WO2012060092A1 - Procédé de production de guide d'ondes optiques et guide d'ondes optiques - Google Patents

Procédé de production de guide d'ondes optiques et guide d'ondes optiques Download PDF

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Publication number
WO2012060092A1
WO2012060092A1 PCT/JP2011/006112 JP2011006112W WO2012060092A1 WO 2012060092 A1 WO2012060092 A1 WO 2012060092A1 JP 2011006112 W JP2011006112 W JP 2011006112W WO 2012060092 A1 WO2012060092 A1 WO 2012060092A1
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WIPO (PCT)
Prior art keywords
core
cladding
forming
resin layer
layer
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PCT/JP2011/006112
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English (en)
Japanese (ja)
Inventor
徹 中芝
近藤　直幸
潤子 八代
橋本　眞治
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パナソニック株式会社
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Publication of WO2012060092A1 publication Critical patent/WO2012060092A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Definitions

  • the present invention relates to the technical field of an optical waveguide, and more particularly to a method of manufacturing an optical waveguide and an optical waveguide.
  • the optical waveguide propagates while totally reflecting light incident on one end at the interface between the core and the cladding having different refractive indexes, and emits the light from the other end.
  • an optical waveguide is manufactured by separately forming a lower cladding layer, a core layer, and an upper cladding layer.
  • the outer surface of the lower cladding layer may be previously plasma-treated to be activated in order to enhance the adhesion between the lower cladding layer and the core layer.
  • the outer surface of the lower cladding layer When the outer surface of the lower cladding layer is plasma-treated as described above, the outer surface of the lower cladding layer may be roughened to reduce the smoothness of the outer surface. When the smoothness of the outer surface of the lower cladding layer is reduced, light scattering tends to increase and waveguide loss increases.
  • An object of the present invention is to provide an optical waveguide excellent in interlayer adhesion between a lower cladding layer and a core layer without performing plasma treatment, and a method of manufacturing the same.
  • One aspect of the present invention is a method of manufacturing an optical waveguide having a core and a clad, which is a first step of forming a resin layer for forming a cladding made of an uncured photocurable resin, and above the resin layer for forming a cladding A second step of forming a core forming resin layer made of an uncured photocurable resin, forming only the portion of the core forming resin layer which should be made the core and making the core of the clad forming resin layer
  • a method of manufacturing an optical waveguide comprising: a light irradiation step of irradiating light only to a portion corresponding to a portion to be light; and a heat treatment step of heat treating the resin layer for core formation and the resin layer for cladding formation. is there.
  • the core forming resin layer has a stamping step of forming a sloped surface, and the embossing step corresponds to the sloped surface. It is preferable that the step of forming the inclined surface on the core-forming resin layer is performed by pressing a molding die having a projection having a molding surface so that the projection enters the core-forming resin layer. .
  • molding die is a height exceeding the thickness of the said resin layer for core formation.
  • a transfer film in which a metal film is laminated is brought into close contact with the inclined surface formed on the core-forming resin layer. It is preferable to have a metal film forming step of transferring and forming the metal film as a metal reflection film on the inclined surface.
  • a second cladding layer forming step of forming a second cladding layer so as to cover and embed the formed cladding layer and core layer after the heat treatment step.
  • the other one aspect of this invention is an optical waveguide which has a core and a clad, Comprising: It is an optical waveguide characterized by manufacturing by the said manufacturing method.
  • Another aspect of the present invention is an optical waveguide having a core and a clad, wherein a substrate, a first clad partially formed on the substrate, and a first clad are overlapped. And a second clad formed to cover and embed the first clad and the core, wherein the outline shape of the first clad and the core in plan view of the substrate.
  • the optical waveguide is characterized in that the contour shape matches and a chemical coupling force is generated between the layers between the first cladding and the core.
  • FIG. 1 is an enlarged view of an essential part for explaining one of the characteristic parts of the method of manufacturing an optical waveguide according to the embodiment of the present invention.
  • FIG. 2 is a principal part expanded sectional view for demonstrating the embossing process of the manufacturing method of the optical waveguide which concerns on embodiment of this invention.
  • FIG. 3 is a side view for explaining the specifications of a mold used in the embossing step of the method of manufacturing an optical waveguide according to the embodiment of the present invention.
