及存在的散热效果差的问题， 本发明实施例提 供了一种散热器。 所述技术方案如下- 一种散热器， 包括子散热器、 连接装置及共用支架， 所述子散热器通过所述的连接装 置连接在所述共用支架上； 其中， 所述子散热器包括第一导热面， 所述子散热器通过所述 第一导热面与第一热源接触以对所述第一热源散热， 所述的共用支架包括第二导热面， 所 述共用支架通过第二导热面与第二热源接触以对所述第二热源散热， 所述第二导热面与所 述子散热器分别设置在所述共用支架的不同位置处。
本发明实施例提供的技术方案的有益效果是： 相比现有技术， 本发明实施例所述散热 器通过共用支架的第二导热面实现了第二热源的散热问题， 通过子散热器的第一导热面实 现了第一热源的散热问题， 通过连接装置实现了第一热源与第二热源之间的共面安装， 仅 需一个很小的力即可实现第一热源与子散热器之间的良好接触， 一方面降低了第一热源的 受力， 增加了第一热源的可靠性， 另一方面， 消除了现有技术中导热垫对第一热源及第二 热源的散热影响， 提高了整体的散热效果。 附图说明
图 1是本发明实施例所述单板的布置图；
图 2是本发明一实施例所述散热器与所述主芯片和所述外围器件的安装示意图； 图 3是本发明另一实施例所述散热器与所述主芯片和所述外围器件的安装示意图； 图 4是图 3中本发明另一实施例所述散热器去掉外围器件的零件分解图；
图 5是本发明一实施例所述连接装置的结构示意图；
图 5A是本发明另一实施例所述连接装置的结构示意图；
图 6是本发明实施例所述桥接热管一种结构图简图；
图 7是本发明实施例所述桥接热管另一种结构图简图。
附图中， 各标号所代表的组件列表如下-
1单板；
2主芯片， 21主芯片 A， 22主芯片 B;
3外围器件， 31外围器件八， 32外围器件 B;
4子散热器， 4A第一导热面， 41子散热器八， 42子散热器13，
5基板， 5A嵌入部， 5B连接部， 51子散热器 A的基板， 52子散热器 B的基板，
6散热片， 61子散热器 A的散热片， 62子散热器 B的散热片；
7共用支架， 7A第二导热面， 71穿孔；
8连接装置， 81支撑柱， 81A内螺纹， 82螺钉， 83弹簧， 81A光滑支撑柱， 811A限位 结构；
9柔性导热装置， 91桥接热管， 91A变形区；
10辅助导热元件， 10A热管的蒸发端， 10B热管的冷凝端。 具体实施方式 为使本发明的目的、 技术方案和优点更加清楚， 下面将结合附图对本发明实施方式作 进一步地详细描述。
本发明实施例以单板及其上的主芯片和外围器件为例加以说明。 如图 1 所示的单板， 单板 1上设有多个主芯片 2， 每个主芯片 2的周围都设有多个外围器件 3。 当然， 本领域技 术人员可知， 主芯片 2和外围器件可以是任何的发热器件， 本例中， 主芯片 2定义为第一 热源， 外围器件 3定义为第二热源。
如图 2所示， 本发明一实施例所述的一种散热器， 包括子散热器 4、 连接装置 8及共用 支架 7， 子散热器 4通过连接装置 8连接在共用支架上 7; 其中， 子散热器 4包括第一导热 面 4A， 子散热器 4通过第一导热面 4A与第一热源 （本例中指主芯片 2 ) 接触以对第一热源 (本例中指主芯片 2 ) 散热， 共用支架 7包括第二导热面 7A， 共用支架 7通过第二导热面 7A与第二热源 （本例中指外围器件 3 ) 接触以对第二热源散热 （本例中指外围器件 3)， 第 二导热面 7A与子散热器 4分别设置在共用支架 7的不同位置处。
本例中， 第一热源为主芯片 2， 第二热源为外围器件 3。
