WO2012057077A1 - Dispositif à semi-conducteurs, cellule photovoltaïque à contacts au verso pourvue d'une carte de câblage, module de cellules photovoltaïques, et procédé de fabrication de dispositif à semi-conducteurs - Google Patents

Dispositif à semi-conducteurs, cellule photovoltaïque à contacts au verso pourvue d'une carte de câblage, module de cellules photovoltaïques, et procédé de fabrication de dispositif à semi-conducteurs Download PDF

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Publication number
WO2012057077A1
WO2012057077A1 PCT/JP2011/074429 JP2011074429W WO2012057077A1 WO 2012057077 A1 WO2012057077 A1 WO 2012057077A1 JP 2011074429 W JP2011074429 W JP 2011074429W WO 2012057077 A1 WO2012057077 A1 WO 2012057077A1
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Prior art keywords
insulating adhesive
wiring
state
insulating
solar cell
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PCT/JP2011/074429
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English (en)
Japanese (ja)
Inventor
隆行 山田
今瀧　智雄
朋代 白木
泰史 道祖尾
安紀子 常深
友宏 仁科
真介 内藤
正朝 棚橋
晃司 福田
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シャープ株式会社
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Publication of WO2012057077A1 publication Critical patent/WO2012057077A1/fr

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a semiconductor device, a back electrode type solar cell with a wiring board, a solar cell module, and a method for manufacturing a semiconductor device.
  • solar cells that convert solar energy into electrical energy have been rapidly expected as next-generation energy sources.
  • solar cells such as those using compound semiconductors and those using organic materials, but currently, solar cells using silicon crystals are the mainstream.
  • the most manufactured and sold solar cells have an n-electrode formed on the surface on which sunlight is incident (light-receiving surface), and a p-electrode on the surface opposite to the light-receiving surface (back surface). It is a double-sided electrode type solar cell having the formed structure.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-88145 discloses a technique for connecting a back electrode type solar cell and a wiring board.
  • a back electrode type solar cell and a wiring board are connected by the following steps. (1) A step in which the electrode portion is solder coated by immersing the back electrode type solar cell in a Sn-Bi solder bath. (2) The process of apply
  • Patent Document 1 Japanese Patent Laid-Open No. 2009-88145
  • the electrode of the back electrode type solar cell and the wiring of the wiring board are electrically connected by Sn—Bi solder, and the back electrode type solar cell is used.
  • the cell and the wiring substrate are mechanically connected by bonding with an acrylic adhesive.
  • Patent Document 1 discloses a technique for bonding a back electrode type solar battery cell and a wiring board with an adhesive, but how to use the adhesive when the back electrode type solar battery cell and the wiring board are bonded together. There is no description on how to make this possible.
  • the adhesive is not cured after application, the adhesive is applied to the electrode of the back electrode solar cell and the wiring of the wiring substrate by the pressure when bonding the back electrode solar cell and the wiring substrate. There is a possibility that sufficient electrical connection cannot be obtained.
  • the adhesive strength of the adhesive is significantly reduced, and it functions as an adhesive that adheres the back electrode solar cell and the wiring board.
  • the surface where the hardened adhesive and the wiring board are in contact with each other does not necessarily become flat, so the solder melted by heating flows out from the gap between the adhesive and the wiring board, and between adjacent electrodes Or the problem of causing the short circuit between wiring also generate
  • Patent Document 1 describes that an adhesive tape can be used as an adhesive.
  • an adhesive tape is used so that it does not overlap electrodes or wiring in a narrow area between electrodes or wiring. The pasting process can lead to a significant decrease in productivity and quality.
  • the object of the present invention is excellent in productivity, can improve the stability of the mechanical connection between the semiconductor substrate and the wiring substrate, and the wiring of the semiconductor substrate and the wiring substrate. It is an object of the present invention to provide a semiconductor device, a back electrode type solar cell with a wiring board, a solar cell module, and a method for manufacturing a semiconductor device that can improve the stability of electrical connection.
  • the present invention provides a semiconductor substrate in which electrodes having different polarities are provided on one surface, a wiring substrate in which wiring is provided on one surface of an insulating base, and a semiconductor substrate and an insulating base.
  • the first insulating adhesive and the second insulating adhesive, and the conductive adhesive provided between the electrode and the wiring, and the first insulating adhesive has a different polarity.
  • the second insulating adhesive is disposed between the surface region of the semiconductor substrate between the electrodes and the surface region of the insulating base material between the adjacent wirings.
  • the second insulating adhesive material includes the first insulating adhesive material and the conductive adhesive material.
  • the first insulating adhesive is supplied with energy in an uncured state, so that the viscosity rises from the uncured state and becomes the first cured state.
  • the viscosity is once lowered from the cured state of 1 to become a softened state, and then the viscosity is increased again to be in the first cured state.
  • the second insulative adhesive has the property of becoming a second cured state in which the viscosity is higher, and the viscosity increases from the uncured state by supplying energy to the uncured state.
  • the semiconductor device has a property of being cured.
  • the first cured state is a state in which the viscosity is higher than that in the uncured state at room temperature, the shape is retained, and the adhesiveness is low.
  • the cured state is preferably a state in which bonding is possible when the viscosity of the first insulating adhesive in the first cured state once decreases and then increases again.
  • the conductive adhesive has a melting point higher than a temperature at which the viscosity of the first insulating adhesive in the first cured state starts to decrease.
  • the first insulating adhesive in the second cured state is white.
  • the present invention also includes a back electrode type solar cell having a semiconductor substrate provided with electrodes having different polarities on one surface, a wiring substrate provided with wiring on one surface of an insulating substrate, and a semiconductor substrate.
  • a first insulating adhesive and a second insulating adhesive provided between the electrode and the insulating base material, and a conductive adhesive provided between the electrode and the wiring.
  • the insulating adhesive is disposed between the surface region of the semiconductor substrate between the electrodes of different polarities and the surface region of the insulating base material between the adjacent wirings, and the second insulating adhesive is 1 is a back electrode type solar cell with a wiring board disposed between the insulating adhesive material 1 and the conductive adhesive material.
  • the present invention is a solar cell module in which the back electrode type solar cell with a wiring board is sealed in a sealing material.
  • the present invention also provides a surface region between electrodes of a semiconductor substrate in which electrodes having different polarities are provided on one surface and insulation between adjacent wires in a wiring substrate in which wiring is provided on one surface of an insulating base.
  • a step of installing a first insulating adhesive on at least one of the surface regions of the conductive substrate, a step of increasing the viscosity of the first insulating adhesive to a first cured state, a surface of the electrode, and The semiconductor substrate and the wiring substrate are overlapped so that the step of installing the second insulating adhesive material including the conductive adhesive on at least one of the surfaces of the wiring and the electrode of the semiconductor substrate and the wiring of the wiring substrate face each other.
  • the first cured state has a higher viscosity than the uncured state at room temperature, has shape retainability, and is in a low adhesive state. It is preferable that the second cured state is a state in which the first insulating adhesive material in the first cured state can be bonded by increasing once again and then increasing again.
  • the softening state, the melting step, and the second hardening state are preferably performed in a single heating step.
  • the conductive adhesive preferably has a melting point higher than a temperature at which the viscosity of the first insulating adhesive in the first cured state starts to decrease.
  • the first insulative adhesive in the second cured state is white.
  • the first insulating adhesive is installed between the electrode of the semiconductor substrate and the peripheral portion of the semiconductor substrate. It is preferred that
  • the first insulating adhesive is positioned between the electrode of the semiconductor substrate and the peripheral portion of the semiconductor substrate for aligning the semiconductor substrate and the wiring substrate. It is preferable to be installed so as to form a mating pattern.
  • the wiring substrate is provided with an alignment pattern corresponding to the alignment pattern of the first insulating adhesive, and the overlapping step is provided on the semiconductor substrate. It is preferable to include a step of aligning so that the alignment pattern of the first insulating adhesive and the alignment pattern of the wiring board overlap.
