WO2012035722A1 - Processing device - Google Patents

Processing device Download PDF

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Publication number
WO2012035722A1
WO2012035722A1 PCT/JP2011/005038 JP2011005038W WO2012035722A1 WO 2012035722 A1 WO2012035722 A1 WO 2012035722A1 JP 2011005038 W JP2011005038 W JP 2011005038W WO 2012035722 A1 WO2012035722 A1 WO 2012035722A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
processing
processing apparatus
processing target
target member
Prior art date
Application number
PCT/JP2011/005038
Other languages
French (fr)
Japanese (ja)
Inventor
一登 三田
Original Assignee
古河機械金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河機械金属株式会社 filed Critical 古河機械金属株式会社
Priority to KR1020127034245A priority Critical patent/KR20130099816A/en
Priority to CN201180037946.XA priority patent/CN103052577B/en
Priority to JP2012533849A priority patent/JPWO2012035722A1/en
Publication of WO2012035722A1 publication Critical patent/WO2012035722A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • This invention relates to the processing apparatus which performs a predetermined process with respect to a flat member.
  • the present applicant has proposed a member processing apparatus that can uniformly perform a heat treatment or the like on a target member.
  • the target member is advanced from the standby position to the processing position with the fork, and the fork is moved relative to the lower side of the plurality of support wires to process the target member with a plurality of support wires arranged in parallel. Support in position.
  • a flat processing target member is horizontally supported at a plurality of points by a movable pin and a stationary pin of a lift pin mechanism.
  • the present invention has been made in view of the above-described problems, and provides a processing apparatus capable of uniformly executing a predetermined process such as heat treatment or reduced-pressure drying on a processing target member.
  • a processing apparatus that performs processing by arranging a flat plate-like member at a processing position, and the flat plate-like member is disposed across the flat plate-like member when viewed from above.
  • the first wire portion and the second wire portion supported from the lower side, and the first wire portion is moved relative to the second wire portion in the up-down direction, so that the first in the up-down direction
  • a processing unit for processing the flat plate member supported by the first wire member or the second wire member.
  • the processing apparatus includes a drive unit that moves the first wire member relative to the second wire member in the vertical direction, and the first wire member as the second wire. And a displacement mechanism that moves relative to the part in the horizontal direction. Therefore, for example, after the flat wire member to be processed is supported by the first wire member, the first wire member is moved downward relative to the second wire member, and the second wire member is moved. A flat member can be supported on the portion. Thereby, it is prevented that the same location of a flat member is supported by a wire part. Furthermore, while the flat wire member is supported by the second wire rod portion, the first wire rod portion can be moved in the horizontal direction relative to the second wire rod portion.
  • a flat member can be supported by the 1st wire part.
  • the member is supported by the first wire rod part before and after the step of supporting the member by the second wire rod part, but the first wire before and after the step of supporting the member by the second wire rod part.
  • the place which a wire part supports will differ. This also prevents the flat member from being supported by the wire portion at the same location.
  • the first wire portion is moved in the horizontal direction relative to the second wire portion while the plate member is supported by the second wire portion.
  • the present invention is not limited to this, and the second wire portion may be relatively moved in the horizontal direction while the plate member is supported by the first wire portion.
  • the first wire portion when the first wire portion is composed of a plurality of wires, at least a part of the wire is driven relatively up and down with respect to the wire constituting the second wire portion,
  • the positional relationship in the vertical direction between the position of the wire constituting the first wire part and the position of the wire constituting the second wire part may be switched.
  • moving the first wire rod portion relative to the second wire rod portion in the vertical direction may move the first wire rod portion in the vertical direction. You may move to an up-down direction, Furthermore, you may move both a 1st wire rod part and a 2nd wire rod part to an up-down direction.
  • a plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like.
  • the front / rear, left / right, and up / down directions are defined, but these are defined for convenience in order to briefly explain the relative relationship of the components of the present invention.
  • the direction at the time of manufacture and use is not limited.
  • front / rear / left / right / up / down directions do not need to be completely geometrically orthogonal, but may be relatively front / rear / left / right / up / down directions.
  • each direction is inclined in an arbitrary direction. You may do it.
  • relative movement in the vertical direction referred to in the present invention means movement to a different position in the vertical direction as a result of displacement, and the direction of displacement itself must be strictly vertical on the surface. There is no.
  • the processing apparatus of the present invention it is possible to uniformly execute a predetermined process such as a heating process or a vacuum drying process on a member to be processed.
  • front and rear and left and right directions are also defined in addition to the up and down direction.
  • the front-rear and left-right directions are directions along the horizontal direction, and the front-rear direction and the left-right direction are orthogonal to each other.
  • the processing apparatus 100 is a so-called pre-baking apparatus.
  • a flat processing target member GB which is a substrate such as a glass substrate or a printed wiring board used for a liquid crystal panel, is disposed at a processing position BP, and a heating process that is a predetermined process is performed.
  • This processing apparatus 100 performs processing by arranging a flat member (processing target member GB) at a processing position BP (see FIG. 5). As shown in FIGS. 1 and 2, the processing apparatus 100 is arranged such that the processing target member GB extends over the top view, and the first wire portion 112 that supports the processing target member GB from below. And a second wire rod part 122, a drive part (vertical mechanism) 113 for moving the first wire rod part 112 relative to the second wire rod part 122 in the vertical direction, and the first wire rod part 112. Is supported by a displacement mechanism (displacement mechanism portions 132, 134) that moves relative to the second wire rod portion 122 in the horizontal direction, and the first wire rod portion 112 or the second wire rod portion 122. And a processing unit 130 that performs processing on the processing target member GB.
  • the first wire portion 112 has a plurality of (four in this embodiment) first wire 112A.
  • the plurality of first wire rods 112 ⁇ / b> A are arranged in parallel to each other and extend in the front-rear direction.
  • Each first wire 112 ⁇ / b> A is stretched around the upper end of a pair of opposed first shafts (processed upper and lower shafts) 111.
  • the pair of first shafts 111 arranged to face each other is provided on a pair of support bases 117 (first unit portions) arranged to face each other.
  • Each support base 117 is provided with a plurality of shafts 111 so as to protrude from each support base 117.
  • the first unit 111 is constituted by the first shaft 111 and the pair of support bases 117.
  • the plurality of shafts 111 provided on each support base 117 are arranged in parallel in the left-right direction.
  • a plurality of first units 110 are spaced apart in the left-right direction.
  • the first wire rods 112A are arranged in parallel to each other.
  • the first wire 112A is made of, for example, a wire having a heat resistance of 200 ° C. or higher, such as a meta-aramid fiber or a polyimide fiber, or a metal core wire passed through a fluororesin tube, or the above-described artificial fiber or metal core wire. It consists of a wire coated with a fluororesin.
  • the first wire 112A is made of a wire having a sufficiently small cross-sectional area perpendicular to the longitudinal direction, and has a sufficiently smaller heat capacity than the processing target member GB in terms of physical properties.
  • the 2nd wire which comprises the 2nd wire part 122 mentioned later may also be comprised with the wire of the material similar to 1st wire 112A, and the 2nd wire is a material different from 112A of 1st wires. For example, you may be comprised with the wire of the material whose heat capacity is larger than 112 A of 1st wire.
  • the drive part 113 shown in FIG. 4 is for driving the 1st wire rod part 112 to an up-down direction.
  • the drive unit 113 includes an eccentric cam 115 connected to each first shaft 111, a drive shaft 114 for driving the eccentric cam 115, and a drive motor for driving the drive shaft 114. 116 (see FIGS. 1 and 2).
  • One drive shaft 114 is communicated with a plurality of support bases 117 arranged in the left-right direction, and is connected to one drive motor 116.
  • a plurality of, for example, four eccentric cams 115 are accommodated inside the support base 117, and the first shaft 111 is fixed to each of the eccentric cams 115.
  • the first shaft 111 is provided on the support base 117 so as to be displaceable in the vertical direction.
  • the plurality of first shafts 111 that respectively support one end portions of the plurality of first wire members 112 ⁇ / b> A of the plurality of first units 110 are fixed to the same drive shaft 114 via the eccentric cams 115.
  • the plurality of first shafts 111 that respectively support the other ends of the plurality of first wires 112A of the plurality of first units 110 are fixed to the other same drive shafts 114 via eccentric cams 115, respectively.
  • the drive unit 113 selectively raises or lowers the plurality of pairs of first shafts 111 in pairs in each first unit 110.
  • the processing target member GB is partitioned into a plurality of regions HS and regions DS.
  • the region HS is a portion (processing target region) that is used after the heat treatment
  • the region DS is a portion that is not used after the heat treatment.
  • the regions HS are arranged at predetermined intervals in the horizontal direction, specifically, the front-rear direction and the left-right direction
  • the region DS is a region DS.
  • the plurality of first wire rods 112A are arranged at positions that support the plurality of regions HS.
  • the 2nd wire which comprises the 2nd wire part 122 is in the position which mainly supports the area
  • the processing apparatus 100 includes a second wire portion 122.
  • the second wire rod portion 122 is constituted by one second wire rod.
  • the end portion of the second wire rod is fixed to the pair of second shafts 121 and is spanned between the pair of second shafts 121.
  • the pair of second shafts 121 are provided on support tables 127 arranged to face each other.
  • Each support base 127 is provided with one second shaft 121 so as to protrude from the support base 127.
  • the second shaft 121 is supported by a support base (second unit portion) 127 so as to be displaceable in the vertical direction.
  • the second unit 120 includes the second wire, the pair of second shafts 121 on which the second wire is bridged, and the pair of support bases 127.
  • a plurality of second units 120 are spaced apart in the left-right direction at positions corresponding to the region DS.
  • the second wire rods of the plurality of second units 120 are arranged in parallel to each other.
  • the second units 120 and the first units 110 are alternately arranged along the left-right direction.
  • the first wire 112A and the second wire are parallel to each other.
  • the processing apparatus 100 has a drive unit (not shown) for driving the second wire in the vertical direction.
  • it has a drive mechanism such as a solenoid for vertically driving a pair of second shafts 121 that are arranged opposite to each other and over which one second wire is bridged.
  • the drive mechanism such as a solenoid and the drive unit 113 constitute a drive unit that relatively moves the first wire member 112 and the second wire member 112 in the vertical direction.
  • the processing apparatus 100 includes a first base 131 on which a plurality of first units 110 are mounted and is slidable in the left-right direction, and the first base 131. And a displacement mechanism section 132 having a motor (moving means) 132A that displaces the lens in the left-right direction.
  • the displacement mechanism portion 132 is for moving the first wire portion 112 relative to the second wire portion 122 in the horizontal direction (in this embodiment, the left-right direction).
  • the displacement mechanism unit 132 includes a pulse motor 132A, a feed screw 132B that is rotated by the pulse motor 132A, and a first base 131 that linearly moves in the left-right direction as the feed screw 132B rotates.
  • the first base 131 is a flat rectangular plate-shaped member, and a plurality of first units 110 are mounted on the first base 131.
  • Support bases 117 are spaced apart along a pair of opposing sides of the first base 131.
  • the first base 131 moves on a rail (not shown).
  • tires or rollers that are rolling elements may be provided on the first base 131 so as to roll on the rail. Further, the first base 131 may move on the rail while being floated on the rail by air.
  • the displacement mechanism part 132 moves the 1st wire rod part 112 to a horizontal direction, the 1st wire rod part 112 will mainly move within the area
  • the processing apparatus 100 of the present embodiment includes a displacement mechanism unit 134.
  • the displacement mechanism unit 134 includes a second base 133 on which the second unit 120 is mounted and is slidable in the left-right direction, And a motor 134A for displacing the two bases 133 in the left-right direction.
  • the displacement mechanism part 134 is for moving the second wire part 122 relative to the first wire part 112 in the horizontal direction (in this embodiment, the left-right direction).
  • the displacement mechanism unit 134 includes a pulse motor 134A, a feed screw 134B that is rotated by the pulse motor 134A, and a second base 133 that linearly moves in the left-right direction by the rotation of the feed screw 134B.
  • the second base 133 is a flat rectangular plate member, and a plurality of second units 120 are mounted on the second base 133.
  • Support tables 127 are spaced apart along a pair of opposing sides of the second base 133.
  • the second base 133 moves on a rail (not shown).
  • a tire or a roller that is a rolling element may be provided on the second base 133 so as to roll on the rail.
  • the second base 133 may move on the rail while being floated on the rail by air. By doing in this way, generation
  • the displacement mechanism part 134 moves the 2nd wire rod part 122 to a horizontal direction, the 2nd wire rod part 122 will move within the area
  • the processing apparatus 100 includes at least a pair of claws 141 having a shape passing through the gaps between the plurality of first wire members 112 that are stretched. It also has a fork 140 that supports the member GB substantially horizontally, and a forward / backward movement mechanism (not shown) that moves the fork 140 back and forth between the standby position WP and the processing position BP.
  • the fork 140 is relatively moved above and below the second wire rods of the plurality of second wire rod portions 122 at least at the processing position BP. More specifically, as shown in FIG. 5 (c), the drive unit raises the second wire rod of the second wire rod portion 122 arranged at the initial position below the fork 140 to process the processing position BP.
  • the target member GB is received from the fork 140.
  • the second wire rod of the second wire rod portion 122 is raised, the fork 140 carried above is lowered, and the processing target member GB is supported by the second wire rod of the second wire rod portion 122. It is good (not shown).
  • the processing apparatus 100 of the present embodiment further includes a panel heater 130 that performs a heating process as a predetermined process on the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A.
  • This panel heater (member processing mechanism) 130 is formed in a flat plate shape (planar rectangular shape) equivalent to the processing target member GB, and as shown in FIG. Two units 120 and four pairs of first units 110 are arranged in the left-right direction.
  • the panel heater 130 heat-treats the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A, for example, from 80 to 150 ° C. from below.
  • the panel heater 130 is provided above the base 131 but is separated from the base 131.
  • the panel heater 130 is fixed without moving as the base 131 moves.
  • the processing apparatus 100 carries the heating process by bringing the flat processing target member GB into the processing position BP from the rear standby position WP as described above. This will be described with reference to FIGS.
