WO2012117840A1 - 熱可塑性樹脂組成物およびその成形品 - Google Patents
熱可塑性樹脂組成物およびその成形品 Download PDFInfo
- Publication number
- WO2012117840A1 WO2012117840A1 PCT/JP2012/053322 JP2012053322W WO2012117840A1 WO 2012117840 A1 WO2012117840 A1 WO 2012117840A1 JP 2012053322 W JP2012053322 W JP 2012053322W WO 2012117840 A1 WO2012117840 A1 WO 2012117840A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyphenylene ether
- ether ketone
- thermoplastic resin
- cyclic polyphenylene
- acid
- Prior art date
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 89
- 239000011342 resin composition Substances 0.000 title claims abstract description 73
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 231
- 150000002576 ketones Chemical class 0.000 claims abstract description 218
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 191
- 229920005989 resin Polymers 0.000 claims abstract description 106
- 239000011347 resin Substances 0.000 claims abstract description 106
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 claims abstract description 6
- LUCCIOKYRSXZHQ-UHFFFAOYSA-N bicyclo[4.1.0]hepta-1,3,5-trien-7-one Chemical compound C1=CC=C2C(=O)C2=C1 LUCCIOKYRSXZHQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- -1 ether ketone Chemical class 0.000 claims description 198
- 239000000203 mixture Substances 0.000 claims description 91
- 238000002844 melting Methods 0.000 claims description 46
- 230000008018 melting Effects 0.000 claims description 46
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 38
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 38
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 32
- 239000004645 polyester resin Substances 0.000 claims description 23
- 239000000945 filler Substances 0.000 claims description 21
- 229920001225 polyester resin Polymers 0.000 claims description 21
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 13
- 239000003365 glass fiber Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 10
- 229920005668 polycarbonate resin Polymers 0.000 claims description 10
- 239000004431 polycarbonate resin Substances 0.000 claims description 10
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 9
- 239000004917 carbon fiber Substances 0.000 claims description 9
- 239000012765 fibrous filler Substances 0.000 claims description 9
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- 239000000835 fiber Substances 0.000 abstract description 26
- 238000002425 crystallisation Methods 0.000 abstract description 11
- 230000008025 crystallization Effects 0.000 abstract description 11
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- 239000002904 solvent Substances 0.000 description 99
- 238000000034 method Methods 0.000 description 89
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 58
- 238000006243 chemical reaction Methods 0.000 description 46
- 239000002798 polar solvent Substances 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 34
- 230000000694 effects Effects 0.000 description 33
- 229920001577 copolymer Polymers 0.000 description 28
- 239000002585 base Substances 0.000 description 27
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 25
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 24
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- 239000000047 product Substances 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 20
- 229920001707 polybutylene terephthalate Polymers 0.000 description 20
- 239000007787 solid Substances 0.000 description 20
- 238000002156 mixing Methods 0.000 description 19
- 238000012545 processing Methods 0.000 description 19
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000002253 acid Substances 0.000 description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 description 18
- 239000005020 polyethylene terephthalate Substances 0.000 description 18
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 16
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 14
- 150000001491 aromatic compounds Chemical class 0.000 description 14
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 14
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 13
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
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- 150000003839 salts Chemical class 0.000 description 13
- 238000011282 treatment Methods 0.000 description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 12
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 12
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- 239000012298 atmosphere Substances 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 11
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 10
- 229920000412 polyarylene Polymers 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical class CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 9
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 9
- 230000018044 dehydration Effects 0.000 description 9
- 238000006297 dehydration reaction Methods 0.000 description 9
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 8
- 238000010533 azeotropic distillation Methods 0.000 description 8
- 239000006227 byproduct Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 150000002009 diols Chemical class 0.000 description 8
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- LSQARZALBDFYQZ-UHFFFAOYSA-N 4,4'-difluorobenzophenone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 LSQARZALBDFYQZ-UHFFFAOYSA-N 0.000 description 7
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- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 6
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 6
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- 125000003118 aryl group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
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- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
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- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
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- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
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- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
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- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
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- HGPXWXLYXNVULB-UHFFFAOYSA-M lithium stearate Chemical compound [Li+].CCCCCCCCCCCCCCCCCC([O-])=O HGPXWXLYXNVULB-UHFFFAOYSA-M 0.000 description 1
- HQRPHMAXFVUBJX-UHFFFAOYSA-M lithium;hydrogen carbonate Chemical compound [Li+].OC([O-])=O HQRPHMAXFVUBJX-UHFFFAOYSA-M 0.000 description 1
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- 235000011285 magnesium acetate Nutrition 0.000 description 1
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
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- OMEMQVZNTDHENJ-UHFFFAOYSA-N n-methyldodecan-1-amine Chemical compound CCCCCCCCCCCCNC OMEMQVZNTDHENJ-UHFFFAOYSA-N 0.000 description 1
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- 150000002825 nitriles Chemical class 0.000 description 1
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- 229910000273 nontronite Inorganic materials 0.000 description 1
- 229920006118 nylon 56 Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- NOUWNNABOUGTDQ-UHFFFAOYSA-N octane Chemical compound CCCCCCC[CH2+] NOUWNNABOUGTDQ-UHFFFAOYSA-N 0.000 description 1
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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- 239000004626 polylactic acid Substances 0.000 description 1
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- 239000011116 polymethylpentene Substances 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
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- 230000008439 repair process Effects 0.000 description 1
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- 235000009566 rice Nutrition 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- WPFGFHJALYCVMO-UHFFFAOYSA-L rubidium carbonate Chemical compound [Rb+].[Rb+].[O-]C([O-])=O WPFGFHJALYCVMO-UHFFFAOYSA-L 0.000 description 1
- 229910000026 rubidium carbonate Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
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- 239000002453 shampoo Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
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- 239000000344 soap Substances 0.000 description 1
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- 239000011780 sodium chloride Substances 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- WJMMDJOFTZAHHS-UHFFFAOYSA-L strontium;carbonic acid;carbonate Chemical compound [Sr+2].OC([O-])=O.OC([O-])=O WJMMDJOFTZAHHS-UHFFFAOYSA-L 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
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- 238000003786 synthesis reaction Methods 0.000 description 1
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- 238000009864 tensile test Methods 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical group NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- RWWNQEOPUOCKGR-UHFFFAOYSA-N tetraethyltin Chemical compound CC[Sn](CC)(CC)CC RWWNQEOPUOCKGR-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- LOAWHQCNQSFKDK-UHFFFAOYSA-N triethyltin Chemical compound CC[Sn](CC)CC.CC[Sn](CC)CC LOAWHQCNQSFKDK-UHFFFAOYSA-N 0.000 description 1
- OLBXOAKEHMWSOV-UHFFFAOYSA-N triethyltin;hydrate Chemical compound O.CC[Sn](CC)CC OLBXOAKEHMWSOV-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- PDSVZUAJOIQXRK-UHFFFAOYSA-N trimethyl(octadecyl)azanium Chemical compound CCCCCCCCCCCCCCCCCC[N+](C)(C)C PDSVZUAJOIQXRK-UHFFFAOYSA-N 0.000 description 1
- DOOPOMANTWCTIB-UHFFFAOYSA-M tris(2-methylpropyl)stannanylium;acetate Chemical compound CC([O-])=O.CC(C)C[Sn+](CC(C)C)CC(C)C DOOPOMANTWCTIB-UHFFFAOYSA-M 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 235000013904 zinc acetate Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/02—Condensation polymers of aldehydes or ketones only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
-
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Definitions
- the present invention relates to a thermoplastic resin composition, and by blending a cyclic polyphenylene ether ketone mixture having a specific ring structure, it has excellent fluidity, high crystallization characteristics and transparency, and is a resin molded product or sheet.
- the present invention provides a thermoplastic resin composition having excellent processability during melt processing of films, fibers and pipes.
- Thermoplastic resins are used in various applications by taking advantage of their superior properties.
- polyamide resins and polyester resins have excellent balance between mechanical properties and toughness, so they are used for various electrical / electronic parts, machine parts and automotive parts mainly for injection molding.
- polyester resins polybutylene terephthalate (PBT (hereinafter abbreviated as PBT) and polyethylene terephthalate (hereinafter abbreviated as PET) are industrial molded products such as connectors, relays, switches, etc. for automobiles and electrical / electronic devices that take advantage of moldability, heat resistance, mechanical properties and chemical resistance. Widely used as material.
- Amorphous resins such as polycarbonate resins are used in a wide range of fields such as optical materials, household electrical appliances, office automation equipment, and automobiles, taking advantage of their transparency and dimensional stability.
- aromatic cyclic compounds can be applied to highly functional materials and functional materials based on properties unique to their cyclic molecular forms, for example, effective for the synthesis of high molecular weight linear polymers by ring-opening polymerization.
- it has attracted attention due to its specificity derived from its structure, such as its use as a monomer and its application as a resin additive that has no end group to suppress reaction with the matrix.
- a compound having a polyarylene ether ketone structure having high heat resistance and excellent chemical stability has attracted particular attention in conjunction with the above reasons, and has characteristics such as fluidity and residence stability of a thermoplastic resin. Application as an additive for modification is being performed.
- Non-Patent Document 1 discloses the structure and characteristics of cyclic polyphenylene ether extracted from a commercially available polyphenylene ether ketone resin having a linear structure.
- this cyclic polyphenylene ether is only present in an amount of 0.2 wt% at most with respect to the linear polyphenylene ether ketone resin, and the effects and characteristic changes due to the inclusion of the cyclic polyphenylene ether are unclear.
- the disclosed compound is a high melting point compound having a melting point of about 330 ° C., and there is a problem that a thermoplastic resin that can be used as a modifier is limited.
- Non-Patent Document 2 discloses a method for synthesizing cyclic polyphenylene ether ketone and the characteristics of the product. Specifically, a linear polyphenylene ether ketone oligomer having hydroxyl groups at both ends and a linear shape having fluorine groups at both ends are disclosed. The method of reacting the polyphenylene ether ketone oligomer and the melting point of the cyclic product to be produced are described, but there is no description about the effects and characteristics when the obtained cyclic polyphenylene ether ketone is added to the thermoplastic resin.
- an oligomer having a long chain length is used as a raw material, so that the obtained cyclic polyphenylene ether ketone mixture has a cyclic polyphenylene ether ketone repeating number m of 3 and / or 6, and has a melting point. Only cyclic polyphenylene ether ketone having a temperature exceeding 270 ° C. can be obtained. More specifically, a cyclic polyphenylene ether obtained from the linear oligomer shown in the above formula (both terminal hydroxyl oligomer composed of 4 units of benzene ring component and fluorine terminal oligomer composed of 5 terminals of benzene ring component).
- thermoplastic resin that can be used as the resin modifier is limited.
- Patent Document 1 a composition in which a low-viscosity polyarylene ether ketone resin is added to a higher-viscosity polyarylene ether ketone resin as a viscosity modifier is disclosed in Patent Document 1, but as a low-viscosity polyarylene ether ketone resin,
- the chain polyarylene ether ketone is only exemplified, and there is no description about the effect when the cyclic polyarylene ether ketone is added, and the viscosity of the chain polyarylene ether ketone described in Patent Document 1 is modified. The effect as an agent is not sufficient.
- Patent Documents 2 to 6 disclose resin compositions obtained by adding a small amount of a polyether ether ketone resin to a high heat resistant thermoplastic resin such as aromatic polyamide, polyether imide, polyphenylene sulfide, liquid crystal polyester, and the like.
- a polyether ether ketone resin such as aromatic polyamide, polyether imide, polyphenylene sulfide, liquid crystal polyester, and the like.
- chain polyarylene ether ketone is added, and there is no description about the effects and characteristics when cyclic polyarylene ether ketone is added to the thermoplastic resin.
- chain polyarylene ether ketones are considered to have a high melting point exceeding 330 ° C., the problem that the thermoplastic resins that can be used as resin modifiers are still not solved, An additive having high versatility and a large modifying effect has been desired.
- the present invention relates to a resin composition that solves the above problems, has excellent fluidity during melt processing, and has excellent moldability, and further melts resin molded products, sheets, films, fibers, pipes, and the like.
- the present invention relates to a resin composition suitable for processability.
- the present invention (1) (A) The following general formula having (B) a phenylene ketone represented by -Ph-CO- and a phenylene ether represented by -Ph-O- as repeating structural units with respect to 100 parts by weight of the thermoplastic resin.
- a thermoplastic resin composition comprising 0.5 to 50 parts by weight of the cyclic polyphenylene ether ketone represented by (I),
- thermoplastic resin composition according to the description, (4) The above (1) to (3), wherein the (B) cyclic polyphenylene ether ketone is a cyclic polyphenylene ether ether ketone represented by the following general formula (II):
- a thermoplastic resin composition
- thermoplastic resin composition according to any one of (1) to (4) above, wherein the cyclic polyphenylene ether ketone (B) has a melting point of 270 ° C. or lower.
- thermoplastic resin composition as described in any one of (1) to (5) above, wherein the melting point of the cyclic polyphenylene ether ketone (B) is 250 ° C. or lower.
- thermoplastic resin (A) is at least one selected from polyphenylene ether ether ketone resin, polyphenylene sulfide resin, polyamide resin, polyester resin, polycarbonate resin and polystyrene resin.
- thermoplastic resin composition according to any one of to (6), (8) The heat described in any one of (1) to (7) above, further comprising (A) 100 parts by weight of a thermoplastic resin and (C) 0.1 to 200 parts by weight of a filler.
- a plastic resin composition (9) The thermoplastic resin composition according to any one of the above (1) to (8), wherein the filler (C) contains at least a fibrous filler, (10) The thermoplastic resin composition as described in (9) above, wherein the filler (C) is glass fiber and / or carbon fiber, (11) A molded article obtained by melt-molding the resin composition described in any one of (1) to (10) above.
- thermoplastic resin composition having excellent fluidity and high molding processability, excellent in retention stability, and excellent in melt processability during injection molding, fiber, and film processing. Furthermore, according to the present invention, depending on the type of thermoplastic resin to be used, in addition to the above effects, a resin composition having high crystallinity and high transparency can be provided.
- weight means “mass”.
- thermoplastic resin (A) used in the present invention may be any resin that can be melt-molded.