参见图 2， 相比现有技术， 本发明实施例所述散热器通过共用支架 7实现了外围器件 3 的散热问题， 通过子散热器 4实现了主芯片 2的散热问题， 通过连接装置实现了主芯片 2 与子散热器 4之间的共面安装， 保证了主芯片 2与子散热器 4之间的良好接触， 本发明实 施例所述结构使得外围器件 3与共用支架 7之间良好接触， 而不需要再应用厚度较大的导 热垫， 避免现有技术中由于应用高厚度的导热垫填充高度差， 导致的结温升高问题， 消除 了导热垫对大功耗主芯片引起的温升， 使得散热器整体散热效果好。
具体地， 所述连接装置可以采用常见的固定连接装置， 如螺钉连接， 螺栓螺母连接或 铆钉连接。
具体地， 如图 2所示， 本实施例中子散热器 4包括基板 5和散热片 6， 子散热器 4的第 一导热面 4A及散热片 6分别形成在基板 5相对的两侧。
具体地， 作为优选， 本实施例中， 如图 2所示， 散热器 4的基板 5包括连接部 5B和嵌 入部 5A， 连接部 5B连接在共用支架 7上， 散热器 4的散热片 6形成在连接部 5B的上表面， 嵌入部 5A相对散热片 6形成在连接部 5B的下表面， 第一导热面 4A形成在嵌入部 5A的下 表面； 共用支架 7对应基板 5的嵌入部 5A形成有穿孔 71， 基板 5的嵌入部 5A置于共用支 架 7的穿孔 71内。
为了更好地解决第一热源与第二热源之间的高度差问题， 实现第一热源与第二热源之 间的共面安装， 具体地， 如图 2 所示， 连接装置可相对共用支架浮动以调节所述第一热源 即主芯片 2与所述第二热源即外围器件 3之间的安装距离， 使得所述第一热源即主芯片 2 与所述第二热源即外围器件 3之间实现共面安装。 其中， 共面安装是指主芯片 2与外围器 件 3的底面齐平。
本实施例， 通过各自的连接装置 8使得子散热器 4与共用支架 7的相对浮动， 调节主 芯片 2与外围器件 3之间的安装距离， 经验证单板中采用本发明的连接装置 8之后， 相比 现有技术能够有效降低主芯片 2长期承受的压力的 2/3， 故大幅提高了主芯片 2的可靠性。
具体地， 如图 3所示本发明另一实施例所述散热器， 还可参见图 4， 本实施例以图 3为 主加以说明， 本实施例以两个第一热源即两个主芯片为例加以说明， 具体地， 所述两个主 芯片包括主芯片 A 21和主芯片 B 22。外围器件 3包括与主芯片 A 21相对应的外围器件 A 31 , 以及与主芯片 B 22相对应的外围器件 B 32。 所述散热器包括共用支架 7、 子散热器 A 41、 子散热器 B 42以及两个连接装置 8。 其中， 子散热器 A 41包括子散热器 A的基板 51和子 散热器 A的散热片 61，子散热器 B 42包括子散热器 B的基板 52和子散热器 B的散热片 62。 共用支架 7上设有两个穿孔 71， 一个穿孔 71内嵌入部分主芯片 A 21和子散热器 A的基板 51的嵌入部， 另一个穿孔 71内嵌入部分主芯片 B 22和散热器 B的基板 52的嵌入部。 外围 器件 A 31和外围器件 B 32连接在共用支架 7的下方， 并通过共用支架 7散热。 两个连接 装置 8， 其中之一设置在共用支架 7与子散热器 A的基板 51之间， 另一个连接装置 8设置 在共用支架 7与子散热器 B的基板 52之间。
本实施例中， 两个子散热器 A 41、 子散热器 B 42共用一个共用支架 7， 有效减少了散 热器的螺钉安装孔， 提高了安装效率。
