KR20140125205A - In-line type heat treatment apparatus - Google Patents

In-line type heat treatment apparatus Download PDF

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Publication number
KR20140125205A
KR20140125205A KR20130043088A KR20130043088A KR20140125205A KR 20140125205 A KR20140125205 A KR 20140125205A KR 20130043088 A KR20130043088 A KR 20130043088A KR 20130043088 A KR20130043088 A KR 20130043088A KR 20140125205 A KR20140125205 A KR 20140125205A
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KR
South Korea
Prior art keywords
substrate
support
bar
moving
moving member
Prior art date
Application number
KR20130043088A
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Korean (ko)
Inventor
임현옥
최정환
Original Assignee
주식회사 테라세미콘
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Priority to KR20130043088A priority Critical patent/KR20140125205A/en
Publication of KR20140125205A publication Critical patent/KR20140125205A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An in-line heat treatment apparatus is disclosed. In the in-line heat treatment apparatus according to the present invention, a substrate is transported by being mounted and supported on a moving member which moves in the same direction as or the opposite direction to a substrate transporting direction. Therefore, frictional force does not act between the substrate and the moving member or between a support member on which the substrate is mounted and supported and the moving member and no particles are generated. As a result, damage to the substrate due to particles is prevented, thereby improving the reliability of a product.

Description

[0001] IN-LINE TYPE HEAT TREATMENT APPARATUS [0002]

The present invention relates to an inline thermal processing apparatus capable of transferring a substrate without damaging the substrate.

An annealing apparatus used in manufacturing a flat panel display is a heat treatment apparatus for crystallizing or phase-changing a deposited film to improve the characteristics of the film deposited on the substrate.

The thin film transistor, which is a semiconductor layer used in a flat panel display, is formed by depositing amorphous silicon on a substrate such as glass or quartz using a deposition apparatus, annealing the amorphous silicon layer by dehydrogenation, ), Phosphorus (Phosphorus) or boron (Boron). A crystallization process for crystallizing the amorphous silicon layer having low electron mobility into a polycrystalline silicon layer having a crystalline structure with high electron mobility is performed.

In order to crystallize the amorphous silicon layer into a polycrystalline silicon layer, there is a common characteristic that an energy of heat must be applied to the amorphous silicon layer.

As a general method of applying heat to the amorphous silicon layer, a substrate is put into a furnace and heat is applied to the amorphous silicon layer by a heating means such as a heater provided inside the furnace.

In the conventional heat treatment apparatus, a heat treatment process for heating and cooling the substrate using one heating furnace was performed. However, the conventional heat treatment apparatus using one heating furnace has a disadvantage in that it takes much time to manufacture the substrate as a product, and the productivity is lowered.

In order to overcome such disadvantages, an inline heat treatment apparatus has been developed and used in which a plurality of heating furnaces are successively arranged and a substrate is sequentially transferred to each of the heating furnaces to heat treat the substrate.

In the conventional inline thermal processing apparatus, a substrate is directly mounted on a plurality of rotatably installed rollers, or a support plate is mounted on a roller, and a substrate is mounted on a support plate and transferred.

In the conventional inline thermal processing apparatus, particles are scratched due to frictional force acting between the roller and the substrate or friction force acting between the roller and the support plate, which scratches the roller and the substrate or the roller and the support plate. In this case, since the particles adhere to the substrate and can damage the substrate, the reliability of the product is deteriorated.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a moving member moving in a direction opposite to a conveying direction of a substrate or a conveying direction of a substrate, And an inline heat treatment apparatus capable of improving the reliability of a product by transferring the substrate by supporting the substrate by supporting the substrate.

According to an aspect of the present invention, there is provided an inline thermal processing apparatus comprising: a plurality of furnaces arranged continuously and each providing a space in which a substrate is heat-treated; A moving member which is installed inside the heating furnace in parallel with a feeding direction of the substrate and feeds the substrate while linearly reciprocating in a feeding direction of the substrate or in a direction opposite to the feeding direction of the substrate; A supporting unit for supporting the moving member; And an elevating unit for moving the moving member.

The inline thermal processing apparatus according to the present invention transports a substrate supported on a moving member moving in the direction of transport of the substrate or in the direction opposite to the transport direction of the substrate. Therefore, since no frictional force acts between the substrate and the moving member or between the supporting member on which the substrate is mounted and the moving member, particles due to friction are not generated. Therefore, since the substrate is prevented from being damaged by the particles, the reliability of the product is improved.

