JP5169543B2 - Semiconductor chip mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a semiconductor chip from being given an excessive load when sucking and holding the semiconductor chip or pressing it onto a surface of a board. <P>SOLUTION: The mounting apparatus includes a collet 3 for sucking a bare chip 2 and an electropneumatic regulator for supplying and sucking air. The collet 3 is provided with a body 11 of the collet 3 wherein a fluid passage communicating with the electropneumatic regulator is provided and a membrane 13 which is arranged opposite to the bare chip 2 and expands/contracts depending on the entry and discharging of air. The mounting apparatus causes the membrane 13 to expand so that the membrane 13 may be brought into contact with the bare chip 2, and makes the membrane 13 to contract so as to suck and hold the bare chip 2. After the bare chip 2 is sucked and held by causing the membrane 13 to contract, the mounting apparatus causes the membrane 13 to expand again so as to press the bare chip 2 onto the surface of the board 7. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a semiconductor chip mounting apparatus for mounting a semiconductor chip diced into individual pieces on a circuit board, and more particularly to an apparatus for adsorbing and holding a semiconductor chip and pressurizing and bonding it to the board.

  Conventionally, when mounting a semiconductor chip on a circuit board, it is common to dice the semiconductor wafer into individual pieces, take out the bare chips one by one and place them on the substrate, and bond the bare chip to the substrate. is there. Further, for the joining of the bare chip and the substrate, a pressurization method in which a brazing material applied on the substrate is heated and melted and welded while pressing the bare chip against the surface of the substrate is mainly used (for example, see Patent Document 1).

  FIG. 20 is a diagram showing an example of a conventional semiconductor chip mounting apparatus. The mounting apparatus 60 includes a collet 62 that sucks and holds the bare chip 61, a vertical drive unit 63 that raises and lowers the collet 62, and air. The electropneumatic regulator 64 to be sucked, the pressure control unit 65 for controlling the operating pressure of the vertical drive unit 63 and the like, and the brazing material 67 on the substrate 66 are heated. And a heater 68.

  In the mounting apparatus, first, the collet 62 and the vertical drive unit 63 are moved above the bare chip 61 by a transfer unit (not shown) or the like, and then the collet 62 is lowered and air is sucked from the collet 62 to bare the chip. 61 is vacuum-adsorbed. At this time, the pressure control unit 65 adjusts the operating pressure of the vertical drive unit 63 and the suction pressure from the collet 62 so that the bare chip 61 is not damaged.

  Next, with the bare chip 61 adsorbed, the collet 62 and the vertical drive unit 63 are moved above the substrate 66, and in parallel, the substrate 66 is heated by the heater 68 to melt the brazing material 67. Next, the collet 62 is lowered to place the bare chip 61 on the brazing material 67. In this state, compressed air is supplied to the collet 62 to press the bare chip 61 against the substrate 66 side. Also at this time, the operating pressure of the vertical drive unit 63 and the amount of pressure applied by the collet 62 are adjusted to prevent the bare chip 61 from being damaged. Then, the bare chip 61 and the substrate 66 are bonded via the brazing material 67, and the bare chip 61 is fixed on the substrate 66.

JP 58-68942 A

  In recent years, due to demands for downsizing electronic devices, ultra-thin bare chips whose circuits have been miniaturized have been widely available. Such bare chips have low rigidity and low resistance to external stress, and therefore require careful handling in handling.

  However, in the conventional mounting device, an air cylinder is usually used for the vertical drive unit, and in such a vertical drive unit, sliding resistance is generated on the operating shaft (see FIG. 20), and therefore the operating pressure is precisely controlled. It is difficult to operate with a low load. Although there are motors that are electrically driven up and down using a motor or the like, even in this case, there is a sliding resistance of the operating shaft, so it is not suitable for fine control of the operating pressure and operation with a low load. .

  For this reason, when handling an ultra-thin bare chip using a conventional mounting device, an excessive load is easily applied to the bare chip when the bare chip is sucked and held or pressed against the surface of the substrate, and the bare chip is damaged ( There is a problem in that the yield is deteriorated due to occurrence of dents or damage.

