JP2000018207A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device and method capable of keeping moving speed of a piston always constant even if air master pressure or slide resistance between a piston and an air cylinder fluctuated. SOLUTION: DSC1 and DSC2 are disposed respectively on the supply side passage and the discharge side passage of an air cylinder 84. Moving speed of a piston 85 is detected by sensors S1, S2 disposed on the side surface of the air cylinder 84, magnetic markers M1, M2 attached to the piston 85, and a controller. Depending on the moving speed of the piston 85 detected, applied voltage to DSC1 and DSC2 are adjusted for controlling the moving speed of the piston 85 in real time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
In the CD substrate manufacturing process, a resist liquid is applied to a substrate to be processed such as a semiconductor wafer or an LCD glass substrate,
The present invention relates to a processing apparatus such as a heat treatment apparatus that heats a substrate to be processed after application.

[0002]

2. Description of the Related Art Conventionally, as a heat treatment apparatus, a semiconductor wafer (hereinafter simply referred to as "wafer") is placed on a hot plate heated by energizing a built-in heater and brought into contact with the surface of the hot plate. Heating structures are widely used.

FIG. 14 is a vertical sectional view of a typical heat treatment apparatus.

In this heat treatment apparatus, a plurality of through-holes 201 penetrating vertically are provided near the center of a hot platen 200 having a built-in heater.
02 is moved up and down so that the pins 202 come and go from the surface of the hot platen 200. In order to heat-treat the wafer W with the hot platen 200, the pins 202 projecting from the main arm (not shown) onto the surface of the hot platen 200.
The wafer W is placed on top of the
2 is stored in the lower part of FIG.
The wafer W is brought into contact with the upper surface of the wafer W and heat-treated by heat from the hot platen 200.

In the conventional heat treatment apparatus, the pin is fixed to a piston of an air cylinder driven by pressurized air, and moves up and down in conjunction with the movement of the piston which moves up and down by the force of air supplied to the air cylinder. It has a moving structure.

[0006]

However, in the piston of the air cylinder, the original pressure of the air supplied to the air cylinder fluctuates, dust adheres to the air flow path, and the air hardly flows. In some cases, dust may adhere to the sliding portion between the piston and the inner surface of the air cylinder, or the sliding resistance may increase due to insufficient lubricating oil in such a portion. In such a case, the moving speed of the piston changes. . When the moving speed of the piston changes, the moving speed of the pins decreases, so that the time during which the wafer W mounted on the pins is exposed to the heat of the hot plate fluctuates. Since the fluctuation of the time of exposure to heat directly leads to the fluctuation of the heat history of the wafer W,
There is a problem in that the heat treatment of the wafer W becomes non-uniform, which causes a decrease in yield and a rise in manufacturing cost of semiconductor products.

Therefore, as a device for adjusting the moving speed of the piston, a device for adjusting the moving speed of the piston, which is conventionally called a speed controller, is attached. This speed controller employs a mechanism that adjusts the flow rate of air by adjusting the protrusion amount of a needle that protrudes into the air flow path to change the cross-sectional area of the flow path, thereby adjusting the movement speed of the piston. This speed controller is a fixed type, and if the source pressure of air fluctuates after manual adjustment or the sliding resistance between the piston and the air cylinder changes, it must be adjusted each time. Cannot always keep the moving speed constant.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is intended to keep the moving speed of the piston constant even when the source pressure of air or the sliding resistance between the piston and the air cylinder fluctuates. It is an object of the present invention to provide a processing apparatus and a processing method that can perform the processing.

[0009]

According to a first aspect of the present invention, there is provided a processing apparatus comprising: a piston for driving a system to be processed; an air cylinder for accommodating the piston in a reciprocating manner; Means for detecting a moving speed of the piston, and means for controlling a flow rate of air discharged from the air cylinder based on the detected moving speed of the piston are provided.

According to a second aspect of the present invention, there is provided a processing apparatus according to the present invention, wherein a piston for driving a system to be processed, an air cylinder for accommodating the piston in a reciprocating manner, and an air supply path to the air cylinder for opening and closing. A second valve for opening and closing an air exhaust path from the air cylinder, a means for detecting a moving speed of the piston, and controlling the second valve based on a moving speed of a retraction operation of the piston. Means for performing the operation. The processing apparatus according to the third aspect of the present invention includes a piston that drives the processing target system, an air cylinder that accommodates the piston in a reciprocating manner, and a first valve that opens and closes an air supply path to the air cylinder. A second valve for opening and closing an air exhaust passage from the air cylinder;
Means for detecting the moving speed of the piston, and means for controlling the first valve based on the moving speed of the pushing operation of the piston are provided. The processing apparatus of the present invention according to claim 4, wherein a piston for driving the system to be processed, an air cylinder for accommodating the piston in a reciprocating manner, and a first valve for opening and closing an air supply path to the air cylinder. ,
A second valve for opening and closing an air exhaust path from the air cylinder, a unit for detecting a moving speed of the piston, and controlling the first valve based on a moving speed of a pushing operation of the piston, and controlling the piston. Means for controlling the second valve based on the moving speed of the retraction operation,
Is provided.

A processing apparatus according to a fifth aspect of the present invention is the processing apparatus according to any one of the first to fourth aspects, wherein at least one of the first valve and the second valve is a piezo valve. There is a feature.

A processing apparatus according to a sixth aspect of the present invention is the processing apparatus according to any one of the first to fifth aspects, wherein the controlling means is a digital speed controller.

According to a seventh aspect of the present invention, there is provided a heat treatment apparatus, wherein a piston for bringing a substrate to be processed into and out of contact with a heat treatment plate, an air cylinder accommodating the piston in a reciprocating manner, and means for detecting a moving speed of the piston. And means for controlling the flow rate of air discharged from the air cylinder based on the detected moving speed of the piston.

