WO2012091494A2 - 기판 검사방법 - Google Patents
기판 검사방법 Download PDFInfo
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- WO2012091494A2 WO2012091494A2 PCT/KR2011/010316 KR2011010316W WO2012091494A2 WO 2012091494 A2 WO2012091494 A2 WO 2012091494A2 KR 2011010316 W KR2011010316 W KR 2011010316W WO 2012091494 A2 WO2012091494 A2 WO 2012091494A2
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- observation area
- height
- substrate
- measurement module
- previous
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
Definitions
- the present invention relates to a substrate inspection method, and more particularly, to a substrate inspection method for increasing the reliability of the inspection process for inspecting the formation state of the measurement object formed on the substrate.
- At least one projection unit for irradiating pattern light to the measurement object including an illumination source and a grid element, and photographing the image of the measurement object through irradiation of the pattern light
- a measurement module including a camera to be used.
- the substrate inspection apparatus may measure the entire area of the substrate in one step. However, when the size of the substrate is larger than the field of view (FOV) of the camera, the substrate inspection apparatus divides the substrate into a plurality of observation regions. Can be measured sequentially over.
- FOV field of view
- the substrate loaded on the substrate inspection apparatus maintains both ends fixed by the stage. Accordingly, as the size of the substrate increases, warpage occurs in the substrate, and height deviation occurs for each of the plurality of observation regions. In general, since the substrate inspection apparatus has a measurable range in which the height can be measured, if the height deviation due to the warpage of the substrate exceeds the height measurable range, the height measurement may not be properly performed. have.
- the displacement amount of each observation region is measured in advance through a separate laser rangefinder, and the height of the measurement module is reset for each observation region.
- the board inspection time is increased according to the height displacement measurement in advance.
- the present invention has been made in view of such a problem, and the present invention adjusts the height of the measurement module for the next observation region to be inspected by using the height trend information of at least one previous observation region that has been inspected.
- a substrate inspection method that can shorten the measurement time.
- the present invention provides a substrate inspection method that can increase the measuring range of the height in response to the bending of the substrate by performing the substrate inspection using the first pattern light and the second pattern light having different wavelengths.
- the present invention provides a substrate inspection method capable of more accurately predicting the amount of height displacement with respect to the target observation region by setting a dummy observation region between the target observation region and the previous observation region when the observation regions are far apart.
- the present invention when the substrate is carried through a substrate transfer mechanism such as a tray or a jig, by correcting the height of the camera by the amount of height displacement of the substrate by the substrate transfer mechanism, the substrate that can further improve the reliability of substrate inspection Provide inspection methods.
- a region of interest (ROI) in which an object of measurement actually exists in the observation area is biased to one side, a dummy region of interest for confirming the bottom trend is set in the observation area, thereby providing Provides a substrate inspection method that can improve the reliability.
- ROI region of interest
- a method for inspecting a substrate includes a plurality of substrates using a measurement module including at least one projection unit for irradiating pattern illumination with a substrate fixed to a stage and a camera for capturing an image of the substrate.
- the height displacement amount of the target observation area may be estimated using extrapolation from the trend information of the previous observation area.
- estimating a height displacement amount of the target observation area may include height of the target observation area using height information of at least two previous observation areas existing on the same row corresponding to the longitudinal direction of the stage. Predict displacement.
- estimating a height displacement amount of the target observation area may include: using the height information of at least three previous observation areas on the same row and the previous row corresponding to the longitudinal direction of the stage, to observe the target; Predict the height displacement of the area.
- the trend information for the previous observation area may be calculated using a height information of at least one ROI existing in the previous observation area, and use the plane equation as trend information. Can be.
- the height of the measuring module may be adjusted in any one of before, after, and during the transfer of the measuring module to the target observation area.
- the height of the measurement module may be adjusted based on the height displacement of the center point of the target observation area and the previous observation area.
- the measurement module may include at least one first projection unit irradiating a first pattern light having a first wavelength, and at least one second projection unit irradiating a second pattern light having a second wavelength different from the first wavelength. It may include. In contrast, the projection unit may sequentially irradiate the first and second pattern lights having different wavelengths.
- Substrate inspection method a plurality of substrates by using a measurement module including at least one projection unit for irradiating pattern illumination to a substrate fixed to the stage and a camera for taking an image of the substrate
- a method of inspecting a substrate by sequentially dividing the observation areas into FOVs comprising: setting an inspection order for the plurality of observation areas, at least one dummy observation between a target observation area and a previous observation area; Setting an area, estimating a height displacement with respect to the target observation area using trend information of at least one of the dummy observation area and the previous observation area, and calculating the estimated height displacement with respect to the target observation area.
- Adjusting the height of the measuring module based on the height of the measuring module; Use comprises the step of inspecting the observation target region.
- the planar equation may be used as trend information.
- the measurement module may include at least one first projection unit irradiating a first pattern light having a first wavelength, and at least one second projection unit irradiating a second pattern light having a second wavelength different from the first wavelength. It may include. In contrast, the projection unit may sequentially irradiate the first and second pattern lights having different wavelengths.
- a method for inspecting a substrate may include at least one of irradiating pattern illumination with a substrate mounted on the substrate transport mechanism when the substrate is fixed to the stage while the substrate transport mechanism is mounted on the substrate transport mechanism.
- the substrate inspecting method may further include, in inspecting the plurality of observation regions according to the inspection order, using the trend information of at least one previous observation region that has been inspected for the next observation region to be inspected. Predicting the height displacement amount for the observation area, adjusting the height of the measurement module based on the predicted height displacement amount with respect to the target observation area, and using the measurement module in which the height adjustment is completed, the target observation area.
- the method may further include checking.
- the trend information for the previous observation area may be calculated using a height information of at least one ROI existing in the previous observation area, and use the plane equation as trend information. Can be.
- the measurement module may include at least one first projection unit irradiating a first pattern light having a first wavelength, and at least one second projection unit irradiating a second pattern light having a second wavelength different from the first wavelength. It may include. In contrast, the projection unit may sequentially irradiate the first and second pattern lights having different wavelengths.
- Substrate inspection method the substrate using a measurement module including at least one projection unit for irradiating the pattern light to the substrate fixed to the stage and a camera for taking an image of the substrate,
- a method for inspecting a substrate by sequentially dividing a into a plurality of observation areas (FOV), and determining whether there is at least one previous observation area close to the target observation area to be inspected next. Adjusting the focus by moving the Z axis of the measurement module to an initial position if the previous observation region does not exist, and using the trend information of the previous observation region in the target observation region if the previous observation region exists. Estimating the Z axis transfer position of the measurement module, and transferring the Z axis of the measurement module to the estimated transfer position. Adjusting the focus, and using the measuring module, the focus adjustment is completed, and a step of inspecting the observation target region.