1 is a front sectional view showing a schematic configuration of an inline heat treatment apparatus according to an embodiment of the present invention;
2 is a schematic plan sectional view of Fig.
Fig. 3A is an enlarged view of the heating furnace of the heating section shown in Fig. 1; Fig.
FIG. 3B is a side sectional view of FIG. 3A. FIG.
FIG. 4A is a perspective view of the moving member, the elevating unit, and the supporting unit shown in FIG. 1; FIG.
4B is an enlarged exploded perspective view of the "A"
5A to 5G are front sectional views showing the operation of the inline thermal processing apparatus according to one embodiment of the present invention.
6A is a perspective view showing the support unit according to another embodiment of the present invention supporting the moving member.
FIG. 6B is an enlarged perspective view of the support unit shown in FIG. 6A. FIG.
7 is a sectional view taken along the line "BB" in Fig. 6;
8 (a) and 8 (b) are perspective views of a support member used in an inline thermal processing apparatus according to embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are mutually exclusive, but need not be mutually exclusive. For example, certain features, specific structures, and specific features described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with the embodiments. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled. The length, area, thickness, and shape of the embodiments shown in the drawings may be exaggerated for convenience.

Hereinafter, an inline thermal processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

For convenience of description, the same reference numerals are used for the same components.

FIG. 1 is a front sectional view showing a schematic configuration of an inline thermal processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan sectional view of FIG.

The inline thermal processing apparatus according to an embodiment of the present invention includes a loading unit 110, a temperature increasing unit 120, a controller 130, a cooling unit 140, and an unloading unit 150 The loading unit 110, the heating unit 120, the common unit 130, the cooling unit 140, and the unloading unit 150 are sequentially arranged in this order.

The loading unit 110, the heating unit 120, the cavity unit 130, the cooling unit 140, and the unloading unit 150 are furnaces 110a, 120a, 120b, 130a, 140a, .

The substrate 50 can be uniformly preheated to a predetermined temperature in the loading unit 110, and then transferred to the heating unit 120. To this end, a heater (not shown) may be installed in the heating furnace 110a.

The temperature raising unit 120 will be described with reference to Figs. 1 to 3B. Fig. 3A is an enlarged view of the heating furnace of the heating section shown in Fig. 1, and Fig. 3B is a side view of Fig. 3A.

As shown in the figure, the temperature elevating unit 120 heats the substrate 50 to a predetermined temperature and transfers the heated substrate to the cooling unit 130. The temperature elevating unit 120 may include at least two heating furnaces 120a and 120b independently controlled in temperature. The number of the heating furnaces 120a and 120b of the temperature increasing unit 120 may be appropriately determined in consideration of the heat treatment temperature of the substrate 50. [

The substrate 50 can be prevented from being deformed even when the heating temperature is raised rapidly at a low temperature, but can be deformed when the heating temperature is rapidly raised at a high temperature. Therefore, it is preferable that the heating furnaces 120a and 120b of the heating section 120 are set so that the heating temperature is rapidly raised at a low temperature, and is set so that the heating temperature is gradually raised at a high temperature.

A plurality of heaters 210 for heating the substrate 50 may be installed in the heating furnaces 120a and 120b. The heater 210 may be installed on the upper and lower sides of the substrate 50 through which the substrate is transferred while passing through the heating furnaces 120a and 120b.

The configuration of the first heating furnace 120a of the heating section 120 and the configuration of the second heating furnace 120b are the same.

1 and 2, the substrate 50 heated by the temperature increasing part 120 is transferred to the fixing part 130, and the fixing part 130 is transferred from the heating part 120 to the substrate 50 ) Is heat-treated at a predetermined heat treatment temperature. The configuration of the heating furnace 130a of the furnace 130 is the same as that of the furnace 120a of the temperature increasing unit 120. [

The cooling unit 140 receives the substrate 50 transferred from the cooling unit 130, cools the substrate 50 to a predetermined temperature, and transfers the cooled substrate to the unloading unit 150. The configuration of the heating furnace 140a of the cooling section 140 is the same as the configuration of the heating furnace 120a of the heating section 120 and the number of the heating furnaces 140a of the cooling section 140 is the same as that of the heating furnace 120a of the heating section 120, It can be provided in an appropriate number in consideration of the heat treatment temperature. The cooling unit 140 may be provided with various cooling means for uniformly cooling the substrate 50.