  • FIG. 5 is a view of the processing apparatus 100 of FIG. 1 as viewed orthogonally to the left-right direction
  • FIG. 6 is a view of the processing apparatus 100 of FIG.
  • the processing apparatus 100 is configured so that all the first wire rods 112A and the second wire rod portions constituting the first wire rod portion 112 are in the initial state. 122 is descending. Then, the processing target member GB is supported substantially horizontally by the fork 140 positioned at the standby position WP above the wire rod.
  • the fork 140 is advanced from the standby position WP to the processing position BP by the fork moving mechanism. At this time, the fork 140 is located above all the first wire rods 112 ⁇ / b> A and the second wire rod portions 122 constituting the first wire rod portion 112.
  • each first unit 110 the first wire 112A located at a common position, for example, arranged first from the right rises.
  • the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire portion 112A is raised to the height of the second wire portion 112 that supports the processing target member GB, and then the second wire portion 122 is lowered. The same applies to the subsequent steps, and it is preferable that the height position of the processing target member GB does not change when the processing target member GB is delivered between the second wire portion 122 and the first wire rod 112A.
  • the processing target member GB is heated by the panel heater 130.
  • the first wire 112A that supports the processing target member GB in the region HS rises one by one in order, and three of them fall.
  • the processing target member GB is not continuously supported by the single first wire 112A. More specifically, as shown in FIGS. 6B and 6C, in each first unit 110, the first target wire 112 ⁇ / b> A among the plurality of first wires 112 ⁇ / b> A is used to process the member GB to be processed. To support.
  • the first first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB.
  • the second first wire rod 112A supporting the processing target member GB is lowered and does not support the processing target member GB.
  • the pair of first shafts 111 over which the fourth first wire rod 112A that does not support the processing target member GB is lifted rises, and the processing target member GB is supported by the raised first wire rod 112A.
  • the third first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB (processing S2).
  • the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one.
  • the first wire rods 112A in common positions are raised and lowered in synchronization.
  • the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire 112A is lowered after the other first wire 112A is raised to the height of the first wire 112A that supports the processing target member GB.
  • the second wire rod portion 122 is lowered. Then, in a state where the second wire portion 122 does not support the processing target member GB, as shown in FIG. 6C, all the second wire portions 122 are slid in the left-right direction by the displacement mechanism portion 134. In the processing apparatus 100 of the present embodiment, the second wire portion 122 periodically rises to support the processing target member GB, but when the second wire portion 122 rises to support the processing target member GB. The processing target member GB is supported at a position different from the previous time (before sliding) (see FIG. 6D).
  • each first unit 110 after the first first wire rod 112A to the fourth first wire rod 112A support the processing target member GB in order, the second wire rod portion 122 rises (processing S3). ). Thereafter, the fourth first wire rod 112A is lowered. Thereby, the processing target member GB is supported by the second wire portion 122. Thereafter, as shown in FIG. 6D, all the first wire rods 112 are slid in the left-right direction by the displacement mechanism 132. Next, as shown in FIG. 6E, the first first wire 112A is raised and the second wire 122 is lowered and before the first first wire 112A slides. The processing target member GB is supported at different positions.
  • the first wire rod 112A supports the processing target member GB within the region HS of the processing target member GB. Then, similarly to the process S2, the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one to deliver the processing target member GB between the first wire rods 112A (processing S4). ).
  • the second wire rod part 122 moves down and the second wire rod part 122 does not support the processing target member GB, all the second wire rods are moved by the displacement mechanism part 134 as shown in FIG.
  • the part 122 is slid in the left-right direction (processing S5).
  • the processing target member GB is supported at a position different from the previous time (before sliding).
  • the processes S1 to S5 are repeated.
  • the second wire portion 122 may support the processing target member GB within the region HS of the processing target member GB by sliding.
  • the processing target member GB subjected to the heating process is carried out to the standby position WP by executing the operations of FIGS. 5 (a) to 5 (d) in reverse. Is done.
  • the effect of this embodiment will be described.
  • the first wire rod 112A is lowered and the second wire rod portion 122 is raised.
  • the base 131 is slid.
  • the position of the first wire 112A is shifted before and after the step in which the second wire portion 112 supports the processing target member GB by lowering the second wire portion 122 and raising the first wire 112A.
  • Can do Thereby, it is prevented that the same position of the process target member GB is supported by the first wire rod 112A, and the heat treatment can be performed uniformly on the process target member GB.
  • the base 133 can be slid to displace the position of the second wire rod portion 122 in the left-right direction. Can be performed uniformly on the processing target member GB.
  • the plurality of first wire rods 112A are raised one by one in order and lowered in order. Thereby, it is prevented that the process target member GB is continuously supported by one first wire rod 112A. For this reason, heat processing can be uniformly performed to the process target member GB.
  • each first unit 110 is provided with a plurality of first wire rods 112A, and the processing target member GB can be delivered between the first wire rods 112A. It is not necessary to frequently deliver the processing target member GB between the portion 112 and the second wire portion 122.
  • each first unit has only one first wire rod
  • the first wire rod portion and the second wire rod portion are frequently used in order to prevent the processing target member GB from being supported at the same place.
  • the handling of the processing apparatus will deteriorate.
  • a plurality of first wire rods 112A are provided in each first unit 110, and the second member with a margin is provided while the processing target member GB is being transferred between the first wire rods 112A.
  • the wire portion 122 can be slid in the left-right direction, and the first wire portion 112 and the second wire portion 122 do not need to be frequently slid, so that an apparatus with excellent handleability can be obtained.
  • the processing target member GB carried into the processing position BP can be supported by the second wire portion 122 in the region DS that is not used after the heat treatment, the second member to the region HS that is used after the heat treatment can be supported. The influence of the support of the wire portion 122 can be minimized.
  • the first wire 112A has a sufficiently small cross-sectional area and heat capacity as described above, heat conduction is also reduced. For this reason, the deviation of the temperature distribution of the process target member GB heat-processed by the panel heater 130 can be suppressed, and the process target member GB can be heat-processed uniformly.
  • the four first shafts 111 are similarly moved up and down by the plurality of first units 110 by the single drive motor 116, so that the structure is simple and the first wire rod 112A.
  • the vertical movement is surely synchronized.
  • the wire part which is not supporting the process target member GB among the 1st wire part 112 and the 2nd wire part 122 is moved to the horizontal direction. Therefore, the processing target member GB is prevented from moving with the horizontal movement of the wire portion, and the processing target member GB can remain at the same position during the heat treatment.
  • the processing target member The height position of GB does not change. Therefore, it is possible to prevent the convection from being generated around the movement of the processing target member GB and change the temperature distribution of the processing target member GB, and to efficiently heat the processing target member GB.
  • the first unit 110 and the second unit 120 are alternately arranged along the left-right direction. Thereby, the process target member GB can be stably supported.
  • the first unit 110 is mounted on the first base 131 and the second unit 120 is mounted on the second base 133.
  • the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 is adjusted by moving the 1st base 131 and the 2nd base 133 linearly. Since the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by sliding the bases 131 and 133, the position adjustment of the 1st wire part 112 and the 2nd wire part 122 is possible. Easy. Moreover, the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by moving the bases 131 and 133 along a horizontal direction, and the sliding amount can also be set easily easily. it can.
  • the present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention.
  • the processing target member GB does not slide in the horizontal direction during the heat treatment, but this may slide.
  • the base 131 may be moved in the horizontal direction while the first wire rod 112A supports the processing target member GB.
  • these units can have various layouts corresponding to the classification of the processing target member GB.
  • the plurality of second units 120 and the plurality of first units 110 are arranged so as to correspond to the divisions of the plurality of types of processing target members GB, and the plurality of second units 120 and the plurality of first units are arranged. 110 can be selectively operated to cope with a plurality of types of processing target members GB (not shown).
  • the plurality of second units 120 and the plurality of first units 110 are arranged so as to be movable in the left-right direction, and the positions of the plurality of second units 120 and the plurality of first units 110 are changed.
  • a plurality of types of processing target members GB can also be handled (not shown).
  • the first wire 112 ⁇ / b> A has a sufficiently small cross-sectional area and heat capacity to reduce heat conduction and suppress temperature deviation of the processing target member GB to be heat-treated by the panel heater 130. did.
  • the cross-sectional area and the heat capacity of the first wire rod 112A are appropriately determined on the condition of the allowable temperature distribution deviation of the processing target member GB, the strength and durability for supporting the processing target member GB, and the like. .
  • the drive unit 113 is composed of the eccentric cam 115 supported by the common drive shaft 114, but this can also be formed by a crank mechanism.
  • the processing apparatus 100 illustrated heat-processing the process target member GB from the downward direction with the panel heater 130.
  • a processing device that heats the processing target member GB from above with the panel heater 130 or a processing device that heats the processing target member GB from above and below with a pair of panel heaters 130 is possible (both Not shown).
  • the pre-baking apparatus that heats the processing target member GB by the panel heater 130 is exemplified as the processing apparatus 100.
  • a reduced-pressure drying apparatus for drying the processing target member GB under reduced pressure can be used as a processing apparatus (not shown).
  • the processing apparatus 100 of the above embodiment may be arranged in a chamber connected to a decompression means such as a vacuum pump to constitute a decompression drying apparatus.
  • the 1st wire part 112 and the 2nd wire part 122 were moved to the horizontal direction by moving the bases 131 and 133 along a horizontal direction, but it is not restricted to this. Absent.
  • the first wire member 112 may be moved in the horizontal direction with respect to the second wire member 122 using the base 131 without providing the base 133.
  • the 1st wire part 112 was comprised with the several 1st wire 112A, it is not restricted to this, It is comprised with 1 1st wire 112A. Also good. By doing in this way, simplification of an apparatus can be achieved.
  • the first wire rod 112A is four, it is not limited to this. When there are a plurality of first wire rods 112A, for example, the number may be five or three.
  • the first wire 112A which comprises the 1st wire rod part 112 was raised and lowered in order, not only this but some 1st wire rods 112A are fixed.
  • Another part of the first wire 112A may be driven in the vertical direction. For example, after supporting the processing target member GB with a part of the first wire rod 112A, the other part of the first wire rod 112A is driven to be positioned above the part of the first wire rod 112A, The processing target member GB is supported by some of the first wires 112A. Thereafter, the other part of the first wire 112A is driven downward, and the processing target member GB is delivered to the part of the first wire 112A.

Abstract

This processing device (100) is provided with: a first wire section (112) and a second wire section (122) that are disposed in a manner so that a member (GB) to be processed bridges across in a plan view, and that support the member (GB) to be processed from beneath; a driving unit (vertical mechanism) (113) that moves the first wire section (112) in the vertical direction relative to the second wire section (122); and a displacement mechanism (displacement mechanism sections (132), (134)) that moves the first wire section (112) in the horizontal direction relative to the second wire section (122).

Description

処理装置Processing equipment
　本発明は、平板状の部材に対し、所定の処理を実行する処理装置に関する。 This invention relates to the processing apparatus which performs a predetermined process with respect to a flat member.
　従来、処理装置である加熱処理装置でガラス基板などの処理対象部材を加熱処理するとき、処理対象部材をリフトピン機構の不動ピン（固定ピン）と可動ピンとで支持している(例えば、特許文献１，２参照)。特許文献１に開示されたリフトピン機構では、可動ピンと固定ピンとで交互に基板を支持している。 Conventionally, when a processing target member such as a glass substrate is heat-processed by a heat processing apparatus that is a processing apparatus, the processing target member is supported by a fixed pin and a movable pin of a lift pin mechanism (for example, Patent Document 1). , 2). In the lift pin mechanism disclosed in Patent Document 1, the substrate is alternately supported by the movable pin and the fixed pin.
　一方、特許文献２に開示されたリフトピン機構では、可動ピンが上下方向と水平方向とに移動する。上昇した可動ピンで処理対象部材を支持して水平方向に移動させ、可動ピンを下降させて不動ピンで支持させる。この動作を繰り返すことにより、可動ピンと不動ピンとが処理対象部材に接触する位置を常時変化させ、ピン接触に起因した処理対象部材の温度ムラを抑制する。
　その他、リフトピン機構を開示した文献としては、特許文献３、４がある。 On the other hand, in the lift pin mechanism disclosed in Patent Document 2, the movable pin moves in the vertical direction and the horizontal direction. The member to be processed is supported by the raised movable pin and moved in the horizontal direction, and the movable pin is lowered and supported by the stationary pin. By repeating this operation, the position where the movable pin and the non-moving pin are in contact with the processing target member is constantly changed, and the temperature unevenness of the processing target member due to the pin contact is suppressed.
Other documents disclosing the lift pin mechanism include Patent Documents 3 and 4.
　また、本出願人は加熱処理などを処理対象部材に均一に実行できる部材処理装置を提案している。その技術では、フォークで処理対象部材を待機位置から処理位置まで前進させ、フォークを複数の支持線材より下方まで相対移動させることで、並列に配置されている複数の支持線材で処理対象部材を処理位置に支持させる。 In addition, the present applicant has proposed a member processing apparatus that can uniformly perform a heat treatment or the like on a target member. In that technology, the target member is advanced from the standby position to the processing position with the fork, and the fork is moved relative to the lower side of the plurality of support wires to process the target member with a plurality of support wires arranged in parallel. Support in position.
　この状態で、フォーク移動機構により複数の支持線材より下方に位置させたフォークを処理位置から待機位置まで後退させる。このような状態で、複数の支持線材で処理位置に支持された対象部材にパネルヒータで加熱処理を実行する(特許文献５)。 In this state, the fork that is positioned below the plurality of support wires is moved backward from the processing position to the standby position by the fork moving mechanism. In such a state, the target member supported at the processing position by the plurality of support wires is subjected to a heat treatment with a panel heater (Patent Document 5).
特開平１０－７６２１１号公報JP 10-76211 A 特開２００６－０６１７５５号公報JP 2006-061755 A 特開２００９－９４１８２号公報JP 2009-94182 A 国際公開ＷＯ２００８／０２９９４３のパンフレットPamphlet of International Publication WO2008 / 029943 特開２０１０－１４９９５３号公報JP 2010-149953 A
　しかし、特許文献１～４の処理装置では、リフトピン機構の可動ピンと不動ピンにより平板状の処理対象部材を水平に複数箇所で点状に支持する。 However, in the processing apparatuses of Patent Documents 1 to 4, a flat processing target member is horizontally supported at a plurality of points by a movable pin and a stationary pin of a lift pin mechanism.
