WO2012070498A1 - 表示装置及びテレビ受信装置 - Google Patents
表示装置及びテレビ受信装置 Download PDFInfo
- Publication number
- WO2012070498A1 WO2012070498A1 PCT/JP2011/076692 JP2011076692W WO2012070498A1 WO 2012070498 A1 WO2012070498 A1 WO 2012070498A1 JP 2011076692 W JP2011076692 W JP 2011076692W WO 2012070498 A1 WO2012070498 A1 WO 2012070498A1
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- Prior art keywords
- wiring
- source
- display device
- electrode
- display area
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Images
Classifications
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/136259—Repairing; Defects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136263—Line defects
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
- G02F2201/122—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode having a particular pattern
Definitions
- the present invention relates to a display device and a television receiver.
- a liquid crystal panel used in a liquid crystal display device has a configuration in which a liquid crystal layer is sandwiched between a pair of glass substrates, one of which is an array substrate including TFTs as active elements.
- This array substrate has a structure in which a large number of gate lines and source lines are provided in a lattice shape in the display region, and TFTs are provided at intersections of the gate lines and the source lines.
- a pixel electrode is disposed in a region surrounded by the gate wiring and the source wiring, thereby constituting a pixel as a display unit.
- the source wiring arranged on the upper layer side intersects with the gate wiring on the lower layer side, so that it has a running portion.
- the source wiring is formed by depositing a metal material such as Cr using a sputtering method or the like
- the Cr film formed at the rising portion is likely to be a rough film, and the film thickness of the Cr film at the rising portion. May not be sufficient.
- the wet etching is performed using the resist pattern as a mask after depositing the metal film to be the source wiring, the etching of the landing portion proceeds rapidly, and as a result, the source wiring is disconnected. May occur.
- the thing described in the following patent document 1 is known as what addressed such a problem.
- the width of the non-display area that forms a frame surrounding the display area must be reduced, and accordingly, the non-display area is allocated to the non-display area. If each wiring to be made thin, there is a problem that disconnection is more likely to occur than before.
- the present invention has been completed based on the above situation, and an object thereof is to prevent disconnection in a non-display area.
- the display device includes a display area capable of displaying an image and a non-display area surrounding the display area, wherein at least the non-display area includes a first wiring and the first wiring. And a second wiring that is disposed on the upper layer side and intersects the first wiring, and is provided at a side edge at an intersection of the first wiring with the second wiring. Is provided with a bent portion bent in the extending direction of the second wiring.
- intersection of the second wiring relatively disposed on the upper layer side with the first wiring runs on the first wiring.
- An etching solution used for etching the second wiring when patterning the second wiring on the upper layer side of the first wiring is along the side edge of the first wiring at the intersection (climbing portion) in the second wiring.
- the etching liquid is provided by the amount of the bent portion. It is possible to lengthen the infiltration path. Therefore, it is difficult for the crossing portion of the second wiring to be etched by the etching solution over the entire width, and thus the disconnection of the second wiring is difficult to occur.
- the first wiring and the second wiring are arranged in the non-display area in the display device.
- the second wiring is directly or indirectly connected to the wiring in the display area.
- a predetermined voltage cannot be supplied to the wiring in the display area and the display quality may be significantly impaired.
- the above-described configuration prevents the second wiring from being disconnected. It is possible to effectively prevent the display quality from being adversely affected.
- the non-display area where the first wiring and the second wiring are arranged has a frame shape surrounding the display area, the width of the non-display area when the display device is required to be narrowed is reduced.
- the first wiring and the second wiring are also required to be thinned, and the occurrence of the disconnection is more concerned.
- the above-described configuration prevents the disconnection of the second wiring. This is extremely useful for creating a picture frame.
- the bent portion includes a concave portion that is recessed in the extending direction of the second wiring at least at a side edge of the first wiring. In this way, it is possible to reduce the parasitic capacitance that can be formed between the first wiring and the second wiring.
- the recessed portion has a recessed margin that is not more than half the line width of the first wiring.
- the wiring resistance becomes excessive if the recess allowance of the recess exceeds half the line width of the first wiring.
- the recess allowance of the recess is set to be half the line width of the first interconnect.
- the wiring resistance concerning the 1st wiring can be kept small by setting it as the following.
- the bent portion includes a convex portion protruding in an extending direction of the second wiring at least at a side edge of the first wiring. In this way, the wiring resistance relating to the first wiring can be reduced.
- the bent portions are respectively provided at both side edges of the intersecting portion of the first wiring. In this way, the etching solution intrusion path can be lengthened at any of both side edges at the intersection of the first wiring, so that the disconnection of the second wiring can be more reliably prevented.
- the bent portion includes a concave portion recessed in one side edge in the extending direction of the second wiring, and a second side edge of the second wiring at the other side edge. And a protrusion protruding in the extending direction of the wiring.
- the change in the area associated with the provision of the bent portion is small or eliminated at the intersection of the first wiring, so that the change in parasitic capacitance that can be formed between the first wiring and the second wiring is reduced. Or it can be eliminated.
- This is advantageous in controlling the voltage value applied to the first wiring and the second wiring.
- the wiring resistance which concerns on a 1st wiring can be maintained small.
- the concave portion and the convex portion are arranged so that at least a part thereof overlaps in the extending direction of the first wiring.
- the change in the line width accompanying the provision of the bent portion is small or eliminated, and thus the first wiring is patterned. In doing so, disconnection or the like due to a pattern defect or the like is less likely to occur.
- the recess margin in the concave portion and the protrusion margin in the convex portion are substantially equal to each other.
- the line width in the portion of the first wiring where the concave portion and the convex portion overlap in the extending direction of the first wiring can be made equal to the portion where the concave portion and the convex portion are not formed.
- the concave portion and the convex portion are arranged so that the center positions in the extending direction of the first wiring are substantially the same. If it does in this way, a crevice and a convex part can be arranged so that it may overlap to the maximum about the extension direction of the 1st wiring. Thereby, when patterning the first wiring, disconnection due to a pattern defect or the like is less likely to occur.
- the concave portion and the convex portion have substantially the same length in the extending direction of the first wiring.
- the line width of the first wiring can be kept in two ways, that is, a maximum of the formation part of the concave part and the convex part and a non-formation part of the concave part and the convex part. If the length in the extending direction of the first wiring is different between the concave portion and the convex portion, the shape of the first wiring is simplified compared to the case where the first wiring has three line widths at the maximum. Therefore, when patterning the first wiring, disconnection due to a pattern defect or the like is further less likely to occur.
- the bent portions provided at both side edges of the intersecting portion of the first wiring are arranged so that the center positions in the extending direction of the first wiring are substantially the same. In this way, even if the crossing portion in the second wiring is eroded by the etching solution, the crossing portion in the remaining second wiring is easily maintained in a straight shape, and thus the wiring related to the second wiring Resistance can be kept small.
- the display area is provided with a switching element having an electrode and an electrode wiring connected to the electrode, whereas the non-display area is provided with the electrode wiring extended.
- a spare wiring that intersects with an extension of the electrode wiring is provided.
- the first wiring is the spare wiring
- the second wiring is the electrode wiring.
- the display region includes a switching element having a source electrode, a gate electrode, and a drain electrode, a source wiring connected to the source electrode, and a connection to the gate electrode and intersecting the source wiring.
- a gate wiring; a pixel electrode connected to the drain electrode; a storage capacitor wiring that is parallel to the gate wiring and forms a capacitance with respect to the pixel electrode; and a parallel to the source wiring and A connection wiring connected to the storage capacitor wiring is provided, whereas the source wiring and the connection wiring are provided in the non-display area so as to extend, and the source wiring and the connection wiring
- the first wiring is provided with a lead wiring that crosses each extension portion and is connected to the connection wiring. , Whereas are the lead-wire, the second wire is to the source line.
- the storage capacitor wiring that forms a capacitance with the pixel electrode can be supplied with, for example, a reference voltage from an external circuit via the connection wiring and the routing wiring.
- a bent portion at the intersection with the extension of the source wiring in the routing wiring it is possible to prevent disconnection from occurring at the intersection at the extension of the source wiring. Defects can be prevented from being generated, and thus high display quality can be obtained.
- the display region includes a switching element having a source electrode, a gate electrode, and a drain electrode, a source wiring connected to the source electrode, and a connection to the gate electrode and intersecting the source wiring.
- a gate wiring, a pixel electrode connected to the drain electrode, and a storage capacitor wiring that is parallel to the gate wiring and that forms a capacitance with respect to the pixel electrode and is opposed to the pixel electrode
- the storage capacitor line is provided with an extension, and a lead-out line that intersects with the extension of the storage capacitor line and is connected to the extension of the storage capacitor line is provided.
- the first wiring is the storage capacitor wiring
- the second wiring is the lead wiring.
- the storage capacitor wiring that forms a capacitance with the pixel electrode can be supplied with, for example, a reference voltage from an external circuit via the lead wiring.
- a bent portion at the intersection of the storage capacitor wiring with the routing wiring it is possible to prevent disconnection from occurring at the intersection of the routing wiring.
- the second wiring is made of a metal material containing copper. In this way, it is possible to make the wiring resistance related to the second wiring relatively small as compared with the case where the second wiring is made of a metal material containing aluminum.
- the second wiring is formed of a metal material containing copper, when the second wiring is patterned on the upper layer side of the first wiring, the adhesiveness with the resist provided on the upper layer side of the second wiring may be deteriorated. There is a concern that the etchant may easily enter from a gap generated between the resist and the second wiring, and the second wiring may be disconnected. In that respect, by providing a bent portion at the side edge of the intersection of the first wiring with the second wiring, the intrusion path for the etching solution is lengthened, so that the disconnection of the second wiring can be effectively prevented. Can do.
- the bent portion is arranged to have an overlapping portion that overlaps with the second wiring and a non-overlapping portion that does not overlap with the second wiring. In this way, when the second wiring is patterned, even if the second wiring is provided at a position shifted from the normal position in the extending direction of the first wiring, the amount of positional deviation is non-existent. If it is in a range that does not exceed the overlapping portion, the bent portion can be reliably overlapped with the second wiring. Thereby, the function of a bending part can be exhibited more reliably.
- the bent portion is arranged so that a central position in the extending direction of the first wiring overlaps with a side edge of the second wiring. In this way, the distances from the side edges of the bent portion to the side edges of the second wiring are equal. Therefore, for example, after patterning the first wiring and the second wiring, when inspecting the positional relationship of the two wirings in the extending direction of the first wiring, the side edges of the bent portion and the side edges of the second wiring are The interval between them can be used as an index of inspection.
