WO2008029943A1

WO2008029943A1 - Lift pin mechanism

Info

Publication number: WO2008029943A1
Application number: PCT/JP2007/067569
Authority: WO
Inventors: Masaaki Chikaike
Original assignee: Semiconductor & Display Corporation
Priority date: 2006-09-08
Filing date: 2007-09-10
Publication date: 2008-03-13
Also published as: KR20090053839A; JP5561664B2; JPWO2008029943A1

Abstract

Occurrence of unevenness or a pin trace is prevented on the surface of a substrate to be processed. A lift pin mechanism is equipped with an elevating/lowering pin for supporting the substrate to be processed by abutting against it from the underside. The lift pin mechanism is provided with an elevating/lowering pin unit for supporting the substrate by elevating/lowering one or more than one elevating/lowering pins in one set of a plurality of elevating/lowering pins simultaneously and sequentially and by abutting the upper end of each elevating/lowering pin against the lower side face of the substrate. A plurality of elevating/lowering pin units are arranged on the underside of the substrate. The elevating/lowering pin unit elevates/lowers one or more than one of a plurality elevating/lowering pins simultaneously and sequentially and abuts the upper end of each elevating/lowering pin against the lower side face of the substrate thus supporting the substrate by the elevating/lowering pins.

Description

Specification

Lift pin mechanism

Technical field

TECHNICAL FIELD [0001] The present invention relates to a lift pin mechanism that supports a substrate to be processed from below when processing the substrate to be processed, and particularly relates to a lift pin mechanism that is suitable for use in heat treatment of a glass substrate for a liquid crystal display, a semiconductor wafer, or the like. .

Background art

[0002] In the case of a substrate to be processed such as a glass substrate for liquid crystal display, a film substrate, and a semiconductor wafer, a coating film is formed on the surface and subjected to a drying treatment. In this case, the substrate to be processed is supported by lift pins from below during the heat treatment or the like.

[0003] For example, in the manufacture of a liquid crystal display! /, A glass substrate constituting this liquid crystal display is coated with a coating film and dried. When the coating film is dried, a lift pin mechanism is used. The coating film drying oven provided is used. The force that dries the coating film by supporting the glass substrate with the lift pins in the coating film drying furnace and heating it to a high temperature. At this time, the overheated lift pins are newly processed, and the back surface of the cooled glass substrate. The coating film may be adversely affected by heating locally while in contact with the coating.

[0004] Various improvements have been proposed to eliminate the adverse effects on the coating film caused by local heating caused by the contact of the lift pins. An example of this is cited document 1.

[0005] As shown in Fig. 2, the conventional coating film drying furnace described in the cited document 1 has a five-stage coating film drying furnace 1 in which a hot plate heater 2 and a drying chamber 3 are sequentially arranged. The drying chambers of 3, 3, · · · are formed. A transfer port 4 is provided on the side surface of the drying chamber 3, and a transfer door 5 for opening and closing the transfer port 4 is provided.

[0006] The glass substrate 6 is taken into and out of the drying chamber 3 by the transfer robot 7 that has received the glass substrate 6 sent from the previous step. The transfer robot 7 moves up and down according to the transfer port 4 of each drying chamber 3 and has an arm 8 extending from the transfer port 4 into the drying chamber 3, and the glass substrate 6 is placed on the arm 8. Then, it is carried into the drying chamber 3.

[0007] The glass substrate 6 is formed in a rectangular shape, and a coating film 9 is printed on the upper surface 6a thereof. ing.

As shown in FIG. 3, the feeding means 10 is provided on the upper surface of the hot plate heater 2 that is the bottom surface of the drying chamber 3. The feeding means 10 includes a support pin 11 that is in contact with and supported by the lower surface of the glass substrate 6 carried in from the transport port 4, and a moving pin 12. The moving pin 12 has a tip 12a of the moving pin 12 attached to a vertical air cylinder 13 that moves vertically to a position lower and higher than the tip 1 la of the support pin 11! The vertical air cylinder 13 is attached to a horizontal air cylinder 14 which is a horizontal expansion / contraction mechanism that moves in the horizontal direction.

[0009] Thereby, the glass substrate 6 is dried as follows.

A glass substrate 6 is placed on the arm 8 of the transfer robot 7 and is carried into the drying chamber 3. The carry-in door 5 is opened at the transfer port 4 of the drying chamber 3. The glass substrate 6 supported on the arm 8 is carried into the drying chamber 3 from the transfer port 4, the arm 8 is lowered, and the glass substrate 6 is placed on the support pins 11. Next, the carry-in door 5 is closed (the state shown in FIG. 3 (a)). The inside of the drying chamber 3 is controlled to the set temperature by the hot plate heater 2.

Next, the moving pin 12 is raised by the vertical air cylinder 13, and the contact of the bottom surface of the glass substrate 6 is switched from the supporting pin 11 to the moving pin 12 (the state shown in FIG. 3B). Wow.

[0012] Next, the horizontal air cylinder 14 moves the vertical air cylinder 13 and the moving pin 12 (moved to the right in FIG. 3 (c)) to move the glass substrate 6, and the vertical air cylinder 13 moves the moving pin. 12 is lowered (the state shown in FIG. 3D), and the glass substrate 6 is placed on the support pins 11. Next, move the moving pin 12 back to its original position (the state shown in Fig. 3 (e)) using /!