- FOV observation areas
- the measurement module may include at least one first projection unit irradiating a first pattern light having a first wavelength, and at least one second projection unit irradiating a second pattern light having a second wavelength different from the first wavelength. It may include. In contrast, the projection unit may sequentially irradiate the first and second pattern lights having different wavelengths.
- a method for inspecting a substrate includes a plurality of substrates using a measurement module including at least one projection unit for irradiating pattern illumination with a substrate fixed to a stage and a camera for capturing an image of the substrate.
- FOVs observation areas
- Adjusting the height of the measuring module based on a predicted height displacement, and the side on which the height adjustment is completed Using the module comprises the step of inspecting the next observation area.
- a planar equation of the observation area may be calculated using at least one height information of the actual ROI and the dummy ROI existing in the observation area, and the planar equation may be used as trend information.
- the dummy region of interest may be manually set by a user.
- the dummy ROI may be automatically set based on the location of the actual ROI.
- Automatically setting the dummy region of interest may include identifying a position of the actual region of interest in the observation region, and setting the dummy region of interest at a location as far away from the actual region of interest as possible. have.
- the measurement module may include at least one first projection unit irradiating a first pattern light having a first wavelength, and at least one second projection unit irradiating a second pattern light having a second wavelength different from the first wavelength. It may include. In contrast, the projection unit may sequentially irradiate the first and second pattern lights having different wavelengths.
- the height of the measurement module for the target observation region is adjusted by using the height trend information of at least one previous observation region, thereby substantially measuring the substrate inspection apparatus. The effect of increasing the range possible is obtained.
- the measurement range of the height compared to the case of using the pattern illumination of a single wavelength, the measurement range of the height As is increased, even if the substrate is severely bent, it is within the measurement range, thereby improving the reliability of the height measurement.
- a dummy observation area is set between the target observation area and the previous observation area, and by using the trend information of the dummy observation area and the previous observation area, the amount of height displacement with respect to the target observation area is more accurate. It can be predicted.
- the substrate is corrected by correcting the Z-axis height of the camera by the height displacement of the substrate by the substrate transfer mechanism prior to the inspection of the observation areas.
- the reliability of the test can be further improved.
- FIG. 1 is a conceptual diagram schematically showing a substrate inspection apparatus according to an embodiment of the present invention.
- FIG. 2 is a plan view illustrating a state in which a substrate is fixed to a stage.
- FIG 3 is a side view illustrating a state in which a substrate is fixed to a stage.
- FIG. 4 is a flow chart showing a substrate inspection method according to an embodiment of the present invention.
- FIG. 5 is a conceptual diagram illustrating a substrate inspection method according to an embodiment of the present invention.
- 6 and 7 are plan views illustrating first and second pattern lights emitted from the projection unit.
- FIG. 8 is a conceptual diagram illustrating a substrate inspection method according to another embodiment of the present invention.
- FIG. 9 is a flow chart illustrating a substrate inspection method according to another embodiment of the present invention.
- FIG. 10 is a plan view illustrating a state in which a substrate is fixed to a stage according to another embodiment of the present invention.
- FIG. 11 is a flow chart showing a substrate inspection method according to another embodiment of the present invention.
- FIG. 12 is a plan view illustrating a state in which a substrate is fixed to a stage according to another embodiment of the present invention.
- FIG. 13 is a side view illustrating a state in which a substrate is fixed to a stage according to another embodiment of the present invention.
- FIG. 14 is a flow chart showing a substrate inspection method according to another embodiment of the present invention.
- 15 is a flow chart showing a substrate inspection method according to another embodiment of the present invention.
- 16 is a plan view of one observation area.
- first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
- the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
- FIG. 1 is a conceptual view schematically showing a substrate inspection apparatus according to an embodiment of the present invention
- Figure 2 is a plan view showing a state in which the substrate is fixed to the stage
- Figure 3 is a side view showing a state in which the substrate is fixed to the stage. .
- the substrate inspection apparatus 100 is at least one projection unit for irradiating pattern light to the substrate 150 on which the measurement object 152 is formed (
- the measurement module 120 includes a camera 130 for capturing an image of the 110 and the substrate 150.
- the substrate inspection apparatus 100 may further include a stage 140 for supporting and fixing the substrate 150 on which the measurement object 152 is formed.
- the projection unit 110 irradiates the substrate 150 with pattern light to measure the three-dimensional shape of the measurement object 152 formed on the substrate 150.
- the projection unit 110 includes a light source 112 for generating light, a grating element 114 for converting light from the light source 112 into pattern illumination, and a grating for pitch conveying the grating element 114.
- a projection lens 118 for projecting the patterned light converted by the transfer mechanism 116 and the grating element 114 onto the measurement object 152.
- the grating element 114 may be transferred by 2 [pi] / N by a grating transfer mechanism 116 such as a piezo actuator (PZT) for the phase shift of pattern lighting.
- PZT piezo actuator
- Projection unit 110 having such a configuration may be provided in plurality so as to be spaced apart at a predetermined angle in the circumferential direction with respect to the camera 130 to increase the inspection accuracy.
- the plurality of projections 110 are installed to be inclined at a predetermined angle with respect to the substrate 150 to irradiate pattern light onto the substrate 150 from a plurality of directions.
- the substrate inspecting apparatus 100 may include only one projection unit 110.
- the camera 130 captures an image of the substrate 150 through irradiation of the pattern light of the projection unit 110.
- the camera 130 is installed at an upper portion perpendicular to the substrate 150.
- the camera 130 may include a CCD camera or a CMOS camera for capturing an image.
- the stage 140 is for supporting and fixing the substrate 150, and is configured to support and fix both ends of the substrate 150, for example.
- the stage 140 may include a first stage 140a for supporting and fixing one end of the substrate 150 and a second stage 140b for supporting and fixing the other end of the substrate 150.
- the first stage 140a and the second stage 140b each include a lower stage 142 in contact with the lower surface of the substrate 150 and an upper stage 144 in contact with the upper surface of the substrate 150. can do. Therefore, when the substrate 150 is carried between the lower stage 142 and the upper stage 144, the gap between the lower stage 142 and the upper stage 144 may be narrowed to fix the substrate 150.
- the lower stage 142 may be raised to fix the substrate 150.
- the substrate inspection apparatus 100 having such a configuration irradiates pattern light using the projection unit 110 to the substrate 150 fixed to the stage 140, and the image of the substrate 150 through the camera 130. By photographing, the three-dimensional shape of the substrate 150 on which the measurement object 152 is formed is inspected.
- the substrate 150 may be a printed circuit board (PCB) on which conductive wires and pads are formed, and the measurement object 152 is mounted on the solder or substrate 150 formed on the pad. It may be an electronic component.
- PCB printed circuit board
- the substrate inspection apparatus 100 measures the entire area of the substrate 150 by dividing it into several steps. That is, as shown in FIG. 2, the substrate 150 is divided into a plurality of fields of view (FOVs), and the measurement module 120 sequentially views the fields of view according to a predetermined inspection order. By inspecting while moving, the whole area
- the size of the observation area (FOV) is preferably substantially the same as the size of the measurement area that the camera 130 can measure at one time, and may be slightly smaller in some cases.