The configuration of the heating path 150a of the unloading unit 150 is the same as that of the heating path 110a of the loading unit 110. [ Then, the substrate 50 transferred to the unloading portion 150 can be uniformly cooled to, for example, 110 ° C or lower, and then transferred to the next process so as not to be deformed. To this end, the unloading unit 150 may be provided with a heater (not shown) for heating the substrate 50 for uniform cooling of the substrate 50.

The temperature difference between the loading section 110, the temperature increasing section 120, the cooling section 130, the cooling section 140, and the unloading section 150, which are continuously arranged, changes linearly with a gentle slope, The heating unit 210, the heating unit 120, the cooling unit 130, the cooling unit 140, and the heater 210 of the unloading unit 150 can be independently controlled and independently controlled.

The inline thermal processing apparatus according to an embodiment of the present invention may include an inline thermal processing apparatus installed parallel to the transfer direction of the substrate 50 and configured to perform a linear reciprocating movement along the transfer direction of the substrate 50 or the transfer direction of the substrate 50 Moving member 230 is mounted on the substrate 50 and transported.

The lifting unit 250 for driving the moving member 230, the moving member 230, and the supporting unit 270 for supporting the moving member 230 will be described with reference to Figs. 1 to 4B. Fig. 4A is a perspective view of the moving member, the elevating unit and the supporting unit shown in Fig. 1, and Fig. 4B is an enlarged exploded perspective view of the "A"

As shown in the drawing, the moving member 230 includes a plurality of moving bars 231 which are installed in parallel to the conveying direction of the substrate 50 and reciprocate linearly in parallel with the conveying direction of the substrate 50, And may include a plurality of connection bars 235 interconnecting the bars 231.

The moving bar 231 can be formed by connecting a plurality of unit moving bars 231a. To this end, a coupling protrusion 231aa is formed at one end of the unit moving bar 231a, and a coupling hole 231ab is formed at the other end of the unit moving bar 231a, into which the coupling protrusion 231aa is inserted. On the outer circumferential surface of the engaging projection 231aa and the inner circumferential surface of the engaging hole 231ab, teeth engaging with each other are formed. Thus, when the engaging projections 231aa of the unit moving bars 231a disposed adjacent to each other are coupled to the engaging holes 231ab, a moving bar 231 having a predetermined length is formed.

The connecting bar 235 is installed perpendicular to the moving bar 231 to prevent the moving bar 231 from moving away from each other.

A driving unit 250 for moving the moving member 230 may be installed in the heating furnace 110a of the loading unit 110 located at the outermost position. The driving unit 250 may include a guide rail 251, a rotating belt 253, a connecting member 255, and a motor 257.

The guide rails 251 may be provided in parallel to the conveying direction of the substrate 50, and may be provided in a plurality of intervals. The rotary belt 253 is supported inside the guide rail 251 to be rotatable while forming a closed loop. The lower portion of the connecting member 255 is connected to the rotating belt 253, and the upper end portion of the connecting member 255 is connected to one end of the moving member 230. The connecting member 255 is linearly reciprocated along the guide rail 251 as the rotating belt 253 rotates by the motor 257 so that the moving member 230 connected to the connecting member 255 ) Reciprocate linearly.

The drive unit 250 is installed in the outermost heating furnace 110a and the substrate 50 mounted with the moving member 230 linearly moved by the drive unit 250 is heated by the heating furnace 120a, 120a, 120a, 120b, 120b, 130a, 130a, 140a, 140a, 150a. Therefore, it is preferable that the moving member 230 is installed inside the remaining heating furnaces 110a, 120a, 120b, 130a, and 140a except one of the outermost heating rods 150a.

The driving unit 250 may be installed outside the heating furnaces 110a and 150a located at the outermost positions. When the drive unit 250 is installed outside the heating furnace 110a, the moving member 230 is installed inside the heating furnaces 110a, 120a, 120b, 130a, and 140a except for the heating furnace 150a desirable.

The driving unit 250 may be provided as a cylinder (not shown) that is directly connected to the moving member 230 to linearly reciprocate the moving member 230.

