WO2012137739A1 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- WO2012137739A1 WO2012137739A1 PCT/JP2012/058970 JP2012058970W WO2012137739A1 WO 2012137739 A1 WO2012137739 A1 WO 2012137739A1 JP 2012058970 W JP2012058970 W JP 2012058970W WO 2012137739 A1 WO2012137739 A1 WO 2012137739A1
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- WIPO (PCT)
- Prior art keywords
- lens frame
- lens
- imaging device
- imaging
- frame
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/10—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/00071—Insertion part of the endoscope body
- A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
- A61B1/00096—Optical elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2407—Optical details
- G02B23/2423—Optical details of the distal end
- G02B23/243—Objectives for endoscopes
- G02B23/2438—Zoom objectives
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2270/00—Control; Monitoring or safety arrangements
- F04C2270/04—Force
- F04C2270/042—Force radial
- F04C2270/0421—Controlled or regulated
Definitions
- the present invention relates to an imaging apparatus in which an imaging system is disposed behind an objective optical system.
- an endoscope in which an imaging device using a solid-state imaging device such as a CCD is disposed at the distal end of the insertion portion of the endoscope, and the insertion portion in which the imaging device is disposed By inserting it into the image, the image of the test site in the body cavity can be observed on the monitor.
- a solid-state imaging device such as a CCD
- an imaging device incorporated in the distal end portion of such an endoscope is made up of a plurality of lens groups as disclosed in Japanese Patent Application Laid-Open No. 2008-307293. Behind the objective optical system, a solid-state imaging device, a cover glass that protects the imaging surface of the solid-state imaging device, and a circuit board on which electronic components are mounted on the back surface opposite to the imaging surface of the solid-state imaging device are made of resin. An image pickup device package sealed and packaged is arranged.
- a plurality of lens groups constituting the objective optical system of the imaging apparatus are generally held using a lens frame.
- the lens holding structure with this lens frame there are cases where it is held using a plurality of lens frames. In such a case, as shown in FIG. 5, in order to ensure the optical performance by accurately holding the optical position of each lens.
- an image sensor package is often arranged behind the lens holding structure.
- the second lens frame 211 holding the other lens 201 is abutted and joined in the first lens frame 210 holding one lens 200 constituting the objective lens group.
- the lenses 200 and 201 are arranged at specified positions in the optical axis direction, and an imaging frame 212 holding an imaging device package (not shown) is joined to the second lens frame 211.
- the first lens frame 210 and the second lens frame 211 need to have a fitting structure in order to eliminate the optical misalignment between the lenses 200 and 201 in the radial direction. .
- the insertion resistance due to friction is large, not only causing a decrease in workability, but also adding an unreasonable load to the lens. There is a risk of malfunction.
- the tip surface 211a of the second lens frame 211 securely in contact with the abutting surface 210a of the first lens frame 210? Is difficult to confirm, and a gap is generated between the abutting surface 210a of the first lens frame 210 and the front end surface 211a of the second lens frame 211, and the position of the lens in the optical axis direction varies. There is a possibility that stable optical performance cannot be obtained.
- the circuit board of the imaging device package when the first lens frame 210 and the second lens frame 211 are assembled and then the imaging frame 212 is held by joining the imaging frame 212 to the second lens frame 211, the circuit board of the imaging device package, Depending on the amount of the resin agent that seals the electronic component, excessive stress due to thermal expansion of the resin may be applied to the cover glass on the imaging surface side of the solid-state imaging device, which may cause a problem.
- the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an imaging apparatus that can reliably fix components without applying an excessive load and obtain stable optical performance.
- An imaging apparatus is an imaging apparatus in which an imaging system is disposed behind an objective optical system, and the objective optical system includes a plurality of lenses and a plurality of lens frames, and at least two of them.
- the first lens frame includes a step portion with which the tip of the second lens frame abuts on the inside, and the second lens frame is fitted to the inner diameter of the first lens frame.
- a fitting portion and an abutting portion that provides an inner diameter and a gap of the first lens frame and abuts on the stepped portion are provided.