- the upper surface of the substrate 150 may have different heights according to positions. That is, the substrate 150 may have different topography for each observation region FOV due to the warpage phenomenon. Therefore, in order to increase the reliability of the inspection of the substrate 150, it is necessary to adjust the focus of the substrate inspection apparatus 100 for each observation area FOV in response to the bending of the substrate 150. At this time, focus adjustment of the substrate inspection apparatus 100 may be performed by raising or lowering the measurement module 120 in the Z-axis direction.
- FIG. 4 is a flowchart illustrating a substrate inspection method according to an embodiment of the present invention
- FIG. 5 is a conceptual diagram illustrating a substrate inspection method according to an embodiment of the present invention.
- an inspection order of the plurality of observation areas (FOVs) is set. (S100).
- the inspection order of the plurality of observation areas FOV is set along the length direction of the stage 140. For example, as shown in FIG. 2, when the substrate 150 is divided into nine observation areas FOV1 to FOV9, the stage 150 starts with the first observation area FOV1 adjacent to the stage 140.
- the inspection order (FOV1-FOV2-FOV3-FOV4-FOV5-FOV6-FOV7-FOV8-FOV9) is set up to the ninth observation area FOV9 along the longitudinal direction of 140.
- the inspection order is set according to the length direction of the stage 140. Since the substrate 150 is fixed to the stage 140, the substrate 150 is relatively less affected by the bending of the substrate 150.
- the height displacement of the target observation area FOV is predicted using the trend information of the previous observation area FOV (S110). That is, while sequentially examining a plurality of observation areas (FOV), the target observation area by using the trend information on the previous observation area (FOV) that the inspection is completed for the next target observation area (FOV) to be examined next Predict the height displacement for (FOV).
- the height displacement amount for the target observation area FOV is determined by using extrapolation from trend information of the previous observation area FOV. Predict.
- interpolation may be used in addition to extrapolation in some cases.
- the first observation area FOV which is located near the fifth observation area FOV5 of FIG. 2
- the first observation area FOV which is located near the fifth observation area FOV5
- the Z-axis transfer position of the measurement module 120 in the fifth viewing area FOV5 may be calculated using the estimated terrain in the fifth viewing area FOV5.
- the terrain information for all of the first, second, third and fourth observation areas FOV1, FOV2, FOV3, and FOV4 may be used, the first, second, third and fourth observation areas ( At least one of FOV1, FOV2, FOV3, and FOV4 may be selected and used. That is, before estimating the terrain in the fifth viewing area FOV5, the step of selecting at least one of the first, second, third and fourth viewing areas FOV1, FOV2, FOV3, and FOV4 is performed. May be
- the linear trend information may be obtained.
- the height displacement of the target observation area (FOV) is estimated by using the method. That is, the height displacement of the target observation area FOV is predicted using trend information of at least two or more previous observation areas FOV existing on the same row corresponding to the longitudinal direction of the stage 140. For example, the center of the target observation area FOV using height information of the center point of at least two or more previous observation areas FOV existing on the same row corresponding to the longitudinal direction of the stage 140. Predict the height displacement of the point. For example, when the target observation area FOV is the third observation area FOV3, the third observation area is obtained by using height trend information of the first observation area FOV1 and the second observation area FOV2 that have been inspected. Predict the height displacement of (FOV3).
- the amount of displacement of the target observation area FOV is predicted using the trend information. That is, the height displacement of the target observation area FOV is determined by using trend information of at least three or more previous observation areas FOV on the same row and the previous row corresponding to the longitudinal direction of the stage 140. Predict.
- the target observation area FOV may be obtained by using height information of a center point of at least three or more previous observation areas FOV on the same row and the previous row corresponding to the longitudinal direction of the stage 140. Predict the height displacement of the center point.
- FOV previous observation area
- the target observation area FOV is the fifth observation area FOV5
- the height trends of the inspected second observation area FOV2, the third viewing area FOV3, and the fourth viewing area FOV4 are completed.
- the height displacement of the fifth observation area FOV5 is estimated using the information.
- the target observation area FOV is the sixth observation area FOV5
- the first observation area FOV1 and the second observation area FOV2 which are adjacent to the sixth observation area FOV6 among the previous observation areas where the inspection is completed.
- the height displacement information of the fifth observation area FOV5 is predicted.
- the trend information on the previous observation area may be a change trend of heights of all areas of the previous observation area (FOV).
- the change in the height of the entire area may include not only information on the three-dimensional shape of the measurement object 152 but also height information on the upper surface of the substrate 150.
- the height data may be at some area or at some point of the previous observation area (FOV).
- the plane equation of the corresponding observation area may be obtained by using height information of at least one Region of Interest (ROI) existing in the previous observation area (FOV).
- ROI Region of Interest
- a planar equation is calculated and obtained by using height information of at least one of an entire region of the ROI, a bottom region of the ROI, and an extended ROI, and a center point or at least one of the planar equations.
- the height of the outer point of can be used as reference data for height displacement measurement.
- the plane equation for the previous observation area FOV may be calculated using height information of at least three points in the previous observation area FOV.
- the height displacement of the target observation area (FOV) may be predicted using the height trend information of one previous observation area (FOV).
- the height of the measurement module 120 is adjusted based on the estimated height displacement amount of the target observation area FOV (S120). For example, the height adjustment of the measurement module 120 is performed based on the height displacement of the center point of the target observation area FOV. For example, as shown in FIG. 5, when the target viewing area is the fifth viewing area FOV5, the height of the center point of the fifth viewing area FOV5 is the fourth viewing area FOV4.
- the measurement module 120 is lowered in the Z-axis direction by the height difference.
- the measurement module 120 is raised in the Z-axis direction by the height difference.
- it may be compared with the preset initial Z-axis height, not the previous observation area.
- the initial Z-axis height for the measurement module 120 is set based on the height of the substrate 150 is fixed to the stage 140, for example, through the Z-axis calibration of the measurement module 120 The data obtained beforehand. Meanwhile, the height adjustment of the measurement module 120 may be performed before, after, or during the transfer of the measurement module 120 to the target observation area FOV.
- the target observation area (FOV) is inspected using the measurement module 120 in which the height adjustment is completed (S130).
- the focus for obtaining accurate measurement information is adjusted. I can adjust it.
- the effect of substantially increasing the measurable range of the substrate inspection apparatus 100 may be obtained.
- the height reliability and the size and position distortion of the measurement object 152 according to the perspective change of the measured substrate 150 due to the distance change between the camera 130 and the measurement object 152 can be measured more accurately.
- the substrate 150 loaded on the substrate inspection apparatus 100 has a structure in which both sides are fixed by the stage 140, the length of the stage 140 is larger than the direction corresponding to the longitudinal direction of the stage 140.