[0013] This series of movements is taken as one cycle, and this cycle is repeated many times during the drying time. This cycle is less likely to cause pin marks as the moving speed of the moving pin 12 increases, but is approximately 4 to 8 seconds depending on the thickness of the coating film.

[0014] This cycle or reverse cycle (Fig. 3 (e)-> Fig. 3 (d)-> Fig. 3 (c)-> Fig. 3 (b)-> Fig. 3 (a)) makes pin traces less likely to occur. I am doing so.

[0015] Further, there is also a glass substrate that is alternately supported by lift pins and fixed pins so that pin marks or the like are not generated. An example of this is described in cited document 2. In particular, When the substrate is carried into the processing chamber, the lift pin is raised to a predetermined position, the substrate is placed on the lift pin, and the lift pin is lowered. As the lift pins descend, the substrate is transferred from the lift pins to the fixed pins at a position where the upper end of the fixed pin contacts the lower surface of the substrate. And the upper end part of a lift pin stops in the position which does not contact the lower surface of a board | substrate. When the decompression of the processing chamber starts and the processing is completed, the lift pin rises again, receives the substrate from the fixed pin, and raises it to a predetermined position. In this way, do not keep the same position on the board with the pins, and no pin marks will be generated! /.

Patent Document 1: Japanese Patent Laid-Open No. 2006-61755

Patent Document 2: Japanese Patent Laid-Open No. 10-76211

Disclosure of the invention

Problems to be solved by the invention

[0016] However, in the coating film drying furnace of Patent Document 1, a force that lifts and shifts the glass substrate 6 with the moving pin 12 and places the glass substrate 6 on the supporting pin 11 is heated by the series of operations. And the moving pin 12 contacts the back surface of the glass substrate 6 for a few seconds and the glass substrate

6 will be overheated.

[0017] At this time, the thermal conductivity is poor due to the thickness and material of the glass substrate 6, and it is difficult to transfer heat to the coating film 9 on the upper surface of the glass substrate 6. If the glass substrate 6 is thin or has a good thermal conductivity, heat is transferred to the coating film 9, resulting in drying irregularities and pin marks.

[0018] Also, the reduced-pressure drying apparatus of Patent Document 2 has a configuration in which different positions on the lower surface of the glass substrate are alternately supported by the fixing pins and the lift pins and dried, but is supported alternately at two points. Therefore, if the glass substrate is thin or has good thermal conductivity, heat will be transferred to the coating film, which will cause adverse effects such as uneven drying and pin marks.

[0019] The present invention has been made in consideration of the above-described problems, and an object thereof is to provide a lift pin mechanism that minimizes the influence on a substrate to be processed by pins that are supported by contact. Means to solve

[0020] In order to solve the above-mentioned problem, the present invention is configured to contact a substrate to be processed from below. A lift pin mechanism including supporting lift pins, each of the lift pins being moved up and down one by one or two or more of the lift pins at the same time and in sequence. And an elevating pin unit which supports the upper end of the substrate to be brought into contact with the lower surface of the substrate to be processed, and a plurality of the elevating pin units are arranged below the substrate to be processed.

[0021] With the above-described configuration, the plurality of lifting pin units disposed on the lower side of the substrate to be processed lifts the lifting pins one by one or two or more simultaneously and sequentially, By bringing the upper end into contact with the lower surface of the processing target substrate, the processing target substrate is supported by the lift pins.

The invention's effect

[0022] When the substrate to be processed is heat-treated, heat from the heated lifting pins is hardly transmitted to the substrate to be processed, and it is ensured that unevenness or pin marks are generated on the surface of the substrate to be processed. Can be prevented.

Brief Description of Drawings

FIG. 1 is a perspective view showing a lift pin mechanism according to a first embodiment of the present invention.

FIG. 2 is a schematic side view showing a conventional coating film drying furnace.

FIG. 3 is a schematic diagram showing the operation of a moving pin of a conventional coating film drying furnace.

FIG. 4 is a main part enlarged view showing a lift pin mechanism according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram showing an operation in which cross sections A, B, C, and D in FIG. 4 are arranged at intervals of lifting pins for convenience.

[Fig. 6] Fig. 6 is a plan view of the lift pin mechanism that exerts a force according to the first embodiment of the present invention when viewed from the upper side of the hot plate.

FIG. 7 is a front view showing a lift pin mechanism according to the first embodiment of the present invention.

FIG. 8 is an enlarged view of a main part showing a cam mechanism of a lift pin mechanism according to a second embodiment of the present invention.

FIG. 9 is a schematic configuration diagram showing thermal expansion absorbing means of a lift pin mechanism according to a second embodiment of the present invention.

FIG. 10 is a schematic configuration diagram showing a modification of the second embodiment of the present invention. FIG. 11 is a schematic configuration diagram showing a lift pin mechanism according to a third embodiment of the present invention.

FIG. 12 is a schematic configuration diagram showing a lift pin mechanism according to a third embodiment of the present invention.

FIG. 13 is a side view showing an eccentric cam according to a modification of the present invention.

FIG. 14 is a side view showing a linear cam according to a modification of the present invention.

FIG. 15 is a front view showing a lift pin mechanism according to a modification of the present invention.

