WO2012043623A1 - Boîtier contenant un élément, module et dispositif à semi-conducteurs - Google Patents

Boîtier contenant un élément, module et dispositif à semi-conducteurs Download PDF

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Publication number
WO2012043623A1
WO2012043623A1 PCT/JP2011/072172 JP2011072172W WO2012043623A1 WO 2012043623 A1 WO2012043623 A1 WO 2012043623A1 JP 2011072172 W JP2011072172 W JP 2011072172W WO 2012043623 A1 WO2012043623 A1 WO 2012043623A1
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WO
WIPO (PCT)
Prior art keywords
fixing member
ferrule
frame body
thickness
peripheral surface
Prior art date
Application number
PCT/JP2011/072172
Other languages
English (en)
Japanese (ja)
Inventor
博司 柴山
藤原　宏信
宮原　学
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2012043623A1 publication Critical patent/WO2012043623A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base

Definitions

  • the present invention relates to an element storage package (hereinafter also simply referred to as a package) for storing semiconductor elements typified by LD (laser diode) and PD (photodiode), and a module and semiconductor device including the same.
  • a package for storing semiconductor elements typified by LD (laser diode) and PD (photodiode), and a module and semiconductor device including the same.
  • a package described in Patent Document 1 is known as an element storage package for storing semiconductor elements.
  • the package described in Patent Document 1 includes a frame having a through hole in a side portion and a cylindrical fixing member attached to an outer surface around the through hole of the frame.
  • An optical fiber or a ferrule into which the optical fiber is inserted is used as the fixing member.
  • the optical fiber can be optically coupled to the semiconductor element housed in the package.
  • the package described in Patent Document 1 has thermal stress due to heat from the brazing material that is a bonding member when the substrate and the frame are bonded, or heat generated from the semiconductor element when the semiconductor device including the package is used. Will be added.
  • the frame body may be deformed by this thermal stress. Further, when the package is fixed to the mounting substrate by screwing, the stress caused by the screwing may be transmitted to the frame body and the frame body may be deformed such as bending.
  • An element storage package includes a base having a mounting area on which a semiconductor element is mounted on an upper surface, and an inner surface disposed on the upper surface of the base so as to surround the mounting area.
  • a frame having an opening that opens to the side surface and the outer surface, a first portion fixed around the opening on the inner peripheral surface of the opening or the outer surface of the frame, and the first portion
  • a cylindrical fixing member having a second portion that is positioned outside the frame and to which the ferrule is fixed.
  • the fixing member has a portion having a smaller thickness than the thickness of the second portion between the first portion and the second portion.
  • FIG. 2 is a plan view of the element storage package shown in FIG. 1.
  • FIG. 3 is an enlarged sectional view in the vicinity of a fixing member in the AA section of the element storage package shown in FIG.
  • FIG. 3 is a BB cross-sectional view of the element storage package shown in FIG. 2.
  • FIG. 10 is an enlarged cross-sectional view showing a first modification of the element storage package shown in FIG. 3.
  • FIG. 10 is an enlarged cross-sectional view showing a second modification of the element storage package shown in FIG. 3.
  • FIG. 10 is an enlarged cross-sectional view showing a third modification of the element storage package shown in FIG. 3. It is an expanded sectional view of the vicinity of the fixing member in the element storage package of the second embodiment. It is an expanded sectional view of the vicinity of the fixing member in the element storage package of the third embodiment.
  • an element storage package according to an embodiment of the present invention a module including the same, and a semiconductor device will be described in detail with reference to the drawings.
  • the element storage package, the module, and the semiconductor device according to the present invention can include arbitrary constituent members that are not shown in the respective drawings to be referred to.
  • the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
  • the element storage package 1 is mounted on a base 5 having a mounting region 5 a on which a semiconductor element 3 is mounted on the top surface, and on the top surface of the base 5.
  • a frame 7 having an opening 7a that opens to the inner surface and the outer surface, which is disposed so as to surround the region 5a, and a first portion 9a fixed around the opening 7a on the outer surface of the frame 7.
  • a cylindrical fixing member 9 having a second portion 9b which is located outside the frame body 7 relative to the first portion 9a and to which the ferrule 11 is fixed.
  • the fixing member 9 has a portion having a smaller thickness than the thickness of the second portion 9b between the first portion 9a fixed to the frame body 7 and the second portion 9b to which the ferrule 11 is fixed. is doing.