  • FIG. 4 is a side view for explaining the configuration of a reflective film transfer film used in the method of manufacturing an optical waveguide according to the embodiment of the present invention.
  • FIG. 5 is a process diagram for explaining a method of manufacturing the optical waveguide of the first embodiment.
  • FIG. 6 is a process diagram for explaining a method of manufacturing the optical waveguide of Comparative Example 1.
  • FIG. 7 is a process diagram for explaining a method of manufacturing the optical waveguide of the second embodiment.
  • the method of manufacturing the optical waveguide according to the present embodiment is, for example, with reference to FIG. 5, a method of manufacturing the optical waveguide 1 having the core 17 and the cladding 13 and is a resin for forming a cladding made of uncured photocurable resin.
  • the core forming resin layer 14 is formed.
  • the convex portion 16a has a molding die 16 having a embossing step of forming the inclined surface 18a, the embossing step including the convex portion 16a having the molding surface 16b corresponding to the inclined surface 18a. It is preferable that this step is a step of forming the inclined surface 18 a on the core-forming resin layer 14 by pushing the resin layer 14 so as to enter the resin layer 14 (FIG. 7F).
  • the height (D) of the convex portion 16 a of the mold 16 be a height exceeding the thickness of the core forming resin layer 14. .
  • the second cladding layer is formed to cover and bury the formed cladding layer 13 and core layer 17 after the heat treatment step (FIG. 5D). It is preferable to have the 2nd cladding layer formation process (FIG.5 (f)) which forms 21.
  • FIG. 5D the 2nd cladding layer formation process
  • the optical waveguide according to the present embodiment is, for example, as shown in FIG. 5, an optical waveguide 1 having a core 17 and a cladding 13 and manufactured by the method of manufacturing the optical waveguide.
  • the optical waveguide according to the present embodiment is, for example, referring to FIG. 5 (g) and FIG. 5 (g '), an optical waveguide 1 having a core 17 and a clad 13 and is provided on a substrate 11 and a substrate 11.
  • the contour shape of the first cladding 13 when the substrate 11 is viewed in plan matches the contour shape of the core 17, and a chemical bonding force is generated between the first cladding and the core.
  • One of the features of the method for producing an optical waveguide according to this embodiment is that an uncured resin layer for core formation is formed on the uncured resin layer for cladding formation without curing. Then, light is simultaneously applied to the uncured resin layer for forming a cladding and the uncured resin layer for forming a core, and heat treatment is simultaneously performed.
  • an uncured photocurable resin layer for forming a cladding 12 is formed, and an uncured photocurable resin layer for forming a core 14 is formed thereon.
  • two photocurable resin layers 12 and 14 are laminated
  • a negative mask 22 in which an exposure pattern is opened is superimposed on the side of the core forming resin layer 14, and ultraviolet light (arrow ( ⁇ ) in FIG. 1 (b)).
  • the core-forming resin layer 14 and the cladding-forming resin layer 12 are irradiated with the ultraviolet light (shown below) through the negative mask 22.
  • the exposure pattern is formed in an outline shape of a portion of the core forming resin layer 14 to be the core 17. That is, only the portion of the core forming resin layer 14 to be the core 17 is exposed.
  • the exposed part of the cladding forming resin layer 12 and the exposed part of the core forming resin layer 14 are in a semi-cured state. Then, when the core forming resin layer 14 and the cladding forming resin layer 12 are heat-treated, the exposed portion which has been in the semi-cured state is completely cured. That is, the uncured resin layer 12 for clad formation and the uncured resin layer 14 for core formation are simultaneously cured.
  • the unexposed area is removed, and the clad layer 13 in which the exposed area of the resin layer 12 for forming a clad is cured and the resin layer 14 for forming a core.
  • the core layer in which the exposed portion is hardened that is, the core 17 remains in an overlapping state with each other.
  • the cladding layer 13 and the resin layer 12 are not subjected to plasma treatment. Interlayer adhesion to the core layer 17 can be enhanced. This is considered to be due to the chemical bonding force acting between the cladding layer 13 and the core layer 17. That is, since the uncured resin layer 12 for clad formation and the uncured resin layer 14 for core formation are laminated simultaneously with light and heat, the resin layer 12 for clad formation and the uncured resin core are formed. It is considered that a chemical bond exists between the resin layer 14 and the layer.