FIG. 16 is a side view showing a cam mechanism and a vacuum chamber of a lift pin mechanism that exerts force on an embodiment of the present invention.

Explanation of symbols

[0024] 21 Lift pin mechanism, 22 Lifting pin unit, 23 Lifting pin, 24 Lifting means, 25 Drive part, 26 Glass substrate, 27 Shaft part, 28 Head, 29 Spring, 30 Cam mechanism, 31 Connecting shaft, 32 Coupling, 34 container, 35 camshaft, 36 eccentric cam, 38 drive motor, 39 motor connecting shaft, 40 control unit, 43 hot plate, 44 insertion hole, 45 base plate BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described. The lift pin mechanism of the present invention is an improved apparatus that minimizes the influence on the substrate to be processed by the pins that contact the substrate to be processed and support the substrate to be processed. This effect may be due to heat or static electricity. Here, an example in which the influence of heat is eliminated will be described. Specifically, a coating film drying furnace similar to the prior art will be described as an example. For this reason, the substrate to be processed is a glass substrate having a coating film on the upper surface. Since the entire configuration of the coating film drying furnace is the same as that of the prior art, the description here will focus on the lift pin mechanism.

[0026] [First embodiment]

As shown in FIG. 1, the lift pin mechanism 21 is a mechanism for supporting the glass substrate 26 (see FIG. 4) from below. The lift pin mechanism 21 is configured to include a plurality of lifting pin units 22 disposed below the glass substrate 26 over the entire area of the glass substrate 26.

[0027] This lifting pin unit 22 is composed of four lifting pins 23 as a set, and lifts and lowers one or more of the lifting pins 23 one by one or two at a time. The top This is a device for contacting and supporting the lower surface of the glass substrate 26.

[0028] Specifically, the elevating pin unit 22 includes an elevating pin 23, an elevating means 24, and a drive unit 25.

The elevating pin 23 is a material for supporting the glass substrate 26 from below while being supported so as to be movable up and down. The elevating pin 23 is composed of a shaft portion 27 and a head portion 28. The shaft portion 27 is a portion that is supported so as to move up and down and moves up and down by the lifting means 24. The head portion 28 is a portion that is provided integrally with the lower end portion of the shaft portion 27 and that abuts on an eccentric cam 36 of the elevating means 24 described later and follows the cam surface. The head 28 is brought into contact with and follows the cam surface of the eccentric cam 36 so that the elevating pin 23 moves up and down along the shape of the cam surface. The elevating pin 23 is provided with a spring 29 (see FIG. 4) as required. The spring 29 urges the elevating pin 23 downward so that the elevating pin 23 pushed up by the eccentric cam 36 moves up and down following the cam surface of the eccentric cam 36.

The elevating means 24 is a device for moving the elevating pin 23 up and down. The elevating means 24 includes a cam mechanism 30, a connecting shaft 31, and a coupling 32.

[0031] The cam mechanism 30 is a device for raising and lowering the lift pin 23 by contacting the head 28 at the lower end of the lift pin 23. As shown in l, 4, and 5, the cam mechanism 30 includes a camshaft 35 that is rotatably supported in a container 34, and four eccentric force members 36 provided on the camshaft 35. ing. All of the four eccentric cams 36 have a circular outer peripheral cam surface, and are arranged by changing the eccentric direction by 90 degrees sequentially from the cam at one end thereof. As a result, the four lifting pins 23 are pushed up one by one from the one end in order and are in contact with and supported by the back surface of the glass substrate 26.

The connecting shaft 31 is a shaft that is connected to the camshaft 35 and transmits torque from the drive unit 25.

The coupling 32 is a member for connecting the connecting shafts 31 to each other, and a motor connecting shaft 39 of the drive motor 38 to be described later and the connecting shaft 31. The coupling 32 has a connecting hole 32A in which the motor connecting shaft 39 and the connecting shaft 31 are fitted in the center of the cylindrical main body. The connecting shaft 31 and the like are inserted into the connecting hole 32A and the tips of the connecting holes 32A are inserted. Are fixed with screws 32B.

The drive unit 25 includes a drive motor 38 and a motor connecting shaft 39! /. Driving mode The motor 38 is a motor that drives the cam shaft 35 of the cam mechanism 30. The drive motor 38 is connected to a control unit 40 that controls the drive motor 38. The controller 40 is a device for adjusting the speed at which the ascending / descending means 24 is driven. The control unit 40 is configured as an independent device that controls only the drive motor 38, or is incorporated as a part of a control unit (not shown) that controls the entire coating film drying furnace. The control unit 40 can control the drive motor 38 to adjust the rotational speed of the eccentric cam 36 of the camshaft 35. Specifically, the control unit 40 can set the rotational speed of the eccentric cam 36 from 0.2 second / time to several seconds / time. The control unit 40 is configured to include a controller such as an inverter that adjusts the number of rotations by controlling the voltage and frequency applied to the motor.

The motor connection shaft 39 is a shaft for connecting the drive motor 38 and the camshaft 35.

The motor connecting shaft 39 is rotatably supported by a support plate 46 of a base plate 45 described later. The drive motor 38 and the camshaft 35 are connected via a motor connecting shaft 39, a coupling 32, and a connecting shaft 31.