　このため、可動ピンと不動ピンによる処理対象部材の支持位置に応力および伝熱が点状に集中することになり、加熱処理や減圧乾燥などの所定処理を処理対象部材に均一に実行することが困難である。 For this reason, stress and heat transfer are concentrated in a dot shape at the support position of the processing target member by the movable pin and the non-moving pin, and it is difficult to perform predetermined processing such as heat treatment and reduced pressure drying uniformly on the processing target member. It is.
　また、特許文献５の部材処理装置では、複数の支持線材で処理対象部材を処理位置に支持するので、特許文献１～４のようにピンで支持する場合よりも、加熱処理や減圧乾燥などの所定処理を処理対象部材に均一に実行することができる。しかし、それでも支持線材で支持されている部分と支持されていない部分とで加熱処理や減圧乾燥などの所定処理に不均一が発生する。 Further, in the member processing apparatus of Patent Document 5, since the member to be processed is supported at the processing position by a plurality of support wires, heat treatment, reduced pressure drying, and the like are performed rather than the case of supporting by a pin as in Patent Documents 1 to 4. The predetermined process can be uniformly performed on the processing target member. However, non-uniformity still occurs in a predetermined process such as heat treatment or reduced-pressure drying between the part supported by the support wire and the part not supported.
　本発明は上述のような課題に鑑みてなされたものであり、加熱処理や減圧乾燥などの所定処理を処理対象部材に均一に実行することができる処理装置を提供するものである。 The present invention has been made in view of the above-described problems, and provides a processing apparatus capable of uniformly executing a predetermined process such as heat treatment or reduced-pressure drying on a processing target member.
　本発明によれば、平板状の部材を処理位置に配置して処理を実行する処理装置であって、上面視において、前記平板状の部材がまたがって配置されるとともに、前記平板状の部材を下方側から支持する第一の線材部および第二の線材部と、前記第一の線材部を前記第二の線材部に対し、上下方向に相対的に移動させて、上下方向における第一の線材部と第二の線材部との位置関係を逆転させるための駆動部と、前記第一の線材部を、前記第二の線材部に対し、水平方向に、相対的に移動させる変位機構と、前記第一の線材部または前記第二の線材部に支持された前記平板状の部材に処理を施す処理部と、を備える処理装置が提供される。 According to the present invention, a processing apparatus that performs processing by arranging a flat plate-like member at a processing position, and the flat plate-like member is disposed across the flat plate-like member when viewed from above. The first wire portion and the second wire portion supported from the lower side, and the first wire portion is moved relative to the second wire portion in the up-down direction, so that the first in the up-down direction A drive unit for reversing the positional relationship between the wire part and the second wire part, and a displacement mechanism for moving the first wire part relative to the second wire part in the horizontal direction; And a processing unit for processing the flat plate member supported by the first wire member or the second wire member.
　以上のような、本発明の処理装置は、第一の線材部を第二の線材部に対し、上下方向に、相対的に移動させる駆動部と、第一の線材部を、第二の線材部に対し、水平方向に、相対的に移動させる変位機構とを備えている。
　そのため、たとえば、第一の線材部に処理対象となる平板状の部材を支持させた後、第一の線材部を、第二の線材部よりも相対的に下方に移動させ、第二の線材部に平板状の部材を支持させることができる。これにより、平板状の部材の同一箇所を線材部で支持することが防止される。さらに、第二の線材部により、平板状の部材を支持している間に、第一の線材部を第二の線材部に対し、相対的に水平方向に移動させることができる。その後、第一の線材部を第二の線材部に対し相対的に上方に移動させれば、第一の線材部により、平板状の部材を支持することができる。第二の線材部により前記部材を支持する工程の前後で第一の線材部により前記部材が支持されることとなるが、第二の線材部により前記部材を支持する工程の前後で第一の線材部が支持する箇所が異なることとなる。これによっても、平板状の部材を同一箇所で線材部により支持することが防止される。
　なお、以上の説明では、第二の線材部により、平板状の部材を支持している間に、第一の線材部を第二の線材部に対し、相対的に水平方向に移動させるとしたが、これに限られるものではなく、第一の線材部により、平板状の部材を支持している間に、第二の線材部を相対的に水平方向に移動させてもよい。
　なお、本発明において、第一の線材部が複数本の線材で構成されている場合、少なくとも一部の線材が第二の線材部を構成する線材に対し、相対的に上下方向に駆動し、第一の線材部の構成する線材の位置と第二の線材部を構成する線材の位置との上下方向における位置関係が入れ替わればよい。
　また、前記第一の線材部を前記第二の線材部に対し、上下方向に相対的に移動させるとは、第一の線材部を上下方向に移動させてもよく、第二の線材部を上下方向に移動させてもよく、さらには、第一の線材部および第二の線材部の双方を上下方向に移動させてもよい。 As described above, the processing apparatus according to the present invention includes a drive unit that moves the first wire member relative to the second wire member in the vertical direction, and the first wire member as the second wire. And a displacement mechanism that moves relative to the part in the horizontal direction.
Therefore, for example, after the flat wire member to be processed is supported by the first wire member, the first wire member is moved downward relative to the second wire member, and the second wire member is moved. A flat member can be supported on the portion. Thereby, it is prevented that the same location of a flat member is supported by a wire part. Furthermore, while the flat wire member is supported by the second wire rod portion, the first wire rod portion can be moved in the horizontal direction relative to the second wire rod portion. Then, if a 1st wire part is moved upwards relatively with respect to a 2nd wire part, a flat member can be supported by the 1st wire part. The member is supported by the first wire rod part before and after the step of supporting the member by the second wire rod part, but the first wire before and after the step of supporting the member by the second wire rod part. The place which a wire part supports will differ. This also prevents the flat member from being supported by the wire portion at the same location.
In the above description, the first wire portion is moved in the horizontal direction relative to the second wire portion while the plate member is supported by the second wire portion. However, the present invention is not limited to this, and the second wire portion may be relatively moved in the horizontal direction while the plate member is supported by the first wire portion.
In the present invention, when the first wire portion is composed of a plurality of wires, at least a part of the wire is driven relatively up and down with respect to the wire constituting the second wire portion, The positional relationship in the vertical direction between the position of the wire constituting the first wire part and the position of the wire constituting the second wire part may be switched.
In addition, moving the first wire rod portion relative to the second wire rod portion in the vertical direction may move the first wire rod portion in the vertical direction. You may move to an up-down direction, Furthermore, you may move both a 1st wire rod part and a 2nd wire rod part to an up-down direction.
　なお、本発明の各種の構成要素は、必ずしも個々に独立した存在である必要はなく、複数の構成要素が一個の部材として形成されていること、一つの構成要素が複数の部材で形成されていること、ある構成要素が他の構成要素の一部であること、ある構成要素の一部と他の構成要素の一部とが重複していること、等でもよい。 The various components of the present invention do not necessarily have to be independent of each other. A plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like.
　さらに、以下の実施形態では、前後左右上下の方向を規定しているが、これは本発明の構成要素の相対関係を簡単に説明するために便宜的に規定したものであり、本発明を実施する場合の製造時や使用時の方向を限定するものではない。 Furthermore, in the following embodiments, the front / rear, left / right, and up / down directions are defined, but these are defined for convenience in order to briefly explain the relative relationship of the components of the present invention. The direction at the time of manufacture and use is not limited.
　また、前後左右上下の方向とは、完全に幾何学的に直交している必要はなく、相対的に前後左右上下となる方向となっていればよく、例えば、各方向が任意の方向に傾斜していてもよい。 Also, the front / rear / left / right / up / down directions do not need to be completely geometrically orthogonal, but may be relatively front / rear / left / right / up / down directions. For example, each direction is inclined in an arbitrary direction. You may do it.
　例えば、本発明で云う上下方向に相対的に移動するとは、変位の結果として上下方向に相違する位置に移動することを意味しており、変位の方向そのものが表面に厳密に上下方向である必要はない。 For example, relative movement in the vertical direction referred to in the present invention means movement to a different position in the vertical direction as a result of displacement, and the direction of displacement itself must be strictly vertical on the surface. There is no.
　本発明の処理装置によれば、加熱処理や減圧乾燥などの所定処理を処理対象となる部材に均一に実行することができる。 According to the processing apparatus of the present invention, it is possible to uniformly execute a predetermined process such as a heating process or a vacuum drying process on a member to be processed.
　上述した目的、およびその他の目的、特徴および利点は、以下に述べる好適な実施の形態、およびそれに付随する以下の図面によってさらに明らかになる。 The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.
本発明の実施の形態の処理装置の内部構造を示す模式的な斜視図である。It is a typical perspective view which shows the internal structure of the processing apparatus of embodiment of this invention. 処理装置の内部構造を示す模式的な斜視図である。It is a typical perspective view which shows the internal structure of a processing apparatus. 処理装置の内部構造を示す模式的な平面図である。It is a typical top view which shows the internal structure of a processing apparatus. 駆動部の構造を示す側面図である。It is a side view which shows the structure of a drive part. 処理装置の動作を示す模式的な工程図である。It is a typical process figure showing operation of a processing unit. 処理装置の動作を示す模式的な工程図である。It is a typical process figure showing operation of a processing unit.
　本発明の実施の第一の形態を図面を参照して以下に説明する。なお、本実施の形態では図示するように上下方向以外に前後左右の方向も規定して説明する。しかし、これは構成要素の相対関係を簡単に説明するために便宜的に規定するものである。従って、本発明を実施する製品の製造時や使用時の方向を限定するものではない。
　なお、前後左右方向は、水平方向に沿った方向であり、前後方向と、左右方向とは直交する。 A first embodiment of the present invention will be described below with reference to the drawings. In this embodiment, as shown in the drawing, the front and rear and left and right directions are also defined in addition to the up and down direction. However, this is provided for the sake of convenience in order to briefly explain the relative relationship between the components. Therefore, the direction at the time of manufacture and use of the product which implements the present invention is not limited.
The front-rear and left-right directions are directions along the horizontal direction, and the front-rear direction and the left-right direction are orthogonal to each other.
　はじめに、本実施形態の処理装置１００の概要について説明する。
　処理装置１００は、いわゆるプリベーク装置である。処理装置１００では、液晶パネルに使用するガラス基板やプリント配線基板などの基板である平板状の処理対象部材ＧＢを処理位置ＢＰに配置して所定処理である加熱処理を実行する。 First, the outline | summary of the processing apparatus 100 of this embodiment is demonstrated.
The processing apparatus 100 is a so-called pre-baking apparatus. In the processing apparatus 100, a flat processing target member GB, which is a substrate such as a glass substrate or a printed wiring board used for a liquid crystal panel, is disposed at a processing position BP, and a heating process that is a predetermined process is performed.
　この処理装置１００は、平板状の部材（処理対象部材ＧＢ）を処理位置ＢＰ（図５参照）に配置して処理を実行するものである。この処理装置１００は、図１および図２に示すように、上面視において、処理対象部材ＧＢがまたがるようにして配置されるとともに、処理対象部材ＧＢを下方側から支持する第一の線材部１１２および第二の線材部１２２と、第一の線材部１１２を第二の線材部１２２に対し、上下方向に、相対的に移動させる駆動部（上下機構）１１３と、前記第一の線材部１１２を、前記第二の線材部１２２に対し、水平方向に、相対的に移動させる変位機構（変位機構部１３２、１３４）と、第一の線材部１１２または第二の線材部１２２に支持された処理対象部材ＧＢに処理を施す処理部１３０と、を備える。 This processing apparatus 100 performs processing by arranging a flat member (processing target member GB) at a processing position BP (see FIG. 5). As shown in FIGS. 1 and 2, the processing apparatus 100 is arranged such that the processing target member GB extends over the top view, and the first wire portion 112 that supports the processing target member GB from below. And a second wire rod part 122, a drive part (vertical mechanism) 113 for moving the first wire rod part 112 relative to the second wire rod part 122 in the vertical direction, and the first wire rod part 112. Is supported by a displacement mechanism (displacement mechanism portions 132, 134) that moves relative to the second wire rod portion 122 in the horizontal direction, and the first wire rod portion 112 or the second wire rod portion 122. And a processing unit 130 that performs processing on the processing target member GB.
　次に、本実施形態の処理装置１００について詳細に説明する。
　第一の線材部１１２は、複数本（本実施形態では４本）の第一線材１１２Ａを有する。複数本の第一線材１１２Ａは、図１，２にも示すように、互いに平行に配置され、前後方向に延在している。
　各第一線材１１２Ａは、一対の対向配置された第一シャフト（処理上下シャフト）１１１の上端に張架されている。対向配置された一対の第一シャフト１１１は、それぞれ対向配置された一対の支持台１１７（第一ユニット部）に設けられている。各支持台１１７には、各支持台１１７から突出するように、複数本のシャフト１１１が設けられている
　換言すると、複数本の第一線材１１２Ａと、第一線材１１２Ａがそれぞれ架け渡される複数対の第一シャフト１１１と、一対の支持台１１７とで第一ユニット１１０が構成されている。
　各支持台１１７に設けられた複数本のシャフト１１１は、左右方向に並んで、平行に配置されている。 Next, the processing apparatus 100 of this embodiment will be described in detail.
The first wire portion 112 has a plurality of (four in this embodiment) first wire 112A. As shown in FIGS. 1 and 2, the plurality of first wire rods 112 </ b> A are arranged in parallel to each other and extend in the front-rear direction.
Each first wire 112 </ b> A is stretched around the upper end of a pair of opposed first shafts (processed upper and lower shafts) 111. The pair of first shafts 111 arranged to face each other is provided on a pair of support bases 117 (first unit portions) arranged to face each other. Each support base 117 is provided with a plurality of shafts 111 so as to protrude from each support base 117. In other words, a plurality of pairs of first wires 112A and a plurality of pairs over which the first wires 112A are respectively bridged. The first unit 111 is constituted by the first shaft 111 and the pair of support bases 117.
The plurality of shafts 111 provided on each support base 117 are arranged in parallel in the left-right direction.
