WO2012056922A1 - Procédé et appareil pour fabriquer un composant électronique céramique - Google Patents

Procédé et appareil pour fabriquer un composant électronique céramique Download PDF

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WO2012056922A1
WO2012056922A1 PCT/JP2011/073793 JP2011073793W WO2012056922A1 WO 2012056922 A1 WO2012056922 A1 WO 2012056922A1 JP 2011073793 W JP2011073793 W JP 2011073793W WO 2012056922 A1 WO2012056922 A1 WO 2012056922A1
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electronic component
superheated steam
ceramic electronic
degreasing
manufacturing
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PCT/JP2011/073793
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English (en)
Japanese (ja)
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中村　和敬
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株式会社村田製作所
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Definitions

  • the present invention relates to a method for manufacturing a ceramic electronic component.
  • the present invention also relates to an apparatus for manufacturing a ceramic electronic component.
  • a multilayer ceramic capacitor As a ceramic electronic component formed by firing a molded body containing ceramic powder and a binder, for example, a multilayer ceramic capacitor can be cited.
  • a method for producing a multilayer ceramic capacitor for example, a green sheet is produced by a doctor blade method using a slurry containing ceramic powder and a binder. An internal electrode is printed on the green sheet, and after stacking a plurality of green sheets, they are pressed and cut into chips to form a molded body. Thereafter, external electrodes are formed after degreasing and firing.
  • Patent Document 1 discloses a ceramic molding in which a binder is decomposed and removed by heat treatment at 1000 ° C. or less in a non-oxidizing gas atmosphere containing 5 to 90% by volume of water vapor A body degreasing method is disclosed.
  • the present invention has been made in view of such a problem, and an object of the present invention is to provide a method of manufacturing a ceramic electronic component and a manufacturing apparatus thereof that can be degreased in a short time without causing peeling or cracking.
  • the method for manufacturing a ceramic electronic component according to the present invention includes mixing ceramic powder and a binder to produce a mixture, forming the mixture to form a formed body, and supplying superheated steam to the formed body.
  • the method comprises a step of degreasing the molded body to form a degreased body and a step of firing the degreased body.
  • the superheated steam is supplied in a state of being mixed with air in the step of forming the degreased body.
  • the temperature of the superheated steam is equal to or higher than the thermal decomposition temperature of the binder.
  • the temperature of the superheated steam is preferably 250 to 600 ° C.
  • the molded body has an internal electrode.
  • the present invention is also directed to a ceramic electronic component manufacturing apparatus.
  • An apparatus for manufacturing a ceramic electronic component according to the present invention includes a degreasing chamber in which a molded body containing ceramic powder and a binder is disposed, steam generating means for generating steam, and heating the steam to superheated steam. And a superheated steam supply means for supplying the superheated steam to the molded body.
  • the ceramic electronic component manufacturing apparatus preferably further comprises a degreasing chamber heating means for heating the outer wall of the degreasing chamber.
  • the ceramic electronic component manufacturing apparatus may further include a connection path that connects the water vapor generation means and the superheated steam generation means, and an air introduction path that introduces air into the connection path. preferable.
  • the drainage path is disposed below the degreasing chamber so as to be connected to the degreasing chamber, and the drainage path for discharging the condensed water in the degreasing chamber; It is preferable to further include a drainage tank for storing water.
  • the superheated steam directly permeates the inside of the molded body, the temperature difference between the inside and the outside of the molded body is small, and the inside of the molded body can be heated quickly. Therefore, degreasing is possible in a short time without peeling or cracking.
  • the method for manufacturing a ceramic electronic component according to the present invention is manufactured as follows as an example.
  • make ceramic powder Specifically, it is produced by a solid-phase synthesis method in which compound powders such as oxides, carbonates, chlorides, and metal organic compounds containing the main constituent elements are mixed at a predetermined ratio and calcined.
