WO2012169850A3 - 3차원 비휘발성 메모리 장치 및 이의 제조 방법 - Google Patents
3차원 비휘발성 메모리 장치 및 이의 제조 방법 Download PDFInfo
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- WO2012169850A3 WO2012169850A3 PCT/KR2012/004582 KR2012004582W WO2012169850A3 WO 2012169850 A3 WO2012169850 A3 WO 2012169850A3 KR 2012004582 W KR2012004582 W KR 2012004582W WO 2012169850 A3 WO2012169850 A3 WO 2012169850A3
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Abstract
본 발명의 실시예들은 3차원 비휘발성 메모리 장치 및 이의 제조 방법에 관한 것이다. 일 실시예에 따른 3차원 비휘발성 메모리 장치는, 서로 평행하게 이격된 복수의 도전성 라인들; 상기 복수의 도전성 라인들을 가로지르면서 서로 평행하게 이격된 복수의 도전성 평판들; 및 상기 복수의 도전성 라인들과 상기 복수의 도전성 평판들의 교차 영역들 사이에 각각 배치되는 비휘발성 정보 저장막 패턴을 포함한다.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/125,198 US9331272B2 (en) | 2011-06-10 | 2012-06-11 | 3-dimensional (3D) non-volatile memory device and method of fabricating the same |
US15/095,501 US9735203B2 (en) | 2011-06-10 | 2016-04-11 | 3-dimensional (3D) non-volatile memory device and method of fabricating the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0056207 | 2011-06-10 | ||
KR1020110056207A KR101331859B1 (ko) | 2011-06-10 | 2011-06-10 | 3차원 비휘발성 메모리 장치 및 이의 제조 방법 |
KR10-2011-0061665 | 2011-06-24 | ||
KR1020110061665A KR101297088B1 (ko) | 2011-06-24 | 2011-06-24 | 3차원 비휘발성 메모리 장치 및 이의 제조 방법 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/125,198 A-371-Of-International US9331272B2 (en) | 2011-06-10 | 2012-06-11 | 3-dimensional (3D) non-volatile memory device and method of fabricating the same |
US15/095,501 Division US9735203B2 (en) | 2011-06-10 | 2016-04-11 | 3-dimensional (3D) non-volatile memory device and method of fabricating the same |
Publications (3)
Publication Number | Publication Date |
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WO2012169850A2 WO2012169850A2 (ko) | 2012-12-13 |
WO2012169850A3 true WO2012169850A3 (ko) | 2013-04-04 |
WO2012169850A9 WO2012169850A9 (ko) | 2013-05-16 |
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PCT/KR2012/004582 WO2012169850A2 (ko) | 2011-06-10 | 2012-06-11 | 3차원 비휘발성 메모리 장치 및 이의 제조 방법 |
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US (2) | US9331272B2 (ko) |
WO (1) | WO2012169850A2 (ko) |
Families Citing this family (17)
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KR20140117211A (ko) * | 2013-03-26 | 2014-10-07 | 에스케이하이닉스 주식회사 | 반도체 장치 |
US9343507B2 (en) | 2014-03-12 | 2016-05-17 | Sandisk 3D Llc | Dual channel vertical field effect transistor including an embedded electrode |
KR102319407B1 (ko) * | 2014-12-19 | 2021-11-01 | 삼성전자주식회사 | 기판 스트립 및 이를 이용한 반도체 패키지의 제조 방법 |
US9559049B1 (en) * | 2015-08-17 | 2017-01-31 | Macronix International Co., Ltd. | Memory device and method of manufacturing the same |
US9553132B1 (en) * | 2015-09-09 | 2017-01-24 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
US20170186731A1 (en) * | 2015-12-23 | 2017-06-29 | Sandisk Technologies Llc | Solid state drive optimized for wafers |
US10305032B2 (en) * | 2016-11-30 | 2019-05-28 | Samsung Electronics Co., Ltd. | Memory device and method of fabricating the same |
US10355128B2 (en) * | 2016-12-20 | 2019-07-16 | Imec Vzw | Double-gate vertical transistor semiconductor device |
US10032908B1 (en) | 2017-01-06 | 2018-07-24 | Sandisk Technologies Llc | Multi-gate vertical field effect transistor with channel strips laterally confined by gate dielectric layers, and method of making thereof |
US10096655B1 (en) | 2017-04-07 | 2018-10-09 | Micron Technology, Inc. | Three dimensional memory array |
US10566321B1 (en) * | 2018-08-14 | 2020-02-18 | Newport Fab, Llc | Wafer-to-wafer and die-to-wafer bonding of phase-change material (PCM) switches with integrated circuits and bonded two-die devices |
DE102019115915A1 (de) * | 2018-11-30 | 2020-06-04 | Taiwan Semiconductor Manufacturing Co. Ltd. | Halbleitervorrichtung, welche speicherzellen aufweist, und verfahren zur herstellung derselben |
JP2020155485A (ja) * | 2019-03-18 | 2020-09-24 | キオクシア株式会社 | 半導体装置およびその製造方法 |
KR20210041692A (ko) * | 2019-10-07 | 2021-04-16 | 삼성전자주식회사 | 가변 저항 메모리 소자 |
KR20210058168A (ko) * | 2019-11-13 | 2021-05-24 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 |
US11251080B2 (en) | 2019-12-02 | 2022-02-15 | Tokyo Electron Limited | Method of making 3D circuits with integrated stacked 3D metal lines for high density circuits |
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2012
- 2012-06-11 WO PCT/KR2012/004582 patent/WO2012169850A2/ko active Application Filing
- 2012-06-11 US US14/125,198 patent/US9331272B2/en active Active
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2016
- 2016-04-11 US US15/095,501 patent/US9735203B2/en active Active
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KR20080092603A (ko) * | 2007-04-12 | 2008-10-16 | 한국과학기술원 | 3차원 전면 게이트 구조를 갖는 비휘발성 디램 셀과 그제조방법 및 그 구동방법 |
KR20100049564A (ko) * | 2007-06-29 | 2010-05-12 | 쌘디스크 3디 엘엘씨 | 다이오드와 저항 반도체 소자를 구비한 3d r/w 셀과 이를 제조하는 방법 |
KR20100024800A (ko) * | 2008-08-26 | 2010-03-08 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 동작 방법 |
Also Published As
Publication number | Publication date |
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WO2012169850A2 (ko) | 2012-12-13 |
US9331272B2 (en) | 2016-05-03 |
US9735203B2 (en) | 2017-08-15 |
US20140124729A1 (en) | 2014-05-08 |
WO2012169850A9 (ko) | 2013-05-16 |
US20160225825A1 (en) | 2016-08-04 |
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