- An imaging apparatus is an imaging apparatus in which an imaging system is disposed behind an objective optical system, wherein the objective optical system includes a plurality of lenses and a plurality of lens frames, and at least In the configuration of the two lens frames, the first lens frame is a slide in which a step portion with which the tip end portion of the second lens frame abuts on the inside and a moving lens frame that moves forward and backward in the optical axis direction are arranged in front of the step portion.
- the second lens frame is provided with a fitting portion that fits into an inner diameter of the first lens frame, an inner diameter and a gap of the first lens frame, and abutting against the stepped portion. And a contact portion.
- An imaging apparatus is an imaging apparatus in which an imaging system is disposed behind an objective optical system, wherein the imaging system includes a solid-state imaging element that photoelectrically converts light incident from the objective optical system; A cover glass covering the imaging surface of the solid-state imaging device; a circuit board portion disposed on the back surface opposite to the imaging surface of the solid-state imaging device; and the cover glass on the side of the imaging surface of the solid-state imaging device.
- the block diagram which shows the imaging device provided in the front-end
- an explanatory diagram showing the configuration of the image pickup device package As above, an explanatory diagram showing the configuration of another imaging device package.
- the block diagram which concerns on the 2nd Embodiment of this invention and shows the imaging device provided in the front-end
- the imaging apparatus according to the present invention is applied to, for example, an endoscope that incorporates an imaging element on the distal end side of an elongated insertion portion that is inserted into a cavity of an observation site.
- an imaging apparatus 1 includes an objective optical system unit 2 and an imaging system unit 30 disposed behind the objective optical system unit 2.
- the objective optical system unit 2 holds an objective lens group 20 composed of a plurality of lenses by a first lens frame 3 and a second lens frame 10 joined to the first lens frame 3.
- the first lens 21 on the distal end side is held by the first lens frame 3, and the remaining lens groups are held by the second lens frame 10.
- each lens of the objective lens group 20 is disposed in each lens frame at a site where the perpendicularity and the coaxiality are processed with high accuracy. With such a structure, each lens of the objective lens group 20 is arranged in each lens frame without being inclined.
- the first lens frame 3 is formed in a substantially cylindrical shape, and a flange portion 4 with which the proximal end side outer peripheral portion of the first lens 21 is in contact is provided at a position near the tip of the inside of the cylindrical shape.
- a space for accommodating the second lens frame 10 is provided on the back side of the flange portion 4.
- the first lens frame 3 is fitted to a distal end frame of an endoscope (not shown) and held at the distal end portion of the endoscope.
- the first lens 21 held by the first lens frame 3 is hermetically joined to the first lens frame 3 by soldering such as soldering or brazing, taking into account, for example, autoclave sterilization processing. ing.
- the second lens frame 10 holds the remaining lens group other than the first lens 21 of the objective lens group 20, and a second lens 22 disposed behind the first lens 21 in order from the front end side.
- a diaphragm 23, a third lens 24, a fourth lens 25, and a fifth lens 26 are held.
- the second lens frame 10 that holds these lens groups is inserted into a space provided on the rear surface side of the flange portion 4 of the first lens frame 3, and the tip portion is on the rear surface side of the flange portion 4 of the first lens frame 3. While being in contact with the end surface 4a, the rear end portion is fitted to the inner wall surface of the space portion of the first lens frame 3, and is fixed by an adhesive or the like.
- the second lens frame 10 is formed in a stepped cylindrical shape whose outer shape differs in outer diameter on the front end side and the rear end side, and has a smaller diameter than the inner diameter of the space portion of the first lens frame 3.
- the front end of the first lens frame 3 is in contact with the rear end face 4a of the flange 4 of the first lens frame 3, and the rear end of the contact 11 is provided over a predetermined length.
- a cylindrical fitting portion 12 having a diameter larger than that of the contact portion 11 and fitted to the inner wall surface of the space of the first lens frame 3. That is, the second lens frame 10 is formed in such a shape that a gap 5 is generated between the second lens frame 10 and the inner wall surface of the first lens frame 3 when inserted into the space of the first lens frame 3.
- the surface of the front end portion of the second lens frame 10 and the end surface 4a of the flange portion 4 of the first lens frame 3 are processed with a high degree of perpendicularity with respect to the optical axis. Furthermore, the fitting part 12 is processed with high accuracy coaxiality with respect to the optical axis.