- the bent portion is disposed at a substantially central position in the width direction of the second wiring. In this way, the distances from the side edges of the second wiring to the bent portions are substantially equal. Therefore, for example, after patterning the first wiring and the second wiring, when inspecting the positional relationship of the two wirings in the extending direction of the first wiring, the distance between the side edges of the second wiring and the bent portion Can be used as an index of inspection.
- an image can be displayed in the display area of the display panel using the light supplied from the lighting device.
- luminance of the image displayed can be made high.
- the display panel can be exemplified by a liquid crystal panel.
- Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
- FIG. 1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention.
- the exploded perspective view which shows schematic structure of the liquid crystal display device with which a television receiver is equipped
- Sectional drawing which shows schematically the cross-sectional structure of a liquid crystal display device
- the figure which shows the cross-sectional structure of the liquid crystal panel roughly
- the top view which shows the plane structure of the display area in the array substrate which comprises a liquid crystal panel
- FIG. 7 is a cross-sectional view taken along the line viii-viii of FIG.
- FIG. 7 is a cross-sectional view taken along the line ix-ix in FIG. 7 showing a state in which a resist film is laminated on a metal film forming a source wiring in the array substrate manufacturing process
- 7 is a cross-sectional view taken along the line ix-ix in FIG. 7 showing a state where the exposed resist film is developed in the array substrate manufacturing process.
- FIG. 7 is a cross-sectional view taken along the line ix-ix in FIG.
- region which concerns on the modification 1 of Embodiment 1 The top view which shows the planar structure of the cross
- FIGS. 1 A first embodiment of the present invention will be described with reference to FIGS.
- the liquid crystal display device 10 including the liquid crystal panel 11 is illustrated.
- the upper side shown in FIG. 3 is the front side, and the lower side is the back side.
- the television receiver TV includes a liquid crystal display device 10 (display device), front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, and a power source P.
- a tuner T and a stand S are provided.
- the liquid crystal display device 10 has a horizontally long rectangular shape as a whole.
- the liquid crystal panel 11 is a display panel having a rectangular shape in plan view, and the backlight device 12 (illumination device) is an external light source. These are integrally held by the bezel 13 or the like.
- the backlight device 12 is a so-called direct-type backlight in which a light source is disposed directly under the back surface of the liquid crystal panel 11, and has a chassis 14 opened on the front side (light emitting side, liquid crystal panel 11 side), A reflective sheet 15 laid on the optical member 16, an optical member 16 attached to the opening of the chassis 14, a frame 17 for fixing the optical member 16, and a plurality of cold cathodes accommodated in the chassis 14 in parallel.
- a tube 18 (light source) and a lamp holder 19 that shields the end of the cold cathode tube 18 and has light reflectivity are provided.
- the liquid crystal panel 11 includes a liquid crystal material, which is a substance whose optical characteristics change with application of an electric field, between a pair of transparent (translucent) glass substrates 20 and 21.
- the liquid crystal layer 22 is enclosed.
- the two substrates 20, 21 constituting the liquid crystal panel 11 the one arranged on the back side (backlight device 12 side) is the array substrate (element substrate) 20 and arranged on the front side (light emitting side of the element substrate 20).
- alignment films (not shown) for aligning liquid crystal molecules contained in the liquid crystal layer 22 while facing the liquid crystal layer 22 are formed on the inner surfaces of both the substrates 20 and 21, respectively.
- a pair of front and back polarizing plates 23 are attached to the outer surfaces of the substrates 20 and 21 (see FIG. 3).
- the liquid crystal panel 11 has a display area AA (an area surrounded by a two-dot chain line in FIG. 6) on which an image is displayed and a frame shape (frame shape) surrounding the display area AA. And a non-display area NAA in which no image is displayed.
- the configuration in the display area AA of the array substrate 20 will be described.
- a plurality of source wires (signal wires) 24 extending in the X-axis direction (row direction, lateral direction), that is, extending in a direction orthogonal (crossing) to the source wires 24 and parallel to each other.
- Gate wirings (scanning wirings) 25 and a large number of storage capacitor wirings (auxiliary capacitor wirings, Cs wirings) 26 arranged between the gate wirings 25 and parallel to each other while being parallel to the gate wirings 25 are formed in a grid pattern.
- the gate lines 25 and the storage capacitor lines 26 are alternately arranged, and the intervals between the adjacent gate lines 25 and the storage capacitor lines 26 are set to be approximately equal.
- the gate wiring 25 and the storage capacitor wiring 26 are provided with the same material in the same process in the manufacturing process of the array substrate 20 and are arranged in the same layer (stacking order).
- the gate line 25 and the storage capacitor line 26 are arranged on the lower layer side relative to the source line 24, and the source line 24 is arranged on the upper layer side relatively to the gate line 25 and the storage capacitor line 26. (See FIGS. 8 and 9).
- a gate insulating film (insulating layer) 29 is interposed between the source wiring 24, the gate wiring 25, and the storage capacitor wiring 26 that intersect with each other, thereby maintaining the insulating state therebetween.
- an interlayer insulating film (passivation film, protective layer) 30 is provided on the further upper layer side of the source wiring 24 arranged relatively on the upper layer side.
- the interlayer insulating film 30 protects the source wiring 24. It is illustrated.
- the gate wiring 25, the source wiring 24, and the storage capacitor wiring 26 are all made of a metal material containing copper (Cu), and more specifically, for example, an alloy made of copper and titanium (Ti).
- TFTs 27 Thin Film Transistors, thin film transistors are formed as switching elements connected to both the wiring lines 24 and 25 at the intersections of the source lines 24 and the gate lines 25, respectively.
- the TFT 27 is a so-called inverted stagger type, and is disposed on the gate wiring 25, and a part of the gate wiring 25 serves as a gate electrode 27a.
- the gate electrode 27a is supplied with a scanning signal input to the gate wiring 25 at a predetermined timing.
- a branch line drawn from the source wiring 24 to the TFT 27 side constitutes a source electrode 27b of the TFT 27 that overlaps the gate electrode 27a via a semiconductor film or the like (not shown), and the source electrode 27b
- the image signal (data signal) input to the source wiring 24 is supplied.
- a large number of pixel electrodes 28 having a vertically long rectangular shape are arranged in a matrix.
- the pixel electrode 28 is connected to a drain wiring (not shown together with the contact hole) through a contact hole, and one end side of the drain wiring is drawn out to the TFT 27 side, and a gate electrode 27a and a semiconductor film (not shown) are provided.
- the drain electrode 27c overlaps with the drain electrode 27c.
- the pixel electrode 28 is disposed on a further upper layer side of the interlayer insulating film 30 described above, whereas the drain wiring is provided in the same layer in the same process by the same material as the source wiring 24 described above. Yes.
- a substantially central portion in the long side direction of the pixel electrode 28 is disposed so as to overlap with the storage capacitor wiring 26 via the gate insulating film 29 and the interlayer insulating film 30. Forming. As a result, the voltage of the pixel electrode 28 can be held even during a period when the scanning signal is not input to the gate electrode 27a of the TFT 27 (TFT off period).
- the pixel electrode 28 is made of a transparent conductive film such as ITO (IndiumInTin Oxide) or ZnO (Zinc Oxide).
- a color filter (not shown) composed of colored portions exhibiting R (red), G (green), and B (blue).
- a large number of colored portions are arranged in parallel in a matrix at positions that overlap each pixel electrode 28 on the array substrate 20 side when viewed in plan.
- the light shielding part black matrix which forms the grid
- the light shielding portion is arranged so as to overlap with the source wiring 24, the gate wiring 25, and the storage capacitor wiring 26 on the array substrate 20 in plan view.
- a counter electrode 31 facing the pixel electrode 28 on the array substrate 20 side is provided on the surface of each colored portion and the light shielding portion.
- the non-display area NAA in the array substrate 20 is extended from each gate wiring 25 on the display area AA side to the inner surface side of one end part on the short side (right end part shown in FIG. 6).
- An extension portion 25EX and an extension portion 26EX extended from each storage capacitor wiring 26 are provided, and a terminal portion is provided at the extension end of each extension portion 25EX, 26EX.
- One end side of a gate driver 33 that supplies a scanning signal or the like to the gate wiring 25 and a reference potential or the like to the storage capacitor wiring 26 is connected to the terminal portion.
- a control board (not shown), which is a signal source, is connected to the other end of the gate driver 33.
- the source line 24 extends over the entire length in the short side direction (Y-axis direction) in the display area AA, and both end parts thereof are both end parts on the long side side of the non-display area NAA (shown in FIG. 6). It is extended toward the upper and lower ends.
- the pair of extended portions 24EX are respectively disposed at both ends of the long side of the non-display area NAA of the array substrate 20.
- the spare wiring 32 extends over the three sides of the both ends on the long side in the non-display area NAA and the end on the opposite side to the gate driver 33 (extension portions 25EX and 26EX) among the both ends on the short side.
- the display area AA is surrounded from three sides.
- one end portion on the long side (the upper end portion shown in FIG. 6) is provided with a terminal portion provided on the extended portion 24 EX of the source wiring 24 and the end portion of the spare wiring 32. Has been.
- One end side of a source driver 34 for supplying a scanning signal or the like to the source wiring 24 and the spare wiring 32 is connected to the terminal portion.
- the spare wiring 32 includes a pair of long side portions 32 a extending along the long side direction (X-axis direction) of the array substrate 20 and the short side direction (Y-axis direction) of the array substrate 20. And a short side portion 32b extending along the line. Among these, a pair of long side part 32a cross
- FIG. The spare wiring 32 is provided in the manufacturing process of the array substrate 20 using the same material (metal material including copper as described above) in the same process as the gate wiring 25 and the auxiliary capacitance wiring 26 described above. They are arranged in the same layer (stacking order). Therefore, as shown in FIGS.
- the spare wiring 32 is disposed on the lower layer side relative to the extension portion 24EX of the source wiring 24, and the extension portion 24EX of the source wiring 24 is connected to the spare wiring 32.
- a gate insulating film 29 is interposed between the extended portion 24EX of the source wiring 24 and the long side portion 32a of the spare wiring 32 that intersect with each other, thereby maintaining the insulated state.
- an interlayer insulating film 30 is provided on the further upper layer side of the extended portion 24EX of the source wiring 24 disposed relatively on the upper layer side, and the interlayer insulating film 30 protects the extended portion 24EX of the source wiring 24. Is planned.