  Also, in the conventional mounting device, the air around the bare chip is sucked to suck the bare chip, or the compressed air is blown directly onto the bare chip to pressurize, so an air flow is generated around the bare chip and the temperature of the bare chip is lowered. Let For this reason, the melting temperature of the brazing material at the time of mounting cannot be secured, and as a result, the wettability becomes non-uniform, resulting in a mounting defect due to poor wettability.

  Further, in the conventional mounting apparatus, in order to spread the brazing material over the entire area of the chip mounting surface, an operation of expanding the brazing material by moving the bare chip or the substrate a small amount in the front / rear and left / right directions while the bare chip is in contact with the brazing material ( It is common to perform a scrub operation). However, at this time, the bare tip may slide on the collet due to the surface tension or frictional force of the brazing material, and the relative position of the collet and the bare tip may vary. In this case, there is a problem that the bare chip is bonded in a state shifted from the target position, resulting in poor mounting.

  Accordingly, the present invention has been made in view of the above-described problems in the prior art, and prevents an excessive load from being applied to the semiconductor chip when the semiconductor chip is sucked and held or pressed onto the surface of the substrate. It is an object of the present invention to provide a semiconductor chip mounting apparatus capable of preventing mounting defects due to poor paintability and preventing the displacement of the semiconductor chip during scrubbing.

To achieve the above object, the present invention provides a semiconductor chip having a collet for adsorbing a semiconductor chip and fluid supply / suction means for supplying and aspirating fluid, and pressurizing and bonding the semiconductor chip to a substrate. The collet is disposed so as to face the semiconductor chip and a collet body provided with a fluid passage communicating with the fluid supply / suction means, and according to the fluid entering and exiting through the fluid passage. A membrane support that is disposed between the collet body and the membrane and has a predetermined gap formed therein , and the mounting apparatus expands the membrane to form the membrane on the semiconductor chip. after contact, the semiconductor chip held by suction by contracting the membrane, the semiconductor chip when holding suction, the membrane support It said membrane is adhered to the semiconductor chip while pressed by preparative, characterized by sucking the inside of fluid in the membrane through said fluid passageway.

  According to the present invention, after the membrane is brought into contact with the semiconductor chip using the expansion of the membrane, the semiconductor chip is sucked and held using the contraction of the membrane. It is possible to prevent an excessive load from being applied to the chip.

  In the semiconductor chip mounting apparatus, after the membrane is contracted to suck and hold the semiconductor chip, the membrane is expanded to press the semiconductor chip against the surface of the substrate.

  According to the above configuration, it is possible to prevent an excessive load from being applied to the semiconductor chip when the semiconductor chip held by suction is pressure bonded. Further, since the semiconductor chip can be pressed without directly spraying the fluid, it is possible to prevent mounting failure due to poor coating properties of the adhesive on the substrate.

  In the semiconductor chip mounting apparatus, the membrane support can be composed of a plurality of plate-like members arranged at a predetermined interval, and is also composed of a plate-like member having a plurality of through holes formed therein. can do.

  In the semiconductor chip mounting apparatus, the collet is disposed between the second fluid passage communicating with the fluid supply / suction means, the collet body and the membrane support, and the fluid passing through the second fluid passage. And an inner tube that expands and contracts in response to the entry / exit of.

  In the semiconductor chip mounting apparatus, the collet includes a frame-like retainer having an opening corresponding to the surface area of the semiconductor chip, and lifting means for lifting and lowering the retainer, and the mounting apparatus lowers the retainer. It can be configured to perform a scrubbing operation in a state where According to this, it is possible to prevent the positional deviation of the semiconductor chip during the scrubbing operation, and it is possible to prevent mounting defects due to the positional deviation.

  In the semiconductor chip mounting apparatus, the membrane may be arranged so as to correspond to a contactable area on the semiconductor chip, and contact with only the contact area. According to this, a semiconductor chip can be adsorbed while avoiding a non-contactable area, and even a semiconductor chip including a non-contactable area can be handled appropriately.

