WO2012066689A1 - 円柱状部材の研磨装置、円柱状部材および円柱状部材の研磨方法 - Google Patents

円柱状部材の研磨装置、円柱状部材および円柱状部材の研磨方法 Download PDF

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Publication number
WO2012066689A1
WO2012066689A1 PCT/JP2010/072090 JP2010072090W WO2012066689A1 WO 2012066689 A1 WO2012066689 A1 WO 2012066689A1 JP 2010072090 W JP2010072090 W JP 2010072090W WO 2012066689 A1 WO2012066689 A1 WO 2012066689A1
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WIPO (PCT)
Prior art keywords
polishing
workpiece
brush
grindstone
cylindrical member
Prior art date
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PCT/JP2010/072090
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English (en)
French (fr)
Japanese (ja)
Inventor
将太 澤井
茂 棚橋
雅雄 平野
Original Assignee
新東工業株式会社
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Filing date
Publication date
Application filed by 新東工業株式会社 filed Critical 新東工業株式会社
Priority to JP2011549090A priority Critical patent/JP5594295B2/ja
Priority to KR1020127007906A priority patent/KR101600997B1/ko
Priority to CN201080044589.5A priority patent/CN102652049B/zh
Publication of WO2012066689A1 publication Critical patent/WO2012066689A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B24B5/045—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally with the grinding wheel axis perpendicular to the workpiece axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/50—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings

Definitions

  • the present invention relates to a polishing apparatus for polishing an outer peripheral surface of a cylindrical workpiece made of a hard and brittle material.
  • the cylindrical member of the hard and brittle material to be polished of the present invention includes, for example, a silicon block that is a material for obtaining a silicon wafer by slicing with a wire saw, and the silicon block is made of a single crystal.
  • a silicon ingot made of a polycrystal is cut into a cylindrical shape by cutting with a band saw or a wire saw. If the required accuracy regarding the external dimensions after the cutting is high, the surface layer is ground.
  • a single crystal silicon block obtained by a chocolate ski method (CZ method) or a polycrystalline silicon block obtained by a casting method or the like is a silicon wafer that is sliced by a wire saw in the next step. If there are microcracks or micro unevenness in the surface layer portion, the silicon wafer manufactured at the time of slicing is likely to be cracked or chipped. Therefore, in Patent Document 1 and Patent Document 2, the surface layer portion of the silicon block is polished and removed. It is disclosed that minute unevenness (and microcracks) present in the surface layer portion is removed to improve the product yield of the silicon wafer.
  • Patent Document 1 discloses that the surface roughness Ry of 10 to 20 ⁇ m before polishing is flattened to 3 to 4 ⁇ m by polishing and removing the surface layer portion of the silicon block of 50 to 100 ⁇ m to 200 ⁇ m from the surface.
  • Patent Document 3 is disclosed as a silicon block polishing apparatus.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2005-347712
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2002-252188
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2009-233794
  • Patent Documents 1 to 3 each disclose a method and apparatus for polishing a surface layer portion of a silicon block of a quadrangular columnar member, and perform polishing processing of a surface layer portion of a cylindrical member to be performed by the present invention. No device is disclosed. Moreover, the diameter of a cross section may change with the cylindrical member which the cross section does not form a perfect circle, or the manufacture shape dispersion
  • the present invention provides a polishing apparatus and a polishing method that can satisfy the above-mentioned requirements and can polish the outer peripheral surface of a hard and brittle material such as a cylindrical silicon block, which is a workpiece, with a single apparatus. I will provide a.
  • clamping means Connecting to the rotating means of the workpiece, clamping means for clamping the both end faces of the workpiece, polishing means for polishing the outer peripheral surface of the workpiece, the workpiece to the polishing means, A moving means for relatively moving in a longitudinal direction orthogonal to the cross-sectional direction which is a substantially circular shape of the workpiece, and a height position detecting means for detecting the height position of the finished polished product and the workpiece before polishing.