- the warpage of the substrate 150 in a direction perpendicular to the direction tends to be severe. Therefore, in setting the inspection order for the plurality of observation areas (FOV), by setting the inspection order along the longitudinal direction of the stage 140 with a relatively small amount of height displacement, the reliability of the height adjustment of the measurement module 120 Can improve.
- the substrate inspection method according to the present embodiment may use a multi-wavelength inspection method to increase the height measurement range in response to the bending of the substrate 150.
- FIG. 6 and 7 are plan views illustrating first and second pattern lights emitted from the projection unit
- FIG. 8 is a conceptual diagram illustrating a substrate inspection method according to another exemplary embodiment of the present invention.
- the projection unit 110 sequentially irradiates first and second pattern lights having different wavelengths, that is, pitches of different gratings.
- the measurement module 120 may include at least one first projection unit 110a for irradiating the first pattern light 210 having the first wavelength ⁇ 1, as shown in FIG. 6. And at least one second projection unit 110b irradiating the second pattern light 220 having the second wavelength ⁇ 2 different from the first wavelength ⁇ 1 as shown in FIG. 7. .
- a plurality of first projection unit 110a and second projection unit 110b may be alternately installed at regular intervals along the circumferential direction with respect to the camera 130.
- one projection unit 110 and the first pattern light 210 and the second pattern light 220 having different wavelengths can be examined sequentially.
- the lattice element 114 included in the projection unit 110 may include a first region having a lattice spacing for the first pattern light 210 and a lattice spacing for the second pattern light 220. By dividing into two areas, multi-wavelength inspection can be performed.
- the measurement range of the height is higher than that of the pattern light of the single wavelength. Is increased.
- the height measurement range of the substrate inspection apparatus 100 is determined by the least common multiple of the first wavelength ⁇ 1 and the second wavelength ⁇ 2. Therefore, as the measurement range of the height is increased, even if the substrate 150 is severely bent, it is within the measurement range, thereby improving the reliability of the height measurement.
- FIG. 9 is a flowchart illustrating a method of inspecting a substrate according to another exemplary embodiment of the present invention
- FIG. 10 is a plan view illustrating a state in which a substrate is fixed to a stage according to another exemplary embodiment of the present invention.
- an inspection order of the plurality of observation areas (FOVs) is set (S200).
- the inspection order of the plurality of observation areas FOV may be set in a zigzag manner along the length direction of the stage 140.
- the substrate 150 is divided into six observation regions FOV1 to FOV6, the substrate 150 starts with the first observation region FOV1 adjacent to the first stage 140a.
- the inspection order (FOV1-> FOV2-> FOV3-> FOV4-> FOV5 -FOV6 is set up to the 6th observation area
- At least one dummy observation area DFOV is set between the target observation area FOV and the previous observation area FOV (S210).
- the second observation area FOV2 is too far from the first observation area FOV1. Since the distance is far from each other, when the height displacement of the second observation area FOV2 is predicted using the trend information of the first observation area FOV1, the reliability of the prediction data may be deteriorated.
- the first dummy observation area DFOV1 between the second observation area FOV2 and the first observation area FOV1 and utilizing the trend information measured from the first dummy observation area DFOV1, 2 It is possible to improve the prediction reliability of the height displacement amount for the observation area (FOV2).
- the second dummy observation area DFOV2 is set between the third observation area FOV3 and the fourth observation area FOV4, and the second dummy observation area DFOV2 is set between the fifth observation area FOV5 and the sixth observation area FOV6.
- the dummy observation area DFOV3 can be set.
- the setting of the dummy observation area DFOV may be performed when setting the inspection order of the observation areas FOV, or may be made before the inspection of the target observation area FOV.
- the height displacement of the target observation area FOV is predicted by using trend information on at least one of the dummy observation area DFOV adjacent to the target observation area FOV and the previous observation area FOV (S220). .
- the target observation area using extrapolation from trend information of the dummy observation area (DFOV) and the previous observation area (FOV). It is possible to predict the height displacement with respect to (FOV).
- interpolation may be used in addition to extrapolation in some cases.
- the target observation area FOV is the fourth observation area FOV4 in FIG. 10
- the first, second and third observation areas where the inspection is completed before the fourth observation area FOV4 is performed.
- FOV1, FOV2, FOV3 and first and second dummy observation areas DFOV1, DFOV2 exist. Therefore, the fourth observation area is obtained from the trend information of the first, second and third observation areas FOV1, FOV2 and FOV3 and the first and second dummy observation areas DFOV1 and DFOV2 using the extrapolation method.
- the Z-axis transfer position of the measurement module 120 in the fourth viewing area FOV4 is calculated using the estimated terrain in the fourth viewing area FOV4. Can be.
- trend information for both the first, second and third observation areas FOV1, FOV2 and FOV3 and the first and second dummy observation areas DFOV1 and DFOV2 may be used, but the first and second observation areas FOV1 and FOV2 may be used. And at least one of the third viewing areas FOV1, FOV2, and FOV3 and the first and second dummy viewing areas DFOV1 and DFOV2. That is, before estimating the terrain in the fourth observation region FOV4, the first, second and third observation regions FOV1, FOV2, and FOV3 and the first and second dummy observation regions DFOV1 and DFOV2 are estimated. Selecting at least one of may be performed.
- the linear Predicting the height displacement of the target observation area (FOV) by using the general trend information if the dummy observation area DFOV and the previous observation area FOV are on the same row corresponding to the length direction of the stage 140 based on the target observation area FOV to be examined next, the linear Predicting the height displacement of the target observation area (FOV) by using the general trend information. That is, the height displacement of the target observation area FOV is predicted using the trend information of the dummy observation area DFOV and the previous observation area FOV existing on the same row corresponding to the longitudinal direction of the stage 140. . For example, the target observation area using height information of at least two center points of the dummy observation area DFOV and the previous observation area FOV present on the same row corresponding to the longitudinal direction of the stage 140. Predict the height displacement of the center point of (FOV). For example, when the target observation area FOV is the second observation area FOV2, the second observation area FOV2 is formed using the height trend information of the first dummy observation area DFOV
- the dummy viewing area DFOV and the previous viewing area FOV exist on the same row and the previous row corresponding to the length direction of the stage 140 based on the target viewing area FOV to be examined next. If so, the planar trend information is used to predict the height displacement of the target observation area (FOV). That is, the target observation area FOV is generated by using at least three or more trend information of the dummy observation area DFOV and the previous observation area FOV on the same row and the previous row corresponding to the longitudinal direction of the stage 140. Predict the amount of height displacement.
- the height displacement of the center point of the target observation area is estimated.
- the target viewing area FOV is the fourth viewing area FOV4
- the first viewing area FOV1, the first dummy viewing area DFOV1, and the second dummy adjacent to the fourth viewing area FOV4 are provided.
- the height displacement information of the fourth viewing area FOV4 may be estimated using the height trend information of the viewing area DFOV2.