  In the semiconductor chip mounting apparatus, the collet may be configured to include a plurality of the membranes and a plurality of the fluid passages provided corresponding to each of the plurality of membranes. According to this, the pressing force and the pressing timing in each membrane can be controlled independently, and finer load control can be performed.

  As described above, according to the present invention, it is possible to prevent an excessive load from being applied to the semiconductor chip during the adsorption holding of the semiconductor chip or the pressing on the surface of the substrate, or the mounting failure or scrubbing operation due to poor paintability. It is possible to prevent misalignment of the semiconductor chip from time to time.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a first embodiment of a semiconductor chip mounting apparatus according to the present invention. This mounting apparatus 1 moves a collet 3 up and down by a collet 3 that holds and holds a bare chip 2 on a supply table 10. The transfer unit 4 that horizontally moves between the adsorption position and the mounting position, the electropneumatic regulator 5 that supplies and sucks air, the supply and suction air amount in the electropneumatic regulator 5 are controlled, and the operating pressure of the transfer unit 4 And the like, and a ceramic heater 9 for heating the brazing material 8 on the substrate 7 and the like.

  As shown in FIGS. 2 and 3, the collet 3 includes a collet main body 11, a top plate 12 disposed on the collet main body 11, and a membrane 13 wound so as to cover a side surface and a lower surface of the collet main body 11. Is provided. The membrane 13 can be a rubber film that expands and contracts in response to the entry and exit of air. For example, a high heat resistant rubber sheet is preferably used.

  As shown in FIG. 3, a membrane support 14 for pushing down the membrane 13 is disposed between the collet body 11 and the membrane 13. As shown in FIG. 4, the membrane support 14 includes a plurality of plate-like members 14 a to 14 e arranged at a predetermined interval, and a connecting portion 14 f that connects the plate-like members 14 a to 14 e. In the region where the membrane support 14 is disposed (the region between the membrane 13 and the collet body 11), nothing is provided in places other than the plate-like members 14a to 14e and the connecting portion 14f, and the gap portion 14g is formed. The

  As shown in FIG. 3, an inner tube 16 for raising and lowering the membrane support 14 is disposed between the membrane support 14 and the collet body 11. The inner tube 16 is a rubber tube that can be expanded and contracted by air supply and suction, and is provided on top of the plate-like members 14a and 14e (see FIG. 4). Further, a retainer 17 that moves up and down is disposed on the side of the collet body 11. As shown in FIG. 2C, the retainer 17 is formed in a frame shape in a bottom view and has an opening corresponding to the surface area of the bare chip 2.

  2 and 3, the collet 3 includes a membrane air line 18 for supplying air to the membrane 13, and an inner tube air line 19 for supplying air to the inner tube 16. , A retainer air line 20 for supplying air to the retainer 17, a relief valve 21 for detecting a contact failure between the bare chip 2 and the substrate 7, and a relief valve air line for supplying air to the relief valve 21. 22 etc. are provided.

  Next, the operation of the mounting apparatus 1 having the above configuration will be described. Here, first, the case where the bare chip 2 placed on the supply table 10 is sucked and held by the collet 3 will be described with reference to FIGS.

  In sucking and holding the bare chip 2, first, the transfer unit 4 (see FIG. 1) is moved horizontally, and the collet 3 is positioned above the bare chip 2. Thereafter, as shown in FIG. 5, the collet 3 is lowered to a predetermined position and brought close to the surface of the bare chip 2. At this time, air is sucked from the inner tube air line 19 to contract the inner tube 16, and air is sucked from the retainer air line 20 to raise the retainer 17. Compressed air is also supplied to the relief valve air line 22, and this compressed air is sealed by the relief valve 21 while the relief valve 21 is closed, and does not flow into the collet 3.

  Next, as shown in FIG. 6, compressed air is supplied to the retainer air line 20 to lower the retainer 17 and bring it into contact with the supply table 10. In parallel with this, compressed air is supplied to the inside of the membrane 13 through the membrane air line 18 to expand the membrane 13. At this time, since the membrane 13 swells sequentially from the central portion, it contacts the central portion of the bare chip 2 and then gradually contacts the end portion. Note that the expansion pressure of the membrane 13 is preferably suppressed to be sufficiently lower than the pressure resistance of the bare chip 2.