According to another aspect of the present invention, there is provided a heat treatment apparatus, comprising: a piston for bringing a substrate to be processed into and out of contact with a heat treatment plate; an air cylinder for movably housing the piston; A first valve, a second valve for opening and closing an air exhaust path from the air cylinder, a means for detecting a moving speed of the piston, and the second valve based on a moving speed of a retraction operation of the piston. Means for controlling the valve.

According to a ninth aspect of the present invention, there is provided a heat treatment apparatus according to the present invention, wherein a piston for bringing a substrate to be processed into and out of contact with a heat treatment plate, an air cylinder for movably accommodating the piston, and an air supply passage to the air cylinder are opened and closed. A first valve, a second valve for opening and closing an air exhaust passage from the air cylinder, a means for detecting a moving speed of the piston, and the first valve based on a moving speed of a pushing operation of the piston. Means for controlling the valve.

According to a tenth aspect of the present invention, there is provided a heat treatment apparatus comprising:
A piston for bringing the substrate to be processed into and out of contact with the heat-treated plate, an air cylinder for movably accommodating the piston, a first valve for opening and closing an air supply passage to the air cylinder, and an air exhaust passage from the air cylinder A second valve for opening and closing, a means for detecting the moving speed of the piston, and controlling the first valve based on the moving speed of the pushing operation of the piston and based on the moving speed of the retracting operation of the piston. Means for controlling the second valve.

According to the first aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using a means for detecting the moving speed of the piston, and the piston is discharged from the air cylinder based on the detected moving speed of the piston. The movement speed of the piston is controlled in real time by increasing or decreasing the flow rate of the supplied air, so the movement speed of the piston is always kept constant even if the source pressure of air or the sliding resistance between the piston and the air cylinder fluctuates. Can be kept.

According to a second aspect of the present invention, the moving speed of the retraction operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the detected moving speed of the retraction operation of the piston is detected. The moving speed of the retraction operation of the piston is controlled in real time by controlling the second valve based on the flow rate of the air exhausted from the air cylinder, thereby controlling the original pressure of the air and the piston and the air cylinder. Even if the sliding resistance of the piston fluctuates, the moving speed of the retraction operation of the piston can be always kept constant.

According to a third aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using a means for detecting the moving speed of the piston, and the detected moving speed of the pushing operation of the piston is detected. Since the moving speed of the piston pushing operation is controlled in real time by controlling the first valve based on the flow rate of the air supplied to the air cylinder, the original pressure of the air and the piston and the air cylinder are controlled. Even if the sliding resistance of the piston fluctuates, the moving speed of the pushing operation of the piston can always be kept constant.

According to a fourth aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the moving speed of the retracting operation is detected. Controlling the first valve based on the moving speed of the air to increase or decrease the flow rate of the air supplied to the air cylinder, thereby controlling the moving speed of the pushing operation of the piston in real time, while the detected retraction of the piston is performed. By controlling the second valve based on the movement speed of the operation to increase or decrease the flow rate of the air exhausted from the air cylinder, the movement speed of the retraction operation of the piston is controlled in real time. Even if the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the piston pushing operation and the moving speed of the retracting operation should always be kept constant. Can.

According to a fifth aspect of the present invention, in the processing apparatus according to any one of the first to fourth aspects, at least one of the first valve and the second valve has a high response speed to an applied voltage. Since the piezo valve capable of accurately controlling the flow rate is employed, the effect of the invention of claims 1 to 4, which is the effect of always keeping the moving speed of the piston constant, can be further ensured. it can.

According to a sixth aspect of the present invention, in the processing apparatus according to any one of the first to fifth aspects, a digital speed controller that can be controlled by a numerical value is used as the controlling device. According to the fifth to fifth aspects, the effect of always keeping the moving speed of the piston constant can be further ensured.

In the heat treatment apparatus of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the piston is discharged from the air cylinder based on the detected moving speed of the piston. The movement speed of the piston is controlled in real time by increasing or decreasing the flow rate of the supplied air, so the movement speed of the piston is always kept constant even if the source pressure of air or the sliding resistance between the piston and the air cylinder fluctuates. Therefore, uniform heat treatment can be performed on the substrate to be processed.

In the heat treatment apparatus of the present invention, the moving speed of the retraction operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the detected moving speed of the retraction operation of the piston is detected. The moving speed of the retraction operation of the piston is controlled in real time by controlling the second valve based on the flow rate of the air exhausted from the air cylinder, thereby controlling the original pressure of the air and the piston and the air cylinder. Even if the sliding resistance of the piston fluctuates, the moving speed of the retraction operation of the piston can always be kept constant, whereby a uniform heat treatment can be performed on the substrate to be processed.

In the heat treatment apparatus of the ninth aspect, the moving speed of the pushing operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the moving speed of the pushing operation of the piston is detected. Since the moving speed of the piston pushing operation is controlled in real time by controlling the first valve based on the flow rate of the air supplied to the air cylinder, the original pressure of the air and the piston and the air cylinder are controlled. Even if the sliding resistance of the piston fluctuates, the moving speed of the pushing operation of the piston can always be kept constant, whereby a uniform heat treatment can be performed on the substrate to be processed.

In the heat treatment apparatus of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the moving speed of the retracting operation is detected. Controlling the first valve based on the moving speed of the air to increase or decrease the flow rate of the air supplied to the air cylinder, thereby controlling the moving speed of the pushing operation of the piston in real time, while the detected retraction of the piston is performed. By controlling the second valve based on the movement speed of the operation to increase or decrease the flow rate of the air exhausted from the air cylinder, the movement speed of the retraction operation of the piston is controlled in real time. Even when the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the piston pushing operation and the moving speed of the retracting operation are always kept constant. It can, thus, can be subjected to uniform heat treatment on the target substrate.

[0027]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a semiconductor wafer provided with a resist coating unit (COT) according to an embodiment of the present invention (hereinafter referred to as a “COT”).
FIG. 1 is a plan view showing the entire coating and developing processing system 1 of “wafer”).