　本実施形態では、第一ユニット１１０は、複数個、左右方向に離間配置されている。処理装置１００において各第一線材１１２Ａは互いに平行に配置されている。
　第一線材１１２Ａは、例えば、２００℃以上の耐熱性がある、メタ系アラミド繊維やポリイミド繊維などの人工繊維や金属芯線をフッ素系樹脂チューブに通したワイヤや、前述した人工繊維や金属芯線を、フッ素系樹脂でコーティングを施したワイヤなどからなる。このため、第一線材１１２Ａは、長手方向と直交する断面の面積が充分に小さい線材からなり、物性的にも処理対象部材ＧＢより充分に熱容量が小さい。
　なお、後述する第二の線材部１２２を構成する第二線材も第一線材１１２Ａと同様の材料のワイヤで構成されていてもよく、また、第二線材は、第一線材１１２Ａとは異なる材料、たとえば、第一線材１１２Ａよりも熱容量が大きな材料のワイヤで構成されていてもよい。 In the present embodiment, a plurality of first units 110 are spaced apart in the left-right direction. In the processing apparatus 100, the first wire rods 112A are arranged in parallel to each other.
The first wire 112A is made of, for example, a wire having a heat resistance of 200 ° C. or higher, such as a meta-aramid fiber or a polyimide fiber, or a metal core wire passed through a fluororesin tube, or the above-described artificial fiber or metal core wire. It consists of a wire coated with a fluororesin. For this reason, the first wire 112A is made of a wire having a sufficiently small cross-sectional area perpendicular to the longitudinal direction, and has a sufficiently smaller heat capacity than the processing target member GB in terms of physical properties.
In addition, the 2nd wire which comprises the 2nd wire part 122 mentioned later may also be comprised with the wire of the material similar to 1st wire 112A, and the 2nd wire is a material different from 112A of 1st wires. For example, you may be comprised with the wire of the material whose heat capacity is larger than 112 A of 1st wire.
　図４に示す駆動部１１３は、第一線材部１１２を上下方向に駆動するためのものである。図４に示すように、駆動部１１３は、各第一シャフト１１１に接続された偏心カム１１５と、この偏心カム１１５を駆動するための駆動軸１１４と、駆動軸１１４を駆動するための駆動モータ１１６（図１，２参照）とを有する。左右方向に沿って配列されている複数の支持台１１７には、１本の駆動軸１１４が連通されており、一個の駆動モータ１１６に連結されている。また、支持台１１７の内部には、複数、たとえば、４つの偏心カム１１５が収納され、偏心カム１１５それぞれには、第一シャフト１１１が固定されている。従って、第一シャフト１１１は、上下方向に変位自在に支持台１１７に設けられることとなる。
　換言すると、複数の第一ユニット１１０の複数の第一線材１１２Ａの一方の端部をそれぞれ支持する複数の第一シャフト１１１は、それぞれ偏心カム１１５を介して同一の駆動軸１１４に固定される。また、複数の第一ユニット１１０の複数の第一線材１１２Ａの他方の端部をそれぞれ支持する複数の第一シャフト１１１は、それぞれ偏心カム１１５を介して他の同一の前記駆動軸１１４に固定される。
　駆動部１１３は、各第一ユニット１１０において、複数対の第一シャフト１１１を一対ずつ選択的に上昇または下降させる。 The drive part 113 shown in FIG. 4 is for driving the 1st wire rod part 112 to an up-down direction. As shown in FIG. 4, the drive unit 113 includes an eccentric cam 115 connected to each first shaft 111, a drive shaft 114 for driving the eccentric cam 115, and a drive motor for driving the drive shaft 114. 116 (see FIGS. 1 and 2). One drive shaft 114 is communicated with a plurality of support bases 117 arranged in the left-right direction, and is connected to one drive motor 116. A plurality of, for example, four eccentric cams 115 are accommodated inside the support base 117, and the first shaft 111 is fixed to each of the eccentric cams 115. Therefore, the first shaft 111 is provided on the support base 117 so as to be displaceable in the vertical direction.
In other words, the plurality of first shafts 111 that respectively support one end portions of the plurality of first wire members 112 </ b> A of the plurality of first units 110 are fixed to the same drive shaft 114 via the eccentric cams 115. The plurality of first shafts 111 that respectively support the other ends of the plurality of first wires 112A of the plurality of first units 110 are fixed to the other same drive shafts 114 via eccentric cams 115, respectively. The
The drive unit 113 selectively raises or lowers the plurality of pairs of first shafts 111 in pairs in each first unit 110.
　さらに、本実施の形態では、図３に示すように、処理対象部材ＧＢは、複数の領域ＨＳと、領域ＤＳとに区画されている。領域ＨＳは、熱処理後、利用される部分（処理対象領域）であり、領域ＤＳは、熱処理後、利用されない部分である。領域ＨＳは、水平方向、具体的には、前後方向および左右方向に所定の間隔をあけて配置され、領域ＨＳ間が領域ＤＳとなっている。複数の第一線材１１２Ａは複数の領域ＨＳを支持する位置に配置される。第二の線材部１２２を構成する第二線材は、主に領域ＤＳを支持する位置にあるが、領域ＨＳを支持する位置に配置されることもある。 Furthermore, in the present embodiment, as shown in FIG. 3, the processing target member GB is partitioned into a plurality of regions HS and regions DS. The region HS is a portion (processing target region) that is used after the heat treatment, and the region DS is a portion that is not used after the heat treatment. The regions HS are arranged at predetermined intervals in the horizontal direction, specifically, the front-rear direction and the left-right direction, and the region DS is a region DS. The plurality of first wire rods 112A are arranged at positions that support the plurality of regions HS. Although the 2nd wire which comprises the 2nd wire part 122 is in the position which mainly supports the area | region DS, it may be arrange | positioned in the position which supports the area | region HS.
　さらに、本実施形態の処理装置１００は、第二の線材部１２２を有する。第二の線材部１２２は、本実施形態では、１本の第二線材で構成される。
　そして、第二線材は、その端部が一対の第二シャフト１２１に固定され、一対の第二シャフト１２１間に架け渡されている。一対の第二シャフト１２１は、それぞれ対向配置された支持台１２７に設けられている。各支持台１２７には、支持台１２７から突出するように、１本の第二シャフト１２１が設けられている。第二シャフト１２１は、上下方向に変位自在に支持台（第二ユニット部）１２７に支持されている。
　換言すると、第二線材と、第二線材が架け渡される一対の第二シャフト１２１と、一対の支持台１２７とで第二ユニット１２０が構成されている。
　本実施形態では、第二ユニット１２０は、領域ＤＳに対応した位置で複数個、左右方向に離間配置されている。複数の第二ユニット１２０の第二線材は互いに平行に配置されている。 Furthermore, the processing apparatus 100 according to the present embodiment includes a second wire portion 122. In the present embodiment, the second wire rod portion 122 is constituted by one second wire rod.
The end portion of the second wire rod is fixed to the pair of second shafts 121 and is spanned between the pair of second shafts 121. The pair of second shafts 121 are provided on support tables 127 arranged to face each other. Each support base 127 is provided with one second shaft 121 so as to protrude from the support base 127. The second shaft 121 is supported by a support base (second unit portion) 127 so as to be displaceable in the vertical direction.
In other words, the second unit 120 includes the second wire, the pair of second shafts 121 on which the second wire is bridged, and the pair of support bases 127.
In the present embodiment, a plurality of second units 120 are spaced apart in the left-right direction at positions corresponding to the region DS. The second wire rods of the plurality of second units 120 are arranged in parallel to each other.
　また、本実施形態では、第二ユニット１２０と、第一ユニット１１０とは左右方向に沿って交互に配置されている。そして、第一線材１１２Ａと、第二線材とは互いに平行になっている。
　さらに、処理装置１００は、第二線材を上下方向に駆動するための駆動部(図示せず)を有している。具体的には、対向配置され、１本の第二線材が架け渡される一対の第二シャフト１２１を上下に駆動するソレノイド等の駆動機構を有している。このソレノイド等の駆動機構と、駆動部１１３とで、第一の線材部１１２と第二の線材部１１２とを相対的に上下方向に移動させる駆動部が構成されることとなる。 In the present embodiment, the second units 120 and the first units 110 are alternately arranged along the left-right direction. The first wire 112A and the second wire are parallel to each other.
Furthermore, the processing apparatus 100 has a drive unit (not shown) for driving the second wire in the vertical direction. Specifically, it has a drive mechanism such as a solenoid for vertically driving a pair of second shafts 121 that are arranged opposite to each other and over which one second wire is bridged. The drive mechanism such as a solenoid and the drive unit 113 constitute a drive unit that relatively moves the first wire member 112 and the second wire member 112 in the vertical direction.
　さらに、本実施形態の処理装置１００は、図１および図２に示すように、複数の第一ユニット１１０が搭載されていて左右方向にスライド自在な一個の第一ベース１３１と、第一ベース１３１を左右方向に変位させるモータ（移動手段）１３２Ａと、を有する変位機構部１３２を有する。
　変位機構部１３２は、第一の線材部１１２を第二の線材部１２２に対し、相対的に水平方向（本実施形態では、左右方向）に移動させるためのものである。たとえば、変位機構部１３２は、パルスモータ１３２Ａと、パルスモータ１３２Ａにより、回転される送りネジ１３２Ｂと、送りネジ１３２Ｂの回転により、左右方向に直線移動する第一ベース１３１とを備える。
　第一ベース１３１は、平面矩形形状の平板状の部材であり、この第一ベース１３１上に複数の第一ユニット１１０が搭載されている。第一ベース１３１の対向する一対の辺にそって支持台１１７が離間配置される。なお、第一ベース１３１は図示しないレール上を移動する。たとえば、第一ベース１３１に転動体であるタイヤやローラを設け、レール上を転がり移動するものとしてもよい。また、第一ベース１３１はエアにより、レール上に浮上させた状態で、レール上を移動してもよい。このようにすることで、第一ベース１３１を移動させることによるパーティクルの発生を抑制できる。
　変位機構部１３２は、第一の線材部１１２を水平方向に移動させるが、第一の線材部１１２は、処理対象部材ＧＢの下方の領域内で主に移動することとなる。ただし、熱処理中において、第一の線材部１１２が処理対象部材ＧＢからはみ出すように、水平方向に移動してもよい。 Furthermore, as shown in FIGS. 1 and 2, the processing apparatus 100 according to the present embodiment includes a first base 131 on which a plurality of first units 110 are mounted and is slidable in the left-right direction, and the first base 131. And a displacement mechanism section 132 having a motor (moving means) 132A that displaces the lens in the left-right direction.
The displacement mechanism portion 132 is for moving the first wire portion 112 relative to the second wire portion 122 in the horizontal direction (in this embodiment, the left-right direction). For example, the displacement mechanism unit 132 includes a pulse motor 132A, a feed screw 132B that is rotated by the pulse motor 132A, and a first base 131 that linearly moves in the left-right direction as the feed screw 132B rotates.
The first base 131 is a flat rectangular plate-shaped member, and a plurality of first units 110 are mounted on the first base 131. Support bases 117 are spaced apart along a pair of opposing sides of the first base 131. The first base 131 moves on a rail (not shown). For example, tires or rollers that are rolling elements may be provided on the first base 131 so as to roll on the rail. Further, the first base 131 may move on the rail while being floated on the rail by air. By doing in this way, generation | occurrence | production of the particle by moving the 1st base 131 can be suppressed.
Although the displacement mechanism part 132 moves the 1st wire rod part 112 to a horizontal direction, the 1st wire rod part 112 will mainly move within the area | region under the process target member GB. However, during the heat treatment, the first wire portion 112 may move in the horizontal direction so as to protrude from the processing target member GB.
　また、本実施の形態の処理装置１００は、変位機構部１３４を有し、変位機構部１３４は、第二ユニット１２０が搭載されていて左右方向にスライド自在な一個の第二ベース１３３と、第二ベース１３３を左右方向に変位させるモータ１３４Ａとを有する。
　変位機構部１３４は、第二の線材部１２２を第一の線材部１１２に対し、相対的に水平方向（本実施形態では、左右方向）に移動させるためのものである。たとえば、変位機構部１３４は、パルスモータ１３４Ａと、パルスモータ１３４Ａにより、回転される送りネジ１３４Ｂと、送りネジ１３４Ｂの回転により、左右方向に直線移動する第二ベース１３３とを備える。
　第二ベース１３３は、平面矩形形状の平板状の部材であり、この第二ベース１３３上に複数の第二ユニット１２０が搭載されている。第二ベース１３３の対向する一対の辺にそって支持台１２７が離間配置される。なお、第二ベース１３３は図示しないレール上を移動する。たとえば、第二ベース１３３に転動体であるタイヤやローラを設け、レール上を転がり移動するものとしてもよい。また、第二ベース１３３はエアにより、レール上に浮上させた状態で、レール上を移動してもよい。このようにすることで、第二ベース１３３を移動させることによるパーティクルの発生を抑制できる。
　変位機構部１３４は、第二の線材部１２２を水平方向に移動させるが、第二の線材部１２２は、処理対象部材ＧＢの下方の領域内で移動することとなる。すなわち、熱処理中において、第二の線材部１２２が処理対象部材ＧＢからはみ出すように、水平方向に移動することはない。 In addition, the processing apparatus 100 of the present embodiment includes a displacement mechanism unit 134. The displacement mechanism unit 134 includes a second base 133 on which the second unit 120 is mounted and is slidable in the left-right direction, And a motor 134A for displacing the two bases 133 in the left-right direction.
The displacement mechanism part 134 is for moving the second wire part 122 relative to the first wire part 112 in the horizontal direction (in this embodiment, the left-right direction). For example, the displacement mechanism unit 134 includes a pulse motor 134A, a feed screw 134B that is rotated by the pulse motor 134A, and a second base 133 that linearly moves in the left-right direction by the rotation of the feed screw 134B.
The second base 133 is a flat rectangular plate member, and a plurality of second units 120 are mounted on the second base 133. Support tables 127 are spaced apart along a pair of opposing sides of the second base 133. The second base 133 moves on a rail (not shown). For example, a tire or a roller that is a rolling element may be provided on the second base 133 so as to roll on the rail. Further, the second base 133 may move on the rail while being floated on the rail by air. By doing in this way, generation | occurrence | production of the particle by moving the 2nd base 133 can be suppressed.