  • the embossing process is performed after the second process and before the light irradiation process.
  • the molding die 16 provided with the convex portion 16a having the molding surface 16b is embossed in the arrow direction with respect to the core forming resin layer 14.
  • the convex portion 16 a of the molding die 16 enters the core forming resin layer 14.
  • the inclined surface 18 a is formed on the core-forming resin layer 14 by the molding surface 16 b of the convex portion 16 a.
  • the inclined surface 18a functions as a micro mirror that changes (for example, changes to substantially vertical) the light path. Therefore, the obtained optical waveguide is suitable for a photoelectric composite wiring board or the like in which the optical waveguide and the electric circuit are combined.
  • the mold 16 used in the embossing step of the method of manufacturing an optical waveguide according to the embodiment of the present invention is a rectangular mold body 16x in a side view and a central portion of the lower surface 16c of the mold body 16x. And a convex portion 16a protruding downward.
  • the convex portion 16a has a molding surface 16b.
  • the molding surface 16b is inclined in a range of 45 ° ⁇ 3 ° from a perpendicular (dotted-dotted line) to the lower surface 16c of the mold body 16x (also inclined in a range of 45 ° ⁇ 3 ° with respect to the lower surface 16c of the mold body 16x) doing).
  • the height (D) of the convex portion 16a is the distance between the lower surface 16c and the tip of the convex portion 16a.
  • the height (D) of the convex portion 16 a of the mold 16 is set to a height exceeding the thickness of the core forming resin layer 14.
  • the symbol S indicates the height of the surface of the core forming resin layer 14 before being embossed.
  • the raised surface abuts on the lower surface 16 c of the mold 16 and is formed flat. If the height (D) of the convex portion 16a of the mold 16 is equal to or less than the thickness of the core forming resin layer 14, the inclined surface 18a is completely formed on the core forming resin layer 14 (in other words, the surface of the raised resin layer 14 may abut against the lower surface 16c of the mold 16 before the core layer forming resin layer 14 is formed over the entire thickness of the core forming resin layer 14 and may not be further pressed.
  • the height (D) of the convex portion 16a of the mold 16 higher than the thickness of the core forming resin layer 14, it is ensured that the inclined surface 18a is completely formed on the core forming resin layer 14 Be done.
  • the upper limit of the height (D) varies depending on the amount of resin from which the convex portions 16a are pushed away, the amount of swelling of the surface of the resin layer 14, etc.
  • the thickness of the core forming resin layer 14 and the cladding forming resin A height corresponding to the sum of the thickness of the layer 12 (see, for example, FIG. 7F) and a height corresponding to a value obtained by adding 5 ⁇ m to the sum are preferable.
  • the inclined surface 18a formed on the core forming resin layer 14 can function as a micro mirror, but in order to enhance the reflection efficiency, it is preferable to form a metal reflection film on the inclined surface 18a.
  • a metal reflective film for example, one formed by a vacuum process such as evaporation or sputtering, one formed by a plating process, one formed by a transfer process using a transfer film, etc. are preferably adopted. obtain.
  • a transfer film (reflection film transfer film) 15 used in the method of manufacturing an optical waveguide according to the present embodiment is a metal film on a PET film 15a (10 ⁇ m thick, etc.) as a base film.
  • a thin film 15b (a thickness of, for example, 1500 ⁇ ) of gold (or another metal may be used) and an adhesive layer 15c (a thickness of, for example, 1 ⁇ m) are laminated in this order.
  • the transfer film 15 is placed so that the adhesive layer 15 c is in contact with the core forming resin layer 14. Then, the transfer film 15 is brought into close contact with the inclined surface 18a formed on the core-forming resin layer 14, whereby the metal film 15b is transferred and formed on the inclined surface 18a as a metal reflective film.
  • the photocurable resin layer constituting the resin layer 12 for forming a clad and the resin layer 14 for forming a core is a layer of a resin which is cured by light (ultraviolet light or the like).
  • the resin is preferably a transparent resin.