  Next, as shown in FIG. 7, compressed air is supplied to the inner tube air line 19 to expand the inner tube 16 and lower the membrane support 14. Thereby, the edge part of the membrane 13 is pushed down, and the membrane 13 is stuck to the whole surface of the bare chip 2. At this time, it is preferable to suppress the expansion pressure of the inner tube 16 in consideration of the pressure resistance of the bare chip 2.

  Next, as shown in FIG. 8, air existing inside the membrane 13 is sucked through the membrane air line 18 to make the inside of the membrane 13 in a vacuum state. At this time, in the gap portion 14g existing between the plate-like members 14a to 14e, the membrane 13 is pulled up by the negative pressure. As a result, vacuum regions 23a to 23d are formed between the region where the membrane 13 is pulled up and the surface of the bare chip 2, and the bare chip 2 is adsorbed by the vacuum regions 23a to 23d.

Here, the following relationship holds for the suction holding force of the bare chip 2.
Vacuum pressure of membrane air line 18 = Deformed vacuum pressure of membrane 13 (1)
Deformation vacuum pressure of membrane 13 = vacuum pressure between membrane 13 and bare chip 2 (2)
Vacuum pressure between membrane 13 and bare chip 2 x adsorption area of bare chip 2 (total area of vacuum regions 23a to 23d) = adsorption holding force of bare chip 2 (3)

On the other hand, in order to hold the bare chip 2 properly,
It is necessary to satisfy the weight of the bare chip 2 <the adsorption holding force of the bare chip 2 <the pressure resistance of the bare chip 2. For this reason, in adsorbing the bare chip 2, the vacuum pressure of the membrane air line 18 (pump for evacuation is adjusted in accordance with the weight and pressure resistance of the bare chip 2 in consideration of the relationships (1) to (3). Pressure).

  Next, as shown in FIG. 9, air is sucked from the inner tube air line 19 while the vacuum inside the membrane 13 is maintained, and the inner tube 16 is contracted. Thereby, the plate-like members 14a to 14e (membrane support 14) and the membrane 13 are raised, and the bare chip 2 is lifted. At the same time, air is sucked from the retainer air line 20, and the retainer 17 is raised and separated from the supply table 10.

  As described above, in the present embodiment, after the membrane 13 is brought into contact with the bare chip 2 using the expansion deformation of the membrane 13, the membrane 13 is pushed down by the membrane support 14, and the membrane 13 is brought into close contact with the surface of the bare chip 2. . In this state, the air inside the membrane 13 is sucked to deform the membrane 13 by the gap 14g, and vacuum regions 23a to 23d are formed to hold the bare chip 2 by suction. For this reason, even if the collet 3 is not lowered and brought into contact with the bare chip 2 by an air cylinder, a motor or the like, the bare chip 2 can be sucked and held, and it is possible to prevent an excessive load from being applied to the bare chip 2. .

  Further, when the membrane support 14 is lowered (see FIG. 7), in order to utilize the expansion and deformation of the inner tube 16, the air flow rate and supply pressure to the inner tube 16 are controlled, so that the pressing down pressure of the membrane support 14 is finely adjusted. Can be adjusted. Thereby, it is possible to prevent an excessive load from being applied to the bare chip 2 when the membrane 13 is brought into close contact with the surface of the bare chip 2.

  Further, in order to form the membrane support 14 by a plurality of plate-like members 14a to 14e arranged at a predetermined interval (see FIG. 4), a plurality of vacuum regions 23a to 23d (see FIG. 8) may be formed. it can. Thereby, it is possible to disperse the stress to the bare chip 2 accompanying the vacuum holding, and it is possible to prevent the deformation of the bare chip 2 at the time of suction.