  • the productivity is excellent, the stability of the mechanical connection between the semiconductor substrate and the wiring substrate can be improved, and the electrical connection between the electrode of the semiconductor substrate and the wiring of the wiring substrate can be stabilized. It is possible to provide a semiconductor device, a back electrode type solar cell with a wiring board, a solar cell module, and a method for manufacturing a semiconductor device that can improve performance.
  • FIG. 7 is a schematic cross-sectional view taken along VII-VII in FIG. 6.
  • FIG. 1 is typical sectional drawing illustrating an example of the manufacturing method of a back surface electrode type photovoltaic cell with a wiring board.
  • a change in heating temperature with respect to elapsed time when a resin capable of being B-staged is used as the first insulating adhesive and a solder resin is used as the second insulating adhesive including the conductive adhesive It is a figure which shows an example of the relationship with the viscosity change of an insulating adhesive material and a 2nd insulating adhesive material.
  • FIG. It is typical sectional drawing of an example of the solar cell module of embodiment. It is an enlarged photograph of the back surface of the back electrode type photovoltaic cell of the Example after installing the 1st insulating adhesive material. It is an enlarged photograph of the surface of the installation side of the wiring of the wiring board of an Example. It is a figure which shows the temperature profile of an Example.
  • FIG. 1 shows a schematic cross-sectional view of a back electrode type solar cell with a wiring board of the present embodiment which is an example of the semiconductor device of the present invention.
  • the back electrode type solar battery cell with a wiring board includes a back electrode type solar battery cell 8 and a wiring board 10.
  • the back electrode type solar cell 8 has a semiconductor substrate 1 and an n-type electrode 6 and a p-type electrode 7 provided on one surface of the semiconductor substrate 1.
  • the n-type electrode 6 and the p-type electrode 7 are electrodes having different polarities.
  • the wiring substrate 10 has an insulating base material 11 and also has an n-type wiring 12 and a p-type wiring 13 provided on one surface of the insulating base material 11.
  • the n-type wiring 12 is a wiring corresponding to the n-type electrode 6, and is provided to face the n-type electrode 6.
  • the p-type wiring 13 is a wiring corresponding to the p-type electrode 7 and is provided to face the p-type electrode 7.
  • the n-type electrode 6 of the back electrode type solar cell 8 is electrically connected to the n-type wiring 12 of the wiring substrate 10 by a conductive adhesive 21.
  • the p-type electrode 7 of the back electrode type solar cell 8 is electrically connected to the p-type wiring 13 of the wiring substrate 10 by the conductive adhesive 21.
  • first insulating adhesive material 22 and a second insulating adhesive material 23 are provided.
  • the first insulative adhesive 22 has a surface region of the semiconductor substrate 1 between the n-type electrode 6 and the p-type electrode 7 that are arranged adjacent to each other on one surface of the semiconductor substrate 1, and an insulating property.
  • the n-type wiring 12 and the p-type wiring 13 disposed adjacent to each other on one surface of the base material 11 are disposed between the surface regions of the insulating base material 11.
  • the first insulating adhesive 22 is provided so as to cover the widthwise end of the surface of the n-type wiring 12 and the widthwise end of the surface of the p-type wiring 13.
  • the second insulating adhesive material 23 is disposed between the first insulating adhesive material 22 and the conductive adhesive material 21.
  • the second insulating adhesive 23 is provided between the respective surfaces of the n-type wiring 12 and the p-type wiring 13 of the wiring substrate 10 and the surface of the semiconductor substrate 1 on the electrode forming side.
  • the connection body between the mold electrode 6 and the conductive adhesive 21 and the connection body between the p-type electrode 7 and the conductive adhesive 21 are covered.
  • the first insulating adhesive 22 is supplied with energy in an uncured state, so that the viscosity rises from the uncured state to the first cured state, and then the viscosity is changed from the first cured state to the viscosity. Is temporarily lowered to a softened state, and then the viscosity is increased again to have a second cured state in which the viscosity is higher than that of the first cured state. In the state of the back electrode type solar cell with a wiring board shown in FIG. 1, the first insulating adhesive 22 is in the second cured state.
  • Examples of the energy supplied to the first insulating adhesive material include thermal energy by heating and / or light energy by irradiation with light such as ultraviolet rays.
  • the uncured first insulating adhesive is cured by, for example, heating and / or irradiation with light such as ultraviolet rays to be in the first cured state.
  • the 1st insulating adhesive material of the 1st hardening state to which adhesive force and fluidity
  • the first insulating adhesive in the first cured state has a higher viscosity than the uncured state at room temperature (about 25 ° C.) and has shape retention (a property that does not deform unless an external force is applied).
  • the state of low adhesiveness even if the back electrode type solar cell 8 and the wiring substrate 10 are brought into contact with the surface of the first insulating adhesive material, the back electrode type solar cell 8 and the wiring substrate 10 are It is preferable that the insulating adhesive is in such a state that it does not adhere to the insulating adhesive. In this case, a highly productive printing process can be employed in the process of installing a solder resin described later.
  • the back electrode type solar cells 8 are also overlapped after the back electrode type solar cells 8 and the wiring substrate 10 are overlapped.
  • the wiring board 10 tend to be easily removable. For this reason, the electrodes of the back electrode type solar battery cell 8 and the wiring of the wiring board 10 tend to be easily and accurately aligned.
  • the second cured state is a state in which the first insulating adhesive material in the first cured state can be bonded by once rising and then rising again.
  • the back electrode type solar cell 8 and the wiring substrate 10 can be bonded in a desired positional relationship.
  • the temperature is preferably lower than the temperature at which the first insulating adhesive in the first cured state is softened and the temperature at which the first insulating adhesive in the softened state is in the second cured state.
  • a step of softening the first cured adhesive material in the first cured state to form a softened first insulating adhesive material; and curing the softened first insulating adhesive material to And the step of forming the first cured adhesive material in the cured state of 2 is performed by heating, the temperature at which the first cured adhesive material in the first cured state is softened is the first temperature in the softened state. It is preferable that the temperature is lower than the temperature at which the first insulating adhesive is cured to obtain the second cured state. By controlling the heating temperature in this way, the first insulating adhesive can be reliably changed in order of the first cured state, the softened state, and the second cured state.
  • the second insulating adhesive material 23 has a property that, when energy is supplied to an uncured state, the viscosity rises from the uncured state and becomes a cured state.
  • Examples of the energy supplied to the second insulating adhesive 23 include thermal energy by heating and / or light energy by irradiation with light such as ultraviolet rays.
  • the conductive adhesive 21 has a melting point higher than the temperature at which the viscosity of the first insulating adhesive in the first cured state starts to decrease. In this case, as will be described later, there is a tendency that the occurrence of an electrical short circuit due to the conductive adhesive 21 flowing out between the electrodes and between the wirings can be effectively prevented.
  • the first insulating adhesive 22 in the second cured state is white.
  • the first insulative adhesive material 22 in the second cured state is white, the reflectance of light in these resins is increased, and the light transmitted through the back electrode type solar cells 8 is transferred to these resins. Since the light loss can be reduced by efficiently irradiating the back electrode type solar cell 8 with light and re-irradiating the back electrode type solar cell 8 with light, the conversion efficiency of the back electrode type solar cell with wiring board can be improved. It tends to be possible.
  • “white” means that the reflectance for light with a wavelength of 360 to 830 nm is 50% or more.
  • the first insulating adhesive 22 in the second cured state is white, the reflectance of the first insulating adhesive 22 in the second cured state with respect to light having a wavelength of 360 to 830 nm is 100%. The closer one is preferable.
  • back electrode type solar cell 8 As back electrode type solar cell 8, for example, back electrode type solar cell 8 manufactured as follows can be used. Hereinafter, an example of a method for manufacturing the back electrode type solar cell 8 used in the present embodiment will be described with reference to the schematic cross-sectional views of FIGS.
  • a semiconductor substrate 1 in which slice damage 1a is formed on the surface of the semiconductor substrate 1 is prepared by, for example, slicing from an ingot.
  • the semiconductor substrate 1 for example, a silicon substrate made of polycrystalline silicon, single crystal silicon, or the like having either n-type or p-type conductivity can be used.
  • the slice damage 1a on the surface of the semiconductor substrate 1 is removed.