- the contact area between the first lens frame 3 and the second lens frame 10 is reduced and inserted. Resistance is reduced and assembly workability can be improved.
- the tip end portion of the second lens frame 10 can be reliably brought into contact with the end surface 4a of the flange portion 4 of the first lens frame 3, the first lens 21 disposed on the first lens frame 3 and the second lens frame 3 can be brought into contact with each other. It is possible to eliminate variations in the degree of coaxiality and perpendicularity with respect to the remaining lens groups arranged in the lens frame 10 and the position in the optical axis direction, and to prevent deterioration in optical performance.
- the adhesive applied to the fitting portion 12 remains in the gap 5 even if the adhesive flows to the tip side.
- the adhesive does not flow between the end surface 4a of the flange portion 4 of the first lens frame 3 and the tip of the contact portion 11 of the second lens frame 10. Therefore, the adhesive flows into the contact surface, and there is no deviation between the lenses in the optical axis direction due to the thickness of the flowed adhesive layer, and stable optical accuracy can be ensured.
- the objective optical system unit 2 described above is joined to the imaging system unit 30, and incident light incident through the objective lens group 20 forms an image on the light receiving surface of the solid-state imaging device 41 in the imaging system unit 30.
- the optical image of the subject is photoelectrically converted by the solid-state imaging device 41, and the photoelectrically converted imaging signal is transmitted to the subsequent signal processing circuit via the signal cable 70.
- the objective optical system unit 2 and the imaging system unit 30 are fitted by inserting the first lens frame 3 housing and fixing the second lens frame 10 into the inner diameter portion of the imaging frame 31 that holds the imaging device package 40.
- the two members are joined by airtight joining.
- the image pickup device package 40 has a protective cover glass 42 bonded and fixed to an image pickup surface 41a of a solid-state image pickup device 41 made of CMOS, CCD, or the like with an ultraviolet curable adhesive or the like.
- the circuit board portion 43 on which a plurality of electronic components such as capacitors, resistors, and transistors are mounted is disposed on the back surface side of 41a, and these are electrically connected and then integrally formed with an insulating sealing resin 44. It is a unitized one.
- the image pickup device package 40 has a plurality of electronic components 45a mounted in a recess formed inside as a circuit board portion 43 disposed on the back side of the solid-state image pickup device 41.
- the flexible substrate 43b on which the plurality of electronic components 45b are mounted.
- the laminated substrate 43a and the flexible substrate 43b are electrically connected by, for example, bump connection or the like, and the inner leads 46 extending from the flexible substrate 43b are covered with the cover glass 42 on the imaging surface 41a side of the solid-state imaging device 41. It is connected to a bonding part 47 provided in a part not covered by the.
- Such an image pickup device package 40 seals the substrates 43 a and 43 b and the electronic components 45 a and 45 b with the sealing resin 44, and extends to the upper surface of the inner lead 46 connected to the bonding portion 47 of the solid-state image pickup device 41.
- the cover glass 42 is integrally molded so that the entire side surface of the cover glass 42 is not covered with the sealing resin. That is, the upper surface portion of the inner lead 46 disposed on the surface of the solid-state imaging device 41 that is not covered with the cover glass 42 is sealed with a minimum amount of resin that can protect the electrical component, and the sealing resin 44 is changed by temperature change.
- the image sensor package 40 is transported before the imaging unit 30 is assembled because the cover glass 42 and the connecting portion between the inner lead 46 and the bonding portion 47 are not subjected to an excessive load even if the imaging unit 30 is assembled. It is possible to avoid breakage of the cover glass 42 and poor connection between the inner lead 46 and the bonding portion 47 due to stress such as the above.
- a connection portion with the signal cable 70 is provided on the rear end side of the laminated substrate 43 a and is exposed without being covered with the sealing resin 44.
- the image pickup device package 40 integrally formed with the sealing resin 44 is provided with a translucent optical adhesive or the like on a cover glass 32 for centering that is fixed to the inner diameter side of the image pickup frame 31 so as to face the fifth lens 26.
- the cover glass 42 is bonded and bonded together. That is, the image pickup device package 40 is held by the image pickup frame 31 via the centering cover glass 32.