  • the formation of the resin layer can be performed, for example, by laminating resin films.
  • the resin film for example, a dry film or the like in which there is no fluidity of the resin at room temperature and the film shape can be maintained is preferably employable.
  • the photocurable resin for example, an acrylic resin, an epoxy resin, or a silicone resin is used. Resins that cure with light and also cure with heat are more preferred. Among them, epoxy resins are preferable, and examples thereof include bisphenol A epoxy, bisphenol F epoxy, and phenoxy resin. Specifically, “YX 8000” manufactured by Japan Epoxy Resins, "YL 7170” manufactured by Japan Epoxy Resins, “Epicoat 1006 FS” manufactured by Japan Epoxy Resins, "YP 50” manufactured by Toto Kasei Co., Ltd., manufactured by Daicel Chemical Industries, Ltd.
  • the first cladding layer 13 and the core layer 17 are covered with the second cladding layer 21 so as to be buried.
  • the material of the second cladding layer 21 may be the same as or different from the material of the first cladding layer 13 or the material of the core layer 17.
  • the refractive index is not particularly limited as long as it is smaller than the refractive index of the core layer 17.
  • the second cladding layer forming step may be performed after the heat treatment step as shown in FIG. 5 (g) or 7 (n), but the first cladding layer 13 and the core layer 17 are formed. If it is back, it will not be limited in particular. That is, it may be before the heat treatment step.
  • epoxy films for cladding and epoxy films for core were produced as materials used for producing an optical waveguide.
  • composition ingredient 7 parts by mass of polypropylene glycol glycidyl ether (“PG 207” manufactured by Tohto Kasei Co., Ltd.) 25 parts by mass of liquid hydrogenated bisphenol A epoxy resin (“YX 8000” manufactured by Japan Epoxy Resins Co., Ltd.) solid hydrogenated bisphenol A Epoxy resin (“YL 7170” manufactured by Japan Epoxy Resins Co., Ltd.) 20 parts by mass ⁇ 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol (Daicel chemistry 8 parts by mass of "EHPE3150” manufactured by Kogyo Co., Ltd.
  • the method of loss evaluation of the optical waveguide in end face input-output is as follows.
  • the 850 nm light from the LED light source is incident on one end face of the optical waveguide through an optical fiber having a core diameter of 10 ⁇ m and a NA of 0.21 through a matching oil (silicone oil).
  • the power (P1) of the light emitted from the other end face is measured by a power meter through the same matching oil, an optical fiber with a core diameter of 200 ⁇ m, and an NA of 0.4. Further, the two optical fibers are directly butted, and the power (P0) of the light emitted without inserting the optical waveguide is measured by a power meter.
  • the insertion loss of the optical waveguide at the end face input / output is calculated based on the formula of “( ⁇ 10) log (P1 / P0)”.
  • the method of evaluating the loss of the optical waveguide at the mirror input / output is as follows.
  • the 850 nm light from the LED light source is incident on one of the micro mirrors of the optical waveguide through an optical fiber having a core diameter of 10 ⁇ m and a NA of 0.21 through a matching oil (silicone oil).
  • the power (P1) of the light emitted from the other micro mirror is measured with a power meter through the same matching oil, through an optical fiber with a core diameter of 200 ⁇ m and NA of 0.4. Further, the two optical fibers are directly butted, and the power (P0) of the light emitted without inserting the optical waveguide is measured by a power meter.
  • the insertion loss of the optical waveguide at the mirror input / output is calculated based on the formula “( ⁇ 10) log (P1 / P0)”.
  • Example 1 The production of the optical waveguide 1 of Example 1 will be described with reference to FIG.
  • FIG. 5 (a) A 140 mm ⁇ 120 mm substrate (“Panlight PC 1151” manufactured by Teijin Chemicals Co., Ltd.) 11 made of polycarbonate resin was subjected to oxygen plasma treatment. The conditions were 10 sccm, 300 W, 2 minutes and 30 seconds.
  • FIG. 5 (b) A clad epoxy film 12 having a thickness of 10 ⁇ m was laminated on a substrate 11 using a pressure type vacuum laminator (“V-130” manufactured by Nichigo Morton Co., Ltd.) under conditions of 60 ° C. and 0.2 MPa. .
