WO2012035722A1 - Dispositif de traitement - Google Patents

Dispositif de traitement Download PDF

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Publication number
WO2012035722A1
WO2012035722A1 PCT/JP2011/005038 JP2011005038W WO2012035722A1 WO 2012035722 A1 WO2012035722 A1 WO 2012035722A1 JP 2011005038 W JP2011005038 W JP 2011005038W WO 2012035722 A1 WO2012035722 A1 WO 2012035722A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
processing
processing apparatus
processing target
target member
Prior art date
Application number
PCT/JP2011/005038
Other languages
English (en)
Japanese (ja)
Inventor
一登 三田
Original Assignee
古河機械金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河機械金属株式会社 filed Critical 古河機械金属株式会社
Priority to KR1020127034245A priority Critical patent/KR20130099816A/ko
Priority to CN201180037946.XA priority patent/CN103052577B/zh
Priority to JP2012533849A priority patent/JPWO2012035722A1/ja
Publication of WO2012035722A1 publication Critical patent/WO2012035722A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • This invention relates to the processing apparatus which performs a predetermined process with respect to a flat member.
  • the present applicant has proposed a member processing apparatus that can uniformly perform a heat treatment or the like on a target member.
  • the target member is advanced from the standby position to the processing position with the fork, and the fork is moved relative to the lower side of the plurality of support wires to process the target member with a plurality of support wires arranged in parallel. Support in position.
  • a flat processing target member is horizontally supported at a plurality of points by a movable pin and a stationary pin of a lift pin mechanism.
  • the present invention has been made in view of the above-described problems, and provides a processing apparatus capable of uniformly executing a predetermined process such as heat treatment or reduced-pressure drying on a processing target member.
  • a processing apparatus that performs processing by arranging a flat plate-like member at a processing position, and the flat plate-like member is disposed across the flat plate-like member when viewed from above.
  • the first wire portion and the second wire portion supported from the lower side, and the first wire portion is moved relative to the second wire portion in the up-down direction, so that the first in the up-down direction
  • a processing unit for processing the flat plate member supported by the first wire member or the second wire member.
  • the processing apparatus includes a drive unit that moves the first wire member relative to the second wire member in the vertical direction, and the first wire member as the second wire. And a displacement mechanism that moves relative to the part in the horizontal direction. Therefore, for example, after the flat wire member to be processed is supported by the first wire member, the first wire member is moved downward relative to the second wire member, and the second wire member is moved. A flat member can be supported on the portion. Thereby, it is prevented that the same location of a flat member is supported by a wire part. Furthermore, while the flat wire member is supported by the second wire rod portion, the first wire rod portion can be moved in the horizontal direction relative to the second wire rod portion.
  • a flat member can be supported by the 1st wire part.
  • the member is supported by the first wire rod part before and after the step of supporting the member by the second wire rod part, but the first wire before and after the step of supporting the member by the second wire rod part.
  • the place which a wire part supports will differ. This also prevents the flat member from being supported by the wire portion at the same location.
  • the first wire portion is moved in the horizontal direction relative to the second wire portion while the plate member is supported by the second wire portion.
  • the present invention is not limited to this, and the second wire portion may be relatively moved in the horizontal direction while the plate member is supported by the first wire portion.
  • the first wire portion when the first wire portion is composed of a plurality of wires, at least a part of the wire is driven relatively up and down with respect to the wire constituting the second wire portion,
  • the positional relationship in the vertical direction between the position of the wire constituting the first wire part and the position of the wire constituting the second wire part may be switched.
  • moving the first wire rod portion relative to the second wire rod portion in the vertical direction may move the first wire rod portion in the vertical direction. You may move to an up-down direction, Furthermore, you may move both a 1st wire rod part and a 2nd wire rod part to an up-down direction.
  • a plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like.
  • the front / rear, left / right, and up / down directions are defined, but these are defined for convenience in order to briefly explain the relative relationship of the components of the present invention.
  • the direction at the time of manufacture and use is not limited.
  • front / rear / left / right / up / down directions do not need to be completely geometrically orthogonal, but may be relatively front / rear / left / right / up / down directions.
