JP2005077426A - Substrate-bonding apparatus and substrate-bonding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity, while preventing deterioration in quality. <P>SOLUTION: A temperature-sensitive adhesive member 14 which exhibits adhesiveness at or below a set temperature or non-adhesiveness at or above the set temperature is disposed on an upper stage 6 of a substrate-bonding apparatus 11. A heater 23 for heating the temperature-sensitive adhesive member 14 and a tube 24 for distributing a cooling medium for cooling it are provided on the upper stage 6. When an upper substrate 2 is held on the upper stage 6, the temperature-sensitive adhesive member 14 is cooled at or below the set temperature to generate the adhesiveness. When the upper substrate 2 held on the upper stage 6 is peeled off, the temperature-sensitive adhesive member 14 is heated at or above the set temperature so as to be changed into non-adhesiveness. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate laminating apparatus and a substrate laminating method for laminating two substrates through an adhesive under a reduced pressure atmosphere.
[0002]
[Prior art]
For example, in the manufacturing process of a liquid crystal display panel, one substrate to which a required amount of liquid crystal is supplied to the inner region of a sealing agent as an adhesive applied so as to surround the display region and the other substrate are decompressed. 2. Description of the Related Art There is known a substrate bonding apparatus in which liquid crystal is stacked and bonded in a closed space formed by two substrates and a sealing agent.
[0003]
Such a substrate bonding apparatus has an upper stage and a lower stage, which are arranged in a vacuum chamber so as to face each other vertically and each has a facing surface as a holding surface of the substrate. The moving mechanism is configured by providing an XY-θ moving mechanism on the lower stage (see, for example, Patent Document 1).
[0004]
As a means for holding the substrates of the upper and lower stages, those using vacuum suction means, electrostatic suction means, or mechanical holding means are known.
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-66163 [0006]
[Problems to be solved by the invention]
However, when the vacuum suction means is used, when the upper and lower substrates are bonded together, the vacuum chamber is in a reduced-pressure atmosphere. And the substrate held by suction is likely to drop, misalign, and the like, and the quality of the bonded substrate may be significantly impaired.
[0007]
Further, when the electrostatic attraction means is used, the problem due to the vacuum attraction means is reduced, but in order to obtain a large holding force, it is necessary to apply a high voltage to the electrodes of the electrostatic attraction means. When a high voltage is applied to the electrode of the electrostatic adsorption means, a discharge easily occurs between the surrounding metal parts in a reduced pressure atmosphere, and when the discharge occurs, the adsorption force disappears or significantly decreases, and the substrate from the upper stage May fall, and the substrate may be damaged.
[0008]
Furthermore, when a mechanical holding means such as a chuck is used, the display surface is formed near the center of the substrate, so that the outer periphery of the substrate must be held. The central part of the substrate hangs down by its own weight and deforms downward. When aligning the upper and lower substrates, the upper and lower substrates are brought close to each other. At this time, the drooping portion of the upper substrate contacts the lower substrate, preventing good alignment, and the quality of the bonded substrates. There is a risk of damage.
[0009]
An object of this invention is to provide the board | substrate bonding apparatus and the board | substrate bonding method which can improve productivity, preventing impairing quality.
[0010]
[Means for Solving the Problems]
In the present invention, a substrate is held and held on at least one of a first substrate holding stage and a second substrate holding stage with an adhesive force when a temperature-sensitive adhesive member is changed to adhesive. The temperature sensitive adhesive member is changed to non-adhesive and peeled off.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. 1 is a partially sectional front view showing the configuration of a substrate bonding apparatus according to the present invention, FIG. 2A is a bottom view of the upper stage of the substrate bonding apparatus shown in FIG. 1, and FIG. FIG. 3 is a cross-sectional view taken in the direction of the arrow from the line AA in FIG.
[0012]
In FIG. 1, a substrate bonding apparatus 1 bonds an upper substrate 2 as a first substrate and a lower substrate 3 as a second substrate through a sealing agent 4 as an adhesive. And an upper stage 6 for holding the upper substrate 2, a lower stage 7 for holding the lower substrate 3, a position detection device 8, and a control device 9.