In the coating and developing system 1, a plurality of wafers W as objects to be processed are loaded into and unloaded from the system in units of, for example, 25 wafer cassettes CR. A cassette station 10 for loading and unloading, a processing station 11 in which various single-wafer processing units for performing predetermined processing on the wafers W one by one in a coating and developing process are arranged at predetermined positions in multiple stages, and An interface unit 12 for transferring a wafer W to and from an exposure apparatus (not shown) provided adjacent to the processing station 11 is integrally connected. In this cassette station 10,
At the position of the positioning projection 20a on the cassette mounting table 20,
A plurality of, for example, up to four wafer cassettes CR are placed in a line in the X direction (vertical direction in FIG. 1) with their respective wafer entrances facing the processing station 11 side. The wafer carrier 21 that can move in the wafer arrangement direction (Z direction; vertical direction) of the wafers W stored in the wafer CR selectively accesses each wafer cassette CR.

The wafer transfer body 21 is rotatable in the θ direction, and a third
Access to the processing unit group G ₃ of the multi-stage unit section disposed in the alignment unit (ALIM) and an extension unit (EXT).

The processing station 11 is provided with a vertical transfer type main wafer transfer mechanism 22 having a wafer transfer device, around which all the processing units are arranged in one or more sets in multiple stages. ing.

FIG. 2 is a front view of the coating and developing system 1.

[0033] In the first processing unit group G _1, the cup C
Two spinner type processing units, for example, a resist coating unit (COT) and a developing unit (DEV), which perform a predetermined process by placing the wafer W on the spin chuck in the P, are stacked in two stages from the bottom. In the second processing unit group G _2, two spinner-type processing units, for example, the resist coating unit (COT) and a developing unit (D
EV) are stacked in two stages in order from the bottom. These resist coating units (COT) are preferably arranged in the lower stage as described above because drainage of the resist solution is troublesome both mechanically and in terms of maintenance. However, it is of course possible to appropriately arrange the upper stage as needed.

FIG. 3 is a rear view of the coating and developing system 1.

In the main wafer transfer mechanism 22, the cylindrical support 4
9, the wafer transfer device 46 is moved vertically (in the Z direction).
It can be moved up and down freely. The cylindrical support 49 is connected to a rotation shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 46 about the rotation shaft by the rotation driving force of the motor, whereby the wafer transfer is performed. The device 46 is rotatable in the θ direction. Note that the cylindrical support 49 may be configured to be connected to another rotating shaft (not shown) rotated by the motor. The wafer transfer device 46 is provided with a plurality of holding members 48 movable in the front-rear direction of the transfer base 47, and these holding members 48 enable the transfer of the wafer W between the processing units. ing.

Further, as shown in FIG. 1, in this coating and developing processing system 1, five processing unit groups G ₁ , G ₂ , G
₃ , G ₄ , G ₅ can be arranged, and the multi-stage units of the first and second processing unit groups G ₁ , G ₂ are arranged on the system front (front side in FIG. 1) side, and the third processing unit multistage unit group G ₃ are cassette station 10
, And the multi-stage unit of the _fourth processing unit group G ₄ is disposed adjacent to the interface unit 12,
Multistage unit of the fifth processing unit group G ₅ is capable of being disposed on the rear side.

As shown in FIG. 3, in the third processing unit group G ₃ , an oven-type processing unit for performing a predetermined process by placing the wafer W on a holding table (not shown), for example, a cooling system for performing a cooling process Unit (COL), adhesion unit (AD) for performing so-called hydrophobic treatment for improving the fixability of resist, alignment unit (ALIM) for positioning, extension unit (EXT), heat treatment before exposure processing Prebaking unit (PREBAKE) for performing heat treatment and postbaking unit (POBAKE) for performing heat treatment after exposure processing
Are, for example, stacked in eight stages from the bottom. Even the fourth processing unit group G _4, oven-type processing units, for example, a cooling unit (COL), an extension and cooling unit (EXTCOL), extension unit (EXT), a cooling unit Bok (CO
L), a pre-baking unit (PREBAKE) and a post-baking unit (POBAKE) are stacked in order from the bottom, for example, in eight stages.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the pre-baking unit (PREBAKE), the post-baking unit (POBAKE) and the ad-housing unit having a high processing temperature are arranged. By arranging the John units (AD) in the upper stage, thermal mutual interference between the units can be reduced. Of course, a random multi-stage arrangement may be used.

As shown in FIG. 1, the interface unit 12
In the depth direction (X direction), the processing station 11
But has a smaller size in the width direction (Y direction). A portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages at the front of the interface unit 12, while a peripheral exposure device 23 is arranged at the rear, and a central exposure unit is further arranged at the center. Is provided with a wafer carrier 24. This wafer carrier 24
Moves in the X and Z directions to access both cassettes CR and BR and the peripheral exposure device 23.

The wafer transfer body 24 is also rotatable in the θ direction, and includes an extension unit (EXT) provided in the multi-stage unit of the fourth processing unit group G ₄ on the processing station 11 side and an adjacent exposure unit. The wafer delivery table (not shown) on the apparatus side can also be accessed.

In the coating and developing system 1, the multi-stage unit of the _fifth processing unit group G5 shown by the broken line in FIG. 1 can be arranged on the back side of the main wafer transfer mechanism 22 as described above. The multi-stage unit of the _fifth processing unit group G ₅ is movable in the Y direction along the guide rail 25.
Therefore, even when provided as a multi-stage unit of the fifth processing unit group G ₅ shown, by moving along the guide rail 25, the space portion can be secured, to the main wafer transfer mechanism 22 Maintenance work can be easily performed from behind.

Next, referring to FIGS. 4 and 5, the baking unit (PREBA) included in the multistage unit of the third and fourth sets G ₃ and G _{4 at} the processing station 11 will be described.
KE), (POBAKE), cooling unit (CO
L) and the configuration and operation of the heat treatment unit such as (EXTCOL) will be described.

