WO2012023381A1 - マイクロレンズアレイを使用したスキャン露光装置 - Google Patents
マイクロレンズアレイを使用したスキャン露光装置 Download PDFInfo
- Publication number
- WO2012023381A1 WO2012023381A1 PCT/JP2011/066646 JP2011066646W WO2012023381A1 WO 2012023381 A1 WO2012023381 A1 WO 2012023381A1 JP 2011066646 W JP2011066646 W JP 2011066646W WO 2012023381 A1 WO2012023381 A1 WO 2012023381A1
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- WIPO (PCT)
- Prior art keywords
- microlens array
- substrate
- microlens
- exposure
- exposure apparatus
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Definitions
- the present invention relates to a scanning exposure apparatus using a microlens array that exposes a mask pattern onto a substrate by a microlens array in which microlenses are two-dimensionally arranged.
- the thin film transistor liquid crystal substrate, the color filter substrate, and the like form a predetermined pattern by overlaying and exposing a resist film formed on a glass substrate several times. These exposed substrates may expand and contract during the film formation process, and the lower layer pattern for overlay exposure may differ from the designed pitch depending on manufacturing conditions (exposure apparatus characteristics and temperature conditions). is there.
- overlay exposure if a change in the pitch of the exposure position occurs, the change in the pitch has to be absorbed by correcting the magnification on the exposure apparatus side. That is, when the dimensional variation of the substrate to be exposed occurs, it is necessary to arrange the image at the center of a predetermined position on the substrate of the pitch after the variation by adjusting the magnification of the image for the deviation of the pitch. .
- Patent Document 1 a scanning exposure apparatus using a microlens array in which microlenses are two-dimensionally arranged.
- a scanning exposure apparatus using a microlens array in which microlenses are two-dimensionally arranged has been proposed (Patent Document 1).
- a plurality of microlens arrays are arranged in one direction, and a substrate and a mask are moved relative to the microlens array and the exposure light source in a direction perpendicular to the arrangement direction. Then, the exposure light scans the mask, and the exposure pattern formed in the hole of the mask is imaged on the substrate.
- this conventional scanning exposure apparatus has the following problems.
- an exposure apparatus using a projection optical system using a combination of ordinary lenses it is easy to adjust the magnification by adjusting the distance between the lenses.
- an erecting equal-magnification image is formed on a substrate by arranging eight lenses in the optical axis direction in a plate having a thickness of, for example, 4 mm. Because there is, you cannot adjust the magnification. Therefore, a scanning exposure apparatus using a microlens array has a problem that it cannot cope with a change in the pitch of the substrate to be exposed.
- An object of the present invention is to provide an image of a mask pattern in an exposure apparatus using a microlens array, even if the size of a substrate to be exposed changes due to fluctuations in manufacturing conditions such as exposure apparatus characteristics and temperature conditions. It is an object of the present invention to provide a scanning exposure apparatus using a microlens array that can adjust the position of a lens to a predetermined position.
- a scanning exposure apparatus using a microlens array according to the present invention is arranged above a substrate to be exposed, a plurality of microlens arrays in which microlenses are two-dimensionally arranged, and above the microlens array.
- a mask that is arranged and has a predetermined exposure pattern formed thereon, an exposure light source that irradiates exposure light to the mask, a moving device that relatively moves the microlens array, the substrate, and the mask in one direction;
- the plurality of microlens arrays are arranged on a support substrate in a direction perpendicular to the one direction, and each microlens array is a substrate to be exposed with respect to the arrangement direction with respect to the support substrate. It is characterized by being supported so that it can incline from the direction parallel to.
- microlens array can be configured such that the inclination angle thereof gradually increases or decreases with respect to the arrangement direction.
- the microlens arrays are arranged in two rows in the one direction, and the microlens arrays are arranged in a staggered manner on the support substrate.
- the microlens array is not necessarily arranged in a staggered manner.
- the microlens projects an erecting equal-magnification image of the exposure pattern of the mask onto the substrate.
- the adjustment of the tilt angle of the microlens array is such that the total pitch of the lower layer pattern already formed on the substrate to be exposed is measured in advance, and the pitch of the exposure pattern is adjusted to the total pitch of the lower layer pattern. Can be done.