  • a hydrothermal synthesis method, a hydrolysis method, or the like may be applied.
  • the obtained ceramic powder and a binder are mixed to prepare a slurry as a mixture.
  • the binder include acrylic resin, polyvinyl butyral, polyvinyl alcohol, and vinyl acetate.
  • a plasticizer and a dispersant may be mixed.
  • the obtained mixture is molded to form a molded body.
  • a ceramic green sheet is produced by a sheet forming method or the like.
  • a conductive paste is applied to a predetermined ceramic green sheet by printing or the like. And after laminating
  • the method in which an internal electrode is not formed such as a press molding method, may be used.
  • the molded body is degreased to form a degreased body.
  • superheated steam penetrates directly into the molded body because there are many holes and gaps through which the superheated steam passes. Therefore, the temperature difference between the inside and outside of the molded body is small, and the inside of the molded body can be heated quickly. Therefore, degreasing is possible in a short time while suppressing peeling and cracks that occur during conventional degreasing.
  • heating is performed using water having a higher thermal conductivity than air, so heat efficiency during degreasing is good.
  • the step of forming the degreased body it is preferable to supply superheated steam mixed with air.
  • oxygen is supplied at the same time, so that the thermal decomposition reaction of the binder is facilitated and degreasing is further promoted.
  • the temperature of the superheated steam is equal to or higher than the thermal decomposition temperature of the binder.
  • the thermal decomposition temperature of the binder refers to a temperature at which the thermal decomposition reaction of the binder is started. In this case, the thermal decomposition reaction of the binder is further promoted.
  • the temperature of the superheated steam is 250 to 600 ° C. In this case, the thermal decomposition reaction of the organic component, particularly the carbon component is promoted.
  • the internal electrode is hardly oxidized when degreasing using superheated steam.
  • the material of the internal electrode include those containing Ni, Ag / Pd, Pt, and Cu as main components.
  • the degreased body is fired to obtain a fired body.
  • external electrodes are formed on the end face of the fired body.
  • the external electrode is formed by applying and baking a conductive paste, for example.
  • FIG. 1 is a schematic diagram of an apparatus for manufacturing a ceramic electronic component.
  • a manufacturing apparatus 1 includes a degreasing chamber 52 that houses a molded body containing ceramic powder and a binder, a water vapor generating means 10 for generating water vapor, and heating water vapor into superheated water vapor. Heating steam generating means 30 and superheated steam supply means 40 for supplying superheated steam to the compact.
  • the water vapor generating means 10 has a water vapor generating chamber 12, a water supply means 14, a water tank 18, and a heating means 19.
  • the water 16 supplied from the water supply means 14 is stored in a water tank 18 in the steam generation chamber 12. Then, it is heated by the heating means 19 and evaporated to become water vapor.
  • connection path 24 is provided so as to connect the steam generating means 10 and the superheated steam generating means 30.
  • the superheated steam generating means 30 is provided to heat the steam to form heated steam.
  • the steam flowing in from the connection path 24 is heated by the superheated steam generating means 30 to become heated steam.
  • the air introduction path 22 is provided so as to introduce air into the connection path 26.
  • the superheated steam generated by the superheated steam generation means 30 is mixed with the superheated steam and air in the connection path 26. Then, the superheated steam whose temperature is lowered by mixing with air is reheated by the temperature holding heat source 35 and adjusted to an arbitrary temperature. Thereafter, the superheated steam enters the superheated steam supply means 40.
  • the superheated steam supply means 40 includes a supply path 42 and a nozzle 44.
  • the leading end of the supply path 42 reaches the inside of the degreasing chamber 52.
  • the superheated steam is supplied to the molded body placed on the table 56 in the degreasing chamber 52 through the superheated steam supply means 40.
  • the nozzle 44 is arranged so that superheated steam is ejected toward the surface of the molded body.