- Trend information on the dummy observation area DFOV and the previous observation area FOV is, in one embodiment, a change in height of all the areas of the dummy observation area DFOV and the previous observation area FOV.
- the change in the height of the entire area may include not only information on the three-dimensional shape of the measurement object 152 but also height information on the upper surface of the substrate 150.
- the height data may be the height data in some areas or some points of the dummy viewing area DFOV and the previous viewing area FOV.
- the planar equation of the corresponding observation area may be calculated and obtained by using height information of a region of interest (ROI) existing in the dummy observation area DFOV or the previous observation area FOV. .
- ROI region of interest
- a planar equation is calculated and obtained by using height information of at least one of an entire region of the ROI, a bottom region of the ROI, and an extended ROI, and a center point or at least one of the planar equations.
- the height of the outer point of can be used as reference data for height displacement measurement.
- the planar equations for the dummy observation area DFOV and the previous observation area FOV may be calculated using height information of at least three points in the dummy observation area DFOV and the previous observation area FOV.
- the height of the measurement module 120 is adjusted based on the estimated height displacement amount in the target observation area FOV (S230). For example, the height adjustment of the measurement module 120 is performed based on the height displacement of the center point of the target observation area FOV. Since the height adjustment of the measurement module 120 has been described above with reference to FIG. 5, duplicate description thereof will be omitted.
- the target observation area (FOV) is inspected using the measurement module 120 in which the height adjustment is completed (S240).
- the substrate inspection method according to the present embodiment may use a multi-wavelength inspection method to increase the height measurement range in response to the bending of the substrate 150. Since the multi-wavelength inspection method has been described above with reference to FIGS. 6 and 7, a redundant description thereof will be omitted.
- the dummy observation area DFOV is set between the target observation area and the previous observation area, and the target observation is performed by using the trend information of the dummy observation area and the previous observation area.
- the amount of height displacement over the area can be predicted more accurately.
- FIG. 11 is a flowchart illustrating a substrate inspection method according to another embodiment of the present invention
- FIG. 12 is a plan view illustrating a state in which a substrate is fixed to a stage according to another embodiment of the present invention
- FIG. According to another embodiment is a side view showing a state in which the substrate is fixed to the stage.
- At least one substrate 150 on which the measurement object 152 is formed is mounted on the substrate transfer mechanism 160.
- the furnace is fixed to the stage 140.
- an inspection order of the plurality of observation areas FOV is first set (S300).
- the inspection order of the plurality of observation areas FOV may be set in a zigzag manner along the length direction of the stage 140.
- the initial observation area FOV1 is measured according to the set inspection order, and the height displacement amount ⁇ H of the substrate 150 with respect to the initial measurement area FOV1 relative to the initial measurement reference plane H1 of the preset measurement module 120 is measured.
- Measure (S310) the initial Z-axis height of the measurement module 120 is set based on a height at which the substrate 150 on which the measurement object 152 is formed is fixed to the stage 140.
- the initial Z axis height of the measurement module 120 may be set based on the lower surface of the upper stage 144. That is, in the case of not using the substrate transfer mechanism 160, after the substrate 150 is loaded, the lower stage 142 is raised to move the substrate 150 between the upper stage 144 and the lower stage 142.
- the Z-axis height of the camera 130 is set based on the substrate surface (that is, the initial Z-axis height reference plane of the camera) fixed to the lower surface of the upper stage 144.
- the substrate transfer mechanism 160 such as a tray or a jig
- the height of the substrate 150 by the substrate transfer mechanism 160 is increased. Since the displacement amount ⁇ H occurs, it is necessary to correct the Z-axis height of the measurement module 120 even when the initial observation area FOV1 is measured.
- the height of the measurement module 120 is adjusted based on the height displacement ⁇ H measured in the initial observation area FOV1 (S320). For example, the height of the measurement module 120 is adjusted based on the height displacement amount ⁇ H between the initial Z axis height of the preset camera 130 and the measured initial observation area FOV1. That is, the measurement module 120 by the height displacement amount ⁇ H corresponding to the height difference between the upper surface of the substrate conveyance mechanism 160 fixed to the stage 140 and the upper surface of the substrate 150 fixed to the substrate conveyance mechanism 160. ) In the Z-axis direction.
- the initial observation area FOV1 is inspected using the measurement module 120 in which the height adjustment is completed (S330).
- the target observation area is applied to the target observation area using trend information on at least one previous observation area that has been inspected for the next observation area to be inspected.
- the amount of height displacement is predicted (S340). Since the prediction of the height displacement with respect to the target observation area has been described above with reference to FIG. 2 or FIG. 10, a detailed description thereof will be omitted.
- the height of the measurement module 120 is adjusted based on the estimated height displacement amount with respect to the target observation area (S350). For example, the height adjustment of the measurement module 120 is made based on the height displacement of the center point of the target observation area. Since the height adjustment of the measurement module 120 has been described above with reference to FIG. 5, a detailed description thereof will be omitted.
- the target observation area (FOV) is inspected using the measurement module 120 in which the height adjustment is completed (S360).
- the substrate inspection method according to the present embodiment may use a multi-wavelength inspection method to increase the height measurement range in response to the bending of the substrate 150. Since the multi-wavelength inspection method has been described above with reference to FIGS. 6 and 7, a redundant description thereof will be omitted.
- the substrate 150 when the substrate 150 is carried through the substrate transfer mechanism 160 such as a tray or a jig, the substrate 150 may be caused by the substrate transfer mechanism 160 before the inspection of the observation areas.
- the substrate transfer mechanism 160 By correcting the Z-axis height of the camera 130 by the height displacement ⁇ H of the substrate 150, the reliability of the substrate inspection can be improved.
- FIG. 14 is a flow chart showing a substrate inspection method according to another embodiment of the present invention.
- the Z axis of the measurement module 120 is moved to the initial position and is focused.
- the step of transferring the Z axis of the measurement module 120 to the initial position may be said to be a process that is performed when the first inspection of the three-dimensional shape of the measurement object 152 formed on the substrate 150 is performed for the first time.
- the Z-axis initial position of the measurement module 120 is set based on the height of the substrate 150 is fixed to the stage 140, for example, through the Z-axis calibration of the measurement module 120 The data obtained beforehand.
- the estimation of the Z-axis transfer position of the measurement module 120 may be divided into two steps. First, extrapolation is used to estimate the terrain in the target observation area (FOV) from the trend information of the previous observation area (FOV), and then the estimated terrain in the target observation area (FOV) is estimated. Determine the Z axis feed position of the measurement module 120 by using. On the other hand, in estimating the terrain of the target observation area (FOV), interpolation may be used in addition to extrapolation in some cases.
- the Z-axis transfer position estimating step S420 will be described below.
- the target observation area FOV is referred to as the fifth observation area FOV5 in FIG. 5
- the first, second, and first observation areas FOV are located near the fifth observation area FOV5.
