WO2012147605A1 - 非酸化物単結晶基板の研磨方法 - Google Patents
非酸化物単結晶基板の研磨方法 Download PDFInfo
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- WO2012147605A1 WO2012147605A1 PCT/JP2012/060577 JP2012060577W WO2012147605A1 WO 2012147605 A1 WO2012147605 A1 WO 2012147605A1 JP 2012060577 W JP2012060577 W JP 2012060577W WO 2012147605 A1 WO2012147605 A1 WO 2012147605A1
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- polishing
- single crystal
- crystal substrate
- polished
- oxide single
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- 238000005498 polishing Methods 0.000 title claims abstract description 241
- 239000000758 substrate Substances 0.000 title claims abstract description 99
- 239000013078 crystal Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 87
- 239000006061 abrasive grain Substances 0.000 claims abstract description 42
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000007800 oxidant agent Substances 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 8
- 150000003624 transition metals Chemical class 0.000 claims abstract description 8
- 230000033001 locomotion Effects 0.000 claims abstract description 7
- 150000002500 ions Chemical class 0.000 claims description 20
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 10
- 230000033116 oxidation-reduction process Effects 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 34
- 230000001590 oxidative effect Effects 0.000 abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 229910002601 GaN Inorganic materials 0.000 description 8
- 239000012286 potassium permanganate Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- -1 permanganate Chemical compound 0.000 description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 239000008119 colloidal silica Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 239000011163 secondary particle Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- UNTBPXHCXVWYOI-UHFFFAOYSA-O azanium;oxido(dioxo)vanadium Chemical compound [NH4+].[O-][V](=O)=O UNTBPXHCXVWYOI-UHFFFAOYSA-O 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001282 polysaccharide Polymers 0.000 description 2
- 239000005017 polysaccharide Substances 0.000 description 2
- 150000004804 polysaccharides Chemical class 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 244000215068 Acacia senegal Species 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000001879 Curdlan Substances 0.000 description 1
- 229920002558 Curdlan Polymers 0.000 description 1
- 229920002148 Gellan gum Polymers 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 229920000161 Locust bean gum Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000003421 Plantago ovata Nutrition 0.000 description 1
- 244000134552 Plantago ovata Species 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920000805 Polyaspartic acid Polymers 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 108010020346 Polyglutamic Acid Proteins 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000009223 Psyllium Substances 0.000 description 1
- 239000004373 Pullulan Substances 0.000 description 1
- 229920001218 Pullulan Polymers 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000004298 Tamarindus indica Nutrition 0.000 description 1
- 240000004584 Tamarindus indica Species 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 239000000783 alginic acid Substances 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- 229960001126 alginic acid Drugs 0.000 description 1
- 150000004781 alginic acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229940105329 carboxymethylcellulose Drugs 0.000 description 1
- 235000010418 carrageenan Nutrition 0.000 description 1
- 239000000679 carrageenan Substances 0.000 description 1
- 229920001525 carrageenan Polymers 0.000 description 1
- 229940113118 carrageenan Drugs 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 235000019316 curdlan Nutrition 0.000 description 1
- 229940078035 curdlan Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000010492 gellan gum Nutrition 0.000 description 1
- 239000000216 gellan gum Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 150000001261 hydroxy acids Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 235000010420 locust bean gum Nutrition 0.000 description 1
- 239000000711 locust bean gum Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000001139 pH measurement Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229960000292 pectin Drugs 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 1
- IYDGMDWEHDFVQI-UHFFFAOYSA-N phosphoric acid;trioxotungsten Chemical compound O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.OP(O)(O)=O IYDGMDWEHDFVQI-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 108010064470 polyaspartate Proteins 0.000 description 1
- 229920002643 polyglutamic acid Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 229940070687 psyllium Drugs 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- CGFYHILWFSGVJS-UHFFFAOYSA-N silicic acid;trioxotungsten Chemical compound O[Si](O)(O)O.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 CGFYHILWFSGVJS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Definitions
- the present invention relates to a polishing method for polishing a non-oxide single crystal substrate. More specifically, the present invention relates to a polishing method suitable for finish polishing of a silicon carbide single crystal substrate or the like.
- Silicon carbide (SiC) semiconductors have a higher breakdown electric field, electron saturation drift velocity, and thermal conductivity than silicon semiconductors, so silicon carbide semiconductors can be operated at higher temperatures and higher speeds than conventional silicon devices.
- Research and development to realize power devices has been conducted.
- the development of a highly efficient switching element used as a power source for driving a motor of an electric motorcycle, an electric vehicle, a hybrid car or the like has attracted attention.
- a silicon carbide single crystal substrate having a smooth surface for epitaxial growth of a high-quality silicon carbide semiconductor layer is required.
- Such a light-emitting element is manufactured using a gallium nitride (GaN) semiconductor, and a silicon carbide single crystal substrate is used as a substrate for forming a high-quality gallium nitride semiconductor layer.
- GaN gallium nitride
- a silicon carbide single crystal substrate for such applications requires high processing accuracy in terms of substrate flatness, substrate surface smoothness, and the like.
- the silicon carbide single crystal has extremely high hardness and excellent corrosion resistance, the workability in producing a substrate is poor, and it is difficult to obtain a silicon carbide single crystal substrate having high smoothness.
- a smooth surface of a semiconductor single crystal substrate is formed by polishing.
- the surface is mechanically polished using abrasive grains such as diamond harder than silicon carbide as an abrasive to form a flat surface, but a silicon carbide single crystal substrate polished with diamond abrasive grains A minute scratch corresponding to the grain size of the diamond abrasive grains is introduced on the surface of the.