  • a degreasing chamber heating means 54 for heating the outer wall of the degreasing chamber 52 is provided around the outer wall of the degreasing chamber 52.
  • the degreasing chamber heating means 54 can prevent dew condensation that occurs in the degreasing chamber 52.
  • a drainage path 72 is arranged so as to be connected to the degreasing chamber 52.
  • the water generated when the molded body is heated is condensed in the degreasing chamber 52 and is discharged out of the degreasing chamber 52 through the drainage path 72.
  • the discharged water is stored as drainage 74 in a drainage tank 76 disposed below the degreasing chamber 52.
  • Gases such as carbon monoxide and methane generated at the time of degreasing are adsorbed with water molecules as described above, and are discharged together with the wastewater into the drainage tank. Therefore, compared with the conventional degreasing, there is an advantage that unnecessary gas is hardly generated.
  • this invention is not limited to said embodiment, A various deformation
  • a ceramic electronic component was produced as follows.
  • a ceramic powder was prepared. Specifically, BaTiO 3 powder, Dy 2 O 3 powder, and SiO 2 powder were prepared as the starting material compound powder. Then, with respect to BaTiO 3 100 mol, 0.02 mol of Dy 2 O 3, a SiO 2 was 0.5mol formulated. Then, pure water was added thereto, and the mixture was pulverized with a ball mill using PSZ beads as a medium. Then, the slurry after the mixing and pulverizing treatment was dehydrated and dried, granulated to have a particle size of about 50 ⁇ m, and then calcined at a temperature of 1200 ° C. for 2 hours.
  • a mixture was prepared. Specifically, with respect to 100 parts by weight of the dried product, 0.8 parts by weight of a polycarboxylic acid ammonium salt-based dispersant, 0.7 parts by weight of a dibutyl phthalate plasticizer, an acrylic resin 15 parts by weight of a system binder and a predetermined amount of pure water were weighed and added. Then, PSZ beads were mixed as media with a ball mill to obtain a sheet forming slurry.
  • a molded body was produced. Specifically, a green sheet having a thickness of 4 ⁇ m was prepared by a doctor blade method using a slurry for sheet forming. And the electrically conductive paste which contains Ni as a main component was printed on the green sheet, and was dried at 60 degreeC for 1 hour. Next, 100 green sheets on which conductive paste was not printed, 51 green sheets on which conductive paste was printed, and 100 green sheets on which conductive paste was not printed were sequentially stacked. These were pressure-bonded at a pressure of 20 MPa and then cut into a size of 2.0 mm ⁇ 1.2 mm. Then, together with the 3 mm ⁇ alumina beads, the cut molded body was put in a pot and subjected to barrel polishing using a planetary mill.
  • the obtained molded body was degreased as follows to prepare samples of Experimental Examples 1 and 2 and Comparative Examples 1 to 4.
  • Experimental Examples 1 and 2 are samples in which superheated steam was directly blown with a blower for 30 minutes to degrease the molded body.
  • Experimental Example 1 is a sample degreased with superheated steam at 250 ° C.
  • Experimental Example 2 is a sample degreased with 600 ° C. superheated steam.
  • Comparative Examples 1 to 4 are samples in which the molded body was heated to 300 ° C. and kept at 300 ° C. for 2 hours by a conventional degreasing method. Comparative Examples 1 to 4 are samples in which the heating rate was changed from 0.2 to 3.0 ° C./min.
  • the degreasing time of Comparative Examples 1 to 4 is the total time of the temperature rising time up to 300 ° C. and 2 hours that is the keeping time at 300 ° C.
  • a conductive paste containing Cu as a main component was applied to the end of the fired body and baked at a predetermined temperature and atmosphere to form external electrodes. Thereafter, electrolytic plating was performed in the order of Ni and Sn to form a plating film on the external electrode.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Capacitors (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un composant électronique céramique, où le dégraissage peut être effectué en un court laps de temps; et un appareil pour la fabrication d'un composant électronique céramique. Ce procédé de fabrication d'un composant électronique céramique est caractérisé en ce qu'il comprend : une étape où un mélange est préparé en mélangeant une poudre céramique et un liant et un corps moulé est formé par moulage du mélange; une étape où la vapeur surchauffée est amenée au corps moulé si bien que le corps moulé est dégraissé, formant ainsi un corps dégraissé; et une étape où le corps dégraissé est cuit.
PCT/JP2011/073793 2010-10-26 2011-10-17 Procédé et appareil pour fabriquer un composant électronique céramique WO2012056922A1 (fr)