- the thermoplastic resin (A) used in the present invention may be any resin that can be melt-molded.
- the thermoplastic resin may be modified with at least one compound selected from unsaturated carboxylic acids, acid anhydrides or derivatives thereof.
- polyphenylene ether ketone resin, polyphenylene sulfide resin, polyamide resin, polyester resin, polycarbonate resin, polyphenylene ether resin, ABS resin, and polyolefin resin are preferable in terms of heat resistance, moldability, and mechanical properties, and polyphenylene ether ketone is particularly preferable.
- Resins, polyphenylene sulfide resins, polyamide resins, polyester resins, polycarbonate resins, and ABS resins are preferably used.
- the polyphenylene ether ketone resin preferable as the component (A) of the present invention is a polymer having a repeating structural unit represented by the following formula (III), and a substantially linear polymer can be used.
- Ar and Ar ′ represent the same or different substituted or unsubstituted aryl residues, and m is an integer of 1 or more.
- the substituent on the benzene ring in Ar and Ar ′ is not particularly limited.
- a functional group containing a hetero atom, a halogen atom, or the like can be given. Among these, an unsubstituted para-phenylene group is preferable.
- a polyphenylene ether ether ketone resin having a repeating structural unit represented by the chemical formula (IV) is preferable.
- the polyaryl ether ketone resin may be mainly a copolymer such as a random copolymer, an alternating copolymer, or a block copolymer in addition to a homopolymer. It is desirable to contain 50 mol% or more of structural units with respect to all the structural units.
- the degree of polymerization of these polyaryl ether ketone resins is not particularly limited, but the reduced viscosity is preferably in the range of 0.1 to 3.0, particularly in the range of 0.5 to 2.0. Ketone resins are preferred.
- the reduced viscosity in the present invention has the effect of sulfonation on a concentrated sulfuric acid solution having a concentration of 0.1 g / dL (weight of cyclic polyphenylene ether ketone composition / 98% by weight concentrated sulfuric acid) unless otherwise specified. In order to minimize the value, it is a value measured using an Ostwald viscometer at 25 ° C. immediately after completion of dissolution. The reduced viscosity was calculated according to the following formula.
- ⁇ ⁇ (t / t 0 ) ⁇ 1 ⁇ / C (Here, t represents the number of seconds passing through the sample solution, t 0 represents the number of seconds passing through the solvent (98 wt% concentrated sulfuric acid), and C represents the concentration of the solution.)
- polyphenylene sulfide resin preferably used in the present invention, a polymer having a repeating unit represented by the following structural formula can be used.
- a polymer containing 70 mol% or more, more preferably 90 mol% or more of the repeating unit represented by the above structural formula is preferable.
- about less than 30 mol% of the repeating units may be composed of repeating units having any of the following structures.
- a p-phenylene sulfide / m-phenylene sulfide copolymer m-phenylene sulfide units of 20% or less
- Such a polyphenylene sulfide resin can be produced in a high yield by recovering and post-treating a polyphenylene sulfide resin obtained by reacting a polyhalogen aromatic compound and a sulfidizing agent in a polar organic solvent.
- a method for obtaining a polymer having a relatively small molecular weight described in JP-B-45-3368, or a relatively molecular weight described in JP-B-52-12240 and JP-A-61-7332 is disclosed. It can also be produced by a method for obtaining a large polymer.
- Specific methods for crosslinking / high molecular weight polyphenylene sulfide resin by heating include an atmosphere of an oxidizing gas such as air or oxygen, or a mixed gas atmosphere of the oxidizing gas and an inert gas such as nitrogen or argon.
- an atmosphere of an oxidizing gas such as air or oxygen
- a mixed gas atmosphere of the oxidizing gas and an inert gas such as nitrogen or argon.
- the heat treatment temperature is usually 170 to 280 ° C., preferably 200 to 270 ° C.
- the heat treatment time is usually selected from 0.5 to 100 hours, and preferably from 2 to 50 hours. By controlling both of these, the target viscosity level can be obtained.
- the heat treatment apparatus may be a normal hot air drier, or a heating apparatus with a rotary type or a stirring blade, but for efficient and more uniform processing, a rotary type or with a stirring blade is used. It is preferable to use a heating device.
- a specific method for heat-treating the polyphenylene sulfide resin under an inert gas atmosphere such as nitrogen or under reduced pressure is a heat treatment temperature of 150 to 280 ° C., preferably 200, under an inert gas atmosphere such as nitrogen or under reduced pressure.
- Examples include a method of heat treatment at 270 ° C. and a heating time of 0.5 to 100 hours, preferably 2 to 50 hours.
- the heat treatment apparatus may be a normal hot air drier, or a heating apparatus with a rotary type or a stirring blade, but for efficient and more uniform treatment, a rotary type or with a stirring blade is used. More preferably, a heating device is used.
- the polyphenylene sulfide resin used in the present invention is preferably a polyphenylene sulfide resin that has been subjected to a cleaning treatment.
- a cleaning treatment include an acid aqueous solution cleaning process, a hot water cleaning process, and an organic solvent cleaning process. These treatments may be used in combination of two or more methods.
- the following method can be exemplified as a specific method when the polyphenylene sulfide resin is washed with an organic solvent. That is, the organic solvent used for washing is not particularly limited as long as it does not have an action of decomposing polyphenylene sulfide resin.
- nitrogen-containing polar solvents such as N-methylpyrrolidone, dimethylformamide, dimethylacetamide, dimethyl Sulfoxides such as sulfoxide, dimethylsulfone, sulfone solvents, ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone, acetophenone, ether solvents such as dimethyl ether, dipropyl ether, tetrahydrofuran, chloroform, methylene chloride, trichloroethylene, ethylene dichloride, Halogenated solvents such as dichloroethane, tetrachloroethane, chlorobenzene, methanol, ethanol, propanol, butanol, pentanol, ethylene glycol , Propylene glycol, phenol, cresol, alcohols such as polyethylene glycol, phenolic solvents, benzene, toluene, and aromatic hydrocarbon solvents such as x
- organic solvents N-methyl-2-pyrrolidone, acetone, dimethylformamide, chloroform and the like are preferred. These organic solvents are used alone or in combination of two or more.
- a method of washing with an organic solvent there is a method of immersing a polyphenylene sulfide resin in an organic solvent, and if necessary, stirring or heating can be appropriately performed.
- the washing temperature when washing the polyphenylene sulfide resin with an organic solvent there is no particular limitation on the washing temperature when washing the polyphenylene sulfide resin with an organic solvent, and an arbitrary temperature of about room temperature to about 300 ° C. can be selected. The higher the cleaning temperature, the higher the cleaning efficiency tends to be. However, a sufficient effect is usually obtained at a cleaning temperature of room temperature to 150 ° C.
- the polyphenylene sulfide resin that has been washed with an organic solvent is preferably washed several times with water or warm water in order to remove the remaining organic solvent.
- the following method can be exemplified as a specific method when the polyphenylene sulfide resin is washed with hot water. That is, it is preferable that the water used is distilled water or deionized water in order to develop a preferable chemical modification effect of the polyphenylene sulfide resin by hot water washing.
- the operation of the hot water treatment is usually performed by charging a predetermined amount of polyphenylene sulfide resin into a predetermined amount of water, and heating and stirring at normal pressure or in a pressure vessel.
- the ratio of the polyphenylene sulfide resin and water is preferably as much as possible, but usually a bath ratio of 200 g or less of polyphenylene sulfide resin is selected per liter of water.
- an aqueous solution containing a Group II metal element of the periodic table when washing with hot water, it is preferably used with an aqueous solution containing a Group II metal element of the periodic table.
- the aqueous solution containing a Group II metal element of the periodic table is obtained by adding a water-soluble salt having a Group II metal element of the periodic table to the water.
- the concentration of the water-soluble salt having a Group II metal element in the periodic table with respect to water is preferably in the range of about 0.001 to 5% by weight.
- preferred metal elements can include calcium, magnesium, barium and zinc, and other anions include acetate ion, halide ion, hydroxide ion and Examples include carbonate ions. More specific and preferred compounds include calcium acetate, magnesium acetate, zinc acetate, calcium chloride, calcium bromide, zinc chloride, calcium carbonate, calcium hydroxide and calcium oxide, and particularly preferably calcium acetate. is there.
- the temperature of the aqueous solution containing the Group II metal element of the periodic table is preferably 130 ° C. or higher, and more preferably 150 ° C. or higher.
- the upper limit of the washing temperature is not particularly limited, but when using a normal autoclave, the limit is about 250 ° C.
- the bath ratio of the aqueous solution containing the Group II metal element in the periodic table is preferably selected from the range of 2 to 100, more preferably 4 to 50, and more preferably 5 to 15 with respect to the dry polymer 1 by weight. More preferably, it is in the range.
- the following method can be illustrated as a specific method when the polyphenylene sulfide resin is washed with an acid aqueous solution. That is, there is a method of immersing a polyphenylene sulfide resin in an acid or an acid aqueous solution, and stirring or heating can be appropriately performed as necessary.
- the acid used is not particularly limited as long as it does not have the action of decomposing polyphenylene sulfide resin, and is saturated with aliphatic saturated monocarboxylic acids such as formic acid, acetic acid, propionic acid and butyric acid, and halo-substituted fatty acids such as chloroacetic acid and dichloroacetic acid.
- Aliphatic unsaturated monocarboxylic acids such as aromatic saturated carboxylic acids, acrylic acids and crotonic acids, aromatic carboxylic acids such as benzoic acid and salicylic acid, dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, phthalic acid and fumaric acid, Examples include inorganic acidic compounds such as sulfuric acid, phosphoric acid, hydrochloric acid, carbonic acid, and silicic acid. Of these, acetic acid and hydrochloric acid are more preferably used.
- the acid-treated polyphenylene sulfide resin is preferably washed several times with water or warm water in order to remove the remaining acid or salt.
- the water used for washing is preferably distilled water or deionized water in the sense that it does not impair the preferable chemical modification effect of the polyphenylene sulfide resin by acid treatment.
- the amount of ash content of the polyphenylene sulfide resin used in the present invention is preferably a relatively large range of 0.1 to 2% by weight from the viewpoint of imparting characteristics such as fluidity during processing and molding cycle, and is preferably 0.2 to 1% by weight. % Is more preferable, and a range of 0.3 to 0.8% by weight is more preferable.
- the amount of ash refers to the amount of inorganic components in the polyphenylene sulfide resin determined by the following method.
- A Weigh 5-6 g of polyphenylene sulfide resin in a platinum dish fired and cooled at 583 ° C.
- B Pre-baking polyphenylene sulfide resin at 450 to 500 ° C. together with a platinum dish.
- C A polyphenylene sulfide sample pre-fired with a platinum pan is placed in a muffle furnace set at 583 ° C., and fired for about 6 hours until it completely incinerates.
- D Weigh after cooling in a desiccator.
- the melt viscosity of the polyphenylene sulfide resin used in the present invention is in the range of 1 to 3000 Pa ⁇ s (320 ° C., shear rate 1000 sec ⁇ 1 ) from the viewpoint of imparting characteristics such as improved chemical resistance and fluidity during processing. Is preferably selected, more preferably in the range of 1 to 1000 Pa ⁇ s, still more preferably in the range of 1 to 200 Pa ⁇ s.
- the melt viscosity is a value measured with a Koka flow tester at a cylinder temperature of 320 ° C. using a nozzle having a nozzle diameter of 0.5 mm ⁇ and a nozzle length of 10 mm under conditions of a shear rate of 1000 sec ⁇ 1 .
- the preferred polyamide resin in the present invention is a polyamide mainly composed of amino acids, lactams or diamines and dicarboxylic acids.
- Representative examples of the main constituents include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid, lactams such as ⁇ -caprolactam and ⁇ -laurolactam, and pentamethylenediamine.
- a particularly useful polyamide resin is a polyamide resin having a melting point of 150 ° C. or more and excellent in heat resistance and strength.
- Specific examples include polycaproamide (nylon 6), polyhexamethylene adipamide. (Nylon 66), polypentamethylene adipamide (nylon 56), polyhexamethylene sebamide (nylon 610), polyhexamethylene dodecane (nylon 612), polyundecanamide (nylon 11), polydodecanamide (nylon) 12), polycaproamide / polyhexamethylene adipamide copolymer (nylon 6/66), polycaproamide / polyhexamethylene terephthalamide copolymer (nylon 6 / 6T), polyhexamethylene adipamide / polyhexamethylene terephthalamide Copolymer (N Ron 66 / 6T), polyhexamethylene adipamide / polyhexamethylene isophthalamide copolymer (nylon 66 / 6I
- preferable polyamide resins include nylon 6, nylon 66, nylon 12, nylon 610, nylon 6/66 copolymer, nylon 6T / 66 copolymer, nylon 6T / 6I copolymer, nylon 6T / 12, nylon 6T / 6 copolymer, and the like.
- the copolymer which has the hexamethyl terephthalamide unit of this can be mentioned, Especially preferably, nylon 6 and nylon 66 can be mentioned.
- the degree of polymerization of these polyamide resins is not particularly limited, but the relative viscosity measured at 25 ° C. in a 98% concentrated sulfuric acid solution having a sample concentration of 1.0 g / dl is in the range of 1.5 to 7.0. Particularly preferred are polyamide resins in the range of 2.0 to 6.0.
- a copper compound is preferably used for the polyamide resin of the present invention in order to improve long-term heat resistance.
- copper compounds include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, cupric iodide, cupric sulfate, nitric acid.
- monovalent copper compounds particularly monovalent copper halide compounds are preferable, and cuprous acetate, cuprous iodide, and the like can be exemplified as particularly suitable copper compounds.
- the amount of copper compound added is usually preferably 0.01 to 2 parts by weight, more preferably 0.015 to 1 part by weight, based on 100 parts by weight of the polyamide resin. If the amount added is too large, metal copper is liberated during melt molding, and the value of the product is reduced by coloring.
- an alkali halide can be added in combination with a copper compound.
- the alkali halide compound include lithium chloride, lithium bromide, lithium iodide, potassium chloride, potassium bromide, potassium iodide, sodium bromide and sodium iodide.
- Sodium chloride is particularly preferred.