FIGS. 4 and 5 are a plan view and a vertical sectional view showing the structure of the heat treatment unit U according to this embodiment. In FIG. 5, the horizontal shielding plate 55 is omitted for illustration.

The processing chamber 50 of the heat treatment unit U is formed by both side walls 53 and a horizontal shielding plate 55, and the front side (main wafer transfer mechanism 24 side) and the rear side of the processing chamber 50 have openings 50A and 50B, respectively. Has become. A circular opening 56 is formed in the center of the shielding plate 55, and a disk-shaped hot plate 58 having a built-in pipe (not shown) for passing a heat medium is provided in the opening 56 as a mounting table SP. .

For example, three through-holes 60 are provided in the hot platen 58, and support pins 62 are inserted in the through-holes 60 in a loosely fitted state. 62 projects or rises above the surface of the hot platen 58 and transfers the wafer W to and from the holding member 48 of the main wafer transfer mechanism 22.

On the outer periphery of the hot platen 58, there is provided a shutter 66 made of a ring-shaped band plate having a large number of ventilation holes 64 formed at intervals of, for example, 2 ° in the circumferential direction. The shutter 66 is normally retracted to a position below the hot platen 58, but rises to a position higher than the upper surface of the hot platen 58 as shown in FIG. A ring-shaped side wall is formed between the air passage 68 and the downstream side 68 so that the down-flow clean air flowing in from the front side of the apparatus flows uniformly in the circumferential direction from the vent hole 64.

An exhaust port 6 for discharging gas generated from the surface of the wafer W during the heating process is provided at the center of the cover 68.
8a is provided, and an exhaust pipe 70 is connected to the exhaust port 68a. The exhaust pipe 70 communicates with a duct 53 (or 54) on the front side of the apparatus (on the main wafer transfer mechanism 22 side) or a duct (not shown).

Under the shielding plate 55, a machine room 74 is formed by the shielding plate 55, both side walls 53 and the bottom plate 72. In the room of the opportunity room 74, a hot plate support plate 76, a shutter arm 78, a support pin arm 80) A shutter arm lifting / lowering driving air cylinder 82 and a support pin arm lifting / lowering driving air cylinder 84 are provided.

As shown in FIG. 5, a plurality of, for example, 4
A plurality of wafer guide support projections 86 are provided.

FIG. 6 is a vertical sectional view showing a schematic configuration of the support pin elevating mechanism of the heat treatment unit according to the present embodiment.

As shown in FIG. 6, a piston 85 directly connected to the support pin arm 80 is provided with an air cylinder 84 for driving the support pin arm up and down (hereinafter simply referred to as “air cylinder”).
It is mounted to be able to move up and down inside. An opening 88 is provided in an upper portion of the air cylinder 84, and a digital speed controller (hereinafter, referred to as “DS”) will be described later.
C ". ) DSC1 is connected.

On the other hand, an air supply port 86 is provided below the air cylinder 84, and a digital speed controller DSC2 having the same structure as the DSC1 is connected to the air supply port 86. One opening of the DSC 2 is connected to an air compressor 91 via a pipe 90a, an air operation type switching valve 89, and a pipe 90b. The switching valve 89 selectively connects or disconnects the pipe 90a with the pipe 90b or releases the pipe 90a to the atmosphere. This switching is performed by switching the air from the pump 92 to a regulator (REG) 1.
The switching element 89a in the main body of the switching valve 89 controlled by 1
Is moved vertically in the figure.

An air compressor 91 is further connected to the upstream side of the air operation valve 89 via a pipe 90b, and the air sent from the air compressor 91 passes through the pipes 90b and 90a to the lower side of the piston 85 of the air cylinder 84. The supply of the air is performed by opening and closing the communication between the pipes 90a and 90b by the switching valve 89.

The switching valve 89 is an air-driven valve driven by air supplied from a pump 92 via pipes 90c and 90d, and is driven by a command signal from a control device 110 as described later.

In the middle of a piston 85 reciprocating vertically in the air cylinder 84, two magnets M1, M
2 are installed. On the other hand, magnet sensors S1 and S2 for detecting magnetic lines of force emitted from the magnets are attached to the side surfaces of the air cylinder 84, and the magnetic lines of force of the magnets M1 and M2 attached to the piston 85 are detected. The moving speed is detected.

One digital speed controller DSC1 and one digital speed controller DSC2 are connected to the opening 88 at the upper part of the air cylinder 84 and the air supply port 86 at the lower part, respectively.

These DSCs are a type of piezo valve. An amplifier (not shown) numerically controlled by using a piezo element which is deformed by changing an applied voltage for a valve element for opening and closing an air flow path. The flow rate of air can be adjusted with high accuracy by accurately controlling the applied voltage via the control unit.

FIG. 7 is a vertical sectional view showing a schematic structure of this DSC.

As shown in FIG. 7, the main body 9 of this DSC
4 are provided with flow paths 95 and 96 which are orthogonal to each other and communicate with each other. A valve element 97 made of a piezo element is provided at a portion where these two flow paths 95 and 96 communicate, and a position facing the valve element 97. And a ring-shaped seal member 104. The valve body 97 has a cylindrical shape and is arranged so as to be deformed in the vertical direction in the figure. An electrode 98 is provided on the upper end of the valve body 97, and this electrode 98 is connected to a wiring 99.
Through the terminal 100. On the other hand, the valve body 97
The electrode 101 is also provided on the lower side of the electrode 101, and the electrode 101 is connected to the terminal 103 via the wiring 102. Therefore, when a predetermined voltage is applied between the terminal 100 and the terminal 103, the valve element 97 made of a piezo element is applied in accordance with the applied voltage.
Extend vertically in the figure. A ring-shaped seal member 104 having an outer diameter substantially equal to the radius of the bottom surface of the valve body 97 is provided at a position facing the bottom surface of the valve body 97.