  • the fixing member 9 in the package 1 of the present embodiment is a cylindrical member, and is joined to the frame body 7 so that the through hole of the cylinder is connected to the opening on the outer surface of the frame body 7. ing.
  • the fixing member 9 has a shape in which the thickness D2 on one end side is smaller than the thickness D1 on the other end side. Therefore, a portion having a thickness smaller than the thickness of the second portion 9b (the third portion 9b) between the first portion 9a located on the one end side and the second portion 9b located on the other end side.
  • the shape has a portion 9c).
  • the fixing member 9 in the package 1 of the present embodiment has the portion 9c having a thickness smaller than the thickness of the second portion 9b to which the ferrule 11 is fixed. This portion is located between the first portion 9a and the second portion 9b. This small thickness portion 9 c is relatively easily deformed in the fixing member 9. Therefore, the stress transmitted to the optical fiber 13 due to the deformation of the frame 7 can be relieved in the thin portion 9c. As a result, since the position shift of the optical fiber 13 can be suppressed, a decrease in the operability of the semiconductor element 3 can be suppressed.
  • the base body 5 in the present embodiment has a quadrangular shape when viewed in plan, and has a mounting area 5a on which the semiconductor element 3 is mounted.
  • the placement region 5a means a region that overlaps the semiconductor element 3 when the substrate 5 is viewed in plan.
  • substrate 5 has the screwing part 15 in the four corners, respectively.
  • the base 5 can be mounted and fixed to a mounting substrate (not shown) by the screwing portion 15.
  • the size can be set to, for example, 5 mm to 100 mm on a side.
  • substrate 5 it can set to 0.2 mm or more and 2 mm or less, for example.
  • the placement area 5a is formed at the center of the upper surface of the substrate 5, but the area where the semiconductor element 3 is placed is referred to as the placement area 5a. Therefore, for example, there is no problem even if the placement region 5 a is formed at the end of the upper surface of the base 5.
  • the base body 5 of the present embodiment has one placement area 5a, but the base body 5 has a plurality of placement areas 5a, and the semiconductor element 3 is placed in each placement area 5a. May be.
  • a plurality of wiring conductors 17 are disposed on the base body 5.
  • the plurality of wiring conductors 17 are located from the inside to the outside of the region surrounded by the frame body 7. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 7.
  • the plurality of wiring conductors 17 are arranged at predetermined intervals so as not to be electrically short-circuited with each other.
  • a metal substrate made of a metal member or an insulating substrate made of an insulating member can be used as the substrate 5.
  • a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used as the metal member.
  • a metal substrate constituting the substrate 5 can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • the insulating substrate may be, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or Glass ceramic materials can be used.
  • a mixing member is prepared by mixing raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder.
  • a plurality of ceramic green sheets are produced by forming the mixed member into a sheet.
  • a plurality of laminated bodies are produced by laminating the produced ceramic green sheets.
  • An insulating substrate is produced by integrally firing the plurality of laminates at a temperature of about 1600 degrees.
  • the base body 5 is constituted by one metal substrate or an insulating substrate.
  • the substrate 5 is not limited to this.
  • the substrate 5 may be configured by laminating a plurality of metal substrates.
  • the base 5 may be configured by laminating a plurality of insulating substrates.
  • the base body 5 may be configured by laminating a plurality of metal substrates and a plurality of insulating substrates. Specifically, since the wiring conductor 17 is disposed on the main surface of the base body 5, at least a portion where the wiring conductor 17 is disposed is required to have high insulation.
  • the base 5 may have a configuration in which an insulating substrate is laminated on a metal substrate.
  • the substrate 5 preferably has the above-described configuration. This is because the metal member has high heat dissipation.
  • a member having good conductivity As the wiring conductor 17. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver and gold can be used as the wiring conductor 17. The above metal materials may be used alone or as an alloy.
  • the wiring conductor 17 is a member for electrically connecting an external wiring (not shown) and the semiconductor element 3 via the lead terminal 19 or the like. Therefore, although the wiring conductor 17 in this embodiment is arrange
  • the base body 5 made of an insulating member exists between the wiring conductors 17 in the embedded portion. Therefore, the insulation between the plurality of wiring conductors 17 can be improved.
  • the wiring conductor 17 is pulled out from the side surface of the base body 5, and is electrically connected to the lead terminal 19 at the exposed portion on the side surface of the base body 5. You may connect.