  • the removal of the slice damage 1a is performed, for example, when the semiconductor substrate 1 is made of the above silicon substrate, the surface of the silicon substrate after the above slice is mixed with an aqueous solution of hydrogen fluoride and nitric acid, sodium hydroxide, or the like. It can be performed by etching with an alkaline aqueous solution or the like.
  • the size and shape of the semiconductor substrate 1 after removal of the slice damage 1a are not particularly limited, but the thickness of the semiconductor substrate 1 can be set to 50 ⁇ m or more and 400 ⁇ m or less, for example.
  • an n-type impurity diffusion region 2 and a p-type impurity diffusion region 3 are formed on the back surface of the semiconductor substrate 1, respectively.
  • the n-type impurity diffusion region 2 can be formed, for example, by a method such as vapor phase diffusion using a gas containing n-type impurities
  • the p-type impurity diffusion region 3 uses, for example, a gas containing p-type impurities. It can be formed by a method such as vapor phase diffusion.
  • the n-type impurity diffusion region 2 and the p-type impurity diffusion region 3 are each formed in a strip shape extending to the front side and / or the back side of the paper surface of FIG. 2, and the n-type impurity diffusion region 2 and the p-type impurity diffusion region 3 Are alternately arranged at predetermined intervals on the back surface of the semiconductor substrate 1.
  • the n-type impurity diffusion region 2 is not particularly limited as long as it includes an n-type impurity and exhibits n-type conductivity.
  • an n-type impurity such as phosphorus can be used.
  • the p-type impurity diffusion region 3 is not particularly limited as long as it includes a p-type impurity and exhibits p-type conductivity.
  • a p-type impurity such as boron or aluminum can be used.
  • n-type impurity a gas containing an n-type impurity such as phosphorus such as POCl 3 can be used.
  • a gas containing a p-type impurity a p-type such as boron such as BBr 3 is used.
  • a gas containing impurities can be used.
  • a passivation film 4 is formed on the back surface of the semiconductor substrate 1.
  • the passivation film 4 can be formed by a method such as a thermal oxidation method or a plasma CVD (Chemical Vapor Deposition) method.
  • the passivation film 4 for example, a silicon oxide film, a silicon nitride film, or a stacked body of a silicon oxide film and a silicon nitride film can be used, but is not limited thereto.
  • the thickness of the passivation film 4 can be, for example, 0.05 ⁇ m or more and 1 ⁇ m or less, and particularly preferably about 0.2 ⁇ m.
  • an uneven structure such as a texture structure is formed on the entire light receiving surface of the semiconductor substrate 1, and then an antireflection film 5 is formed on the uneven structure.
  • the texture structure can be formed, for example, by etching the light receiving surface of the semiconductor substrate 1.
  • the semiconductor substrate 1 is a silicon substrate
  • the semiconductor is used by using an etching solution in which a solution obtained by adding isopropyl alcohol to an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide is heated to 70 ° C. or higher and 80 ° C. or lower, for example. It can be formed by etching the light receiving surface of the substrate 1.
  • the antireflection film 5 can be formed by, for example, a plasma CVD method.
  • a silicon nitride film or the like can be used, but is not limited thereto.
  • a part of the passivation film 4 on the back surface of the semiconductor substrate 1 is removed to form a contact hole 4a and a contact hole 4b.
  • the contact hole 4a is formed so as to expose at least part of the surface of the n-type impurity diffusion region 2, and the contact hole 4b exposes at least part of the surface of the p-type impurity diffusion region 3. Formed.
  • the contact hole 4a and the contact hole 4b are formed after a resist pattern having openings at portions corresponding to the formation positions of the contact hole 4a and the contact hole 4b is formed on the passivation film 4 by using, for example, photolithography technology.
  • a back electrode type solar battery cell 8 To form the back electrode type solar battery cell 8.
  • n-type electrode 6 and the p-type electrode 7 for example, electrodes made of metal such as silver can be used.
  • the n-type electrode 6 and the p-type electrode 7 pass through the openings provided in the passivation film 4, respectively, along the n-type impurity diffusion region 2 and the p-type impurity diffusion region 3 on the back surface of the semiconductor substrate 1. It is formed so as to be in contact with diffusion region 2 and p-type impurity diffusion region 3.
  • FIG. 3 shows a schematic plan view of an example when the back electrode type solar cell 8 manufactured as described above is viewed from the back side.
  • the n-type electrode 6 and the p-type electrode 7 are each formed in a comb shape, and a portion corresponding to the comb teeth of the comb-shaped n-type electrode 6 and the comb-shaped p-type electrode
  • the n-type electrode 6 and the p-type electrode 7 are arranged so that the portions corresponding to the comb teeth of the electrode 7 are alternately meshed one by one.
  • a portion corresponding to the comb teeth of the comb-shaped n-type electrode 6 and a portion corresponding to the comb teeth of the comb-shaped p-type electrode 7 are alternately arranged at predetermined intervals. Will be.
  • the shape and arrangement of the n-type electrode 6 and the p-type electrode 7 on the back surface of the back electrode type solar cell 8 are not limited to the configuration shown in FIG. Any shape and arrangement that can be electrically connected to the mold wiring may be used.
  • FIG. 4 shows a schematic plan view of another example when the back electrode type solar battery cell 8 is viewed from the back surface side.
  • the n-type electrode 6 and the p-type electrode 7 are each formed in a strip shape that extends in the same direction (extends in the vertical direction in FIG. 4).
  • One is alternately arranged in a direction orthogonal to the direction.
  • FIG. 5 shows a schematic plan view of still another example when the back electrode type solar battery cell 8 is viewed from the back surface side.
  • the n-type electrode 6 and the p-type electrode 7 are each formed in a dot shape, and a row of dot-shaped n-type electrodes 6 (extending in the vertical direction in FIG. 5) and dot-like
  • the rows of the p-type electrodes 7 are alternately arranged one by one on the back surface of the semiconductor substrate 1.
  • FIG. 6 shows a schematic plan view of an example when the example of the wiring board used in the present embodiment is viewed from the wiring installation side.
  • the wiring substrate 10 includes an insulating base 11, a wiring including an n-type wiring 12, a p-type wiring 13 and a connection wiring 14 installed on the surface of the insulating base 11. 16.
  • the n-type wiring 12, the p-type wiring 13 and the connection wiring 14 are conductive, and the n-type wiring 12 and the p-type wiring 13 are arranged in a direction in which a plurality of rectangles are orthogonal to the longitudinal direction of the rectangle. It is set as the comb shape containing the shape made.
  • the connection wiring 14 has a strip shape. Further, the n-type wiring 12 and the p-type wiring 13 other than the n-type wiring 12a and the p-type wiring 13a, which are located at the end of the wiring board 10, are electrically connected by the connection wiring 14. Has been.
  • the portions corresponding to the comb teeth (rectangular) of the comb-shaped n-type wiring 12 and the portions corresponding to the comb teeth (rectangular) of the comb-shaped p-type wiring 13 are alternately arranged one by one.
  • An n-type wiring 12 and a p-type wiring 13 are arranged so as to be engaged with each other.
  • the portion corresponding to the comb teeth of the comb-shaped n-type wiring 12 and the portion corresponding to the comb teeth of the comb-shaped p-type wiring 13 are alternately arranged at predetermined intervals. Will be.
  • FIG. 7 shows a schematic cross-sectional view along VII-VII in FIG. As shown in FIG. 7, in the wiring substrate 10, the n-type wiring 12 and the p-type wiring 13 are provided only on one surface of the insulating base material 11.
  • the material of the insulating substrate 11 can be used without particular limitation as long as it is an electrically insulating material.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PET polyphenylene sulfide
  • a material containing at least one resin selected from the group consisting of PPS (Polyphenylene sulfide), polyvinyl fluoride (PVF) and polyimide (Polyimide) can be used.
  • the thickness of the insulating substrate 11 is not particularly limited, and can be, for example, 25 ⁇ m or more and 150 ⁇ m or less.
  • the insulating substrate 11 may have a single-layer structure composed of only one layer or a multi-layer structure composed of two or more layers.
  • the wiring 16 can be used without particular limitation as long as it is made of a conductive material.