具体地， 作为优选， 参见图 5， 本实施例以两个主芯片为例加以说明， 两个连接装置 8 为相同的结构， 本例中， 以设置在子散热器 B 42 (参见图 3 ) 的连接装置 8为例加以说明， 参见图 5， 连接装置 8包括至少两对并且一一配套的支撑柱 81、 螺钉 82及弹簧 83， 至少两 个支撑柱 81分布在共用支架 7上， 至少两个螺钉 82分别贯穿所述子散热器 B 42 (参见图 3 ) 的基板 52的连接部， 并与共用支架 7固定， 至少两个螺钉 82的位置与至少两个支撑柱 81的设置位置相对应， 至少两个弹簧 83对应套接在至少两个支撑柱 81的外部， 其中， 支 撑柱 81设有内螺纹 81A， 螺钉 82设有外螺纹， 支撑柱 81的内螺纹 81A与螺钉 82的外螺纹 相配合。
参见图 5， 本发明实施例连接装置 8， 本例中子散热器 A 41的连接装置 8与子散热器 B 42的连接装置 8结构相同， 连接装置 8均包括四个支撑柱 81、 四个螺钉 82和四个弹簧 83。 当然， 本领域技术人员可知， 根据子散热器的基板的面积大小合理设置支撑柱 81、 螺钉 82 及弹簧 83的数量， 例如两个、 三个、 五个、 六个等等。
当然本领域技术人员可知， 所述连接装置不局限于带有内螺纹的支撑柱与带有外螺纹 的螺钉配合的结构形式， 支撑柱和螺钉还可以设计成为一体结构， 即具有顶端限位结构的 光滑支撑柱 （参见图 5A)。
具体地， 如图 5A所示的连接装置， 本例中， 连接装置包括至少两对并且一一配套的光 滑支撑柱 81A及弹簧 83， 至少两个光滑支撑柱 81A的底端分别穿过所述各自的基板的连接 部， 并与所述共用支架 （图中未画出） 固定， 至少两个弹簧 83对应套接在至少两个光滑支 撑柱 81A的外部， 其中， 至少两个光滑支撑柱 81A的顶端均设有限位结构 811A。
进一步地， 如图 4所示， 本实施例中， 所述散热器还包括辅助导热元件 10， 本例以设 置在子散热器 A 41 (参见图 3 ) 的连接装置 8为例加以说明， 辅助导热元件 10与子散热器 A 41 (参见图 3 ) 及共用支架 7可导热地连接， 用以实现子散热器 A 41 (参见图 3 ) 与共用 之架 7之间的热传递。
具体地， 如图 4所示， 本例中， 共用支架 7与子散热器 A 41 (参见图 3 ) 通过它的辅 助导热元件 10连通， 共用支架 7与子散热器 B 42 (参见图 3 ) 通过它的辅助导热元件 10 连通， 辅助导热元件 10均为热管。
当然， 本领域技术人员可知， 所述辅助导热元件不局限于热管， 还可以是 VC等具有高 导热能的材料。
具体地， 参见图 4， 以散热器 A的辅助导热元件 10为例加以说明， 该辅助导热元件 10 即热管的蒸发端 10A伸入子散热器 A中， 热管的冷凝端 10B延与共用支架 7连接， 通过热 管的均温性能实现了子散热器 A 41、 子散热器 B 42与共用支架 7之间的热传递。
参见图 3， 本实施例所述的散热器在设有连接装置 8的基础上， 实现了主芯片 A 21与 外围器件 A 31之间的热量导通， 以及主芯片 B 22与外围器件 B 32之间的热量导通， 解决 了现有技术中由于外围器件的散热面积无法满足其自身散热需求， 而单板尺寸有限无法扩 大外围器件的散热面积， 导致外围器件积蓄热量较多， 而主芯片的子散热器得不到充分利 用， 存在散热浪费显现的问题， 通过上述辅助导热元件 10 (参见图 4) 解决了它们两者之 间的散热矛盾， 达到了散热优化。
