WO2012014853A1 - Substrat pour élément électroluminescent, dispositif électroluminescent, et procédé de production d'un substrat pour élément électroluminescent - Google Patents

Substrat pour élément électroluminescent, dispositif électroluminescent, et procédé de production d'un substrat pour élément électroluminescent Download PDF

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Publication number
WO2012014853A1
WO2012014853A1 PCT/JP2011/066877 JP2011066877W WO2012014853A1 WO 2012014853 A1 WO2012014853 A1 WO 2012014853A1 JP 2011066877 W JP2011066877 W JP 2011066877W WO 2012014853 A1 WO2012014853 A1 WO 2012014853A1
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Prior art keywords
substrate
light
emitting element
light emitting
glass
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PCT/JP2011/066877
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English (en)
Japanese (ja)
Inventor
勝寿 中山
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旭硝子株式会社
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Priority to JP2012526495A priority Critical patent/JPWO2012014853A1/ja
Publication of WO2012014853A1 publication Critical patent/WO2012014853A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Definitions

  • the present invention relates to a light emitting element substrate on which a light emitting element is mounted, a light emitting device including a light emitting element and a light emitting element substrate mounted on the light emitting element substrate, and a method for manufacturing the light emitting element substrate.
  • Such a light-emitting device includes a light-emitting element and a light-emitting element substrate for mounting the light-emitting element.
  • the light-emitting element is mounted on one surface of the light-emitting element substrate. Are configured to emit white light.
  • a light emitting device that emits white light for example, as a light source for a strobe of a mobile phone camera
  • a light condensing property is not necessary, and a wide directivity for emitting light over a wide range is required.
  • a light emitting device that emits white light is used as a backlight of a liquid crystal display
  • a wide directivity that emits light over a wider range is required so that the luminance distribution of the entire display is not uneven. .
  • Such a wide-directional light distribution characteristic that is, that the distribution of emitted light is uniform over the entire visual field is called “Lambertian distribution”.
  • a white light emitting element such as a blue LED or an ultraviolet LED is covered with a resin containing a phosphor.
  • a white LED using a blue LED emits white light when blue light emitted from the blue LED excites the phosphor, and the excited phosphor emits yellow fluorescence that is a complementary color of blue. It is.
  • a white LED using an ultraviolet LED emits white light by the ultraviolet light emitted from the ultraviolet LED exciting the phosphor, and the excited phosphor emits three primary colors of red, green, and blue light. It emits light.
  • it is necessary to fill a resin containing a phosphor so as to cover the blue LED or the ultraviolet LED.
  • the light distribution characteristics described above have a wide directivity, that is, to make the distribution of emitted light close to the Lambertian distribution, from the light emitting element mounted on the light emitting device, not only in front of the light emitting element but also in the lateral direction. It is also preferable to distribute light. For this purpose, it is preferable that no structure is provided around the light emitting element. However, as described above, in order to configure a white LED, it is necessary to cover the light emitting element with a resin containing a phosphor.
  • a frame (or a side wall) for filling a resin for sealing the light emitting element is provided so as to surround the light emitting element (see, for example, Patent Document 1).
  • the white LED light emitting device using the blue LED as described above and the light emitting element substrate on which the light emitting element is mounted have the following problems.
  • a frame body (translucent material layer) for filling a resin is provided so as to surround the light emitting element.
  • the inner surface of the frame (translucent material layer) is inclined, and a part of the light emitted from the side surface of the light emitting element is inside the frame (translucent material layer). It is totally reflected on the surface and heads forward (upward). Therefore, although the amount of light emitted in front (upper) of the light emitting element increases, the light distribution characteristic becomes narrow directivity, and the light distribution characteristic becomes wide directivity, that is, the emitted light distribution is changed to Lambertian distribution. It cannot be made uniform to get closer.
  • resin is disclosed as a material for the frame.
  • a resin is used as the material of the frame (translucent material layer)
  • reliability such as deterioration due to emitted light.
  • the present invention has been made in view of the above points, and for a light-emitting element capable of widening the light distribution characteristics of emitted light and preventing deterioration of the frame for filling the resin due to the emitted light.
  • a substrate a light emitting device, and a method for manufacturing a light emitting element substrate.
  • the present invention comprises a sintered body of a glass ceramic composition (hereinafter also referred to as “a glass ceramic composition for a substrate body”) containing 30 to 50% by mass of a glass powder and 50 to 70% by mass of a ceramic filler. And a substrate body having a mounting surface (hereinafter simply abbreviated as “light emitting element mounting surface”), and surrounding the light emitting element mounted on the mounting surface on the mounting surface side of the substrate body. And a frame containing 80% by mass or more of glass that is transparent to visible light emitted from the light-emitting element.
  • a glass ceramic composition for a substrate body containing 30 to 50% by mass of a glass powder and 50 to 70% by mass of a ceramic filler.
  • a substrate body having a mounting surface hereinafter simply abbreviated as “light emitting element mounting surface”
  • a frame containing 80% by mass or more of glass that is transparent to visible light emitted from the light-emitting element.
  • the frame body preferably has an incident visible light transmittance of 80% or more.
  • the said frame is for formation of the sealing layer which seals the said light emitting element mounted in the said mounting surface by filling sealing resin in the frame of the said frame.
  • the refractive index difference of the refractive index of the said frame and the refractive index of the said sealing layer is 0.1 or less.
  • the height of the frame body is 1.3 times to 5 times the distance from the mounting surface to the upper surface of the light emitting element mounted on the mounting surface.
  • the frame body has ⁇ 1 ⁇ 1.0 ⁇ It is preferable that the condition of ⁇ 2 ⁇ ⁇ 1 is satisfied.
  • the frame body comprises a glass ceramic composition (hereinafter referred to as “for frame body”) comprising 90 to 95% by mass of glass powder and 5 to 10% by mass of at least one filler selected from the group consisting of ceramic fillers and silica fillers. It is preferably made of a sintered body of “glass ceramic composition”. Moreover, it is preferable that the said frame is provided in the said mounting surface side in the peripheral part of the said board
  • the substrate body is preferably formed on the mounting surface side of the substrate body, and has a reflective layer that reflects light and an overcoat layer formed on the reflective layer.
  • the present invention is formed by filling a light emitting element substrate according to the present invention, the light emitting element mounted on the mounting surface, and a sealing resin in a frame of the frame, and the mounting surface There is provided a light emitting device having a sealing layer for sealing the light emitting element mounted on the substrate.
  • the present invention also comprises a substrate body having a light emitting element mounting surface, comprising a sintered body of a glass ceramic composition for a substrate body containing 30 to 50% by mass of glass powder and 50 to 70% by mass of a ceramic filler. It is provided on the mounting surface side of the main body so as to surround the light emitting element mounted on the mounting surface, and contains 80% by mass or more of glass transparent to visible light emitted from the light emitting element.
  • a method for manufacturing a substrate for a light emitting device having a frame The first green sheet for forming the substrate main body and the second green sheet for forming the frame body containing 80% by mass or more of glass, which are made of the glass ceramic composition for the substrate main body, are laminated.
  • a method for producing a substrate for a light-emitting element comprising a step of firing a laminate.
  • the present invention also comprises a substrate body having a light emitting element mounting surface, comprising a sintered body of a glass ceramic composition for a substrate body containing 30 to 50% by mass of glass powder and 50 to 70% by mass of a ceramic filler. It is provided on the mounting surface side of the main body so as to surround the light emitting element mounted on the mounting surface, and contains 80% by mass or more of glass transparent to visible light emitted from the light emitting element.
  • a method for producing a substrate for a light-emitting element having a frame wherein the substrate body made of a sintered body of the glass ceramic composition for a substrate body, and the frame body containing 80% by mass or more of the glass, Provided is a method for manufacturing a substrate for a light-emitting element, which includes a joining step of joining the substrate body and the frame body by heat-treating a laminate laminated through a low-melting glass paste.
  • “to” indicating the numerical range described above is used to mean that the numerical values described before and after it are used as a lower limit value and an upper limit value, and hereinafter “to” Used with meaning.
  • the light distribution characteristic of the emitted light can be wide-directed, and deterioration of the resin-filled frame containing the phosphor due to the emitted light can be prevented.
  • FIG. It is a figure which shows typically a part of manufacturing process of the board
  • FIG. 1 is a plan view (FIG. 1A) showing an example of a light-emitting element substrate 1 and a light-emitting device 10 using the light-emitting element substrate 1 according to this embodiment, and a cross section taken along line XX. It is a figure (FIG.1 (b)).
  • one light emitting element 11 is mounted on the light emitting element substrate 1 according to the present embodiment.
  • the light emitting element substrate 1 is electrically connected to the light emitting element 11 by bonding wires 12, and a sealing layer 13 is provided so as to cover the light emitting elements 11 and the bonding wires 12. That is, in the light emitting device 10 shown in FIG. 1, the portion excluding the light emitting element 11, the bonding wire 12 and the sealing layer 13 is the light emitting element substrate 1 according to this embodiment.