[0036] As shown in Figs. 6 and 7, a plurality of lift pin mechanisms 21 having the above-described configuration are disposed below the hot plate 43 provided in the drying chamber of the coating film drying furnace. The hot plate 43 is a heating device for heating the glass substrate 26 installed on the upper side thereof. The lift pin mechanism 21 is provided below the hot plate 43. More specifically, the cam mechanism 30 of the lift pin mechanism 21 is arranged in five vertically and four horizontally, for a total of 20 at almost equal intervals. Four insertion holes 44 are provided at positions corresponding to the cam mechanisms 30 of the hot plate 43, and the elevation pins 23 of the elevation pin unit 22 are inserted into the insertion holes 44, respectively. .

Each cam mechanism 30 is connected by a coupling 32. Here, four cam mechanisms 30 are connected by a coupling 32 corresponding to the size of the glass substrate 26 and driven by one drive motor 38. The four connected cam mechanisms 30 are arranged in parallel in five rows corresponding to the size of the glass base plate 26, and are arranged on the lower surface of the hot plate 43 at an approximately equal interval with each other. Yes. A number of force mechanisms 30 corresponding to the size of the hot plate 43 are connected by a coupling 32, and can be freely configured to an arbitrary size. [0038] On the upper side surface of the hot plate 43, a plurality of fixing pins 43A are provided. The fixing pin 43A is a pin used to heat the glass substrate 26 placed near the hot plate 43.

The lift pin mechanism 21 is attached to the base plate 45. The base plate 45 is supported by an elevating mechanism (not shown) so as to be movable up and down. The lift pin mechanism 21 is moved up and down by this lift mechanism, so that the glass substrate 26 inserted into the drying chamber of the coating film drying furnace and supported by the lift pins 23 is moved up and down. Thus, the distance between the glass substrate 26 and the hot plate 43 is adjusted according to each drying process. On the base plate 45, a support plate 46 that rotatably supports the motor connecting shaft 39 is provided.

[0040] [Operation]

The lift pin mechanism 21 configured as described above operates as follows.

[0041] First, the hot plate 43 in the drying chamber of the coating film drying furnace is heated to a set temperature. Along with this, the elevating pins 23 inserted into the insertion holes 44 of the hot plate 43 are also heated.

[0042] In this state, the glass substrate 26 is inserted into the drying chamber, and is placed on the elevating pins 23 extending to the upper side surface of the hot plate 43! /.

At this time, the eccentric cam 36 of the elevating means 24 is rotated at the set rotational speed by the drive motor 38 of the drive unit 25. By the rotation of the eccentric cam 36, the four lifting pins 23 are moved up and down one by one. Since the four eccentric cams 36 are offset by 90 degrees, the camshaft

Each time the 35 rotates 90 degrees, each lifting pin 23 moves up and down sequentially, and the tip of the lifting pin 23 comes into contact with the back surface of the glass substrate 26 to support the glass substrate 26.

[0044] Here, the camshaft 35 is rotated at a speed of 0.2 sec / time. As a result, the four lifting pins 23 are supported in contact with the back surface of the glass substrate 26 in order and every 0.05 seconds. The number of rotations of the camshaft 35 is selected in accordance with various conditions such as the temperature of the lift pins 23, the number of lift pins 23, the dimensions of the glass substrate 26, and the like.

[0045] This operation is performed by all of the 20 cam mechanisms 30 arranged on the lower side of the hot plate 43, and the glass substrate 26 is placed at 20 positions on the back surface thereof every 0.05 seconds. Supported by lift pins 23 that change contact position with 26.

[0046] Thereby, the glass substrate 26 inserted in the drying chamber of the coating film drying furnace in a cold state. The force that is heated directly by the lift pin 23 and heated by the lift pin 23 is as follows. One lift pin 23 and the glass substrate 26 are momentarily within 0.05 seconds within 0.5 seconds. Therefore, the coating film on the upper surface of the glass substrate 26 where the heat of the elevating pins 23 is not easily transmitted to the glass substrate 26 is not locally heated.

[0047] When the glass substrate 26 is heated and the temperature rises to be the same as or similar to that of the lift pin 23, the rotational speed of the camshaft 35 is slowed or stopped.

[0048] The lift pin mechanism 21 is a lifting mechanism for the base plate 45, and is appropriately adjusted to a set height in each step. For example, in the latter half of the drying process, the glass substrate 26 is heated close to the hot plate 43 from the state shown in FIG. 5A to the state supported by the fixing pin 43A shown in FIG. In some cases, the glass substrate 26 is directly placed on the upper surface of the hot plate 43 and heated.

[0049] When the drying process in the coating film drying furnace is completed, the glass substrate 26 is unloaded, the next glass substrate 26 is loaded, and the drying process is repeated.

[0050] During maintenance, the cam mechanism 30 at an arbitrary position is selectively repaired or replaced. In this case, the front and rear couplings 32 of the cam mechanism 30 to be maintained are removed, and the cam mechanism 30 is repaired or replaced.

[0051] [Effect]

As described above, a plurality of elevating pin units 22 cam mechanism 30 arranged on the lower side of the glass substrate 26 force 4 elevating pins 23 are raised and lowered one by one in order, and each elevating pin 23 Since the glass substrate 26 is supported by contacting the upper end of the glass substrate 26 with the lower surface of the glass substrate 26, the heat from the heated elevating pins 23 is less likely to be transmitted to the glass substrate 26, resulting in uneven drying and pin marks. Can be reliably prevented. Thereby, the vacuum beta process can be omitted.