- the polyester resin preferable in the present invention is a polymer having an ester bond in the main chain and not exhibiting melt liquid crystallinity, and (i) a dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof ( (B) A polymer or copolymer having at least one selected from hydroxycarboxylic acid or an ester-forming derivative thereof and (c) lactone as a main structural unit.
- dicarboxylic acid or ester-forming derivatives thereof examples include terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, bis (p-carboxyphenyl) methane, anthracene dicarboxylic acid, Aromatic dicarboxylic acids such as 4,4'-diphenyl ether dicarboxylic acid, 5-tetrabutylphosphonium isophthalic acid, 5-sodium sulfoisophthalic acid, oxalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, dodecanedioic acid, malon
- Aromatic dicarboxylic acids such as 4,4'-diphenyl ether dicarboxylic acid, 5-tetrabutylphosphonium isophthalic acid, 5-sodium sulfoisophthalic acid, oxalic acid
- diol or ester-forming derivatives thereof include aliphatic glycols having 2 to 20 carbon atoms, that is, ethylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1, Fragrances such as 6-hexanediol, decamethylene glycol, cyclohexanedimethanol, cyclohexanediol, dimer diol, or long chain glycols having a molecular weight of 200 to 100,000, ie, polyethylene glycol, poly-1,3-propylene glycol, polytetramethylene glycol, etc.
- Group dioxy compounds, ie, 4,4′-dihydroxybiphenyl, hydroquinone, t-butylhydroquinone, bisphenol A, bisphenol S, bisphenol F and the like Such ester forming derivatives.
- Polymers or copolymers containing dicarboxylic acid or its ester-forming derivative and diol or its ester-forming derivative as structural units include polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polycyclohexanedimethylene terephthalate, polyhexylene terephthalate.
- Aromatic polyester resin polyethylene oxalate, polypropylene oxalate, polybutylene oxalate, polyethylene succinate, polypropylene succinate, polybutylene succinate, polyethylene adipate, polypropylene adipate, polybutylene adipate, polyneopentyl glycol adipate, polyethylene sebacate , Polypropylene sebake DOO, polybutylene sebacate, polyethylene succinate / adipate, polypropylene succinate / adipate, aliphatic polyester resins such as polybutylene succinate / adipate and the like.
- hydroxycarboxylic acid examples include glycolic acid, lactic acid, hydroxypropionic acid, hydroxybutyric acid, hydroxyvaleric acid, hydroxycaproic acid, hydroxybenzoic acid, p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, and these
- the polymer or copolymer having these as a structural unit examples include polyglycolic acid, polylactic acid, polyglycolic acid / lactic acid, polyhydroxybutyric acid / ⁇ -hydroxybutyric acid / ⁇ -hydroxyyoshide.
- Aliphatic polyester resins such as herbic acid can be mentioned.
- lactone examples include caprolactone, valerolactone, propiolactone, undecalactone, 1,5-oxepan-2-one, and the polymer or copolymer having these as structural units includes polycaprolactone.
- polyvalerolactone polypropiolactone
- polycaprolactone / valerolactone examples include polycaprolactone, polypropiolactone, polycaprolactone / valerolactone, and the like.
- a polymer or copolymer having a main structural unit of dicarboxylic acid or its ester-forming derivative and diol or its ester-forming derivative is preferable, and aromatic dicarboxylic acid or its ester-forming derivative and aliphatic diol.
- a polymer or copolymer having an ester-forming derivative as a main structural unit is more preferable, and an aliphatic diol selected from terephthalic acid or an ester-forming derivative thereof and ethylene glycol, propylene glycol, or butanediol or an ester-forming property thereof.
- a polymer or copolymer having a derivative as a main structural unit is more preferable, and among them, polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polycyclohexanedimethylene terephthalate, polyethylene naphthalate.
- the ratio of terephthalic acid or its ester-forming derivative to the total dicarboxylic acid in the polymer or copolymer having the above dicarboxylic acid or its ester-forming derivative and diol or its ester-forming derivative as the main structural unit is It is preferably 30 mol% or more, and more preferably 40 mol% or more.
- polyester resins in terms of hydrolysis resistance.
- the amount of carboxyl end groups of the polyester resin used in the present invention is not particularly limited, but is preferably 50 eq / t or less, more preferably 30 eq / t or less in terms of hydrolysis resistance and heat resistance. It is more preferably 20 eq / t or less, and particularly preferably 10 eq / t or less. The lower limit is 0 eq / t.
- the carboxyl end group amount of the polyester resin is a value measured by dissolving in an o-cresol / chloroform solvent and titrating with ethanolic potassium hydroxide.
- the amount of vinyl end groups of the polyester resin used in the present invention is not particularly limited, but is preferably 15 eq / t or less, more preferably 10 eq / t or less, and more preferably 5 eq / t or less in terms of color tone. More preferably.
- the lower limit is 0 eq / t.
- the amount of vinyl end groups of the polyester resin is a value measured by 1H-NMR using a deuterated hexafluoroisopropanol solvent.
- the amount of hydroxyl terminal groups of the polyester resin used in the present invention is not particularly limited, but is preferably 50 eq / t or more, more preferably 80 eq / t or more, and 100 eq / t or more in terms of moldability. More preferably, it is 120 eq / t or more.
- the upper limit is not particularly limited, but is 180 eq / t.
- the polyester resin is a value measured by 1 H-NMR using a deuterated hexafluoroisopropanol solvent.
- the viscosity of the polyester resin used in the present invention is not particularly limited, but the intrinsic viscosity when the o-chlorophenol solution is measured at 25 ° C. is preferably in the range of 0.36 to 1.60 dl / g. A range of 50 to 1.25 dl / g is more preferable.
- the molecular weight of the polyester resin used in the present invention is preferably in the range of weight average molecular weight (Mw) of 50,000 to 500,000, more preferably in the range of 100,000 to 300,000, from the viewpoint of heat resistance. A range of 10,000 to 250,000 is more preferable.
- the production method of the polyester resin used in the present invention is not particularly limited and can be produced by a known polycondensation method or ring-opening polymerization method, and may be either batch polymerization or continuous polymerization. Either a transesterification reaction or a reaction by direct polymerization can be applied, but continuous polymerization can be performed in that the amount of carboxyl end groups can be reduced and the effect of improving fluidity and hydrolysis resistance is increased. Direct polymerization is preferred from the viewpoint of cost.
- the polyester resin used in the present invention is a polymer or copolymer obtained by a condensation reaction mainly comprising a dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof
- a dicarboxylic acid Alternatively, an ester-forming derivative thereof and a diol or an ester-forming derivative thereof can be produced by an esterification reaction or an ester exchange reaction and then a polycondensation reaction.
- the polymerization reaction catalyst include methyl ester of titanic acid, Organic titanium such as tetra-n-propyl ester, tetra-n-butyl ester, tetraisopropyl ester, tetraisobutyl ester, tetra-tert-butyl ester, cyclohexyl ester, phenyl ester, benzyl ester, tolyl ester, or mixed esters thereof Compound, dibutyltin oxide, methylphenyltin oxide, tetraethyltin, hexaethylditin oxide, cyclohexahexylditin oxide, didodecyltin oxide, triethyltin hydroxide, Riphenyltin hydroxide, triisobutyltin acetate, dibutyltin diacetate, diphenyltin dilaurate, monobutyltin trich
- polymerization reaction catalysts may be used alone or in combination of two or more.
- the addition amount of the polymerization reaction catalyst is preferably in the range of 0.005 to 0.5 parts by weight, and 0.01 to 0.2 parts by weight with respect to 100 parts by weight of the polyester resin in terms of mechanical properties, moldability and color tone. A range of parts is more preferred.
- Polycarbonate resin is a resin having a carbonate bond, and is a polymer or copolymer obtained by reacting an aromatic hydroxy compound or a small amount of a polyhydroxy compound with a carbonate precursor.
- Aromatic hydroxy compounds include 2,2-bis (4-hydroxyphenyl) propane (commonly called bisphenol A), bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1 -Bis (4-hydroxyphenyl) cyclohexane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2, 2-bis (hydroxy-3-methylphenyl) propane, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone, hydroquinone, resorcinol, 4,6-dimethyl-2,4,6-tri (4 -Hydroxyphenyl) heptene,
- carbonate precursor carbonyl halide, carbonate ester, haloformate or the like is used, and specific examples include phosgene, diphenyl carbonate and the like.
- the molecular weight of the polycarbonate used in the present invention is not particularly limited, but from the viewpoint of excellent impact resistance and moldability, a ratio when 0.7 g of polycarbonate resin is dissolved in 100 ml of methylene chloride and measured at 20 ° C. Those having a viscosity of 0.1 to 4.0, particularly 0.5 to 3.0 are preferred, and those having a viscosity of 0.8 to 2.0 are most preferred.
- the styrenic resin used in the present invention means a resin composition obtained by polymerizing an aromatic vinyl monomer typified by styrene as one component of a monomer, such as acrylonitrile / styrene resin (AS resin) or acrylonitrile / Butadiene styrene (ABS resin) can be preferably used.
- the ABS resin used in the present invention is composed of a diene rubber, a vinyl cyanide monomer, an aromatic vinyl monomer, and other copolymerizable monomers as necessary, and the total amount of the monomers.
- diene rubber used in the present invention examples include polybutadiene rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene copolymer rubber, polyisoprene rubber, and the like. These may be used alone or in combination of two or more. Can do. Polybutadiene and / or styrene-butadiene copolymer rubber is preferably used.
- vinyl cyanide include acrylonitrile and methacrylonitrile. Among them, acrylonitrile is preferable.
- aromatic vinyl examples include styrene, ⁇ -methylstyrene, p-methylstyrene, pt-butylstyrene, and the like. Of these, styrene and / or ⁇ -methylstyrene are preferably used.
- Other monomers that can be copolymerized include ⁇ , ⁇ -unsaturated carboxylic acids such as acrylic acid and methacrylic acid, ⁇ , ⁇ such as methyl methacrylate, ethyl methacrylate, tert-butyl methacrylate, and cyclohexyl methacrylate.
- the composition of the ABS resin is not particularly limited, but 5 to 85 parts by weight of a diene rubber is preferable with respect to 100 parts by weight of the ABS resin from the viewpoint of molding processability and impact resistance of the resulting thermoplastic resin composition. More preferably, it is 15 to 75 parts by weight.
- the vinyl cyanide is preferably 5 to 50 parts by weight, particularly 7 to 45 parts by weight, and more preferably 8 to 40 parts by weight.
- the aromatic vinyl is preferably 10 to 90 parts by weight, particularly preferably 13 to 83 parts by weight, and more preferably 17 to 77 parts by weight.
- ABS resin There is no restriction
- the cyclic polyphenylene ether ketone means at least one phenylene ketone represented by the formula —Ph—CO— and at least one phenylene ether represented by the formula —Ph—O—. It is a cyclic compound represented by the following general formula (VI) having a repeating structural unit.
- Ph in the formula (VI) represents a para-phenylene group
- o and p are each an integer of 1 or more.
- the range of the number of repetitions m in formula (VI) is not particularly limited, but is preferably 2 to 40, more preferably 2 to 20, still more preferably 2 to 15, and 2 to 10 can be exemplified as a particularly preferable range. Since the melting point of the cyclic polyphenylene ether ketone tends to increase as the repeating number m increases, the repeating number m is preferably within the above range from the viewpoint of melting and dissolving the cyclic polyphenylene ether ketone at a low temperature.
- the cyclic polyphenylene ether ketone represented by the formula (VI) is preferably a mixture of cyclic polyphenylene ether ketones having at least three different repeating numbers m, and is a mixture having four or more repeating numbers m. It is more preferable that the mixture is composed of 5 or more repeating m. Furthermore, it is particularly preferable that these repeating numbers m are continuous. Compared with a single compound having a single repeating number m and a cyclic polyphenylene ether ketone mixture comprising two different repeating numbers m, the melting point of a mixture comprising three or more repeating numbers m tends to be low. The melting point of the mixture consisting of continuous repetitions m tends to be lower than that of the mixture consisting of continuous repetitions m.
- the cyclic polyphenylene ether ketone having a ring composition in the above range tends to lower the melting point of the cyclic polyphenylene ether ketone described later, and tends to improve the workability when added to a thermoplastic resin and various effects due to the addition. ,preferable.
- the cyclic polyphenylene ether ketone having each repeating number m can be divided by high performance liquid chromatography, and the cyclic composition of the cyclic polyphenylene ether ketone, that is, the cyclic having each repeating number m contained in the cyclic polyphenylene ether ketone.
- the weight fraction of polyphenylene ether ketone can be calculated from the peak area ratio of each cyclic polyphenylene ether ketone in high performance liquid chromatography.
- the cyclic polyphenylene ether ketone of the present invention has a melting point of 270 ° C. or lower, and has a feature that the melting point is significantly lower than the corresponding linear polyphenylene ether ketone.
- the melting point is preferably 250 ° C. or lower, more preferably 230 ° C. or lower, and even more preferably 200 ° C. or lower.
- the melting point of the cyclic polyphenylene ether ketone can be measured by observing the endothermic peak temperature using a differential scanning calorimeter.
- the cyclic polyphenylene ether ketone in the present invention is preferably a cyclic polyphenylene ether ketone composition containing 60% by weight or more of cyclic polyphenylene ether ketone, more preferably a composition containing 65% or more, and 70% or more. It is even more preferable that the composition contains 75% or more.
- an impurity component in the cyclic polyphenylene ether ketone composition that is, a component other than the cyclic polyphenylene ether ketone, linear polyphenylene ether ketone can be mainly exemplified.
- the melting point of the cyclic polyphenylene ether ketone tends to increase as the weight fraction of the linear polyphenylene ether ketone increases. Therefore, when the weight fraction of the cyclic polyphenylene ether ketone in the cyclic polyphenylene ether ketone composition is in the above range, it tends to be a cyclic polyphenylene ether ketone composition having a low melting point, and when added to the thermoplastic resin composition It is preferable that the weight fraction of cyclic polyphenylene ether ketone exists in the said range also from a viewpoint that the energy which processing requires can be reduced.
- the reduced viscosity ( ⁇ ) of the cyclic polyphenylene ether ketone of the present invention having the above-described characteristics can be preferably exemplified by 0.1 dL / g or less, more preferably 0.09 dL / g or less, More preferably, it is 0.08 dL / g or less.