  • this embodiment demonstrates as one light emitting element mounted, the number of the light emitting elements mounted, the electrical connection methods, such as series and parallel when mounting two or more, are not restrict
  • the configuration of each member described below can be appropriately adjusted in accordance with the design of the light emitting device used within the scope of the present invention.
  • the light-emitting element substrate 1 has a substantially flat plate body (meaning a flat plate on the visual level, the same applies hereinafter) and a frame body 8 provided on the substrate body 2.
  • the substrate body 2 is made of a sintered body of a glass ceramic composition for a substrate body containing 30 to 50% by mass of glass powder and 50 to 70% by mass of a ceramic filler.
  • the main body 21 has a surface on which the light emitting element is mounted. In this example, the opposite surface is a back surface 22.
  • the substrate body 2 preferably has, for example, a flexural strength of 250 MPa or more from the viewpoint of suppressing damage or the like when the light emitting element is mounted and thereafter used.
  • the shape, thickness, size and the like of the substrate body 2 and the frame body 8 are not particularly limited, and these can be generally the same as those used as the light emitting element substrate.
  • the raw material composition, sintering conditions, etc. of the sintered body of the glass-ceramic composition for the substrate main body including the glass powder and the ceramic filler constituting the substrate main body 2 will be described in a method for manufacturing a light-emitting element substrate described later. .
  • a pair of external connection terminals 6 electrically connected to an external circuit are provided on the back surface 22 of the substrate body 2, and an element connection terminal 5 and an external connection terminal 6 described later are electrically connected to the inside of the substrate body 2.
  • a pair of through conductors 7 to be connected to each other is provided. The through conductor 7 is provided so as to further penetrate the overcoat layer 4 formed on the main surface of the substrate body 2 described below.
  • the peripheral portion of the main surface 21, the portion where the pair of through conductors 7 are disposed, and the region excluding the vicinity thereof, are made of a metal material containing silver and have a film thickness of 8
  • a heat dissipation layer 3 having a flat surface of ⁇ 50 ⁇ m is formed.
  • an overcoat layer 4 having a flat surface is formed so as to cover the entire surface including the edge of the heat dissipation layer 3.
  • the through conductor 7 provided in the substrate body 2 is further provided on the surface opposite to the laminated surface (hereinafter referred to as “laminated surface”) from the surface on the main surface 21 side of the overcoat layer 4 (hereinafter referred to as “laminated surface”). It is referred to as “mounting surface.”) 21 a is provided so as to penetrate the inside of the overcoat layer 4.
  • the overcoat layer 4 is formed so as to cover the heat radiation layer 3 on the entire main surface 21 excluding the portion where the through conductors 7 are disposed, and the light emitting element 11 is mounted on the mounting surface 21a.
  • the heat radiation layer 3 may be formed on the main surface 21 side of the substrate body 2, and may be formed directly on the main surface 21 or may be formed so as to be embedded in the main surface 21.
  • the heat-dissipating layer 3 is a paste obtained by adding a vehicle such as ethyl cellulose to a metal powder such as silver, silver-palladium alloy, or silver-platinum alloy, and if necessary, a solvent, etc., by a method such as screen printing. It can be formed by printing on the substrate body 2.
  • the film thickness of the overcoat layer 4 depends on the design of the light emitting device, it is 5 to 150 ⁇ m in view of ensuring sufficient insulation protection function and considering economics, deformation due to a difference in thermal expansion from the substrate body 2, and the like. Is preferable, and 75 to 125 ⁇ m is more preferable.
  • the film thickness of the overcoat layer 4 here means the film thickness of the overcoat layer 4 that covers the heat dissipation layer 3.
  • the overcoat layer 4 has a flat surface. Specifically, as the surface flatness, at least in a portion where the light emitting element 11 is mounted while ensuring sufficient heat dissipation and manufacturing ease.
  • the surface roughness Ra is preferably 0.15 ⁇ m or less, and more preferably 0.10 ⁇ m or less.
  • any material can be used without particular limitation as long as it can protect the heat dissipation layer 3 and ensure the surface roughness Ra. It is preferable to be the same as the sintered body of the glass ceramic composition for a substrate body which is a constituent material. However, a glass ceramic composition having a composition different from the glass ceramic composition for the substrate body may be used in consideration of reflectivity for reflecting light from the light emitting element 11 in the light extraction direction. In addition, the raw material composition of the sintered body of the glass ceramic composition constituting the overcoat layer 4, the sintering conditions, and the like will also be described in the method for manufacturing a light emitting element substrate described later.
  • the overcoat layer 4 is preferably a sintered body of a glass ceramic composition containing glass powder and a ceramic filler because it can be produced by simultaneous firing with a substrate.
  • a reflective film may be provided on the mounting surface 21a side of the overcoat layer 4 for the purpose of reflecting light emitted from the light emitting element as much as possible.
  • a constituent material of the reflective film it is preferable to use silver or an alloy thereof from the viewpoint of economy and reflectivity.
  • a glass film also referred to as a glass overcoat film
  • the surface of the glass film may correspond to the mounting surface in the present invention.
  • the thickness of the reflective film is preferably 10 to 300 ⁇ m.
  • the thickness of the glass film is preferably 5 to 50 ⁇ m.
  • the glass composition of the glass film is expressed in mol% on the basis of oxide, SiO 2 is 62 to 84%, B 2 O 3 is 10 to 25%, Al 2 O 3 is 0 to 5%, Na 2
  • One or more of O and K 2 O is contained in a total amount of 0 to 5%, the total content of SiO 2 and Al 2 O 3 is 62 to 84%, MgO is 0 to 10%, CaO, SrO,
  • borosilicate glass having a total content of 5% or less can be cited as a preferred example.
  • a pair of external connection terminals 6 that are electrically connected to an external circuit are provided on the back surface 22 of the substrate body 2, and the element connection terminals 5 and the external connection terminals 6 are electrically connected to the inside of the substrate body 2.
  • a pair of through conductors 7 are provided.
  • the element connection terminal 5, the external connection terminal 6 and the through conductor 7 are arranged as long as they are electrically connected to the light emitting element 11 ⁇ the element connection terminal 5 ⁇ the through conductor 7 ⁇ the external connection terminal 6 ⁇ the external circuit.
  • the position and shape provided are not limited to those shown in FIG. 1 and can be adjusted as appropriate.
  • These component connection terminals 5, external connection terminals 6 and through conductors 7, that is, the constituent materials of the wiring conductors can be used without particular limitation as long as they are the same constituent materials as the wiring conductors used for the light emitting element substrate.
  • Specific examples of the constituent material of these wiring conductors include metal materials mainly composed of copper, silver, gold, or the like. Among such metal materials, a metal material made of silver, silver and platinum, or silver and palladium is preferable.
  • the element connection terminal 5 and the external connection terminal 6 are preferably 5 to 15 ⁇ m thick, and have a conductive protection that protects this layer from oxidation and sulfidation on the metal conductor layer made of the above metal material.
  • a structure in which a layer is formed is preferable.
  • the conductive protective layer is not particularly limited as long as it is made of a conductive material having a function of protecting the metal conductor layer, but a gold plating layer is preferable, and a nickel / gold plating in which a gold plating layer is provided on the nickel plating layer.
  • the layer configuration is more preferred.
  • the thickness of the conductive protective layer is preferably 3 to 20 ⁇ m for the nickel plating layer and 0.1 to 1.0 ⁇ m for the gold plating layer.
  • a thermal via may be arranged immediately below the mounting portion of the light emitting element 11.
  • the frame body 8 is provided on the mounting surface 21a side of the substrate body 2 so as to surround the light emitting element 11 mounted on the mounting surface 21a.
  • the frame 8 is mounted on the peripheral portion of the substrate body 2 so as to form a cavity having a circular portion at the center of the mounting surface 21a of the substrate body 2 as a bottom surface (hereinafter referred to as “cavity bottom surface”). It is provided on the surface 21a side.
  • the frame body 8 seals the light emitting element 11 mounted on the mounting surface 21a by filling the frame of the frame body 8 with a sealing resin.
  • the inner wall of the frame body 8 may be substantially perpendicular to the main surface 21 (meaning that it is vertical at the visual level, the same applies hereinafter), or not upward but from the main surface upward. And may have a tapered shape so as to increase the opening area. Moreover, when the inner wall of the frame 8 has a taper shape, the inner wall having a taper shape may form a flat surface, for example, by stacking a plurality of frame green sheets. , May be stepped.