[0052] Since the controller 40 controls the number of rotations of the drive motor 38 to control the up / down speed of the up / down pins 23 by the eccentric cam 36, the upper end of the up / down pins 23 and the lower surface of the glass substrate 26 are Can be freely adjusted. As a result, it is possible to adjust the rotational speed of the eccentric cam 36 according to various conditions.

[0053] The lift pin mechanism 21 can be freely adjusted in size with respect to the hot plates 43 having different sizes by connecting a plurality of cam mechanisms 30 with couplings 32. The force density can be adjusted by adjusting the arrangement density of the force mechanism 30 freely. [0054] Further, the number of cam mechanisms 30 of the elevating means 24 is connected by the coupling 32 by the number corresponding to the size of the glass substrate 26 (here, four), and the number corresponding to the size of the glass substrate 26. Since (here 5 rows) are arranged in parallel, the lift pin mechanism 21 in which the cam mechanism 30 is arranged at the optimum position can be easily configured for the glass substrates 26 of various sizes. it can. Since the four cam mechanisms 30 connected by the coupling 32 are driven by one drive motor 38, the number of drive motors 38 can be reduced.

[0055] Further, at the time of maintenance, the cam mechanism 30 can be removed and maintained by removing the couplings 32 before and after the cam mechanism 30 to be maintained, so that the workability at the time of maintenance is improved.

[0056] [Second Embodiment]

Next, a second embodiment of the present invention will be described.

The lift pin mechanism of the present embodiment is provided with a thermal expansion absorbing unit that absorbs a shift due to thermal expansion of the hot plate 43. Conventionally, the hole into which the elevating pin 23 is inserted is enlarged to absorb the thermal expansion of the hot plate 43. On the other hand, the lift pin mechanism of the present embodiment is adapted to be absorbed by the thermal expansion absorbing means. In the lift pin mechanism of the present embodiment, the configuration other than the thermal expansion absorbing means is the same as that of the lift pin mechanism 21 of the first embodiment, and therefore, here, the description will focus on the thermal expansion absorbing means.

As shown in FIGS. 8 and 9, the thermal expansion absorbing means 51 is constituted by an electromagnet 52 that absorbs a shift due to thermal expansion. The electromagnet 52 includes a coil 54 incorporated in the upper drive unit 53, a power supply 55, and a switch 56. The elevating pin 23 is made of a magnetic material, and its head 28 is electromagnetically coupled to the electromagnet 52. The upper drive unit 53 is provided with a lower drive unit 58 via a connecting rod 57, and the connecting rod 57 is supported so as to move up and down, and the upper drive unit 53 and the lower drive unit 58 follow the eccentric cam 36. It is designed to move up and down.

[0059] The upper side surface of the upper drive unit 53 and the lower side surface of the head 28 of the elevating pin 23 are formed in a flat surface. As a result, the upper drive unit 53 and the head 28 of the elevating pin 23 can be reliably electromagnetically coupled with each other, and the force S can be easily shifted along the contact surfaces. ! / [0060] The thermal expansion absorbing means 51 of the lift pin mechanism configured as described above operates as follows.

Prior to the heat treatment, the force S at which the hot plate 43 is heated to the set temperature, and the hot plate 43 then thermally expands as the temperature rises. This thermal expansion increases in proportion to the distance from the center position. Specifically, the cam mechanisms 30 at the four corners of the hot plate 43 are displaced the most. On the other hand, the shift of the lift pin unit 22 near the center of the hot plate 43 is small! /.

[0062] Therefore, as the hot plate 43 is heated, the switch 56 is turned off to release the electromagnetic coupling between the head 28 of the lift pin 23 and the electromagnet 52. As a result, the head 28 of the elevating pin 23 and the upper drive unit 53 are displaced as shown in FIG. When the hot plate 43 reaches the set temperature, there is no further thermal expansion, so the switch 56 is turned on, and the head 28 of the lift pin 23 and the electromagnet 52 are electromagnetically coupled. Thereby, the expansion of the hot plate 43 is absorbed.

The other operations are the same as those of the lift pin mechanism 21 of the first embodiment.

[0064] As described above, the electromagnetic coupling between the head 28 of the elevating pin 23 and the electromagnet 52 is temporarily released as the hot plate 43 reaches the set temperature as the hot plate 43 is heated. Thus, it is possible to reliably absorb the displacement of the elevating pin 23 due to thermal expansion.

[0065] Here, a force S and a permanent magnet that electromagnetically couples the head 28 of the lifting pin 23 and the electromagnet 52 using the electromagnet 52 may be used.

In this case, as shown in FIG. 10, the head portion 28 of the elevating / lowering pin 23 is composed of an N-pole or S-pole permanent magnet. Further, the portion of the upper drive unit 53 is composed of an S-pole or N-pole permanent magnet instead of the coil 54. The contact surfaces of each other are flat.

[0067] Thereby, the displacement due to the thermal expansion is absorbed by the mutual displacement of the flat contact surface.