- the spare wiring 32 when the predetermined source wiring 24 is disconnected, the spare wiring 32 has, for example, a laser beam at a position that intersects the pair of extended portions 24EX related to the source wiring 24 having the disconnected position BP. Is electrically short-circuited with respect to each extended portion 24EX. As a result, an image signal or the like is supplied from the source driver 34 to the source wiring 24 having the disconnection point BP by using the spare wiring 32 short-circuited by the pair of short-circuiting points SP as a bypass.
- each of the wirings 24 to 26, 32 provided on the array substrate 20 is formed by patterning a metal film made of a metal material into a predetermined pattern shape by a known photolithography method.
- the following problems may occur when patterning the source wiring 24 relatively disposed on the upper layer side. That is, when patterning the source wiring 24, a resist film R having photosensitivity is formed on the upper side of the metal film forming the source wiring 24 (see FIGS. 11 and 12), and the resist film R is exposed and developed. After that (see FIG. 13), wet etching is performed using a predetermined etching solution (see FIG. 14). This etching solution penetrates into the portion of the source wiring 24 covered with the resist film R. There was a possibility.
- the source line 24 has a run-up portion at the intersection of the gate line 24 and the storage capacitor line 26 in the display area AA, and the adhesion with the resist film R may deteriorate at this run-up part.
- the metal material forming the source wiring 24 contains copper, the source wiring 24 is coupled with the fact that, for example, the adhesion to the resist film R is not good compared to a metal material containing aluminum. This is because a gap may be formed between the resist film R and the resist film R, and the etching solution enters the gap.
- This gap that is, the etching solution intrusion path is formed along the side edges of the lower gate wiring 24 and the storage capacitor wiring 26 while crossing the source wiring 24, so that the etching liquid enters the entire width of the source wiring 24.
- the source wiring 24 may be disconnected.
- the disconnection of the source line 24 described above may occur in the intersection 24CP of the extended part 24EX of the source line 24 in the non-display area NAA and the intersection part 24CP of the spare line 32 with the long side part 32a. According to the above, it has been found that in this case, a larger problem may occur.
- a break occurs in the extension portion 24EX on the side (upper side shown in FIG. 6) near the source driver 34 (terminal portion), which is a supply source of various signals, of the pair of extension portions 24EX in the source wiring 24.
- the source driver 34 terminal portion
- the extension portion 24EX of the source wiring 24 that rides on the spare wiring 32 becomes shorter because the flat portion on the spare wiring 32 becomes shorter and the bending points associated with the riding before and after the extension become closer (see FIG. 8).
- the adhesiveness with the resist film R may be further deteriorated. For this reason, when the frame narrowing proceeds, the source wiring 24 tends to be more easily disconnected.
- the source wiring 24 has a side edge of the intersection portion 32 ⁇ / b> CP intersecting the extended portion 24 ⁇ / b> EX of the source wiring 24 in the long side portion 32 a of the spare wiring 32.
- a bent portion 35 bent in the Y-axis direction that is the extending direction is provided.
- the bent portions 35 are respectively provided on both side edges of the intersecting portion 32CP in the long side portion 32a of the auxiliary wiring 32.
- the bent portions 35 are provided on one side edge of both side edges and are recessed in the Y-axis direction.
- the concave portion 36 and the convex portion 37 both have a horizontally long rectangular shape when seen in a plan view, and the long side direction thereof coincides with the X-axis direction, that is, the extending direction of the long side portion 32a of the spare wiring 32, and the short side The direction coincides with the Y-axis direction, that is, the extending direction of the source wiring 24.
- the etching path for the etching solution is made longer than before by the amount of the recessed portion 36, specifically, the dimension of the pair of short sides in the recessed portion 36.
- the etching solution intrusion path is made longer than before by the amount of protrusion of the convex portion 37, specifically, by the dimension of the pair of short sides of the convex portion 37. be able to. This makes it difficult for the extended portion 24EX of the source wiring 24 to be etched over the entire width by the etchant, and thus disconnection of the source wiring 24 is difficult to occur in the non-display area NAA.
- the concave portion 36 is formed by denting the upper side edge shown in FIG. 7 of the intersecting portion 32CP of the spare wiring 32 described above downward.
- the margin (short side dimension) is set to a size that is not more than half (for example, about 1/4) of the line width of the spare wiring 32.
- the convex portion 37 is formed by projecting the lower side edge shown in FIG. 7 of the intersecting portion 32CP of the spare wiring 32 described above downward, and the projecting margin (short side dimension) is as follows.
- the size is not more than half the line width of the spare wiring 32 (for example, about 1/4), and is substantially the same as the recess allowance of the recess 36 described above.
- the recess 36 has a long side dimension smaller than the line width of the source wiring 24, and specifically has a half size.
- the long side dimension of the convex part 37 is substantially the same as the long side dimension of the concave part 36 described above. Therefore, the recesses 36 and the protrusions 37 have substantially the same area when viewed in a plane.
- the parasitic capacitance formed between the intersections 24CP and 32CP between the long side portion 32a of the spare wiring 32 and the extended portion 24EX of the source wiring 24 is substantially the same as that of the previous one not having the concave portion 36 and the convex portion 37. It is assumed that they are equivalent and hardly change.
- the concave portion 36 and the convex portion 37 are arranged so that the center positions in the long side direction are substantially the same. Therefore, the concave portion 36 and the convex portion 37 are arranged so as to overlap each other over the entire length in the long side direction, and do not have a non-overlapping portion. In other words, the concave portion 36 and the convex portion 37 are arranged back to back. Since the concave portion 36 and the convex portion 37 have substantially the same short side dimension and long side dimension as described above, the long side portion 32a of the spare wiring 32 is formed with the bent portion 35 (the concave portion 36 and the convex portion 37).
- the line width is the same between the part and the non-formed part, and the line width is uniform over the entire length.
- the concave portion 36 and the convex portion 37 are arranged so that the central position in the long side direction is substantially equal to the central position in the width direction of the extended portion 24EX of the source wiring 24. Accordingly, the distances between the side edges of the extended portion 24EX of the source wiring 24 and the short sides of the concave portion 36 and the convex portion 37 are substantially equal. Further, the concave portion 36 and the convex portion 37 have a relationship of overlapping the extended portion 24EX of the source wiring 24 in plan view over the entire area.
- This embodiment has the structure as described above, and its operation will be described next.
- the manufacturing procedure of the array substrate 20 in the liquid crystal panel 11 will be described in detail.
- Each structure is sequentially laminated on the surface of the array substrate 20 by a known photolithography method. Specifically, first, the gate wiring 25, the storage capacitor wiring 26, and the spare wiring 32 are formed as the first layer on the surface of the array substrate 20. Then, the gate insulating film 29 as the second layer, the source wiring 24 and the drain wiring as the third layer, the interlayer insulating film 30 as the fourth layer, the pixel electrode 28 as the fifth layer, and the sixth layer. An alignment film, which is a layer of, is formed (see FIGS. 8 and 9).
- each long side portion 32a of the spare wiring 32 has a concave portion 36 and a convex portion 37 which are bent portions 35, but the concave portion 36 and the convex portion 37 have both short side dimensions and long side dimensions. Since they are substantially the same and overlap each other over the entire length in the X-axis direction, the line width of each long side portion 32a of the spare wiring 32 is constant over the entire length and does not change in the middle (see FIG. 7). . This makes it difficult for pattern defects to occur when the spare wiring 32 is patterned. Note that, as shown in FIG.
- a concave portion 36 and a convex portion 37 which are bent portions 35, are provided at the intersection 32CP of the long side portion 32a of the spare wiring 32 with the extended portion 24EX of the source wiring 24.
- the gate insulating film 29, the intersecting portion 24CP of the source wiring 24, and the interlayer insulating film 30 stacked on the upper layer side are formed along the concave portion 36 and the convex portion 37 as viewed in a plan view. Is bent.
- a metal film M made of a metal material forming the source wiring 24 is formed on the upper side of the gate insulating film 29 so as to have a uniform film thickness (source film forming process).
- a resist film R having photosensitivity is formed on the upper layer side of the metal film forming the source wiring 24 so as to have a uniform film thickness (resist film forming process).
- the resist film R is a so-called positive type in which the exposed portion has increased solubility in a developer and can be removed by the developer.
- a process of exposing the resist film R using a mask having a pattern corresponding to the source wiring 24 is performed (exposure process).
- the light shielding part LB of the mask is illustrated by a two-dot chain line, and the light exposed to the resist film R is illustrated by an arrow line.
- the resist film R is developed using a developer (development process). Then, as shown in FIG. 13, while the exposed portion of the resist film R is removed, the non-exposed portion remains.
- wet etching is performed on the metal film M forming the source wiring 24 using a predetermined etching solution (etching process). When wet etching is performed, as shown in FIG.
- an etching solution soaks into a portion exposed without being covered with the resist film R (a portion where the resist film R is not formed). In contrast, the portion that is covered with the resist film R (the portion where the resist film R is formed) remains without being infiltrated with the etching solution.
- the metal film M that forms the source wiring 24 is made of a metal material containing copper, the metal film M does not have good adhesion to the resist film R in the first place, and the board runs on the spare wiring 32 in the non-display area NAA. Since it has a portion (stepped portion), the adhesion with the resist film R tends to be deteriorated at this riding-up portion. Further, when trying to narrow the frame of the liquid crystal display device 10, the metal film M forming the source line 24 is flattened on the spare line 32 as the line width of the spare line 32 becomes narrower. Since the portions become shorter and the bending points accompanying the front and rear rides become closer, the adhesion with the resist film R may further deteriorate (see FIG. 8).
- a gap may be formed between the two, and the gap, that is, the etching solution intrusion path, overlaps with the above-described bent point in plan view. It follows the side edges of the long side portion 32a of the spare wiring 32 on the lower layer side.
- the concave portion 36 and the convex portion 37 that are the bent portions 35 are provided on both side edges of the intersection portion 32CP of the long side portion 32a of the spare wiring 32 and the extended portion 24EX of the source wiring 24, respectively. Therefore, the shape of both side edges is a meandering shape (non-straight shape, bent shape), and the intrusion path of the etching solution can be meandered (bent), and the recess allowance of the recess 36 and the protrusion allowance of the protrusion 37 can be obtained.
- the etching solution penetration path can be made longer than before by the dimension corresponding to the above.
