WO2012033338A3 - 프로브 카드 및 이의 제조 방법 - Google Patents

프로브 카드 및 이의 제조 방법 Download PDF

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Publication number
WO2012033338A3
WO2012033338A3 PCT/KR2011/006615 KR2011006615W WO2012033338A3 WO 2012033338 A3 WO2012033338 A3 WO 2012033338A3 KR 2011006615 W KR2011006615 W KR 2011006615W WO 2012033338 A3 WO2012033338 A3 WO 2012033338A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
manufacturing same
area
unit plates
pad area
Prior art date
Application number
PCT/KR2011/006615
Other languages
English (en)
French (fr)
Other versions
WO2012033338A2 (ko
Inventor
이학주
김정엽
박준협
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to US13/821,045 priority Critical patent/US9194889B2/en
Priority to EP11823771.8A priority patent/EP2615636B1/en
Priority to JP2013528114A priority patent/JP2013541705A/ja
Priority to CN201180047938.3A priority patent/CN103140921B/zh
Publication of WO2012033338A2 publication Critical patent/WO2012033338A2/ko
Publication of WO2012033338A3 publication Critical patent/WO2012033338A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

프로브 카드는 패드 영역과 접촉 프로브 영역을 포함하는 복수의 단위 플레이트와, 패드 영역에 형성된 복수의 전극 패드와, 접촉 프로브 영역에 형성된 복수의 접촉 프로브와, 전극 패드와 접촉 프로브를 전기적으로 연결하는 복수의 배선층을 포함한다. 복수의 단위 플레이트는 서로 다른 크기로 형성되고, 각 단위 플레이트의 패드 영역을 모두 노출시키도록 정렬 및 적층된다.
PCT/KR2011/006615 2010-09-07 2011-09-07 프로브 카드 및 이의 제조 방법 WO2012033338A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/821,045 US9194889B2 (en) 2010-09-07 2011-09-07 Probe card and manufacturing method thereof
EP11823771.8A EP2615636B1 (en) 2010-09-07 2011-09-07 Probe card and method for manufacturing same
JP2013528114A JP2013541705A (ja) 2010-09-07 2011-09-07 プローブカードおよびその製造方法
CN201180047938.3A CN103140921B (zh) 2010-09-07 2011-09-07 探卡及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100087598A KR101136534B1 (ko) 2010-09-07 2010-09-07 프로브 카드 및 이의 제조 방법
KR10-2010-0087598 2010-09-07

Publications (2)

Publication Number Publication Date
WO2012033338A2 WO2012033338A2 (ko) 2012-03-15
WO2012033338A3 true WO2012033338A3 (ko) 2012-06-14

Family

ID=45811074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/006615 WO2012033338A2 (ko) 2010-09-07 2011-09-07 프로브 카드 및 이의 제조 방법

Country Status (6)

Country Link
US (1) US9194889B2 (ko)
EP (1) EP2615636B1 (ko)
JP (1) JP2013541705A (ko)
KR (1) KR101136534B1 (ko)
CN (1) CN103140921B (ko)
WO (1) WO2012033338A2 (ko)

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JP7166586B2 (ja) 2015-06-25 2022-11-08 ロズウェル バイオテクノロジーズ，インコーポレイテッド 生体分子センサーおよび方法
JP7280590B2 (ja) 2016-01-28 2023-05-24 ロズウェル バイオテクノロジーズ，インコーポレイテッド 大スケールの分子電子工学センサアレイを使用する被分析物を測定するための方法および装置
US10712334B2 (en) 2016-01-28 2020-07-14 Roswell Biotechnologies, Inc. Massively parallel DNA sequencing apparatus
WO2017139493A2 (en) 2016-02-09 2017-08-17 Roswell Biotechnologies, Inc. Electronic label-free dna and genome sequencing
US10597767B2 (en) 2016-02-22 2020-03-24 Roswell Biotechnologies, Inc. Nanoparticle fabrication
US9829456B1 (en) 2016-07-26 2017-11-28 Roswell Biotechnologies, Inc. Method of making a multi-electrode structure usable in molecular sensing devices
KR101998831B1 (ko) * 2016-07-29 2019-07-11 삼성디스플레이 주식회사 표시 장치
CA3052062A1 (en) 2017-01-10 2018-07-19 Roswell Biotechnologies, Inc. Methods and systems for dna data storage
KR20230158636A (ko) 2017-01-19 2023-11-20 로스웰 바이오테크놀로지스 인코포레이티드 2차원 레이어 재료를 포함하는 솔리드 스테이트 시퀀싱 디바이스들
US10508296B2 (en) 2017-04-25 2019-12-17 Roswell Biotechnologies, Inc. Enzymatic circuits for molecular sensors
EP3615685A4 (en) 2017-04-25 2021-01-20 Roswell Biotechnologies, Inc ENZYMATIC CIRCUITS FOR MOLECULAR SENSORS
CA3057155A1 (en) 2017-05-09 2018-11-15 Roswell Biotechnologies, Inc. Binding probe circuits for molecular sensors
WO2019046589A1 (en) 2017-08-30 2019-03-07 Roswell Biotechnologies, Inc. PROCESSIVE ENZYME MOLECULAR ELECTRONIC SENSORS FOR STORING DNA DATA
US11100404B2 (en) 2017-10-10 2021-08-24 Roswell Biotechnologies, Inc. Methods, apparatus and systems for amplification-free DNA data storage
KR102164378B1 (ko) * 2019-07-17 2020-10-12 윌테크놀러지(주) 기판형 공간변환기를 갖는 프로브 카드
CN114729909A (zh) * 2019-11-14 2022-07-08 Nok株式会社 细胞外电位测定装置
CN111693738A (zh) * 2020-05-13 2020-09-22 中国科学院上海微系统与信息技术研究所 一种多通道高频芯片的低温测试结构

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Also Published As

Publication number Publication date
CN103140921B (zh) 2015-11-25
WO2012033338A2 (ko) 2012-03-15
EP2615636A4 (en) 2017-06-14
US20130162276A1 (en) 2013-06-27
KR101136534B1 (ko) 2012-04-17
JP2013541705A (ja) 2013-11-14
US9194889B2 (en) 2015-11-24
EP2615636B1 (en) 2019-08-07
KR20120025302A (ko) 2012-03-15
EP2615636A2 (en) 2013-07-17
CN103140921A (zh) 2013-06-05

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