  • the frame 8 is not particularly limited as long as it is a transparent inorganic material, but contains 80% by mass or more of glass from the viewpoint of transparency and prevention of deterioration with respect to radiated light. It is preferable for the above reason that the frame 8 contains 90 to 95% by mass of glass and 5 to 10% by mass of at least one of ceramic filler and silica filler. It is preferable in terms of transparency and reliability that the frame 8 is a sintered body of a glass ceramic composition containing 90 to 95% by mass of glass powder and 5 to 10% by mass of ceramic filler. In the glass ceramic composition, the ceramic filler may be entirely or partially replaced with a silica filler. Silica filler is also a kind of ceramic filler. In this specification, a filler composed of at least one selected from the group consisting of alumina powder, zirconia powder, titania powder and mullite powder is called a ceramic filler. And ceramic filler may be used separately.
  • the frame 8 is preferably transparent to visible light emitted from the light emitting element 11. Thereby, when the light emitted from the light emitting element 11 to the outer side passes through the sealing layer 13 as visible light and enters the frame 8 from the inner side, the incident visible light enters the frame 8. The light passes through and is radiated to the outer side or the upper outside of the frame 8. Therefore, the light distribution characteristic of the light emitted from the light emitting device 10 can be wide directivity.
  • the frame body 8 is, for example, as shown by an optical path L in FIG. 1B, the visible light incident on the frame body 8 from the inner side is transmitted through the frame body 8 with respect to the incident visible light.
  • the transmittance is less than 80%, it is difficult to make the light distribution characteristic of the light emitted from the light emitting device 10 wide directivity.
  • the frame 8 has a transmittance of incident visible light of 80% or more. More preferably, the transmittance of the transmitted light, which is transmitted through the frame 8 by visible light incident on the frame 8 from the inner side, is 85% or more. Thereby, the light distribution characteristic of the light radiated
  • the frame body 8 has 400% of visible light incident on the frame body 8 perpendicularly from the inner side and including light in a wavelength region of 400 to 800 nm transmitted through the frame body 8 to the incident visible light.
  • the average transmittance in the wavelength region of ⁇ 800 nm is preferably 80% or more.
  • emitted from the light-emitting device 10 can be made more wide directivity.
  • the visible light transmittance is expressed as 80% in the present specification, or when expressed with other numerical values, it means the average transmittance in the visible light wavelength region of 400 to 800 nm.
  • the above-described transmittance is such that, when the width dimension of the frame body 8 is 0.6 mm, for example, visible light incident on the frame body 8 from the inner side is transmitted through the frame body 8 with respect to the incident visible light. It is preferable that the transmittance is 80% or more.
  • the refractive index difference between the refractive index of the frame body 8 and the refractive index of the sealing layer 13 is 0.1 or less, total reflection at the interface between the frame body 8 and the sealing layer 13 can be prevented, and This is preferable because the light distribution characteristic of the light emitted from the light emitting device 10 can be wide directivity.
  • a combination in which the refractive index of the sealing layer 13 is 1.6 and the refractive index of the frame 8 is 1.5 is a preferable example. More preferably, the refractive index difference is 0.07 or less. The refractive index difference is more preferably 0.05 or more.
  • the height dimension H1 of the frame body 8 When the height dimension H1 of the frame body 8 is less than 1.3 times the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11 mounted on the mounting surface 21a, Filling of the sealing resin is insufficient. As a result, since the amount of phosphor added in the sealing layer 13 is reduced, it is difficult to adjust the chromaticity of the light emitting device 10. On the other hand, when the height dimension H1 of the frame 8 exceeds five times the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11, the transmittance of the light emitted from the light emitting element 11 through the sealing layer 13 is high. Therefore, the light extraction efficiency in the light emitting device 10 is reduced.
  • the height dimension H1 of the frame body 8 is preferably 1.3 times or more and 5 times or less of the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11 mounted on the mounting surface 21a. Thereby, the chromaticity adjustment in the light emitting device 10 is facilitated, and a decrease in light extraction efficiency can be prevented.
  • the height dimension H1 of the frame body 8 is the height dimension from the mounting surface 21a that is the upper surface of the overcoat layer 4 to the upper surface of the frame body 8. To do.
  • the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11 is the distance from the upper surface of the overcoat layer 4 to the upper surface of the light emitting element 11.
  • the thermal expansion coefficient of the substrate body 2 is ⁇ 1 (ppm / ° C.) and the thermal expansion coefficient of the frame 8 is ⁇ 2 (ppm / ° C.)
  • ⁇ 2 > ⁇ 1 when the laminated body is fired and cooled to room temperature, the frame body 8 may be cracked by the tensile stress acting on the frame 8.
  • ⁇ 2 ⁇ 1 -1.0 when the laminate is fired and cooled to room temperature, a large compressive stress acts on the frame 8, which may break the light emitting element substrate 1. Therefore, the frame 8 preferably satisfies the condition of ⁇ 1 ⁇ 1.0 ⁇ ⁇ 2 ⁇ ⁇ 1 .
  • ⁇ 1 can be 4.5 ppm / ° C.
  • ⁇ 2 can be 3.8 ppm / ° C.
  • the raw material composition of the sintered body of the glass ceramic composition for the frame body, the sintering conditions, and the like will be described in the method for manufacturing a light emitting element substrate described later.
  • the light emitting device 10 according to the present embodiment has a die bond agent such as a silicone die bond agent on the mounting surface 21a of the light emitting element substrate 1 according to the present embodiment.
  • a light emitting element 11 such as an LED element is mounted.
  • the electrode of the light emitting element 11 (not shown) is connected to the element connection terminal 5 by the bonding wire 12, and the sealing layer 13 is provided so as to cover the light emitting element 11 and the bonding wire 12.
  • a silicone resin or an epoxy resin can be used as the sealing layer 13.
  • a silicone resin is preferable because it is excellent in light resistance, heat resistance, and translucency.
  • a phosphor or the like may be mixed and dispersed in the sealing layer 13. Thereby, for example, when the emitted light from the light emitting element 11 such as a blue LED element passes through the sealing layer 13, the phosphor is excited to emit visible light, and the emitted visible light and the light emitting element 11 are emitted.
  • the desired light emission color such as white can be obtained as the light emitting device 10 by mixing with the emitted light.
  • phosphors that emit three primary colors of red, green, and blue light may be mixed and dispersed in the sealing layer 13.
  • the sealing layer 13 thereby, for example, when radiated light from the light emitting element 11 such as an ultraviolet LED element passes through the sealing layer 13, the phosphor is excited to emit the three primary colors of light, and the emitted three primary colors are mixed, for example, A desired emission color such as white can be obtained.
  • the kind of fluorescent substance is not specifically limited, According to the kind of light radiated
  • FIGS. 2 and 3 are views schematically showing a part of the manufacturing process of the light emitting element substrate shown in FIG.
  • the light emitting element substrate according to the present embodiment can be manufactured, for example, by a manufacturing method including the following steps (A1) to (D1). In the following description, members used for manufacturing will be described with the same reference numerals as those of the finished product.
  • a Green Sheet Production Step In the green sheet production step, the substrate body green sheet 2 constituting the substrate body 2, the overcoat layer green sheet 4 constituting the overcoat layer 4, and the frame constituting the frame body 8. A green sheet 8 is prepared.
  • FIG. 2 is a diagram schematically showing a green sheet manufacturing process.
  • FIGS. 2A and 2B are a plan view and a cross-sectional view taken along line XX, respectively, showing the frame green sheet 8.
  • FIGS. 2C and 2D are a plan view and a cross-sectional view taken along the line XX, respectively, showing the overcoat layer green sheet 4.
  • FIGS. 2E and 2F are a plan view and a cross-sectional view taken along the line XX, respectively, showing the green sheet 2 for a substrate body.
  • the substrate main body green sheet 2 and the overcoat layer green sheet 4 are a binder for the substrate main body and overcoat layer glass ceramic composition containing glass powder and a ceramic filler, and optionally a plasticizer, a dispersant, and a solvent. Etc. are added to prepare a slurry.
  • the green sheet 8 for frames prepares a slurry by adding a binder, and a plasticizer, a dispersing agent, a solvent, etc. as needed to the glass-ceramic composition for frames containing glass powder and a ceramic filler. And it can manufacture by shape
  • the glass powder (hereinafter referred to as “glass powder for substrate main body”) in the glass ceramic composition for substrate main body used for manufacturing the green sheet 2 for substrate main body and the green sheet 4 for overcoat layer is not necessarily limited.
  • a transition point (Tg) of 550 ° C. or higher and 700 ° C. or lower is preferable. When the glass transition point (Tg) is less than 550 ° C., degreasing may be difficult. When the glass transition point (Tg) exceeds 700 ° C., the shrinkage start temperature becomes high and the dimensional accuracy may be lowered.
  • crystals precipitate when fired at 800 ° C. or higher and 880 ° C. or lower.
  • crystals do not precipitate, there is a possibility that sufficient mechanical strength cannot be obtained.
  • the thing whose crystallization peak temperature (Tc) measured by DTA (differential thermal analysis) is 880 degrees C or less is preferable. When the crystallization peak temperature (Tc) exceeds 880 ° C., the dimensional accuracy may be lowered.