  • each direction is inclined in an arbitrary direction. You may do it.
  • relative movement in the vertical direction referred to in the present invention means movement to a different position in the vertical direction as a result of displacement, and the direction of displacement itself must be strictly vertical on the surface. There is no.
  • the processing apparatus of the present invention it is possible to uniformly execute a predetermined process such as a heating process or a vacuum drying process on a member to be processed.
  • front and rear and left and right directions are also defined in addition to the up and down direction.
  • the front-rear and left-right directions are directions along the horizontal direction, and the front-rear direction and the left-right direction are orthogonal to each other.
  • the processing apparatus 100 is a so-called pre-baking apparatus.
  • a flat processing target member GB which is a substrate such as a glass substrate or a printed wiring board used for a liquid crystal panel, is disposed at a processing position BP, and a heating process that is a predetermined process is performed.
  • This processing apparatus 100 performs processing by arranging a flat member (processing target member GB) at a processing position BP (see FIG. 5). As shown in FIGS. 1 and 2, the processing apparatus 100 is arranged such that the processing target member GB extends over the top view, and the first wire portion 112 that supports the processing target member GB from below. And a second wire rod part 122, a drive part (vertical mechanism) 113 for moving the first wire rod part 112 relative to the second wire rod part 122 in the vertical direction, and the first wire rod part 112. Is supported by a displacement mechanism (displacement mechanism portions 132, 134) that moves relative to the second wire rod portion 122 in the horizontal direction, and the first wire rod portion 112 or the second wire rod portion 122. And a processing unit 130 that performs processing on the processing target member GB.
  • the first wire portion 112 has a plurality of (four in this embodiment) first wire 112A.
  • the plurality of first wire rods 112 ⁇ / b> A are arranged in parallel to each other and extend in the front-rear direction.
  • Each first wire 112 ⁇ / b> A is stretched around the upper end of a pair of opposed first shafts (processed upper and lower shafts) 111.
  • the pair of first shafts 111 arranged to face each other is provided on a pair of support bases 117 (first unit portions) arranged to face each other.
  • Each support base 117 is provided with a plurality of shafts 111 so as to protrude from each support base 117.
  • the first unit 111 is constituted by the first shaft 111 and the pair of support bases 117.
  • the plurality of shafts 111 provided on each support base 117 are arranged in parallel in the left-right direction.
  • a plurality of first units 110 are spaced apart in the left-right direction.
  • the first wire rods 112A are arranged in parallel to each other.
  • the first wire 112A is made of, for example, a wire having a heat resistance of 200 ° C. or higher, such as a meta-aramid fiber or a polyimide fiber, or a metal core wire passed through a fluororesin tube, or the above-described artificial fiber or metal core wire. It consists of a wire coated with a fluororesin.
  • the first wire 112A is made of a wire having a sufficiently small cross-sectional area perpendicular to the longitudinal direction, and has a sufficiently smaller heat capacity than the processing target member GB in terms of physical properties.
  • the 2nd wire which comprises the 2nd wire part 122 mentioned later may also be comprised with the wire of the material similar to 1st wire 112A, and the 2nd wire is a material different from 112A of 1st wires. For example, you may be comprised with the wire of the material whose heat capacity is larger than 112 A of 1st wire.
  • the drive part 113 shown in FIG. 4 is for driving the 1st wire rod part 112 to an up-down direction.
  • the drive unit 113 includes an eccentric cam 115 connected to each first shaft 111, a drive shaft 114 for driving the eccentric cam 115, and a drive motor for driving the drive shaft 114. 116 (see FIGS. 1 and 2).
  • One drive shaft 114 is communicated with a plurality of support bases 117 arranged in the left-right direction, and is connected to one drive motor 116.
  • a plurality of, for example, four eccentric cams 115 are accommodated inside the support base 117, and the first shaft 111 is fixed to each of the eccentric cams 115.
  • the first shaft 111 is provided on the support base 117 so as to be displaceable in the vertical direction.