  • the PET film was peeled off from the epoxy film 12.
  • FIG. 5 (c) Using a pressure-type vacuum laminator (“V-130” manufactured by Nichigo Morton Co., Ltd.) on a 30 ⁇ m thick core epoxy film 14 on the cladding epoxy film 12 with the cladding epoxy film 12 uncured. And laminated at 60.degree. C. and 0.2 MPa. The PET film was peeled off from the epoxy film 14. At this time, no surface treatment such as plasma treatment was performed.
  • V-130 manufactured by Nichigo Morton Co., Ltd.
  • the negative mask 22 was positioned and overlapped on the core epoxy film 14 side.
  • the negative mask 22 has a configuration in which slits of a linear pattern having a width of 30 ⁇ m and a length of 120 mm are formed in a sheet that does not transmit ultraviolet light. From the side of the core epoxy film 14, using a super high pressure mercury lamp, under a condition of 4 J / cm 2 , UV light (UV light indicated by an arrow ( ⁇ ) in FIG. 5 (d)) through the negative mask 22 The core epoxy film 14 and the cladding epoxy film 12 were irradiated. Of the core epoxy film 14 and the cladding epoxy film 12, portions corresponding to the slits of the linear pattern of the negative mask 22 were exposed.
  • the first clad layer 13 in which the clad epoxy film 12 is cured is formed on the substrate 11, and the core layer 17 in which the core epoxy film 14 is cured is formed on the first clad layer 13. .
  • the first clad layer 13 in which the exposed portion of the clad epoxy film 12 is cured, and the core layer in which the exposed portion of the core epoxy film 14 is cured, that is, the core 17 overlaps each other. Remained on 11th.
  • FIG. 5 (f) Using a pressure type vacuum laminator (“V-130” manufactured by Nichigo Morton Co., Ltd.) at a thickness of 50 ⁇ m on the core layer 17 and a part of the substrate 11 at 80 ° C. It laminated on the conditions of 0.3 Mpa.
  • the PET film was peeled off from the epoxy film 19.
  • the cladding epoxy film 19 was irradiated with ultraviolet light (ultraviolet light indicated by an arrow (2) in FIG. 5 (f)) under a condition of 2 J / cm 2 . Furthermore, it heat-treated at 140 degreeC for 60 minutes.
  • the second cladding layer 21 in which the cladding epoxy film 19 is cured is formed on the core layer 17 and a part of the substrate 11.
  • the second cladding layer 21 is formed to cover and embed the first cladding layer 13 and the core layer 17.
  • An optical waveguide (slab waveguide: planar waveguide) 1 having the first cladding layer 13, the core layer 17 and the second cladding layer 21 was manufactured.
  • the optical waveguide 1 was bonded to the substrate 11.
  • Comparative Example 1 The production of the optical waveguide 1 of Comparative Example 1 will be described with reference to FIG. The same reference numerals are used for the same or corresponding elements as in the first embodiment.
  • FIG. 6 (a) On a 140 mm ⁇ 120 mm substrate (“Panlite PC 1151” manufactured by Teijin Chemicals Ltd.) 11 made of polycarbonate resin, a clad epoxy film 12 having a thickness of 10 ⁇ m was applied using a pressure type vacuum laminator (“V-” manufactured by Nichigo Morton Co.) It laminated
  • the cladding epoxy film 12 was irradiated with ultraviolet light ( ⁇ ) under conditions of 2 J / cm 2 using an ultrahigh pressure mercury lamp. After peeling the PET film from the epoxy film 12, it was further heat-treated at 150 ° C. for 30 minutes.
  • the first cladding layer 13 in which the cladding epoxy film 12 is cured is formed on the substrate 11.
  • the first cladding layer 13 was subjected to oxygen plasma treatment. The conditions were 10 sccm, 300 W, 2 minutes and 30 seconds.
  • FIG. 6 (c) A core epoxy film 14 having a thickness of 30 ⁇ m was applied on the first cladding layer 13 subjected to oxygen plasma treatment at 60 ° C. using a pressure type vacuum laminator (“V-130” manufactured by Nichigo Morton Co., Ltd.) It laminated on the conditions of 0.2 Mpa. The PET film was peeled off from the epoxy film 14.