- the cross portion 32CP is also bent at the long side portion 32a on the source driver 34 side (the upper side shown in FIG. 6) which is a supply source of various signals. Since the concave portion 36 and the convex portion 37 which are the portions 35 are provided, the source wiring 24 is prevented from being disconnected in the extended portion 24EX on the supply source side of various signals.
- the liquid crystal display device (display device) 10 includes the display area AA that can display an image and the non-display area NAA that surrounds the display area AA, and is at least not displayed.
- a spare wiring 32 that is a first wiring, and a source wiring 24 that is a second wiring that is arranged on the upper layer side relative to the spare wiring 32 and intersects the spare wiring 32 are provided.
- a bent portion 35 that is bent in the extending direction of the source wiring 24 is provided at the side edge of the spare wiring 32 at the intersection 32CP with the source wiring 24.
- An etching solution used to etch the source wiring 24 when the source wiring 24 is patterned on the upper layer side of the spare wiring 32 is formed on the side edge of the spare wiring 32 at the intersection 24CP (climbing portion) in the source wiring 24.
- the intersection 24CP may be etched over the entire width, and there is a concern that the source wiring 24 may be disconnected.
- a bent portion 35 bent in the extending direction of the source wiring 24 is provided at the side edge of the spare wiring 32 according to the present embodiment at the intersection 32CP with the source wiring 24.
- the etching solution penetration path can be lengthened by the amount. Accordingly, it is difficult for the intersection 24CP in the source wiring 24 to be etched by the etching solution over the entire width, and thus the source wiring 24 is less likely to be disconnected.
- the spare wiring 32 and the source wiring 24 are arranged in the non-display area NAA in the liquid crystal display device 10, and among these, the source wiring 24 is directly or indirectly connected to the wiring in the display area AA. In such a case, if the source wiring 24 is disconnected, a predetermined voltage cannot be supplied to the wiring in the display area AA and the display quality may be significantly impaired. However, the above-described configuration prevents the source wiring 24 from being disconnected. Therefore, the display quality can be effectively prevented from being adversely affected.
- the non-display area NAA in which the spare wiring 32 and the source wiring 24 are arranged has a frame shape surrounding the display area AA, when the liquid crystal display device 10 is required to narrow the frame, Although the width is narrowed, and the auxiliary wiring 32 and the source wiring 24 are also required to be thinned accordingly, the occurrence of the disconnection is a further concern, but the above-described configuration prevents the source wiring 24 from being disconnected. Therefore, it is extremely useful for narrowing the frame.
- the bent portion 35 includes a concave portion 36 that is recessed in the extending direction of the source wiring 24 that is the second wiring at the side edge of the spare wiring 32 that is the first wiring. In this way, the parasitic capacitance that can be formed between the spare wiring 32 and the source wiring 24 can be reduced.
- the recess 36 has a recess margin that is not more than half the line width of the spare wiring 32 that is the first wiring. In this case, there is a concern that the wiring resistance becomes excessive if the recess allowance of the recess exceeds half of the line width of the spare wiring 32, but the recess allowance of the recess 36 is set to be equal to the line width of the reserve wiring 32.
- the wiring resistance concerning the spare wiring 32 can be kept small by setting it to half or less.
- the bent portion 35 includes a convex portion 37 that protrudes in the extending direction of the source wiring 24 that is the second wiring at the side edge of the spare wiring 32 that is the first wiring. In this way, the wiring resistance related to the spare wiring 32 can be reduced.
- bent portions 35 are respectively provided at both side edges of the intersecting portion 32CP of the spare wiring 32 which is the first wiring. In this way, the etching solution intrusion path can be lengthened at any of both side edges of the intersecting portion 32CP of the spare wiring 32, so that the disconnection of the source wiring 24 can be more reliably prevented.
- the bent portion 35 includes a concave portion 36 that is recessed in the extending direction of the source wiring 24 that is the second wiring at one side edge of the both side edges of the intersecting portion 32CP of the spare wiring 32 that is the first wiring, and the other side. And a convex portion 37 that protrudes in the extending direction of the source wiring 24 at the side edge.
- the change in the area associated with the provision of the bent portion 35 is small or eliminated at the intersection 32CP of the spare wiring 32, the change in the parasitic capacitance that can be formed between the spare wiring 32 and the source wiring 24. Can be reduced or eliminated. This is advantageous in controlling the voltage value applied to the spare wiring 32 and the source wiring 24. Further, the wiring resistance related to the spare wiring 32 can be kept small as compared with the case where the concave portions are provided on both side edges of the intersecting portion 32CP.
- the concave portion 36 and the convex portion 37 are formed so that their areas are substantially equal. In this way, since there is almost no change in the area associated with the provision of the bent portion 35 at the intersection 32CP of the spare wiring 32, the parasitic capacitance that can be formed between the spare wiring 32 and the source wiring 24 is changed. It can be almost eliminated. This is more advantageous in controlling the voltage value applied to the spare wiring 32 and the source wiring 24.
- the concave portion 36 and the convex portion 37 are arranged so that at least a part thereof overlaps in the extending direction of the spare wiring 32 that is the first wiring. In this manner, in the portion of the spare wiring 32 where the concave portion 36 and the convex portion 37 overlap in the extending direction of the spare wiring 32, the change in the line width accompanying the provision of the bent portion 35 is reduced or eliminated. When patterning 32, disconnection due to a pattern defect or the like hardly occurs.
- the dent allowance in the recess 36 and the protrusion allowance in the protrusion 37 are substantially equal to each other.
- the line width in the portion of the spare wiring 32 where the concave portion 36 and the convex portion 37 overlap in the extending direction of the preliminary wiring 32 can be made equal to the portion where the concave portion 36 and the convex portion 37 are not formed. Therefore, when patterning the preliminary wiring 32, disconnection due to a pattern defect or the like is further less likely to occur.
- the concave portion 36 and the convex portion 37 are arranged so that the central positions in the extending direction of the preliminary wiring 32 which is the first wiring are substantially the same. In this way, the concave portion 36 and the convex portion 37 can be arranged so as to overlap to the maximum in the extending direction of the auxiliary wiring 32. Thereby, when patterning the preliminary wiring 32, disconnection due to a pattern defect or the like is less likely to occur.
- the recesses 36 and the protrusions 37 are substantially equal in length in the extending direction of the spare wiring 32 that is the first wiring.
- the line width of the spare wiring 32 can be limited to two types, that is, a portion where the concave portion 36 and the convex portion 37 are formed and a portion where the concave portion 36 and the convex portion 37 are not formed. If the length of the auxiliary wiring 32 in the extending direction is different between the concave portion and the convex portion, the shape of the auxiliary wiring 32 is simplified as compared with the maximum number of three line widths of the auxiliary wiring 32. Therefore, when the spare wiring 32 is patterned, disconnection due to a pattern defect or the like is further less likely to occur.
- the bent portions 35 provided at both side edges of the intersecting portion 32CP of the spare wiring 32 which is the first wiring are arranged so that the central positions in the extending direction of the spare wiring 32 are substantially the same. In this way, even if the intersection 24CP in the source wiring 24 is eroded by the etching solution, the intersection 24CP in the remaining source wiring 24 is easily maintained in a straight shape, and thus the source wiring 24 is Such wiring resistance can be kept small.
- a TFT (switching element) 27 having the electrodes 27a, 27b, and 27c and a source wiring (electrode wiring) 24 connected to the source electrode 27b among the electrodes 27a, 27b, and 27c are provided.
- the source wiring 24 is extended and a spare wiring 32 intersecting the extended portion 24EX of the source wiring 24 is provided. Is a spare wiring 32, whereas the second wiring is a source wiring 24 which is an electrode wiring. In this way, when the source wiring 24 is disconnected, the source wiring 24 is repaired by short-circuiting the extension 24EX of the source wiring 24 and the spare wiring 32 at the intersections 24CP and 32CP. Is possible.
- the source wiring 24 as the second wiring is made of a metal material containing copper. In this way, it is possible to make the wiring resistance related to the source wiring 24 relatively small as compared with the case where the source wiring is made of a metal material containing aluminum.
- the source wiring 24 is formed of a metal material containing copper, there is a possibility that the adhesion with the resist film R provided on the upper layer side of the source wiring 24 may deteriorate when the source wiring 24 is patterned on the upper layer side of the spare wiring 32. In such a case, the etchant is likely to enter from a gap formed between the resist film R and the source wiring 24, and there is a concern that the source wiring 24 may be disconnected. In that respect, by providing the bent portion 35 at the side edge of the intersecting portion 32CP with the source wiring 24 in the spare wiring 32, the etching solution intrusion path becomes long, so that the disconnection of the source wiring 24 is effectively prevented. can do.
- the bent portion 35 is disposed at a substantially central position in the width direction of the source wiring 24 that is the second wiring. In this way, the distances from the side edges of the source wiring 24 to the bent portion 35 are substantially equal. Therefore, for example, after patterning the spare wiring 32 and the source wiring 24, when inspecting the positional relationship of the two wirings in the extending direction of the spare wiring 32, the gap between the side edges of the source wiring 24 and the bent portion 35 is determined. The interval can be used as an inspection index.
- Embodiment 1 of this invention was shown, this invention is not restricted to the said embodiment, For example, the following modifications can also be included. In the following modifications, parts similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and illustration and description may be omitted.
- protrusions projecting in the extending direction of the source wiring 24 are formed on both side edges of the intersection 32CP-2 with the extended portion 24EX of the source wiring 24 in the spare wiring 32-2 according to this modification. Only the portion 37-2 is provided.
- the pair of convex portions 37-2 are configured to protrude in opposite directions along the Y-axis direction from each side edge of the intersecting portion 32CP-2 in the spare wiring 32-2.
- the pair of convex portions 37-2 both have a horizontally long rectangular shape when seen in a plan view, and have a short side dimension, a long side dimension, and an area that are substantially equal to each other.
- the pair of convex portions 37-2 are arranged at substantially the center in the width direction of the extended portion 24 ⁇ / b> EX of the source wiring 24 while the center positions in the X-axis direction are substantially the same.
- recesses 36 that are recessed in the extending direction of the source wiring 24 are formed on both side edges of the intersection 32 ⁇ / b> CP- 3 of the spare wiring 32-3 according to the present modification. Only -3 is provided.
- the pair of recesses 36-3 is configured to be recessed inward along the Y-axis direction from each side edge of the intersecting portion 32CP-3 in the spare wiring 32-3.