  • a polishing device for polishing a surface layer portion of an outer peripheral surface of a cylindrical workpiece comprising: a control means for performing polishing by calculating the height position and processing conditions;
  • the polishing means includes a grindstone whose tip rotates in contact with the outer peripheral surface of the workpiece, and a hair material containing abrasive grains or an elastic body containing abrasive grains, and the tip is provided on the outer peripheral surface of the workpiece.
  • At least one polishing brush rotating in contact with each other For example, the polishing brush and the grinding wheel are arranged consecutively provided along the axis of the cylindrical workpiece.
  • the polishing means includes a first grindstone and a polishing brush arranged continuously along the axis of the columnar workpiece.
  • Each of the grindstone and the polishing brush of the first polishing means, and each of the grindstone and the polishing brush of the second polishing means make a pair, and each of the pair of the grindstone and the polishing brush has a circular cross section of the workpiece.
  • the first polishing means and the second polishing means are arranged in the same plane, the axial centers of the first polishing means and the second polishing means are arranged so as to coincide with the radial direction of the workpiece, and the first core forming a pair
  • the axis of the polishing means and the axis of the second polishing means are arranged so as to intersect at the center of the cross section of the workpiece so as to form a predetermined angle ⁇ .
  • the calculation in the control means is performed by calculating a difference in height position from two or more axial centers in the circumferential direction of the workpiece. At least a calculation, a calculation of a difference between a height position of the finished product after polishing and a height position of the workpiece before polishing, and a calculation for setting other processing conditions than the input processing conditions Including any one (third invention)
  • a plurality of bristle materials containing abrasive grains are planted in a ring shape at the bottom of the polishing brush. Structure. (Fourth invention)
  • the polishing brush has a polishing tool mounting plate in which a base of a polishing tool in which a plurality of bristle materials containing abrasive grains are bundled is used. It is a structure that is fixed to a plurality.
  • the polishing brush has an elastic body containing abrasive grains arranged in a ring shape at the bottom of the polishing brush means. It is the structure that was established. (Sixth invention)
  • the particle size of the abrasive forming the grindstone is F60 to # 800. (Seventh invention)
  • the particle size of the abrasive grains mixed with the bristle material or the elastic body used in the polishing means is F180 to ##.
  • Two or more kinds of polishing means having hair materials or elastic bodies having different particle sizes are selected, and polishing means having different abrasive particle sizes are polished in the order of coarse particles to fine particles. It continues along the axial center of a column-shaped workpiece so that it may process.
  • the particle size of the abrasive grains mixed with the bristle material or the elastic body used in the polishing means is F180 to ##.
  • a polishing means having a hair material or an elastic body having a particle size of approximately 2000 is provided continuously along the axial center of a cylindrical workpiece.
  • the cylindrical member is polished by the cylindrical member polishing apparatus according to any one of the first to third inventions, and microcracks existing below 100 ⁇ m are removed from the surface layer of the workpiece.
  • the surface roughness Ry of the polished surface is 3 ⁇ m or less.
  • the columnar member described in the tenth invention is a silicon block or ceramics. (Eleventh invention)
  • the workpiece clamped by the clamping unit is rotated by the rotating unit, and the A dimension adjustment step of adjusting the dimension of the workpiece by contacting and rotating the tip of the grindstone with the outer peripheral surface of the workpiece and moving the polishing means relative to the workpiece; After the dimension adjustment step, the tip of the polishing brush is brought into contact with and rotated on the outer peripheral surface of the workpiece, and the polishing means is moved relative to the workpiece to polish the workpiece. And a finishing process for performing processing. (Twelfth invention)
  • the particle size of the abrasive particles mixed with the bristle material or the elastic body used in the polishing brush is F180 to # 2000, and the particle size is different.
  • the abrasive grains mixed with the bristle material or the elastic body used in the polishing brush have a particle size of F180 to # 2000, and the particle size is approximately Polishing means having the same bristle material or elastic body is continuously provided along the axis of the cylindrical workpiece and polished.