  As shown in FIG. 10, when foreign matter is mixed between the membrane 13 and the bare chip 2, it is necessary to detect this and stop the operation. Such abnormality detection is performed by the pressure control unit 6. This can be realized by monitoring the pressure in the relief valve air line 22 (see FIG. 1).

  That is, when the foreign matter W is mixed, a space is formed between the membrane 13 and the bare chip 2, and the membrane 13 cannot be brought into close contact with the bare chip 2. In this case, since the space between the membrane 13 and the bare chip 2 is not in a vacuum state, the deformation of the membrane 13 in the gap 14g is larger than that shown in FIG. As a result, the relief valve 21 is pushed up and opened by the membrane 13, and the compressed air in the relief valve air line 22 flows into the membrane 13. At this time, since the pressure in the relief valve air line 22 rapidly decreases, the pressure control unit 6 can detect abnormality by detecting this pressure decrease.

  In addition, as shown in FIG. 11, when the retainer 17 contacts the bare chip 2 in a state where the position of the bare chip 2 on the supply table 10 is shifted, the space between the membrane 13 and the bare chip 2 is the same as described above. Therefore, the pressure control unit 6 can detect the abnormality by monitoring the pressure in the relief valve air line 22.

  Next, a case where the bare chip 2 held by suction is mounted on the substrate 7 will be described with reference to FIGS.

  In mounting on the substrate 7, first, the transfer unit 4 (see FIG. 1) is moved horizontally with the bare chip 2 held by suction, and the collet 3 is positioned above the substrate 7. Thereafter, the collet 3 is lowered to a predetermined position, and the bare chip 2 is brought close to the surface of the substrate 7. At the same time, the substrate 7 is heated by the ceramic heater 9 to melt the brazing material 8.

  Next, as shown in FIG. 12, compressed air is supplied to the retainer air line 20 to lower the retainer 17 and bring it into contact with the surface of the substrate 7. Next, as shown in FIG. 13, compressed air is supplied to the inner tube air line 19 to expand the inner tube 16 and lower the membrane support 14. Thereby, the membrane 13 and the bare chip 2 are lowered, and the bare chip 2 is brought into contact with the brazing material 8 on the substrate 7.

  Next, the transfer unit 4 is moved a small amount back and forth and left and right to perform a scrubbing operation. At this time, even if the bare chip 2 moves on the collet 3 due to the influence of the surface tension, frictional force, etc. of the brazing material 8, the position of the bare chip 2 does not vary greatly because it abuts against the retainer 17. Therefore, it is possible to prevent the bare chip 2 from being removed from the target position, and it is possible to avoid mounting defects due to misalignment.

  When the scrubbing operation is completed, compressed air is supplied to the inside of the membrane 13 through the membrane air line 18 to release the adsorption of the bare chip 2. At the same time, the membrane 13 is expanded and deformed, the bare chip 2 is pressed against the surface of the substrate 7, and the bare chip 2 and the substrate 7 are pressure welded. Next, as shown in FIG. 14, air is sucked from the inner tube air line 19 to contract the inner tube 16, and the membrane support 14 and the membrane 13 are raised. Thereafter, air is sucked from the retainer air line 20 to raise the retainer 17, and finally, the transfer unit 4 is driven to raise the collet 3.

  As described above, in the present embodiment, since the bare chip 2 sucked and held is pressed against the surface of the substrate 7 by using the expansion deformation of the membrane 13, the collet 3 is not lowered using an air cylinder, a motor or the like. In both cases, the bare chip 2 can be pressure bonded to the substrate 7. In particular, the load on the bare chip 2 and the substrate 7 can be finely adjusted by controlling the air flow rate and the supply pressure into the membrane 13, so that the bare chip 2 can be pressed with a low load. Therefore, even if the bare chip 2 has a low rigidity, it is possible to prevent the occurrence of scratches (damage marks) or damage.

  Further, when the bare chip 2 is pressed against the surface of the substrate 7, air is not blown directly onto the surface of the bare chip 2, so that it is possible to avoid generating unnecessary air current around the bare chip 2. Thereby, it can suppress that the temperature of the bare chip 2 falls, and it becomes possible to prevent the mounting defect by the poor paintability of the brazing material 8.