- a work-affected layer having mechanical strain is generated on the surface, the smoothness of the surface of the silicon carbide single crystal substrate is not sufficient as it is.
- CMP chemical mechanical polishing
- a polishing composition having a pH of 4 to 9 containing colloidal silica is known as an abrasive for polishing the surface of a silicon carbide single crystal substrate smoothly by CMP (see, for example, Patent Document 1).
- a polishing composition containing silica abrasive grains, an oxidizing agent (oxygen donor) such as hydrogen peroxide, and a vanadate has been proposed (see, for example, Patent Document 2).
- a polishing composition comprising abrasive grains such as alumina, titania, ceria, zirconia, an oxidizing agent such as hydrogen peroxide, permanganate, periodate, and a dispersion medium has been proposed ( For example, see Patent Document 3).
- Patent Document 4 a method has been proposed in which the surface of a silicon carbide single crystal substrate or the like is smoothly polished using a polishing pad containing abrasive grains in the presence of an oxidizing polishing liquid (see Patent Document 4).
- the method described in Patent Document 4 has a problem that the polishing rate is not sufficient, and damage such as scratches and distortions is caused on the surface due to the strong mechanical action of the fixed abrasive grains.
- a non-oxide single crystal substrate having a high hardness and high chemical stability such as a silicon carbide single crystal substrate, is polished at a high polishing rate and smoothed.
- An object of the present invention is to provide a polishing method for obtaining a smooth surface.
- a polishing liquid is supplied to a polishing pad that does not contain abrasive grains, the surface to be polished of the non-oxide single crystal substrate and the polishing pad are brought into contact with each other, A method of polishing by relative motion, wherein the polishing liquid contains an oxidizing agent containing a transition metal having an oxidation-reduction potential of 0.5 V or more and water, and does not contain abrasive grains.
- the oxidizing agent is preferably permanganate ions. And it is preferable that content of the said permanganate ion in the said polishing liquid is 0.05 mass% or more and 5 mass% or less. Furthermore, the pH of the polishing liquid is preferably 11 or less, and more preferably 5 or less. Furthermore, the non-oxide single crystal substrate can be a silicon carbide single crystal substrate or a gallium nitride single crystal substrate.
- the polished surface of a non-oxide single crystal substrate having high hardness and high chemical stability such as a silicon carbide single crystal substrate or a gallium nitride single crystal substrate is polished at a high polishing rate. And a flat and smooth surface to be polished can be obtained.
- polishing is performed using a polishing liquid that does not contain abrasive grains, there is no risk of unstable supply of the polishing liquid due to agglomeration of abrasive grains, or scratches or the like on the surface to be polished. It can be performed.
- the “surface to be polished” is a surface to be polished of an object to be polished, such as a surface.
- the polishing liquid is supplied to a polishing pad that does not contain abrasive grains, and the surface to be polished of the non-oxide single crystal substrate, which is the object to be polished, contacts the polishing pad. And polishing by relative movement between the two.
- a polishing liquid containing an oxidizing agent having a transition metal-containing oxidation-reduction potential of 0.5 V or more and water and not containing abrasive grains is used as the polishing liquid.
- the polishing liquid used in the polishing method of the present invention does not contain abrasive grains, but contains an oxidizing agent having a high oxidizing power including a transition metal having an oxidation-reduction potential of 0.5 V or more. For this reason, even with the polishing method of the present invention in which a polishing liquid is supplied to a polishing pad that does not contain abrasive grains and polishing is performed, a non-oxide single crystal substrate having high hardness and high chemical stability, such as a SiC single crystal substrate.
- the surface to be polished can be polished at a sufficiently high polishing rate, and a flat, smooth and excellent surface property can be obtained.
- the pH of the polishing liquid is preferably 11 or less.
- a pH adjuster can be added to the polishing liquid.
- the pH of the polishing liquid is 11 or less, the oxidizing agent acts effectively, so the polishing rate is high and the polishing characteristics are good.
- the oxidizing agent containing a transition metal and having an oxidation-reduction potential of 0.5 V or more, contained in the polishing liquid used in the present invention, is applied to an object to be polished (for example, a SiC single crystal substrate or a GaN single crystal substrate) described later.
- An oxide layer is formed on the polished surface.
- compound semiconductors such as SiC and GaN are non-oxides and are difficult to polish, but an oxidation layer is formed on the surface by an oxidizing agent containing a transition metal having a redox potential of 0.5 V or more in the polishing liquid.
- Examples of the oxidizing agent containing a transition metal having a redox potential of 0.5 V or more contained in the polishing liquid include permanganate ions, vanadate ions, dichromate ions, cerium ammonium nitrate, iron nitrate (III )
- permanganate ions include silver nitrate, phosphotungstic acid, silicotungstic acid, phosphomolybdic acid, phosphotungstomolybdic acid, phosphovanadomolybdic acid and the like.
- permanganate ions are particularly preferred.
- permanganate ions such as potassium permanganate and sodium permanganate is preferable.
- permanganate ions are particularly preferable as an oxidizing agent in polishing a SiC single crystal substrate.
- Permanganate ions have strong oxidizing power for oxidizing SiC single crystals. If the oxidizing power of the oxidizing agent is too weak, the reaction with the polished surface of the SiC single crystal substrate becomes insufficient, and as a result, a sufficiently smooth surface cannot be obtained.
- An oxidation-reduction potential is used as an index of the oxidizing power with which an oxidizing agent oxidizes a substance.