  • the grindstone and polishing brush provided in the polishing means are in contact with the outer peripheral surface of a cylindrical workpiece, and the workpiece is rotated by the rotating means, whereby the outer peripheral surface of the workpiece is polished. can do. Further, since the workpiece clamped by the clamping means is rotated in the circumferential direction by the rotating means (hereinafter referred to as rotating means (for workpiece)), the outer peripheral surface of the workpiece is made uniform. It can be polished. First, the grindstone is used to grind the workpiece to the vicinity of the target dimension, and then the surface can be removed with a polishing brush to remove microcracks present on the surface layer portion of the outer peripheral surface (first and second). 12 inventions).
  • the processing time is shortened by arranging the first polishing means and the second polishing means along the axis of the workpiece by the grindstone and the polishing brush (second invention).
  • the dimension adjusting step can be performed efficiently (seventh invention).
  • the polishing brush has a structure in which a plurality of bristle materials containing abrasive grains are planted in a ring shape at the bottom of the polishing brush, and a base of a polishing tool in which a plurality of bristle materials containing abrasive grains are bundled
  • a structure in which a plurality of fixing members are fixed to the tool mounting plate and a structure in which an elastic body containing abrasive grains is arranged in a ring shape at the bottom of the polishing brush means can be selected as appropriate (fourth and fifth). , Sixth invention).
  • the abrasive grains can be appropriately selected according to the purpose from the range of F180 to # 2000 (JIS R6001: 1998).
  • each abrasive brush contains When the grain size of the abrasive grains is different, the workpieces are arranged in order from “rough” to “fine” so that the workpieces pass through and are processed, so that the workpieces can be processed in a single polishing process. Microcracks and irregularities in the surface layer can be removed (eighth and thirteenth inventions), and multi-stage processing such as “rough” ⁇ “thin” described above is not required, and one-step processing is required. When the surface is obtained (for example, when the surface of the workpiece W has micro cracks and the surface roughness is not greatly different from the required value, the processing is performed only with “fine”).
  • both polishing means should be approximately the same. And the processing time can be shortened (the ninth and fourteenth inventions).
  • the term “substantially the same particle size” of the abrasive and the abrasive means that the abrasive and the abrasive having “the same particle size can be obtained” in addition to the “the same particle size” abrasive. It is a concept that includes.
  • the height position between the shaft core and the outer peripheral surface of the workpiece is measured at two or more locations, and the difference between them is calculated, so that the deviation of the clamping location from the shaft core can be understood.
  • a standard piece (hereinafter referred to as “master work”) of the finished polishing process is detected by the height position detecting means and stored by the polishing means by the polishing means, and stored.
  • the “input” described in the first invention means information input (stored) to the control means manually (operator), information automatically input (stored) to the control means, manual or / and automatic Any of the information input (stored) after the calculation based on the information input (stored) in (1) is included. (Third invention)
  • a cylindrical member having 100 ⁇ m microcracks removed from the surface layer and having a surface roughness Ry of 3 ⁇ m or less can be obtained.
  • a hard and brittle material such as a silicon block or ceramics can be suitably used (tenth and eleventh inventions).
  • FIG. 2A is a partially cutaway cross-sectional view seen from the front
  • FIG. 2B is a view taken along the line AA in FIG. 2A.
  • FIG. 3A is a schematic diagram in which hair material is planted at the bottom
  • FIG. 3B is a schematic diagram in which an elastic body is installed at the bottom.
  • FIG. 4A is an explanatory view showing a position adjusting step
  • FIG. 4B is an explanatory view showing a finishing step.
  • FIG. 5A is an explanatory view for explaining the arrangement of the first polishing means and the second polishing means viewed from the cross-sectional direction of the workpiece
  • FIG. 5B is a first view viewed from the longitudinal direction of the workpiece. It is explanatory drawing explaining arrangement
  • the configuration of the polishing apparatus and the polishing process according to the first embodiment of the present invention will be described with reference to the drawings.