- the magnification of an erecting equal magnification image transmitted through the microlens can be simulated in a pseudo manner by making the inclination angles of the plurality of microlens arrays different from each other.
- the dimensional accuracy of the exposure position in the overlay exposure can be improved.
- FIG. 1 It is a longitudinal cross-sectional view which shows the part of one micro lens array of the exposure apparatus which concerns on embodiment of this invention. It is a perspective view which shows the state in which this micro lens array is arranged in multiple numbers. It is a figure which shows a micro lens.
- (A), (b) is a figure which shows the aperture_diaphragm
- FIG. 1 is a longitudinal sectional view showing a part of one microlens array of an exposure apparatus according to an embodiment of the present invention.
- FIG. 2 is a perspective view showing a state in which a plurality of microlens arrays are arranged.
- 4 is a diagram showing a micro lens
- FIGS. 4A and 4B are diagrams showing the diaphragm
- FIG. 5 is a diagram showing an exposure area of the micro lens array
- FIG. 6 is a diagram showing a relationship between the micro lens arrays. .
- a microlens array 2 configured by two-dimensionally arranging microlenses 2a is disposed above an exposed substrate 1 such as a glass substrate, and a mask 3 is disposed on the microlens array 2, An exposure light source 4 is disposed above the mask 3.
- the mask 3 is formed with a light shielding film made of a Cr film 3b on the lower surface of the transparent substrate 3a, and the exposure light passes through the holes formed in the Cr film 3b and is converged on the substrate by the microlens array 2.
- the microlens array 2 and the exposure light source 4 are fixed, and the substrate 1 and the mask 3 are moved in the direction of the arrow 5 in synchronization, whereby the exposure light from the exposure light source 4 is masked.
- the substrate 1 is scanned in the direction of arrow 5.
- the movement of the substrate 1 and the mask 3 is driven by a driving source of an appropriate moving device.
- the microlens array 2 and the exposure light source 4 may be moved while the substrate 1 and the mask 3 are fixed.
- microlens arrays 2 are arranged in two rows on the support substrate 6 in a direction perpendicular to the scanning direction 5, and these microlens arrays 2 are arranged in the scanning direction 5.
- three of the four microlens arrays 2 in the rear stage are respectively arranged between the four microlens arrays 2 in the front stage, and the two rows of microlens arrays 2 are arranged in a staggered manner. Thereby, the entire region of the exposure region in the direction perpendicular to the scanning direction 5 on the substrate 1 is exposed by the two rows of microlens arrays 2.
- Each microlens 2a of each microlens array 2 has a structure of four lenses and eight lenses, and has a structure in which four microlens arrays 2-1, 2-2, 2-3, and 2-4 are laminated.
- Each microlens array 2-1 or the like is composed of two lenses.
- a hexagonal field stop 12 is disposed between the microlens array 2-2 and the microlens array 2-3, and an aperture stop 11 is disposed between the microlens array 2-3 and the microlens array 2-4.
- the hexagonal field stop 12 and the aperture stop 11 are provided for each microlens 2a, and the exposure area on the substrate is shaped into six corners for each microlens 2a.
- the hexagonal field stop 12 is formed as a hexagonal opening in the lens field area 10 of the microlens 2a, and the aperture stop 11 is formed as shown in FIG.
- a circular opening is formed in the lens visual field region 10 of the microlens 2a.
- the hexagonal field stop 12 has a dimension (mm) shown in FIG.
- each microlens array 2 the microlenses 2a are arranged as shown in FIG. In other words, the microlenses 2 a are sequentially shifted in the horizontal direction with respect to the scanning direction 5.
- the hexagonal field stop 12 is divided into a central rectangular portion 12 a and triangular portions 12 b and 12 c on both sides when viewed in the scanning direction 5. As shown in FIG. 5, with respect to the scanning direction 5, the triangular portion 12c on the right side of the hexagonal field stop 12 in the first row overlaps with the triangular portion 12b on the left side of the hexagonal field stop 12 in the second row.