  • the lead terminal 19 it is preferable to use a member having good conductivity similarly to the wiring conductor 17.
  • a metal material such as tungsten, molybdenum, nickel, copper, silver, and gold can be used as the lead terminal 19.
  • the above metal materials may be used alone or as an alloy.
  • the element storage package 1 of the present embodiment includes a mounting substrate 21 for mounting the semiconductor element 3 disposed on the mounting area 5a.
  • the semiconductor element 3 may be directly mounted on the base 5, the semiconductor element 3 is provided on the mounting substrate 21 and provided with the mounting substrate 21 as in the element housing package 1 of the present embodiment. Is preferably placed. This is because the difference in height between the semiconductor element 3 and the fixing member 9 can be reduced, so that the optical coupling between the semiconductor element 3 and the optical fiber 13 can be facilitated.
  • the fixing member 9 is fixed around the opening 7 a on the outer surface of the frame body 7. Therefore, the fixing member 9 is separated from the base body 5 by a predetermined distance in the height direction of the base body 5.
  • a deviation in the height direction tends to occur between the semiconductor element 3 and the fixing member 9.
  • this height deviation can be reduced. Therefore, the optical coupling can be performed stably between the semiconductor element 3 and the optical fiber 13.
  • the mounting substrate 21 it is preferable to use a member having a good insulating property like the base 5.
  • a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body, or a glass ceramic material is placed on the mounting substrate 21. Can be used.
  • the frame body 7 is provided on the upper surface of the base body 5 so as to surround the placement region 5a when viewed in plan.
  • the frame body 7 has an opening 7a that opens to the inner peripheral surface and the outer peripheral surface.
  • the frame body 7 in the present embodiment has through holes that open to the inner peripheral surface and the outer peripheral surface as the opening 7a.
  • the through hole can be formed in the frame body 7 by, for example, drilling.
  • the outer periphery can be set to 5 mm to 100 mm on a side, for example. Further, when the distance between the outer periphery and the inner periphery is the thickness of the frame body 7, the thickness of the frame body 7 can be set to 0.5 mm or more and 2 mm or less, for example. Moreover, as the height of the frame 7, it can set to 2 mm or more and 10 mm or less, for example.
  • a metal member such as iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals can be used.
  • a metal substrate constituting the substrate 5 can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • a ceramic member may be used as the frame body 7.
  • the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.
  • an opening is provided in the frame 7 and the wiring conductor 17 is provided in the opening in order to ensure insulation between the frame 7 and the wiring conductor 17. It is preferable that an insulating member is disposed between the frame body 7 and the frame body 7.
  • the element storage package 1 of the present embodiment includes a cylindrical fixing member 9 to which the optical fiber 13 is fixed. More specifically, as shown in FIGS. 1 to 4, the fixing member 9 includes a first portion 9a fixed around the opening 7a on the outer surface of the frame body 7 and a first portion 9a. Between the second portion 9b that is located outside the frame 7 and to which the ferrule 11 is fixed, and between the first portion 9a that is fixed to the frame 7 and the second portion 9b to which the ferrule 11 is fixed And a portion having a thickness smaller than the thickness of the second portion 9b.
  • the fixing member 9 in the present embodiment fixes and positions the optical fiber 13 and is cylindrical, so that light is transmitted between the semiconductor element 3 and the optical fiber 13 in the cylindrical hollow portion. It can be performed.
  • the fixing member 9 has a shape in which the thickness on one end side is smaller than the thickness on the other end side. In this manner, the fixing member 9 is a portion having a thickness smaller than the thickness of the second portion 9b between the first portion 9a fixed to the frame body 7 and the second portion 9b to which the ferrule 11 is fixed. 9c. Therefore, the third portion 9c is relatively easily deformed as compared with the second portion 9b of the fixing member 9.
  • the package 1 of the present embodiment stably fixes the ferrule 11 in the second portion 9b having a relatively large thickness, and the third portion 9c having a relatively small thickness deforms to deform the frame 7.
  • the stress transmitted to the optical fiber 13 due to the deformation can be relaxed.
  • a decrease in the operability of the semiconductor element 3 can be suppressed.
  • the thickness of the fixing member 9 in this embodiment means the width between the inner peripheral surface and the outer peripheral surface of the cylindrical fixing member 9. Therefore, for example, as shown in FIG. 3, the cylindrical fixing in the direction perpendicular to the axis of the through hole in the cross section including the axis of the through hole in the cylindrical fixing member 9 is parallel to the through direction of the through hole.