  • the polishing apparatus according to the first embodiment is a polishing apparatus for a cylindrical member in which one grindstone is connected to two polishing brushes having different polishing roughnesses.
  • the vertical and horizontal directions refer to vertical and horizontal directions in the drawings unless otherwise specified.
  • the columnar member polishing apparatus 1 includes a base 11 on which the workpiece W is placed, a lifting / lowering means 12 for moving the base 11 up and down, and a clamp for clamping the workpiece W
  • a means 13 a rotating means (for a workpiece) (not shown) connected to the clamping means for rotating around the axis of the workpiece W, and the clamped workpiece W are shown in the figure.
  • Moving means 14 for moving the sandwiched workpiece W to the machining position by moving in the left-right direction and the outer periphery of the workpiece W for measuring the height position of the workpiece W from the axis.
  • the surface height position detecting means 15, the polishing means 20, and a control means (not shown) are configured.
  • the polishing means 20 includes a grindstone 21 connected to a rotating means (for a grindstone) 21M and a polishing brush 22 connected to a rotating means (for a polishing brush) 22M.
  • the height position detection means 15 measures the height position (reference position) from the axis of the master workpiece to the outer peripheral surface in order to calculate the machining amount of the workpiece W. And stored in a control means (not shown). First, both ends of the master work are clamped by the clamping means 13. When the master work is sandwiched by the sandwiching means 13, for example, the master work is placed on the base 11 having a V-shaped groove. By placing the master work in the groove, the center in the left-right direction (in the direction perpendicular to the paper surface in FIG. 1) about the axis of the master work can always be substantially the same position.
  • the mounting position of the base can be finely adjusted by the elevating means 12 in the vertical direction in the figure.
  • the master work is placed on the base, and the holding shafts 13a and 13b of the holding means 13 are advanced to hold the both ends of the master work.
  • the base 11 is removed from the master work by lowering the base 11 by the lifting means 12.
  • the clamping means 13 is rotated by the rotating means (for the workpiece), that is, rotates around the axis of the clamping shafts 13a and 13b, so that the axis of the clamping shafts 13a and 13b and the axis of the master work are The alignment must be adjusted to match.
  • the height position detecting means 15 measures the outer peripheral surface height position H1 of the master work, and then rotates the master work (for example, 180 degrees) to increase the height in the rotated state.
  • the position H2 is measured.
  • three height position detecting means 15 are arranged in the longitudinal direction (left and right direction in the figure) of the master work, and the height position is measured at each position.
  • the base 11 When the difference between the measured H1 and H2 is calculated and H1 and H2 are not substantially the same, the base 11 is raised and the master work is placed on the base 11, and then the holding shafts 13a and 13b are moved. Retract each and release the master work. Based on the calculation result, the vertical position of the base, that is, the vertical position of the master work is adjusted by raising or lowering the lifting / lowering means 12, and then the master work is clamped by the clamping means 13 again. After removing the base 11 from the master work, H1 and H2 of the master work are similarly measured. When H1 and H2 are substantially the same, the centering process of the master work is completed. Further, the height position H at this time is stored in the control means as a reference position. Thereafter, the base 11 is raised, and after placing the master work on the base 11, the holding shafts 13 a and 13 a are retracted to release the master work, and then the master work is removed from the base 11. The reference position measurement process is completed.
  • the workpiece W is clamped by the clamping means 13 in the same manner as described above, and then the height of the workpiece W is detected by the height position detection means 15.
  • the position h1 is measured.
  • the workpiece W is rotated, and the height position h2 of the workpiece W is measured.
  • the rotation angle can be arbitrarily set according to the shape of the surface of the workpiece W or the like. That is, when the rotation angle is 180 °, two height positions (h1, h2) with respect to the circumferential direction of the workpiece W are obtained, and when the rotation angle is 120 °, three height positions (h1, h2, h3).