- microlenses 2a are arranged so that the triangular portion 12b on the left side of the hexagonal diaphragm 12 in the row overlaps the triangular portion 12c on the right side of the hexagonal field stop 12 in the third row.
- three rows of microlenses 2a are arranged as one set with respect to the scanning direction 5. That is, the fourth row of microlenses 2 a are arranged at the same position as the first row of microlenses 2 a in the direction perpendicular to the scan direction 5.
- the line segments (broken lines) connecting the corners of the hexagon in the scanning direction 5 are 0. Equal intervals of 03 mm.
- each microlens array 2 is supported by a support substrate 6, but the microlens array 2 can be inclined with respect to the support substrate 6 in a direction perpendicular to the scanning direction 5. So that it is supported.
- the total of eight microlens arrays 2 in each row can be tilted at an arbitrary tilt angle with respect to the direction perpendicular to the scan direction.
- Such tilt driving of the microlens array 2 can be performed by a piezoelectric element. That is, when a voltage is applied to the piezoelectric element, the piezoelectric element is deformed according to the applied voltage, and the angle of the microlens array 2 can be changed using this.
- 6 shows the front microlens array 2 and the rear microlens array 2 alternately shown in FIG. 2, and the front and rear microlens arrays 2 are viewed in the scan direction 5. . Therefore, FIG. 6 shows the microlens array 2 which is half of FIG.
- FIGS. 1 to 3 when exposure light from the exposure light source 4 enters the microlens array 2 through the mask 3, an inverted 1 ⁇ magnification image is formed on the hexagonal field stop 12. Then, the hexagonal field stop 12 shapes the exposure light transmitted through each microlens 2a into a hexagon as shown in FIG. 4A, and as shown in FIG. As projected.
- the eight microlens arrays 2 expose the entire exposure region in the direction perpendicular to the scanning direction 5 of the substrate 1 with a uniform light amount. Then, when the substrate 1 and the mask 3 are scanned with respect to the microlens array 2 in the scanning direction 5, the exposure area on the entire surface of the substrate 1 is exposed with a uniform amount of light. Thereby, the mask pattern formed on the mask 3 forms an image on the substrate 1.
- the exposure pattern in the overexposure shifts from the lower layer pattern. Therefore, as shown in FIG. 6, if the size of the substrate 1 to be exposed becomes large, the microlens array 2 is inclined with respect to the adjacent microlens array 2. Then, the rightmost microlens array 2 shown in FIG. 6 is parallel to the substrate 1 to be exposed, and the exposure light is perpendicularly incident on the microlens array 2. It is slightly inclined (about 1/1000 of a few degrees) with respect to the lens array 2.
- the exposure light transmitted through the microlens array 2 enters the substrate 1 in a direction slightly inclined from the vertical direction.
- the leftmost microlens array 2 is tilted the most with respect to the vertical direction, and the exposure light. Enters the substrate 1 with the greatest inclination from the vertical direction.
- the mask pattern (indicated by ⁇ in the figure) of the mask 3 projected from each microlens array 2 onto the substrate 1 is projected onto the area a for each microlens array 2.
- the inclination angle of the exposure light is different for each microlens array 2, but the exposure area a is substantially the same size for each microlens array 2 because the inclination angle itself is extremely small.
- the intervals b1, b2, b3 between the adjacent microlens arrays 2 are larger than the intervals when each microlens array 2 is horizontal to the substrate 1. For this reason, the transmission region of the exposure light when passing through the mask 3 is spread on the substrate 1, and the effect that the lens magnification is substantially increased is obtained.
- an image of each mask pattern can be formed in the center of the predetermined exposure area of the stretched substrate, and the image is formed in the center of the predetermined exposure area as in the case where there is no change in the dimensions of the substrate. Can be made.
- microlens arrays 2 are used to expose the entire area of the substrate 1. is required.
- the magnification of the exposure area of the projection exposure can be increased in a pseudo manner, and the variation in the dimensions of the substrate 1 can be absorbed.
- the gap since it is only necessary to correct the gap by 0.375 ⁇ m with respect to the adjacent microlens array 2, if the gap is changed to such an extent, the angle at which the microlens array 2 is inclined is sufficient.