  • the thickness of the fixing member 9 can be evaluated by measuring the widths D1 and D2 between the inner peripheral surface and the outer peripheral surface of the member 9. Further, as shown in FIG. 4, the thicknesses D ⁇ b> 1 and D ⁇ b> 2 of the fixing member 9 may be measured in a cross section perpendicular to the through direction of the through hole in the cylindrical fixing member 9.
  • the axial length of the through hole of the fixing member 9 can be set to 2 mm or more and 5 mm or less.
  • the outer diameter of the fixing member 9 can be set to 1 mm or more and 5 mm or less at the largest portion.
  • it can set to 0.2 mm or more and 3 mm or less in the smallest part.
  • the thickness of the first portion 9a can be set to 0.2 mm or more and 1 mm or less.
  • the thickness of the second portion 9a can be set to 0.4 mm or more and 1 mm or less.
  • the thickness of the third portion 9c can be set to 0.2 mm or more and 0.8 mm or less.
  • the thickness of the third portion 9c is preferably 3/4 or less as compared with the thickness of the second portion 9b.
  • the thickness of the third portion 9c is preferably 0.6 mm or less.
  • the thickness of the third portion 9c is preferably 1 ⁇ 4 or more compared to the thickness of the second portion 9b.
  • the thickness of the third portion 9c is preferably 0.2 mm or more. Since it is suppressed that the thickness of the 3rd part 9c becomes thin too much, possibility that a crack will arise in the fixing member 9 can be reduced.
  • the fixing member 9 and the ferrule 11 are separated from each other in a portion closer to the frame body 7 than the second portion 9 b of the fixing member 9. That is, the third portion 9 c is separated from the ferrule 11. In such a case, the possibility that stress is directly applied to the ferrule 11 from the third portion 9c can be reduced.
  • the stress transmitted from the frame body 7 to the optical fiber 13 via the fixing member 9 is reduced by the deformation of the third portion 9c of the fixing member 9.
  • the fixing member 9 and the ferrule 11 are separated from each other, even if the third portion 9c is deformed, the third portion 9c comes into contact with the ferrule 11 and the third portion 9c
  • the possibility that stress is directly applied to the ferrule 11 from the portion 9c of the above can be reduced. Therefore, the possibility that the ferrule 11 is displaced can be further reduced.
  • the fixing member 9 in the present embodiment has a third portion having a thickness smaller than the thickness of the second portion 9b by forming a stepped portion on the outer peripheral surface of the fixing member 9. It is not limited to this.
  • a third portion 9 c having a thickness smaller than the thickness of the second portion 9 b may be formed by forming a step portion on the inner peripheral surface of the fixing member 9. .
  • the third portion 9c is formed by forming a step portion on the inner peripheral surface of the fixing member 9, the portion closer to the frame body 7 than the second portion 9b of the fixing member 9 is used. Since the interval between the fixing member 9 and the ferrule 11 can be further increased, the possibility that the third portion 9c abuts on the ferrule 11 and stress is directly applied to the ferrule 11 from the third portion is further reduced. can do.
  • the portion having a small thickness in the fixing member 9 has a shape formed in an annular shape along the circumferential direction of the outer peripheral surface in a cross section perpendicular to the longitudinal direction of the fixing member 9. Since the third portion 9c has the above-described configuration, the third portion 9c is further easily deformed. Therefore, the stress transmitted from the frame body 7 to the optical fiber 13 via the fixing member 9 can be further reduced. Further, since the third portion 9c has the above-described configuration, the third portion 9c is easily deformed not in a specific circumferential direction on the outer peripheral surface of the fixing member 9 but in an arbitrary circumferential direction. Can be relaxed.
  • the fixing member 9 is positioned outside the frame body 7, and is fixed to at least one of the inner peripheral surface and the outer peripheral surface of the portion closer to the frame body 7 than the second portion 9 b. It is preferable to have the groove part 10 formed in a direction perpendicular to the longitudinal direction.
  • the thickness of the 1st part 9a and the 3rd part 9c is not the same, and the thickness of the 3rd part 9c is smaller than the thickness of the 1st part 9a and the thickness of the 2nd part 9b. Is preferred.
  • the third portion 9c By forming the third portion 9c at the above-mentioned location, the thickness of the first portion 9a can be increased. Therefore, the bonding area between the fixing member 9 and the frame body 7 can be increased, so that the possibility that the fixing member 9 peels from the frame body 7 can be reduced.