  • the base 11 is raised and the workpiece W is moved to the base so that the difference between the respective height positions (h1, h2, h3, h4) becomes the smallest as in the above-described master work centering adjustment. 11, after holding the workpiece W is released and the base 11 is raised or lowered to adjust the vertical position of the base 11, that is, the vertical position of the workpiece W, After being sandwiched again by the sandwiching means 13 and removing the base 11 from the workpiece W, the height positions h1, h2, h3, h4 of the workpiece W are measured again.
  • the height positions h1, h2, h3, and h4 of the workpiece W after adjustment need to be larger than the reference position H.
  • the height positions h1, h2, h3, h4 are the same or different even if there is a difference. It must be within a range that does not affect the rotation, and is calculated and determined by the control means.
  • the workpiece W that has passed the determination is polished by the grindstone 21.
  • the grindstone 21 sets the height positions h1, h2, h3, and h4 of the workpiece W so as to be close to the reference position H in consideration of the polishing amount by the polishing brush in the next process (this height position is defined as h). Used) for the purpose of polishing the workpiece W.
  • the particle size of the abrasive constituting the grindstone 21 is F60 to # 800, preferably # 100 to # 500 (definition of the abrasive particle size is based on JIS standard R6001: 1998), depending on the material and dimensions of the workpiece W. It can be suitably selected from the range.
  • Processing conditions rotation speed of the grindstone 21, rotation speed of the polishing brush 22, rotation speed of the workpiece W, transfer speed of the workpiece W, machining allowance (processing of the workpiece) inputted in advance to the control means
  • the cutting amount of the tip of the polishing brush with respect to the surface S hereinafter simply referred to as “the cutting amount”
  • the reference position H and the height positions h1, h2, h3, h4 are subjected to arithmetic processing, and the grindstone 21 Is moved downward, that is, the grindstone 21 is moved in the direction of the machining surface S.
  • the grindstone 21 is driven by driving a rotating means (for grindstone) 21M (motor in this embodiment) connected to the grindstone 21.
  • polishing is performed (position adjustment step; see FIG. 4A) Note that the difference between the reference position H and the height positions h1, h2, h3, and h4 is large, and a desired processing amount can be obtained by one polishing. If not, polishing may be performed by reciprocating the moving means or by lowering the grindstone 21 step by step each time the moving means is reciprocated. While moving to the previous position, the driving of the rotating means (for the grindstone) 21M is stopped, and then the workpiece W is moved to the position before starting the polishing.
  • the workpiece W is polished by the polishing brush 22 (polishing brushes 22a and 22b).
  • the polishing brush 22 having the form shown in FIG. 2 is used.
  • the bristle material 24a made of synthetic resin such as nylon mixed with abrasive grains is bundled, and one end thereof is fixed in the abrasive tool holder 24b to form the abrasive tool 24, and the base of the abrasive tool 24 is rotated by a rotating means (abrasive tool).
  • the grain size of the abrasive grains mixed with the bristle material is preferably selected from the range of the abrasive grain size or less and F180 to # 2000 (definition of the grain size of the abrasive grains is based on JIS standard R6001: 1998). .
  • the grindstone 21 and the two polishing brushes 22a and 22b are arranged along the axis of the workpiece W. Further, the abrasive grains contained in the bristle materials of the polishing brushes 22a and 22b are different in particle size, and the grindstone 21, the large abrasive particle brush 22a, and the small abrasive particle brush 22b are illustrated. In FIG. 1, they were arranged in order from the left side to the right side.
  • the polishing brush 22a having a large particle size removes most of the scratches and irregularities generated on the surface of the workpiece W (processing surface S) by polishing with the grindstone 21, and most of the microcracks present on the surface layer portion of the workpiece W.
  • the polishing brush 22b having a small particle size can remove microcracks existing in the surface layer portion of the workpiece W (finishing processing).