- the shield frame 33 is fitted to the outer periphery of the rear end side of the image pickup frame 31 in a state where the signal cable 70 is connected to the image pickup device package 40, and the shield frame 33 and the image pickup between the image pickup frame 31 and the image pickup device package 40.
- the imaging element package 40 is fixed by an adhesive 60 made of a thermosetting resin or the like filled between the element package 40 and the connection portion of the signal cable 70.
- a protective tube 34 made of a heat shrinkable tube or the like is covered in a range extending from the outer periphery of the shield frame 33 to the distal end side of the signal cable 70.
- the above-described imaging device package 40 is assumed to be applied to a direct-viewing endoscope that observes the direction along the insertion direction of the endoscope insertion portion. However, the same configuration can also be applied to a side-view endoscope that observes a direction substantially orthogonal to the insertion direction.
- the image pickup device package 40A shown in FIG. 3 has a prism (not shown) or the like arranged on the upper surface of the cover glass 51 with the image pickup surface 50a of the solid-state image pickup device 50 oriented in a direction orthogonal to the optical axis direction of the objective optical system. is there.
- a flexible substrate 53 on which a plurality of electronic components 52 are mounted is disposed on the lower surface side of the solid-state image pickup device 50 (the back surface side of the image pickup surface 50 a), and inner leads 54 extended from the flexible substrate 53. Is connected to a bonding portion 55 provided at a portion not covered by the cover glass 51 on the imaging surface 50 a side of the solid-state imaging device 50.
- an insulating sealing resin 56 the electronic component 52 and the flexible substrate 53 are sealed and integrally molded so as to cover up to the upper surface of the inner lead 54 connected to the bonding portion 55.
- a package 40A is formed.
- the signal cable 70 has a plurality of electric wires 70 b exposed from the outer sheath 70 a in the vicinity of the end of the shield frame 33 fitted to the imaging frame 31, and the electric wires 70 b are imaged by soldering, for example. It is fixed by an adhesive 60 together with the image pickup device package 40 while being connected to the package 40.
- the vicinity of the strip end of the outer sheath 70a where the electric wire 70b is exposed is fixed with a cable fixing thread 71 and further covered with an elastic tube 72 having a predetermined length.
- the distal end side of the elastic tube 72 is fixed by another cable fixing thread 73 slightly behind the cable fixing thread 71, and the rear end of the elastic tube 72 extends to the rear of the bending portion of the endoscope.
- the distal end side of the elastic tube 72 is covered with a heat shrinkable tube 74.
- the portion near the strip end of the signal cable 70 that is doubly covered with the elastic tube 72 and the heat shrinkable tube 74 is within the protective tube 34 covered with the shield frame 33, and the image sensor package 40 and In addition to the adhesive 60 that fixes the electric wire 70b, it is fixed by an adhesive 75 that is filled.
- the position of the rear end of the heat-shrinkable tube 74 is behind the rear end of the protective tube 34, and is an indirect portion between a hard portion that does not bend on the distal end side of the endoscope insertion portion and a bending portion that is composed of a plurality of bending pieces. It is arranged more forward.
- the heat shrinkable tube 74 is an elastic material.
- an elastic tube 72 and a heat shrinkable tube 74 that hold the signal cable 70 with a gap between the outer skin 70 a behind the portion that is rigidly fixed by the adhesive 60. Therefore, a portion where the hardness gradually changes from the hard portion to the soft portion of the cable itself is provided. Therefore, even if an external force in the bending direction is applied to the signal cable 70, the signal cable 70 is gently bent so that stress is not partially concentrated, and disconnection of the internal electric wire can be prevented.
- the imaging apparatus 1 ⁇ / b> A is configured to include an objective optical system unit 100 and an imaging system unit 30 similar to the first embodiment that is disposed behind the objective optical system unit 100.
- the objective optical system unit 100 described above is joined to the imaging system unit 30, and incident light incident through the objective lens group forms an image on the light receiving surface of the solid-state imaging device 41 in the imaging system unit 30. Then, the optical image of the subject is photoelectrically converted by the solid-state imaging device 41, and the photoelectrically converted imaging signal is transmitted to the signal processing circuit at the subsequent stage via the signal cable.