- the magnification of the projected image can be easily changed, and the dimensional accuracy in the overlay exposure can be improved.
- Each microlens array is supported by a support substrate via, for example, a piezoelectric element so that it can be tilted from a direction parallel to the substrate to be exposed with respect to the arrangement direction with respect to the support substrate.
- the inclination angle of the microlens array is set to be gradually increased with respect to the arrangement direction, but the inclination angle of the microlens array is set to be gradually reduced. Also good. In this case, when the size of the substrate to be exposed is reduced, the position of the exposure light from the microlens array and the substrate after the size change can be matched.
- the exposure position can be adjusted to the lower exposure pattern with high accuracy.
- the total pitch of the lower layer pattern is measured in advance, the inclination angle of each microlens is adjusted so that the pitch of the exposure pattern matches this total pitch, and the pattern projection position can be finely adjusted.
- the pitch of the lower layer pattern is not measured in advance, the positional deviation between the lower layer pattern and the exposure pattern is confirmed with a camera during exposure in the exposure apparatus, and the inclination angle of each microlens is determined based on the result. May be adjusted in real time.
- the total pitch is the distance between the patterns at both ends in the direction perpendicular to the scanning direction 5.
- the exposure light various kinds of light such as pulsed laser light or continuous light such as a mercury lamp can be used.
- the exposure magnification of the microlens array can be adjusted when performing overlay exposure in a scan exposure apparatus, so that the pitch fluctuation of the lower layer pattern can be easily absorbed.
- Substrate 2 Microlens array 2a: Microlenses 2-1 to 2-4: (Configuration) Microlens array 3: Mask 3a: Transparent substrate 3b: Cr film 4: Exposure light source 5: Scanning direction 6: Support substrate 11 : Aperture stop 12: Hexagonal field stop 12a: Rectangular portion 12b, 12c: Triangle portion
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
2:マイクロレンズアレイ
2a:マイクロレンズ
2-1~2-4:(構成)マイクロレンズアレイ
3:マスク
3a:透明基板
3b:Cr膜
4:露光光源
5:スキャン方向
6:支持基板
11:開口絞り
12:6角視野絞り
12a:矩形部分
12b、12c:三角形部分
Claims (5)
- 露光すべき基板の上方に配置され、マイクロレンズが2次元的に配置された複数個のマイクロレンズアレイと、このマイクロレンズアレイの上方に配置され所定の露光パターンが形成されたマスクと、このマスクに対して露光光を照射する露光光源と、前記マイクロレンズアレイと前記基板及び前記マスクとを相対的に一方向に移動させる移動装置とを有し、前記複数個のマイクロレンズアレイは、支持基板上に、前記一方向に垂直の方向に配置されており、各マイクロレンズアレイは、前記支持基板に対してその配置方向に関し被露光基板に平行の方向から傾斜することができるように支持されていることを特徴とするマイクロレンズアレイを使用したスキャン露光装置。
- 前記マイクロレンズアレイは、その傾斜角度が、前記配置方向に関し徐々に大きくなるか、又は小さくなっていることを特徴とする請求項1に記載のマイクロレンズアレイを使用したスキャン露光装置。
- 前記マイクロレンズアレイは、前記一方向に2列に配置され、各マイクロレンズアレイは前記支持基板上で千鳥に配置されていることを特徴とする請求項1又は2に記載のマイクロレンズアレイを使用したスキャン露光装置。
- 前記マイクロレンズは、前記マスクの露光パターンの正立等倍像を前記基板上に投影することを特徴とする請求項1乃至3のいずれか1項に記載のマイクロレンズアレイを使用したスキャン露光装置。