  In addition, in said embodiment, although the case where air was used as a fluid was illustrated, gas, such as nitrogen other than air, can also be used. Further, the membrane support 14 is composed of a plurality of plate-like members 14a to 14e and a connecting portion 14f (see FIG. 4). However, since it is sufficient if there is a gap, a punching plate or the like having a plurality of through holes is used. It can also be configured.

  Next, a second embodiment of the semiconductor chip mounting apparatus according to the present invention will be described with reference to FIGS. In the present embodiment, since the configuration other than the collet is the same as that of the first embodiment, illustration and description thereof are omitted.

  As shown in FIG. 15, the bare chip is of a type having a region 31 where contact with other members is allowed (contactable region) and a region 32 where contact is prohibited (contact impossible region). There is. The mounting apparatus according to the present embodiment is suitable for handling a bare chip including such a non-contactable area 32.

  FIG. 16 is a bottom view of a collet used in the mounting apparatus according to the present embodiment, and FIG. 17 is an operation explanatory view thereof. In these drawings, the same components as those in FIGS. 2 to 14 are denoted by the same reference numerals.

  As shown in FIG. 16, the collet 40 includes a membrane 41 that is arranged in a square shape when viewed from the bottom and has an opening at the center. The membrane 41 is arranged in a shape corresponding to the contactable region 31 on the bare chip 30 and is configured to contact only the contactable region 31. The shape of the membrane is not limited to the square shape, and can be appropriately changed according to the shape of the contactable region 31.

  In the collet 40, as shown in FIG. 17, since the bare chip 30 can be sucked and held avoiding the non-contactable area 32, the bare chip 30 including the non-contactable area 32 can be handled appropriately.

  Next, a third embodiment of the semiconductor chip mounting apparatus according to the present invention will be described with reference to FIGS. In the present embodiment, since the configuration other than the collet is the same as that of the first embodiment, illustration and description thereof are omitted.

  FIG. 18 is a bottom view of a collet used in the mounting apparatus according to the present embodiment, and FIG. 19 is an operation explanatory view thereof. In these drawings, the same components as those in FIGS. 2 to 14 are denoted by the same reference numerals.

  As shown in FIGS. 18 and 19, the collet 50 is for the first to fifth membranes 51a to 51e divided and the first to fifth membranes provided corresponding to the membranes 51a to 51e, respectively. Air lines 52a to 52e.

  In the collet 50, as shown in FIG. 19, since each of the first to fifth membranes 51a to 51e expands and presses the bare chip 2, it is possible to apply a uniform load to the entire brazing material 8. It is possible to prevent poor bonding due to uneven paintability.

  Moreover, since the air flow rate, supply pressure, supply timing, and the like to the first to fifth membranes 51a to 51e can be adjusted separately, the pressing force and the pressing timing at each of the membranes 51a to 51e are independently controlled. can do. For this reason, for example, by reducing the pressing force in some membranes, the bare chip 2 can be pressed in a state where the load is partially suppressed, which is beneficial when handling a bare chip with non-uniform rigidity. .

  FIG. 18 shows the case where the first to fourth membranes 51a to 51d are arranged concentrically with the fifth membrane 51e arranged at the center as the center. For example, other arrangement methods such as arranging strip-like membranes in the vertical and horizontal directions on the paper surface of FIG. 18 can also be adopted. Further, the number of membranes is not limited to five, and may be any number as long as it is plural.