- the pair of recesses 36-3 both have a horizontally long rectangular shape when seen in a plan view, and have a short side dimension, a long side dimension, and an area that are substantially equal to each other.
- the pair of recesses 36-3 are arranged at approximately the center in the width direction of the extension portion 24 ⁇ / b> EX of the source wiring 24 while the center positions in the X-axis direction are substantially the same.
- Modification 4 of Embodiment 1 will be described with reference to FIG. Here, a configuration in which a pair of concave portions 36-4 and convex portions 37-4 are provided as the bent portions 35-4 is shown.
- a pair of recesses 36- is formed on one side edge of both side edges of the intersection 32CP-4 with the extended portion 24EX of the source wiring 24 in the spare wiring 32-4 according to this modification.
- 4 is disposed at a position spaced apart in the X-axis direction
- a pair of convex portions 37-4 are disposed at positions separated in the X-axis direction on the other side edge.
- Each of the concave portions 36-4 and the convex portions 37-4 has a horizontally long rectangular shape as viewed in a plane, and the short side dimension, the long side dimension, and the area are substantially equal to each other.
- the concave portions 36-4 and the convex portions 37-4 are aligned in the X-axis direction so as to be arranged back to back.
- each of the concave portions 36-4 and the convex portions 37-4 are arranged such that the center positions in the long side direction substantially coincide with the side edges of the extended portion 24EX of the source wiring 24. That is, each of the concave portions 36-4 and the convex portions 37-4 is an overlapping portion RP in which about half of the long side direction is overlapped with the extended portion 24EX of the source wiring 24 in a plan view. Each of the remaining half is a non-overlapping portion NRP that does not overlap with the extended portion 24EX of the source wiring 24 in a plan view.
- the non-overlapping portion NRP functions as a displacement buffer, and the source wiring 24 A portion of the concave portion 36-4 and the convex portion 37-4 can be reliably overlapped with the extended portion 24EX in a plan view.
- the patterned source When inspecting the position of the wiring 24 in the X-axis direction, it is possible to use each short side of each concave portion 36-4 and each convex portion 37-4 as an inspection index.
- the bent portion 35-4 has the overlapping portion RP that overlaps with the source wiring 24 that is the second wiring, and the non-overlapping portion NRP that does not overlap with the source wiring 24. It is arranged. In this way, when the source line 24 is patterned, even if the source line 24 is provided at a position shifted from the normal position in the extending direction of the spare line 32-4, the amount of the position shift If it is in a range that does not exceed the non-overlapping portion NRP, the bent portion 35-4 can be reliably superimposed on the source wiring 24. Thereby, the function of the bending part 35-4 can be exhibited more reliably.
- the bent portion 35-4 is arranged so that the central position in the extending direction of the spare wiring 32-4 overlaps with the side edge of the source wiring 24. In this way, the distances from the both side edges of the bent portion 35-4 to the side edges of the source wiring 24 become equal. Therefore, for example, after patterning the spare wiring 32-4 and the source wiring 24, when inspecting the positional relationship of the two wirings in the extending direction of the spare wiring 32-4, both side edges and the source in the bent portion 35-4 An interval between the side edges of the wiring 24 can be used as an index for inspection.
- Modification 5 of Embodiment 1 Modification 5 of Embodiment 1 will be described with reference to FIG. Here, an arrangement in which the positions of the concave portions 36-5 and the convex portions 37-5 which are the bent portions 35-5 are reversed from the above-described modified example 4 is shown.
- a pair of convex portions 37 is formed on one side edge of both side edges of the intersection 32CP-5 with the extension 24EX of the source wiring 24 in the spare wiring 32-5 according to this modification. -5 is provided, whereas the other side edge is provided with a pair of recesses 36-5. That is, in the present modification, the arrangement of the pair of concave portions 36-5 and the pair of convex portions 37-5 that are the bent portions 35-5 is reversed from that of the above-described modified example 4.
- protrusions projecting in the extending direction of the source wiring 24 are formed on both side edges of the intersection 32CP-6 with the extended portion 24EX of the source wiring 24 in the spare wiring 32-6 according to this modification.
- a pair of portions 37-6 are provided.
- a pair of convex portions 37-6 provided on one side edge and a pair of convex portions 37-6 provided on the other side edge are Y It is set as the form which protrudes in the mutually opposite direction along an axial direction.
- each convex portion 37-6 (relation with the extended portion 24EX of the source wiring 24) have the same relationship as the concave portion 36-4 and the convex portion 37-4 in Modification 4 described above. Therefore, duplicate explanations are omitted.
- Modification 7 of Embodiment 1 will be described with reference to FIG.
- This modification is a further modification of the above-described modification 4, and shows a structure in which only the concave portion 36-7 is provided as the bent portion 35-7.
- concave portions projecting in the extending direction of the source wiring 24 are formed on both side edges of the intersection 32CP-7 with the extension 24EX of the source wiring 24 in the spare wiring 32-7 according to this modification.
- a pair of 36-7 is provided.
- a pair of recesses 36-7 provided on one side edge and a pair of recesses 36-7 provided on the other side edge are in the Y-axis direction. It is made into the form dented inward along.
- the shape and arrangement (relationship with the extended portion 24EX of the source wiring 24) of each recess 36-7 have the same relationship as the recess 36-4 and the protrusion 37-4 in the above-described modification 4. Because of this, redundant explanations are omitted.
- Modification 8 of Embodiment 1 will be described with reference to FIG. Here, a case is shown in which each side edge of the intersecting portion 32CP-8 in the spare wiring 32-8 is provided with a concave portion 36-8 and a convex portion 37-8 with the bent portion 35-8.
- one side edge has a convex portion 37-8 as shown in FIG.
- the concave portion 36-8 are provided, respectively, while the other side edge is provided with a concave portion 36-8 and a convex portion 37-8.
- the convex part 37-8 provided on one side edge and the concave part 36-8 provided on the other side edge are mutually back-to-back. The positions in the X-axis direction are aligned so as to be arranged.
- each concave portion 36-8 provided on one side edge and the convex portion 37-8 provided on the other side edge are back to back.
- the positions in the X-axis direction are aligned so that
- the shape and arrangement (relationship with the extended portion 24EX of the source wiring 24) of each concave portion 36-8 and each convex portion 37-8 are the same as those of the concave portion 36-4 and the convex portion 37-4 in Modification 4 described above. Duplicate explanations are omitted because they have the same relationship.
- the concave portion 36-9 and the convex portion 37-9 which are the bent portions 35-9 according to the present modification are arranged so as to be offset toward one side edge in the extended portion 24EX of the source wiring 24. ing.
- the concave portion 36-9 and the convex portion 37-9 have a central position in the extending direction (X-axis direction) of the spare wiring 32-9 from the center in the width direction of the extending portion 24EX of the source wiring 24 as shown in FIG. It is arranged so as to be shifted to the right side shown in FIG.
- Modification 10 of Embodiment 1 will be described with reference to FIG. Here, an arrangement in which the concave portion 36-10 and the convex portion 37-10 which are the bent portions 35-10 are displaced from each other is shown.
- the concave portion 36-10 and the convex portion 37-10 which are the bent portions 35-10 according to this modification are displaced from each other in the extending direction (X-axis direction) of the spare wiring 32-10. It is supposed to be arranged. Specifically, the concave portion 36-10 is arranged so that the center position in the long side direction substantially coincides with one side edge of the extended portion 24EX of the source wiring 24, whereas the convex portion 37-10 is arranged in the long side direction. Is arranged so as to substantially coincide with the other side edge of the extended portion 24EX of the source wiring 24.
- the concave portion 36-10 and the convex portion 37-10 are formed as overlapping portions RP in which about half of the long side direction is overlapped with the extended portion 24EX of the source wiring 24 in plan view, while the remaining portions About half each is a non-overlapping portion NRP that does not overlap with the extended portion 24EX of the source wiring 24 in a plan view.
- the concave portion 36-10 and the convex portion 37-10 have a long side dimension substantially the same as the line width of the extended portion 24EX of the source wiring 24, and have a relationship that does not overlap each other in the X-axis direction. is doing.
- FIG. 11 is a further modified example of the above-described modified example 10, and shows a modified example of the positional relationship between the concave portion 36-11 that is the bent portion 35-11 and the convex portion 37-11.
- the concave portion 36-11 and the convex portion 37-11 which are the bent portions 35-11 according to the present modification are arranged so as to partially overlap each other in the X-axis direction.
- the dimension of the overlapping portion RP with respect to the extended portion 24EX of the source wiring 24 is more than half the total length of the concave portion 36-11 and the convex portion 37-11 (for example, 2/3 Degree).
- Modification 12 of Embodiment 1 will be described with reference to FIG.
- This modified example is a further modified example of the above-described modified example 5 and shows a configuration in which the concave portions 36-12 and the convex portions 37-12 that are the bent portions 35-12 are displaced from each other.
- each concave portion 36-12 and each convex portion 37-12 are arranged in the extending direction of the spare wiring 32-12 (X-axis direction). ) With respect to each other. Specifically, each concave portion 36-12 and each convex portion 37-12 are arranged at positions where the center positions in the long side direction are displaced from the respective side edges of the extended portion 24EX of the source wiring 24.
- the pair of recesses 36-12 includes the overlapping portion RP with the extended portion 24EX of the source wiring 24 included in one (left side in FIG. 26) and the other (right side in FIG. 26) recess 36-12.
- the non-overlapping portion NRP is disposed at a position where they have substantially the same area.
- the pair of convex portions 37-12 includes a non-overlapping portion NRP with the extension 24EX of the source wiring 24 included in one (left side in FIG. 26) and the other (right side in FIG. 26).
- the overlapping portion RP included in the convex portion 37-12 is arranged at a position where they have substantially the same area.
- the one concave portion 36-12 and the one convex portion 37-12 are arranged so that a part thereof overlaps in the X-axis direction.
- the other concave portion 36-12 and the other convex portion 37-12 are arranged so that a part thereof overlaps in the X-axis direction.
- Modification 13 of Embodiment 1 will be described with reference to FIG.
- This modified example is a further modified example of the above-described modified example 6 and shows an arrangement in which the convex portions 37-13 that are the bent portions 35-13 are displaced from each other.
- FIG. 14 The modification 14 of Embodiment 1 is demonstrated using FIG.
- This modified example is a further modified example of the above-described modified example 4.