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JP2010-239803 2010-10-26

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017009207A (ja) * 2015-06-23 2017-01-12 株式会社モトヤマ 電気炉
JP2017119592A (ja) * 2015-12-28 2017-07-06 太盛工業株式会社 粉体焼結成形体の製造方法、粉体焼結成形体用バインダ組成物及び焼結用成形材料
JP2021028290A (ja) * 2020-10-29 2021-02-25 太盛工業株式会社 焼結用成形材料

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109177A (ja) * 1993-10-15 1995-04-25 Matsushita Electric Ind Co Ltd セラミック成形体の脱脂方法
JPH09115704A (ja) * 1995-10-19 1997-05-02 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPH09241734A (ja) * 1996-03-01 1997-09-16 Hiroshi Shishido 過熱蒸気発生装置により発生した過熱蒸気雰囲気を利用した熱処理炉により行なう金属、非鉄金属、ガラス、セラミックス、樹脂などの表面を脱脂、焼鈍、焼き戻し、防錆する方法および過熱蒸気雰囲気を利用した金属、非鉄金属、ガラス、セラミックス、樹脂などの表面処理装置。
JP2005201606A (ja) * 2004-01-19 2005-07-28 Nadex Co Ltd 加熱装置
JP2005221135A (ja) * 2004-02-05 2005-08-18 Ishin Giken:Kk 焼成炉
JP2007230796A (ja) * 2006-02-28 2007-09-13 Mino Shigen Kaihatsu:Kk セラミックスの製造方法およびセラミックス焼成炉
WO2008053647A1 (fr) * 2006-10-31 2008-05-08 Ngk Insulators, Ltd. Procédé de prétraitement d'un moulage en nid d'abeille pour calcination et système de prétraitement d'un moulage en nid d'abeille pour calcination

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109177A (ja) * 1993-10-15 1995-04-25 Matsushita Electric Ind Co Ltd セラミック成形体の脱脂方法
JPH09115704A (ja) * 1995-10-19 1997-05-02 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPH09241734A (ja) * 1996-03-01 1997-09-16 Hiroshi Shishido 過熱蒸気発生装置により発生した過熱蒸気雰囲気を利用した熱処理炉により行なう金属、非鉄金属、ガラス、セラミックス、樹脂などの表面を脱脂、焼鈍、焼き戻し、防錆する方法および過熱蒸気雰囲気を利用した金属、非鉄金属、ガラス、セラミックス、樹脂などの表面処理装置。
JP2005201606A (ja) * 2004-01-19 2005-07-28 Nadex Co Ltd 加熱装置
JP2005221135A (ja) * 2004-02-05 2005-08-18 Ishin Giken:Kk 焼成炉
JP2007230796A (ja) * 2006-02-28 2007-09-13 Mino Shigen Kaihatsu:Kk セラミックスの製造方法およびセラミックス焼成炉
WO2008053647A1 (fr) * 2006-10-31 2008-05-08 Ngk Insulators, Ltd. Procédé de prétraitement d'un moulage en nid d'abeille pour calcination et système de prétraitement d'un moulage en nid d'abeille pour calcination

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017009207A (ja) * 2015-06-23 2017-01-12 株式会社モトヤマ 電気炉
JP2017119592A (ja) * 2015-12-28 2017-07-06 太盛工業株式会社 粉体焼結成形体の製造方法、粉体焼結成形体用バインダ組成物及び焼結用成形材料
JP2021028290A (ja) * 2020-10-29 2021-02-25 太盛工業株式会社 焼結用成形材料
JP7001794B2 (ja) 2020-10-29 2022-01-20 太盛工業株式会社 焼結用成形材料
JP2022031454A (ja) * 2020-10-29 2022-02-18 太盛工業株式会社 過熱水蒸気脱脂焼結装置
JP7359459B2 (ja) 2020-10-29 2023-10-11 太盛工業株式会社 過熱水蒸気脱脂焼結装置

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