[0013]
The vacuum chamber 5 includes an upper chamber 10 and a lower chamber 11, and the upper chamber 10 is disposed so as to be movable up and down by a driving device (not shown) with respect to the lower chamber 11 fixed on a base (not shown). It is comprised so that the vacuum chamber 5 can be divided into 2 parts up and down. In addition, a seal member (not shown) is disposed at the joint between the upper chamber 10 and the lower chamber 11, and is configured to maintain airtightness between the upper chamber 10 and the lower chamber 11 that are in contact with each other. Is done.
[0014]
The upper stage 6 is connected to an elevating / moving device 12 fixedly disposed on the upper portion of the upper chamber 10 via a connecting member 13 and is disposed in the upper chamber 10. In addition, between the upper chamber 10 and the connection member 13, airtightness is hold | maintained, allowing the movement of an up-down direction with the airtight holding member which has elasticity, such as a bellows, for example.
[0015]
The upper stage 6 has a temperature-sensitive adhesive member 14 and a temperature adjusting device 15 which will be described in detail later.
[0016]
The lower stage 7 is connected to a horizontal movement device 16 that is rotatable (θ) in a horizontal direction (X, Y direction) and a horizontal plane via a connecting member 17 and is arranged in the lower chamber 11. An elastic sheet S is provided on the holding surface of the lower substrate 3 in the lower stage 7. In addition, between the connection member 17 and the lower chamber 11, airtightness is hold | maintained allowing the movement of an up-down direction with the airtight holding member which has elasticity, such as a bellows, for example.
[0017]
The position detection device 8 includes two cameras 18 and 19 and an image processing device 20 that processes images of the cameras 18 and 19. The cameras 18 and 19 pass through the through hole 7a of the lower stage 7 and the window 11a of the lower chamber 11 to the edge of the upper substrate 2 held by the upper stage 6 and the lower substrate 3 held by the lower stage 7. The corresponding positioning marks are arranged below the lower chamber 11 so that they can be imaged. The image processing device 20 captures captured image data of the cameras 18 and 19, respectively, and images of the position detection marks on the upper substrate 2 and the lower substrate 3 captured by the cameras 18 and 19 are imaged using a known pattern recognition technique. The relative position shift between the upper substrate 2 and the lower substrate 3 is detected.
[0018]
The control device 9 is connected to the lifting / lowering moving device 12, the horizontal moving device 16 and the image processing device 20, and controls the operations of the lifting / lowering moving device 12, the horizontal moving device 16 and the image processing device 20.
[0019]
As described above, the upper stage 6 includes the temperature-sensitive adhesive member 14 and the temperature adjusting device 15.
[0020]
The temperature-sensitive adhesive member 14 is an adhesive member that switches between adhesive and non-adhesive depending on the temperature, and there are those that produce adhesiveness above the set temperature, or those that produce adhesiveness below the set temperature, In the present embodiment, an example in which a temperature-sensitive adhesive member 14 that generates adhesiveness at a set temperature or lower is used will be described. As the temperature-sensitive adhesive member 14, for example, trade name Intellimer (trademark of Landeck Corporation, USA) manufactured by NITTA Corporation is known.
[0021]
As shown in FIG. 2, the temperature-sensitive adhesive member 14 has a sheet shape that is slightly smaller than the upper substrate 2, and is bonded and fixed to the surface of the flat holding plate 21. The holding plate 21 is detachably fitted into a recess 6 b provided on the holding surface 6 a of the upper substrate 2 in the upper stage 6, and is fixed by a set screw 22. Therefore, the holding plate 21 can be detached and removed from the recess 6 b of the upper stage 6 by removing the set screw 22. In the state where the holding plate 21 is fixed in the recess 6b, the surface of the temperature-sensitive adhesive member 14 and the holding surface 6a of the upper stage 6 are substantially the same height.
[0022]
Further, a concave surface 21b is formed on the contact surface 21a of the holding plate 21 with the upper stage 6, and a plurality of vacuum suction holes 21c communicating between the concave portion 21b and the surface of the temperature sensitive adhesive member 14 are formed. Is formed. A communication pipe 6c connected to a vacuum source (not shown) is provided at a position corresponding to the recess 21b in the upper stage 6. The vacuum suction hole 21 c acts when the upper substrate 2 is held by the upper stage 6 and assists the adhesion of the upper substrate 2 to the temperature-sensitive adhesive member 14.