This utilizes the characteristics of the permanent magnet. When N-pole and S-pole permanent magnets are coupled to each other, a very strong force is required in the direction to separate them, but they can be shifted with a slight force in the direction along the contact surface. The permanent magnets that are in contact with each other on the flat surface-like contact surfaces absorb the displacement due to thermal expansion by the mutual displacements of the flat surface-like contact surfaces, so that the vertical direction is reliably coupled.

[0068] In this case as well, it is possible to achieve the same effect S as the second embodiment. [0069] The permanent magnet may be used only on either the head 28 side or the upper drive unit 53 side of the elevating pin 23, and the other may be a magnetic body.

Furthermore, an electromagnet may be used instead of the permanent magnet. In this case, unlike the case of the second embodiment, it is used in the same manner as the permanent magnet.

[0071] [Third Embodiment]

Next, a third embodiment of the present invention will be described.

[0072] The lift pin mechanism of this embodiment uses a linear cam instead of the eccentric cam 36 of the cam mechanism 30 of the first embodiment.

As shown in FIGS. 11 and 12, the cam mechanism 61 is composed of a linear cam 62 and a driven portion 63.

[0074] The linear motion cam 62 is composed of a flat bar that reciprocates in the horizontal direction. A chevron-shaped cam surface for moving the elevating pin 23 up and down is formed on the upper side surface of the flat bar-like linear motion cam 62. By adjusting the shape of this mountain-shaped cam surface, the vertical movement speed and movement amount of the lifting pin 23 are set. The linear cam 62 is connected to a drive unit (not shown) by a connecting rod 65. This drive unit is composed of a reciprocating mechanism, and causes the linear cam 62 to reciprocate.

The follower 63 is composed of a roller 66 and a vertically moving piece 67. The roller portion 66 is rotatably supported by the lower end portion of the vertical moving piece portion 67. The vertically moving piece 67 is supported so as to be vertically movable. As a result, the roller portion 66 rotates along the mountain-shaped cam surface of the linear cam 62, so that the vertically moving piece portion 67 moves up and down to raise and lower the lifting pin 23.

The follower 63 is attached to each lift pin 23. Four followers 63 are arranged in accordance with the four lifting pins 23.

[0077] In the lift pin mechanism configured as described above, the linear motion cam 62 is reciprocated by the drive portion, and accordingly, the roller portion 66 of the driven portion 63 rotates along the mountain-shaped cam surface, Vertical movement piece 67 moves up and down to raise and lower the lift pin 23.

[0078] Further, the linear motion cam 62 reciprocates to move the four driven parts 63 up and down in order.

： Raise and lower the four lifting pins 23 one after another. As a result, the lifting pins 2 of the first embodiment As in 3, the glass substrate 26 is supported.

[0079] Also in this case, it is possible to achieve the same effect S as the first embodiment.

Industrial applicability

[0080] In each of the above embodiments, the drying operation by heating in the coating film drying furnace is described as an example, and the force by the lift pin 23 for explaining the lift pin mechanism for suppressing the influence by heat is as follows. In addition to heat, other factors such as static electricity are also conceivable. Also in the case of other factors such as static electricity, the lift pin mechanism 21 of each of the above embodiments can be used to eliminate adverse effects on the substrate to be processed. In the case of static electricity, the charge can be dispersed by the lifting pins 23.

[0081] In each of the above-described embodiments, it is needless to say that the force may be 2, 3, or 5 or more as described in the case where four lifting pins 23 are provided. The number is determined according to various conditions such as the size of the glass substrate 26 to be supported and the number of lift pin mechanisms 21 installed. The number of eccentric cams 36 is adjusted according to the number of lifting pins 23.

In each of the above embodiments, the force using a thin pin with a sharp tip as the lift pin 23 The shape of the lift pin 23 is not limited to the thin pin with a sharp tip, and is moved up and down by the lift pin unit 22 Any existing pin that can be used can be used.

[0083] In the first embodiment, a rotating cam may be used as a means for raising and lowering the elevating pin 23, and in the third embodiment, another cam mechanism such as a force end face cam using a linear motion cam may be used. Needless to say. If the cam mechanism is configured to be able to move the elevating pin 23 up and down, the same operations and effects as the above embodiments can be achieved.

[0084] In the case of an end face cam, each lifting pin 23 is arranged along a circle that is not arranged in series, as in the above-described embodiments.

[0085] In the first embodiment, other shapes such as a force ellipse in which the outer peripheral cam surface of the eccentric cam 36 is circular may be used! /, Needless to say! /. By appropriately adjusting the shape of the eccentric cam 36, the amount of movement and movement of the elevating pin 23 up and down, the contact time with the glass substrate 26, etc. are appropriately set.

[0086] In the first embodiment, the four lifting pins 23 are provided with the force S that is brought into contact with and supported by the back surface of the glass substrate 26 one by one from one end thereof. 2 or more of May be moved up and down simultaneously and sequentially. Further, the force of raising and lowering the four raising / lowering pins 23 in order from one end thereof may be varied. For example, you can move up and down in other order, such as first, fourth, second, third in order, etc.! / ヽThe time during which the elevating pin 23 is in contact with the back surface of the glass substrate 26 can be easily set by changing the shape of the eccentric cam 36.