- the objective optical system unit 100 includes a first lens frame 101 that holds a first lens group, a moving lens frame 110 that holds a moving lens group, a second lens frame 104 that holds the remaining lens groups, and a moving lens frame.
- 110 fits in the outer shape of the third lens frame 113, the third lens frame 113 holding the second lens frame 104, the fourth lens frame 114 holding the first lens frame 101 and the third lens frame 113, and the third lens frame 113.
- an adjusting ring 116 to be configured.
- the third lens frame 113 accommodates the moving lens frame 110 and holds the second lens frame 104.
- the third lens frame 113 is formed in a substantially cylindrical shape, and the inner surface of this cylindrical portion becomes a sliding surface on which the moving lens frame 110 advances and retreats. Further, the cylindrical portion is provided with a slit for disposing the action portion 110a of the moving lens frame 110 that is advanced and retracted by the actuator 28.
- each lens of the first lens group, the second lens group, and the moving lens group is disposed in each lens frame at a site where the verticality and the coaxiality are processed with high accuracy. With such a structure, the lenses of the first lens group, the second lens group, and the moving lens group are arranged in each lens frame without tilting.
- a step 113a is provided on the inner surface of the cylindrical shape.
- a space for accommodating the second lens frame 104 is provided on the rear side of the step 113a.
- a convex portion 113b on which the actuator 28 is disposed is provided on the outer surface of the cylindrical portion.
- the fourth lens frame 114 is formed in a substantially cylindrical shape, and holds the first lens frame 101 and the third lens frame 113. Moreover, the convex part 114a is provided in this cylindrical outer surface. The convex portion 114 a is provided with a concave portion 114 b that houses the spring 115 that abuts on the action portion 110 a of the moving lens frame 110.
- the first lens frame 101 when the first lens frame 101 is applied to an endoscope, the first lens frame 101 is fitted to a distal end frame of an endoscope (not shown) and held at the distal end portion of the endoscope.
- the first lens frame 101 is formed in a substantially cylindrical shape, and a flange portion with which the proximal end side outer peripheral portion of the first lens 103 is in contact with the first lens frame 102 via the first diaphragm 102 at a position near the distal end inside the cylindrical shape. 101a is provided. On the back side of the flange portion 101a, a contact portion 101b that contacts the fourth lens frame 114 and a convex portion that fits inside the fourth lens frame 114 are provided.
- the first lens frame 101 When the first lens frame 101 is applied to, for example, an endoscope, the first lens frame 101 abuts on a distal end frame of an endoscope (not shown) in the optical axis direction, and the imaging device is positioned with respect to the distal end frame of the endoscope. become.
- the second lens frame 104 holds the first lens group of the objective lens group and the remaining lens groups other than the moving lens group, and a third diaphragm 106 disposed behind the moving lens group in order from the front end side.
- the third lens 105, the cemented lens 107, the spacer 108, and the first filter 109 are held.
- the second lens frame 104 that holds these lens groups is inserted into a space provided on the rear side of the step portion of the third lens frame 113, and an intermediate portion is located on the end surface of the second lens frame 104 on the back side of the step portion.
- the rear end portion is fitted to the inner wall surface of the space portion of the third lens frame 113 and is fixed by an adhesive or the like.
- the second lens frame 104 is formed in a stepped substantially cylindrical shape with outer diameters different from each other at the front convex portion 104a, the intermediate portion 104b, and the rear end portion 104c, and from the inner diameter of the space portion of the third lens frame 113.
- a cylindrical intermediate portion 104b having a small diameter is provided over a predetermined length on the rear end side of the contact portion 104d, and a contact portion 104d that contacts the end surface of the third lens frame 113 on the back side of the stepped portion.
- a cylindrical fitting portion 104e having a diameter larger than that of the contact portion 104d and fitted to the inner wall surface of the space of the third lens frame 113.
- the second lens frame 104 is formed in such a shape that a gap A is generated between the second lens frame 104 and the inner wall surface of the space of the third lens frame 113 when inserted into the space of the third lens frame 113. Further, the surface of the front end portion of the second lens frame 104 and the end surface of the third lens frame 113 on the back side of the stepped portion are processed with high accuracy perpendicularity to the optical axis. Furthermore, the fitting portion 104e is processed with high accuracy coaxiality with respect to the optical axis.