[0023]
The temperature control device 15 has a heater 23 built in the upper stage 6 and a conduit 24 through which a cooling medium such as water or gas can flow. In the example of FIG. 2, four heaters 23 are arranged in parallel, and a conduit 24 is provided between the heaters 23 in a meandering manner in a plan view as indicated by a broken line in FIG. Each heater 23 is connected to a temperature controller 25, and the amount of heat generated is controlled. The conduit 24 is in communication with a refrigerant supply machine 26, and is configured to be able to circulate the refrigerant in the conduit 24 by the action of the refrigerant supply machine 26. The temperature adjustment device 15 includes a temperature detector 27 built in the upper stage 6, and a detection signal from the temperature detector 27 is supplied to the control device 9.
[0024]
Next, the operation will be described.
[0025]
First, in a state where the upper chamber 11 is raised with respect to the lower chamber 10 and the vacuum chamber 5 is divided into two, the upper substrate 2 is supplied between the upper stage 6 and the lower stage 7 by a transfer arm (not shown). . That is, the upper substrate 2 is supported and transported on the transport arm with the bonding surface with the lower substrate 3 facing down, and is positioned directly below the upper stage 6.
[0026]
Next, the upper stage 6 is lowered by driving the lifting / lowering device 12, and the holding surface 6 a of the upper stage 6 is brought into contact with the upper surface of the upper substrate 2.
[0027]
Prior to this contact, the control device 9 controls the refrigerant supply machine 26 to circulate the refrigerant in the conduit 24 to cool the temperature-sensitive adhesive member 14 to a temperature equal to or lower than the set temperature. Produces adhesive strength. At this time, the heating of the heater 23 is stopped. In addition, the control device 9 causes the vacuum suction force to act on the vacuum suction hole 21 c at a timing before the upper stage 6 comes into contact with the upper substrate 2.
[0028]
When the holding surface 6a of the upper stage 6 comes into contact with the upper substrate 2, the upper substrate 2 is adsorbed and held by the vacuum adsorbing force acting on the vacuum adsorbing hole 21c, and is in close contact with the temperature sensitive adhesive member 14 by this vacuum adsorbing force. And is held by the adhesive force of the temperature-sensitive adhesive material 14.
[0029]
The upper stage 6 holding the upper substrate 2 is raised by the lifting / lowering device 12. Further, the transfer arm is retracted, and the lower substrate 3 on which the sealant 4 and the liquid crystal are applied is supported and transferred on the transfer arm with the bonding surface of the upper substrate 2 facing upward, and the lower stage 7 Is positioned directly above.
[0030]
When the lower substrate 3 is positioned, lift pins (not shown) built in the lower stage 7 are lifted to lift and support the lower substrate 3 from the transfer arm. Then, the lift pin descends while supporting the lower substrate 3 after the transfer arm is retracted, and transfers the lower substrate 3 onto the lower stage 7.
[0031]
Next, the upper chamber 10 descends and comes into contact with the lower chamber 11 to seal the vacuum chamber 5. The control device 9 controls a decompression device (not shown) to decompress the inside of the vacuum chamber 5 to a vacuum state of about 1 Pa. During this decompression process, the vacuum suction by the vacuum suction hole 21c is stopped. This is because if the pressure in the vacuum chamber 5 reaches a pressure lower than the pressure acting on the vacuum suction hole 21c, the vacuum suction force by the vacuum suction hole 21c cannot be obtained. Even if the vacuum suction force does not act, the upper substrate 2 is held by the adhesive force of the temperature sensitive adhesive member 14 and therefore does not fall. Therefore, the vacuum suction force by the vacuum suction hole 21 c may be released when the upper substrate 2 is held by the adhesive force of the temperature sensitive adhesive member 14.
[0032]
When the inside of the vacuum chamber 5 is evacuated, the upper stage 6 is moved downward by driving the elevating / lowering device 12, and the upper substrate 2 is brought close to the lower substrate 3. In this state, the positioning marks attached to the upper substrate 2 and the lower substrate 3 are imaged by the cameras 18 and 19, and the upper substrate 2 and the lower substrate 3 are based on the captured images of the cameras 18 and 19 by the image processing device 20. The relative positional deviation with respect to is detected. If a relative displacement between the upper substrate 2 and the lower substrate 3 is detected, the control device 9 controls the horizontal movement device 16 to eliminate the relative displacement between the upper substrate 2 and the lower substrate 3. The lower substrate 3 is moved as described above.