A support unit 270 is installed in the heating furnaces 110a, 120a, 120b, 130a, 140a and 150a to prevent the moving bar 231 from falling down due to its own weight.

The support unit 270 is rotatably mounted on a support bracket 271 and a support bracket 271 on the lower surface of the heating furnaces 110a, 120a, 120b, 130a, 140a and 150a, And a roller 275 that supports the bar 231. It is natural that the roller 275 should be rotatably installed along the moving direction of the moving bar 231.

3B is a plan view of the roller 275. The roller 275 has a supporting surface 275a (see FIG. 3B) formed in a center portion of the roller 275 to have a ring shape and being inserted into and supported by the moving bar 231 for firmly supporting the moving bar 231. [ ) May be formed.

A plurality of lift bars 290 may be installed on the heating furnaces 110a, 120a, 120b, 130a, 140a and 150a to lift the substrate 50 away from the moving member 230 and lower it. The lifting bar 290 lifts or unloads the substrate 50 from or to the moving member 230 and moves the substrate 50 mounted on the moving member 230 to a heating furnace The substrate 50 is lifted and lowered when the substrates are transported to the substrates 120a, 120a, 120a, 120b, 120b, 130a, 130a, 140a, 140a, 150a.

The upper portion of the lifting bar 290 is located inside the heating furnaces 110a, 120a, 120b, 130a, 140a and 150a and the lower portion is located inside the heating furnaces 110a, 120a, 120b, . The lower end of the elevating bar 290 is connected to a side of the elevating unit 292 such as a cylinder or a motor, and is elevated and lowered by the elevating unit 292.

When the lower end side of the lifting bar 290 is coupled to the frame 294 and the piston of the lifting unit 292 is coupled to the center side of the frame 294, The bar 290 can be raised and lowered.

In order to prevent the heat inside the heating furnaces 110a, 120a, 120b, 130a, 140a and 150a from being radiated to the outside, the heating furnaces 110a, 120a, 120b, 130a, 140a, 150a The elevating bar 290 is inserted into the heat insulating pipe 296 and elevated and lowered.

The elevating bar 290 is preferably positioned between the moving bars 231 so that the elevating bar 290 can move up and down without any interference from the surroundings. The elevating bar 210 is preferably located above the upper end of the elevating bar 290 when the elevating bar 290 is positioned at the top dead center.

The operation of the inline thermal processing apparatus according to one embodiment of the present invention will be described with reference to FIGS. 5A to 5G. 5A to 5G are front sectional views showing the operation of the inline thermal processing apparatus according to an embodiment of the present invention.

The moving member 230 is positioned from the heating path 110a of the loading unit 110 to the heating path 140a of the cooling unit 140. The lifting bar 290 is positioned at the bottom dead center, 230 are assumed to be in the initial state when the substrate 50 is not mounted.

5A, when the substrate 50 is loaded and mounted on the moving member 230 in the initial state, the elevating unit 292 is driven to move the elevating bar 290 to the position of the top dead center . Then, the upper end of the lifting bar 290 is positioned on the upper side of the moving member 230, and the substrate 50 is mounted on the lifting bar 290 by an arm (not shown) of the robot.

5B, when the substrate 50 mounted on the lifting bar 290 is moved to the position of the bottom dead center by driving the lifting unit 292 to move the lifting bar 290 to the moving member 230 ).

5B, when the driving unit 250 is driven in the forward direction to move the moving member 230 from left to right, the substrate 50 positioned in the heating furnace 110a of the loading unit 110 , And is conveyed to the heating furnace 120a of the heating section 120 as shown in Fig. 5C.

When the substrate 50 is transferred to the heating furnace 120a of the temperature increasing unit 120, the substrate 50 is heated to a proper temperature and then the substrate 50 is lifted up as shown in FIG. (250) in the opposite direction to move the moving member (230) from right to left.

5E, the new substrate 50 is mounted on the elevating bar 290 of the heating furnace 110a of the loading unit 110 and loaded on the arm of the robot. Then, as shown in FIG. 5F, The lifting bar 290 is lowered to move the substrate 50 positioned in the heating furnace 110a of the loading unit 110 and the heating furnace 120a of the heating unit 120 to the moving member 230 .

5G, when the driving unit 250 is driven in the forward direction to move the moving member 230 from the left to the right, the substrate 50 (see FIG. 5) positioned in the heating furnace 120a of the temperature- Is transferred to the heating furnace 120b of the heating section 120 and the substrate 50 located in the heating furnace 110a of the loading section 110 is transferred to the heating furnace 120a of the heating section 120 .