- the contact area between the third lens frame 113 and the second lens frame 104 is reduced, and the insertion resistance is reduced. Can be reduced and assembly workability can be improved.
- the intermediate portion 104b of the second lens frame 104 can be reliably brought into contact with the end surface of the step portion 113a of the third lens frame 113, variations in the position in the optical axis direction are eliminated and stable optical accuracy is achieved. Therefore, it is possible to obtain variations in the degree of coaxiality, perpendicularity, and optical axis direction between the first lens 103 arranged in the first lens frame 101 and the remaining lens group arranged in the second lens frame 104. This eliminates the deterioration of optical performance.
- the rear end of the third lens frame 113 is made longer from the contact portion 104d of the second lens frame 104 than the length from the step 113a of the third lens frame 113 to the rear end of the third lens frame 113. Attached portion 104f is provided.
- the second lens frame 104 holds the third lens 105 that protrudes into the moving lens frame 110 in front of the step portion of the third lens frame 113 and has a tip convex portion having a smaller diameter than the inner diameter of the moving lens frame 110. 104a.
- the sliding surface of the third lens frame 113 can be provided long in the optical axis direction, and the sliding stroke from the WIDE position to the TELE position of the moving lens frame 110 is optically designed. Therefore, the length of the sliding surface of the moving lens frame 110 in the optical axis direction can be increased.
- the moving lens frame 110 when the moving lens frame 110 is advanced and retracted by the operation of the actuator 28, the moving lens frame 110 can suppress the inclination of the third lens frame 113 with respect to the radial direction, and stable optical performance and a smooth moving lens can be achieved.
- the forward / backward movement of the frame 110 can be obtained.
- the moving lens frame 110 holds the second diaphragm 112 and the moving lens 111.
- the moving lens frame 110 is formed in a cylindrical shape, and the outer surface of the cylindrical portion becomes a sliding surface with the third lens frame 113. Further, a convex action in which the force of the actuator 28 acts on the outer surface of the cylindrical portion. A portion 110a is provided.
- the signal cable 70 has a plurality of electric wires 70 b exposed from the outer skin 70 a in the vicinity of the end of the shield frame 33 fitted to the imaging frame 31. 70b is fixed by the adhesive 60 together with the image pickup device package 40 in a state of being connected to the image pickup device package 40 by soldering, for example.
- the vicinity of the strip end of the outer sheath 70a where the electric wire 70b is exposed is fixed with a cable fixing thread 71 and further covered with an elastic tube 72 having a predetermined length.
- the distal end side of the elastic tube 72 is fixed by another cable fixing thread 73 slightly behind the cable fixing thread 71, and the rear end of the elastic tube 72 extends to the rear of the bending portion of the endoscope.
- the distal end side of the elastic tube 72 is covered with a heat shrinkable tube 74.
- the portion near the strip end of the signal cable 70 that is doubly covered with the elastic tube 72 and the heat shrinkable tube 74 is within the protective tube 34 covered with the shield frame 33, and the image sensor package 40 and In addition to the adhesive 60 that fixes the electric wire 70b, it is fixed by an adhesive 75 that is filled.
- the position of the rear end of the heat-shrinkable tube 74 is behind the rear end of the protective tube 34, and is an indirect portion between a hard portion that does not bend on the distal end side of the endoscope insertion portion and a bending portion that is composed of a plurality of bending pieces. It is arranged more forward.
- the heat shrinkable tube 74 is an elastic material.
- an elastic tube 72 and a heat shrinkable tube 74 that hold the signal cable 70 with a gap between the outer skin 70 a behind the portion that is rigidly fixed by the adhesive 60. Therefore, a portion where the hardness gradually changes from the hard portion to the soft portion of the cable itself is provided. Therefore, even if an external force in the bending direction is applied to the signal cable 70, the signal cable 70 is gently bent so that stress is not partially concentrated, and disconnection of the internal electric wire can be prevented.
- the objective optical system unit 100 and the imaging system unit 30 capture the third lens frame 113 in which the second lens frame 104 is housed and fixed, and hold the imaging device package 40.
- the two members are joined by being inserted into and fitted into the inner diameter portion of the frame 31 and hermetically joined.