Although the displacement mechanism part 134 moves the 2nd wire rod part 122 to a horizontal direction, the 2nd wire rod part 122 will move within the area | region under the process target member GB. That is, during the heat treatment, the second wire portion 122 does not move in the horizontal direction so as to protrude from the processing target member GB.
　さらに、本実施の形態の処理装置１００は、図３および図５に示すように、張架されている複数の第一の線材部１１２の間隙を通過する形状の少なくとも一対のクロー１４１で処理対象部材ＧＢを略水平に支持するフォーク１４０と、フォーク１４０を待機位置ＷＰと処理位置ＢＰとに前後移動させる前後移動機構(図示せず)と、も有する。 Furthermore, as shown in FIGS. 3 and 5, the processing apparatus 100 according to the present embodiment includes at least a pair of claws 141 having a shape passing through the gaps between the plurality of first wire members 112 that are stretched. It also has a fork 140 that supports the member GB substantially horizontally, and a forward / backward movement mechanism (not shown) that moves the fork 140 back and forth between the standby position WP and the processing position BP.
　フォーク１４０を少なくとも処理位置ＢＰで複数の第二の線材部１２２の第二線材より上方と下方とに相対移動させる。より具体的には、図５(ｃ)に示すように、駆動部はフォーク１４０より下方の初期位置に配置している第二の線材部１２２の第二線材を上昇させ、処理位置ＢＰの処理対象部材ＧＢをフォーク１４０から受け取る。 The fork 140 is relatively moved above and below the second wire rods of the plurality of second wire rod portions 122 at least at the processing position BP. More specifically, as shown in FIG. 5 (c), the drive unit raises the second wire rod of the second wire rod portion 122 arranged at the initial position below the fork 140 to process the processing position BP. The target member GB is received from the fork 140.
　ただし、第二の線材部１２２の第二線材を上昇させておき、それより上方に搬入させたフォーク１４０を下降させ、処理対象部材ＧＢを第二の線材部１２２の第二線材に支持させてもよい(図示せず)。 However, the second wire rod of the second wire rod portion 122 is raised, the fork 140 carried above is lowered, and the processing target member GB is supported by the second wire rod of the second wire rod portion 122. It is good (not shown).
　また、本実施の形態の処理装置１００は、複数の第一線材１１２Ａで処理位置ＢＰに支持された処理対象部材ＧＢに所定処理として加熱処理を実行するパネルヒータ１３０を、さらに有する。 Further, the processing apparatus 100 of the present embodiment further includes a panel heater 130 that performs a heating process as a predetermined process on the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A.
　このパネルヒータ（部材処理機構）１３０は、処理対象部材ＧＢと同等な平板状（平面矩形形状）に形成されており、図３に示すように、その前後方向の縁部に、五対の第二ユニット１２０と四対の第一ユニット１１０とが左右方向に配列されている。上述のパネルヒータ１３０は、複数の第一線材１１２Ａで処理位置ＢＰに支持された処理対象部材ＧＢを、例えば、８０～１５０℃に下方から加熱処理する。
　なお、パネルヒータ１３０は、ベース１３１の上部に設けられているが、ベース１３１からは離間している。パネルヒータ１３０はベース１３１等の移動に伴い移動することはなく、固定されたものである。 This panel heater (member processing mechanism) 130 is formed in a flat plate shape (planar rectangular shape) equivalent to the processing target member GB, and as shown in FIG. Two units 120 and four pairs of first units 110 are arranged in the left-right direction. The panel heater 130 heat-treats the processing target member GB supported at the processing position BP by the plurality of first wire rods 112A, for example, from 80 to 150 ° C. from below.
The panel heater 130 is provided above the base 131 but is separated from the base 131. The panel heater 130 is fixed without moving as the base 131 moves.
　上述のような構成において、本実施の形態の処理装置１００は、前述のように平板状の処理対象部材ＧＢを処理位置ＢＰに後方の待機位置ＷＰから搬入して加熱処理を実行する。
　図５および図６を参照して説明する。図５は、図１の処理装置１００を左右方向と直交して見た図であり、図６は、図１の処理装置１００を前後方向と直交して見た図である。 In the configuration as described above, the processing apparatus 100 according to the present embodiment carries the heating process by bringing the flat processing target member GB into the processing position BP from the rear standby position WP as described above.
This will be described with reference to FIGS. FIG. 5 is a view of the processing apparatus 100 of FIG. 1 as viewed orthogonally to the left-right direction, and FIG. 6 is a view of the processing apparatus 100 of FIG.
　より詳細には、本実施の形態の処理装置１００は、図５(ａ)に示すように、初期状態では、第一の線材部１１２を構成する全ての第一線材１１２Ａおよび第二の線材部１２２は下降している。そして、これらの線材よりも上方の待機位置ＷＰに位置するフォーク１４０により、処理対象部材ＧＢは略水平に支持されている。 More specifically, as shown in FIG. 5A, the processing apparatus 100 according to the present embodiment is configured so that all the first wire rods 112A and the second wire rod portions constituting the first wire rod portion 112 are in the initial state. 122 is descending. Then, the processing target member GB is supported substantially horizontally by the fork 140 positioned at the standby position WP above the wire rod.
　つぎに、図５(ｂ)に示すように、このフォーク１４０がフォーク移動機構により、待機位置ＷＰから処理位置ＢＰまで前進される。このとき、フォーク１４０は、第一の線材部１１２を構成する全ての第一線材１１２Ａおよび第二の線材部１２２よりも上方に位置している。 Next, as shown in FIG. 5B, the fork 140 is advanced from the standby position WP to the processing position BP by the fork moving mechanism. At this time, the fork 140 is located above all the first wire rods 112 </ b> A and the second wire rod portions 122 constituting the first wire rod portion 112.
　つぎに、図５(ｃ)、図６（ａ）に示すように、すべての第二シャフト１２１が上昇し、左右方向に沿って配列されている複数の第二の線材部１２２が上方に一様に移動する。これにより、図３に示すように、処理対象部材ＧＢが領域ＤＳの位置で、第二の線材部１２２の第二線材により支持される（処理Ｓ１）。 Next, as shown in FIG. 5C and FIG. 6A, all the second shafts 121 are raised, and a plurality of second wire portions 122 arranged along the left-right direction are moved upward. Move like. As a result, as shown in FIG. 3, the processing target member GB is supported by the second wire rod of the second wire rod portion 122 at the position of the region DS (processing S1).
　このような状態で、図５(ｃ)に示すように、フォーク１４０は処理位置ＢＰから待機位置ＷＰまで退避する。次に、図５（ｄ）および図６（ｂ）に示すように、第二シャフト１２１が下降し、これに伴い、処理対象部材ＧＢを支持している第二の線材部１２２が下降する。一方で、第一シャフト１１１が上昇し、第一線材１１２Ａが上昇することにより、処理対象部材ＧＢが、第一線材１１２Ａにより領域ＨＳの位置で支持される。
　ここでは、各第一ユニット１１０において、対向する一対のシャフト１１１が上昇し、一本の第一線材１１２Ａが上昇する。各第一ユニット１１０において、他の第一線材１１２Ａは上昇しない。また、各第一ユニット１１０において、共通の位置にある、たとえば、右から１番目に配置されている第一線材１１２Ａが上昇する。
　また、第二の線材部１２２に支持された処理対象部材ＧＢを、第一線材１１２Ａに引き渡す際、処理対象部材ＧＢの高さ位置は変動しないことが好ましい。すなわち、処理対象部材ＧＢを支持する第二の線材部１１２の高さまで第一線材部１１２Ａを上昇させた後、第二の線材部１２２を下降させることが好ましい。なお、後段の工程においても、同様であり、第二の線材部１２２および第一線材１１２Ａ間で処理対象部材ＧＢを引き渡す際には、処理対象部材ＧＢの高さ位置は変動しないことが好ましい。 In this state, as shown in FIG. 5C, the fork 140 is retracted from the processing position BP to the standby position WP. Next, as shown in FIG. 5D and FIG. 6B, the second shaft 121 is lowered, and accordingly, the second wire portion 122 supporting the processing target member GB is lowered. On the other hand, when the first shaft 111 is raised and the first wire 112A is raised, the processing target member GB is supported by the first wire 112A at the position of the region HS.
Here, in each 1st unit 110, a pair of shaft 111 which opposes raises, and the 1st 1st wire 112A raises. In each first unit 110, the other first wire 112A does not rise. Further, in each first unit 110, the first wire 112A located at a common position, for example, arranged first from the right rises.
In addition, when the processing target member GB supported by the second wire portion 122 is delivered to the first wire 112A, the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire portion 112A is raised to the height of the second wire portion 112 that supports the processing target member GB, and then the second wire portion 122 is lowered. The same applies to the subsequent steps, and it is preferable that the height position of the processing target member GB does not change when the processing target member GB is delivered between the second wire portion 122 and the first wire rod 112A.
　このような状態でパネルヒータ１３０により処理対象部材ＧＢが加熱処理される。ただし、各第一ユニット１１０において、領域ＨＳで処理対象部材ＧＢを支持する第一線材１１２Ａは、四本のうち、一本ずつ順番に上昇して三本は下降した状態となる。一本の第一線材１１２Ａで処理対象部材ＧＢが継続的に支持されることがない。
　より詳細に説明すると、図６（ｂ）、（ｃ）に示すように、各第一ユニット１１０において、複数本の第一線材１１２Ａのうち、１本目の第一線材１１２Ａにより処理対象部材ＧＢを支持する。次に、処理対象部材ＧＢを支持していない２本目の第一線材１１２Ａが架け渡された一対の第一シャフト１１１が上昇し、上昇した第一線材１１２Ａにより、処理対象部材ＧＢを支持する。一方で、処理対象部材ＧＢを支持していた１本目の第一線材１１２Ａは、下降し、処理対象部材ＧＢを支持しない状態となる。
　次に、処理対象部材ＧＢを支持していない３本目の第一線材１１２Ａが架け渡された一対の第一シャフト１１１が上昇し、上昇した第一線材１１２Ａにより、処理対象部材ＧＢを支持する。一方で、処理対象部材ＧＢを支持していた２本目の第一線材１１２Ａは、下降し、処理対象部材ＧＢを支持しない状態となる。
　次に、処理対象部材ＧＢを支持していない４本目の第一線材１１２Ａが架け渡された一対の第一シャフト１１１が上昇し、上昇した第一線材１１２Ａにより、処理対象部材ＧＢを支持する。一方で、処理対象部材ＧＢを支持していた３本目の第一線材１１２Ａは、下降し、処理対象部材ＧＢを支持しない状態となる（処理Ｓ２）。
　このように、複数本の第一線材１１２Ａを順番に、１本ずつ上昇させるとともに、１本ずつ下降させる。
　なお、各第一ユニット１１０において、共通の位置にある第一線材１１２Ａを同期させて、上昇、下降させる。
　また、一の第一線材１１２Ａ支持された処理対象部材ＧＢを、他の第一線材１１２Ａに引き渡す際、処理対象部材ＧＢの高さ位置は変動しないことが好ましい。すなわち、処理対象部材ＧＢを支持する一の第一線材１１２Ａの高さまで他の第一線材１１２Ａを上昇させた後、一の第一線材１１２Ａを下降させることが好ましい。 In this state, the processing target member GB is heated by the panel heater 130. However, in each of the first units 110, the first wire 112A that supports the processing target member GB in the region HS rises one by one in order, and three of them fall. The processing target member GB is not continuously supported by the single first wire 112A.
More specifically, as shown in FIGS. 6B and 6C, in each first unit 110, the first target wire 112 </ b> A among the plurality of first wires 112 </ b> A is used to process the member GB to be processed. To support. Next, the pair of first shafts 111 on which the second first wire rod 112A that does not support the processing target member GB is lifted and the processing target member GB is supported by the raised first wire rod 112A. On the other hand, the first first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB.
Next, the pair of first shafts 111 over which the third first wire rod 112A that does not support the processing target member GB is lifted and the processing target member GB is supported by the raised first wire rod 112A. On the other hand, the second first wire rod 112A supporting the processing target member GB is lowered and does not support the processing target member GB.
Next, the pair of first shafts 111 over which the fourth first wire rod 112A that does not support the processing target member GB is lifted rises, and the processing target member GB is supported by the raised first wire rod 112A. On the other hand, the third first wire rod 112A that has supported the processing target member GB is lowered and does not support the processing target member GB (processing S2).
As described above, the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one.
In each first unit 110, the first wire rods 112A in common positions are raised and lowered in synchronization.
In addition, when the processing target member GB supported by one first wire rod 112A is delivered to another first wire rod 112A, the height position of the processing target member GB is preferably not changed. That is, it is preferable that the first wire 112A is lowered after the other first wire 112A is raised to the height of the first wire 112A that supports the processing target member GB.
　ここで、第一の線材部１１２により、処理対象部材ＧＢを支持している間、第二の線材部１２２は下降した状態となる。そして、第二の線材部１２２が処理対象部材ＧＢを支持しない状態で、図６（ｃ）に示すように、変位機構部１３４により全部の第二の線材部１２２を左右方向にスライド移動させる。本実施の形態の処理装置１００では、定期的に第二の線材部１２２が上昇して処理対象部材ＧＢを支持するが、第二の線材部１２２が上昇して処理対象部材ＧＢを支持するときには、前回（スライドする前）と違った位置で処理対象部材ＧＢを支持することになる（図６（ｄ）参照）。
　次に、各第一ユニット１１０において、１本目の第一線材１１２Ａから４本目の第一線材１１２Ａまでが順番に処理対象部材ＧＢを支持した後、第二の線材部１２２が上昇する（処理Ｓ３）。その後、４本目の第一線材１１２Ａを下降させる。これにより、第二の線材部１２２により処理対象部材ＧＢが支持されることとなる。その後、図６（ｄ）に示すように、変位機構部１３２により全部の第一の線材部１１２を左右方向にスライド移動させる。次に、図６（ｅ）に示すように、１本目の第一線材１１２Ａを上昇させるとともに、第二の線材部１２２を下降させて、１本目の第一線材１１２Ａにより、スライドする前とは違った位置で処理対象部材ＧＢを支持する。ただし、第一線材１１２Ａは、処理対象部材ＧＢの領域ＨＳ内で処理対象部材ＧＢを支持する。そして、処理Ｓ２と同様に、複数本の第一線材１１２Ａを順番に、１本ずつ上昇させるとともに、１本ずつ下降させて、第一線材１１２Ａ間で処理対象部材ＧＢの引渡しを行なう（処理Ｓ４）。 Here, while the process target member GB is supported by the first wire rod portion 112, the second wire rod portion 122 is lowered. Then, in a state where the second wire portion 122 does not support the processing target member GB, as shown in FIG. 6C, all the second wire portions 122 are slid in the left-right direction by the displacement mechanism portion 134. In the processing apparatus 100 of the present embodiment, the second wire portion 122 periodically rises to support the processing target member GB, but when the second wire portion 122 rises to support the processing target member GB. The processing target member GB is supported at a position different from the previous time (before sliding) (see FIG. 6D).