- any method can be used as long as the cyclic polyphenylene ether ketone having the above-described characteristics can be produced.
- a preferred method (a) at least a dihalogenated aromatic ketone compound, a base, and an organic Production method by heating and reacting a mixture containing a polar solvent, (b) Production by heating and reacting a mixture containing at least a dihalogenated aromatic ketone compound, a base, a dihydroxy aromatic compound, and an organic polar solvent It is possible to use a method.
- dihalogenated aromatic ketone compound examples include 4,4′-difluorobenzophenone, 4,4′-dichlorobenzophenone, 4,4′-dibromobenzophenone, 4,4′-diiodobenzophenone, 4- Fluoro-4'-chlorobenzophenone, 4-fluoro-4'-bromobenzophenone, 4-fluoro-4'-iodobenzophenone, 4-chloro-4'-bromobenzophenone, 4-chloro-4'-iodobenzophenone, 4- Examples include bromo-4'-iodobenzophenone, 1,4-bis (4-fluorobenzoyl) benzene, 1,4-bis (4-chlorobenzoyl) benzene, and among these, 4,4'-difluorobenzophenone, 4 , 4'-dichlorobenzophenone, 1,4-bis (4-fluorobenzo ) Benzene and 1,4-
- Bases include alkaline metal carbonates such as lithium carbonate, sodium carbonate, potassium carbonate, rubidium carbonate, cesium carbonate, alkaline earth metal carbonates such as calcium carbonate, strontium carbonate, barium carbonate, lithium hydrogen carbonate, hydrogen carbonate
- Alkali metal bicarbonates such as sodium, potassium bicarbonate, rubidium bicarbonate, cesium bicarbonate, alkaline earth metal bicarbonates such as calcium bicarbonate, strontium bicarbonate, barium bicarbonate, or lithium hydroxide
- water Examples include alkali metal hydroxides such as sodium oxide, potassium hydroxide, rubidium hydroxide, cesium hydroxide, and alkaline earth metal hydroxides such as calcium hydroxide, strontium hydroxide, and barium hydroxide.
- Sodium carbonate carbonates such as potassium carbonate and sodium hydrogen carbonate, bicarbonates such as potassium hydrogen carbonate are preferable, sodium carbonate, potassium carbonate is used more preferably. These may be used alone or in combination of two or more.
- the alkali is preferably used in the form of an anhydride, but can also be used as a hydrate or an aqueous mixture.
- the aqueous mixture refers to an aqueous solution, a mixture of an aqueous solution and a solid component, or a mixture of water and a solid component.
- the organic polar solvent used in the production of the cyclic polyphenylene ether ketone of the present invention is not particularly limited as long as it does not substantially cause undesirable side reactions such as reaction inhibition and decomposition of the generated cyclic polyphenylene ether ketone. Absent. Specific examples of such organic polar solvents include N-methyl-2-pyrrolidone, N-methylcaprolactam, N, N-dimethylformamide, N, N-dimethylacetamide, 1,3-dimethyl-2-imidazolidinone.
- Nitrogen-containing polar solvents such as hexamethylphosphoramide and tetramethylurea, sulfoxide and sulfone solvents such as dimethyl sulfoxide, dimethyl sulfone, diphenyl sulfone and sulfolane, nitrile solvents such as benzonitrile, diaryl ethers such as diphenyl ether, Examples thereof include ketones such as benzophenone and acetophenone, and mixtures thereof. These are preferably used because of their high reaction stability. Among them, N-methyl-2-pyrrolidone and dimethyl sulfoxide are preferred, and N-methyl-2-pyrrolidone is particularly preferred. These organic polar solvents are excellent in stability in a high temperature region, and can be said to be preferable organic polar solvents from the viewpoint of availability.
- dihydroxy aromatic compound used in the present invention examples include hydroquinone, 4,4′-dihydroxybenzophenone, and 1,4-bis (4-hydroxybenzoyl) benzene. Hydroquinone or 4,4 ′ -Dihydroxybenzophenone is more preferred, and hydroquinone is particularly preferred. These dihydroxy aromatic compounds may be used alone or as a mixture of two or more.
- the amount of the organic polar solvent in the mixture when producing the cyclic polyphenylene ether ketone by the method according to the above production method (a) or (b) is preferably 1.15 with respect to 1.0 mol of the benzene ring component in the mixture.
- the upper limit of the amount of the organic polar solvent in the mixture is not particularly limited, but is preferably 100 liters or less, more preferably 50 liters or less, and more preferably 20 liters or less with respect to 1.0 mol of the benzene ring component in the mixture.
- Is more preferable, and 10 liters or less is particularly preferable.
- Increasing the amount of the organic polar solvent tends to improve the selectivity of cyclic polyphenylene ether ketone production, but if too much, the production amount of cyclic polyphenylene ether ketone per unit volume of the reaction vessel tends to decrease. Further, the time required for the reaction tends to increase. Therefore, from the viewpoint of achieving both the production selectivity of the cyclic polyphenylene ether ketone and the productivity, it is preferable that the use range of the organic polar solvent described above is used.
- the amount of the organic polar solvent here is based on the volume of the solvent under normal temperature and normal pressure.
- the amount of the organic polar solvent used in the reaction mixture is the amount of the organic polar solvent introduced into the reaction system during the dehydration operation. It is the amount obtained by subtracting the amount of the organic polar solvent excluded from the reaction system.
- the benzene ring component in the mixture here is a benzene ring component contained in a raw material that can become a cyclic polyphenylene ether ketone constituent by reaction, and the “number of moles” of the benzene ring component in these raw materials means “compound "Number of benzene rings constituting”.
- 4,4'-difluorobenzophenone has 2 moles of benzene ring component, 1 mole of hydroquinone has 1 mole of benzene ring component, and a mixture containing 1 mole of 4,4'-difluorobenzophenone and 1 mole of hydroquinone has 3 moles of benzene ring component.
- the component which cannot become a cyclic polyphenylene ether ketone constituent by reaction, such as toluene is considered as 0 mol of benzene ring components.
- the amount of base used in the method (a) for producing cyclic polyphenylene ether ketone by heating and reacting a mixture containing at least a dihalogenated aromatic ketone compound, a base, and an organic polar solvent is based on the dihalogenated aromatic ketone compound.
- the specific amount of the base used is, for example, A mole of a divalent base such as sodium carbonate or potassium carbonate, sodium bicarbonate or potassium bicarbonate.
- the amount of the monovalent base used is B mole, (A + 2B) with respect to 1.0 mole of the dihalogenated aromatic ketone compound used in producing the cyclic polyphenylene ether ketone by the production method (a). Is preferably in the range of 1.00 mol to 1.25 mol, and in the range of 1.00 mol to 1.15 mol Preparative more preferably, more preferred examples in a range of 1.10 mol 1.00 mol.
- the amount of base used in the production method (b) of cyclic polyphenylene ether ketone by heating and reacting a mixture containing at least a dihalogenated aromatic ketone compound, a base, a dihydroxy aromatic compound, and an organic polar solvent is:
- the ratio may be larger than the stoichiometric ratio with respect to the dihydroxy aromatic compound, and the specific amount of base used is such that (A + 2B) is in the range of 1.00 to 1.10 moles with respect to the dihydroxy aromatic compound. It is preferable that it is in the range of 1.00 mol to 1.05 mol, more preferably in the range of 1.00 to 1.03 mol.
- a base is added to supply an excess amount of the base. be able to.
- the excess amount of the supplied base is preferably such that (A + 2B) is in the range of 0 to 0.10 mol with respect to 1.0 mol of the dihydroxy aromatic compound used for producing the cyclic polyphenylene ether ketone. It is preferably in the range of -0.05 mol, more preferably in the range of 0-0.03 mol.
- the amount of the base used in producing the cyclic polyphenylene ether ketone is within these preferable ranges, so that the metal salt of the dihydroxy aromatic compound can be sufficiently produced, and a large excess It is preferable because the progress of an unfavorable reaction such as a decomposition reaction of the cyclic polyphenylene ether ketone produced by the base of the compound can be suppressed.
- the dihalogenated aromatic ketone compound used in the reaction, the base, the organic polar solvent, and the dihydroxyaromatic compound are diversified depending on the type and amount, and cannot be uniquely determined, but are usually 120 to 350 ° C., preferably 130 A range of -320 ° C, more preferably 140-300 ° C can be exemplified. In this preferable temperature range, a higher reaction rate tends to be obtained.
- the reaction may be either a one-step reaction performed at a constant temperature, a multi-stage reaction in which the temperature is raised stepwise, or a reaction in which the temperature is continuously changed.
- the reaction time depends on the type and amount of the raw material used or the reaction temperature, and thus cannot be specified unconditionally, but is preferably 0.1 hour or longer, more preferably 0.5 hour or longer, and further preferably 1 hour or longer. . By setting it as this preferable time or more, it exists in the tendency which can reduce an unreacted raw material component fully. On the other hand, the reaction time is not particularly limited, but the reaction proceeds sufficiently even within 40 hours, preferably within 10 hours, more preferably within 6 hours.
- the reaction When reacting by heating a mixture containing at least a dihalogenated aromatic ketone compound, a base, and an organic polar solvent, or heating a mixture containing at least a dihalogenated aromatic ketone compound, a base, a dihydroxy aromatic compound, and an organic polar solvent
- limiting in particular in the method of performing reaction it is preferable to carry out on stirring conditions.
- various known polymerization methods and reaction methods such as a batch method and a continuous method can be employed.
- the atmosphere in the production is preferably a non-oxidizing atmosphere, preferably in an inert atmosphere such as nitrogen, helium, and argon, and preferably in a nitrogen atmosphere in view of economy and ease of handling.
- the amount of water present in the system during the reaction is preferably 2.0% by weight or less, more preferably 1.0% by weight or less, and more preferably 0.5% by weight or less, The content is particularly preferably 0.1% by weight or less, and it is important to perform a dehydration operation as necessary so as to be within this preferable range.
- the amount of water present in the system is a weight fraction with respect to the total weight of the reaction mixture, and the amount of water can be measured by the Karl Fischer method.
- a) After mixing essential components in a manufacturing method (a) or (b), or (b) After mixing essential components other than a dihalogenated aromatic ketone compound it is preferable that
- a cyclic polyphenylene ether ketone is produced by adding a dihalogenated aromatic ketone compound or a dihalogenated aromatic ketone compound and an organic polar solvent after the dehydration operation.
- any method for removing water can be used as long as water can be removed from the reaction system, and examples thereof include dehydration by high-temperature heating and azeotropic distillation using an azeotropic solvent, and in particular, from the viewpoint of dehydration efficiency.
- a preferred method is an azeotropic distillation method.
- the azeotropic solvent used in the azeotropic distillation is an organic compound that can form an azeotropic mixture with water, and the boiling point of the azeotropic mixture is lower than the boiling point of the organic polar solvent used in the reaction.
- hydrocarbon solvents such as hexane, cyclohexane, heptane, benzene, toluene, and xylene
- inert chlorinated aromatic compounds such as chlorobenzene and dichlorobenzene.
- the amount of azeotropic solvent cannot be specified unconditionally because the amount required to form an azeotrope with water varies depending on the amount of water present in the system and the type of solvent. It is preferable to use an excess amount of solvent more than that required to remove water as an azeotrope, specifically 0.2 liters or more per 1.0 mole of dihalogenated aromatic ketone compound in the mixture.
- the upper limit of the amount of azeotropic solvent is not particularly limited, but it is preferably 20.0 liters or less, preferably 10.0 liters or less, relative to 1.0 mol of the dihalogenated aromatic ketone compound in the mixture. More preferably, it is more preferably 5.0 liters or less.
- the amount of the azeotropic solvent used is too large, the polarity of the mixture decreases, so that the efficiency of the reaction between the base and the dihalogenated aromatic ketone compound or the reaction between the base and the dihydroxy aromatic compound tends to decrease.
- the amount of the azeotropic solvent is based on the volume of the solvent under normal temperature and pressure.
- the amount of azeotropic solvent in the reaction system can always be kept constant, so the amount of azeotropic solvent used can be further reduced. It is.
- the temperature at which water is removed from the reaction system cannot be uniquely determined because the boiling point of the azeotrope with water differs depending on the type of azeotropic solvent, but it is above the boiling point of the azeotrope with water and is It is preferably below the boiling point of the organic polar solvent to be used, and specifically, a range of 60 to 170 ° C.
- the removal of water may be either a method of performing a constant temperature within a preferable temperature range, a method of increasing the temperature stepwise, or a method of changing the temperature continuously. Furthermore, it is also a preferable method to carry out the azeotropic distillation under reduced pressure. By performing the azeotropic distillation under reduced pressure, water tends to be removed more efficiently.
- the above azeotropic solvent is preferably excluded from the system after azeotropic distillation.
- the time for removing the azeotropic solvent from the system is preferably after the end of the azeotropic distillation of water.
- the removal of the azeotropic solvent is performed by dihalogenated aromatics. It is preferable to carry out the step before adding the ketone compound or the dihalogenated aromatic ketone compound and the organic polar solvent. If a large amount of the azeotropic solvent remains in the system, the polarity of the reaction system is lowered, and the reaction rate for producing the cyclic polyphenylene ether ketone tends to be reduced.
- the amount of azeotropic solvent present in the system during the cyclic polyphenylene ether ketone formation reaction is preferably 20% or less, preferably 10% or less, relative to the organic polar solvent used in the cyclic polyphenylene ether ketone formation reaction. More preferably, it is more preferably 8% or less, and particularly preferably 6% or less. It is important to remove the azeotropic solvent so that it is below this preferred range.
- a method for removing the azeotropic solvent a method by distillation is preferable, and an inert gas such as nitrogen, helium, or argon may be used as a carrier gas.
- the temperature at which the azeotropic solvent is removed may be any temperature as long as the azeotropic solvent can be excluded from the reaction system. Specifically, a range of 60 to 170 ° C. can be exemplified, preferably 100 to 170 ° C., more preferably. Can be exemplified by the range of 120 to 170 ° C, more preferably 140 to 170 ° C.
- the removal of the azeotropic solvent may be performed either at a constant temperature in a preferable temperature range, a method of increasing the temperature stepwise, or a type of continuously changing the temperature.