  • SiO 2 is 57 mol% to 65 mol%
  • B 2 O 3 is 13 mol% to 18 mol%
  • CaO is 9 mol% to 23 mol%
  • Al 2 O 3 is 3 mol%.
  • SiO 2 becomes a glass network former.
  • the content of SiO 2 is preferably 58 mol% or more, more preferably 59 mol% or more, and particularly preferably 60 mol% or more.
  • the content of SiO 2 is preferably 64 mol% or less, more preferably 63 mol% or less.
  • B 2 O 3 is a glass network former. If the content of B 2 O 3 is less than 13 mol%, there is a possibility that the glass melting temperature or the glass transition point (Tg) becomes too high. On the other hand, when the content of B 2 O 3 exceeds 18 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered.
  • the content of B 2 O 3 is preferably 14 mol% or more, more preferably 15 mol% or more. Further, the content of B 2 O 3 is preferably 17 mol% or less, more preferably 16 mol% or less.
  • Al 2 O 3 is added to increase the stability, chemical durability, and strength of the glass.
  • the content of Al 2 O 3 is less than 3 mol%, the glass may become unstable.
  • the content of Al 2 O 3 exceeds 8 mol%, the glass melting temperature and the glass transition point (Tg) may be excessively high.
  • the content of Al 2 O 3 is preferably 4 mol% or more, more preferably 5 mol% or more.
  • the content of Al 2 O 3 is preferably 7 mol% or less, more preferably 6 mol% or less.
  • CaO is added to increase glass stability and crystal precipitation, and to lower the glass melting temperature and glass transition point (Tg).
  • the content of CaO is less than 9 mol%, the glass melting temperature may be excessively high.
  • the content of CaO exceeds 23 mol%, the glass may become unstable.
  • the content of CaO is preferably 12 mol% or more, more preferably 13 mol% or more, and particularly preferably 14 mol% or more.
  • the CaO content is preferably 22 mol% or less, more preferably 21 mol% or less, and particularly preferably 20 mol% or less.
  • K 2 O and Na 2 O are added to lower the glass transition point (Tg).
  • Tg glass melting temperature
  • Tg glass melting point
  • the total content of K 2 O and Na 2 O is preferably 0.8 mol% or more and 5 mol% or less.
  • the glass powder for substrate main bodies is not necessarily limited to what consists only of the said component, Other components can be contained in the range with which various characteristics, such as a glass transition point (Tg), are satisfy
  • the glass powder for a substrate body is obtained by melting glass raw materials blended so as to have the glass composition as described above to produce glass, and pulverizing the glass by a dry pulverization method or a wet pulverization method.
  • a dry pulverization method it is preferable to use water as a solvent.
  • the pulverizer include a roll mill, a ball mill, and a jet mill.
  • the 50% particle size (D 50 ) of the glass powder for substrate main body is preferably 0.5 ⁇ m or more and 2 ⁇ m or less.
  • the 50% particle size of the glass powder for substrate main body is less than 0.5 ⁇ m, the glass powder is likely to aggregate, making it difficult to handle and uniformly dispersing.
  • the 50% particle size of the glass powder for substrate main body exceeds 2 ⁇ m, the glass softening temperature may increase or the sintering may be insufficient.
  • the particle size can be adjusted, for example, by classification as necessary after pulverization.
  • the particle diameter means a value obtained by a particle diameter measuring apparatus using a laser diffraction / scattering method.
  • the ceramic filler those conventionally used for the production of LTCC substrates (low temperature co-fired ceramic substrates) can be used without particular limitation.
  • alumina powder, zirconia powder, or a mixture of alumina powder and zirconia powder is used. It can be used suitably.
  • the 50% particle size (D 50 ) of the ceramic filler is preferably, for example, from 0.5 ⁇ m to 4 ⁇ m.
  • glass ceramic composition for a substrate body can be obtained.
  • a glass ceramic composition different from the glass ceramic composition for the substrate body may be used as the glass ceramic composition for the overcoat layer used for manufacturing the green sheet 4 for the overcoat layer.
  • a glass ceramic composition for example, in a glass ceramic composition for a substrate body, the same glass powder is used, and a glass ceramic composition using a mixture of alumina powder and zirconia powder as a ceramic filler is preferable.
  • the mixture of alumina powder and zirconia powder is preferably a mixture in which the mixing ratio of alumina powder: zirconia powder is 90:10 to 70:30 by mass ratio.
  • the mixing ratio of the glass powder and the ceramic filler is preferably 35:75 to 50:50 by mass ratio.
  • the glass ceramic composition for a frame used for manufacturing the green sheet 8 for a frame may be a composition different from the glass ceramic composition for a substrate body or may be the same composition.
  • the glass ceramic composition for the frame is different from the glass ceramic composition for the substrate body as follows. A composition is preferred.
  • the glass powder in the glass ceramic composition for a frame (hereinafter referred to as “frame glass powder”) is, for example, 75 mol% to 85 mol% of SiO 2 , 10 mol% to 20 mol% of B 2 O 3 , K 2 O. And at least one selected from Na 2 O is preferably 2 mol% or less in total.
  • the glass powder for a frame body is produced by a melting method and is pulverized by a dry pulverization method or a wet pulverization method.
  • the 50% particle size of the glass powder for the frame (D 50) similar to the 50% particle size of the glass powder for a substrate main body (D 50), it is preferably 0.5 ⁇ m or more 2 ⁇ m or less.
  • the ceramic filler may be at least one filler selected from the group consisting of alumina powder, zirconia powder, titania powder and mullite powder, such as alumina powder, zirconia powder, or alumina powder.
  • a mixture with zirconia powder can be preferably used.
  • the 50% particle size (D 50 ) of the ceramic filler is preferably, for example, from 0.5 ⁇ m to 4 ⁇ m.
  • the glass ceramic composition for a frame it is preferable to contain 80% by mass or more of glass powder because a frame containing 80% by mass or more of glass can be easily obtained after firing the green sheet for frame.
  • the glass-ceramic composition for a frame it is more preferable that the glass powder is 80% by mass or more and the remainder is at least one of a ceramic filler or a silica filler.
  • the glass ceramic composition for a frame includes a glass powder for a frame and at least one of a ceramic filler and a silica filler, and the glass powder for a frame is 90% by mass to 95% by mass, and the ceramic filler Alternatively, it is particularly preferable to mix and mix the silica filler so that the total amount is 5% by mass or more and 10% by mass or less.
  • a slurry can be prepared by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent, and the like to the glass ceramic composition thus obtained.
  • binder examples include polyvinyl butyral and acrylic resin.
  • plasticizer examples include dibutyl phthalate, dioctyl phthalate, and butyl benzyl phthalate.
  • solvent organic solvents such as toluene, xylene, 2-propanol and 2-butanol can be used.
  • the slurry thus obtained is formed into a sheet having a predetermined shape by a doctor blade method or the like and dried to produce a green sheet 2 for a substrate body, a green sheet 4 for an overcoat layer, and a green sheet 8 for a frame. To do.
  • the shape of the frame 8 is formed by punching with a punching machine or the like.
  • FIG. 3A to FIG. 3D are diagrams schematically showing a conductor paste layer forming step.
  • FIG. 3A and FIG. 3B are a plan view and a cross-sectional view taken along line XX, respectively, of the overcoat layer green sheet 4 after the formation of the conductor paste layer.
  • FIG. 3C and FIG. 3D are a plan view and a cross-sectional view taken along the line XX, respectively, showing the substrate body green sheet 2 after the conductor paste layer is formed.
  • the overcoat layer green sheet 4 is formed with a through conductor paste layer 72 constituting a part of the through conductor 7 at two predetermined locations.
  • the element connection terminal paste layer 5 is formed in a substantially rectangular shape (meaning a rectangle on the visual level, hereinafter the same) so as to cover the through conductor paste layer 72 on the surface on which the light emitting element 11 is mounted.
  • the substrate body green sheet 2 includes a through conductor that forms part of the through conductor 7 that penetrates from the main surface 21 to the back surface 22 at two predetermined locations.
  • a paste layer 71 is formed.
  • the external connection terminal paste layer 6 that is electrically connected to the through conductor paste layer 71 is formed on the back surface 22 of the substrate main body green sheet 2.
  • the peripheral portion of the main surface 21 of the substrate main body green sheet 2 and the region excluding the portion where the pair of through conductors 71 are disposed and the vicinity thereof are excluded. Then, the paste layer 3 for heat dissipation layer containing a metal material containing silver is formed.
  • the element connection terminal paste layer 5 As a method for forming the element connection terminal paste layer 5, the external connection terminal paste layer 6, the through conductor paste layers 71 and 72, and the heat dissipation layer paste layer 3, a method of applying and filling the conductor paste by screen printing Is mentioned.
  • the film thicknesses of the element connection terminal paste layer 5, the external connection terminal paste layer 6, and the heat dissipation layer paste layer 3 to be formed are the final element connection terminal 5, external connection terminal 6, and heat dissipation layer 3.