- 前記マイクロレンズアレイの傾斜角度の調整は、前記被露光基板に既に形成されている下層パターンのトータルピッチを予め測定しておき、露光パターンのピッチをこの下層パターンのトータルピッチに合わせるように行うことを特徴とする請求項1乃至4のいずれか1項に記載のマイクロレンズアレイを使用したスキャン露光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/816,462 US9069251B2 (en) | 2010-08-19 | 2011-07-22 | Scanning exposure apparatus using a plurality of microlens arrays with adjustable inclination |
KR1020137006840A KR101761976B1 (ko) | 2010-08-19 | 2011-07-22 | 마이크로 렌즈 어레이를 사용한 스캔 노광 장치 |
CN201180040182.XA CN103052917B (zh) | 2010-08-19 | 2011-07-22 | 使用了微透镜阵列的扫描曝光装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-184457 | 2010-08-19 | ||
JP2010184457A JP5704525B2 (ja) | 2010-08-19 | 2010-08-19 | マイクロレンズアレイを使用したスキャン露光装置 |
Publications (1)
Publication Number | Publication Date |
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WO2012023381A1 true WO2012023381A1 (ja) | 2012-02-23 |
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ID=45605042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2011/066646 WO2012023381A1 (ja) | 2010-08-19 | 2011-07-22 | マイクロレンズアレイを使用したスキャン露光装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9069251B2 (ja) |
JP (1) | JP5704525B2 (ja) |
KR (1) | KR101761976B1 (ja) |
CN (1) | CN103052917B (ja) |
TW (1) | TWI536114B (ja) |
WO (1) | WO2012023381A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5853343B2 (ja) * | 2011-07-29 | 2016-02-09 | 株式会社ブイ・テクノロジー | マイクロレンズアレイを使用したスキャン露光装置 |
JP6286813B2 (ja) * | 2012-03-26 | 2018-03-07 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
JP6150043B2 (ja) * | 2012-03-29 | 2017-06-21 | 株式会社ブイ・テクノロジー | 露光装置 |
KR102096989B1 (ko) | 2013-11-04 | 2020-04-03 | 현대모비스 주식회사 | 차량의 요크유격보상장치 |
CN106292188B (zh) * | 2015-05-24 | 2019-01-18 | 上海微电子装备(集团)股份有限公司 | 曝光装置 |
CN104865801B (zh) * | 2015-06-01 | 2017-03-01 | 京东方科技集团股份有限公司 | 曝光装置 |
KR102129706B1 (ko) * | 2019-08-13 | 2020-07-03 | 주식회사 옵토전자 | 마이크로 광학소자 및 이를 포함하는 광전자 모듈 |
KR102129702B1 (ko) * | 2020-02-06 | 2020-07-03 | 주식회사 옵토전자 | 마이크로 광학소자 시스템 제조 방법 |
KR102129703B1 (ko) * | 2020-02-06 | 2020-07-03 | 주식회사 옵토전자 | 회절 방식을 이용한 마이크로 광학소자 시스템 |
KR102129701B1 (ko) * | 2020-02-06 | 2020-07-03 | 주식회사 옵토전자 | 무회전 스캐닝을 위한 마이크로 광학소자 시스템 |
KR102439662B1 (ko) * | 2020-08-11 | 2022-09-05 | 주식회사 나무가 | 무작위 패턴을 가지는 마이크로 렌즈 어레이 및 그 제조방법 |
CN113379652B (zh) * | 2021-08-11 | 2021-10-22 | 深圳市先地图像科技有限公司 | 一种激光成像用的线形图像修正方法、系统及相关设备 |
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2011
- 2011-07-22 WO PCT/JP2011/066646 patent/WO2012023381A1/ja active Application Filing
- 2011-07-22 CN CN201180040182.XA patent/CN103052917B/zh not_active Expired - Fee Related
- 2011-07-22 US US13/816,462 patent/US9069251B2/en not_active Expired - Fee Related
- 2011-07-22 KR KR1020137006840A patent/KR101761976B1/ko active IP Right Grant
- 2011-08-11 TW TW100128773A patent/TWI536114B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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KR101761976B1 (ko) | 2017-07-26 |
KR20130132770A (ko) | 2013-12-05 |
TWI536114B (zh) | 2016-06-01 |
JP2012042765A (ja) | 2012-03-01 |
CN103052917A (zh) | 2013-04-17 |
TW201219993A (en) | 2012-05-16 |
US20130135602A1 (en) | 2013-05-30 |
JP5704525B2 (ja) | 2015-04-22 |
US9069251B2 (en) | 2015-06-30 |
CN103052917B (zh) | 2016-04-27 |
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