- the pair of the concave portions 36-14 and the convex portions 37-14 provided as the bent portions 35-14 with respect to the extended portion 24EX of the source wiring 24 over the entire area. Shows what is superimposed.
- each concave portion 36-14 and each convex portion 37-14 are formed on both side edges of the intersection portion 32CP-14 of the spare wiring 32-14 according to the present modification with the extended portion 24EX of the source wiring 24, respectively.
- a pair is provided, and the concave portions 36-14 and the convex portions 37-14 are arranged so as to overlap the extended portion 24 EX of the source wiring 24 over the entire area.
- each concave portion 36-14 and each convex portion 37-14 have a substantially square shape when seen in a plan view, and the dimension of each side is equal to or less than half the line width of the extended portion 24EX of the source wiring 24 (for example, 1 / 4).
- Each concave portion 36-14 and each convex portion 37-14 are superposed portions RP where the entire region overlaps with the extended portion 24 EX of the source wiring 24.
- the wiring configuration in the array substrate 120 is changed so that the storage capacitor wiring 126 is connected to the source driver 134.
- a connection wiring (second wiring) 38 that is parallel to the source wiring 24 and is connected to the storage capacitor wiring 126 in the display area AA, and a connection wiring 38 in the non-display area NAA.
- a lead wiring (first wiring, Cs trunk) 39 that is connected to the source driver 134 and connected to the source driver 134 is provided.
- connection wiring 38 is configured to extend along the Y-axis direction so as to be close to each source wiring 24, and is arranged adjacent to each source wiring 24 while having a slight gap. A large number of connection wirings 38 are provided in association with each source wiring 24. Similarly to the source wiring 24, the connection wiring 38 traverses the display area AA along the short side direction over the entire length, and extends to the ends on both long sides in the non-display area NAA, thereby extending the extended portion 38EX. Have. The connection wiring 38 crosses all the gate wirings 25 and all the storage capacitor wirings 126 in the display area AA, but crosses the predetermined storage capacitor wirings 126 via the contact holes CH. Electrically connected. The connection wiring 38 is provided using the same material in the same process as the source wiring 24 and is arranged in the same layer (stacking order).
- the routing wiring 39 is arranged at the end on the source driver 134 which is a supply source of various signals among the both ends on the long side in the non-display area NAA of the array substrate 120, and is in the X-axis direction, that is, the gate.
- a plurality of wirings 25 and the storage capacitor wiring 126 extend along the extending direction.
- the routing wiring 39 is provided using the same material in the same process as the gate wiring 25 and the storage capacitor wiring 126 and is arranged in the same layer (stacking order). On the other hand, it is arranged on the lower layer side relatively. In other words, the connection wiring 38 is arranged on the upper layer side relative to the routing wiring 39.
- the routing wiring 39 crosses the extension portions 38EX of all the connection wirings 38 through the gate insulating film 29, respectively.
- the connection wiring 38 is electrically connected to a predetermined crossing wiring 39 intersecting through a contact hole CH.
- the routing wiring 39 intersects the extended portions 38EX of all the connection wirings 38. Therefore, the patterning of the connection wiring 38 is performed at the intersection of each connection wiring 38 with each routing wiring 39. There is a concern that disconnection due to the intrusion of the etching solution may occur when performing. Therefore, by providing a bent portion (see FIG. 7) similar to that of the above-described first embodiment at the intersection of each connection wiring 38 with each routing wiring 39, the disconnection of the connection wiring 38 is suitably performed. It is possible to prevent.
- the display area AA includes the TFT (switching element) 27 having the source electrode 27b, the gate electrode 27a, and the drain electrode 27c, and the source wiring 24 connected to the source electrode 27b.
- a gate line 25 connected to the gate electrode 27a and intersecting the source line 24, a pixel electrode 28 connected to the drain electrode 27c, and a capacitor parallel to the gate line 25 and forming a capacitor for the pixel electrode 28
- the storage capacitor wiring 126 and the connection wiring 38 which are parallel to the source wiring 24 and connected to the storage capacitor wiring 126 are provided, whereas the storage wiring wiring 126 which is opposite to the source wiring 24 is provided in the non-display area NAA.
- connection wiring 38 are extended to each of the extension portions of the source wiring 24 and the connection wiring 38.
- 24EX and 38EX are provided, and a routing wiring 39 is provided which is connected to the connection wiring 38.
- the first wiring is a routing wiring 39
- the second wiring is The source wiring 24 is used.
- the storage capacitor wiring 126 that forms a capacitance with the pixel electrode 28 is supplied with a reference voltage, for example, from the source driver 134 that is an external circuit via the connection wiring 38 and the routing wiring 39. Is possible. Since the bent portion 35 is provided at the intersection of the source wiring 24 with the extension 24EX of the source wiring 24, it is possible to prevent disconnection from occurring at the intersection of the extension 24EX of the source wiring 24. It is possible to prevent the occurrence of a line defect related to the source wiring 24, thereby obtaining a high display quality.
- Embodiment 3 of the present invention will be described with reference to FIG.
- the wiring configuration in the array substrate 220 is further changed from the above-described second embodiment.
- action, and effect as above-mentioned Embodiment 2 is abbreviate
- a wiring configuration is adopted in which the storage capacitor wiring 226 is connected to the source driver 234 without using the connection wiring 38 shown in the second embodiment.
- a lead-out wiring (second wiring, Cs trunk) connected to the extension portion 226EX of the storage capacitor wiring 226 and connected to the source driver 234 in the non-display area NAA. 40 is provided.
- the routing wiring 40 is arranged at the end on the gate driver 233 side which is a supply source of the scanning signal to the gate wiring 225 among the both ends on the short side in the non-display area NAA of the array substrate 220.
- a plurality of wires extend along the axial direction, that is, the extending direction of the source wiring 24. Since the routing wiring 40 is provided using the same material in the same process as the source wiring 24 and is arranged in the same layer (stacking order), the gate wiring 225 and the storage capacitor wiring 226 (first capacitance) It is arranged on the lower layer side relative to the (wiring).
- the routing wiring 40 crosses the extended portions 225EX of all the gate wirings 225 and the extended portions 226EX of all the storage capacitor wirings 226 through the gate insulating film 29, respectively.
- the storage capacitor wiring 226 is electrically connected through a contact hole CH to a predetermined routing wiring 40 where the extended portion 226EX intersects.
- the source driver 234 can supply a reference potential to the storage capacitor wiring 226 through the connected routing wiring 40.
- the routing wiring 40 intersects the extended portions 225EX and 226EX in all the gate wirings 225 and the storage capacitor wiring 226. For this reason, there is a concern that disconnection due to the intrusion of the etching solution may occur when patterning the routing wiring 40 at the intersection of each extending portion 225EX, 226EX with each routing wiring 40. Therefore, by providing a bent portion (see FIG. 7) similar to that of the above-described first embodiment at the intersection of each extension portion 225EX, 226EX with each routing wire 40, each routing wire 40 can be It is possible to suitably prevent disconnection.
- the display area AA includes the TFT (switching element) 27 having the source electrode 27b, the gate electrode 27a, and the drain electrode 27c, and the source wiring 24 connected to the source electrode 27b.
- the storage capacitor line 226 that is opposite to the storage capacitor line 226 is provided, whereas the non-display area NAA is provided with the storage capacitor line 226 extended and intersects the extended portion 226EX of the storage capacitor line 226.
- a lead wiring 40 connected to the extension 226EX of the storage capacitor wiring 226 is provided.
- Ri first wiring while being the storage capacitor wiring 226, the second wiring is a lead-wire 40.
- the storage capacitor wiring 226 that forms a capacitance with the pixel electrode 28 can be supplied with, for example, a reference voltage from the source driver 234 that is an external circuit via the routing wiring 40.
- the Since the bent portion 35 is provided at the intersection of the extended portion 226EX of the storage capacitor wiring 226 with the routing wiring 40, disconnection can be prevented from occurring at the intersection of the routing wiring 40. It is possible to prevent the occurrence of a line defect related to the storage capacitor wiring 226 connected to the circuit wiring 40, thereby obtaining a high display quality.
- a wiring configuration is adopted in which the gate wiring 325 and the storage capacitor wiring 326 are connected to the source driver 334 without using the gate driver 233 shown in the third embodiment. is doing. Specifically, on the inner surface side of the array substrate 320, the routing wiring connected to the extension portion 325 EX of the gate wiring 325 and the extension portion 326 EX of the storage capacitor wiring 326 in the non-display area NAA and connected to the source driver 334. (Second wiring, Cs trunk) 41 is provided.
- the routing wiring 41 is arranged at one end of the both ends on the short side in the non-display area NAA of the array substrate 320, and a large number along the Y-axis direction, that is, the extending direction of the source wiring 24.
- the book shall be extended.
- the number of routing lines 41 connected to each storage capacitor line 326 is smaller than the number of storage capacitor lines 326, whereas the number connected to each gate line 325 is the same as the gate line 325.
- the same number is provided. Since the routing wiring 41 is provided using the same material in the same process as the source wiring 24 and is arranged in the same layer (stacking order), the gate wiring 325 and the storage capacitor wiring 326 (first capacitance) It is arranged on the lower layer side relative to the (wiring).
- the routing wiring 41 crosses the extended portions 325EX of all the gate wirings 325 and the extended portions 326EX of all the storage capacitor wirings 326 through the gate insulating film 29, respectively.
- the gate line 325 and the storage capacitor line 326 are electrically connected to a predetermined routing line 41 where the extended portions 325EX and 326EX intersect with each other through a contact hole CH.
- the source driver 334 can supply a scanning signal to the gate wiring 325 through the connected lead wiring 41 and also the reference potential to the storage capacitor wiring 326. Can be supplied.
- the routing wiring 41 intersects the extended portions 325EX and 326EX of all the gate wirings 325 and the storage capacitor wiring 326. For this reason, there is a concern that disconnection due to the intrusion of the etching solution may occur when patterning the routing wiring 41 at the intersections of the extending portions 325EX and 326EX with the routing wiring 41. Therefore, by providing a bent portion (see FIG. 7) similar to that of the above-described first embodiment at the intersection of each extended portion 325EX, 326EX with each routed wire 41, It is possible to suitably prevent disconnection.
- the present invention is not limited to the embodiments described with reference to the above description and drawings.
- the following embodiments are also included in the technical scope of the present invention.
- the bent portion is provided in the spare wiring or the lead wiring arranged in the non-display area.
- a similar bent portion may be provided in each wiring (gate wiring or storage capacitor wiring) arranged in the display area.