  • the film thickness is adjusted to a predetermined film thickness.
  • a paste obtained by adding a vehicle such as ethyl cellulose to a metal powder mainly composed of copper, silver, gold, or the like, and a solvent as necessary may be used.
  • a metal powder made of silver, a metal powder made of silver and platinum, or a metal powder made of silver and palladium is preferably used.
  • FIGS. 3 (e) and 3 (f) are diagrams schematically showing the stacking process, and are respectively a plan view showing the green light emitting element substrate 1 after the stacking process and its XX line. It is sectional drawing.
  • (B1) The surface in which the element connecting terminal paste layer 5 is formed on the main surface 21 of the substrate paste-equipped green sheet 2 with the conductor paste layer obtained in the step (B1). (Mounting surface) Laminate with 21a facing up. Furthermore, the green sheet 8 for frames obtained in the step (A1) is laminated thereon to obtain the unsintered light emitting element substrate 1. (D1) Firing Step In the firing step, the unsintered light emitting device substrate 1 is fired at 800 to 880 ° C.
  • step (C1) Unsintered light emitting device substrate 1 obtained in step (C1) is degreased (debindered) to remove the binder and the like as necessary, and the glass ceramic composition and the like are fired.
  • Degreasing is, for example, held at a temperature of 500 ° C. to 600 ° C. for 1 hour to 10 hours.
  • the degreasing temperature is less than 500 ° C. or the degreasing time is less than 1 hour, the binder or the like may not be sufficiently removed.
  • the degreasing temperature is about 600 ° C. and the degreasing time is about 10 hours, the binder and the like can be sufficiently removed, and if it exceeds this, productivity and the like may be lowered.
  • the firing can be performed by adjusting the time appropriately in the temperature range of 800 ° C. to 930 ° C., considering only the acquisition of the dense structure of the substrate body 2 and the frame body 8 and the productivity.
  • a metal paste containing silver-containing metal powder is used as the metal paste for the heat dissipation layer, when the firing temperature exceeds 880 ° C., it is excessively fired and contracted, and the predetermined shape cannot be maintained. There is a fear. Therefore, it is preferable to appropriately adjust the time in the temperature range of 800 ° C. to 880 ° C.
  • the substrate body 2 and the frame body 8 may not be obtained as a dense structure.
  • the unsintered light emitting element substrate 1 is fired to obtain the light emitting element substrate 1. After firing, as necessary, the entire element connection terminals 5 and external connection terminals 6 are covered.
  • a conductive protective film used for protecting a conductor in a light emitting element substrate such as gold plating may be provided.
  • substrate bodies does not necessarily need to consist of a single green sheet, and is what laminated
  • Modification of the first embodiment Next, a light emitting element substrate according to a modification of the first embodiment will be described.
  • the frame body is made of a glass powder sintered body containing a silica filler.
  • the light emitting element substrate according to the present modification can be the same as that of the first embodiment except for the composition of the glass ceramic composition of the frame green sheet 8.
  • the glass powder for frame body of the glass ceramic composition of the green sheet for frame body 8 in this modification has the same composition as the glass powder for frame body of the glass ceramic composition in the first embodiment. Also good.
  • the glass powder of the glass ceramic composition for a frame in the first embodiment has a glass transition point (Tg) of 550 ° C. or higher and 700 ° C. or lower
  • Tg glass transition point
  • the shape of the frame 8 may change from the desired shape, for example, the green sheet for the body 8 is softened and the height dimension H1 of the frame 8 becomes smaller than the desired height dimension.
  • the glass ceramic composition for a frame body contains a silica filler such as Aerosil (manufactured by Nippon Aerosil Kogyo Co., Ltd.) produced by an ultrafine particle high heat method in place of the ceramic filler. Thereby, the shape change of the frame 8 can be prevented.
  • a light emitting element substrate and a light emitting device according to a second embodiment will be described with reference to FIG.
  • the second embodiment is a form without the heat dissipation layer 3 and the overcoat layer 4 in FIG. 1, and the substrate body is constituted by a green sheet for the substrate body.
  • FIG. 4 is a plan view (FIG.
  • FIG. 4A showing an example of a light emitting element substrate 1a and a light emitting device 10a using the light emitting element substrate 1a according to the present embodiment, and a cross section taken along line XX. It is a figure (FIG.4 (b)).
  • FIG. 4 parts that are the same as the parts described in the first embodiment with reference to FIG.
  • the light emitting element substrate 1a also has one light emitting element 11 mounted thereon as shown in FIG.
  • the light emitting element substrate 1 a is configured such that the light emitting element 11 is electrically connected by the bonding wire 12 and the sealing layer 13 is provided so as to cover the light emitting element 11 and the bonding wire 12. And used as the light emitting device 10a.
  • the light emitting element substrate 1 a includes a substantially flat substrate body 2 and a frame body 8 provided on the substrate body 2.
  • the substrate body 2 in the present embodiment is the same as the substrate body 2 in the first embodiment except that the substrate body 2 in the first embodiment does not have the heat dissipation layer and the overcoat layer of the substrate body 2 in the first embodiment.
  • the frame body 8 can be the same as in the first embodiment. That is, the frame 8 is made of a sintered body of a glass ceramic composition for a frame including glass powder and a ceramic filler, and is mounted on the main surface 21 on the main surface 21 of the substrate body 2. It is provided so as to surround the light emitting element 11. In the present embodiment, the main surface 21 corresponds to the mounting surface in the present invention.
  • the frame 8 is preferably transparent to visible light emitted from the light emitting element 11.
  • the frame body 8 is, for example, as shown by an optical path L in FIG. 4B, the visible light incident on the frame body 8 from the inner side is transmitted through the frame body 8 with respect to the incident visible light.
  • the transmittance is 80% or more.
  • the frame body 8 has 400 to 800 nm of the transmitted light transmitted through the frame body 8 with visible light including light in the wavelength region of 400 to 800 nm incident on the frame body 8 from the inner side.
  • the average transmittance in the wavelength region is preferably 80% or more.
  • the frame body 8 preferably has a refractive index difference with the sealing layer 13 of 0.1 or less.
  • the height H1 of the frame body 8 is not less than 1.3 times and not more than 5 times the distance H0 from the main surface 21 to the upper surface of the light emitting element 11 mounted on the main surface 21. It is preferable. As a result, chromaticity adjustment in the light emitting device 10a is facilitated, and a decrease in light extraction efficiency can be prevented.
  • the height dimension H1 of the frame 8 is made into the height dimension from the main surface 21 to the upper surface of the frame 8.
  • a distance H0 from the main surface 21 to the upper surface of the light emitting element 11 is a distance from the main surface 21 to the upper surface of the light emitting element 11.
  • the present embodiment is the same as the first embodiment.
  • the frame body 8 preferably satisfies the condition of ⁇ 1 ⁇ 1.0 ⁇ ⁇ 2 ⁇ ⁇ 1 .
  • the light emitting device 10a has the light emitting element 11 such as an LED element mounted on the main surface 21 of the light emitting element substrate 1a according to the present embodiment using a die bond agent such as a silicone die bond agent. .
  • a reflective layer may be provided on the main surface 21 side of the substrate body 2 for the purpose of reflecting light emitted from the light emitting element as much as possible.
  • a constituent material of the reflective film it is preferable to use silver or a silver alloy from the viewpoint of economy and reflectance.
  • the reflective film is silver
  • a glass film may be provided on the surface so as to cover the silver reflective film in order to prevent oxidation and sulfurization of silver.
  • FIGS. 5 and 6 are diagrams schematically showing a part of the manufacturing process of the light emitting element substrate shown in FIG.
  • the light emitting element substrate according to the present embodiment can be manufactured, for example, by a manufacturing method including the following steps (A2) to (D2).
  • steps (A2) to (D2) members used for manufacturing will be described with the same reference numerals as those of the finished product.
  • A2) Green Sheet Production Step In the green sheet production step, the substrate body green sheet 2 constituting the substrate body 2 and the frame body green sheet 8 constituting the frame body 8 are produced.
  • FIG. 5 is a diagram schematically showing a green sheet manufacturing process.
  • FIGS. 5A and 5B are a plan view and a cross-sectional view taken along line XX, respectively, showing the frame green sheet 8.
  • FIGS. 5C and 5D are a plan view and a cross-sectional view taken along the line XX, respectively, showing the green sheet 2 for a substrate body.
  • the substrate main body green sheet 2 is added with a binder, and if necessary, a plasticizer, a dispersant, a solvent, and the like to the glass main body composition for the substrate main body.
  • the frame green sheet 8 is obtained by adding a binder, and if necessary, a plasticizer, a dispersant, a solvent, etc. to the frame glass-ceramic composition, as in the step (A1) in the first embodiment.
  • the slurry thus obtained is formed into a sheet having a predetermined shape by a doctor blade method or the like, and dried to produce the substrate main body green sheet 2 and the frame body green sheet 8.