- the redox potential of permanganate ions is 1.70 V, and potassium perchlorate (KClO 4 ) (redox potential 1.20 V) or sodium hypochlorite (NaClO) (redox potential) generally used as an oxidizing agent. Compared with 1.63 V), the redox potential is high.
- K Permanganate ions have a high reaction rate. Since permanganate ions have a higher oxidation reaction rate than hydrogen peroxide (oxidation-reduction potential: 1.76 V), which is known as an oxidizing agent with a strong oxidizing power, the oxidizing power is exerted quickly. it can.
- Permanganate ions are safe and low in toxicity to the human body. (4) The permanganate is completely dissolved in water which is a dispersion medium described later. Therefore, the dissolution residue does not adversely affect the smoothness of the substrate.
- the content (concentration) of permanganate ions in the polishing liquid is preferably 0.05% by mass or more and 5% by mass or less. If it is less than 0.05% by mass, the effect as an oxidizing agent cannot be expected, and it may take a very long time to form a smooth surface by polishing.
- the content of permanganate ions exceeds 5% by mass, depending on the temperature of the polishing liquid, the permanganate may not be completely dissolved and precipitates, and the solid permanganate contacts the surface to be polished. May cause scratches.
- the content of permanganate ions contained in the polishing liquid is more preferably 0.1% by mass or more and 4% by mass or less, particularly preferably 0.2% by mass or more and 3.5% by mass or less, and 1.0% by mass or more. 3.5 mass% or less is very preferable.
- the polishing liquid used in the present invention includes silicon oxide (silica) particles, cerium oxide (ceria) particles, aluminum oxide (alumina) particles, zirconium oxide (zirconia) particles, and titanium oxide (titania) particles used as polishing abrasive grains. Etc. are substantially not contained. Since the polishing liquid does not contain abrasive grains, the polishing liquid can be used without paying attention to the dispersibility of the abrasive grains, and since the aggregation of the abrasive grains does not occur substantially, damage to the surface of the workpiece is suppressed. There is an advantage.
- the pH of the polishing liquid used in the present invention is preferably 11 or less, more preferably 5 or less, and particularly preferably 3 or less from the viewpoint of polishing characteristics.
- the pH is more than 11, not only a sufficient polishing rate cannot be obtained, but also the smoothness of the surface to be polished may be deteriorated.
- the pH of the polishing liquid can be adjusted by adding or blending an acid or basic compound that is a pH adjusting agent.
- acids include inorganic acids such as nitric acid, sulfuric acid, phosphoric acid and hydrochloric acid, saturated carboxylic acids such as formic acid, acetic acid, propionic acid and butyric acid, hydroxy acids such as lactic acid, malic acid and citric acid, phthalic acid and salicylic acid.
- Organic acids such as aromatic carboxylic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric acid, maleic acid and other dicarboxylic acids, amino acids, and heterocyclic carboxylic acids can be used.
- nitric acid or phosphoric acid is preferable, and use of nitric acid is particularly preferable.
- the basic compound quaternary ammonium compounds such as ammonia, lithium hydroxide, potassium hydroxide, sodium hydroxide and tetramethylammonium, and organic amines such as monoethanolamine, ethylethanolamine, diethanolamine and propylenediamine can be used.
- Use of potassium hydroxide and sodium hydroxide is preferable, and potassium hydroxide is particularly preferable.
- the content ratio (concentration) of these acids or basic compounds is an amount that adjusts the pH of the polishing liquid to a predetermined range (pH 11 or less, more preferably 5 or less, more preferably 3 or less).
- the polishing liquid used in the present invention contains water as a dispersion medium.
- Water is a medium for dispersing / dissolving the oxidant and optional components added as necessary.
- blending component mixing of an impurity, pH, etc., a pure water, an ultrapure water, and ion-exchange water (deionized water) are preferable.
- the polishing liquid used in the present invention is prepared and used so as to be in a mixed state in which the above-described components are contained in the predetermined ratio and uniformly dissolved.
- a stirring and mixing method using a stirring blade usually used in the production of a polishing liquid can be employed.
- the polishing liquid does not necessarily have to be supplied to the polishing site as a mixture of all the polishing components that are configured in advance. When supplying to a polishing place, polishing components may be mixed to form a polishing liquid composition.
- a lubricant In the polishing liquid, a lubricant, a chelating agent, a reducing agent, a viscosity imparting agent or a viscosity modifier, a rust preventive agent, and the like can be appropriately contained as necessary unless contrary to the gist of the present invention.
- these additives have the function of an oxidizing agent, an acid, or a basic compound, they are handled as an oxidizing agent, an acid, or a basic compound.
- anionic, cationic, nonionic, amphoteric surfactants, polysaccharides, water-soluble polymers and the like can be used.
- the surfactant there are an aliphatic hydrocarbon group and an aromatic hydrocarbon group as a hydrophobic group, and a linking group such as an ester, ether, amide, etc., an acyl group, an alkoxyl group, etc. is included in the hydrophobic group.
- a linking group such as an ester, ether, amide, etc., an acyl group, an alkoxyl group, etc.
- One having one or more introduced groups and one having a carboxylic acid, a sulfonic acid, a sulfate ester, a phosphoric acid, a phosphate ester or an amino acid can be used as the hydrophilic group.
- alginic acid pectin, carboxymethylcellulose, curdlan, pullulan, xanthan gum, carrageenan, gellan gum, locust bean gum, gum arabic, tamarind, psyllium and the like can be used.