Next, in each first unit 110, after the first first wire rod 112A to the fourth first wire rod 112A support the processing target member GB in order, the second wire rod portion 122 rises (processing S3). ). Thereafter, the fourth first wire rod 112A is lowered. Thereby, the processing target member GB is supported by the second wire portion 122. Thereafter, as shown in FIG. 6D, all the first wire rods 112 are slid in the left-right direction by the displacement mechanism 132. Next, as shown in FIG. 6E, the first first wire 112A is raised and the second wire 122 is lowered and before the first first wire 112A slides. The processing target member GB is supported at different positions. However, the first wire rod 112A supports the processing target member GB within the region HS of the processing target member GB. Then, similarly to the process S2, the plurality of first wire rods 112A are sequentially raised one by one and lowered one by one to deliver the processing target member GB between the first wire rods 112A (processing S4). ).
　第二の線材部１２２が下降し、第二の線材部１２２が処理対象部材ＧＢを支持しない状態となったら、図６（ｆ）に示すように、変位機構部１３４により全部の第二の線材部１２２を左右方向にスライド移動させる（処理Ｓ５）。次に、第二の線材部１２２が上昇して処理対象部材ＧＢを支持するときには、前回（スライドする前）と違った位置で処理対象部材ＧＢを支持することになる。以下、処理Ｓ１～処理Ｓ５の工程を繰り返す。ただし、第二の線材部１２２は、スライドすることにより、処理対象部材ＧＢの領域ＨＳ内で処理対象部材ＧＢを支持することとなる場合もある。 When the second wire rod part 122 moves down and the second wire rod part 122 does not support the processing target member GB, all the second wire rods are moved by the displacement mechanism part 134 as shown in FIG. The part 122 is slid in the left-right direction (processing S5). Next, when the second wire portion 122 is raised to support the processing target member GB, the processing target member GB is supported at a position different from the previous time (before sliding). Thereafter, the processes S1 to S5 are repeated. However, the second wire portion 122 may support the processing target member GB within the region HS of the processing target member GB by sliding.
　上述のような処理対象部材ＧＢの加熱処理が完了すると、前述の図５(ａ)～(ｄ)の動作を反対に実行することにより、加熱処理された処理対象部材ＧＢが待機位置ＷＰに搬出される。 When the heating process of the processing target member GB as described above is completed, the processing target member GB subjected to the heating process is carried out to the standby position WP by executing the operations of FIGS. 5 (a) to 5 (d) in reverse. Is done.
　次に、本実施形態の効果について説明する。
　本実施形態では、第一線材１１２Ａで処理対象部材ＧＢを支持した後、第一線材１１２Ａを下降させ、第二の線材部１２２を上昇させている。その後、ベース１３１をスライドさせている。次に、第二の線材部１２２を下降させ、第一線材１１２Ａを上昇させることで、第二の線材部１１２が処理対象部材ＧＢを支持する工程の前後における第一線材１１２Ａの位置をずらすことができる。これにより、第一線材１１２Ａで処理対象部材ＧＢの同じ位置を支持することが防止され、加熱処理を処理対象部材ＧＢに均一に実行することができる。
　さらに、第一線材１１２Ａで処理対象部材ＧＢを支持している間に、ベース１３３をスライドさせて、第二の線材部１２２の左右方向における位置を変位させることができ、これによっても、加熱処理を処理対象部材ＧＢに均一に実行することができる。 Next, the effect of this embodiment will be described.
In the present embodiment, after the processing target member GB is supported by the first wire rod 112A, the first wire rod 112A is lowered and the second wire rod portion 122 is raised. Thereafter, the base 131 is slid. Next, the position of the first wire 112A is shifted before and after the step in which the second wire portion 112 supports the processing target member GB by lowering the second wire portion 122 and raising the first wire 112A. Can do. Thereby, it is prevented that the same position of the process target member GB is supported by the first wire rod 112A, and the heat treatment can be performed uniformly on the process target member GB.
Further, while the processing target member GB is supported by the first wire rod 112A, the base 133 can be slid to displace the position of the second wire rod portion 122 in the left-right direction. Can be performed uniformly on the processing target member GB.
　本実施の形態の処理装置１００では、上述のように、複数の第一線材１１２Ａを１本ずつ順番に上昇させるとともに、順番に下降させている。これにより、一つの第一線材１１２Ａで継続的に処理対象部材ＧＢを支持することが防止されている。このため、加熱処理を処理対象部材ＧＢに均一に実行することができる。 In the processing apparatus 100 of the present embodiment, as described above, the plurality of first wire rods 112A are raised one by one in order and lowered in order. Thereby, it is prevented that the process target member GB is continuously supported by one first wire rod 112A. For this reason, heat processing can be uniformly performed to the process target member GB.
　さらに、第一線材１１２Ａ間で処理対象部材ＧＢを引き渡しているので、処理対象部材ＧＢを支持する際の応力が局所的に集中することもない。このため、処理対象部材ＧＢは応力集中による変形なども発生することなく加熱処理される。
　各第一ユニットに第一線材が１本しかない場合、処理対象部材ＧＢへの応力の負担等を考慮すると、第一の線材部および第二の線材部間での処理対象部材ＧＢの引渡しを頻繁に行なう必要がある。
　これに対し、本実施形態では、各第一ユニット１１０に複数本の第一線材１１２Ａを設けており、第一線材１１２Ａ間で処理対象部材ＧＢの引き渡しを行なうことができるので、第一の線材部１１２および第二の線材部１２２間での処理対象部材ＧＢの引渡しを頻繁に行なわなくてすむ。
　また、各第一ユニットに第一線材が１本しかない場合、処理対象部材ＧＢを同じ場所で支持してしまうことを防止するためには、第一の線材部および第二の線材部を頻繁にスライドさせる必要があり、処理装置の取り扱い性が悪くなることが懸念される。
　これに対し、本実施形態では、各第一ユニット１１０に複数本の第一線材１１２Ａを設けており、第一線材１１２Ａ間で処理対象部材ＧＢの引き渡しを行なっている間に、余裕をもって第二の線材部１２２を左右方向にスライドさせることができ、第一の線材部１１２および第二の線材部１２２を頻繁にスライドさせずにすむので、取り扱い性に優れた装置とすることができる。 Furthermore, since the processing target member GB is delivered between the first wire rods 112A, stress when supporting the processing target member GB is not locally concentrated. For this reason, the processing target member GB is heated without causing deformation due to stress concentration.
When there is only one first wire in each first unit, considering the stress burden on the processing target member GB, the delivery of the processing target member GB between the first wire portion and the second wire portion is performed. Must be done frequently.
On the other hand, in this embodiment, each first unit 110 is provided with a plurality of first wire rods 112A, and the processing target member GB can be delivered between the first wire rods 112A. It is not necessary to frequently deliver the processing target member GB between the portion 112 and the second wire portion 122.
In addition, when each first unit has only one first wire rod, the first wire rod portion and the second wire rod portion are frequently used in order to prevent the processing target member GB from being supported at the same place. There is a concern that the handling of the processing apparatus will deteriorate.
In contrast, in the present embodiment, a plurality of first wire rods 112A are provided in each first unit 110, and the second member with a margin is provided while the processing target member GB is being transferred between the first wire rods 112A. The wire portion 122 can be slid in the left-right direction, and the first wire portion 112 and the second wire portion 122 do not need to be frequently slid, so that an apparatus with excellent handleability can be obtained.
　さらに、処理位置ＢＰに搬入される処理対象部材ＧＢを、熱処理後において利用されない領域ＤＳで第二の線材部１２２により支持することができるので、熱処理後において利用される領域ＨＳへの第二の線材部１２２の支持の影響を最小限にとどめることができる。 Furthermore, since the processing target member GB carried into the processing position BP can be supported by the second wire portion 122 in the region DS that is not used after the heat treatment, the second member to the region HS that is used after the heat treatment can be supported. The influence of the support of the wire portion 122 can be minimized.
　しかも、第一線材１１２Ａは、前述のように断面積と熱容量とが充分に小さいので、熱伝導も低減されている。このため、パネルヒータ１３０により加熱処理される処理対象部材ＧＢの温度分布の偏差を抑制することができ、処理対象部材ＧＢを均一に加熱処理することができる。 Moreover, since the first wire 112A has a sufficiently small cross-sectional area and heat capacity as described above, heat conduction is also reduced. For this reason, the deviation of the temperature distribution of the process target member GB heat-processed by the panel heater 130 can be suppressed, and the process target member GB can be heat-processed uniformly.
　さらに、本実施の形態の処理装置１００では、一個の駆動モータ１１６により複数の第一ユニット１１０で四本の第一シャフト１１１を同様に上下させるので、その構造が簡単であるとともに第一線材１１２Ａの上下移動の同期が確実である。 Furthermore, in the processing apparatus 100 of the present embodiment, the four first shafts 111 are similarly moved up and down by the plurality of first units 110 by the single drive motor 116, so that the structure is simple and the first wire rod 112A. The vertical movement is surely synchronized.
　また、本実施形態では、第一の線材部１１２、第二の線材部１２２のうち、処理対象部材ＧＢを支持していない方の線材部を水平方向に移動させている。そのため、線材部の水平方向の移動に伴い、処理対象部材ＧＢが移動してしまうことが防止され、処理対象部材ＧＢは、加熱処理中、同じ位置にとどまることができる。
　これに加え、第一の線材部１１２および第二の線材部１２２間での処理対象部材ＧＢの引渡しの際、および、第一線材１１２Ａ間での処理対象部材ＧＢの引渡しの際、処理対象部材ＧＢの高さ位置が変動しない。
　そのため、処理対象部材ＧＢを動かすことで周囲に対流が生じ、処理対象部材ＧＢの温度分布が変化してしまうことを防止でき、効率よく、処理対象部材ＧＢを加熱処理することができる。 Moreover, in this embodiment, the wire part which is not supporting the process target member GB among the 1st wire part 112 and the 2nd wire part 122 is moved to the horizontal direction. Therefore, the processing target member GB is prevented from moving with the horizontal movement of the wire portion, and the processing target member GB can remain at the same position during the heat treatment.
In addition to this, at the time of delivery of the processing target member GB between the first wire portion 112 and the second wire portion 122 and at the time of delivery of the processing target member GB between the first wire portions 112A, the processing target member The height position of GB does not change.
Therefore, it is possible to prevent the convection from being generated around the movement of the processing target member GB and change the temperature distribution of the processing target member GB, and to efficiently heat the processing target member GB.
　さらに、本実施形態では、第一ユニット１１０と第二ユニット１２０とを、左右方向に沿って交互に配置している。これにより、処理対象部材ＧＢを安定的に支持することができる。 Furthermore, in this embodiment, the first unit 110 and the second unit 120 are alternately arranged along the left-right direction. Thereby, the process target member GB can be stably supported.
　また、本実施形態では、第一ユニット１１０を第一ベース１３１に搭載し、第二ユニット１２０を第二ベース１３３に搭載している。そして、第一ベース１３１と第二ベース１３３を直線移動させることで、第一の線材部１１２、第二の線材部１２２の水平方向における位置を調整している。ベース１３１，１３３をスライドさせるだけで、第一の線材部１１２、第二の線材部１２２の水平方向における位置を調整できるので、第一の線材部１１２および第二の線材部１２２の位置調整が容易である。また、ベース１３１，１３３を水平方向に沿って移動させるだけで、第一の線材部１１２、第二の線材部１２２の水平方向における位置を調整でき、そのスライド量も適宜簡単に設定することができる。 In the present embodiment, the first unit 110 is mounted on the first base 131 and the second unit 120 is mounted on the second base 133. And the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 is adjusted by moving the 1st base 131 and the 2nd base 133 linearly. Since the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by sliding the bases 131 and 133, the position adjustment of the 1st wire part 112 and the 2nd wire part 122 is possible. Easy. Moreover, the position in the horizontal direction of the 1st wire part 112 and the 2nd wire part 122 can be adjusted only by moving the bases 131 and 133 along a horizontal direction, and the sliding amount can also be set easily easily. it can.
　なお、本発明は本実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で各種の変形を許容する。上記形態では、熱処理中、処理対象部材ＧＢが水平方向にスライド移動しないことを例示したが、これがスライド移動してもよい。たとえば、第一の線材１１２Ａが処理対象部材ＧＢを支持した状態で、ベース１３１を水平方向に移動してもよい。 The present invention is not limited to the present embodiment, and various modifications are allowed without departing from the scope of the present invention. In the above embodiment, it is exemplified that the processing target member GB does not slide in the horizontal direction during the heat treatment, but this may slide. For example, the base 131 may be moved in the horizontal direction while the first wire rod 112A supports the processing target member GB.
　また、上記形態では、図３に示すように、処理対象領域ＨＳが２×４に区分された処理対象部材ＧＢを加熱処理するため、５つの第二ユニット１２０と４つの第一ユニット１１０とが配列されていることを例示した。 Moreover, in the said form, in order to heat-process the process target member GB in which process target area | region HS was divided into 2x4 as shown in FIG. 3, five 2nd units 120 and four 1st units 110 are included. Exemplified that they are arranged.