In each of the above embodiments, the lifting pin 23 may be moved up and down using a force electromagnetic solenoid in which the lifting pin 23 is moved up and down using the cam mechanism 30. Specifically, the lifting pin unit is provided at a plurality of lifting pins 23 supported so as to be movable up and down, and at the base end of each lifting pin 23, and each lifting pin 23 is lifted and lowered individually. An electromagnetic solenoid (not shown) that moves one or more of 23 at the same time and in order, and a drive unit (not shown) that drives the electromagnetic solenoid may be provided. Good! The drive unit includes a control unit that individually controls power supplied to the electromagnetic solenoid. This control unit may control the electromagnetic solenoids of one set (four) of the lift pins 23 or may control all the electromagnetic solenoids disposed in the entire lower area of the glass substrate 26. In this case, heat insulation is applied so that the electromagnetic solenoid is not affected by heat. In addition, when electromagnetic solenoids are used for processing with the purpose of eliminating the adverse effects of other factors such as static electricity (processing without heat), they can be used as they are.

As a result, each electromagnetic solenoid can be easily and individually controlled by the control unit, so that one of the lifting pins 23 is moved up and down one by one. However, it is also possible to easily carry out a mode in which two or more are moved up and down at the same time. Further, the time during which the elevating pins 23 are in contact with the back surface of the glass substrate 26 and the order in which the elevating pins 23 are raised and lowered can be easily set.

In the first embodiment, the control unit 40 can set the rotational speed of the eccentric cam 36 from 0.2 second / time to several seconds / time. Generally, the camshaft It is desirable that the rotation speed of 35 is as high as possible so that the contact time of one lifting pin 23 with the glass substrate 26 is shortened. For this reason, it is desirable to increase the number of lifting pins 23 while increasing the rotation of the camshaft 35.

[0090] In the above-described embodiment, the force S formed by using the perfect rotating plate for the eccentric cam 36 is limited to the perfect circle. Other shapes may be used. For example, as shown in FIG. 13, the eccentric cam 70 may be configured to include a circular arc portion 71 concentric with the rotation center in a part of the outer peripheral shape thereof. Further, the arc portion 71 is set so as to partially overlap the adjacent eccentric cams 70.

Thus, when the eccentric cam 70 is rotated, the elevating pins 23 are moved up and down along the outer peripheral shape of the eccentric cam 70. Specifically, the elevating pin 23 rises due to the rotation of the eccentric cam 70, stops at the upper end position at the arc portion 71, and descends after passing the arc portion 71.

[0092] When the four eccentric cams 70 are rotated by the connecting shaft 31, one of the two adjacent lifting pins 23 is raised by the preceding eccentric cam 70 and stops at the upper end position of the arc portion 71, and the arc portion Descent after 71. Immediately before this descent, the other force S of the adjacent two lifting pins 23 is raised by the following eccentric cam 70, and the two lifting pins 23 are simultaneously moved to the upper end at the part where the eccentric cam 70 partially overlaps. The glass substrate 26 is supported by moving up to the position. Immediately after this, one raising / lowering pin 23 descends, the other raising / lowering pin 23 stops at the upper end position, and descends after passing the arc portion 71.

[0093] This is done in cooperation with the four lift pins 23 adjacent to each other. In the case of the lift pin 23 at the end, the lift pin 23 at one end and the lift pin 23 at the other end cooperate with each other. As a result, one of the two adjacent lift pins 23 always supports the glass substrate 26. As a result, any one of the plurality of lifting pins 23 always comes into contact with the glass substrate 26, and the glass substrate 26 can be stably supported.

[0094] In the above embodiment, the linear cam 62 is formed in a mountain shape and its apex is provided, and the elevating pin 23 rises before this apex and descends after the apex is flattened. You may do it. Specifically, as shown in FIG. 14, the linear cam 72 has a flat surface portion 73 formed at the apex portion of the mountain shape.

[0095] Furthermore, the flat surface portion 73 is set to a length that can simultaneously contact the roller portions 66 of at least two adjacent lifting pins 23 among the plurality of lifting pins 23 arranged. You may set to the length which the roller part 66 of three or more raising / lowering pins 23 can contact simultaneously.

Thus, when the linear cam 72 is moved, each lifting pin 23 is moved up and down by the linear cam 72 and stops at the upper end position at the flat surface portion 73 to support the glass substrate 26. Each elevating pin 23 descends again after passing the flat surface portion 73. At this time, the roller portions 66 of the two adjacent lift pins 23 simultaneously become upper end positions near both ends of the flat surface portion 73, and the two lift pins 23 At the same time, the glass substrate 26 is supported. Immediately after this, one raising / lowering pin 23 descends, the other raising / lowering pin 23 stops at the upper end position, and descends after passing the flat surface portion 73.

[0097] This is done in cooperation with the four lifting pins 23 adjacent to each other. As a result, one of the two adjacent lift pins 23 always supports the glass substrate 26. As a result, any one of the plurality of lifting pins 23 always comes into contact with the glass substrate 26, and the glass substrate 26 can be stably supported.

In this case as well, the same operations and effects as in the above embodiment can be achieved.

In the above embodiment, processing in vacuum is not considered, but the present invention can also be applied to processing in vacuum. Specifically, as shown in FIG. 15, O-rings 75 are respectively attached to the upper and lower ends of the hole through which the shaft portion 27 of the elevating pin 23 of the hot plate 43 passes.