进一步地， 如图 4所示， 辅助导热元件 10即热管的冷凝端 10B设有弯折段， 所述弯折 段用于扩大所述热管的柔性长度。， 从而更好的保证了散热器 A的基板、 散热器 B的基板与 共用支架 7之间的相对浮动， 以便吸收更大的高度差。 本例中， 弯折段为 L形， 当然本领 域技术人员可知， 弯折段不局限于 L形， 还可以是 U形等弯折形式， 只要该弯折形式能够 扩大辅助导热元件 10的柔性长度即可。 本实施例中， 作为优选， 两个辅助导热元件 10均 呈八字形。
进一步地， 参见图 3， 所述散热器包括至少两个所述子散热器以及与它们一一对应的至 少两个所述连接装置 8， 至少两个所述子散热器 4 (参见图 2 ) 通过至少两个所述连接装置 8共同设置在共用支架 7上， 所述散热器还包括至少一个柔性导热装置 9， 所述至少一个柔 性导热装置 9分别与至少两个所述子散热器 4 (参见图 2 )中的任意两个所述子散热器 4 (参 见图 2 ) 相连接， 以使任意两个所述子散热器 4 (参见图 2 ) 实现热交换。
如图 3所示， 本实施例中， 散热器包括子散热器 A 41、 子散热器 B 42以及与之一一对 应的连接装置 8， 子散热器 A 41、 子散热器 B 42之间设置柔性导热装置 9， 在单个主芯片 A 21或主芯片 B 22浮动均温的基础上， 通过柔性导热装置 9使得两子散热器 A 41和子散 热器 B的热量能够相互传导， 保证子散热器 A 41和子散热器 B 42的温度趋于一致， 实现 了温度场的平衡， 有效利用了两个主芯片之间的散热面积。 解决了现有技术中， 两个独立 设置散热器的主芯片， 在两者之间功耗差异较大或散热条件差异较大的场景， 散热条件恶 劣的器件需要更大面积的散热器才能保证散热， 而散热条件好的器件则存在很大裕量， 无 法通过热平衡来减小散热面积的问题。
具体地， 参见图 4， 柔性导热装置 9为桥接热管 91。
当然， 本领域技术人员可知， 所述辅助导热元件不局限于桥式热管， 还可以是任何高 导热性能的材料。
具体地， 参见图 4， 桥接热管 91的端部分别固定在任意两个所述子散热器上， 本实施 例中， 桥接热管 91的端部分别固定在子散热器 A 41和子散热器 B 42上。
更具体地， 参见图 4， 本例以主芯片 A 21和主芯片 B 22为例加以说明， 桥接热管 91 的一端部固定在子散热器 A的基板 51及子散热器 A的散热片 61之间， 桥接热管 91的另一 端部固定在子散热器 B的基板 52及子散热器 B的散热片 62之间， 使得结构设计更为合理。
进一步地， 参见图 4， 桥接热管 91的局部或整体设有变形区 91A， 变形区 91A用于扩 大桥接热管 91的柔性长度。
更具体地， 参见图 4， 本实施例中， 桥接热管 91 的中间部分设有变形区 91A， 变形区 91A为拱形， 中间位置的桥接热管 91的拱形设计， 在短距离内实现了桥接热管 91的柔性设 计方案。
具体地， 如图 4所示， 变形区 91A为折线拱。
具体地， 如图 6所示， 变形区 91A为弧形拱。
具体地， 如图 7所示， 变形区 91A为矩形拱。
进一步地， 参见图 4， 所述桥接热管 91的数量为两个， 设计了一个冗余桥接热管 91， 保证桥接热管 91的可靠性， 同时两个桥接热管 91均匀的布置在散热器 A 41及散热器 B 42 的中心位置， 避免在安装操作工程中对桥接热管 91造成的损伤。 由此可见， 本发明实施例相比现有技术实现了主芯片和器件、 功耗差异较大的两个主 器件的散热平衡， 利用较小功耗的主器件的散热裕量来解决了高功耗主器件的散热难题， 有效减少了散热器面积。