　しかし、当然ながら、これらのユニットは処理対象部材ＧＢの区分に対応させて各種のレイアウトが可能である。さらに、複数種類の処理対象部材ＧＢの区分に対応するように、複数の第二ユニット１２０と複数の第一ユニット１１０とを配列しておき、その複数の第二ユニット１２０と複数の第一ユニット１１０とを選択的に作動させることで複数種類の処理対象部材ＧＢに対応することもできる(図示せず)。 However, as a matter of course, these units can have various layouts corresponding to the classification of the processing target member GB. Furthermore, the plurality of second units 120 and the plurality of first units 110 are arranged so as to correspond to the divisions of the plurality of types of processing target members GB, and the plurality of second units 120 and the plurality of first units are arranged. 110 can be selectively operated to cope with a plurality of types of processing target members GB (not shown).
　さらに、複数の第二ユニット１２０と複数の第一ユニット１１０とを左右方向に移動自在に配列しておき、その複数の第二ユニット１２０と複数の第一ユニット１１０との位置を変更することで複数種類の処理対象部材ＧＢに対応することもできる(図示せず)。 Furthermore, the plurality of second units 120 and the plurality of first units 110 are arranged so as to be movable in the left-right direction, and the positions of the plurality of second units 120 and the plurality of first units 110 are changed. A plurality of types of processing target members GB can also be handled (not shown).
　なお、上記形態では第一線材１１２Ａの断面積と熱容量とが充分に小さいことで熱伝導を低減し、パネルヒータ１３０により加熱処理される処理対象部材ＧＢの温度分布の偏差を抑制することを例示した。 In the above embodiment, the first wire 112 </ b> A has a sufficiently small cross-sectional area and heat capacity to reduce heat conduction and suppress temperature deviation of the processing target member GB to be heat-treated by the panel heater 130. did.
　当然ながら、第一線材１１２Ａの断面積や熱容量は、許容される処理対象部材ＧＢの温度分布の偏差、処理対象部材ＧＢを支持するための強度や耐久性、等を条件として適正に決定される。 Of course, the cross-sectional area and the heat capacity of the first wire rod 112A are appropriately determined on the condition of the allowable temperature distribution deviation of the processing target member GB, the strength and durability for supporting the processing target member GB, and the like. .
　さらに、上記形態では、図４に示すように、駆動部１１３が共通する駆動軸１１４で支持された偏心カム１１５からなることを例示したが、これをクランク機構で形成することもできる。 Furthermore, in the above embodiment, as shown in FIG. 4, it is exemplified that the drive unit 113 is composed of the eccentric cam 115 supported by the common drive shaft 114, but this can also be formed by a crank mechanism.
　また、上記形態では処理装置１００がパネルヒータ１３０により処理対象部材ＧＢを下方から加熱処理することを例示した。しかし、パネルヒータ１３０により処理対象部材ＧＢを上方から加熱処理する処理装置や、一対のパネルヒータ１３０により処理対象部材ＧＢを上方と下方との両方から加熱処理する処理装置なども可能である(ともに図示せず)。 Moreover, in the said form, the processing apparatus 100 illustrated heat-processing the process target member GB from the downward direction with the panel heater 130. FIG. However, a processing device that heats the processing target member GB from above with the panel heater 130 or a processing device that heats the processing target member GB from above and below with a pair of panel heaters 130 is possible (both Not shown).
　さらに、上記形態ではパネルヒータ１３０により処理対象部材ＧＢを加熱処理するプリベーク装置を処理装置１００として例示した。しかし、処理対象部材ＧＢを減圧乾燥する減圧乾燥装置を処理装置とすることもできる(図示せず)。たとえば、前記実施形態の処理装置１００を、真空ポンプ等の減圧手段に接続されたチャンバ内に配置し、減圧乾燥装置を構成してもよい。
　さらに、前記実施形態では、ベース１３１，１３３を水平方向に沿って移動させることで、第一の線材部１１２、第二の線材部１２２を水平方向に移動させたが、これに限られるものではない。たとえば、ベース１３３を設けずに、ベース１３１を使用して、第一の線材部１１２を第二の線材部１２２に対して、水平方向に移動させてもよい。
　また、前記実施形態では、第一の線材部１１２は複数本の第一線材１１２Ａで構成されているとしたが、これに限られるものではなく、１本の第一線材１１２Ａで構成されていてもよい。このようにすることで、装置の簡素化をはかることができる。さらに、第一線材１１２Ａは４本であったが、これに限れられるものではない。第一線材１１２Ａが複数本の場合には、たとえば、５本でもよく、また、３本あってもよい。 Further, in the above embodiment, the pre-baking apparatus that heats the processing target member GB by the panel heater 130 is exemplified as the processing apparatus 100. However, a reduced-pressure drying apparatus for drying the processing target member GB under reduced pressure can be used as a processing apparatus (not shown). For example, the processing apparatus 100 of the above embodiment may be arranged in a chamber connected to a decompression means such as a vacuum pump to constitute a decompression drying apparatus.
Furthermore, in the said embodiment, the 1st wire part 112 and the 2nd wire part 122 were moved to the horizontal direction by moving the bases 131 and 133 along a horizontal direction, but it is not restricted to this. Absent. For example, the first wire member 112 may be moved in the horizontal direction with respect to the second wire member 122 using the base 131 without providing the base 133.
Moreover, in the said embodiment, although the 1st wire part 112 was comprised with the several 1st wire 112A, it is not restricted to this, It is comprised with 1 1st wire 112A. Also good. By doing in this way, simplification of an apparatus can be achieved. Furthermore, although the first wire rod 112A is four, it is not limited to this. When there are a plurality of first wire rods 112A, for example, the number may be five or three.
　さらに、前記実施形態では、第一の線材部１１２を構成する複数本の第一線材１１２Ａを順番に上昇および下降させていたが、これに限らず、一部の第一線材１１２Ａが固定され、他の一部の第一線材１１２Ａが上下方向に駆動するものとしてもよい。たとえば、一部の第一線材１１２Ａで処理対象部材ＧＢを支持した後、他の一部の第一線材１１２Ａを一部の第一線材１１２Ａよりも上方に位置するように、駆動し、他の一部の第一線材１１２Ａにより処理対象部材ＧＢを支持する。その後、他の一部の第一線材１１２Ａを下方に駆動し、一部の第一線材１１２Ａに処理対象部材ＧＢを引き渡す。 Furthermore, in the said embodiment, although several 1st wire rod 112A which comprises the 1st wire rod part 112 was raised and lowered in order, not only this but some 1st wire rods 112A are fixed, Another part of the first wire 112A may be driven in the vertical direction. For example, after supporting the processing target member GB with a part of the first wire rod 112A, the other part of the first wire rod 112A is driven to be positioned above the part of the first wire rod 112A, The processing target member GB is supported by some of the first wires 112A. Thereafter, the other part of the first wire 112A is driven downward, and the processing target member GB is delivered to the part of the first wire 112A.
　さらに、前記実施形態では、第一の線材部１１２および第二の線材部１２２の双方が上下方向に駆動するとしたが、これに限らず、いずれか一方の線材部のみが上下方向に駆動するものとしてもよい。 Furthermore, in the said embodiment, although both the 1st wire rod part 112 and the 2nd wire rod part 122 drive up and down, not only this but only one wire rod part drives up and down. It is good.
　なお、当然ながら、上述した実施の形態および複数の変形例は、その内容が相反しない範囲で組み合わせることができる。また、上述した実施の形態および変形例では、各部の構造などを具体的に説明したが、その構造などは本願発明を満足する範囲で各種に変更することができる。
　この出願は、２０１０年９月１４日に出願された日本特許出願特願２０１０－２０５５２７、日本特許出願特願２０１０－２０５５２８を基礎とする優先権を主張し、その開示をすべてここに取り込む。 Needless to say, the above-described embodiment and a plurality of modifications can be combined within a range in which the contents do not conflict with each other. Further, in the above-described embodiments and modifications, the structure of each part has been specifically described, but the structure and the like can be changed in various ways within a range that satisfies the present invention.
This application claims priority based on Japanese Patent Application No. 2010-205527 and Japanese Patent Application No. 2010-205528 filed on Sep. 14, 2010, the entire disclosures of which are incorporated herein.

Claims (34)

  1. 　平板状の部材を処理位置に配置して処理を実行する処理装置であって、
    　上面視において、前記平板状の部材がまたがって配置されるとともに、前記平板状の部材を下方側から支持するための第一の線材部および第二の線材部と、
    　前記第一の線材部を前記第二の線材部に対し、上下方向に相対的に移動させて、上下方向における前記第一の線材部と前記第二の線材部との位置関係を逆転させる駆動部と、
    　前記第一の線材部を、前記第二の線材部に対し、水平方向に、相対的に移動させる変位機構と、
    　前記第一の線材部または前記第二の線材部に支持された前記平板状の部材に処理を施す処理部とを備える処理装置。     A processing apparatus that performs processing by arranging a flat plate-like member at a processing position,
    In the top view, the flat plate-like member is arranged across the first wire rod portion and the second wire rod portion for supporting the flat plate-like member from the lower side,
    Drive that reverses the positional relationship between the first wire portion and the second wire portion in the vertical direction by moving the first wire portion relative to the second wire portion in the vertical direction. And
    A displacement mechanism for moving the first wire portion relative to the second wire portion in the horizontal direction;
    A processing apparatus comprising: a processing unit that performs processing on the flat plate member supported by the first wire member or the second wire member.
  2. 　請求項１に記載の処理装置において、
    　前記変位機構は、前記第一の線材部および前記第二の線材部のうち、前記平板状の部材を支持している一方の線材部を水平方向に移動させず、前記支持してない他方の線材部を水平方向に移動させるように構成されている処理装置。     The processing apparatus according to claim 1,
    Of the first wire portion and the second wire portion, the displacement mechanism does not move one wire portion supporting the flat plate member in the horizontal direction and does not support the other wire portion. A processing apparatus configured to move the wire portion in the horizontal direction.
  3. 　請求項１または２に記載の処理装置において、
    　前記第一の線材部により、前記平板状の部材を支持した後、前記駆動部により、前記第二の線材部を前記第一の線材部よりも相対的に上方に移動させて、前記第二の線材部により、前記平板状の部材を支持させ、
    　前記変位機構により、前記第一の線材部を水平方向に移動した後、前記駆動部により、前記第一の線材部を前記第二の線材部よりも相対的に上方に移動させて、前記第一の線材部により、前記平板状の部材を支持するように構成された処理装置。     The processing apparatus according to claim 1 or 2,
    After the flat member is supported by the first wire portion, the second wire portion is moved relatively higher than the first wire portion by the driving portion, and the second wire portion The flat plate member is supported by the wire portion,
    After the first wire rod portion is moved in the horizontal direction by the displacement mechanism, the first wire rod portion is moved relatively higher than the second wire rod portion by the drive portion, and the first wire rod portion is moved upward. The processing apparatus comprised so that the said flat member may be supported by one wire rod part.
  4. 　請求項３に記載の処理装置において、
    　前記第一の線材部は、平面視で平行配置される複数本の第一線材を有し、
    　前記駆動部は、複数の第一線材のうち、一部の第一線材を、他の一部の第一線材に比べて、相対的に下方および上方に駆動するように構成されている処理装置。     The processing apparatus according to claim 3, wherein
    The first wire rod part has a plurality of first wire rods arranged in parallel in a plan view,
    The said drive part is a processing apparatus comprised so that it may drive a some 1st wire among a some 1st wire relatively below and upwards compared with the other some 1st wire. .
  5. 　請求項４に記載の処理装置において、
    　複数本の第一線材を有する第一の線材部と、前記第一線材がそれぞれ架け渡される複数対の第一シャフトを有する第一ユニットを複数備え、
    　異なる前記第一ユニットにおける第一線材同士が互いに平行となるように、複数の第一ユニットが離間配置され、
    　前記駆動部は、前記各第一ユニットにおける複数対の前記第一シャフトのうち、少なくとも一対の第一シャフトを他の一対の第一シャフトに比べて相対的に下方および上方に駆動するように構成されている処理装置。     The processing apparatus according to claim 4, wherein
    A plurality of first wires having a plurality of first wires having a plurality of first wires, and a plurality of first units each having a plurality of pairs of first shafts on which the first wires are spanned,
    A plurality of first units are spaced apart so that the first wire rods in the different first units are parallel to each other,
    The drive unit is configured to drive at least a pair of first shafts relatively downward and upward compared to other pairs of first shafts among a plurality of pairs of the first shafts in the first units. Processing equipment.
  6. 　請求項５に記載の処理装置において、
    　前記複数の第一ユニットの複数の第一線材の一方の端部をそれぞれ支持する複数の第一シャフトは、それぞれ偏心カムを介して同一の駆動軸に固定され、
    　前記複数の第一ユニットの複数の第一線材の他方の端部をそれぞれ支持する複数の第一シャフトは、それぞれ偏心カムを介して他の同一の駆動軸に固定され、
    　前記駆動部は、前記偏心カムと、前記駆動軸とを備えて構成される処理装置。     The processing apparatus according to claim 5, wherein
    The plurality of first shafts respectively supporting one end of the plurality of first wire rods of the plurality of first units are respectively fixed to the same drive shaft via eccentric cams,
    The plurality of first shafts that respectively support the other ends of the plurality of first wires of the plurality of first units are fixed to other same drive shafts via eccentric cams, respectively.
    The said drive part is a processing apparatus comprised with the said eccentric cam and the said drive shaft.
  7. 　請求項５または６に記載の処理装置において、
    　少なくとも１本の第二線材を有する第二線材部と、前記第二線材が架け渡される少なくとも一対の第二シャフトとを有する第二ユニットを備え、
    　前記第一ユニットと前記第二ユニットとが交互に配置され、
    　上面視において、前記第一線材と前記第二線材とが平行に配置されている処理装置。     The processing apparatus according to claim 5 or 6,
    A second unit having a second wire portion having at least one second wire, and at least a pair of second shafts around which the second wire is bridged;
    The first unit and the second unit are alternately arranged,
    The processing apparatus by which said 1st wire and said 2nd wire are arrange | positioned in parallel in the top view.
  8. 　請求項１乃至７のいずれかに記載の処理装置において、
    　前記変位機構は、
    　前記第一の線材部が搭載されたベースと、
    　前記第二の線材部が搭載されたベースと、
    　これらのベースを相対的に水平方向に移動させる移動手段とを備える処理装置。     In the processing apparatus in any one of Claims 1 thru | or 7,
    The displacement mechanism is
    A base on which the first wire portion is mounted;
    A base on which the second wire portion is mounted;
    A processing apparatus comprising a moving means for moving these bases relatively in the horizontal direction.