- polyacrylic acid polyvinyl alcohol, polyvinyl pyrrolidone, polymethacrylic acid, polyacrylamide, polyaspartic acid, polyglutamic acid, polyethyleneimine, polyallylamine, polystyrene sulfonic acid and the like can be used.
- a polishing object to be polished using such a polishing liquid is a non-oxide single crystal substrate.
- non-oxide single crystal substrates include compound semiconductor substrates such as SiC single crystal substrates and GaN single crystal substrates.
- the polishing liquid by polishing the polished surface of a single crystal substrate having a modified Mohs hardness of 10 or more, such as the SiC single crystal substrate or the GaN single crystal substrate, using the polishing liquid, the effect of improving the polishing rate can be obtained. You can get even more.
- the polishing method of the present invention uses a known polishing pad that does not contain abrasive grains, and supplies the polishing liquid to the polishing pad while polishing the surface to be polished of the non-oxide single crystal substrate that is the object to be polished. This is a method in which a pad is brought into contact and polishing is performed by relative movement between the two.
- FIG. 1 shows an example of a polishing apparatus that can be used in an embodiment of the present invention, but the polishing apparatus used in the present invention is not limited to such a structure.
- a polishing surface plate 1 is provided in a state of being rotatably supported around a vertical axis C 1, and this polishing surface plate 1 is supported by a surface plate driving motor 2. , And is driven to rotate in the direction indicated by the arrow in the figure.
- a known polishing pad 3 that does not contain abrasive grains is attached to the upper surface of the polishing surface plate 1.
- a substrate holding member (carrier) 5 for holding a polishing object 4 such as a SiC single crystal substrate on the lower surface by suction or using a holding frame is provided at a position eccentric from the axis C1 on the polishing surface plate 1. It is supported so as to be rotatable about the axis C2 and movable in the direction of the axis C2.
- the substrate holding member 5 is configured to be rotated in a direction indicated by an arrow by a carrier drive motor (not shown) or by a rotational moment received from the polishing surface plate 1.
- a non-oxide single crystal substrate that is an object to be polished 4 is held. The polishing object 4 is pressed against the polishing pad 3 with a predetermined load.
- a dripping nozzle 6 or a spray nozzle (not shown) is provided in the vicinity of the substrate holding member 5, and the above-described polishing liquid 7 sent from a tank (not shown) is supplied onto the polishing surface plate 1. It has become so.
- the polishing liquid 7 is supplied from the dropping nozzle 6 or the like to the surface of the polishing pad 3, and the polishing object 4 held by the substrate holding member 5 is pressed against the polishing pad 3.
- the surface to be polished of the polishing object 4 that is, the surface facing the polishing pad 3 is chemically and mechanically polished.
- the substrate holding member 5 may perform a linear motion as well as a rotational motion. Further, the polishing surface plate 1 and the polishing pad 3 do not have to rotate, and may move in one direction, for example, by a belt type.
- the polishing pad 3 a known pad made of a non-woven fabric, a porous resin such as foamed polyurethane, or the like and containing no abrasive grains can be used. Further, in order to promote the supply of the polishing liquid 7 to the polishing pad 3 or to collect a certain amount of the polishing liquid 7 on the polishing pad 3, the surface of the polishing pad 3 has a lattice shape, a concentric circle shape, a spiral shape, or the like. Groove processing may be performed. Further, if necessary, polishing may be performed while bringing the pad conditioner into contact with the surface of the polishing pad 3 and conditioning the surface of the polishing pad 3.
- the polishing conditions by the polishing apparatus 10 are not particularly limited, but by applying a load to the substrate holding member 5 and pressing it against the polishing pad 3, it is possible to increase the polishing pressure and improve the polishing rate.
- the polishing pressure is preferably about 5 to 80 kPa, and more preferably about 10 to 50 kPa from the viewpoint of uniformity of polishing rate in the surface to be polished, flatness, and prevention of polishing defects such as scratches.
- the number of rotations of the polishing surface plate 1 and the substrate holding member 5 is preferably about 50 to 500 rpm, but is not limited thereto.
- the supply amount of the polishing liquid 7 is appropriately adjusted and selected according to the composition of the polishing liquid, the polishing conditions described above, and the like.
- Example 1 to 15, Example 20, Example 21, Example 23, Example 25, Examples 28 to 29, and Example 31 are examples.
- Examples 16 to 19, Example 22, Example 24, Examples 26 to 27, Example 30 and Example 32 is a comparative example.
- polishing liquid and abrasive liquid (1-1) In Examples 1 to 15, Example 20, Example 21, Example 23, Example 25, Examples 28 to 29 and Example 31, polishing liquids were prepared as follows. First, pure water was added to potassium permanganate, which is an oxidizing agent shown in Tables 1 and 2, and stirred for 10 minutes using a stirring blade. Next, a pH adjuster (phosphoric acid, nitric acid, potassium hydroxide or sodium hydroxide) shown in Table 1 and Table 2 was gradually added to this liquid with stirring to obtain a predetermined pH shown in Table 1 and Table 2. To obtain a polishing liquid. Tables 1 and 2 show the content (concentration: mass%) of each component used in each example with respect to the entire polishing liquid. The oxidant concentration in Tables 1 and 2 is not the concentration of permanganate ions that are ions, but the concentration of potassium permanganate.