  • a metal including at least one selected from the group consisting of copper, aluminum, and silver can be used. .
  • the thickness of the wiring 16 is not particularly limited, and can be, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the shape of the wiring 16 is not limited to the shape described above, and can be set as appropriate.
  • a conductive substance containing at least one selected from the group consisting of Tin Oxide may be installed.
  • the electrical connection between the wiring 16 of the wiring substrate 10 and the electrode of the back electrode type solar battery cell 8 to be described later can be improved and the weather resistance of the wiring 16 can be improved.
  • At least a part of the surface of the wiring 16 may be subjected to a surface treatment such as a rust prevention treatment or a blackening treatment.
  • the wiring 16 may also have a single-layer structure consisting of only one layer or a multi-layer structure consisting of two or more layers.
  • an insulating substrate 11 such as a PEN film is prepared, and a conductive material such as a metal foil or a metal plate is bonded to the entire surface of one surface of the insulating substrate 11.
  • a conductive material such as a metal foil or a metal plate is bonded to the entire surface of one surface of the insulating substrate 11.
  • pull out a roll of insulating base material cut to a predetermined width apply adhesive on one surface of the insulating base material, and stack a roll of metal foil cut slightly smaller than the width of the insulating base material They can be bonded together by applying pressure and heating.
  • the conductive material is patterned on the surface of the insulating substrate 11 by removing a part of the conductive material bonded to the surface of the insulating substrate 11 by photoetching or the like and patterning the conductive material.
  • a wiring 16 including an n-type wiring 12, a p-type wiring 13, a connection wiring 14, and the like made of a conductive material is formed.
  • FIG. 8A to FIG. 8H are schematic cross-sectional views illustrating an example of a method for manufacturing a back electrode type solar cell with a wiring board according to the present embodiment.
  • FIGS. 8A to 8H an example of a method for manufacturing the back electrode type solar cell with wiring board of the present embodiment will be described.
  • Step of installing first insulating adhesive> First, as shown in FIG. 8A, the back electrode type solar cell 8 manufactured as described above is prepared. Next, as shown in FIG. 8B, the uncured first electrode 6 and the p-type electrode 7 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8 are respectively uncured. 1 insulating adhesive 22a is installed.
  • Examples of the method for installing the uncured first insulating adhesive 22a include screen printing, dispenser coating, and inkjet coating. Among these, it is preferable to use screen printing as a method of installing the first insulating adhesive 22a.
  • the first insulating adhesive 22a is installed by screen printing, the first insulating adhesive 22a can be installed simply, at low cost, and in a short time.
  • the width of the first insulating adhesive 22a on the semiconductor substrate 1 side of the back electrode type solar cell 8 is preferably such that it does not contact the n-type electrode 6 and the p-type electrode 7. In this case, the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring board 10 can be improved.
  • the width of the first insulating adhesive 22 a on the side opposite to the semiconductor substrate 1 side of the back electrode type solar cell 8 is narrower than the interval between the wirings on the wiring substrate 10. Also in this case, the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring board 10 can be improved.
  • the shape of the first insulating adhesive 22 a is preferably a line shape along each of the n-type electrode 6 and the p-type electrode 7 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8.
  • the shape may be intermittently arranged.
  • the first insulating adhesive 22a it is preferable to use a resin capable of being B-staged.
  • B-stageable resin means that when the liquid uncured first insulative adhesive 22a is heated, the viscosity is increased and then the viscosity is decreased after being in a cured state (first cured state). It is a resin that softens and then rises again and becomes a cured state (second cured state). Said 1st hardening state is called B stage.
  • the resin that can be made into B stage include a resin that can be made into a solid state (B stage) by evaporating the solvent from the liquid state.
  • the resin capable of being B-staged for example, in a second cured state
  • insulation that can prevent a short circuit between the electrodes on the back surface of the back electrode type solar cell 8 and between the wirings of the wiring substrate 10 is possible.
  • maintaining mechanical connection strength between the back electrode type solar cell 8 and the wiring substrate 10 in order to maintain long-term reliability of the back electrode type solar cell with the wiring substrate and the solar cell module is possible to use a resin having an adhesive strength that can be used.
  • the swelling type resin is a mixture of an uncured and liquid resin and a fine particle resin.
  • the thermal behavior of the swelling type resin is, for example, as follows. When the swelling type resin is heated above the glass transition temperature of the fine particle resin, the liquid resin enters between the molecules of the fine particle resin. As a result, the volume of the resin in the fine particle state appears to be in an expanded state (swelled state) and the viscosity is increased, so that an apparently cured state (first cured state) is obtained.
  • the resin in the liquid state is uncured, when heated again, the resin in the liquid state that has entered between the molecules of the resin in the fine particle state can flow, and the viscosity is lowered to a softened state. When the heating is further continued, the resin in the liquid state is cured and becomes a cured state (second cured state).
  • the uncured first insulating adhesive 22a is in a first cured state and a softened state. After passing through, it can be set as the 2nd hardening state.
  • the uncured first insulating adhesive 22a is not only between the electrodes of the back electrode type solar cells 8, but also the electrodes of the back electrode type solar cells 8 (the n type electrode 6, the p type electrode). It is preferable to install also between 7) and the peripheral part of the back electrode type photovoltaic cell 8. In this case, the stability of the mechanical connection between the back electrode type solar cell 8 and the wiring substrate 10 can be further improved.
  • the first insulating adhesive 22 a is formed between the back electrode solar cell 8 and the electrode of the back electrode solar cell 8 (n-type electrode 6, p-type electrode 7) and the peripheral portion. It is preferable to install so as to form an alignment pattern for alignment with the wiring board 10.
  • the back electrode type solar cells 8 and the wiring board are based on the alignment pattern of the first insulating adhesive material 22a. 10 can be aligned with each other, so that the wirings arranged adjacent to each other (for n-type use) are compared with the case where alignment is performed based on the electrode of the back electrode type solar cell 8 or the conductive adhesive 21.
  • the first insulating adhesive 22a can be placed between the wiring 12 and the p-type wiring 13) with higher accuracy. Therefore, an electrical short circuit due to the conductive adhesive 21 flowing between the wirings can be effectively prevented by the first insulating adhesive material, so that the electrodes of the back electrode type solar cells 8 and the wiring of the wiring substrate 10 can be prevented. It tends to be possible to improve the stability of the electrical connection.
  • an uncured first insulating adhesive 22a is provided as an example of the alignment pattern of the first insulating adhesive 22a between the electrode of the back electrode type solar cell 8 and the peripheral edge.
  • region which is not shown is shown.
  • an uncured first insulating adhesive material is interposed between the electrode (n-type electrode 6, p-type electrode 7) of the back electrode type solar cell 8 and the peripheral portion 31.
  • Non-installation areas 41a and 41b where 22a is not provided are arranged at a distance from each other.
  • an n-type electrode 6a having a circular surface and a p-type electrode 7a having a track-shaped surface are arranged inside the non-installation regions 41a and 41b.
  • the n-type electrode 6 a is provided on the extension line of the n-type electrode 6, and the p-type electrode 7 a is provided on the extension line of the p-type electrode 6.
  • the uncured first insulating adhesive 22a is installed in the surface region between the electrodes having different polarities on the back surface of the semiconductor substrate 1 of the back electrode type solar battery cell 8
  • the uncured first insulating adhesive material 22 a may be installed in the surface region of the insulating base material 11 between adjacent wirings of the wiring substrate 10, and the back surface of the back electrode type solar cell 8. May be installed in both the surface region between the electrodes having different polarities and the surface region of the insulating base 11 between adjacent wirings of the wiring substrate 10.
  • the alignment pattern of the first insulating adhesive 22a is not limited to the non-installation area where the first insulating adhesive 22a is not provided, and other parts of the first insulating adhesive 22a.
  • the end of the first insulating adhesive 22a may be formed in a concave shape or a convex shape, and the first insulating property of another shape may be formed in the non-installation area. It is good also as a structure which provided the adhesive material 22a.