  • the fixing member 9 has a smaller thickness at the portion having the groove portion 10 than the thickness at the second portion 9b. As a result, the fixing member 9 is easily deformed in the groove portion 10, so that the stress transmitted from the frame body 7 to the optical fiber 13 through the fixing member 9 while fixing the ferrule 11 in the second portion 9 b of the fixing member 9. It can be further relaxed.
  • the fixing member 9 has a convex portion on the outer peripheral surface of the second portion 9b and a concave portion on the inner peripheral surface of the second portion 9b. preferable.
  • the fixing member in the 2nd part 9b is enlarged, increasing the thickness of the 2nd part 9b of the fixing member 9. A sufficient space can be ensured between 9 and the ferrule 11.
  • the joining member 23 that joins the fixing member 9 and the ferrule 11 can be stored in the space. Thereby, the joining strength of the fixing member 9 and the ferrule 11 can be improved.
  • it will not specifically limit if it is a member which can join the fixing member 9 and the ferrule 11 as the joining member 23,
  • a glass-type joining material is used suitably.
  • the joining member 23 is stored in the above space. Therefore, it can suppress flowing into the part nearer to the frame body 7 than the second part 9b.
  • the fixing member 9 has a strength that can at least fix the optical fiber 13.
  • metal members such as stainless steel, iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used.
  • the cylindrical fixing member 9 can be produced by subjecting such a metal member ingot to a metal processing method such as a rolling method or a punching method.
  • the frame body 7 and the fixing member 9 are formed using the same metal member. This is because the difference in thermal expansion between the frame body 7 and the fixing member 9 can be reduced, so that the stress generated between the frame body 7 and the fixing member 9 can be reduced.
  • the fixing member 9 can be fixed to the frame body 7 by joining the frame body 7 with a brazing material.
  • a brazing material for example, gold-tin brazing can be used.
  • the fixing member 9 may be fixed to the frame body 7 by welding the fixing member 9 to the frame body 7.
  • a translucent member may be disposed inside the cylindrical fixing member 9 so as to close the hole of the fixing member 9.
  • the translucent member closes the inside of the fixing member 9, maintains the airtightness of the element housing package 1, and attaches and connects the excited light of the semiconductor element 3 that transmits the internal space of the fixing member 9 to the fixing member 9 as it is.
  • the optical fiber 13 to be transmitted is transmitted.
  • the translucent member for example, lead-based silicon oxide, lead-based amorphous oxides, and boric acid-based amorphous glass mainly composed of silica sand can be used.
  • the ferrule 11 is fixed to the second portion 9b of the fixing member 9.
  • the ferrule 11 has a through hole in which a first portion 9 a located on one end side with respect to the inside of the cylinder of the fixing member 9 is opened. Then, the optical fiber 13 is inserted and fixed in this through hole.
  • the fixing member 9 in the present embodiment has a portion having a relatively small thickness between a joint portion with the frame body 7 and a joint portion with the fixing member 9 with the ferrule 11. For this reason, even when the frame body 7 is deformed, the influence of the deformation of the frame body 7 on the positional deviation of the optical fiber 13 can be limited.
  • ferrule 11 for example, a ceramic material such as zirconia or alumina can be used. Further, as the optical fiber 13, a light-transmitting material such as quartz glass can be used.
  • the ferrule 11 in this embodiment is being fixed to the internal peripheral surface of the cylindrical fixing member 9, it is not restricted to this. For example, you may fix by joining the ferrule 11 to the end surface of the 2nd part 9b of the fixing member 9. FIG.
  • the element storage package 1 includes a base 5 having a placement area 5 a on which the semiconductor element 3 is placed on the top surface, and a placement area on the top surface of the base 5.
  • a frame body 7 having an opening 7a that opens to the inner surface and the outer surface, which is disposed so as to surround 5a, and a first portion 9a and a first portion 9a fixed to the inner peripheral surface of the opening 7a of the frame body 7;
  • a cylindrical fixing member 9 having a second portion 9b that is positioned outside the frame body 7 relative to the first portion 9a and to which the ferrule 11 is fixed.
  • the fixing member 9 has a portion having a smaller thickness than the thickness of the second portion 9b between the first portion 9a fixed to the frame body 7 and the second portion 9b to which the ferrule 11 is fixed. Yes.