[0033]
After this alignment, the relative position shift between the upper substrate 2 and the lower substrate 3 is detected by imaging the positioning marks of the upper substrate 2 and the lower substrate 3 with the cameras 18 and 19 again. If the relative positional deviation is within the preset allowable range, the positioning is completed. If the relative positional deviation is not within the allowable range, alignment is performed again so that the relative positional deviation is within the allowable range. In this way, the alignment is repeated until the positional deviation between the upper and lower substrates 2 and 3 falls within the allowable range.
[0034]
When the alignment is completed, the control device 9 controls the elevating / lowering device 12 to move the upper stage 6 downward to bring the upper substrate 2 into contact with the lower substrate 3 through the sealant 4 and to apply a preset addition. Pressure is applied to the upper stage 6 to press the substrates 2 and 3.
[0035]
After a preset time has elapsed, the control device 9 maintains a pressurization device (not shown) such as a supply device for an inert gas such as nitrogen gas or an air release valve while maintaining the pressurization by the upper stage 6. The pressure in the vacuum chamber 5 is returned to atmospheric pressure by controlling. In the process of returning to the atmospheric pressure, the controller 9 stops the circulation of the refrigerant by the refrigerant supplier 26 and controls the temperature controller 25 to cause the heater 23 to generate heat. Thereby, the temperature-sensitive adhesive member 14 is heated to a temperature equal to or higher than the set temperature, the adhesive force of the temperature-sensitive adhesive member 14 is reduced, and the temperature-sensitive adhesive member 14 is switched to non-adhesive.
[0036]
When the pressure in the vacuum chamber 5 is increased to atmospheric pressure, the control device 9 controls the lifting / lowering device 12 to raise the upper stage 6. At this time, since the adhesive force of the temperature-sensitive adhesive member 14 is reduced, the upper and lower substrates 2 and 3 bonded together easily peel off from the upper stage 6. At this time, a pressurized gas such as nitrogen gas supplied from a supply source (not shown) is simultaneously ejected from the vacuum suction hole 21c to assist the separation of the bonded substrates 2 and 3 from the upper stage 6. Here, the pressure increase to the atmospheric pressure in the vacuum chamber 5 can be known by providing a pressure detector or the like in the vacuum chamber 5 and monitoring the pressure in the vacuum chamber 5.
[0037]
After the raising of the upper stage 6 is completed, the upper chamber 10 is raised. Further, the lift pins (not shown) are lifted from the lower stage and lifted to the delivery position to the transfer arm (not shown).
[0038]
When entering the lower side of the substrates 2 and 3 to which the transfer arm is bonded, the lift pins are lowered to hold the bonded substrates 2 and 3 on the transfer arm. Then, the transfer arm that holds the bonded substrates 2 and 3 retracts to transfer the bonded substrates 2 and 3 to the next step, for example, the curing step of the sealant 4.
[0039]
Thus, a series of operations for bonding the two substrates 2 and 3 is completed. Thereafter, the above-described bonding operation is repeated until there are no more substrates 2 and 3 to be bonded.
[0040]
Further, when the temperature-sensitive adhesive member 14 is deteriorated or broken while repeating the bonding operation, the bonding operation is interrupted and the holding plate 21 to which the temperature-sensitive adhesive member 14 is fixed is placed on the upper stage 6. The fixing screw 22 is removed, the holding plate 21 is removed from the upper stage 6, and the new temperature-sensitive adhesive member 14 is replaced with the holding plate 21 fixed thereto. Here, a plurality of holding plates 21 are prepared, and one holding plate 21 to which the temperature sensitive adhesive member 14 is fixed is attached to the upper stage 6 and used while being fixed to the other holding plate 21. The temperature-sensitive adhesive member 14 having deteriorated or broken may be peeled off and replaced with a new temperature-sensitive adhesive member 14.
[0041]
According to the above embodiment, the upper substrate 2 is held on the upper stage 6 by the adhesive force of the temperature-sensitive adhesive member 14, so that it is compared with the case where the upper substrate 2 is held by holding means such as vacuum suction, electrostatic suction or chuck. Thus, the upper substrate 2 can be stably and reliably held on the upper stage 6. Thereby, it is possible to effectively prevent the upper substrate 2 held on the upper stage 6 from dropping even under a reduced pressure atmosphere, and to prevent the upper substrate 2 from being displaced with respect to the upper stage 6. The upper substrate 2 and the lower substrate 3 can be bonded together with good accuracy.