- Example 16 In Comparative Examples 16 to 19, Example 22, Example 24, Examples 26 to 27, Example 30 and Example 32, abrasive liquids containing abrasive grains were prepared as follows. In Example 16, pure water was added to a colloidal silica dispersion (silica solid content of about 40% by mass) having an average primary particle size of 40 nm and an average secondary particle size of about 70 nm, and stirred for 10 minutes using a stirring blade. did. Next, ammonium vanadate as a metal salt is added to this solution while stirring. Finally, hydrogen peroxide solution is added and stirred for 30 minutes, and an abrasive solution adjusted to the prescribed component concentrations shown in Table 1 is prepared. Obtained.
- Examples 17 to 19 pure water was added to a colloidal silica dispersion (silica solid content of about 40% by mass) having an average primary particle size of 80 nm and an average secondary particle size of about 110 nm, followed by stirring for 10 minutes. Next, potassium permanganate as an oxidant was added to this liquid while stirring, and phosphoric acid or nitric acid was gradually added as necessary to adjust to the predetermined pH shown in Table 1 to obtain an abrasive liquid. .
- Examples 22, 24, 26 to 27, 30 and 32 pure water was added to a cerium oxide dispersion having an average secondary particle size of 30 nm (ceria solid content of about 30% by mass) and stirred for 10 minutes. .
- potassium permanganate as an oxidant was added to this liquid while stirring, and nitric acid was gradually added to adjust to a predetermined pH shown in Table 2 to obtain an abrasive liquid.
- Tables 1 and 2 show the content (concentration: mass%) of each component used in each comparative example with respect to the entire abrasive liquid.
- the oxidant concentration in Tables 1 and 2 is not the concentration of permanganate ions that are ions, but the concentration of potassium permanganate.
- the average primary particle size of the silica particles blended in Examples 16 to 19 is obtained by conversion from the specific surface area obtained by the BET method.
- the average secondary particle size is determined by Microtrac UPA (Nikkiso Co., Ltd.). It was measured. Further, the average secondary particle diameter of the cerium oxide particles blended in Examples 22, 24, 26 to 27, 30 and 32 was measured by Microtrac UPA (Nikkiso Co., Ltd.).
- polishing machine a small polishing machine manufactured by MAT was used.
- polishing pad SUBA800-XY-groove (manufactured by Nitta Haas) was used, and the polishing pad was conditioned using a diamond disk and a brush before polishing.
- Polishing was performed for 30 minutes with a polishing liquid or abrasive liquid supply rate of 25 cm 3 / min, a polishing platen rotation speed of 68 rpm, a substrate holder rotation speed of 68 rpm, and a polishing pressure of 5 psi (34.5 kPa). .
- (3-2) Object to be polished A 3 inch diameter 4H—SiC substrate that had been pre-polished using diamond abrasive grains was used as the object to be polished, and the principal surface (0001) was 0 ° with respect to the C axis.
- An SiC single crystal substrate (hereinafter referred to as an On-axis substrate) within + 0.25 ° and an SiC single crystal substrate with an off angle with respect to the C axis of the main surface within 4 ° ⁇ 0.5 ° are used, respectively.
- the Si surface side was polished and evaluated.
- polishing liquids or abrasive liquids of Examples 1 to 2, Example 8, Example 11, and Examples 17 to 33 are for SiC single crystal substrates having an off angle of 4 ° or less (hereinafter referred to as 4 ° off substrates). Only the polishing characteristics (polishing rate) were evaluated. For the polishing liquids of Example 4, Example 10, and Example 15, only the polishing characteristics (polishing rate) for the On-axis substrate were evaluated.
- polishing rate was evaluated by the amount of change in thickness (nm / hr) of the substrate (wafer) per unit time. Specifically, the mass of an unpolished substrate with a known thickness and the substrate mass after polishing each time were measured, and the mass change was determined from the difference. And the change per time of the thickness of the board
- On-axis A high polishing rate is obtained with respect to at least one of the substrate and the 4-degree off-substrate.
- the polishing liquids of Examples 3, 5-7, 9 and 12-14 are used, the On-axis A high polishing rate can be obtained for both the substrate and the 4-degree off-substrate, and high-speed polishing is possible.
- Example 16 containing colloidal silica, hydrogen peroxide and ammonium vanadate was used, Examples 1 to 15, Example 20, Example 21, Example 23, Example 25, and Example 28 to The polishing rate is lower than when the polishing liquids of 29 and Example 31 are used.
- the abrasive liquids of Examples 16 to 19 containing potassium permanganate as the oxidizing agent and further containing colloidal silica as the abrasive grains are used, the aggregation of the abrasive grains is not confirmed in the abrasive sedimentation evaluation.
- the polishing rate is significantly lower than when the polishing liquids of Examples 1 to 15 and Example 20, Example 21, Example 23, Example 25, Examples 28 to 29 and Example 31 which do not contain colloidal silica as an abrasive grain are used. It has become.
- Example 22 when the abrasive liquids of Example 22, Example 24, Examples 26 to 27, Example 30 and Example 32 containing potassium permanganate as the oxidizing agent and cerium oxide as the abrasive grains were used, the abrasive grains were changed.
- the polishing rate is lower than when the polishing liquids of Examples 20, 21, 21, 23, 25, 28 to 29, and 31 having the same pH at the same oxidant concentration are used except that they are not contained. ing.
- a compound semiconductor substrate having high hardness and high chemical stability such as a non-oxide single crystal substrate, particularly a SiC single crystal substrate or a GaN single crystal substrate, can be polished at a high polishing rate.
- a polished surface having excellent flatness and smoothness can be obtained. Therefore, it can contribute to the improvement of productivity of those substrates.