  • (B2) Conductive paste layer forming step In the conductive paste layer forming step, a predetermined conductive paste layer is formed at a predetermined position of the green sheet 2 for substrate main body obtained in the step (A2).
  • 6 (a) and 6 (b) are diagrams schematically showing a conductive paste layer forming step, and are a plan view and a XX line showing the substrate body green sheet 2 after the conductive paste layer is formed, respectively.
  • the green sheet 2 for substrate main body 2 has a main surface 21 to a back surface 22 at two predetermined locations.
  • a through-conductor paste layer 7 constituting the through-conductor 7 penetrating through is formed.
  • the external connection terminal paste layer 6 that is electrically connected to the through conductor paste layer 7 is formed on the back surface 22 of the substrate body green sheet 2.
  • the conductor paste is formed by screen printing as in the step (B1) in the first embodiment.
  • coating and filling is mentioned.
  • the conductor paste can be made in the same manner as the step (B1) in the first embodiment.
  • (C2) Laminating Step In the laminating step, the substrate body green sheet 2 and the frame body green sheet 8 obtained in step (B2) are stacked.
  • 6 (c) and 6 (d) are diagrams schematically showing the stacking process, and are respectively a plan view and a XX line showing the unsintered light emitting element substrate 1a after the stacking process. It is sectional drawing.
  • the green sheet 8 is laminated to obtain an unsintered light emitting device substrate 1a.
  • D2 Firing Step In the firing step, the unsintered light emitting device substrate 1a is fired at 800 to 880 ° C.
  • step (D1) in the first embodiment degreasing for removing a binder or the like is performed as necessary to obtain a glass ceramic composition. Firing the objects.
  • the degreasing and firing conditions can be the same as in step (D1) in the first embodiment.
  • the device connection terminal 5 and the external connection terminal 6 are usually used for protecting the conductor in the light emitting element substrate so as to cover the entire element connection terminal 5 and the external connection terminal 6 as necessary.
  • An electrically conductive protective film can be provided.
  • the substrate main body green sheet 2 is not necessarily made of a single green sheet, and may be a laminate of a plurality of green sheets. Further, the order of forming each part can be changed as appropriate as long as the light emitting element substrate can be manufactured.
  • a frame body consists of a glass powder sintered compact containing a ceramic filler
  • the glass powder whose frame body contains a silica filler similarly to the modification of 1st Embodiment. It may be made of a sintered body.
  • the substrate body and the frame body which are separately fired, are laminated via a low melting point glass paste, and are heat-treated and bonded. That is, the fired substrate main body and the fired frame body are laminated via a low-melting glass paste, and bonded by heat treatment.
  • FIG. 7 is a plan view (FIG. 7A) showing an example of a light emitting element substrate 1b and a light emitting device 10b using the light emitting element substrate 1b according to the present embodiment, and a cross section taken along line XX. It is a figure (FIG.7 (b)).
  • FIG. 7 as well, the same portions as those described in the first embodiment with reference to FIG.
  • the light emitting element substrate 1b according to the present embodiment is also mounted with one light emitting element 11 as shown in FIG.
  • the light emitting element substrate 1b is configured such that the light emitting elements 11 are electrically connected by the bonding wires 12 and the sealing layer 13 is provided so as to cover the light emitting elements 11 and the bonding wires 12.
  • the light emitting device 10b is obtained.
  • the light emitting element substrate 1b includes a substantially flat substrate body 2 and a frame body 8 provided on the substrate body 2. However, a bonding layer 9 is provided between the substrate body 2 and the frame body 8, and a low-melting glass paste is disposed and heat-treated to bond the substrate body 2 and the frame body 8.
  • the substrate body 2 in the present embodiment can be the same as the substrate body 2 in the first embodiment. That is, the heat dissipation layer 3 is formed on the main surface 21 of the substrate body 2, and the overcoat layer 4 is formed so as to cover the heat dissipation layer 3. Further, a surface opposite to the surface (laminated surface) on the main surface 21 side of the overcoat layer 4 is defined as a mounting surface 21a.
  • the substrate body 2, the heat dissipation layer 3, and the overcoat layer 4 are collectively referred to as a laminated substrate body 2a.
  • the film thickness of the bonding layer 9 is preferably 20 to 80 ⁇ m, and more preferably 40 to 50 ⁇ m. When the thickness of the bonding layer 9 is less than 20 ⁇ m, sufficient bonding strength cannot be obtained. Further, when the thickness exceeds 50 ⁇ m, the low melting point glass paste is melted, so that the positional deviation between the substrate body 2 and the frame body 8 is likely to occur. In addition, the raw material composition regarding a low melting glass paste is demonstrated in the below-mentioned manufacturing method.
  • the frame body 8 is provided on the mounting surface 21a side of the substrate body 2 so as to surround the light emitting element 11 mounted on the mounting surface 21a.
  • the frame 8 is preferably transparent to visible light emitted from the light emitting element 11.
  • the same material as that of the first embodiment and the second embodiment is preferable.
  • the frame body 8 is, for example, as shown by an optical path L in FIG. 7B, the visible light incident on the frame body 8 from the inner side is transmitted through the frame body 8 with respect to the incident visible light. It is preferable that the transmittance is 80% or more. Further, the frame body 8 has 400 to 800 nm of the transmitted light transmitted through the frame body 8 with visible light including light in the wavelength region of 400 to 800 nm incident on the frame body 8 from the inner side. The average transmittance in the wavelength region is preferably 80% or more. Further, the frame body 8 preferably has a refractive index difference with the sealing layer 13 of 0.1 or less.
  • the height H1 of the frame body 8 is not less than 1.3 times and not more than 5 times the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11 mounted on the mounting surface 21a. It is preferable. As a result, chromaticity adjustment in the light emitting device 10b is facilitated, and a decrease in light extraction efficiency can be prevented.
  • the height dimension H1 of the frame body 8 is a height dimension from the mounting surface 21a (the lower surface of the bonding layer 9) to the upper surface of the frame body 8. .
  • the distance H0 from the mounting surface 21a to the upper surface of the light emitting element 11 is the distance from the mounting surface 21a to the upper surface of the light emitting element 11.
  • the present embodiment is the same as the first embodiment.
  • the frame body 8 preferably satisfies the condition of ⁇ 1 ⁇ 1.0 ⁇ ⁇ 2 ⁇ ⁇ 1 .
  • the light emitting element 11 such as an LED element is mounted on the mounting surface 21a of the light emitting element substrate 1b according to the present embodiment using a die bond agent such as a silicone die bond agent. .
  • the heat radiation layer 3 and the overcoat layer 4 are formed on the main surface 21 of the substrate body 2
  • the heat radiation layer 3 and the overcoat layer 4 may not be formed on the main surface 21 of the substrate body 2.
  • the frame body 8 is provided on the main surface 21 side of the substrate body 2 so as to surround the light emitting element 11 mounted on the main surface 21.
  • the light emitting element 11 such as an LED element is mounted on the main surface 21 of the light emitting element substrate 1b with a die bond agent such as a silicone die bond agent.
  • FIGS. 8 and 9 are diagrams schematically showing a part of the manufacturing process of the light emitting element substrate shown in FIG.
  • the light emitting element substrate according to the present embodiment can be manufactured, for example, by a manufacturing method including the following steps (A3) to (F3).
  • steps (A3) to (F3) members used for manufacturing will be described with the same reference numerals as those of the finished product.
  • (A3) Frame body preparation step In the frame body preparation step, the frame body 8 is prepared in advance.
  • 8 (a) and 8 (b) are diagrams schematically showing the frame body preparation step, and are a plan view showing the frame body 8 and a sectional view taken along the line XX, respectively.
  • the frame body 8 may be prepared by baking a green sheet for a frame body alone and producing a transparent frame body 8 containing a glass material. Or you may prepare by processing a glass plate.
  • B3 Green Sheet Production Step In the green sheet production step, the substrate body green sheet 2 constituting the substrate body 2 and the overcoat layer green sheet 4 constituting the overcoat layer 4 are produced.
  • FIG. 8 (c) to 8 (f) are diagrams schematically showing a green sheet manufacturing process.
  • FIG. 8C and FIG. 8D are a plan view showing the overcoat layer green sheet 4 and a sectional view taken along the line XX, respectively.
  • FIG. 8E and FIG. 8F are a plan view and a cross-sectional view taken along line XX, respectively, showing the green sheet 2 for a substrate body.
  • the substrate main body green sheet 2 and the overcoat layer green sheet 4 are similar to the step (A1) in the first embodiment.
  • the substrate main body glass ceramic composition includes a binder, and if necessary, a plasticizer, a dispersant, A slurry is prepared by adding a solvent or the like. And it can manufacture by shape
  • the slurry thus obtained is formed into a sheet having a predetermined shape by a doctor blade method or the like, and dried to produce a green sheet 2 for a substrate body and a green sheet 4 for an overcoat layer.