When the valve member 97 is extended in the vertical direction in the drawing to close the communication between the flow path 95 and the flow path 96, the sealing member 104 functions to completely equalize the closing. , Made of an elastic material such as silicone rubber. Before the voltage is applied to the valve body 97, the valve body 97 is disposed with a predetermined gap between the valve body 97 and the bottom surface.

Hereinafter, the operation of the DSC will be described.

Before a voltage is applied to the valve body 97 via the terminals 100 and 103, a predetermined gap is formed between the bottom surface of the valve body 97 and the upper surface of the seal member 104. The flow path 96 communicates with the flow path 95 through the flow path, and air flows from the flow path 96 to the flow path 95 or in the opposite direction.

Next, when a voltage is applied to the valve element 97, the valve element 9
Numeral 7 extends in the vertical direction in the figure to reduce the gap between the bottom surface of the valve body 97 and the top surface of the seal member 104, so that the air flowing between the flow path 96 and the flow path 95 becomes difficult to flow, and The flow rate of the flowing air decreases. If the applied voltage is further increased, the gap becomes smaller and the flow rate decreases, and by setting the applied voltage to a predetermined value or more, the flow path 95 and the flow path 96 are completely closed. Conversely, by decreasing the applied voltage, the degree of extension of the valve body 97 in the vertical direction is reduced, and the valve body 97
Since the gap between the bottom surface and the upper surface of the seal member 104 is increased, the air flowing between the flow path 96 and the flow path 95 becomes easier to flow, and the flow rate of the air flowing per unit time increases. In this way, the DSC 93 not only opens and closes the upstream flow path and the downstream flow path by changing the applied voltage, but also operates the working fluid such as air flowing from the upstream flow path to the downstream flow path. Can be controlled accurately and with little delay.

FIG. 8 is a block diagram showing the electrical connection of the heat treatment unit according to this embodiment.

As shown in FIG. 8, the control device 110
Is connected to a regulator 111 that drives a switching valve 89 that opens and closes a flow path on the air supply side of the air cylinder 84. By sending a signal to the regulator 111, the piston 85 of the air cylinder 84 is pushed out, that is, in a vertical direction. It controls the timing of upward drive.

The control device 110 controls the air cylinder 84
Sensors S1, S arranged vertically on the side surface of
2 and DSC1 and DSC2 for opening and closing the flow path on the air exhaust side of the air cylinder 84 and finely adjusting the flow rate per unit time, respectively.
DS based on the moving speed of the piston 85 detected in S2
By changing the voltage sent to C1 and DSC2, the piston 85 is always moved up and down at a constant speed.

That is, the sensors S1 and S2 are arranged at a known distance on the side surface of the air cylinder 84, and the markers M1 and M2 attached at predetermined positions of the piston 85 pass through the sensor S1. After that, the time from when it passes through the sensor S2 is obtained, and the moving speed of the piston 85 is calculated from these data. The moving speed of the piston 85 thus determined is compared with a preset target value. If the difference is within the allowable range, the operation of the apparatus is continued without activating DSC1 or DSC2, and the difference is determined to be within the allowable range. If it is outside, the DSC1 or DSC2 is operated to adjust the flow rate on the exhaust side of the air cylinder 84. With respect to the adjustment ratio, a flow rate adjustment value on the exhaust side is obtained in advance corresponding to each difference value, and this is stored in the storage unit of the control device as a time table.

Therefore, when the moving speed of the piston 85 is out of the allowable range of the target value, the difference from the target value is obtained, and the adjustment value corresponding to the difference is grasped from the time table, and the DSC1 or DSC2 is obtained. To operate the air cylinder 8
The width of the flow path is adjusted so that the flow rate on the exhaust side of 4 becomes a target value.

That is, when the rising speed of the piston 85 is too fast, the DSC 1 is operated to reduce the exhaust speed of the air, thereby reducing the rising speed of the piston 85.
On the other hand, if the descending speed of the piston 85 is too fast, DS
The lowering speed of the piston 85 is reduced by operating C2 to reduce the exhaust speed of the air.

Next, the operation when using the heat treatment unit U as a baking unit (PREBAKE) will be described below.

First, a wafer W is taken out from the wafer cassette CR set on the mounting table 20 by the wafer carrier 21, and then the wafer W is delivered from the wafer carrier 21 to the main wafer carrier 22. The main wafer transfer mechanism 22 transfers the received wafer W to a resist coating unit (C
The wafer W is transferred and set in the OT), and the resist is applied to the wafer W here. Next, the main wafer transfer mechanism 22 takes out the wafer W from the inside of the resist coating unit (COT), transfers the wafer W to the inside of the heat treatment unit U, and sets the wafer W on the hot platen 58.

FIG. 9 is a vertical sectional view showing a state where the main wafer transfer mechanism 22 on which the wafer W is mounted has been transferred to a position immediately above the hot platen 58.

In this state, the control device 110 sends a command signal to the regulator 111, sends air to the switching valve 89 to communicate between the pipes 90 a and 90 b, and sends air from the compressor 91 to the air chamber of the air cylinder 84. B. At this stage, the flow paths in the DSC1 and DSC2 connected above and below the air cylinder 84 are both circulated, and air flows into the air chamber B from the pipe 90a side, and the air in the air chamber A flows through the DSC1. Exhausted to the outside of the device via

The air chamber B from the pipe 90a through the DSC 2
Supplied to the piston 85 pushes the piston 85 upward in the vertical direction, so that the support pin arm 80 attached to the piston 85 and the support pin 62
Is lifted up, passes through the through-hole 60 of the hot platen 58, projects above the upper surface of the hot platen 58, and further comes into contact with the lower surface of the wafer W mounted thereon from below the main wafer transfer mechanism 22. The wafer W is received from the main wafer transfer mechanism 22. Next, the transfer of the wafer W from the main wafer transfer mechanism 22 to the support pins 62 is completed by retracting the main wafer transfer mechanism 22.