The O-ring 75 is fixed with existing technology such as a ring grooved washer. The O-ring 75 is made of an annular seal material that can be inserted into the hole of the hot plate 43. The hole of the hot plate 43 is sealed by the O-ring 75 and the shaft portion 27 of the lifting pin 23 is passed through the central hole of the O-ring 75.

[0100] On the upper side of the hot plate 43, a side wall 76 is provided in a body-like manner, and is attached to the upper end of the side wall 76 with a top plate 77. The side wall 76 and the top plate 77 are sealed with an O-ring 78. Thus, a vacuum chamber 79 is formed by the hot plate 43, the side wall portion 76, and the top plate 77. Processing such as vacuum baking and vacuum drying is performed in the vacuum chamber 79.

[0101] In this case as well, the same operations and effects as in the above embodiment can be achieved.

In the above-described embodiment, the case where the lift pin mechanism 21 is provided alone has been described as an example. However, the lift bin mechanism 21 and the existing feeding unit may be combined. The glass substrate 26 is lifted by existing feeding means and moved by, for example, lmm. Then, the glass substrates 26 are alternately supported by the four lifting pins 23 of the lift pin mechanism 21. As a result, the number of contact of the lift pins 23 contacting the back surface of the glass substrate 26 with the same location can be reduced, and damage to the back surface of the glass substrate 26 due to the contact of the lift pins 23 can be greatly reduced.

[0103] In particular, when the feeding means and the lift pin mechanism 21 are operated alternately, each lifting pin 23 does not come into contact with the same place on the back surface of the glass substrate 26 twice. Damage to the back of the substrate 26 can be minimized.

Further, when the glass substrate 26 is moved, it may be reciprocated by changing the moving pitch. For example, it may be moved to one side with a lmm pitch by the feeding means and then moved to the other side with a pitch of 0.8mm. Further, as the direction in which the glass substrate 26 is moved by the feeding means, the glass substrate 26 may be moved by appropriately combining not only the front-rear direction but also the left-right direction.

Claims

The scope of the claims

[1] A lift pin mechanism having a lift pin that supports a substrate to be processed from below and supports it.

A plurality of the lifting pins are taken as a set, and one or more of the lifting pins are moved up and down simultaneously and sequentially so that the upper end of each lifting pin contacts the lower surface of the substrate to be processed. Elevating pin unit to support

A lift pin mechanism in which a plurality of the lift pin units are arranged below the substrate to be processed.

[2] In the lift pin mechanism according to claim 1,! /,

The elevating pin unit includes a plurality of elevating pins supported so as to be movable up and down, elevating means for elevating one or more of the elevating pins one by one or two simultaneously and sequentially, and driving the elevating means A lift pin mechanism comprising a drive unit.

[3] In the lift pin mechanism according to claim 2,

The elevating means includes a force mechanism that raises and lowers the elevating pin by contacting the lower end of the elevating pin;

A lift pin mechanism characterized in that the drive unit is configured to include a drive motor for driving the cam mechanism.

[4] In the lift pin mechanism according to claim 3,

A lift pin mechanism characterized in that a cam mechanism force of the elevating means is connected in a number corresponding to the size of the substrate to be processed and arranged in parallel in a number corresponding to the size of the substrate to be processed.

[5] The lift pin mechanism according to claim 3,

A cam mechanism of the elevating means includes a rotating plate-shaped eccentric cam;

A lift pin mechanism, wherein the eccentric cam has an arc portion concentric with a rotation center in a part of the outer peripheral shape thereof.

[6] In the lift pin mechanism according to claim 5,

A lift bin mechanism in which the arc portion of the eccentric cam partially overlaps between adjacent eccentric cams.

[7] In the lift pin mechanism according to claim 3,

A cam mechanism of the elevating means includes a linear cam;

The linear motion cam has a flat surface portion at the apex portion of the mountain shape.

[8] In the lift pin mechanism according to claim 7,

A lift pin mechanism characterized in that a flat surface portion of the linear cam is set to a length capable of simultaneously contacting at least two adjacent lift pins among a plurality of lift pins arranged.

[9] In the lift pin mechanism according to claim 2,! /,

A lift pin mechanism characterized in that the drive unit includes a control unit for adjusting a speed of driving the elevating means.

[10] In the lift pin mechanism according to claim 2,

The elevating means is provided at the base end of each elevating pin and elevates each elevating pin individually, and moves up or down one or more of the elevating pins simultaneously and sequentially. Configured with electromagnetic solenoid,

A lift pin mechanism characterized in that the drive unit includes a control unit that individually controls electric power supplied to each electromagnetic solenoid.

[11] The lift pin mechanism according to claim 1,

A lift pin mechanism characterized in that the elevating pin includes a thermal expansion absorbing means for absorbing a shift caused by thermal expansion.

[12] In the lift pin mechanism according to claim 11, the! /,

The thermal expansion absorbing means electromagnetically couples the contact surfaces of each other with a flat surface, and temporarily releases the coupling in accordance with the thermal expansion and shifts the contact surfaces of each other to expand the thermal expansion. A lift pin mechanism characterized by comprising an electromagnet that absorbs misalignment associated with.

[13] In the lift pin mechanism according to claim 11,! /

The thermal expansion absorbing means electromagnetically couples the contact surfaces of each other as a flat surface, with one of the N poles and the other as the S poles. A lift pin mechanism characterized by comprising permanent magnets or electromagnets that absorb each other's misalignment.