- the cyclic polyphenylene ether ketone composition of the present invention can be obtained by separating and recovering from the reaction mixture obtained by the production method described above.
- the reaction mixture obtained by the above production method contains at least cyclic polyphenylene ether ketone, linear polyphenylene ether ketone and an organic polar solvent, and other components include unreacted raw materials, by-product salts, water, azeotropic solvents, and the like. In some cases.
- There is no particular limitation on the method for recovering the cyclic polyphenylene ether ketone from such a reaction mixture For example, if necessary, a part or most of the organic polar solvent is removed by distillation or the like and then dissolved in the polyphenylene ether ketone component.
- the cyclic polyphenylene ether ketone is recovered as a mixed solid with the linear polyphenylene ether ketone by contacting with a solvent having a low solubility and being soluble in the by-product salt and having solubility in the by-product salt, if necessary.
- Solvents having such characteristics are generally relatively polar solvents, and preferred solvents differ depending on the type of organic polar solvent and by-product salt used, but are not limited.
- a treatment method using the above-mentioned solvent there is a method of mixing a solvent and a reaction mixture, and stirring or heating can be appropriately performed as necessary.
- the temperature at which the treatment with the solvent is performed is not particularly limited, but is preferably in the range of 20 to 220 ° C, more preferably in the range of 50 to 200 ° C. In such a range, for example, by-product salt can be easily removed, and the treatment can be performed at a relatively low pressure, which is preferable.
- the water when water is used as the solvent, the water is preferably distilled water or deionized water, but formic acid, acetic acid, propionic acid, butyric acid, chloroacetic acid, dichloroacetic acid, acrylic acid, crotonic acid, Organic acidic compounds such as benzoic acid, salicylic acid, oxalic acid, malonic acid, succinic acid, phthalic acid, fumaric acid and their alkali metal salts and alkaline earth metal salts, sulfuric acid, phosphoric acid, hydrochloric acid, carbonic acid, silicic acid, etc. It is also possible to use an aqueous solution containing an inorganic acidic compound and ammonium ions. If the mixed solid of cyclic polyphenylene ether ketone and linear polyphenylene ether ketone obtained after this treatment contains the solvent used in the treatment, it is possible to remove the solvent by drying, etc., if necessary. is there.
- the cyclic polyphenylene ether ketone is recovered as a mixture with the linear polyphenylene ether ketone to obtain a cyclic polyphenylene ether ketone composition.
- a method for separating and recovering cyclic polyphenylene ether ketone from this mixture for example, the difference in solubility between cyclic polyphenylene ether ketone and linear polyphenylene ether ketone is used.
- a solvent having a high solubility in cyclic polyphenylene ether ketone and a poor solubility in linear polyphenylene ether ketone may be removed by heating the cyclic polyphenylene ether ketone and linear polyphenylene as necessary.
- An example is a method of obtaining cyclic polyphenylene ether ketone as a solvent-soluble component by contacting with a mixture with ether ketone.
- linear polyphenylene ether ketone is known to have high crystallinity and very low solubility in solvents. Difference in solubility between cyclic polyphenylene ether ketone and linear polyphenylene ether ketone in solvent Therefore, cyclic polyphenylene ether ketone can be efficiently obtained by the separation method using the difference in solubility.
- the solvent used here is not particularly limited as long as it is a solvent capable of dissolving cyclic polyphenylene ether ketone.
- a solvent in which cyclic polyphenylene ether ketone dissolves in a dissolution environment but linear polyphenylene ether ketone is difficult to dissolve is preferable.
- a solvent that does not dissolve linear polyphenylene ether ketone is more preferable.
- the pressure of the reaction system when the mixture of the cyclic polyphenylene ether ketone and the linear polyphenylene ether ketone is brought into contact with the solvent is preferably normal pressure or slight pressure, and particularly preferably normal pressure.
- the reaction system pressure avoid pressurizing conditions that require expensive pressure resistant containers.
- the solvent to be used those which do not substantially cause undesired side reactions such as decomposition and crosslinking of the polyphenylene ether ketone component are preferable, and as a preferable solvent when the operation of bringing the mixture into contact with the solvent is performed, for example, under normal pressure reflux conditions
- hydrocarbon solvents such as pentane, hexane, heptane, octane, cyclohexane, cyclopentane, benzene, toluene, xylene, chloroform, bromoform, methylene chloride, 1,2-dichloroethane, 1,1,1-trichloroethane, chlorobenzene, Halogen solvents such as 2,6-dichlorotoluene, ether solvents such as diethyl ether, tetrahydrofuran, diisopropyl ether
- the atmosphere when the mixture of cyclic polyphenylene ether ketone and linear polyphenylene ether ketone is brought into contact with the solvent is preferably performed in a non-oxidizing atmosphere, and an inert gas atmosphere such as nitrogen, helium, or argon It is preferable to perform under a nitrogen atmosphere, and among these, it is particularly preferable to carry out in a nitrogen atmosphere from the viewpoints of economy and ease of handling.
- the temperature at which the mixture of the cyclic polyphenylene ether ketone and the linear polyphenylene ether ketone is brought into contact with the solvent is not particularly limited, but generally the higher the temperature, the more the dissolution of the cyclic polyphenylene ether ketone in the solvent tends to be promoted.
- the upper limit temperature is set to the reflux temperature under atmospheric pressure of the solvent used.
- a temperature range of 20 to 150 ° C. can be exemplified.
- the time for bringing the mixture of cyclic polyphenylene ether ketone and linear polyphenylene ether ketone into contact with the solvent varies depending on the type and temperature of the solvent used and cannot be uniquely limited. For example, it can be exemplified by 1 minute to 50 hours. In such a range, the cyclic polyphenylene ether ketone tends to be sufficiently dissolved in the solvent.
- a method for bringing the mixture into contact with the solvent may be a known general method, and is not particularly limited.
- a mixture of a cyclic polyphenylene ether ketone and a linear polyphenylene ether ketone and a solvent are mixed, and if necessary.
- Any method can be used such as a method of recovering the solution portion after stirring, a method of dissolving the cyclic polyphenylene ether ketone in the solvent at the same time as showering the solvent in the above mixture on various filters, or a method based on the Soxhlet extraction method principle.
- the amount of the solvent used when the mixture of the cyclic polyphenylene ether ketone and the linear polyphenylene ether ketone is brought into contact with the solvent is not particular limitation.
- a range of 0.5 to 100 in terms of a bath ratio with respect to the weight of the mixture can be exemplified.
- the bath ratio is in such a range, the mixture and the solvent are easily mixed uniformly, and the cyclic polyphenylene ether ketone tends to be sufficiently dissolved in the solvent.
- a larger bath ratio is advantageous for dissolving cyclic polyphenylene ether ketone in a solvent, but if it is too large, no further effect can be expected, and conversely an economic disadvantage due to an increase in the amount of solvent used may occur. is there.
- a sufficient effect is often obtained even with a small bath ratio, and the Soxhlet extraction method has a similar effect in principle, so in this case also with a small bath ratio. In many cases, sufficient effects can be obtained.
- the removal of the solvent can be exemplified by, for example, a method of heating and treating under normal pressure, or removal of the solvent using a membrane, but from the viewpoint of obtaining cyclic polyphenylene ether ketone more efficiently and efficiently.
- a method of removing the solvent by heating in the following is preferred.
- the solution containing the cyclic polyphenylene ether ketone obtained as described above may contain a solid depending on the temperature. However, since the solid in this case also belongs to the cyclic polyphenylene ether ketone, the solvent is removed.
- the solvent is preferably removed by at least 50% by weight or more, preferably 70% by weight or more, more preferably 90% by weight or more, and still more preferably 95% by weight or more.
- the temperature at which the solvent is removed by heating depends on the type of solvent used and cannot be uniquely limited. However, a temperature range of 20 to 150 ° C., preferably 40 to 120 ° C. can be selected.
- the pressure for removing the solvent is preferably normal pressure or lower, which makes it possible to remove the solvent at a lower temperature.
- Thermoplastic resin composition of the present invention is represented by (B) phenylene ketone represented by -Ph-CO- and -Ph-O- with respect to 100 parts by weight of the thermoplastic resin.
- a thermoplastic resin composition comprising 0.5 to 50 parts by weight of a cyclic polyphenylene ether ketone represented by the above general formula (VI) having a repeating phenylene ether as a structural unit.
- thermoplastic resin By blending cyclic polyphenylene ether ketone with the thermoplastic resin, it is possible to significantly reduce the melt viscosity of the thermoplastic resin, and the effect of improving the fluidity of the thermoplastic resin is exhibited. This is presumed to be due to the fact that the cyclic polyphenylene ether ketone does not have a terminal structure unlike a normal linear polymer, and therefore the entanglement between molecules is reduced. In addition, since the intermolecular interaction is small, the self-aggregation force is small, and it is easy to finely disperse in the thermoplastic resin. Furthermore, when blended with a resin having crystallinity, it acts as a crystal nucleating agent and promotes crystallization (the difference between the melting point and the crystallization temperature is reduced).
- the cyclic polyphenylene ether ketone retains the cyclic structure in the thermoplastic resin composition.
- the cyclic polyphenylene ether ketone is It is thought that it has not undergone chemical changes such as ring-opening reactions.
- the amount of cyclic polyphenylene ether ketone added is 0.5 to 50 parts by weight, preferably 0.5 to 20 parts by weight, more preferably 0.5 to 10 parts by weight.
- a fibrous and / or non-fibrous filler can be further blended.
- the blending amount is preferably 0.1 to 200 parts by weight, more preferably 0.5 to 200 parts by weight, based on 100 parts by weight of the thermoplastic resin (A) of the present invention.
- the filler content is preferably 1 to 150 parts by weight, more preferably 1 to 100 parts by weight.
- any filler such as fibrous, plate-like, powdery, and granular can be used.
- a fibrous filler such as is desirable.
- silicates such as talc, wollastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, bentonite, asbestos, alumina silicate, silicon oxide, magnesium oxide, alumina, Metal compounds such as zirconium oxide, titanium oxide and iron oxide, carbonates such as calcium carbonate, magnesium carbonate and dolomite, sulfates such as calcium sulfate and barium sulfate, glass beads, ceramic beads, boron nitride, silicon carbide, Non-fibrous fillers such as calcium phosphate, calcium hydroxide, magnesium hydroxide, aluminum hydroxide, glass flakes, glass powder, carbon black and silica, graphite, and montmorillonite, beidellite, nontronite, saponite Smectite clay minerals such as hectorite and soconite, various clay minerals such as vermiculite, halloysite, kanemite, various clay minerals such as vermiculite, hall
- the layered silicate may be a layered silicate in which exchangeable cations existing between layers are exchanged with organic onium ions, and examples of the organic onium ions include ammonium ions, phosphonium ions, and sulfonium ions. Of these, ammonium ions and phosphonium ions are preferred, and ammonium ions are particularly preferred.
- the ammonium ion may be any of primary ammonium, secondary ammonium, tertiary ammonium, and quaternary ammonium. Examples of primary ammonium ions include decyl ammonium, dodecyl ammonium, octadecyl ammonium, oleyl ammonium, benzyl ammonium and the like.
- Secondary ammonium ions include methyl dodecyl ammonium and methyl octadecyl ammonium.
- Tertiary ammonium ions include dimethyl dodecyl ammonium and dimethyl octadecyl ammonium.
- Quaternary ammonium ions include benzyltrialkylammonium ions such as benzyltrimethylammonium, benzyltriethylammonium, benzyltributylammonium, benzyldimethyldodecylammonium, benzyldimethyloctadecylammonium, trioctylmethylammonium, trimethyloctylammonium, trimethyldodecylammonium, trimethyloctadecyl.
- benzyltrialkylammonium ions such as benzyltrimethylammonium, benzyltriethylammonium, benzyltributylammonium, benzyldimethyldodecylammonium, benzyldimethyloctadecylammonium, trioctylmethylammonium, trimethyloctylammonium, trimethyldode
- alkyltrimethylammonium ions such as ammonium
- dimethyldialkylammonium ions such as dimethyldioctylammonium, dimethyldidodecylammonium, and dimethyldioctadecylammonium.
- alkyltrimethylammonium ions such as ammonium
- dimethyldialkylammonium ions such as dimethyldioctylammonium, dimethyldidodecylammonium, and dimethyldioctadecylammonium.
- aniline p-phenylenediamine, ⁇ -naphthylamine, p-aminodimethylaniline
- benzidine pyridine
- piperidine 6-aminocaproic acid
- 11-aminoundecanoic acid 11-aminoundecanoic acid
- 12-aminododecanoic acid etc.
- ammonium ions such as ammonium, di
- Layered silicates in which exchangeable cations existing between layers are exchanged with organic onium ions can be produced by reacting layered silicates having exchangeable cations between layers and organic onium ions by a known method. It can. Specifically, a method by an ion exchange reaction in a polar solvent such as water, methanol, ethanol, or a method by directly reacting a layered silicate with a liquid or melted ammonium salt may be used.
- glass fibers preferred are glass fibers, carbon fibers, talc, wollastonite, layered silicates such as montmorillonite and synthetic mica, and particularly preferred are glass fibers and carbon fibers.
- Two or more kinds of these fillers may be used in combination.
- the type of glass fiber is not particularly limited as long as it is generally used for reinforcing a resin, and can be selected from, for example, a long fiber type, a short fiber type chopped strand, a milled fiber, or the like.
- said filler can also be used in combination of 2 or more types.
- the surface of the filler used in the present invention has a known coupling agent (for example, silane coupling agent, titanate coupling agent), sizing agent (epoxy resin, phenol resin, etc.), other It can also be used after being treated with a surface treatment agent.
- the filler may be coated or focused with a thermoplastic resin such as an ethylene / vinyl acetate copolymer or a thermosetting resin such as an epoxy resin.
- the type of carbon fiber may be either a PAN-based or pitch-based carbon fiber, and may be selected from, for example, long fiber type roving or short fiber type chopped strand.
- one or more heat-resistant agents selected from phenolic and phosphorus compounds can be included.