  • the n-type electrode 6a and the p-type electrode 7a are arranged so that the first insulating adhesive 22a and the electrode are disposed when the first insulating adhesive 22a is installed between the electrodes of the back electrode type solar battery cell 8.
  • the n-type electrode 6a and the p-type electrode 7a are not necessarily provided inside the non-installation regions 41a and 41b, but by providing them inside the non-installation regions 41a and 41b, a wiring board to be described later
  • the n-type electrode 6a and the p-type electrode 7a only need to be recognized when the first insulating adhesive material 22a is placed between the electrodes of the back electrode type solar cell 8, and therefore the first insulating adhesive material 22a. May be covered with the first insulating adhesive 22a after being installed in the back electrode type solar battery cell 8. Further, the n-type electrode 6a and the p-type electrode 7a may not be provided inside the first insulating adhesive 22a, and may be provided outside the first insulating adhesive 22a.
  • the insulating adhesive material 22a may be partially overlapped or may be overlapped entirely.
  • the n-type electrode 6a and the p-type electrode 7a are not limited to the shape of the present embodiment, and various shapes suitable for the positioning of the installation location of the first insulating adhesive 22a can be used. .
  • the n-type electrode 6a and the p-type electrode 7a may have the same shape or different shapes, but the first insulation provided between the electrodes of the back electrode solar cell 8 When the shape of the conductive adhesive 22a is not rotationally symmetric, or when it is desired to align the direction of the back electrode solar cell 8 in one direction in the step of installing the first insulating adhesive 22a, the n-type electrode 6a And the p-type electrode 7a preferably have different shapes.
  • the orientation of the back electrode type solar cell 8 and the first insulating adhesive material 22a is incorrect. It is possible to prevent the installation of one insulating adhesive 22a.
  • the first insulating adhesive 22b in the first cured state is obtained by increasing the viscosity of the uncured first insulating adhesive 22a.
  • the first insulating adhesive 22b in the first cured state is formed by supplying energy to the first insulating adhesive 22a in the uncured state.
  • Examples of a method of supplying energy to the uncured first insulating adhesive 22a include a method of supplying thermal energy by heating and / or a method of supplying optical energy by irradiation of light such as ultraviolet rays. Can be used.
  • solder resin 20 is placed on each surface of the n-type electrode 6 and the p-type electrode 7 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8.
  • the solder resin 20 includes a conductive adhesive material 21 and a second insulating adhesive material 23, and has a configuration in which the conductive adhesive material 21 is dispersed in the second insulating adhesive material 23. Yes.
  • a conductive substance such as solder particles can be used.
  • a thermosetting and / or photocurable insulating resin containing at least one selected from the group consisting of epoxy resin, acrylic resin and urethane resin as a resin component is used. Can be used.
  • solder resin 20 As a method for installing the solder resin 20, for example, a screen printing method, a dispenser coating method, an ink jet coating method, or the like can be used. Among them, it is preferable to use a screen printing method. When screen printing is used, the solder resin 20 can be installed simply, at low cost, and in a short time.
  • the solder resin 20 when installing the solder resin 20 by screen printing after installing the uncured first insulating adhesive material 22a, the first insulating adhesive material 22a having a high adhesive strength and a printing mask for screen printing are used. And the solder resin 20 cannot be installed.
  • solder resin 20 is installed by dispenser application or inkjet application after the uncured first insulating adhesive 22a is installed, even when the adhesive strength of the first insulating adhesive 22a is high Although the solder resin 20 can be installed, the processing time is long and the productivity may be deteriorated.
  • the solder resin 20 when the solder resin 20 is installed in a state where the fluidity of the uncured first insulating adhesive material 22a is high, the first insulating adhesive material 22a flows into the solder resin 20 in a later process. By doing so, the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 may be hindered. Further, in this case, the adhesive force between the back electrode type solar cell 8 and the wiring substrate 10 is reduced, or the conductive adhesive 21 is melted and mixed with the first insulating adhesive 22a. May cause a short circuit between the adjacent conductive adhesives 21.
  • the solder resin 20 after the uncured first insulating adhesive 22a is cured to form the first cured adhesive 22b in the first cured state.
  • the stability of the mechanical connection between the back electrode type solar cell 8 and the wiring substrate 10 and the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 are achieved. It is possible to improve the productivity of the back electrode type solar cell with wiring board and the solar cell module.
  • solder resin 20 is provided on the electrode of the back electrode type solar cell 8
  • the solder resin 20 may be provided on the wiring of the wiring substrate 10, and the back surface.
  • the solder resin 20 may be provided on both the electrode of the electrode type solar cell 8 and the wiring of the wiring substrate 10.
  • both the first insulating adhesive 22a and the solder resin 20 need not be installed on the back electrode solar cell 8 or the wiring substrate 10.
  • the first insulating adhesive 22 a may be installed and the solder resin 20 may be installed on the wiring of the wiring board 10.
  • the n-type electrode 6 and the p-type electrode 7 of the back electrode type solar battery cell 8 are respectively overlapped on the insulating base material 11 of the wiring board 10. Is performed so as to face the n-type wiring 12 and the p-type wiring 13 provided in the circuit.
  • FIG. 10 shows a schematic plan view of an example after the back electrode type solar cell 8 and the wiring substrate 10 are overlapped.
  • the back electrode solar cell 8 and the wiring are arranged such that the back surface, which is the surface on the electrode installation side of the back electrode type solar cell 8, and the wiring installation side surface of the wiring substrate 10 face each other.
  • the substrate 10 is overlaid.
  • 16 back electrode type solar cells 8 are overlaid on one wiring board 10, but it is needless to say that the present invention is not limited to this configuration.
  • one wiring board 10 has one sheet on one wiring board 10. It is good also as a structure which piled up the back surface electrode type photovoltaic cell 8. As shown in FIG.
  • the 1st insulating adhesive material 22a which has an alignment pattern between the electrode of the back electrode type photovoltaic cell 8 and a peripheral part is provided, alignment of the 1st insulating adhesive material 22a is carried out. It is preferable to use the wiring board 10 provided with an alignment pattern corresponding to the pattern.
  • FIG. 11 is a schematic enlarged plan view of the wiring board 10 when viewed from the insulating base material 11 side, and the opening 51 provided in the wiring board 10 passes through the insulating base material 11. It can be recognized visually or by using light of a specific wavelength such as infrared rays.
  • the opening 51 is a region where the wiring of the wiring substrate 10 is not provided (that is, a region where the surface of the insulating base 11 is exposed).
  • the n-type wiring 12 is provided on the extended line 12 at a position away from the tip of the n-type wiring 12.
  • the back electrode type solar cell 8 and the wiring board 10 can be aligned so that the can be seen.
  • the solder resin 20 is installed in a state in which the position is shifted with respect to the n-type electrode 6 and the p-type electrode 7 of the back electrode type solar cell 8
  • one insulating adhesive 22b can be properly positioned and installed between the n-type wiring 12 and the p-type wiring 13 adjacent to each other on the wiring substrate 10, the first hardening is performed between the adjacent wirings.
  • the first insulative adhesive 22b in a state can be more stably installed, and the solder resin 20 can flow out by the first insulative adhesive 22b in a first cured state installed between adjacent wirings. Since the dam can be stopped, the occurrence of an electrical short circuit tends to be suppressed.
  • the non-installation region 41a and the non-installation region of the first insulating adhesive 22b in the first cured state It is good also as a shape different from 41b. Accordingly, the shape of the non-installation region 41a or the non-installation region 41b of the first insulative adhesive material 22b in the first cured state can be confirmed through the opening 51 provided in the wiring board 10, so that the back surface electrode It is possible to prevent the back electrode solar cell 8 and the wiring substrate 10 from being aligned in a state where the direction of the solar cell 8 is wrong.
  • the n-type electrode 6a and the p-type electrode 7a can be recognized even if the first insulating adhesive 22a is installed as in the example of FIG. 9, the n-type electrode 6a By making the surface shape different from the surface shape of the p-type electrode 7a, the surface shape of the n-type electrode 6a and the surface shape of the p-type electrode 7a are confirmed through the opening 51 provided in the wiring board 10. Also, the same effect as described above can be obtained.