The control device 110 controls to keep this state. That is, the pipe 90 a and the pipe 9 are switched by the switching valve 89.
0b is kept in communication. Then, the state where the pressure from the compressor 91 is applied to the air chamber B is maintained, so that the piston 85 is maintained at the position of the top dead center.
At this time, the flow path in the DSC 2 may be open or closed.

FIG. 10 shows the support pin 6 lifted up to the top.
FIG. 4 is a vertical cross-sectional view showing a state where a wafer W is mounted on two front ends.

As will be described later, this piston 85
The moving speed at the time of raising the wafer W first is determined by the sensors S1 and S2 and the markers M1 and M2, and the piston 8 at the time of lifting the wafer W in the subsequent processing step is determined from the moving speed.
It is also possible to use it as basic data for calculating the moving speed of No. 5 and to perform feedback control from now on.

Next, to lower the wafer W by contacting with the hot platen 58 to perform the heat treatment, the switching valve 89 is switched to connect the pipe 90a with the opening 89b to release the air in the air chamber B. Release to the atmosphere.

That is, the control device 110
11 to the switching valve 8 from the pump 92.
The supply of air to 9 is stopped. Then, the switching valve 8
At 9, the switch 89a is moved upward in the drawing by the force of the spring. Then, as shown in FIG.
The key-shaped flow path on the lower side in FIG.
And the air in the air chamber B is
2. The gas flows in the order of the pipe 90a and the switching element 89a, and is exhausted to the outside of the apparatus through the opening 89b. Accordingly, the piston 85 starts to descend.

At this time, magnets M1 and M2 as markers are mounted in the middle of the piston 85, and the passage of these markers is detected by sensors S1 and S2 mounted on the side surface of the air cylinder 84. These two sensors S1 and S2 are disposed at predetermined intervals in the vertical direction on the side surface of the air cylinder 84, and are both connected to the control device 110. The control device 110
A signal is sent to the control device 110 at the moment when the marker passes before 1, S2. The control device 110 determines the moving speed of the piston 85 from these signals, compares the moving speed with the target value, and determines whether the difference is within an allowable range. Then, if the difference between the moving speed of the piston 85 calculated from the actually measured value and the target value is within the allowable range, the state is maintained and the air is exhausted through the DSC 2.

On the other hand, when the difference between the moving speed of the piston 85 and the target value exceeds the allowable range, the voltage applied to the DSC 2 is changed to change the gap between the valve body 97 and the seal member 104. By controlling the flow rate of air passing through the gap per unit time, control is performed so that the difference between the moving speed of the piston 85 and the target value falls within an allowable range.

FIG. 11 is a vertical cross-sectional view showing a state in which the support pins having the wafer W mounted thereon at the tip are lowered, and FIG. 12 is a view in which the support pins are lowered to a position lower than the upper surface of the through hole 60 of the hot platen 58. FIG. 6 is a vertical cross-sectional view showing a state completely housed in the through hole 60.

Since the moving speed of the piston 85 at the time of lowering is controlled as described above, the piston 85 and the supporting pin 62 always lower at a predetermined time, and as shown in FIG. It descends to a position lower than the upper surface of 60 and is completely accommodated in through-hole 60. Therefore, the wafer W of the piston 85 is placed on the upper surface of the hot platen 58, and heat is supplied from the surface of the hot platen 58 by contact with the surface of the hot platen 58, so that the wafer W is subjected to heat treatment.

Next, when the required heat treatment is completed after a lapse of a predetermined time, the support pins 62 are raised to lift the wafer W, and the wafer W is separated from the surface of the hot platen 58. That is, a command signal is sent from the control device 110 to the regulator 111, the switching valve 89 is operated, and the pipe 90a and the pipe 9 are connected.
0b, and the air supplied from the compressor 91 is sent into the air chamber B of the air cylinder 84. Air chamber B
When the pressure of the air inside increases, the piston 85 is pushed upward, so that the support pins 62 also rise, and the processed wafer W is lifted.

At this time, similarly to the case of the above-mentioned piston descending, the pistons 85 are detected by the sensors S1 and S2 and the markers M1 and M2.
When the rising speed is too fast, the controller 110 sends a command signal to the DSC 1 to reduce the cross-sectional area of the flow path in the DSC 1 and thereby reduce the rising speed of the piston 85. Control is performed so that the piston 85 is driven at an appropriate ascending speed by lowering it.

FIG. 13 shows that the wafer W after the heat treatment is
FIG. 4 is a vertical cross-sectional view showing a state where it is lifted up again at 2.

Thereafter, the support pins 62 are raised to the highest position by raising the piston 85 to the top dead center. In this state, the main wafer transfer mechanism 22 is moved below the support pins 62 on which the wafer W is mounted. Is extended, the support pin 62 is lowered again. By doing so, the support pins 6
The wafer W is delivered to the main wafer transfer mechanism 22 from the front end of the wafer 2, and a series of heat treatments in the heat treatment unit is completed.
The wafer W that has completed the heat treatment is sent to a subsequent process, for example, an exposure process, and is subjected to a series of processes.

As described above, in the heat treatment apparatus according to the present embodiment, one DSC is provided at each of the upper and lower portions of the air cylinder 84, and two sensors are provided at the side portions of the air cylinder 84. S1, S2 and control device 110
And the moving speed of the piston 85 is detected.
The moving speed of the piston 85 is controlled in real time by adjusting the voltage applied to the DSC1 and the DSC2 based on the moving speed of No. 5. Therefore, even if the source pressure of air or the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the piston can always be kept constant.

Further, since a digital controller is employed as the control device 110 which processes all signals by replacing them with numerical signals, information such as replacement time of consumable parts can be centrally managed.

The present invention is not limited to the contents of the above embodiment.