The substrate 50 is transferred from the loading unit 110 to the unloading unit 150 through the heating unit 120, the fixing unit 130, the cooling unit 140, and the like. The elevating bar 290 is lifted up to the top dead center so that the substrate 50 is separated from the moving member 230 even when unloading the substrate 50 placed in the unloading portion 150. [ Thereafter, the substrate 50 is supported by the arm of the robot, and the substrate 50 is unloaded.

In the inline thermal processing apparatus according to an embodiment of the present invention, a substrate 50 is mounted on a moving member 230 linearly reciprocatingly moved by a driving unit 250 and is transported. Therefore, since no frictional force acts between the substrate 50 and the moving member 230, particles due to friction are not generated. Therefore, since the substrate 50 is prevented from being damaged by the particles, the reliability of the product is improved.

FIG. 6A is a perspective view showing the support unit according to another embodiment of the present invention supporting the moving member, FIG. 6B is an enlarged perspective view of the support unit shown in FIG. 6A, Which will be described.

As shown, the support unit 370 may include a support bar 371, a roller 373, a support holder 375, a bearing 376, a release prevention frame 377, and a stopper 378.

The supporting bar 371 is perpendicular to the conveying direction of the substrate 50 (see Fig. 1), that is, perpendicular to the moving bar 231, and the front end side and the rear end side thereof are perpendicular to the front surface of the heating furnace 110a And a rear surface, respectively. At this time, it is natural that the support bar 371 should be rotated along the linear movement direction of the moving bar 231. The roller 373 is provided on the outer circumferential surface of the support bar 371 and rotates together with the support bar 371 to support the moving bar 231.

A support path 373a is formed at the center of the outer circumferential surface of the roller 373 so as to be depressed toward the center of the roller 373 so as to form a ring shape and into which the guide bar 231 is inserted and supported .

The front end side and the rear end side of the support bar 371 are exposed to the front and rear outer sides of the heating furnace 110a and are exposed on the front end side and the rear end side outer peripheral face of the support bar 371 exposed to the outside of the heating furnace 110a A plurality of end faces (step faces) are respectively formed.

The support holder 375 surrounds the front end side and the rear end side outer circumferential surface of the support bar 371 exposed to the outside of the heating furnace 110a to support the support bar 371 to the heating furnace 110a, Are coupled to the front and rear surfaces of the first housing 110a, respectively. A bearing 376 is interposed between the support bar 371 and the support holder 375 to allow rotation of the support bar 371. A bearing 376 is supported by the support holder 375, And a release preventing frame 377 for preventing the release frame 377 from falling out to the outside. One surface of the bearing 376 is in contact with a step formed on the support bar 371.

A semicircular stopper 371 for preventing the support bar 371 from flowing in the longitudinal direction is formed on the outer circumferential surface of the support bar 371 on the outer side of any one of the front end portion and the rear end portion of the support bar 371, (378) is inserted and coupled. The stopper 378 is inserted and coupled to a ring-shaped hook 371a formed on the outer circumferential surface of the support bar 371.

When the stopper 378 is provided on the outer circumferential surface on the both end sides of the support bar 371, the center portion side of the support bar 371 located inside the heating furnace 110a You can wheel. In order to prevent this, the stopper 378 is provided on the outer peripheral surface at one end side of the support bar 371.

It goes without saying that the support unit 370 according to another embodiment of the present invention may also be installed in the heating furnaces 120a, 120b, 130a, 140a, 150a shown in Fig.

8 (a) and 8 (b) are perspective views of a support member used in an inline heat treatment apparatus according to embodiments of the present invention.

When the substrate 50 (see FIG. 1) is directly mounted on the moving member 230 (see FIG. 1), the substrate 50 can be formed by its own weight.

8 (a), the support plate 61 may be mounted on the moving member 230, and the substrate 50 may be mounted on the support plate 61. In this case, At this time, a plurality of support protrusions 61a may be formed on the support plate 61 to support the substrate 50. The support plate 61 may be provided with an access hole 61b through which the elevating bar 290 (see FIG. 1) enters and exits.