  • the alignment pattern of the wiring substrate 10 is not limited to the opening 51 corresponding to the non-installation areas 41a and 41b.
  • the alignment pattern of the first insulating adhesive material 22a can be used as the back electrode type.
  • Various patterns that can appropriately align the electrode of the solar battery cell 8 and the wiring of the wiring substrate 10 can be used.
  • Step of softening the first insulating adhesive material Next, as shown in FIG. 8F, the viscosity of the first insulative adhesive 22b in the first cured state is lowered to form a soft insulative first insulative adhesive 22c.
  • the soft insulating first insulating material 22c is deformed by pressurization between the back electrode solar cell 8 and the wiring substrate 10 superimposed as described above, and the back electrode solar It fills between the surface area
  • a method of supplying energy to the first cured adhesive material 22b in the first cured state for example, a method of supplying thermal energy by heating and / or a method of supplying light energy by irradiation of light such as ultraviolet rays. Etc. can be used.
  • the viscosity of the first insulating adhesive is made higher than the viscosity of the second insulating adhesive until the first insulating adhesive is in the second cured state.
  • the first insulating adhesive material 22c can block the second insulating adhesive material 23 from flowing and flowing into regions between electrodes having different polarities and / or between adjacent wirings.
  • the solder resin 20 can be retained in the vicinity of the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10, and a molten conductive adhesive 21 a to be described later is interposed between the electrode and the wiring. It is possible to prevent a shortage of the second insulating adhesive material serving as a medium when aggregating.
  • the second insulating adhesive can be sufficiently disposed around the electrode and the wiring, thereby improving the stability of electrical connection.
  • the relationship between the viscosity of the first insulating adhesive and the viscosity of the second insulating adhesive should be adjusted as appropriate to the respective materials of the first insulating adhesive and the second insulating adhesive. Is possible.
  • the conductive adhesive 21 in the solder resin 20 preferably has a melting point higher than the temperature at which the viscosity of the first insulating adhesive 22b in the first cured state starts to decrease. In this case, the viscosity of the first insulating adhesive 22b in the first cured state is lowered and deformed, and the surface region and the wiring of the semiconductor substrate 1 between the electrodes having different polarities of the back electrode type solar cell 8
  • the conductive adhesive 21 in the solder resin 20 is filled between the electrodes having different polarities and / or between the adjacent wirings before being filled with the surface region of the insulating base 11 between the adjacent wirings of the substrate 10. It tends to be able to suppress the outflow to the area.
  • the solid state conductive adhesive 21 in the solder resin 20 is melted to form a molten state conductive adhesive 21a.
  • a method of melting the conductive adhesive 21 in the solid state for example, a method of heating the conductive adhesive 21 can be used.
  • the solid state conductive adhesive material 21 is melted to become a molten state conductive adhesive material 21a, so that the n-type electrode 6 and the n-type wire 12 and the p-type electrode 7 and the p-type wire are connected. 13 respectively.
  • the viscosity of the first insulating adhesive 22 c is higher than the viscosity of the second insulating adhesive 23, the molten conductive adhesive 21 a becomes the second insulating adhesive 23.
  • the first insulating adhesive 22c can be used to block the mixed and flowing out of the electrodes having different polarities and / or the region between the adjacent wirings. Thereby, the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 can be improved.
  • the softened first insulating adhesive 22c As a method of using the softened first insulating adhesive 22c as the second hardened first insulating adhesive 22, for example, energy is supplied to the softened first insulating adhesive 22c. Can be done. Thereby, the back-electrode-type solar cell 8 and the wiring board 10 which are overlaid and pressed as described above can be bonded by the first insulating adhesive 22 in the second cured state.
  • a method of supplying energy to the soft insulating first insulating material 22c for example, a method of supplying thermal energy by heating or the like and / or a method of supplying light energy by irradiation of light such as ultraviolet rays are used. be able to.
  • the softened state The second insulating adhesive material 23 of the solder resin 20 is softened until the first insulating adhesive material 22c becomes the second cured first insulating adhesive material 22c. Deformation is performed so as to fill a space between the n-type electrode 6 and the n-type wiring 12 and between the p-type electrode 7 and the p-type wiring 13 surrounded by 22c. Thereby, the stability of the mechanical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 can be improved.
  • the viscosity of the second insulating adhesive after the first insulating adhesive is in the second cured state is higher than the viscosity of the first insulating adhesive 22 in the second cured state. It may be lower, lower, or the same.
  • the solder resin 20 is heated and soldered. Even when the conductive adhesive 21 in the resin 20 starts to melt, the first insulating adhesive 22c in the softened state has already entered between the wirings of the wiring board 10 and between the electrodes of the back electrode type solar cell 8. Therefore, it does not flow toward the adjacent wiring and electrode. Therefore, it is possible to effectively prevent short-circuiting between the adjacent electrodes and between the wirings with the conductive adhesive 21 in the solder resin 20.
  • the melting start temperature of the conductive adhesive 21 in the solder resin 20 is preferably higher than the softening start temperature of the first insulating adhesive 22b in the first cured state.
  • the melting start temperature of the conductive adhesive 21 is the melting point of the conductive adhesive 21
  • the softening start temperature of the first insulating adhesive 22b in the first cured state is the first temperature in the first cured state. This is a temperature at which the viscosity of the insulating adhesive 22b starts to decrease.
  • the back electrode is made such that the viscosity of the first insulating adhesive is higher than the viscosity of the second insulating adhesive until the first insulating adhesive is in the second cured state.
  • the solar cell 8 and the wiring substrate 10 are bonded. Therefore, in the present embodiment, the first insulating adhesive prevents the conductive adhesive 21 of the solder resin 20 from entering between the electrodes of the back electrode solar cell 8 and between the wirings of the wiring substrate 10.
  • the first insulating adhesive material 22c in the softened state enters between the electrodes of the back electrode type solar cell 8 and between the wirings of the wiring board 10, the first softened adhesive material 22c is softened in a wider region on the surface of the wiring board 10.
  • the insulating adhesive material 22c is brought into contact, and then the softened first insulating adhesive material 22c is cured to form the back electrode type solar cell 8 and the wiring as the first cured adhesive material 22 in the second cured state.
  • the substrate 10 is firmly bonded.
  • a B-stageable resin is used for the first insulating adhesive
  • a solder resin is used as the second insulating adhesive (epoxy resin) containing the conductive adhesive (Sn—Bi solder particles).
  • the relationship between the change of the heating temperature with respect to the elapsed time at the time of contact and the viscosity change of the first insulating adhesive and the second insulating adhesive is shown.
  • the viscosity of the first insulative adhesive in the first cured state decreases, and the first insulative adhesive in the softened state Become a material.
  • the solder resin conductive adhesive melts and flows.
  • the viscosity of the first insulating adhesive in the first cured state is lowered and is not the first insulating adhesive in the softened state, the viscosity of the first insulating adhesive is It is high and the first insulating adhesive cannot sufficiently enter between adjacent wirings of the wiring board, so that a space tends to remain between the back electrode type solar cell and the wiring board.
  • the viscosity of the uncured first insulating adhesive such as a B-stageable resin or a swelling type resin is increased.
  • a resin is used in which the viscosity is lowered to be in a softened state after the first cured state is reached, and then the viscosity is increased again to be in the second cured state. Therefore, before the solder resin conductive adhesive melts and flows, it is softened so as to fill as wide a space as possible between the back electrode solar cell and the wiring board except for the solder resin installation location.
  • the first insulating adhesive can be filled.
  • the heating temperature is kept constant at a temperature exceeding the melting point of the conductive adhesive material of the solder resin, whereby the soft insulating first insulating adhesive material is cured and the second conductive adhesive material is melted. It is set as the 1st insulating adhesive material of the hardening state.
  • the soft insulating first insulating adhesive is filled in the widest space between the back electrode type solar cell and the wiring substrate, the soft insulating first insulating adhesive After curing to become the first insulating adhesive in the second cured state, the adhesive strength between the back electrode solar cell and the wiring substrate can be increased, and the back electrode solar cell and the wiring The stability of the mechanical connection with the substrate can be increased.