  • V-130 manufactured by Nichigo Morton Co., Ltd.
  • the negative mask 22 was positioned and overlapped on the core epoxy film 14 side.
  • the negative mask 22 has a configuration in which slits of a linear pattern having a width of 30 ⁇ m and a length of 120 mm are formed in a sheet that does not transmit ultraviolet light. From the side of the core epoxy film 14, using an ultra-high pressure mercury lamp, under a condition of 4 J / cm 2 , UV light (UV light indicated by an arrow ()) in FIG.
  • the core epoxy film 14 was irradiated. A portion of the core epoxy film 14 corresponding to the slit of the linear pattern of the negative mask 22 was exposed. Furthermore, it heat-treated at 140 degreeC for 2 minutes.
  • the core layer 17 in which the core epoxy film 14 is cured is formed on the first cladding layer 13.
  • FIG. 6 (f) A cladding epoxy film 19 having a thickness of 40 ⁇ m was formed on the core layer 17 and a portion of the first cladding layer 13 using a pressure type vacuum laminator (“V-130” manufactured by Nichigo Morton Co., Ltd.) It laminated on conditions of 80 degreeC and 0.3 Mpa.
  • the PET film was peeled off from the epoxy film 19.
  • the cladding epoxy film 19 was irradiated with ultraviolet light (ultraviolet light indicated by an arrow ( ⁇ ) in FIG. 6F) under a condition of 2 J / cm 2 using an extra-high pressure mercury lamp. Furthermore, it heat-treated at 140 degreeC for 60 minutes.
  • the second cladding layer 21 in which the cladding epoxy film 19 is cured is formed on the core layer 17 and a part of the first cladding layer 13.
  • An optical waveguide (slab waveguide: planar waveguide) 2 having the first cladding layer 13, the core layer 17 and the second cladding layer 21 was produced.
  • the optical waveguide 2 was bonded to the substrate 11.
  • the second cladding layer 21 covered only the core layer 17.
  • the first cladding layer 13 is formed on the entire surface of the substrate 11. Further, when the substrate 11 is viewed in plan, the contour shape of the first cladding layer 13 and the contour shape of the core 17 are different.
  • Example 2 The production of the optical waveguide 1 of Example 2 will be described with reference to FIG. The same reference numerals are used for the same or corresponding elements as in the first embodiment.
  • FIG. 7 (a) A flexible double-sided copper-clad laminate ("FELIOS (R-F775)” manufactured by Panasonic Electric Works Co., Ltd.) was prepared, in which a copper foil with a thickness of 12 ⁇ m was laminated on both sides of a 25 ⁇ m-thick polyimide film. A copper foil on one side of this flexible laminate is etched to form an electric circuit in advance, and all copper foils on the other side are etched off and removed to obtain a flexible printed wiring board having an outer size of 130 mm ⁇ 130 mm. Were made and used as the flexible substrate 31.
  • FELIOS R-F775
  • FIG. 7 (d) Using a pressure type vacuum laminator ("V-130" manufactured by Nichigo Morton Co., Ltd.), a core epoxy film 14 having a thickness of 30 ⁇ m on the clad epoxy film 12 under conditions of 60 ° C. and 0.2 MPa , Laminated. The PET film was peeled off from the epoxy film 14.
  • V-130 manufactured by Nichigo Morton Co., Ltd.
  • a mold 16 provided with a convex portion 16a (45 ⁇ m in height) having a molding surface 16b was made of brass. The mold 16 was positioned at the mirror forming position outside the core epoxy film 14.
  • FIG. 7 (f) The mold 16 was pressed under the conditions of 50 ° C., 0.2 MPa, and 15 seconds so that the convex portion 16 a enters the core epoxy film 14.
  • the negative mask 22 was positioned and overlapped on the core epoxy film 14 side.
  • the negative mask 22 has a configuration in which slits of a linear pattern having a width of 30 ⁇ m and a length of 120 mm are formed in a sheet that does not transmit ultraviolet light. From the epoxy film 14 side, using a super-high pressure mercury lamp, under a condition of 3 J / cm 2 , for ultraviolet light (ultraviolet light indicated by an arrow ()) in FIG. The epoxy film 14 and the clad epoxy film 12 were irradiated. The portions of the core epoxy film 14 and the cladding epoxy film 12 corresponding to the slits of the linear pattern of the negative mask 22 were simultaneously exposed.