[0042]
In addition, since the vacuum suction hole 21c is provided in the holding surface 6a of the upper stage 6 and the vacuum suction force is applied to the vacuum suction hole 21c when the upper substrate 2 is held on the upper stage 6, the upper substrate 2 is vacuumed. Since the attracting force attracts and adheres to the adhesive surface of the temperature-sensitive adhesive member 14, the upper substrate 2 can be reliably held by the temperature-sensitive adhesive member 14. Accordingly, it is possible to more effectively prevent the upper substrate 2 from dropping from the upper stage 6 in a reduced-pressure atmosphere and the positional displacement of the upper substrate 2 with respect to the upper stage 6, and to improve the reliability of the quality of the produced liquid crystal panel. Can do.
[0043]
Further, since the temperature-sensitive adhesive member 14 can switch between adhesive and non-adhesive at the set temperature, the temperature-sensitive adhesive member 14 is peeled off when the bonded substrates 2 and 3 are peeled off from the upper stage 6. By switching to non-adhesive, the bonded substrates 2 and 3 can be peeled off from the upper stage 6 without difficulty. Accordingly, when the substrates 2 and 3 bonded from the upper stage 6 are peeled off, it is possible to prevent a force from acting in a direction in which the gap between the bonded substrates 2 and 3 is enlarged. 3 can be prevented from being impaired.
[0044]
Further, when the bonded substrates 2 and 3 are peeled from the upper stage 6, the pressurized gas is ejected from the vacuum suction holes 21c provided in the holding surface 6a of the upper stage 6. By extruding, the substrates 2 and 3 can be peeled off from the upper stage 6 more reliably and reliably. Thereby, the reliability of bonding quality can be improved.
[0045]
In addition, since the temperature-sensitive adhesive member 14 used is one that generates adhesiveness at a set temperature or lower and becomes non-adhesive at a set temperature or higher, the atmosphere in the vacuum chamber 5 is reduced by reducing the pressure in the vacuum chamber 5. Even if the upper stage 6 is cooled and the temperature of the temperature sensitive adhesive member 14 is lowered, the adhesiveness of the temperature sensitive adhesive member 14 is not reduced. Good bonding can be performed without hindering the bonding accuracy between the upper substrate 2 and the lower substrate 3.
[0046]
Further, since the temperature-sensitive adhesive member 14 is fixed to the holding plate 21 and the holding plate 21 is attached to the upper stage 6 with a set screw 22 so as to be replaceable, the temperature-sensitive adhesive member 14 is deteriorated. When damage occurs, the temperature-sensitive adhesive member 14 can be easily replaced by replacing the holding plate 21 with a new temperature-sensitive adhesive member 14, and the temperature-sensitive adhesive member 14 can be replaced. It is possible to prevent the operating rate of the laminating apparatus 1 from being lowered as much as possible.
[0047]
In addition, the holding plate 21 to which the temperature-sensitive adhesive member 14 that has deteriorated or damaged is attached and deteriorated during the bonding operation on the holding plate 21 to which the new temperature-sensitive adhesive member 14 is attached. If the temperature-sensitive adhesive member 14 is peeled and removed and replaced with a new temperature-sensitive adhesive member 14, the next replacement work of the holding plate 21 can be performed efficiently.
[0048]
In the first embodiment, the holding plate 21 having the temperature-sensitive adhesive member 14 fixed to the surface has been described as being detachably fixed to the upper stage 6 with a set screw 21. However, for example, manual or automatic The holding plate 21 is fixed to the upper stage 6 by using other fixing means, such as a stopper pin that moves forward and backward in the upper stage is built in, and the holding plate 21 is fixed by engaging the stopper pin with the holding plate 21. You may do it.
[0049]
Moreover, although demonstrated by the example which exfoliates the board | substrates 2 and 3 bonded together from the temperature sensitive adhesive member 14 which ejected pressurized gas from the vacuum suction hole 21c of the upper stage 6 and was switched to non-adhesiveness, 6, a knockout pin may be incorporated, and the substrates 2 and 3 may be peeled off by pushing out the knockout pin.