- the Z-axis transfer position of the measurement module 120 in the fifth viewing area FOV5 may be calculated using the estimated terrain in the fifth viewing area FOV5.
- the terrain information for all of the first, second, third and fourth observation areas FOV1, FOV2, FOV3, and FOV4 may be used, the first, second, third and fourth observation areas ( At least one of FOV1, FOV2, FOV3, and FOV4 may be selected and used. That is, before estimating the terrain in the fifth viewing area FOV5, the step of selecting at least one of the first, second, third and fourth viewing areas FOV1, FOV2, FOV3, and FOV4 is performed. May be
- the extrapolation in the Z-axis transfer position estimating step (S420) may mean a method of estimating the height in the target observation area (FOV) by using height information of the terrain information of the previous observation area (FOV).
- the height information in the previous observation area (FOV) is preferably a trend of the change of the height of the entire area of the observation area (FOV), in contrast, in some areas or a part of the observation area (FOV) Height information at the point.
- the height in the target viewing area (FOV) may be estimated through the height of the center point or at least one outer point in the previous viewing area (FOV).
- the height in the previous observation area FOV and the height in the target observation area FOV may refer to the height of the substrate 150 in FIG. 5.
- the Z-axis of the measurement module 120 is transferred to the estimated transfer position to adjust the focus (S430). For example, when the terrain height in the fifth viewing area FOV5 is lower than the terrain height in the fourth viewing area FOV4, the Z axis of the measurement module 120 is moved downward, and the fifth viewing area is moved. When the terrain height at FOV5 is higher than the terrain height at the fourth viewing area FOV4, the Z axis of the measurement module 120 is moved upward.
- the measurement module 120 or the stage 140 is transferred to the XY axis to inspect the target observation area FOV.
- the XY axis transfer process of the measurement module 120 or stage 140 has been described as being performed after the estimated focus adjustment step (S430), otherwise the XY axis transfer process is the estimation It may be performed before the focus adjusting step S430 or at the same time as the estimated focus adjusting step S430.
- a multi-wavelength inspection method may be used to increase the height measurement range in response to the warpage of the substrate 150. Since the multi-wavelength inspection method has been described above with reference to FIGS. 6 and 7, a redundant description thereof will be omitted.
- the inspection step is increased in order to inspect the target observation area FOV to be inspected next (S460). For example, when the substrate 150 is divided into nine observation regions FOV1 to FOV9, and inspection is performed to the fifth observation region FOV5, the inspection step is increased from 5 to 6. Then, the inspection process for the sixth observation area FOV6 is performed again. On the other hand, when the inspection of all the observation areas (FOV) is completed, the inspection of the substrate 150 is terminated.
- the step of adjusting the focus of the substrate inspection apparatus 100 by using a laser rangefinder may be selectively performed. For example, when the terrain estimation in the target observation area (FOV) using the extrapolation method exceeds the actual height and the error range, the adjustment of the focus of the substrate inspection apparatus 100 is incorrect. It is preferable to further perform the step of refocusing the substrate inspection apparatus 100 by using.
- FOV target observation area
- the measurement time can be shortened. That is, in the related art, the process of adjusting the focus of the substrate inspection apparatus 100 by measuring the separation distance between the camera 130 and the substrate 150 for each observation area FOV is essentially performed. As this is omitted, the substrate inspection time can be greatly reduced.
- FIG. 15 is a flowchart illustrating a method of inspecting a substrate according to another exemplary embodiment of the present invention
- FIG. 16 is a plan view of one observation area.
- the measurement object is actually measured in the observation area FOVs.
- the region of interest ROI in which 152 is formed may be set to be biased in either direction. That is, in the inspection of the substrate 150, the measurement object 152 that requires substantially inspection is not performed to perform data processing for the entire area of the observation area (FOV) in order to reduce the amount of data to be processed and increase the inspection speed. Only the formed region is set as the region of interest ROI and the substrate 152 is inspected through data processing of only the region of interest ROI. However, when the set ROI is not uniformly distributed in the observation area FOV and is deviated in one direction as shown in FIG. 16, the entire observation area FOV is based on only the data in the ROI. It may be difficult to obtain accurate floor trend information for.
- the dummy ROI is set up separately from the ROI in one observation area FOV, so that the substrate can acquire more accurate bottom trend information for the observation area FOV. Provide inspection methods.
- the ROI in which the measurement object 152 is formed, and the dummy ROI DROI for identifying the bottom trend are set for the at least one observation area FOV (S500).
- the actual ROI is set based on an area in which the measurement object 152 on which the inspection is to be performed is formed.
- the substrate inspection apparatus 100 automatically sets the actual ROI according to the position of the measurement object 152 existing in the observation area FOV by using the information about the substrate 150 which is previously held. .
- the dummy region of interest DROI is set separately from the actual region of interest ROI in order to obtain bottom trend information of the corresponding observation region FOV.
- the dummy region of interest DROI is preferably set as far from the actual region of interest ROI as possible in order to identify a more accurate bottom trend for the entire area of the field of view. For example, as shown in FIG. 16, when the actual ROI is located in one quadrant of the observation area FOV, the dummy ROI DROI is 3 which is a diagonal direction of the actual ROI. Is set in quadrant.
- the dummy ROI may be manually set by a user. That is, when it is determined that the actual ROI existing in the observation area FOV is not evenly distributed in the observation area FOV, the user sets a dummy ROI separately from the actual ROI. Can be. According to the manual setting of the dummy region of interest DROI, the measurement module 120 performs data processing on the actual region of interest ROI and the dummy region of interest DROI in the observation area FOV.
- the dummy region of interest DROI may be automatically set based on location information of the actual region of interest ROI. That is, after checking the position of the actual ROI existing in the observation area FOV, the substrate inspection apparatus 100 determines that the actual ROI is not evenly distributed in the observation area FOV.
- the dummy ROI may be automatically set at a position as far from the ROI as possible.
- the height displacement of the next observation area FOV is predicted using the bottom trend information acquired from at least one of the actual ROI and the dummy ROI (S510).
- the trend information of the observation area ROI may be obtained by using at least one height information of the actual ROI and the dummy ROI existing in the observation area FOV.
- the planar equation of can be calculated, and the planar equation can be used as trend information.
- the bottom trend of the observation area FOV can be more accurately identified. Through this, the accuracy of height displacement prediction for the next observation area (FOV) can be improved.
- the height of the measurement module 120 is adjusted based on the predicted height displacement before the inspection for the next observation area FOV (S520). For example, the height adjustment of the measurement module 120 is made based on the height displacement of the center point of the next observation area (FOV). For example, as shown in FIG. 5, when the next viewing area is the fifth viewing area FOV5, the height of the center point of the fifth viewing area FOV5 is the fourth viewing area FOV4.
- the measurement module 120 is lowered in the Z-axis direction by the height difference.