  • the transfer film 15 was spread and placed on the recessed grooves 18 b of the core layer 17.
  • the transfer film 15 has a configuration in which a gold thin film 15b (thickness 1500 ⁇ ) and an adhesive layer 15c (thickness 1 ⁇ m) are laminated in this order on a PET film 15a (thickness 10 ⁇ m).
  • the transfer film 15 was placed so that the adhesive layer 15 c was in contact with the core layer 17.
  • the transfer film 15 is pushed into the groove 18 at 150 ° C., 0.5 MPa, 15 seconds using the silicone rubber mold 20 provided with the convex portion having a shape along the inner surface of the groove 18 b, and the inclined surface is inclined. It was attached to 18a.
  • the second cladding layer 21 in which the cladding epoxy film 19 is cured is formed on the core layer 17 and a part of the flexible substrate 31.
  • the surface of the second cladding layer 21 was subjected to oxygen plasma treatment.
  • the optical waveguide (channel waveguide) 3 having the first cladding layer 13, the core layer 17 and the second cladding layer 21 is manufactured.
  • the optical waveguide 3 is bonded to the flexible substrate 31 and the coverlay film 24. That is, a photoelectric composite flexible wiring board was produced.
  • the glass plate 32 and the double-sided adhesive tape 33 were removed.
  • the loss evaluation at the mirror input / output of the optical waveguide 3 of the produced photoelectric composite flexible wiring board was performed, it was a good result of 3.8 dB.
  • the value of this loss is the result of measurement using an optical waveguide with a micro mirror. That is, it is a value including mirror loss.
  • the method for manufacturing the optical waveguide according to the present embodiment has, for example, the core 17 and the clad 13 with reference to FIG.
  • a method of manufacturing an optical waveguide 1 the first step (FIG. 5 (b)) of forming a cladding forming resin layer 12 made of an uncured photocurable resin, on the cladding forming resin layer 12,
  • a light irradiation step (FIG.
  • Interlayer adhesion to the core layer 17 is enhanced. This is because, as described above, the clad layer 13 and the core are simultaneously cured by light and heat in a state where the uncured clad forming resin layer 12 and the uncured core forming resin layer 14 are laminated. It is considered to be due to the occurrence of chemical bonding force with the layer 17.
  • the core forming resin layer 14 is formed.
  • the convex portion 16a has a molding die 16 having a embossing step of forming the inclined surface 18a, the embossing step including the convex portion 16a having the molding surface 16b corresponding to the inclined surface 18a. It is preferable that this step is a step of forming the inclined surface 18 a on the core-forming resin layer 14 by pushing the resin layer 14 so as to enter the resin layer 14 (FIG. 7F). Therefore, the inclined surface 18 a is formed on the core forming resin layer 14.
  • the inclined surface 18a functions as a micro mirror that changes the path of light (for example, changes substantially vertically). Therefore, an optical waveguide suitable for a photoelectric composite wiring board or the like in which the optical waveguide and the electric circuit are combined can be obtained.
  • the height (D) of the convex portion 16 a of the mold 16 be a height that exceeds the thickness of the core forming resin layer 14. Therefore, it is ensured that the inclined surface 18a is completely formed on the core forming resin layer 14 (over the entire thickness of the core forming resin layer 14).
  • the core-forming resin layer A step of forming a metal film for transferring the metal film 15b as a metal reflection film on the inclined surface 18a by bringing the transfer film 15 having the metal film 15b in close contact with the inclined surface 18a formed on 14. It is preferable to have 7 (j). Therefore, the metal reflection film can be formed on the inclined surface 18a simply and at low cost, and the reflection efficiency of the micro mirror can be enhanced.
  • the second cladding layer 21 is buried to cover and embed the formed cladding layer 13 and core layer 17. It is preferable to have the 2nd cladding layer formation process (FIG.5 (f)) to form. Therefore, the problem that dust or dirt easily adheres to the core 17 or the problem that the propagation characteristics easily change in an environment where condensation easily occurs can be avoided.