- planar shape of the concave and convex portions that are the bent portions is exemplified as a rectangle or a square, but can be changed to other shapes.
- planar shapes of the other concave portions and convex portions a vertically long square, a triangle, a circle, an ellipse, a rhombus, a trapezoid, a pentagon or more polygon can be employed.
- one or two concave portions and convex portions that are bent portions are provided at the side edge of the intersection portion of the first wiring with the second wiring.
- planar shapes of the concave portions and the convex portions which are bent portions provided at the side edges of the first wiring at the intersection with the second wiring, are all the same.
- the planar shape of the bent portion may be set to be different between one side edge and the other side edge of the intersection of the first wiring with the second wiring.
- the areas of the concave portions and the convex portions that are the bent portions provided at the respective side edges of the intersecting portion of the first wiring with the second wiring are all the same.
- the area of the bent portion may be set to be different between one side edge and the other side edge of the intersection of the first wiring with the second wiring.
- the dimensions of the concave portions and the dimensions of the convex portions may be set differently on one side edge and the other side edge of the intersection of the first wiring with the second wiring.
- the first wiring is provided with bent portions on both side edges of the intersection with the second wiring, but the second wiring in the first wiring In the present invention, a bent portion is provided only on one side edge of the crossing portion and a bent portion is not provided on the other side edge.
- the specific arrangement and size (dimensions of each side) of the concave portions and convex portions forming the bent portions can be appropriately changed.
- the recess allowance of the recesses and the protrusion allowance of the protrusions can be about half of the line width of the first wiring, or more than half.
- the spare wiring is connected to the source driver.
- the present invention includes the spare wiring connected to the gate driver.
- the direct type is exemplified as the backlight device included in the liquid crystal display device, but the present invention includes a backlight device of an edge light type.
- Embodiment 1 described above a transmissive liquid crystal display device including a backlight device as an external light source has been exemplified.
- the present invention is applied to a reflective liquid crystal display device that performs display using external light.
- the backlight device can be omitted.
- Embodiment 1 the liquid crystal display device having a rectangular display screen is exemplified, but a liquid crystal display device having a square display screen is also included in the present invention.
- a TFT is used as a switching element of a liquid crystal display device.
- the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)).
- a switching element other than TFT for example, a thin film diode (TFD)
- the present invention can also be applied to a liquid crystal display device for monochrome display.
- the liquid crystal display device using the liquid crystal panel as the display panel has been exemplified.
- the present invention is applicable to a display device using another type of display panel (PDP, organic EL panel, etc.). Applicable. In that case, the backlight device can be omitted.
- SYMBOLS 10 Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Backlight device (illumination device) 20, 120, 220, 320 ... Array substrate (substrate), 21 ... CF substrate (substrate) , 22 ... liquid crystal layer (liquid crystal), 24 ... source wiring (second wiring, electrode wiring), 24EX ... extension, 25 ... gate wiring, 26, 126 ... storage capacitor wiring, 27 ... TFT (switching element), 27a ... Gate electrode (electrode), 27b ... Source electrode (electrode), 27c ... Drain electrode (electrode), 28 ... Pixel electrode, 32 ...
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Abstract
Description
上記した特許文献1に記載されたものは、液晶表示装置における表示領域内に配されるソース配線の断線を防止する構成であるが、表示領域を取り囲む非表示領域に着目したものではない。非表示領域において交差する配線に断線が生じると、その配線が接続された表示領域内の配線にライン欠陥が発生し、表示品位を著しく損なうおそれがある。さらには、近年では、液晶表示装置において狭額縁化が求められる傾向にあり、そうなると表示領域を取り囲む額縁状をなす非表示領域の幅寸法を狭めなければならず、それに伴って非表示領域に配される各配線を細線化すると、従前よりも断線が発生し易くなる、という問題があった。
本発明の表示装置は、画像を表示可能な表示領域と、前記表示領域を取り囲む非表示領域とを備えたものであって、少なくとも前記非表示領域には、第1配線と、前記第1配線に対して相対的に上層側に配されるとともに前記第1配線に対して交差する第2配線とが設けられており、前記第1配線のうち前記第2配線との交差部における側縁には、前記第2配線の延在方向に屈曲した屈曲部が設けられている。
(1)前記屈曲部は、少なくとも前記第1配線における側縁にて前記第2配線の延在方向に凹む凹部を含むものとされる。このようにすれば、第1配線と第2配線との間に形成され得る寄生容量の低減を図ることができる。
本発明によれば、非表示領域において断線を防止することができる。
本発明の実施形態1を図1から図14によって説明する。本実施形態では、液晶パネル11を備える液晶表示装置10について例示する。なお、図3に示す上側を表側とし、同図下側を裏側とする。
実施形態1の変形例1について図15を用いて説明する。ここでは、屈曲部35‐1である凹部36‐1及び凸部37‐1の配置を逆にしたものを示す。
実施形態1の変形例2について図16を用いて説明する。ここでは、屈曲部35‐2として凸部37‐2のみを設けるようにしたものを示す。
実施形態1の変形例3について図17を用いて説明する。ここでは、屈曲部35‐2として凹部36‐3のみを設けるようにしたものを示す。
実施形態1の変形例4について図18を用いて説明する。ここでは、屈曲部35‐4として凹部36‐4及び凸部37‐4を一対ずつ設けるようにしたものを示す。
実施形態1の変形例5について図19を用いて説明する。ここでは、上記した変形例4から、屈曲部35‐5である各凹部36‐5及び各凸部37‐5の配置を逆にしたものを示す。
実施形態1の変形例6について図20を用いて説明する。本変形例は、上記した変形例4のさらなる変形例であって、屈曲部35‐6として凸部37‐6のみを設けるようにしたものを示す。
実施形態1の変形例7について図21を用いて説明する。本変形例は、上記した変形例4のさらなる変形例であって、屈曲部35‐7として凹部36‐7のみを設けるようにしたものを示す。
実施形態1の変形例8について図22を用いて説明する。ここでは、予備配線32‐8における交差部32CP‐8の各側縁をそれぞれ屈曲部35‐8として凹部36‐8及び凸部37‐8を設けるようにしたものを示す。
実施形態1の変形例9について図23を用いて説明する。ここでは、屈曲部35‐9である凹部36‐9及び凸部37‐9の配置を変更したものを示す。
実施形態1の変形例10について図24を用いて説明する。ここでは、屈曲部35‐10である凹部36‐10と凸部37‐10とが互いに位置ずれした配置のものを示す。
実施形態1の変形例11について図25を用いて説明する。本変形例は、上記した変形例10のさらなる変形例であって、屈曲部35‐11である凹部36‐11と凸部37‐11との位置関係を変更したものを示す。
実施形態1の変形例12について図26を用いて説明する。本変形例は、上記した変形例5のさらなる変形例であって、屈曲部35‐12である各凹部36‐12と各凸部37‐12とが互いに位置ずれした配置のものを示す。
実施形態1の変形例13について図27を用いて説明する。本変形例は、上記した変形例6のさらなる変形例であって、屈曲部35‐13である各凸部37‐13が互いに位置ずれした配置のものを示す。
実施形態1の変形例14について図28を用いて説明する。本変形例は、上記した変形例4のさらなる変形例であって、屈曲部35‐14として一対ずつ設けた凹部36‐14及び凸部37‐14が全域にわたってソース配線24の延長部分24EXに対して重畳するようにしたものを示す。
本発明の実施形態2を図29によって説明する。この実施形態2では、アレイ基板120における配線構成を変更したものを示す。なお、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。また、以下では、上記した実施形態1にて示した予備配線32の図示及び説明を省略するものとする。
本発明の実施形態3を図30によって説明する。この実施形態3では、上記した実施形態2からアレイ基板220における配線構成をさらに変更したものを示す。なお、上記した実施形態2と同様の構造、作用及び効果について重複する説明は省略する。
本発明の実施形態4を図31によって説明する。この実施形態4では、上記した実施形態3からアレイ基板320における配線構成をさらに変更したものを示す。なお、上記した実施形態3と同様の構造、作用及び効果について重複する説明は省略する。
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
(1)上記した各実施形態では、非表示領域に配される予備配線や引廻配線などに屈曲部を設けるようにしたものを示したが、非表示領域に配される各配線に加えて、表示領域に配される各配線(ゲート配線や蓄積容量配線)にも同様の屈曲部を設けるようにしても勿論構わない。
Claims (22)
- 画像を表示可能な表示領域と、前記表示領域を取り囲む非表示領域とを備えたものであって、
少なくとも前記非表示領域には、第1配線と、前記第1配線に対して相対的に上層側に配されるとともに前記第1配線に対して交差する第2配線とが設けられており、
前記第1配線のうち前記第2配線との交差部における側縁には、前記第2配線の延在方向に屈曲した屈曲部が設けられている表示装置。 - 前記屈曲部は、少なくとも前記第1配線における側縁にて前記第2配線の延在方向に凹む凹部を含むものとされる請求項1記載の表示装置。
- 前記凹部は、その凹み代が前記第1配線の線幅の半分以下とされている請求項2記載の表示装置。
- 前記屈曲部は、少なくとも前記第1配線における側縁にて前記第2配線の延在方向に突出する凸部を含むものとされる請求項1から請求項3のいずれか1項に記載の表示装置。
- 前記屈曲部は、前記第1配線の前記交差部における両側縁にそれぞれ設けられている請求項1から請求項4のいずれか1項に記載の表示装置。
- 前記屈曲部は、前記第1配線の前記交差部における両側縁のうち、一方の側縁にて前記第2配線の延在方向に凹む凹部と、他方の側縁にて前記第2配線の延在方向に突出する凸部とを含むものとされる請求項5記載の表示装置。