  • C3 Conductive paste layer forming step
  • a predetermined conductive paste layer is formed at predetermined positions on the substrate body green sheet 2 and the overcoat layer green sheet 4 obtained in step (B3). .
  • the overcoat layer green sheet 4 includes one through conductor 7 at two predetermined locations.
  • a through-conductor paste layer 72 constituting the portion is formed.
  • the element connection terminal paste layer 5 is formed in a substantially rectangular shape so as to cover the through conductor paste layer 72 on the surface on which the light emitting element 11 is mounted.
  • the green sheet 2 for a substrate main body has two main locations from the main surface 21.
  • a through conductor paste layer 71 constituting a part of the through conductor 7 penetrating the back surface 22 is formed.
  • the external connection terminal paste layer 6 that is electrically connected to the through conductor paste layer 71 is formed on the back surface 22 of the substrate main body green sheet 2.
  • the peripheral portion of the main surface 21 of the substrate main body green sheet 2 and the region excluding the portion where the pair of through conductors 71 are disposed and the vicinity thereof are excluded.
  • the paste layer 3 for heat dissipation layer containing a metal material containing silver is formed.
  • the conductor paste is formed by screen printing as in the step (B1) in the first embodiment.
  • coating and filling is mentioned.
  • the conductor paste can be made in the same manner as the step (B1) in the first embodiment.
  • (D3) Lamination process In a lamination process, the green sheet 2 for substrate bodies and the green sheet 4 for overcoat layers obtained at the (C3) process are laminated
  • 9 (a) and 9 (b) are diagrams schematically showing the lamination process, and a plan view and a cross-sectional view along the line XX showing the unsintered laminated substrate 2a after the lamination process, respectively. It is.
  • the green sheet 4 for overcoat layers with a layer is laminated
  • (E3) Firing Step the unsintered laminated substrate 2a is fired at 800 to 880 ° C. to obtain the laminated substrate body 2a.
  • degreasing for removing a binder or the like is performed as necessary to obtain a glass ceramic composition or the like. Is fired.
  • the degreasing and firing conditions can be the same as in step (D1) in the first embodiment.
  • (F3) Joining Step In the joining step, the fired laminated substrate body 2a and the frame body 8 prepared in advance are laminated via a low-melting glass paste, and heat treated and joined.
  • FIG. 9C to FIG. 9F are diagrams schematically showing the joining process.
  • FIGS. 9C and 9D are a plan view and a cross-sectional view taken along line XX, respectively, showing the laminated substrate body 2a after the low-melting glass paste 9 is applied on the main surface 21.
  • FIG. 9 (e) and 9 (f) are plan views showing a sintered light emitting element substrate 1b formed by further laminating the frame body 8 and heat-treating the frame body 8 and the laminated substrate body 2a.
  • FIG. 3 is a cross-sectional view taken along line XX.
  • the low melting point glass paste for example, 45 mol% of SiO 2 , 41.5 mol% of B 2 O 3 , 3.5 mol% of ZrO 2 , 1 mol% of ZnO, 9 mol% of the total of K 2 O and Na 2 O are contained. Things can be used.
  • a low melting point glass paste is applied to a predetermined region of the mounting surface 21a of the laminated substrate body 2a obtained in the step (E3), that is, a region where the frame body 8 is joined. 9 is applied and heated to, for example, about 380 ° C., and the binder of the low-melting glass paste 9 is blown off, thereby pre-baking.
  • the frame 8 is laminated on the main surface 21 of the substrate body 2 on which the low-melting glass paste 9 is temporarily baked to form the low-melting glass 9 with the low-melting glass 9 interposed therebetween. Then, the low-melting glass 9 is melted by heat treatment in a vacuum or gas atmosphere at a temperature of about 380 ° C., for example, and as shown in FIGS. 9 (e) and 9 (f), a frame is formed on the laminated substrate body 2a. The body 8 is joined to obtain the light emitting element substrate 1b.
  • the first embodiment after bonding, it is usually used for protecting a conductor in a light emitting element substrate such as gold plating so as to cover the entire element connection terminal 5 and the external connection terminal 6 as necessary.
  • An electrically conductive protective film can be provided.
  • the substrate main body green sheet 2 is not necessarily made of a single green sheet, and may be a laminate of a plurality of green sheets. Further, the order of forming each part can be changed as appropriate as long as the light emitting element substrate can be manufactured.
  • Example 1 A test light-emitting device having the same structure as that shown in FIG. 1 was produced by the method described below. In addition, the same code
  • a substrate main body green sheet 2, an overcoat layer green sheet 4, and a frame green sheet 8 for preparing the substrate main body 2 of the light emitting element substrate 1 were prepared.
  • a substrate main body glass powder for producing the substrate main body green sheet 2 and the overcoat layer green sheet 4 SiO 2 is 60.4 mol%, B 2 O 3 is 15.6 mol%, and Al 2 O 3 is 6 mol. %, CaO is 15 mol%, K 2 O is 1 mol%, mixing the raw materials as Na 2 O is obtained 2 mol% of the glass, were mixed.
  • the glass powder for a frame for producing the green sheet 8 for a frame SiO 2 is 81.6 mol%, B 2 O 3 is 16.6 mol%, and K 2 O is 1.8 mol%.
  • the raw materials were blended and mixed. These raw material mixtures were put in a platinum crucible and melted at 1600 ° C. for 60 minutes, and then the molten glass was poured out and cooled. This glass was pulverized for 40 hours by an alumina ball mill to produce a glass powder for a substrate body. In addition, ethyl alcohol was used as a solvent for pulverization.
  • This substrate body glass powder is 38% by mass, alumina filler (made by Showa Denko, trade name: AL-45H) is 38% by weight, zirconia filler (made by Daiichi Rare Element Chemical Industries, trade name: HSY-3F-).
  • a glass ceramic composition for a substrate body was produced by blending and mixing such that J) was 24% by mass.
  • a glass ceramic composition for a frame is prepared by blending such that the glass powder for a frame is 93% by mass and the alumina filler (trade name: AL-45H, manufactured by Showa Denko KK) is 7% by mass and mixing.
  • the alumina filler trade name: AL-45H, manufactured by Showa Denko KK
  • a slurry made of a glass ceramic composition for a substrate body was applied onto a PET film by a doctor blade method and dried to prepare a green sheet. Then, the produced green sheets are laminated to form a substrate body green sheet 2 having a substantially flat plate shape and having a thickness after firing of 0.2 mm. An overcoat layer green sheet 4 having a thickness of 1 mm was produced.
  • a slurry made of a glass ceramic composition for a frame was applied on a PET film by a doctor blade method and dried to prepare a green sheet. Then, the produced green sheets are laminated, and the shape outside the frame is the same as that of the green sheet 2 for a substrate body, the shape inside the frame is a circular shape having a diameter of 4.3 mm, and the frame height after firing is 0.
  • a green sheet 8 for a frame body of 5 mm was manufactured.
  • conductive powder (silver powder, manufactured by Daiken Chemical Industry Co., Ltd., trade name: S550) and ethyl cellulose as a vehicle are blended at a mass ratio of 85:15, and used as a solvent so that the solid content is 85 mass%. Of ⁇ -terpineol. Thereafter, the paste was kneaded for 1 hour in a porcelain mortar, and further kneaded and dispersed three times with three rolls to produce a wiring conductor paste.
  • the metal paste for the heat radiation layer is composed of silver powder (manufactured by Daiken Chemical Industry Co., Ltd., trade name: S400-2) and ethyl cellulose as a vehicle in a mass ratio of 90:10, and the solid content is 87 mass. % Was dispersed in ⁇ -terpineol as a solvent. Then, it knead
  • a through hole having a diameter of 0.3 mm is formed in a portion corresponding to the through conductor 7 of the green sheet 2 for a substrate body using a hole puncher, and the wiring conductor paste is filled by a screen printing method to paste the through conductor paste layer 71.
  • the external connection terminal paste layer 6 was formed on the back surface 22. Further, on the main surface 21 of the substrate main body green sheet 2, the peripheral portion of the main surface 21 of the substrate main body green sheet 2, the portion where the pair of through conductors 7 are disposed, and the vicinity thereof are excluded.
  • the heat-dissipating layer paste layer 3 was formed in the region by screen printing so that the film thickness after firing was 15 ⁇ m to obtain a green sheet 2 for a substrate body with a conductive paste layer. Further, the surface roughness Ra of the heat-dissipating layer 3 after firing was confirmed to be 0.08 ⁇ m from the measurement with Surfcom 1400D manufactured by Tokyo Seimitsu Co., Ltd.
  • the overcoat layer green sheet 4 a through hole having a diameter of 0.3 mm is formed in a portion corresponding to the through conductor 7 using a hole puncher, and the wiring conductor paste is filled by a screen printing method.