[0050]
Next, a second embodiment of the present invention will be described with reference to FIG.
[0051]
The second embodiment is different from the first embodiment in that the temperature-sensitive adhesive member 14 is formed in a single sheet shape that is slightly smaller in size than the upper substrate 2, whereas a plurality of temperature-sensitive adhesive portions are provided. For example, as shown in FIG. 3A, the sheet is provided at a total of five positions including a position corresponding to each corner of the substrate 2 and a position corresponding to the center. The second embodiment is the same as the first embodiment except that the configuration of the upper stage 6 is different from that of the first embodiment shown in FIG. However, description of other configurations is omitted.
[0052]
As shown in FIG. 3 (b), the temperature-sensitive adhesive member 14a is fixed to a moving block 30 that is supported by the upper stage 6 so as to be movable up and down by an elevating drive device 31 using, for example, an air cylinder. The holding position (a position in the figure) of the substrate 2 where the surface of the temperature-sensitive adhesive member 14a and the holding surface 6a of the upper stage 6 substantially coincide, and the surface of the temperature-sensitive adhesive member 14a is the holding surface of the upper stage 6a. It is possible to move between an immersion position (b position in the figure) that has been submerged from 6a.
[0053]
In addition, each moving block 30 is provided with a conduit 24a through which the heater 23a and the refrigerant are circulated, thereby enabling temperature control of the temperature-sensitive adhesive member 14a. Note that, similarly to the first embodiment, the heater 23 a is connected to the temperature controller 25. The conduit 24a is formed in a substantially U shape in plan view in the moving block 30, and is configured to allow the refrigerant supplied from the refrigerant supplier 26 to flow from one end to the other end of the U shape. Furthermore, although not shown in the drawings, each moving block 30 includes a temperature detector (not shown), and the control device 9 controls the temperature controller 25 and the refrigerant based on the detection value of the temperature detector. By controlling the supply device 26, it is possible to accurately control the temperature of the temperature-sensitive adhesive member 14a.
[0054]
With this configuration, the temperature-sensitive adhesive member 14a is switched to non-adhesive when the substrate 2 (the two bonded substrates 2 and 3) is separated from the upper stage 6, and the temperature-sensitive adhesive member 14a is switched. Is moved from the holding position a to the immersion position b, the temperature-sensitive adhesive member 14a rises, but the substrate 2 is held at that position by the holding surface 6a of the upper stage 6, so that the substrate 2 is sensitive. The substrate 2 is peeled off from the warm adhesive member 14a and can be easily and reliably peeled off. Therefore, as in the first embodiment described above, the reliability of the bonding quality of the substrates 2 and 3 can be improved.
[0055]
Further, in this embodiment, each moving block 30 is provided with the conduit 24a for individually circulating the heater 23a and the refrigerant, so that the temperature of the entire upper stage 6 is controlled as in the first embodiment. Thus, the temperature control of the temperature-sensitive adhesive member 14a can be efficiently performed with less energy. That is, if the temperature energy generally given is the same, the larger the size of the structure, the more slowly the temperature change of the structure tends to be slow. Therefore, the moving block 30 is controlled rather than controlling the temperature of the entire upper stage 6. When the temperature is individually controlled, the structure for temperature control can be made smaller, and therefore the temperature control of the temperature-sensitive adhesive member 14a can be efficiently performed with less energy.
[0056]
Further, if a heat insulating member is provided between the moving block 30 and the upper stage 6, heat transfer from the moving block 30 to the upper stage 6 can be prevented, so that the temperature control of the temperature-sensitive adhesive member 14a. Can be performed with less energy.
[0057]
In the second embodiment, the temperature-sensitive adhesive member 14a is fixed to the moving block 30, but as in the first embodiment, the temperature-sensitive adhesive member 14a is fixed to the holding plate. The holding plate may be attached to the moving block 30 using a fixing tool such as a set screw.
[0058]
Further, a vacuum suction hole is provided in the temperature-sensitive adhesive member 14a or the holding surface 6a of the upper stage 6, and the upper substrate 2 is brought into close contact with the temperature-sensitive adhesive member 14a by the vacuum suction force. You may make it assist holding | maintenance of the board | substrate 2. FIG.