- 前記凹部及び前記凸部は、互いの面積がほぼ等しくなるよう形成されている請求項6記載の表示装置。
- 前記凹部及び前記凸部は、少なくとも一部同士が前記第1配線の延在方向について重なり合うよう配されている請求項6または請求項7記載の表示装置。
- 前記凹部における凹み代と、前記凸部における突出代とが互いにほぼ等しいものとされる請求項8記載の表示装置。
- 前記凹部及び前記凸部は、前記第1配線の延在方向についての中央位置が互いにほぼ同じになるよう配されている請求項8または請求項9記載の表示装置。
- 前記凹部及び前記凸部は、前記第1配線の延在方向についての長さが互いにほぼ等しいものとされる請求項10記載の表示装置。
- 前記第1配線の前記交差部における両側縁にそれぞれ設けられた前記屈曲部は、前記第1配線の延在方向についての中央位置が互いにほぼ同じになるよう配されている請求項5から請求項11のいずれか1項に記載の表示装置。
- 前記表示領域には、電極を有するスイッチング素子と、前記電極に接続される電極配線とが設けられているのに対し、
前記非表示領域には、前記電極配線が延長して設けられるとともにその電極配線の延長部分に対して交差する予備配線が設けられており、
前記第1配線は、前記予備配線とされるのに対し、前記第2配線は、前記電極配線とされる請求項1から請求項12のいずれか1項に記載の表示装置。 - 前記表示領域には、ソース電極、ゲート電極及びドレイン電極を有するスイッチング素子と、前記ソース電極に接続されるソース配線と、前記ゲート電極に接続されるとともに前記ソース配線に対して交差するゲート配線と、前記ドレイン電極に接続される画素電極と、前記ゲート配線に並行するとともに前記画素電極に対して容量を形成しつつ対向状をなす蓄積容量配線と、前記ソース配線に並行するとともに前記蓄積容量配線に接続される接続配線とが設けられているのに対し、
前記非表示領域には、前記ソース配線及び前記接続配線がそれぞれ延長して設けられるとともに、前記ソース配線及び前記接続配線の各延長部分に対してそれぞれ交差し且つ前記接続配線に対して接続される引廻配線が設けられており、
前記第1配線は、前記引廻配線とされるのに対し、前記第2配線は、前記ソース配線とされる請求項1から請求項12のいずれか1項に記載の表示装置。 - 前記表示領域には、ソース電極、ゲート電極及びドレイン電極を有するスイッチング素子と、前記ソース電極に接続されるソース配線と、前記ゲート電極に接続されるとともに前記ソース配線に対して交差するゲート配線と、前記ドレイン電極に接続される画素電極と、前記ゲート配線に並行するとともに前記画素電極に対して容量を形成しつつ対向状をなす蓄積容量配線とが設けられているのに対し、
前記非表示領域には、前記蓄積容量配線が延長して設けられるとともに前記蓄積容量配線の延長部分に対して交差し且つ前記蓄積容量配線の延長部分に対して接続される引廻配線が設けられており、
前記第1配線は、前記蓄積容量配線とされるのに対し、前記第2配線は、前記引廻配線とされる請求項1から請求項12のいずれか1項に記載の表示装置。 - 前記第2配線は、銅を含む金属材料からなる請求項1から請求項15のいずれか1項に記載の表示装置。
- 前記屈曲部は、前記第2配線と重畳する重畳部と、前記第2配線とは重畳しない非重畳部とを有するよう配されている請求項1から請求項16のいずれか1項に記載の表示装置。
- 前記屈曲部は、前記第1配線の延在方向についての中央位置が前記第2配線における側縁と重畳するよう配されている請求項17記載の表示装置。
- 前記屈曲部は、前記第2配線における幅方向のほぼ中央位置に配されている請求項1から請求項17のいずれか1項に記載の表示装置。
- 前記表示領域及び前記非表示領域を有する表示パネルと、前記表示パネルに向けて光を供給するバックライト装置とを備える請求項1から請求項19のいずれか1項に記載の表示装置。
- 前記表示パネルは、一対の基板間に液晶を封入してなる液晶パネルとされる請求項20記載の表示装置。
- 請求項20または請求項21に記載された表示装置を備えるテレビ受信装置。
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AU2011332956A AU2011332956A1 (en) | 2010-11-25 | 2011-11-18 | Display device and television receiver |
CN2011900008978U CN203276738U (zh) | 2010-11-25 | 2011-11-18 | 显示装置和电视接收装置 |
SG2013039649A SG190866A1 (en) | 2010-11-25 | 2011-11-18 | Display device and television receiver |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014155458A1 (ja) * | 2013-03-29 | 2014-10-02 | パナソニック液晶ディスプレイ株式会社 | 表示装置 |
WO2020040246A1 (ja) * | 2018-08-23 | 2020-02-27 | 株式会社ジャパンディスプレイ | 表示装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI505010B (zh) * | 2013-11-12 | 2015-10-21 | E Ink Holdings Inc | 主動元件陣列基板 |
US9785032B2 (en) * | 2013-11-12 | 2017-10-10 | E Ink Holdings Inc. | Active device array substrate and display panel |
KR101633175B1 (ko) * | 2014-04-29 | 2016-06-24 | 엘지디스플레이 주식회사 | 터치 센서 일체형 표시장치 |
KR102308620B1 (ko) * | 2014-11-27 | 2021-10-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104460150B (zh) * | 2014-12-09 | 2018-09-04 | 深圳市华星光电技术有限公司 | 阵列基板、液晶显示面板及该阵列基板的制造方法 |
CN105138166B (zh) * | 2015-08-07 | 2018-07-17 | 深圳市明泰电讯有限公司 | 一种手机触摸屏两侧窄边框的结构及其制备方法和手机 |
KR20180079550A (ko) * | 2016-12-30 | 2018-07-11 | 엘지디스플레이 주식회사 | 표시패널 |
KR102473069B1 (ko) * | 2018-01-02 | 2022-12-01 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
US10964235B1 (en) * | 2018-06-25 | 2021-03-30 | Apple Inc. | Electronic devices with narrow border displays |
US10859884B2 (en) * | 2018-09-13 | 2020-12-08 | HKC Corporation Limited | Liquid crystal display panel and liquid crystal display apparatus |
WO2020065938A1 (ja) * | 2018-09-28 | 2020-04-02 | シャープ株式会社 | 表示デバイス |
CN109545823A (zh) * | 2018-10-23 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | 阵列基板、该阵列基板的制备方法及显示面板 |
CN109613772B (zh) * | 2019-01-03 | 2021-12-10 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、修复方法、显示装置 |
US11778874B2 (en) | 2020-03-30 | 2023-10-03 | Apple Inc. | Reducing border width around a hole in display active area |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236266A (ja) * | 1984-05-10 | 1985-11-25 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JPH05259300A (ja) * | 1992-03-13 | 1993-10-08 | Sony Corp | 半導体装置 |
JP2004013003A (ja) * | 2002-06-10 | 2004-01-15 | Advanced Display Inc | 液晶表示装置 |
JP2005164854A (ja) * | 2003-12-01 | 2005-06-23 | Nec Lcd Technologies Ltd | 液晶表示装置 |
JP2007025281A (ja) * | 2005-07-15 | 2007-02-01 | Sharp Corp | 液晶表示装置 |
JP2007156338A (ja) * | 2005-12-08 | 2007-06-21 | Sharp Corp | ディスプレイパネルの修理方法 |
WO2008010334A1 (fr) * | 2006-07-19 | 2008-01-24 | Sharp Kabushiki Kaisha | substrat matriciel actif, panneau à cristaux liquides, affichage, récepteur de télévision |
WO2010134439A1 (ja) * | 2009-05-21 | 2010-11-25 | シャープ株式会社 | 液晶パネル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5841490A (en) * | 1994-10-31 | 1998-11-24 | Kyocera Corporation | Liquid crystal display device and its fabricating method |
KR100244449B1 (ko) * | 1997-02-11 | 2000-02-01 | 구본준 | 박막 트랜지스터 검사용 단락 배선을 갖는 액정 표시 장치와 그 제조 방법(liquid crystal display having shorting bar for testing tft and method for manufacturing the same) |
JPH10288950A (ja) * | 1997-04-14 | 1998-10-27 | Casio Comput Co Ltd | 液晶表示装置 |
KR100841613B1 (ko) * | 2001-12-28 | 2008-06-27 | 엘지디스플레이 주식회사 | 박막 트랜지스터 검사용 단락 배선을 갖는 액정 표시장치 |
US6774958B2 (en) * | 2002-02-26 | 2004-08-10 | Lg.Philips Lcd Co., Ltd. | Liquid crystal panel, apparatus for inspecting the same, and method of fabricating liquid crystal display thereof |
-
2011
- 2011-11-18 CN CN2011900008978U patent/CN203276738U/zh not_active Expired - Lifetime
- 2011-11-18 WO PCT/JP2011/076692 patent/WO2012070498A1/ja active Application Filing
- 2011-11-18 AU AU2011332956A patent/AU2011332956A1/en not_active Abandoned
- 2011-11-18 US US13/988,622 patent/US8994886B2/en active Active
- 2011-11-18 SG SG2013039649A patent/SG190866A1/en unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236266A (ja) * | 1984-05-10 | 1985-11-25 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JPH05259300A (ja) * | 1992-03-13 | 1993-10-08 | Sony Corp | 半導体装置 |
JP2004013003A (ja) * | 2002-06-10 | 2004-01-15 | Advanced Display Inc | 液晶表示装置 |
JP2005164854A (ja) * | 2003-12-01 | 2005-06-23 | Nec Lcd Technologies Ltd | 液晶表示装置 |
JP2007025281A (ja) * | 2005-07-15 | 2007-02-01 | Sharp Corp | 液晶表示装置 |
JP2007156338A (ja) * | 2005-12-08 | 2007-06-21 | Sharp Corp | ディスプレイパネルの修理方法 |
WO2008010334A1 (fr) * | 2006-07-19 | 2008-01-24 | Sharp Kabushiki Kaisha | substrat matriciel actif, panneau à cristaux liquides, affichage, récepteur de télévision |
WO2010134439A1 (ja) * | 2009-05-21 | 2010-11-25 | シャープ株式会社 | 液晶パネル |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014155458A1 (ja) * | 2013-03-29 | 2014-10-02 | パナソニック液晶ディスプレイ株式会社 | 表示装置 |
US9960191B2 (en) | 2013-03-29 | 2018-05-01 | Panasonic Liquid Crystal Display Co., Ltd. | Display device |
US10128277B2 (en) | 2013-03-29 | 2018-11-13 | Panasonic Liquid Crystal Display Co., Ltd. | Display device |
WO2020040246A1 (ja) * | 2018-08-23 | 2020-02-27 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2020030337A (ja) * | 2018-08-23 | 2020-02-27 | 株式会社ジャパンディスプレイ | 表示装置 |
JP7132032B2 (ja) | 2018-08-23 | 2022-09-06 | 株式会社ジャパンディスプレイ | 表示装置 |
US11815773B2 (en) | 2018-08-23 | 2023-11-14 | Japan Display Inc. | Display device |
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US8994886B2 (en) | 2015-03-31 |
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