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Abstract
Description
本発明の非酸化物単結晶基板の研磨方法は、砥粒を内包しない研磨パッドに研磨液を供給し、研磨対象物である非酸化物単結晶基板の被研磨面と前記研磨パッドとを接触させ、両者間の相対運動により研磨する方法である。そして、研磨液として、遷移金属を含む酸化還元電位が0.5V以上の酸化剤と、水とを含み、砥粒を含まない研磨液を使用することを特徴とする。
(酸化剤)
本発明に使用する研磨液に含有される、酸化還元電位が0.5V以上の、遷移金属を含む酸化剤は、後述する研磨対象物(例えば、SiC単結晶基板やGaN単結晶基板)の被研磨面に酸化層を形成するものである。この酸化層を機械的な力で被研磨面から除去することにより、研磨対象物の研磨が促進される。すなわち、SiCやGaN等の化合物半導体は非酸化物であり、難研磨材料であるが、研磨液中の、酸化還元電位が0.5V以上の、遷移金属を含む酸化剤により、表面に酸化層を形成できる。形成された酸化層は、研磨対象物に比べて硬度が低く研磨されやすいので、砥粒を内包しない研磨パッドとの接触によっても除去できる。したがって、十分に高い研磨速度を得ることができる。
(1)過マンガン酸イオンは、SiC単結晶を酸化する酸化力が強い。
酸化剤の酸化力が弱すぎると、SiC単結晶基板の被研磨面との反応が不十分となり、その結果十分に平滑な表面を得ることができない。酸化剤が物質を酸化する酸化力の指標として、酸化還元電位が用いられる。過マンガン酸イオンの酸化還元電位は1.70Vであり、酸化剤として一般に用いられる過塩素酸カリウム(KClO4)(酸化還元電位1.20V)や次亜塩素酸ナトリウム(NaClO)(酸化還元電位1.63V)に比べて、酸化還元電位が高い。
(2)過マンガン酸イオンは反応速度が大きい。
過マンガン酸イオンは、酸化力の強い酸化剤として知られている過酸化水素(酸化還元電位1.76V)に比べて、酸化反応の反応速度が大きいので、酸化力の強さを速やかに発揮できる。
(3)過マンガン酸イオンは、人体に対して毒性が低く安全である。
(4)過マンガン酸塩は、後述する分散媒である水に完全に溶解する。したがって、溶解残渣が基板の平滑性に悪影響を与えることがない。
本発明に使用する研磨液は、研磨砥粒として使用される酸化ケイ素(シリカ)粒子、酸化セリウム(セリア)粒子、酸化アルミニウム(アルミナ)粒子、酸化ジルコニウム(ジルコニア)粒子、酸化チタン(チタニア)粒子等を、実質的に含有していないことを特徴とする。研磨液が砥粒を含有しないので、砥粒の分散性に留意することなく研磨液を使用できる、実質的に砥粒の凝集が発生しないため、被研磨物表面へのダメージが抑制されるというという利点がある。
本発明に使用する研磨液のpHは、研磨特性の点から、11以下が好ましく、5以下がより好ましく、3以下が特に好ましい。pHが11超では、十分な研磨速度が得られないばかりでなく、被研磨面の平滑性が悪化するおそれがある。
本発明に使用する研磨液においては、分散媒として水が含有される。水は、前記酸化剤および必要に応じて添加される後述する任意成分を分散・溶解するための媒体である。水については、特に制限はないが、配合成分に対する影響、不純物の混入、pH等への影響の観点から、純水、超純水、イオン交換水(脱イオン水)が好ましい。
本発明に使用する研磨液は、前記した成分が前記所定の割合で含有され、均一に溶解した混合状態になるように調製され使用される。混合には、研磨液の製造に通常用いられる撹拌翼による撹拌混合方法を採ることができる。研磨液は、必ずしも予め構成する研磨成分をすべて混合したものとして研磨の場に供給する必要はない。研磨の場に供給する際に、研磨成分が混合されて研磨液の組成になってもよい。
このような研磨液を使用して研磨する研磨対象物は、非酸化物単結晶基板である。非酸化物単結晶基板としては、SiC単結晶基板やGaN単結晶基板のような化合物半導体基板が挙げられる。特に、前記SiC単結晶基板やGaN単結晶基板のような、修正モース硬度が10以上の単結晶基板の被研磨面を、前記研磨液を使用して研磨することで、研磨速度向上の効果をよりいっそう得ることができる。
本発明の研磨方法は、砥粒を内包しない公知の研磨パッドを使用し、この研磨パッドに前記した研磨液を供給しながら、研磨対象物である非酸化物単結晶基板の被研磨面と研磨パッドとを接触させ、両者間の相対運動により研磨を行う方法である。
(1)研磨液および研磨剤液の調製
(1-1)
実施例である例1~15、例20、例21、例23、例25、例28~29および例31において、以下に示すようにして研磨液を調製した。まず、表1および表2に示す酸化剤である過マンガン酸カリウムに純水を加え、撹拌翼を用いて10分間撹拌した。次いで、この液に、表1および表2に示すpH調整剤(リン酸、硝酸、水酸化カリウムまたは水酸化ナトリウム)を撹拌しながら徐々に添加して、表1および表2に示す所定のpHに調整し、研磨液を得た。各実施例において使用した各成分の研磨液全体に対する含有割合(濃度;質量%)を表1および表2に示す。なお、表1および表2における酸化剤濃度は、イオンである過マンガン酸イオンの濃度ではなく、過マンガン酸カリウムの濃度である。
比較例である例16~19、例22、例24、例26~27、例30および例32において、砥粒を含有する研磨剤液を、以下に示すようにして調製した。例16においては、平均1次粒子径が40nm、平均2次粒子径が約70nmのコロイダルシリカ分散液(シリカ固形分約40質量%)に、純水を加え、撹拌翼を用いて10分間撹拌した。次いで、この液に、金属塩としてバナジン酸アンモニウムを撹拌しながら加え、最後に過酸化水素水を添加して30分間撹拌し、表1に示す所定の各成分濃度に調整された研磨剤液を得た。
例1~15、例20、例21、例23、例25、例28~29、および例31で得られた各研磨液、および例16~19、例22、例24、例26~27、例30および例32で得られた各研磨剤液のpHを、横河電機社製のpH81-11を使用し25℃で測定した。測定結果を表1および表2に示す。
例1~15、例20、例21、例23、例25、例28~29および例31で得られた各研磨液、および例16~19、例22、例24、例26~27、例30および例32で得られた各研磨剤液について、以下の方法で研磨特性、および砥粒沈降性の評価を行った。
研磨機としては、MAT社製小型研磨装置を使用した。研磨パッドとしては、SUBA800-XY-groove(ニッタハース社製)を使用し、研磨前にダイヤディスクおよびブラシを用いて、研磨パッドのコンディショニングを行った。
被研磨物として、ダイヤモンド砥粒を用いて予備研磨処理を行った3インチ径の4H-SiC基板を使用し、主面(0001)がC軸に対して0°+0.25°以内のSiC単結晶基板(以下、On-axis基板と示す。)と、主面のC軸に対するオフ角が4°±0.5°以内のSiC単結晶基板をそれぞれ使用し、Si面側を研磨し評価した。なお、例1~2、例8、例11、例17~33の研磨液または研磨剤液については、オフ角が4°以内のSiC単結晶基板(以下、4度オフ基板と示す。)に対する研磨特性(研磨速度)のみを評価した。また、例4、例10、例15の研磨液については、On-axis基板に対する研磨特性(研磨速度)のみを評価した。