  • the plurality of first shafts 111 that respectively support one end portions of the plurality of first wire members 112 ⁇ / b> A of the plurality of first units 110 are fixed to the same drive shaft 114 via the eccentric cams 115.
  • the plurality of first shafts 111 that respectively support the other ends of the plurality of first wires 112A of the plurality of first units 110 are fixed to the other same drive shafts 114 via eccentric cams 115, respectively.
  • the drive unit 113 selectively raises or lowers the plurality of pairs of first shafts 111 in pairs in each first unit 110.
  • the processing target member GB is partitioned into a plurality of regions HS and regions DS.
  • the region HS is a portion (processing target region) that is used after the heat treatment
  • the region DS is a portion that is not used after the heat treatment.
  • the regions HS are arranged at predetermined intervals in the horizontal direction, specifically, the front-rear direction and the left-right direction
  • the region DS is a region DS.
  • the plurality of first wire rods 112A are arranged at positions that support the plurality of regions HS.
  • the 2nd wire which comprises the 2nd wire part 122 is in the position which mainly supports the area
  • the processing apparatus 100 includes a second wire portion 122.
  • the second wire rod portion 122 is constituted by one second wire rod.
  • the end portion of the second wire rod is fixed to the pair of second shafts 121 and is spanned between the pair of second shafts 121.
  • the pair of second shafts 121 are provided on support tables 127 arranged to face each other.
  • Each support base 127 is provided with one second shaft 121 so as to protrude from the support base 127.
  • the second shaft 121 is supported by a support base (second unit portion) 127 so as to be displaceable in the vertical direction.
  • the second unit 120 includes the second wire, the pair of second shafts 121 on which the second wire is bridged, and the pair of support bases 127.
  • a plurality of second units 120 are spaced apart in the left-right direction at positions corresponding to the region DS.
  • the second wire rods of the plurality of second units 120 are arranged in parallel to each other.
  • the second units 120 and the first units 110 are alternately arranged along the left-right direction.
  • the first wire 112A and the second wire are parallel to each other.
  • the processing apparatus 100 has a drive unit (not shown) for driving the second wire in the vertical direction.
  • it has a drive mechanism such as a solenoid for vertically driving a pair of second shafts 121 that are arranged opposite to each other and over which one second wire is bridged.
  • the drive mechanism such as a solenoid and the drive unit 113 constitute a drive unit that relatively moves the first wire member 112 and the second wire member 112 in the vertical direction.
  • the processing apparatus 100 includes a first base 131 on which a plurality of first units 110 are mounted and is slidable in the left-right direction, and the first base 131. And a displacement mechanism section 132 having a motor (moving means) 132A that displaces the lens in the left-right direction.
  • the displacement mechanism portion 132 is for moving the first wire portion 112 relative to the second wire portion 122 in the horizontal direction (in this embodiment, the left-right direction).
  • the displacement mechanism unit 132 includes a pulse motor 132A, a feed screw 132B that is rotated by the pulse motor 132A, and a first base 131 that linearly moves in the left-right direction as the feed screw 132B rotates.
  • the first base 131 is a flat rectangular plate-shaped member, and a plurality of first units 110 are mounted on the first base 131.
  • Support bases 117 are spaced apart along a pair of opposing sides of the first base 131.
  • the first base 131 moves on a rail (not shown).
  • tires or rollers that are rolling elements may be provided on the first base 131 so as to roll on the rail. Further, the first base 131 may move on the rail while being floated on the rail by air.
  • the displacement mechanism part 132 moves the 1st wire rod part 112 to a horizontal direction, the 1st wire rod part 112 will mainly move within the area
  • the processing apparatus 100 of the present embodiment includes a displacement mechanism unit 134.
  • the displacement mechanism unit 134 includes a second base 133 on which the second unit 120 is mounted and is slidable in the left-right direction, And a motor 134A for displacing the two bases 133 in the left-right direction.
  • the displacement mechanism part 134 is for moving the second wire part 122 relative to the first wire part 112 in the horizontal direction (in this embodiment, the left-right direction).