[0059]
In the above-described embodiment, the temperature-sensitive adhesive member 14 is described as an example using a material that becomes adhesive at a set temperature or lower and becomes non-adhesive at a set temperature or higher. You may make it use the thing which becomes adhesiveness above setting temperature, and becomes non-adhesiveness below setting temperature.
[0060]
Further, although the temperature sensitive adhesive members 14 and 14a are fixed to the upper stage 6 via the holding plate 21 and the moving block 30, they may be directly fixed to the upper stage 6.
[0061]
Further, the temperature-sensitive adhesive members 14 and 14a have been described as being directly fixed to the holding plate 21 and the moving block 30, but the holding plate 21 and the moving block 30 or the upper stage 6 are interposed via an elastic body such as silicon rubber. You may fix to.
[0062]
Further, although the temperature-sensitive adhesive members 14 and 14a have been described as having a quadrangular shape, they may be circular or other polygonal shapes.
[0063]
【The invention's effect】
According to the present invention, productivity can be improved while preventing deterioration in quality.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional front view showing a configuration of a substrate bonding apparatus according to the present invention.
2A is a bottom view of the upper stage of the substrate bonding apparatus shown in FIG. 1, and FIG. 2B is a view seen in the direction of the arrow from the line AA in FIG. 2A. It is sectional drawing.
3A is a plan view of an upper stage of another structure in the substrate bonding apparatus according to the present invention as viewed from below, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A. It is sectional drawing which looked at the arrow direction from the line.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate bonding apparatus 2 Upper board | substrate 3 Lower board | substrate 4 Sealing agent 5 Vacuum tank 6 Upper stage 6a Holding surface 6b Recessed part 6c Communication pipe 7 Lower stage 8 Position detection apparatus 9 Control apparatus 10 Upper chamber 11 Lower chamber 12 Elevation moving apparatus 14, 14a Temperature-sensitive adhesive member 15 Temperature control device 21 Holding plate 21a Contact surface 21b Recess 21c Vacuum suction hole 22 Set screw 23, 23a Heater 24, 24a Conduit 25 Temperature controller 26 Refrigerant supplier 27 Temperature detector 30 Moving block 31 Lifting drive device

Claims (8)

In the substrate bonding apparatus in which the first substrate held on the first substrate holding stage and the second substrate held on the second substrate holding stage are opposed to each other and bonded under a reduced pressure atmosphere through an adhesive.
A temperature-sensitive adhesive member that is disposed on a holding surface of the substrate on at least one of the first substrate holding stage and the second substrate holding stage and changes between adhesive and non-adhesive depending on temperature;
A substrate bonding apparatus comprising: a temperature adjusting device that changes a temperature of the temperature-sensitive adhesive member. The substrate bonding apparatus according to claim 1, wherein the temperature-sensitive adhesive member is detachably provided on the substrate holding stage. The substrate bonding apparatus according to claim 1, wherein the holding surface on which the temperature-sensitive adhesive member is disposed has a suction unit. The substrate bonding apparatus according to claim 1, wherein a plurality of the temperature sensitive adhesive members are arranged on the substrate holding stage. The first substrate holding stage is provided with the holding surface of the first substrate facing upward, and the second substrate holding stage has the holding surface of the second substrate above the first substrate holding stage. It is provided opposite to the holding surface of the first substrate holding stage,
The substrate bonding apparatus according to claim 1, wherein the temperature-sensitive adhesive member is disposed on a holding surface of the second substrate holding stage. The substrate bonding apparatus according to claim 5, wherein the first substrate holding stage has an elastic member disposed on the holding surface. In the substrate bonding method in which the first substrate held on the first substrate holding stage and the second substrate held on the second substrate holding stage are opposed to each other and bonded in a reduced-pressure atmosphere via an adhesive.
The substrate was held on the holding surface of at least one of the first substrate holding stage and the second substrate holding stage by the adhesive force of the temperature sensitive adhesive member, and held by the temperature sensitive adhesive member. The substrate and the substrate held on the other substrate holding stage are bonded together via the adhesive, and the bonded substrate is removed from the substrate holding stage by changing the adhesive force of the temperature sensitive adhesive member to non-adhesive. A method for laminating a substrate, comprising peeling. The substrate bonding method according to claim 7, wherein the temperature-sensitive adhesive member changes from adhesive to non-adhesive with a temperature rise.

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