  • the cylindrical fixing member 9 is characterized in that it is fixed to the inner peripheral surface of the opening 7 a of the frame body 7. In this way, when the fixing member 9 is fixed to the frame body 7, the fixing member 9 and the frame body 7 can be joined without increasing the thickness of the first portion 9 a of the cylindrical fixing member 9. The area can be increased. Therefore, it is possible to reduce the possibility that the fixing member 9 is peeled off from the frame body 7 while reducing the height of the package 1.
  • the element housing package 1 of the third embodiment has a fixing member 9 around the opening 7 a on the outer surface of the frame body 7 as compared with the package 1 of the first embodiment.
  • a cylindrical first member 9d one end of which is fixed to the first member 9d, and a cylinder which is joined to the other end of the first member 9d and located on the outer side of the frame body 7 relative to the first member 9d.
  • a second member 9e having a shape. The thickness of the second member 9e is larger than the thickness of the first member 9d.
  • the fixing member 9 in the first embodiment is composed of one member, but the fixing member 9 in the present embodiment is composed of the first member 9d and the second member 9e.
  • the fixing member 9 is composed of a plurality of members in this way, it is easy to adjust the thickness for each member, and thus the first portion 9a and the second portion 9b of the fixing member 9 are used. It becomes easy to make each thickness into a desired thickness. As a result, the stress transmitted from the frame body 7 to the optical fiber 13 via the fixing member 9 can be further relaxed while fixing the ferrule 11.
  • first member 9d and the second member 9e as exemplified with respect to the fixing member 9, a metal member such as stainless steel, iron, copper, nickel, chromium, cobalt and tungsten, or an alloy made of these metals is used. be able to.
  • the cylindrical first member 9d and second member 9e can be manufactured by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • the material constituting the second member 9e has higher rigidity than the material constituting the first member 9d. Since the first member 9d having a relatively small thickness is more easily deformed, it is transmitted from the frame body 7 to the optical fiber 13 through the fixing member 9 while the ferrule 11 is stably fixed by the second member 9e. This is because the stress can be further relaxed by the first member 9d.
  • copper may be used as the first member 9d and stainless steel may be used as the second member 9e.
  • the rigidity of the first member 9d and the second member 9e is determined by applying a load to the first member 9d and the second member 9e based on, for example, a JIS three-point bending test (JIS R 1601). Can be judged.
  • JIS R 1601 JIS three-point bending test
  • the first member 9d and the second member 9e are formed into rectangular prisms in accordance with the JIS three-point bending test.
  • a test piece is produced by processing, the test piece is placed on two fulcrums arranged at a fixed distance, and a load is applied to one central point between the fulcrums for evaluation.
  • the inner diameter of the second member 9e is larger than the inner diameter of the first member 9d, and the second member is larger than the outer diameter of the first member 9d.
  • the outer diameter of 9e is large. Therefore, at the boundary between the other end portion of the first member and the one end portion of the second member, steps are formed on the inner peripheral surface side and the outer peripheral surface side, respectively. Therefore, a third portion 9c in which the thickness of the fixing member 9 is relatively small is formed at a boundary portion between the first member 9d and the second member 9e.
  • the third member 9d can be easily made without excessively thinning the thickness of the first member 9d and without excessively thickening the second member 9e. 9c can be formed.
  • the module 25 of the present embodiment is joined to the element housing package 1 typified by the above embodiment, the semiconductor element 3 placed in the placement region 5 a of the element housing package 1, and the frame body 7.
  • a lid 27 for sealing the semiconductor element 3 is provided.
  • the module 25 of the present embodiment includes the element housing package 1 typified by the above-described embodiment, it is possible to suppress the displacement of the optical fiber 13.
  • the optical axis shift of the optical coupling can be reduced. Therefore, a decrease in the operability of the semiconductor element 3 is suppressed, and the performance of the module 25 can be improved.
  • the semiconductor element 3 is mounted on the mounting region 5a of the base body 5.
  • the semiconductor element 3 and the wiring conductor 17 are electrically connected via a conducting wire 29.
  • a desired output can be obtained from the semiconductor element 3 by inputting an external signal to the semiconductor element 3 via an external wiring (not shown), the wiring conductor 17 and the conducting wire 29.
  • the semiconductor element 3 include a light emitting element that emits light to the optical fiber 13 typified by an LD element, and a light receiving element that receives light to the optical fiber 13 typified by a PD element. .