  • the displacement mechanism unit 134 includes a pulse motor 134A, a feed screw 134B that is rotated by the pulse motor 134A, and a second base 133 that linearly moves in the left-right direction by the rotation of the feed screw 134B.
  • the second base 133 is a flat rectangular plate member, and a plurality of second units 120 are mounted on the second base 133.
  • Support tables 127 are spaced apart along a pair of opposing sides of the second base 133.
  • the second base 133 moves on a rail (not shown).
  • a tire or a roller that is a rolling element may be provided on the second base 133 so as to roll on the rail.
  • the second base 133 may move on the rail while being floated on the rail by air. By doing in this way, generation
  • the displacement mechanism part 134 moves the 2nd wire rod part 122 to a horizontal direction, the 2nd wire rod part 122 will move within the area
  • the processing apparatus 100 includes at least a pair of claws 141 having a shape passing through the gaps between the plurality of first wire members 112 that are stretched. It also has a fork 140 that supports the member GB substantially horizontally, and a forward / backward movement mechanism (not shown) that moves the fork 140 back and forth between the standby position WP and the processing position BP.
  • the fork 140 is relatively moved above and below the second wire rods of the plurality of second wire rod portions 122 at least at the processing position BP. More specifically, as shown in FIG. 5 (c), the drive unit raises the second wire rod of the second wire rod portion 122 arranged at the initial position below the fork 140 to process the processing position BP.
  • the target member GB is received from the fork 140.
  • the second wire rod of the second wire rod portion 122 is raised, the fork 140 carried above is lowered, and the processing target member GB is supported by the second wire rod of the second wire rod portion 122. It is good (not shown).
  • the processing apparatus 100 of the present embodiment further includes a panel heater 130 that performs a heating process as a predetermined process on the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A.
  • This panel heater (member processing mechanism) 130 is formed in a flat plate shape (planar rectangular shape) equivalent to the processing target member GB, and as shown in FIG. Two units 120 and four pairs of first units 110 are arranged in the left-right direction.
  • the panel heater 130 heat-treats the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A, for example, from 80 to 150 ° C. from below.
  • the panel heater 130 is provided above the base 131 but is separated from the base 131.
  • the panel heater 130 is fixed without moving as the base 131 moves.
  • the processing apparatus 100 carries the heating process by bringing the flat processing target member GB into the processing position BP from the rear standby position WP as described above. This will be described with reference to FIGS.
  • FIG. 5 is a view of the processing apparatus 100 of FIG. 1 as viewed orthogonally to the left-right direction
  • FIG. 6 is a view of the processing apparatus 100 of FIG.
  • the processing apparatus 100 is configured so that all the first wire rods 112A and the second wire rod portions constituting the first wire rod portion 112 are in the initial state. 122 is descending. Then, the processing target member GB is supported substantially horizontally by the fork 140 positioned at the standby position WP above the wire rod.
  • the fork 140 is advanced from the standby position WP to the processing position BP by the fork moving mechanism. At this time, the fork 140 is located above all the first wire rods 112 ⁇ / b> A and the second wire rod portions 122 constituting the first wire rod portion 112.
  • each first unit 110 the first wire 112A located at a common position, for example, arranged first from the right rises.
  • the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire portion 112A is raised to the height of the second wire portion 112 that supports the processing target member GB, and then the second wire portion 122 is lowered. The same applies to the subsequent steps, and it is preferable that the height position of the processing target member GB does not change when the processing target member GB is delivered between the second wire portion 122 and the first wire rod 112A.
  • the processing target member GB is heated by the panel heater 130.
  • the first wire 112A that supports the processing target member GB in the region HS rises one by one in order, and three of them fall.
  • the processing target member GB is not continuously supported by the single first wire 112A. More specifically, as shown in FIGS. 6B and 6C, in each first unit 110, the first target wire 112 ⁇ / b> A among the plurality of first wires 112 ⁇ / b> A is used to process the member GB to be processed. To support.
  • the first first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB.
  • the second first wire rod 112A supporting the processing target member GB is lowered and does not support the processing target member GB.
  • the pair of first shafts 111 over which the fourth first wire rod 112A that does not support the processing target member GB is lifted rises, and the processing target member GB is supported by the raised first wire rod 112A.