研磨速度は、単位時間当たりの基板(ウェハ)の厚さの変化量(nm/hr)で評価した。具体的には、厚さが既知の未研磨基板の質量と各時間研磨した後の基板質量とを測定し、その差から質量変化を求めた。そして、この質量変化から求めた基板の厚さの時間当たりの変化を、下記の式を用いて算出した。研磨速度の算出結果を表1および表2に示す。
(研磨速度(V)の計算式)
Δm=m0-m1
V=Δm/m0 × T0 × 60/t
(式中、Δm(g)は研磨前後の質量変化、m0(g)は未研磨基板の初期質量、m1(g)は研磨後基板の質量、Vは研磨速度(nm/hr)、T0は未研磨基板の厚さ(nm)、tは研磨時間(min)を表す。)
砥粒沈降性評価は、例16~19、例22、例24、例26~27、例30および例32で得られた各研磨剤液を、20mlの試験管に入れて静置し、目視により試験管の底に砥粒の沈殿層が確認されるまでの時間を測定し評価した。なお、5分経過後も沈殿層が確認されない場合は、「凝集せず」と評価した。
Claims (6)
- 砥粒を内包しない研磨パッドに研磨液を供給し、非酸化物単結晶基板の被研磨面と前記研磨パッドとを接触させ、両者間の相対運動により研磨する方法であって、
前記研磨液は、酸化還元電位が0.5V以上の、遷移金属を含む酸化剤と、水とを含み、砥粒を含まないことを特徴とする非酸化物単結晶基板の研磨方法。 - 前記酸化剤は、過マンガン酸イオンである請求項1に記載の非酸化物単結晶基板の研磨方法。
- 前記研磨液中の前記過マンガン酸イオンの含有量は、0.05質量%以上5質量%である請求項2に記載の非酸化物単結晶基板の研磨方法。
- 前記研磨液のpHは11以下である請求項1~3のいずれか1項に記載の非酸化物単結晶基板の研磨方法。
- 前記研磨液のpHは5以下である請求項4に記載の非酸化物単結晶基板の研磨方法。
- 前記非酸化物単結晶基板は、炭化ケイ素(SiC)単結晶基板または窒化ガリウム(GaN)単結晶基板である請求項1~5のいずれか1項に記載の非酸化物単結晶基板の研磨方法。
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014196394A1 (ja) * | 2013-06-04 | 2014-12-11 | 新日鐵住金株式会社 | エピタキシャル炭化珪素ウエハ用炭化珪素単結晶基板の製造方法及びエピタキシャル炭化珪素ウエハ用炭化珪素単結晶基板 |
WO2016072371A1 (ja) * | 2014-11-07 | 2016-05-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2016092246A (ja) * | 2014-11-06 | 2016-05-23 | 株式会社ディスコ | 研磨液及びSiC基板の研磨方法 |
JP2016094588A (ja) * | 2014-11-07 | 2016-05-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2017041526A (ja) * | 2015-08-19 | 2017-02-23 | 濱田重工株式会社 | 単結晶SiCウェハのウェットエッチング方法並びにウェットエッチング液及びウェットエッチング装置 |
WO2018174008A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
WO2019138846A1 (ja) * | 2018-01-11 | 2019-07-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
WO2021200148A1 (ja) | 2020-03-30 | 2021-10-07 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6001532B2 (ja) * | 2011-05-24 | 2016-10-05 | 株式会社クラレ | 化学機械研磨用エロージョン防止剤、化学機械研磨用スラリーおよび化学機械研磨方法 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007027663A (ja) * | 2005-07-21 | 2007-02-01 | Fujimi Inc | 研磨用組成物 |
JP2008068390A (ja) * | 2006-09-15 | 2008-03-27 | Noritake Co Ltd | 結晶材料の研磨加工方法 |
JP2009238891A (ja) * | 2008-03-26 | 2009-10-15 | Hitachi Metals Ltd | SiC単結晶基板の製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030139069A1 (en) * | 2001-12-06 | 2003-07-24 | Block Kelly H. | Planarization of silicon carbide hardmask material |
JP2005117027A (ja) | 2003-09-16 | 2005-04-28 | Matsushita Electric Ind Co Ltd | SiC基板の製造方法 |
US20050059247A1 (en) | 2003-09-16 | 2005-03-17 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing SiC substrate |
JP4759298B2 (ja) * | 2005-03-30 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 単結晶表面用の研磨剤及び研磨方法 |
JP2007021703A (ja) * | 2005-07-21 | 2007-02-01 | Fujimi Inc | 研磨用組成物 |
KR20070012209A (ko) | 2005-07-21 | 2007-01-25 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 연마 방법 |
US20070039926A1 (en) * | 2005-08-17 | 2007-02-22 | Cabot Microelectronics Corporation | Abrasive-free polishing system |
US20070147551A1 (en) | 2005-12-26 | 2007-06-28 | Katsumi Mabuchi | Abrasive-free polishing slurry and CMP process |
TWI332017B (en) | 2005-12-26 | 2010-10-21 | Hitachi Chemical Co Ltd | Abrasive-free polishing slurry and cmp process |