  • An arithmetic process is performed based on the processing conditions inputted in advance to the control means, the reference position H and the height position h, and the polishing brush 22 is moved in the vertical direction, that is, the polishing brush 22 is moved in the direction perpendicular to the processing surface S. Move. Thereafter, the rotating means (for polishing brush) 22M (motor in this embodiment) connected to the polishing brush 22 is driven to rotate the polishing brush 22 around the axis of the polishing surface. Further, by moving the workpiece W from the left to the right in the drawing by the moving means 14, each polishing surface of the polishing brush 22 comes into contact with the processing surface S of the workpiece W, and based on the processing conditions. Polishing with the polishing brush 22 is performed.
  • polishing can be performed in the order of rough finishing and finishing (finishing step; see FIG. 4B). .
  • the polishing brush 22 is moved (raised) to a position before starting polishing, and the driving of the rotating means (for polishing brush) 22M is stopped.
  • the workpiece W is moved to a position before starting polishing, the driving of the rotating means (for the workpiece) is stopped, and the rotation of the workpiece W is stopped.
  • polishing is performed through the same steps (paragraph 0029 to paragraph 0035). That is, by first measuring the height position of the master workpiece and setting the height position as a reference position, it is possible to polish a plurality of workpieces W thereafter.
  • the workpiece W is moved in the left-right direction in the figure, but the grindstone 21 and the polishing brushes 22a and 22b may be moved, or the grindstone 21 and the polishing brushes 22a and 22b and the workpiece W are moved. Both of them may be moved.
  • the machining conditions are manually input to the control means, but the machining conditions that are manually input and the machining position that is not input from the automatically input (stored) outer peripheral surface height position of the workpiece W are input.
  • the polishing may be performed by calculating the condition by the control means.
  • the moving speed of the workpiece W may be calculated by the control means by inputting the cutting amount and the rotation speed of the polishing means 2, or the cutting amount may be calculated from the other processing conditions and height position by the control means. You may make it calculate. Then, polishing can be performed based on these calculation results.
  • the processing conditions to be input are not limited to the items described in this embodiment.
  • the type of the polishing means 20 and the state of the workpiece may be input, and the calculation by the control means may be combined based on these.
  • the polishing brush 22 as the polishing means 20 is not limited to that shown in FIG. 2, and a polishing tool 25 made of a bristle material 25a mixed with abrasive grains is directly attached and fixed to the polishing tool mounting plate 23.
  • the polishing tool mounting plate 23 may be exchanged together, or without using the polishing tool 25, a bristle material 24c made of synthetic resin such as nylon containing abrasive grains is ring-shaped at the bottom of the polishing means 20. (See FIG. 3A.
  • the upper figure is a front view and the lower figure is a bottom view (a view taken along the line AA in the front view)).
  • an elastic body 24d made of a synthetic resin containing abrasive grains may be arranged in a ring shape at the bottom of the polishing means 20 (see FIG. 3B).
  • the figure is a front view, and the bottom figure is a bottom view (a view taken along the line AA in the front view).
  • the elastic body 24d in this case is, for example, a resin bulk body having a relatively soft hardness, a resin bulk body such as polyurethane or urethane having a large number of bubbles inside, and a fibrous elastic body entangled with each other. It may be a thing.
  • a resin bulk body having a relatively soft hardness the resin itself functions as a buffer material.
  • the bubbles inside serve as a buffer material.
  • the elastic bodies are entangled with each other, so that air is included in these aggregates, and this air layer functions as a cushioning material.
  • the type of synthetic resin, the content of abrasive grains, and the like are appropriately selected so that the elastic body 24d maintains an appropriate elastic force when it contacts the workpiece.
  • the grain size of the abrasive grains mixed in the bristle material 24c and the elastic body 24d is desirably selected from the range of F180 to # 2000, as in this embodiment.
  • the grain size of the abrasive grains contained in the polishing brush 22 that performs rough finishing is compared with the grain size of the abrasive grains contained in the polishing brush 22 that performs finishing.