  • the third first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB (processing S2).
  • the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one.
  • the first wire rods 112A in common positions are raised and lowered in synchronization.
  • the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire 112A is lowered after the other first wire 112A is raised to the height of the first wire 112A that supports the processing target member GB.
  • the second wire rod portion 122 is lowered. Then, in a state where the second wire portion 122 does not support the processing target member GB, as shown in FIG. 6C, all the second wire portions 122 are slid in the left-right direction by the displacement mechanism portion 134. In the processing apparatus 100 of the present embodiment, the second wire portion 122 periodically rises to support the processing target member GB, but when the second wire portion 122 rises to support the processing target member GB. The processing target member GB is supported at a position different from the previous time (before sliding) (see FIG. 6D).
  • each first unit 110 after the first first wire rod 112A to the fourth first wire rod 112A support the processing target member GB in order, the second wire rod portion 122 rises (processing S3). ). Thereafter, the fourth first wire rod 112A is lowered. Thereby, the processing target member GB is supported by the second wire portion 122. Thereafter, as shown in FIG. 6D, all the first wire rods 112 are slid in the left-right direction by the displacement mechanism 132. Next, as shown in FIG. 6E, the first first wire 112A is raised and the second wire 122 is lowered and before the first first wire 112A slides. The processing target member GB is supported at different positions.
  • the first wire rod 112A supports the processing target member GB within the region HS of the processing target member GB. Then, similarly to the process S2, the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one to deliver the processing target member GB between the first wire rods 112A (processing S4). ).
  • the second wire rod part 122 moves down and the second wire rod part 122 does not support the processing target member GB, all the second wire rods are moved by the displacement mechanism part 134 as shown in FIG.
  • the part 122 is slid in the left-right direction (processing S5).
  • the processing target member GB is supported at a position different from the previous time (before sliding).
  • the processes S1 to S5 are repeated.
  • the second wire portion 122 may support the processing target member GB within the region HS of the processing target member GB by sliding.
  • the processing target member GB subjected to the heating process is carried out to the standby position WP by executing the operations of FIGS. 5 (a) to 5 (d) in reverse. Is done.
  • the effect of this embodiment will be described.
  • the first wire rod 112A is lowered and the second wire rod portion 122 is raised.
  • the base 131 is slid.
  • the position of the first wire 112A is shifted before and after the step in which the second wire portion 112 supports the processing target member GB by lowering the second wire portion 122 and raising the first wire 112A.
  • Can do Thereby, it is prevented that the same position of the process target member GB is supported by the first wire rod 112A, and the heat treatment can be performed uniformly on the process target member GB.
  • the base 133 can be slid to displace the position of the second wire rod portion 122 in the left-right direction. Can be performed uniformly on the processing target member GB.
  • the plurality of first wire rods 112A are raised one by one in order and lowered in order. Thereby, it is prevented that the process target member GB is continuously supported by one first wire rod 112A. For this reason, heat processing can be uniformly performed to the process target member GB.
  • each first unit 110 is provided with a plurality of first wire rods 112A, and the processing target member GB can be delivered between the first wire rods 112A. It is not necessary to frequently deliver the processing target member GB between the portion 112 and the second wire portion 122.
  • each first unit has only one first wire rod
  • the first wire rod portion and the second wire rod portion are frequently used in order to prevent the processing target member GB from being supported at the same place.
  • the handling of the processing apparatus will deteriorate.
  • a plurality of first wire rods 112A are provided in each first unit 110, and the second member with a margin is provided while the processing target member GB is being transferred between the first wire rods 112A.
  • the wire portion 122 can be slid in the left-right direction, and the first wire portion 112 and the second wire portion 122 do not need to be frequently slid, so that an apparatus with excellent handleability can be obtained.
  • the processing target member GB carried into the processing position BP can be supported by the second wire portion 122 in the region DS that is not used after the heat treatment, the second member to the region HS that is used after the heat treatment can be supported. The influence of the support of the wire portion 122 can be minimized.