  • the optical waveguide according to the present embodiment is, for example, as shown in FIG. 5, an optical waveguide 1 having a core 17 and a cladding 13 and manufactured by the above-described manufacturing method. Therefore, since the uncured resin layer 12 for clad formation and the resin layer 14 for uncured core formation are simultaneously cured in the laminated state, the clad layer 13 and the core layer 17 are not subjected to plasma treatment. The adhesion between the layers is enhanced. This is because, as described above, the clad layer 13 and the core are simultaneously cured by light and heat in a state where the uncured clad forming resin layer 12 and the uncured core forming resin layer 14 are laminated. It is considered to be due to the occurrence of chemical bonding force with the layer 17.
  • the optical waveguide according to the present embodiment is, for example, referring to FIG. 5 (g) and FIG. 5 (g '), an optical waveguide 1 having a core 17 and a clad 13 and is provided on a substrate 11 and a substrate 11.
  • the contour shape of the first cladding 13 when the substrate 11 is viewed in plan matches the contour shape of the core 17, and a chemical bonding force is generated between the first cladding 13 and the core 17.
  • a resin layer for forming a cladding is cured first, and an uncured resin layer for forming a core is formed on the cured layer (cladding layer).
  • a structure which can not be obtained by individual formation of each layer such as irradiating light to a portion to be made and curing it see Comparative Example 1. That is, such a structure is a structure obtained only because it is manufactured by the method of manufacturing an optical waveguide according to the present embodiment. That is, the structure is obtained only by selectively exposing and curing only the portion to be the core in a state in which the uncured resin layer 12 for cladding formation and the uncured resin layer 14 for core formation are laminated. .
  • the optical waveguide according to the present embodiment having such a structure is simultaneously cured in a state in which the uncured resin layer for forming a cladding 12 and the uncured resin layer for forming a core 14 are laminated.
  • the interlayer adhesion between the cladding layer 13 and the core layer 17 is enhanced without plasma treatment. This is because, as described above, the clad layer 13 and the core are simultaneously cured by light and heat in a state where the uncured clad forming resin layer 12 and the uncured core forming resin layer 14 are laminated. It is considered to be due to the occurrence of chemical bonding force with the layer 17.
  • an optical waveguide capable of manufacturing an optical waveguide excellent in the interlayer adhesion between a cladding layer and a core layer without performing plasma treatment.
  • an optical waveguide manufactured by the method of manufacturing the optical waveguide is provided.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

La présente invention concerne un procédé de production de guide d'ondes optiques (1) avec un noyau (17) et un placage (13, 21), comprenant : une première étape pour former une couche de résine (12) formant un placage comprenant une résine phototraitable non traitée; une seconde étape servant à former sur le dessus de la couche de résine (12) formant le placage une couche de résine (14) formant le noyau comprenant une résine phototraitable non traitée; une étape d'irradiation laser pour irradier avec de la lumière seulement la section placée dans la couche de résine (14) formant le noyau qui deviendra le noyau (17) et seulement la section prévue dans la couche de résine (12) formant le placage qui deviendra le noyau; et une étape de traitement thermique dans laquelle la couche de résine (14) formant le noyau et la couche de résine (12) formant le placage sont thermisées.
PCT/JP2011/006112 2010-11-05 2011-11-01 Procédé de production de guide d'ondes optiques et guide d'ondes optiques WO2012060092A1 (fr)

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JP2010-248614 2010-11-05
JP2010248614A JP5728655B2 (ja) 2010-11-05 2010-11-05 光導波路の製造方法

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WO2019093460A1 (fr) * 2017-11-09 2019-05-16 パナソニックＩｐマネジメント株式会社 Guide d'ondes optique et son procédé de fabrication

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CN105452919B (zh) * 2013-09-27 2020-09-18 松下知识产权经营株式会社 光波导用干膜和使用该光波导用干膜的光波导的制造方法以及光波导
JP6236180B1 (ja) * 2017-03-07 2017-11-22 株式会社エンジニア 工具、およびカバー部材
JP6236179B1 (ja) * 2017-03-07 2017-11-22 株式会社エンジニア ウォーターポンププライヤ、およびカバー部材

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