  • one or more polishing brushes (intermediate finishing process) including an intermediate particle size may be disposed between the polishing brushes 22a and 22b. That is, three or more polishing brushes may be arranged along the axis of the workpiece W.
  • polishing brush 22b for finishing may be disposed.
  • a plurality of grindstones 21 can be arranged.
  • a cylindrical single crystal silicon block which is the workpiece W, is processed into a size of ⁇ 175 mm ⁇ 500 mm, and microcracks existing in the surface layer portion of the workpiece W Then, the surface roughness was removed by removing the irregularities on the surface. Thereafter, when the silicon block was sliced with a wire saw to form a silicon wafer, it was evaluated whether or not the generation rate of defective products due to cracking or chipping of the silicon wafer could be reduced.
  • the silicon block that had not been polished was cut (sliced) with a wire saw to form a silicon wafer, the incidence of defective products due to cracks, chips, etc. was 5 to 6%.
  • the silicon block, which is the workpiece (W) is polished using the polishing apparatus described in the first embodiment to remove microcracks and irregularities and reduce the surface roughness, and then the silicon block The incidence of defective products due to cracks and chipping when a block was sliced with a wire saw to form a silicon wafer was evaluated.
  • the processing conditions in this evaluation test were set as shown in Table 1, and after inputting this into the control means, three single crystal silicon blocks were processed.
  • the results are shown in Table 2.
  • the single crystal silicon block diameter is processed to a target dimension, and the maximum depth of the microcracks is 0.7-0.
  • the microcrack and the surface roughness were reduced to 9 ⁇ m and the surface roughness was a flat portion Ry 0.7 to 1.0 ⁇ m (average: Ry 0.9 ⁇ m).
  • the data described in the column “after polishing with a grindstone” indicates data in a state of “after polishing with a grindstone and before processing with a polishing brush”. Yes, it shows data in the middle of the polishing process.
  • the maximum depth of the microcracks is 3.0 ⁇ m or less, preferably 2.3 ⁇ m or less.
  • the maximum depth is 3.0 ⁇ m or more, the incidence of defective products increases.
  • the maximum depth is 2.3 ⁇ m or less, there is little influence on the occurrence rate of defective products due to cracks / chips when sliced into a thickness of several tens of ⁇ m to form a silicon wafer.
  • the maximum depth was 0.9 ⁇ m, which was significantly less than 2.3 ⁇ m, which affects the incidence of defective products.
  • the polishing apparatus according to the second embodiment has an apparatus configuration that is used when a surface state required by one-stage processing can be obtained without requiring multi-stage processing such as finishing after rough finishing. .
  • the polishing apparatus according to the second embodiment has an apparatus configuration that is used when a surface state required by one-stage processing can be obtained without requiring multi-stage processing such as finishing after rough finishing.
  • the abrasive grains contained in the polishing brushes 22a and 22b The particle size can be substantially the same as that of the polishing brush 22b used for the finishing process.
  • the polishing apparatus according to the third embodiment has an apparatus configuration in which the first polishing means 30 and the second polishing means 40 are arranged so as to shorten the processing time.
  • first polishing means 30 and the second polishing means 40 are arranged so as to shorten the processing time.
  • the first polishing means 30 and the second polishing means 40 are arranged in the same cross section (circular) surface of the workpiece W.
  • the axial centers of the first polishing means 30 and the second polishing means 40 are arranged so as to coincide with the radial direction of the workpiece W, and the first polishing means 30 and the second polishing means 40 are mutually connected.
  • the axis of the first polishing means 20 and the axis of the second polishing means 20 intersect at the center of the cross section of the workpiece W so as to form a predetermined angle ⁇ . Is arranged. (See FIG.
  • This angle ⁇ can be arbitrarily set as long as the first polishing means 30 and the second polishing means 40 do not interfere with each other.