  • the conductive adhesive material of the solder resin is solidified so that the electrical connection between the electrode of the back electrode type solar cell and the wiring of the wiring board is achieved. Connection is made.
  • the hardness of the first insulative adhesive in the second cured state hardly changes as the heating temperature decreases, the adhesive strength between the back electrode solar cell and the wiring board is maintained.
  • the change of the heating temperature with respect to the elapsed time shown in FIG. 13 when the change of the heating temperature with respect to the elapsed time shown in FIG. 13 is changed, it influences the softening temperature of the first insulating adhesive, the curing start time, the curing completion time, the meltability of the conductive adhesive, and the like. Therefore, it is preferable to combine a material design that conforms to this process with a change in heating temperature that is suitable for the material design.
  • the first insulating adhesive material is preferably softened to such an extent that it can be deformed by pressure before the conductive adhesive material 21 of the solder resin 20 is in a molten state.
  • the conductive adhesive 21 of the solder resin 20 can be brought into a molten state after the first insulating adhesive is filled between the wirings of the wiring substrate 10, the conductive adhesive of the solder resin 20 can be brought into a molten state. It is possible to effectively prevent the inflow of the 21 wiring boards 10 between the wirings.
  • the conductive adhesive 21 of the solder resin 20 is in a molten state before the softened first insulating adhesive 22c is cured again and becomes the second cured first insulating adhesive 22. It is preferable. As the conductive adhesive 21 of the solder resin 20 melts, the height between the back electrode type solar cell 8 and the wiring board 10 decreases, and the soft insulating first insulating adhesive 22c becomes the wiring board along with the decrease. It flows in between 10 wires. Therefore, when the conductive adhesive 21 of the solder resin 20 is melted after the formation of the first insulating adhesive 22 in the second cured state, the first insulating adhesive 22c in the softened state becomes the wiring board 10.
  • the conductive adhesive 21 of the solder resin 20 flows between the wirings of the wiring board 10 in a molten state in a state where the wirings are not sufficiently filled.
  • the conductive adhesive 21 melts and aggregates between the electrode and the wiring and spreads wet, but when the first insulating adhesive 22 is in the second cured state, the back electrode solar cell 8 and the wiring Since the height between the substrate 10 and the substrate 10 is fixed, there is a possibility that the conductive adhesive 21 that has spread out may not be sufficiently filled between the electrode and the wiring.
  • the conductive adhesive 21 of the solder resin 20 is maintained in a molten state until the first insulative adhesive 22 in the second cured state is formed.
  • the conductive adhesive 21 of the solder resin 20 is formed. Since it solidifies, the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 can be improved.
  • the conductivity between the adjacent electrodes and / or between the wirings is adjusted.
  • the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 can be electrically connected while suppressing the occurrence of a short circuit due to the conductive adhesive 21, and the back electrode type solar cell 8 and the wiring substrate 10 Can be mechanically connected by the first insulating adhesive 22 and the second insulating adhesive 23 in the second cured state.
  • the process of curing the first insulating adhesive 22c in the softened state to form the first insulating adhesive 22 in the second cured state is, for example, a single heating process as described above. Preferably, it is done. In this case, productivity tends to be further improved.
  • the first cured state, the softened state, and the second cured state can be confirmed by investigating changes in viscosity with the passage of time when energy such as thermal energy and / or light energy is supplied.
  • the first cured state, the softened state, and the second cured state can also be confirmed by analyzing the characteristics, composition, and state of the first insulating adhesive material, respectively.
  • the first insulating adhesive is a resin capable of being B-staged
  • a B-stageable resin is used for the first insulating adhesive, and a solder resin is used as the second insulating adhesive (epoxy resin) containing the conductive adhesive (Sn—Bi solder particles).
  • the second insulating adhesive epoxy resin
  • Sn—Bi solder particles the conductive adhesive
  • FIG. 14 The typical expanded sectional view of an example of the photovoltaic cell with a wiring board produced in this way is shown.
  • the back electrode type solar cells 8 and the wiring substrate 10 are mechanically connected by the first insulating adhesive 22 and the second insulating adhesive 23 in the second cured state.
  • the n-type electrode 6 and the p-type electrode 7 of the back electrode type solar battery cell 8 are electrically connected to the n-type wiring 12 and the p-type wiring 13 of the wiring substrate 10 by the conductive adhesive 21, respectively. ing.
  • the height T between the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8 and the surface of the insulating substrate 11 of the wiring substrate 10 is determined by the n-type wiring 12 and the p-type wiring 13.
  • the thicknesses are about 35 ⁇ m, for example, the thickness is about 50 ⁇ m or more and 60 ⁇ m or less.
  • the distance P between the adjacent n-type wiring 12 and p-type wiring 13 is, for example, about 200 ⁇ m.
  • the distance P is 5 mm or less, particularly when it is 1 mm or less, a short circuit between wires due to solder is likely to occur. Therefore, in such a case, the effect that the stability of the electrical connection between the electrode of the back electrode type solar battery cell 8 of the present invention and the wiring of the wiring substrate 10 can be improved effectively.
  • the width W of each of the n-type wiring 12 and the p-type wiring 13 is, for example, about 550 ⁇ m.
  • the back electrode type solar cell with a wiring board manufactured as described above is, for example, in the sealing material 18 between the surface protective material 17 and the back surface protective material 19 as shown in the schematic cross-sectional view of FIG.
  • a solar cell module is produced by sealing with.
  • the step of sealing in the sealing material is provided, for example, in the sealing material 18 such as ethylene vinyl acetate (EVA) provided in the surface protecting material 17 such as glass and the back surface protecting material 19 such as polyester film.
  • EVA ethylene vinyl acetate
  • a solar battery cell with a wiring board is sandwiched between a sealing material 18 such as EVA, and these sealing materials 18 are integrated by heating while pressing between the front surface protective material 17 and the back surface protective material 19. Can be done.
  • the step of reducing the viscosity of the first cured adhesive 22b in the first cured state to the softened first insulating adhesive 22c, and the conductive adhesive 21 in the solder resin 20 are performed.
  • the productivity of the solar cell module can be further improved. That is, the superposed back electrode type solar cell 8 and the wiring board 10 before performing these steps and the sealing material 18 provided on the surface protective material 17 and the sealing material provided on the back surface protective material 19.
  • the first insulating adhesive 22b in the first cured state is supplied with energy while being pressed between the surface protective member 17 and the back surface protective member 19. Accordingly, the first insulating adhesive is cured through the first cured state, the softened state, and the second cured state to produce a back electrode solar cell with a wiring substrate, and the back electrode with the wiring substrate.
  • a solar cell module in which the solar cell is sealed in the sealing material 18 can be produced.
  • this sealing step is preferably performed in a vacuumed atmosphere. Thereby, it can suppress that a bubble generate
  • the first cured adhesive 22b in the first cured state is used as the first insulated adhesive 22c in the softened state, and in the solder resin 20 The step of melting the conductive adhesive material 21 and the step of increasing the viscosity of the first insulating adhesive material 22c in the softened state to form the first insulating adhesive material 22 in the second cured state.
  • the back electrode type solar cell 8 and the wiring substrate 10 can be deaerated, so that the first insulating adhesive 22, the second insulating adhesive 23, and the conductive adhesive 21 can be used. Generation of bubbles and voids can be suppressed, and a highly reliable solar cell module can be manufactured.
  • the first insulating adhesive 22 in the second cured state in the solar cell module is preferably white.
  • the reflectance of light in the first insulative adhesive 22 is high and has passed through the back electrode type solar cell 8. Light loss can be reduced by efficiently reflecting the light with the first insulating adhesive 22 and irradiating the back electrode solar cell 8 with light again. Therefore, in this case, the conversion efficiency of the solar cell module tends to be improved. Since the description of “white” is the same as described above, the description thereof is omitted here.
  • the concept of the back electrode type solar battery cell in the present invention only has a configuration in which both the n-type electrode and the p-type electrode are formed only on one surface side (back side) of the substrate described above.
  • so-called back contact type solar cells opposite to the light receiving surface side of the solar cells
  • MWT Metal Wrap Through
  • solar cells having a configuration in which a part of an electrode is arranged in a through hole provided in a substrate
  • All of the solar cells having a structure in which current is taken out from the back side of the side.