- the blending amount of such a heat-resistant agent is preferably 0.01 parts by weight or more, particularly preferably 0.02 parts by weight or more, with respect to 100 parts by weight of the thermoplastic resin (A) of the present invention, from the viewpoint of the heat resistance improving effect. From the viewpoint of the gas component generated during molding, it is preferably 5 parts by weight or less, particularly 1 part by weight or less.
- a hindered phenolic compound is preferably used as the phenolic compound.
- Specific examples thereof include triethylene glycol-bis [3-t-butyl- (5-methyl-4-hydroxyphenyl) propionate], N, N ′. Hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide), tetrakis [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate] methane Pentaerythrityltetrakis [3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate], 1,3,5-tris (3,5-di-t-butyl-4- Hydroxybenzyl) -s-triazine-2,4,6- (1H, 3H, 5H) -trione, 1,1,3-tris (2-methyl-4- Droxy-5-tert-butylphenyl) butane
- N, N′-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide), tetrakis [methylene-3- (3 ′, 5′-di-t-butyl-4′- Hydroxyphenyl) propionate] methane and the like are preferably used.
- phosphorus compounds include bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol-di-phosphite, bis (2,4-di-t-butylphenyl) penta Erythritol di-phosphite, bis (2,4-di-cumylphenyl) pentaerythritol di-phosphite, tris (2,4-di-t-butylphenyl) phosphite, tetrakis (2 , 4-di-t-butylphenyl) -4,4'-bisphenylene phosphite, di-stearyl pentaerythritol di-phosphite, triphenyl phosphite, 3,5-di-butyl-4-hydroxybenzyl phosphite
- Examples thereof include phosphonate diethyl ester. Among them, those having a high melting
- thermoplastic resin composition of the present invention can be added to the thermoplastic resin composition of the present invention as long as the effects of the present invention are not impaired.
- Coupling agents such as organic titanate compounds and organic borane compounds, polyalkylene oxide oligomeric compounds, plasticizers such as thioether compounds, ester compounds and organic phosphorus compounds, crystal nuclei such as talc, kaolin and organic phosphorus compounds Agents, metal soaps such as montanic acid wax, lithium stearate, aluminum stearate, release agents such as ethylenediamine / stearic acid / sebacic acid polycondensate, silicone compounds, anti-coloring agents such as hypophosphite, In addition, usual additives such as lubricants, UV inhibitors, colorants, flame retardants, and foaming agents can be blended.
- thermoplastic resin composition of the present invention Any of the above compounds is not preferred if the amount exceeds 20 parts by weight with respect to 100 parts by weight of the entire thermoplastic resin composition of the present invention, because the original properties of the thermoplastic resin composition of the present invention are impaired. Addition of 1 part by weight or less is preferable.
- thermoplastic resin composition of the present invention is not particularly limited, but the mixture of raw materials is a single-screw or twin-screw extruder, Banbury mixer, kneader. Examples thereof include a method of supplying to a generally known melt mixer such as a mixing roll and kneading at a temperature of 200 to 400 ° C.
- the order of mixing the raw materials is not particularly limited, and after pre-blending the thermoplastic resin (A), cyclic polyphenylene ether ketone (B) and, if necessary, fillers and other additives, A method of uniformly melting and kneading with a single screw or twin screw extruder or a method of removing a solvent after mixing in a solution is used at a melting point of the cyclic polyphenylene ether ketone (B) or higher.
- a method of uniformly melting and kneading with a single-screw or twin-screw extruder is preferable, and in particular, the temperature is higher than the melting point of the thermoplastic resin using a twin-screw extruder, and the cyclic polyphenylene ether ketone (B).
- a method of uniformly kneading at a temperature equal to or higher than the melting point is preferably used.
- thermoplastic resin composition (A), cyclic polyphenylene ether ketone (B) and other necessary additives are added.
- a method of producing a thermoplastic resin composition by charging from the origin of the extruder and supplying the filler to the extruder using a side feeder is preferably used.
- thermoplastic resin composition of the present invention can be molded by any known method such as injection molding, extrusion molding, blow molding, press molding, spinning, etc. It can be processed and used in various molded products. As molded products, they can be used as injection molded products, extrusion molded products, blow molded products, films, sheets, fibers, and the like. As a method for producing the film, a known melt film forming method can be employed. For example, after melting the resin composition in a single-screw or twin-screw extruder, the resin composition is extruded from a film die and cooled on a cooling drum.
- Examples include a method for producing an unstretched film, or a uniaxial stretching method, a biaxial stretching method, etc., in which a film thus produced is appropriately stretched in the longitudinal and transverse directions using a roller-type longitudinal stretching apparatus and a transverse stretching apparatus called a tenter. Although it is possible, it is not particularly limited to this.
- the fiber it can be used as various fibers such as undrawn yarn, drawn yarn, and super-drawn yarn, and a known melt spinning method can be applied as a method for producing the fiber using the resin composition of the present invention.
- chips made of a resin composition as a raw material are kneaded while being fed to a single-screw or twin-screw extruder, and then spun through a polymer streamline changer installed at the tip of the extruder, a filtration layer, etc.
- a method of extruding from the die, cooling, stretching, heat setting and the like can be employed, but is not particularly limited thereto.
- the resin composition of the present invention taking advantage of its excellent fluidity, it can be processed into large injection molded products such as automobile parts and injection molded products having a thin part with a thickness of 0.01 to 1.0 mm. Is possible.
- thermoplastic resin composition the above-mentioned various molded products can be used for various uses such as automobile parts, electrical / electronic parts, building members, various containers, daily necessities, household goods and sanitary goods.
- Specific applications include air flow meters, air pumps, thermostat housings, engine mounts, ignition hobbins, ignition cases, clutch bobbins, sensor housings, idle speed control valves, vacuum switching valves, ECU housings, vacuum pump cases, inhibitor switches, rotations Sensor, Accelerometer, Distributor cap, Coil base, ABS actuator case, Radiator tank top and bottom, Cooling fan, Fan shroud, Engine cover, Cylinder head cover, Oil cap, Oil pan, Oil filter, Fuel cap, Fuel strainer , Distributor cap, vapor canister Automotive underhood parts such as uzing, air cleaner housing, timing belt cover, brake booster parts, various cases, various tubes, various tanks, various hoses, various clips, various valves, various pipes, torque control lever, safety belt parts, Car interior parts such as register blade, washer lever
- VTR parts TV parts, irons, hair dryers, rice cooker parts, microwave oven parts, acoustic parts, video camera, video equipment parts such as projectors, laser discs (registered trademark), compact discs (CD), CD-ROMs , CD-R, CD-RW, DVD-ROM, DVD-R, DVD-RW, DVD-RAM, Blu-ray disc and other optical recording media substrates, lighting parts, refrigerator parts, air conditioner parts, typewriter parts, word processor parts , Etc., home and office electrical appliance parts.
- projectors laser discs (registered trademark), compact discs (CD), CD-ROMs , CD-R, CD-RW, DVD-ROM, DVD-R, DVD-RW, DVD-RAM, Blu-ray disc and other optical recording media substrates
- lighting parts refrigerator parts, air conditioner parts, typewriter parts, word processor parts , Etc., home and office electrical appliance parts.
- Medical supplies such as medical supplies, non-woven fabric for medical use (stitching reinforcing material, anti-adhesion film, prosthetic repair material), wound dressing material, wound tape bandage, sticking material base fabric, surgical suture, fracture reinforcing material, medical film, etc.
- Various clothing such as composites, polo shirts, T-shirts, inners, uniforms, sweaters, socks, ties, curtains, chairs, carpets, tablecloths, futons, wallpaper, furoshiki and other interior goods, carrier tapes, prints, thermal Film for stencil printing, release film, porous film, container bag, credit card, cash card, ID card, IC card, paper, leather, nonwoven fabric, hot melt binder, magnetic material, zinc
- Binders optical elements, conductive embossed tape, C tray, golf tee, garbage bag, plastic bag, various nets, toothbrush, stationery, draining net, body towel, hand towel, tea pack, drainage filter, clear file, coating agent, adhesive, bag, chair, table, Useful as a cooler box, kumade, hose reel, planter, hose nozzle, dining table, desk surface, furniture panel, kitchen cabinet, pen cap, gas lighter, wire harness connector, SMJ connector, PCB connector, door grommet connector, etc. It is particularly useful as a connector for various automobiles.
- the thermoplastic resin composition of the present invention and a molded product comprising the same can be recycled.
- a resin composition obtained by pulverizing a resin composition and a molded product comprising the resin composition, preferably powdered, and then adding additives as necessary, is used in the same manner as the resin composition of the present invention. It can also be a molded product.
- the fraction was 21%.
- Cyclic polyphenylene ether ketone B-1 was confirmed to be a compound consisting of phenylene ether ketone units from the absorption spectrum in infrared spectroscopic analysis, and mass spectral analysis was performed by separating components by high performance liquid chromatography (apparatus; Hitachi M-1200H) Further, from the molecular weight information obtained by MALDI-TOF-MS, it was found that this white powder was a cyclic polyphenylene ether ketone mixture mainly composed of 5 types of cyclic polyphenylene ether ketones having a repeating number m of 2-6.
- components other than cyclic polyphenylene ether ketone in the cyclic polyphenylene ether ketone mixture were linear polyphenylene ether ketone oligomers.
- the reaction mixture was allowed to cool, pulverized, and washed several times with water and acetone to remove by-product salts and diphenylsulfone.
- the obtained polymer was dried at 120 ° C. in an air dryer to obtain Powder B-2.
- Examples 1 to 19, Comparative Examples 1 to 24 Each component was dry blended in the proportions shown in Tables 2 to 4, then supplied from the extruder main feeder, and set to the cylinder set temperature shown in the table with a TEX30 twin screw extruder manufactured by Nippon Steel. The gut discharged from the die was immediately cooled in a water bath and pelletized with a strand cutter. The pellets obtained in Examples 7, 8, 12, 16, and 17 and Comparative Examples 6 to 9, 16, 17, 21, and 22 were vacuum-dried at 80 ° C. for 12 hours, and the other pellets were 5 ° C. at 120 ° C. After drying with hot air for a period of time, the following evaluation was performed.
- Examples 20 to 25, Comparative Examples 25 to 31 After dry blending the thermoplastic resin component and the polyphenylene ether ketone of Reference Example 1 or 2 in the proportions shown in Table 5, they are supplied from the extruder main feeder, and the filler is supplied from the extruder side feeder. Using a TEX30 type twin screw extruder manufactured by the company, set the cylinder set temperature as shown in the table, melt knead at a screw rotation speed of 200 rpm, immediately cool the gut discharged from the die in a water bath, Pelletized. The pellets obtained in Examples 22 and 23 and Comparative Examples 28 and 29 were vacuum-dried at 80 ° C. for 12 hours, and the other pellets were hot-air dried at 120 ° C. for 5 hours, and then evaluated as follows.
- the polyphenylene ether ketone (B) used in this example or comparative example is as follows.
- thermoplastic resin is as follows.
- Tm ⁇ Tc 63 ° C.
- Tg 88 ° C.
- MFR 200 g / 10 min (315.5 ° C., 5 kg load) polyphenylene sulfide resin (M2588 manufactured by Toray Industries, Inc.)
- Tm ⁇ Tc 38 ° C.
- Tc 178 ° C.
- Tg 81 ° C., intrinsic viscosity 1.15 polyethylene terephthalate resin (T704T manufactured by Toray Industries, Inc.)
- Tm 226 ° C.
- Tc 188 ° C.
- A-7 Polycarbonate resin having a glass transition temperature of 152 ° C. and a total light transmittance of 89% (A2500 manufactured by Idemitsu Kosan Co., Ltd.)
- A-8 Transparent ABS resin having a glass transition temperature of 103 ° C.
- transparent ABS resin is a resin composed of a rubbery polymer and a styrene copolymer, so that a plurality of glass Although having a transition temperature, the melt processing temperature of the transparent ABS resin was determined by the glass transition temperature of 103 ° C. of the styrene copolymer as the matrix).
- the filler is as follows.
- C-1 Glass fiber (NEC Electric Glass ECS03T-790DE)
- C-2 Glass fiber (T-249 made by Nippon Electric Glass)
- C-3 Glass fiber (T-289 manufactured by Nippon Electric Glass)
- C-4 Glass fiber (Nittobo CS3J948)
- C-5 Glass fiber (Nippon Electric Glass T-747)
- C-6 Carbon fiber (TS12-006 manufactured by Toray)
- a capillary type melt viscosity measuring apparatus (CAPIROGRAPH-1C manufactured by Toyo Seiki Co., Ltd.) was used, and the pellet was put into the cylinder part for 5 minutes under the following conditions with a shear rate of 100 sec-1.
- the melt viscosity (Pa ⁇ s) measured after melting was used as a fluidity evaluation item.
- Polycarbonate resin Cylinder temperature 300 ° C., or
- Tc temperature drop crystallization temperature
- Tg glass transition temperature
- Tm melting point
- thermoplastic resin was injection molded using SG75H-MIV manufactured by Sumitomo Heavy Industries, Ltd. at a cylinder set temperature of the thermoplastic resin + 100 ° C. to 200 ° C. and a mold set temperature of 40 ° C.
- the total light transmittance of a molded product of 70 mm ⁇ 2 mm was measured under a temperature condition of 23 ° C. using a direct reading haze meter manufactured by Toyo Seiki Co., Ltd. The larger the transmittance, the better the transparency.
- thermoplastic resin composition of the present invention containing the cyclic polyphenylene ether ketone is compared with the thermoplastic resin containing no cyclic polyphenylene ether ketone or no linear polyphenylene ether ketone.
- the melt viscosity is remarkably lowered and the moldability is high.
- cyclic polyphenylene ether ketone is mix
- blended with an amorphous resin an effect of lowering melt viscosity can be obtained while maintaining transparency.
- the compounding amount of the cyclic polyphenylene ether ketone is less than 0.5 parts by weight, the above effect is not exhibited.
- the cyclic polyphenylene ether ketone has a low melting point compared to the linear polyphenylene ether ketone, is in a molten state at the thermoplastic resin processing temperature and is easy to be finely dispersed, and does not have a terminal structure. This can be attributed to the small intermolecular interaction.