  • the angle ⁇ can be set to 180 °, and the shaft core of the first polishing means 30 and the shaft core of the second polishing means 40 can be disposed so as to completely coincide with each other.
  • the workpiece W is polished while rotating in the circumferential direction, so that the processed surface of the workpiece has two locations of the first polishing means 30 and the second polishing means 40. In this case, the processing time is shortened.
  • each of the grindstones 31 and 41 and the polishing brush may be one each, or a plurality of them may be arranged along the axis of the workpiece W.
  • the figure shows a state where one grindstone 31 and 41 and two polishing brushes 32 and 42 (32a, 32b and 42a, 42b) are arranged, respectively.
  • the particle size of the abrasive forming the grindstone and the particle size of the abrasive grains contained in the bristle material or the elastic body provided in each polishing brush are determined by the grindstone (first polishing means) 31 and the grindstone (first grindstone).
  • the polishing means) 42b are substantially the same, that is, the grindstone and the polishing brush in the same row are set to have substantially the same polishing power.
  • the particle size can be made substantially the same.
  • the present invention is not limited to this, and an arbitrary number of polishing means may be arranged in accordance with the arrangement space, the target processing time, etc. as long as the respective polishing means do not interfere with each other.
  • the present invention is not limited to the processing of a cylindrical silicon block, and can be suitably used for all hard and brittle materials such as ceramics.
  • Polishing equipment 11 base 12 Lifting means 13 Clamping means 13a, 13b Holding shaft 13c, 13d clamping part 14 Means of transportation 15, 15a, 15b, 15c Height position detection means 20 Polishing means 21 Whetstone 21M Rotating means (for grinding stone) 22, 22a, 22b Polishing brush 22M Rotating means (for polishing brush) 30 First polishing means 31 Whetstone (first polishing means) 31M Rotating means (for grinding stone (first polishing means)) 32, 32a, 32b Polishing brush (first polishing means) 40 Second polishing means 41 Whetstone (second polishing means) 41M Rotating means (for grinding stone (second polishing means)) 42, 42a, 42b Second polishing means W Work piece S Work surface
PCT/JP2010/072090 2010-11-18 2010-12-09 円柱状部材の研磨装置、円柱状部材および円柱状部材の研磨方法 WO2012066689A1 (ja)

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KR1020127007906A KR101600997B1 (ko) 2010-11-18 2010-12-09 원기둥형상 부재의 연마장치, 원기둥형상 부재 및 원기둥형상 부재의 연마방법
CN201080044589.5A CN102652049B (zh) 2010-11-18 2010-12-09 圆柱状部件的研磨装置、圆柱状部件以及圆柱状部件的研磨方法

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CN106217146A (zh) * 2016-09-30 2016-12-14 贵州省铜仁市万山区丹缘朱砂工艺品有限公司 一种多磨砂轮阶梯横排的朱砂工艺品加工装置
CN106256490A (zh) * 2016-09-30 2016-12-28 贵州省铜仁市万山区丹缘朱砂工艺品有限公司 一种多磨砂轮横排的朱砂工艺品加工装置
CN106363496A (zh) * 2016-09-30 2017-02-01 贵州省铜仁市万山区丹缘朱砂工艺品有限公司 一种多磨砂轮竖排的朱砂工艺品加工装置
CN106363472A (zh) * 2016-09-30 2017-02-01 贵州省铜仁市万山区丹缘朱砂工艺品有限公司 一种多磨砂轮阶梯竖排的朱砂工艺品加工装置
CN107088794A (zh) * 2017-05-13 2017-08-25 嘉兴汇森集成家居有限公司 一种建筑装修施工用的材料表面处理装置
CN110026852A (zh) * 2019-05-08 2019-07-19 江西亦成光电科技有限公司 一种光学元件生产用高效抛光装置
CN115091334A (zh) * 2022-07-26 2022-09-23 张家港海运金属冷挤压有限公司 一种马达输出轴表面精加工设备及其加工方法

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