  • the stability of the mechanical connection between the back electrode solar cell 8 and the wiring substrate 10 is improved, and the electrode and the wiring substrate of the back electrode solar cell 8 are improved.
  • the back electrode type solar cell with a wiring board and the solar cell module with improved electrical connection stability with 10 wirings can be manufactured with excellent productivity. Therefore, according to this Embodiment, it becomes possible to manufacture the back electrode type solar cell with a wiring board and solar cell module which were excellent in long-term reliability, and produced with excellent productivity.
  • a strip-shaped n-type electrode formed on the n-type impurity diffusion region on the back surface of the n-type silicon substrate and a strip-shaped p-type electrode formed on the p-type impurity diffusion region are alternately arranged one by one.
  • the arranged back electrode type solar cell was produced.
  • each of the n-type electrode and the p-type electrode was an Ag electrode, and the pitch between the adjacent n-type electrode and the p-type electrode was 750 ⁇ m.
  • the width of each of the n-type electrode and the p-type electrode was 50 ⁇ m to 150 ⁇ m, and the height of each of the n-type electrode and the p-type electrode was 3 ⁇ m to 13 ⁇ m.
  • an uncured first insulating adhesive (SPSR-900G manufactured by Sanwa Chemical Industry Co., Ltd.) is placed between the n-type electrode and the p-type electrode adjacent to each other on the back surface of the back electrode type solar battery cell. Installed by screen printing.
  • the first insulating adhesive is an epoxy-based B-stageable resin, and the first cured resin has low adhesiveness.
  • the temperature is 60 ° C. or lower during evacuation, the first curing is performed.
  • a resin was selected that has the property of not softening from the state, softening at 80 ° C. to 100 ° C. or higher to be softened, and starting to harden at 130 ° C. or higher to become the second cured state.
  • the enlarged photograph of the back surface of the back electrode type photovoltaic cell after installing the 1st insulating adhesive material is shown.
  • the first insulating adhesive alignment pattern is surrounded by the dotted line in FIG. 16 between the electrode and the peripheral portion.
  • two patterns were formed in which the first insulating adhesive was removed in a rhombus shape.
  • the uncured first insulating adhesive between the n-type electrode and the p-type electrode adjacent to each other in the back electrode type solar battery cell it is put in an oven at 80 ° C. for 10 minutes.
  • the first insulating adhesive is heated to cure to the first cured state
  • the width of the first cured adhesive in the first cured state on the back electrode type solar cell side is 400 ⁇ m
  • the back electrode type The width opposite to the solar battery cell was set to 100 ⁇ m and the height was set to approximately 50 ⁇ m.
  • solder resin (TCAP-5401-27 manufactured by Tamura Kaken Co., Ltd.) was placed on each of the n-type electrode and the p-type electrode of the back electrode type solar cell by screen printing.
  • the solder resin used here is a solder resin in which Sn—Bi-based solder particles (conductive adhesive) are dispersed in an epoxy-based insulating resin (second insulating adhesive).
  • Sn—Bi-based solder particles conductive adhesive
  • second insulating adhesive epoxy-based insulating resin
  • the back electrode type solar cell is formed on the wiring substrate so that the n type electrode and the p type electrode on the back surface of the back electrode type solar cell face the n type wiring and the p type wiring of the wiring substrate, respectively.
  • the battery cells were stacked.
  • the n-type wiring and the p-type wiring are each formed on an insulating substrate made of PEN, and the n-type wiring and the p-type wiring are each copper wiring.
  • the back electrode type solar cell is formed on the wiring substrate so that the n type electrode and the p type electrode on the back surface of the back electrode type solar cell face the n type wiring and the p type wiring of the wiring substrate, respectively.
  • the battery cells were stacked.
  • the n-type wiring and the p-type wiring are each formed on an insulating substrate made of PEN, and the n-type wiring and the p-type wiring are each copper wiring.
  • FIG. 17 shows an enlarged photograph of the surface of the wiring board on the wiring side.
  • An alignment pattern (region surrounded by a dotted line in FIG. 17) was provided.
  • the alignment pattern of the first insulating adhesive material of the back electrode solar cell and the alignment pattern of the wiring substrate overlap. Alignment was performed.
  • the stacked back electrode type solar cells and the wiring substrate are put into a vacuum laminator with the back electrode type solar cell side as the lower side, and heated and pressurized according to the temperature profile shown in FIG.
  • the back electrode type solar cell was sealed in a sealing material to produce a solar cell module.
  • the temperature profile shown in FIG. 18 was measured using thermocouples 1-6.
  • heating is started after the stacked back electrode type solar cells and the wiring board are set between the sealing materials made of EVA, and evacuation is performed for 180 seconds. Then, pressurization was started to raise the temperature. Then, as shown in FIG. 18, pressurization was carried out for 600 seconds while raising the temperature to produce a solar cell module in which the back electrode type solar cell with wiring board was sealed in the sealing material.
  • the first insulating adhesive was in the first cured state until about 240 seconds from the start of heating, but softened and softened from the time exceeding 240 seconds.
  • the softened state continued from the start of heating to a time exceeding about 300 seconds, and then cured again to become a second cured state.
  • the viscosity of the first insulating adhesive was set higher than the viscosity of the second insulating adhesive of the solder resin until the first insulating adhesive was in the second cured state.
  • the present invention can be used for a semiconductor device and a method for manufacturing the semiconductor device, and in particular, can be suitably used for a back electrode type solar cell with a wiring board, a solar cell module, and a method for manufacturing these.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Photovoltaic Devices (AREA)
  • Wire Bonding (AREA)

Abstract

La présente invention concerne un dispositif à semi-conducteurs dans lequel une première substance adhésive isolante (22) est disposée entre, d'une part une zone superficielle d'un substrat semi-conducteur (1) situé entre des électrodes (6, 7) de polarités différentes, et d'autre part une zone superficielle d'une base isolante (11) située entre des lignes de câblage adjacentes (12, 13). Selon l'invention également, une seconde substance adhésive isolante (23) est disposée entre la première substance adhésive isolante (22) et une substance adhésive conductrice (21). La première substance adhésive isolante (22) présente des propriétés telles que la première substance adhésive isolante (22) durcit jusqu'à un premier niveau, puis ramollit, et durcit enfin de nouveau jusqu'à un second niveau. Pour la fabrication du dispositif à semi-conducteurs, on maintient la première substance adhésive isolante (22) à une viscosité supérieure à celle de la seconde substance adhésive isolante (23), la première substance adhésive isolante (22) durcissant ensuite jusqu'au second niveau. L'invention concerne également une cellule photovoltaïque à contacts au verso pourvue d'une carte de câblage, un module de cellules photovoltaïques, et un procédé de fabrication de dispositif à semi-conducteurs.
PCT/JP2011/074429 2010-10-29 2011-10-24 Dispositif à semi-conducteurs, cellule photovoltaïque à contacts au verso pourvue d'une carte de câblage, module de cellules photovoltaïques, et procédé de fabrication de dispositif à semi-conducteurs WO2012057077A1 (fr)

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JP2010-244316 2010-10-29
JP2010244316A JP5410397B2 (ja) 2010-10-29 2010-10-29 半導体装置の製造方法、配線基板付き裏面電極型太陽電池セルの製造方法、太陽電池モジュールの製造方法、半導体装置、配線基板付き裏面電極型太陽電池セルおよび太陽電池モジュール

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WO2013027591A1 (fr) * 2011-08-25 2013-02-28 三洋電機株式会社 Cellule solaire et module solaire

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JP2015185743A (ja) 2014-03-25 2015-10-22 シャープ株式会社 光電変換素子

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JP2007201331A (ja) * 2006-01-30 2007-08-09 Sanyo Electric Co Ltd 光起電力モジュール
JP2007294575A (ja) * 2006-04-24 2007-11-08 Seiko Epson Corp 半導体装置の製造方法
WO2010082594A1 (fr) * 2009-01-16 2010-07-22 シャープ株式会社 Module de cellule solaire et son procede de fabrication

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