- the measurement module 120 is raised in the Z-axis direction by the height difference.
- it may be compared with the preset initial Z-axis height, not the previous observation area.
- the initial Z-axis height for the measurement module 120 is set based on the height of the substrate 150 is fixed to the stage 140, for example, through the Z-axis calibration of the measurement module 120 The data obtained beforehand. Meanwhile, the height adjustment of the measurement module 120 may be performed before, after, or during the transfer of the measurement module 120 to the next observation area FOV.
- the height of the measurement module 120 for the next observation area to be inspected is adjusted by using the bottom trend information of the at least one previous observation area.
- the focus can be adjusted for acquisition of measurement information.
- the bottom trend information of the actual ROI and the dummy ROI may be used together, thereby improving reliability of the bottom trend information.
- the substrate inspection method according to the present embodiment may use a multi-wavelength inspection method to increase the height measurement range in response to the bending of the substrate 150. Since the multi-wavelength inspection method has been described above with reference to FIGS. 6 and 7, a redundant description thereof will be omitted.
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Abstract
Description
Claims (28)
- 스테이지에 고정된 기판으로 패턴조명을 조사하는 적어도 하나의 투영부 및 상기 기판의 이미지를 촬영하는 카메라를 포함하는 측정 모듈을 이용하여, 상기 기판을 복수의 관측영역(FOV)들로 분할하여 순차적으로 검사하는 기판 검사방법에 있어서,상기 복수의 관측영역들에 대하여 상기 스테이지의 길이 방향을 따라 검사 순서를 설정하는 단계;대상 관측영역에 대하여 검사가 완료된 적어도 하나의 이전 관측영역에 대한 추세 정보를 이용하여 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계;상기 대상 관측영역에 대하여 상기 예측된 높이 변위량을 기초로 상기 측정 모듈의 높이를 조정하는 단계; 및높이 조정이 완료된 상기 측정 모듈을 이용하여 상기 대상 관측영역을 검사하는 단계를 포함하는 기판 검사방법.
- 제1항에 있어서, 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계는,상기 이전 관측영역의 추세 정보로부터 외삽법(extrapolation)을 이용하여 상기 대상 관측영역에 대한 높이 변위량을 예측하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계는,상기 스테이지의 길이 방향에 대응되는 동일 행 상에 존재하는 적어도 2개의 상기 이전 관측영역들의 높이 정보들을 이용하여 상기 대상 관측영역의 높이 변위량을 예측하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계는,상기 스테이지의 길이 방향에 대응되는 동일 행 및 이전 행 상에 존재하는 적어도 3개의 상기 이전 관측영역들의 높이 정보들을 이용하여 상기 대상 관측영역의 높이 변위량을 예측하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 이전 관측영역에 대한 추세 정보는,상기 이전 관측영역에 존재하는 적어도 하나의 관심영역(ROI)의 높이 정보들을 이용하여 상기 이전 관측영역의 평면방정식을 산출하고, 상기 평면방정식을 추세 정보로 사용하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 측정 모듈의 높이를 조정하는 단계는,상기 대상 관측영역으로 상기 측정 모듈을 이송하기 전, 이송 후 및 이송 도중 중 어느 하나에서 상기 측정 모듈의 높이를 조정하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 측정 모듈의 높이를 조정하는 단계에서는,상기 대상 관측영역 및 상기 이전 관측영역의 센터 지점의 높이 변위량을 기준으로 상기 측정 모듈의 높이를 조정하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서, 상기 측정 모듈은제1 파장을 갖는 제1 패턴조명을 조사하는 적어도 하나의 제1 투영부; 및상기 제1 파장과 다른 제2 파장을 갖는 제2 패턴조명을 조사하는 적어도 하나의 제2 투영부를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제1항에 있어서,상기 투영부는 서로 다른 파장을 갖는 제1 및 제2 패턴조명을 순차적으로 조사하는 것을 특징으로 하는 기판 검사방법.
- 스테이지에 고정된 기판으로 패턴조명을 조사하는 적어도 하나의 투영부 및 상기 기판의 이미지를 촬영하는 카메라를 포함하는 측정 모듈을 이용하여, 상기 기판을 복수의 관측영역(FOV)들로 분할하여 순차적으로 검사하는 기판 검사방법에 있어서,상기 복수의 관측영역들에 대하여 검사 순서를 설정하는 단계;대상 관측영역과 이전 관측영역 사이에 적어도 하나의 더미 관측영역을 설정하는 단계;상기 더미 관측영역 및 상기 이전 관측영역 중 적어도 하나에 대한 추세 정보를 이용하여 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계;상기 대상 관측영역에 대하여 상기 예측된 높이 변위량을 기초로 상기 측정 모듈의 높이를 조정하는 단계; 및높이 조정이 완료된 상기 측정 모듈을 이용하여 상기 대상 관측영역을 검사하는 단계를 포함하는 기판 검사방법.
- 제10항에 있어서, 상기 더미 관측영역 및 상기 이전 관측영역에 대한 추세 정보는,상기 더미 관측영역 및 상기 이전 관측영역에 각각 존재하는 적어도 하나의 관심영역(ROI)의 높이 정보들을 이용하여 해당 관측영역의 평면방정식을 산출하고, 상기 평면방정식을 추세 정보로 사용하는 것을 특징으로 하는 기판 검사방법.
- 제10항에 있어서, 상기 측정 모듈은제1 파장을 갖는 제1 패턴조명을 조사하는 적어도 하나의 제1 투영부; 및상기 제1 파장과 다른 제2 파장을 갖는 제2 패턴조명을 조사하는 적어도 하나의 제2 투영부를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제10항에 있어서,상기 투영부는 서로 다른 파장을 갖는 제1 및 제2 패턴조명을 순차적으로 조사하는 것을 특징으로 하는 기판 검사방법.
- 적어도 하나의 기판이 기판 반송 기구에 실장된 상태로 스테이지에 고정된 경우, 상기 기판 반송 기구에 실장된 기판으로 패턴조명을 조사하는 적어도 하나의 투영부 및 상기 기판의 이미지를 촬영하는 카메라를 포함하는 측정 모듈을 이용하여, 상기 기판 반송 기구에 실장된 상기 기판을 복수의 관측영역(FOV)들로 분할하여 순차적으로 검사하는 기판 검사방법에 있어서,상기 복수의 관측영역들에 대하여 검사 순서를 설정하는 단계;상기 검사 순서에 따른 최초 관측영역을 측정하여 기 설정된 상기 측정 모듈의 측정 기준면 대비 상기 최초 관측영역에 대한 상기 기판의 높이 변위량을 측정하는 단계;상기 측정된 높이 변위량을 기초로 상기 측정 모듈의 높이를 조정하는 단계; 및높이 조정이 완료된 상기 측정 모듈을 이용하여 상기 최초 관측영역을 검사하는 단계를 포함하는 기판 검사방법.