  • the semiconductor element 3 and the wiring conductor 17 can be electrically connected by so-called wire bonding, for example, via a conductive wire 29. Further, the wiring conductor 17 is extended directly below the semiconductor element 3 and the semiconductor element 3 and the wiring conductor 17 are joined by a so-called flip chip in which the semiconductor element 3 and the wiring conductor 17 are joined via a conductive adhesive such as a brazing material. The conductor 17 may be electrically connected.
  • the lid body 27 is joined to the frame body 7 so as to seal the semiconductor element 3.
  • the lid body 27 is joined to the upper surface of the frame body 7.
  • the semiconductor element 3 is sealed in a space surrounded by the base body 5, the frame body 7, and the lid body 27.
  • a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used.
  • the frame body 7 and the lid body 27 can be joined by, for example, a seam welding method. Further, the frame body 7 and the lid body 27 may be joined using, for example, gold-tin solder.
  • the semiconductor device 31 according to the present embodiment includes the module 25 represented by the above embodiment and the optical fiber 13 fixed to the fixing member 9 by being fixed to the ferrule 11.
  • the semiconductor device 31 of this embodiment includes the element housing package 1 typified by the above embodiment, the optical fiber 13 and the semiconductor element 3 can be prevented from being misaligned.
  • the optical axis deviation of the optical coupling can be reduced. Therefore, it is possible to provide a high-performance semiconductor device 31 in which a decrease in operability of the semiconductor element 3 is suppressed.
  • the optical fiber 13 and the ferrule 11 may be fixed to the fixing member 9 at the end face located outside the frame body 7, and a part of the optical fiber 13 and the ferrule 11 is inserted into the fixing member 9. May be fixed to the inner peripheral surface of the fixing member 9.
  • the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments may be made without departing from the scope of the present invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Un mode de réalisation de la présente invention porte sur un boîtier contenant un élément, lequel boîtier comprend : un corps de base ayant sur la surface supérieure de celui-ci une région de disposition sur laquelle est disposé un élément semi-conducteur ; un corps de cadre disposé sur la surface supérieure du corps de base de façon à entourer la région de disposition et ayant une ouverture ouverte à la surface interne et à la surface externe du corps de cadre ; et un élément fixe en forme de tube ayant une première partie qui est fixée à la surface périphérique interne de l'ouverture ou à la surface externe du corps de cadre de façon à être située autour de l'ouverture, l'élément fixe en forme de tube ayant également une seconde partie qui est disposée davantage vers l'extérieur du corps de cadre que la première partie et à laquelle est fixée une virole. L'élément fixe a une partie ayant une épaisseur inférieure à celle de la seconde partie, et la partie est disposée entre la première partie et la seconde partie.
PCT/JP2011/072172 2010-09-28 2011-09-28 Boîtier contenant un élément, module et dispositif à semi-conducteurs WO2012043623A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-216738 2010-09-28
JP2010216738 2010-09-28

Publications (1)

Publication Number Publication Date
WO2012043623A1 true WO2012043623A1 (fr) 2012-04-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191214A (ja) * 2013-03-27 2014-10-06 Kyocera Corp 光半導体素子収納用パッケージおよびそれを用いた実装構造体
JP2014215455A (ja) * 2013-04-25 2014-11-17 京セラ株式会社 光半導体素子収納用パッケージおよびこれを備えた実装構造体
CN105164801A (zh) * 2013-08-28 2015-12-16 京瓷株式会社 元件收纳用封装件以及具备该元件收纳用封装件的安装结构体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234638A (ja) * 2006-02-27 2007-09-13 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234638A (ja) * 2006-02-27 2007-09-13 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014191214A (ja) * 2013-03-27 2014-10-06 Kyocera Corp 光半導体素子収納用パッケージおよびそれを用いた実装構造体
JP2014215455A (ja) * 2013-04-25 2014-11-17 京セラ株式会社 光半導体素子収納用パッケージおよびこれを備えた実装構造体
CN105164801A (zh) * 2013-08-28 2015-12-16 京瓷株式会社 元件收纳用封装件以及具备该元件收纳用封装件的安装结构体
EP3041040A4 (fr) * 2013-08-28 2017-02-08 Kyocera Corporation Boîtier de logement d'élément et structure de montage comprenant ce dernier
CN105164801B (zh) * 2013-08-28 2017-11-14 京瓷株式会社 元件收纳用封装件以及具备其的安装结构体

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