  • the first wire 112A has a sufficiently small cross-sectional area and heat capacity as described above, heat conduction is also reduced. For this reason, the deviation of the temperature distribution of the process target member GB heat-processed by the panel heater 130 can be suppressed, and the process target member GB can be heat-processed uniformly.
  • the four first shafts 111 are similarly moved up and down by the plurality of first units 110 by the single drive motor 116, so that the structure is simple and the first wire rod 112A.
  • the vertical movement is surely synchronized.
  • the wire part which is not supporting the process target member GB among the 1st wire part 112 and the 2nd wire part 122 is moved to the horizontal direction. Therefore, the processing target member GB is prevented from moving with the horizontal movement of the wire portion, and the processing target member GB can remain at the same position during the heat treatment.
  • the processing target member The height position of GB does not change. Therefore, it is possible to prevent the convection from being generated around the movement of the processing target member GB and change the temperature distribution of the processing target member GB, and to efficiently heat the processing target member GB.
  • the first unit 110 and the second unit 120 are alternately arranged along the left-right direction. Thereby, the process target member GB can be stably supported.
  • the first unit 110 is mounted on the first base 131 and the second unit 120 is mounted on the second base 133.
  • the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 is adjusted by moving the 1st base 131 and the 2nd base 133 linearly. Since the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by sliding the bases 131 and 133, the position adjustment of the 1st wire part 112 and the 2nd wire part 122 is possible. Easy. Moreover, the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by moving the bases 131 and 133 along a horizontal direction, and the sliding amount can also be set easily easily. it can.
  • the present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention.
  • the processing target member GB does not slide in the horizontal direction during the heat treatment, but this may slide.
  • the base 131 may be moved in the horizontal direction while the first wire rod 112A supports the processing target member GB.
  • these units can have various layouts corresponding to the classification of the processing target member GB.
  • the plurality of second units 120 and the plurality of first units 110 are arranged so as to correspond to the divisions of the plurality of types of processing target members GB, and the plurality of second units 120 and the plurality of first units are arranged. 110 can be selectively operated to cope with a plurality of types of processing target members GB (not shown).
  • the plurality of second units 120 and the plurality of first units 110 are arranged so as to be movable in the left-right direction, and the positions of the plurality of second units 120 and the plurality of first units 110 are changed.
  • a plurality of types of processing target members GB can also be handled (not shown).
  • the first wire 112 ⁇ / b> A has a sufficiently small cross-sectional area and heat capacity to reduce heat conduction and suppress temperature deviation of the processing target member GB to be heat-treated by the panel heater 130. did.
  • the cross-sectional area and the heat capacity of the first wire rod 112A are appropriately determined on the condition of the allowable temperature distribution deviation of the processing target member GB, the strength and durability for supporting the processing target member GB, and the like. .
  • the drive unit 113 is composed of the eccentric cam 115 supported by the common drive shaft 114, but this can also be formed by a crank mechanism.
  • the processing apparatus 100 illustrated heat-processing the process target member GB from the downward direction with the panel heater 130.
  • a processing device that heats the processing target member GB from above with the panel heater 130 or a processing device that heats the processing target member GB from above and below with a pair of panel heaters 130 is possible (both Not shown).
  • the pre-baking apparatus that heats the processing target member GB by the panel heater 130 is exemplified as the processing apparatus 100.
  • a reduced-pressure drying apparatus for drying the processing target member GB under reduced pressure can be used as a processing apparatus (not shown).
  • the processing apparatus 100 of the above embodiment may be arranged in a chamber connected to a decompression means such as a vacuum pump to constitute a decompression drying apparatus.
  • the 1st wire part 112 and the 2nd wire part 122 were moved to the horizontal direction by moving the bases 131 and 133 along a horizontal direction, but it is not restricted to this. Absent.
  • the first wire member 112 may be moved in the horizontal direction with respect to the second wire member 122 using the base 131 without providing the base 133.
  • the 1st wire part 112 was comprised with the several 1st wire 112A, it is not restricted to this, It is comprised with 1 1st wire 112A. Also good. By doing in this way, simplification of an apparatus can be achieved.