8 (b), the boat 65 having a frame shape can be mounted on the moving member 230, and the board 50 can be mounted on the boat 65. [ At this time, a plurality of support protrusions 65a may be formed on the boat 65 to support the substrate 50. The elevating bar 290 moves up and down through an empty space formed inside the boat 65.

The support plate (61) and the boat (65) are support members for supporting the substrate (50).

The above-described embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which the detailed contour lines are omitted and portions belonging to the technical idea of the present invention are easily seen. It should be noted that the above-described embodiments are not intended to limit the technical spirit of the present invention, but merely as a reference for understanding the technical idea included in the claims of the present invention.

110a, 120a, 120b, 130a, 140a, 150a:
230: Moving member
250: drive unit
270: support unit

Claims (14)

A plurality of furnaces disposed continuously and each providing a space in which the substrate is heat-treated;
A moving member which is installed inside the heating furnace in parallel with a feeding direction of the substrate and feeds the substrate while linearly reciprocating in a feeding direction of the substrate or in a direction opposite to the feeding direction of the substrate;
A supporting unit for supporting the moving member; And
And a driving unit for moving the moving member. The method according to claim 1,
Wherein the moving member includes a plurality of moving bars provided in parallel with a feeding direction of the substrate and reciprocating in a straight line parallel to the feeding direction of the substrate and interconnecting the moving bars,
Wherein the support unit is installed in the heating furnace to prevent the moving bar from sagging. 3. The method of claim 2,
The support unit includes:
A supporting bracket having one side supported by the heating furnace;
And a roller which is installed on the other side of the supporting bracket so as to be rotatable along the linear movement direction of the moving bar and on which the moving bar is supported. The method of claim 3,
Wherein a support path is formed in the central portion of the outer circumferential surface of the roller so as to be recessed toward the center of the roller to form a ring and into which the free bar is inserted and supported. 3. The method of claim 2,
The support unit includes:
A supporting bar rotatably supporting one side of the heating furnace and the other side of the heating furnace while being perpendicular to a conveying direction of the substrate, the supporting bar rotating along a linear movement direction of the moving bar;
And a roller provided on an outer circumferential surface of the support bar and rotated together with the support bar to support the moving bar. 6. The method of claim 5,
Wherein a support path is formed in the central portion of the outer circumferential surface of the roller so as to be recessed toward the center of the roller to form a ring and into which the free bar is inserted and supported. The method according to claim 6,
One end side and the other end side of the support bar are exposed to the outside of the heating furnace,
The support unit includes:
A supporting holder coupled to the heating furnace while surrounding one end side and the other end side circumferential surface of the supporting bar;
A bearing interposed between the support bar and the support holder;
Further comprising a release preventing frame coupled to the support holder to prevent the bearing from being released to the outside of the support holder. 8. The method of claim 7,
And a stopper for preventing the support bar from flowing in the longitudinal direction of the support bar is inserted and coupled to the outer circumferential surface of the support bar on the outer side of one of the one end side and the other end side of the support bar. Inline heat treatment apparatus. 9. The method of claim 8,
Wherein the supporting bar is formed with an outer circumferential surface on which a stop frame is inserted and coupled. The method according to claim 1,
The driving unit includes:
A plurality of guide rails having mutually spaced intervals provided in parallel with the conveying direction of the substrate;
A rotating belt supported inside the guide rail and rotatably provided with a closed loop;
And a connecting member connected to the rotating belt at one side and the moving member supported at the other side for moving the moving member in a linear reciprocating motion as the rotating belt rotates in the forward and reverse directions. The method according to claim 1,
Wherein each of the heating furnaces is provided with a lift bar for lifting the substrate mounted on the moving member and moving the substrate away from the moving member and then lowering the substrate. The method according to claim 1,
Wherein the moving member is mounted with a supporting member on which the substrate is mounted. 13. The method of claim 12,
Wherein the support member is a support plate having a plurality of support protrusions on which the substrate is contactably supported. 14. The method of claim 13,
Wherein the support member is a frame-shaped boat having a plurality of support protrusions on which the substrate is contactably supported.
KR20130043088A 2013-04-18 2013-04-18 In-line type heat treatment apparatus KR20140125205A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10914007B2 (en) 2017-04-13 2021-02-09 Nps Corporation Method and apparatus for substrate processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10914007B2 (en) 2017-04-13 2021-02-09 Nps Corporation Method and apparatus for substrate processing

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