  9. 　請求項１乃至８のいずれかに記載の処理装置において、
    　前記平板状の部材は、基板である処理装置。     In the processing apparatus in any one of Claims 1 thru | or 8,
    The flat plate member is a processing apparatus which is a substrate.
  10. 　請求項１乃至９のいずれかに記載の処理装置において、
    　前記処理部は、前記平板状の部材を加熱する加熱部である処理装置。     In the processing apparatus in any one of Claims 1 thru | or 9,
    The processing unit is a processing unit that is a heating unit that heats the plate-shaped member.
  11. 　請求項１乃至９のいずれかに記載の処理装置において、
    　前記処理部は、減圧乾燥を行なう減圧乾燥機である処理装置。     In the processing apparatus in any one of Claims 1 thru | or 9,
    The processing unit is a processing apparatus which is a vacuum dryer that performs vacuum drying.
  12. 　平板状の処理対象部材を処理位置に配置して所定処理を実行する処理装置であって、
    　前後方向に一対ずつ左右方向に複数が配列されている複数の第一ユニット部と、
    　複数の前記第一ユニット部の各々に上下方向に変位自在に支持されている第一シャフトと、
    　前後方向の一対ずつの前記第一シャフトの上端で個々に張架されている複数の第一線材と、
    　前記第一シャフトを相対的に上昇させて前記第一線材で前記処理対象部材を前記処理位置に支持させる上下機構と、
    　複数の前記第一ユニット部が搭載されていて左右方向にスライド自在な一個のベースと、
    　前記ベースを左右方向に変位させる処理変位機構と、
    を有する処理装置。     A processing apparatus that performs a predetermined process by arranging a flat processing target member at a processing position,
    A plurality of first unit parts arranged in the left-right direction one by one in the front-rear direction;
    A first shaft supported by each of the plurality of first unit parts so as to be freely displaceable in the vertical direction;
    A plurality of first wire members individually stretched at the upper ends of the pair of first shafts in the front-rear direction;
    An up-and-down mechanism that relatively raises the first shaft and supports the processing target member at the processing position with the first wire;
    A single base on which a plurality of the first unit parts are mounted and slidable in the left-right direction;
    A processing displacement mechanism for displacing the base in the left-right direction;
    A processing apparatus.
  13. 　前記処理対象部材は少なくとも左右方向で複数の処理対象領域に区分されており、
    　複数の前記第一線材は複数の前記処理対象領域を支持する位置に配置されている請求項１２に記載の処理装置。     The processing target member is divided into a plurality of processing target areas at least in the left-right direction,
    The processing apparatus according to claim 12, wherein the plurality of first wire rods are arranged at positions that support the plurality of processing target regions.
  14. 　複数の前記第一ユニット部には、各々に複数の前記第一シャフトが左右方向に配列されており、
    　複数の前記第一ユニット部の左右方向で共通位置の前記第一シャフトを選択的に相対的に上昇させて前記第一線材で前記処理対象部材を前記処理位置に支持させる上下機構を、さらに有する請求項１２または１３に記載の処理装置。     A plurality of the first shafts are arranged in the left-right direction in each of the plurality of first unit portions,
    And a vertical mechanism that selectively raises the first shaft at a common position in the left-right direction of the plurality of first unit portions and supports the processing target member at the processing position with the first wire rod. The processing apparatus according to claim 12 or 13.
  15. 　複数の前記第一ユニット部が個々に左右方向に移動自在に支持されている請求項１２ないし１４の何れか一項に記載の処理装置。 The processing apparatus according to any one of claims 12 to 14, wherein the plurality of first unit portions are individually supported so as to be movable in the left-right direction.
  16. 　前記処理対象部材は、左右方向で複数の前記処理対象領域に区分され、
    　前記処理対象領域間の領域に対応した位置で前後方向に一対ずつ左右方向に複数が配列されている複数の第二ユニット部と、
    　複数の前記第二ユニット部の各々に上下方向に変位自在に支持されている第二シャフトと、
    　前後方向の一対ずつの前記第二シャフトの上端で個々に張架されている複数の第二線材と、
    　前記第二シャフトを相対的に上昇させて搬入される前記処理対象部材を前記第二線材で前記処理位置に支持させる第二上下機構とを、
    さらに有する請求項１２ないし１５の何れか一項に記載の処理装置。     The processing target member is divided into a plurality of processing target areas in the left-right direction,
    A plurality of second unit parts arranged in the left-right direction in pairs in the front-rear direction at positions corresponding to the areas between the processing target areas;
    A second shaft supported by each of the plurality of second unit portions so as to be freely displaceable in the vertical direction;
    A plurality of second wires individually stretched at the upper ends of the pair of second shafts in the front-rear direction;
    A second up-and-down mechanism for supporting the processing target member carried in by raising the second shaft relative to the processing position with the second wire,
    The processing apparatus according to any one of claims 12 to 15, further comprising:
  17. 　複数の前記第二ユニット部が搭載されていて左右方向にスライド自在な一個の第二ベースと、
    　前記第二ベースを左右方向に変位させる変位機構とを、
    さらに有する請求項１６に記載の部材処理装置。     One second base on which a plurality of the second unit parts are mounted and slidable in the left-right direction;
    A displacement mechanism for displacing the second base in the left-right direction,
    Furthermore, the member processing apparatus of Claim 16.
  18. 　複数の前記第二ユニット部が個々に左右方向に移動自在に支持されている請求項１６または１７に記載の処理装置。 The processing apparatus according to claim 16 or 17, wherein a plurality of the second unit parts are individually supported so as to be movable in the left-right direction.
  19. 　張架されている複数の前記第二線材の間隙を通過する形状の少なくとも一対のクローで前記処理対象部材を略水平に支持するフォークと、
    　前記フォークを待機位置と前記処理位置とに前後移動させる前後移動機構とを、さらに有し、
    　前記第二上下機構は、前記フォークを少なくとも前記処理位置で複数の前記第二線材より上方と下方とに相対移動させる請求項１６ないし１８の何れか一項に記載の処理装置。     A fork that supports the processing target member substantially horizontally with at least a pair of claws that pass through the gaps between the plurality of second wires that are stretched;
    A back-and-forth movement mechanism for moving the fork back and forth between the standby position and the processing position;
    The processing apparatus according to any one of claims 16 to 18, wherein the second vertical mechanism moves the fork relatively above and below the plurality of second wires at least at the processing position.
  20. 　複数の前記第一線材で前記処理位置に支持された前記処理対象部材に前記所定処理を実行する部材処理機構を、さらに有する請求項１２ないし１９の何れか一項に記載の処理装置。 The processing apparatus according to any one of claims 12 to 19, further comprising a member processing mechanism that performs the predetermined processing on the processing target member supported at the processing position by a plurality of the first wire rods.
  21. 　前記部材処理機構は、複数の前記第一線材で前記処理位置に支持された前記処理対象部材を加熱処理する請求項２０に記載の処理装置。 21. The processing apparatus according to claim 20, wherein the member processing mechanism heats the processing target member supported at the processing position by a plurality of the first wire rods.
  22. 　前記部材処理機構は、複数の前記第一線材で前記処理位置に支持された前記処理対象部材を減圧乾燥する請求項２０に記載の処理装置。 21. The processing apparatus according to claim 20, wherein the member processing mechanism dries the processing target member supported at the processing position by a plurality of the first wire rods under reduced pressure.
  23. 　平板状の処理対象部材を処理位置に配置して所定処理を実行する処理装置であって、
    　前後方向に一対ずつ左右方向に複数が配列されている複数の第二ユニット部と、
    　複数の前記第二ユニット部の各々に上下方向に変位自在に支持されている第二シャフトと、
    　前後方向の一対ずつの前記第二シャフトの上端で個々に張架されている複数の第二線材と、
    　前記第二シャフトを相対的に上昇させて搬入される前記処理対象部材を前記第二線材に支持させる第二上下機構と、
    を有する処理装置。     A processing apparatus that performs a predetermined process by arranging a flat processing target member at a processing position,
    A plurality of second unit parts arranged in pairs in the left-right direction one by one in the front-rear direction;
    A second shaft supported by each of the plurality of second unit portions so as to be freely displaceable in the vertical direction;
    A plurality of second wires individually stretched at the upper ends of the pair of second shafts in the front-rear direction;
    A second vertical mechanism for causing the second wire rod to support the processing target member carried by raising the second shaft relatively;
    A processing apparatus.
  24. 　前記処理対象部材は左右方向で複数の処理対象領域に区分されており、
    　複数の前記第二ユニット部は、前記処理対象領域間の領域に対応した位置で前後方向に一対ずつ左右方向に複数が配列されており、
    　第二上下機構は、前記処理対象部材を前記処理対象領域間の領域で前記第二線材に支持させる請求項２３に記載の処理装置。     The processing target member is divided into a plurality of processing target areas in the left-right direction,
    A plurality of the second unit parts are arranged in the left-right direction in pairs in the front-rear direction at positions corresponding to the regions between the processing target areas,
    The processing apparatus according to claim 23, wherein the second vertical mechanism is configured to support the processing target member on the second wire rod in a region between the processing target regions.
  25. 　張架されている複数の前記第二線材の間隙を通過する形状の少なくとも一対のクローで前記処理対象部材を略水平に支持するフォークと、
    　前記フォークを待機位置と前記処理位置とに前後移動させる前後移動機構とを、さらに有し、
    　前記第二上下機構は、前記フォークを少なくとも前記処理位置で複数の前記第二線材より上方と下方とに相対移動させる請求項２３または２４に記載の処理装置。     A fork that supports the processing target member substantially horizontally with at least a pair of claws that pass through the gaps between the plurality of second wires that are stretched;
    A back-and-forth movement mechanism for moving the fork back and forth between the standby position and the processing position;
    25. The processing apparatus according to claim 23, wherein the second vertical mechanism moves the fork relatively above and below the plurality of second wires at least at the processing position.
  26. 　複数の前記第二ユニット部が搭載されていて左右方向にスライド自在な一個の第二ベースと、
    　前記第二ベースを左右方向に変位させる第二変位機構とを、
    さらに有する請求項２３ないし２５の何れか一項に記載の処理装置。     One second base on which a plurality of the second unit parts are mounted and slidable in the left-right direction;
    A second displacement mechanism for displacing the second base in the left-right direction;
    The processing apparatus according to any one of claims 23 to 25, further comprising:
  27. 　複数の前記第二ユニット部が個々に左右方向に移動自在に支持されている請求項２３ないし２６の何れか一項に記載の処理装置。 27. The processing apparatus according to claim 23, wherein the plurality of second unit parts are individually supported so as to be movable in the left-right direction.
  28. 　前後方向に一対ずつ左右方向に複数が配列されている複数の第一ユニット部と、
    　複数の前記第一ユニット部の各々に左右方向に配列されていて各々が上下方向に変位自在に支持されている複数の第一シャフトと、
    　前後方向の一対ずつの前記第一シャフトの上端で個々に張架されている複数の第一線材と、
    　複数の前記第一ユニット部の左右方向で共通位置の前記第一シャフトを選択的に相対的に上昇させて前記第一線材で前記処理対象部材を前記対象処理位置に支持させる第一上下機構と、
    を有する請求項２３ないし２７の何れか一項に記載の処理装置。     A plurality of first unit parts arranged in the left-right direction one by one in the front-rear direction;
    A plurality of first shafts arranged in the left-right direction in each of the plurality of first unit parts and each supported so as to be displaceable in the up-down direction;
    A plurality of first wire members individually stretched at the upper ends of the pair of first shafts in the front-rear direction;
    A first vertical mechanism that selectively raises the first shaft at a common position in the left-right direction of the plurality of first unit portions and supports the processing target member at the target processing position with the first wire rod; ,
    A processing apparatus according to any one of claims 23 to 27, comprising:
  29. 　前記処理対象部材は左右方向で複数の処理対象領域に区分されており、
    　複数の前記第一線材は複数の前記処理対象領域を支持する位置に配置されている請求項２８に記載の処理装置。     The processing target member is divided into a plurality of processing target areas in the left-right direction,
    29. The processing apparatus according to claim 28, wherein the plurality of first wire rods are disposed at positions that support the plurality of processing target areas.
  30. 　複数の前記第一ユニット部が搭載されていて左右方向にスライド自在な一個の第一ベースと、
    　前記第一ベースを左右方向に変位させる第一変位機構とを、
    さらに有する請求項２８または２９に記載の処理装置。     One first base on which a plurality of the first unit parts are mounted and slidable in the left-right direction;
    A first displacement mechanism for displacing the first base in the left-right direction;
    30. The processing apparatus according to claim 28 or 29.
  31. 　複数の前記第一ユニット部が個々に左右方向に移動自在に支持されている請求項２８ないし３０の何れか一項に記載の処理装置。 The processing apparatus according to any one of claims 28 to 30, wherein a plurality of the first unit parts are individually supported so as to be movable in the left-right direction.
  32. 　複数の前記第一線材で前記処理位置に支持された前記処理対象部材に前記所定処理を実行する部材処理機構を、さらに有する請求項２３ないし３１の何れか一項に記載の処理装置。 32. The processing apparatus according to claim 23, further comprising a member processing mechanism that performs the predetermined processing on the processing target member supported at the processing position by a plurality of the first wire rods.
  33. 　前記部材処理機構は、複数の前記第一線材で前記処理位置に支持された前記処理対象部材を加熱処理する請求項３２に記載の処理装置。 The processing apparatus according to claim 32, wherein the member processing mechanism heats the processing target member supported at the processing position by a plurality of the first wire rods.
  34. 　前記部処理機構は、複数の前記第一線材で前記処理位置に支持された前記処理対象部材を減圧乾燥する請求項３２に記載の処理装置。 33. The processing apparatus according to claim 32, wherein the partial processing mechanism dries the processing target member supported at the processing position by a plurality of the first wire rods under reduced pressure.
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JP2000150333A (en) * 1998-11-18 2000-05-30 Tokyo Electron Ltd Substrate heat treatment apparatus
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