- the image pickup device package 40 is also integrally formed into a unit.
- the image sensor package 40 in the present embodiment also employs the same configuration as that shown in FIG. 2 as in the first embodiment described above.
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Abstract
Description
本発明による撮像装置は、例えば、観察部位の腔内に挿入される細長の挿入部の先端側に撮像素子を内蔵する内視鏡等に適用されるものである。図1に示すように、このような撮像装置1は、対物光学系ユニット2と、この対物光学系ユニット2の後方に配設された撮像系ユニット30とを有して構成されている。
図4において、撮像装置1Aは、対物光学系ユニット100と、この対物光学系ユニット100の後方に配設された、第1形態と同様の撮像系ユニット30とを有して構成されている。
Claims (9)
- 対物光学系の後方に撮像系を配置した撮像装置において、
前記対物光学系は、複数のレンズと複数のレンズ枠とを備えて構成され、そのうち少なくとも2つのレンズ枠において、
第1のレンズ枠は、内側に第2のレンズ枠の先端部が当接する段部を備え、
前記第2のレンズ枠は、前記第1のレンズ枠の内径に嵌合する嵌合部と、前記第1のレンズ枠の内径と間隙を設け、前記段部に当接する当接部とを備えた
ことを特徴とする撮像装置。 - 対物光学系の後方に撮像系を配置した撮像装置において、
前記対物光学系は、複数のレンズと複数のレンズ枠とを備えて構成され、そのうち少なくとも2つのレンズ枠の構成において、
第1のレンズ枠は、内側に第2のレンズ枠の先端部が当接する段部と、段部前方に光軸方向に進退する移動レンズ枠を配置する摺動部とを備え、
前記第2のレンズ枠は、前記第1のレンズ枠の内径に嵌合する嵌合部と、前記第1のレンズ枠の内径と間隙を設け、前記段部に当接する当接部とを備えた
ことを特徴とする撮像装置。 - 前記第2のレンズ枠は、前記段部より前方に少なくとも1つのレンズを配置する凸部を備え、前記凸部は前記移動レンズ枠内に突出していることを特徴とする請求項2に記載の撮像装置。
- 前記第1のレンズ枠は、前記移動レンズ枠を進退するアクチュエータとの作用部を配置するスリットが形成されていることを特徴とする請求項2または3に記載の撮像装置。
- 前記第1のレンズ枠の後端部よりも前記第2のレンズ枠の後端部が後方側へ突出していることを特徴とする請求項1乃至4のいずれかに記載の撮像装置。
- 対物光学系の後方に撮像系を配置した撮像装置において、
前記撮像系は、
前記対物光学系から入射される光を光電変換する固体撮像素子と、
前記個体撮像素子の撮像面を覆うカバーガラスと、
前記固体撮像素子の撮像面と反対側の背面に配設される回路基板部と、
前記固体撮像素子の撮像面の側方で前記カバーガラスに覆われない位置に設けた接続部に接続される前記回路基板部から延出されるインナーリードと、
前記カバーガラスの側方で前記カバーガラス側面全域は覆わず、前記インナーリードの上面までを覆う封止樹脂と
を備えて構成されることを特徴とする撮像装置。 - 前記回路基板部は、前記インナーリードを介して前記固体撮像素子に接続されるフレキシブル基板と、このフレキシブル基板に接続される回路基板と、各基板に実装される複数の電子部品とを備えて構成されることを特徴とする請求項6に記載の撮像装置。
- 前記封止樹脂は、前記インナーリードから前記回路基板部までを一体的に覆うように形成されることを特徴とする請求項6または7に記載の撮像装置。
- 前記回路基板部は内側に凹部を形成したことを特徴とする請求項6乃至8のいずれかに記載の撮像装置。
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CN201280002340.7A CN103069323B (zh) | 2011-04-05 | 2012-04-02 | 摄像装置 |
US13/646,058 US8823787B2 (en) | 2011-04-05 | 2012-10-05 | Image pickup apparatus |
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EP2605053A1 (en) | 2013-06-19 |
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JPWO2012137739A1 (ja) | 2014-07-28 |
US20130027534A1 (en) | 2013-01-31 |
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US8823787B2 (en) | 2014-09-02 |
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