For example, in the above embodiment, the air cylinder 8
The DSC adopts only the exhaust side flow path of 4 and the air cylinder 8
4 employs a conventional air operation valve 89 in the supply side flow path, while adopting a DSC in the supply side flow path of the air cylinder 84 and an air operation valve in the exhaust side flow path, 85 is obtained from the sensors S1 and S2 and the controller 110, and the DSC is determined based on the moving speed of the piston 85 in the pushing operation.
The flow rate of air supplied to the air cylinder 84 per unit time may be adjusted by adjusting the voltage applied to the air cylinder 84. Further, DSC is adopted for both the supply side flow path and the exhaust side flow path of the air cylinder 84, and the movement speeds of the pushing operation and the retraction operation of the piston 85 are measured by the sensors S1 and S2 and the control device 11.
0, and by adjusting the voltage applied to the DSC based on the moving speed of the pushing operation and the retracting operation of the piston 85, the flow rate of the air supplied to the air cylinder 84 per unit time and the exhaust air from the air cylinder 84 are exhausted. The piston 8 is controlled by adjusting the flow rate of air
It is also possible to precisely control the respective moving speeds at the time of extrusion and at the time of retraction of No. 5.

In the above embodiment, a digitally controlled device is used as the control device, and the digital speed controller (DSC) 93 that can be digitally controlled to open and close the exhaust side flow passage of the air cylinder 84 is used.
Any variable valve that can adjust the flow rate per unit time in real time based on the moving speed of the piston 85 detected in step (1) may be used.

In addition to the digitally controlled piezo valve used in the above embodiment as an example of the variable valve,
Conventional piezo valves and variable valves driven by a stepping motor or solenoid can also be used.

Further, in the above embodiment, the baking unit has been described as an example, but the present invention can be applied to a processing unit driven by a so-called air operation, for example, a coating unit and a drying unit.

In the above embodiment, the coating and developing system 1 for the wafer W has been described as an example. However, it is needless to say that the present invention can be applied to other processing apparatuses, for example, an LCD substrate processing apparatus. .

[0096]

As described above in detail, according to the first aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston. The movement speed of the piston is controlled in real time by increasing or decreasing the flow rate of air discharged from the air cylinder based on the movement speed of the piston, so the original pressure of the air and the sliding resistance between the piston and the air cylinder are reduced. Even if it fluctuates, the moving speed of the piston can always be kept constant.

According to the second aspect of the present invention, the moving speed of the retracting operation of the piston moving in the air cylinder is detected using the means for detecting the moving speed of the piston, and the detected retracting operation of the piston is detected. By controlling the second valve based on the moving speed to increase or decrease the flow rate of the air exhausted from the air cylinder, the moving speed of the retraction operation of the piston is controlled in real time. Even if the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the retraction operation of the piston can always be kept constant.

According to the third aspect of the present invention, the moving speed of the pushing operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the detected pushing operation of the piston is detected. By controlling the first valve based on the moving speed to increase or decrease the flow rate of the air supplied to the air cylinder, the moving speed of the pushing operation of the piston is controlled in real time. Even when the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the pushing operation of the piston can always be kept constant.

According to the fourth aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston. Controlling the first valve based on the moving speed of the pushing operation to increase or decrease the flow rate of the air supplied to the air cylinder to control the moving speed of the piston pushing operation in real time,
The moving speed of the piston retraction operation is controlled in real time by controlling the second valve based on the detected movement speed of the retraction operation of the piston to increase or decrease the flow rate of the air exhausted from the air cylinder. Therefore, even if the source pressure of the air or the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the pushing operation and the moving speed of the retracting operation of the piston can always be kept constant.

According to the present invention as set forth in claim 5, according to claim 1,
In the processing apparatus according to any one of (1) to (4), as the first valve and / or the second valve, a piezo valve having a quick response speed to an applied voltage and capable of accurately controlling a flow rate is employed. The effect of the invention of claims 1 to 4, which is to constantly maintain the moving speed of the piston, can be further ensured.

According to the present invention described in claim 6, according to claim 1,
In the processing device according to any one of the first to fifth aspects, a digital speed controller that can be controlled by a numerical value is employed as the device to be controlled. The effect of keeping it constant can be further ensured.

According to the present invention, the moving speed of the piston moving in the air cylinder is detected using the means for detecting the moving speed of the piston, and the air speed is determined based on the detected moving speed of the piston. Since the movement speed of the piston is controlled in real time by increasing or decreasing the flow rate of air discharged from the cylinder, the movement speed of the piston is always constant even if the source pressure of air or the sliding resistance between the piston and the air cylinder fluctuates. Can be kept constant, so that a uniform heat treatment can be applied to the substrate to be processed.

According to the present invention, the moving speed of the retracting operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the detected retracting operation of the piston is detected. By controlling the second valve based on the moving speed to increase or decrease the flow rate of the air exhausted from the air cylinder, the moving speed of the retraction operation of the piston is controlled in real time. Even when the sliding resistance between the piston and the air cylinder fluctuates, the moving speed of the retraction operation of the piston can always be kept constant, whereby uniform heat treatment can be performed on the substrate to be processed. According to the ninth aspect of the present invention, the moving speed of the pushing operation of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston, and the moving speed of the pushing operation of the piston is detected. Since the moving speed of the piston pushing operation is controlled in real time by controlling the first valve based on the flow rate of the air supplied to the air cylinder, the original pressure of the air and the piston and the air cylinder are controlled. Even if the sliding resistance of the piston fluctuates, the moving speed of the pushing operation of the piston can always be kept constant, whereby a uniform heat treatment can be performed on the substrate to be processed.

According to the tenth aspect of the present invention, the moving speed of the piston moving in the air cylinder is detected by using the means for detecting the moving speed of the piston. By controlling the first valve based on the moving speed of the pushing operation to increase or decrease the flow rate of the air supplied to the air cylinder, the moving speed of the pushing operation of the piston is controlled in real time. Since the movement speed of the piston retraction operation is controlled in real time by controlling the second valve based on the movement speed of the piston retraction operation to increase or decrease the flow rate of air exhausted from the air cylinder, the air The moving speed of the piston pushing operation and the moving speed of the retracting operation are always constant even if the original pressure of the piston and the sliding resistance between the piston and the air cylinder fluctuate. It can be maintained, whereby it is possible to apply uniform heat treatment on the target substrate.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of a coating and developing processing system according to an embodiment of the present invention.