1 is an overall configuration diagram showing a first embodiment of a semiconductor chip mounting apparatus according to the present invention; It is a figure which shows the collet of FIG. 1, Comprising: (a) is a top view, (b) is a side view, (c) is a bottom view. It is the sectional view on the AA line of Fig.2 (a). FIG. 4 is a sectional view taken along line BB in FIG. 3. It is a figure which shows the adsorption | suction operation | movement of a bare chip. It is a figure which shows the adsorption | suction operation | movement of a bare chip. It is a figure which shows the adsorption | suction operation | movement of a bare chip. It is a figure which shows the adsorption | suction operation | movement of a bare chip. It is a figure which shows the adsorption | suction operation | movement of a bare chip. It is a figure which shows an example of the contact failure of a membrane and a bare chip. It is a figure which shows the other example of the contact failure of a membrane and a bare chip. It is a figure which shows joining operation | movement to the board | substrate of a bare chip. It is a figure which shows joining operation | movement to the board | substrate of a bare chip. It is a figure which shows joining operation | movement to the board | substrate of a bare chip. It is a top view which shows an example of the bare chip containing a non-contact area | region. It is a bottom view of the collet used in 2nd Embodiment of the mounting apparatus of the semiconductor chip concerning this invention. It is a figure which shows operation | movement of the collet of FIG. It is a bottom view of the collet used in 3rd Embodiment of the mounting device of the semiconductor chip concerning this invention. It is a figure which shows operation | movement of the collet of FIG. It is a whole block diagram which shows an example of the conventional semiconductor chip mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip mounting apparatus 2 Bare chip 3 Collet 4 Transfer unit 5 Electropneumatic regulator 6 Pressure control unit 7 Substrate 8 Brazing material 9 Ceramic heater 10 Supply table 11 Collet body 12 Top plate 13 Membrane 14 Membrane supports 14a-14e Plate-like member 14f Connecting portion 14g Cavity 16 Inner tube 17 Retainer 18 Membrane air line 19 Inner tube air line 20 Retainer air line 21 Relief valve 22 Relief valve air line 23a to 23d Vacuum region 30 Bare chip 31 Contactable region 32 Non-contactable region 40 Collet 41 Membrane 50 Collets 51a to 51e First to Fifth Membranes 52a to 52e First to Fifth Membrane Air Lines

Claims (8)

A semiconductor chip mounting apparatus comprising: a collet that adsorbs a semiconductor chip; and a fluid supply / suction unit that supplies and sucks a fluid.
The collet has a collet body provided with a fluid passage communicating with the fluid supply / suction means, a membrane disposed opposite to the semiconductor chip, and inflated / contracted according to the entry / extraction of fluid through the fluid passage , It is arranged between the collet body and the membrane, and comprises a membrane support in which a predetermined gap is formed ,
The mounting apparatus expands the membrane to bring the membrane into contact with the semiconductor chip, and then contracts the membrane to suck and hold the semiconductor chip .
An apparatus for mounting a semiconductor chip , wherein when holding the semiconductor chip by suction, the membrane is brought into close contact with the semiconductor chip while being pressed by the membrane support, and the fluid inside the membrane is sucked through the fluid passage. .   2. The semiconductor chip according to claim 1, wherein the mounting device contracts the membrane to suck and hold the semiconductor chip, and then expands the membrane to press the semiconductor chip against the surface of the substrate. Mounting equipment. 2. The semiconductor chip mounting apparatus according to claim 1 , wherein the membrane support is composed of a plurality of plate-like members arranged at a predetermined interval. 2. The semiconductor chip mounting apparatus according to claim 1 , wherein the membrane support is constituted by a plate-like member having a plurality of through holes. The collet is
A second fluid passage communicating with the fluid supply and suction means;
Wherein disposed between the collet body and the membrane support, in any one of claims 1 to 4, characterized in that it comprises an inner tube inflated and deflated in response to the input and of fluid through the fluid passage of the second The semiconductor chip mounting apparatus described. The collet includes a frame-like retainer having an opening corresponding to the surface area of the semiconductor chip, and lifting means for lifting and lowering the retainer,
The mounting apparatus, a semiconductor chip mounting apparatus according to any one of claims 1 to 5, characterized in that the scrubbing operation while being lowered the retainer. The membrane, the disposed corresponding to the contact area on the semiconductor chip, the semiconductor chip mounting apparatus according to any one of claims 1 to 6, characterized in that contact only with the contact area. The collet includes a plurality of the membrane, a semiconductor chip according to any one of claims 1 to 6, characterized in that it comprises a plurality of said fluid passages provided corresponding to each of the plurality of membrane Mounting device.

Images