以上所述仅为本发明的较佳实施例， 并不用以限制本发明， 凡在本发明的精神和原则 之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1、 一种散热器， 其特征在于， 包括子散热器、 连接装置及共用支架， 所述子散热器通过 所述的连接装置连接在所述共用支架上； 其中， 所述子散热器包括第一导热面， 所述子散热 器通过所述第一导热面与第一热源接触以对所述第一热源散热， 所述的共用支架包括第二导 热面， 所述共用支架通过第二导热面与第二热源接触以对所述第二热源散热， 所述第二导热 面与所述子散热器分别设置在所述共用支架的不同位置处。
2、 如权利要求 1所述的散热器， 其特征在于， 所述子散热器包括基板和散热片， 所述子 散热器的第一导热面及所述散热片分别形成在所述基板相对的两侧。
3、如权利要求 2所述的散热器，其特征在于，所述子散热器的基板包括连接部和嵌入部， 所述连接部连接在所述共用支架上， 所述散热器的散热片形成在所述连接部的上表面， 所述 嵌入部相对所述散热片形成在所述连接部的下表面， 所述第一导热面形成在所述嵌入部的下 表面； 所述共用支架对应所述基板的嵌入部形成有穿孔， 所述基板的嵌入部置于所述共用支 架的穿孔内。
4、 如权利要求 3所述的散热器， 其特征在于： 所述连接装置可相对所述共用支架浮动以 调节所述第一热源与所述第二热源之间的安装距离， 使得所述第一热源与所述第二热源之间 实现共面安装。
5、 如权利要求 4所述的散热器， 其特征在于， 所述连接装置包括至少两对并且一一配套 的支撑柱、 螺钉及弹簧， 所述至少两个支撑柱分布在所述共用支架上， 所述至少两螺钉分别 贯穿所述子散热器的基板并与所述共用支架固定， 所述至少两个螺钉的位置与所述至少两个 支撑柱的设置位置相对应， 所述至少两个弹簧对应套接在所述至少两个支撑柱的外部， 其中， 所述支撑柱设有内螺纹， 所述螺钉设有外螺纹， 所述支撑柱的内螺纹与所述螺钉的外螺纹相 配合。
6、 如权利要求 1-5任一项权利要求所述的散热器， 其特征在于， 所述散热器还包括辅助 导热元件， 所述辅助导热元件与所述子散热器及所述共用支架可导热地连接， 用以实现所述 子散热器与所述共用之架之间的热传递。
7、 如权利要求 6所述的散热器， 其特征在于， 所述辅助导热元件为热管， 所述热管蒸发 端伸入所述子散热器中， 所述热管的冷凝端与所述共用支架连接。
8、 如权利要求 7所述的散热器， 其特征在于， 所述热管的冷凝端设有弯折段， 所述弯折 段用于扩大所述热管的柔性长度。
9、 如权利要求 1-8任一项权利要求所述的散热器， 其特征在于， 所述散热器包括至少两 个所述子散热器以及与它们一一对应的至少两个所述连接装置， 至少两个所述子散热器通过 至少两个所述连接装置共同设置在所述共用支架上， 所述散热器还包括至少一个柔性导热装 置， 所述至少一个柔性导热装置分别与至少两个所述子散热器中的任意两个所述子散热器相 连接， 以使任意两个所述子散热器实现热交换。
10、 如权利要求 9所述的散热器， 其特征在于， 所述柔性导热装置为桥接热管。
11、 如权利要求 10所述的散热器， 其特征在于， 所述桥接热管的端部分别固定在任意两 个所述子散热器上。
12、如权利要求 11所述的散热器，其特征在于，所述桥接热管的局部或整体设有变形区， 所述变形区用于扩大所述桥接热管的柔性长度。
13、 如权利要求 12所述的散热器， 其特征在于， 所述变形区为拱形。
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