US7678700B2 (en) | 2006-09-05 | 2010-03-16 | Cabot Microelectronics Corporation | Silicon carbide polishing method utilizing water-soluble oxidizers |
US7998866B2 (en) | 2006-09-05 | 2011-08-16 | Cabot Microelectronics Corporation | Silicon carbide polishing method utilizing water-soluble oxidizers |
JP5095228B2 (ja) | 2007-01-23 | 2012-12-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2009241224A (ja) | 2008-03-31 | 2009-10-22 | Toyo Tire & Rubber Co Ltd | 研磨パッド作製用積層シート |
JP2009272380A (ja) * | 2008-05-01 | 2009-11-19 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶およびその表面処理方法、iii族窒化物積層体およびその製造方法、ならびにiii族窒化物半導体デバイスおよびその製造方法 |
JP2010021394A (ja) * | 2008-07-11 | 2010-01-28 | Sumco Corp | 半導体ウェーハの製造方法 |
JP4333820B1 (ja) * | 2009-01-19 | 2009-09-16 | 住友電気工業株式会社 | 化合物半導体基板 |
EP2394787B1 (en) * | 2009-02-04 | 2019-05-29 | Hitachi Metals, Ltd. | Manufacturing method for a silicon carbide monocrystal substrate |
US9368367B2 (en) * | 2009-04-13 | 2016-06-14 | Sinmat, Inc. | Chemical mechanical polishing of silicon carbide comprising surfaces |
TW201103084A (en) * | 2009-04-13 | 2011-01-16 | Sinmat Inc | Chemical mechanical fabrication (CMF) for forming tilted surface features |
US8247328B2 (en) * | 2009-05-04 | 2012-08-21 | Cabot Microelectronics Corporation | Polishing silicon carbide |
EP2251897B1 (en) * | 2009-05-13 | 2016-01-06 | Siltronic AG | A method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side |
DE102009025243B4 (de) * | 2009-06-17 | 2011-11-17 | Siltronic Ag | Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium |
WO2012103091A2 (en) * | 2011-01-24 | 2012-08-02 | Clarkson University | Abrasive free silicon chemical mechanical planarization |
-
2012
- 2012-04-19 WO PCT/JP2012/060577 patent/WO2012147605A1/ja active Application Filing
- 2012-04-19 JP JP2013512301A patent/JP5614498B2/ja active Active
- 2012-04-19 CN CN201280020186.6A patent/CN103493183B/zh active Active
- 2012-04-19 KR KR1020137026891A patent/KR20140012135A/ko not_active Application Discontinuation
- 2012-04-19 DE DE112012001891.5T patent/DE112012001891B4/de active Active
- 2012-04-24 TW TW101114585A patent/TWI475607B/zh active
-
2013
- 2013-10-28 US US14/064,397 patent/US9129901B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007027663A (ja) * | 2005-07-21 | 2007-02-01 | Fujimi Inc | 研磨用組成物 |
JP2008068390A (ja) * | 2006-09-15 | 2008-03-27 | Noritake Co Ltd | 結晶材料の研磨加工方法 |
JP2009238891A (ja) * | 2008-03-26 | 2009-10-15 | Hitachi Metals Ltd | SiC単結晶基板の製造方法 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6048581B2 (ja) * | 2013-06-04 | 2016-12-21 | 新日鐵住金株式会社 | エピタキシャル炭化珪素ウエハ用炭化珪素単結晶基板の製造方法 |
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DE112012001891B4 (de) | 2016-09-15 |
DE112012001891T5 (de) | 2014-01-23 |
TWI475607B (zh) | 2015-03-01 |
US9129901B2 (en) | 2015-09-08 |
JPWO2012147605A1 (ja) | 2014-07-28 |
TW201250812A (en) | 2012-12-16 |
KR20140012135A (ko) | 2014-01-29 |
CN103493183A (zh) | 2014-01-01 |
JP5614498B2 (ja) | 2014-10-29 |
CN103493183B (zh) | 2016-06-08 |
US20140057438A1 (en) | 2014-02-27 |
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