- 제14항에 있어서,상기 검사 순서에 따라 상기 복수의 관측영역들을 검사함에 있어, 다음으로 검사할 대상 관측영역에 대하여 검사가 완료된 적어도 하나의 이전 관측영역에 대한 추세 정보를 이용하여 상기 대상 관측영역에 대한 높이 변위량을 예측하는 단계;상기 대상 관측영역에 대하여 상기 예측된 높이 변위량을 기초로 상기 측정 모듈의 높이를 조정하는 단계; 및높이 조정이 완료된 상기 측정 모듈을 이용하여 상기 대상 관측영역을 검사하는 단계를 더 포함하는 것을 특징으로 하는 기판 검사방법.
- 제15항에 있어서, 상기 이전 관측영역에 대한 추세 정보는,상기 이전 관측영역에 존재하는 적어도 하나의 관심영역(ROI)의 높이 정보들을 이용하여 상기 이전 관측영역의 평면방정식을 산출하고, 상기 평면방정식을 추세 정보로 사용하는 것을 특징으로 하는 기판 검사방법.
- 제15항에 있어서, 상기 측정 모듈은제1 파장을 갖는 제1 패턴조명을 조사하는 적어도 하나의 제1 투영부; 및상기 제1 파장과 다른 제2 파장을 갖는 제2 패턴조명을 조사하는 적어도 하나의 제2 투영부를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제15항에 있어서,상기 투영부는 서로 다른 파장을 갖는 제1 및 제2 패턴조명을 순차적으로 조사하는 것을 특징으로 하는 기판 검사방법.
- 스테이지에 고정된 기판으로 패턴조명을 조사하는 적어도 하나의 투영부 및 상기 기판의 이미지를 촬영하는 카메라를 포함하는 측정 모듈을 이용하여, 상기 기판을 복수의 관측영역(FOV)들로 분할하여 순차적으로 검사하는 기판 검사방법에 있어서,다음으로 검사할 대상 관측영역의 근처에 검사가 완료된 적어도 하나의 이전 관측영역이 존재하는지 판단하는 단계;상기 이전 관측영역이 존재하지 않을 경우, 상기 측정 모듈의 Z축을 초기위치로 이송하여 초점을 조정하는 단계;상기 이전 관측영역이 존재할 경우, 상기 이전 관측영역의 추세 정보를 이용하여 상기 대상 관측영역에서의 상기 측정 모듈의 Z축 이송위치를 추정하는 단계;상기 측정 모듈의 Z축을 상기 추정된 이송위치로 이송하여 초점을 조정하는 단계; 및상기 초점 조정이 완료된 상기 측정 모듈을 이용하여 상기 대상 관측영역을 검사하는 단계를 포함하는 기판 검사방법.
- 제19항에 있어서, 상기 측정 모듈은제1 파장을 갖는 제1 패턴조명을 조사하는 적어도 하나의 제1 투영부; 및상기 제1 파장과 다른 제2 파장을 갖는 제2 패턴조명을 조사하는 적어도 하나의 제2 투영부를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제19항에 있어서,상기 투영부는 서로 다른 파장을 갖는 제1 및 제2 패턴조명을 순차적으로 조사하는 것을 특징으로 하는 기판 검사방법.
- 스테이지에 고정된 기판으로 패턴조명을 조사하는 적어도 하나의 투영부 및 상기 기판의 이미지를 촬영하는 카메라를 포함하는 측정 모듈을 이용하여, 상기 기판을 복수의 관측영역(FOV)들로 분할하여 순차적으로 검사하는 기판 검사방법에 있어서,적어도 하나의 상기 관측영역에 대하여, 측정대상물이 형성된 실제 관심영역(ROI) 및 바닥 추세를 확인하기 위한 더미 관심영역(DROI)을 설정하는 단계;상기 실제 관심영역 및 상기 더미 관심영역 중 적어도 하나로부터 획득된 추세 정보를 이용하여 다음 관측영역에 대한 높이 변위량을 예측하는 단계;상기 다음 관측영역에 대한 검사에 앞서 상기 예측된 높이 변위량을 기초로 상기 측정 모듈의 높이를 조정하는 단계; 및높이 조정이 완료된 상기 측정 모듈을 이용하여 상기 다음 관측영역을 검사하는 단계를 포함하는 기판 검사방법.
- 제22항에 있어서, 상기 추세 정보는상기 관측영역에 존재하는 상기 실제 관심영역 및 상기 더미 관심영역의 적어도 하나의 높이 정보를 이용하여 상기 관측영역의 평면방정식을 산출하고, 상기 평면방정식을 추세 정보로 사용하는 것을 특징으로 하는 기판 검사방법.
- 제22항에 있어서,상기 더미 관심영역은 사용자에 의해 수동으로 설정되는 것을 특징으로 하는 기판 검사방법.
- 제22항에 있어서,상기 더미 관심영역은 상기 실제 관심영역의 위치를 기초로 자동으로 설정되는 것을 특징으로 하는 기판 검사방법.
- 제25항에 있어서, 상기 더미 관심영역을 자동으로 설정하는 단계는,상기 관측영역 내의 상기 실제 관심영역의 위치를 확인하는 단계; 및상기 실제 관심영역과 가능한 멀리 떨어진 위치에 상기 더미 관심영역을 설정하는 단계를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제22항에 있어서, 상기 측정 모듈은제1 파장을 갖는 제1 패턴조명을 조사하는 적어도 하나의 제1 투영부; 및상기 제1 파장과 다른 제2 파장을 갖는 제2 패턴조명을 조사하는 적어도 하나의 제2 투영부를 포함하는 것을 특징으로 하는 기판 검사방법.
- 제22항에 있어서,상기 투영부는 서로 다른 파장을 갖는 제1 및 제2 패턴조명을 순차적으로 조사하는 것을 특징으로 하는 기판 검사방법.
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JP2014055812A (ja) * | 2012-09-11 | 2014-03-27 | Keyence Corp | 形状測定装置、形状測定方法および形状測定プログラム |
CN104427853A (zh) * | 2013-09-10 | 2015-03-18 | Juki株式会社 | 检查方法、安装方法以及安装装置 |
CN104427853B (zh) * | 2013-09-10 | 2019-02-22 | Juki株式会社 | 检查方法、安装方法以及安装装置 |
JP2015129703A (ja) * | 2014-01-08 | 2015-07-16 | 富士通株式会社 | 基板の反り測定方法 |
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Publication number | Publication date |
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DE112011104658T5 (de) | 2013-09-26 |
CN103299728A (zh) | 2013-09-11 |
CN103299728B (zh) | 2016-02-17 |
DE112011104658B4 (de) | 2020-06-18 |
JP2014504721A (ja) | 2014-02-24 |
JP5597774B2 (ja) | 2014-10-01 |
US20140009601A1 (en) | 2014-01-09 |
WO2012091494A3 (ko) | 2012-11-08 |
US9885669B2 (en) | 2018-02-06 |
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