- the effect of decreasing the melt viscosity by blending cyclic polyphenylene ether ketone is also prominently exhibited in the fiber reinforced thermoplastic resin composition blended with glass fiber and carbon fiber, and the effect is compared with the comparative example. it is obvious.
- the fiber reinforced thermoplastic resin composition blended with cyclic polyphenylene ether ketone has higher physical properties than the unblended fiber reinforced thermoplastic resin composition. This is presumed to be because the thermoplastic resin composition has been made to have a low viscosity by blending cyclic polyphenylene ether ketone, and as a result, the shear stress during melt-kneading was reduced, and the thermal degradation of the matrix resin and the breakage of the fibrous filler were suppressed. .
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Abstract
Description
(1)(A)熱可塑性樹脂100重量部に対し、(B)-Ph-CO-で表されるフェニレンケトンおよび-Ph-O-で表されるフェニレンエーテルを繰り返し構造単位に持つ下記一般式(I)で表される環状ポリフェニレンエーテルケトン0.5~50重量部を配合してなる熱可塑性樹脂組成物、
(2)前記(B)環状ポリフェニレンエーテルケトンが、一般式(I)における繰り返し数m=2~8の環状ポリフェニレンエーテルケトンの総重量を100%とした場合に、繰り返し数m=2および3のそれぞれの環状ポリフェニレンエーテルケトンをそれぞれ5重量%以上含む混合物であることを特徴とする上記(1)項に記載の熱可塑性樹脂組成物、
(3)前記(B)環状ポリフェニレンエーテルケトンが、少なくとも異なる3つ以上の繰り返し数mからなる環状ポリフェニレンエーテルケトン混合物であることを特徴とする上記(1)または(2)のいずれか1項に記載の熱可塑性樹脂組成物、
(4)前記(B)環状ポリフェニレンエーテルケトンが、下記一般式(II)で表される環状ポリフェニレンエーテルエーテルケトンであることを特徴とする上記(1)~(3)のいずれか1項に記載の熱可塑性樹脂組成物、
(5)前記(B)環状ポリフェニレンエーテルケトンの融点が270℃以下であることを特徴とする上記(1)~(4)のいずれか1項に記載の熱可塑性樹脂組成物、
(6)前記(B)環状ポリフェニレンエーテルケトンの融点が250℃以下であることを特徴とする上記(1)~(5)のいずれか1項に記載の熱可塑性樹脂組成物、
(7)前記(A)熱可塑性樹脂がポリフェニレンエーテルエーテルケトン樹脂、ポリフェニレンスルフィド樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリカーボネート樹脂およびポリスチレン系樹脂から選ばれる少なくとも1種であることを特徴とする上記(1)~(6)のいずれか1項に記載の熱可塑性樹脂組成物、
(8)さらに、(A)熱可塑性樹脂100重量部に対し(C)充填剤0.1~200重量部を配合してなる上記(1)~(7)のいずれか1項に記載の熱可塑性樹脂組成物、
(9)前記(C)充填剤が少なくとも繊維状充填剤を含むことを特徴とする上記(1)~(8)のいずれか1項に記載の熱可塑性樹脂組成物、
(10)前記(C)充填剤がガラス繊維および/または炭素繊維であることを特徴とする上記(9)に記載の熱可塑性樹脂組成物、
(11)上記(1)~(10)のいずれか1項に記載の樹脂組成物を溶融成形してなる成形品、を提供するものである。
本発明で用いられる熱可塑性樹脂(A)は、溶融成形可能な樹脂であればいずれでもよく、例えば、ポリアミド樹脂、ポリエステル樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリフェニレンエーテル樹脂、ポリフェニレンエーテル樹脂を他の樹脂とブレンドまたはグラフト重合させて変性させた変性ポリフェニレンエーテル樹脂、ポリアリレート樹脂、ポリスルホン樹脂、ポリフェニレンスルフィド樹脂、ポリエーテルスルホン樹脂、ポリケトン樹脂、ポリフェニレンエーテルケトン樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、熱可塑性ポリウレタン樹脂、高密度ポリエチレン樹脂、低密度ポリエチレン樹脂、直鎖状低密度ポリエチレン樹脂、ポリプロピレン樹脂、ポリメチルペンテン樹脂、環状オレフィン系樹脂、ポリ1-ブテン樹脂、ポリ1-ペンテン樹脂、ポリメチルペンテン樹脂、エチレン/α-オレフィン共重合体、(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体、(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体のカルボキシル基の少なくとも一部を金属塩化して得られるポリオレフィン、共役ジエンとビニル芳香族炭化水素のブロック共重合体、共役ジエンとビニル芳香族炭化水素のブロック共重合体の水素化物、ポリ塩化ビニル樹脂、ポリスチレン樹脂、ポリアクリル酸エステル樹脂、ポリメタクリル酸エステル樹脂などのアクリル樹脂、アクリロニトリルを主成分とするアクリロニトリル系共重合体、アクリロニトリル・ブタンジエン・スチレン(ABS)樹脂、アクリロニトリル・スチレン(AS)樹脂、酢酸セルロースなどのセルロース系樹脂、塩化ビニル/エチレン共重合体、塩化ビニル/酢酸ビニル共重合体、エチレン/酢酸ビニル共重合体、およびエチレン/酢酸ビニル共重合体のケン化物などが挙げられ、1種または2種以上併用してポリマーアロイとして用いてもよい。前記熱可塑性樹脂を不飽和カルボン酸、その酸無水物またはその誘導体から選ばれる少なくとも1種類の化合物で変性して用いることもできる。中でも、耐熱性、成形性および機械特性の点で、ポリフェニレンエーテルケトン樹脂、ポリフェニレンスルフィド樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ポリフェニレンエーテル樹脂、ABS樹脂、ポリオレフィン樹脂が好ましく、特に好ましくはポリフェニレンエーテルケトン樹脂、ポリフェニレンスルフィド樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリカーボネート樹脂、ABS樹脂が好ましく用いられる。
η={(t/t0)-1}/C
(ここでのtはサンプル溶液の通過秒数、t0は溶媒(98重量%濃硫酸)の通過秒数、Cは溶液の濃度を表す。)。
(a)583℃で焼成、冷却した白金皿にポリフェニレンスルフィド樹脂5~6gを秤量する。
(b)白金皿とともにポリフェニレンスルフィド樹脂を450~500℃で予備焼成する。
(c)583℃にセットしたマッフル炉に白金皿とともに予備焼成したポリフェニレンスルフィド試料を入れ、完全に灰化するまで約6時間焼成する。
(d)デシケーター内で冷却後、秤量する。
(e)式:灰分量(重量%)=(灰分の重量(g)/試料重量(g))×100により灰分量を算出する。
本発明における環状ポリフェニレンエーテルケトンとは、少なくとも1つの式-Ph-CO-で表されるフェニレンケトン、および少なくとも1つの式-Ph-O-で表されるフェニレンエーテルを繰り返し構造単位に持つ、下記一般式(VI)で表される環状化合物である。
本発明の樹脂組成物は、(A)熱可塑性樹脂100重量部に対し、(B)-Ph-CO-で表されるフェニレンケトンおよび-Ph-O-で表されるフェニレンエーテルを繰り返し構造単位に持つ、前記一般式(VI)で表される環状ポリフェニレンエーテルケトン0.5~50重量部を配合してなる熱可塑性樹脂組成物である。
本発明の熱可塑性樹脂組成物の製造方法は、特に限定されるものではないが、原料の混合物を単軸あるいは二軸の押出機、バンバリーミキサー、ニーダー、ミキシングロールなど通常公知の溶融混合機に供給して200~400℃の温度で混練する方法などを例として挙げることができる。また、原料の混合順序にも特に制限はなく、熱可塑性樹脂(A)、環状ポリフェニレンエーテルケトン(B)および必要に応じて充填剤およびその他の添加剤等を予めブレンドした後、熱可塑性樹脂と環状ポリフェニレンエーテルケトン(B)の融点以上において、単軸または二軸押出機で均一に溶融混練する方法、溶液中で混合した後に溶媒を除く方法などが用いられる。中でも生産性の点で、単軸または二軸押出機で均一に溶融混練する方法が好ましく、特に二軸押出機を用いて熱可塑性樹脂の融点以上であって、さらに環状ポリフェニレンエーテルケトン(B)の融点以上の温度において均一に溶融混練する方法が好ましく用いられる。
本発明の樹脂組成物は、通常公知の射出成形、押出成形、ブロー成形、プレス成形、紡糸などの任意の方法で成形することができ、各種成形品に加工し利用することができる。成形品としては、射出成形品、押出成形品、ブロー成形品、フィルム、シート、繊維などとして利用できる。フィルムの製造方法としては、公知の溶融製膜方法を採用することができ、例えば、単軸または2軸の押出機中で樹脂組成物を溶融後、フィルムダイより押出し、冷却ドラム上で冷却して未延伸フィルムを作成する方法、あるいは、このようにして作成したフィルムをローラー式の縦延伸装置とテンターと呼ばれる横延伸装置にて適宜縦横に延伸する一軸延伸法、二軸延伸法などが例示できるが、特にこれに限定されるものではない。
本発明において、上記各種成形品は、自動車部品、電気・電子部品、建築部材、各種容器、日用品、生活雑貨および衛生用品など各種用途に利用することができる。具体的な用途としては、エアフローメーター、エアポンプ、サーモスタットハウジング、エンジンマウント、イグニッションホビン、イグニッションケース、クラッチボビン、センサーハウジング、アイドルスピードコントロールバルブ、バキュームスイッチングバルブ、ECUハウジング、バキュームポンプケース、インヒビタースイッチ、回転センサー、加速度センサー、ディストリビューターキャップ、コイルベース、ABS用アクチュエーターケース、ラジエータタンクのトップ及びボトム、クーリングファン、ファンシュラウド、エンジンカバー、シリンダーヘッドカバー、オイルキャップ、オイルパン、オイルフィルター、フューエルキャップ、フューエルストレーナー、ディストリビューターキャップ、ベーパーキャニスターハウジング、エアクリーナーハウジング、タイミングベルトカバー、ブレーキブースター部品、各種ケース、各種チューブ、各種タンク、各種ホース、各種クリップ、各種バルブ、各種パイプなどの自動車用アンダーフード部品、トルクコントロールレバー、安全ベルト部品、レジスターブレード、ウオッシャーレバー、ウインドレギュレーターハンドル、ウインドレギュレーターハンドルのノブ、パッシングライトレバー、サンバイザーブラケット、各種モーターハウジングなどの自動車用内装部品、ルーフレール、フェンダー、ガーニッシュ、バンパー、ドアミラーステー、スポイラー、フードルーバー、ホイールカバー、ホイールキャップ、グリルエプロンカバーフレーム、ランプリフレクター、ランプベゼル、ドアハンドルなどの自動車用外装部品、ワイヤーハーネスコネクター、SMJコネクター、PCBコネクター、ドアグロメットコネクターなど各種自動車用コネクター、リレーケース、コイルボビン、光ピックアップシャーシ、モーターケース、ノートパソコンハウジングおよび内部部品、CRTディスプレーハウジングおよび内部部品、プリンターハウジングおよび内部部品、携帯電話、モバイルパソコン、ハンドヘルド型モバイルなどの携帯端末ハウジングおよび内部部品、記録媒体(CD、DVD、PD、FDDなど)ドライブのハウジングおよび内部部品、コピー機のハウジングおよび内部部品、ファクシミリのハウジングおよび内部部品、パラボラアンテナなどに代表される電気・電子部品を挙げることができる。更に、VTR部品、テレビ部品、アイロン、ヘアードライヤー、炊飯器部品、電子レンジ部品、音響部品、ビデオカメラ、プロジェクターなどの映像機器部品、レーザーディスク(登録商標)、コンパクトディスク(CD)、CD-ROM、CD-R、CD-RW、DVD-ROM、DVD-R、DVD-RW、DVD-RAM、ブルーレイディスクなどの光記録媒体の基板、照明部品、冷蔵庫部品、エアコン部品、タイプライター部品、ワードプロセッサー部品、などに代表される家庭・事務電気製品部品を挙げることができる。また電子楽器、家庭用ゲーム機、携帯型ゲーム機などのハウジングや内部部品、各種ギヤー、各種ケース、センサー、LEPランプ、コネクター、ソケット、抵抗器、リレーケース、スイッチ、コイルボビン、コンデンサー、バリコンケース、光ピックアップ、発振子、各種端子板、変成器、プラグ、プリント配線板、チューナー、スピーカー、マイクロフォン、ヘッドホン、小型モーター、磁気ヘッドベース、パワーモジュール、半導体、液晶、FDDキャリッジ、FDDシャーシ、モーターブラッシュホルダー、トランス部材、コイルボビンなどの電気・電子部品、サッシ戸車、ブラインドカーテンパーツ、配管ジョイント、カーテンライナー、ブラインド部品、ガスメーター部品、水道メーター部品、湯沸かし器部品、ルーフパネル、断熱壁、アジャスター、プラ束、天井釣り具、階段、ドアー、床などの建築部材、釣り糸、漁網、海藻養殖網、釣り餌袋などの水産関連部材、植生ネット、植生マット、防草袋、防草ネット、養生シート、法面保護シート、飛灰押さえシート、ドレーンシート、保水シート、汚泥・ヘドロ脱水袋、コンクリート型枠などの土木関連部材、歯車、ねじ、バネ、軸受、レバー、キーステム、カム、ラチェット、ローラー、給水部品、玩具部品、ファン、テグス、パイプ、洗浄用治具、モーター部品、顕微鏡、双眼鏡、カメラ、時計などの機械部品、マルチフィルム、トンネル用フィルム、防鳥シート、植生保護用不織布、育苗用ポット、植生杭、種紐テープ、発芽シート、ハウス内張シート、農ビの止め具、緩効性肥料、防根シート、園芸ネット、防虫ネット、幼齢木ネット、プリントラミネート、肥料袋、試料袋、土嚢、獣害防止ネット、誘因紐、防風網などの農業部材、紙おむつ、生理用品包材、綿棒、おしぼり、便座ふきなどの衛生用品、医療用不織布(縫合部補強材、癒着防止膜、人工器官補修材)、創傷被服材、キズテープ包帯、貼符材基布、手術用縫合糸、骨折補強材、医療用フィルムなどの医療用品、カレンダー、文具、衣料、食品等の包装用フィルム、トレイ、ブリスター、ナイフ、フォーク、スプーン、チューブ、プラスチック缶、パウチ、コンテナー、タンク、カゴなどの容器・食器類、ホットフィル容器類、電子レンジ調理用容器類化粧品容器、ラップ、発泡緩衝剤、紙ラミ、シャンプーボトル、飲料用ボトル、カップ、キャンディ包装、シュリンクラベル、蓋材料、窓付き封筒、果物かご、手切れテープ、イージーピール包装、卵パック、HDD用包装、コンポスト袋、記録メディア包装、ショッピングバック、電気・電子部品等のラッピングフィルムなどの容器・包装、天然繊維複合、ポロシャツ、Tシャツ、インナー、ユニホーム、セーター、靴下、ネクタイなどの各種衣料、カーテン、イス貼り地、カーペット、テーブルクロス、布団地、壁紙、ふろしきなどのインテリア用品、キャリアーテープ、プリントラミ、感熱孔版印刷用フィルム、離型フィルム、多孔性フィルム、コンテナバッグ、クレジットカード、キャッシュカード、IDカード、ICカード、紙、皮革、不織布等のホットメルトバインダー、磁性体、硫化亜鉛、電極材料等粉体のバインダー、光学素子、導電性エンボステープ、ICトレイ、ゴルフティー、ゴミ袋、レジ袋、各種ネット、歯ブラシ、文房具、水切りネット、ボディタオル、ハンドタオル、お茶パック、排水溝フィルター、クリアファイル、コート剤、接着剤、カバン、イス、テーブル、クーラーボックス、クマデ、ホースリール、プランター、ホースノズル、食卓、机の表面、家具パネル、台所キャビネット、ペンキャップ、ガスライターなどとして有用であり、ワイヤーハーネスコネクター、SMJコネクター、PCBコネクター、ドアグロメットコネクターなど各種自動車用コネクターとして特に有用である。