  • the paste layer 72 is formed, and the element connection terminal paste layer 5 is formed by a screen printing method in a substantially rectangular shape so as to cover the through conductor paste layer 72 on the surface on which the light emitting element 11 is mounted.
  • the overcoat layer green sheet 4 was obtained.
  • the layers were laminated with 21a) facing up. Furthermore, the green sheet 8 for frames obtained above was laminated thereon to obtain a green light emitting device substrate 1.
  • the unfired light-emitting element substrate 1 obtained above was degreased by holding at 550 ° C. for 5 hours, and further held and fired at 870 ° C. for 30 minutes to produce a test light-emitting element substrate 1.
  • Comparative Example 1 A light emitting device according to Comparative Example 1 was produced in the same manner as in Example 1 except that the glass ceramic composition for a frame body was replaced with the glass ceramic composition for a substrate body in Example 1.
  • transmittance (%) and light distribution characteristics were measured by the following methods.
  • the transmittance is measured according to a normal transmission spectrum measurement method, using a spectrophotometer (manufactured by Perkin Elmer, trade name: Lambda 950), and the average value in the visible light range of 400 to 800 nm is used as the transmittance. Calculated as (%).
  • the light emitting element was mounted on the light emitting element substrate produced in Example 1 and Comparative Example 1 to produce a light emitting device.
  • a light emitting device was manufactured by mounting two 2-wire type LED elements on a test light emitting element substrate between a pair of element connection terminals on the mounting surface of the overcoat layer.
  • the LED element 11 (trade name: GQ2CR460Z, manufactured by Showa Denko KK) is fixed at the above position by a die bond material (trade name: KER-3000-M2 manufactured by Shin-Etsu Chemical Co., Ltd.), and the light emitting element has.
  • a pair of electrodes and an element connection terminal located outside each light emitting element were electrically connected to each other through bonding wires.
  • sealing was performed with a sealing agent (trade name: SCR-1016A, manufactured by Shin-Etsu Chemical Co., Ltd.).
  • the sealant contained 20% by mass of a phosphor (product name: P46-Y3, manufactured by Kasei Optonix Co., Ltd.) with respect to the sealant.
  • the light distribution characteristics of the light obtained from this light emitting device were measured using a spectroscopic device (trade name: SOLIDLAMBDA / CCD / LED / MONITOR / PLUS) and an LED photometric measurement stage (trade name: MAS-). L0702) was mounted and measured. At this time, 35 mA was applied to the LED element as the light emitting element using a voltage / current generator (trade name: R6243, manufactured by Advantest Corporation).
  • the light distribution characteristics are measured with the central portion of the light emitting element 11 as a starting point and the vertical direction with respect to the light emitting surface (upper side surface in the figure) of 0 °.
  • the light intensity was measured every 0.5 ° up to an angle of 55 ° left and right.
  • the difference between the highest light intensity and the lowest light intensity was calculated.
  • the light distribution light intensity difference was large, and variation in light distribution characteristics was recognized in the obtained light.
  • the difference in the light distribution intensity of the obtained light is reduced, there is little variation in the light distribution characteristics, and the light distribution characteristics of the emitted light are widely directed. It was recognized that it can be sex.
  • a light-emitting element substrate, a light-emitting device, and a light-emitting element substrate capable of widening the light distribution characteristics of emitted light and preventing deterioration of the frame for filling the resin due to the emitted light.
  • This method is particularly useful for light-emitting devices using white LED elements.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un substrat pour un élément électroluminescent, avec lequel il est possible de réaliser une directivité large de la distribution d'intensité lumineuse de la lumière émise et aussi de prévenir la dégradation d'une armature remplie de résine en résultat de l'exposition à la lumière émise. Elle concerne aussi un dispositif électroluminescent et un procédé de production du substrat pour un élément électroluminescent. Un substrat (1) pour un élément électroluminescent comprend : un corps de substrat principal (2) qui a une surface de montage (21a) servant à monter un élément électroluminescent (11), et qui est formé à partir d'une pastille frittée d'une composition céramique de verre comprenant 30 à 50 % en masse de poudre de verre et 50 à 70 % en masse de charge céramique ; et une armature (8) qui est disposée du côté de la surface de montage (21a) du corps de substrat principal (2) afin d'enfermer l'élément électroluminescent (11) monté sur la surface de montage (21a), et qui comprend 80 % en masse ou plus d'un verre qui est transparent à la lumière visible émise par l'élément électroluminescent (11).
PCT/JP2011/066877 2010-07-26 2011-07-25 Substrat pour élément électroluminescent, dispositif électroluminescent, et procédé de production d'un substrat pour élément électroluminescent WO2012014853A1 (fr)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013168420A (ja) * 2012-02-14 2013-08-29 Stanley Electric Co Ltd 発光装置
JP2013197335A (ja) * 2012-03-21 2013-09-30 Kyocera Corp 発光装置
JP2013197369A (ja) * 2012-03-21 2013-09-30 Rohm Co Ltd 光源装置およびｌｅｄランプ
WO2014009311A1 (fr) * 2012-07-09 2014-01-16 Ceramtec Gmbh Substrat réflecteur de lumière pour des applications de del
JP2017139456A (ja) * 2016-01-29 2017-08-10 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US10211378B2 (en) 2016-01-29 2019-02-19 Nichia Corporation Light emitting device and method for manufacturing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7147197B2 (ja) * 2018-03-16 2022-10-05 大日本印刷株式会社 配線基板および配線基板の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004175645A (ja) * 2002-11-29 2004-06-24 Asahi Glass Co Ltd ガラスフリット混合物、電子回路基板製造方法および電子回路基板
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2006073547A (ja) * 2004-08-31 2006-03-16 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2007251182A (ja) * 2004-08-06 2007-09-27 Allied Material Corp 半導体素子搭載部材、半導体装置、撮像装置、発光ダイオード構成部材、および発光ダイオード
JP2008091449A (ja) * 2006-09-29 2008-04-17 Mimaki Denshi Buhin Kk 光源装置
JP2009099926A (ja) * 2007-09-29 2009-05-07 Kyocera Corp 発光素子収納用パッケージおよび発光装置
WO2009128354A1 (fr) * 2008-04-18 2009-10-22 旭硝子株式会社 Ensemble diode électroluminescente
WO2010021367A1 (fr) * 2008-08-21 2010-02-25 旭硝子株式会社 Dispositif émettant de la lumière
US20100182791A1 (en) * 2009-01-22 2010-07-22 Sanyo Electric Co., Ltd. Package for light emitting element and light emitting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007189031A (ja) * 2006-01-12 2007-07-26 Allied Material Corp 半導体素子搭載用部材とそれを用いた半導体装置および発光ダイオード
JP5477756B2 (ja) * 2006-07-07 2014-04-23 日本電気硝子株式会社 半導体封止材料及びそれを用いて封止してなる半導体素子
JP2008277349A (ja) * 2007-04-25 2008-11-13 Kyocera Corp 発光素子搭載用基体、及びその製造方法、ならびに発光装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004175645A (ja) * 2002-11-29 2004-06-24 Asahi Glass Co Ltd ガラスフリット混合物、電子回路基板製造方法および電子回路基板
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2007251182A (ja) * 2004-08-06 2007-09-27 Allied Material Corp 半導体素子搭載部材、半導体装置、撮像装置、発光ダイオード構成部材、および発光ダイオード
JP2006073547A (ja) * 2004-08-31 2006-03-16 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2008091449A (ja) * 2006-09-29 2008-04-17 Mimaki Denshi Buhin Kk 光源装置
JP2009099926A (ja) * 2007-09-29 2009-05-07 Kyocera Corp 発光素子収納用パッケージおよび発光装置
WO2009128354A1 (fr) * 2008-04-18 2009-10-22 旭硝子株式会社 Ensemble diode électroluminescente
WO2010021367A1 (fr) * 2008-08-21 2010-02-25 旭硝子株式会社 Dispositif émettant de la lumière
US20100182791A1 (en) * 2009-01-22 2010-07-22 Sanyo Electric Co., Ltd. Package for light emitting element and light emitting device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013168420A (ja) * 2012-02-14 2013-08-29 Stanley Electric Co Ltd 発光装置
JP2013197335A (ja) * 2012-03-21 2013-09-30 Kyocera Corp 発光装置
JP2013197369A (ja) * 2012-03-21 2013-09-30 Rohm Co Ltd 光源装置およびｌｅｄランプ
WO2014009311A1 (fr) * 2012-07-09 2014-01-16 Ceramtec Gmbh Substrat réflecteur de lumière pour des applications de del
JP2017139456A (ja) * 2016-01-29 2017-08-10 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US10211378B2 (en) 2016-01-29 2019-02-19 Nichia Corporation Light emitting device and method for manufacturing same
US10720556B2 (en) 2016-01-29 2020-07-21 Nichia Corporation Method for manufacturing light emitting device
JP7177326B2 (ja) 2016-01-29 2022-11-24 日亜化学工業株式会社 発光装置及び発光装置の製造方法

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