  • the first wire rod 112A is four, it is not limited to this. When there are a plurality of first wire rods 112A, for example, the number may be five or three.
  • the first wire 112A which comprises the 1st wire rod part 112 was raised and lowered in order, not only this but some 1st wire rods 112A are fixed.
  • Another part of the first wire 112A may be driven in the vertical direction. For example, after supporting the processing target member GB with a part of the first wire rod 112A, the other part of the first wire rod 112A is driven to be positioned above the part of the first wire rod 112A, The processing target member GB is supported by some of the first wires 112A. Thereafter, the other part of the first wire 112A is driven downward, and the processing target member GB is delivered to the part of the first wire 112A.

Abstract

Ce dispositif de traitement (100) est pourvu : d'une première section câble (112) et d'une seconde section câble (122) qui sont disposées de manière à ce qu'un élément (GB) devant être traité les relie sur une vue en plan, qui supportent par en-dessous l'élément (GB) devant être traité ; d'une unité d'entraînement (mécanisme vertical) (113) qui déplace la première section câble (112) dans la direction verticale par rapport à la seconde section câble (122) ; et d'un mécanisme de déplacement (sections de mécanisme de déplacement (132), (134)) qui déplace la première section câble (112) dans la direction horizontale par rapport à la seconde section câble (122).
PCT/JP2011/005038 2010-09-14 2011-09-08 Dispositif de traitement WO2012035722A1 (fr)

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KR1020127034245A KR20130099816A (ko) 2010-09-14 2011-09-08 처리장치
CN201180037946.XA CN103052577B (zh) 2010-09-14 2011-09-08 处理装置
JP2012533849A JPWO2012035722A1 (ja) 2010-09-14 2011-09-08 処理装置

Applications Claiming Priority (4)

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JP2010-205528 2010-09-14
JP2010205527 2010-09-14
JP2010-205527 2010-09-14
JP2010205528 2010-09-14

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WO2012035722A1 true WO2012035722A1 (fr) 2012-03-22

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JP (1) JPWO2012035722A1 (fr)
KR (1) KR20130099816A (fr)
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TW (1) TWI577955B (fr)
WO (1) WO2012035722A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076211A (ja) * 1996-09-03 1998-03-24 Dainippon Screen Mfg Co Ltd 減圧乾燥装置
JP2000150333A (ja) * 1998-11-18 2000-05-30 Tokyo Electron Ltd 基板熱処理装置
JP2006061755A (ja) * 2004-08-24 2006-03-09 Ishii Hyoki Corp 塗布膜用乾燥炉
JP2010149953A (ja) * 2008-12-24 2010-07-08 Furukawa Co Ltd 部材処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003066486A1 (fr) * 2002-02-04 2003-08-14 Sumitomo Precision Products Co., Ltd Dispositif de traitement de substrat de type transfert
WO2008029943A1 (fr) * 2006-09-08 2008-03-13 Semiconductor & Display Corporation Mécanisme de lamelles élévatrices
JP5022855B2 (ja) * 2007-10-05 2012-09-12 古河機械金属株式会社 リフトピン機構、加熱処理装置、減圧乾燥装置
JP2009168860A (ja) * 2008-01-10 2009-07-30 Olympus Corp 基板用ステージ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076211A (ja) * 1996-09-03 1998-03-24 Dainippon Screen Mfg Co Ltd 減圧乾燥装置
JP2000150333A (ja) * 1998-11-18 2000-05-30 Tokyo Electron Ltd 基板熱処理装置
JP2006061755A (ja) * 2004-08-24 2006-03-09 Ishii Hyoki Corp 塗布膜用乾燥炉
JP2010149953A (ja) * 2008-12-24 2010-07-08 Furukawa Co Ltd 部材処理装置

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JPWO2012035722A1 (ja) 2014-01-20
TW201221883A (en) 2012-06-01
CN103052577A (zh) 2013-04-17
CN103052577B (zh) 2015-04-01
KR20130099816A (ko) 2013-09-06
TWI577955B (zh) 2017-04-11

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