また、本発明の熱可塑性樹脂組成物およびそれからなる成形品はリサイクルすることが可能である。例えば、樹脂組成物およびそれからなる成形品を粉砕し、好ましくは粉末状とした後、必要に応じて添加剤を配合して得られる樹脂組成物は、本発明の樹脂組成物と同じように使用でき、成形品とすることも可能である。
撹拌装置を備えたオートクレーブ装置に、4,4’-ジフルオロベンゾフェノン1.1kg(5mol)、ヒドロキノン0.55kg(5mol)、無水炭酸カリウム0.69kg(5mol)、N-メチル-2-ピロリドン50Lを仕込んだ。混合物中のベンゼン環成分1.0モルに対するN-メチル-2-ピロリドンの量は3.33リットルである。反応器内を窒素置換した後、145℃まで昇温し、145℃で1時間保持、その後185℃にまで昇温し185℃で3時間保持、さらに250℃にまで昇温し250℃で2時間保持して反応を行った。反応終了後、室温にまで冷却して反応混合物を調製した。
攪拌機、窒素吹き込み管、ディーン・スターク装置、冷却管、温度計を具備した4つ口フラスコに4,4’-ジフルオロベンゾフェノン22.5g(103mmol)、ヒドロキノン11.0g(100mmol)、およびジフェニルスルホン49gを仕込んだ。混合物中のベンゼン環成分1.0モルに対するジフェニルスルホンの量は約0.16リットルである。窒素を通じながら140℃にまで昇温したところ、ほぼ無色の溶液を形成した。この温度で無水炭酸ナトリウム10.6g(100mmol)及び無水炭酸カリウム0.28g(2mmol)を加えた。温度を200℃に上げて1時間保持し、250℃に上げて1時間保持し、次いで315℃に上げて2時間保持した。
装置 :島津株式会社製 LC-10Avpシリーズ
カラム :Mightysil RP-18GP150-4.6
検出器 :フォトダイオードアレイ検出器(UV=270nmを使用)
流速 :1.0mL/min
カラム温度 :40℃
サンプル :0.1重量%THF溶液
移動相 :THF/0.1w%トリフルオロ酢酸水溶液。
粘度計 :オストワルド型粘度計
溶媒 :98重量%硫酸
サンプル濃度 :0.1g/dL(サンプル重量/溶媒容量)
測定温度 :25℃
還元粘度計算式 :η={(t/t0)-1}/C
t :サンプル溶液の通過秒数
t0 :溶媒の通過秒数
C :溶液の濃度。
ポリフェニレンエーテルケトンの融点は、セイコー電子工業製ロボットDSC RDC220を用い、窒素雰囲気下、下記測定条件で測定を行った。
・50℃×1分 ホールド
・50℃から360℃へ昇温,昇温速度20℃/分
各成分を表2~4に記載の各割合でドライブレンドした後、押出機メインフィーダーより供給し、日本製鋼所社製TEX30型2軸押出機で、表に記載のシリンダー設定温度に設定して、スクリュー回転数200rpmで溶融混練を行い、ダイから吐出されるガットは即座に水浴にて冷却し、ストランドカッターによりペレット化した。実施例7、8、12、16、17および比較例6~9、16、17、21、22で得られたペレットは、80℃で12時間真空乾燥し、それら以外のペレットは120℃で5時間熱風乾燥した後、下記の評価を行った。
熱可塑性樹脂成分および参考例1または2のポリフェニレンエーテルケトンを表5に記載の各割合でドライブレンドした後、押出機メインフィーダーより供給し、充填剤を押出機サイドフィーダーより供給し、日本製鋼所社製TEX30型2軸押出機で、表に記載のシリンダー設定温度に設定して、スクリュー回転数200rpmで溶融混練を行い、ダイから吐出されるガットは即座に水浴にて冷却し、ストランドカッターによりペレット化した。実施例22、23および比較例28、29で得られたペレットは、80℃で12時間真空乾燥し、それら以外のペレットは120℃で5時間熱風乾燥した後、下記の評価を行った。
B-1:参考例1
B-2:参考例2
A-1:Tm=338℃、Tc=287℃(Tm-Tc=51℃)、Tg=143℃のポリフェニレンエーテルエーテルケトン樹脂(ビクトレックス製450G)
A-2:Tm=278℃、Tc=215℃(Tm-Tc=63℃)、Tg=88℃、MFR=200g/10分(315.5℃、5kg荷重)のポリフェニレンスルフィド樹脂(東レ製M2588)
A-3:Tm=225℃、Tc=177℃(Tm-Tc=48℃)、Tg=58℃、98%硫酸中濃度1g/dlでの相対粘度2.80のナイロン6樹脂(東レ製CM1010)
A-4:Tm=265℃、Tc=227℃(Tm-Tc=38℃)、Tg=63℃、98%硫酸1中濃度g/dlでの相対粘度2.95のナイロン66樹脂(東レ製CM3001N)
A-5:Tm=255℃、Tc=178℃(Tm-Tc=77℃)、Tg=81℃、固有粘度1.15のポリエチレンテレフタレート樹脂(東レ製T704T)
A-6:Tm=226℃、Tc=188℃(Tm-Tc=38℃)、Tg=25℃、固有粘度0.85のポリブチレンテレフタレート樹脂(東レ製1100S)
A-7:ガラス転移温度152℃、全光線透過率89%のポリカーボネート樹脂(出光興産製A2500)
A-8:ガラス転移温度103℃、全光線透過率87%の透明ABS樹脂(東レ製920)(透明ABS樹脂は、ゴム質重合体とスチレン系共重合体からなる樹脂であるため複数のガラス転移温度を有するが、マトリックスであるスチレン系共重合体のガラス転移温度103℃により透明ABS樹脂の溶融加工温度を決定した)。
C-1:ガラス繊維(日本電気硝子製ECS03T-790DE)
C-2:ガラス繊維(日本電気硝子製T-249)
C-3:ガラス繊維(日本電気硝子製T-289)
C-4:ガラス繊維(日東紡績製CS3J948)
C-5:ガラス繊維(日本電気硝子製T-747)
C-6:炭素繊維(東レ製TS12-006)
流動性を評価するため、キャピラリー型溶融粘度測定装置(東洋精機社製CAPIROGRAPH-1C)を用いて、以下の条件で、剪断速度100sec-1の条件下、ペレットをシリンダー部に投入後、5分間溶融させた後に測定した溶融粘度(Pa・s)を流動性評価項目とした。
・ポリフェニレンエーテルエーテルケトン樹脂:シリンダー温度400℃、オリフィスL/D=20mm(内径1mm)
・ポリフェニレンスルフィド樹脂:シリンダー温度300℃、オリフィスL/D=20mm(内径1mm)
・ナイロン6樹脂:シリンダー温度250℃、オリフィスL/D=10mm(内径1mm)
・ナイロン6,6樹脂:シリンダー温度290℃、オリフィスL/D=10mm(内径1mm)
・ポリブチレンテレフタレート樹脂:シリンダー温度250℃、オリフィスL/D=20mm(内径1mm)
・ポリエチレンテレフタレート樹脂:シリンダー温度280℃、オリフィスL/D=20mm(内径1mm)
・ポリカーボネート樹脂:シリンダー温度300℃、オリフィスL/D=10mm(内径1mm)
・ABS樹脂:シリンダー温度220℃、オリフィスL/D=10mm(内径0.5mm)。
TAインスツルメント社製Q200型示差走査熱量測定(DSC)装置を用いて熱的特性を測定した。下記測定条件を用い、降温結晶化温度(Tc)およびガラス転移温度(Tg)は1st Runの値を、融点(Tm)は2nd Runの値を用いた。Tm-Tcの値を結晶化特性を示す指標とし、この値が小さいほど結晶化速度が速い。
First Run
・50℃×1分 ホールド
・50℃から融点+20℃へ昇温,昇温速度20℃/分
・融点+20℃×1分 ホールド
・融点+20℃からガラス転移温度+20℃へ降温,降温速度20℃/分(この時の結晶化ピーク温度をTcとする)
Second Run
・ガラス転移温度+20℃×1分 ホールド
・ガラス転移温度+20℃から融点+20℃へ昇温,昇温速度20℃/分(この時の融解ピーク温度をTmとする)。
得られた熱可塑性樹脂を熱可塑性樹脂のガラス転移温度+100℃~200℃のシリンダー設定温度、金型設定温度40℃で住友重機社製SG75H-MIVを用いて射出成形し、得られた70mm×70mm×2mmの成形品を東洋精機(株)製直読ヘイズメーターを用いて、23℃の温度条件で全光線透過率を測定した。透過率が大きいほど透明性に優れることを示している。
ASTM D-638に準じて、試験機テンシロンUTA-2.5T(オリエンテック製)により、ASTM1号ダンベル試験片を室温23℃、湿度50%の恒温室内にて、試料評点間距離114mm、歪み速度10mm/minで引張試験を行った。なお、ダンベル試験片は射出成形(住友重機社製SG75H-MIV)により調製した。
Claims (11)
- 前記(B)環状ポリフェニレンエーテルケトンが、一般式(I)における繰り返し数m=2~8の環状ポリフェニレンエーテルケトンの総重量を100%とした場合に、繰り返し数m=2および3のそれぞれの環状ポリフェニレンエーテルケトンをそれぞれ5重量%以上含む混合物であることを特徴とする請求項1に記載の熱可塑性樹脂組成物。
- 前記(B)環状ポリフェニレンエーテルケトンが、少なくとも異なる3つ以上の繰り返し数mからなる環状ポリフェニレンエーテルケトン混合物であることを特徴とする請求項1または2のいずれか1項に記載の熱可塑性樹脂組成物。
- 前記(B)環状ポリフェニレンエーテルケトンの融点が270℃以下であることを特徴とする請求項1~4のいずれか1項に記載の熱可塑性樹脂組成物。
- 前記(B)環状ポリフェニレンエーテルケトンの融点が250℃以下であることを特徴とする請求項1~5のいずれか1項に記載の熱可塑性樹脂組成物。
- 前記(A)熱可塑性樹脂がポリフェニレンエーテルエーテルケトン樹脂、ポリフェニレンスルフィド樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリカーボネート樹脂およびポリスチレン系樹脂から選ばれる少なくとも1種であることを特徴とする請求項1~6のいずれか1項に記載の熱可塑性樹脂組成物。
- さらに、(A)熱可塑性樹脂100重量部に対し(C)充填剤0.1~200重量部を配合してなる請求項1~7のいずれか1項に記載の熱可塑性樹脂組成物。
- 前記(C)充填剤が少なくとも繊維状充填剤を含むことを特徴とする請求項1~8のいずれか1項に記載の熱可塑性樹脂組成物。
- 前記(C)充填剤がガラス繊維および/または炭素繊維であることを特徴とする請求項9に記載の熱可塑性樹脂組成物。
- 請求項1~10のいずれか1項に記載の樹脂組成物を溶融成形してなる成形品。
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CN107109027A (zh) * | 2014-10-30 | 2017-08-29 | 旭玻璃纤维股份有限公司 | 透明abs树脂组合物 |
US20170335088A1 (en) * | 2014-10-30 | 2017-11-23 | Asahi Fiber Glass Co., Ltd. | Transparent abs resin composition |
US10774200B2 (en) * | 2014-10-30 | 2020-09-15 | Asahi Fiber Glass Co., Ltd. | Transparent ABS resin composition |
JP7133912B2 (ja) | 2017-06-30 | 2022-09-09 | 三井化学株式会社 | 金属/樹脂複合構造体および金属/樹脂複合構造体の製造方法 |
Also Published As
Publication number | Publication date |
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CN103403098A (zh) | 2013-11-20 |
EP2682255A4 (en) | 2014-01-08 |
CN103403098B (zh) | 2014-11-12 |
TW201241087A (en) | 2012-10-16 |
AU2012224318A1 (en) | 2013-09-12 |
AU2012224318B2 (en) | 2015-12-03 |
JP5077500B2 (ja) | 2012-11-21 |
TWI447171B (zh) | 2014-08-01 |
KR101340406B1 (ko) | 2013-12-11 |
EP2682255A1 (en) | 2014-01-08 |
KR20130102657A (ko) | 2013-09-17 |
EP2682255B1 (en) | 2015-12-16 |
JPWO2012117840A1 (ja) | 2014-07-07 |
US20130331500A1 (en) | 2013-12-12 |
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