FIG. 2 is a front view of the coating and developing system according to the embodiment of the present invention.

FIG. 3 is a rear view of the coating and developing processing system according to the embodiment of the present invention.

FIG. 4 is a plan view showing a configuration of a heat treatment unit according to the embodiment of the present invention.

FIG. 5 is a vertical sectional view of the heat treatment unit according to the embodiment of the present invention.

FIG. 6 is a vertical sectional view showing a schematic configuration of a support pin driving mechanism of the heat treatment unit according to the embodiment.

FIG. 7 is a vertical sectional view showing a schematic configuration of a digital speed controller according to the embodiment.

FIG. 8 is a block diagram showing an electrical connection relationship of the heat treatment unit according to the embodiment.

FIG. 9 is a vertical sectional view of the heat treatment unit showing a state where the main wafer transfer mechanism on which the wafer W is placed is brought to a position immediately above the hot platen.

FIG. 10 is a vertical sectional view showing a state where a wafer W is mounted on the tip of a support pin which has been lifted.

FIG. 11 is a vertical cross-sectional view showing a state in which a support pin on which a wafer W is placed at the tip is lowered.

FIG. 12 is a vertical cross-sectional view showing a state where the support pins are lowered and completely accommodated in the through holes.

FIG. 13 is a vertical sectional view showing a state where the wafer W after the heat treatment is lifted up again by the support pins.

FIG. 14 is a vertical sectional view of a conventional heat treatment unit.

[Explanation of symbols]

 84 air cylinder 85 piston S1, S2 sensor 89 switching valve 111 regulator DSC digital speed controller 110 controller

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Nobukazu Ishizaka 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Inside Electron Kyushu Kumamoto Office (72) Inventor Hideaki Goto 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Electron Kyushu Co., Ltd. Kumamoto Office F term (reference) 3F059 AA14 BA01 DA07 DD08 FC02 FC12 3F060 EB06 EB07 EB12 GA01 GA16 GD07 GD11 3H089 AA27 BB17 CC01 DB12 EE31 FF04 FF12 GG03 JJ20 5F031 CA02 FA07 GA08 MA26 MA30 5F046 JA04 JA22 KA04 KA07 KA10 LA01 LA18

Claims (12)

[Claims] 1. A piston for driving a system to be processed, an air cylinder for accommodating the piston in a reciprocable manner, a means for detecting a moving speed of the piston, and Means for controlling the flow rate of air discharged from the air cylinder. 2. A piston for driving a system to be processed, an air cylinder for accommodating the piston in a reciprocable manner, a first valve for opening and closing an air supply passage to the air cylinder, and air from the air cylinder. A second valve that opens and closes an exhaust path, a unit that detects a moving speed of the piston, and a unit that controls the second valve based on a moving speed of a retraction operation of the piston. Processing equipment. 3. A piston for driving a system to be processed, an air cylinder for accommodating the piston in a reciprocable manner, a first valve for opening and closing an air supply path to the air cylinder, and air from the air cylinder. A second valve that opens and closes an exhaust path, a unit that detects a moving speed of the piston, and a unit that controls the first valve based on a moving speed of a pushing operation of the piston. Processing equipment. 4. A piston for driving a system to be processed, an air cylinder accommodating the piston in a reciprocable manner, a first valve for opening and closing an air supply path to the air cylinder, and air from the air cylinder. A second valve that opens and closes an exhaust path; a unit that detects a moving speed of the piston; and a moving speed of a retracting operation of the piston while controlling the first valve based on a moving speed of an extruding operation of the piston. Means for controlling the second valve based on the following. 5. The processing apparatus according to claim 1, wherein at least one of said first valve and said second valve is a piezo valve. 6. The processing apparatus according to claim 1, wherein said control means is a digital speed controller. 7. A piston for bringing a substrate to be processed into and out of contact with a heat-treating plate, an air cylinder accommodating the piston in a reciprocable manner, means for detecting a moving speed of the piston, and a moving speed of the detected piston. Means for controlling a flow rate of air discharged from the air cylinder based on the heat treatment apparatus. 8. A piston for bringing a substrate to be processed into and out of contact with a heat treatment plate, an air cylinder for movably housing the piston, a first valve for opening and closing an air supply path to the air cylinder, and the air cylinder. A second valve that opens and closes an air exhaust path from the device, a unit that detects a moving speed of the piston, and a unit that controls the second valve based on a moving speed of a retraction operation of the piston. A heat treatment apparatus characterized by the above-mentioned. 9. A piston for bringing a substrate to be processed into and out of contact with a heat-treating plate, an air cylinder for movably housing the piston, a first valve for opening and closing an air supply path to the air cylinder, and the air cylinder. A second valve that opens and closes an air exhaust path from the device, a unit that detects the moving speed of the piston, and a unit that controls the first valve based on the moving speed of the pushing operation of the piston. A heat treatment apparatus characterized by the above-mentioned. 10. A piston for bringing a substrate to be processed into and out of contact with a heat-treating plate, an air cylinder for movably housing the piston, a first valve for opening and closing an air supply passage to the air cylinder, and the air cylinder. A second valve that opens and closes an air exhaust path from the device; a unit that detects a moving speed of the piston; and a retracting operation of the piston while controlling the first valve based on a moving speed of a pushing operation of the piston. Means for controlling the second valve based on the moving speed of the heat treatment apparatus. 11. The heat treatment apparatus according to claim 7, wherein at least one of said first valve and said second valve is a piezo valve. 12. The heat treatment apparatus according to claim 7, wherein said control means is a digital speed controller.